Wireless earbird
Patent Information
- Application Number
- KR1020220034905
- Authority / Receiving Office
- KR · KR
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2022-03-21
- Publication Date
- 2026-08-14
- Estimated Expiration
- 2042-03-21
Smart Images

Figure 112022030342662-PAT00004_ABST
Abstract
Description
Technology Field
[0001] This specification relates to electronic devices, and more specifically, to electronic devices having an antenna. A specific embodiment relates to wireless earbuds having an antenna and a control circuit. Background Technology
[0002] Electronic devices, such as electronic accessories for mobile phones, computers, and other electronic equipment, may contain wireless circuits. For example, earbuds can be used as electronic devices that communicate wirelessly with mobile phones and other equipment.
[0003] Small electronic devices, such as wireless earbuds, can be configured to receive content played from a host device, a mobile terminal, via the Bluetooth frequency band. Wireless earbuds are wearable electronic devices that are inserted into the human ear.
[0004] Another problem may arise in implementing antennas and wireless communication circuits in small electronic devices such as wireless earbuds. In this regard, the antenna inside the main body of the wireless earbud, which is worn on the human body, may not function effectively to radiate wireless signals. Consequently, there is a problem in that it is difficult to achieve the desired level of wireless communication performance through wireless communication with surrounding electronic devices.
[0005] Wireless earbuds can be designed to receive wireless signals via a Bluetooth frequency band with a specific bandwidth and a center frequency of approximately 2.45 GHz. In this regard, the operational bandwidth of the antenna equipped in the wireless earbud needs to be designed to be wider than the operational bandwidth of other electronic devices that perform wireless communication via the Bluetooth frequency band. This is because the antenna resonant frequency may change depending on the movement of the human body or the movement of the wireless earbud within the space inside the ear when worn. Additionally, the antenna placement space within the mechanism of the wireless earbud is narrow, so changes in antenna performance due to manufacturing variations may be sensitive.
[0006] Accordingly, it is necessary to implement electronic devices such as wireless earbuds equipped with improved antennas and control circuits. The problem to be solved
[0007] The present specification aims to solve the aforementioned problems and other problems. Additionally, another objective is to provide an electronic device, such as a wireless earbud, equipped with an improved antenna and control circuit.
[0008] Another objective of this specification is to increase the operating bandwidth of an antenna provided in a wireless earbud.
[0009] Another objective of this specification is to stably receive wireless signals even when the antenna resonance frequency changes as the wireless earbuds are worn.
[0010] Another objective of the present specification is to minimize changes in antenna performance due to the narrow antenna placement space located inside the mechanism of the wireless earbud. means of solving the problem
[0011] To achieve the above or other purposes, an earbud according to an embodiment comprises: a housing having a main body portion having a speaker port and a stoke extending from the main body portion; a radiator disposed within the stoke to radiate a wireless signal to the outside of the earbud; and a printed circuit board (PCB) configured to be electrically connected to the radiator. The radiator comprises a first conductive pattern formed on a first surface within the stoke; a second conductive pattern formed on a second surface perpendicular to the first surface; and a connecting portion configured to electrically connect the first conductive pattern and the PCB. The first conductive pattern and the connecting portion are configured to radiate a signal in a first frequency band, and the first conductive pattern and the second conductive pattern may be configured to radiate a signal in a second frequency band different from the first frequency band.
[0012] According to an embodiment, the connection portion may be composed of a coaxial cable comprising a signal line formed on the inner side, a dielectric formed to surround the signal line, and a ground formed on the outer side to surround the dielectric. The signal line of the coaxial cable is connected to the first conductive pattern, the ground of the coaxial cable is connected to the ground of the PCB, and the first conductive pattern and the ground of the coaxial cable connected to the first conductive pattern can radiate a first signal in the first frequency band and operate as a radiator.
[0013] According to an embodiment, the second conductive pattern may include a touch sensor. The first conductive pattern may be formed with a first length in the first axial direction of the stock, and the second conductive pattern may be formed with a second length in the first axial direction.
[0014] According to an embodiment, the first length of the first conductive pattern may be formed to be within a predetermined range based on 14.6 mm, and the second length of the second conductive pattern may be formed to be within a predetermined range based on 13.6 mm. The first frequency band may be a frequency band having a center frequency of 2.3 GHz to perform Bluetooth communication with an electronic device, and the second frequency band may be a frequency band having a center frequency of 2.6 GHz to perform Bluetooth communication.
[0015] According to an embodiment, the first conductive pattern formed on the first surface and the coaxial cable formed on the first surface can radiate a first signal in the first frequency band. The first conductive pattern and the second conductive pattern formed on the second surface perpendicular to the first surface can be configured to radiate a second signal in the second frequency band. The first direction of the first current formed in the first conductive pattern on the first surface and the coaxial cable and the second direction of the second current formed in the second conductive pattern on the second surface perpendicular to the first surface are formed orthogonally, so that the radiator can operate broadband in the first frequency band and the second frequency band.
[0016] According to an embodiment, one end of the first conductive pattern and one end of the second conductive pattern are formed spaced apart, and a current formed in the first conductive pattern can be coupled to the second conductive pattern in the second frequency band.
[0017] According to an embodiment, a third conductive pattern formed on a third surface facing the second conductive pattern may be further included. The third conductive pattern disposed on the third surface may include a force sensor.
[0018] According to an embodiment, the third challenge pattern may be configured to radiate a signal in a third frequency band higher than the second frequency band. The third frequency band may be a 5 GHz band or a 7 GHz band for Bluetooth communication.
[0019] According to an embodiment, the signal pattern of the first conductive pattern may be formed as a conductive pattern of a predetermined shape to radiate signals in the first frequency band and the second frequency band. The ground pattern of the first conductive pattern may be electrically connected to the ground of the coaxial cable.
[0020] According to an embodiment, the signal pattern of the second conductive pattern may be formed as a conductive pattern of a predetermined shape to radiate a signal in the second frequency band and operate as a touch sensor. The ground pattern of the second conductive pattern may be electrically connected to the ground of the coaxial cable.
[0021] According to an embodiment, the signal pattern of the third conductive pattern may be formed as a conductive pattern of a predetermined shape to operate as a force sensor. The ground pattern of the second conductive pattern may be electrically connected to the ground of the coaxial cable.
[0022] According to an embodiment, the earbud may further include a flexible printed circuit board configured to connect the PCB and the first conductive pattern. The FPCB may be formed to surround a metal frame forming an inner side area formed by the curved surface of the main body.
[0023] According to an embodiment, the earbud may further include a second FPCB connected to one end of the FPCB and disposed in the inner side area; and a metal gasket configured such that the ground pattern of the FPCB and the ground pattern of the second FPCB are connected to the metal frame.
[0024] According to an embodiment, the earbud may further include a proximity sensor and a voice pickup unit (VPU) disposed in an outer first side area of the main body, and a connector and a battery protection circuit disposed between the outer second side area and the inner side. The FPCB disposed between the metal frame disposed in the inner side area of the main body and the main body may be electrically connected to the proximity sensor, the VPU, the connector, and the battery protection circuit.
[0025] According to an embodiment, the first conductive pattern may be selectively formed on a dielectric injection molded product using a laser, and a second conductive pattern may be formed on the first conductive pattern by plating.
[0026] An electronic device according to another aspect of the present specification may include a dielectric housing having a main body portion having a port and a protruding portion extending from the main body portion; and an antenna disposed within the protruding portion to radiate a wireless signal to the outside of the electronic device. The antenna may include a first conductive pattern formed on a first surface within the protruding portion; a second conductive pattern formed on a second surface perpendicular to the first surface; and a connecting portion configured to electrically connect the first conductive pattern and a PCB. The first conductive pattern and the connecting portion may be configured to radiate a signal in a first frequency band, and the first conductive pattern and the second conductive pattern may be configured to radiate a signal in a second frequency band different from the first frequency band.
[0027] According to an embodiment, the electronic device may further include a printed circuit board (PCB) configured to be electrically connected to the antenna. The connection portion may be composed of a coaxial cable comprising a signal line formed on the inside, a dielectric formed to surround the signal line, and a ground formed on the outside to surround the dielectric. The signal line of the coaxial cable may be connected to the first conductive pattern, and the ground of the coaxial cable may be connected to the ground of the PCB. The first conductive pattern and the ground of the coaxial cable connected to the first conductive pattern may radiate a first signal in the first frequency band and operate as a radiator.
[0028] According to an embodiment, the second conductive pattern may include a touch sensor. The first conductive pattern may be formed with a first length in the first axial direction of the stock, and the second conductive pattern may be formed with a second length in the first axial direction.
[0029] According to an embodiment, the first length of the first conductive pattern may be formed to be within a predetermined range based on 14.6 mm, and the second length of the second conductive pattern may be formed to be within a predetermined range based on 13.6 mm. The first frequency band may be a frequency band having a center frequency of 2.3 GHz to perform Bluetooth communication with an electronic device, and the second frequency band may be a frequency band having a center frequency of 2.6 GHz to perform Bluetooth communication.
[0030] According to an embodiment, the first conductive pattern formed on the first surface and the coaxial cable formed on the first surface can radiate a first signal in the first frequency band. The first conductive pattern and the second conductive pattern formed on the second surface perpendicular to the first surface can be configured to radiate a second signal in the second frequency band. Effects of the invention
[0031] The technical effects of wireless earbuds equipped with such a broadband antenna are explained as follows.
[0032] According to the present specification, a broadband antenna in an electronic device, such as a wireless earbud, can be configured to operate in a broadband manner.
[0033] According to the present specification, the operating bandwidth of the antenna can be increased by coupling the current formed in the conductive pattern of the antenna provided in the wireless earbud to the touch sensor.
[0034] According to the present specification, when wearing wireless earbuds, wireless signals can be stably received even when the antenna resonance frequency changes due to human movement or movement of the wireless earbuds within the space inside the ear.
[0035] According to the present specification, changes in antenna performance due to the narrow antenna placement space placed inside the mechanism of the wireless earbud can be minimized, thereby stably maintaining wireless communication performance.
[0036] Further scopes of the applicability of the present invention will become apparent from the following detailed description. However, since various changes and modifications within the spirit and scope of the present invention are clearly understood by those skilled in the art, specific embodiments, such as the detailed description and preferred embodiments of the present invention, should be understood as being given merely as examples. Brief explanation of the drawing
[0037] FIG. 1 is a configuration diagram of an exemplary system including an electronic device that communicates wirelessly with a wearable electronic device, such as a wireless earbud, according to the present specification. FIGS. 2 and FIGS. 3 show a front perspective view and a rear perspective view of an earbud according to the present specification. FIGS. 4a and FIGS. 4b show configurations including conductive patterns and mechanical structures disposed inside an earbud according to the present specification from different perspectives. Figure 5a compares the reflection coefficient characteristics according to frequency of an earbud with the radiator structure of Figures 4a and 4b placed inside with the reflection coefficient characteristics of a radiator structure having a single conduction pattern. Figures 5b and 5c show the change in reflection coefficient according to the shape change of the RF cable and FPCB in single-mode and dual-mode antenna structures. FIG. 6a shows the current distribution formed in the conductive patterns disposed inside the earbud, the metal frame, the FPCB, and the RF cable according to the present specification. Meanwhile, FIG. 6b shows the current distribution formed in the conductive patterns disposed inside the earbud of FIG. 6a and the RF cable. FIG. 7 illustrates the operating principle considering current distribution in a configuration where an antenna structure placed inside an earbud according to the present specification is connected to a PCB. FIGS. 8A and FIGS. 8B show internal perspective views of the conductive pattern arrangement structure inside the earbuds viewed from different angles. FIG. 9a shows a structure in which a plurality of conductive patterns constituting the radiator of an earbud according to the present specification are connected to ground. FIG. 9b shows a single-mode antenna and mechanical structure inside an earbud. FIG. 9c shows a dual-mode antenna and mechanical structure inside an earbud according to the present specification. FIG. 10a shows a configuration in which a radiator inside an earbud according to the present specification is connected to a PCB and also connected to a separate FPCB. FIG. 10b shows a configuration in which at least one operating unit and an interface terminal are provided in the outer region of the earbud of FIG. 10a or between the outer region and the inner region. FIGS. 11a and FIGS. 11b are drawings of a metal pattern and an interface structure formed on an internal dielectric structure of an earbud according to the present specification, viewed from different angles. FIGS. 12a to 12c show, from different angles, a structure in which a conductive pattern and electronic components are arranged inside an earbud according to the specification. Figure 13 shows the antenna reflection coefficient characteristics according to the change in the length of the touch sensor in the antenna structure inside the earbud. FIGS. 14a to 14c show a structure in which a plurality of FPCBs are arranged and assembled inside an earbud according to the present specification. FIGS. 15a to 15c show, from different angles, a structure in which an FPCB is arranged to surround a metal frame inside an earbud according to the present specification. Figure 16a shows the reflection coefficient characteristics according to the change in the RF cable connection point when the slide touch sensor corresponding to the coupling challenge pattern is not placed inside the earbud. FIG. 16b shows the reflection coefficient characteristics according to the change in the RF cable connection point when the slide touch sensor is placed inside the earbud. FIG. 17a shows the structural radiation performance and antenna performance by the mechanical structure in a broadband antenna structure disposed inside an earbud according to the present specification. FIG. 17b shows the overall wireless performance of a broadband antenna structure placed inside an earbud according to the present specification. Specific details for implementing the invention
[0038] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Identical or similar components regardless of drawing symbols will be assigned the same reference number, and redundant descriptions thereof will be omitted. The suffixes "module" and "part" used for components in the following description are assigned or used interchangeably solely for the ease of drafting the specification and do not inherently possess distinct meanings or roles. Furthermore, in describing embodiments disclosed in this specification, if it is determined that a detailed description of related prior art could obscure the essence of the embodiments disclosed in this specification, such detailed description will be omitted. Additionally, the attached drawings are intended only to facilitate understanding of the embodiments disclosed in this specification; the technical concept disclosed in this specification is not limited by the attached drawings, and it should be understood that they include all modifications, equivalents, and substitutions that fall within the spirit and technical scope of the present invention.
[0039] Terms including ordinal numbers, such as first, second, etc., may be used to describe various components, but said components are not limited by said terms. These terms are used solely for the purpose of distinguishing one component from another.
[0040] When it is stated that one component is "connected" or "connected" to another component, it should be understood that while it may be directly connected or connected to that other component, there may also be other components in between. On the other hand, when it is stated that one component is "directly connected" or "directly connected" to another component, it should be understood that there are no other components in between.
[0041] A singular expression includes a plural expression unless the context clearly indicates otherwise.
[0042] In this application, terms such as “comprising” or “having” are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.
[0043] The electronic devices described herein may be wearable devices. Wireless wearable electronic devices, such as wireless earbuds, may communicate with a host device and with each other. Any suitable type of host electronic device and wearable wireless electronic device may be used in this type of arrangement. The use of a wireless host, such as a cellular phone, computer, or wristwatch, may sometimes be described in this specification as an example. Additionally, any suitable wearable wireless electronic device may communicate wirelessly with a wireless host. The use of wireless earbuds to communicate with a wireless host is merely illustrative.
[0044] A wireless electronic device host can communicate wirelessly with an accessory device such as earbuds. In this regard, FIG. 1 is a configuration diagram of an exemplary system including an electronic device that communicates wirelessly with a wearable electronic device such as wireless earbuds according to the present specification.
[0045] Referring to FIG. 1, the host electronic device (100a) may be a mobile terminal or a wireless earbud and other wearable device capable of performing wireless communication, but is not limited thereto. The host electronic device (100a) may be implemented as any electronic device capable of performing wireless communication with the wireless earbud, such as a computer, a laptop computer, a content playback device of a home network, or a communication device of a vehicle.
[0046] The wireless earbud (100) may be configured to include various components. In this regard, the wireless earbud (100) may be configured to include an antenna module (200), an RF circuit (10), and a sensor module (20). The wireless earbud (100) may be configured to further include a control circuit (30), a battery (40), and a speaker (50). Meanwhile, the host electronic device (100a) may be configured to include an antenna module (200a) and an RF circuit (10a) to perform wireless communication with the earbud (100). The host electronic device (100a) may be configured to further include a sensor module (20), a control circuit (30), a battery (40), and a speaker (50), but is not limited thereto. The host electronic device (100a) may be configured to include more components than the earbud (100).
[0047] The antenna module (200) may be configured to receive a wireless signal containing voice content from a host electronic device (100a). The antenna module (200) may be configured to receive a wireless signal from the host electronic device (100a) in a Bluetooth band, for example, a band of 2.4 to 2.488 GHz. In this regard, the wireless communication link between the host electronic device (100a) and the earbud (100) is not limited to Bluetooth communication. Any wireless communication link capable of supporting short-range wireless communication between the host electronic device (100a) and the earbud (100), such as a short-range wireless communication link in a 2.4 GHz, 5 GHz, or other frequency band, may be used. Depending on the application, a wireless communication link in a mobile communication frequency band or a wireless communication link in a millimeter wave band that supports IoT wireless communication may also be used.
[0048] Additionally, when user input is applied by an operation button provided on the earbud (100), a control command to control playback and volume of voice content, etc., can be transmitted to the host electronic device (100a) through the antenna module (200). The antenna module (200a) of the host electronic device (100a) can receive a wireless signal containing the control command in the Bluetooth band.
[0049] The antenna module (200) can be operably coupled with the RF circuit (10). The antenna module (200) can be connected to the signal pattern of the RF circuit (10) via a feed section (FP). The antenna module (200) can be connected to the ground pattern of the RF circuit (10) via a ground connection section (GP). The RF circuit (10) can be configured to amplify, filter, and process signals transmitted and received through the antenna module (200).
[0050] The sensor module (20) may be configured to include at least one sensor. The sensor module (20) may be configured to include a proximity sensor capable of detecting user movement and proximity, a touch sensor capable of detecting user input, and a pressure sensor, but is not limited thereto. The sensor module (20) may further include an accelerometer and a gyroscope.
[0051] The control circuit (30) can be operably coupled with the sensor module (20), battery (40), and speaker (50). The control circuit (30) can be configured to control the operation of the sensor module (20), battery (40), and speaker (50).
[0052] The battery (40) may be configured to supply power to various electronic components placed inside the earbud (100). The battery (40) may be configured to store power when power is received from a charger and to supply power to various electronic components. The speaker (50) may be configured to play voice content received from the host electronic device (100a).
[0053] Meanwhile, the earbud (100) according to the present specification may be formed with a housing-shaped mechanical structure and configured to have a port, such as a speaker port, formed externally. In this regard, an antenna module capable of receiving or transmitting a wireless signal from the earbud (100) may be disposed inside the housing. In this regard, FIGS. 2 and FIGS. 3 show a front perspective view and a rear perspective view of the earbud according to the present specification.
[0054] Referring to the front perspective view of FIG. 2, the earbud (100) can be divided into a front (100F) and a rear (100R) based on one axis. The housing (120) may have a main body portion (120b) in which a speaker port (120a) is formed. The speaker port (120a) may be formed to face the front of the earbud (100). An elongated protruding portion, such as a stock portion (122) of the housing (120), may extend outward from the main housing portion (120b). The stock portion (122) may be formed as an elongated protruding portion having a predetermined length (L) and diameter (D).
[0055] The main body (120b) may have a shape that fits the user's ear. The speaker (20) may be mounted on the main body (120b) and aligned with the speaker port (120a). The speaker (20) may be used to provide sound to the user's ear. The speaker port (120a) may be formed from one or more openings of the housing (120). One or more layers of plastic or metal mesh may be interposed between the speaker (20) and the opening(s) of the housing (120).
[0056] The housing (120) may be formed of metal, plastic, carbon fiber composite or other fiber composite, glass, ceramic, other materials, or a combination of these materials. The long shape of the stocking (122) enables the user to hold the earbud (100) in their hand at the ear. The stocking (122) may extend from the main body portion (120b) at the rear (100R) of the housing (120) and may extend along the longitudinal stocking axis (120). Depending on the application, the stocking (122) may be formed in a curved shape of a certain shape in addition to a straight shape.
[0057] FIG. 3 shows a rear perspective view of the earbud (100) of FIG. 2. As shown in FIG. 3, the antenna (200) may have an elongated shape extending along an axis parallel to the length of the stock (122). The antenna (200) may be formed from the feed portion (108) to the lower region of the stock (122), but is not limited thereto.
[0058] Referring to FIGS. 1 through 3, the antenna (200) may overlap with a structure such as a battery (26) and other conductive components located in an internal region (124) of the housing (120). This structure may include a conductive material that tends to shield the antenna (200).
[0059] The antenna feed section (108) may be located at the joint (12J) of the housing (120) between the main body section (120b) and the stock (122), rather than at a location that overlaps with the area (124) of the main body section (120b). Placing the antenna feed section at a second location (108), such as the joint (120J), rather than at a first location (108'), such as the main main body section (120b), may help minimize unwanted radiation and current consumption occurring on a different ground plane. By minimizing such unwanted radiation and current consumption, the battery's current consumption can be reduced and antenna efficiency can be improved.
[0060] The antenna (200) may be formed as a patterned metal pattern or metal trace on a printed circuit board (PCB). In addition to a rigid substrate, the PCB may be composed of a flexible printed circuit board (FPCB) (e.g., a printed circuit formed from a sheet of polyimide or other polymer substrate material).
[0061] Hereinafter, a configuration for performing wireless communication with an electronic device outside the earbud through a radiator disposed inside the earbud according to the present specification is described. The electronic device outside the earbud corresponds to the host electronic device (100a) of FIG. 1, and the earbud corresponds to the earbud (100) of FIG. 1, and can perform wireless communication with the host electronic device (100a) through an antenna module (200). The earbud corresponds to a type of electronic device that receives content through wireless communication with the host electronic device. The earbud may be referred to as TWS (True Wireless Stereo). The structure of the radiator disposed inside the earbud that performs wireless communication with the host electronic device is described in detail.
[0062] In this regard, FIGS. 4a and FIGS. 4b illustrate, from different angles, a configuration including conductive patterns and a mechanical structure disposed inside an earbud according to the present specification. Referring to FIGS. 2 through 4b, the earbud (100) may be configured to include a housing (120), a radiator (200), and a printed circuit board (PCB, 150). The radiator (200) may be configured to radiate a wireless signal to perform wireless communication with an electronic device outside the earbud (100). Since the radiator (200) transmits and receives a wireless signal, it may be referred to as an antenna (200).
[0063] The housing (120) has a main body portion (120b) having a speaker port (120a) and a stoke (122) extending from the main body portion. A radiator (200) may be positioned within the stoke (122) and configured to radiate a wireless signal to the outside of the earbud (100). A PCB (150) may be configured to be electrically connected to the radiator.
[0064] The radiator (200) may be configured to include a first conductive pattern (210) and a second conductive pattern (220). The radiator (200) may be configured to further include a connecting part (240). The connecting part (240) may be implemented as an RF cable, but is not limited thereto. The first conductive pattern (210) may be formed on a first surface within the stock (122). The second conductive pattern (220) may be formed on a second surface perpendicular to the first surface within the stock (122). The connecting part (240) may be configured to electrically connect the first conductive pattern (210) and the PCB (150).
[0065] The first conduction pattern (210) and the connection part (240) may be configured to radiate a signal in a first frequency band. The first conduction pattern (210) and the second conduction pattern (220) may be configured to radiate a signal in a second frequency band different from the first frequency band. For example, the second frequency band may be a frequency band higher than the first frequency band, but is not limited thereto.
[0066] The connection portion (240) may be configured to include a signal line (241), a dielectric (242), and a ground (243) formed on the inner side. The connection portion (240) may be implemented as a coaxial cable including the signal line (241), the dielectric (242), and the ground (243), but is not limited thereto. The signal line (241) of the coaxial cable (240) may be connected to the first conductive pattern (210). The signal line (241) of the coaxial cable (240) may be connected to the feed connection portion (FP) of the first conductive pattern (210). The ground (243) of the coaxial cable (240) may be connected to the ground of the PCB (150). The ground (243) of the coaxial cable (240) may be connected to the first conductive pattern (210). The ground (243) of the coaxial cable (240) can be connected to the ground connection part (GP) of the first conduction pattern (210).
[0067] The ground (243) of the coaxial cable (240) horizontally positioned in the first conduction pattern (210) can operate as a radiator by radiating a first signal in the first frequency band. The ground (243) of the coaxial cable (240) can be positioned parallel to the first conduction pattern (210) in the lower region of the first conduction pattern (210).
[0068] The second conductive pattern (220) may be configured to include a touch sensor. The first conductive pattern (210) and the second conductive pattern (220) may be formed with a predetermined length on a substantially perpendicular plane. The first conductive pattern (210) may be formed with a first length in the first axial direction of the stock. The second conductive pattern (210) may be formed with a second length in the first axial direction. The first length of the first conductive pattern (210) may be formed within a predetermined range based on 14.6 mm, but is not limited thereto. The second length of the second conductive pattern (210) may be formed within a predetermined range based on 13.6 mm, but is not limited thereto. The radiator (200) may further include a third conductive pattern (230). The third conductive pattern (230) disposed on the third plane may be configured to include a force sensor (231).
[0069] The first conduction pattern (210) and the coaxial cable (240) may be configured to radiate a signal in a first frequency band. The first conduction pattern (210) and the second conduction pattern (220) may be configured to radiate a signal in a second frequency band higher than the first frequency band. The first frequency band may be a frequency band having a center frequency of 2.3 GHz to perform Bluetooth communication with an electronic device, but is not limited thereto. The second frequency band may be a frequency band having a center frequency of 2.6 GHz to perform the Bluetooth communication, but is not limited thereto.
[0070] In this regard, FIG. 5a compares the reflection coefficient characteristics according to frequency of an earbud with the radiator structure of FIG. 4a and FIG. 4b placed inside with the reflection coefficient characteristics of a radiator structure having a single conduction pattern. FIG. 5b and FIG. 5c show the change in reflection coefficient according to the shape change of the RF cable and FPCB in single-mode and dual-mode antenna structures.
[0071] Referring to FIGS. 4a and 4b, the earbud can transmit and receive wireless signals in a broadband frequency range by means of first and second conductive patterns (210, 220) formed on substantially vertical surfaces and a coaxial cable (240) connected to the first conductive pattern (210). Referring to FIGS. 2 through 5a, a radiator (200) having first and second conductive patterns (210, 220) and a connection part (240) operates as an antenna having dual resonance characteristics in a first frequency band and a second frequency band. On the other hand, a radiator structure having a single conductive pattern operates as an antenna having single resonance characteristics in a frequency band between the first and second frequency bands.
[0072] In this regard, a first conductive pattern (210) formed on a first surface and a coaxial cable formed on the first surface may be configured to radiate a first signal in a first frequency band. Meanwhile, a second conductive pattern (220) formed on a second surface perpendicular to the first surface and the first conductive pattern (210) may be configured to radiate a second signal in a second frequency band. For example, the first frequency band may be a 2.3 GHz band and the second frequency band may be a frequency band higher than the first frequency band, but is not limited thereto. For example, the second frequency band may be a 2.55 GHz band or a 2.6 GHz band, but is not limited thereto.
[0073] Meanwhile, the antenna structure inside the earbud according to the present specification may be formed as a structure in which flexible printed circuit boards (FPCBs) on which a plurality of electronic components can be arranged are interconnected. In this regard, an FPCB (161) placed on the upper part of the PCB (150) may be configured to be connected to a second FPCB (162). The ground pattern of the FPCB (161) and the ground pattern of the second FPCB (162) may be interconnected. A plurality of proximity sensors (121a) may be provided on the side of the second FPCB (162), and a voice pickup unit (VPU, 121b) may be placed between the proximity sensors (121a). The other end of a connecting FPCB (164), which is configured such that one end is connected to the PCB (150), may be configured to be connected to the FPCB (161).
[0074] Meanwhile, referring to FIG. 5a, the operating frequency of an antenna provided in an earbud that performs wireless communication via Bluetooth can be configured with a predetermined bandwidth with a center frequency of approximately 2.45 GHz. In this regard, the operating bandwidth (BW1) of the antenna operating in a single frequency band can be set to approximately 100 MHz. The frequency bandwidth for wireless communication via Bluetooth can be set to approximately 2.4 to 2.4835 GHz. The operating bandwidth (BW1) of the antenna set to approximately 100 MHz can cover the bandwidth for Bluetooth wireless communication. However, variations in manufacturing of the antenna placed inside the earbud or changes in antenna performance may occur when inserted into the ear and used. Accordingly, there is a problem that it is difficult to apply an antenna with a bandwidth of approximately 100 MHz to the earbud.
[0075] Meanwhile, the operating bandwidth (BW2) of the antenna according to the present specification, which operates in multiple frequency bands, may be set to approximately 400 MHz or higher. In this regard, the operating frequency of the antenna according to the present specification may be approximately 2.25 to 2.6 GHz, and the operating bandwidth (BW2) accordingly may be set to approximately 450 MHz. Accordingly, an antenna having dual-band resonance characteristics according to the present specification can be applied to an earbud. In this regard, the earbud can be used stably even if there is a manufacturing deviation of the antenna placed inside the earbud or a change in antenna performance when inserted into the ear for use.
[0076] Specifically, changes in antenna performance may occur due to 1) dielectric constant deviation of the structure placed inside the earbud, 2) assembly deviation of the structure placed inside the earbud, and 3) deviation of the user environment during the use of the earbud. For example, an antenna resonance frequency deviation of approximately 45 to 90 MHz may occur depending on a dielectric constant deviation of about 5 to 10%. Assembly deviation caused by the flexible circuit board placed inside the earbud may occur more significantly than assembly deviation of other components. For example, an antenna resonance frequency deviation of about 170 MHz may occur depending on the shape and placement error of the assembled FPCB. Accordingly, this specification intends to present a broadband antenna structure placed inside an earbud having a bandwidth of about 400 MHz or more. To this end, this specification intends to present a dual-mode broadband antenna structure that operates in a first mode in a first frequency band, which is a low-frequency band, and in a second mode in a second frequency band, which is a high-frequency band.
[0077] Meanwhile, in the antenna structure inside the earbud as presented in FIGS. 4a and 4b, changes in antenna performance may occur depending on changes in the shape of the FPCB and RF cable and the usage environment. In this regard, FIG. 5b shows the change in the reflection coefficient according to changes in the shape of the RF cable and FPCB in a single-mode antenna structure in which only the first conductive pattern is formed inside the earbud of FIGS. 4a and 4b. FIG. 5c shows the change in the reflection coefficient according to changes in the shape of the RF cable and FPCB in a dual-mode antenna structure having a first conductive pattern and a second conductive pattern connected to the RF cable inside the earbud of FIGS. 4a and 4b.
[0078] Referring to FIGS. 4a, 4b and FIG. 5b (a), the resonant frequency of the single-mode antenna can change from a frequency lower than 2.2 GHz to a frequency higher than 2.6 GHz depending on the shape change and shaking of the FPCB (161, 162). In this regard, the resonant frequency can be shifted by about 0.4 GHz depending on the shape change and shaking of the FPCB (161, 162). Referring to FIGS. 4a, 4b and FIG. 5b (b), the resonant frequency of the single-mode antenna can change from about 2.45 GHz to a lower frequency of 2.3 GHz depending on the shape change and shaking of the RF cable (240). In this regard, the resonant frequency can be shifted by about 0.2 GHz depending on the shape change and shaking of the RF cable (240). Therefore, considering both the shape change and vibration of the RF cable (240) and FPCB (161, 162), the resonant frequency of the single-mode antenna can change by approximately 0.4 GHz + 0.2 GHz = 0.6 GHz.
[0079] Referring to FIGS. 4a, 4b, and 5c (a), the dual-mode antenna (200) can be designed to resonate dual-mode in the approximately 2.3 GHz band and the 2.6 GHz band. Referring to FIGS. 4a, 4b, and 5c (b), the antenna operating band changes to the approximately 2.2 GHz band and the 2.4 GHz band depending on the shape change and vibration of the RF cable (240) and the FPCB (161, 162). Therefore, even when all shape changes and vibrations of the RF cable (240) and the FPCB (161, 162) are taken into account, the degree of change in the resonant frequency of the dual-mode antenna (200) is reduced compared to a single-mode antenna. In the first and second frequency bands, the dual-mode antenna (200) has radiation contribution components due to the connection and other conductivity patterns in addition to the radiation contribution component due to the first conductivity pattern (210). Therefore, compared to a single-mode antenna, the dual-mode antenna (200) shows less change in resonance frequency due to other environmental changes, such as changes in the shape and shaking of the cable (240) and FPCB (161, 162).
[0080] Meanwhile, even in the case of broadband operation such as with a dual-mode antenna (200), it is necessary to minimize changes in the resonant frequency due to changes in the shape and shaking of the connection structure. To minimize shifts in the resonant frequency due to changes in the shape and shaking of the FPCB (161, 162), the FPCB (161, 162) can be attached to a cradle structure such as a metal frame (165) using adhesive tape. To minimize shifts in the resonant frequency due to changes in the shape and shaking of the RF cable (240), a guide structure can be installed to guide the RF cable (240).
[0081] Current formed in the conductive pattern of the antenna structure disposed inside the earbud according to the present specification may be coupled to the FPCB and RF cable adjacent to the conductive pattern and affect the antenna characteristics. In this regard, FIG. 6a shows the current distribution formed in the conductive patterns disposed inside the earbud according to the present specification, the metal frame, the FPCB, and the RF cable. Meanwhile, FIG. 6b shows the current distribution formed in the conductive patterns disposed inside the earbud of FIG. 6a and the RF cable.
[0082] Referring to FIGS. 4a, 4b and 6a, a surface current distribution is formed in the first conductive pattern (210) and the second conductive pattern (220) and can be coupled to adjacent electronic components. Referring to FIGS. 6a (a) and 6a (b), a high current distribution can be formed in the RF cable (240), PCB (150), and FPCB (161, 162) adjacent to the first and second conductive patterns (210, 220). Additionally, a high current distribution can be formed in the metal frame (165) operating as ground.
[0083] Referring to the surface current distribution in FIG. 6a, the current formed in the FPCB (161, 162) and RF cable (240) can affect antenna matching performance more than the antenna itself. In particular, the shape of the FPCB (161) and RF cable (240) adjacent to the PCB (150) corresponding to the main board is a factor that can significantly affect antenna matching performance. In this regard, the RF cable (240) and FPCB (161) are components that may be subject to shaking even during earbud use. Therefore, in addition to antenna performance deviations caused by assembly deviations of the RF cable and FPCB as shown in FIG. 5b, antenna performance degradation may occur even during earbud use. However, through the dual-mode broadband antenna structure according to the present specification, stable wireless communication is possible even when antenna performance changes due to assembly deviations of the RF cable and FPCB and shaking during use as shown in FIG. 5c.
[0084] Referring to FIGS. 2 to 5a and FIG. 6b(a), a first mode operating at a first frequency band of 2.3 GHz can be implemented by a first conductive pattern (210) and a fourth conductive pattern (240) implemented as a connection part such as an RF cable. The first conductive pattern (210) can be implemented as an LDS antenna by an LDS process with a metal pattern on a dielectric structure. The ground (243) of the RF cable (240) corresponding to the fourth conductive pattern can be implemented as a radiator together with the first conductive pattern (210).
[0085] Referring to FIGS. 2 to 5a and FIG. 6b(b), the second mode operating at a second frequency band of 2.55 GHz can radiate a signal through a gap region (G) corresponding to an open slot implemented between the first conduction pattern (210) and the second conduction pattern (220). The second conduction pattern (220) can be implemented as a slide-type slide touch sensor. It can be configured to operate the functions of the earbuds by means of the slide touch sensor. For example, it can be configured to adjust the volume of content received through the earbuds by means of the slide touch sensor, but is not limited thereto.
[0086] Meanwhile, the length of the open slot can be implemented to be almost identical to the first length of the first conduction pattern (210), which is an LDS antenna, within a predetermined range. Thus, both the open slot and the LDS antenna can be implemented with electrical lengths that operate in the 2.4 GHz band. Due to the orthogonality of the electric fields of the first mode and the second band, interference between modes can be minimized. Accordingly, a broadband antenna having dual resonance characteristics with minimized interference between modes in the first frequency band and the second frequency band can be implemented.
[0087] Meanwhile, the antenna structure disposed inside the earbud according to the present specification can operate in a dual mode to enable broadband operation. In this regard, FIG. 7 illustrates the operating principle considering current distribution in a configuration where the antenna structure disposed inside the earbud according to the present specification is connected to a PCB.
[0088] Referring to FIGS. 2 through 7, a first and second current can be generated on the first and second conduction patterns (210, 220), respectively. The first direction of the first current formed on the first conduction pattern (210) and the coaxial cable (240) of the first surface and the second direction of the second current formed on the second conduction pattern (220) of the second surface perpendicular to the first surface can be formed orthogonally. In this regard, the first direction of the first current formed on the first surface may be the x-axis or y-axis direction on the first conduction pattern (210). Meanwhile, the first direction of the second current formed on the second surface may be the z-axis direction on the second conduction pattern (220). Accordingly, the radiator (200) can operate broadband in the first frequency band and the second frequency band.
[0089] One end of the first conductive pattern (210) and one end of the second conductive pattern (220) may be formed to be spaced apart. The current formed in the first conductive pattern (210) may be configured to be coupled to the second conductive pattern (220) in a second frequency band. Accordingly, the first conductive pattern (210) and the second conductive pattern (220) may be spaced apart by a gap (G) and operate as a coupling antenna.
[0090] Referring to FIGS. 4a through 7, the dual-mode antenna structure according to the present specification can be summarized by the following technical features: 1) The dual-mode antenna structure may have two branch structures formed in the same direction. In this regard, a first branch structure and a second branch structure, each operating in a first mode and a second mode respectively, may be formed in the same first axis direction. 2) An RF cable (240) may be placed near the first branch structure by the current formed on the first conductive pattern (210). In this regard, the RF cable (240) has a significant influence on the antenna resonance of the first frequency band, the 2.3 GHz band. 3) The second branch structure may be formed with a second conductive pattern (220) corresponding to a slide sensor. In this regard, the slide sensor has a significant influence on the antenna resonance of the second frequency band, the 2.6 GHz band. The length of the slide sensor corresponds to the resonance length of the second frequency band. The length of the slide sensor corresponds to the length of the first conductive pattern (210) and the second conductive pattern (220) separated by a gap (G).
[0091] 4) The first and second FPCBs (161, 162), corresponding to the main FPCB and audio FPCB, can be electrically connected together with the metal frame (165) using a metal gasket (163). Thus, a stable ground current can be secured between the first and second FPCBs (161, 162) and the metal frame (165). Through this stable ground connection structure, the generation of higher-order modes formed by loop currents according to the connection structure of the conductive patterns and FPCBs can be prevented. Through the ground connection structure between the first and second FPCBs (161, 162) and the metal frame (165), the formation of loop disturbances due to higher-order mode generation caused by loop currents can be prevented.
[0092] The radiator (200) of the earbud (100) according to the present specification may further include additional conductive patterns in addition to the first and second conductive patterns (210, 220). In this regard, FIGS. 8a and FIGS. 8b show internal perspective views of a conductive pattern arrangement structure inside the earbud seen from different angles.
[0093] FIG. 8a (a) is an internal perspective view in the first direction showing a first surface in which a first conductive pattern (210) is formed and a third surface in which a third conductive pattern (230) is formed inside the earbud. FIG. 8a (b) is an internal perspective view in the second direction showing a first surface in which a first conductive pattern (210) is formed and a second surface in which a second conductive pattern (220) is formed inside the earbud. FIG. 8b is an internal perspective view in the third direction showing a fourth surface facing the first surface inside the earbud. Referring to FIG. 8b, a second conductive pattern (220) and a third conductive pattern (230) can be formed on the second surface and the third surface, respectively, which are the two sides of the fourth surface.
[0094] Referring to FIGS. 2 through 8b, the radiator (200) may further include a third conductive pattern (230) formed on a third surface facing a second conductive pattern (220) disposed on a second surface. The third conductive pattern (230) disposed on the third surface may be configured to include a force sensor (231). In this regard, a connection (240) which may be implemented as an RF cable may be referred to as a fourth conductive pattern (240). The third conductive pattern (230) may be configured to radiate a signal in a third frequency band higher than the second frequency band. The third frequency band may be a 5 GHz band or a 7 GHz band for Bluetooth communication, but is not limited thereto.
[0095] The third conductive pattern (230) is positioned adjacent to the first conductive pattern (210), which acts as an antenna and is placed inside the stoke (122) corresponding to the handle of the earbud. Additionally, the third conductive pattern (230) is positioned to face the second conductive pattern (220). Accordingly, the third conductive pattern (230) is positioned adjacent to another antenna element and can act as a disruptive element to the radiation characteristics of the antenna element. However, the resonant frequency band of the third conductive pattern (230) can be set to a 5 GHz band, a 7 GHz band, or an 8 GHz band so as not to significantly affect the radiation characteristics of the other antenna element.
[0096] Accordingly, the third conduction pattern (230) can be designed to operate in a resonant frequency band of about 7 GHz when operating as an antenna. On the other hand, in the 2.4 GHz band, which is the Bluetooth (BT) operating frequency of the earbuds, the third conduction pattern (230) has an electrical length in which it does not operate as a radiator. In other words, the third conduction pattern (230) operating as a force sensor can be implemented so that it does not operate as an antenna in the Bluetooth (BT) frequency band but operates as an antenna in another frequency band, for example, in the 7 GHz band.
[0097] Accordingly, other conductive patterns other than the first conductive pattern (210) constituting the radiator (200) of the earbud may operate as sensors or be implemented as RF cables. In this regard, the second conductive pattern (220) may operate as a touch sensor and the third conductive pattern (230) may operate as a force sensor. Additionally, the fourth conductive pattern (240) may be implemented as an RF cable. Meanwhile, the second conductive pattern (220) and the third conductive pattern (230) may also be formed on a dielectric structure similar to the first conductive pattern (210). Thus, the second conductive pattern (220) and the third conductive pattern (230) may be formed on the second dielectric structure and the third dielectric structure, respectively. Accordingly, the second conductive pattern (220) and the third conductive pattern (230) may be referred to as a touch sensor and a force sensor, respectively.
[0098] Meanwhile, a plurality of conductive patterns constituting the radiator (200) of the earbud according to the present specification may be configured to be connected to a signal line and / or ground. In this regard, FIG. 9a shows a structure in which a plurality of conductive patterns constituting the radiator of the earbud according to the present specification are connected to ground. Referring to FIG. 9a, as the plurality of conductive patterns operating as radiators are connected to ground, the size of the radiator can be reduced and broadband operation can be performed. In addition, as the conductive patterns operating as touch sensors and force sensors are connected to ground, sensing accuracy can be improved and the influence of changes in the surrounding environment can be reduced.
[0099] Referring to FIGS. 2 through 9a, the signal pattern of the first conductive pattern (210) may be formed as a conductive pattern of a predetermined shape to radiate a signal in a first frequency band and a second frequency band. The ground pattern of the first conductive pattern (210) may be electrically connected to the ground of the coaxial cable (240). The signal pattern of the second conductive pattern (220) may be formed as a conductive pattern of a predetermined shape to radiate a signal in the second frequency band and operate as a touch sensor. The ground pattern of the second conductive pattern (220) may be electrically connected to the ground of the coaxial cable (240). The signal pattern of the third conductive pattern (230) may be formed as a conductive pattern of a predetermined shape to operate as a force sensor. The ground pattern of the third conductive pattern (230) may be electrically connected to the ground of the coaxial cable (240).
[0100] The radiator and mechanical structure inside the earbud according to the present specification may be structured as shown in FIGS. 9b and FIGS. 9c. In this regard, FIGS. 9b shows a single-mode antenna and mechanical structure inside the earbud. FIGS. 9c shows a dual-mode antenna and mechanical structure inside the earbud according to the present specification.
[0101] Referring to FIG. 9b, the single-mode antenna (200a) inside the earbud may have only a first conductive pattern (210) or may additionally have a third conductive pattern (230) equipped with a force sensor. An RF cable (240a) connected to the first conductive pattern (210) may be connected to the PCB (150) at a first location (P1). In this regard, the single-mode antenna (200a) may be configured to resonate at a single frequency of approximately 2.45 GHz, as with the single-mode antenna of FIG. 5a.
[0102] Referring to FIG. 9c, the dual-mode antenna (200) inside the earbud may be configured to couple a first conductive pattern (210) and a second conductive pattern (220) equipped with a touch sensor. Referring to FIG. 5a and FIG. 9c, the dual-mode antenna (200) may operate as a radiator that radiates a signal in a first frequency band by means of the first conductive pattern (210) and an RF cable (240). The RF cable (240) connected to the first conductive pattern (210) may be connected to the PCB (150) at a second location (P2). The first conductive pattern (210) may be configured to include a signal pattern (211) and a ground pattern (212). The signal pattern (211) may be connected to a feed section (FP), and the ground pattern (212) may be connected to a ground connection section (GP).
[0103] A second position (P2) connected to the RF cable (240) may be formed adjacent to the other end of the PCB (150) than the first position (P1). One end of the PCB (150) may be formed adjacent to the end of the ground pattern (212) of the first conductive pattern (210). The other end of the PCB (150) may be formed to be connected to the FPCB (161, 162). Accordingly, as the length of the RF cable (240) in the dual-mode antenna (200) increases, the radiator composed of the first conductive pattern (210) and the RF cable (240) can operate as a radiator even in a frequency band lower than 2.45 GHz.
[0104] The connection position of the RF cable (240) in the dual-mode antenna (200) may be formed to be longer than the connection position of the RF cable (240a) in the single-mode antenna (200a). The connection position of the RF cable (240) in the dual-mode antenna (200) may be formed within a predetermined range based on approximately 11 mm. In this regard, if the connection position of the RF cable (240) is set to 7 mm or less, the RF cable (240) may be considered not to operate as a radiator in the first frequency band. Accordingly, the connection position of the RF cable (240) in the dual-mode antenna (200) may be set within a range of 7 mm to 15 mm based on approximately 11 mm. In relation to antenna operation in the first frequency band, the connection position of the RF cable (240a) may be replaced by the length of the RF cable (240a).
[0105] Meanwhile, the dual-mode antenna (200) can operate as a radiator that radiates a signal by first and second conduction patterns (210, 220) in a second frequency band higher than the first frequency band. The second conduction pattern (220), which operates as a touch sensor, can be implemented as a slide-type slide touch sensor. The dual-mode antenna (200) that radiates a signal by first and second conduction patterns (210, 220) can operate as a radiator in the second frequency band, which is approximately 2.55 GHz.
[0106] Accordingly, the radiator itself of the dual-mode antenna structure disposed inside the earbud according to the present specification can operate similarly to a conventional Bluetooth antenna. In this regard, the first conduction pattern (210), which is the main radiator, operates as a single resonance antenna. However, the radiator structure can be made to operate as a dual resonance antenna depending on the presence or absence of a slide touch sensor and the location of the connection point on the main board PCB. Specifically, the difference in the location where the second conduction pattern (220) equipped with a slide touch sensor and the RF cable (240) are connected to the PCB (150) determines the operating frequency band of the dual resonance broadband antenna. The location where the RF cable (240) is connected to the PCB (150) may also be referred to as the mobile switch position. This is because the operating frequency of the first frequency band can be determined depending on the location where the RF cable (240) is connected to the PCB (150).
[0107] Meanwhile, the radiator inside the earbud according to the present specification may be configured to be connected to a PCB and also connected to a separate FPCB. In this regard, FIG. 10a shows a configuration in which the radiator inside the earbud according to the present specification is connected to a PCB and also connected to a separate FPCB.
[0108] Referring to FIG. 10a, the earbud (100) may further include a flexible printed circuit board (161). Additionally, the earbud (100) may further include a second FPCB (162) separately from the FPCB (161). The FPCB (161) may be configured to connect the PCB (160) and the first conductive pattern (210). The second FPCB (162) may be placed on a metal frame (165) forming an inner side area formed by the curved surface of the main body.
[0109] The FPCB (161) may be formed to surround a metal frame (165) that forms an inner side area formed by the curved surface of the main body. The second FPCB (162) may also be formed to surround a metal frame (165) that forms an inner side area formed by the curved surface of the main body. The ground pattern of the FPCB (161) and the ground pattern of the second FPCB (162) may be electrically connected to the metal frame (165). A metal gasket (163) may be configured to connect the FPCB (161) and the second FPCB (162). Accordingly, the FPCB (161), the second FPCB (162), and the metal frame (165) may be configured to be interconnected with ground by the metal gasket (163).
[0110] Meanwhile, at least one operating unit and an interface terminal may be provided in the outer region of the earbud according to the present specification or between the outer region and the inner region. In this regard, FIG. 10b shows a configuration in which at least one operating unit and an interface terminal are provided in the outer region of the earbud of FIG. 10a or between the outer region and the inner region.
[0111] FIG. 10b (a) shows a configuration in which proximity sensors are arranged in one side area on the outer side of the earbud. FIG. 10b (b) shows a configuration in which one of the proximity sensors formed in one side area on the outer side of the earbud is rotated by a predetermined angle in FIG. 10b (a) and a charging terminal is formed at the bottom of the stock.
[0112] Referring to FIGS. 2 through 10b, the main body (120b) may further include a proximity sensor (121a) and a voice pickup unit (VPU, 121b) disposed in a first side area on the outside. Additionally, the main body (120b) may further include a connector (121c), a battery protection circuit (121d), and a charging terminal (121e) disposed between a second side area on the outside and the inside. An FPCB (161) may be disposed between a metal frame (165) disposed in the inner side area of the main body (120b) and the main body (120b). The FPCB (161) may be electrically connected to the proximity sensor (121a), the voice pickup unit (VPU, 121b), the connector (121c), the battery protection circuit (121d), and the charging terminal (121e).
[0113] At least one of the conductive patterns constituting the radiator of the earbud according to the present specification may be formed on a dielectric structure. In this regard, FIGS. 11a and FIGS. 11b are drawings of a conductive pattern and an interface structure formed on an internal dielectric structure of the earbud according to the present specification, viewed from different angles. Specifically, FIGS. 11a is a drawing of a structure in which a first conductive pattern of the earbud according to the present specification is formed on a dielectric structure, viewed from different angles. Referring to FIGS. 11a, the first conductive pattern (210) may be configured such that a first conductive pattern having a first conductivity is selectively formed on a dielectric injection molded product (201) using a laser. Additionally, a second conductive pattern having a second conductivity may be formed on the first conductive pattern (210) by plating.
[0114] The signal pattern (211) of the first conductive pattern (210) formed on the front surface of the dielectric injection molded product (201) can be formed by an LDS (Laser Direct Structuring) process in which a second conductive pattern is plated onto the first conductive pattern. The ground pattern (212) of the first conductive pattern (210) formed on the back surface of the dielectric injection molded product (201) can also be formed by an LDS process in which a second conductive pattern is plated onto the first conductive pattern. In this regard, the metal material of the second conductive pattern can be determined such that the second conductivity of the second conductive pattern is higher than the first conductivity of the first conductive pattern. Accordingly, the structural stability of the conductive pattern can be improved through the first conductive pattern attached to the surface of the dielectric injection molded product (201), and the antenna efficiency can be improved through the second conductive pattern. For example, the second conductive pattern is approximately 4.1 x 10 7 It may be formed of a gold material having S / m, but is not limited thereto. The first conductive pattern is approximately 2 x 10 7 It may be formed of a metal material having S / m, but is not limited thereto. The first conductive pattern (210) can be connected to an RF cable (240) and operate as a radiator in a first frequency band.
[0115] The ground pattern of the conductive patterns formed by the LDS process constituting the radiator of the earbud according to the present specification may be configured to be electrically connected to another metal structure. In this regard, FIG. 11b shows a structure attached to the ground pattern of a first conductive pattern formed on the back surface of the dielectric structure of FIG. 11a.
[0116] Referring to FIGS. 11a and 11b, a conductive structure (213) can be attached to the ground pattern (212) of the first conductive pattern (210). Accordingly, when the ground pattern (212) of the first conductive pattern (210) is electrically connected to another metal structure, the ground characteristics can be stabilized by the conductive structure (213). The ground pattern of the first conductive pattern (210) can be attached to a ground structure inside the main body, such as a metal frame, through the conductive structure (213).
[0117] The conductive structure (213) may be implemented as a double-sided conductive tape (213a) for attaching the ground pattern (212) of the first conductive pattern (210) to another metal structure. The conductive structure (213) may be implemented to further include a conductive stiffener (213b) combined with the double-sided conductive tape (213a). In this regard, the conductive stiffener (213b) may be implemented with Steel Use Stainless (SUS), but is not limited thereto.
[0118] The RF cable (240) connected to the ground pattern (211) of the first conduction pattern (210) operates as a radiator together with the first conduction pattern (210). Accordingly, the RF cable (240) may be referred to as a ground radiator. The RF cable (240) may be formed to be separated from the main ground of the earbud structure. The RF cable (240) may be positioned so as to be spaced apart from the signal pattern (211) of the first conduction pattern (210) by a gap distance of less than or equal to a threshold. For example, the RF cable (240) may be formed to be spaced apart from the first conduction pattern (210) by about 1.1 mm to form a coupling structure.
[0119] Meanwhile, the structure in which the conductive pattern and electronic components are arranged inside the earbud according to the present specification is described in more detail. In this regard, FIGS. 12a to 12c show the structure in which the conductive pattern and electronic components are arranged inside the earbud according to the specification from different perspectives. Referring to FIGS. 10a to 12a, the FPCB (161) can be configured to be connected on a double-sided conductive tape (213a). By electrically connecting the FPCB (161) on the double-sided conductive tape (213a), grounds of different conductive patterns can be interconnected so that the ground is stabilized.
[0120] Referring to FIGS. 10a through 12b, a plurality of electronic components may be placed on an FPCB (161). For example, a microphone (161a, 161b), a charging terminal (161c), and a connector (161d) may be mounted and placed on the FPCB (161). Meanwhile, the FPCB (161) may be electrically connected to a proximity sensor (121a), a voice pickup unit (VPU, 121b), a connector (121c), and a battery protection circuit (121d). A second conductive pattern (220) with a touch sensor and a third conductive pattern (230) with a force sensor may be placed on one side and the other side, respectively, of the FPCB (161). The touch sensor and the force sensor may operate without being affected by changes in the surrounding environment due to a ground connection structure in which the FPCB (161) is connected on a double-sided conductive tape (213a).
[0121] Referring to FIGS. 4a, 4b, 7, and FIGS. 10a through 12c, the first length (L1) of the first conductive pattern (210) and the second length (L2) of the second conductive pattern (220) can be formed to be nearly similar within a predetermined range. For example, the first length (L1) of the first conductive pattern (210) can be implemented within a predetermined range based on approximately 14.8 mm. The second length (L2) of the second conductive pattern (220) can be implemented within a predetermined range based on approximately 13.6 mm. The third length (L3) of the force sensor formed in the third conductive pattern (230) can be implemented within a predetermined range based on approximately 4.2 mm. Resonance may occur at approximately 7 GHz or approximately 8 GHz due to the third length of the force sensor formed in the third conductive pattern (230).
[0122] The first conductive pattern (210) can be referred to as an LDS antenna pattern because it is formed by an LDS process. The second conductive pattern (220) can be referred to as a slide sensor because a touch sensor with a slide structure is placed thereon. The FPCB (161) can be configured to be connected to the touch sensor of the second conductive pattern (220) through a connector (241). The area of the FPCB (161) connected through the connector (241) formed at the end of the RF cable (240) can be referred to as the sensor FPCB. Accordingly, the touch sensor of the second conductive pattern (220) can be electrically connected to the FPCB (161) through the connector (241). Additionally, the force sensor of the third conductive pattern (230) can be electrically connected to the FPCB (161) through the connector (241).
[0123] Meanwhile, in the antenna structure inside the earbud according to the present specification, the antenna characteristics may change depending on the length of the touch sensor. In this regard, FIG. 13 shows the antenna reflection coefficient characteristics according to the change in the length of the touch sensor in the antenna structure inside the earbud. Referring to FIG. 13, as the second length (L2) of the second conductive pattern (220) changes from 10mm to 13.5mm, the resonant frequency in the first frequency band hardly changes. However, as the second length (L2) of the second conductive pattern (220) changes from 10mm to 13.5mm, the resonant frequency in the second frequency band shifts to a lower frequency.
[0124] Referring to FIGS. 7, FIG. 12c, and FIG. 13, the effect of the change in length of the slide touch sensor implemented as an open slot (G) is the second resonant frequency. For Bluetooth (BT) wireless communication, the length of the slide touch sensor usable for such communication must be at least about 8 mm. Considering the assembly deviation of electronic components such as FPCB, the length of the slide touch sensor can be designed to be at least 13.5 mm based on a VSWR of 2:1. Meanwhile, the larger the gap between the first and second resonant frequencies due to the position of the RF cable (240) connected to the PCB (150), the longer the slide touch sensor is required.
[0125] Referring to FIG. 12c and FIG. 13, the first conductive pattern (210) may be formed with a first length (L1) in the first axial direction of the stock. The second conductive pattern (220) may be formed with a second length (L2) in the first axial direction. The first length (L1) of the first conductive pattern (210) may be formed with a length within a predetermined range based on 14.6 mm, but is not limited thereto. The second length (L2) of the second conductive pattern (210) may be formed with a length within the range of 8 mm to 14.6 mm, but is not limited thereto. The second length (L2) of the second conductive pattern (210) may be set to maintain a VSWR of 2.5:1 or less across the entire first and second frequency bands. In this regard, the second length (L2) of the second conduction pattern (210) may be formed to a length within the range of 10 mm to 14.6 mm, but is not limited thereto. The second length (L2) of the second conduction pattern (210) may be set to maintain a VSWR of 2:1 or less across the entire first and second frequency bands. In this regard, the second length (L2) of the second conduction pattern (210) may be formed to a length within the range of 13.5 mm to 14.6 mm, but is not limited thereto.
[0126] Meanwhile, a plurality of FPCBs may be arranged inside the earbud according to the present specification. In this regard, FIGS. 14a to 14c show a structure in which a plurality of FPCBs are arranged and assembled inside the earbud according to the present specification.
[0127] FIG. 14a shows a structure in which an FPCB (161) is connected and interfaced through a first side area of a PCB (150). FIG. 14b shows a structure in which a connected FPCB (164) is connected and interfaced through a second side area of a PCB (150) in the structure of FIG. 14a. FIG. 14c shows a structure in which a second FPCB (162) is connected and interfaced through a first side area of a PCB (150) in the structure of FIG. 14b.
[0128] Referring to FIGS. 4a, 4b, 7, 10a, and 14a, a phenomenon in which radiation energy is trapped in the space between the PCB (150) and the FPCB (161) may occur. To prevent this trapping phenomenon, a gasket (163) can be filled to connect the ground structure and stabilize the ground. In this regard, the metal gasket (163) may be formed in a rectangular shape. The size of the metal gasket (163) may be 1.68 x 1.68 x 2.76 mm, but is not limited thereto.
[0129] Referring to FIGS. 4a, 4b, 7, and FIGS. 10a through 14b, a connecting FPCB (164) having a connector formed at its end can be configured to be connected to an FPCB (161). The connector of the connecting FPCB (164) can be connected to the FPCB (161) to transmit control signals from a battery power source, a speaker, a proximity sensor (121a), and a voice pickup unit (VPU, 121b). The FPCB (161) can be coupled to the battery power source, the speaker, the proximity sensor (121a), and the voice pickup unit (VPU, 121b) through the connecting FPCB (164). Accordingly, the battery power source, the speaker, the proximity sensor (121a), and the voice pickup unit (VPU, 121b) are connected, and their respective control signals can be transmitted between the FPCB (161) and the connecting FPCB (164).
[0130] Referring to FIGS. 4a, 4b, 7, and FIGS. 10a through 14c, a battery, a speaker, a proximity sensor (121a), and a voice pickup unit (VPU, 121b) may be placed on the second FPCB (162). Since the speaker is placed on the second FPCB (162) and an audio signal can be output, the second FPCB (162) may be referred to as an audio FPCB. A metal gasket (163) may be placed between the FPCB (161) and the second FPCB (162) to form a ground structure between the FPCB (161) and the second FPCB (162). In other words, the FPCB (161) and the second FPCB (162) may be configured to be connected through the metal gasket (163) to stably form a ground current formed on the ground.
[0131] The audio FPCB may be referred to as the second FPCB (162). The second FPCB (162) may be configured to accommodate a battery power source, an audio module including a speaker, a proximity sensor, and VPU units to which VPU control signals are transmitted. Meanwhile, the second FPCB (162) may have a ground pattern formed to form a stable ground current in addition to the signal pattern. The ground pattern of the second FPCB (162) may be combined with the ground pattern of the first FPCB (161) through a metal gasket (163).
[0132] Meanwhile, the mainboard PCB (150) may be implemented in the form of an FPCB. In this regard, when the mainboard PCB (150) controlling the touch sensor and force sensor is implemented as an FPCB, it may be referred to as a sensor FPCB (150) or a third FPCB (150). Accordingly, a plurality of FPCBs placed inside the earbud may include a first FPCB (161) and a second FPCB (162). When the mainboard PCB (150) is implemented as an FPCB, the plurality of FPCBs may be configured to include a first FPCB (161), a second FPCB (162), and a third FPCB (150). Meanwhile, the plurality of FPCBs may be configured to include a first FPCB (161), a second FPCB (162), and a fourth FPCB (164) which is a connecting FPCB. Additionally, the plurality of FPCBs may be configured to include the first FPCB (161), the second FPCB (162), the third FPCB (150), and the fourth FPCB (164).
[0133] Meanwhile, an FPCB may be arranged to surround a metal frame inside the earbud according to the present specification. In this regard, FIGS. 15a to 15c show a structure in which an FPCB is arranged to surround a metal frame inside the earbud according to the present specification from different angles.
[0134] Referring to FIGS. 4a, 4b, 7, and 15a, a sensor (121a), a speaker, a microphone, and a VPU (121b) can be attached to a second FPCB (162) corresponding to an audio FPCB. In this regard, the speaker frame and the second FPCB (162) can be configured to be connected to stabilize the attachment of electronic components and the ground structure. The metal frame (165) corresponding to the speaker frame and the second FPCB (162) can be connected via a double-sided conductive tape as in FIG. 15a(a) so that the grounds are mutually coupled.
[0135] Referring to FIGS. 4a, 4b, 7, and 15b, a metal frame (165) may be mounted inside the earbud. In this regard, a second FPCB (162) may be placed on the metal frame (165). The second FPCB (162) may be formed to surround the side area of the metal frame (165). Additionally, the second FPCB (162) may be extended to be placed on the front area of the metal frame (165). The second FPCB (162) may be attached to the metal frame (165) through a double-sided conductive tape (165c) on the front area of the metal frame (165).
[0136] Referring to FIGS. 4a, 4b, 7, and 15c, direct connection between ground structures is possible through a direct connection between the metal frame (165) and the second FPCB (162) corresponding to the audio FPCB. Ground stabilization is possible through this direct connection between the ground structures of the metal frame (165) and the second FPCB (162). To this end, the ground regions of the metal frame (165) and the second FPCB (162) may be connected via double-sided conductive tapes (165a, 165b), but are not limited thereto. The double-sided conductive tapes (165a, 165b) can attach the metal frame (165) and the second FPCB (162) at a point on the side region and a point on the bottom region of the metal frame (165), respectively.
[0137] The broadband antenna structure, mechanism, and fastening structure inside the earbud according to the present specification have been described above. Below, changes in antenna characteristics according to the RF cable connection point and the presence or absence of a slide touch sensor in the broadband antenna structure inside the earbud according to the present specification will be described.
[0138] In this regard, FIG. 16a shows the reflection coefficient characteristics according to a change in the RF cable connection point when a slide touch sensor corresponding to the coupling challenge pattern is not placed inside the earbud. FIG. 16b shows the reflection coefficient characteristics according to a change in the RF cable connection point when a slide touch sensor is placed inside the earbud.
[0139] Referring to FIGS. 4a, 4b, and 16a, when there is no slide touch sensor, the second frequency band of the antenna shifts to approximately 2.75 GHz, which is higher than 2.55 GHz. Additionally, when there is no slide touch sensor, the first frequency band of the antenna shifts to a frequency band lower than 2.3 GHz. Accordingly, when there is no slide touch sensor, even if the antenna structure operates as a radiator in the first and second frequency bands, the antenna radiation performance is degraded in the band between the first and second frequency bands. Meanwhile, when the end position of the RF cable (240) moves inward by 1.5 mm (Fig. 16a (b)), the first frequency band shifts to a lower frequency band.
[0140] Referring to FIGS. 4a, 4b, and 16b, when a slide touch sensor is provided, the second frequency band of the antenna is shifted to approximately 2.55 GHz. Additionally, when a slide touch sensor is provided, the first frequency band of the antenna is shifted to a higher frequency band, approximately 2.3 GHz. Accordingly, with the provision of a slide touch sensor, the antenna structure operates as a radiator across both the first and second frequency bands. Meanwhile, when the end position of the RF cable (240) is moved inward by 1.5 mm (Fig. 16b (b)), the first frequency band is shifted to a lower frequency band. Therefore, it may be advantageous for antenna operation and sensitivity reduction if the position where the RF cable (240) is connected to the PCB (150) is formed adjacent to the outer end of the PCB (150). In this regard, if a slide sensor is provided and an RF cable (240) is formed adjacent to the end, the reflection coefficient performance can be maintained at -10dB or less across the entire first and second frequency bands.
[0141] Accordingly, the positional influence of the mobile switch on the main board PCB (150) may correspond to the gap between the first and second resonances and the resonance frequency transition to a lower frequency. Due to the occurrence of an open slot mode caused by the slide sensor, electric field orthogonality of the first and second resonances is achieved. Accordingly, the formation of a current distribution capable of operating as a radiator across the entire first and second frequency bands and the synthesis between modes are achieved, thereby securing dual resonance wide band characteristics.
[0142] Meanwhile, the broadband antenna structure disposed inside the earbud according to the present specification must satisfy the antenna performance in a specific frequency band and the structural radiation performance of a different mechanical structure. In this regard, FIG. 17a shows the structural radiation performance and antenna performance by the mechanical structure in the broadband antenna structure disposed inside the earbud according to the present specification. Meanwhile, FIG. 17b shows the overall wireless performance of the broadband antenna structure disposed inside the earbud according to the present specification.
[0143] Referring to FIGS. 4a, 4b, and 17a(a), the structural radiation performance of the metal frame (165) and the plurality of FPCBs (161, 162, 164) has a high efficiency of -4dB or higher in the Bluetooth operating band. In this regard, a degradation in structural radiation performance may occur due to the metal frame (165) and the plurality of FPCBs (161, 162, 164). Referring to FIGS. 4a, 4b, and 17a(b), the antenna structure resonates in the first frequency band by the first conductive pattern (210) and the RF cable (240), and in the second frequency band by the first and second conductive patterns (210, 220), respectively. Therefore, through the dual-mode antenna structure, it can operate as an antenna in a band other than the Bluetooth operating band.
[0144] An earbud having a dual-mode antenna structure can be combined with surrounding components to maintain the structural and functional stability of the antenna. As shown in FIGS. 4a and 4b, FPCBs (161, 162, 164) placed inside the earbud can be implemented to surround the space between the metal frame (165) and the battery, rather than in a standardized shape. Accordingly, internal components such as the VPU (121b), proximity sensor (121a), connector (121c), and battery protection circuit (121d) of FIG. 10b can be combined and supported at specific locations by the FPCBs (161, 162, 164) placed to surround the metal frame (165).
[0145] The FPCBs (161, 162, 164) may have variable shapes, and thus wireless performance may not be consistent due to changes in spacing between them and surrounding components. In this regard, a radiation energy trap phenomenon may occur in the space between the FPCBs (161, 162, 164), the battery, the metal frame (165), and the PCB (150). Meanwhile, the energy trap phenomenon may change depending on the shape of the FPCBs (161, 162, 164), and the antenna resonance frequency may also change as a result. To minimize this change in antenna resonance frequency, a conductive tape and a gasket (164) may be placed at appropriate locations where the FPCBs (161, 162, 164) are joined together or joined to the metal frame (165). By utilizing these conductive tapes and gaskets (164), changes in wireless performance due to deformation of the FPCBs (161, 162, 164) can be minimized.
[0146] Referring to FIGS. 4a, 4b, and 17b, the overall wireless performance efficiency, taking into account both structural radiation performance and antenna performance, has a value greater than a reference value in both the Bluetooth operating band and the entire frequency band including it, i.e., the first and second frequency bands. In this regard, the overall wireless performance efficiency has a value of -5dB or higher in the entire frequency band including 2.3 GHz to 2.55 GHz. Accordingly, even if there are manufacturing errors in the antenna and mechanism and performance deviations due to earbud usage, a wireless signal can be received stably through the earbud.
[0147] In summary, to compensate for frequency band variations in structural radiation efficiency characteristics as shown in FIG. 17a (a), the dual-mode radiator structure is formed with a coupling structure between the first and second conduction patterns (210, 220). Through the open slot structure between the first and second conduction patterns (210, 220), the degradation of wireless performance due to energy trapping in the FPCB structure can be compensated for. In this regard, as shown in FIG. 17a (b), the antenna efficiency can maintain a constant value in a wide band of 2.3 to 2.6 GHz, including the Bluetooth band. Accordingly, as shown in FIG. 17b, the overall efficiency according to the antenna structure and the overall mechanical structure in the Bluetooth band can maintain a constant value. Additionally, in a wide band of 2.3 to 2.55 GHz, including the Bluetooth band, the overall efficiency can maintain a value above a specific level (e.g., -5 dB).
[0148] The broadband antenna structure disposed inside the earbud according to the present specification utilizes a conductive pattern of a sensor and a mechanical structure such as a metal frame as part of the radiator, in addition to the conductive pattern as a radiator. Accordingly, the broadband antenna structure disposed inside the earbud corresponds to a broadband sensor-fusion type zero-volume antenna in which antenna performance is secured up to the Bluetooth band, as well as bands lower and higher than the Bluetooth band.
[0149] The multimode antenna structure placed inside these earbuds secures broadband antenna performance, such as an antenna bandwidth five times wider than the Bluetooth bandwidth, thereby maintaining stable antenna performance under various user scenario conditions. In this regard, structural radiation performance based on the mechanism and PCB structure can be implemented to have a high radiation efficiency of at least -6dB and an average of -5dB across the entire band.
[0150] The above describes an earbud having a broadband antenna structure according to the present specification. The following describes an electronic device having an antenna provided inside a dielectric housing according to the present specification. In this regard, an electronic device having an antenna provided inside a dielectric housing according to the present specification is described with reference to FIGS. 1 to 17b.
[0151] The electronic device (100) may include a dielectric housing (120) having a main body portion (120b) having a port (120a) and a protruding portion extending from the main body portion (120b). The electronic device (100) may include an antenna (200) disposed within the protruding portion to radiate a wireless signal to the outside of the electronic device. The antenna (200) may include a first conductive pattern (210) formed on a first surface within the protruding portion and a second conductive pattern (220) formed on a second surface perpendicular to the first surface. The antenna (200) may include a connection portion (240) configured to electrically connect the first conductive pattern (210) and the first conductive pattern (210) to the PCB (150). The connection portion (240) may be implemented as an RF cable, but is not limited thereto.
[0152] The first conduction pattern (210) and the connection part (240) may be configured to radiate a signal in a first frequency band. The first conduction pattern (210) and the second conduction pattern (220) may be configured to radiate a signal in a second frequency band different from the first frequency band.
[0153] The electronic device (100) may further include a printed circuit board (PCB) (150) configured to be electrically connected to an antenna (200). The PCB (150) may correspond to a mainboard PCB that controls various electronic components of the earbud. The connection part (240) may be composed of a coaxial cable comprising a signal line (241) formed on the inside, a dielectric (242) formed to surround the signal line (241), and a ground (243) formed on the outside to surround the dielectric (242). The signal line of the coaxial cable may be connected to a first conductive pattern (210), and the ground of the coaxial cable may be configured to be connected to the ground of the PCB (150). The first conductive pattern (210) and the ground of the coaxial cable (240) that is connected to the first conductive pattern (210) and arranged horizontally may radiate a first signal in a first frequency band and operate as a radiator.
[0154] The second challenge pattern (220) may be configured to include a touch sensor. The first challenge pattern (210) may be formed with a first length (L1) in the first axial direction of the stock (122), and the second challenge pattern (220) may be formed with a second length (L2) in the first axial direction. The first length (L1) of the first challenge pattern (210) may be formed with a length within a predetermined range based on 14.6 mm. The second length (L2) of the second challenge pattern (220) may be formed with a length within a predetermined range based on 13.6 mm. The first frequency band may be a frequency band having a center frequency of 2.3 GHz to perform Bluetooth communication with an electronic device, and the second frequency band may be a frequency band having a center frequency of 2.6 GHz to perform Bluetooth communication.
[0155] A first conductive pattern (210) formed on a first surface and a coaxial cable (240) formed on the first surface may be configured to radiate a first signal in a first frequency band. A second conductive pattern (220) formed on a second surface perpendicular to the first surface and the first conductive pattern (210) may be configured to radiate a second signal in a second frequency band.
[0156] The above describes wireless earbuds equipped with a broadband antenna. The technical and structural features of such wireless earbuds equipped with a broadband antenna can be summarized as follows, but are not limited thereto.
[0157] In this regard, wireless earbuds may also be referred to as TWS (Truly Wireless Stereo). TWS, such as wireless earbuds, may experience significant wireless performance degradation in early products due to manufacturing issues. Furthermore, compared to other product categories, TWS is more susceptible to wireless performance degradation due to characteristics such as dropping the product or frequent movement during use. Therefore, the antenna placed inside the wireless earbud needs to be designed with an operating bandwidth that is as wide as possible relative to the minimum bandwidth required for Bluetooth (BT) wireless communication. Wireless earbuds equipped with an antenna structure designed with such a wide operating bandwidth relative to the minimum bandwidth can operate robustly against the aforementioned issues.
[0158] A broadband antenna structure is presented having a connection structure configured to be connected to a coupling conduction pattern and a main conduction pattern according to the present specification. The broadband antenna structure according to the present specification is designed to have a bandwidth of approximately 0.4 to 0.5 GHz, which is about 4 to 5 times wider than a bandwidth of about 80 MHz or about 0.1 GHz. Accordingly, the broadband antenna structure according to the present specification can operate robustly against the aforementioned issues.
[0159] As described above, since the broadband antenna structure according to the present specification has wide operating bandwidth characteristics, the reliability of wireless performance of TWS products adopting such a broadband antenna structure can be improved. Furthermore, to ensure high wireless performance and reliability when this broadband antenna structure is applied to TWS products, LDS-based antenna process technology can be introduced through differentiated process technology. Additionally, compared to conventional antenna structures, an integrated functional antenna module based on sensor fusion can be provided through a conductive pattern in which a sensor module is arranged and a coupling structure. Moreover, TWS products adopting the broadband antenna structure according to the present specification can secure enhanced wireless performance with the highest wireless communication reliability compared to all TWS product families.
[0160] Meanwhile, the structural and technical features of the dual-mode antenna structure and mechanical structure formed inside the earbud according to the present specification can be formed as an optimal antenna structure and mechanical coupling structure to overcome the following problems.
[0161] 1) Compared to general wireless devices, earbuds are formed with a structure that facilitates the trapping of radiated energy. Therefore, in the radiation structure where the antenna is formed, null frequency bands may occur at least at 2 to 3 points. In this regard, wireless performance degradation due to energy trapping may occur depending on the coupling structure between the FPCB and the battery, between the FPCB and the metal frame, and between the main board PCB and the battery.
[0162] 2) Compared to general wireless devices, assembly deviations in earbuds can directly and significantly affect antenna matching performance and structural radiation performance. Therefore, by implementing a dual-mode broadband antenna according to the present specification, the degradation of antenna matching performance caused by assembly deviations can be minimized.
[0163] 3) A design that minimizes structural radiation performance caused by assembly deviations is possible by securing open slot areas of the PCB and ensuring electrical connection reliability through stable contact between multiple components.
[0164] 3) The reason metal frames are not used in electronic devices such as earbuds is that they significantly affect structural radiation performance. To overcome the degradation of structural radiation performance caused by such metal frames, an antenna structure is required that can achieve a wideband while maintaining antenna performance while adopting a metal frame mechanism structure. To this end, the radiator structure of the coupling coupling structure according to the present specification and the coupling structure between the FPCB and the metal frame are very important elements.
[0165] Meanwhile, the technical effects of wireless earbuds equipped with a broadband antenna can be summarized as follows, but are not limited thereto.
[0166] According to the present specification, a broadband antenna in an electronic device, such as a wireless earbud, can be configured to operate in a broadband manner.
[0167] According to the present specification, the operating bandwidth of the antenna can be increased by coupling the current formed in the conductive pattern of the antenna provided in the wireless earbud to the touch sensor.
[0168] According to the present specification, when wearing wireless earbuds, wireless signals can be stably received even when the antenna resonance frequency changes due to human movement or movement of the wireless earbuds within the space inside the ear.
[0169] According to the present specification, changes in antenna performance due to the narrow antenna placement space placed inside the mechanism of the wireless earbud can be minimized, thereby stably maintaining wireless communication performance.
[0170] Further scopes of the applicability of the present invention will become apparent from the following detailed description. However, since various changes and modifications within the spirit and scope of the present invention are clearly understood by those skilled in the art, specific embodiments, such as the detailed description and preferred embodiments of the present invention, should be understood as being given merely as examples.
[0171] Further scopes of the applicability of the present invention will become apparent from the following detailed description. However, since various changes and modifications within the spirit and scope of the present invention are clearly understood by those skilled in the art, specific embodiments, such as the detailed description and preferred embodiments of the present invention, should be understood as being given merely as examples.
[0172] In relation to the present invention described above, the antenna structure disposed in the wireless earbud and the control operation thereon may be implemented using software, firmware, or a combination thereof. Meanwhile, the configuration performing the control operation thereon and the antenna structure disposed in the wireless earbud can be implemented as computer-readable code on a medium on which a program is recorded. A computer-readable medium includes all types of recording devices in which data readable by a computer system is stored. Examples of computer-readable media include HDD (Hard Disk Drive), SSD (Solid State Disk), SSD (Silicon Disk Drive), ROM, RAM, CD-ROM, magnetic tape, floppy disk, optical data storage device, etc., and also include implementations in the form of a carrier wave (e.g., transmission over the Internet). Furthermore, the computer may include a control unit of the terminal or wireless earbud, i.e., a processor. Accordingly, the above detailed description should not be interpreted restrictively in all respects and should be considered exemplary. The scope of the present invention shall be determined by a reasonable interpretation of the appended claims, and all modifications within the equivalent scope of the present invention are included within the scope of the present invention.
Claims
Claim 1 An earbud comprising: a housing having a main body portion having a speaker port and a stoke extending from the main body portion; a radiator disposed within the stoke for radiating a wireless signal to the outside of the earbud; and a printed circuit board (PCB) configured to be electrically connected to the radiator, wherein the radiator comprises: a first conductive pattern formed on a first surface within the stoke; a second conductive pattern formed on a second surface perpendicular to the first surface and spaced apart from one end of the first conductive pattern; and a connecting portion configured to electrically connect the first conductive pattern and the PCB, wherein the first conductive pattern and the connecting portion are configured to radiate a signal in a first frequency band, and the first conductive pattern and the second conductive pattern are configured to radiate a signal in a second frequency band different from the first frequency band. Claim 2 In claim 1, the connection portion comprises a coaxial cable including a signal line formed on the inner side, a dielectric formed to surround the signal line, and a ground formed on the outer side to surround the dielectric, wherein the signal line of the coaxial cable is connected to the first conductive pattern, the ground of the coaxial cable is connected to the ground of the PCB, and the first conductive pattern and the ground of the coaxial cable connected to the first conductive pattern radiate a first signal in the first frequency band and operate as a radiator, an earbud. Claim 3 In claim 2, the second conductive pattern includes a touch sensor, the first conductive pattern is formed with a first length in the first axial direction of the stock, and the second conductive pattern is formed with a second length in the first axial direction, an earbud. Claim 4 In claim 3, the first conductive pattern formed on the first surface and the coaxial cable formed on the first surface are configured to radiate a first signal in the first frequency band, and the second conductive pattern formed on the second surface perpendicular to the first conductive pattern and the first surface is configured to radiate a second signal in the second frequency band, and the first direction of the first current formed on the first conductive pattern and the coaxial cable of the first surface and the second direction of the second current formed on the second conductive pattern of the second surface perpendicular to the first surface are formed orthogonally, so that the radiator operates broadband in the first frequency band and the second frequency band, and the first frequency band is a frequency band having a center frequency of 2.3 GHz to perform Bluetooth communication with an electronic device, and the second frequency band is a frequency band having a center frequency of 2.6 GHz to perform Bluetooth communication, characterized in that the earbud. Claim 5 An earbud according to claim 1, characterized in that the current formed in the first conductive pattern is coupled to the second conductive pattern in the second frequency band. Claim 6 The earbud according to claim 2, wherein the radiator further comprises a third conductive pattern formed on a third surface facing the second conductive pattern, the third conductive pattern disposed on the third surface comprises a force sensor, the third conductive pattern is configured to radiate a signal in a third frequency band higher than the second frequency band, and the third frequency band is a 5GHz band or a 7GHz band for Bluetooth communication. Claim 7 The earbud according to claim 2, wherein the signal pattern of the first conductive pattern is formed as a conductive pattern of a predetermined shape to radiate a signal in the first frequency band and the second frequency band, the ground pattern of the first conductive pattern is electrically connected to the ground of the coaxial cable, and the signal pattern of the second conductive pattern is formed as a conductive pattern of a predetermined shape to radiate a signal in the second frequency band and operate as a touch sensor, and the ground pattern of the second conductive pattern is electrically connected to the ground of the coaxial cable. Claim 8 An earbud according to claim 6, characterized in that the signal pattern of the third conductive pattern is formed as a conductive pattern of a predetermined shape to operate as a force sensor, and the ground pattern of the second conductive pattern is electrically connected to the ground of the coaxial cable. Claim 9 The earbud according to claim 1 further comprises a flexible printed circuit board (FPCB) configured to connect the PCB and the first conductive pattern, wherein the FPCB is formed to surround a metal frame forming an inner side area formed by a curved surface of the main body, the main body further comprises a proximity sensor and a voice pickup unit (VPU) disposed in an outer first side area, and a connector and a battery protection circuit disposed between the outer second side area and the inner side, and the FPCB disposed between the metal frame disposed in the inner side area of the main body and the main body is electrically connected to the proximity sensor, the VPU, the connector, and the battery protection circuit. Claim 10 The earbud according to claim 9, further comprising: a second FPCB connected to one end of the FPCB and disposed in the inner side area; and a metal gasket configured such that the ground pattern of the FPCB and the ground pattern of the second FPCB are connected to the metal frame. Claim 11 delete Claim 12 delete Claim 13 delete Claim 14 delete Claim 15 delete Claim 16 delete Claim 17 delete Claim 18 delete Claim 19 delete Claim 20 delete
Citation Information
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