Apparatus for manufacturing display device, manufacturing method for display device using the same, and display device manufactured by the same

Abstract

According to one embodiment of the present invention, a manufacturing device for a display device may be provided, comprising: a housing; an electric field application module located within the housing and capable of outputting power; and a heating module located within the housing and capable of emitting heat, wherein the position of the electric field application module is fixed and the heating module is fixed so as to be movable between a first position and a second position.

Description

Technology Field

[0001] The present invention relates to a manufacturing apparatus for a display device, a method for manufacturing a display device using the same, and a display device manufactured by the same. Background Technology

[0002] With the recent rise in interest in information displays, research and development on display devices is continuously being carried out. The problem to be solved

[0003] One objective of the present invention is to provide a manufacturing apparatus for a display device capable of performing an electric field application process and a solvent removal process for a display panel within a single process, a method for manufacturing a display device using the same, and a display device manufactured by the same.

[0004] The problems of the present invention are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by a person skilled in the art from the description below. means of solving the problem

[0005] According to one embodiment of the present invention, a manufacturing device for a display device may be provided, comprising: a housing; an electric field application module located within the housing and capable of outputting power; and a heating module located within the housing and capable of emitting heat, wherein the position of the electric field application module is fixed and the heating module is fixed so as to be movable between a first position and a second position.

[0006] A manufacturing device for a display device may be provided, wherein when the heating module moves from the first position to the second position, the distance between the heating module and the electric field application module decreases.

[0007] A manufacturing device for a display device may be provided, wherein the electric field application module comprises a probe head including a probe tip capable of applying voltage and a module support member for fixing the position of the probe head, and one end of the module support member is connected to the probe head and the other end of the module support member is connected to the housing.

[0008] A manufacturing device for a display device may be provided, wherein the probe tip is configured to face from the electric field application module toward the heating module.

[0009] When the heating module is located at the first position, the manufacturing device may be provided with a manufacturing device for a display device capable of receiving a substrate from the outside.

[0010] The above electric field application module may be provided with a manufacturing device for a display device that provides power when the heating module is located at the second position.

[0011] A manufacturing device for a display device may be provided, further comprising a pin module capable of fixing a substrate provided from the outside.

[0012] A manufacturing device for a display device may be provided, wherein the pin module is configured such that a substrate provided from the outside is loaded when the heating module is positioned at the first position.

[0013] A manufacturing device for a display device may be provided, wherein the heating module comprises a heating plate capable of emitting heat, and when the heating module moves from the first position to the second position, the substrate loaded on the pin module is provided on the heating plate.

[0014] A manufacturing device for a display device may be provided, comprising a first space and a second space defined by being partitioned from each other by the heating module, wherein the volume of the second space decreases when the heating module is moved from the first position to the second position.

[0015] A manufacturing device for a display device may be provided, further comprising: a discharge module capable of discharging air within the housing and fluidly connecting the first space and the external area.

[0016] According to another embodiment of the present invention, a method for manufacturing a display device using a device for manufacturing a display device may be provided, comprising: a housing; an electric field application module located within the housing and capable of outputting power; and a heating module located within the housing and capable of emitting heat, wherein the position of the electric field application module is fixed and the heating module is fixed so as to be movable between a first position and a second position, the method comprising: preparing a source substrate provided with ink including a light-emitting element; positioning the heating module at the first position; providing the source substrate within the housing; moving the heating module from the first position to the second position; providing power to at least a portion of the source substrate by the electric field application module; moving the heating module from the second position to the first position; and discharging the source substrate to the outside.

[0017] A method for manufacturing a display device may be provided, wherein when the heating module is located at the first position, the manufacturing device can receive a substrate from the outside.

[0018] A manufacturing device for the above-mentioned display device may further include a pin module capable of fixing the source substrate; and a method for manufacturing the display device may be provided, wherein the step of providing the source substrate includes the step of loading the source substrate onto the pin module.

[0019] In the above loading step, a method for manufacturing a display device may be provided in which the original substrate is physically separated from the heating module.

[0020] A method for manufacturing a display device may be provided, wherein the heating module comprises a heating plate capable of emitting heat, and in the step of moving to the second position, as the heating module moves from the first position to the second position, the original substrate is placed on the heating plate.

[0021] A method for manufacturing a display device may be provided, wherein the above-mentioned original substrate includes a conductive portion comprising a conductive material, the electric field application module includes a probe tip capable of applying voltage, and the step of moving to the second position includes the step of physically contacting the probe tip and the conductive portion.

[0022] A method for manufacturing a display device may be provided, wherein the step of providing the power includes the step of the electric field application module applying power to the conductive part through the probe tip.

[0023] A manufacturing device for the above-mentioned display device may be provided, comprising: a discharge module capable of discharging air within the housing; and a first space and a second space defined by being partitioned from each other by the heating module; wherein the discharge module fluidly connects the first space and an external area, and after the step of moving to the second position, the discharge module further comprises the step of discharging air inside the housing to the outside of the manufacturing device.

[0024] A display device manufactured by the above method of manufacturing a display device may be provided.

[0025] The means for solving the problem of the present invention are not limited to the means for solving the problem described above, and unmentioned means for solving the problem will be clearly understood by those skilled in the art from this specification and the attached drawings. Effects of the invention

[0026] According to one embodiment of the present invention, a manufacturing apparatus for a display device capable of performing an electric field application process and a solvent removal process for a display panel within a single process, a method for manufacturing a display device using the same, and a display device manufactured by the same may be provided.

[0027] The effects of the present invention are not limited to the effects described above, and unmentioned effects will be clearly understood by those skilled in the art from this specification and the accompanying drawings. Brief explanation of the drawing

[0028] FIGS. 1 and FIGS. 2 are a perspective view and a cross-sectional view showing a light-emitting element according to one embodiment. FIG. 3 is a plan view showing a display device including a light-emitting element according to an embodiment. Figure 4 is a cross-sectional view according to I~I' of Figure 3. FIGS. 5 and 6 are cross-sectional views showing a manufacturing apparatus for a display device according to an embodiment. FIGS. 7, FIGS. 9 to 11, and FIG. 13 are drawings of the manufacturing process steps of a display device according to an embodiment. Figure 8 is an enlarged view of the EA1 area of ​​Figure 7. Figure 12 is an enlarged view of the EA2 area of ​​Figure 11. Specific details for implementing the invention

[0029] The embodiments described in this specification are intended to clearly explain the concept of the invention to those skilled in the art to which the invention pertains; therefore, the invention is not limited by the embodiments described in this specification, and the scope of the invention should be interpreted to include modifications or variations that do not depart from the concept of the invention.

[0030] The terms used in this specification have been selected to be as widely used as possible, taking into account their functions in the present invention; however, they may vary depending on the intent, custom, or emergence of new technologies of those skilled in the art to which the present invention pertains. However, if a specific term is defined and used with an arbitrary meaning, the meaning of that term will be described separately. Accordingly, the terms used in this specification should be interpreted based on their actual meaning and the content throughout this specification, rather than merely their names.

[0031] The drawings attached to this specification are intended to facilitate the explanation of the present invention. The shapes depicted in the drawings may be exaggerated as necessary to aid in understanding the present invention, and therefore the present invention is not limited by the drawings.

[0032] In cases where it is determined that a specific description of known configurations or functions related to the present invention in this specification may obscure the essence of the present invention, such detailed description will be omitted as necessary.

[0033] The present invention relates to a manufacturing apparatus for a display device, a method for manufacturing a display device using the same, and a display device manufactured by the same.

[0034] Hereinafter, with reference to FIGS. 1 to 13, a manufacturing apparatus for a display device according to an embodiment, a method for manufacturing a display device using the same, and a display device manufactured by the same will be described.

[0035] Before describing the manufacturing apparatus for a display device according to an embodiment (see '100' in FIG. 5) and the manufacturing apparatus using the same, the display device manufactured by the manufacturing apparatus (100) of the display device will be described with reference to FIG. 1 to FIG. 4.

[0036] FIGS. 1 and 2 illustrate a light-emitting element (LD) included in a display device according to an embodiment. FIGS. 1 and 2 are a perspective view and a cross-sectional view showing a light-emitting element according to one embodiment. FIGS. 1 and 2 illustrate a pillar-shaped light-emitting element (LD), but the type and / or shape of the light-emitting element (LD) is not limited thereto.

[0037] Referring to FIGS. 1 and 2, the light-emitting element (LD) may include a first semiconductor layer (11) and a second semiconductor layer (13), and an active layer (12) interposed between the first and second semiconductor layers (11, 13). For example, if the extension direction of the light-emitting element (LD) is the length (L) direction, the light-emitting element (LD) may include a first semiconductor layer (11), an active layer (12), and a second semiconductor layer (13) that are sequentially stacked along the length (L) direction.

[0038] The light-emitting element (LD) may be provided in a columnar shape extending along one direction. The light-emitting element (LD) may have a first end (EP1) and a second end (EP2). One of the first and second semiconductor layers (11, 13) may be disposed at the first end (EP1) of the light-emitting element (LD). The other of the first and second semiconductor layers (11, 13) may be disposed at the second end (EP2) of the light-emitting element (LD).

[0039] According to an embodiment, the light-emitting element (LD) may be a light-emitting element manufactured into a pillar shape through an etching method or the like. In this specification, the term "pillar shape" encompasses a rod-like shape or a bar-like shape that is long in the length (L) direction (i.e., has an aspect ratio greater than 1), such as a cylindrical column or a polygonal column, and the shape of the cross-section is not particularly limited. For example, the length (L) of the light-emitting element (LD) may be larger than its diameter (D) (or the width of the cross-section).

[0040] Light-emitting diodes (LDs) can have a size small enough to be on the nanoscale to microscale. For example, each light-emitting diode (LD) can have a diameter (D) (or width) and / or length (L) in the nanoscale to microscale range. However, the size of the light-emitting diode (LD) is not limited to this, and the size of the light-emitting diode (LD) can be varied depending on the design conditions of various devices that utilize a light-emitting device using the light-emitting diode (LD) as a light source, such as display devices.

[0041] The first semiconductor layer (11) may be a semiconductor layer of the first conductivity type. For example, the first semiconductor layer (11) may include an N-type semiconductor layer. As an example, the first semiconductor layer (11) may include any one of the semiconductor materials of InAlGaN, GaN, AlGaN, InGaN, AlN, and InN, and may include an N-type semiconductor layer doped with a first conductivity type dopant such as Si, Ge, Sn, etc. However, the material constituting the first semiconductor layer (11) is not limited thereto, and the first semiconductor layer (11) may be composed of various other materials.

[0042] The active layer (12) is disposed on the first semiconductor layer (11) and can be formed as a single-quantum well or multi-quantum well structure. The position of the active layer (12) can be varied depending on the type of light-emitting element (LD).

[0043] A clad layer (not shown) doped with a conductive dopant may be formed on the upper and / or lower portions of the active layer (12). For example, the clad layer may be formed as an AlGaN layer or an InAlGaN layer. According to the embodiment, materials such as AlGaN and InAlGaN may be used to form the active layer (12), and various other materials may also constitute the active layer (12).

[0044] The second semiconductor layer (13) is disposed on the active layer (12) and may include a semiconductor layer of a different type from the first semiconductor layer (11). For example, the second semiconductor layer (13) may include a P-type semiconductor layer. As an example, the second semiconductor layer (13) may include at least one semiconductor material among InAlGaN, GaN, AlGaN, InGaN, AlN, and InN, and may include a P-type semiconductor layer doped with a second conductivity type dopant such as Mg. However, the material constituting the second semiconductor layer (13) is not limited thereto, and various other materials may also constitute the second semiconductor layer (13).

[0045] When a voltage greater than the threshold voltage is applied to both ends of the light-emitting element (LD), electron-hole pairs combine in the active layer (12), causing the light-emitting element (LD) to emit light. By controlling the light emission of the light-emitting element (LD) using this principle, the light-emitting element (LD) can be used as a light source for various light-emitting devices, including pixels of a display device.

[0046] The light-emitting element (LD) may further include an insulating film (INF) provided on its surface. The insulating film (INF) may be formed on the surface of the light-emitting element (LD) to surround at least the outer surface of the active layer (12), and may also further surround a portion of the first and second semiconductor layers (11, 13).

[0047] According to an embodiment, the insulating film (INF) may expose both ends of a light-emitting element (LD) having different polarities. For example, the insulating film (INF) may expose one end of each of the first and second semiconductor layers (11, 13) located at the first and second ends (EP1, EP2) of the light-emitting element (LD). In another embodiment, the insulating film (INF) may expose the sides of the first and second semiconductor layers (11, 13) adjacent to the first and second ends (EP1, EP2) of the light-emitting element (LD) having different polarities.

[0048] According to the embodiments, the insulating film (INF) may be composed of at least one insulating material selected from silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiOxNy), aluminum oxide (AlOx), and titanium oxide (TiOx), and may be composed of a single layer or a multilayer (e.g., a double layer composed of aluminum oxide (AlOx) and silicon oxide (SiOx)), but is not necessarily limited thereto. According to the embodiments, the insulating film (INF) may be omitted.

[0049] When an insulating film (INF) is provided to cover the surface of the light-emitting element (LD), particularly the outer surface of the active layer (12), it is possible to prevent the active layer (12) from being short-circuited with the first pixel electrode or the second pixel electrode, etc., which will be described later. Accordingly, electrical stability of the light-emitting element (LD) can be secured.

[0050] In addition, if an insulating film (INF) is provided on the surface of the light-emitting element (LD), surface defects of the light-emitting element (LD) can be minimized, thereby improving lifespan and efficiency. Furthermore, even when multiple light-emitting elements (LDs) are arranged in close proximity to each other, unwanted short circuits between the light-emitting elements (LDs) can be prevented.

[0051] In one embodiment, the light-emitting element (LD) may include additional components in addition to the first semiconductor layer (11), the active layer (12), the second semiconductor layer (13), and / or the insulating film (INF) surrounding them. For example, the light-emitting element (LD) may additionally include one or more phosphor layers, active layers, semiconductor layers, and / or electrode layers disposed on one side of the first semiconductor layer (11), the active layer (12), and / or the second semiconductor layer (13). For example, a contact electrode layer may be disposed at the first and second ends (EP1, EP2) of the light-emitting element (LD), respectively. Meanwhile, although a pillar-type light-emitting element (LD) is illustrated in FIGS. 1 and 2, the type, structure, and / or shape of the light-emitting element (LD) may be varied. For example, the light-emitting element (LD) may be formed with a core-shell structure having a polygonal pyramid shape.

[0052] A light-emitting device including the light-emitting element (LD) described above can be used in various types of devices requiring a light source, including display devices. For example, multiple light-emitting elements (LDs) can be arranged within each pixel of a display panel, and the light-emitting elements (LDs) can be used as the light source for each pixel. However, the application fields of the light-emitting element (LD) are not limited to the examples described above. For example, the light-emitting element (LD) can also be used in other types of devices requiring a light source, such as lighting devices.

[0053] FIG. 3 is a plan view showing a display device including a light-emitting element according to an embodiment.

[0054] FIG. 3 illustrates an example of an electronic device capable of using a light-emitting element (LD) as a light source, specifically a display panel (PNL) provided in the display device. FIG. 3 briefly illustrates the structure of the display panel (PNL) with the display area (DA) as the center. However, depending on the embodiment, at least one driving circuit part (e.g., at least one of a scanning driving part and a data driving part), wiring, and / or pads that are not illustrated may be further disposed in the display panel (PNL).

[0055] Referring to FIG. 3, the display panel (PNL) may include a substrate (SUB) and a pixel (PXL) disposed on the substrate (SUB). A plurality of pixels (PXL) may be provided on the substrate (SUB).

[0056] The substrate (SUB) constitutes the base member of the display panel (PNL) and may be a rigid or flexible substrate or film.

[0057] A display panel (PNL) and a substrate (SUB) for forming the same may include a display area (DA) for displaying an image and a non-display area (NDA) excluding the display area (DA).

[0058] Pixels (PXL) may be arranged in the display area (DA). The pixels (PXL) may include light-emitting elements (LD). Various wirings, pads, and / or embedded circuits connected to the pixels (PXL) of the display area (DA) may be arranged in the non-display area (NDA). The pixels (PXL) may be arranged regularly according to a stripe or pentile array structure, etc. However, the arrangement structure of the pixels (PXL) is not limited thereto, and the pixels (PXL) may be arranged in the display area (DA) in various structures and / or ways.

[0059] According to an embodiment, two or more types of pixels (PXL) emitting different colors of light may be arranged in a display area (DA). For example, a pixel (PXL) may include a first pixel (PXL1) emitting light of a first color, a second pixel (PXL2) emitting light of a second color, and a third pixel (PXL3) emitting light of a third color. At least one first to third pixel (PXL1, PXL2, PXL3) arranged adjacent to each other may constitute a single pixel unit capable of emitting light of various colors. For example, the first to third pixels (PXL1, PXL2, PXL3) may each be a sub-pixel emitting light of a predetermined color. According to an embodiment, the first pixel (PXL1) may be a red pixel emitting red light, the second pixel (PXL2) may be a green pixel emitting green light, and the third pixel (PXL3) may be a blue pixel emitting blue light, but is not limited thereto.

[0060] In one embodiment, the first pixel (PXL1), the second pixel (PXL2), and the third pixel (PXL3) are each equipped with a light source comprising a first color light-emitting element, a second color light-emitting element, and a third color light-emitting element, respectively, so that they can emit light of the first color, the second color, and the third color, respectively. In another embodiment, the first pixel (PXL1), the second pixel (PXL2), and the third pixel (PXL3) are equipped with light-emitting elements that emit light of the same color, but may each emit light of the first color, the second color, and the third color, respectively, by including a color conversion layer and / or a color filter of a different color disposed on each light-emitting element. However, the color, type, and / or number of pixels (PXL) constituting each pixel unit are not particularly limited. That is, the color of the light emitted by each pixel (PXL) can be varied.

[0061] A pixel (PXL) may include at least one light source driven by a predetermined control signal (e.g., a scan signal and a data signal) and / or a predetermined power source (e.g., a first power source and a second power source). In one embodiment, each pixel (PXL) may be configured as an active pixel. However, the type, structure, and / or driving method of the pixels (PXL) that can be applied to a display device is not particularly limited. For example, each pixel (PXL) may be configured as a pixel of a passive or active light-emitting display device with various structures and / or driving methods.

[0062] Hereinafter, with reference to FIG. 4, the stacking structure of each pixel (PXL) will be explained in detail. FIG. 4 is a cross-sectional view according to I to I' of FIG. 3.

[0063] Referring to FIG. 4, the pixel (PXL) may include a substrate (SUB), a pixel circuit part (PCL), and a display element part (DPL).

[0064] The substrate (SUB) may be a rigid or flexible substrate. According to one example, the substrate (SUB) may include a rigid material or a flexible material. According to one example, the flexible material may include at least one of polystyrene, polyvinyl alcohol, polymethyl methacrylate, polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, cellulose triacetate, and cellulose acetate propionate. However, the material of the substrate (SUB) applied to the embodiments of the present invention is not limited to specific examples.

[0065] The pixel circuit (PCL) may include a buffer film (BFL), a transistor (T), a gate insulating film (GI), a first interlayer insulating film (ILD1), a second interlayer insulating film (ILD2), a power line (PL), a first contact hole (CH1), a second contact hole (CH2), and a protective film (PSV).

[0066] A buffer film (BFL) may be located on a substrate (SUB). The buffer film (BFL) can prevent impurities from diffusing from the outside. The buffer film (BFL) may include at least one of metal oxides such as silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiOxNy), and aluminum oxide (AlOx).

[0067] The transistor (T) may be a thin-film transistor. According to one example, the transistor (T) may be a driving transistor among thin-film transistors. The transistor (T) may include a semiconductor layer (SCL), a gate electrode (GE), a source electrode (SE), and a drain electrode (DE).

[0068] The semiconductor layer (SCL) may be located on the buffer film (BFL). The semiconductor layer (SCL) may include at least one of polysilicon, amorphous silicon, and oxide semiconductor.

[0069] The semiconductor layer (SCL) may include a first contact region in contact with the source electrode (SE) and a second contact region in contact with the drain electrode (DE).

[0070] The first contact region and the second contact region may be semiconductor patterns doped with impurities. The region between the first contact region and the second contact region may be a channel region. The channel region may be an intrinsic semiconductor pattern not doped with impurities.

[0071] A gate insulating film (GI) may be provided on a semiconductor layer (SCL). The gate insulating film (GI) may comprise an inorganic material. According to one example, the gate insulating film (GI) may comprise at least one of silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiOxNy), and aluminum oxide (AlOx). According to an embodiment, the gate insulating film (GI) may comprise an organic material.

[0072] The gate electrode (GE) may be located on the gate insulating film (GI). The location of the gate electrode (GE) may correspond to the location of the channel region of the semiconductor layer (SCL). For example, the gate electrode (GE) may be placed on the channel region of the semiconductor layer (SCL) with the gate insulating film (GI) in between.

[0073] The first interlayer insulating film (ILD1) may be located on the gate electrode (GE). The first interlayer insulating film (ILD1), like the gate insulating film (GI), may comprise at least one of silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiOxNy), and aluminum oxide (AlOx).

[0074] The source electrode (SE) and the drain electrode (DE) may be located on the first interlayer insulating film (ILD1). The source electrode (SE) may penetrate the gate insulating film (GI) and the first interlayer insulating film (ILD1) to contact the first contact region of the semiconductor layer (SCL), and the drain electrode (DE) may penetrate the gate insulating film (GI) and the first interlayer insulating film (ILD1) to contact the second contact region of the semiconductor layer (SCL).

[0075] The second interlayer insulating film (ILD2) may be located on the source electrode (SE) and the drain electrode (DE). The second interlayer insulating film (ILD2) may include an inorganic material, similar to the first interlayer insulating film (ILD1) and the gate insulating film (GI). The inorganic material may include at least one of the materials exemplified as constituent materials of the first interlayer insulating film (ILD1) and the gate insulating film (GI), such as silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiOxNy), and aluminum oxide (AlOx). According to an embodiment, the second interlayer insulating film (ILD2) may include an organic material.

[0076] A power line (PL) can be placed on the second interlayer insulating film (ILD2). Power can be supplied to the power line (PL), and the supplied power can be provided to the second connecting wiring (CNL2) through a second contact hole (CH2) electrically connected to the power line (PL).

[0077] The protective film (PSV) may be located on the second interlayer insulating film (ILD2). The protective film (PSV) may cover the power line (PL). The protective film (PSV) may be provided in a form comprising an organic insulating film, an inorganic insulating film, or the organic insulating film disposed on the inorganic insulating film.

[0078] In the protective film (PSV), a first contact hole (CH1) electrically connected to the source electrode (SE) and a second contact hole (CH2) electrically connected to the power line (PL) may be formed.

[0079] The display element part (DPL) may include a first bank (BNK1), a first electrode (ELT1), a second electrode (ELT2), a first insulating film (INS1), a light-emitting element (LD), a first contact electrode (CNE1), a second contact electrode (CNE2), a second insulating film (INS2), a second bank (BNK2), and a third insulating film (INS3).

[0080] The first bank (BNK1) may have a shape protruding in an upward direction, and the first electrode (ELT1) and the second electrode (ELT2) may be arranged on the first bank (BNK1) to form a reflective barrier. By forming a reflective barrier, the light efficiency of the light-emitting element (LD) may be improved.

[0081] A portion of the first electrode (ELT1) may be arranged on a protective film (PSV), and another portion of the first electrode (ELT1) may be arranged on a first bank (BNK1). The first electrode (ELT1) may be a path through which electrical information for a light-emitting element (LD) applied through a first connecting wire (CNL1) can be provided. A portion of the second electrode (ELT2) may be arranged on a protective film (PSV), and another portion of the second electrode (ELT2) may be arranged on a first bank (BNK1). The second electrode (ELT2) may be a path through which electrical information for a light-emitting element (LD) applied through a second connecting wire (CNL2) can be provided.

[0082] The first insulating film (INS1) may be located on the protective film (PSV). The first insulating film (INS1), like the second interlayer insulating film (ILD2), may include at least one of silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiOxNy), and aluminum oxide (AlOx).

[0083] At least a portion of the first insulating film (INS1) is disposed on the first contact electrode (CNE1), the second contact electrode (CNE2), the first electrode (ELT1), and / or the second electrode (ELT2) to stabilize the electrical connection and attenuate external influences.

[0084] A light-emitting element (LD) may be positioned on the first insulating film (INS1). According to one example, the first insulating film (INS1) may have a predetermined groove, at least a portion of the light-emitting element (LD) may be in contact with an end formed from the groove, and another portion of the light-emitting element (LD) may be in contact with another end formed by the groove.

[0085] A light-emitting element (LD) may be located on a first insulating film (INS1) between a first electrode (ELT1) and a second electrode (ELT2). The light-emitting element (LD) may be the light-emitting element (LD) described above with reference to FIGS. 1 and FIGS. 2.

[0086] The second insulating layer (INS2) may be located on the light-emitting element (LD). The second insulating layer (INS2) may be formed to cover an area corresponding to the active layer (12) of the light-emitting element (LD). The second insulating layer (INS2) may include at least one of an organic material or an inorganic material.

[0087] Depending on the embodiment, at least a portion of the second insulating film (INS2) may be located on the back surface of the light-emitting element (LD). The second insulating film (INS2) formed on the back surface of the light-emitting element (LD) may fill the gap between the first insulating film (INS1) and the light-emitting element (LD) during the process in which the second insulating film (INS2) is formed on the light-emitting element (LD).

[0088] The first contact electrode (CNE1) and the second contact electrode (CNE2) may be located on the first insulating film (INS1). The first contact electrode (CNE1) and the second contact electrode (CNE2) may be electrically connected to the first electrode (ELT1) and the second electrode (ELT2), respectively, through a contact hole formed in the first insulating film (INS1).

[0089] The first contact electrode (CNE1) and the second contact electrode (CNE2) may include at least one of a conductive material including ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), and ITZO (Indium Tin Zinc Oxide).

[0090] An electrical signal provided through the first electrode (ELT1) can be provided to a light-emitting element (LD) through the first contact electrode (CNE1), and the light-emitting element (LD) can emit light based on the electrical signal provided. An electrical signal provided through the second electrode (ELT2) can be provided to a light-emitting element (LD) through the second contact electrode (CNE2).

[0091] The second bank (BNK2) may be a structure that defines the light-emitting region of the pixel (PXL). The light-emitting region may refer to an area where light is emitted from a light-emitting element (LD). For example, the second bank (BNK2) may be placed in the boundary area between adjacent light-emitting elements (LDs) to surround the light-emitting elements (LDs) of the pixel (PXL).

[0092] The third insulating film (INS3) may be arranged on the second bank (BNK2), the first contact electrode (CNE1), the second contact electrode (CNE2), and the second insulating film (INS2). The third insulating film (INS3) may include either an organic material or an inorganic material. The third insulating film (INS3) can protect the display element part (DPL) from external influences.

[0093] The arrangement relationship regarding the light-emitting element (LD) and electrode configuration, etc., is not limited to the example described above with reference to FIG. 4, and arrangement relationships according to various modifiable embodiments may be implemented.

[0094] Hereinafter, a manufacturing apparatus (100) for a display device according to an embodiment will be described with reference to FIGS. 5 and 6. FIGS. 5 and 6 are cross-sectional views showing a manufacturing apparatus for a display device according to an embodiment. Referring to FIGS. 5 and 6, the manufacturing apparatus (100) for a display device may include a housing (120), an electric field application module (130), a heating module (140), a pin module (150), and an exhaust module (160). Hereinafter, for convenience, the manufacturing apparatus (100) for a display device will be briefly described as the manufacturing apparatus (100).

[0095] The housing (120) can support the external shape of the manufacturing device (100). The housing (120) is provided in a form that surrounds the internal area of ​​the manufacturing device (100), thereby forming a sealed space. According to one example, the housing (120) may be provided in the form of a chamber. Although not shown in the drawing, an opening / closing area is formed in at least a part of the housing (120), so that a target substrate for manufacturing a display device may be provided from the outside through the opening / closing area. When the opening / closing area of ​​the housing (120) is closed, the internal area of ​​the manufacturing device (100) is sealed, so that the intrusion of external material can be prevented.

[0096] The electric field application module (130) can output power. The electric field application module (130) can form an electric field. The position of the electric field application module (130) can be fixed. The electric field application module (130) may include a module support (132) and a probe head (134).

[0097] The module support (132) can fix the electric field application module (130) at a specific position. The module support (132) can fix the position of the probe head (134). At least a portion of the module support (132) may be physically connected to the housing (120), and another at least portion of the module support (132) may be physically connected to the probe head (134). According to one embodiment, the module support (132) may have an arm shape, but is not limited thereto.

[0098] The probe head (134) can be fixed at a specific position. The probe head (134) can be configured so as not to move. The position of the probe head (134), at least partially physically connected to the module support (132), may not change.

[0099] The probe head (134) may have a bar shape, but is not limited thereto and may be implemented in various shapes and / or structures.

[0100] The probe head (134) may include a probe tip capable of applying voltage. The probe tip may be directed toward a location where a source substrate (see '110' in FIG. 7) may be provided from the outside. The probe tip of the probe head (134) may be directed toward a heating module (140) from an electric field application module (130). Accordingly, when the source substrate (110) is located at the bottom of the probe tip, the probe tip may be electrically connected to at least a portion of the source substrate (110).

[0101] Although not shown in the drawing, the electric field application module (130) may further include a power supply unit capable of supplying a predetermined voltage to the probe head (134). The predetermined voltage supplied from the power supply unit may be provided through the probe tip of the probe head (134).

[0102] The heating module (140) can be moved between a first position and a second position. The heating module (140) can be moved along a third direction (DR3). The heating module (140) can be moved in an up-and-down direction.

[0103] FIG. 5 is a simplified drawing of a manufacturing device (100) when the heating module (140) is located in a first position, and FIG. 6 is a simplified drawing of a manufacturing device (100) when the heating module (140) is located in a second position. The first position may be a lowered position of the heating module (140), and the second position may be a raised position of the heating module (140). The heating module (140) may be movably fixed so as to be movable between the first position and the second position.

[0104] The position of the heating module (140) at the first position may be further separated from the electric field application module (130) than the position of the heating module (140) at the second position. The position of the heating module (140) at the first position may be positioned closer to the bottom of the housing (120) than the position of the heating module (140) at the second position. When the heating module (140) moves from the first position to the second position, the distance between the heating module (140) and the electric field application module (130) may be reduced.

[0105] When the heating module (140) is located at the first position, the manufacturing device (100) can receive the original substrate (110) from the outside. When the heating module (140) is located at the second position, a space can be provided in which the original substrate (110) provided to the manufacturing device (100) can be fixed. For example, in FIG. 6, the heating module (140) is located at the second position, but a separate original substrate (110) is not shown. At this time, a space in which at least the original substrate (110) can be placed can be formed between the electric field application module (130) and the heating module (140) located at the second position.

[0106] The heating module (140) may define a first space (S1) and a second space (S2). The first space (S1) may refer to a lower area of ​​the heating module (140) where the electric field application module (130) is not placed. The second space (S2) may refer to an upper area of ​​the heating module (140) where the electric field application module (130) is placed.

[0107] As the position of the heating module (140) changes, the volume of the first space (S1) and the volume of the second space (S2) may change. For example, if the heating module (140) is moved from the first position to the second position, the volume of the first space (S1) may increase and the volume of the second space (S2) may decrease. Conversely, if the heating module (140) is moved from the second position to the first position, the volume of the second space (S2) may increase and the volume of the first space (S1) may decrease.

[0108] The heating module (140) can provide heat to the outside. The heating module (140) can operate in a heating mode, and when the heating module (140) enters the heating mode, it can emit heat. The heating module (140) may include a driving unit (142) and a heating plate (144).

[0109] There may be at least two driving units (142). One of the driving units (142) may be located on one side of the housing (120), and another of the driving units (142) may be located on the other side of the housing (120). The driving units (142) may be provided in multiple numbers, so that one end of the heating plate (144) is connected to one of the driving units (142), and the other end of the heating plate (144) is connected to another of the driving units (142).

[0110] The driving unit (142) can move the heating plate (144) upward so that the heating module (140) is positioned at the second position, and can move the heating plate (144) downward so that the heating module (140) is positioned at the first position. The upward direction refers to the third direction (DR3), and the downward direction may refer to the opposite direction of the third direction (DR3). The upward direction refers to the direction from the heating module (140) toward the electric field application module (130), and the downward direction may refer to the direction from the electric field application module (130) toward the heating module (140).

[0111] The heating plate (144) may be located below the electric field application module (130). The heating plate (144) may be moved in the upward direction or the downward direction. The heating plate (144) may be moved by the driving unit (142). Referring to FIG. 5, the heating plate (144) may be moved in the downward direction by the driving unit (142) and arranged in the first position. Referring to FIG. 6, the heating plate (144) may be moved in the upward direction by the driving unit (142) and arranged in the second position.

[0112] The heating plate (144) can emit heat. The heat emitted by the heating plate (144) can remove the solvent ('SLV' in FIG. 7) after the electric field application process is performed on the original substrate (110). The heating plate (144) may have a plate shape, and according to one example, the heating plate (144) may be implemented as an oven-type drying device. However, the implementation form and shape of the heating plate (144) are not limited to specific embodiments.

[0113] The pin module (150) can be fixed at a specific location. The pin module (150) may be implemented as a fixed type and may not be moved.

[0114] The pin module (150) can be configured to receive the source substrate (110) when the source substrate (110) is provided to the manufacturing device (100). The source substrate (110) can be provided from the outside and coupled to the pin module (150). The source substrate (110) can be loaded into the pin module (150).

[0115] The original substrate (110) accommodated by the pin module (150) can be placed on the heating plate (144) as the heating module (140) moves in the upward direction. And when the heating module (140) moves in the upward direction and is placed in the second position, the original substrate (110) placed on the heating plate (144) can be moved to a position where it can receive power from the electric field application module (130).

[0116] As described above, the position of the pin module (150) can be fixed in one area. Since the pin module (150) included in the manufacturing device (100) is fixed in one area, the original substrate (110) can be moved to a position where an electric field can be applied without a separate driving operation of the pin module (150) as the original substrate (110) is loaded and the position of the heating module (140) is moved, thereby reducing process costs. In addition, this simplifies the structure of the pin module (150), thereby improving design convenience.

[0117] The discharge module (160) may be located at the bottom of the manufacturing device (100). The discharge module (160) may be positioned at a location corresponding to the first space (S1). The discharge module (160) may fluidly connect the first space (S1) and the external area of ​​the manufacturing device (100).

[0118] The exhaust module (160) can discharge air inside the manufacturing device (100) to the outside. The exhaust module (160) can reduce the pressure inside the housing (120) by discharging air inside the housing (120) to the outside. The exhaust module (160) can make the inside of the manufacturing device (100) a vacuum (or a state equivalent to a vacuum).

[0119] For example, the exhaust module (160) can discharge air from the first space (S1) to the outside and make the inside of the housing (120) a vacuum (or a vacuum-like state).

[0120] Hereinafter, with reference to FIGS. 7 to 13, a method for manufacturing a display device using a manufacturing apparatus (100) according to an embodiment will be described. FIGS. 7, FIGS. 9 to 11, and FIG. 13 are drawings of the manufacturing process steps of a display device according to an embodiment. FIG. 8 is an enlarged view of the EA1 area of ​​FIG. 7. FIG. 12 is an enlarged view of the EA2 area of ​​FIG. 11.

[0121] Referring to FIGS. 7 and 8, an ink process can be performed on a source substrate (110). Ink (INK) output from a printing device (200) can be provided to the source substrate (110). Accordingly, a source substrate (110) provided with ink (INK) containing a light-emitting element (LD) can be prepared.

[0122] First, the source substrate (110) on which the ink process is performed will be described. The source substrate (110) may include a mother substrate (112), a cell (114) for a display panel, a first conductive part (116a), a second conductive part (116b), a first wiring part (118a), and a second wiring part (118b).

[0123] The original substrate (110) may be configured to manufacture a plurality of display panel cells (114) on a mother substrate (112). The mother substrate (112) may refer to a substrate on which a plurality of display panel cells (114) are formed. For example, a plurality of display panel cells (114) may be manufactured simultaneously on the mother substrate (112) in the form of an original substrate (110) and then separated into individual display panel cells (114) through a cutting process (for example, a scribing process).

[0124] A plurality of display panel cells (114) may be provided, and each display panel cell (114) may be located on a base plate (112). The display panel cell (114) may be configured to include a substrate for manufacturing a display panel (PNL). Each display panel cell (114) may include at least a portion of the pixel (PXL) described above with reference to FIG. 4. For example, the display panel cell (114) may include a pixel circuit (PCL).

[0125] The first conductive part (116a) and the second conductive part (116b) may be located on the base plate (112). The first conductive part (116a) may be located on one side of the cell (114) for the display panel, and the second conductive part (116b) may be located on the other side of the display panel (116). The first conductive part (116a) and the second conductive part (116b) may be provided in the form of pads. The first conductive part (116a) and the second conductive part (116b) may include a conductive material. The first conductive part (116a) and the second conductive part (116b) may each be electrically connected to the cell (114) for the display panel.

[0126] The first wiring section (118a) can electrically connect the cell (114) for the display panel and the first conductive section (116a), and the second wiring section (118b) can electrically connect the cell (114) for the display panel and the second conductive section (116b).

[0127] The printing device (200) may include a nozzle portion capable of discharging a liquid fluid to the outside. The printing device (200) may provide ink (INK) onto a source substrate (110), thereby allowing a light-emitting element (LD) contained in the ink (INK) to be positioned on a cell (114) for a display panel. Referring to FIG. 8, the light-emitting element (LD) provided on the cell (114) for a display panel may be arranged between a first electrode (ELT1) and a second electrode (ELT2) when viewed in a planar view.

[0128] The ink (INK) may include a light-emitting element (LD) and a solvent (SLV). As defined herein, the ink (INK) may refer to a liquid mixture that can be provided by a printing device (200). The solvent (SLV) may be a non-solid phase material that allows the light-emitting element (LD) to be dispersed. According to one example, the solvent (SLV) may be a liquid material.

[0129] Referring to FIG. 9, the original substrate (110) may be provided within the manufacturing device (100). The original substrate (110) may be located within the second space (S2) within the housing (120). The original substrate (110) may be loaded into the pin module (150). The original substrate (110) loaded into the pin module (150) may be physically separated from the heating plate (144).

[0130] The manufacturing device (100) can receive the original substrate (110) within the housing (120) when the heating module (140) is located at the first position. That is, the first position of the heating module (140) may mean a state in which the original substrate (110) can be provided from the outside.

[0131] Referring to FIG. 10, the heating module (140) can be moved from the first position to the second position. At this time, the heating module (140) can be raised so that one side of the heating plate (144) is adjacent to the original substrate (110).

[0132] That is, as the heating module (140) moves from the first position to the second position, the original substrate (110) is placed on the heating plate (144), and one side of the original substrate (110) can be connected to the probe head (134) of the electric field application module (130). According to one example, the first conductive part (116a) of the original substrate (110) can be physically in contact with the probe tip of the electric field application module (130), and the second conductive part (116b) of the original substrate (110) can be physically in contact with the probe tip of the electric field application module (130).

[0133] Subsequently, the internal area of ​​the housing (120) is sealed, and the exhaust module (160) can reduce the pressure within the manufacturing device (100). The opening and closing area of ​​the housing (120) is closed, and the exhaust module (160) can discharge air inside the housing (120). The internal pressure of the housing (120) can be reduced by the exhaust module (160) to a vacuum or near a vacuum.

[0134] According to the embodiment, the exhaust module (160) is fluidically connected to the first space (S1) and can exhaust air from the first space (S1). As described above, when the heating module (140) is moved to the second position, the volume of the second space (S2) can be reduced. Since the second space (S2) is partitioned by the heating module (140), removing air from the second space (S2) by the exhaust module (160) may be relatively difficult compared to removing air from the first space (S1). Therefore, in the manufacturing device (100) according to the embodiment, the operation of the exhaust module (160) is performed after the heating module (140) is moved upward and the volume of the second space (S2) is reduced, so that the operational performance of the exhaust module (160) can be improved.

[0135] Referring to FIG. 11, the electric field application module (130) can apply an electric field to a cell (114) for a display panel included in the original substrate (110). Although not clearly illustrated, the probe head (134) can apply power to the first conductive part (116a) and the second conductive part (116b) included in the original substrate (110), respectively.

[0136] The first conductive part (116a) may be electrically connected to the first connecting wire (CNL1) of the pixel (PXL) included in the cell (114) for the display panel, and the second conductive part (116b) may be electrically connected to the second connecting wire (CNL2) of the pixel (PXL) included in the cell (114) for the display panel. Electrical information provided through the first conductive part (116a) may be provided to the first electrode (ELT1) electrically connected to the first connecting wire (CNL1), and electrical information provided through the second conductive part (116b) may be provided to the second electrode (ELT2) electrically connected to the second connecting wire (CNL2). Ultimately, the voltage provided from the probe head (134) of the electric field application module (130) is provided to the first electrode (ELT1) and the second electrode (ELT2), respectively, so that an electric field can be formed between the first electrode (ELT1) and the second electrode (ELT2).

[0137] Referring to FIG. 12, one end of a light-emitting element (LD) may be arranged to face the first electrode (ELT1), and the other end of a light-emitting element (LD) may be arranged to face the second electrode (ELT2). An electric field is formed between the first electrode (ELT1) and the second electrode (ELT2), so that the light-emitting elements (LD) may be biasedly aligned between the first electrode (ELT1) and the second electrode (ELT2) when viewed in a plane. The biased alignment of the light-emitting elements (LD) may mean an alignment state in which the ratio of one end of the light-emitting element (LD) being aligned in contact with the electrode configuration is dominant compared to the ratio of the other end of the light-emitting element (LD) being aligned with the electrode configuration.

[0138] After the electric field application module (130) applies an electric field to the cell (114) for the display panel, the heating module (140) can enter a heating mode. When the heating module (140) enters the heating mode, the temperature of the heating plate (144) can be increased. However, the point at which the heating plate (144) of the heating module (140) switches to the heating mode is not limited to the example described above. For example, to shorten the process time, the heating plate (144) can be switched to the heating mode before the electric field application module (130) applies an electric field.

[0139] And the heating module (140) can apply heat to the cell (114) for the display panel. Heat is provided by the heating module (140) so that the solvent (SLV) contained in the ink (INK) provided to the cell (114) for the display panel can be removed.

[0140] Referring to FIG. 13, the original substrate (110) can be discharged outside the manufacturing device (100). The heating module (140) is moved from the second position to the first position, and the original substrate (110) located on the heating module (140) can be separated from the electric field application module (130). Subsequently, the original substrate (110) can be moved outside the housing (120). The original substrate (110) can be discharged outside the housing (120) when the heating module (140) is located at the first position. That is, the first position of the heating module (140) may mean a state in which the original substrate (110) can be discharged outside the housing (120).

[0141] According to the manufacturing apparatus (100) of the display device according to the embodiment, the electric field application process and the process for drying the solvent (SLV) of the ink (INK) can be performed by a single device. Consequently, according to the manufacturing apparatus (100) of the display device according to the embodiment, process costs can be reduced.

[0142] And in the manufacturing device (100) of the display device according to the embodiment, the electric field application module (130) is fixed at a specific position so that the electric field application process can be performed, and thereby the precision of the electric field application process can be improved.

[0144] The foregoing description is merely an illustrative explanation of the technical concept of the present invention, and those skilled in the art to which the present invention pertains will be able to make various modifications and variations within the scope of the essential characteristics of the present invention. Accordingly, the embodiments of the present invention described above may be implemented separately or in combination.

[0145] Accordingly, the embodiments disclosed in this invention are intended to illustrate, not limit, the technical concept of the invention, and the scope of the technical concept of the invention is not limited by these embodiments. The scope of protection of this invention shall be interpreted by the claims below, and all technical concepts within an equivalent scope shall be interpreted as being included within the scope of rights of this invention. Explanation of the symbols

[0146] LD: Light-emitting element PXL: Pixels DPL: Display component PCL: Pixel circuit 100: Manufacturing device for display devices 110: Original board 112: Mosquito net 114: Display panel 120: Housing 130: Electric field application module 140: Heating module 150: Pin Module 160: Emission module

Claims

Claim 1 delete Claim 2 delete Claim 3 delete Claim 4 delete Claim 5 delete Claim 6 delete Claim 7 delete Claim 8 delete Claim 9 delete Claim 10 delete Claim 11 delete Claim 12 A method for manufacturing a display device using a manufacturing device for a display device, comprising: a housing; an electric field application module located within the housing and capable of outputting power; and a heating module located within the housing and capable of emitting heat; wherein the position of the electric field application module is fixed and the heating module is fixed so as to be movable between a first position and a second position, the method comprising: preparing a source substrate provided with ink including a light-emitting element; positioning the heating module at the first position; providing the source substrate within the housing; moving the heating module from the first position to the second position; providing power to at least a portion of the source substrate by the electric field application module; moving the heating module from the second position to the first position; and discharging the source substrate to the outside. Claim 13 A method for manufacturing a display device according to claim 12, wherein when the heating module is located at the first position, the manufacturing device can receive a substrate from the outside. Claim 14 In claim 12, the manufacturing device of the display device further comprises a pin module capable of fixing the source substrate; and the step of providing the source substrate comprises the step of loading the source substrate onto the pin module; a method for manufacturing a display device. Claim 15 A method for manufacturing a display device according to claim 14, wherein, in the loading step, the original substrate is physically separated from the heating module. Claim 16 A method for manufacturing a display device according to claim 15, wherein the heating module comprises a heating plate capable of emitting heat, and in the step of moving to the second position, as the heating module moves from the first position to the second position, the original substrate is placed on the heating plate. Claim 17 A method for manufacturing a display device according to claim 12, wherein the original substrate comprises a conductive portion including a conductive material, the electric field application module comprises a probe tip capable of applying voltage, and the step of moving to the second position includes the step of physically contacting the probe tip and the conductive portion. Claim 18 A method for manufacturing a display device according to claim 17, wherein the step of providing power comprises the step of the electric field application module applying power to the conductive part through the probe tip. Claim 19 A method for manufacturing a display device according to claim 12, wherein the manufacturing device of the display device comprises: a discharge module capable of discharging air within the housing; and a first space and a second space defined by being partitioned from each other by the heating module; wherein the discharge module fluidly connects the first space and an external area, and after the step of moving to the second position, the discharge module further comprises the step of discharging air inside the housing to the outside of the manufacturing device. Claim 20 An electronic device comprising a display device manufactured by a method for manufacturing a display device according to any one of claims 12 to 19.

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