Electronic device including shielding member and heat radiating structure

Abstract

An electronic device according to various embodiments of the present invention may include a housing, a printed circuit board disposed inside the housing, a first electronic component and / or a second electronic component disposed on the printed circuit board, a shielding member disposed to surround the first electronic component and / or the second electronic component, and a first thermal diffusion member configured to surround at least a portion of a first surface of the shielding member. Various other embodiments may be possible.

Description

Technology Field

[0001] Various embodiments of the present invention relate to an electronic device including a shielding member and a heat dissipation structure. Background Technology

[0002] The use of electronic devices such as smartphones, laptops, or tablet PCs is increasing.

[0003] The above electronic device may include a printed circuit board (PCB) on which various electronic components are arranged.

[0004] Electronic components such as an application processor (AP), a communication processor (CP), a power management integrated circuit (PMIC), and / or RLC components may be placed on the above printed circuit board.

[0005] In order to provide various functions to the user, the integration density of electronic components placed on a printed circuit board can be increased in the above electronic device. The problem to be solved

[0006] When various electronic components (e.g., processors, PMICs, and / or RLC devices) are integrated at high density on a printed circuit board, the electronic device can generate heat.

[0007] If the above electronic device does not diffuse and dissipate heat generated from electronic components placed on a printed circuit board to other areas, the performance of the electronic device may be degraded or the electronic device may not operate normally.

[0008] As the functions of the aforementioned electronic device become more complex and high-performance, the clock frequency and data transmission speed for driving electronic components, such as processors, may become increasingly faster. In this case, the performance of the electronic device may be degraded due to electromagnetic interference (e.g., EMI) and noise interference (e.g., RFI) generated within the electronic device.

[0009] As the performance of electronic components (e.g., processor, PMIC) increases and current consumption rises, the above electronic device may place, for example, at least one capacitor around the electronic components to enable the electronic components to operate stably. In this case, if a significant difference in power ripple occurs due to the power consumption of the PMIC, at least one capacitor placed on the printed circuit board may vibrate, and audible noise may be generated in a specific frequency band.

[0010] Various embodiments of the present invention may provide an electronic device capable of shielding electromagnetic interference generated from electronic components placed on a printed circuit board, improving heat dissipation, or reducing audible noise.

[0011] The technical problems to be solved in this disclosure are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art from the description below. means of solving the problem

[0012] An electronic device according to various embodiments of the present invention may include a housing, a printed circuit board disposed inside the housing, a first electronic component and / or a second electronic component disposed on the printed circuit board, a shielding member disposed to surround the first electronic component and / or the second electronic component, and a first thermal diffusion member configured to surround at least a portion of a first surface of the shielding member.

[0013] An electronic device according to various embodiments of the present invention may include a housing, a printed circuit board disposed inside the housing, a first electronic component and / or a second electronic component disposed on the printed circuit board, a shielding member disposed to surround the first electronic component and / or the second electronic component, a first thermal diffusion member surrounding at least a portion of a first surface of the shielding member, and an insulating member surrounding at least a portion of a second surface of the shielding member.

[0014] An electronic device according to various embodiments of the present invention may include a housing, a printed circuit board disposed inside the housing, a first electronic component and / or a second electronic component disposed on the printed circuit board, a shielding member disposed to surround the first electronic component and / or the second electronic component, and a noise reduction member configured to surround at least a portion of a second surface of the shielding member and to reduce audible noise generated from the first electronic component and / or the second electronic component. Effects of the invention

[0015] According to various embodiments of the present invention, by using a heat dissipation structure comprising a shielding member, an insulating member and / or a noise reduction member, electromagnetic interference generated from electronic components placed on a printed circuit board can be shielded, heat dissipation can be improved, or audible noise can be reduced.

[0016] In addition, various effects that can be identified directly or indirectly through this document may be provided. Brief explanation of the drawing

[0017] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components. FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present invention. FIG. 2a is a front perspective view of an electronic device according to various embodiments of the present invention. FIG. 2b is a perspective view of the rear of an electronic device according to various embodiments of the present invention. FIG. 3 is an exploded perspective view of an electronic device according to various embodiments of the present invention. FIG. 4 is a cross-sectional view schematically showing a portion of the AA' part of the electronic device disclosed in FIG. 2b according to one embodiment of the present invention. FIG. 5 is a cross-sectional view of one embodiment schematically showing a part of the AA' portion of the electronic device disclosed in FIG. 2b according to various embodiments of the present invention. FIG. 6 is a cross-sectional view of various embodiments schematically showing a portion of the AA' part of the electronic device disclosed in FIG. 2b according to various embodiments of the present invention. Specific details for implementing the invention

[0018] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments.

[0019] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0020] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0021] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0022] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0023] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0024] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0025] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0026] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0027] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0028] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0029] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0030] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0031] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0032] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0033] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0034] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0035] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0036] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) may support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0037] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0038] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0039] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0040] According to one embodiment, commands or data may be transmitted or received between an electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0041] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0042] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as “coupled” or “connected” to another (e.g., 2nd) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0043] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0044] FIG. 2a is a front perspective view of an electronic device according to various embodiments of the present invention. FIG. 2b is a rear perspective view of an electronic device according to various embodiments of the present invention.

[0045] Referring to FIGS. 2a and 2b, an electronic device (200) according to one embodiment may include a housing (210) comprising a first surface (or front) (210A), a second surface (or rear) (210B), and a side (210C) surrounding the space between the first surface (210A) and the second surface (210B). In other embodiments (not shown), the housing may refer to a structure forming some of the first surface (210A), the second surface (210B), and the side (210C) of FIGS. 2a and 2b. According to one embodiment, the first surface (210A) may be formed by a front plate (202) (e.g., a glass plate or a polymer plate including various coating layers) in which at least a portion is substantially transparent. The second surface (210B) may be formed by a rear plate (211) that is substantially opaque. The rear plate (211) may be formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side (210C) may be formed by a side bezel structure (218) (or "side member") comprising metal and / or polymer, which is combined with the front plate (202) and the rear plate (211). In some embodiments, the rear plate (211) and the side bezel structure (218) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum).

[0046] In the illustrated embodiment, the front plate (202) may include a first region (210D) that curves seamlessly from the first surface (210A) toward the rear plate at both ends of the long edge of the front plate. In the illustrated embodiment (see FIG. 2b), the rear plate (211) may include a second region (210E) that curves seamlessly from the second surface (210B) toward the front plate at both ends of the long edge. In some embodiments, the front plate (202) or the rear plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) may not include the first region and the second region, but may include only a flat plane positioned parallel to the second surface (210B). In the above embodiments, when viewed from the side of the electronic device (200), the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E) as above, and may have a second thickness that is thinner than the first thickness on the side that includes the first region or the second region.

[0047] According to one embodiment, an electronic device (200) (e.g., the electronic device (101) of FIG. 1) may include at least one of a display (201), an input module (203) (e.g., the input module (150) of FIG. 1), an acoustic output module (207, 214) (e.g., the acoustic output module (155) of FIG. 1), a sensor module (204, 219), a camera module (205, 212, 213) (e.g., the camera module (180) of FIG. 1), a key input device (217), an indicator (not shown), and a connector (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the key input device (217), or the indicator) or additionally include other components.

[0048] The display (201) may be exposed, for example, through a substantial portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202) forming the first surface (210A) and the first area (210D) of the side (210C). The display (201) may be combined with or placed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer that detects a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor module (204, 219) and / or at least a portion of the key input device (217) may be placed in the first area (210D) and / or the second area (210E).

[0049] The input module (203) may include a microphone. In some embodiments, the input module (203) may include a plurality of microphones (203) arranged to detect the direction of sound. The sound output module (207, 214) may include speakers (207, 214). The speakers (207, 214) may include an external speaker (207) and a call receiver (214). In some embodiments, the microphone (203), speakers (207, 214), and connector (208) are placed in the space of the electronic device (200) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used in common for the microphone (203) and speakers (207, 214). In some embodiments, the acoustic output module (207, 214) may include a speaker (e.g., a piezo speaker) that is operated with the hole formed in the housing (210) excluded.

[0050] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., proximity sensor) and / or a second sensor module (not shown) (e.g., fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., HRM sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be placed on the first side (210A) (e.g., display (201)) of the housing (210) as well as on the second side (210B). The electronic device (200) may further include at least one of a sensor module not illustrated, e.g., a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor (204).

[0051] The camera modules (205, 212, 213) may include a first camera module (205) disposed on a first surface (210A) of the electronic device (200), a second camera module (212) disposed on a second surface (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle lenses, ultra-wide-angle lenses, or telephoto lenses) and image sensors may be disposed on one surface of the electronic device (200).

[0052] A key input module (217) may be placed on a side (210C) of the housing (210). In another embodiment, the electronic device (200) may not include some or all of the aforementioned key input modules (217), and the key input modules (217) that are not included may be implemented in other forms, such as soft keys, on the display (201). In another embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (201). In some embodiments, the key input module (217) may include a sensor module (216) placed on a second side (210B) of the housing (210).

[0053] The indicator may be placed, for example, on a first surface (210A) of the housing (210). The indicator may, for example, provide status information of the electronic device (200) in the form of light. In another embodiment, the light-emitting element may, for example, provide a light source that is coupled with the operation of the camera module (205). The indicator may include, for example, an LED, an IR LED, and a xenon lamp.

[0054] The connector hole (208) may include a first connector hole (208) capable of receiving a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) capable of receiving a connector for transmitting and receiving audio signals with an external electronic device.

[0055] Some of the camera modules (205, 212), some of the sensor modules (204, 219), or indicators may be positioned to be exposed through the display (201). For example, the camera module (205), sensor module (204), or indicator may be positioned in the internal space of the electronic device (200) to come into contact with the external environment through a through hole perforated to the front plate (202) of the display (201). In another embodiment, some of the sensor modules (204) may be positioned to perform their function without being visually exposed through the front plate (202) in the internal space of the electronic device (200). For example, in this case, the area of ​​the display (201) facing the sensor modules may not require a through hole.

[0056] According to one embodiment, the area where the display (201) and the camera module (205) face each other may be formed as a transparent area having a certain transmittance as part of the area for displaying content. According to one embodiment, the transparent area may be formed to have a transmittance in the range of about 5% to about 20%. This transparent area may include an area that overlaps with the effective aperture (e.g., field of view) of the camera module (205) through which light passes to form an image and generate an image by forming an image with an image sensor. For example, the transparent area of ​​the display (201) may include an area with a lower pixel density than the surrounding area. For example, the camera module (205) may include an under-display camera (UDC).

[0057] FIG. 3 is an exploded perspective view of an electronic device according to various embodiments of the present invention.

[0058] The electronic device (300) of FIG. 3 may be at least partially similar to the electronic device (101) of FIG. 1 and the electronic device (200) of FIG. 2a and / or FIG. 2b, or may include other embodiments of the electronic device.

[0059] Referring to FIG. 3, an electronic device (300) (e.g., electronic device (101) of FIG. 1, electronic device (200) of FIG. 2a and / or FIG. 2b) may include a side member (310) (e.g., a side bezel structure), a first support member (311) (e.g., a bracket or support structure), a front plate (320) (e.g., a front cover), a display (330), a printed circuit board (340), a battery (350), a second support member (360) (e.g., a rear case), an antenna (370), and a rear plate (380) (e.g., a rear cover). In some embodiments, the electronic device (300) may omit at least one of the components (e.g., the first support member (311), or the second support member (360)) or additionally include other components. At least one of the components of the electronic device (300) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 1 or the electronic device (200) of FIG. 2a and / or FIG. 2b, and redundant descriptions are omitted below.

[0060] The first support member (311) may be disposed inside the electronic device (300) and connected to the side member (310), or may be formed integrally with the side member (310). The first support member (311) may be formed from, for example, a metal material and / or a non-metal (e.g., a polymer) material. The first support member (311) may have a display (330) (e.g., the display (201) of FIG. 2a) attached to one side and a printed circuit board (340) attached to the other side.

[0061] The printed circuit board (340) may be equipped with, for example, a processor (120), memory (130), and / or an interface (177) as disclosed in FIG. 1. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0062] According to various embodiments, the printed circuit board (340) may include a first PCB (340a) and / or a second PCB (340b). For example, the first PCB (340a) and the second PCB (340b) may be spaced apart from each other and may be electrically connected using a connecting member (345) (e.g., a coaxial cable and / or an FPCB). As another example, the printed circuit board (340) may include a structure in which a plurality of printed circuit boards (PCBs) are stacked. The printed circuit board (340) may include an interposer structure. The printed circuit board (340) may be implemented in the form of a flexible printed circuit board (FPCB) and / or a rigid printed circuit board (PCB).

[0063] The memory (e.g., the memory (130) of FIG. 1) may include, for example, volatile memory or non-volatile memory.

[0064] The interface (e.g., the interface (177) of FIG. 1) may include, for example, an HDMI (high definition multimedia interface), a USB (universal serial bus) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (300) to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0065] The battery (350) is a device for supplying power to at least one component of the electronic device (300) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially coplanar with, for example, the printed circuit board (340). The battery (350) may be integrally disposed inside the electronic device (300). In another embodiment, the battery (350) may be disposed detachably from the electronic device (300).

[0066] An antenna (370) may be positioned between the rear plate (380) and the battery (350). The antenna (370) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (370) may, for example, communicate near-field with an external device or wirelessly transmit and receive power required for charging. In other embodiments, the antenna structure may be formed by a part or combination thereof of the side member (310) and / or the first support member (311).

[0067] FIG. 4 is a cross-sectional view schematically showing a portion of the AA' part of the electronic device disclosed in FIG. 2b according to one embodiment of the present invention.

[0068] In one embodiment, the AA' portion of the electronic device (200) disclosed in FIG. 2b may be a cross-section of the portion where the second support member (360) and antenna (370) of the electronic device (300) disclosed in FIG. 3 do not overlap or are omitted.

[0069] The electronic device (200) of FIG. 4 may include embodiments described in the electronic device (101) of FIG. 1, the electronic device (200) of FIG. 2a and FIG. 2b and / or the electronic device (300) of FIG. 3. In the description of FIG. 4, the same reference numerals are assigned to components that are substantially identical to the embodiments disclosed in the electronic device (200) of FIG. 2a and FIG. 2b and / or the electronic device (300) of FIG. 3, and redundant descriptions may be omitted.

[0070] In one embodiment, the embodiment related to the electronic device (200) of FIG. 4 is illustrated and described with respect to a bar-type electronic device, but is not limited thereto and may be applied to electronic devices such as a foldable type, rollable type, sliding type, wearable type, tablet PC, or notebook PC.

[0071] Referring to FIG. 4, an electronic device (200) according to various embodiments of the present invention may include a printed circuit board (340), a first electronic component (410), a second electronic component (420), a shielding member (430), a first heat diffusion member (440), a noise reduction member (450), a heat transfer member (460), a second heat diffusion member (470), a third heat diffusion member (480), and / or a back plate (211).

[0072] According to one embodiment, the printed circuit board (340) may be placed inside a housing (e.g., the housing (210) of FIG. 2b). A first electronic component (410) and / or a second electronic component (420) may be placed in one direction (e.g., the -z-axis direction) of the printed circuit board (340). The first electronic component (410) and / or the second electronic component (420) may be mounted on the printed circuit board (340) using a conductive pad (not shown) formed on the printed circuit board (340).

[0073] According to various embodiments, the printed circuit board (340) may be equipped with, for example, a processor (120), memory (130), input module (150), sound output module (155), audio module (170), sensor module (176), power management module (188), and / or interface (177) as disclosed in FIG. 1. The processor may include, for example, at least one of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The printed circuit board (340) may be implemented in the form of a flexible printed circuit board (FPCB) and / or a rigid printed circuit board (PCB).

[0074] According to various embodiments, the printed circuit board (340) may include a ground portion (342) formed along at least a portion of the outer edge of the first electronic component (410) and / or the second electronic component (420). The ground portion (342) may include a conductive line patterned along the outer edge (e.g., edge) of the first electronic component (410) and / or the second electronic component (420) placed on the printed circuit board (340). The ground portion (342) may include a ground contact pad. The ground portion (342) may be formed using, for example, a conductive metal (e.g., copper foil). The grounding portion (342) is in contact with and coupled to the end surface of the shielding member (430), and can diffuse heat transferred through the first heat diffusion member (440) positioned on the upper part (e.g., in the -z-axis direction) of the shielding member (430) to the entire or outside of the printed circuit board (340).

[0075] According to one embodiment, the first electronic component (410) may include a processor (e.g., application processor (AP), communication processor (CP)) (e.g., processor (120) of FIG. 1) or a power management integrated circuit (PMIC) (e.g., power management module (188) of FIG. 1). The first electronic component (410) may emit heat and generate electromagnetic interference depending on the operation of the electronic device (200). The first electronic component (410) may generate audible noise in a high-frequency band depending on the operation of the electronic device (200). The first electronic component (410) may be implemented in the form of at least one chip.

[0076] According to one embodiment, the second electronic component (420) may be placed around the first electronic component (410) so that the first electronic component (410) (e.g., a processor or PMIC) can operate stably. The second electronic component (420) may include, for example, at least one of an inductor, a resistor, or a capacitor. If a large difference in power ripple occurs depending on the power amount of the first electronic component (410) (e.g., PMIC), oscillation may occur in the second electronic component (420) (e.g., at least one capacitor) and may generate audible noise in a specific frequency band.

[0077] According to one embodiment, the shielding member (430) may be positioned in a first direction (e.g., -z-axis direction) of the first electronic component (410) and the second electronic component (420) and may be positioned to surround the first electronic component (410) and the second electronic component (420). The end surface of the shielding member (430) may be joined to a ground portion (342) formed on the printed circuit board (340) through thermal compression. The shielding member (430) may shield electromagnetic interference generated from the first electronic component (410) and / or the second electronic component (420). The shielding member (430) may form a conformal shielding structure.

[0078] According to various embodiments, the shielding member (430) may include a conductive fiber (e.g., nanofiber) sheet, a copper (CU) sheet, or an aluminum (AL) sheet having excellent heat diffusion and heat transfer performance in a first direction (e.g., -z-axis direction). The shielding member (430) may be formed with a first thickness having, for example, about 20 μm to 30 μm.

[0079] According to one embodiment, the first heat diffusion member (440) may be disposed in a first direction (e.g., -z-axis direction, top surface) of the shielding member (430). The first heat diffusion member (440) may surround at least a portion of the first surface (e.g., -z-axis direction, top surface) of the shielding member (430). The first heat diffusion member (440) may include a first opening (445) formed at a location where at least a portion of the first electronic component (410) is disposed. The first opening (445) may be formed at a location that overlaps with at least a portion of the first electronic component (410). The first heat diffusion member (440) may be disposed in the remaining portion of the shielding member (430) excluding the first opening (445). The first heat diffusion member (440) can absorb, diffuse, and release heat transferred from the first electronic component (410) and / or the shielding member (430). For example, the first heat diffusion member (440) can transfer and diffuse heat transferred from the first electronic component (410) and / or the shielding member (430) to a third direction (e.g., direction ③ in FIG. 4) and a fourth direction (e.g., direction ④ in FIG. 4) of the electronic device (200). In one embodiment, the third direction (e.g., direction ③ in FIG. 4) may be the x-axis of the electronic device (200) and the direction between the x-axis and the z-axis. The fourth direction (e.g., direction ④ in FIG. 4) may be the -x-axis of the electronic device (200) and the direction between the -x-axis and the z-axis.

[0080] According to various embodiments, the first thermal diffusion member (440) may include a graphite sheet, a copper (CU) sheet, or an aluminum (AL) sheet having excellent thermal diffusion and heat transfer performance in a third direction (e.g., direction ③ in FIG. 4) and a fourth direction (e.g., direction ④ in FIG. 4). The first thermal diffusion member (440) may be formed with a second thickness having, for example, about 35 μm to 50 μm.

[0081] According to various embodiments, the first heat diffusion member (440) may be formed thicker than the shielding member (430) to perform the function of absorbing and diffusing heat transferred from the first electronic component (410) and / or the shielding member (430). For example, the second thickness of the first heat diffusion member (440) may be formed thicker than the first thickness of the shielding member (430).

[0082] According to various embodiments, an insulating member (not shown) (e.g., insulating member (640) of FIG. 6) may be disposed on at least a portion of the first direction (e.g., -z-axis direction, top surface) of the first thermal diffusion member (440). The insulating member (not shown) can prevent the first thermal diffusion member (440) from being electrically short-circuited with other electronic components within the electronic device (200). The insulating member (not shown) can prevent the first thermal diffusion member (440) from being damaged during the thermal compression process. The insulating member (not shown) may be formed of a dielectric material (e.g., a polymer) having strong insulating properties and durability.

[0083] According to one embodiment, the noise reduction member (450) may be disposed in a second direction (e.g., z-axis direction, bottom surface) of the shielding member (430). The noise reduction member (450) may surround at least a portion of the second surface (e.g., z-axis direction, bottom surface) of the shielding member (430). The noise reduction member (450) may include a second opening (455) formed at a location where at least a portion of the first electronic component (410) is disposed. The second opening (455) may be formed at a location that overlaps with at least a portion of the first electronic component (410). The noise reduction member (450) may be disposed in the remaining portion of the shielding member (430) excluding the second opening (455). The noise reduction member (450) may be disposed to surround at least a portion of the first electronic component (410) and / or the second electronic component (420).

[0084] According to various embodiments, the noise reduction member (450) can reduce audible noise generated from a first electronic component (410) (e.g., PMIC) and / or a second electronic component (420) (e.g., at least one capacitor). The noise reduction member (450) can absorb and reflect audible noise of a specific frequency generated from the first electronic component (410) and / or the second electronic component (420).

[0085] In one embodiment, when the noise reduction member (450) performs the function of absorbing audible noise, the noise reduction member (450) is composed of a non-conductive material such as pulp (e.g., sound-absorbing material) and can absorb audible noise generated from the first electronic component (410) and / or the second electronic component (420). In another embodiment, when the noise reduction member (450) performs the function of reflecting and blocking audible noise, the noise reduction member (450) is composed of a conductive material such as metal and can reflect and block audible noise generated from the first electronic component (410) and / or the second electronic component (420). When the noise reduction member (450) is composed of a conductive material (e.g., metal), an insulating member (not shown) (e.g., the insulating member (550) of FIG. 5) may be disposed in a second direction (e.g., z-axis direction, bottom surface) of the noise reduction member (450). An insulating member (not shown) can prevent the noise reduction member (450) from being electrically shorted with the first electronic component (410) and / or the second electronic component (420). The insulating member (not shown) may be formed of a dielectric material (e.g., a polymer) that has strong insulating properties and durability.

[0086] According to one embodiment, the heat transfer member (460) may be disposed in a first direction (e.g., -z-axis direction, top surface) of a shielding member (430) that overlaps with at least a portion of the first electronic component (410). At least a portion of the heat transfer member (460) may be disposed in a first opening (445) formed in the first heat diffusion member (440). A second surface (e.g., z-axis direction, bottom surface) of the heat transfer member (460) may be in contact with and coupled with at least a portion of the first surface (e.g., -z-axis direction, top surface) of the shielding member (430). The heat transfer member (460) may transfer and release heat generated from the first electronic component (410) in a first direction (e.g., -z-axis direction).

[0087] According to various embodiments, the heat transfer member (460) can absorb heat generated from the first electronic component (410) and transfer it to the direction in which the second heat diffusion member (470) is positioned (e.g., the -z-axis direction) to cool it. If at least a portion of the second surface (e.g., the z-axis direction, bottom surface) of the heat transfer member (460) is positioned in the first opening (445) formed in the first heat diffusion member (440) and is in direct contact with at least a portion of the first surface (e.g., the -z-axis direction, top surface) of the shielding member (430), the thermal resistance to the heat release path transferred through the heat transfer member (460) in the first direction (e.g., the -z-axis direction) can be reduced. The heat transfer member (460) may include, for example, a high-viscosity liquid thermal interface material (TIM) or a carbon fiber TIM.

[0088] According to various embodiments, the heat transfer member (460) may be omitted. If the heat transfer member (460) is omitted, the first opening (445) may not be formed in the first heat diffusion member (440). In this case, the first heat diffusion member (440) may be in direct contact with and coupled with the second heat diffusion member (470).

[0089] According to one embodiment, the second heat diffusion member (470) may be disposed in a first direction (e.g., -z-axis direction, top surface) of the heat transfer member (460). The second heat diffusion member (470) may have a second surface (e.g., z-axis direction, bottom surface) in contact with and coupled to the first surface (e.g., -z-axis direction, top surface) of the heat transfer member (460). The second heat diffusion member (470) may have a second surface (e.g., z-axis direction, bottom surface) spaced apart from the first surface (e.g., -z-axis direction, top surface) of the heat transfer member (460). The second heat diffusion member (470) may absorb, diffuse, and release heat transferred from the heat transfer member (460).

[0090] According to various embodiments, the second heat diffusion member (470) can transfer and diffuse heat transferred from the heat transfer member (460) in a fifth direction (e.g., x-axis direction, direction ⑤ in FIG. 4) and a sixth direction (e.g., -x-axis direction, direction ⑥ in FIG. 4) of the electronic device (200). The second heat diffusion member (470) may include a graphite sheet, a copper (CU) sheet, or an aluminum (AL) sheet that has excellent heat diffusion and heat transfer performance in the fifth direction (e.g., x-axis direction) and the sixth direction (e.g., -x-axis direction). The second heat diffusion member (470) may include a heat sink, a vapor chamber, or a heat pipe.

[0091] According to one embodiment, the third heat diffusion member (480) may be positioned in the first direction (e.g., -z-axis direction, upper) of the second heat diffusion member (470) with the air gap (475) in between. The third heat diffusion member (480) may be positioned in the second direction (e.g., z-axis direction, lower surface) of the rear plate (211). The third heat diffusion member (480) can transfer and diffuse heat transmitted through the second heat diffusion member (470) and the air gap (475) to the seventh direction (e.g., x-axis direction, direction ⑦ in FIG. 4) and the eighth direction (e.g., -x-axis direction, direction ⑧ in FIG. 4) of the electronic device (200).

[0092] According to various embodiments, the air gap (475) is formed between the second heat diffusion member (470) and the third heat diffusion member (480), and can facilitate the diffusion of heat transferred through the second heat diffusion member (470). The third heat diffusion member (480) may include a graphite sheet, a copper (CU) sheet, or an aluminum (AL) sheet that has excellent heat diffusion and heat transfer performance in the seventh direction (e.g., x-axis direction) and the eighth direction (e.g., -x-axis direction).

[0093] According to one embodiment, the rear plate (211) can protect the rear surface of the electronic device (200). A third heat diffusion member (480) may be disposed in a second direction (e.g., z-axis direction, bottom surface) of the rear plate (211). The rear plate (211) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the materials.

[0094] FIG. 5 is a cross-sectional view of one embodiment schematically showing a part of the AA' portion of the electronic device disclosed in FIG. 2b according to various embodiments of the present invention.

[0095] The electronic device (200) of FIG. 5 may be integrated with the embodiment disclosed in FIG. 4. The electronic device (200) of FIG. 5 may include the embodiments described in FIG. 4. In the description of FIG. 5, the same reference numerals are assigned to components that are substantially identical to the embodiments disclosed in the electronic device (200) of FIG. 4, and redundant descriptions may be omitted.

[0096] Referring to FIG. 5, an electronic device (200) according to various embodiments of the present invention may include a printed circuit board (340), a first electronic component (410), a second electronic component (420), a shielding member (430), a first heat diffusion member (440), an insulating member (550), a heat transfer member (460), a second heat diffusion member (470), a third heat diffusion member (480), and / or a back plate (211).

[0097] The electronic device (200) disclosed in FIG. 5 may be an embodiment in which the noise reduction member (450) included in the electronic device (200) of FIG. 4 is replaced with an insulating member (550).

[0098] According to one embodiment, a first electronic component (410) and / or a second electronic component (420) may be placed in one direction (e.g., the -z-axis direction) of the printed circuit board (340).

[0099] According to various embodiments, the printed circuit board (340) may include a ground portion (342) formed along at least a portion of the outer edge of the first electronic component (410) and / or the second electronic component (420). The ground portion (342) is in contact with the end surface of the shielding member (430) and can diffuse heat transferred through the first heat diffusion member (440) positioned on the upper part (e.g., in the -z-axis direction) of the shielding member (430) to the whole or outside of the printed circuit board (340).

[0100] According to one embodiment, the first electronic component (410) may include a processor (e.g., application processor (AP), communication processor (CP)) (e.g., processor (120) of FIG. 1) or a PMIC (power management integrated circuit) (e.g., power management module (188) of FIG. 1).

[0101] According to one embodiment, the second electronic component (420) may be placed around the first electronic component (410) so that the first electronic component (410) (e.g., a processor or PMIC) can operate stably.

[0102] According to one embodiment, the shielding member (430) may be positioned in a first direction (e.g., -z-axis direction) of the first electronic component (410) and the second electronic component (420) and may be positioned to surround the first electronic component (410) and the second electronic component (420). The shielding member (430) may shield electromagnetic interference generated from the first electronic component (410) and / or the second electronic component (420).

[0103] According to one embodiment, the first heat diffusion member (440) may be disposed in a first direction (e.g., -z-axis direction, top surface) of the shielding member (430). The first heat diffusion member (440) may surround at least a portion of the first surface (e.g., -z-axis direction, top surface) of the shielding member (430). The first heat diffusion member (440) may include a first opening (445) formed at a location where at least a portion of the first electronic component (410) is disposed. The first opening (445) may be formed at a location that overlaps with at least a portion of the first electronic component (410). The first heat diffusion member (440) may absorb, diffuse, and emit heat transferred from the first electronic component (410) and / or the shielding member (430). For example, the first heat diffusion member (440) can transfer and diffuse heat transferred from the first electronic component (410) and / or shielding member (430) to the third direction (e.g., direction ③ in FIG. 4) and the fourth direction (e.g., direction ④ in FIG. 4) of the electronic device (200).

[0104] According to various embodiments, an insulating member (not shown) (e.g., insulating member (640) of FIG. 6) may be disposed on at least a portion of the first direction (e.g., -z-axis direction, top surface) of the first thermal diffusion member (440). The insulating member (not shown) can prevent the first thermal diffusion member (440) from being electrically short-circuited with other electronic components within the electronic device (200). The insulating member (not shown) can prevent the first thermal diffusion member (440) from being damaged during the thermal compression process.

[0105] According to one embodiment, the insulating member (550) may be positioned in a second direction (e.g., z-axis direction, bottom surface) of the shielding member (430). The insulating member (550) may surround at least a portion of the second surface (e.g., z-axis direction, bottom surface) of the shielding member (430). The insulating member (550) may include a second opening (555) formed at a location where at least a portion of the first electronic component (410) is positioned. The second opening (555) may be formed at a location that overlaps with at least a portion of the first electronic component (410). The insulating member (550) may be positioned in the remaining portion of the shielding member (430) excluding the second opening (555). The insulating member (550) may be positioned so as to surround at least a portion of the first electronic component (410) and / or the second electronic component (420).

[0106] According to various embodiments, the insulating member (550) can prevent the shielding member (430) from being electrically shorted to the first electronic component (410) and / or the second electronic component (420) within the electronic device (200). The insulating member (550) can prevent the shielding member (430) from being damaged during the heat pressing process. The insulating member (550) may be formed of a dielectric material (e.g., a polymer) that has strong insulating properties and durability.

[0107] According to one embodiment, the heat transfer member (460) may be disposed in a first direction (e.g., -z-axis direction, top surface) of a shielding member (430) that overlaps with at least a portion of the first electronic component (410). At least a portion of the heat transfer member (460) may be disposed in a first opening (445) formed in the first heat diffusion member (440). A second surface (e.g., z-axis direction, bottom surface) of the heat transfer member (460) may be in contact with and coupled with at least a portion of the first surface (e.g., -z-axis direction, top surface) of the shielding member (430). The heat transfer member (460) may transfer and release heat generated from the first electronic component (410) in a first direction (e.g., -z-axis direction).

[0108] According to various embodiments, the heat transfer member (460) may be omitted. If the heat transfer member (460) is omitted, the first opening (445) may not be formed in the first heat diffusion member (440). In this case, the first heat diffusion member (440) may be in direct contact with and coupled with the second heat diffusion member (470).

[0109] According to one embodiment, the second heat diffusion member (470) may be disposed in the first direction (e.g., -z-axis direction, top surface) of the heat transfer member (460). The second surface (e.g., z-axis direction, bottom surface) of the second heat diffusion member (470) may be in contact with and coupled to the first surface (e.g., -z-axis direction, top surface) of the heat transfer member (460). The second heat diffusion member (470) may absorb, diffuse, and release heat transferred from the heat transfer member (460). The second heat diffusion member (470) may transfer and diffuse the heat transferred from the heat transfer member (460) to the fifth direction (e.g., x-axis direction, direction ⑤ in FIG. 5) and the sixth direction (e.g., -x-axis direction, direction ⑥ in FIG. 5) of the electronic device (200).

[0110] According to one embodiment, the third heat diffusion member (480) may be positioned in the first direction (e.g., -z-axis direction, upper) of the second heat diffusion member (470) with the air gap (475) in between. The third heat diffusion member (480) may be positioned in the second direction (e.g., z-axis direction, lower surface) of the rear plate (211). The third heat diffusion member (480) can transfer and diffuse heat transmitted through the second heat diffusion member (470) and the air gap (475) to the seventh direction (e.g., x-axis direction, direction ⑦ in FIG. 5) and the eighth direction (e.g., -x-axis direction, direction ⑧ in FIG. 5) of the electronic device (200).

[0111] FIG. 6 is a cross-sectional view of various embodiments schematically showing a portion of the AA' part of the electronic device disclosed in FIG. 2b according to various embodiments of the present invention.

[0112] The electronic device (200) of FIG. 6 may be integrated with the embodiment disclosed in FIG. 4 or FIG. 5. The electronic device (200) of FIG. 6 may include the embodiments described in FIG. 4 or FIG. 5. In the description of FIG. 6, the same reference numerals are assigned to components that are substantially identical to the embodiments disclosed in the electronic device (200) of FIG. 4 or FIG. 5, and redundant descriptions may be omitted.

[0113] Referring to FIG. 6, an electronic device (200) according to various embodiments of the present invention may include a printed circuit board (340), a first electronic component (410), a second electronic component (420), a shielding member (430), an insulating member (640), a noise reduction member (450), a heat transfer member (460), a second heat diffusion member (470), a third heat diffusion member (480), and / or a back plate (211).

[0114] The electronic device (200) disclosed in FIG. 6 may be an embodiment in which the first thermal diffusion member (440) included in the electronic device (200) of FIG. 4 is replaced with an insulating member (640).

[0115] According to one embodiment, a first electronic component (410) and / or a second electronic component (420) may be placed in one direction (e.g., the -z-axis direction) of the printed circuit board (340).

[0116] According to various embodiments, the printed circuit board (340) may include a ground portion (342) formed along at least a portion of the outer edge of the first electronic component (410) and / or the second electronic component (420). The ground portion (342) is in contact with the end surface of the shielding member (430) and can diffuse heat transferred through the first heat diffusion member (440) positioned on the upper part (e.g., in the -z-axis direction) of the shielding member (430) to the whole or outside of the printed circuit board (340).

[0117] According to one embodiment, the second electronic component (420) may be placed around the first electronic component (410) so that the first electronic component (410) (e.g., a processor or PMIC) can operate stably.

[0118] According to one embodiment, the shielding member (430) may be positioned in a first direction (e.g., -z-axis direction) of the first electronic component (410) and the second electronic component (420) and may be positioned to surround the first electronic component (410) and the second electronic component (420). The shielding member (430) may shield electromagnetic interference generated from the first electronic component (410) and / or the second electronic component (420).

[0119] According to one embodiment, the insulating member (640) may be positioned in a first direction (e.g., -z-axis direction, top surface) of the shielding member (430). The insulating member (640) may surround at least a portion of the first surface (e.g., -z-axis direction, top surface) of the shielding member (430). The insulating member (640) can prevent the shielding member (430) from being electrically short-circuited with other electronic components within the electronic device (200). The insulating member (640) can prevent the shielding member (430) from being damaged during the heat pressing process.

[0120] According to various embodiments, the insulating member (640) may include a first opening (645) formed at a location where at least a portion of the first electronic component (410) is positioned. The first opening (645) may be formed at a location that overlaps with at least a portion of the first electronic component (410).

[0121] According to one embodiment, the noise reduction member (450) may be disposed in a second direction (e.g., z-axis direction, bottom surface) of the shielding member (430). The noise reduction member (450) may surround at least a portion of the second surface (e.g., z-axis direction, bottom surface) of the shielding member (430). The noise reduction member (450) may include a second opening (455) formed at a location where at least a portion of the first electronic component (410) is disposed. The second opening (455) may be formed at a location that overlaps with at least a portion of the first electronic component (410). The noise reduction member (450) may be disposed in the remaining portion of the shielding member (430) excluding the second opening (455). The noise reduction member (450) may be disposed such that at least a portion of the first electronic component (410) and / or the second electronic component (420) is surrounded.

[0122] According to various embodiments, the noise reduction member (450) can reduce audible noise generated from a first electronic component (410) (e.g., PMIC) and / or a second electronic component (420) (e.g., at least one capacitor). The noise reduction member (450) can absorb and reflect audible noise of a specific frequency generated from the first electronic component (410) and / or the second electronic component (420).

[0123] In one embodiment, when the noise reduction member (450) performs the function of absorbing audible noise, the noise reduction member (450) is composed of a sound-absorbing material such as pulp and can absorb audible noise generated from the first electronic component (410) and / or the second electronic component (420). In another embodiment, when the noise reduction member (450) performs the function of reflecting and blocking audible noise, the noise reduction member (450) is composed of a reflective material such as metal and can reflect and block audible noise generated from the first electronic component (410) and / or the second electronic component (420). When the noise reduction member (450) is composed of a metal material, an insulating member (not shown) (e.g., the insulating member (550) of FIG. 5) may be disposed in the second direction (e.g., z-axis direction, bottom surface) of the noise reduction member (450).

[0124] According to one embodiment, the heat transfer member (460) may be disposed in a first direction (e.g., -z-axis direction, top surface) of a shielding member (430) that overlaps with at least a portion of the first electronic component (410). At least a portion of the heat transfer member (460) may be disposed in a first opening (645) formed in an insulating member (640). A second surface (e.g., z-axis direction, bottom surface) of the heat transfer member (460) may be in contact with and coupled with at least a portion of the first surface (e.g., -z-axis direction, top surface) of the shielding member (430). The heat transfer member (460) may transfer and release heat generated from the first electronic component (410) in a first direction (e.g., -z-axis direction).

[0125] According to various embodiments, the heat transfer member (460) may be omitted. If the heat transfer member (460) is omitted, the first opening (645) may not be formed in the insulating member (640). In this case, the insulating member (640) may be in direct contact with and coupled with the second heat diffusion member (470).

[0126] According to one embodiment, the second heat diffusion member (470) may be disposed in the first direction (e.g., -z-axis direction, top surface) of the heat transfer member (460). The second surface (e.g., z-axis direction, bottom surface) of the second heat diffusion member (470) may be in contact with and coupled to the first surface (e.g., -z-axis direction, top surface) of the heat transfer member (460). The second heat diffusion member (470) may absorb, diffuse, and release heat transferred from the heat transfer member (460). The second heat diffusion member (470) may transfer and diffuse the heat transferred from the heat transfer member (460) to the fifth direction (e.g., x-axis direction, direction ⑤ in FIG. 6) and the sixth direction (e.g., -x-axis direction, direction ⑥ in FIG. 6) of the electronic device (200).

[0127] According to one embodiment, the third heat diffusion member (480) may be positioned in the first direction (e.g., -z-axis direction, upper) of the second heat diffusion member (470) with the air gap (475) in between. The third heat diffusion member (480) may be positioned in the second direction (e.g., z-axis direction, lower surface) of the rear plate (211). The third heat diffusion member (480) can transfer and diffuse heat transmitted through the second heat diffusion member (470) and the air gap (475) to the seventh direction (e.g., x-axis direction, direction ⑦ in FIG. 6) and the eighth direction (e.g., -x-axis direction, direction ⑧ in FIG. 6) of the electronic device (200).

[0128] An electronic device (101, 200, 300) according to various embodiments of the present invention may include a housing (210), a printed circuit board (340) disposed inside the housing, a first electronic component (410) and / or a second electronic component (420) disposed on the printed circuit board, a shielding member (430) disposed to surround the first electronic component and / or the second electronic component, and a first thermal diffusion member (440) configured to surround at least a portion of a first surface of the shielding member.

[0129] According to various embodiments, the electronic device may include a noise reduction member (450) configured to surround at least a portion of the second surface of the shielding member (430) and to reduce audible noise generated from the first electronic component (410) and / or the second electronic component (420).

[0130] According to various embodiments, the first heat diffusion member (440) includes a first opening (445) formed at a position overlapping with at least a portion of the first electronic component, and the electronic device may include a heat transfer member (460) disposed in the first opening and having a second surface combined with at least a portion of the first surface of the shielding member.

[0131] According to various embodiments, the noise reduction member (450) may include a second opening (455) formed at a position overlapping with at least a portion of the first electronic component (410).

[0132] According to various embodiments, the printed circuit board (340) includes a ground portion (342) formed along at least a portion of the outer edge of the first electronic component and / or the second electronic component, and the ground portion may be configured to be coupled to the end surface of the shielding member.

[0133] According to various embodiments, the shielding member (430) is formed with a first thickness (e.g., about 20 μm to 30 μm), and the first thermal diffusion member is formed with a second thickness (e.g., about 35 μm to 50 μm), wherein the second thickness may be formed thicker than the first thickness.

[0134] According to various embodiments, the noise reduction member (450) may be composed of a non-conductive material (e.g., porous pulp) that absorbs the audible noise.

[0135] According to various embodiments, the noise reduction member (450) may be composed of a conductive material (e.g., metal) that reflects and blocks the audible noise.

[0136] According to various embodiments, when the noise reduction member (450) is composed of a conductive material, an insulating member may be disposed on a second surface of the noise reduction member.

[0137] According to various embodiments, a second heat diffusion member (470) may be disposed in the first direction of the heat transfer member (460).

[0138] According to various embodiments, a third heat diffusion member (480) may be disposed in the first direction of the second heat diffusion member (470) with an air gap (475) in between, and a rear plate (211) may be disposed in the first direction of the third heat diffusion member.

[0139] According to various embodiments, the shielding member (430) may include a conductive fiber sheet, a copper (CU) sheet, or an aluminum (AL) sheet.

[0140] According to various embodiments, the first electronic component (410) may include a processor or a PMIC (power management integrated circuit), and the second electronic component (420) may include at least one capacitor.

[0141] An electronic device (101, 200, 300) according to various embodiments of the present invention may include a housing (210), a printed circuit board (340) disposed inside the housing, a first electronic component (410) and / or a second electronic component (420) disposed on the printed circuit board, a shielding member (430) disposed to surround the first electronic component and / or the second electronic component, a first thermal diffusion member (440) surrounding at least a portion of a first surface of the shielding member, and an insulating member (550) surrounding at least a portion of a second surface of the shielding member.

[0142] An electronic device (101, 200, 300) according to various embodiments of the present invention may include a housing (210), a printed circuit board (340) disposed inside the housing, a first electronic component (410) and / or a second electronic component (420) disposed on the printed circuit board, a shielding member (430) disposed to surround the first electronic component and / or the second electronic component, and a noise reduction member (450) configured to surround at least a portion of a second surface of the shielding member and to reduce audible noise generated from the first electronic component and / or the second electronic component.

[0143] Although the present invention has been described above according to various embodiments, it is obvious that changes and modifications made by a person skilled in the art within the scope of the technical concept of the present invention, without departing from the technical spirit of the present invention, are also included in the present invention. Explanation of the symbols

[0144] 200: Electronic device 210, 310: Housing 211: Back plate 340: Printed circuit board 342: Grounding section 410: First electronic component 420: Second electronic component 430: Shielding member 440: First thermal diffusion member 450; Noise reduction member 460: Heat transfer element 470: Second heat diffusion element 480: Third thermal diffusion member 550, 640: Insulating members

Claims

Claim 1 An electronic device comprising: a housing; a printed circuit board disposed inside the housing; a first electronic component and a second electronic component disposed on the printed circuit board; a shielding member disposed to surround the first electronic component and the second electronic component; and a first thermal diffusion member comprising a first opening that contacts a first portion of a first surface of the shielding member and overlaps with at least a portion of the first electronic component. Claim 2 An electronic device according to claim 1, comprising a noise reduction member configured to contact at least a portion of a second surface of the shielding member and to reduce audible noise generated from at least one of the first electronic component and the second electronic component. Claim 3 An electronic device comprising a heat transfer member disposed in the first opening and having a second surface coupled to a second portion of the first surface of the shielding member different from the first portion of the first surface of the shielding member. Claim 4 In claim 2, the noise reduction member is an electronic device comprising a second opening formed at a position overlapping with at least a part of the first electronic component. Claim 5 An electronic device according to claim 1, wherein the printed circuit board comprises a ground portion formed along at least a part of the outer edge of at least one of the first electronic component and the second electronic component, and the ground portion is configured to be coupled with the end surface of the shielding member. Claim 6 An electronic device according to claim 1, wherein the shielding member is formed with a first thickness and the first thermal diffusion member is formed with a second thickness, wherein the second thickness is formed to be thicker than the first thickness. Claim 7 In claim 2, the noise reduction member is an electronic device composed of a non-conductive material that absorbs the audible noise. Claim 8 An electronic device according to claim 2, wherein the noise reduction member is composed of a conductive material that reflects and blocks the audible noise, and an insulating member is disposed on one side of the noise reduction member. Claim 9 An electronic device according to claim 3, wherein a second heat diffusion member is disposed in a first direction of the heat transfer member, a third heat diffusion member is disposed in a first direction of the second heat diffusion member with an air gap in between, and a rear plate is disposed in a first direction of the third heat diffusion member. Claim 10 An electronic device comprising: a housing; a printed circuit board disposed inside the housing; a first electronic component and a second electronic component disposed on the printed circuit board; a shielding member disposed to surround the first electronic component and the second electronic component; a first thermal diffusion member comprising a first opening that contacts a first portion of a first surface of the shielding member and overlaps with at least a portion of the first electronic component; and an insulating member surrounding at least a portion of a second surface of the shielding member. Claim 11 In claim 10, the insulating member comprises a second opening formed at a position overlapping with at least a portion of the first electronic component, and the electronic device further comprises a heat transfer member disposed in the first opening, wherein the second surface of the heat transfer member is configured to be coupled to a second surface of the first surface of the shielding member different from the first portion of the first surface of the shielding member. Claim 12 An electronic device according to claim 10, wherein the shielding member is formed with a first thickness and the first thermal diffusion member is formed with a second thickness, wherein the second thickness is formed to be thicker than the first thickness. Claim 13 An electronic device according to claim 10, wherein an insulating member is disposed on the first surface of the first thermal diffusion member. Claim 14 An electronic device according to claim 11, wherein a second heat diffusion member is disposed in a first direction of the heat transfer member, a third heat diffusion member is disposed in a first direction of the second heat diffusion member with an air gap in between, and a rear plate is disposed in a first direction of the third heat diffusion member. Claim 15 An electronic device comprising: a housing; a printed circuit board disposed inside the housing; a first electronic component and a second electronic component disposed on the printed circuit board; a shielding member disposed to surround the first electronic component and the second electronic component; and a noise reduction member configured to contact at least a portion of a second surface of the shielding member and to reduce audible noise generated from at least one of the first electronic component and the second electronic component, wherein the noise reduction member comprises a first opening that overlaps with at least a portion of the first electronic component. Claim 16 An electronic device according to claim 15, comprising an insulating member having a second opening formed in a position overlapping at least a portion of the first electronic component and surrounding a first portion of the first surface of the shielding member. Claim 17 delete Claim 18 An electronic device according to claim 16, further comprising a heat transfer member disposed in the first opening, wherein a second surface of the heat transfer member is configured to be coupled to a second surface of the first surface of the shielding member different from the first portion of the first surface of the shielding member. Claim 19 In claim 15, the noise reduction member is an electronic device composed of a non-conductive material that absorbs the audible noise. Claim 20 In claim 15, the noise reduction member is an electronic device composed of a conductive material that reflects and blocks the audible noise. Claim 21 delete Claim 22 delete Claim 23 delete Claim 24 delete Claim 25 delete

Images