Foldable electronic device with heat radiant structure

Abstract

According to various embodiments of the present invention, a heat dissipation structure of a foldable electronic device may be disclosed. An electronic device according to various disclosed embodiments comprises: a housing including a first housing portion, a second housing portion, and a hinge housing portion disposed at least partially between the first housing portion and the second housing portion; a hinge assembly received in the housing and coupled to the first housing portion and the second housing portion; a flexible display received in the first housing portion and the second housing portion; a first printed circuit board received in the first housing portion; a second printed circuit board received in the second housing portion; and a flexible printed circuit board (FPCB) disposed at least partially between the hinge housing portion and the flexible display and electrically connecting the first printed circuit board and the second printed circuit board. and includes a first part attached to the flexible printed circuit board and a second part configured to receive heat from a first component on the first printed circuit board, and includes a heat transfer sheet disposed at least partially between the hinge housing part and the flexible display, and heat from the first component on the first printed circuit board can be transferred at least partially to the second housing part via the heat transfer sheet.

Description

Technology Field

[0001] Various embodiments of the present invention relate to a heat dissipation structure for a foldable electronic device. Background Technology

[0003] With the advancement of digital technology, electronic devices are being provided in various forms, such as smartphones, tablet PCs, and PDAs. Electronic devices are being developed in portable or wearable forms to enhance portability and user accessibility.

[0004] Recently, portable electronic devices such as smartphones and tablet PCs are becoming lighter and thinner for portability and are striving for development in various ways for ease of use. In particular, foldable electronic devices equipped with flexible displays are gaining popularity as devices that satisfy consumer preferences, as they provide a relatively larger screen than conventional bar-type electronic devices, while their size is reduced when folded, thereby improving portability.

[0005] A foldable electronic device includes a flexible display and a plurality of housings, and the plurality of housings and the flexible display are connected while supported by a hinge assembly, and the housings can be rotated within a specified range according to user operation. Through the process of rotating the plurality of housings, the electronic device can be switched from a folded state to an unfolded state or from an unfolded state to a folded state. The problem to be solved

[0007] However, in a foldable electronic device, heat generated from at least one heating element mounted on a printed circuit board placed in the housing may not be able to be dissipated to the outside, so the heat generated from the heating element may remain trapped inside the housing.

[0008] According to various embodiments of the present invention, an electronic device is provided that includes at least one heat dissipation structure that provides a heat transfer path capable of transferring heat from a heating element contained within a housing to the outside in a closed or open state of the foldable electronic device. means of solving the problem

[0010] According to various embodiments of the present invention, a foldable electronic device comprises: a housing including a first housing portion, a second housing portion, and a hinge housing portion disposed at least partially between the first housing portion and the second housing portion; a hinge assembly received in the housing and coupled to the first housing portion and the second housing portion; a flexible display received in the first housing portion and the second housing portion; a first printed circuit board received in the first housing portion; a second printed circuit board received in the second housing portion; and a flexible printed circuit board (FPCB) disposed at least partially between the hinge housing portion and the flexible display and electrically connecting the first printed circuit board and the second printed circuit board. and includes a first part attached to the flexible printed circuit board and a second part configured to receive heat from a first component on the first printed circuit board, and includes a heat transfer sheet disposed at least partially between the hinge housing part and the flexible display, and heat from the first component on the first printed circuit board can be transferred at least partially to the second housing part via the heat transfer sheet.

[0011] According to various embodiments of the present invention, a foldable electronic device comprises: a first housing including at least one first component; a second housing including at least one second component; and a hinge assembly rotatably connecting the first housing and the second housing; a hinge housing that accommodates the hinge assembly, includes one end and the other end, and is disposed between the first and second housings; a flexible display disposed across the hinge assembly from one area of ​​the first housing to at least one area of ​​the second housing, and capable of being folded according to the rotation; a first plate disposed between the flexible display and the first housing, at least a portion of which supports the flexible display; and a second plate disposed between the flexible display and the second housing, at least a portion of which supports the flexible display. and may include at least one heat transfer member disposed between the first plate and the hinge housing, thermally connected to one end of the hinge housing, and transferring heat generated from the first component to the one end of the hinge housing. Effects of the invention

[0013] According to various embodiments of the present invention, heat generated within the housing of a foldable electronic device can be transferred to the outside by a heat dissipation structure, thereby providing operational stability of the foldable electronic device and preventing burns caused by heat that a user may experience. Brief explanation of the drawing

[0015] FIG. 1 is a block diagram of an electronic device in a network environment (100) according to various embodiments. FIG. 2 is a drawing illustrating the unfolded state of an electronic device according to various embodiments. FIG. 3 is a drawing illustrating the folding state of an electronic device according to various embodiments. FIG. 4 is an exploded perspective view of an electronic device according to various embodiments. FIG. 5a is a plan view showing an electronic device including a heat dissipation structure according to various embodiments. FIG. 5b is a plan cross-sectional view showing an electronic device including a heat dissipation structure according to various embodiments, schematically shown by cutting along line A-A' of FIG. 5a. FIG. 6 is an exemplary diagram schematically illustrating a first heat dissipation structure providing a first heat transfer path according to various embodiments. FIG. 7 is an exemplary diagram schematically illustrating a second heat dissipation structure providing a second heat transfer path according to various embodiments. FIG. 8a is a front view showing a hinge housing according to various embodiments. FIG. 8b is a rear view showing a hinge housing according to various embodiments. FIG. 9a is a plan view showing the state before and after mounting the first and fourth heat transfer members on the first and second plates according to various embodiments. FIG. 9b is a plan view showing the mounting state of the first and fourth heat transfer members on the first and second plates according to various embodiments. FIG. 10 is a cross-sectional view showing an electronic device including a heat dissipation structure according to various embodiments. FIG. 11a is a plan view showing first and second plates according to various embodiments. FIG. 11b is a plan view showing the state in which the first and fourth heat transfer members are respectively arranged on the first and second plates according to various embodiments. FIG. 12 is a cross-sectional view showing the mounting state of a heat transfer sheet according to various embodiments. FIG. 13a is a plan view showing a heat transfer sheet according to various embodiments with an electronic device mounted thereon. FIG. 13b is a plan view showing a state in which a heat transfer sheet according to various embodiments is placed on the first and second plates. FIG. 14 is a cross-sectional view showing the mounting state of a heat transfer sheet according to various embodiments. FIG. 15a is a plan view showing a heat transfer sheet according to various embodiments. FIG. 15b is a side view showing a heat transfer sheet according to various embodiments. FIG. 16a is a plan view showing different heat transfer sheets according to various embodiments. FIG. 16b is a side view showing different heat transfer sheets according to various embodiments. FIG. 17a is a plan view showing different heat transfer sheets according to various embodiments. FIG. 17b is a side view showing different heat transfer sheets according to various embodiments. FIG. 18a is a plan view showing different heat transfer sheets according to various embodiments. FIG. 18b is a side view showing different heat transfer sheets according to various embodiments. FIG. 19a is a side view showing a heat dissipation structure of an electronic device in an unfolded state according to various embodiments. FIG. 19b is a side view showing a heat dissipation structure of an electronic device in a folded state according to various embodiments. FIG. 20 is a side view showing different heat dissipation structures of an electronic device in a folded state according to various embodiments. FIG. 21 is a plan view showing a state in which a heat transfer member is placed between the movable structures of the first and second plates according to various embodiments. FIG. 22 is a cross-sectional view showing a heat dissipation structure of an electronic device according to various embodiments. FIG. 23 is an exemplary diagram schematically showing the fabrication process of a fiber sheet containing heat dissipation particles according to various embodiments. FIG. 24 is a microscopic view of a fiber sheet containing heat dissipation particles fabricated according to various embodiments. Specific details for implementing the invention

[0016] Hereinafter, various embodiments of the present disclosure are described with reference to the accompanying drawings. However, this is not intended to limit the present disclosure to specific embodiments and should be understood to include various modifications, equivalents, and / or alternatives to the embodiments of the present disclosure. In connection with the description of the drawings, similar reference numerals may be used for similar components.

[0017] An electronic device according to various embodiments of the present disclosure may include, for example, at least one of a smartphone, a tablet personal computer, a mobile phone, a video phone, an e-book reader, a desktop personal computer, a laptop personal computer, a netbook computer, a workstation, a server, a personal digital assistant (PDA), a portable multimedia player (PMP), an MP3 player, a mobile medical device, a camera, or a wearable device (e.g., smart glasses, a head-mounted device (HMD)), electronic clothing, an electronic bracelet, an electronic necklace, an electronic appcessory, an electronic tattoo, a smart mirror, or a smart watch).

[0018] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments.

[0019] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input device (150), sound output device (155), display device (160), audio module (170), sensor module (176), interface (177), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., display device (160) or camera module (180)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components may be implemented as a single integrated circuit. For example, the sensor module (176) (e.g., fingerprint sensor, iris sensor, or ambient light sensor) may be implemented embedded in the display device (160) (e.g., display).

[0020] The processor (120) can, for example, execute software (e.g., program (140)) to control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can load commands or data received from other components (e.g., sensor module (176) or communication module (190)) into volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) and an auxiliary processor (123) (e.g., graphics processing unit, image signal processor, sensor hub processor, or communication processor) that can operate independently or together with it. Additionally or generally, the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0021] The auxiliary processor (123) can control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display device (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)).

[0022] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0023] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0024] The input device (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input device (150) may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus pen).

[0025] The sound output device (155) can output a sound signal to the outside of the electronic device (101). The sound output device (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback, and the receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0026] The display device (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display device (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display device (160) may include a touch circuitry configured to detect a touch, or a sensor circuitry configured to measure the intensity of the force generated by said touch (e.g., a pressure sensor).

[0027] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through an input device (150) or output sound through an audio output device (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) that is directly or wirelessly connected to the electronic device (101).

[0028] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0029] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0030] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0031] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0032] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0033] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) may be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0034] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0035] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi Direct, or IrDA (infrared data association)) or a second network (199) (e.g., a cellular network, the Internet, or a long-range communication network such as a computer network (e.g., LAN or WAN). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify and authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0036] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module may include a single antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas. In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., an RFIC) may be additionally formed as part of the antenna module (197).

[0037] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0038] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the electronic devices (102, 104) may be the same or different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the request may perform at least part of the requested function or service, or additional functions or services related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the above result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, or client-server computing technology may be used.

[0040] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0041] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., first) component is referred to as “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., by wire), wirelessly, or through a third component.

[0042] As used in this document, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0043] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' merely means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and this term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0044] According to one embodiment, the method according to the various embodiments disclosed herein may be provided as included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0045] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities. According to various embodiments, one or more of the components or operations described above may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to the integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0047] FIG. 2 is a drawing illustrating an unfolded state of an electronic device (200) according to one embodiment, and FIG. 3 is a drawing illustrating a folded state of an electronic device (200) according to one embodiment.

[0048] Referring to FIGS. 2 and 3, an electronic device (200) according to one embodiment (e.g., the electronic device (101) of FIG. 1) may include a foldable housing (210), a hinge housing (410) covering a foldable portion of the foldable housing (210), a flexible or foldable display (230) disposed within a space formed by the foldable housing (210) (hereinafter abbreviated as "display" (230)), and a protective member (240) disposed on the display (230).

[0049] In the present disclosure, the surface on which the display (230) is placed is defined as the first surface or the front surface of the electronic device (200). Additionally, the surface opposite to the aforementioned front surface is defined as the second surface or the rear surface of the electronic device (200), and the surface surrounding the space between the front surface and the rear surface is defined as the third surface or the side surface of the electronic device (200).

[0050] A foldable housing (210) according to one embodiment may include a first housing (211), a second housing (212) including a sensor area (250), a first rear cover (213), and a second rear cover (214). A foldable housing (210) of an electronic device (200) according to various embodiments is not limited to the shape and / or combination shown in FIGS. 2 and 3, and may be implemented by other shapes or combinations and / or combinations of parts. In one example, the first housing (211) and the first rear cover (213) may be formed integrally, and the second housing (212) and the second rear cover (214) may be formed integrally.

[0051] According to one embodiment (e.g., FIG. 2, FIG. 3), the first housing (211) and the second housing (212) may be arranged on both sides of the folding axis (A-axis) and may be formed in a shape that is symmetrical overall with respect to the folding axis (A-axis). The angle or distance between the first housing (211) and the second housing (212) may vary depending on whether the state of the electronic device (200) is an unfolded state (or "flat state"), a folded state, or an intermediate state, and a detailed explanation thereof will be provided later.

[0052] A second housing (212) according to one embodiment may additionally include a sensor area (250) in which various sensors are arranged, unlike the first housing (211), but the first housing (211) and the second housing (212) may be formed in a mutually symmetrical shape in an area other than the sensor area (250) described above.

[0053] As illustrated in FIG. 2, a first housing (211) and a second housing (212) according to one embodiment may together form a recess that accommodates a display (230). The recess may have two different widths in a direction perpendicular to the folding axis (A-axis) due to a sensor area (250) disposed in one area of ​​the second housing (211).

[0054] In one example, the recess may have a first width (w1) between a first part (211a) parallel to the folding axis (A-axis) of the first housing (211) and a first part (212a) formed at the edge of the sensor area (250) of the second housing (212). In another example, the recess may have a second width (w2) formed by a second part (212b) parallel to the folding axis (A-axis) of the first housing (211) and a second part (212b) parallel to the folding axis (A-axis) that does not correspond to the sensor area (250) of the second housing (212). In this case, the second width (w2) may be formed to be longer than the first width (w1). In other words, the first part (211a) of the first housing (211) and the first part (212a) of the second housing (212), having mutually asymmetrical shapes, can form the first width (w1) of the recess, and the second part (211b) of the first housing (211) and the second part (212b) of the second housing (212), having mutually symmetrical shapes, can form the second width (w2) of the recess. The distances from the folding axis (A-axis) of the first part (212a) and the second part (212b) of the second housing (212) described above may differ from each other. However, the width of the recess is not limited to the embodiment shown in FIG. 2. For example, depending on the shape of the sensor area (250) placed in the second housing structure (212) or the asymmetrical shape of the first housing (211) and the second housing (212), the recess may have multiple widths.

[0055] According to one embodiment, at least a portion of the first housing (211) and the second housing (212) may be formed of a metal or non-metal material having a specified size of rigidity to support the display (230).

[0056] According to one embodiment, the sensor area (250) may be formed to have a predetermined area adjacent to one corner (e.g., top corner) of the second housing (212). However, the arrangement, shape, and / or size of the sensor area (250) are not limited to the embodiment shown in FIG. 2. As an example, the sensor area (250) may be placed at another corner (e.g., bottom corner) of the second housing (212) or in any area between the top corner and the bottom corner. Components for performing various functions embedded in the electronic device (200) may be exposed to the front of the electronic device (200) through the sensor area (250) or through one or more openings provided in the sensor area (250). According to one embodiment, the above-described components may include various types of sensors, and the sensors may include, as an example, at least one of a front camera, a receiver, or a proximity sensor, but are not limited thereto.

[0057] A first rear cover (213) according to one embodiment may be positioned on one side of the folding axis (A-axis) of the rear of the electronic device (200) (e.g., the right side of the folding axis (A-axis)). The first rear cover (213) may have a substantially rectangular periphery as an example, and the periphery may be enclosed by a first housing (211). Similarly, a second rear cover (214) according to one embodiment may be positioned on the other side of the folding axis (A-axis) of the rear of the electronic device (200) (e.g., the left side of the folding axis (A-axis)), and the periphery may be enclosed by a second housing (212).

[0058] Referring to FIGS. 2 and 3, the first rear cover (213) and the second rear cover (214) may be formed in a substantially symmetrical shape with respect to the folding axis (A-axis). However, the first rear cover (213) and the second rear cover (214) are not necessarily formed in mutually symmetrical shapes, and according to the embodiment, the electronic device (200) may include the first rear cover (213) and the second rear cover (214) of various shapes. According to another embodiment, the first rear cover (213) may be formed integrally with the first housing (211), and the second rear cover (214) may be formed integrally with the second housing (212).

[0059] According to one embodiment, the first rear cover (213), the second rear cover (214), the first housing (211), and the second housing (212) may form a space in which various components of the electronic device (200) (e.g., a printed circuit board, or a battery) may be placed. According to one embodiment, at least one component may be placed or visually exposed on the rear of the electronic device (200). In one example, at least a portion of the sub-display (230a) may be visually exposed through the first rear area (213a) of the first rear cover (213). In another embodiment, one or more components or sensors may be visually exposed through the second rear area (214a) of the second rear cover (214). In this case, the sensor may include, as an example, a proximity sensor and / or a rear camera, but is not limited thereto.

[0060] Referring to FIG. 3, the hinge housing (410) may include a curved surface and may be configured to be positioned between the first housing (211) and the second housing (212) to cover a component (e.g., a hinge structure) placed inside the electronic device (200). According to one embodiment, the hinge housing (410) may be covered by a part of the first housing (211) and the second housing (212) or exposed outside the electronic device (200) depending on the state of the electronic device (200) (e.g., an unfolded state or a folded state).

[0061] In one example (e.g., see FIG. 2), when the electronic device (200) is in an unfolded state, the hinge housing (410) may be covered by the first housing (211) and the second housing (212) and not exposed.

[0062] In another example (e.g., see FIG. 3), when the electronic device (200) is in a folded state (e.g., a fully folded state), the hinge housing (410) described above may be exposed to the outside between the first housing (211) and the second housing (212).

[0063] In another example (not shown), when the first housing (211) and the second housing (212) are in an intermediate state where they are folded with a certain angle, the hinge housing (410) may be partially exposed to the outside between the first housing (211) and the second housing (212). However, when the electronic device (200) is in an intermediate state, the area of ​​the hinge housing (410) exposed to the outside of the electronic device (200) may be smaller than the area exposed when the electronic device (200) is in a completely folded state.

[0064] A display (230) according to one embodiment may be placed on a space formed by a foldable housing (210). In one example, the display (230) may be seated on a recess formed by the foldable housing (210) to constitute most of the front surface of the electronic device (200). The display (230) may mean a display in which at least some area can be deformed into a flat or curved surface.

[0065] A display (230) according to one embodiment may include a folding area (233), a first area (231) positioned on one side (e.g., the left side of the folding area (233) shown in FIG. 2) relative to the folding area (233), and a second area (232) positioned on the other side (e.g., the right side of the folding area (233) shown in FIG. 2) relative to the folding area (223). However, the division of the areas of the display (230) shown in FIG. 2 is merely exemplary, and the display (230) may be divided into a plurality of areas (e.g., two or four or more) depending on the structure or function. According to one embodiment (e.g., see FIG. 2), the area of ​​the display (230) may be divided by a folding area (233) extending parallel to the y-axis or a folding axis (A-axis), but according to another embodiment, the area of ​​the display (230) may be divided based on a different folding area (e.g., a folding area parallel to the x-axis) or a different folding axis (e.g., a folding axis parallel to the x-axis).

[0066] The first region (231) and the second region (232) described above may have a shape that is symmetrical overall with respect to the folding region (233). However, unlike the first region (231), the second region (232) may include a cut notch region as a sensor region (250) exists, but the second region (232) may have a shape that is symmetrical to the first region (231) in areas other than the aforementioned notch region. That is, the first region (231) and the second region (232) may include a part that has a shape that is symmetrical to each other and a part that has a shape that is asymmetrical to each other.

[0067] A protective member (240) according to one embodiment may be attached to at least one area of ​​a foldable housing (210) to protect the display (230) from external impact. The protective member (240) may be formed along the periphery of the display (230) to prevent the first area (231) and the second area (232) of the display (230) from coming into contact when the electronic device (200) is in a folded state.

[0068] According to one embodiment, the protective member (240) may include a first protective member (241) formed along a portion of the top edge, left edge, and bottom edge of the display (230), and a second protective member (242) formed along a portion of the top edge, right edge, and bottom edge of the display (230). According to one embodiment, the first protective member (241) and the second protective member (242) may be formed as a band structure in the shape of a "C" overall, but are not limited thereto. Additionally, although FIG. 2 shows the protective member (240) including the first protective member (241) and the second protective member (242), it is not limited thereto, and according to the embodiment, the protective member (240) may include a plurality (e.g., 4 or 6) of protective members.

[0069] The first protective member (241) and the second protective member (242) may be positioned at a distance apart as shown in FIG. 2. The total length of the display (230) when the electronic device (200) is in a folded state may be reduced compared to the total length of the display (230) when it is in an unfolded state due to the folding area (233). However, the first protective member (241) and the second protective member (242) are positioned at a distance apart so as to prevent the end of the first protective member (241) and the end of the second protective member (242) facing the first protective member (241) from overlapping when the electronic device (200) is in a folded state.

[0070] According to one embodiment, the first protective member (241) and the second protective member (242) may have a shape that is symmetrical overall with respect to the folding area (233). However, the second protective member (242) may include an exposure area (242a) for exposing the sensor area (250) to the outside of the electronic device (200), and the first protective member (241) and the second protective member (242) may have an asymmetrical shape due to the exposure area (242a). The second protective member (242) described above may have a shape that is symmetrical to the first protective member (241) in an area other than the exposure area (242a). That is, the first protective member (241) and the second protective member (242) may include a part that has a shape that is symmetrical to each other and a part that has an asymmetrical shape.

[0071] According to one embodiment, the first protective member (241) may be formed integrally with the first housing (211), and similarly, the second protective member (242) may be formed integrally with the second housing (212). However, the arrangement and / or coupling structure of the first protective member (241) and the second protective member (242) are not limited thereto, and according to an embodiment, the first protective member (241) and the second protective member (242) may not be coupled to a portion of the first housing (211) and / or the second housing (212) but may be attached to the display (230).

[0072] According to the above configuration, the front of the electronic device (200) may include a display (230), a protective member (240) disposed on the display (230) and formed along the edge of the display (230), a portion of a first housing (211) adjacent to the display (230), and a portion of a second housing (212). Additionally, the rear of the electronic device (200) may include a first rear cover (213), a portion of a first housing (211) adjacent to the first rear cover (213), a second rear cover (214), and a portion of a second housing (212) adjacent to the second rear cover (214).

[0073] Below, the operation of the first housing (211) and the second housing (212) and each area of ​​the display (230) according to the state of the electronic device (200) (e.g., unfolded state and folded state) will be described.

[0074] According to one embodiment (e.g., see FIG. 2), when the electronic device (200) is in an unfolded state, the first housing (211) and the second housing (212) may be positioned to face in the same direction at an angle of 180˚. The surface of the first region (231) and the surface of the second region (232) of the display (230) may form an angle of 180˚ with each other and may face in the same direction (e.g., the front direction of the electronic device). The folding region (233) may form a plane with the first region (231) and the second region (232). In one example, the first protective member (241) may be positioned on the region corresponding to the first region (231) of the display (230), and the second protective member (242) may be positioned on the region corresponding to the second region (232) of the display (230). That is, when the electronic device (200) is in an unfolded state, the first protective member (241) and the second protective member (242) may face in the same direction.

[0075] According to another embodiment (e.g., see FIG. 3), when the electronic device (200) is in a folded state, the first housing (211) and the second housing (212) may be positioned to face each other. The surface of the first region (231) and the surface of the second region (232) of the display (230) may face each other, forming a narrow angle (e.g., between 0 and 10 degrees). The folding region (233) may be formed of a curved surface having at least a portion of a predetermined curvature. The surfaces of the first protective member (241) positioned in the region corresponding to the first region (231) of the display (230) and the second protective member (242) positioned in the region corresponding to the second region (232) may be in a state of contact with each other. In one example, the first area (231) and the second area (232) of the display (230) may not come into direct contact with each other by means of the first protective member (241) and the second protective member (242). If the first area (231) and the second area (232) come into direct contact, friction may be generated between the first area (231) and the second area (232) of the display (230) by an external impact (e.g., a fall). The friction generated between the first area (231) and the second area (232) may damage the surface of the first area (231) and / or the second area (232). On the other hand, an electronic device (200) according to one embodiment can prevent the first region (231) and the second region (232) from coming into contact through the first protective member (241) and the second protective member (242), and as a result, when the electronic device (200) is in a folded state, it can prevent damage to a part of the display (230) due to external impact.

[0076] According to another embodiment (not shown), when the electronic device (200) is in an intermediate state, the first housing (211) and the second housing (212) may be positioned at a certain angle to each other. In the above-described case, the first protective member (241) and the second protective member (242) may also be positioned to form a certain angle to each other. The surface of the first region (231) and the surface of the second region (232) of the display (230) may form an angle that is larger than the folded state and smaller than the unfolded state. The folding region (233) may be formed of a curved surface having at least a certain curvature, and the curvature may be smaller than in the folded state.

[0077] Although only an embodiment in which the electronic device (200) is folded in the vertical direction (e.g., the y direction in FIG. 3) has been mentioned above, the embodiments of the present disclosure are not limited to the embodiments described above. Although not illustrated in the drawings, an electronic device (200) according to another embodiment may be folded in the horizontal direction based on a virtual folding axis (not shown) extended in the horizontal direction (e.g., the x direction in FIG. 2 and FIG. 3).

[0079] FIG. 4 is an exploded perspective view of an electronic device (200) according to one embodiment.

[0080] Referring to FIG. 4, an electronic device (200) according to one embodiment (e.g., the electronic device (200) of FIG. 2 and FIG. 3) may include a first protective member (241) (e.g., the first protective member (241) of FIG. 2), a second protective member (242) (e.g., the second protective member (242) of FIG. 2), a display (230) (e.g., the display (230) of FIG. 2), a first support plate (261), a second support plate (262), a protective layer (300) (or "protective sheet"), a first bracket (215), a second bracket (216), a foldable housing (210) (e.g., the foldable housing (210) of FIG. 2 and FIG. 3), and / or a connecting structure (400). At least one of the components of the electronic device (200) of FIG. 4 may be identical or similar to at least one of the components of the electronic device of FIG. 2 and / or FIG. 3, and redundant descriptions below will be omitted.

[0081] According to one embodiment, the first protective member (241) and the second protective member (242) are attached to at least one area of ​​the foldable housing (210) to protect at least a portion of the top surface of the display (230) (e.g., the surface in the z direction of FIG. 4) from external impact. According to another embodiment, the first protective member (241) and the second protective member (242) may be formed integrally with the first housing (211) and the second housing (212) of the foldable housing (210), respectively. In one example, the first protective member (241) may be positioned along the left edge of the display (230) (e.g., the -x direction of FIG. 4) with respect to the center of the display (230), and the second protective member may be positioned along the right edge of the display (230) (e.g., the x direction of FIG. 4).

[0082] According to one embodiment, the display (230) may be formed of a plurality of layers. The display (230) may include, for example, a protective film layer, a polarizing layer, a thin film encapsulation layer, a pixel layer, a TFT (thin film transistor) layer, and / or a cushion layer. The display (230) may emit light from the pixel layer to convey information to a user, and the light emitted from the pixel layer may be transmitted to the outside of the electronic device (200). The display (230) may include a folding area (233), a first area (231) located to the left (e.g., the -x direction of FIG. 4) relative to the folding area (233), and a second area (232) located to the right (e.g., the x direction of FIG. 4) relative to the folding area (233). The above-described first area (231), folding area (233), and second area (232) may be arranged to face the same direction when the electronic device (200) is in an unfolded state. Conversely, when the electronic device (200) is in a folded state, at least a portion of the folding area (233) of the display (230) may be bent, and accordingly, the first area (231) and the second area (232) may be positioned to face each other.

[0083] According to one embodiment, the first support plate (261) and the second support plate (262) may be attached to at least a portion of the bottom surface of the display (230) (e.g., the surface in the -z direction of FIG. 4) to support a portion of the display (230). In one example, the first support plate (261) may be attached to a first portion (231) of the display (230) to support at least a portion of the display (230). Similarly, the second support plate (262) may be attached to a second portion (232) of the display (230) to support at least a portion of the display (230).

[0084] In one example, a portion of the first support plate (261) may be attached to the first portion (231) of the display (230), while another portion may not be attached to the first portion (231) of the display (230). Additionally, a portion of the second support plate (262) may be attached to the second portion (232) of the display (230), while another portion may not be attached to the second portion (232) of the display (230). Through the structure described above, a portion of the first support plate (261) and a portion of the second support plate (262) may be separated from the display (230) during the process in which the electronic device (200) rotates from an unfolded state (e.g., see FIG. 2) to a folded state (e.g., see FIG. 3). Accordingly, as the electronic device (200) rotates from an unfolded state (e.g., see FIG. 2) to a folded state (e.g., see FIG. 3), a portion of the display (230) (e.g., a folding area (233)) may be exposed between the first support plate (261) and the second support plate (262). However, a detailed explanation thereof will be provided later.

[0085] According to one embodiment, the first support plate (261) and the second support plate (262) are formed of a material having a specified rigidity so as to support at least one area of ​​the display (230). For example, the first support plate (261) and the second support plate (262) may be formed of a metal (e.g., SUS) material. However, they are not limited thereto, and according to another embodiment, the first support plate (261) and the second support plate (262) may be formed of a polymer.

[0086] According to one embodiment, the protective layer (300) may be located between the first support plate (261), the second support plate (262), and the connecting structure (400). As previously described, as the electronic device (200) rotates from an unfolded state to a folded state, a portion of the first support plate (261) and the second support plate (262) is separated from the display (230), thereby forming a certain space between the first support plate (261) and the second support plate (262). The protective layer (300) according to one embodiment can prevent external foreign substances (e.g., dust) from entering the aforementioned certain space as the electronic device (200) rotates from an unfolded state to a folded state. Accordingly, the protective layer (300) can prevent defects in the display (230) caused by external foreign substances, and a detailed explanation thereof will be provided later.

[0087] According to one embodiment, the first bracket (215) and the second bracket (216) are disposed within the foldable housing (210) to support components (e.g., electronic components) of the electronic device (200). In one example, the first bracket (215) may be disposed within the first housing (211), and the second bracket (216) may be disposed within the second housing (212). The first bracket (215) and the second bracket (216) described above may be disposed within the first housing (211) and the second housing (212), respectively, to provide a space in which electronic components (e.g., wiring members, printed circuit boards) for implementing various functions of the electronic device (200) can be mounted. Additionally, the first bracket (215) and the second bracket (216) can support a portion of the display (230) that is not supported by the first support plate (261) and / or the second support plate (262).

[0088] According to one embodiment, the foldable housing (210) may include a first housing (211), a second housing (212), a first rear cover (not shown) (e.g., the first rear cover (213) of FIG. 2), and a second rear cover (not shown) (e.g., the second rear cover (214) of FIG. 2). In one example, the foldable housing (210) may form the side and / or rear of the electronic device (200). A space may be formed inside the above-described foldable housing (210) so that components of the electronic device (200) (e.g., a battery (270), a printed circuit board (280)) may be placed within the above-described space of the foldable housing (210). In one example, the first rear cover may be attached to at least one area of ​​the first housing (211), and the second rear cover may be attached to at least one area of ​​the second housing (212). In another example, the first housing (211) and the first rear cover may be formed integrally, and the second housing (212) and the second rear cover may also be formed integrally.

[0089] According to one embodiment, the battery (270) is a device for supplying power to at least one component of the electronic device (200) and may be disposed in a space formed inside the foldable housing (210) described above. The battery (270) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell, but is not limited thereto.

[0090] According to one embodiment, a printed circuit board (280) may be placed in a space formed inside a foldable housing (210), and components for implementing various functions of an electronic device (200) may be mounted on the printed circuit board (280). For example, a processor (e.g., processor (120) of FIG. 1), a communication module (e.g., communication module (190) of FIG. 1), a memory (e.g., memory (130) of FIG. 1)), etc. may be mounted on the printed circuit board (280).

[0091] According to one embodiment, a connecting structure (400) may be disposed between the first housing (211) and the second housing (212). The connecting structure (400) may rotatably connect the first housing (211) and the second housing (212), and through the connecting structure (400), the first housing (211) and the second housing (212) may rotate within a specified rotation angle range.

[0092] According to one embodiment, the connection structure (400) may be a hinge assembly. The hinge assembly may include, for example, a hinge housing (410) (e.g., the hinge housing (410) of FIG. 3), at least one hinge module (420), a first plate (431), and a second plate (432).

[0093] In one example, the hinge housing (410) may be fixed to at least one area of ​​the foldable housing (210) through a fixing member (e.g., a screw). The hinge housing (410) may be positioned between the first housing (211) and the second housing (212) to cover or protect the hinge module (420) positioned inside the hinge housing (410) from external impact. According to one embodiment, the hinge housing (410) may be covered by a part of the first housing (211) and the second housing (212) or exposed outside the electronic device (200) depending on the state of the electronic device (200) (e.g., unfolded state or folded state). In one example (e.g., see FIG. 2), when the electronic device (200) is in an unfolded state, the hinge housing (410) may be covered by the first housing (211) and the second housing (212) and not exposed. In another example (e.g., see FIG. 3), when the electronic device (200) is in a folded state (e.g., a fully folded state), the hinge housing (410) may be exposed to the outside between the first housing (211) and the second housing (212).

[0094] In one example, at least one hinge module (420) can rotatably connect the first housing (211) and the second housing (212). Through the at least one hinge module (420), the first housing (211) and the second housing (212) can rotate within a specified range of rotation angles, and as a result, the electronic device (200) can rotate from a folded state to an unfolded state, or conversely, from an unfolded state to a folded state. At least one hinge module (420) may include, for example, a first hinge module that causes the display (230) to bend or fold along a designated rotational trajectory during the rotation of the electronic device (200), a second hinge module that assists the rotation of the first housing (211) and the second housing (212), and a third hinge module that fixes the movement of the first housing (211) and the second housing (212) within a designated rotational angle (e.g., 180˚) and / or a designated rotational angle range (e.g., 30˚ to 60˚). However, it is not limited to the above-described embodiment, and according to other embodiments, at least one hinge module (420) may further include other hinge modules in addition to the first hinge module, the second hinge module, and the third hinge module.

[0095] In one example, the first plate (431) and the second plate (432) may be positioned on the hinge housing (410) so as to face the display (230) to form one side of the hinge assembly (e.g., the side in the z-direction of FIG. 4). At least one hinge module (420) may be positioned within the space formed by the first plate (431), the second plate (432), and the hinge housing (410). An opening (433, 434) may be formed in at least one area of ​​the first plate (431) and the second plate (432), and at least one hinge module (420) disposed within the space formed by the first plate (431), the second plate (432), and the hinge housing (410) may be electrically connected to a printed circuit board and / or battery disposed within the foldable housing (210) through the aforementioned opening (433, 434). In one example, an electrical connection means (e.g., a flexible printed circuit board (FPCB)) electrically connected to at least one hinge module (420) may pass through the opening (433, 434) formed in the first plate (431) and the second plate (432) to be electrically connected to a printed circuit board and / or battery disposed within the foldable housing (210).

[0096] Although not illustrated in the drawings, the connection structure (400) according to another embodiment may be a multi-joint structure. In one example, the multi-joint structure may include a plurality of joint portions arranged in a continuous manner, and the first housing (211) and the second housing (212) may be rotatably connected through at least one joint portion described above. In one example, an inclined surface (or inclined portion) may be formed in at least one region of the plurality of joint portions, and the first housing (211) and the second housing (212) may rotate within a specified rotation angle range as the inclined surfaces formed in the plurality of joint portions come into close contact with each other. However, a detailed description of the embodiment in which the connection structure (400) is a multi-joint structure will be provided later.

[0097] Referring to FIGS. 5a and 5b, an electronic device (500) according to one embodiment may be the same electronic device as the electronic device (100) shown in FIG. 1 or the electronic device (200) shown in FIGS. 2 to 4.

[0098] According to one embodiment, the electronic device (500) may have a hinge housing (410) disposed between the first and second housings (211, 212) made of a metal material having excellent heat transfer properties, so that heat generated in the first housing (211) may be transferred to the hinge housing (410), heat generated in the second housing (212) may be transferred to the hinge housing (410), or heat generated in the first housing (211) may be transferred to the second housing (212). Heat generated in the second housing (212) may be transferred to the first housing (211). The hinge housing (410) may function as a protective member protecting the hinge assembly and as a heat transfer member transferring heat generated from a heating element. For example, the hinge housing (410) may include a lightweight aluminum material among metal materials.

[0099] According to one embodiment, the electronic device (500) may include at least one heat dissipation structure. According to one embodiment, the heat dissipation structure may transfer heat generated from at least one first heating element, such as first and second electronic components (p1, p2), disposed in the first housing (211), to the hinge housing (410), or dissipate heat generated from at least one second heating element, such as a battery (270), disposed in the second housing (212), toward the hinge housing (410), or dissipate heat generated from the first and second electronic components (p1, p2) toward the second housing (212). According to one embodiment, the heat dissipation structure may include a first heat radiant structure that provides a first heat transfer path for transferring heat generated from first and second electronic components (p1, p2) to a hinge housing (410), and a second heat radiant structure that provides a second heat transfer path for transferring heat transferred to the hinge housing (410) to a second housing (212).

[0100] According to one embodiment, the first heating element may include a first printed circuit board (280) and at least one first and second electronic component (p1, p2) disposed on the first printed circuit board (280). For example, the first and second electronic component (p1, p2) may be one or more of an application processor (AP) (e.g., processor (120)), a central processing unit (CPU) (e.g., processor (120)), or a radio frequency (RF) unit (e.g., communication module (190)).

[0101] According to one embodiment, the first heat dissipation structure may be disposed between the first and second electronic components (p1, p2) and the hinge housing (410) and may be laminated between the first plate (431) and the first back cover (213). According to one embodiment, the first heat dissipation structure may include at least one heat transfer member (51, 52, 53) or a heat transfer material (56, 57, 58). According to one embodiment, the heat transfer member may include a first heat transfer member (51) that transfers heat generated from the first and second electronic components (p1, p2) to the hinge housing (410). According to one embodiment, the first heat transfer member (51) may overlap with at least a portion of the first plate (431) and may be disposed facing it. For example, the first heat transfer member (51) may include a sheet of copper, a plate of copper, or a graphite sheet.

[0102] According to one embodiment, the first heat transfer member (51) can be thermally connected to the first and second electronic components (p1, p2) using the third heat transfer member (53), the first heat transfer material (56), the second heat transfer material (57), or the third heat transfer material (58) to transfer heat generated from the first and second electronic components (p1, p2) to the hinge housing (410). Being thermally connected may mean that a heat transfer path is formed.

[0103] According to one embodiment, the first heat dissipation structure may include a second heat transfer member (52). According to one embodiment, the second heat transfer member (52) is positioned between the first heat transfer member (51) and the hinge housing (410) so as to be thermally connected to a portion of the first heat transfer member (51) and the hinge housing (410), respectively. According to one embodiment, the second heat transfer member (52) can transfer heat transferred from the first heat transfer member (51) to a portion (4101) of the hinge housing (410). For example, the second heat transfer member (52) may include a heat transfer tape or a thermal interfacing material (TIM). For example, a portion of the first heat transfer member (51), the second heat transfer member (52), and a portion of the hinge housing (410) may be arranged in a stacked state.

[0104] According to one embodiment, the first heat transfer member (51) may include a third heat transfer member (53) that is thermally connected. The third heat transfer member (53) is positioned between the first electronic components (p1, p2) and the first heat transfer member (51) so as to transfer heat generated from the first electronic components (p1, p2) to the first heat transfer member (51). For example, the third heat transfer member (53) may include either a vapor chamber or a heat pipe.

[0105] According to one embodiment, a first thermal interfacing material (56) (TIM; thermal interfacing material) may be placed between the third thermal transfer member (53) and the first electronic component (p1). For example, the first thermal interfacing material (56) may be placed in a way that fills a gap between the third thermal transfer member (53) and the first electronic component (p1). The first thermal interfacing material (56) transfers heat generated from the first electronic component (p1) to the third thermal interfacing member (53) and may include an adhesive function and a support function. For example, the first thermal interfacing material (56) may include a thermal transfer double-sided tape.

[0106] According to one embodiment, a second heat transfer material (57) may be further disposed between the third heat transfer member (53) and the second electronic component (p2). For example, the second electronic component (p2) may include a shield can(s) for electromagnetic shielding and may include an RF part (e.g., a communication module (190)) disposed in the space inside the shield can(s). According to one embodiment, the second heat transfer material (57) may transfer heat generated in the shield can(s) to the third heat transfer member (53). According to one embodiment, the first heat transfer member (51) may be thermally connected to the first electronic component (p1) or the second electronic component (p2) through the first and second (56, 57) heat transfer materials without the third heat transfer member (53). For example, the second heat transfer material (57) may include a heat transfer double-sided tape.

[0107] According to one embodiment, a third heat transfer material (58) may be additionally disposed between the first heat transfer member (51) and the third heat transfer member (53). According to one embodiment, the third heat transfer material (58) may be thermally connected to the first heat transfer member (51) and the third heat transfer member (53), respectively. The third heat transfer material (58) may transfer heat transferred to the third heat transfer member (53) to the first heat transfer member (51) and cause the first and third heat transfer members (51, 53) to be attached to each other. For example, the third heat transfer material (58) may include a heat transfer double-sided tape.

[0108] Referring to FIG. 6, the first heat transfer path provided by the first heat dissipation structure (D1) according to one embodiment is as follows. According to one embodiment, the heat generated from the first electronic component (p1) flows in the order of the first heat transfer material (56), the third heat transfer member (53), the third heat transfer material (58), the first heat transfer member (51), and the second heat transfer member (52) and can be transferred to one end (4101) of the hinge housing (410). The heat transferred to the one end (4101) of the hinge housing (410) can be transferred to the other end (4102) of the hinge housing (410). Finally, a portion of the heat transferred to the one end (4101) of the hinge housing (410) can be transferred to the second housing (212), and the remaining portion can be released to the outside through the hinge housing (410).

[0109] Referring again to FIG. 5a, heat transferred to the other end (4102) of the hinge housing (410) according to one embodiment can be transferred toward the second housing (212) by the second heat dissipation structure. According to one embodiment, the second heat dissipation structure may include a fourth heat transfer member (54) disposed between the second plate (432) and the other end (4102) of the hinge housing (410). According to one embodiment, the second heat dissipation structure may include a fifth heat transfer member (55) between the fourth heat transfer member (54) and the other end (4102) of the hinge housing (410). According to one embodiment, the second heat dissipation structure may include a fourth heat transfer material (59) between the fourth heat transfer member (54) and the support member (216). According to one embodiment, the fourth heat transfer member (54) can transfer heat transferred from the other end (4102) of the hinge housing (410) to a heat transfer member or support member (216) (e.g., bracket) placed in the second hinge housing (410).

[0110] According to one embodiment, a fifth heat transfer member (55) may be included between the fourth heat transfer member (54) and the other end (4102) of the hinge housing (410). According to one embodiment, the fifth heat transfer member (55) may be thermally connected to the fourth heat transfer member (54) and the other end (4102) of the hinge housing (410), respectively. According to one embodiment, the fifth heat transfer member (55) may be a heat transfer material or a heat transfer double-sided tape, and a plurality of them may be arranged along the other end (4102) of the hinge housing (410).

[0111] According to one embodiment, a fourth heat transfer material (59) may be further disposed between the fourth heat transfer member (54) and the support member (216). According to one embodiment, the fourth heat transfer material (59) is thermally connected to the fourth heat transfer member (54) and the support member (216) and may be attached to each of the fourth heat transfer member (54) and the support member (216). For example, the fourth heat transfer material (59) may include a flexible transfer double-sided tape.

[0112] Referring to FIG. 7, the second heat transfer path provided by the second heat dissipation structure (D2) according to one embodiment is as follows. According to the second heat transfer path according to one embodiment, heat transferred to one end (4101) of the hinge housing (410) can be transferred in the order of the other end (4102) of the hinge housing (410), the fifth heat transfer member (55), the fourth heat transfer member (54), the fourth heat transfer material (59), and the support member (216). The support member (216) can be replaced with another heat transfer member.

[0113] Referring to FIG. 8a and FIG. 8b, a hinge housing (410) according to one embodiment has a cross-section in the shape of the letter C and may be a cover that protects a hinge assembly (e.g., a hinge module (420) shown in FIG. 4) and is exposed or hidden depending on whether the electronic device (500) is folded or unfolded. According to one embodiment, the hinge housing (410) may be made of metal, and at least a part or all of it may be made of metal. According to one embodiment, the hinge housing (410) may be disposed between first and second housings (211, 212) and may include an end portion (4101) connected to the first housing (211) and a other end portion (4102) connected to the second housing that is opposite to the end portion (4101). According to one embodiment, one end (4101) and the other end (4102) of the hinge housing (410) may each include a plurality of first and second regions (a1, a2) for arranging the second row transfer member (52) and the fifth row transfer member (55).

[0114] According to one embodiment, the second row transfer member (52) may be arranged along a plurality of first regions (a1) along one end (4101), and the fifth row transfer member (55) may be arranged along a plurality of second regions (a2) along the other end (4102). According to one embodiment, the first regions (a1) may be spaced apart, and the second regions (a2) may also be spaced apart. For example, each of the first regions (a1) or the second regions (a2) may be a flat region.

[0115] Referring to FIG. 9a, a heat dissipation structure according to one embodiment may include a first heat transfer member (51) positioned facing a first plate (431) and a fourth heat transfer member (54) positioned facing a second plate (432). The first heat transfer member (51) shown in FIG. 9a has the same configuration as the first heat transfer member (51) shown in FIG. 5, and the fourth heat transfer member (54) may have the same structure as the fourth heat transfer member (54) shown in FIG. 5. In FIG. 9a, the first and second plates (431, 432) at the top are a drawing of the state before the first and fourth heat transfer members are combined, and the first and second plates (431, 432) at the bottom are a drawing of the state in which the first and fourth heat transfer members are combined.

[0116] According to one embodiment, the first heat transfer member (51) has an area sufficient to substantially cover the first plate (431), and can be omitted in the area of ​​the first opening (433) through which the flexible circuit board passes. According to one embodiment, a plurality of second heat transfer members (52) can be attached spaced apart to one end of the first heat transfer member (51).

[0117] According to one embodiment, the fourth heat transfer member (54) has an area sufficient to substantially cover the second plate (432), and the area of ​​the second opening (434) through which the flexible circuit board passes can be omitted. According to one embodiment, a plurality of fifth heat transfer members (55) can be attached spaced apart to one end of the fourth heat transfer member (54).

[0118] Referring to FIG. 9b, the first heat transfer member (51) according to one embodiment may have a different structure compared to the first heat transfer member (51) shown in FIG. 9a. For example, a part of the first heat transfer member (51) may be additionally removed in a part corresponding to a part of a plurality of holes (h) formed in the first plate (431).

[0119] Referring to FIG. 10, a hinge housing (410) according to one embodiment may be formed from a combination of at least two materials. For example, the hinge housing (410) may be formed mostly from a synthetic resin portion (4100), while the first portion (4103) in contact with the second heat transfer member (52) and the second portion (4104) in contact with the fourth heat transfer member (54) may each be formed from a material with a high heat transfer rate. For example, the material with a high heat transfer rate may include aluminum.

[0120] Referring to FIG. 11a and FIG. 11b, according to one embodiment, when looking at the first and second plates (431, 432) on the foldable display (230), the first portion (4103) may be formed along the longitudinal direction of the hinge housing (410) at least once in the end portions of the first plate (431), and the second portion (4104) may be formed along the longitudinal direction of the hinge housing (410) at least once in the end portions of the second plate (432).

[0121] According to one embodiment, heat can be transferred from the second heat transfer member (52) to the first part (4103), and heat can be transferred from the fourth heat transfer member (54) to the second part (4104).

[0122] Referring to FIGS. 12, 13a, and 13b, a heat transfer sheet (64) (heat transfer sheet or thermal sheet) according to one embodiment may be placed along a connection structure through which a flexible printed circuit board (62) (FPCB; flexible printed circuit board) passes. According to one embodiment, the heat transfer sheet (64) may share a path through which the flexible printed circuit board (62) passes. According to one embodiment, the flexible printed circuit board (62) may be an electrical connection member that electrically connects a first printed circuit board (280) placed in a first housing (211) and a second printed circuit board (282) placed in a second housing (212). For example, the heat transfer sheet (64) may be a graphite sheet.

[0123] According to one embodiment, the heat transfer sheet (64) is positioned facing the flexible circuit board (62) so that heat generated from the first electronic component (p) positioned on the first printed circuit board (280) can be transferred to the fourth heat transfer member (54) positioned on the second housing (212). According to one embodiment, the heat transfer sheet (64) may be positioned on the folding portion (620) of the flexible circuit board (62) with the same width size as the flexible circuit board (62).

[0124] According to one embodiment, the heat transfer sheet (64) may be thermally connected to the third heat transfer member (53) at one end by the heat transfer material (61) and thermally connected to the fourth heat transfer member (54) at the other end by the heat transfer material (63). For example, heat generated from the first printed circuit board (280) may be transferred to the fourth heat transfer member (54) through the heat transfer material (61), the third heat transfer member (53), and the heat transfer sheet (64).

[0125] Referring to FIG. 14, a heat transfer sheet (65) according to one embodiment may have at least a portion laminated with a flexible circuit board (64). According to one embodiment, the portion of the heat transfer sheet (65) passing through the hinge housing (410) may be laminated with the flexible circuit board (62). For example, the method of lamination may utilize an attachment method. According to one embodiment, the heat transfer sheet (65) may be assembled when assembling the flexible circuit board (62).

[0126] According to one embodiment, since the remaining structure of the heat transfer sheet (65) is identical to the heat transfer sheet (64) shown in FIG. 12 and FIG. 13, a detailed description is omitted to avoid duplication.

[0127] Below, the structure of the heat transfer sheet will be described with reference to FIGS. 15a to 18b.

[0128] Referring to FIG. 15a and FIG. 15b, a heat transfer sheet (66) according to one embodiment may be a heat transfer sheet (64) shown in FIG. 12, FIG. 13a, and FIG. 13b, and a heat transfer sheet (65) shown in FIG. 14.

[0129] According to one embodiment, the heat transfer sheet (66) may be formed from a single material. For example, the heat transfer sheet (66) may include a graphite material.

[0130] Referring to FIGS. 16a and 16b, a heat transfer sheet (67) according to one embodiment may be at least a part of the heat transfer sheet (64) shown in FIGS. 12, 13a, and 13b, and at least a part of the heat transfer sheet (65) shown in FIG. 14.

[0131] According to one embodiment, the heat transfer sheet (67) may be formed in multiple layers of heterogeneous materials. Accordingly, the heat transfer sheet (67) may be referred to as a heat transfer composite sheet. According to one embodiment, the heat transfer sheet (67) may include a flexible material layer (670) and first and second graphite sheets (671, 672) respectively attached to one side and the other side of the flexible material layer (670). According to one embodiment, the heat transfer sheet (67) may have multiple gaps (g1, g2) formed in the folding portion (6700) to overcome the difference in elongation rate of the first and second graphite sheets (671, 672) due to folding. According to one embodiment, a first graphite sheet (671) may have a plurality of first gaps (g1) spaced apart in the folding portion, and a second graphite sheet (672) may have a plurality of second gaps (g2) spaced apart in the folding portion.

[0132] According to one embodiment, the thickness of each first and second graphite sheet (671, 672) may be approximately between 17 μm and 70 μm.

[0133] According to one embodiment, the size of each first gap (g1) may be approximately between 0.2 mm and 0.3 mm, and the size of each second gap (g2) may be approximately between 0.2 mm and 0.3 mm. For example, the distance between each first gap (g1) may be the same, and the distance between each second gap (g2) may be the same.

[0134] Referring to FIG. 17a and FIG. 17b, a heat transfer sheet (68) according to one embodiment may be a heat transfer sheet (64) shown in FIG. 12, FIG. 13a and FIG. 13b and a heat transfer sheet (65) shown in FIG. 14.

[0135] According to one embodiment, the heat transfer sheet (68) may be formed in multiple layers of heterogeneous materials. Accordingly, the heat transfer sheet (68) may be referred to as a heat transfer composite sheet. According to one embodiment, the heat transfer sheet (68) may include a copper material layer (680) and first and second graphite sheets (681, 682) respectively attached to one side and the other side of the copper material layer (680). According to one embodiment, the copper material layer (680) may have multiple gaps (g3) formed in the folding portion. According to one embodiment, the multiple gaps (g3) may be formed spaced apart.

[0136] Referring to FIG. 18a and FIG. 18b, a heat transfer sheet (69) according to one embodiment may be the heat transfer sheet shown in FIG. 12 and FIG. 13 and the heat transfer sheet shown in FIG. 14.

[0137] According to one embodiment, the heat transfer sheet (69) may be formed in multiple layers of heterogeneous materials. Accordingly, the heat transfer sheet (69) may be referred to as a heat transfer composite sheet. According to one embodiment, the heat transfer sheet (69) may include a copper material layer (690) and first and second graphite sheets (691, 692) respectively attached to one side and the other side of the copper material layer (690). According to one embodiment, the heat transfer sheet (69) may have multiple gaps (g4, g5) formed in the folding portion (6900) to overcome the difference in elongation rate of the first and second graphite sheets (691, 692) due to folding. According to one embodiment, a first graphite sheet (691) may have a plurality of first gaps (g4) spaced apart in the folding portion, and a second graphite sheet (692) may have a plurality of second gaps (g5) spaced apart in the folding portion.

[0138] Referring to FIG. 19a and FIG. 19b, an electronic device (700) according to one embodiment may include a heat dissipation structure that provides first and second heat transfer paths for transferring heat generated from a heating element in an unfolded state and a folded state, respectively. According to one embodiment, the heat dissipation structure may include first and second plates (431, 432), a hinge housing (410), first and fourth heat transfer members (51, 54), and first to fourth heat transfer materials (71, 72, 73, 74).

[0139] According to one embodiment, the first and second plates (431, 432) and the hinge housing (410) may be identical to the first and second plates (431, 432) and the hinge housing (410) shown in FIG. 5a. According to one embodiment, the first heat transfer member (51) may be coupled to the first plate (431) facing it and rotate together, and the fourth heat transfer member (54) may be positioned to the second plate (432) facing it and rotate together.

[0140] Referring to FIG. 19a, according to one embodiment, when the electronic device (700) is in a 180-degree unfolded state, the hinge housing (410) is positioned between the first and second plates (431, 432), and one end (4101) may be thermally connected to the first plate (431) by a first heat transfer material (71), and the other end (4102) may be thermally connected to the second plate (432) by a second heat transfer material (72). Depending on the unfolding of the electronic device (500), a heat transfer path may be provided. The heat transferred to the first heat transfer member (51) is transferred to one end (4101) of the hinge housing (410) through the first heat transfer material (71), the heat transferred to the one end (4101) is transferred to the other end (4012) through the hinge housing (410), and the heat transferred to the other end (410) can be transferred to the fourth heat transfer member (54) through the second heat transfer material (72).

[0141] Referring to FIG. 19b, according to one embodiment, when the electronic device (700) is in a folded state, the first heat transfer member (51) may be thermally connected to the first part (4105) of the hinge housing (410) by the third heat transfer material (73), and the fourth heat transfer member (54) may be thermally connected to the second part (4106) by the fourth heat transfer material (74). Depending on the folding of the electronic device (500), a heat transfer path may be provided. The heat transferred to the first heat transfer member (51) is transferred to the first part (4105) of the hinge housing (410) through the third heat transfer material (73), the heat transferred to the first part (4105) is transferred to the second part (4106) through the hinge housing (410), and the heat transferred to the second part (4106) can be transferred to the fourth heat transfer member (54) through the fourth heat transfer material (74).

[0142] Referring to FIG. 20, the heat dissipation structure according to one embodiment differs only in the structure of the hinge housing (410) compared to the heat dissipation structure shown in FIG. 19a and FIG. 19b, and the rest of the structure is the same, so in order to avoid duplication, a detailed description of the rest of the structure is omitted.

[0143] A hinge housing (410) according to one embodiment may be formed from a combination of heterogeneous materials. According to one embodiment, a heat transfer material layer (75) may be formed inside the hinge housing (410), for example, a graphite sheet may be attached or a nanofiber coating layer may be applied. When the electronic device (700) is folded, a third heat transfer material (73) may be thermally connected to the heat transfer material layer (75) at one end of the hinge housing (410), and a fourth heat transfer material (74) may be thermally connected to the heat transfer material layer (75) at the other end of the hinge housing (410). For example, when the electronic device (700) is folded, the heat transfer material layer (75) provides a heat transfer path, so that heat transferred from the first heat transfer member (51) can be transferred to the fourth heat transfer member (74) via the third heat transfer material (73), the heat transfer material layer (75), and the fourth heat transfer material (74).

[0144] Referring to FIG. 21, according to various embodiments, first and fourth heat transfer members (51, 54) are disposed on first and second plates (431, 432) and may be disposed between movable structures (m1, m2, m3) on first and second plates (431, 432). According to one embodiment, the first and fourth heat transfer members (51, 54) may be disposed on a flat surface between the movable structures (m1, m2, m3) of first and second plates and utilized as a heat transfer structure.

[0145] According to one embodiment, a heat transfer material (510, 540) is disposed on a portion of each of the first and fourth heat transfer members (51, 54) disposed between the movable structures (m1, m2, m3), and the heat transfer material (510, 540) may be thermally connected to the hinge housing (410). For example, the heat transfer material (510, 540) may include a heat transfer double-sided tape.

[0146] According to one embodiment, first and fourth heat transfer members (51, 54) placed between movable structures (m1, m2, m3) (e.g., hinge springs or hinge cams of a hinge assembly) can reduce or eliminate the step between the movable structures. For example, FIG. 21 illustrates a structure in which four heat transfer materials (510, 540) are respectively placed between three movable structures (m1, m2, m3).

[0147] Referring to FIG. 22, in an electronic device (800) in an unfolded state, according to one embodiment, a heat dissipation structure can transfer heat to a hinge housing (410) using a fiber containing heat dissipation particles. The hinge housing (410) has fiber layers disposed at each end to prevent foreign matter from entering the first and second housings, and by applying thermal particles to these fiber layers, the fiber layers can be utilized as heat transfer members.

[0148] According to one embodiment, the heat dissipation structure may include a first heat transfer metal plate (81) disposed facing the first back cover (213) and a first heat transfer fiber layer (82) disposed between the first heat transfer metal plate (81) and the hinge housing (410). According to one embodiment, the heat dissipation structure may include a second heat transfer metal plate (83) disposed facing the second back cover (214) and a second heat transfer fiber layer (84) disposed between the second heat transfer metal plate (83) and the hinge housing (410). For example, the first and second heat transfer fiber layers (82, 84) may serve as components to prevent foreign substances from entering the first and second housings (211, 212).

[0149] According to one embodiment, the first heat transfer metal plate (81) may further include a first heat transfer connecting member (85) to transfer heat generated from the third heat transfer member (53). According to one embodiment, the second heat transfer metal plate (83) may further include a second heat transfer connecting member (86) to transfer heat generated from the fourth heat transfer member (54).

[0150] According to one embodiment, a portion of the heat transferred from the third heat transfer member (53) may be transferred to the first heat transfer member (51) through the third heat transfer material (56), and the remainder may be transferred to the first heat transfer metal plate (81) by the first heat transfer connecting member (85). The heat transferred to the first heat transfer metal plate (81) may be transferred to the hinge housing (410) by the first heat transfer fiber layer (82).

[0151] According to one embodiment, heat transferred to the hinge housing (410) can be transferred to the second heat transfer metal plate (83) by the second heat transfer fiber layer (84).

[0152] Referring to FIG. 23, the manufacturing process of a fiber sheet containing heat-dissipating particles in one embodiment is as follows.

[0153] In one embodiment, heat dissipation particles (92) can be supplied into a liquid polymer resin (91) in a container and then uniformly mixed within the container. The liquid polymer resin (91) mixed with heat dissipation particles (92) is sprayed onto a prepared fiber sheet (S1) through a supply device, thereby obtaining a fiber sheet equipped with heat dissipation particles (92). In one embodiment, the plurality of heat dissipation particles (92) may be metal particles that transfer heat, such as a plurality of copper oxide particles.

[0154] According to one embodiment, the prepared fiber sheet (S2) can be compressed by a rolling device (R1, R2) supplied with heat dissipation particles (92), so that the heat dissipation particles (92) can be applied to the fiber sheet (S2). Through this process, a fiber sheet with heat dissipation particles applied can be obtained, and a drawing of the manufactured fiber sheet (S3) is shown in FIG. 24.

[0155] The fiber sheet (s3) coated with the finally completed heat dissipation particles (92) can be used as the fabric for the first and second heat transfer fiber layers (82, 84) shown in FIG. 22.

[0156] The various embodiments of the present disclosure disclosed in this specification and drawings are provided merely as specific examples to facilitate the explanation of the technical content of the present disclosure and to aid in understanding the present disclosure, and are not intended to limit the scope of the present disclosure. Accordingly, the scope of the present disclosure should be interpreted to include all modifications or variations derived based on the technical concept of the present disclosure, in addition to the embodiments disclosed herein.

Claims

Claim 1 A foldable electronic device comprises: a housing including a first housing portion, a second housing portion, and a hinge housing portion disposed at least partially between the first housing portion and the second housing portion; a hinge assembly received in the housing and coupled to the first housing portion and the second housing portion; a flexible display received in the first housing portion and the second housing portion; a first printed circuit board received in the first housing portion; a second printed circuit board received in the second housing portion; and a flexible printed circuit board (FPCB) comprising a folding portion disposed at least partially between the hinge housing portion and the flexible display, and electrically connecting the first printed circuit board and the second printed circuit board. and includes a first portion attached to the flexible printed circuit board and a second portion configured to receive heat from a first component on the first printed circuit board, and includes a heat transfer sheet disposed at least partially between the hinge housing portion and the flexible display, wherein at least a portion of the first portion of the heat transfer sheet is attached to the folding portion of the flexible printed circuit board and is configured to bend while attached to the folding portion of the flexible printed circuit board when the folding portion of the flexible printed circuit board is folded, and heat from the first component on the first printed circuit board is transferred at least partially to the second housing portion via the heat transfer sheet, and in the unfolded state of the foldable electronic device, the first portion attached to the flexible printed circuit board includes a portion that overlaps with the hinge housing in a direction toward the hinge assembly from the flexible display, and passing through the portion that overlaps with the hinge housing A foldable electronic device extending toward at least one of a first housing or a second housing. Claim 2 In claim 1, the first portion is a foldable electronic device laminated with at least a portion of the flexible printed circuit board. Claim 3 A foldable electronic device according to claim 1, wherein the heat transfer sheet is made of copper. Claim 4 In claim 1, the heat transfer sheet is a graphite sheet, and the foldable electronic device. Claim 5 In claim 1, the second part is a foldable electronic device thermally coupled to the first printed circuit board. Claim 6 A foldable electronic device according to claim 1, wherein the first portion is formed with a width size approximately the same as that of the flexible printed circuit board. Claim 7 delete Claim 8 In claim 1, the first part is a foldable electronic device passing through the hinge housing part. Claim 9 A foldable electronic device according to claim 1, wherein the second portion is thermally coupled to a first heat transfer member accommodated in the first housing portion. Claim 10 In claim 9, the second part is a foldable electronic device thermally coupled to the first heat transfer member by a first heat transfer material. Claim 11 In claim 10, the heat transfer sheet comprises a third portion that is thermally coupled to a portion of the second housing portion via the first portion, and the first portion is a foldable electronic device located between the second portion and the third portion. Claim 12 In claim 11, the third part is a foldable electronic device that is thermally coupled to a second heat transfer member accommodated in the second housing part. Claim 13 In claim 12, the third part is a foldable electronic device thermally coupled to the second heat transfer member by a second heat transfer material. Claim 14 A foldable electronic device according to claim 1, wherein the heat transfer sheet is formed from either a single material or a heterogeneous material. Claim 15 In claim 14, the heat transfer sheet is a foldable electronic device formed in multiple layers. Claim 16 A foldable electronic device according to claim 15, wherein the heat transfer sheet comprises a copper material layer formed on one side; and at least one graphite layer formed on the other side opposite to the one side. Claim 17 In claim 16, the copper material layer is a foldable electronic device in which at least one first gap is formed in the folding portion of the heat transfer sheet. Claim 18 In claim 17, the foldable electronic device wherein at least one graphite layer has at least one second gap formed in the folding portion of the heat transfer sheet. Claim 19 delete Claim 20 delete

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