Wiring board laminate and method for manufacturing a wiring board laminate

Abstract

A wiring board laminate is provided that makes it easy to laminate the substrates and also prevents the substrates from becoming expensive. A wiring board laminate (10) having a wiring board (WB) having an opening (19a), a buried member (14) embedded within the opening (19a) of the wiring board (WB), a curing agent (17) having a thermosetting resin, disposed between the buried member (14) and the inner surface of the opening (19a) and bonded to the wiring board (WB), and a wiring layer (23) formed on the surface of the wiring board (WB), the buried member (14), and the curing agent (17), wherein the buried member (14) has a ceramic body (13) and a metal film (15) formed on both surfaces of the ceramic body (13).

Description

Technology Field

[0001] The present invention relates to a wiring board laminate and a method for manufacturing a wiring board laminate. Background Technology

[0002] A wiring board laminate is known to properly cool heat-generating components, such as LEDs or QFNs (Quad For Non-Lead Packages), mounted on a wiring board, by dissipating heat from the back side of the wiring board.

[0003] In addition, in recent years, ceramic circuit boards are known in which ceramics with high thermal conductivity, such as aluminum nitride (AlN), are used as substrate materials for wiring boards (see, for example, Patent Document 1). By using ceramics with high thermal conductivity as substrate materials, high heat dissipation and heat resistance can be realized. Prior art literature

[0004] Japanese Patent Publication No. 3690944 The problem to be solved

[0005] However, in the ceramic circuit board (wire board laminate) described in Patent Document 1, there is a problem that it is difficult to laminate the board because ceramics are used throughout the entire board. In addition, there is a problem that the board becomes expensive because relatively expensive ceramics are used throughout the entire board.

[0006] Accordingly, the present invention aims to solve such problems by providing a wiring board laminate that facilitates the lamination of substrates and prevents the substrates from becoming expensive. Furthermore, the invention aims to provide a method for manufacturing such a wiring board laminate. means of solving the problem

[0007] [1] The wiring board laminate of the present invention comprises a wiring board having an opening, a buried member embedded within the opening of the wiring board, a thermosetting resin, a curing agent disposed between the buried member and the inner circumferential surface of the opening and bonded to the wiring board, and a wiring layer formed on the surface of the wiring board, the buried member and the thermosetting resin, wherein the buried member comprises a ceramic body and a metal film formed on both surfaces of the ceramic body.

[0008] According to the wiring board laminate of the present invention, a wiring board having an opening and a buried member embedded within the opening of the wiring board are provided. Since the buried member has a ceramic body, high heat dissipation and heat resistance can be realized by using a ceramic with high thermal conductivity as the substrate material. Furthermore, because a wiring board is used, high heat dissipation and heat resistance can be realized by using a ceramic as the substrate material, while also enabling lamination within the wiring board area. Additionally, costs can be reduced compared to the case of a ceramic circuit board in which the entire substrate is composed of ceramics.

[0009] In addition, according to the wiring board laminate of the present invention, a wiring board having an opening and a buried member embedded within the opening of the wiring board are provided, and since the buried member has a ceramic body, a reorganized ceramic body is used instead of a single ceramic board, and by making different areas into wiring boards, the possibility of cracking is reduced compared to the case where a single ceramic board is used.

[0010] [2] In the wiring substrate laminate of the present invention, at least one side of the outer edge of the embedded member has a metal film non-forming region in which the metal film is not formed, and the curing material is preferably disposed between the ceramic body and the wiring layer in the metal film non-forming region.

[0011] According to the wiring substrate laminate of the present invention, at least one side of the outer edge of the embedded member has a metal film non-forming region in which a metal film is not formed, and since the curing agent is disposed between the ceramic body and the wiring layer in the metal film non-forming region, the adhesion between the ceramic and the wiring layer, which is relatively difficult to adhere to, can be increased.

[0012] However, in cases where a metal film non-forming region is not formed and a metal film is formed to cover the entire ceramic body, there is a risk that cracks may occur in the corners of the ceramic body due to the difference in thermal expansion rates between the metal film and the ceramic body. However, according to the wiring board laminate of the present invention, the outer edge of the embedded member has a metal film non-forming region in which a metal film is not formed, and since the curing material is also disposed between the ceramic body and the wiring layer in the metal film non-forming region, there is no metal film on the outer edge of the embedded member, and it is possible to prevent cracks from occurring in the corners of the ceramic body due to the difference in thermal expansion rates between the metal film and the ceramic body.

[0013] [3] In the wiring substrate laminate of the present invention, the outer edge of the ceramic body has a metal film non-forming region on both sides, and the curing material is preferably placed between the ceramic body and the wiring layer in both metal film non-forming regions of the ceramic body.

[0014] According to the wiring substrate laminate of the present invention, on both sides of the ceramic body, there is a non-metal film forming region, and since the curing agent is disposed between the ceramic body and the wiring layer in the non-metal film forming region, the adhesion between the ceramic and the wiring layer, which is relatively difficult to adhere to on both sides of the ceramic body, can be improved, and cracks can be more reliably prevented from forming in the corner portions of the ceramic body.

[0015] [4] In the wiring substrate laminate of the present invention, when viewed in a planar view, the metal film non-forming region is preferably formed over the entire outer edge to surround the metal film.

[0016] According to the wiring substrate laminate of the present invention, since the metal film non-forming region is formed over the entire outer edge to surround the metal film, it becomes difficult for a local crack to form in a part of the outer edge of the ceramic body, and furthermore, it becomes difficult for a crack to form in the ceramic body.

[0017] [5] In the wiring substrate laminate of the present invention, it is preferable that the metal film is formed on the surface of the ceramic body by direct plating.

[0018] According to the wiring substrate laminate of the present invention, since the metal film is formed on the surface of the ceramic body by direct plating, the ceramic body and the metal film can be bonded with high adhesion. In addition, since it is not necessary to place a bonding material between the ceramic body and the metal film to increase adhesion, it is possible to prevent heat dissipation performance from being reduced by said bonding material.

[0019] [6] In the wiring substrate laminate of the present invention, a metal layer is disposed on the surface of the wiring substrate, and it is preferable to form a circuit wiring with a wiring layer, a metal layer, and a metal film.

[0020] According to the wiring board laminate of the present invention, a metal layer is disposed on the surface of the wiring board, and since the circuit wiring is composed of a wiring layer, a metal layer, and a metal film, various wiring structures can be formed even in the vertical direction.

[0021] [7] In the wiring substrate laminate of the present invention, the metal layer is preferably a metal plating film formed on the surface of the wiring substrate by plating.

[0022] According to the wiring substrate laminate of the present invention, since the metal layer is a metal plating film formed on the surface of the wiring substrate by plating, it has high adhesion to the wiring layer of the wiring substrate and becomes easy to form a laminated substrate with a complex structure.

[0023] [8] In the wiring board laminate of the present invention, the embedded member is preferably rectangular when viewed in planar form.

[0024] According to the wiring board laminate of the present invention, since the embedded member is rectangular when viewed in a planar view, it can be easily processed and also easily aligned with the opening. In addition, when electronic components are placed by interposing a wiring layer on the embedded member, the rectangular shape allows for even heat dissipation from many electronic components, thereby preventing localized thermal stress from increasing and making it even more difficult for cracks to form.

[0025] [9] The method for manufacturing a wiring board laminate according to the present invention is a method for manufacturing a wiring board laminate described in any one of [1] to [3], and comprises a wiring board or wiring board material having an opening, a buried member located inside the opening, and a cured product of a filling sheet or coating layer integrated with the wiring board or wiring board material and containing a thermosetting resin, and a step of obtaining a laminate in which a thermosetting resin is filled between the inner surface of the opening of the wiring board or wiring board material and the buried member, and a step of removing the cured product of the filling sheet or coating layer by grinding the cured product of the filling sheet or coating layer so that the thickness of the laminate after grinding becomes constant.

[0026] According to the method for manufacturing a wiring board laminate of the present invention, since a laminate with a structure in which a filling member is placed in an opening of a wiring board or wiring board material and a thermosetting resin is filled into the opening (by heating and pressurizing) is used, cumbersome processes are not required when placing the filling member, and the method can accommodate filling members of various shapes. Furthermore, when removing a cured material such as a filling sheet by grinding it so that the thickness of the laminate after grinding becomes uniform, the thermosetting resin filled into the opening does not become integrated with the cured material such as the filling sheet, making it difficult for the filled thermosetting resin to break or detach when peeling off the cured material. Consequently, the reliability of the filling structure of the filling member and the smoothness of the surface can be improved.

[0027]

[10] The method for manufacturing a wiring board laminate according to the present invention preferably comprises the steps of: preparing a laminated material including the wiring board or the wiring board material, the embedded member, and the filling sheet; integrating the laminated material by heating and pressing to obtain the laminated material; and removing the hardened material of the filling sheet by grinding the hardened material of the filling sheet so that the thickness of the laminated material after grinding becomes constant.

[0028] According to the method for manufacturing a wiring board laminate of the present invention, a buried member is placed in an opening of a wiring board or wiring board material, and a thermosetting resin contained in a filler sheet can be filled into the opening by heating and pressurizing, thereby allowing the laminate to be obtained by a dry process. At that time, cumbersome processes are not required when placing the buried member, and it is possible to accommodate buried members of various shapes. Furthermore, by grinding the cured material of the filler sheet so that the thickness of the laminate after grinding becomes uniform and removing the cured material of the filler sheet, the thermosetting resin filled into the opening does not become integrated with the cured material of the filler sheet, making it difficult for fracture or defects of the filled thermosetting resin to occur. Therefore, the reliability of the filling structure of the buried member and the smoothness of the surface can be improved.

[0029]

[11] The method for manufacturing a wiring board laminate according to the present invention is preferably a laminate in which a resin film having an opening at a position corresponding to the opening of the wiring board or the wiring board material is attached to the wiring board or the wiring board material, and when removing the cured product of the filling sheet or the coating layer, the thickness of the laminate after grinding is set to a thickness in which a portion of the resin film is removed, and the remaining portion of the resin film is peeled off from the laminate, and the cured product of the thermosetting resin covering the embedded member of the laminate is removed.

[0030] According to the method for manufacturing a wiring board laminate of the present invention, by attaching a resin film to the wiring board or the wiring board material, it becomes difficult for a thermosetting resin to adhere to the surface of the wiring board, etc. during filling. In addition, since the resin film is interposed between the cured material, such as a filling sheet, and the wiring board, etc., and the cured material is ground down to a thickness where a portion of the resin film is removed, the cured material can be removed more reliably. Furthermore, when the remainder of the resin film is peeled off from the laminate, the height of the thermosetting resin located at the opening of the resin film is lowered, and the convex thermosetting resin can be removed more easily. Brief explanation of the drawing

[0031] FIG. 1 is a cross-sectional view showing a wiring board laminate (10) according to embodiment 1. FIG. 2 is a drawing illustrating the buried member (14) in embodiment 1. FIG. 3 is a cross-sectional view illustrating a method for manufacturing a wiring board laminate according to Embodiment 1. FIG. 4 is a cross-sectional view illustrating a method for manufacturing a wiring board laminate according to Embodiment 1. FIG. 5 is a cross-sectional view illustrating a method for manufacturing a wiring board laminate according to Embodiment 1. FIG. 6 is a cross-sectional view illustrating a method for manufacturing a wiring board laminate according to Embodiment 2. FIG. 7 is a cross-sectional view illustrating a method for manufacturing a wiring board laminate according to Embodiment 3. FIG. 8 is a cross-sectional view illustrating a method for manufacturing a wiring board laminate according to Embodiment 3. FIG. 9 is a cross-sectional view illustrating a method for manufacturing a wiring board laminate according to Embodiment 3. FIG. 10 is a cross-sectional view illustrating a method for manufacturing a wiring substrate laminate according to Variant Example 1. FIG. 11 is a cross-sectional view illustrating a method for manufacturing a wiring substrate laminate according to Variant Example 2. Specific details for implementing the invention

[0032] Hereinafter, a wiring board laminate and a method for manufacturing a wiring board laminate according to an embodiment of the present invention will be described with reference to the drawings. Furthermore, each drawing described below is a schematic drawing that does not strictly reflect the actual structure, dimensions, or longitudinal and transverse scale.

[0033] [Embodiment 1]

[0034] 1. Configuration of the wiring board laminate (10) according to Embodiment 1

[0035] FIG. 1 is a cross-sectional view showing a wiring board laminate (10) according to embodiment 1. FIG. 2 is a drawing showing an embedded member (14) in embodiment 1. FIG. 2 (a) is a cross-sectional view showing an embedded member (14), FIG. 2 (b) is a perspective view showing an embedded member (14), and FIG. 2 (c) is a drawing showing a ceramic wafer (100) forming an embedded member (14).

[0036] As shown in FIG. 1, the wiring board laminate (10) according to embodiment 1 comprises a wiring board (WB), an embedded member (14), a curing agent (17), and a wiring layer (23). A wiring layer (23) is formed on both sides of the wiring board laminate (10). A pattern wiring is formed on the wiring layer (23) on the upper surface, and the wiring layer (23) on the lower surface is formed over the entire surface and can be connected to a heat sink not shown.

[0037] Accordingly, in the wiring board laminate (10), when an electric element (semiconductor chip, LED, reactor, etc.) is placed on the wiring layer (23) on the embedded member (14), heat emitted from the electric element is transferred to a heat sink (not shown) through the wiring layer (23) on the lower side of the embedded member, and can be dissipated to the outside from the heat sink.

[0038] The wiring board (WB) is a double-sided metal-clad laminate in which metal layers (20) are disposed on both sides of an insulating layer (19). For the wiring board (WB), for example, a glass epoxy substrate may be used, but a substrate using a suitable material as described later may also be used. In the wiring board (WB), a patterned metal layer is formed on one side (the upper surface in FIG. 1) of the insulating layer (19), but a metal layer that is not wired may also be used. In addition, in Embodiment 1, a single-layer wiring board is used for ease of explanation, but a laminated wiring board may also be used.

[0039] As the material of the insulating layer (19), it is preferable to include a thermosetting resin, and it is preferable to be a prepreg including a thermosetting resin and reinforcing fibers. As the thermosetting resin, any material that has heat resistance required for a wiring board while curing by heating, etc., may be used. Specifically, as the thermosetting resin, various thermosetting resins such as epoxy resin, phenolic resin, and polyimide resin may be used.

[0040] As for the prepreg, it only needs to contain a thermosetting resin, and any material that cures by heating, etc., and possesses the heat resistance required for a wiring board can be used. Specifically, examples include composites of various thermosetting resins such as epoxy resin, phenolic resin, and polyimide resin, and reinforcing fibers such as glass fiber, ceramic fiber, aramid fiber, and paper.

[0041] As for the metal layer (20), any metal may be used, for example, copper, copper alloy, aluminum, stainless steel, nickel, iron, other alloys, etc. Among these, copper and aluminum are preferred in terms of thermal conductivity and electrical conductivity.

[0042] The wiring board (WB) has an opening (18) in a portion corresponding to the position where the embedded member (14) is placed. The wiring board (WB) typically has a plurality of openings (18). The openings (18) can be formed using a drill, punch, router, etc. It is preferable that the size of the openings (18) be slightly larger than the ceramic body (13) of the embedded member (14).

[0043] The shape of the opening (18) is rectangular, but any shape such as a circle, ellipse, square, or a shape corresponding to the outer shape of the embedded member (14) can be adopted. Even in the case of a square or complex shape, it is possible to form a complex shape of the opening (18) by using a router, etc.

[0044] The embedded member (14) is embedded within the opening (18) of the wiring board (WB). The ceramic body (13) has a roughly rectangular shape, and the embedded member (14) has a rectangular shape when viewed in plan (see FIG. 2(a) and FIG. 2(b)), but it can be made into a suitable shape corresponding to the opening (18), for example, a circular, elliptical, square, or other shape. The horizontal size of the embedded member (14) is preferably 0.1 to 20 mm at the widest part, because if it is too large, it is easy to fall off after filling, and if it is too small, placement becomes difficult.

[0045] The embedded member (14) has a ceramic body (13) and a metal film (15) formed on both surfaces of the ceramic body (13) (see FIG. 2 (a) and FIG. 2 (b)). The thickness of the metal film (15) of the embedded member (14) is the same as the thickness of the metal layer (20) of the wiring board (WB).

[0046] On both sides of the outer edge of the embedded member (14), there is a metal film non-forming region E where the metal film (15) is not formed. That is, on both sides of the embedded member (14), the ceramic body (13) is exposed over the entire circumference of the outer edge.

[0047] The embedded member (14) can be formed by forming a metal film on both sides of a flat ceramic substrate by direct plating, etching the metal film to a predetermined width along a dicing line to form a non-metal film region E, and then cutting along the dicing line to form a reorganized portion (see (c) of FIG. 2 for the ceramic substrate before cutting).

[0048] As the material for the ceramic body (13), aluminum nitride (AlN) is used, but alumina (Al2O3) or other ceramic materials can be used.

[0049] The metal film (15) is formed on the surface of the ceramic body (13) by direct plating. Any metal may be used as the metal film (15), for example, copper, copper alloy, aluminum, stainless steel, nickel, iron, other alloys, etc. Among these, copper and aluminum are preferred in terms of thermal conductivity and electrical conductivity.

[0050] The curing agent (17) contains a thermosetting resin and is disposed between the inner surface of the embedded member (14) and the opening (18), and is bonded to the wiring substrate (WB). The curing agent (17) is also disposed between the ceramic body (13) and the wiring layer (23) in the metal film non-forming region E.

[0051] As for the resin constituting the curing agent (17), it is desirable that it has excellent adhesion to the embedded member (14) and does not impair voltage resistance characteristics. In addition, it is desirable that it deforms when heated and pressurized, hardens by heating, and possesses the heat resistance required for the wiring board. As such a resin, various engineering plastics can be used alone or mixed with two or more types in addition to epoxy resin, phenolic resin, and polyimide resin, but among these, epoxy resin is preferred because it has excellent bonding strength between metals. In particular, among epoxy resins, bisphenol A type epoxy resin, bisphenol F type epoxy resin, hydrogenated bisphenol A type epoxy resin, hydrogenated bisphenol F type epoxy resin, triblock polymer having a bisphenol A type epoxy resin structure at both ends, and triblock polymer having a bisphenol F type epoxy resin structure at both ends are even more preferred resins, as they have high fluidity and excellent miscibility with metal oxides and metal nitrides.

[0052] The wiring layer (23) is formed on both sides of the wiring board laminate (10) and is formed on the surface of the wiring board (WB), the embedded member (14), and the curing material (17). The wiring layer (23) is a metal plating layer formed by metal plating on the surface of the wiring board (WB), the embedded member (14), and the curing material (17). The wiring layer (23) forms a wiring pattern with the metal film (15) of the embedded member (14) and also forms a wiring pattern with the metal layer (20) of the wiring board (WB).

[0053] By placing an electronic element on the pattern wiring (especially on the pattern wiring on the embedded member (14)), heat emitted from the electronic element can be dissipated to the back side through the wiring layer (23) on the upper side, the embedded member (14), and the wiring layer (23) on the lower side, and can be dissipated to the outside through a heat dissipation fin (not shown) connected to the surface of the wiring layer (23) on the back side.

[0054] 2. Method for manufacturing a wiring board laminate according to Embodiment 1

[0055] Continuing, FIGS. 3 to 5, which describe a method for manufacturing a wiring board laminate (10), are cross-sectional views shown to explain a method for manufacturing a wiring board laminate according to Embodiment 1. FIGS. 3 (a) to FIGS. 3 (e), FIGS. 4 (a) to FIGS. 4 (d), FIGS. 5 (a) to FIGS. 5 (e) are each process diagrams.

[0056] In this embodiment, first, as shown in FIG. 3(a) and FIG. 3(b), a double-sided metal-clad laminate is used as the wiring board material (WB'), and a resin film (21) (filling sheet) is laminated onto the wiring board material (WB').

[0057] The double-sided metal-clad laminate, which is the wiring board material (WB'), has a cured insulating layer (19') bonded to metal layers (20') on both sides, but can be used with a semi-cured insulating layer (19') and cured at any stage. Additionally, it is possible to use two single-sided metal-clad laminates in which a semi-cured insulating layer (19') is bonded to a metal layer (20') and laminated with the insulating layers (19') facing each other. Furthermore, it may be a case where two metal plates (metal layers (20')) are laminated on both sides of the semi-cured insulating layer (19'). Additionally, it may be a wiring board (WB) having a patterned metal layer (20) on the surface of the insulating layer (19). As for the material of the semi-cured insulating layer (19'), it is preferable to include a thermosetting resin, and it is preferable to be a prepreg containing a thermosetting resin and reinforcing fibers.

[0058] The resin film (21) may be placed on the wiring board material (WB') as shown in FIG. 3 (b), but it is preferable to attach it to the wiring board (WB) or wiring board material (WB') to prevent misalignment and to prevent the curing agent (17) from adhering to the surface of the wiring board (WB) or wiring board material (WB').

[0059] As for the resin film (21), a resin film is preferred, and all of the following can be used: polyester such as polyethylene terephthalate, polyolefin such as polyethylene and polypropylene, polyamide, etc. However, from the perspective of heat resistance, polyester such as polyethylene terephthalate is preferred. In addition, when attaching the resin film (21), it is preferable to form an adhesive layer on the resin film (21). As the adhesive, rubber-based adhesive, acrylic-based adhesive, silicone-based adhesive, etc. can be used. Instead of forming an adhesive layer on the resin film (21), it is also possible to form an adhesive layer by applying it separately to a wiring board (WB) or a wiring board material (WB').

[0060] Next, as shown in FIG. 3(c), an opening (18) is formed in a portion corresponding to the embedded member (14) of the wiring board material (WB'). The wiring board material (WB') typically has a plurality of openings (18). The openings (18) can be formed using a drill, punch, router, etc. It is preferable that the size of the opening (18) be slightly larger than the upper surface of the embedded member (14).

[0061] Next, as shown in (d) of FIG. 3, a support film (22) is attached to the lower surface of the wiring board material (WB'). As for the support film (22), the same material as the resin film (21) described above can be used, and it is preferable that it have the same adhesive layer.

[0062] Next, as shown in FIG. 3 (e), a wiring board material (WB') is loaded onto a support (1).

[0063] Next, as shown in FIG. 4 (a), a buried member (14) is placed inside the opening (18) of the wiring board material (WB'). In this embodiment, a buried member (14) having a thickness equal to the thickness of the wiring board material (WB') is used. It is sufficient if it can be placed inside the opening (18) of the wiring board material (WB'). If the buried member (14) has a thickness smaller than the thickness of the wiring board material (WB'), the upper surface of the buried member (14) can be exposed by removing the curing agent (17) covering the upper surface of the buried member (14) as needed.

[0064] As a method for placing the embedded member (14), a mounting device for surface mounting a fine component on a wiring board, or, as described later, a method of stacking and placing the embedded member (14) on a wiring board (WB) or wiring board material (WB') by using an embedded member (14) that has been formed collectively at the position of the opening by etching on a support beforehand, is also possible, but a method of placing the embedded member (14) inside the opening by applying vibration is preferred. As such a device, a commercially available vibration embedding device used for surface mounting a fine component on a wiring board can be used.

[0065] As a method of applying vibration, a method may be used in which a buried member (14) is continuously placed inside an opening while applying vibration to a wiring board material (WB') and conveying it on its surface, similar to the conveying of fine parts by a vibration feeder. Additionally, as a placement method, a plurality of buried members (14) may be supplied to the upper surface of the wiring board material (WB'), and after applying vibration to the wiring board material (WB') and / or the buried member (14), the buried member (14) existing outside the opening may be removed.

[0066] The frequency and amplitude of the vibration can be appropriately set according to the size of the embedded member (14), but for example, the frequency is preferably 100 to 10000 Hz and the amplitude is preferably 10 μm to 1000 μm. As a generator of such minute vibrations, it can be configured, for example, as a vibrator using an electromagnet and an iron piece, or as an electroacoustic transducer such as a piezoelectric transducer or a ferrite vibrator.

[0067] In addition, as shown in FIG. 4 (a), when placing the embedded member (14) inside the opening (18) without deviation (preferably in the central position), a method using a mounting device or the like is preferred, but in a vibration application method, the embedded member (14) can be placed inside the opening without deviation by placing a jig that has a smaller opening that opens at the central position of the opening or near thereon on the upper side of the wiring board (WB) or wiring board material (WB').

[0068] Next, as shown in FIG. 4(b), a filling sheet (16') containing a curing agent (17) is laminated and placed on a wiring board material (WB') and a buried member (14) on a support (1) to form a laminated material (LM) containing these.

[0069] As for the filling sheet (16'), it may be a sheet made of a thermosetting resin, provided that it contains a curing agent (17), but it is preferable that it be a prepreg containing a curing agent (17) and reinforcing fibers. As for the resin constituting the filling sheet (16'), it is preferable that it has excellent adhesion to the embedded member (14) and does not impair voltage resistance characteristics. As such a resin, in addition to epoxy resin, phenolic resin, and polyimide resin, various engineering plastics may be used alone or mixed in two or more types, but among these, epoxy resin is preferred because it has excellent bonding strength between metals. In addition, as for the filling sheet (16'), it is preferable that it be composed of a material with high thermal conductivity, and examples include a resin containing a thermally conductive filler.

[0070] As for the curing agent (17), any material that deforms when heated and pressurized, hardens by heating, etc., and has the heat resistance required for the wiring board may be used. Specifically, as for the curing agent (17), various thermosetting resins such as epoxy resin, phenolic resin, and polyimide resin may be used.

[0071] As prepreg, any material that deforms when heated and pressurized, solidifies upon heating, and possesses the heat resistance required for wiring boards may be used. Specifically, examples include composites of various thermosetting resins such as epoxy resin, phenolic resin, and polyimide resin, and reinforcing fibers such as glass fiber, ceramic fiber, aramid fiber, and paper.

[0072] Next, as illustrated in FIG. 4(c), an example is shown comprising a process of integrating a laminated material (LM) by heat and pressure and filling a curing agent (17) between the inner surface of an opening of a wiring board material (WB') and a buried member (14) to obtain a laminated body (LB). In the illustrated example, this allows for the formation of a laminated body (LB) in which the height of the buried member (14) is the same height as the surface of the wiring board (WB) or the wiring board material (WB').

[0073] Additionally, as shown in FIG. 4(c) and FIG. 4(d), the filling sheet (16') becomes a thinner cured material (16) by heating and pressurizing, and the curing agent (17) is filled between the inner surface of the opening (18) of the wiring board (WB) or wiring board material (WB') and the embedded member (14), and the upper surface of the embedded member (14) is covered by the curing agent (17) of the filling sheet (16'). In addition, it is also disposed between the ceramic body (13) and the wiring layer (23) in the metal film non-forming region E where the metal film is not formed.

[0074] For heat pressing, a method may be adopted in which a laminated material (LM) is placed on a support (1) and heat pressed using a press plate (2), etc. As for the heat pressing method, it may be performed using a heat pressing device (heat laminator, heat press), etc., and at that time, in order to avoid the mixing of air, the atmosphere may be made vacuum (vacuum laminator, etc.). In particular, when a support film (22) is attached to the lower surface, since there is no place for air inside the opening to escape, it is preferable to perform heat pressing under a reduced pressure atmosphere. Conditions such as heating temperature and pressure may be appropriately set according to the material and thickness of the filling sheet (16'), but as a pressure, 0.5 to 30 MPa is preferred.

[0075] Next, as shown in FIG. 5(a), the cured material (16) of the coating layer is ground so that the thickness of the laminate (LB) after grinding becomes constant, and the cured material (16) is removed. In this embodiment, when removing the cured material (16), an example is shown in which the thickness of the laminate (LB) after grinding is such that a portion of the resin film (21) is removed. By doing so, the entire cured material (16) is removed, and a portion of the resin film (21) is removed. Of course, only the entire cured material (16) may be removed, or the entire cured material (16) and the resin film (21) may be removed.

[0076] As a device for grinding so that the thickness of the laminate (LB) becomes uniform, a commercially available table-moving belt sander can be used. In FIG. 5 (a), a grinding belt supported on the surface of a rotating roll is shown as a dashed line, but in reality, the grinding belt, which has a larger radius of curvature relative to the object to be ground and moves together with the roll, has a constant gap with the moving table (3). By passing the laminate (LB) through that gap, the thickness of the laminate (LB) can be ground so that it becomes uniform.

[0077] Next, as illustrated in FIG. 5(b), the remaining portion (21b) of the resin film (21) is peeled off from the laminate (LB). By doing so, the curing agent (17) covering the embedded member (14) remains, and a convex portion A made of the curing agent (17) is formed.

[0078] Next, as illustrated in FIG. 5(c), a process is provided to remove the convex portion A of the curing agent (17) covering the embedded member (14) of the laminate (LB). By doing so, the upper surface of the laminate (LB) can be flattened. Additionally, in Embodiment 1, the resin film (21) is removed prior to removing the convex portion A, but the resin film (21) can also be removed simultaneously when removing the convex portion A.

[0079] As a method for removing convex portion A, a method by grinding or polishing is preferred, and examples include a method using a grinding device having a hard rotary blade in which multiple hard blades, such as diamond blades, are arranged in the radial direction of a rotating plate, or a method using a sander, belt sander, grinder, surface grinding machine, hard abrasive molded product, etc.

[0080] Next, a process of peeling off at least the support film (22) (bottom side) from the laminate (LB) is performed. When peeling off the support film (22), it is preferable to set the adhesive force between the embedded member (14) and the support film (22) to be smaller than the adhesive force between the embedded member (14) and the curing agent (17). With such an adhesive force, the support film (22) can be easily peeled off.

[0081] Next, as shown in FIG. 5 (d), the exposed buried member (14) and the metal layer (20') are metal-plated to form a metal plating layer (23') (both sides). For the metal type of the metal plating, for example, copper, silver, Ni, etc., are preferred. For the method of forming the metal plating layer (23'), for example, a combination of electroless plating and electroplating can be cited.

[0082] Next, as shown in FIG. 5(e), a wiring layer (23) is formed by patterning the metal plating layer (23') and the metal layer (20'). The patterning can be performed by etching the metal plating layer (23') and the metal layer (20') into a predetermined pattern using, for example, an etching resist, to form the patterned wiring layer (23). The metal film (15) may also be etched.

[0083] In this way, a wiring board laminate (10) can be manufactured.

[0084] 3. Effects of the wiring board laminate (10) and the method for manufacturing the wiring board laminate according to Embodiment 1

[0085] According to the wiring board laminate (10) of Embodiment 1, a wiring board (WB) having an opening (18) and a buried member (14) embedded within the opening (18) of the wiring board (WB) are provided, and since the buried member (14) has a ceramic body (13), high heat dissipation and heat resistance can be realized by using ceramics with high thermal conductivity as the substrate material. In addition, since a wiring board (WB) is used, high heat dissipation and heat resistance can be realized by using ceramics as the substrate material, and lamination can be performed in the area of ​​the wiring board (WB). Furthermore, costs can be reduced compared to the case of a ceramic circuit board in which the entire substrate is composed of ceramics.

[0086] In addition, according to the wiring board laminate (10) of embodiment 1, a wiring board (WB) having an opening (18) and a buried member (14) embedded within the opening (18) of the wiring board (WB) are provided, and since the buried member (14) has a ceramic body (13), the possibility of cracking can be reduced compared to the case where a single ceramic board is used, by using a reorganized ceramic body (13) and making different areas into wiring boards.

[0087] According to the wiring board laminate (10) according to embodiment 1, the outer edge of the embedded member (14) has a metal film non-forming region E in which a metal film (15) is not formed, and since the curing agent (17) is also placed between the ceramic body (13) and the wiring layer (23) in the metal film non-forming region E, the adhesion between the ceramic body (13), which is made of ceramics that are relatively difficult to adhere to, and the wiring layer (23), which is made of metal, can be increased.

[0088] According to the wiring board laminate (10) according to embodiment 1, on both sides of the ceramic body (13), there is a metal film non-forming region E, and since the curing agent (17) is also placed between the ceramic body (13) and the wiring layer (23) in the metal film non-forming region E, the adhesion between the ceramic body (13) and the wiring layer (23), which is relatively difficult to adhere to on both sides of the ceramic body (13), can be increased, and also, cracks can be more reliably prevented from forming in the corner portions of the ceramic body (13).

[0089] According to the wiring board laminate (10) according to embodiment 1, the metal film non-forming region E is formed over the entire outer edge to surround the metal film (15), so it is difficult for a local crack to form in a part of the outer edge of the ceramic body (13), and furthermore, it is difficult for a crack to form in the ceramic body (13).

[0090] According to the wiring board laminate (10) of Embodiment 1, since the metal film (15) is formed on the surface of the ceramic body (13) by direct plating, the ceramic body (13) and the metal film (15) can be bonded with high adhesion. In addition, since it is not necessary to place a bonding material to increase adhesion between the ceramic body (13) and the metal film (15), it is possible to prevent heat dissipation from being reduced by said bonding material.

[0091] According to the wiring board laminate (10) according to embodiment 1, a wiring layer (23) is disposed on the surface of the wiring board (WB), and since the circuit wiring is configured with the wiring layer (23), the metal layer (20), and the metal film (15), it is possible to configure a wiring pattern of a complex configuration.

[0092] According to the wiring board laminate (10) of Embodiment 1, since the wiring layer (23) is a metal plating film formed on the surface of the wiring board (WB) by plating, the adhesion between the wiring board (WB) and the wiring layer (23) is high, and it becomes easy to form a laminated board with a complex structure.

[0093] According to the wiring board laminate (10) of Embodiment 1, since the embedded member (14) is rectangular when viewed in a planar view, it can be easily processed and also easily aligned with the opening. In addition, when electronic elements are placed by interposing a wiring layer (23) on the embedded member (14), heat can be evenly dissipated from many electronic elements due to the rectangular shape, so localized thermal stress can be prevented, making it even more difficult for cracks to form.

[0094] According to the method for manufacturing a wiring board laminate according to Embodiment 1, a laminate structure is used in which a filling member (14) is placed in an opening of a wiring board (WB) or a wiring board material (WB') and a thermosetting resin is filled into the opening by heating and pressurizing. Therefore, when placing the filling member (14), a complicated process is not required, and the method can accommodate filling members of various shapes. In addition, when removing a hardened material such as a filling sheet (16') by grinding it so that the thickness of the laminate after grinding becomes uniform, the thermosetting resin filled into the opening (18) does not become integrated with the hardened material such as the filling sheet, and it becomes difficult for the filling thermosetting resin to break or break when peeling off the hardened material. Therefore, the reliability of the filling structure of the filling member and the smoothness of the surface can be increased.

[0095] According to the method for manufacturing a wiring board laminate according to Embodiment 1, a buried member (14) is placed in an opening (18) of a wiring board (WB) or a wiring board material (WB'), and a thermosetting resin included in a filling sheet (16') can be filled into the opening (by heating and pressurizing), so the laminate can be obtained by a dry process. At that time, no complicated process is required when placing the buried member, and it can accommodate buried members of various shapes. In addition, the cured material of the filling sheet is ground so that the thickness of the laminate after grinding becomes uniform, and the cured material of the filling sheet is removed so that the thermosetting resin filled into the opening does not become integrated with the cured material of the filling sheet, and it becomes difficult for the filling thermosetting resin to break or break. Therefore, the reliability of the filling structure of the buried member and the smoothness of the surface can be increased.

[0096] According to the method for manufacturing a wiring board laminate according to Embodiment 1, by attaching a resin film to a wiring board (WB) or a wiring board material (WB'), it becomes difficult for a thermosetting resin to adhere to the surface of the wiring board, etc., during filling. In addition, since a resin film is interposed between a cured material such as a filling sheet and the wiring board, etc., and the cured material is ground down to a thickness where a portion of the resin film is removed, the cured material can be removed more reliably. Furthermore, when the remaining portion of the resin film is peeled off from the laminate, the height of the thermosetting resin located at the opening of the resin film is lowered, making it easier to remove the convex thermosetting resin.

[0097] [Embodiment 2]

[0098] FIG. 6 is a cross-sectional view illustrating a method for manufacturing a wiring board laminate according to Embodiment 2. FIG. 6(a) to FIG. 6(c) are each process steps. The method for manufacturing a wiring board laminate according to Embodiment 2 basically has the same process as the method for manufacturing a wiring board laminate according to Embodiment 1, but differs from the method for manufacturing a wiring board laminate according to Embodiment 1 in that it does not use a support film (22).

[0099] In embodiment 2, as shown in FIG. 6(a), a wiring board material (WB') is loaded onto a support (1), such as a mirror plate, and a buried member (14) is placed inside the opening of the wiring board material (WB') (see FIG. 6(b)).

[0100] Next, a filling sheet containing a curing agent (17) is loaded and heated and pressed (see (c) of FIG. 6). By doing so, a process is carried out to obtain a laminate (LB) in which the curing agent (17) is filled between the inner surface of the opening (18) of the wiring board (WB) or wiring board material (WB') and the embedded member (14) and integrated. At that time, the curing agent (17) may adhere around the opening on the lower surface of the wiring board (WB) or wiring board material (WB'), but the adhered curing agent (17) can be removed by polishing or chemical treatment.

[0101] The subsequent process is omitted from the description because, except for the process of removing the support film, it follows the same process as the method for manufacturing a wiring board laminate according to Embodiment 1.

[0102] As such, the method for manufacturing a wiring board laminate according to Embodiment 2 differs from the method for manufacturing a wiring board laminate according to Embodiment 1 in that it does not use a support film (22). However, just like the method for manufacturing a wiring board laminate according to Embodiment 1, a laminate with a structure in which a filling member is placed in an opening of a wiring board or wiring board material and a thermosetting resin is filled into the opening by heating and pressurizing is used. Therefore, when placing the filling member, a cumbersome process is not required, and it can accommodate filling members of various shapes. In addition, when removing a cured material such as a filling sheet by grinding it so that the thickness of the laminate after grinding becomes uniform, the thermosetting resin filled into the opening does not become integrated with the cured material such as the filling sheet, and it becomes difficult for the filling thermosetting resin to break or break when peeling off the cured material. Therefore, the reliability of the filling structure of the filling member and the smoothness of the surface can be increased.

[0103] In addition, the method for manufacturing a wiring board laminate according to Embodiment 2 has the same process as the method for manufacturing a wiring board laminate according to Embodiment 1 except that it does not use a support film (22), so it has the corresponding effect among the effects of the method for manufacturing a wiring board laminate according to Embodiment 1.

[0104] [Embodiment 3]

[0105] FIG. 7 is a cross-sectional view illustrating a method for manufacturing a wiring board laminate according to Embodiment 3. FIG. 7(a) to FIG. 7(e) are each process steps. The method for manufacturing a wiring board laminate according to Embodiment 3 basically has the same process as the method for manufacturing a wiring board laminate according to Embodiment 1, but differs from the method for manufacturing a wiring board laminate according to Embodiment 1 in that it does not use a resin film (21).

[0106] In embodiment 3, a wiring board material (WB') having an opening (18) and not having a resin film (21) attached (see FIG. 7 (a)), a buried member (14) located inside the opening, and a filling sheet (16') laminated to the wiring board material (WB') and containing a curing agent (17) are prepared (see FIG. 7 (b)). In this embodiment, a support film (22) is attached to the lower surface of the wiring board material (WB').

[0107] Next, in the same manner as in the previous embodiment, the laminated material (LM) is integrated by heat and pressure to obtain a laminated body (LB) in which a curing agent (17) is filled between the inner surface of the opening (18) of the wiring board material (WB') and the embedded member (14). By doing so, a laminated body (LB) can be formed in which the height of the embedded member (14) is the same height as the surface of the wiring board material (WB').

[0108] Next, as shown in FIG. 7 (d), the hardened material (16) of the filling sheet (16') is ground so that the thickness of the laminate (LB) after grinding becomes constant, thereby removing the hardened material (16) of the filling sheet (16'). However, in this embodiment, when removing the hardened material (16) of the filling sheet (16'), the thickness of the laminate (LB) after grinding is set to a thickness such that all or almost all of the hardened material (16) is removed. By doing so, all or almost all of the hardened material (16) is removed.

[0109] Next, the support film (22) is removed. Since the subsequent process is the same as the manufacturing method of the wiring board laminate according to Embodiment 1, the description is omitted. In this way, the wiring board laminate (10) according to Embodiment 3 can be manufactured (see FIG. 7 (e)).

[0110] As such, the method for manufacturing a wiring board laminate according to Embodiment 3 differs from the method for manufacturing a wiring board laminate according to Embodiment 1 in that it does not use a resin film (21). However, just like the method for manufacturing a wiring board laminate according to Embodiment 1, a laminate with a structure in which a filling member is placed in an opening of a wiring board or wiring board material and a thermosetting resin is filled into the opening by heating and pressurizing is used. Therefore, when placing the filling member, a cumbersome process is not required, and it can accommodate filling members of various shapes. In addition, when removing a cured material such as a filling sheet by grinding it so that the thickness of the laminate after grinding becomes uniform, the thermosetting resin filled into the opening does not become integrated with the cured material such as the filling sheet, and it becomes difficult for the filling thermosetting resin to break or break when peeling off the cured material. Therefore, the reliability of the filling structure of the filling member and the smoothness of the surface can be increased.

[0111] In addition, the method for manufacturing a wiring board laminate according to Embodiment 3 has the same process as the method for manufacturing a wiring board laminate according to Embodiment 1 except that it does not use a resin film (21), so it has the corresponding effect among the effects of the method for manufacturing a wiring board laminate according to Embodiment 1.

[0112] [Embodiment 4]

[0113] FIG. 8 is a cross-sectional view illustrating a method for manufacturing a wiring board laminate according to Embodiment 4. FIG. 8(a) and FIG. 8(b) are each process diagrams. The method for manufacturing a wiring board laminate according to Embodiment 4 basically has the same process as the method for manufacturing a wiring board laminate according to Embodiment 1, but differs from the method for manufacturing a wiring board laminate according to Embodiment 1 in that an embedded member (14) is placed on a support film (22) in front of the wiring board material (WB).

[0114] In embodiment 4, as shown in FIG. 8(a), a buried member (14) is placed on a support film (22) in front of a wiring board material (WB'), and then, while aligning the position with the buried member (14), a wiring board material (WB) is placed on the support film (22), and a charging sheet (16') is placed on the wiring board material (WB) and the buried member (14).

[0115] The subsequent process is omitted from the description because it follows the same process as the method for manufacturing a wiring board laminate according to Embodiment 1.

[0116] As such, the method for manufacturing a wiring board laminate according to Embodiment 4 differs from the method for manufacturing a wiring board laminate according to Embodiment 1 in that a buried member (14) is placed on a support film (22) in front of the wiring board material (WB). However, just like the method for manufacturing a wiring board laminate according to Embodiment 1, a buried member is placed in an opening of the wiring board or wiring board material, and a laminate with a structure in which a thermosetting resin is filled into the opening by heating and pressurizing is used. Therefore, when placing the buried member, a cumbersome process is not required, and it can accommodate buried members of various shapes. Furthermore, when removing the cured material, such as a filling sheet, by grinding it so that the thickness of the laminate after grinding becomes uniform, the thermosetting resin filled into the opening does not become integrated with the cured material, such as the filling sheet, and it becomes difficult for the filled thermosetting resin to break or break when peeling off the cured material. For this reason, the reliability of the filling structure of the buried member or the smoothness of the surface can be improved.

[0117] In addition, the method for manufacturing a wiring board laminate according to Embodiment 4 has the same process as the method for manufacturing a wiring board laminate according to Embodiment 1 except that a buried member (14) is placed on a support film (22) in front of the wiring board material (WB), so it has the corresponding effect among the effects of the method for manufacturing a wiring board laminate according to Embodiment 1.

[0118] [Embodiment 5]

[0119] FIG. 9 is a cross-sectional view illustrating a method for manufacturing a wiring board laminate according to Embodiment 5. FIG. 9(a) to FIG. 9(e) are each process steps. The method for manufacturing a wiring board laminate according to Embodiment 5 basically has the same process as the method for manufacturing a wiring board laminate according to Embodiment 1, but differs from the method for manufacturing a wiring board laminate according to Embodiment 1 in that a wiring board (WB) having a wiring pattern (20) as a metal layer and an insulating layer (19) is used instead of a wiring board material (WB).

[0120] As illustrated in FIG. 9(a), a laminated material (LM) comprising a support film (22) forming a buried member (14), a wiring board (WB) having a plurality of openings (18) in a portion corresponding to the buried member (14), and a filling sheet (16') containing a curing agent (17) is laminated such that the buried member (14) is positioned inside each opening (18). At this time, it is preferable that the upper surface of the wiring board (WB) is covered with a resin film (21), and it is even more preferable that the resin film (21) has a plurality of openings (21a) in a portion corresponding to the buried member (14).

[0121] Next, as illustrated in FIG. 9(b), a process is carried out to obtain a laminate (LB) in which a curing agent (17) is filled between the inner surface of the opening (18) of the wiring board (WB) and the embedded member (14) by integrating the laminated material (LM) by heating and pressing. By doing so, a laminate (LB) can be formed in which the height of the embedded member (14) is the same height as or slightly lower than the upper surface of the wiring board (WB). This process can be carried out in the same manner as the previous embodiment.

[0122] After that, as shown in FIG. 9(c), a process of removing the cured material (16) of the filling sheet (16') is performed by grinding the cured material (16) of the filling sheet (16') so that the thickness of the laminate (LB) after grinding becomes constant, in the same manner as in the previous embodiment. In this embodiment, when removing the cured material (16) of the filling sheet (16'), an example is shown in which the thickness of the laminate (LB) after grinding is set to a thickness at which a portion of the resin film (21) is removed. As a result, the entire cured material (16) is removed, and a portion of the resin film (21) is removed. Of course, it is also possible to remove only the entire cured material (16).

[0123] Next, as shown in FIG. 9 (d) and FIG. 9 (e), the resin film (21) on the upper surface is peeled off, and the thermosetting resin (convex portion A) covering the upper surface of the embedded member (14) is removed. If the upper surface of the embedded member (14) is higher than the upper surface of the wiring board (WB), it is also possible to remove the embedded member (14) to that extent as needed.

[0124] Accordingly, a wiring board can be obtained having an insulating layer (19), a buried member (14) embedded in the insulating layer (19), and a wiring layer (wiring pattern (20)), wherein the insulating layer (19) comprises a cured product (16) of a filling sheet (16'), and the surroundings of the buried member (14) are bonded to the insulating layer (19) by a curing agent (17) different from the resin component of the insulating layer (19).

[0125] As shown in the example, when using a double-sided wiring board, it is desirable to have an interlayer connection structure such as plated through-holes, metal bumps, field vias, and plated vias.

[0126] As such, the method for manufacturing a wiring board laminate according to Embodiment 5 differs from the method for manufacturing a wiring board laminate according to Embodiment 1 in that a wiring board (WB) having a wiring pattern (20) and an insulating layer (19) is used instead of a wiring board material (WB). However, just like the method for manufacturing a wiring board laminate according to Embodiment 1, a laminate with a structure in which a filling member is placed in an opening of a wiring board or wiring board material and a thermosetting resin is filled into the opening by heating and pressurizing is used. Therefore, when placing the filling member, a cumbersome process is not required, and it can accommodate filling members of various shapes. Furthermore, when removing a hardened material such as a filling sheet by grinding so that the thickness of the laminate after grinding becomes uniform, the thermosetting resin filled into the opening does not become integrated with the hardened material such as the filling sheet, and it becomes difficult for the filled thermosetting resin to break or break when peeling off the hardened material. For this reason, the reliability of the filling structure of the buried member or the smoothness of the surface can be improved.

[0127] In addition, the method for manufacturing a wiring board laminate according to Embodiment 5 has the same process as the method for manufacturing a wiring board laminate according to Embodiment 1, except that a wiring board (WB) having a wiring pattern (20) and an insulating layer (19) is used instead of a wiring board material (WB), so it has the corresponding effect among the effects of the method for manufacturing a wiring board laminate according to Embodiment 1.

[0128] Although the present invention has been described above based on the embodiments, the present invention is not limited to the embodiments described above. It is possible to implement the invention in various forms without departing from the spirit thereof, and, for example, the following modifications are possible.

[0129] (1) The number, material, shape, position, size, etc. of the components described in each of the above embodiments are examples, and may be changed within a range that does not impair the effects of the present invention.

[0130] (2) In each of the above embodiments (including variations of the above or below; hereinafter the same), the wiring board laminate is made with the surface and the back surface insulated, but the present invention is not limited thereto. The wiring board laminate may be made with the surface and the back surface conductive. In this case, the wiring board laminate may be made with the surface and the back surface conductive by forming a through hole in the opening of the wiring board material (WB) and plating the inner surface of the through hole to form a plated through hole (wiring board laminate according to Variation Example 1. See FIG. 10 (a) to FIG. 10 (c)).

[0131] (3) In each of the above embodiments, the metal layer (20) is a single-layer structure, but the present invention is not limited thereto. The metal layer may be a multilayer wiring board with two or more layers.

[0132] (4) In each of the above embodiments, an example of forming a laminate (LB) using a filling sheet (16') containing a curing agent (17) has been shown, but the present invention is not limited thereto. As illustrated in FIG. 11(a), a laminate (LB) is formed in which a cured product (16) of a coating layer having a concave portion (17a) above a buried member (14) is integrated with a wiring board material (WB') by using a coating material containing a curing agent (17) (see FIG. 11(a)), and when performing a process to remove the cured product (16) by grinding the cured product (16) of the coating layer so that the thickness of the laminate (LB) after grinding becomes constant, the peripheral portion (17b) of the cured product (16) of the coating layer and a portion of the thickness of the resin film (21) are removed (see FIG. 11(b)), the remainder (21b) of the resin film (21) is peeled off from the laminate (LB) (see FIG. 11(c)), and the cured product (16) of the coating layer on the upper surface of the buried member (14) may be removed by polishing such as buff polishing or sandblasting (Fig. 11(d) reference).

[0133] (5) In each of the above embodiments, a wiring board laminate is manufactured using a wiring board material (WB') having a metal layer formed on both surfaces of a ceramic body (13), but the present invention is not limited thereto. A wiring board laminate may also be manufactured using a wiring board material having a metal layer formed on one side of a ceramic body (13).

[0134] (6) In each of the above embodiments, the metal film non-forming region is provided on both sides of the outer edge of the ceramic body, but the present invention is not limited thereto. The metal film non-forming region may be provided on only one side of the outer edge of the ceramic body and said metal film non-forming region may be filled with a curing agent, or the metal film non-forming region may be provided on only a part of the outer edge of the ceramic body and said metal film non-forming region may be filled with a curing agent.

[0135] (7) In each of the above embodiments, the thickness of the metal film (15) of the embedded member (14) is made to be the same as the thickness of the metal layer (20) of the wiring board (WB), but the present invention is not limited thereto. The thickness of the metal film (15) of the embedded member (14) may be made to be different from the thickness of the metal layer (20) of the wiring board (WB). When the thickness of the metal film (15) of the embedded member (14) is made thinner than the thickness of the metal layer (20) of the wiring board (WB), the thermal resistance when transferring heat emitted from the electronic element to the back side through the embedded member (14) is reduced, and furthermore, the heat emitted from the electronic element is made easier to transfer to the outside. In addition, if the thickness of the metal film (15) of the embedded member (14) is made thicker than the thickness of the metal layer (20) of the wiring board (WB), the stress of the ceramic body (13) and the stress of the metal film (15) can be adjusted. Explanation of the symbols

[0136] 10: Wiring board laminate 13: Ceramics body 14: Buried component 15: Metal film 17: Hardener 19: Insulating layer 20: Metal layer 19a: opening 23: Wiring layer E: Metal film non-formation region WB: Wiring board

Claims

Claim 1 A wiring board laminate comprising: a wiring board having an opening; a buried member embedded within the opening of the wiring board; a thermosetting resin; a curing agent disposed between the buried member and the inner circumferential surface of the opening and bonded to the wiring board; and a wiring layer formed on the surface of the wiring board, the buried member, and the thermosetting resin; wherein the buried member has a ceramic body and a metal film formed on both surfaces of the ceramic body, and has a metal film non-forming region in which the metal film is not formed on the outer edge of at least one of the front and back surfaces of the buried member, and the curing agent is disposed between the ceramic body and the wiring layer in the metal film non-forming region, and the metal film is directly bonded to the wiring layer. Claim 2 A wiring substrate laminate according to claim 1, characterized in that the metal film non-forming regions are formed on both sides of the outer edge of the embedded member, and the curing material is disposed between the ceramic body and the wiring layer in the metal film non-forming regions on both sides of the ceramic body. Claim 3 A wiring substrate laminate according to claim 1 or 2, characterized in that, when viewed in a planar view, the metal film non-forming region is formed over the entire outer edge to surround the metal film. Claim 4 A wiring substrate laminate according to claim 1 or 2, characterized in that the metal film is formed on the surface of the ceramic body by direct plating. Claim 5 A wiring board laminate according to claim 1 or 2, wherein a metal layer is disposed on the surface of the wiring board, and circuit wiring is formed by the wiring layer, the metal layer, and the metal film. Claim 6 A wiring substrate laminate according to claim 5, wherein the metal layer is a metal plating film formed on the surface of the wiring substrate by plating. Claim 7 A wiring board laminate according to claim 1 or 2, wherein the opening is rectangular in shape and the embedded member is rectangular when viewed in planar form. Claim 8 A wiring board laminate according to claim 1 or 2, wherein the ceramic body is composed solely of ceramics. Claim 9 A method for manufacturing a wiring board laminate according to claim 1 or 2, comprising: a wiring board or wiring board material having an opening; a ceramic body located inside the opening; a metal film formed on both surfaces of the ceramic body; a metal film non-forming region having no metal film formed on the outer edge of at least one surface, either a front or a back surface; a cured product of a filling sheet or coating layer including a thermosetting resin integrated with the wiring board or wiring board material; a process of obtaining a laminate disposed on the surface of the ceramic body in the metal film non-forming region, wherein the thermosetting resin is filled between the inner surface of the opening of the wiring board or wiring board material and the cured product of the coating layer and the filling member; a process of removing the cured product of the filling sheet or coating layer by grinding the cured product of the coating layer so that the thickness of the laminate after grinding becomes constant; and a process of forming a wiring layer on the surface of the wiring board or wiring board material and the filling member from which the cured product has been removed. A method for manufacturing a wiring substrate laminate, wherein the curing agent is also disposed between the ceramic body and the wiring layer in the metal film non-forming region, and the wiring layer is formed such that the metal film is directly bonded to the wiring layer. Claim 10 A method for manufacturing a wiring board laminate according to claim 9, characterized by comprising: a process of preparing a laminated material including the wiring board or the wiring board material, the embedded member, and the filling sheet; a process of integrating the laminated material by heating and pressing to obtain the laminated body; and a process of removing the hardened material of the filling sheet by grinding the hardened material of the filling sheet so that the thickness of the laminated body after grinding becomes constant. Claim 11 A method for manufacturing a wiring board laminate according to claim 9, wherein the laminate is a laminate in which a resin film having an opening at a position corresponding to the opening of the wiring board or the wiring board material is attached to the wiring board or the wiring board material, and wherein, when removing the cured product of the filling sheet or the coating layer, the thickness of the laminate after grinding is set to a thickness in which a portion of the resin film is removed, and further, the remaining portion of the resin film is peeled off from the laminate, and the cured product of the thermosetting resin covering the embedded member of the laminate is removed. Claim 12 delete

Images