Electronic device including grip sensing pad

Abstract

According to various embodiments of the present invention, an electronic device is disclosed comprising: a housing including at least a portion of a non-conductive region; a first printed circuit board including a cavity and a fill-cut region that overlap with the non-conductive region; an antenna module including at least one antenna array disposed within the cavity; a support frame coupled to one surface of the first printed circuit board to support the antenna module; a grip sensing pad disposed to surround the cavity and that overlaps with the fill-cut region; and a sensing circuit unit electrically connected to the grip sensing pad to control the output power of the antenna module through the grip sensing pad. In addition to this, various embodiments identified from the specification are possible.

Description

Technology Field

[0001] The embodiments disclosed in this document relate to an electronic device including a grip sensing pad. Background Technology

[0002] With the development of mobile communication technology, electronic devices equipped with at least one antenna are becoming widely available. Electronic devices can transmit and / or receive RF (radio frequency) signals containing voice signals or data (e.g., messages, photos, videos, music files, or games) using an antenna for wireless communication.

[0003] As the frequency for wireless communication increases, the amount of energy transmitted to the surface of the human body increases, which can have adverse effects. Countries regulate to ensure that exposure to electromagnetic waves does not exceed standard limits. The problem to be solved

[0004] An electronic device can satisfy the electromagnetic exposure standards of each country by lowering the maximum power of the wireless signal to be transmitted to a specified value or lower. However, if the maximum power of the wireless signal to be transmitted is lowered to a specified value or lower, the communication performance of the electronic device may be degraded.

[0005] Various embodiments of this document provide an electronic device comprising a grip sensing pad capable of controlling the transmission power of a wireless signal depending on whether a human body is approaching. means of solving the problem

[0006] An electronic device according to one embodiment disclosed in this document may include: a housing having at least a portion of a non-conductive region; a first printed circuit board having a cavity and a fill-cut region that overlap with the non-conductive region; an antenna module having at least one antenna array disposed within the cavity; a support frame coupled to one side of the first printed circuit board to support the antenna module; a grip sensing pad disposed to surround the cavity and that overlaps with the fill-cut region; and a sensing circuit unit electrically connected to the grip sensing pad to control the output power of the antenna module through the grip sensing pad. Effects of the invention

[0007] According to the embodiments disclosed in this document, the electronic device can more accurately determine the proximity of a human body through a grip sensing pad positioned to surround an antenna module.

[0008] According to the embodiments disclosed in this document, the electronic device can maintain the maximum power intensity of the wireless signal transmitted through the communication circuit after detecting the non-proximity of the human body, thereby ensuring stable communication performance.

[0009] According to the embodiments disclosed in this document, the electronic device can limit the maximum power of a wireless signal transmitted through a communication circuit after detecting the proximity of a human body, thereby reducing the absorption of electromagnetic waves by an external object.

[0010] In addition, various effects that can be identified directly or indirectly through this document may be provided. Brief explanation of the drawing

[0011] FIG. 1 is a block diagram showing an electronic device in a network environment according to various embodiments. FIGS. 2a and FIGS. 2b are drawings showing electronic devices according to various embodiments. FIG. 3 is a cross-sectional view showing an electronic device including a grip sensing pad according to various embodiments. FIG. 4 is a drawing for explaining the arrangement relationship between a support frame and a second plate according to various embodiments. FIG. 5 is a drawing showing an electronic device in which a second plate is omitted according to various embodiments. FIGS. 6a and 6b are drawings illustrating the arrangement relationship between a grip sensing pad and an antenna module of an electronic device according to various embodiments. FIG. 7 is a diagram illustrating the arrangement relationship between a first printed circuit board and a second printed circuit board of an electronic device according to various embodiments. FIGS. 8a and 8b are drawings for explaining grip sensing operation using a grip sensing pad of an electronic device according to various embodiments. FIG. 9 is a cross-sectional view showing an electronic device including a support frame that serves as a grip sensing pad according to various embodiments. Figure 10 is a cross-sectional view showing an enlarged view of area B in Figure 9. FIGS. 11a and FIGS. 11b are drawings for explaining the connection relationship between a second frame and a sensing circuit unit according to various embodiments. FIG. 12 is a drawing for explaining grip sensing operation using a support frame that serves as a grip sensing pad according to various embodiments. FIG. 13 is a cross-sectional view showing an electronic device including a grip sensing pad according to various embodiments. FIG. 14 is a diagram for explaining a grip sensing operation using the grip sensing pad illustrated in FIG. 13. FIG. 15 is a flowchart illustrating a sensing operation using a grip sensor pad of an electronic device according to various embodiments. FIGS. 16a and FIGS. 16b are drawings showing the output power of a wireless signal that varies depending on whether there is access between an electronic device and an external object according to various embodiments. In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Specific details for implementing the invention

[0012] Hereinafter, various embodiments of the present invention are described with reference to the accompanying drawings. However, this is not intended to limit the present invention to specific embodiments and should be understood to include various modifications, equivalents, and / or alternatives of the embodiments of the present invention.

[0013] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input device (150), sound output device (155), display device (160), audio module (170), sensor module (176), interface (177), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., display device (160) or camera module (180)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components may be implemented as a single integrated circuit. For example, a sensor module (176) (e.g., fingerprint sensor, iris sensor, or light sensor) can be implemented embedded in a display device (160) (e.g., display).

[0014] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can load commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) into volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) and an auxiliary processor (123) (e.g., a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor) that can be operated independently or together with it. Additionally or generally, the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0015] The auxiliary processor (123) can control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display device (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)).

[0016] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, software (e.g., program (140)) and input data or output data for related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0017] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0018] The input device (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input device (150) may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus pen).

[0019] The sound output device (155) can output a sound signal to the outside of the electronic device (101). The sound output device (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes such as multimedia playback or recording playback, and the receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0020] The display device (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display device (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display device (160) may include a touch circuitry configured to detect a touch, or a sensor circuitry configured to measure the intensity of the force generated by said touch (e.g., a pressure sensor).

[0021] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through an input device (150) or output sound through an audio output device (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) that is directly or wirelessly connected to the electronic device (101).

[0022] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0023] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0024] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0025] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0026] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0027] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0028] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0029] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi Direct, or IrDA (infrared data association)) or a second network (199) (e.g., a cellular network, the Internet, or a long-range communication network such as a computer network (e.g., LAN or WAN). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify and authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0030] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include a single antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas. In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., an RFIC) may be additionally formed as part of the antenna module (197).

[0031] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0032] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, 104) may be the same or different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, or client-server computing technology may be used.

[0034] FIG. 2a is a perspective view showing the front of an electronic device (200) according to one embodiment (e.g., the electronic device (101) of FIG. 1), and FIG. 2b is a perspective view showing the rear of an electronic device (200) according to one embodiment.

[0035] Referring to FIGS. 2a and 2b, the electronic device (200) may include a housing (210) comprising a first surface (or front) (210A), a second surface (or rear) (210B), and a side (210C) surrounding the space between the first surface (210A) and the second surface (210B).

[0036] In another embodiment (not shown), the housing (210) may refer to a structure forming some of the first surface (210A), second surface (210B) and side surface (210C) of FIG. 2a.

[0037] In one embodiment, the first surface (210A) may be formed by a front plate (202) in which at least a portion is substantially transparent (e.g., a glass plate containing various coating layers, or a polymer plate). The second surface (210B) may be formed by a rear plate (211) that is substantially opaque. The rear plate (211) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the materials. The side surface (210C) may be formed by a side bezel structure (218) comprising metal and / or polymer, which is combined with the front plate (202) and the rear plate (211).

[0038] In one embodiment, the rear plate (211) and the side bezel structure (218) may be formed integrally and may include the same material (e.g., a metallic material such as aluminum).

[0039] In another embodiment, the side (210C) of the housing (210) may include a plurality of conductive regions (212) and segmented regions (214) disposed between the plurality of conductive regions (212). The side region may be segmented by the plurality of segmented regions (214). Each conductive region (212) segmented by the segmented regions (214) may function as an individual antenna region. Each conductive region (212) may be segmented to have a specified length for transmitting or receiving a signal of a specified frequency band. The segmented regions (214) may be filled with an insulating material. For example, the segmented regions (214) may be filled with a polymer material formed through an injection molding process. The segmented regions (214) not only insulate adjacent conductive regions (212) used as antenna regions of different frequency bands, but also prevent foreign matter from penetrating from the outside of the housing (210).

[0040] In one embodiment, the electronic device (200) may include at least one of a display (201), an audio module (203, 207), a sensor module (not shown), a camera module (204, 205, 206), a key input device, and a connector hole (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., a key input device) or additionally include another component (e.g., a light-emitting element).

[0041] The display (201) may be visually exposed through a significant portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202), which includes a portion of the first surface (210A) and a portion of the side (210C).

[0042] In some embodiments, the corners of the display (201) may be formed to be generally identical to the adjacent outer shape of the front plate (202). In other embodiments (not shown), in order to expand the visually exposed area of ​​the display (201), the gap between the outer edge of the display (201) and the outer edge of the front plate (202) may be formed to be generally identical.

[0043] In another embodiment (not shown), at least one of an audio module (203, 207), a sensor module (not shown), a camera module (204, 205, 206), and a light-emitting element (not shown) may be included in a portion of the screen display area of ​​the display (201). In another embodiment (not shown), the display (201) may be combined with or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field-type stylus pen.

[0044] In one embodiment, a sensor module (not shown) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (100) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0045] The camera module (204, 205, 206) may include a first camera device (204) exposed to a first surface (210A) of the electronic device (200), a second camera device (205) exposed to a second surface (210B), and / or a flash (206). At least one of the second camera device (205), the flash (206), and the first antenna module (250) may overlap with a slot area (220) of the housing (210). The slot area (220) may be formed of a non-conductive material such as at least one of glass, ceramic, and plastic. The camera devices (204, 205) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (206) may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lens) and image sensors may be placed on one side of the electronic device (200).

[0046] In one embodiment, the audio module (203, 207) may include a microphone hole (203) and a speaker hole (207). In one embodiment, a microphone for acquiring external sound may be placed inside the microphone hole (203). In some embodiments, the microphone may include a plurality of microphones to detect the direction of sound.

[0047] In one embodiment, the speaker hole (207) may include an external speaker hole and a receiver hole for communication. In some embodiments, the speaker hole (207) and the microphone hole (203) may be implemented as a single hole. In one embodiment, the electronic device (200) may include a speaker communicating with the speaker hole (207). In some embodiments, the speaker may include a piezo speaker in which the speaker hole (207) is omitted.

[0048] In one embodiment, the connector holes (208, 209) may accommodate a connector. In one embodiment, the connector holes (208, 209) may be positioned on the side (210C) of the housing (210). In some embodiments, the electronic device (200) may include a first connector hole (208) capable of accommodating a connector (e.g., a USB connector) for transmitting / receiving power and / or data to / from an external electronic device, and / or a second connector hole (209) capable of accommodating a connector (e.g., an earphone jack) for transmitting / receiving audio signals to / from an external electronic device.

[0049] According to various embodiments, the electronic device may include at least one communication device that uses a millimeter wave (e.g., a band of 25 GHz or higher) as an operating frequency band. According to one embodiment, the communication device (e.g., a first communication device (216)) may include a first antenna module (250) that forms a beam in the rear direction (e.g., -Z-axis direction) and a second antenna module (251) that forms a beam in the front direction (e.g., +Z-axis direction).

[0050] FIG. 3 is a cross-sectional view showing an electronic device (500) according to one embodiment, FIG. 4 is a plan view showing the rear side of a support frame (390) shown in FIG. 3, and FIG. 5 is a perspective view for explaining an electronic device (500) with the second plate (510) combined with a side member (513) according to one embodiment omitted.

[0051] Referring to FIGS. 3 to 5, an electronic device (500) according to one embodiment may include a housing (e.g., housing (210) of FIG. 2), a display (501), a first printed circuit board (310), a first antenna module (400), a support frame (390), and a first grip sensing pad (350). At least one of the components of the electronic device (500) according to one embodiment may be identical or similar to at least one of the components of the electronic device (500) of FIG. 2a and FIG. 2b, and redundant descriptions are omitted below.

[0052] The housing may include a first plate (511) facing a first direction (e.g., +Z direction) (e.g., front plate (202) of FIG. 2), a second plate (510) facing a second direction (e.g., -Z direction) (e.g., rear plate (211) of FIG. 4), and a side member (513) (e.g., side bezel structure (218) of FIG. 2).

[0053] The second surface of the second plate (510) may include a first housing region (512) and at least one second housing region (514). According to one embodiment, the first housing region (512) may be formed from a conductive material such as aluminum, stainless steel (STS), or magnesium. According to another embodiment, the first housing region (512) may be formed by surface treating a non-conductive material over a metallic material. For example, the surface treatment process may be at least one of anodizing, colored coating, and ceramic film coating processes. The first housing region (512) may be formed integrally with the conductive region of the second plate (510) (e.g., the conductive region (212) of FIG. 2a and FIG. 2b) and may be formed from the same material as the conductive region of the second plate (510).

[0054] At least one second housing region (514) may be disposed within a slot (516) penetrating the first housing region (512). At least one second housing region (514) may be formed from a non-conductive material, such as glass, ceramic, and plastic. For example, the second housing region (514) may be formed by a combination of a slot filled with a non-conductive plastic material and a cover region made of a non-conductive glass material through an injection molding process. The cover region may have a larger area than the slot.

[0055] The second housing area (514) may be formed to accommodate an antenna array (430) that radiates to the rear surface (e.g., the surface in the -Z direction) of an electronic device when the rear surface (e.g., the surface in the -Z direction) of the second plate (510) is formed of a metal material.

[0056] According to one embodiment, the second housing area (514) may be positioned to correspond to the antenna array (430) and the first grip sensing pad (350). According to another embodiment, if the second housing area (514) includes a cover area, at least one slot (516) may be positioned to have a size larger than that of the antenna array (430) and the first grip sensing pad (350). According to another embodiment, the second housing area (514), which is a non-conductive area, may be positioned in an area corresponding to the front camera (504) and the rear camera module, as well as the antenna array (430) and the first grip sensing pad (350). According to yet another embodiment, the second housing area (514) may be positioned at least once at a location corresponding to each of the antenna array (430), the first grip sensing pad (350), and the rear camera module. Meanwhile, the rear camera module may include a rear camera (530), a camera window (534), and a camera housing (532). The camera housing (532) may include a camera opening (536) into which the camera window (534) is placed. The camera window (534) may be positioned so that light from the outside can be introduced into the rear camera (530). Additionally, the camera window (534) may serve to seal the camera housing (532) to prevent foreign matter from entering the rear camera (530).

[0057] The support frame (390) can adjust the height of the antenna module (400) and perform the function of supporting the antenna module (400). The support frame (390) can be placed in the space between the first plate (511) and the second plate (510). For example, the support frame (390) can be placed between the antenna module (400) and the display (501).

[0058] The support frame (390) may include a first frame area (396), a second frame area (394), and a side frame area (392). At least one of the first frame area (396), the second frame area (394), and the side frame area (392) may be formed of a conductive material.

[0059] A first frame area (396) may be positioned between an antenna module (400) and a display (501). An antenna module (400) may be positioned on the first frame area (396). Since the first frame area (396) is positioned spaced apart from the display (501) with an air gap (AG) in between, heat generated from the antenna module (400) can be rapidly cooled in the air. A first surface (e.g., a surface facing the +z-axis direction) (396a) of the first frame area (396) is a surface facing the display (501), and a second printed circuit board (410) may be positioned on a second surface (e.g., a surface facing the -z-axis direction) (396b) facing in the opposite direction to the first surface.

[0060] The second frame region (394) can be in contact with the front surface (e.g., the side facing the +Z direction) of the first printed circuit board (310) through the solder pad (360). The second frame region (394) can be coupled with a conductive layer (e.g., a ground layer) formed on the first printed circuit board (310) through the solder pad (360). Accordingly, noise radiated from the RFIC (420) of the antenna module (400) can be shielded, or heat generated from the antenna module (400) can be effectively dissipated.

[0061] The side frame area (392) can be bent from the first frame area (396) toward the second frame area (394). Depending on the degree of bending of the side frame area (392), the protrusion height between the antenna module (400) and the first printed circuit board (310) can be adjusted. The side frame area (392) can be positioned to surround the first frame area (396) between the first frame area (396) and the second frame area (394) to provide a mounting space (352). An antenna module (400), including an antenna array (430), a second printed circuit board (410), and an RFIC (420), can be mounted in the mounting space (352) of the support frame (390). The support frame (390) can support and fix the antenna module (400).

[0062] According to one embodiment, the first frame area (396) may overlap with the antenna module (400) and the first grip sensing pad (350). Accordingly, the first frame area (396) may overlap with the second housing area (514) of the second plate (510). At least a portion of the second frame area (394) may overlap with the first housing area (512) of the second plate (510). For example, the second frame (394) positioned on one side (e.g., the side facing the +X direction) relative to the first frame area (396) may overlap with the first housing area (512) of the second plate (510). The second frame (394) positioned on the other side (e.g., the side facing the -X direction) relative to the first frame area (396) may overlap with the second housing area (514) of the second plate (510). The side frame area (392) may overlap with at least one of the first housing area (512) and the second housing area (514) of the second plate (510).

[0063] A processor (e.g., processor (120) of FIG. 1), memory (e.g., memory (130) of FIG. 1), an interface (e.g., interface (177) of FIG. 1), an antenna module (not shown), and / or a wireless communication circuit (e.g., wireless communication module (192) of FIG. 1) may be disposed on the first printed circuit board (310). The processor (120) may include, for example, one or more of a Central Processing Unit (CPU), an Application Processor (AP), a Graphics Processing Unit (GPU), an Image Signal Processor (ISP), a Sensor Hub Processor (SHP), or a Communication Processor (CP). The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (500) to an external electronic device (e.g., the electronic device (102, 104) of FIG. 1) and may include a USB connector, an SD card / MMC connector, or an audio connector. The wireless communication circuit may be a radio frequency integrated circuit (RFIC) (420). For example, the wireless communication circuit may supply an electrical signal to a protrusion formed in at least a part of the housing.

[0064] The first printed circuit board (310) may include a cavity (300) that overlaps with the antenna module (400). The first antenna module (400) may be placed in the cavity (300) of the first printed circuit board (310). The first printed circuit board (310) on which the grip sensing pad (350) is placed may be spaced apart from the second printed circuit board (410) on which the antenna module (400) is placed, with a space between them. The second printed circuit board (410) may be placed so that it protrudes slightly more than the first printed circuit board (310), or the first printed circuit board (310) may be placed at the same plane height as the second printed circuit board (410).

[0065] According to one embodiment, an intermediate frequency integrate circuit (IFIC) may be disposed on the first printed circuit board (310). The IFIC can up / down convert millimeter wave (mmWave) signals transmitted and received through the first antenna module (400). Since the first antenna module (400) is disposed within the cavity (300) of the first printed circuit board (310), it may be disposed in close proximity to the IFIC disposed on the first printed circuit board (310). Accordingly, loss of millimeter wave (mmWave) signals transmitted and received through the first antenna module (400) can be prevented.

[0066] The first printed circuit board (310) may include a circuit area (A1) and a fill cut area (A2). At least a portion of the circuit area (A1) may overlap with the first housing area (512) of the second plate (510). For example, the circuit area (A1) located on one side (e.g., the side facing the +X direction) relative to the second printed circuit board (410) may overlap with the first housing area (512) of the second plate (510). The circuit area (A1) located on the other side (e.g., the side facing the -X direction) relative to the second printed circuit board (410) may overlap with the second housing area (514) of the second plate (510). The fill cut area (A2) may overlap with the second housing area (514) of the second plate (510).

[0067] The circuit area (A1) may include a plurality of conductive layers and a plurality of insulating layers. The plurality of conductive layers and the plurality of insulating layers may be stacked alternately. The circuit area (A1) may provide electrical connections between the first printed circuit board (310) and various electronic components placed externally using wiring and via holes utilizing the conductive layers.

[0068] The peel-cut area (A2) is a non-conductive area in which the remaining layer of the first printed circuit board (310), excluding the first grip sensing pad (350), is composed of a non-conductive layer, and may be an area composed of an insulating layer where the conductive layers included in the circuit area (A1) are not placed. The peel-cut area (A2) may extend toward the antenna module (400) into the mounting space (352) of the support frame (390). The peel-cut area (A2) of the first printed circuit board (310) may be positioned to overlap with the mounting space (352) of the support frame (390). The peel-cut area (A2) of the first printed circuit board (310) may include a first peel-cut area (370) and a second peel-cut area (307). The first peel-cut area (370) may be positioned between the circuit area (A1) and the second peel-cut area (307). The first fill-cut area (370) may be an area that does not overlap with the first grip sensing pad (350). The second fill-cut area (307) may be spaced apart from the antenna module (400). The second fill-cut area (307) may be an area that overlaps with the first grip sensing pad (350).

[0069] An electronic device (500) according to one embodiment may include a plurality of antenna modules. The plurality of antenna modules may include a first antenna module (400) and a second antenna module (551). At least one of the first antenna module (400) and the second antenna module (551) may output a directional and / or radiative radio signal based on the arrangement of the antenna array. The first antenna module (400) may be configured to radiate a frequency in a frequency band (e.g., a millimeter wave (mmWave) frequency band) designated in a first direction (e.g., -Z direction) of the electronic device (500). The second antenna module (551) may be configured to radiate a frequency in a frequency band (e.g., a millimeter wave (mmWave) frequency band) designated in a second direction (e.g., +Z direction) of the electronic device. For example, the first antenna module (400) and the second antenna module (551) may radiate directional signals in different directions. The first antenna module (400) is a directional antenna module in the first direction (e.g., -Z direction or rear direction), and the second antenna module (551) may be a directional antenna module in the second direction (e.g., +Z direction or front direction) opposite to the first direction.

[0070] At least one of the first antenna module (400) and the second antenna module (551) may include at least one of a patch antenna, a monopole antenna, a spiral antenna, a wave antenna, a loop antenna, a Vivaldi antenna, and a holographic antenna.

[0071] The first antenna module (400) may include a second printed circuit board (410), an antenna array (430), and a radio frequency integrate circuit (RFIC) (420). The second printed circuit board (410) may be part of the first printed circuit board (310) or may be formed separately from the first printed circuit board (310) and electrically connected to the first printed circuit board (310).

[0072] The second printed circuit board (410) can be electrically connected to the first printed circuit board (310) through a connecting member (515). The second printed circuit board (410) may include a first surface (e.g., a surface facing the +Z direction) in contact with the support frame (390) and a second surface opposite to the first surface. A wireless communication circuit (e.g., a radio frequency integrate circuit (RFIC)) is disposed on the first surface of the second printed circuit board (410), and at least one antenna array (430) may be configured on a portion of the second surface of the second printed circuit board (410). In this case, the antenna array (430) may be configured as a mixed form of a dipole antenna and a patch antenna, and may be configured non-overlapping on different conductive layers.

[0073] The antenna array (430) may include a plurality of antennas (432, 434, 436, 438) arranged to form a directional beam. The plurality of antennas (432, 434, 436, 438) may be arranged in a row within a miniaturized electronic device (500). For example, the antenna array may have a plurality of antennas (432, 434, 436, 438) arranged in a 1×4 manner. The plurality of antennas (432, 434, 436, 438) may be formed inside a second printed circuit board (410) or formed on one side of the second printed circuit board (410). The antenna array (430) may include a plurality of antennas of the same or different shapes or types. At least one of the plurality of antennas included in the antenna array (430) may include at least one of a patch antenna, a monopole antenna, a spiral antenna, a wave antenna, a loop antenna, a Vivaldi antenna, and a holographic antenna. For example, the plurality of antennas (432, 434, 436, 438) included in the antenna array (430) may be patch antennas. Patch antennas are small and lightweight, easy to arrange in the antenna array (430), easy to integrate into the second printed circuit board (410) or flexible printed circuit board, and easy to adjust polarization. Patch antennas may be suitable for the second printed circuit board (410) or flexible printed circuit board that has low dielectric constant and high thickness. The antenna array (430) may be one or multiple. For example, if the antenna array (430) includes a first antenna array and a second antenna array, the first antenna array may be composed of multiple patch antennas, and the second antenna array may be composed of multiple dipole antennas.

[0074] The RFIC (420) may be positioned so as to be spaced apart from the antenna array (430). For example, the RFIC (420) may be positioned on the first surface of the second printed circuit board (410) so as to be spaced apart from the antenna array (430) positioned on the second surface of the second printed circuit board (410). The RFIC (420) is configured to process signals of a selected frequency band transmitted and received through the antenna array (430). When transmitting, the RFIC (420) can convert a baseband signal obtained from a communication processor (not shown) into an RF signal of a specified band (e.g., mmWave band (3GHz to 300GHz band)). When receiving, the RFIC (420) can convert an RF signal received through the antenna array (430) into a baseband signal and transmit it to the communication processor.

[0075] An electronic device according to one embodiment may include at least one grip sensing pad (350, 550) capable of determining whether a user is gripping. The at least one grip sensing pad may include a first grip sensing pad (350) and a second grip sensing pad (550).

[0076] The first grip sensing pad (350) may be placed in a location that does not affect the performance of the first antenna module (400). The first grip sensing pad (350) may be placed so as not to overlap with the radiation direction of the antenna array (430) radiating toward the rear side (e.g., the side facing the -Z direction) of the electronic device (500). For example, the first grip sensing pad (350) may be placed to surround the first antenna module (400). The first grip sensing pad (350) may be formed in the shape of a polygonal, circular, or elliptical band with an empty central area corresponding to the first antenna module (400). For example, the first grip sensing pad (350) may be formed in the shape of a rectangular band with an empty central area corresponding to the antenna module (400).

[0077] The first grip sensing pad (350) may be formed of a conductive material in a position that overlaps with the second housing area (514) of the second plate (510) and is in close proximity to the antenna array (430). The first grip sensing pad (350) may be placed on at least one of the first peel-cut area (370) and the second peel-cut area (307) of the first printed circuit board (310). The first grip sensing pad (350) may be formed on at least one conductive layer placed on the first printed circuit board (310) or on at least one conductive layer included within the first printed circuit board (310). For example, the first grip sensing pad (350) may be formed on the conductive layer located at the top of a plurality of conductive layers included within the first printed circuit board (310).

[0078] Since the first grip sensing pad (350) is positioned in close proximity to the antenna array (430), the grip sensing coverage (GSA) using the first grip sensing pad (350) may overlap with the area radiated by the antenna array (430). Accordingly, when a user's finger, which is a local part of the human body and an external object, approaches the radiating area of ​​the first antenna module (400), the user's finger may be within the grip sensing coverage (GSA).

[0079] The second grip sensing pad (550) can be positioned so as not to overlap with the radiation direction of the second antenna module (551) which radiates in the direction of the front of the electronic device (500) (e.g., the side facing the +Z direction).

[0080] The battery (280) is a device for supplying power to at least one component of the electronic device (500) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (280) may be positioned substantially adjacent to, for example, at least one of the first printed circuit board (310) and the second printed circuit board (410). The battery (280) may be integrally positioned inside the electronic device (500) or may be detachably positioned from the electronic device (500).

[0081] FIG. 6a is a plan view showing a grip sensing pad disposed on a first printed circuit board of an electronic device according to one embodiment, FIG. 6b is a cross-sectional view of the electronic device cut along line "II-II'" in FIG. 6a, and FIG. 7 is a drawing showing the first and second printed circuit boards of the electronic device before the antenna module and grip sensing pad are formed according to one embodiment.

[0082] Referring to FIGS. 6a through 7, a grip sensing pad (650) (e.g., the first grip sensing pad (350) of FIGS. 3 through 5) of an electronic device (800) according to one embodiment (e.g., the electronic device (500) of FIGS. 3 through 5) may be formed independently of an adjacent conductive layer to avoid signal interference with an adjacent conductive layer. For example, the grip sensing pad (650) may be positioned independently of an antenna module (700) placed on a second printed circuit board (710) (e.g., the second printed circuit board (410) of FIG. 3) and a circuit area (A1) of the first printed circuit board (610). Since the grip sensing pad (650) is placed on the first printed circuit board (610) separated from the second printed circuit board (710) on which the antenna module (700) is placed, the grip sensing pad (650) can be implemented without reducing the area of ​​the grip sensing pad (650) so that a constant capacitance can be maintained even if the antenna module (700) is miniaturized.

[0083] A grip sensing pad (650) placed on the second peel-cut area (607) may be spaced apart from the circuit area (A1) of the first printed circuit board (610) with the first peel-cut area (670) having a first width (W1) in between. The first width (W1) of the first peel-cut area (670) and the number of stacked insulating layers included in the first peel-cut area (670) may vary depending on the grip sensing performance and the degree of freedom of operation of the signal wiring included in the first printed circuit board (610).

[0084] A first printed circuit board (610) on which a grip sensing pad (650) is placed may include a cavity (600). The grip sensing pad (650) may be placed to surround the cavity (600). An antenna module (700) may be placed in the cavity (600) of the first printed circuit board (610). The first printed circuit board (610) on which the grip sensing pad (650) is placed may be placed so as to be spaced apart from a second printed circuit board (710) on which the antenna module (700) is placed, with a spacing of a second width (W2) between them. The second width (W2), which is the spacing between the first printed circuit board (610) and the second printed circuit board (710), may be the same or different from each other in the upper / lower / left / right directions.

[0085] The grip sensing pad (650) may include first to fourth pad regions (651, 652, 653, 654). The first pad region (651) may be extended toward the grip sensing line (660) in a direction parallel to the arrangement direction of a plurality of antennas included in the antenna array (730) (e.g., +X direction). The first pad region (651) may have a first pad width (d1). The second pad region (652) may be extended in a direction intersecting the first pad region (651) (e.g., -Y direction). The second pad region (652) may have a second pad width (d2). The third pad region (653) is formed parallel to the first pad region (651) and may be spaced apart from the first pad region (651) with the second printed circuit board (710) in between. The third pad area (653) may have a third pad width (d3). The fourth pad area (654) is formed parallel to the second pad area (652) and may be spaced apart from the second pad area (652) with the second printed circuit board (710) in between. The fourth pad area (654) may have a fourth pad width (d4). The widths (d1, d2, d3, d4) of each of the first to fourth pad areas (651, 652, 653, 654) may be the same or different from each other. At least one of the first to fourth pad areas (651, 652, 653, 654) may have a width that varies depending on the location. For example, the first pad area (651) may be formed such that the area adjacent to the fourth pad area (654) has a smaller width than the area adjacent to the second pad area (652).

[0086] In the absence of a grip proximity signal, the grip sensing performance (grip sensing sensitivity) can be improved by optimizing the area of ​​the grip sensing pad (650) to have a specific capacitance. Meanwhile, if the grip sensing area is expanded by widening the area of ​​the grip sensing pad, a trade-off may occur in which the grip sensing performance is degraded by exceeding a specific capacitance.

[0087] For example, at least one of the first to fourth pad regions (651, 652, 653, 654) may have a width of about 1 to 1.5 mm. The length of at least one of the first to fourth pad regions (651, 652, 653, 654) may be about 25 to 35 mm, or the total length of the first to fourth pad regions (651, 652, 653, 654) may be about 25 to 35 mm.

[0088] The grip sensing pad (650) may be positioned to overlap with a support frame (690) comprising a first frame area (696), a second frame area (694), and a side frame area (692). A mounting space (698) may be positioned between the support frame (690) and the grip sensing pad (650). An antenna module (700) comprising an antenna array (730), a second printed circuit board (710), and an RFIC (720) may be mounted in the mounting space (698) of the support frame (690).

[0089] The grip sensing pad (650) may be placed on the second fill-cut area (607) of the first printed circuit board (610). The grip sensing pad (650) may be positioned at the same height as the antenna module (700) or positioned higher than the antenna module (700).

[0090] According to one embodiment, the grip sensing pad (650) is formed of the same material as the uppermost conductive layer (605) of the first printed circuit board (610) and may be placed on the same plane as the uppermost conductive layer (605). At this time, the solder resist layer (640) for protecting the first printed circuit board (310) may be removed in the area corresponding to the grip sensing pad (650). The solder resist layer (640) may be placed on the remaining area of ​​the first printed circuit board (610) excluding the grip sensing pad (650). The non-conductive solder resist layer (640) may be placed to cover the conductive layer (605, 609), via hole (620, 630), and insulating layer (612, 614, 616) placed in the circuit area (A1). The grip sensing pad (650) can be separated from the ground layer (609) connected through the second frame area (694) of the support frame (690) and the solder pad (760). The grip sensing pad (650) can be separated from the ground layer (609) through the first fill-cut area (670) and the second fill-cut area (607).

[0091] Each of the first peel-cut region (670) and the second peel-cut region (607) may consist entirely of an insulating layer (612, 614, 616) or may include at least one insulating layer (612, 614, 616) and at least one conductive layer. The conductive layer included in each of the first peel-cut region (670) and the second peel-cut region (607) may not be electrically connected to the conductive layer (605, 609) included in the circuit region (A1) and the grip sensing pad (650).

[0092] According to one embodiment, the second peel-cut region (607) may include a plurality of layers. The top layer (e.g., the first layer) of the second peel-cut region (607) far from the support frame (690) may be composed of at least one conductive layer and may be used as a grip sensing pad (650). The remaining layers (e.g., the second layer to the bottom layer) excluding the top layer of the second peel-cut region (607) may be composed of at least one second conductive layer and an insulating layer (612, 614, 616), or may be composed of an insulating layer without a second conductive layer. The second conductive layer included in the second peel-cut region (607) may not be electrically connected to the grip sensing pad (650) and the conductive layer (605, 609) included in the circuit region (A1).

[0093] According to various embodiments, the grip sensing pad (650) may be formed as a separate interposer structure distinct from the top conductive layer included in the first printed circuit board (610). The interposer structure may protrude on the first printed circuit board (610) in a direction facing the second plate (510) (e.g., -Z axis). The interposer structure may include an interposer and at least one printed circuit board to secure an area for grip sensing. For example, the interposer structure may include an interposer and a third printed circuit board consisting only of the grip sensing pad (650) without a fill-cut area. The interposer may electrically connect the grip sensing pad of the third printed circuit board to the first printed circuit board. The grip sensing pad (650) included in the interposer structure may be formed as a separate conductive layer distinct from the top conductive layer included in the first printed circuit board (610). A grip sensing pad (650) included in the interposer structure can be formed on a first printed circuit board (610) that is lower in height than the antenna module (700). Accordingly, the height of the antenna module (700) and the height of the grip sensing pad (650) become similar, thereby ensuring grip sensing performance.

[0094] Such a grip sensing pad (650) can detect the sum of the capacitance value of the grip sensing pad (650) itself and the load capacitance value caused by an external object (e.g., a user's finger) gripping the electronic device (e.g., self-capacitance). Accordingly, the grip sensing pad (650) can generate a grip sensing signal containing information related to the degree of the user's grip and the position of the grip. The grip sensing signal generated by the grip sensing pad (650) can be transmitted to a sensing circuit unit (680) via a grip sensing line (660). The sensing circuit unit (680) may be embedded within a processor (e.g., the processor (120) of FIG. 1) mounted on the first printed circuit board (610), or may be mounted on the first printed circuit board (610) separately from the processor.

[0095] The sensing circuit unit (680) may include a circuit that processes and handles at least a portion of the signal received from the grip sensing pad (650). For example, the sensing circuit unit (680) may compare the value of the self-capacitance included in the grip sensing signal received from the grip sensing pad (650) with a threshold value.

[0096] The sensing circuit unit (680) can control the maximum power intensity of a wireless signal to be transmitted using a communication circuit (e.g., RFIC (720) of FIG. 6b) depending on whether the self-capacitance value corresponds to a range of thresholds. In one embodiment, the operation of the communication circuit to reduce the maximum power intensity of the available wireless signal may be referred to as 'power back off'.

[0097] According to one embodiment, the sensing circuit unit (680) can control the communication module (e.g., the communication module (190) of FIG. 1) so that a power back off operation is executed when the self-capacitance value is greater than a threshold value.

[0098] According to one embodiment, the sensing circuit unit (680) can control the communication module (e.g., the communication module (190) of FIG. 1) so that when the self-capacitance value is below a threshold value, the power back-off operation is not performed and the strength of the maximum power of the available wireless signal is maintained.

[0099] According to one embodiment, the sensing circuit unit (680) may be included within a processor (e.g., the processor (120) of FIG. 1).

[0100] FIGS. 8A and 8B are drawings illustrating when a human body comes into contact with a grip sensing pad of an electronic device according to one embodiment. The electronic device described in FIGS. 8A and 8B may include components similar to the electronic device illustrated in FIGS. 6A to 7.

[0101] Referring to FIGS. 8a and 8b, a rear camera module may be positioned adjacent to a first printed circuit board (610) of an electronic device (800) according to one embodiment. The rear camera module may include a rear camera (830), a camera window (834), and a camera housing (832). The camera housing (832) may include a camera opening (836) into which the camera window (834) is positioned. The camera window (834) may be positioned so that light from the outside can be introduced into the rear camera (830). Additionally, the camera window (834) may serve to seal the camera housing (832) to prevent foreign substances (e.g., dust, moisture) from entering the rear camera (830).

[0102] In one embodiment, a display (801) combined with a first plate (811) of an electronic device (800) may have a support frame (690) including a first frame area (696), a second frame area (694), and a side frame area (692) spaced apart.

[0103] Additionally, the grip sensing pad (650) of the electronic device according to one embodiment (e.g., the first grip sensing pad (350) of FIGS. 3 to 5) may surround the antenna module (700) (e.g., the first antenna module (400) of FIGS. 3 to 5) at a minimum distance.

[0104] A grip sensing operation using a grip sensing pad (650) can be performed in the area where the antenna array (730) radiates. A grip sensing signal can be generated through the grip sensing pad (650) placed within the radiating area of ​​the antenna array (730). At this time, since the antenna module (700) includes small patch antennas (732, 734, 736, 738), there may be an intersection area (overlapping area) between the area where a beam pattern formed to have a predetermined beam width is radiated from the patch antennas (732, 734, 736, 738) and the grip sensing coverage. Accordingly, when a user's finger, which is a local part of the human body, an external object, approaches the radiating area of ​​the antenna module (700), the user's finger may be within the grip sensing coverage.

[0105] For example, when a human body approaches the radiation area of ​​the antenna module (700), the grip sensing pad (650) may overlap with an external object with the second housing area (814) formed within the slot (820) in between. The grip sensing pad (650) overlapping with the external object may form self-capacitance. When the human body, which is the external object, approaches the grip sensing pad (650), the self-capacitance may increase. In this way, the change in self-capacitance is sensed through the grip sensing pad (650), and thereby, whether the human body is present within the radiation area of ​​the antenna module (700) can be detected.

[0106] FIG. 9 is a cross-sectional view showing an electronic device according to various embodiments, FIG. 10 is an enlarged view of area B in FIG. 9, FIG. 11a is a detailed view showing a first antenna module and a grip sensing pad of an electronic device according to various embodiments, and FIG. 11b is a cross-sectional view showing an electronic device cut along line "Ⅲ-Ⅲ'" in FIG. 11a.

[0107] Referring to FIGS. 9 to 11b, an electronic device according to one embodiment may include a display (901), a first plate (911), a second plate (910), a first printed circuit board (1010), a first antenna module (1100), a support frame (1090) serving as a grip sensing pad, a heat transfer member (904), and a heat dissipation member (902).

[0108] A heat transfer member (904) may be disposed between the first frame area (1056) of the support frame (1090) and the heat dissipation member (902). The heat transfer member (904) can transfer heat generated from the RFIC (1120) of the antenna module (1100) to the heat dissipation member. For example, heat generated from the RFIC (1120) of the antenna module (1100) can be efficiently transferred to the heat dissipation member (902) through the first frame area (1096) and the heat transfer member (904). The heat transfer member (904) may include a thermal interface material (TIM). For example, the TIM may include a high thermal conductivity material such as graphite, carbon nanotubes, natural renewable materials, silicon, or graphite.

[0109] The heat transfer member (904) may be positioned to be in contact with the front surface (e.g., the surface in the +Z direction) of the first frame area (1096) of the support frame (1090) and to be in contact with the rear surface (e.g., the surface in the -Z direction) of the heat dissipation member (902). The heat transfer member (904) may be formed in various ways depending on the type and size of each of the first frame area (1096) and the heat dissipation member (902) in contact with the heat transfer member (904), or the amount of heat generated from the RFIC (1120). For example, the heat transfer member (904) may have an area equal to or larger than the first frame area (1096) and an area equal to or smaller than the heat dissipation member (902).

[0110] The heat dissipation member (902) can reduce high-temperature heat concentrated around the antenna module (1100). Heat transferred through the heat transfer member (904) is evenly distributed and released through the heat dissipation member (902), thereby effectively dissipating heat generated in the antenna module (1100). The heat dissipation member (902) can be formed in the form of a sheet, thin film, or plate made of aluminum (Al), copper (Cu), or a carbon-based material with high thermal conductivity (e.g., carbon black, graphene, carbon nanotubes, graphite).

[0111] The first printed circuit board (1010) may include a cavity (1000). A support frame (1090) on which an antenna module (1100) is mounted may be disposed in the cavity (1000) of the first printed circuit board (1010). The support frame (1090), which serves as a grip sensing pad, may be disposed spaced apart from the second printed circuit board (1110) on which the antenna module (400) is disposed by the cavity (1000).

[0112] The support frame (1090) may be placed in the space between the first plate (911) and the second plate (910). For example, the support frame (1090) may be placed between the second printed circuit board (1110) and the display (901).

[0113] The support frame (1090) may include a first frame area (1096), a second frame area (1094), and a side frame area (1092). At least one of the first frame area (1096), the second frame area (1094), and the side frame area (1092) may be formed of a conductive material.

[0114] A first frame area (1096) may be positioned between an antenna module (1100) and a display (901). An antenna module (1100) may be positioned on the first frame area (1096). Since the first frame area (1096) is positioned spaced apart from the display (901) by a heat dissipation member (902) and a heat transfer member (904), heat generated from the antenna module (1100) can be prevented from spreading to the display (901). A first surface (e.g., a surface facing the +z-axis direction) (1096a) of the support frame (1090) is a surface facing the display (901), and a second printed circuit board (1110) may be positioned on a second surface (e.g., a surface facing the -z-axis direction) (1096b) facing in the opposite direction to the first surface (1096a).

[0115] The second frame area (1094) is formed of a conductive material and can serve as a grip sensing pad. The second frame area (1094) serving as a grip sensing pad may overlap with the fill cut area (1007) with the solder pad (1060) in between. The solder pad (1060) may be connected to the second frame area (1094) as shown in FIG. 10. A portion of the solder pad (1060) may be electrically connected to the grip sensing line (1160) as shown in FIG. 11.

[0116] According to one embodiment, the second frame region (1094) may be in contact with the rear surface (e.g., the side facing the -Z direction) of the first printed circuit board (1010) through a solder pad (1060). According to another embodiment, a portion of the second frame region (1094) may be in contact with the rear surface (e.g., the side facing the -Z direction) of the first printed circuit board (1010) through a solder pad (1060), and a portion of the second frame region (1094) may be bonded to the rear surface of the first printed circuit board (1010) through a non-conductive adhesive.

[0117] The side frame area (1092) can be bent from the first frame area (1096) toward the second frame area (1094). The second frame area (1094) may be positioned at the same plane height as the antenna module (1100) or may protrude slightly above the antenna module (1100). The side frame area (1092) may be positioned to surround the first frame area (1096) between the first frame area (1096) and the second frame area (1094). Since the antenna module (1100) is mounted within the support frame (1090), the antenna module (1100) can be supported and secured. According to one embodiment, the antenna module (1100) may include an antenna array (1130) comprising at least one patch antenna (1132, 1134, 1136, 1138) (e.g., antennas (432, 434, 436, 438) of FIGS. 3 to 5), a second printed circuit board (1110) (e.g., second printed circuit board (410) of FIGS. 3 to 5) and an RFIC (1120) (e.g., RFIC (420) of FIGS. 3 to 5).

[0118] According to one embodiment, the first frame area (1096) may overlap with the antenna module (1100). The first frame area (1096), the second frame area (1094), and the side frame area (1092) may overlap with the second housing area (914) formed within the slot (920) of the second plate (910). The first frame area (1096), the second frame area (1094), and the side frame area (1092) may not overlap with the first housing area (912), which is a conductive area of ​​the second plate (910).

[0119] According to one embodiment, a second frame area (1094) serving as a grip sensing pad may overlap with a second housing area (914), which is a non-conductive area. The presence or absence of a human body can be determined through a grip sensing signal generated in the second frame area (1094). For example, the second frame area (1094) serving as a grip sensing pad can detect the sum (e.g., self-capacitance) of the capacitance value of the second frame area (1094) itself and the load capacitance value caused by an external object (e.g., a user's finger) gripping the electronic device (1200). Accordingly, the second frame area (1094) serving as a grip sensing pad can generate a grip sensing signal containing information related to the degree of the user's grip and the position of the grip. The grip sensing signal generated in the second frame area (1094) can be transmitted to a sensing circuit unit (1180) via a grip sensing line (1160). The sensing circuit unit (1180) may be embedded within a processor (e.g., processor (120) of FIG. 1) placed on the first printed circuit board (1010), or may be placed on the first printed circuit board (1010) separately from the processor.

[0120] The sensing circuit unit (1180) may include a circuit that processes and handles at least a portion of the signal received from the second frame area (1094) which serves as a grip sensing pad. For example, the sensing circuit unit (1180) may compare the value of the self-capacitance included in the grip sensing signal received from the second frame area (1094) with a threshold value.

[0121] The sensing circuit unit (1180) can control the maximum power intensity of a wireless signal to be transmitted using a communication circuit (e.g., RFIC (720) of FIG. 6b) depending on whether the self-capacitance value corresponds to a range of thresholds. In one embodiment, the operation of the communication circuit to reduce the maximum power intensity of the available wireless signal may be referred to as 'power back off'.

[0122] According to one embodiment, the sensing circuit unit (1180) can control the communication module (e.g., the communication module (190) of FIG. 1) so that a power back off operation is executed when the self-capacitance value is greater than a threshold value.

[0123] According to one embodiment, the sensing circuit unit (1180) can control the communication module (e.g., the communication module (190) of FIG. 1) so that when the self-capacitance value is below a threshold value, the power back-off operation is not performed and the strength of the maximum power of the available wireless signal is maintained.

[0124] FIG. 12 is a drawing showing when a human body approaches an electronic device according to one embodiment. The electronic device described in FIG. 12 may include components similar to the electronic device illustrated in FIG. 9 to FIG. 11b.

[0125] Referring to FIG. 12, a second frame area (1094) serving as a grip sensing pad of an electronic device (1200) according to one embodiment may surround an antenna array (1130) at a minimum distance. A grip sensing operation using the second frame area (1094) may be performed in the area where the antenna array (1130) radiates. Accordingly, when a user's finger, which is a local part of the human body, an external object, approaches the radiating area of ​​the antenna array (1130), the user's finger may be within the grip sensing coverage.

[0126] For example, when a human body approaches the radiation area of ​​the antenna array (1130), self-capacitance can be formed by the second frame area (1094) overlapping with an external object with the second housing area (914), which is a non-conductive area, in between. When the human body, which is an external object, approaches the second housing area (914) that overlaps with the second frame area (1094), the self-capacitance can be increased. In this way, changes in self-capacitance can be sensed through the second frame area (1094), which acts as a grip sensing pad, and thereby, whether the human body is present within the radiation area of ​​the antenna array (1130) can be detected.

[0127] FIG. 13 is a plan view showing the arrangement relationship between an antenna module and a grip sensing pad of an electronic device according to various embodiments, and FIG. 14 is a drawing showing when a human body approaches the electronic device shown in FIG. 13.

[0128] Referring to FIGS. 13 and 14, an electronic device (1300) according to various embodiments may include a second antenna module (1400) that radiates in the front direction (e.g., +Z direction) (e.g., the second antenna module (251) of FIG. 2a) and a second grip sensing pad (1350) positioned in close proximity to the second antenna module (1400).

[0129] The second antenna module (1400) may be placed in a support frame so as to be placed in a non-active area other than where the screen is displayed, and may be placed in the bezel area of ​​the housing (1401) (e.g., the housing (210) of FIG. 2a and FIG. 2b). For example, the second antenna module (1400) may be placed on a side member of the housing (e.g., the side bezel structure (218) of FIG. 2) or on the first plate (1411) of the housing (e.g., the front plate (202) of FIG. 2). The second antenna module (1400) may include a fourth printed circuit board (1410), an antenna array (1430), and a radio frequency integrate circuit (RFIC) (not shown). The fourth printed circuit board (1410) may be part of the third printed circuit board (1310) (e.g., the first printed circuit board (310) of FIG. 3), or may be formed separately from the third printed circuit board (1310) and electrically connected to the third printed circuit board (1310) through a connecting member (1315). The fourth printed circuit board (1410) may be electrically connected to the third printed circuit board (1310) through the connecting member (1315). An antenna array (1430) may be placed on the fourth printed circuit board (1410). According to another embodiment, a flexible circuit board (FPCB) may be used instead of the fourth printed circuit board (1410).

[0130] An antenna array (1430) may include a plurality of antennas (1432, 1434, 1436, 1438) arranged to form a directional beam radiating in the front direction (e.g., +Z direction). The plurality of antennas (1432, 1434, 1436, 1438) may be formed inside the fourth printed circuit board (1410) or formed on one surface of the fourth printed circuit board (1410). The antenna array (1430) may include a plurality of antennas of the same or different shapes or types. At least one of the plurality of antennas included in the antenna array (1430) may include at least one of a patch antenna, a monopole antenna, a spiral antenna, a wave antenna, a loop antenna, a Vivaldi antenna, or a holographic antenna. For example, the plurality of antennas (1432, 1434, 1436, 1438) included in the antenna array (1430) may be patch antennas.

[0131] The second grip sensing pad (1350) may be positioned in a location that does not affect the performance of the second antenna module (1400). The second grip sensing pad (1350) may be positioned so as not to overlap with the radiation direction of the second antenna array (1430) radiating toward the front of the electronic device (1300) (e.g., the side facing the +Z direction). For example, the second grip sensing pad (1350) may be positioned to face at least one side of the second antenna module (1400). The second grip sensing pad (1350) may be formed in an elliptical or polygonal shape, etc., so that the surface facing the second antenna module (1400) is wide. For example, the second grip sensing pad (1350) may be formed in a rectangular shape, but this is not intended to be limited.

[0132] The second grip sensing pad (1350) can be placed on a third printed circuit board (1310) separated from the fourth printed circuit board (1410) on which the second antenna module (1400) is placed. Accordingly, the second grip sensing pad (1350) can be implemented without reducing the area of ​​the second grip sensing pad (1350) so that a constant capacitance can be maintained even if the second antenna module (1400) is miniaturized.

[0133] The second grip sensing pad (1350) may be formed of a conductive material at a location in ultra-close proximity to the second antenna array (1430) to sensitively recognize the degree of proximity of an external object. The second grip sensing pad (1350) may be placed on the peel-cut area (1370) of the third printed circuit board (1310). The second grip sensing pad (1350) may be formed on at least one conductive layer placed on the third printed circuit board (1310) or on at least one conductive layer included within the third printed circuit board (1310). For example, the second grip sensing pad (1350) may be formed on the conductive layer located at the top among a plurality of conductive layers included within the third printed circuit board (1310). The second grip sensing pad (1350) may be spaced apart from a plurality of conductive layers included within the third printed circuit board (1310) with the slit-shaped peel-cut area (1370) in between.

[0134] According to one embodiment, a solder resist layer for protecting the third printed circuit board (1310) may be removed in an area corresponding to the second grip sensing pad (1350). The solder resist layer may be disposed on the remaining area of ​​the third printed circuit board (1310) excluding the second grip sensing pad (1350).

[0135] The second grip sensing pad (1350) can detect the sum (e.g., self-capacitance) of the capacitance value of the second grip sensing pad (1350) itself and the load capacitance value caused by an external object (e.g., a user's finger) gripping the electronic device. According to one embodiment, when an external object approaches the radiation area of ​​the second antenna module (1400), the second grip sensing pad (1350) may overlap with the external object to form self-capacitance. When the external object approaches the second grip sensing pad (1350), the self-capacitance may increase.

[0136] Accordingly, the second grip sensing pad (1350) can generate a grip sensing signal containing information related to the degree of the user's grip and the position of the grip. The grip sensing signal generated by the second grip sensing pad (1350) can be transmitted to a sensing circuit unit (1380) through a grip sensing line (1360). The sensing circuit unit (1380) may be embedded within a processor (e.g., the processor (120) of FIG. 1) mounted on the third printed circuit board (1310), or may be mounted on the third printed circuit board (1310) separately from the processor.

[0137] The sensing circuit unit (1380) may include a circuit that processes and handles at least a portion of the signal received from the second grip sensing pad (1350). For example, the sensing circuit unit (1380) may compare the value of self-capacitance included in the grip sensing signal received from the second grip sensing pad (1350) with a threshold value. If the self-capacitance value is greater than the threshold value, the sensing circuit unit (1380) may transmit a control signal to a communication module (e.g., communication module (190) of FIG. 1) that limits the maximum power of the wireless signal. If the self-capacitance value is less than or equal to the threshold value, the sensing circuit unit (1380) may transmit a control signal to a communication module (e.g., communication module (190) of FIG. 1) that maintains the maximum power of the wireless signal.

[0138] FIG. 15 is a flowchart for explaining a sensing operation using a grip sensor pad of an electronic device according to various embodiments, and FIG. 16a and FIG. 16b are drawings showing the output power of a wireless signal that varies depending on whether a human body approaches.

[0139] Referring to FIG. 15, in operation S1, the sensing circuit unit can acquire a sensing signal generated from the grip sensing pad. For example, when an external object, such as a human body, approaches, the sensing circuit unit can detect self-capacitance (or the amount of change in self-capacitance) using the grip sensing pad. Self-capacitance may increase when the human body approaches the antenna module compared to when the external object, such as a human body, does not approach the antenna module.

[0140] In operation S2, the processor (e.g., the processor (120) of FIG. 1) can determine whether the sensing signal corresponding to the self-capacitance corresponds to a set signal range. In one embodiment, the set signal range compared with the sensing signal may be a range of detection signals that can be obtained when the human body is within a specified distance range from the electronic device or when the human body is in contact with the electronic device.

[0141] In operation S3, if the sensing signal is greater than the signal strength of the set range, the processor determines that the human body is in close proximity to the antenna module and can set the human body proximity state to working. For example, if the self-capacitance value measured by the sensing circuit unit through the grip sensing pad is greater than the threshold value, the human body proximity state can be set to working. When the human body proximity state is set to working, the processor can limit the strength of the maximum power of the wireless signal as illustrated in FIG. 16a. For example, when the human body proximity state is set to working, the processor can control the maximum and minimum power of the wireless signal to be output alternately. Accordingly, when the maximum and minimum power of the wireless signal are output alternately, the average power is lower than the maximum power, so the time-averaged level of electromagnetic wave exposure can satisfy the regulated range.

[0142] In operation S4, if the sensing signal corresponds to a signal strength within a set range, the processor determines that the human body is not in close proximity to the antenna module and can set the human body proximity state to release. For example, if the self-capacitance value measured by the sensing circuit unit through the grip sensing pad is less than or equal to a threshold value, the human body proximity state can be set to release. When the human body proximity state is set to release, the processor can maintain the maximum power strength of the wireless signal as illustrated in FIG. 16b. For example, if the distance between the grip sensing pad, which is positioned close to the antenna module radiating in either the front or rear direction of the electronic device, and the human body exceeds 10 to 15.0 mm, the processor can output the maximum power strength of the wireless signal. Accordingly, since the maximum power of the wireless signal can be continuously transmitted when the human body is not in close proximity, the throughput lost due to the minimum power output intermittently when the human body is in close proximity can be compensated.

[0143] According to various embodiments, an embodiment including a grip sensing pad can secure equivalent RF performance compared to a comparative example that does not include a grip sensing pad.

[0144] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0146] An electronic device according to various embodiments may include: a housing having at least a portion of a non-conductive region; a first printed circuit board having a cavity and a fill-cut region that overlap with the non-conductive region; an antenna module having at least one antenna array disposed within the cavity; a support frame coupled to one side of the first printed circuit board to support the antenna module; a grip sensing pad disposed to surround the cavity and that overlaps with the fill-cut region; and a sensing circuit unit electrically connected to the grip sensing pad to control the output power of the antenna module through the grip sensing pad.

[0147] According to various embodiments, the first printed circuit board includes a circuit region comprising a plurality of insulating layers and a plurality of conductive layers, and the grip sensing pad may be spaced apart from the circuit region with the peel-cut region in between.

[0148] According to various embodiments, the first printed circuit board may further include a solder resist layer disposed on the remaining area excluding the peel-cut area.

[0149] According to various embodiments, the first printed circuit board includes a circuit region comprising a plurality of insulating layers and a plurality of conductive layers, and

[0150] The grip sensing pad above may be disposed on the same plane as the conductive layer disposed at the top of the plurality of conductive layers and made of the same material.

[0151] According to various embodiments, the support frame may include a first frame area on which an antenna module is seated, the antenna module comprising a second printed circuit board spaced apart from the first printed circuit board and an antenna array disposed on the second printed circuit board; a second frame area facing the first printed circuit board; and a side frame area that is bent toward the first printed circuit board from the first frame area.

[0152] According to various embodiments, at least one of the plurality of conductive layers of the first printed circuit board is electrically connected to ground, and the conductive layer of the first printed circuit board electrically connected to ground may be electrically connected to a second frame area of ​​the support frame.

[0153] According to various embodiments, the conductive layer of the first printed circuit board electrically connected to the ground may be spaced apart from the grip sensing pad.

[0154] According to various embodiments, the grip sensing pad may overlap with the first frame area.

[0155] An electronic device according to various embodiments may further include a display spaced apart from a first frame area of ​​the support frame with an air gap in between.

[0156] According to various embodiments, the non-conductive region of the housing overlaps with the grip sensing pad and the antenna module, the conductive region of the housing overlaps with the second frame region, and the antenna module can radiate toward the housing.

[0157] According to various embodiments, the grip sensing pad may have an area corresponding to the antenna module formed in the shape of a hollow frame.

[0158] According to various embodiments, the support frame is

[0159] It may include a first frame area on which the antenna module is mounted, the antenna module comprising a second printed circuit board spaced apart from the first printed circuit board and an antenna array disposed on the second printed circuit board; a second frame area facing the first printed circuit board and operating as the grip sensing pad; and a side frame area that is bent toward the first printed circuit board from the first frame area.

[0160] According to various embodiments, the second frame region can be joined to the fill-cut region through an adhesive or solder pad.

[0161] According to various embodiments, the second frame region may be electrically connected to the sensing circuit unit disposed on the first printed circuit board.

[0162] An electronic device according to various embodiments may further include a heat dissipation member disposed between the first frame area and the display; and a heat transfer member in contact with the first frame area and the heat dissipation member between the first frame area and the heat dissipation member.

[0163] According to various embodiments, the non-conductive region of the housing may overlap with the second frame region and the antenna module.

[0164] An electronic device according to various embodiments may further include a second antenna module that radiates in a direction opposite to that of the first antenna module; and a second grip sensing pad disposed in close proximity to the second antenna module.

[0165] An electronic device according to various embodiments may further include a third printed circuit board having a second peel-cut area on which the second grip sensing pad is disposed; and a fourth printed circuit board on which the second antenna module is disposed.

[0166] According to various embodiments, the third printed circuit board includes a circuit region comprising a plurality of insulating layers and a plurality of conductive layers, and the grip sensing pad may be disposed on the same plane with the same material as the conductive layer disposed at the top of the plurality of conductive layers.

[0167] According to various embodiments, the third printed circuit board includes a circuit region comprising a plurality of insulating layers and a plurality of conductive layers, and the grip sensing pad may be spaced apart from the circuit region with the peel-cut region in between.

[0168] The various embodiments of this document and the terms used therein are not intended to limit the technology described in this document to specific embodiments and should be understood to include various modifications, equivalents, and / or substitutions of such embodiments. In relation to the description of the drawings, similar reference numerals may be used for similar components. A singular expression may include a plural expression unless the context clearly indicates otherwise. In this document, expressions such as "A or B," "at least one of A and / or B," "A, B or C," or "at least one of A, B and / or C" may include all possible combinations of items listed together. Expressions such as "first," "second," "first," or "second" may modify the components, regardless of order or importance, and are used only to distinguish one component from another and do not limit the components. When it is mentioned that a certain (e.g., first) component is "(functionally or telecommunicationally) connected" or "connected" to another (e.g., second) component, said certain component may be directly connected to said other component or connected through another component (e.g., third component).

[0169] In this document, "adapted to or configured to" may be used interchangeably with, depending on the context, for example, hardware- or software-wise, "suitable for," "capable of," "modified to," "made to," "capable of," or "designed to." In some cases, the expression "device configured to" may mean that the device is "capable of" in conjunction with other devices or components. For example, the phrase "processor configured to perform A, B, and C" may refer to a dedicated processor for performing those operations (e.g., an embedded processor), or a general-purpose processor (e.g., a CPU or AP) capable of performing those operations by executing one or more programs stored in a memory device (e.g., memory).

[0170] As used in this document, the term “module” includes a unit composed of hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A “module” may be a component formed as a whole or a minimum unit or part thereof that performs one or more functions. A “module” may be implemented mechanically or electronically and may include, for example, an application-specific integrated circuit (ASIC) chip, field-programmable gate arrays (FPGAs), or programmable logic device, known or under development, that performs certain operations.

[0171] At least a portion of the device (e.g., modules or functions thereof) or method (e.g., operations) according to various embodiments may be implemented as instructions stored in a computer-readable storage medium (e.g., memory) in the form of program modules. When said instructions are executed by a processor (e.g., a processor), the processor may perform a function corresponding to said instructions. Computer-readable recording media may include a hard disk, a floppy disk, a magnetic medium (e.g., magnetic tape), an optical recording medium (e.g., CD-ROM, DVD), a magneto-optical medium (e.g., floptical disk), built-in memory, etc. Instructions may include code generated by a compiler or code that can be executed by an interpreter.

[0172] Each component (e.g., module or program module) according to various embodiments may be composed of a singular or multiple entities, and some of the aforementioned sub-components may be omitted or additional sub-components may be included. Generally or additionally, some components (e.g., module or program module) may be integrated into a single entity to perform the functions performed by each of the respective components prior to integration in the same or similar manner. The operations performed by the module, program module, or other components according to various embodiments may be executed sequentially, in parallel, iteratively, or heuristically, or at least some operations may be executed in a different order, omitted, or additional operations may be added.

Claims

Claim 1 An electronic device comprising: a housing having at least a portion of a non-conductive region; a first printed circuit board having a cavity and a fill-cut region that overlap with the non-conductive region; a first antenna module having at least one antenna array disposed within the cavity; a support frame coupled to one side of the first printed circuit board to support the first antenna module; a grip sensing pad disposed to surround the cavity and that overlaps with the fill-cut region; and a sensing circuit unit electrically connected to the grip sensing pad to control the output power of the first antenna module through the grip sensing pad. Claim 2 In claim 1, the first printed circuit board includes a circuit region comprising a plurality of insulating layers and a plurality of conductive layers, and the grip sensing pad is an electronic device spaced apart from the circuit region with the peel-cut region in between. Claim 3 An electronic device according to claim 1, wherein the first printed circuit board further comprises a solder resist layer disposed on the remaining area excluding the peel-cut area. Claim 4 In claim 1, the first printed circuit board includes a circuit region comprising a plurality of insulating layers and a plurality of conductive layers, and the grip sensing pad is an electronic device disposed on the same plane with the same material as the conductive layer disposed at the top of the plurality of conductive layers. Claim 5 An electronic device according to claim 2, wherein the support frame comprises: a first frame area on which a first antenna module is seated, the first antenna module comprising a second printed circuit board spaced apart from the first printed circuit board and an antenna array disposed on the second printed circuit board; a second frame area facing the first printed circuit board; and a side frame area that is bent toward the first printed circuit board from the first frame area. Claim 6 An electronic device according to claim 5, wherein at least one of the plurality of conductive layers of the first printed circuit board is electrically connected to ground, and the conductive layer of the first printed circuit board electrically connected to ground is electrically connected to a second frame region of the support frame. Claim 7 In claim 6, the conductive layer of the first printed circuit board electrically connected to the ground is disposed spaced apart from the grip sensing pad in an electronic device. Claim 8 In claim 5, the grip sensing pad is an electronic device that overlaps with the first frame area. Claim 9 An electronic device according to claim 5, further comprising a display spaced apart from a first frame area of ​​the support frame with an air gap in between. Claim 10 In claim 5, the non-conductive region of the housing overlaps with the grip sensing pad and the first antenna module, the conductive region of the housing overlaps with the second frame region, and the first antenna module is an electronic device that radiates toward the housing. Claim 11 In claim 1, the grip sensing pad is an electronic device in which the area corresponding to the first antenna module is formed in the shape of an empty frame. Claim 12 An electronic device according to claim 1, wherein the support frame comprises: a first frame area on which a first antenna module is seated, the first antenna module comprising a second printed circuit board spaced apart from the first printed circuit board and an antenna array disposed on the second printed circuit board; a second frame area facing the first printed circuit board and operating as a grip sensing pad; and a side frame area that is bent toward the first printed circuit board in the first frame area. Claim 13 In claim 12, the electronic device wherein the second frame region is joined to the fill-cut region through an adhesive or solder pad. Claim 14 In claim 12, the second frame region is an electronic device electrically connected to the sensing circuit unit disposed on the first printed circuit board. Claim 15 An electronic device according to claim 12, further comprising: a heat dissipation member disposed between the first frame area and the display; and a heat transfer member in contact with the first frame area and the heat dissipation member between the first frame area and the heat dissipation member. Claim 16 In claim 12, the non-conductive region of the housing is an electronic device that overlaps with the second frame region and the first antenna module. Claim 17 An electronic device according to claim 1, further comprising a second antenna module that radiates in a direction opposite to that of the first antenna module; and a second grip sensing pad disposed in close proximity to the second antenna module. Claim 18 An electronic device according to claim 17, further comprising: a third printed circuit board having a second fill-cut area on which the second grip sensing pad is disposed; and a fourth printed circuit board on which the second antenna module is disposed. Claim 19 In claim 18, the third printed circuit board comprises a circuit region including a plurality of insulating layers and a plurality of conductive layers, and the grip sensing pad is an electronic device disposed on the same plane with the same material as the conductive layer disposed at the top of the plurality of conductive layers. Claim 20 In claim 18, the third printed circuit board comprises a circuit region including a plurality of insulating layers and a plurality of conductive layers, and the grip sensing pad is an electronic device spaced apart from the circuit region with the peel-cut region in between.

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