Film peeling device

Abstract

The present disclosure relates to a film peeling device, and more specifically to a film peeling device that peels off a polymer film by tilting it to remove impurities remaining on a wafer, and comprises a carrier portion disposed on the wafer and including a plurality of holes, and a plurality of driving portions for driving the carrier portion.

Description

Technology Field

[0001] The technical concept of the present disclosure relates to a film peeling device, and more specifically, to a device for peeling a film integrated with the device. Background Technology

[0002] Generally, there is a problem where various impurities, such as fine particles or contaminants, remain on the wafer during the semiconductor manufacturing process. To remove these impurities, a method is utilized in which a film capable of effectively adsorbing fine particles and contaminants is applied to the wafer and then peeled off.

[0003] Specifically, a film containing a polymer is applied to the wafer to remove the contaminants on the wafer. The film applied to the wafer adsorbs the contaminants. Subsequently, the film is peeled off from the wafer, thereby removing the contaminants remaining on the wafer.

[0004] However, in a general method of applying and peeling off a film, when peeling off the film, there is a problem in that the bonding force between the film and the contaminant is insufficient, causing the contaminant to remain on the wafer, and the film cannot be easily peeled off from the wafer. The problem to be solved

[0005] The technical problem that the present disclosure aims to solve is to provide a film peeling device that facilitates the removal of contaminants remaining on a wafer and prevents the polymer film used to remove said contaminants from remaining on said wafer. means of solving the problem

[0006] According to one embodiment of the present disclosure, a film peeling device relates to a film peeling device that peels off a polymer film by tilting it to remove impurities remaining on a wafer, and may include a carrier part disposed on the wafer and having a plurality of holes, and a plurality of driving parts for driving the carrier part.

[0007] According to another embodiment of the present disclosure, a film peeling device relates to a film peeling device for peeling a polymer film that removes impurities remaining on a wafer, comprising: a carrier part disposed on the wafer and having a plurality of holes; a plurality of driving parts for driving the carrier part; a film supply part disposed on the carrier part and supplying a film solution to the wafer surface through the plurality of holes; an electromagnetic part that applies an electric field or a magnetic field to the wafer surface; and a control part that peels the film from the carrier part disposed on the wafer by the plurality of driving parts tilting the carrier part, wherein the carrier part has a hollow part in its internal space, and the electromagnetic part may be disposed in the hollow part. Effects of the invention

[0008] According to one embodiment of the present disclosure, a film peeling device supplies a polymer film solution to a carrier portion having a plurality of holes, and the polymer film solution is peeled off while cured as a whole, thereby easily removing impurities remaining on the wafer surface and, when peeling the polymer film, the polymer film can be easily removed without remaining on the wafer surface. Brief explanation of the drawing

[0009] FIG. 1 is a perspective view of a film peeling device according to one embodiment of the present disclosure, and FIG. 2 is a cross-sectional view of a film peeling device cut along line AA' of FIG. 1. FIGS. 3 and FIGS. 4 are cross-sectional views according to various embodiments of a film peeling device cut along the AA' line of FIG. 1. Figures 5 to 7 are enlarged views of area B of Figure 2. Figure 8 is a cross-sectional view of a film peeling device cut along the AA' line of Figure 1. FIGS. 9 to 12 show the arrangement or shape of a plurality of holes within a carrier portion according to various embodiments of the present disclosure. FIGS. 13 to 19 illustrate the driving process of a film peeling device according to one embodiment of the present disclosure. FIG. 20 is a perspective view of a film peeling device according to another embodiment of the present disclosure. FIGS. 21 to 26 illustrate the driving process of a film peeling device according to another embodiment of the present disclosure. Specific details for implementing the invention

[0010] Hereinafter, various embodiments of the present disclosure are described in detail with reference to the attached drawings so that those skilled in the art can easily implement them. The present disclosure may be embodied in various different forms and is not limited to the embodiments described herein.

[0011] To clearly explain the present disclosure, parts unrelated to the description have been omitted, and the same reference numerals are used for identical or similar components throughout the specification.

[0012] Furthermore, the size and thickness of each component shown in the drawings are depicted arbitrarily for convenience of explanation, and thus the present disclosure is not necessarily limited to what is illustrated. Thicknesses have been enlarged in the drawings to clearly represent various layers and regions. Additionally, in the drawings, the thickness of some layers and regions has been exaggerated for convenience of explanation.

[0013] Furthermore, when it is said that a part, such as a layer, membrane, region, or plate, is "on" or "on" another part, this includes not only the case where it is "immediately above" the other part, but also the case where there is another part in between. Conversely, when it is said that a part is "immediately above" another part, it means that there is no other part in between. Also, saying that a part is "on" or "on" a reference part means that it is located above or below the reference part, and does not necessarily mean that it is located "on" or "on" in the direction opposite to gravity.

[0014] Furthermore, throughout the specification, when a part is described as "including" a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components.

[0015] Additionally, throughout the specification, "planar" means when the subject part is viewed from above, and "cross-sectional" means when the cross-section obtained by vertically cutting the subject part is viewed from the side.

[0016] Hereinafter, embodiments of the present disclosure are described in detail so that those skilled in the art can easily implement them. However, the present disclosure may be embodied in various different forms and is not limited to the embodiments described herein.

[0017] FIG. 1 is a perspective view of a film peeling device (100) according to one embodiment of the present disclosure, and FIG. 2 is a cross-sectional view of the film peeling device (100) cut along line AA' of FIG. 1.

[0018] Referring to FIGS. 1 and 2, in one embodiment, the film peeling device (100) is a device for peeling off a film that removes impurities remaining on a wafer (WF). Specifically, the film peeling device (100) may be a device for removing impurities, which are contaminants remaining on the wafer (WF), by applying a film containing a polymer as a cleaning film onto the wafer (WF), for example, and peeling off the applied film.

[0019] The film peeling device (100) may be a device that physically adheres impurities, such as particles, dust, or contaminants on the surface of a wafer (WF), to the film by means of the adhesive force of the film, and peels the film on which the impurities have been adsorbed from the wafer (WF) to remove impurities remaining on the wafer (WF). Specifically, the film peeling device (100) may be used in a process for cleaning the wafer (WF), such as a cleaning process during a semiconductor process. More specifically, the film peeling device (100) may be utilized in various stages where it is necessary to remove impurities, such as particles, dust, or contaminants remaining on the surface of a wafer (WF), during semiconductor manufacturing processes such as wafer fabrication, oxidation, photolithography, etching, ion implantation, deposition, chemical mechanical polishing, or packaging.

[0020] In one embodiment, the film peeling device (100) includes a carrier portion (110) having a plurality of holes (110H) disposed on a wafer (WF), a plurality of driving portions (120) for driving the carrier portion (110), and a film supply portion (130) disposed on the upper part of the carrier portion (110) and supplying a film solution to the surface of the wafer (WF) through the carrier portion (110). Specifically, the film peeling device (100) can control the polymer film solution provided from the film supply portion (130) to pass through the plurality of holes (110H) of the carrier portion (110) and be supplied to the upper part of the carrier portion (110), and to be peeled from the wafer (WF) after the polymer film solution is cured and integrated with the carrier portion (110).

[0021] The carrier portion (110) may be a member to which a cured polymer film is integrated after a polymer film solution is supplied to a wafer (WF). Specifically, the carrier portion (110) may include a plurality of holes (110H). The plurality of holes (110H) may be hollow portions in at least a portion of the carrier portion (110).

[0022] The carrier portion (110) includes a plurality of holes (110H) which are empty spaces, so that the polymer film solution can be easily supplied from the top of the carrier portion (110) to the surface of the wafer (WF), and when the polymer film solution is cured into a polymer film, it becomes integrated with the carrier portion (110), thereby having the advantage of being easy to peel off from the wafer (WF).

[0023] A plurality of holes (110H) may be open regions that are empty in the Z-axis direction, which is perpendicular to the X-axis direction, in which the wafers (WF) are arranged. Specifically, the widths of the plurality of holes (110H) may be the same. The width of the plurality of holes (110H) may refer to the spacing of the plurality of holes (110H) in the X-axis direction. By arranging the widths of the plurality of holes (110H) equally, the polymer film solution supplied to the surface of the wafer (WF) can be uniformly coated.

[0024] In one embodiment, the carrier portion (110) may have a size greater than or equal to the diameter of the wafer (WF). The carrier portion (110) is intended to remove impurities remaining on the surface of the wafer (WF) by peeling off a polymer film placed on the wafer (WF). Accordingly, the size of the carrier portion (110) may be formed to be large enough to completely cover the surface of the wafer (WF).

[0025] The driving unit (120) may be a member that drives the carrier unit (110). Specifically, the driving unit (120) may be a member that drives the carrier unit (110) so that it is positioned at a predetermined distance from the surface of the wafer (WF). More specifically, the driving unit (120) may be a member that drives the polymer film to be peeled off from the wafer (WF) when the polymer film is cured and integrated with the carrier unit (110).

[0026] In one embodiment, the driving unit (120) may be positioned on the carrier unit (110). The driving unit (120) is positioned in the edge region of the carrier unit (110) so that interference is minimized when the polymer film solution is supplied, and the carrier unit (110) and the cured polymer film can be easily peeled off.

[0027] In one embodiment, the driving unit (120) may include a plurality of members. For example, the driving unit (120) may be composed of two or more members. When the driving unit (120) is composed of a plurality of members and drives the carrier unit (110), it may be arranged in a balanced manner parallel to the wafer (WF). The carrier unit (110) is arranged parallel to the wafer (WF) so that the polymer film is uniformly coated on the surface of the wafer (WF) and can be easily peeled off from the surface of the wafer (WF).

[0028] In one embodiment, the driving unit (120) may include a control unit that tilts the carrier unit (110). The driving unit (120) may drive the driving unit (120) at a predetermined angle to peel the polymer film from the wafer (WF) after the polymer film is integrated with the carrier unit (110). Specifically, to peel the polymer film, the driving unit (120) may drive at least one of the driving units (120) in a direction offset from the X-axis direction, which is the direction in which the wafer (WF) is arranged. The direction offset from the X-axis direction may mean, for example, at least one of the Z-axis direction, the direction between the X-axis and the Y-axis, and the direction between the X-axis, the Y-axis, and the Z-axis.

[0029] In one embodiment, the predetermined angle may mean, for example, an angle of 5° or more. Specifically, the control unit may control at least one of the plurality of driving units (120) to tilt by 5° or more relative to the wafer (WF). By driving at least one of the plurality of driving units (120) at the aforementioned predetermined angle, the polymer film integrated with the carrier unit (110) can be easily peeled off.

[0030] In one embodiment, the control unit may be configured to assist in driving the peeling peeling device (100) by supplying power to the driving unit (120). The control unit may be embedded in the peeling peeling device (100) or disposed separately from the peeling peeling device (100).

[0031] A film supply unit (130) is positioned above a carrier unit (110) and can supply a polymer film solution to the carrier unit (110). Specifically, the film supply unit (130) supplies the polymer film solution to the carrier unit (110) so that the polymer film solution passes through a plurality of holes (110H) and is applied to a wafer (WF).

[0032] In one embodiment, the film supply unit (130) may have a nozzle shape. The film supply unit (130) has a nozzle shape and can appropriately supply a polymer film solution to a targeted area. The film supply unit (130) is a movable or rotatable member and, as needed, can be moved or rotated to an area that minimizes interference with subsequent processes after supplying the polymer film solution to the upper part of the carrier unit (110).

[0033] In one embodiment, the film supply unit (130) may supply the polymer film solution from the surface of the wafer (WF) to an area that fills the plurality of holes (110H) of the carrier unit (110). Specifically, the film supply unit (130) may supply the polymer film solution to a height greater than that of the plurality of holes (110H) of the carrier unit (110) from the surface of the wafer (WF). More specifically, the film supply unit (130) may increase the peeling efficiency of the polymer film when peeling the cured polymer film in a subsequent process by causing the polymer film solution to fill from the surface of the wafer (WF) to a height greater than that of the upper surface of the carrier unit (110) in the Z-axis direction. This is because the cured polymer film is strongly bound to the plurality of holes (110H) of the carrier unit (110), so that more force can be transmitted to the carrier unit (110) when the polymer film is peeled.

[0034] FIGS. 3 and FIGS. 4 are cross-sectional views according to various embodiments of a film peeling device (100) cut along the AA' line of FIG. 1.

[0035] Referring to FIG. 3, in one embodiment, the widths of the plurality of holes (110H) may differ from top to bottom. Specifically, the upper width (L1) and lower width (L2) of the plurality of holes (110H) may differ. More specifically, the upper width (L1) of the plurality of holes (110H) may be smaller than the lower width (L2). Since the upper width (L1) is positioned smaller than the lower width (L2), there is an advantage that the polymer film solution is supplied more quickly when it passes through the upper part of the plurality of holes (110H) and is discharged to the lower part.

[0036] Referring to FIG. 4, in one embodiment, the width spacing of a plurality of holes (110H) may be arranged differently from one another. Specifically, at least one of the plurality of holes (110H) may have an upper width (L1) that is smaller than the lower width (L2), and at least one of the others may have an upper width (L1') that is larger than the lower width (L2'). In this way, by arranging the width spacing of the plurality of holes (110H) differently from one another, the polymer film solution is bonded more strongly to the plurality of holes (110H) when cured, making it easier to peel off the polymer film.

[0037] Figures 5 to 7 are enlarged views of area B of Figure 2.

[0038] Referring to FIG. 5, in one embodiment, the film peeling device (100) may include an electromagnetic part (140) that applies an electric field or a magnetic field to the surface of a wafer (WF). Specifically, the electromagnetic part (140) may apply an electric field or a magnetic field to a polymer film solution to help to more easily adsorb impurities remaining on the wafer (WF).

[0039] More specifically, when the film peeling device (100) is performed on a wafer (WF) that has undergone a chemical mechanical polishing process, it may include particles having magnetization among the abrasives remaining on the surface of the wafer (WF) during the chemical mechanical polishing process. When the electromagnetic part (140) applies an electric field or a magnetic field after applying a polymer film solution to the surface of the wafer (WF), the particles having magnetization may be further adsorbed toward the polymer film solution, thereby improving the efficiency of removing impurities. This is a non-limiting example and may be applicable not only to wafers (WF) that have undergone a chemical mechanical polishing process, but also to all processes in semiconductor manufacturing processes where particles having magnetization remain as impurities on the surface of the wafer (WF).

[0040] In one embodiment, when the electromagnetic part (140) applies an electric field, it may include a plurality of electrode parts having a (+) electrode and a (-) electrode. For example, the electrode having a (+) electrode may be placed at the bottom of the wafer (WF), and the electrode having a (-) electrode may be placed embedded in the carrier part (110). Subsequently, power is supplied to the (+) electrode and the (-) electrode to generate an electric field, and accordingly, particles having magnetization among the particles remaining on the surface of the wafer (WF) may be further adsorbed toward the polymer film solution.

[0041] In another embodiment, when the electromagnetic part (140) applies a magnetic field, it may be a component that induces a magnetic field, such as a coil. For example, a component that induces a magnetic field, such as a coil, may be embedded in the carrier part (110) and arranged in a direction parallel to the wafer (WF). Subsequently, power is supplied to the electromagnetic part (140) to generate a magnetic field, and accordingly, a magnetic field is generated surrounding the carrier part (110), so that particles having a magnetization degree may be further adsorbed toward the polymer film solution.

[0042] In one embodiment, the electromagnetic part (140) may be embedded and disposed in the hollow part (110N) of the carrier part (110). The hollow part (110N) of the carrier part (110) may refer to an empty space disposed inside the frame of the carrier part (110). Specifically, the electromagnetic part (140) being embedded in the carrier part (110) may mean being disposed in the empty space inside the frame of the carrier part (110) which is disposed between a plurality of holes (110H). By embedding and disposing of the electromagnetic part (140) in the hollow part (110N) of the carrier part (110), the adsorption efficiency for impurities disposed on the surface of the wafer (WF) can be increased, and interference with other components can be minimized, thereby increasing process efficiency.

[0043] Referring to FIG. 6, in one embodiment, a curing unit (150) for curing a polymer film solution supplied to the wafer surface may be included. The curing unit (150) may be a member that applies light or heat to the polymer film solution to cure it into a polymer film. Specifically, the curing unit (150) may cure the polymer film solution having fluidity, which is supplied and arranged through the wafer (WF) surface and a plurality of holes (110H) of the carrier unit (110) up to a predetermined thickness on the upper part of the carrier unit (110), so that it hardens.

[0044] In one embodiment, when the curing unit (150) supplies light to the polymer film solution, a polymerization reaction may be performed by a component such as a photoreaction indicator contained in the polymer film solution. The polymer film solution may be cured into a polymer film by the polymerization reaction.

[0045] The light may include, for example, visible light (ultraviolet). Specifically, when the visible light is supplied to the polymer film solution, a substance such as ozone (O3) emitted from the visible light acts as an oxidizing agent to hydrophilize the hydrophobic polymer film solution. As the polymer film solution is cured to become a hydrophilic polymer film, the bonding strength with the hydrophilized wafer (WF) is weakened, thereby enhancing the ability of the cured polymer film to detach from the wafer (WF).

[0046] In one embodiment, when the curing unit (150) supplies heat to the polymer film solution, the heat may be supplied by a heating element, such as a heater, for example. Specifically, the heating element supplies heat to the polymer film solution, and accordingly, the polymer film solution can be cured into the polymer film.

[0047] In one embodiment, when the curing unit (150) supplies heat to the polymer film solution, the curing unit (150) may further place an additional heating unit on the lower part of the wafer (WF). The curing unit (150) may cure the polymer film solution into a polymer film by applying heat to the polymer film solution at a temperature range of 100 to 500°C, specifically 200 to 400°C.

[0048] In one embodiment, the curing portion (150) may be embedded and disposed in the hollow portion (110N) of the carrier portion (110). Specifically, the curing portion (150) being embedded in the carrier portion (110) may mean that it is disposed in the empty space inside the frame of the carrier portion (110) which is disposed between a plurality of holes (110H).

[0049] Referring to FIG. 7, in one embodiment, the crack forming member (160) may be a member that forms a crack in a polymer film solution or a cured polymer film. Specifically, the crack forming member (160) may include, for example, a vibrating member that induces vibration or a solution providing member that supplies a separate solution. The vibrating member may be a member that applies vibration to the polymer film solution or the cured polymer film, and the solution providing member may be a member that provides a solution that induces a crack in the polymer film solution or the cured polymer film.

[0050] In one embodiment, when the crack forming portion (160) is a vibrating member, it may apply vibration to a polymer film solution or a cured polymer film. Specifically, the vibrating member may apply vibration to the polymer film solution before curing to enhance detachment from impurities placed on the surface of the wafer (WF). The vibrating member has the advantage of applying vibration to the polymer film after curing to facilitate the peeling of the polymer film from the surface of the wafer (WF).

[0051] In one embodiment, when the crack forming member (160) is a solution supply member, it may supply a solution that causes cracks in a polymer film solution or a cured polymer film. The solution may be, for example, a solution such as propane alcohol, and may cause cracks to occur in some areas as the polymer film solution or the polymer film expands. When cracks occur in the polymer film solution or the cured polymer film and the polymer film is peeled, the peeling efficiency can be increased.

[0052] In one embodiment, the crack forming part (160) may be embedded and disposed in the hollow part (110N). Specifically, the hardening part (150) being embedded in the carrier part (110) may mean that it is disposed in the empty space inside the frame of the carrier part (110) which is disposed between a plurality of holes (110H). The aforementioned electromagnetic part (140), hardening part (150), and crack forming part (160) may be driven by a control part that drives the aforementioned driving part (120), and may also include cases where they are driven by an independent control part separate from the control part.

[0053] FIGS. 5 to 7 discloses that the electromagnetic part (140), the hardening part (150), and the crack forming part (160) are sequentially stacked and arranged in the hollow part (110N), but this is a non-limiting example and includes cases where the electromagnetic part (140), the hardening part (150), and the crack forming part (160) are stacked and arranged in various orders. Additionally, while FIGS. 7 discloses that the electromagnetic part (140), the hardening part (150), and the crack forming part (160) are sequentially stacked in the Z-axis direction, this is a non-limiting example and may include cases where they are arranged in a line in the X-axis direction, or cases where they are arranged in a combination in the X-axis and Z-axis directions.

[0054] FIG. 8 is a cross-sectional view of a film peeling device (100) cut along the AA' line of FIG. 1.

[0055] Referring to FIG. 8, in the film peeling device (100), at least one of the electromagnetic part (140), the curing part (150), and the crack forming part (160) may be disposed at a predetermined distance from the carrier part (110) rather than being embedded in the carrier part (110), unlike as described in FIG. 5 to 7. Specifically, the electromagnetic part (140), the curing part (150), and the crack forming part (160) may be implemented in an external form rather than being embedded in the carrier part (110).

[0056] In one embodiment, when the electromagnetic part (140) applies an electric field, it may include a plurality of electrode parts having a (+) electrode and a (-) electrode. For example, the electrode having a (+) electrode may be placed at the bottom of the wafer (WF), and the electrode having a (-) electrode may be placed at the top of the carrier part (110). Subsequently, power is supplied to the (+) electrode and the (-) electrode to generate an electric field, and accordingly, particles having magnetization among the particles remaining on the surface of the wafer (WF) may be further adsorbed toward the polymer film solution.

[0057] In another embodiment, when the electromagnetic part (140) applies a magnetic field, it may be a component that induces a magnetic field, such as a coil. For example, a component that induces a magnetic field, such as a coil, may be placed on the upper part of the carrier part (110) and positioned in a direction parallel to the wafer (WF). Subsequently, power is supplied to the electromagnetic part (140) to generate a magnetic field, and accordingly, particles having a magnetization degree may be further adsorbed toward the polymer film solution.

[0058] In one embodiment, when the electromagnetic unit (140) is positioned on top of the carrier unit (110), it may be structured to be driven independently as a separate component to scan the surface area of ​​the wafer (WF) when applying a magnetic field or an electric field to the polymer film solution. In another embodiment, when the electromagnetic unit (140) is positioned on top of the carrier unit (110), it may have a size similar to the diameter of the wafer (WF) and may apply an electric field to the polymer film solution.

[0059] In one embodiment, the curing unit (150) may be spaced apart from the carrier unit (110) and may apply light or heat to the polymer film solution applied from the wafer (WF) to fill a plurality of holes (110H) within the carrier unit (110). Specifically, the curing unit (150) may be positioned on the upper or side of the carrier unit (110) to supply light or heat to the polymer film solution placed on the surface of the wafer (WF) to cure the polymer film solution. The polymer film solution may be hardened by the curing unit (150) and its properties may change into a polymer film. In this way, the polymer film solution is cured and its properties change into a polymer film, thereby enabling it to be easily peeled off from the wafer (WF).

[0060] In one embodiment, the crack forming member (160) is spaced apart from the carrier member (110) to form a crack in the polymer film solution or the polymer film cured from the polymer film solution. For example, if the crack forming member (160) is a vibrating member, the vibrating member may be positioned above or below the carrier member (110) to apply vibration to the polymer film solution or the cured polymer film. At this time, when the vibrating member is positioned in contact with the polymer film solution or the cured polymer film, the efficiency of removing impurities from the surface of the wafer (WF) or the efficiency of peeling the polymer film by vibration can be increased.

[0061] When the crack forming part (160) is a solution providing member, the solution providing member may be positioned above or below the carrier part (110) to provide a solution for crack formation to a polymer film solution or a cured polymer film. At this time, the solution providing member may be a movable member and may be a member that can be easily supplied to the polymer film solution or the cured polymer film.

[0062] FIGS. 9 to 12 show the arrangement or shape according to various embodiments of a plurality of holes (110H) within a carrier portion (110) according to various embodiments of the present disclosure.

[0063] Referring to FIG. 9, in one embodiment, the carrier portion (110) may include a plurality of holes (110H). Specifically, the plurality of holes (110H) are holes distributed on the front surface of the carrier portion (110H) and represent an open area. More specifically, the plurality of holes (110H) may include all kinds of shapes through which a polymer film solution can pass, such as, for example, a circular, triangular, polygonal, or polygonal shape.

[0064] Referring to FIGS. 10 and 11, in one embodiment, the density of a plurality of holes (110H) may differ between the central region and the edge region of the carrier portion (110). The central region and the edge region may be divided into an inner and an outer area based on the half-point of the radius of the carrier portion (110). Specifically, the central region is an area where a concentric circle is drawn for the inner radius (P2) based on the center of the carrier portion (110), and the edge region refers to an area where the central region is subtracted from the area where a concentric circle is drawn for the radius (P1) of the carrier portion (110).

[0065] Referring again to FIG. 10, in one embodiment, the density of the plurality of holes (110H) may be higher in the edge region than in the center region of the carrier portion (110). Referring again to FIG. 11, in one embodiment, the density of the plurality of holes (110H) may be higher in the center region of the carrier portion (110) than in the edge region.

[0066] In this way, the density of the plurality of holes (110H) is formed differently between the central region and the edge region of the carrier portion (110), thereby allowing the polymer film to concentrate environmental factors, such as the degree of adhesion to the wafer (WF), and the external force applied accordingly differently. FIGS. 10 and FIGS. 11 illustrate only cases where the holes are controlled to be placed only in the edge region or the central region of the carrier portion (110), respectively, but this is a non-limiting example, and if the density of the plurality of holes (110H) placed in the edge region and the central region is different, cases where the plurality of holes (110H) are placed in both the edge region and the central region may also be included.

[0067] Referring to FIG. 12, in one embodiment, the plurality of holes (110H) may have a horseshoe shape, for example. Specifically, the plurality of holes (110H) may have a “U-shaped” shape. By having the plurality of holes (110H) have the shape described above, the polymer film formed integrally with the carrier portion (110) is bonded more strongly, and as a result, there is an advantage that it is easy to peel off from the surface of the wafer (WF).

[0068] FIGS. 13 to 19 illustrate the driving process of a film peeling device (100) according to one embodiment of the present disclosure.

[0069] Referring to FIG. 13, a film peeling device (100) can be placed on a wafer (WF) to remove impurities (PT), such as particles, dust, or contaminants remaining on the surface of the wafer (WF). At this time, the film peeling device (100) can position a carrier part (110) in a direction parallel to the wafer (WF) by means of a driving part (120).

[0070] Referring to FIG. 14, a polymer film solution can be applied from the surface of a wafer (WF) to the top of a carrier portion (110). The polymer film solution can be supplied through the aforementioned film supply portion (130). At this time, the polymer film solution may be supplied by filling a plurality of holes (110H) of the carrier portion (110) from the surface of the wafer (WF). For example, the polymer film solution may be supplied up to an area that completely fills the top of the plurality of holes (110H), and the polymer film solution may be supplied while covering the upper front surface of the carrier portion (110).

[0071] Referring to FIG. 15, impurities (PT) placed on the surface of a wafer (WF) can be adsorbed in the direction of a polymer film solution (130Fp) by the electromagnetic part (140) of the film peeling device (100) described above. Specifically, by supplying an electric field or a magnetic field to the polymer film solution (130Fp) by the electromagnetic part (140), particles having magnetizing properties placed on the wafer (WF) can be adsorbed into the polymer film solution (130Fp), thereby increasing the efficiency of removing impurities on the wafer (WF).

[0072] Referring to FIG. 16, the polymer film solution (130Fp) can be cured into a polymer film (130F) by applying light or heat to the polymer film solution (130Fp). Specifically, the polymer film solution (130Fp) can be hardened by the light or heat.

[0073] Referring to FIG. 17, the step may be to form a crack (SiC) in the polymer film (130F) by the aforementioned crack forming portion (160). The crack (SiC) may facilitate the peeling of the polymer film (130F). FIG. 17 illustrates the crack (SiC) being shown on the upper part of the polymer film (130F), but this is a non-limiting example, and the crack (SiC) may also occur on the lower part of the polymer film (130F).

[0074] Referring to FIG. 18, the polymer film (130F) can be peeled off from the wafer (WF) by the driving unit (120). Specifically, the polymer film (130F) may be peeled off from the wafer (WF) by the driving unit (120) tilting the carrier unit (110) by the control unit. More specifically, by driving one of the plurality of driving units (120) in a first direction (R1), the carrier unit (110) to which the polymer film (130F) is integrated may be separated from and peeled off from the wafer (WF).

[0075] Referring to FIG. 19, the film peeling device (100) includes a cleaning unit (170), and the cleaning unit (170) may be a component that supplies a cleaning solution to a polymer film (130F) with respect to the film peeling device (100) peeled from a wafer (WF). Specifically, the cleaning unit (170) may be positioned on a carrier unit (110). More specifically, the cleaning unit (170) may be positioned on a carrier unit (110) and may remove the polymer film (130F) by providing an organic solvent to the polymer film (130F).

[0076] The above organic solvent may include, as a non-limiting example, any cleaning solution capable of dissolving and removing a polymer film, such as propylene glycol methyl acetate (PGMA), propylene glycol monomethyl ethate acetate (PGMEA), toluene, benzene, hexane, or xylene. Thus, the film peeling device (100) includes a cleaning unit (170), thereby enabling the film peeling device (100) to be recycled, which has the advantage of being economical.

[0077] FIG. 20 is a perspective view of a film peeling device (100) according to another embodiment of the present disclosure.

[0078] Referring to FIG. 20, in one embodiment, the carrier portion (110) of the film peeling device (100) may have the form of a roll tape. Specifically, the film peeling device (100) may include a plurality of driving portions (120A, 120B). The plurality of driving portions (120A, 120B) may include a first driving portion (120A) and a second driving portion (120B), and may be spaced apart on the same line with respect to the X-axis direction. More specifically, as the first driving portion (120A) and the second driving portion (120B) rotate, the carrier portion (110) moves from the area where the first driving portion (120A) is located to the area where the second driving portion (120B) is located.

[0079] In one embodiment, the film peeling device (100) may include a film supply unit (130), an electromagnetic unit (140), a curing unit (150), and a crack forming unit (160), and a detailed description thereof may be made by referring to the above-mentioned contents in FIGS. 1 to 19 to the extent that they do not contradict each other.

[0080] FIGS. 21 to 26 illustrate the driving process of a film peeling device (100) according to another embodiment of the present disclosure.

[0081] FIGS. 21 to 26 illustrate a film peeling device (100) in the form of a roll tape, which is another embodiment of the present disclosure, as a cross-sectional view taken along the CC' line of FIG. 20.

[0082] Referring to FIG. 21, the carrier portion (110) wound around the first driving unit (120A) can be moved toward the second driving unit (120B) so that the carrier portion (110) is positioned on the wafer (WF) in a direction parallel to the wafer (WF). The first driving unit (120A) and the second driving unit (120B) can drive each other to appropriately move the carrier portion (110) so that the polymer protective film solution can be uniformly applied to the surface of the wafer (WF).

[0083] Referring to FIG. 22, a polymer film solution (130Fp) can be applied from the surface of the wafer (WF) to the top of the carrier portion (110). The polymer film solution (130Fp) can be supplied through the aforementioned film supply portion (130). At this time, the polymer film solution (130Fp) may be supplied by filling a plurality of holes (110H) of the carrier portion (110) from the surface of the wafer (WF). For example, the polymer film solution may be supplied up to an area that fills the top of all the plurality of holes (110H), and the polymer film solution may be supplied while covering the upper front surface of the carrier portion (110). Subsequently, impurities (PT) placed on the surface of the wafer (WF) may be adsorbed in the direction of the polymer film solution (130Fp) by the electromagnetic portion (140) of the aforementioned film peeling device (100). Specifically, by supplying an electric field or a magnetic field to the polymer film solution (130Fp) through the electromagnetic unit (140), particles having magnetized properties placed on the wafer (WF) can be adsorbed into the polymer film solution (130Fp), thereby increasing the efficiency of removing impurities on the wafer (WF).

[0084] Referring to FIG. 23, the polymer film solution (130Fp) can be cured into a polymer film (130F) by applying light or heat to the polymer film solution (130Fp). Specifically, the polymer film solution (130Fp) can be hardened by the light or heat.

[0085] Referring to FIG. 24, the step may be to form a crack in the polymer film (130F) by the aforementioned crack forming portion (160). The crack may be such that peeling of the polymer film (130F) is easily performed. FIG. 24 illustrates the crack being shown on the upper part of the polymer film (130F), but this is a non-limiting example, and the crack may also occur on the lower part of the polymer film (130F).

[0086] Referring to FIG. 25, the polymer film (130F) can be peeled off from the wafer (WF). For example, the polymer film (130F) may be peeled off from the wafer (WF) by the driving unit (120A, 120B) tilting the carrier unit (110) by the control unit, and the polymer film (130F) may be peeled off while the wafer (WF) rotates in a first direction (R1).

[0087] Referring to FIG. 26, the carrier portion (110) integrated with the polymer film (130FF) peeled from the wafer (WF) is moved to the second drive portion (120B) by driving the first drive portion (120A) and the second drive portion (120B). Subsequently, the carrier portion (110) newly supplied from the first drive portion (120A) can repeat the process illustrated in FIG. 21 to FIG. 25 above.

[0089] The present disclosure is not limited to the above embodiments and / or examples but can be manufactured in various different forms, and those skilled in the art will understand that the present disclosure can be implemented in other specific forms without altering the technical spirit or essential features of the present disclosure. Therefore, the embodiments and / or examples described above should be understood as illustrative in all respects and not restrictive. Explanation of the symbols

[0090] 100: Film peeling device 110: Carrier section 120: Driving unit 130: Film supply unit 140: Electromagnetic section 150: Hardening section 160: Crack formation section 170: Cleaning section

Claims

Claim 1 The invention relates to a film peeling device for peeling a polymer film while tilting to remove impurities remaining on a wafer, comprising: a carrier portion disposed on the wafer and including a plurality of holes; and a plurality of driving portions for driving the carrier portion, wherein the plurality of driving portions include a control portion for tilting the carrier portion, and the control portion controls any one of the plurality of driving portions to tilt by 5° or more relative to the wafer. Claim 2 A film peeling device according to claim 1, comprising a film supply unit disposed on the carrier unit and passing through the plurality of holes of the carrier unit to supply a polymer film solution to the wafer surface. Claim 3 A film peeling device according to claim 1, comprising an electromagnetic part that applies an electric field or a magnetic field to the wafer surface. Claim 4 A film peeling device according to claim 1, comprising a curing unit for curing a polymer film solution supplied to the wafer surface. Claim 5 The invention relates to a film peeling device for peeling a polymer film by tilting to remove impurities remaining on a wafer, comprising: a carrier portion disposed on the wafer and including a plurality of holes; a plurality of driving portions for driving the carrier portion; and a crack forming portion for forming a crack in the polymer film. Claim 6 In claim 1, the film peeling device in which the density of the plurality of holes is different between the central region and the edge region of the carrier part. Claim 7 delete Claim 8 A film peeling device according to claim 1, comprising a cleaning unit disposed on the carrier unit and supplying a cleaning solution to the carrier unit. Claim 9 In claim 1, the plurality of driving units includes a first driving unit and a second driving unit spaced apart from the first driving unit, and the carrier unit is arranged in the form of a roll tape on the first driving unit and the second driving unit, and a film peeling device that moves from the first driving unit to the second driving unit. Claim 10 A film peeling device for peeling a polymer film that removes impurities remaining on a wafer, comprising: a carrier portion disposed on the wafer and including a plurality of holes; a plurality of driving portions for driving the carrier portion; a film supply portion disposed on the carrier portion and supplying a film solution to the wafer surface through the plurality of holes; an electromagnetic portion for applying an electric field or a magnetic field to the wafer surface; and a control portion that causes the plurality of driving portions to tilt the carrier portion to peel the film from the carrier portion disposed on the wafer, wherein the carrier portion includes a hollow portion in its internal space and the electromagnetic portion is disposed in the hollow portion.

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