Flexible printed circuits board and foldable electronic device including the same

Abstract

Various embodiments of this document relate to a flexible circuit board and a foldable electronic device including the same, wherein the flexible circuit board comprises a first multilayer region, a second multilayer region, and a high-flexibility region disposed between the first multilayer region and the second multilayer region, wherein the first multilayer region and the second multilayer region comprise a structure in which a plurality of copper clad laminates (CCLs) are laminated, and the high-flexibility region comprises a structure in which a single CCL extending from any one of the plurality of CCLs in the first multilayer region and the second multilayer region is laminated, and wherein the single CCL may be configured such that a first ground wire, a second ground wire, and a plurality of sub-wires spaced apart between the first ground wire and the second ground wire transmit a single RF signal. This document may further include various other embodiments.

Description

Technology Field

[0001] Various embodiments of this document relate to a flexible circuit board and a foldable electronic device including the same. Background Technology

[0002] Electronic devices are pursuing thinness, lightness, miniaturization, and multifunctionality, and to this end, electronic devices may include various types of printed circuit boards on which various components are mounted (e.g., PCB (printed circuit board), PBA (printed board assembly), RFPCB (rigid-flexible PCB), FPCB (flexible printed circuit board) and / or FRC (flexible RF cable)). The problem to be solved

[0003] A foldable electronic device may be positioned so that a flexible circuit board (e.g., FRC) is folded and unfolded in a folding area where the display is folded. The flexible circuit board may be a flexible RF cable (FRC) that includes wiring for transmitting RF signals. As the flexible circuit board is positioned to pass through the folding area, there is a possibility of damage due to the repeated folding and unfolding of the foldable electronic device.

[0004] Various embodiments of the present document can provide a flexible circuit board and an electronic device including the same, which can reduce the risk of damage even during repeated folding or unfolding by providing high flexibility.

[0005] Various embodiments of the present document can provide a flexible circuit board and an electronic device including the same, which can prevent impedance mismatch of RF signals transmitted through a flexible circuit board by preventing interference of the electric field by metal components of the electronic device.

[0006] The technical tasks intended to be accomplished in this document are not limited to those mentioned above, and other technical tasks not mentioned can be clearly understood by a person skilled in the art to which this document belongs from the description below. means of solving the problem

[0007] An electronic device according to various embodiments comprises a first housing, a second housing, a hinge module disposed between the first housing and the second housing so that the second housing can be folded from one end of the first housing, and a flexible circuit board electrically connecting a first electrical component disposed in a first space of the first housing and a second electrical component disposed in a second space of the second housing, wherein the flexible circuit board comprises a first multi-layer region disposed to be connected to a first connector disposed at one end of the flexible circuit board, a second multi-layer region disposed to be connected to a second connector disposed at the other end of the flexible circuit board, and a high-flexibility region disposed between the first multi-layer region and the second multi-layer region, wherein the first multi-layer region and the second multi-layer region comprise a structure in which a plurality of copper clad laminates (CCL) are laminated, and the high-flexibility region comprises the first multi-layer region and the 2. A structure comprising a stacked single CCL extending from one of the multiple CCLs in a multi-layer area, wherein the single CCL disposed in the high bending characteristic area may be configured such that a first ground wire, a second ground wire, and a plurality of sub-wires disposed with a gap between the first ground wire and the second ground wire transmit a single RF signal.

[0008] A flexible circuit board for transmitting an RF signal of an electronic device according to various embodiments comprises: a first multilayer area disposed to be connected to a first connector disposed at one end of the flexible circuit board; a second multilayer area disposed to be connected to a second connector disposed at the other end of the flexible circuit board; and a high-flexibility characteristic area disposed between the first multilayer area and the second multilayer area, wherein the first multilayer area and the second multilayer area comprise a structure in which a plurality of copper clad laminates (CCLs) are laminated, and the high-flexibility characteristic area comprises a structure in which a single CCL extending from any one of the plurality of CCLs in the first multilayer area and the second multilayer area is laminated, and the single CCL disposed in the high-flexibility characteristic area may be configured such that a first ground wire, a second ground wire, and a plurality of sub-wires disposed spaced apart between the first ground wire and the second ground wire transmit a single RF signal. there is. Effects of the invention

[0009] A flexible circuit board and an electronic device including the same according to various embodiments of the present document can reduce the risk of damage even during repeated folding or unfolding by providing a flexible circuit board having high flexibility.

[0010] A flexible circuit board and an electronic device including the same according to various embodiments of the present document can prevent electric field interference caused by metal components of the electronic device, thereby preventing impedance mismatch of RF signals transmitted through the flexible circuit board.

[0011] In addition, various effects that can be identified directly or indirectly through this document may be provided. Brief explanation of the drawing

[0012] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments. FIG. 2 is a block diagram of a wireless communication module, a power management module, and an antenna module of an electronic device according to various embodiments. FIG. 3a is a perspective view of an electronic device showing a flat stage or unfolding state according to various embodiments of the present invention. FIG. 3b is a plan view showing the front of an electronic device in an unfolded state according to various embodiments of the present invention. FIG. 3c is a plan view showing the rear surface of an electronic device in an unfolded state according to various embodiments of the present invention. FIG. 4a is a perspective view of an electronic device illustrating a folding state according to various embodiments of the present invention. FIG. 4b is a perspective view of an electronic device illustrating an intermediate state according to various embodiments of the present invention. FIG. 5 is a drawing showing the rear covers of an electronic device removed according to various embodiments of the present disclosure. FIG. 6 is a drawing showing a flexible circuit board (e.g., a foldable FRC (flexible RF cable)) according to various embodiments of the present disclosure. FIG. 7 is a schematic cross-sectional view of a flexible circuit board according to various embodiments. FIG. 8 is an example schematically illustrating a cross-section of a first portion of a flexible circuit board according to various embodiments. FIG. 9 is a top perspective view of the first part of the flexible circuit board shown in FIG. 8. FIG. 10 is a schematic cross-sectional view of a flexible circuit board according to another embodiment. FIG. 11 is a perspective view of a flexible circuit board according to another embodiment in which sub-ground wiring is formed in a first part of the flexible circuit board. FIG. 12 is a perspective view of a flexible circuit board according to another embodiment in which a ground via is formed in a first part of the flexible circuit board. FIG. 13 is a schematic plan view illustrating a flexible circuit board according to various embodiments. FIG. 14 is a cross-sectional view schematically illustrating a cross-section of a portion of the flexible circuit board shown in FIG. 13. Specific details for implementing the invention

[0013] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or may communicate with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0014] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0015] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0016] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0017] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0018] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0019] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0020] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0021] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0022] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0023] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0024] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0025] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0026] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0027] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0028] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0029] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0030] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) may support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0031] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0032] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0033] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0034] According to one embodiment, commands or data may be transmitted or received between an electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0035] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0036] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as “coupled” or “connected” to another (e.g., 2nd) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0037] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0038] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0039] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or an application store (e.g., Play Store). TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0040] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0041] FIG. 2 is a block diagram (200) of a wireless communication module (192), a power management module (188), and an antenna module (197) of an electronic device (101) according to various embodiments. Referring to FIG. 2, the wireless communication module (192) may include an MST communication module (210) or an NFC communication module (230), and the power management module (188) may include a wireless charging module (250). In this case, the antenna module (297) may include a plurality of antennas, including an MST antenna (297-1) connected to the MST communication module (210), an NFC antenna (297-3) connected to the NFC communication module (230), and a wireless charging antenna (297-5) connected to the wireless charging module (250). For convenience of explanation, components that overlap with FIG. 1 are omitted or described briefly.

[0042] The MST communication module (210) receives a signal from the processor (120) containing control information or payment information such as card information, generates a magnetic signal corresponding to the received signal through the MST antenna (297-1), and then transmits the generated magnetic signal to an external electronic device (102) (e.g., POS device). To generate the magnetic signal, according to one embodiment, the MST communication module (210) includes a switching module (not shown) comprising one or more switches connected to the MST antenna (297-1), and can control the switching module to change the direction of the voltage or current supplied to the MST antenna (297-1) according to the received signal. The change in the direction of the voltage or current enables the direction of the magnetic signal (e.g., magnetic field) transmitted through the MST antenna (297-1) to change accordingly. When a magnetic signal in a state of changing direction is detected by an external electronic device (102), it can cause an effect similar to a magnetic field (e.g., waveform) that occurs when a magnetic card corresponding to the received signal (e.g., card information) is swiped by the card reader of the electronic device (102). According to one embodiment, payment-related information and control signals received in the form of the magnetic signal at the electronic device (102) can be transmitted to an external server (108) (e.g., payment server) via a network (199), for example.

[0043] The NFC communication module (230) can acquire a signal including control information or payment information, such as card information, from the processor (120) and transmit the acquired signal to an external electronic device (102) through the NFC antenna (297-3). According to one embodiment, the NFC communication module (230) can receive a signal transmitted from an external electronic device (102) through the NFC antenna (297-3).

[0044] The wireless charging module (250) can wirelessly transmit power to an external electronic device (102) (e.g., a mobile phone or a wearable device) or wirelessly receive power from an external electronic device (102) (e.g., a wireless charging device) through a wireless charging antenna (297-5). The wireless charging module (250) can support one or more of various wireless charging methods, including, for example, magnetic resonance or magnetic induction methods.

[0045] According to one embodiment, some antennas among the MST antenna (297-1), NFC antenna (297-3), or wireless charging antenna (297-5) may share at least a portion of the radiating portion with each other. For example, the radiating portion of the MST antenna (297-1) may be used as the radiating portion of the NFC antenna (297-3) or the wireless charging antenna (297-5), and vice versa. In this case, the antenna module (297) may include a switching circuit (not shown) configured to selectively connect (e.g., close) or disconnect (e.g., open) at least a portion of the antennas (297-1, 297-3, or 297-5) under the control of a wireless communication module (192) (e.g., MST communication module (210) or NFC communication module (230)) or a power management module (188) (e.g., wireless charging module (250)). For example, when the electronic device (101) uses a wireless charging function, the NFC communication module (230) or the wireless charging module (250) can control the switching circuit to temporarily separate at least a portion of the radiating portion shared by the NFC antenna (297-3) and the wireless charging antenna (297-5) from the NFC antenna (297-3) and connect it to the wireless charging antenna (297-5).

[0046] According to one embodiment, at least one function of the MST communication module (210), NFC communication module (230), or wireless charging module (250) may be controlled by an external processor (e.g., processor (120)). According to one embodiment, designated functions (e.g., payment functions) of the MST communication module (210) or NFC communication module (230) may be performed in a trusted execution environment (TEE). A trusted execution environment (TEE) according to various embodiments may form an execution environment in which at least a designated area of ​​memory (130) is allocated to be used to perform functions requiring a relatively high level of security (e.g., financial transactions, or personal information-related functions). In such cases, access to the designated area may be restricted, for example, depending on the entity accessing it or the application running in the trusted execution environment.

[0047] FIG. 3a is a perspective view of an electronic device showing a flat stage or unfolding state according to various embodiments of the present invention. FIG. 3b is a plan view showing the front of the electronic device in the unfolded state according to various embodiments of the present invention. FIG. 3c is a plan view showing the rear of the electronic device in the unfolded state according to various embodiments of the present invention.

[0048] FIG. 4a is a perspective view of an electronic device illustrating a folding state according to various embodiments of the present invention. FIG. 4b is a perspective view of an electronic device illustrating an intermediate state according to various embodiments of the present invention.

[0049] Referring to FIGS. 3a through 4b, the electronic device (300) may include a pair of housings (310, 320) (e.g., foldable housings) that are rotatably coupled to face each other and fold with respect to a hinge module (e.g., hinge module (580) of FIG. 5). In some embodiments, the hinge module (580) may be positioned in the X-axis direction or in the Y-axis direction. In some embodiments, two or more hinge modules (580) may be positioned to fold in substantially the same direction or in different directions.

[0050] According to one embodiment, the electronic device (300) may include a first display (330) (e.g., a foldable display or a flexible display) disposed in an area formed by a pair of housings (310, 320). According to one embodiment, the first housing (310) and the second housing (320) may be disposed on both sides of a folding axis (axis A) and may have a shape that is substantially symmetric with respect to the folding axis (axis A).

[0051] According to one embodiment, the angle or distance between the first housing (310) and the second housing (320) may differ depending on whether the state of the electronic device (300) is in a flat stage or unfolding state, a folding state, or an intermediate state.

[0052] According to various embodiments, a pair of housings (310, 320) may include a first housing (310) (e.g., a first housing structure) coupled to one end of a hinge module (580) and a second housing (320) (e.g., a second housing structure) coupled to the other end of a hinge module (580).

[0053] According to one embodiment, the first housing (310) may include, in an unfolded state, a first surface (311) facing a first direction (e.g., front direction) (z-axis direction) and a second surface (312) facing a second direction (e.g., rear direction) (-z-axis direction) opposite to the first surface (311).

[0054] According to one embodiment, the second housing (320) may include a third surface (321) facing a first direction (z-axis direction) and a fourth surface (322) facing a second direction (-z-axis direction) when unfolded.

[0055] According to one embodiment, the electronic device (300) can be operated such that, in the unfolded state, the first surface (311) of the first housing (310) and the third surface (321) of the second housing (320) face substantially the same first direction (z-axis direction), and in the folded state, the first surface (311) and the third surface (321) face each other.

[0056] According to one embodiment, the electronic device (300) can be operated such that, in the unfolded state, the second surface (312) of the first housing (310) and the fourth surface (322) of the second housing (320) face substantially the same second direction (- z-axis direction), and in the folded state, the second surface (312) and the fourth surface (322) face opposite directions. For example, in the folded state, the second surface (312) may face the first direction (z-axis direction) and the fourth surface (322) may face the second direction (- z-axis direction).

[0057] According to various embodiments, the first housing (310) may include a first side frame (313) that forms at least partially the exterior of the electronic device (300) and a first rear cover (314) that is coupled to the first side frame (313) and forms at least a part of the second side (312) of the electronic device (300).

[0058] According to one embodiment, the first side frame (313) may include a first side (313a), a second side (313b) extending from one end of the first side (313a), and a third side (313c) extending from the other end of the first side (313a). According to one embodiment, the first side frame (313) may be formed into a rectangular shape (e.g., a square or a rectangle) through the first side (313a), the second side (313b), and the third side (313c).

[0059] According to various embodiments, the second housing (320) may include a second side frame (323) that forms at least partially the exterior of the electronic device (300) and a second rear cover (324) that is coupled to the second side frame (323) and forms at least a part of the fourth side (322) of the electronic device (300).

[0060] According to one embodiment, the second side frame (323) may include a fourth side (323a), a fifth side (323b) extending from one end of the fourth side (323a), and a sixth side (323c) extending from the other end of the fourth side (323b). According to one embodiment, the second side frame (323) may be formed in a rectangular shape through the fourth side (323a), the fifth side (323b), and the sixth side (323c).

[0061] According to various embodiments, a pair of housings (310, 320) are not limited to the illustrated form and combination and may be implemented by other shapes or combinations of parts and / or combinations. For example, in some embodiments, the first side frame (313) may be formed integrally with the first rear cover (314), and the second side frame (323) may be formed integrally with the second rear cover (324).

[0062] According to various embodiments, in the unfolded state, the electronic device (300) can have the second side (313b) of the first side frame (313) and the fifth side (323b) of the second side frame (323) connected without any gap.

[0063] According to one embodiment, in the unfolded state, the third side (313c) of the first side frame (313) and the sixth side (323c) of the second side frame (323) can be connected without any gap.

[0064] According to one embodiment, the electronic device (300) may be configured such that, in an unfolded state, the combined length of the second side (313b) and the fifth side (323b) is longer than the length of the first side (313a) and / or the fourth side (323a). According to one embodiment, the electronic device (300) may be configured such that the combined length of the third side (313c) and the sixth side (323c) is longer than the length of the first side (313a) and / or the fourth side (323a).

[0065] According to various embodiments, the first side frame (313) and / or the second side frame (323) may be formed of metal or may further comprise a polymer injected into the metal. According to one embodiment, the first side frame (313) and / or the second side frame (323) may comprise at least one conductive portion (316 and / or 126) electrically segmented through at least one segmented portion (3161, 3162 and / or 3261, 3262) formed of a polymer. According to one embodiment, the at least one conductive portion may be used as an antenna operating in at least one designated band (e.g., legacy band) by being electrically connected to a wireless communication circuit included in the electronic device (300).

[0066] According to various embodiments, the first rear cover (314) and / or the second rear cover (324) may be formed by, for example, coated or colored glass, ceramic, polymer, or metal (e.g., aluminum, stainless steel (STS), or magnesium) or a combination of at least two of them.

[0067] According to various embodiments, the first display (330) may be positioned to extend from the first surface (311) of the first housing (310) across the hinge module (580) to at least a portion of the third surface (321) of the second housing (320). For example, the first display (330) may include a first planar portion (330a) substantially corresponding to the first surface (311), a second planar portion (330b) corresponding to the second surface (321), and a bendable portion (330c) connecting the first planar portion (330a) and the second planar portion (330b) and corresponding to the hinge module (580).

[0068] According to one embodiment, the electronic device (300) may include a first protective cover (315) (e.g., a first protective frame or a first decorative member) that is coupled along the edge of the first housing (310).

[0069] According to one embodiment, the electronic device (300) may include a second protective cover (325) (e.g., a second protective frame or a second decorative member) that is coupled along the edge of the second housing (320).

[0070] According to one embodiment, the first protective cover (315) and / or the second protective cover (325) may be formed of a metal or polymer material. According to one embodiment, the first protective cover (315) and / or the second protective cover (325) may be used as a decoration member.

[0071] According to one embodiment, the first display (330) may be positioned such that the edge of the first planar portion (330a) is interposed between the first housing (310) and the first protective cover (315). According to one embodiment, the first display (330) may be positioned such that the edge of the second planar portion (330b) is interposed between the second housing (320) and the second protective cover (325).

[0072] According to one embodiment, the electronic device (300) may include a hinge housing (343) (e.g., a hinge cover). According to one embodiment, the hinge housing (343) may support a hinge module (580).

[0073] According to various embodiments, the electronic device (300) may include a second display (331) disposed separately from the first display (330). According to one embodiment, the second display (331) may be disposed to be at least partially exposed on the second surface (312) of the first housing (310). According to one embodiment, the second display (331) may display state information of the electronic device (300) to replace the display function of the first display (330) when the electronic device (300) is in a folded state.

[0074] According to one embodiment, the second display (331) may be positioned so as to be visible from the outside through at least a portion of the first rear cover (314). In some embodiments, the second display (331) may be positioned on the fourth side (324) of the second housing (320). In this case, the second display (331) may be positioned so as to be visible from the outside through at least a portion of the second rear cover (324).

[0075] According to various embodiments, the electronic device (300) may include at least one of an input device (303) (e.g., a microphone), an acoustic output device (301, 302), a sensor module (304), a camera device (305, 308), a key input device (306), or a connector port (307). In the illustrated embodiment, the input device (303) (e.g., microphone), sound output device (301, 302), sensor module (304), camera device (305, 308), key input device (306) or connector port (307) refers to a hole or shape formed in the first housing (310) or the second housing (320), but the parts (e.g., input device (303) (e.g., microphone), sound output device (301, 302), sensor module (304), camera device (305, 308), key input device (306) or connector port (307)) may be defined to include a substantial electronic component (e.g., input device, sound output device, sensor module or camera device) that is placed inside the electronic device (300) and operates through the hole or shape.

[0076] According to various embodiments, the input device (303) may include at least one microphone (303) disposed in the second housing (320). In some embodiments, the input device (303) may include a plurality of microphones (303) disposed to detect the direction of sound. In some embodiments, the plurality of microphones (303) may be disposed in a part of the first housing (310) and / or a part of the second housing (320).

[0077] According to one embodiment, the acoustic output device (301, 302) may include speakers (301, 302). According to one embodiment, the speakers (301, 302) may include a call receiver (301) placed in a first housing (310) and a speaker (302) placed in a second housing (320). In some embodiments, the input device (303), the acoustic output device (301, 302) and the connector port (307) are placed in a space provided by the first housing (310) and / or the second housing (320) of the electronic device (300) and may be exposed to the external environment through at least one hole formed in the first housing (310) and / or the second housing (320).

[0078] According to one embodiment, at least one connector port (307) may be used to transmit and receive power and / or data with an external electronic device. In some embodiments, at least one connector port (e.g., an ear jack hole) may accommodate a connector (e.g., an ear jack) for transmitting and receiving audio signals with an external electronic device. In some embodiments, a hole formed in the first housing (310) and / or the second housing (320) may be used in common for the input device (303) and the acoustic output device (301, 302). In some embodiments, the acoustic output device (301, 302) may further include a piezo speaker.

[0079] According to various embodiments, the sensor module (304) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (300) or an external environmental state.

[0080] According to one embodiment, the sensor module (304) can detect the external environment through the first surface (311) of the first housing (310). In some embodiments, the electronic device (300) may further include at least one sensor module positioned to detect the external environment through the second surface (312) of the first housing (310).

[0081] According to one embodiment, a sensor module (304) (e.g., an illuminance sensor) is positioned below the first display (330) (e.g., in a second direction (-z-axis direction) from the first display (330)) and can detect the external environment through the first display (330).

[0082] According to one embodiment, the sensor module (304) may include at least one of a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, an illuminance sensor, a proximity sensor, a biosensor, an ultrasonic sensor, or an illuminance sensor (304).

[0083] According to various embodiments, the camera device (305, 308) may include a first camera device (305) (e.g., a front camera device) disposed on a first surface (311) of a first housing (310) and a second camera device (308) disposed on a second surface (312) of the first housing (310).

[0084] According to one embodiment, the electronic device (300) may further include a flash (309) positioned near the second camera device (308). According to one embodiment, the camera device (305, 308) may include one or more lenses, an image sensor, and / or an image signal processor.

[0085] According to one embodiment, the flash (309) may include a light-emitting diode or a xenon lamp.

[0086] According to one embodiment, the camera device (305, 308) may be arranged such that two or more lenses (e.g., wide-angle lens, ultra-wide-angle lens, or telephoto lens) and image sensors are located on one side of the electronic device (300) (e.g., first side (311), second side (312), third side (321), or fourth side (322)). In some embodiments, the camera device (305, 308) may include a time of flight (TOF) sensor or a light detection and ranging (LiDAR) sensor and / or an image sensor.

[0087] According to various embodiments, a key input device (306) (e.g., a key button) may be placed on a third side (313c) of a first side frame (313) of a first housing (310). In some embodiments, the key input device (306) may be placed on at least one of the other sides (313a, 313b) of the first housing (310) and / or the sides (323a, 323b, 323c) of the second housing (320). In some embodiments, the electronic device (300) may not include some or all of the key input devices (306), and the key input device (306) that is not included may be implemented in other forms, such as a soft key, on the first display (330). In some embodiments, the key input device (306) may be implemented using a pressure sensor included in the first display (330).

[0088] According to various embodiments, some of the camera devices (305, 308), such as some camera devices (305) or sensor modules (304), may be positioned to be exposed through a first display (330). For example, the first camera device (305) or sensor module (304) may be positioned in the internal space of the electronic device (300) to come into contact with the external environment through an opening (e.g., a through hole) formed at least partially in the first display (330). In another embodiment, some of the camera devices (305, 308), such as some camera devices (305) or sensor modules (304), may be positioned in the internal space of the electronic device (300) to perform their functions without being visually exposed through the first display (330). For example, in this case, the first display (330) may not have an opening formed in the area facing the some camera devices (305) or sensor modules (304).

[0089] Referring to FIG. 3b, an electronic device (300) according to one embodiment may be operated to maintain an intermediate state through a hinge module (580). In this case, the electronic device (300) may control a first display (330) so that different content is displayed in a display area corresponding to the first surface (311) and a display area corresponding to the third surface (321).

[0090] According to one embodiment, the electronic device (300) can be operated through a hinge module (580) to a substantially unfolded state (e.g., the unfolded state of FIG. 1a) and / or a substantially folded state (e.g., the folded state of FIG. 2a) based on a certain inflection angle (e.g., the angle between the first housing (310) and the second housing (320) when in an intermediate state). For example, the electronic device (300) can be operated through the hinge module (580) to transition to an unfolded state (e.g., the unfolded state of FIG. 3a) when a pressure is applied in the unfolding direction (direction B) while in an unfolded state at a certain inflection angle. For example, the electronic device (300) can be operated to transition to a closed state (e.g., the folded state of FIG. 2a) when pressure is applied in the direction of folding (direction C) while it is unfolded at a certain inflection angle through the hinge module (580). In one embodiment, the electronic device (300) may be operated to maintain an unfolded state (not shown) at various angles through the hinge module (580).

[0091] An electronic device according to various embodiments (e.g., the electronic device (101) of FIG. 1) comprises a first housing, a second housing, a hinge module disposed between the first housing and the second housing so that the second housing can be folded from one end of the first housing, and a flexible circuit board (e.g., the flexible circuit board (600) of FIG. 5) electrically connecting a first electrical component disposed in a first space of the first housing and a second electrical component disposed in a second space of the second housing, wherein the flexible circuit board (600) comprises a first multi-layer area (e.g., the first multi-layer area (621) of FIG. 7) disposed to be connected to a first connector disposed at one end of the flexible circuit board (600), and a second multi-layer area (e.g., the second multi-layer area of ​​FIG. 7) disposed to be connected to a second connector disposed at the other end of the flexible circuit board (600). The structure includes a region (622), and a high-flexibility characteristic region (e.g., the first part (610) of FIG. 6) disposed between the first multi-layer region (621) and the second multi-layer region (622), wherein the first multi-layer region (621) and the second multi-layer region (622) comprise a structure in which a plurality of copper clad laminates (CCL) are laminated, and the high-flexibility characteristic region (610) comprises a structure in which a single CCL extending from any one of the plurality of CCLs in the first multi-layer region (621) and the second multi-layer region (622) is laminated, and the single CCL disposed in the high-flexibility characteristic region (610) may be configured such that a first ground wire, a second ground wire, and a plurality of sub-wires (911) disposed spaced apart between the first ground wire and the second ground wire transmit a single RF signal.

[0092] According to one embodiment, the stacked structure of the first multilayer region (621) may include a first CCL extending from a single CCL disposed in the high bending characteristic region (610), a second CCL formed in a first direction from the first CCL, and a third CCL formed in a second direction from the first CCL.

[0093] According to one embodiment, at least one of the first CCL, the second CCL, and the third CCL may be formed as a cross-sectional CCL.

[0094] According to one embodiment, the first CCL can be formed as a cross-sectional CCL.

[0095] According to one embodiment, the plurality of sub-wires (911) include three sub-wires (911), and the impedance of one of the three sub-wires (911) can be determined according to the following mathematical formula.

[0096]

[0097] According to one embodiment, the stacked structure of the first multilayer region (621) may include a first CCL extending from a single CCL disposed in the high bending characteristic region (610), a second CCL formed in a first direction from the first CCL, and a third CCL formed in a second direction from the first CCL.

[0098] According to one embodiment, at least one of the first CCL, the second CCL, and the third CCL may be formed as a cross-sectional CCL.

[0099] According to one embodiment, the first CCL can be formed as a cross-sectional CCL.

[0100] According to one embodiment, a third multilayer area is further included between the first multilayer area (621) and the second multilayer area (622), and the stacking structure of the third multilayer area may be the same as the stacking structure of the first multilayer area (621) and the second multilayer area (622).

[0101] According to one embodiment, a sub-ground wiring disposed between the plurality of sub-wires (911) may be further included.

[0102] According to one embodiment, a plurality of ground vias spaced apart between the plurality of sub-wires (911) may be further included.

[0103] A flexible circuit board (600) for transmitting an RF signal of an electronic device (101) according to various embodiments comprises: a first multi-layer area (621) disposed to be connected to a first connector disposed at one end of the flexible circuit board (600); a second multi-layer area (622) disposed to be connected to a second connector disposed at the other end of the flexible circuit board (600); and a high-flexibility characteristic area (610) disposed between the first multi-layer area (621) and the second multi-layer area (622), wherein the first multi-layer area (621) and the second multi-layer area (622) comprise a structure in which a plurality of copper clad laminates (CCL) are laminated, and the high-flexibility characteristic area (610) comprises a single CCL extending from any one of the plurality of CCLs of the first multi-layer area (621) and the second multi-layer area (622). A single CCL disposed in the high bending characteristic region (610) may be configured to transmit a single RF signal, comprising a first ground wire, a second ground wire, and a plurality of sub-wires (911) spaced apart between the first ground wire and the second ground wire.

[0104] According to one embodiment, the stacked structure of the first multilayer region (621) may include a first CCL extending from a single CCL disposed in the high bending characteristic region (610), a second CCL formed in a first direction from the first CCL, and a third CCL formed in a second direction from the first CCL.

[0105] According to one embodiment, at least one of the first CCL, the second CCL, and the third CCL may be formed as a cross-sectional CCL.

[0106] According to one embodiment, the first CCL can be formed as a cross-sectional CCL.

[0107] According to one embodiment, the plurality of sub-wires (911) include three sub-wires (911), and the impedance of one of the three sub-wires (911) can be determined according to the following mathematical formula.

[0108]

[0109] According to one embodiment, the stacked structure of the first multilayer region (621) may include a first CCL extending from a single CCL disposed in the high bending characteristic region (610), a second CCL formed in a first direction from the first CCL, and a third CCL formed in a second direction from the first CCL.

[0110] According to one embodiment, at least one of the first CCL, the second CCL, and the third CCL may be formed as a cross-sectional CCL.

[0111] According to one embodiment, the first CCL can be formed as a cross-sectional CCL.

[0112] According to one embodiment, a third multilayer area is further included between the first multilayer area (621) and the second multilayer area (622), and the stacking structure of the third multilayer area may be the same as the stacking structure of the first multilayer area (621) and the second multilayer area (622).

[0113] FIG. 5 is a drawing showing the rear covers of an electronic device (500) removed according to various embodiments of the present disclosure.

[0114] The electronic device illustrated in FIG. 5 may include an embodiment that is at least partially similar to or different from the electronic device (101) illustrated in FIG. 1 and / or the electronic device (300) illustrated in FIG. 3a to 4b.

[0115] Referring to FIG. 5, an electronic device (500) according to various embodiments of the present document (e.g., the electronic device (101) shown in FIG. 1 and / or the electronic device (300) shown in FIG. 3a to 4b) may be a foldable device. The electronic device (500) may include a hinge module (580) positioned at a fold position (e.g., a folding area). For example, the electronic device (500) may be folded or unfolded in the y-axis direction relative to the fold position using the hinge module (580). When the electronic device (500) is folded, a first part (501) positioned to correspond to the first housing of the electronic device (500) (e.g., the first housing (310) in FIG. 3a) based on the fold position, and a second part (502) positioned to correspond to the second housing of the electronic device (500) (e.g., the second housing (320) in FIG. 3a) may face each other and be in close proximity.

[0116] According to one embodiment, the electronic device (500) may include a first part (501), a second part (502), a first circuit board (560) disposed in the first part (501), a second circuit board (570) disposed in the second part (502), a plurality of antenna modules, and a flexible circuit board (600) (e.g., a foldable FRC: flexible RF cable). A modem (566), a transceiver (562), and a plurality of front-end modules (564) may be disposed on the first circuit board (560). An antenna feed section (572) connected to at least one antenna module may be disposed on the second circuit board (570). The flexible circuit board (600) may electrically connect the first circuit board (560) of the first part (501) and the second circuit board (570) of the second part (502).

[0117] According to one embodiment, a plurality of antenna modules may include a first antenna module (510, a first main antenna module), a second antenna module (515, a second main antenna module), a third antenna module (520, a sub-1 antenna module), a fourth antenna module (525, e.g., a sub-2 antenna module), a fifth antenna module (530, e.g., a sub-3 antenna module), a sixth antenna module (535, e.g., a sub-4 antenna module), a seventh antenna module (540, e.g., a sub-5 antenna module), an eighth antenna module (545, e.g., a sub-6 antenna module), a first WiFi antenna module (550), and a second WiFi antenna module (555).

[0118] According to one embodiment, the WiFi module is exemplified by a WiFi circuit that supports WiFi communication, but is not limited thereto, and may include, for example, a Bluetooth circuit that supports Bluetooth communication.

[0119] FIG. 6 is a drawing showing a flexible circuit board (500) (e.g., foldable FRC (flexible RF cable)) according to various embodiments of the present disclosure.

[0120] Referring to FIGS. 5 and 6, a flexible circuit board (600) (e.g., foldable FRC) may include a first connector (601), a second connector (602), and wiring portions (610, 620). According to one embodiment, the wiring portions (610, 620) may include a first portion (610) (e.g., a high-flexibility region) that is bent by folding and unfolding of an electronic device (e.g., the electronic device (500) of FIG. 5) and a second portion (620) (e.g., a low-flexibility region) that is not bent. According to one embodiment, the first portion (610) (e.g., a high-flexibility region) of the flexible circuit board (600) (e.g., foldable FRC) may be formed to correspond to the fold position of the electronic device (500). According to one embodiment, a first part (610) of the flexible circuit board (600) may be placed between the second parts (620) of the flexible circuit board (600).

[0121] According to one embodiment, when the electronic device (500) is in a folded state, the first part (501) and the second part (502) may be close to or in contact with each other based on the fold position. In order to prevent the flexible circuit board (600) from being damaged or disconnected at the part where the electronic device (500) is folded (e.g., the fold position), the first part (610) of the flexible circuit board (600) may be placed at the part where the electronic device (500) is folded (e.g., the fold position). For example, the first part (610) of the flexible circuit board (600) may be placed so as to at least overlap with the hinge module (580).

[0122] According to one embodiment, when the electronic device (500) is in an unfolded state, the first part (501) and the second part (502) may be unfolded and separated from each other based on the fold position. In order to prevent the flexible circuit board (600) from being damaged or disconnected at the part where the electronic device (500) is unfolded (e.g., the fold position), the first part (610) of the flexible circuit board (600) may be placed at the part where the electronic device (500) is unfolded (e.g., the fold position). That is, the first part (610) of the flexible circuit board (600) may be placed so as to at least overlap with the hinge module (580).

[0123] According to one embodiment, a flexible circuit board (600) (e.g., foldable FRC) may be formed with a thickness of about 50 µm to 70 µm. Here, a first part (610) (e.g., a high-flexibility region) and a second part (620) (e.g., a low-flexibility region) may be formed to have different thicknesses (see FIG. 7). According to one embodiment, the first part (610) (e.g., a high-flexibility region) may be formed with a thickness of about 50 to 60 µm. According to one embodiment, the second part (620) (e.g., a low-flexibility region) may be formed with a thickness of about 70 µm.

[0124] According to one embodiment, a first connector (601) connected to a connector (562) of a first circuit board may be formed at one end of a flexible circuit board (600) (e.g., foldable FRC). A second connector (602) connected to a connector (564) of a second circuit board may be formed at the other end of a flexible circuit board (600) (e.g., foldable FRC). According to one embodiment, a first circuit board (560) placed in a first part (501) and a second circuit board (570) placed in a second part (502) may be electrically connected to each other by the flexible circuit board (600) (e.g., foldable FRC). For example, transmission and reception of control signals and RF signals may be performed between an electrical component placed in the first part (501) and an electrical component placed in the second part (502) by the flexible circuit board (600) (e.g., foldable FRC).

[0125] FIG. 7 is a schematic cross-sectional view of a flexible circuit board (600) according to various embodiments.

[0126] The flexible circuit board (600) shown in FIG. 7 may include substantially the same or different embodiments as the flexible circuit board (600) shown in FIG. 5 and FIG. 6.

[0127] Referring to FIG. 7, the flexible circuit board (600) may include a first part (610) having relatively high bending characteristics and a second part (620) having relatively low bending characteristics. For example, the first part (610) of the flexible circuit board (600) may have higher bending characteristics than the second part (620) of the flexible circuit board (600).

[0128] According to one embodiment, the second part (620) may include a first multilayer area (621) positioned to be connected to a first connector (e.g., the first connector (601) of FIG. 6) positioned at one end of the flexible circuit board (600), and a second multilayer area (622) connected to a second connector (e.g., the second connector (602) of FIG. 6) positioned at the other end of the flexible circuit board (600).

[0129] According to one embodiment, the laminated structure of the second part (620) may include a multilayer in which a plurality of insulating layers, a plurality of copper foil layers, and a plurality of copper plating layers are laminated. According to one embodiment, the laminated structure of the first multilayer region (621) may include a multilayer in which a plurality of insulating layers, a plurality of copper foil layers, and a plurality of copper plating layers are laminated. According to one embodiment, the laminated structure of the second multilayer region (622) may be substantially the same as the laminated structure of the first multilayer region (621). In another embodiment, the laminated structure of the second multilayer region (622) may differ from the laminated structure of the first multilayer region (621), for example, the second multilayer region (622) may include a greater number of insulating layers, copper foil layers, and copper plating layers than the first multilayer region (621). For example, the first multilayer region (621) may include a greater number of insulating layers, copper foil layers, and copper plating layers than the second multilayer region (622).

[0130] According to one embodiment, the laminated structure of the second part (620) includes a structure in which a plurality of copper clad laminates (CCL: copper clad laminate, or FCCL: flexible copper clad laminate) are laminated, and each copper clad laminate may include a single-sided CCL structure in which a copper clad laminate is formed only in one direction of a specific insulating layer. For example, each of the CCLs arranged to correspond to the second part (620) may include an insulating layer, and a structure in which a copper clad layer is formed only in a first direction (+z direction) from the insulating layer and a copper clad layer is not formed in a second direction (-z direction) from the insulating layer. In the above, the second direction (-z direction) may be defined as opposite to the first direction (+z direction). A flexible circuit board (600) according to various embodiments may increase the flexibility of the flexible circuit board (600) by including a single-sided CCL structure.

[0131] According to one embodiment, the first multi-layer region (621) may include a structure in which a plurality of CCLs are stacked. According to one embodiment, the stacked structure of the first multi-layer region (621) may include a structure in which three CCLs are stacked. According to various embodiments, the number of layers in which CCLs are stacked in the first multi-layer region (621) may be varied. According to one embodiment, the first multi-layer may include a first layer (L1) containing a first CCL, a second layer (L2) formed in a first direction (+z direction) from the first layer (L1) and containing a second CCL, or a third layer (L3) formed in a second direction (-z direction) from the first layer (L1) and containing a third CCL.

[0132] According to one embodiment, the first layer (L1) can form a first CCL by including a first insulating layer (711) and a first copper foil layer (712) formed in a first direction (+z direction) from the first insulating layer (711).

[0133] According to one embodiment, the second layer (L2) can form a second CCL by including a second insulating layer (721) and a second copper foil layer (722) formed in a first direction (+z direction) from the second insulating layer (721).

[0134] According to one embodiment, the third layer (L3) can form a third CCL by including a third insulating layer (731) and a third copper foil layer (732) formed in a second direction (-z direction) from the third insulating layer (731).

[0135] According to one embodiment, a first dielectric adhesive (761) may be disposed between the first layer (L1) and the second layer (L2). According to one embodiment, the first dielectric adhesive (761) may include, for example, prepreg (PPG) or a bonding sheet.

[0136] According to one embodiment, a second dielectric adhesive (763) may be disposed between the first layer (L1) and the third layer (L3). According to one embodiment, the material of the second dielectric adhesive (763) may be substantially the same as the material of the first dielectric adhesive (761).

[0137] According to one embodiment, a first coverlay (741) may be formed as a dielectric in the first direction (+z direction) from the first layer (L1). According to one embodiment, an EMI (electromagnetic interference) film (751) may be formed in the first direction (+z direction) from the first coverlay (741).

[0138] According to one embodiment, a second coverlay (742) may be formed as a dielectric in the second direction (-z direction) from the third layer (L3). According to one embodiment, the first coverlay (741) and the second coverlay (742) may include the same material.

[0139] According to one embodiment, in a first multilayer region (621), a first layer (L1), a second layer (L2), and a third layer (L3) may be electrically connected to each other through vias (791) disposed in at least some areas. According to one embodiment, a flexible circuit board (600) may reduce structural resonance of signal wiring transmitting RF signals by forming at least one via (791) in the first multilayer region (621) and the second multilayer region (622). To this end, at least some of the vias (791) formed in the flexible circuit board (600) may be electrically connected to ground.

[0140] According to one embodiment, in the first multilayer region (621), at least one signal wiring (see FIG. 8) for transmitting an RF signal may be formed in the first copper foil layer (712) of the first layer (L1). According to one embodiment, by forming another metal layer, such as a CCL or EMI film (751) of another layer, in each of the first direction (+z direction) and the second direction (-z direction) from the first layer (L1), RF signal performance may be improved and shielding performance may be enhanced.

[0141] According to various embodiments, the flexible circuit board (600) may not be limited to all CCLs stacked in the second part (620) having a single-sided CCL structure. For example, the second part (620) of the flexible circuit board (600) may include a structure in which a plurality of CCLs are stacked, and at least some of the plurality of CCLs may have a single-sided CCL structure. In some embodiments, the second part (620) may include a structure in which a plurality of CCLs are stacked, and among the plurality of CCLs, only one CCL extending from the CCL placed in the first part (610) may have a single-sided CCL structure. For example, a first CCL forming the first layer (L1) of the flexible circuit board (600) may be arranged to extend from the second part (620) to the first part (610), and the first CCL may have a single-sided CCL structure. For example, in the second part (620) of the flexible circuit board (600), at least one of the remaining CCLs excluding the first CCL, such as the second CCL of the second layer (L2) and the third CCL of the third layer (L3), may include a double-sided CCL structure. Here, the double-sided CCL structure may mean a structure in which a copper foil layer is formed in each of the first direction (+z direction) and the second direction (-z direction) from a specific insulating layer.

[0142] According to one embodiment, the stacking structure of the second multilayer region (622) may be substantially the same as the stacking structure of the first multilayer region (621).

[0143] According to one embodiment, a first portion (610) of a flexible circuit board (600) may be disposed between a first multilayer region (621) and a second multilayer region (622). For example, the first portion (610) may be formed to have a thinner thickness than the first multilayer region (621) and the second multilayer region (622). According to one embodiment, the first multilayer region (621) and the second multilayer region (622) may have a first thickness (d1), and the first portion (610) may have a second thickness (d2) that is thinner than the first thickness (d1).

[0144] According to one embodiment, a first portion (610) of a flexible circuit board (600) may include a cross-sectional CCL (711, 712) extending from a first layer (L1) of a first multi-layer region (621) and leading to a first layer (L1) of a second multi-layer region (622). According to one embodiment, the cross-sectional CCL (711, 712) of the first portion (610) may be formed on the same layer as, for example, the first CCL (711, 712) of the first multi-layer region (621) and the first CCL (711, 712) of the second multi-layer region (622). For example, a cross-sectional CCL disposed in the first part (610) may include a first insulating layer (711) extending from a first insulating layer (711) of the first multi-layer region (621), and a first copper foil layer (712) extending from a first copper foil layer (712) of the first multi-layer region (621). According to one embodiment, the first insulating layer (711) and the first copper foil layer (712) disposed in the first part (610) may be connected to a first layer (L1) of the second multi-layer region (622).

[0145] According to one embodiment, a third coverlay (743) may be disposed in a first direction (+z direction) from the first copper foil layer (712) formed in the first part (610). According to one embodiment, the third coverlay (743) may include the same material as the first coverlay (741).

[0146] FIG. 8 is an example schematically illustrating a cross-section of a first portion (610) of a flexible circuit board (600) according to various embodiments. FIG. 9 is a perspective view taken from above of the first portion (610) of the flexible circuit board (600) illustrated in FIG. 8.

[0147] The first part (610) of the flexible circuit board (600) shown in FIGS. 8 and 9 may include an embodiment that is substantially the same as or different from the first part (610) of the flexible circuit board (600) shown in FIGS. 6 and 7.

[0148] Referring to FIGS. 8 and 9, a first part (610) of a flexible circuit board (600) according to various embodiments may include a plurality of signal wires (820) for transmitting an RF signal or a power signal.

[0149] According to one embodiment, a first part (610) of a flexible circuit board (600) may include a first signal wiring (821) for transmitting a first RF signal. According to one embodiment, the first signal wiring (821) may transmit an RF signal input through a first connector (e.g., the first connector (601) of FIG. 6) of the flexible circuit board (600) to a second connector (e.g., the second connector (602) of FIG. 6). Alternatively, the first signal wiring (821) may transmit an RF signal input through the second connector (602) to the first connector (601). According to one embodiment, the first signal wiring (821) may be branched into a plurality of sub-wires (911) in the first part (610) of the flexible circuit board (600) to transmit an RF signal. For example, the first signal wiring (821) may include three sub-wires (911) spaced apart in the first part (610) of the flexible circuit board (600), and a connecting wiring (912) electrically connecting the three sub-wires (911) at each end of the three sub-wires (911). According to various embodiments, the connecting wiring (912) may be placed in the first part (610) of the flexible circuit board or in the second part (620) of the flexible circuit board. According to various embodiments, the number of sub-wires (911) being three is merely an example and is not limited to multiple.

[0150] According to one embodiment, the first part (610) of the flexible circuit board (600) may further include a plurality of signal wires in addition to the first signal wire (821). For example, the first part (610) of the flexible circuit board (600) may further include a second signal wire (822) for transmitting a second RF signal, or a third signal wire (823) for transmitting a third RF signal. In some embodiments, the first part (610) of the flexible circuit board (600) may further include at least one signal wire (not shown) for transmitting a power signal and a control signal in addition to the first signal wire (821), the second signal wire (822), and the third signal wire (823).

[0151] According to one embodiment, the second signal wiring (822) and the third signal wiring (823) may include a structure substantially identical to the first signal wiring (821). For example, each of the second signal wiring (822) and the third signal wiring (823) may include a plurality of sub-wires (not shown) and a connecting wiring (not shown) that electrically connects the plurality of sub-wires at one end and the other end of the plurality of sub-wires, similar to the first signal wiring (821).

[0152] According to one embodiment, a first portion (610) of a flexible circuit board (600) may include a ground wire (810) formed between signal wires arranged adjacent to each other. According to one embodiment, the ground wire (810) may include a first ground wire (811) arranged on one side (e.g., left direction) of a first signal wire (821), a second ground wire (812) arranged between the first signal wire (821) and the second signal wire (822), a third ground wire (813) arranged between the second signal wire (822) and the third signal wire (823), or a third ground wire (814) arranged on the other side (e.g., right direction) of the third signal wire (823).

[0153] According to one embodiment, the ground wiring (810) and signal wiring (820) formed in the first part (610) of the flexible circuit board (600) may be formed on the same layer. For example, the ground wiring (810) and signal wiring (820) formed in the first part (610) of the flexible circuit board (600) may be formed by a first copper foil layer (712) formed in a first direction (+z direction) from a first insulating layer (711).

[0154] According to one embodiment, each of the first signal wiring (821), the second signal wiring (822), and the third signal wiring (823) disposed in the first part (610) of the flexible circuit board (600) can be designed to match an impedance of 50 ohms (Ω; ohm).

[0155] According to one embodiment, the flexible circuit board (600) can reduce the overall wiring width when matching a 50-ohm (Ω; ohm) impedance by branching a single signal wiring into a plurality of sub-wires (911). For example, when the signal wiring is branched into a plurality of sub-wires (911), the impedance of one branched sub-wire (911) can be determined as in Equation 1. For example, the right-hand term in Equation 1 can increase in proportion to the number of branched sub-wires (911).

[0156]

[0157] A flexible circuit board (600) according to various embodiments can reduce the overall wiring width for transmitting a single RF signal by branching each of the signal wirings (820) that transmit a single RF signal into a plurality of sub-wires (911). For example, the width of a single signal wiring that is 50 ohm impedance matched may be about 500 µm, whereas a signal wiring that is 50 ohm impedance matched and branches into three sub-wires (911) to transmit a single RF signal may be designed to be about 50 µm per sub-wire (911).

[0158] A flexible circuit board (600) according to various embodiments may be advantageous for miniaturization design by reducing the overall width.

[0159] The flexible circuit board (600) according to various embodiments can reduce the effect of electromagnetic noise by reducing capacitance interference when other metal materials are in close proximity to the outside, because the overall wiring width is reduced.

[0160] FIG. 10 is a schematic cross-sectional view of a flexible circuit board (600) according to another embodiment. FIG. 11 is a perspective view of a flexible circuit board (600) according to another embodiment in which a sub-ground wiring is formed in a first part (610) of the flexible circuit board (600). FIG. 12 is a perspective view of a flexible circuit board (600) according to another embodiment in which a ground via is formed in a first part (610) of the flexible circuit board (600).

[0161] The flexible circuit board (600) illustrated in FIGS. 10 to 12 may include embodiments that are at least partially similar or different from the flexible circuit board (600) illustrated in FIGS. 5 to 9. Hereinafter, only the embodiments that differ from FIGS. 10 to 12 will be described.

[0162] Referring to FIG. 10, in a flexible circuit board (600) according to another embodiment, a first portion (610) of the flexible circuit board (600) is disposed between a first multilayer region (621) and a second multilayer region (622), and a third multilayer region (623) may be further formed.

[0163] In another embodiment, the stacking structure of the third multi-layer region (623) may substantially be the same as the stacking structure of the first multi-layer region (621) or the stacking structure of the second multi-layer region (622). For example, the stacking structure of the third multi-layer region (623) may include a structure in which a plurality of CCLs are stacked, similar to the stacking structure of the first multi-layer region (621), wherein the plurality of CCLs may include a cross-sectional CCL structure.

[0164] In another embodiment, the third multi-layer region (623) is positioned between the first multi-layer region (621) and the second multi-layer region (622) to further strengthen the ground design around the signal wirings positioned in the first part (610). For example, as shown in FIG. 11, the first part (610) of the flexible circuit board (600) may form sub-ground wiring (e.g., sub-ground wiring (1101) of FIG. 11) between a plurality of sub-wires (911) by positioning the third multi-layer region (623). For example, as illustrated in FIG. 12, a first portion (610) of a flexible circuit board (600) may form a plurality of ground vias (e.g., ground vias (1201) of FIG. 12) between a plurality of sub-wires (911) by arranging a third multi-layer region (623). Here, the plurality of ground vias (1201) may be spaced apart.

[0165] Referring to FIG. 11, a flexible circuit board (600) according to various embodiments can form a sub-ground wiring (e.g., sub-ground wiring (1101) of FIG. 11) between a plurality of sub-wires (911).

[0166] Referring to FIG. 12, a flexible circuit board (600) according to various embodiments can reduce structural resonance of a plurality of sub-wires (911) transmitting an RF signal by forming ground vias (e.g., ground vias (1201) of FIG. 12) between a plurality of sub-wires (911).

[0167] FIG. 13 is a plan view schematically illustrating a flexible circuit board according to various embodiments. FIG. 14 is a cross-sectional view schematically illustrating a cross-section of a portion of the flexible circuit board shown in FIG. 13.

[0168] The flexible circuit board (600) illustrated in FIGS. 13 and 14 may include embodiments that are at least partially similar or different from the flexible circuit board (600) illustrated in FIGS. 5 to 12. Hereinafter, only the embodiments that differ from FIGS. 13 and 14 will be described.

[0169] Referring to FIG. 13 and FIG. 14, a flexible circuit board (600) according to various embodiments may have a laminated structure of a first portion (610) (e.g., a high-flexibility region) that includes a structure in which a plurality of copper clad laminates (CCL: copper clad laminate, or FCCL: flexible copper clad laminate) are laminated.

[0170] According to various embodiments, the laminated structure of the first part (610) of the flexible circuit board (600) may have each copper clad laminate formed in at least one direction among the upper direction and the lower direction of a specific insulating layer. According to one embodiment, the copper clad laminate placed in the first part (610) may include a double-sided CCL structure placed in the first direction (+z direction) and the second direction (-z direction), respectively, from the specific insulating layer. According to another embodiment, the copper clad laminate placed in the first part (610) may include a single-sided CCL structure placed in only one direction among the first direction (+z direction) and the second direction (-z direction) from the specific insulating layer.

[0171] A first portion (610) of a flexible circuit board (600) according to various embodiments may form a signal wiring (821) (e.g., the first signal wiring (821) of FIG. 9) in a first direction (+z direction) from a specific insulating layer as a double-sided CCL structure, and may form a ground pattern (1321) corresponding to both sides of the signal wiring (821) in a second direction (-z direction) from a specific insulating layer. According to one embodiment, the ground pattern (1321) may be formed on a layer different from the signal wiring (821) and may be placed on both sides of the signal wiring (821) along the direction in which the signal wiring (821) extends.

[0172] According to various embodiments, the first portion (610) of the flexible circuit board (600) may further include at least one ground bridge (1311) that is positioned to cross at least a portion of the signal wiring (821) and connects the ground patterns (1321) positioned on both sides of the signal wiring (821). According to various embodiments, the ground bridge (1311) may have a cross shape. According to various embodiments, there may be multiple ground bridges (1311) and they may be spaced apart along the direction in which the signal wiring (821) extends. According to various embodiments, as the ground bridges (1311) have a cross shape and multiple are spaced apart, they may have a mesh shape that overlaps with at least a portion of the signal wiring (821).

Claims

Claim 1 An electronic device comprises: a first housing; a second housing; a hinge module disposed between the first housing and the second housing so that the second housing can be folded from one end of the first housing; and a flexible circuit board electrically connecting a first electrical component disposed in a first space of the first housing and a second electrical component disposed in a second space of the second housing, wherein the flexible circuit board comprises: a first multi-layer region disposed to be connected to a first connector disposed at one end of the flexible circuit board; and a second multi-layer region disposed to be connected to a second connector disposed at the other end of the flexible circuit board. An electronic device comprising a high-flexibility characteristic region disposed between the first multi-layer region and the second multi-layer region, wherein the first multi-layer region and the second multi-layer region comprise a structure in which a plurality of copper clad laminates (CCL) are laminated, and the high-flexibility characteristic region comprises a structure in which a single CCL extending from any one of the plurality of CCLs in the first multi-layer region and the second multi-layer region is laminated, and the single CCL disposed in the high-flexibility characteristic region comprises a first ground wiring, a second ground wiring, and a signal wiring disposed between the first ground wiring and the second ground wiring and configured to transmit a single RF signal, wherein the signal wiring is branched into a plurality of sub-wires, the plurality of sub-wires are disposed spaced apart from each other, and one end of the plurality of sub-wires is electrically connected by a connecting wire. Claim 2 An electronic device according to claim 1, wherein the stacked structure of the first multilayer region comprises: a first CCL extending from a single CCL disposed in the high bending characteristic region; a second CCL formed in a first direction from the first CCL; and a third CCL formed in a second direction from the first CCL. Claim 3 An electronic device according to claim 2, wherein at least one of the first CCL, the second CCL, and the third CCL is formed as a single-sided CCL. Claim 4 In claim 3, the first CCL is an electronic device formed as a single-sided CCL. Claim 5 An electronic device according to claim 1, wherein the plurality of sub-wires includes three sub-wires, and the impedance of one of the three sub-wires is determined according to the following mathematical formula. Claim 6 delete Claim 7 delete Claim 8 delete Claim 9 An electronic device according to claim 1, further comprising a third multilayer region disposed between the first multilayer region and the second multilayer region, wherein the stacking structure of the third multilayer region is the same as the stacking structure of the first multilayer region and the second multilayer region. Claim 10 An electronic device according to claim 9, further comprising a sub-ground wiring disposed between the plurality of sub-wires. Claim 11 An electronic device according to claim 9, further comprising a plurality of ground vias spaced apart from the plurality of sub-wires. Claim 12 A flexible circuit board for transmitting an RF signal of an electronic device, comprising: a first multi-layer area disposed to be connected to a first connector disposed at one end of the flexible circuit board; and a second multi-layer area disposed to be connected to a second connector disposed at the other end of the flexible circuit board. A flexible circuit board comprising a high-flexibility characteristic region disposed between the first multi-layer region and the second multi-layer region, wherein the first multi-layer region and the second multi-layer region comprise a structure in which a plurality of copper clad laminates (CCL) are laminated, and the high-flexibility characteristic region comprises a structure in which a single CCL extending from any one of the plurality of CCLs in the first multi-layer region and the second multi-layer region is laminated, and the single CCL disposed in the high-flexibility characteristic region comprises a first ground wiring, a second ground wiring, and a signal wiring disposed between the first ground wiring and the second ground wiring and configured to transmit a single RF signal, wherein the signal wiring is branched into a plurality of sub-wires, the plurality of sub-wires are disposed spaced apart from each other, and one end of the plurality of sub-wires is electrically connected by a connecting wire. Claim 13 In claim 12, the stacked structure of the first multilayer region comprises: a first CCL extending from a single CCL disposed in the high bending characteristic region; a second CCL formed in a first direction from the first CCL; and a third CCL formed in a second direction from the first CCL, a flexible circuit board. Claim 14 In claim 13, at least one of the first CCL, the second CCL, and the third CCL is formed as a single-sided CCL, a flexible circuit board. Claim 15 In claim 14, the first CCL is a flexible circuit board formed as a single-sided CCL. Claim 16 A flexible circuit board according to claim 12, wherein the plurality of sub-wires includes three sub-wires, and the impedance of one of the three sub-wires is determined according to the following mathematical formula. Claim 17 delete Claim 18 delete Claim 19 delete Claim 20 A flexible circuit board according to claim 12, further comprising a third multilayer region disposed between the first multilayer region and the second multilayer region, wherein the stacking structure of the third multilayer region is the same as the stacking structure of the first multilayer region and the second multilayer region.

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