Device sealing method, device sealing apparatus, and manufacturing method of semiconductor products

Abstract

The present invention provides a device sealing method, a device sealing apparatus, and a method for manufacturing a semiconductor product, which seals the device with high precision and facilitates the handling of the workpiece and sealing material during the sealing process. A sealing process is provided in which a sealing sheet S is attached to the LED mounting surface of a substrate (10) on which an LED (11) is mounted, thereby sealing the LED (11) with the sealing sheet S by applying a pressure higher than atmospheric pressure to the sealing material composite M. According to this configuration, the LED (11) is sealed using the sealing sheet S, which is pre-shaped as a flat sheet. Therefore, when the sealing of the LED (11) is completed, the flatness of the sealing sheet S that seals the LED (11) can be improved. In addition, since a sufficiently large pressure V1 can be applied to the sealing sheet S, the sealing sheet S can be reliably filled into the gap between the LEDs (11).

Description

Technology Field

[0001] The present invention relates to a device sealing method, a device sealing apparatus, and a method for manufacturing a semiconductor product for sealing a device, such as a semiconductor chip or an electronic component, mounted on a work, such as a semiconductor wafer (hereinafter appropriately referred to as a “wafer”) or a substrate. Background Technology

[0002] In the manufacturing process of an electronic product, such as a BGA (Ball grid array) package, a process is performed to package a device, such as a semiconductor chip, mounted on the surface of a workpiece, such as a wafer or a substrate, by sealing it with a sealing material such as a resin composition. Examples of conventional sealing methods include a method of sealing the device by pouring a liquid resin into the interior of a mold in which the workpiece on which the device is mounted is placed, and then heat-curing the resin (see, for example, Patent Document 1). Prior art literature

[0003] Japanese Patent Publication No. 2017-087551 The problem to be solved

[0004] However, the above-mentioned conventional device has the following problems.

[0005] In conventional sealing methods using liquid resins, the flatness of the resin surrounding the device is low once sealing is complete. This low flatness leads to a problem where it reduces the precision of the electronic product. To avoid this reduction in precision, processes such as molding the surface of the packaged electronic product become necessary, which lowers the manufacturing efficiency of the electronic product. Furthermore, compared to solid resins, there is also concern regarding the difficulty of handling liquid resins at each stage of the process.

[0006] The present invention has been made in consideration of such circumstances and has the main purpose of providing a device sealing method, a device sealing apparatus, and a method for manufacturing a semiconductor product that seals the device with high precision and facilitates the handling of the workpiece and sealing material during the sealing process. means of solving the problem

[0007] To achieve this objective, the present invention adopts the following configuration.

[0008] That is, the device sealing method according to the present invention comprises a sealing process of sealing the device with a sheet-shaped sealant by applying a pressure higher than atmospheric pressure to a sealant composite formed by attaching a sheet-shaped sealant to the device mounting surface of a workpiece on which the device is mounted.

[0009] It is characterized by having

[0010] (Function / Effect) According to this configuration, a device is sealed using a sheet-shaped sealant that is pre-shaped into a flat sheet. Therefore, when the device is sealed, the flatness of the sheet-shaped sealant used to seal the device can be improved.

[0011] In addition, in the sealing process according to the present invention, the device is sealed with a sheet-shaped sealant by applying a pressure higher than atmospheric pressure to the sealant composite. In this case, since a sufficiently large compressive force can be applied to the sheet-shaped sealant, the sheet-shaped sealant can be reliably filled into the gap between the devices. Therefore, the device can be sealed with higher precision.

[0012] In addition, in the above-described invention, it is preferable to provide a receiving process for receiving the sealing material composite in a chamber, and the sealing process involves sealing the device with the sheet-shaped sealing material by increasing the pressure in the internal space of the chamber after the receiving process.

[0013] (Operation / Effect) According to this configuration, after housing the sealing composite in the chamber, a pressure higher than atmospheric pressure is applied to the sealing composite by increasing the pressure within the chamber's internal space. In this case, the pressure applied to the internal space allows for the uniform application of compressive force across the entire sheet-shaped seal. Consequently, the occurrence of irregularities on the surface of the sheet-shaped seal caused by uneven force applied to the seal can be reliably avoided, thereby more effectively improving the flatness of the sheet-shaped seal when the device is sealed.

[0014] In addition, in the invention described above, the sheet-shaped sealant has a predetermined shape according to the device mounting surface of the workpiece and is supported on a long conveying sheet, and the chamber has an upper housing and a lower housing, and the sealing process preferably comprises a process of forming upper and lower spaces by inserting the conveying sheet between the upper housing and the lower housing to divide the internal space of the chamber into a lower space in which the workpiece is positioned with the device mounting surface facing upward and an upper space opposite to the lower space by interposing the sheet-shaped sealant supported on the conveying sheet, and a space pressing process of sealing the device with the sheet-shaped sealant by pressing at least the upper space among the upper space and the lower space.

[0015] (Operation / Effect) According to this configuration, a sheet-shaped sealant is retained and supported on a long conveying sheet, and a chamber is formed by inserting the conveying sheet between an upper housing and a lower housing. In this case, even when a material with high adhesive strength is used as the sheet-shaped sealant to more securely seal the device, the conveying sheet can be inserted without the two housings coming into contact with the sheet-shaped sealant. Therefore, it is possible to avoid a situation where the sheet-shaped sealant adheres to the chamber and does not peel off, thereby hindering the sealing process.

[0016] In addition, by holding and supporting the sheet-shaped sealant on a long conveying sheet, even if the sheet-shaped sealant is already in a predetermined shape, the sheet-shaped sealant can be conveyed with high precision along a predetermined path by supplying the long conveying sheet along the said path. In other words, the conveying precision of the sheet-shaped sealant can be improved while avoiding unnecessary costs caused by making the sheet-shaped sealant into a long shape.

[0017] In addition, in the invention described above, it is preferable to provide a sheet-shaped elastic body disposed inside the upper housing, and in the process of forming the upper and lower spaces, to arrange the sheet-shaped elastic body so that it comes into contact with the surface of the sheet that does not hold and support the sheet-shaped sealant by inserting the conveying sheet between the upper housing and the lower housing. In this case, the sheet-shaped elastic body is deformed into a convex shape with a more uniform curvature over its entire surface due to the compressive force. Consequently, the sheet-shaped sealant becomes more prone to deformation according to the shape of the device mounting surface of the workpiece, thereby improving the filling capacity of the sheet-shaped sealant in the gap between devices. Therefore, the sealing of the device by the sheet-shaped sealant can be performed with higher precision.

[0018] In addition, in the above-described invention, a heating process is provided for heating the sheet-shaped sealant by heating at least one of the lower space and the upper space, and the sealing process preferably involves sealing the device with the sheet-shaped sealant by applying a pressure higher than atmospheric pressure to the sheet-shaped sealant in a state heated by the heating process.

[0019] (Function / Effect) According to this configuration, the sheet-shaped sealant becomes softer by heating it through a heating process. That is, since the sheet-shaped sealant becomes more easily deformed according to the shape of the device mounting surface of the workpiece, the filling capacity of the sheet-shaped sealant in the gap between devices can be improved.

[0020] In addition, in the above-described invention, the workpiece is provided with one or more convex-shaped members on a surface opposite to the device mounting surface, and further comprises a holding support process in which the workpiece is held and supported while the convex-shaped members are positioned inside the concave portion using a holding support member having a concave portion in the center, and it is preferable that the sealing process is executed after the workpiece is held and supported by the holding support member.

[0021] (Operation / Effect) According to this configuration, the retaining support member is provided with a concave portion in the center. The retaining support member retains and supports the workpiece while a convex member, provided on the non-device mounting surface of the workpiece, is placed inside the said concave portion. In this case, the presence of the concave portion prevents a situation where the convex member interferes with the surface of the retaining support member and causes damage to the convex member. In other words, even if the workpiece is equipped with a convex member, the device can be properly sealed without the workpiece being damaged.

[0022] To achieve such an objective, the present invention may adopt the following configuration.

[0023] That is, the device sealing device according to the present invention has a sealing mechanism that seals the device with the sheet-shaped sealant by applying a pressure higher than atmospheric pressure to a sealant composite formed by attaching a sheet-shaped sealant to the device mounting surface of a workpiece on which the device is mounted.

[0024] It is characterized by having

[0025] (Function / Effect) According to this configuration, a device is sealed using a sheet-shaped sealant that is pre-shaped into a flat sheet. Therefore, when the device is sealed, the flatness of the sheet-shaped sealant used to seal the device can be improved.

[0026] Furthermore, the sealing mechanism according to the present invention seals a device with a sheet-shaped sealant by applying a pressure higher than atmospheric pressure to a sealant composite. In this case, since a sufficiently large compressive force can be applied to the sheet-shaped sealant, the sheet-shaped sealant can be reliably filled into the gap between devices. Therefore, the device can be sealed with higher precision.

[0027] To achieve such an objective, the present invention may adopt the following configuration.

[0028] That is, the method for manufacturing a semiconductor product according to the present invention is a method for manufacturing a semiconductor product in which a device mounted on a workpiece is sealed by a sheet-shaped sealing material.

[0029] A sealing process for sealing a device with a sheet-shaped sealant by applying a pressure higher than atmospheric pressure to a sealant composite, wherein the sealant composite is configured such that a sheet-shaped sealant is attached to the device mounting surface of a workpiece on which the device is mounted.

[0030] It is characterized by having

[0031] (Operation / Effect) According to this configuration, it is possible to suitably manufacture a semiconductor product in which a device mounted on a workpiece is sealed by a sheet-shaped sealant. Specifically, by sealing the device using a sheet-shaped sealant that is pre-flat in the form of a sheet, the flatness of the sheet-shaped sealant sealing the device in the semiconductor product can be improved. Furthermore, by sealing the device by applying pressure higher than atmospheric pressure, the sheet-shaped sealant can be reliably filled into the gap between the devices. Consequently, it is possible to manufacture a semiconductor product in which the device is sealed with higher precision. Effects of the invention

[0032] According to the device sealing method, device sealing apparatus, and method for manufacturing a semiconductor product of the present invention, a device is sealed using a sheet-shaped sealing material that is pre-shaped into a flat sheet. Therefore, when the device is sealed, the flatness of the sheet-shaped sealing material used to seal the device can be improved. Furthermore, in the sealing process according to the present invention, the device is sealed with the sheet-shaped sealing material by applying a pressure higher than atmospheric pressure to the sealing material composite. In this case, since a sufficiently large pressure can be applied to the sheet-shaped sealing material, the sheet-shaped sealing material can be reliably filled into the gap between the devices. Therefore, the device can be sealed with higher precision. Brief explanation of the drawing

[0033] FIG. 1 is a drawing illustrating the configuration of a sealing member according to an embodiment. (a) is a perspective view of the back side of the sealing member, and (b) is a longitudinal section view of the sealing member. FIG. 2 is a perspective view illustrating the configuration of a substrate and a ring frame according to an embodiment. FIG. 3 is a plan view of a device sealing device according to an embodiment. FIG. 4 is a front view of a device sealing device according to an embodiment. FIG. 5 is a front view of a sealing unit according to an embodiment. FIG. 6 is a cross-sectional view of a chamber according to an embodiment. FIG. 7 is a flowchart illustrating the operation of a device sealing device according to an embodiment. FIG. 8 is a diagram illustrating step S1 regarding an embodiment. FIG. 9 is a drawing illustrating step S2 regarding an embodiment. FIG. 10 is a drawing illustrating step S3 regarding an embodiment. FIG. 11 is a drawing illustrating step S3 regarding an embodiment. FIG. 12 is a drawing illustrating step S4 regarding an embodiment. FIG. 13 is a drawing illustrating step S4 regarding an embodiment. Figure 14 is a drawing illustrating an example of a configuration for heating a sealing member. FIG. 15 is a drawing illustrating step S5 regarding an embodiment. FIG. 16 is a drawing illustrating step S6 regarding an embodiment. FIG. 17 is a drawing illustrating step S6 regarding an embodiment. FIG. 18 is a drawing illustrating step S7 regarding an embodiment. Figure 19 is a diagram illustrating the effects of an embodiment. (a) is a cross-sectional view illustrating the configuration in which a gap is formed when sealing is performed by depressurizing the inside of the chamber, and (b) is a cross-sectional view illustrating the state in which the gap is filled by sealing the inside of the chamber by pressurizing it. FIG. 20 is a drawing illustrating the configuration of a modified example. (a) is a cross-sectional view illustrating the configuration of a substrate for a modified example, and (b) is a cross-sectional view explaining the configuration of a holding support table for a modified example. FIG. 21 is a diagram illustrating the process of step S4 regarding a deformation example. FIG. 22 is a diagram illustrating the process of step S5 regarding a deformation example. FIG. 23 is a drawing illustrating the configuration of a modified example. (a) is a cross-sectional view illustrating the configuration of a sealing member regarding a deformation example, and (b) is a drawing illustrating the state of step S5 regarding a deformation example. FIG. 24 is a drawing illustrating the configuration of a modified example. (a) is a longitudinal section illustrating the configuration of a frame composite regarding a deformation example, and (b) is a schematic diagram illustrating the state of step S3 regarding a deformation example. FIG. 25 is a drawing illustrating the configuration of a modified example. (a) is a longitudinal section view illustrating the configuration of a sealing member according to a modified example, and (b) is a perspective view explaining the configuration of a sheet cutting device equipped with a modified example. FIG. 26 is a drawing illustrating the configuration of a modified example. (a) is a longitudinal cross-sectional view illustrating the configuration of a sealing member according to a modified example, (b) is a drawing explaining the problems that may occur in a sealing member according to a comparative example that does not have an elastic body, and (c) is a drawing explaining the advantages of a comparative example that has an elastic body. FIG. 27 is a drawing illustrating the configuration of a modified example. (a) is a cross-sectional view illustrating the configuration of a sealant composite according to a modified example, and (b) is a flowchart illustrating the operation of a device sealing device according to a modified example. FIG. 28 is a drawing illustrating step S1 regarding a deformation example. Specific details for implementing the invention

[0034] Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 (a) is a perspective view showing the rear side of a sealing member P, and FIG. 1 (b) is a cross-sectional view of a sealing member P. FIG. 2 is a perspective view showing the configuration of a substrate (10) and a ring frame f to be sealed by the sealing member P.

[0035] The sealing member P according to the present embodiment comprises a sealing sheet S and a conveying sheet T as shown in FIG. 1 (a). The sealing sheet S is pre-cut into a predetermined shape according to the shape of the substrate (10). In the present embodiment, the sealing sheet S is pre-cut into an approximately rectangular shape. Here, an approximately rectangular shape means a shape in which each corner of the rectangle is rounded, as shown in FIG. 1 (a). In addition, in the present embodiment, the size of the sealing sheet S is set to be larger than the substrate (10) and smaller than the inner diameter of the lower housing (29A) described later.

[0036] The conveying sheet T has a long shape, and the sealing sheet S is attached to the conveying sheet T at a predetermined pitch and is held and supported. The sealing sheet S corresponds to the sheet-shaped sealing material of the present invention.

[0037] As shown in FIG. 1(b), the conveying sheet T has a structure in which a non-stick substrate Ta and a sticky adhesive Tb are laminated. Examples of materials constituting the substrate Ta include polyolefin, polyethylene, etc. Examples of materials constituting the adhesive Tb include acrylic acid ester copolymer, etc.

[0038] As shown in FIG. 1(b), the sealing sheet S has a structure in which a non-adhesive substrate Sa and an adhesive sealant Sb are laminated. As the substrate Sa is attached to the adhesive Tb of the conveying sheet T, the conveying sheet T holds and supports the sealing sheet S. Examples of materials constituting the substrate Sa include polyolefin, polyethylene, etc. In this embodiment, the shape of the sealing sheet S is approximately rectangular, but it can be appropriately changed according to the shape of the substrate (10).

[0039] A separator S, not shown, is attached to the sealant Sb, and the adhesive surface of the sealant Sb is exposed when the separator S is peeled off. In this embodiment, an optically transparent adhesive, OCA (Optical Clear Adhesive), is used as the material constituting the sealant Sb.

[0040] As shown in FIG. 2, a plurality of LEDs (11) and TFTs (not shown) are mounted in parallel in a two-dimensional matrix form at the center of the surface of the substrate (10). That is, the surface of the substrate (10) is formed with irregularities by the LEDs (11). The LEDs (11) are connected to the substrate (10) through semiconductor devices, such as TFTs, or bumps (not shown). Examples of the substrate (10) include a glass substrate, an organic substrate, a circuit board, and a silicon wafer. In this embodiment, the substrate (10) is approximately rectangular in shape, but the shape of the substrate (10) may be appropriately changed to any shape, such as a rectangular shape, a circular shape, or a polygonal shape. The substrate (10) corresponds to the work in the present invention. The LEDs (11) correspond to the devices in the present invention.

[0041] The ring frame f is of a size and shape that surrounds the substrate (10). The device sealing device (1) according to the embodiment produces a sealing body MF in which the substrate (10) and the ring frame f are integrated by a sealing member P by sealing the LED (11) mounted on the substrate (10) with a sealing sheet S.

[0042] <Explanation of the overall composition>

[0043] Here, the overall configuration of the device sealing device (1) according to the embodiment is described. FIG. 3 is a plan view illustrating the basic configuration of the device sealing device (1) according to the embodiment. The device sealing device (1) is configured to have a horizontally elongated rectangular portion (1a) and a protrusion (1b). The protrusion (1b) is configured to protrude upward from the central portion of the rectangular portion (1a). In addition, in the following description, the long direction of the rectangular portion (1a) is referred to as the left-right direction (x direction), and the horizontal direction perpendicular thereto (y direction) is referred to as the front-back direction.

[0044] A substrate transport mechanism (3) is provided and positioned on the right side of the rectangular section (1a). Two containers (5) containing substrates (10) are stacked in parallel at a position near the lower right side of the rectangular section (1a). A seal recovery unit (6) for recovering the seal MF described later is provided and positioned on the left side of the rectangular section (1a).

[0045] The aligner (7), lifting table (8), holding support table (9), and frame supply unit (12) are arranged and provided in that order from the upper right side of the rectangular section (1a). In the protrusion (1b), a sealing unit (13) is arranged and provided to seal each of the LEDs (11) mounted on the substrate (10) by means of a sealing sheet S.

[0046] As shown in FIG. 4, the substrate transport mechanism (3) is provided with a substrate transport device (16) that is supported to move back and forth on the right side of a guide rail (15) that is installed horizontally on the upper part of the rectangular section (2a). Additionally, a frame transport device (17) that is supported to move left and right is provided on the left side of the guide rail (15).

[0047] The substrate transport device (16) is configured to transport a substrate (10) taken out from one side of the container (5) to the left and right and forward and backward. The substrate transport device (16) is equipped with a left-right moving platform (18) and a forward-backward moving platform (19).

[0048] The left-right movement movable unit (18) is configured to be able to move back and forth in the left-right direction along the guide rail (15). The front-back movement movable unit (19) is configured to be able to move back and forth in the front-back direction along the guide rail (20) provided on the left-right movement movable unit (18).

[0049] Additionally, a holding support unit (21) for holding and supporting the substrate (10) is equipped at the lower part of the forward and backward moving platform (19). The holding support unit (21) is configured to be able to reciprocate in the up and down direction (z direction) along a lifting rail (22) that extends in the longitudinal direction. Additionally, the holding support unit (20) is made to be rotatable around an axis in the z direction by means of a rotation axis not shown.

[0050] A horseshoe-shaped holding support arm (23) is equipped at the lower part of the holding support unit (21). A plurality of slightly protruding suction pads are provided on the holding support surface of the holding support arm (23), and the substrate (10) is suctioned and held through said suction pads. Additionally, the holding support arm (23) is connected to a compressed air device through a flow path formed inside it and a connecting flow path connected at the base side of the flow path.

[0051] By using the above-described movable structure, the substrate (10) that is adsorbed and supported can be moved forward and backward, moved left and right, and rotated around the z-direction axis by means of the supporting arm (23).

[0052] The frame conveyor device (17) is equipped with a left-right moving platform (24), a front-back moving platform (25), a bending link mechanism (26) connected to the lower part of the left-right moving platform (24), and a suction plate (27) equipped at the lower part of the bending link mechanism (26). The suction plate (27) holds and supports the substrate (10) by suction. Around the suction plate (27), a plurality of suction pads (28) are arranged and provided to hold and support the ring frame f by suction. Accordingly, the frame conveyor device (21) can hold and support the ring frame f or the sealing body MF loaded on the holding support table (9) by suction, and convey it in the up-and-down and front-back and left-and-right directions. The suction pads (28) are slidable in the horizontal direction corresponding to the size of the ring frame f.

[0053] The lifting table (8) holds and supports the substrate (10), and as an example, is a metal chuck table having a size equal to or greater than that of the substrate (10). As a preferred configuration of the lifting table (8), it is configured to hold and support the substrate (10) by suction using a suction device provided inside. The lifting table (8) is connected to one end of a rod (52) that passes through a support member (51) that supports the lifting table (8), as shown in FIG. 5, etc. The other end of the rod (52) is driven and connected to an actuator (53) equipped with a motor, etc. The lifting table (8) is made capable of lifting and lowering movement by means of the rod (52) and the actuator (53).

[0054] The lifting table (8) is configured to be able to move back and forth between an initial position and a sealed position along a rail (54) installed in the front-rear direction as shown in FIGS. 3 and 5. The initial position is inside the rectangular section (1a) and is the position where the lifting table (8) is shown as a solid line in FIG. 3. At the initial position, the substrate (10) is loaded onto the lifting table (9).

[0055] The sealing position is located inside the protrusion (1b), and is the position indicated by the dotted line of the lifting table (8) in FIG. 3. By moving the lifting table (8) to the sealing position, it becomes possible to bring the substrate (10) loaded on the lifting table (8) into contact with the sealing member P.

[0056] The holding support table (9) is a metal chuck table having a size equal to or greater than that of the substrate (10), as shown in FIGS. 5 and 6, etc., and is connected in communication with a pressurizing device (32) that is positioned and provided externally. The operation of the pressurizing device (32) is controlled by a control unit (33). In addition, the holding support table (9) is configured to adsorb and hold the substrate (10) by having a suction device provided inside.

[0057] In addition, as shown in FIG. 5, the holding support table (9) is housed in the lower housing (29A) that constitutes the chamber (29) and is connected to one end of a rod (35) that penetrates the lower housing (29A). The other end of the rod (35) is driven by an actuator (37) equipped with a motor or the like. Therefore, the holding support table (9) is capable of moving up and down inside the chamber (29).

[0058] The lower housing (29A) is provided with a frame-holding support (38) that surrounds the lower housing (29A) from the outside. The frame-holding support (38) is configured so that when the ring frame f is loaded, the upper surface of the ring frame f and the cylindrical top portion of the lower housing (29A) are on the same plane. Additionally, it is preferable that the cylindrical top portion of the lower housing (29A) undergoes a molding process.

[0059] Additionally, as shown in FIG. 3, the holding support table (9) is configured to be able to reciprocate between an initial position and a sealed position along a rail (40) installed in the front-rear direction together with the lower housing (29A). The initial position is located inside the rectangular section (1a) and is the position where the holding support table (9) is shown as a solid line in FIG. 3. At the initial position, the ring frame f is loaded onto the frame holding support section (38).

[0060] The sealing position is located inside the protrusion (1b) and is the position where the holding support table (9) is indicated by a dotted line in FIG. 3. By moving the holding support table (9) to the sealing position, it becomes possible to perform a sealing process using a sealing member P on a substrate (10) loaded on the holding support table (9).

[0061] The frame supply unit (12) stores a pull-out cassette in which a predetermined number of ring frames f are stacked.

[0062] As shown in FIG. 5, the sealing unit (13) is composed of a sheet supply unit (71), a separator recovery unit (72), a device sealing unit (73), and a sheet recovery unit (74). The sheet supply unit (71) is configured to peel off the separator S by a separator peeling roller (75) during the process of supplying the sealing member P to a sealing position from a supply bobbin loaded with a fabric roll wound with the sealing member PS (a sealing member P with a separator S attached) having a separator PS (a sealing member P provided with a separator S attached) attached.

[0063] The separator recovery unit (72) is equipped with a recovery bobbin for winding the separator S peeled from the sealing member P. This recovery bobbin is configured to be driven in forward and reverse directions by a motor.

[0064] The device sealing part (73) is composed of a chamber (29), a device sealing mechanism (81), and a sheet cutting mechanism (82), etc.

[0065] The chamber (29) is composed of a lower housing (29A) and an upper housing (29B). The lower housing (29A) is arranged to surround the holding support table (9) and reciprocates in the forward and backward direction together with the holding support table (9) between the initial position and the sealing position. The upper housing (29B) is arranged on the protrusion (1b) and is configured to be vertically movable.

[0066] As shown in FIG. 6, the lower housing (29A) and the upper housing (29B) are connected to a pressurizing device (32) through a flow path (101). Additionally, an electronic valve (103) is provided in the flow path (101) on the upper housing (11B) side. Furthermore, both housings (11A, 11B) are each connected to a flow path (109) equipped with an electronic valve (105, 107) for atmospheric opening.

[0067] In addition, a flow path (111) equipped with an electronic valve (110) that adjusts the internal pressure, which has been reduced once, by leakage is connected to the upper housing (29B). In addition, the opening and closing operation of these electronic valves (103, 105, 107, 110) and the operation of the pressurizing device (32) are performed by the control unit (33).

[0068] That is, the pressurizing device (32) is configured to independently pressurize the air pressure in the space on the lower housing (29) side and the air pressure in the space on the upper housing side.

[0069] The device sealing mechanism (81) is equipped with a movable base (84), a sealing roller (85), a nip roller (86), etc. The movable base (84) moves horizontally left and right along a guide rail (88) installed in the left and right directions. The sealing roller (85) is axially supported by a bracket connected to the tip of a cylinder provided on the movable base (84). The nip roller (86) is provided on the side of the sheet retrieval unit (74) and is equipped with a transfer roller (89) driven by a motor and a pinch roller (90) that moves up and down by a cylinder.

[0070] The sheet cutting mechanism (82) is provided on a lifting drive unit (91) that raises and lowers the upper housing (29B) and is provided with a support shaft (92) extending in the z-direction and a boss portion (93) that rotates around the support shaft (92). The boss portion (93) is provided with a plurality of support arms (94) that extend in the diameter direction. At the tip of at least one support arm (94), a disc-shaped cutter (95) for cutting a sheet T for conveying a sealing member P along a ring frame f is provided so as to be movable up and down. At the tip of another support arm (94), a pressure roller (96) is provided so as to be movable up and down.

[0071] The sheet recovery unit (74) is equipped with a recovery bobbin for winding the unwanted return sheet T that has been peeled off after cutting. This recovery bobbin is configured to be driven in forward and reverse directions by a motor not shown.

[0072] As shown in FIG. 4, the seal recovery unit (6) is equipped with a cassette (41) for loading and recovering seal MF. This cassette (41) is equipped with a longitudinal rail (45) connected and fixed to a device frame (43) and a lifting platform (49) that is raised and lowered by a motor (47) along the longitudinal rail (45). Accordingly, the seal recovery unit (6) is configured to load seal MF onto the lifting platform (49) and lower it by pitch.

[0073] The device sealing mechanism (81) has a heating mechanism (120) inside the upper housing (29B) as shown in FIG. 6, etc. The heating mechanism (120) is equipped with a cylinder (121) and a heating member (123). The cylinder (121) is connected to the upper part of the heating member (123), and the heating member (123) can move up and down inside the chamber (29) by the operation of the cylinder (121). Additionally, the heating member (123) does not have to be configured to move up and down as long as it can heat the sealing member P.

[0074] The heating member (123) has an overall rectangular shape and is slightly larger than the sealing sheet S. A heater (125) for heating the conveying sheet T and the sealing sheet S is embedded inside the heating member (123). The heating temperature by the heater (125) is adjusted to a temperature at which the conveying sheet T and the sealing sheet S become soft. An example of the heating temperature may be approximately 50°C to 70°C.

[0075] <Overview of Basic Operations>

[0076] Here, the basic operation of the device sealing device according to the embodiment is described. FIG. 7 is a flowchart illustrating a series of processes for sealing an LED (11) mounted on a substrate (10) with a sealing sheet S using the device sealing device (1).

[0077] Step S1 (work supply)

[0078] When a sealing command is issued, the ring frame f is returned from the frame supply unit (12) to the frame holding support unit (38) of the lower housing (29A), and the substrate (10) is returned from the container (5) to the lifting table (8).

[0079] That is, the frame transport device (17) adsorbs the ring frame f from the frame supply unit (12) and moves it onto the frame holding support unit (38). When the frame transport device (17) releases the adsorption of the ring frame f and rises, it performs position alignment of the ring frame f. This position alignment is performed, for example, by synchronously moving a plurality of support pins installed upright to surround the frame holding support unit (38) in the central direction. When the frame holding support unit (38) holds and supports the ring frame f, the lower housing (29A) moves along the rail (40) together with the holding support table (9) from the initial position to the sealing position on the side of the device sealing mechanism (81).

[0080] While the frame transport device (17) transports the ring frame f, the substrate transport device (16) inserts a holding support arm (23) between the substrates (10) stored in multiple stages. The holding support arm (23) adsorbs and holds the portion of the surface of the substrate (10) where the LED (11) is not mounted (the portion on the periphery side), and transports it to the aligner (7). The aligner (7) adsorbs the center of the back surface of the substrate (10) by means of an adsorption pad protruding from its center. At the same time, the substrate transport device (16) releases the adsorption of the substrate (10) and moves upward. The aligner (7) performs position alignment based on notches, etc. while rotating the substrate (10) by holding and supporting it with the adsorption pad.

[0081] When the position alignment is complete, the adsorption pad holding the substrate (10) is protruded from the surface of the aligner (7). The substrate transport device (16) moves to that position and supports the substrate (10) by adsorption from the surface side. The adsorption pad releases the adsorption and descends.

[0082] The substrate transport device (16) moves upward on the lifting table (8) and loads the substrate (10) onto the lifting table (8) with the surface side on which the LED (11) is mounted facing upward. When the lifting table (8) adsorbs and holds the substrate (10), the lifting table (8) moves along the rail (54) from the initial position to the sealing position on the side of the device sealing mechanism (81). The state in which the lifting table (8) and the holding support table (9) have each moved to the sealing position is illustrated in FIG. 8.

[0083] Step S2 (Supply of sealing sheet)

[0084] When a workpiece is supplied by a substrate transport device (16), etc., a sealing sheet S is supplied in the sealing unit (13). That is, a predetermined amount of sealing member P is ejected from the sheet supply unit (71) while peeling off the separator S. The sealing member P, which has an overall long shape, is guided upward to the sealing position along a predetermined transport path. At this time, as shown in FIG. 9, the sealing sheet S, which is held and supported by a transport sheet T, is positioned so as to be located above the substrate (10) loaded on the lifting table (8).

[0085] Step S3 (1st sealing process)

[0086] When the workpiece and sealing sheet S are supplied, the first sealing process is initiated. That is, the control unit (33) drives the actuator (53) to raise the lifting table (8). As the lifting table (8) is raised, the upper surface of the LED (11) mounted on the substrate (10) comes into contact with the sealing sheet S, as shown in FIG. 10.

[0087] By means of the contact, an LED (11) is attached to a sealing layer Sb having adhesive force, and the substrate (10) is held and supported by a sealing sheet S with the LED (11) interposed. The substrate (10) and the sealing member P integrated with the sealing sheet S are hereinafter referred to as a sealing composite M. After the sealing composite M is formed, a predetermined amount of sealing member P is ejected, and the sealing composite M is conveyed upward on the holding support table (9) as shown in FIG. 11. As the sealing composite M is conveyed, the lifting table (8) lowers and returns to the initial state. With the sealing composite M formed and conveyed to the holding support table (9), the first sealing process regarding step S3 is completed.

[0088] Step S4 (Formation of the chamber)

[0089] When the sealant composite M is conveyed upward on the holding support table (9), the attachment roller (85) descends. Then, as shown in FIG. 12, the conveying sheet T is attached across the ring frame f and the upper part of the lower housing (29A) while moving the conveying sheet T.

[0090] When a return sheet T is attached to the ring frame f, the attachment roller (85) is returned to its initial position and the upper housing (29B) is lowered. Along with the lowering of the upper housing (29B), the return sheet T attached to the top of the lower housing (29A) as shown in FIG. 13 is supported by being sandwiched between the upper housing (29B) and the lower housing (29A) to form a chamber (29).

[0091] At this time, the chamber (29) is divided into two spaces by the conveying sheet T, which functions as a sealing material among the sealing members P. That is, it is divided into a lower space H1 on the lower housing (29A) side and an upper space H2 on the upper housing (29B) side with the conveying sheet T in between. Each of the substrate (10) and LED (11) located within the lower housing (29A) is positioned in close proximity to the sealing sheet S with a predetermined clearance.

[0092] Then, the upper space H2 is heated using the heating mechanism (120). That is, the control unit (33) operates the heater (125) to heat the heating device (123) to a predetermined temperature. As the heating device (123) is heated, the upper space H2 is heated by the heat conduction effect, and the conveying sheet T and the sealing sheet S are also heated.

[0093] Since the return sheet T and the sealing sheet S become soft by being heated, the deformability due to the pressure V1 is improved. That is, when the LED (11) is covered with the sealing sheet S, the following ability of the sealing member P with respect to the upper surface of the substrate (10) and the LED (11) can be further increased. Additionally, as shown in FIG. 14, the sealing member P may be directly heated by the heating member (123) by lowering the heating member (123) so as to come into contact with the return sheet T.

[0094] Step S5 (Second sealing process)

[0095] After forming the chamber (29), the second sealing process is initiated. First, the control unit (33) controls the actuator (37) to lower the holding support table (9) to its initial position. Next, the control unit (33) operates the pressurizing device (32) with the electronic valves (105, 107, 110) shown in FIG. 6 closed to supply gas to the lower space H1 and the upper space H2, thereby pressurizing the lower space H1 and the upper space H2 to a specific value. Examples of specific values ​​include 0.3 MPa to 0.5 MPa. As the pressurizing device (32) performs the pressurizing operation, the air pressure in the lower space H1 and the air pressure in the upper space H2 both become higher than atmospheric pressure.

[0096] Due to the pressure applied to the upper space H2, a pressure force V1 is applied from the upper space H2 toward the sealing sheet S as shown in FIG. 15. Also, since the entire upper space H2 is pressurized, the pressure force V1 acts uniformly across the entire sealing sheet S. Additionally, as the entire lower space H1 is pressurized, a pressure force V2 acts uniformly from the lower space H1 toward the back surface of the substrate (10). That is, due to the action of pressure force V1 and pressure force V2, each LED (11) is further pressed into the sealing material Sb of the sealing sheet S, and the sealing material Sb is further filled into the gaps between the LEDs (11). As a result, the substrate (10) and the sealing sheet S are more closely attached, and the LEDs (11) are sealed by the sealing sheet S.

[0097] After applying pressure between the sealing sheet S and the LED (11) for a predetermined time while the lower space H1 and the upper space H2 are pressurized to a pressure higher than atmospheric pressure, the control unit (33) stops the pressurizing device (32). Then, the control unit (33) fully opens the electronic valves (103, 105, 107, 110) to open the lower space H1 and the upper space H2 to the atmosphere. The control unit (33) raises the upper housing (29B) to open the chamber (29) and simultaneously raises the holding support table (9) so that the back surface of the substrate (10) comes into contact with the substrate holding support surface of the holding support table (9).

[0098] Step S6 (Cutting the sheet)

[0099] In addition, while the process for step S5 is being performed in the chamber (29), the sheet cutting mechanism (82) is operated to cut the sealing member P. At this time, as shown in FIG. 16, the cutter (95) cuts the sealing member P (specifically, the conveying sheet T) attached to the ring frame f into the shape of the ring frame f, and at the same time, the compression roller (96) follows the cutter (95) and presses the sheet cutting portion on the ring frame f while moving.

[0100] At the point when the upper housing (29B) is raised, the sealing of the LED (11) by the sealing sheet S and the cutting of the sealing member P are completed, so the pinch roller (90) is raised to release the nip of the return sheet T. Then, as shown in FIG. 17, the nip roller (86) is moved toward the sheet recovery unit (74) to wind up and recover the unnecessary return sheet T after cutting, and at the same time, a predetermined amount of sealing member P is dispensed from the sheet supply unit (71). Through each process up to step S6, the sealing composite M is integrated with the ring frame f with the return sheet T interposed therein. The sealing composite M integrated with the ring frame f is hereinafter referred to as the sealing body MF.

[0101] When the unnecessary return sheet T is wound up and retrieved, the nip roller (86) and the attachment roller (85) return to their initial positions. Then, while holding and supporting the sealant MF, the holding support table (9) moves from the sealing position to the initial position.

[0102] Step S7 (Retrieval of seal)

[0103] When the holding support table (9) returns to its initial position, as shown in FIG. 18, the adsorption pad (28) provided in the frame conveyor (17) adsorbs and holds the sealant MF, thereby removing the sealant MF from the lower housing (29A). The frame conveyor (17) that adsorbs and holds the sealant MF returns the sealant MF to the sealant recovery unit (6). The returned sealant MF is loaded and stored in the cassette (41).

[0104] Thus, the operation of sealing the LED (11) mounted on the substrate (10) with the sealing sheet S is completed. Afterwards, the above process is repeated until the number of sealing bodies MF reaches a predetermined number. In this way, a sealing material composite M in which the sealing sheet S is in a state of tightly sealing the LED (11) is manufactured by the device sealing device (1). The sealing material composite M in which the sealing sheet S is in a state of tightly sealing the LED (11) through the second sealing process corresponds to a semiconductor device in the present invention.

[0105] <Effects of the Composition of the Example>

[0106] According to the apparatus of the above embodiment, by controlling the air pressure inside the chamber (29), the LED (11) mounted on the substrate (10) is sealed with a sealing sheet S. In a conventional sealing method in which a liquid sealing material is filled around the device and then the sealing material is cured, the flatness of the surface of the sealing material is reduced due to causes such as air bubbles being mixed into the uncured resin.

[0107] Meanwhile, in the configuration of the present invention, the substrate Sa and the sealing material Sb provided by the sealing sheet S are each formed in a pre-flat sheet shape. Therefore, when sealing is completed by the sealing sheet S, the flatness of the surface of the sealing sheet S can be improved. Furthermore, since sealing is performed by controlling the air pressure inside the chamber (29) while the substrate (10) and the sealing sheet S are placed inside the chamber (29), the pressure force V1 or pressure force V2 acts uniformly over the entire sealing sheet S. Therefore, since irregularities on the surface of the sealing sheet S caused by unevenness of the force acting on the sealing sheet S can be reliably avoided, the flatness of the sealing sheet S can be improved more reliably.

[0108] In addition, in the second sealing process according to the present invention, the sealing material Sb of the sealing sheet S is filled into the gap of the LED (11) with high precision by pressurizing the lower space H1 and the upper space H2 so that the air pressure becomes greater than atmospheric pressure.

[0109] In the first sealing process, the lifting table (8) is raised to bring the LED (11) into contact with the sealing sheet S. At this time, the force acting between the sealing sheet S and the LED (11) is relatively small. Therefore, when the sealing material Sb of the sealing sheet S covers the LED (11), as shown in FIG. 19 (a), the sealing material Sb cannot completely fill the period space of the LED (11), so a gap J may occur.

[0110] In this regard, the present invention uses a pressurizing device (32) to pressurize the upper space H1 and lower space H2 within the chamber (29) to a pressure greater than atmospheric pressure. That is, in the second sealing process, relatively large pressure forces V1 and V2 can be applied to the sealing sheet S and the LED (11). Accordingly, as shown in FIG. 19 (b), the uncured sealing material Sb is further compressed and deformed by the action of pressure forces V1 and V2, thereby reliably filling the gap J. Therefore, by performing the second sealing process, the LED (11) can be sealed with greater precision.

[0111] In addition, during the second sealing process, the magnitudes of the pressure forces V1 and V2 can be adjusted to arbitrary values ​​by appropriately controlling the pressure device (32). Therefore, even if sealing conditions, such as the constituent material of the sealant Sb or the size and structure of the LED (11), are changed, the LED (11) can be reliably sealed by appropriately adjusting the magnitudes of the pressure forces V1 and V2. Furthermore, since the pressure forces V1 and V2 of appropriate magnitude act uniformly over the entire sealing sheet S, damage to the substrate (10) or LED (11) caused by the application of excessive pressure or uneven pressure can be avoided.

[0112] Furthermore, in conventional device sealing methods using molds and liquid resins, it is necessary to prepare different molds depending on the size or material of the workpiece and device, so the effort and cost required to manufacture the device sealing device are high.

[0113] Meanwhile, in the device sealing method according to the present invention, since the device can be sealed without using a mold, the time and cost required for manufacturing the device sealing device (1) can be significantly reduced. In addition, even when various conditions of the work or device are changed, the shape of the sealing sheet S can be changed to accommodate the change in the work or device. Therefore, the device sealing device according to various conditions can be set up quickly and easily.

[0114] Furthermore, the embodiments disclosed herein are illustrative in all respects and are not limiting. The scope of the invention is defined by the claims, not by the description of the embodiments described above, and includes all modifications (variations) within the equivalent meaning and scope of the claims. For example, the invention may be modified as follows.

[0115] (1) As a work for the embodiment, a substrate (10) having an LED (11) mounted on the surface side and a flat back side was described, but the back side of the work is not limited to a flat configuration. That is, as shown in FIG. 20 (a), a substrate (131) having a convex shape member (130) on the back side may be used as the work. The convex shape member (130) may be an electronic component, such as an LED, or a constituent material of the substrate (131). That is, as a substrate (131) having irregularities on the back side, a configuration in which irregularities are formed on the back side of the substrate (131) itself is included.

[0116] For a substrate (131) having a convex shape member (130) on the back side, when sealing an LED (11) mounted on the surface side with a sealing sheet S, the device sealing device (1) has a holding support table (135) as shown in (b) of FIG. 20 instead of a lifting table (8) and a holding support table (9).

[0117] The holding support table (135) has an annular projection (137) on its outer periphery and a concave portion (139) in its center. That is, the holding support table (135) is hollow in its entirety. The concave portion (139) is configured at a position that includes the area where the convex-shaped member (130) is arranged on the substrate (131) when viewed in a planar view. By the projection (137) supporting the portion of the back surface of the substrate (131) where the convex-shaped member (130) is not arranged, the holding support table (135) can hold and support the substrate (131) without contacting the convex-shaped member (130).

[0118] FIG. 21 illustrates a configuration in which the lower housing (29A) is equipped with a holding support table (135), wherein the holding support table (135) supports the substrate (131). This state corresponds to the process of forming the chamber (29) in step S3. In the configuration equipped with the holding support table (135), each process of sealing the LED (11) on the substrate (10) with a sealing sheet S is the same as the previously described embodiment, so a detailed description is omitted.

[0119] (2) In step S5 of the embodiment, the pressurizing device (32) pressurizes the interior of both the lower space H1 and the upper space H2, but is not limited thereto. That is, the pressurizing device (32) may pressurize only the upper space H2 until the pressure becomes higher than atmospheric pressure, thereby sealing the LED (11) with greater precision by the pressure force V1.

[0120] As an additional variation of the above-described configuration, the chamber (29) may be equipped with a vacuum device (not shown) that reduces the internal space of the chamber (29) in addition to the pressurizing device (32). That is, the configuration may be such that the LED (11) is sealed by using the vacuum device to maintain the interior of the lower space H1 at a reduced pressure lower than atmospheric pressure, and using the pressurizing device (32) to pressurize the interior of the upper space H2 at a pressure higher than atmospheric pressure.

[0121] In the additional variation example, in step S5, the holding support table (9) is raised so that it comes into contact with the back surface of the substrate (10), and the interior of the upper space H2 is pressed. By pressing the upper space H2 while the substrate (10) is held and supported by the holding support table (9) to generate a pressure force V1, the pressure force V1 can be applied evenly across the entire surface of the sealing sheet S and the substrate (10), even if the lower space H1 is depressurized to a level lower than atmospheric pressure.

[0122] (3) In step S5 of the embodiment, a pressure device (32) is used to increase the pressure inside the chamber (29) to be higher than atmospheric pressure, thereby generating a pressure force V1 that presses the LED (11) into the sealing material Sb of the sealing sheet P. However, the process of step S5 is not limited to a configuration that uses the chamber (29) as long as it generates a pressure force greater than atmospheric pressure between the sealing sheet P and the LED (11).

[0123] As an example of a configuration in which the chamber (29) is omitted, as shown in FIG. 22, a compression plate (141) is placed above the holding support table (9) and a compression force V1 is applied by lowering the compression plate (141) to compress the sealing sheet S.

[0124] As an example, the pressure plate (141) is provided with a flat bottom surface and positioned above the sealing sheet S. Therefore, by lowering the pressure plate (141), a downward pressure force V1 is applied evenly to the entire sealing sheet S, and the sealing sheet S is pressed further into contact with the LED (11). As a result, the LED (11) can be sealed with high precision while maintaining the flatness of the sealing sheet S.

[0125] At this time, by raising the holding support table (9) and applying an upward pressure V2 to the back surface of the substrate (10), the force for pressing the LED (11) into the sealing sheet S can be further enhanced. Additionally, as another configuration for applying pressure to the sealing sheet P without the chamber (29), a configuration for pressing the sealing sheet P from above using a roller or the like can be cited.

[0126] (4) In the embodiment, the heating mechanism (120) is configured to be positioned on the upper space H2 side of the chamber (29) to heat the upper space H2, but is not limited thereto. That is, the heating mechanism (120) may be configured to heat the lower space H1. As an example, a heater (125) may be positioned inside the holding support table (9) to heat the lower space H1, thereby heating the conveying sheet T and the sealing sheet S. Additionally, the heating mechanism (120) may be configured to heat both the upper space H1 and the lower space H2.

[0127] (5) In the embodiment, an LED (11) is described as an example of a device to be sealed by the sealing sheet S, but it is not limited thereto. Other examples of devices include, in addition to the optical element exemplified by the LED (11), semiconductor devices, electronic components, etc.

[0128] (6) In the embodiment, after sealing the LED (11) with the sealing sheet S, a process of curing the sealing material Sb of the sealing sheet S may be performed. The process of curing the sealing material Sb can be appropriately changed depending on the material of the sealing material Sb, but examples include curing by heat treatment, curing by ultraviolet treatment, etc.

[0129] (7) In the example, OCA is used as the sealant Sb, but it is not limited thereto. That is, the sealant Sb may be an optically opaque material in addition to an optically transparent material, and may be a colorless or colored material.

[0130] (8) In the embodiment, the sealing member P is described as having a configuration that includes a long-shaped conveying sheet T and a sealing sheet S of a predetermined shape, but the sealing member P is not limited to a configuration that includes a conveying sheet T. As an example, the sealing member P may be configured with a long-shaped sealing sheet S as shown in FIG. 23 (a). FIG. 23 (b) shows the configuration of step S4 in the case of sealing the LED (11) using the long-shaped sealing sheet S. That is, the lower housing (29A) and the upper housing (29B) form a chamber (29) by inserting the sealing sheet S.

[0131] (9) In the embodiment, the LED (11) is sealed by moving the holding support table (9) up and down at a predetermined timing, but the movement of the holding support table (9) up and down may be appropriately changed. As an example, the pressure treatment regarding step S5 is not limited to a configuration in which the holding support table (9) is lowered, and the pressure treatment may be performed while maintaining the raised state.

[0132] (10) In the embodiment, first, in step S3, a relatively small pressure is applied between the sealing material Sb and the LED (11) to perform a first sealing (first sealing process), thereby attaching the substrate (10) to the sealing member P to form a sealing material composite M. Then, later, in steps S4 and S5, a relatively large pressure is applied to the sealing material Sb to perform a second sealing (second sealing process), and at the same time, a sealing material composite M and a ring frame f are integrated to form a sealing body MF. However, the process of forming the sealing body MF is not limited to this.

[0133] As an example, as shown in FIG. 24 (a), a frame composite FP in which a sealing sheet S and a ring frame f are integrated with a conveying sheet T is supplied, and a first sealing process and a second sealing process are performed on the frame composite FP.

[0134] When performing the first sealing process on the frame composite FP, as shown in FIG. 24 (b), the substrate (10) loaded on the lifting table (8) is raised and brought into contact with the frame composite FP positioned above the lifting table (8). As the LED (11) of the substrate (10) is pressed into the sealing sheet S of the frame composite FP, the substrate (10) is attached to and supported by the sealing sheet S. The frame composite FP with the substrate (10) supported is returned to the lower housing (29A) and loaded onto the support table (9) to perform the second sealing process.

[0135] (11) In the embodiment, the frame holding support member (38) is provided outside the lower housing (29A), but the frame holding support member (38) may be provided inside the lower housing (29A). In this case, the process after step S4 is performed with each of the ring frame f and the substrate (10) housed inside the chamber (29).

[0136] (12) In the embodiment, the sealing sheet S provided by the sealing member P is pre-formed into a predetermined shape according to the shape of the LED (11) mounting surface of the substrate (10), but is not limited thereto. That is, the sheet supply unit (71) may load the sealing member P, in which the long-shaped sealing sheet S is loaded onto the long-shaped conveying sheet T. The configuration of the sealing member P, in which the long-shaped sealing sheet S is attached to the long-shaped conveying sheet T, is as shown in FIG. 25 (a). In this case, the device sealing device (1) is provided with a sheet cutting device (201) upstream of the chamber (29), and the sheet cutting device (201) forms the long-shaped sealing sheet S into a predetermined shape.

[0137] The configuration of the sheet cutting device (201) is as shown in FIG. 25 (b). The sheet cutting device (201) is equipped with a support table (203), a cutter (205), and a sealing sheet retrieval unit (207). The support table (203) is arranged to receive a long sealing member P supplied by being ejected along direction L from the sheet supply unit (71) in a horizontal manner. The cutter (205) is arranged above the support table (203) and is capable of moving up and down by means of a movable platform not shown. As an example of the cutter (205), a roughly rectangular Thomson blade is used.

[0138] As the cutter (205) descends, a layer of the sealing sheet S among the sealing member P is cut into an approximately rectangular shape. The configuration in which the cutter (205) cuts the sealing sheet S is not limited to this, and as another example, a configuration in which a knife-shaped cutter (205) is moved along an approximately rectangular trajectory to cut the sealing sheet S into an approximately rectangular shape can be cited.

[0139] The sealing sheet recovery unit (207) recovers the unnecessary sealing sheet Sn left around the sealing sheet S, which has been cut into a roughly rectangular shape. The unnecessary portion of sealing sheet Sn is peeled off from the return sheet T immediately behind the transfer roller (208). The peeled sealing sheet Sn is guided to the recovery bobbin (210) by the guide roller (209). The recovery bobbin (201) winds and recovers the sealing sheet Sn peeled off from the return sheet T. Thus, the sealing member P, by the sheet cutting device (201), is left with the sealing sheet S, which has been formed into a roughly rectangular shape by the cutter (205), remaining on the return sheet T. The sealing sheet S, which has been cut into a roughly rectangular shape, is guided to the chamber (29) together with the return sheet T.

[0140] (13) In the embodiment, as shown in FIG. 26 (a), the chamber (29) may be provided with a sheet-shaped elastic body Ds. The elastic body Ds is arranged inside the upper housing (29B) and is configured to be in contact with the inner diameter of the upper housing (29B). In addition, the lower surface of the elastic body Ds and the cylindrical bottom of the upper housing (29B) are configured to be on the same plane. Thus, when the lower housing (29A) and the upper housing (29B) insert a conveying sheet T and form the chamber (29), the elastic body Ds comes into contact with the conveying sheet T. Specifically, the elastic body Ds comes into contact with the side opposite to the surface that holds and supports the sealing sheet S on the conveying sheet T (the upper surface side in the drawing). By arranging the elastic body Ds so as to be in contact with the inner diameter of the lower housing (29A), the elastic body Ds is not inserted when forming the chamber (29), so the sealing performance of the chamber (29) can be prevented from being reduced by the elastic body Ds. Examples of materials constituting the elastic body Ds include rubber, elastomer, or gel-like polymer materials.

[0141] By having the sealing member P have an elastic body Ds, the curvature of the sealing member P can be made more uniform when the sealing member P is deformed into a convex shape in step S5. For example, if the sealing sheet S is composed of a relatively hard material, the curvature of the sealing member P becomes non-uniform as shown in FIG. 26 (b).

[0142] That is, in region P1, where the sealing sheet S of the sealing member P is held and supported by the return sheet T, the bending ratio of the sealing member P due to the pressure V1 is small because a rigid sealing sheet S exists. On the other hand, in region P2, where the sealing sheet S of the sealing member P is not held and supported by the return sheet T, the bending ratio of the sealing member P due to the pressure V1 is relatively large. That is, as region P2 is easily deformed by the pressure V1, the bending ratio of the sealing member P in region P1 is further reduced. As a result, since the sealing sheet S becomes difficult to deform, the filling capacity of the sealing material Sb for the uneven portion of the substrate (10) (the mounting area of ​​the LED (11)) is reduced.

[0143] Meanwhile, when an elastic body Ds is provided, the entire elastic body Ds is uniformly deformed into a convex shape by the compressive force V1 as shown in FIG. 26 (c). As a result, the curvature of the sealing member P in region P1 is improved. That is, the sealing sheet S becomes more prone to deformation according to the shape of the upper surface in the LED (11) mounting area of ​​the substrate (10). In addition, the sealing sheet S first contacts the LED (11) at a predetermined part (for example, the central part), and then contacts the LED (11) as if spreading radially from said predetermined part. Therefore, the filling capacity of the sealing material Sb for the uneven part of the substrate (10) can be improved, and air bubbles can be avoided between the sealing sheet S and the LED (11). Thus, the sealing of the LED (11) by the sealing sheet S can be performed with greater precision.

[0144] Then, after the sealing of the LED (11) by the sealing sheet S is completed, the pressure applied by the pressure device (32) is stopped to release the pressure force V1, and the elastic body Ds returns to its original flat shape due to the elastic force. As the elastic body Ds becomes flat, the surface of the sealing sheet S also becomes flat along with the elastic body Ds. Therefore, in the state where the sealing by the sealing sheet S is completed, the flatness of the surface of the sealing sheet S can be improved.

[0145] (14) In the embodiment, the configuration of producing a sealing composite M by performing the first sealing process according to step S3 in the device sealing device (1) was described as an example, but the sealing composite M is not limited to a configuration produced inside the device sealing device (1). That is, a sealing composite M may be produced in advance by attaching a sealing sheet S to the LED mounting surface of a substrate (10) on which an LED (11) is mounted, and the LED (11) may be sealed with the sealing sheet S by applying a pressure higher than atmospheric pressure to the sealing composite M using the device sealing device (1).

[0146] The flowchart of the operation of the device sealing device (1) according to such a modified example is as shown in FIG. 27 (a). That is, the first sealing process, etc., according to the embodiment is omitted in this modified example. In addition, in the device sealing device (1) according to the modified example, a sealing material composite M, which is integrated with the ring frame f as shown in FIG. 27 (b), is stored in multiple stages in the frame supply unit (12). The sealing material composite M is integrated with the ring frame f by interposing a conveying sheet T. Below, a series of operations for sealing an LED (11) with a sealing sheet S using the device sealing device (1) according to the modified example will be described.

[0147] Step S1 (Supply of sealant composite)

[0148] First, when a sealing start instruction is given, a sealing composite M integrated with a ring frame f is supplied to the lower housing (29A). That is, the frame conveying device (17) adsorbs the sealing composite M having a ring frame f, which is housed in the frame supply unit (12), and moves it upward to the lower housing (29A).

[0149] When moving upward on the lower housing (29A), as shown in FIG. 28, the frame conveying device (17) descends to load a sealing material composite M having a ring frame f onto the lower housing (29A). At this time, as the ring frame f is moved and mounted on the frame holding support (38) surrounding the lower housing (29A), the conveying sheet T between the ring frame f and the sealing sheet S comes into contact with the cylindrical top of the lower housing (29A).

[0150] When the frame return device (17) releases the adsorption of the sealant composite M and rises, the position of the ring frame f is aligned by a plurality of support pins, etc., that are installed upright to surround the frame holding support member (38). Once the position of the ring frame f is aligned, the lower housing (29A) moves along the rail (40) together with the holding support table (9) from the initial position to the sealing position on the side of the device sealing mechanism (81).

[0151] Step S2 (Formation of the chamber)

[0152] When the sealant composite M is returned to the lower housing (29A), a chamber (29) is formed. In this modified example, since the return sheet T is already attached across the ring frame f and the top part of the lower housing (29A), the operation of the attachment roller (85) is not required. That is, when the sealant composite M is returned to the lower housing (29A), the upper housing (29B) is lowered. Along with the lowering of the upper housing (29B), as shown in FIG. 13, the return sheet T, which is the part attached to the top part of the lower housing (29A), is supported by being sandwiched between the upper housing (29B) and the lower housing (29A), thereby forming a chamber (29).

[0153] Step S3 (Sealing Process)

[0154] After forming the chamber (29), the sealing process is initiated. Since the sealing process in the modified example is common to the second sealing process in step S5 of the embodiment, a detailed description is omitted. That is, the pressurizing device (32) is operated to supply gas to the lower space H1 and the upper space H2, thereby pressurizing the lower space H1 and the upper space H2 to a specific value greater than atmospheric pressure. Examples of specific values ​​include 0.3 MPa to 0.5 MPa.

[0155] Due to the pressure applied to the upper space H2, a pressure force V1 is applied from the upper space H2 toward the sealing sheet S as shown in FIG. 15. Additionally, as the entire lower space H1 is pressurized, a pressure force V2 is applied uniformly from the lower space H1 toward the back surface of the substrate (10). Due to the action of pressure force V1 and pressure force V2, each LED (11) is further pressed into the sealing material Sb of the sealing sheet S, and the sealing material Sb is further filled into the gaps between the LEDs (11). As a result, the substrate (10) and the sealing sheet S are more closely attached, and the LEDs (11) are sealed by the sealing sheet S, thereby producing a sealing body MF.

[0156] After applying pressure between the sealing sheet S and the LED (11) for a predetermined time, the control unit (33) stops the pressurizing device (32). Then, the control unit (33) opens the lower space H1 and the upper space H2 to the atmosphere. The control unit (33) raises the upper housing (29B) to open the chamber (29) and, at the same time, raises the holding support table (9) so that the back side of the substrate (10) comes into contact with the substrate holding support surface of the holding support table (9).

[0157] Step S4 (Cutting the sheet)

[0158] While performing the process of step S3 within the chamber (29), the sheet cutting mechanism (82) is operated to cut the sealing member P. The operation of step S4 regarding the modified example is the same as the operation of step S6 regarding the embodiment. That is, as shown in FIG. 16, the cutter (95) cuts the sealing member P (specifically, the conveying sheet T) attached to the ring frame f into the shape of the ring frame f, and at the same time, the compression roller (96) follows the cutter (95) and presses the sheet cutting portion on the ring frame f while moving.

[0159] When the return sheet T is cut, the pinch roller (90) is raised to release the nip of the return sheet T. Then, as shown in FIG. 17, the nip roller (86) is moved toward the sheet recovery unit (74) to wind up and recover the unnecessary return sheet T after cutting, while simultaneously discharging a predetermined amount of sealing member P from the sheet supply unit (71). When the unnecessary return sheet T is wound up and recovered, the nip roller (86) returns to its initial position. Then, while holding and supporting the sealing body MF, the holding support table (9) moves from the sealing position to the initial position.

[0160] Step S5 (Retrieval of seal)

[0161] When the holding support table (9) returns to its initial position, the sealing body MF is recovered. In the modified example, the operation of step S5 for recovering the sealing body MF is the same as the operation of step S7 for the embodiment. That is, as shown in FIG. 18, the adsorption pad (28) provided in the frame transport device (17) adsorbs and holds the sealing body MF, thereby removing the sealing body MF from the lower housing (29A). The frame transport device (17) that adsorbs and holds the sealing body MF returns the sealing body MF to the sealing body recovery unit (6). The returned sealing body MF is loaded and stored in the cassette (41). Thus, in the modified example of (14), the operation of sealing the LED (11) mounted on the substrate (10) with the sealing sheet S is completed. Explanation of the symbols

[0162] 1: Device sealing device 3: Substrate transport mechanism 5: Courage 6: Complex recovery unit 7: Aligner 8: Lifting table 9: Holding Support Table 10: Board (Work) 11: LED (device) 12: Frame supply unit 13: Sealing unit 16: Substrate transport device 17: Frame return device 23: Retaining support arm 27: Adsorption plate 28: Suction pad 32: Pressurizing device 33: Control unit 38: Frame retaining support 71: Sheet supply unit 72: Separator Recovery Unit 73: Device seal 74: Sheet Retrieval Unit 81: Device attachment device 82: Sheet cutting device 85: Adhesion roller 86: Nip roller 95: Cutter f: Ring frame T: Return sheet S: Sealing sheet P: Sealing member MF: Sealant Ta: Record Tb: Adhesive Sa: Record Sb: Sealant

Claims

Claim 1 A device sealing method comprising a sealing process in which a sheet-shaped sealant is attached to a device mounting surface of a workpiece on which a device is mounted, thereby sealing the device with said sheet-shaped sealant, and wherein the sealing process is characterized by applying a first pressure directed from said sheet-shaped sealant toward the workpiece at a pressure higher than atmospheric pressure and a second pressure directed from said workpiece toward said sheet-shaped sealant at a pressure higher than atmospheric pressure to said sealant composite while the entire surface opposite to the device mounting surface of said workpiece is in contact with space. Claim 2 A device sealing method according to claim 1, comprising a receiving process of receiving the sealing material composite in a chamber, and the sealing process is characterized by sealing the device with the sheet-shaped sealing material by increasing the pressure of the internal space of the chamber after the receiving process. Claim 3 A device sealing method according to claim 2, wherein the sheet-shaped sealing material has a predetermined shape according to the device mounting surface of the workpiece and is supported on a long conveying sheet, the chamber has an upper housing and a lower housing, and the sealing process comprises: a process of forming upper and lower spaces by inserting the conveying sheet between the upper housing and the lower housing to divide the internal space of the chamber into a lower space in which the workpiece is positioned with the device mounting surface facing upward, and an upper space opposite to the lower space by interposing the sheet-shaped sealing material supported on the conveying sheet; and a space pressing process of sealing the device with the sheet-shaped sealing material by pressing at least the upper space among the upper space and the lower space. Claim 4 A device sealing method according to claim 3, wherein a sheet-shaped elastic body is provided and disposed inside the upper housing, and in the process of forming the upper and lower spaces, the sheet-shaped elastic body is disposed and provided such that the sheet-shaped elastic body comes into contact with the surface of the sheet-shaped sealing material that does not retain and support the sheet-shaped sealing material. Claim 5 A device sealing method according to claim 3 or 4, comprising a heating process for heating the sheet-shaped sealing material by heating at least one of the lower space and the upper space, and the sealing process for sealing the device with the sheet-shaped sealing material by applying a pressure higher than atmospheric pressure to the sheet-shaped sealing material in a state heated by the heating process. Claim 6 A device sealing method according to any one of claims 1 to 4, wherein the workpiece has one or more convex shaped members on a surface opposite to the device mounting surface, and further comprises a holding support process in which the workpiece is held and supported while the convex shaped members are positioned inside the concave portion using a holding support member having a concave portion in the center, and wherein the sealing process is executed after the workpiece is held and supported by the holding support member. Claim 7 A device sealing device comprising a sealing mechanism for sealing a device with a sheet-shaped sealant by applying a pressure higher than atmospheric pressure to a sealing composite formed by attaching a sheet-shaped sealant to a device mounting surface of a workpiece on which the device is mounted, wherein the sealing mechanism is characterized by applying a first pressure force directed from the sheet-shaped sealant toward the workpiece at a pressure higher than atmospheric pressure and a second pressure force directed from the workpiece toward the sheet-shaped sealant at a pressure higher than atmospheric pressure to the sealing composite while the entire surface opposite to the device mounting surface of the workpiece is in contact with space. Claim 8 A method for manufacturing a semiconductor product in which a device mounted on a workpiece is sealed by a sheet-shaped sealant, comprising a sealing process in which the device is sealed by applying a pressure higher than atmospheric pressure to a sealant composite formed by attaching a sheet-shaped sealant to the device mounting surface of a workpiece on which the device is mounted, wherein the sealing process comprises applying a first pressure force directed from the sheet-shaped sealant toward the workpiece at a pressure higher than atmospheric pressure and a second pressure force directed from the workpiece toward the sheet-shaped sealant at a pressure higher than atmospheric pressure to the sealant composite while the entire surface opposite to the device mounting surface of the workpiece is in contact with space.

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