Display device and manufacturing method thereof

Abstract

A display device according to one embodiment comprises a substrate, a light-emitting element located on the substrate and including a light-emitting layer, and a light control unit located on the light-emitting element. The light control unit comprises a plurality of light-blocking patterns that extend in a first direction and are spaced apart along a second direction that intersects the first direction, and a transparent portion located between the plurality of light-blocking patterns and extending in the first direction. The transparent portion comprises a first transparent organic film, a transparent inorganic film located on the first transparent organic film, and a second transparent organic film located on the transparent inorganic film.

Description

Technology Field

[0001] The present disclosure relates to a light-emitting display device and a method for manufacturing the same, and more specifically, to a light-emitting display device and a method for manufacturing the same that includes a light control unit for limiting a side viewing angle. Background Technology

[0002] A display device is a device that displays images and includes liquid crystal display (LCD), organic light emitting diode (OLED), quantum dot light emitting diode (QLED), micro LED display, etc.

[0003] These display devices are used in various electronic devices such as smartphones, mobile phones, tablet PCs, monitors, televisions, multimedia players, and video game consoles. In addition to electronic devices, display devices can be used in various fields, and recently, research on automotive display devices using organic light-emitting diodes (OLEDs) is being conducted.

[0004] A light control film (LCF) is provided in the vehicle display device to control the reflected image by blocking light directed toward the vehicle's windshield for the safety of the driver. The problem to be solved

[0005] The embodiments are intended to provide a display device including a light control unit capable of reducing the side light emission angle.

[0006] The embodiments are intended to ensure that light emitted from a display device used in a vehicle is directed toward the driver's eyes so as not to interfere with driving. They are intended to ensure that the display device used in a vehicle does not reflect off the vehicle's windshield at night and obstruct the driver's vision.

[0007] The embodiments are intended to limit the side viewing angle of a display device so as not to expose the user's privacy. means of solving the problem

[0008] A display device according to one embodiment comprises a substrate, a light-emitting element positioned on the substrate and including a light-emitting layer, and a light control unit positioned on the light-emitting element. The light control unit comprises a plurality of light-blocking patterns extending in a first direction and spaced apart along a second direction intersecting the first direction, and a transparent portion positioned between the plurality of light-blocking patterns and extending in the first direction. The transparent portion comprises a first transparent organic film, a transparent inorganic film positioned on the first transparent organic film, and a second transparent organic film positioned on the transparent inorganic film.

[0009] The first transparent organic film may have a cross-section that is purely tapered.

[0010] The above second transparent organic film may have a cross-section that is square in shape or inversely tapered.

[0011] The cross-section of the first transparent organic film may be inversely tapered, and the cross-section of the second transparent organic film may be in a positively tapered shape.

[0012] The above transparent inorganic film can be positioned so as to be in contact with the upper surface of the first transparent organic film and the lower surface of the second transparent organic film.

[0013] The above plurality of light-blocking patterns may have a lower cross-section that is in the shape of an inverted tapered shape.

[0014] The above plurality of light-blocking patterns may have a cross-section in the shape of a diamond or an hourglass.

[0015] The first transparent organic film may have a height of 3 μm to 5 μm in the thickness direction of the substrate.

[0016] The above-mentioned transparent portion may have a height of 6㎛ to 10㎛ in the thickness direction of the substrate.

[0017] The above plurality of light-blocking patterns may include a light-absorbing material having an optical density (OD) of 1.5 to 2.0.

[0018] A method for manufacturing a display device according to one embodiment comprises the steps of forming a light-emitting element on a substrate, forming an encapsulation layer covering the light-emitting element, and forming a light-shielding pattern on the light-emitting element, wherein the step of forming the light-shielding pattern comprises the steps of forming a first transparent organic film pattern extending in a first direction on the encapsulation layer, forming a transparent inorganic film pattern superimposed on the first transparent organic film pattern, forming a second transparent organic film pattern superimposed on the transparent inorganic film pattern, and applying a light-shielding material, and filling the openings between the first transparent organic film pattern, between the transparent inorganic film pattern, and between the second transparent organic film pattern with the light-shielding material.

[0019] The first transparent organic film pattern above may have a net tapered cross-section.

[0020] The above second transparent organic film pattern may have a cross-section that is square in shape or inversely tapered in shape.

[0021] The cross-section of the first transparent organic film may be inversely tapered, and the cross-section of the second transparent organic film may be in a positively tapered shape.

[0022] The above transparent inorganic film pattern can be formed to be in contact with the upper surface of the first transparent organic film pattern and the lower surface of the second transparent organic film pattern.

[0023] The above shading pattern may have a lower cross-section that is in the shape of an inverted tapere.

[0024] The above light-blocking pattern may have a cross-section in the shape of a diamond or an hourglass.

[0025] The first transparent organic film pattern can be formed with a height of 3 μm to 5 μm in the thickness direction of the substrate.

[0026] The light-blocking pattern above can be formed with a height of 6 μm to 10 μm in the thickness direction of the substrate.

[0027] The above light-blocking pattern may include a light-absorbing material having an optical density (OD) of 1.5 to 2.0. Effects of the invention

[0028] According to the embodiments, a display device including a light control unit capable of reducing the side light emission angle and a method for manufacturing the same can be provided.

[0029] According to the embodiments, the light control unit includes a light-blocking pattern with an inclined surface formed on the side, so the side reflection angle can be limited.

[0030] In addition, a display device including a light control unit that protects user privacy by limiting the side viewing angle can be provided.

[0031] In addition, light emitted from a display device used in the vehicle is prevented from reaching the vehicle's windshield, thereby preventing light from reflecting off the windshield and obstructing the driver's view. Brief explanation of the drawing

[0032] FIG. 1 is a plan view schematically illustrating a pixel of a display device according to one embodiment. FIG. 2 is a plan view of a light control unit formed in a display device according to one embodiment. FIG. 3 is a schematic plan view illustrating a display device combining FIG. 1 and FIG. 2. FIG. 4 is a schematic cross-sectional view of one embodiment taken along the line A-A' of FIG. 3. Figure 5 is a graph showing the relationship between the optical density (OD) and reflectance (%) of a light-absorbing material. FIGS. 6 to 10 are drawings sequentially illustrating a manufacturing method for forming a light control unit according to one embodiment. FIG. 11 is a cross-sectional view of a light control unit formed in a display device according to one embodiment. FIGS. 12 to 15 are drawings sequentially illustrating a manufacturing method for forming the light control unit of FIG. 11. FIG. 16 is a cross-sectional view of a light control unit formed in a display device according to one embodiment. FIGS. 17 to 20 are drawings sequentially illustrating a manufacturing method for forming the light control unit of FIG. 16. Figure 21 is a light emission simulation diagram of comparative examples and embodiments. FIG. 22 is a cross-sectional view of a display panel according to one embodiment. FIG. 23 is a drawing of a display device according to one embodiment viewed from various angles. FIG. 24 is a diagram showing the light path emitted from a display device according to an embodiment. FIG. 25 is a diagram showing the light path emitted from a display device according to a comparative example. Specific details for implementing the invention

[0033] Hereinafter, various embodiments of the present invention will be described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present invention. The present invention may be embodied in various different forms and is not limited to the embodiments described herein.

[0034] To clearly explain the present invention, parts unrelated to the explanation have been omitted, and the same reference numerals are used for identical or similar components throughout the specification.

[0035] Furthermore, the size and thickness of each component shown in the drawings are depicted arbitrarily for convenience of explanation, and thus the present invention is not necessarily limited to what is illustrated. Thicknesses have been enlarged in the drawings to clearly represent various layers and regions. Additionally, for convenience of explanation, the thickness of some layers and regions has been exaggerated in the drawings.

[0036] Furthermore, when it is said that a part, such as a layer, membrane, region, or plate, is "on" or "on" another part, this includes not only the case where it is "directly above" the other part, but also the case where there is another part in between. Conversely, when it is said that a part is "directly above" another part, it means that there is no other part in between. Also, saying that a part is "on" or "on" a reference part means that it is located above or below the reference part, and does not necessarily mean that it is located "on" or "on" in the direction opposite to gravity.

[0037] Furthermore, throughout the specification, when a part is described as "including" a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components.

[0038] Additionally, throughout the specification, "planar" means when the subject part is viewed from above, and "cross-sectional" means when the cross-section obtained by vertically cutting the subject part is viewed from the side.

[0039] Furthermore, throughout the specification, when the term "connected" is used, it does not mean only cases where two or more components are directly connected, but may also include cases where two or more components are indirectly connected through other components, cases where they are physically or electrically connected, as well as cases where each part, which is substantially one and referred to by different names depending on its location or function, is connected to one another.

[0040] In addition, throughout the specification, when a part of a wiring, layer, film, region, plate, component, etc. is described as "extending in a first direction or a second direction," this does not mean only a straight line shape extending in that direction, but also includes a structure that extends overall along the first direction or the second direction, and includes a structure that is bent in one part, has a zigzag structure, or extends while including a curved structure.

[0041] A display device including a light control unit according to one embodiment is described through FIGS. 1 to 4.

[0042] FIG. 1 is a plan view schematically illustrating a pixel of a display device according to one embodiment, FIG. 2 is a plan view showing a light control unit according to one embodiment, FIG. 3 is a plan view schematically illustrating a display device combining FIG. 1 and FIG. 2, and FIG. 4 is a cross-sectional view cut along the line AA' of FIG. 3.

[0043] In FIG. 1, three light-emitting elements of different colors (R, G, B) located adjacent to each other are briefly illustrated, and each light-emitting element includes a light-emitting layer (EMLr, EMLg, EMLb).

[0044] Each light-emitting layer (EMLr, EMLg, EMLb) is a portion that emits light from a light-emitting element and is partitioned by a pixel defining layer (380). Each light-emitting layer (EMLr, EMLg, EMLb) may overlap with an opening (OPr, OPg, OPb) formed in the pixel defining layer (380). Each light-emitting layer (EMLr, EMLg, EMLb) may be located within each opening (OPr, OPg, OPb) of the pixel defining layer (380) and may include a portion located outside each opening (OPr, OPg, OPb). Although not shown in FIG. 1, a second electrode (cathode) and an encapsulation layer may be located above the pixel defining layer (380) and the light-emitting layers (EMLr, EMLg, EMLb), and a first electrode (anode) may be located below each light-emitting layer (EMLr, EMLg, EMLb). Here, one anode, one light-emitting layer (EMLr, EMLg, EMLb), and a cathode can constitute one light-emitting device. The detailed stacked structure of the light-emitting device will be described later through FIG. 22.

[0045] FIG. 2 illustrates the planar structure of a light control unit (10) according to one embodiment.

[0046] The light control unit (10) may include a plurality of light-blocking patterns (BL). The light-blocking patterns (BL) may include a light-absorbing material to limit the user's viewing angle of the image light.

[0047] In one embodiment, light-blocking patterns (BL) may be extended in a first direction (DR1) and arranged at regular intervals along a second direction (DR2) that intersects the first direction. In some embodiments, the spacing of the light-blocking patterns (BL) may not be regular.

[0048] The light-blocking pattern (BL) may include a light-blocking material. The light-blocking material is a light-absorbing material, and various light-absorbing materials used in the industry may be used. For example, dark-colored pigments such as black or gray pigments, dark-colored dyes, metals such as aluminum or silver, metal oxides, dark-colored polymers, etc. may be used as light-absorbing materials. Examples of metal oxides include MoTaO. x , AlO x , CrO x , CuO x , MoO x , Ti x , AlNdO x , CuMoO x , MoTi x It may also include the back.

[0049] A transparent portion (TOL) is located in an area where multiple light-blocking patterns (BL) are not formed. The light control unit (10) may have a structure in which a light-blocking pattern (BL) is formed by filling a light-blocking material within an opening (600) formed in the transparent portion (TOL). The transparent portion (TOL) can transmit light incident from a light-emitting element to the outside and may include a transparent organic film and a transparent inorganic film.

[0050] A light control unit (10) according to one embodiment may include a plurality of light-blocking patterns (BL) that are arranged at regular intervals along a second direction (DR2) that extends in a first direction (DR1) in a plane and intersects the first direction, and a transmission unit (TOL) that is located between the light-blocking patterns (BL) and extends in the first direction (DR1), and may be placed on the upper part of a display panel including a light-emitting element as in FIG. 1.

[0051] FIG. 3 is a planar structure of one embodiment in which a light control unit as shown in FIG. 2 is disposed on top of a light-emitting element having an arrangement as shown in FIG. 1.

[0052] In the embodiment of FIG. 3, a structure is illustrated in which a light-blocking pattern (BL) crosses between one light-emitting element, and a light-blocking pattern (BL) is placed on both sides of the light-emitting element and also between adjacent light-emitting elements.

[0053] In one embodiment, the openings (OPr, OPg, OPb) of each light-emitting layer (EMLr, EMLg, EMLb) and / or pixel definition layer (380) overlap with a single light-blocking pattern (BL), and the single light-blocking pattern (BL) is positioned at the center of the openings (OPr, OPg, OPb) of each light-emitting layer (EMLr, EMLg, EMLb) and / or pixel definition layer (380). The openings (OPr, OPg, OPb) of each light-emitting layer (EMLr, EMLg, EMLb) and / or pixel definition layer (380) have a pair of light-blocking patterns (BL) that are not overlapping but are located adjacently, and the pair of light-blocking patterns (BL) can be arranged to overlap with the pixel definition layer (380).

[0054] FIG. 4 is a cross-sectional view taken along the line AA' of FIG. 3. Referring to FIG. 4, an encapsulation layer (400) is located below the transmission portion (TOL), and the encapsulation layer (400) may include a lower inorganic encapsulation film (401), an organic encapsulation film (402), and an upper inorganic encapsulation film (403). A light-emitting element may be located below the encapsulation layer (400). FIG. 4 briefly illustrates only the light-emitting layer (EMLb, EMLg), and the specific lower structure will be described later through FIG. 22.

[0055] According to the embodiment, a touch sensor layer including a touch insulating layer and a plurality of touch electrodes may be positioned between the permeable portion (TOL) and the encapsulation layer (400) to detect a touch.

[0056] Referring to FIG. 4, the side viewing angle of the display device can be limited by the light blocking pattern (BL) of the light control unit (10).

[0057] Referring to Fig. 4, the principle of light transmission and blocking based on the green light-emitting layer (EMLg) is explained. The light-emitting element emits light from the light-emitting layer (EMLg), and the light emitted from the light-emitting layer (EMLg) can be emitted in various directions. The light emitted in various directions is not transmitted at angles greater than a certain angle due to the light-blocking pattern (BL) located on the upper part of the light-emitting layer (EMLg). For example, light (L1, L2) emitted from the light-emitting layer (EMLg) may be absorbed by the light-blocking pattern (BL) and not transmitted to the outside. As a result, the viewing angle of the light-emitting display device is limited.

[0058] In one embodiment, the light control unit (10) may include a plurality of light-blocking patterns (BL) and a transmission unit (TOL) on the encapsulation layer (400).

[0059] The permeable portion (TOL) may include a first transparent organic film (TOLa), a second transparent organic film (TOLb), and a transparent inorganic film (TIL) located between them.

[0060] The first transparent organic film (TOLa) may have a cross-sectional width that varies with height in the third direction (DR3), which is the thickness direction of the substrate. For example, the cross-sectional width of the first transparent organic film (TOLa) may be wide at the bottom near the light-emitting layer (EML) and narrow towards the top. That is, the first transparent organic film (TOLa) may have a net tapered structure with a trapezoidal shape in which the width is wide at the bottom of the cross-section and narrows towards the top.

[0061] A transparent inorganic film (TIL) can be formed on the first transparent organic film (TOLa). The transparent inorganic film (TIL) is positioned between the first transparent organic film (TOLa) and the second transparent organic film (TOLb) and can serve as an adhesive layer between the upper and lower organic films. That is, the transparent inorganic film (TIL) can be positioned to be in contact with the upper surface of the first transparent organic film (TOLa) and the lower surface of the second transparent organic film (TOLb). The inorganic film (TIL) is silicon oxide (SiO₂).x ), silicon nitride (SiN x It may be formed by stacking inorganic materials such as ), or depending on the example, it may be formed with a transparent conductive oxide (TCO) such as ITO or IZO.

[0062] A second transparent organic film (TOLb) may be positioned on a transparent inorganic film (TIL). For example, the second transparent organic film (TOLb) may be formed in a columnar shape with a constant width. The cross-section of the second transparent organic film (TOLb) may be rectangular.

[0063] The first transparent organic film (TOLa) and the second transparent organic film (TOLb) may include a transparent resin. For example, they may include organic materials such as general-purpose polymers like polymethylmethacrylate (PMMA) or polystyrene (PS), polymer derivatives having a phenolic group, acrylic polymers, imide polymers like polyimide (PI), siloxane polymers, and cardo polymers.

[0064] A plurality of light-blocking patterns (BL) can be formed to fill an opening (600) formed between transparent portions (TOL) including a first transparent organic film (TOLa), a transparent inorganic film (TIL), and a second transparent organic film (TOLb) stacked sequentially from the bottom. Referring to FIG. 4, since the cross-section of the first transparent organic film (TOLa) has a net taper shape in the shape of a trapezoid, the cross-section of the opening (600) formed between the first transparent organic films (TOLa) has an inverse taper shape, and accordingly, the light-blocking pattern (BL) formed in the opening (600) may include a cross-section with an inverse taper shape at the bottom corresponding to the shape of the opening (600).

[0065] In this way, according to the net taper shape of the first transparent organic film (TOLa), the lower part of the light-blocking pattern (BL) has a side slope of an inverse taper shape, and the reflection angle of light (L2) that is partially not absorbed and is reflected from the side of the light-blocking pattern (BL) can be limited, thereby reducing the side light emission angle. The specific light emission angle is described in detail with a comparative example in FIG. 21.

[0066] Figure 5 is a graph showing the reflectance (%) according to the optical density (OD) of a light-absorbing material.

[0067] The light-absorbing material included in the light-blocking pattern (BL) can be a dark-colored pigment such as black pigment or gray pigment, a dark-colored dye, a metal such as aluminum or silver, a metal oxide, a dark-colored polymer, etc., and the light reflectance in the light-blocking pattern (BL) may vary depending on the optical density (OD) of such material.

[0068] Referring to FIG. 5, as the optical density (OD) of the material increases, the reflectance decreases rapidly, and then increases again as the optical density (OD) passes 1.5. Subsequently, as the optical density (OD) passes 2.0, the reflectance increases rapidly again; thus, it can be confirmed that the optimal optical density (OD) for lowering the light reflectance of the light-absorbing material is formed in the range of approximately 1.5 to 2.0. Accordingly, the optical density (OD) of the light-absorbing material included in the light-blocking pattern (BL) according to one embodiment may be in the range of approximately 1.5 to 2.0. The optical density (OD) of the light-blocking pattern (BL) can be controlled by the amount of pigment included and the thickness of the light-blocking pattern (BL).

[0069] Hereinafter, a method for manufacturing a light control unit (10) according to one embodiment is examined through FIGS. 6 to 10. FIGS. 6 to 10 are drawings sequentially illustrating a method for manufacturing a light control unit (10) of a display device according to one embodiment.

[0070] In FIGS. 6 to 10, only some of the layers located at the bottom of the light control unit (10) are shown, and only the upper inorganic sealing film (403) included in the sealing layer (400) is shown.

[0071] Referring to FIG. 6, an alignment key (500) is formed on the upper inorganic encapsulation film (403). The alignment key (500) can be used for aligning the pattern in a subsequent process. The alignment key (500) can be formed by a printing process or a photolithography process. For example, the printing process may utilize roll printing, imprinting, screen printing, gravure printing, gravure-offset printing, or flexographic printing methods. The photolithography process may be performed through an etching process in which a photoresist pattern is formed by using a mask and exposing and developing it, and then etching. The etching process may be a wet etching process, a dry etching process, or a laser scribing process.

[0072] Next, referring to FIG. 7, a transparent organic material is applied over the upper inorganic sealing film (403), and the transparent organic material is patterned using a photolithography process to form a first transparent organic film (TOLa) pattern.

[0073] The first transparent organic film (TOLa) is formed with a structure that extends along one direction and can be formed with a first height (h1) in the third direction (DR3), which is the thickness direction of the substrate. For example, the first height (h1) of the first transparent organic film (TOLa) may be in the range of 3 μm to 5 μm.

[0074] The first transparent organic film (TOLa) can be formed in a net taper shape in which the width decreases toward the top of the cross-section. During the photolithography process, the first transparent organic film (TOLa) can be exposed using a UV exposure facility, and the degree of inclination of the net taper shape can be controlled by adjusting the amount of exposure.

[0075] Next, referring to FIG. 8, silicon oxide (SiO₂) is placed on the first transparent organic film (TOLa). x ), silicon nitride (SiN x A transparent inorganic film (TIL) pattern is formed by stacking an inorganic insulating material such as ) or a transparent conductive oxide (TCO) such as ITO or IZO and then etching it. The pattern of the transparent inorganic film (TIL) overlaps with the first transparent organic film (TOLa) pattern on a planar surface.

[0076] Then, referring to Fig. 9, a transparent organic material is applied on a transparent inorganic film (TIL), and a second transparent organic film (TOLb) pattern is formed by patterning the transparent organic material using a photolithography process.

[0077] The second transparent organic film (TOLb) overlaps with the first transparent organic film (TOLa) with the planar transparent inorganic film (TIL) in between. In this way, by positioning the transparent inorganic film (TIL) between the first and second transparent organic films (TOLa, TOLb), mixing between the first and second transparent organic films (TOLa, TOLb) can be prevented, and adhesion characteristics between the first and second transparent organic films (TOLa, TOLb) can be improved. The transparent portion (TOL), comprising the first transparent organic film (TOLa), the transparent inorganic film (TIL), and the second transparent organic film (TOLb), can be formed with a second height (h2) in the third direction (DR3), which is the thickness direction of the substrate. For example, the second height (h2) of the transparent portion (TOL) may be in the range of 6 μm to 10 μm.

[0078] Referring to FIG. 9, between the patterns of transparent portions (TOL) including a first transparent organic film (TOLa) with a net tapered cross-section and a second transparent organic film (TOLb) with a square cross-section, an opening (600) having an inverse tapered shape at the bottom is formed.

[0079] Next, a light-blocking material is applied to the entire area. The light-blocking material may include light-absorbing materials such as dark-colored pigments like black or gray pigments, dark-colored dyes, metals like aluminum or silver, metal oxides, dark-colored polymers, etc.

[0080] Referring to FIG. 10, a light-blocking material applied to the entire area can be introduced into an inversely tapered opening (600) formed between the patterns of the transparent portion (TOL) to form a light-blocking pattern (BL) corresponding to the shape of the opening (600) of the transparent portion (TOL).

[0081] Subsequently, the upper surface of the light-blocking patterns (BL) can be flattened with respect to the upper surface of the second transparent organic film (TOLb) through a flattening process. For example, the upper surface of the light-blocking patterns (BL) can be flattened through a Chemical Mechanical Polishing (CMP) process, and the upper surfaces of a plurality of light-blocking patterns (BL) can be placed on the same plane as the upper surface of the second transparent organic film (TOLb). Accordingly, the light-blocking patterns (BL) can be formed with a height of 6 μm to 10 μm corresponding to the second height (h2) of the transparent portion (TOL).

[0082] By such a process, a light-blocking pattern (BL) including an inverted tapered shape on the lower cross-section can be formed. Since the light-blocking pattern (BL) includes an inclined surface on the side, the side reflection angle can be limited to improve the side blocking rate.

[0083] Additionally, the optical density (OD) of the light-blocking pattern (BL) can be controlled by the amount of pigment included in the light-absorbing material and the thickness of the light-blocking pattern (BL). In one embodiment, the optical density (OD) of the light-absorbing material included in the light-blocking pattern (BL) may be in the range of approximately 1.5 to 2.0, and accordingly, the reflectance reflected from the side of the light-blocking pattern (BL) can be reduced.

[0084] FIG. 11 is a cross-sectional view of a light control unit (12) formed in a display device according to one embodiment.

[0085] Referring to FIG. 11, the light control unit (12) may have a first transparent organic film (TOLa) with a positive taper shape on the upper inorganic encapsulation film (403), a transparent inorganic film (TIL) on the first transparent organic film (TOLa), and a second transparent organic film (TOLb) with an inverse taper shape on the transparent inorganic film (TIL). The transparent inorganic film (TIL) may be positioned to be in contact with the upper surface of the first transparent organic film (TOLa) and the lower surface of the second transparent organic film (TOLb).

[0086] The light control unit (12) of FIG. 11 differs from the light control unit (10) of FIG. 4 in that the cross-sectional shape of the second transparent organic film (TOLb) is different. Hereinafter, specific descriptions of components identical to those in the preceding embodiment are omitted. Descriptions of omitted components shall follow the preceding embodiment.

[0087] Referring to FIG. 11, the transparent portion (TOL), which includes a first transparent organic film (TOLa) with a positive taper shape and a second transparent organic film (TOLb) with a reverse taper shape, may have an hourglass shape in cross-section. Since the cross-section of the transparent portion (TOL) has an hourglass shape, the cross-section of the opening (600) formed between the transparent portions (TOL) may have a diamond shape, and accordingly, the light-blocking pattern (BL) formed in the opening (600) may have a diamond shape in cross-section corresponding to the shape of the opening (600).

[0088] Accordingly, the lower part of the light-blocking pattern (BL) has a side slope of an inverse taper shape according to the net taper shape of the first transparent organic film (TOLa), and the upper part of the light-blocking pattern (BL) can have a side slope of an inverse taper shape according to the inverse taper shape of the second transparent organic film (TOLb). Accordingly, the reflection angle of light that is partially not absorbed and is reflected from the side of the light-blocking pattern (BL) can be limited, thereby reducing the side light emission angle. Specific light emission angles will be described later with a comparative example in FIG. 21.

[0089] Hereinafter, a method for manufacturing a light control unit (12) according to one embodiment is examined through FIGS. 12 to 15. FIGS. 12 to 15 are drawings sequentially illustrating a method for manufacturing a light control unit (12) of a display device according to one embodiment. A detailed description of a process identical to the previously described process is omitted. The description of the omitted components follows the previous embodiment.

[0090] In FIGS. 12 to 15, only some of the layers located at the bottom of the light control unit (12) are shown, and only the upper inorganic sealing film (403) included in the sealing layer (400) is shown.

[0091] First, as shown in FIG. 12, an alignment key (500) is formed on the upper inorganic encapsulation film (403), a transparent organic material is applied, and the transparent organic material is patterned using a photolithography process to form a first transparent organic film (TOLa) pattern.

[0092] The first transparent organic film (TOLa) is formed with a structure that has a constant width and extends along one direction, and can be formed with a first height (h1) in a third direction (DR3). For example, the first height (h1) of the first transparent organic film (TOLa) may be in the range of 3 μm to 5 μm.

[0093] The first transparent organic film (TOLa) can be formed in a net taper shape in which the width decreases toward the top. During the photolithography process, the first transparent organic film (TOLa) can be exposed using a UV exposure facility, and the degree of inclination of the net taper shape can be controlled by adjusting the amount of exposure.

[0094] Next, referring to FIG. 13, silicon oxide (SiO₂) is placed on the first transparent organic film (TOLa). x ), silicon nitride (SiN x A transparent inorganic film (TIL) is formed by stacking an inorganic insulating material such as ) or a transparent conductive oxide (TCO) such as ITO or IZO and then etching it. The pattern of the transparent inorganic film (TIL) overlaps with the first transparent organic film (TOLa) on a planar surface.

[0095] Then, referring to FIG. 14, a second transparent organic film (TOLb) is laminated on a transparent inorganic film (TIL) and patterned using a photolithography process. The second transparent organic film (TOLb) overlaps with the first transparent organic film (TOLa) with the transparent inorganic film (TIL) in between.

[0096] The second transparent organic film (TOLb) can be formed with an inverse taper shape in which the width increases toward the top of the cross-section. During the photolithography process, heat treatment of the second transparent organic film (TOLb) can be performed using a post-exposure bake facility, and the degree of inclination of the inverse taper shape can be controlled by adjusting the heat treatment process conditions.

[0097] A transparent portion (TOL) comprising a first transparent organic film (TOLa), a transparent inorganic film (TIL), and a second transparent organic film (TOLb) may be formed with a second height (h2) in a third direction (DR3). For example, the second height (h2) of the transparent portion (TOL) may be in the range of 6 μm to 10 μm.

[0098] Referring to FIG. 14, an opening (600) having a diamond-shaped cross section is formed between the patterns of transparent portions (TOL), which include a first transparent organic film (TOLa) with a positive taper shape, a transparent inorganic film (TIL) on the first transparent organic film (TOLa), and a second transparent organic film (TOLb) with an inverse taper shape on the transparent inorganic film (TIL).

[0099] Next, in FIG. 15, a light-blocking material is applied over the entire area to fill the opening (600) between the transparent parts (TOL). The light-blocking material applied over the entire area can flow into the diamond-shaped opening (600) formed between the patterns of the transparent parts (TOL) to form a light-blocking pattern (BL) corresponding to the opening (600) of the transparent parts (TOL).

[0100] Afterward, a light-blocking pattern (BL) can be formed through a flattening process, wherein the cross-section has an inverse taper structure at the bottom and a forward taper structure at the top. The cross-section of the light-blocking pattern (BL) may be diamond-shaped, corresponding to the opening (600) of the transparent portion (TOL).

[0101] Since this light-blocking pattern (BL) includes an inclined surface on the side, it can limit the side reflection angle and improve the side blocking rate.

[0102] Additionally, the optical density (OD) of the light-blocking pattern (BL) can be controlled by the amount of pigment included and the thickness of the light-blocking pattern (BL). The optical density (OD) of the light-absorbing material included in the light-blocking pattern (BL) according to one embodiment may be in the range of approximately 1.5 to 2.0, and accordingly, the reflectance reflected from the side of the light-blocking pattern (BL) can be reduced.

[0103] FIG. 16 is a cross-sectional view of a light control unit (13) formed in a display device according to one embodiment.

[0104] Referring to FIG. 16, the light control unit (13) may have a first transparent organic film (TOLa) with an inverse taper shape on top of an upper inorganic encapsulation film (403), a transparent inorganic film (TIL) on top of the first transparent organic film (TOLa), and a second transparent organic film (TOLb) with a forward taper shape on top of the transparent inorganic film (TIL). The transparent unit (TOL) including the first transparent organic film (TOLa), the transparent inorganic film (TIL), and the second transparent organic film (TOLb) may have a diamond-shaped cross-section. The transparent inorganic film (TIL) may be positioned to be in contact with the upper surface of the first transparent organic film (TOLa) and the lower surface of the second transparent organic film (TOLb).

[0105] A plurality of light-blocking patterns (BL) can be formed to fill the opening (600) formed between the patterns of the transparent portions (TOL). Since the cross-sectional shape of the transparent portions (TOL) has a diamond shape, the cross-section of the opening (600) formed between the patterns of the transparent portions (TOL) can have an hourglass shape, and accordingly, the cross-section of the light-blocking pattern (BL) formed in the opening (600) can have an hourglass shape corresponding to the shape of the opening (600).

[0106] Accordingly, the lower part of the light-blocking pattern (BL) has a side slope of a forward taper shape according to the inverse taper shape of the first transparent organic film (TOLa), and the upper part of the light-blocking pattern (BL) can have a side slope of a forward taper shape according to the forward taper shape of the second transparent organic film (TOLb). Accordingly, the reflection angle of light that is partially unabsorbed and reflected from the side of the light-blocking pattern (BL) can be limited, thereby reducing the side light emission angle. Specific light emission angles will be described later with a comparative example in FIG. 21.

[0107] Hereinafter, a method for manufacturing a light control unit (13) according to one embodiment is examined through FIGS. 17 to 20. FIGS. 17 to 20 are drawings sequentially illustrating a method for manufacturing a light control unit (13) of a display device according to one embodiment. A detailed description of a process identical to the previously described process is omitted. The description of the omitted components follows the previous embodiment.

[0108] First, as shown in FIG. 17, an alignment key (500) is formed on the upper inorganic encapsulation film (403), a transparent organic material is applied, and the transparent organic material is patterned using a photolithography process to form a first transparent organic film (TOLa) pattern.

[0109] The first transparent organic film (TOLa) is formed with a structure that has a constant width and extends along one direction, and can be formed with a first height (h1) in a third direction (DR3). For example, the first height (h1) of the first transparent organic film (TOLa) may be in the range of 3 μm to 5 μm.

[0110] The first transparent organic film (TOLa) can be formed in an inverse taper shape that widens toward the top in cross-section. During the photolithography process, heat treatment can be performed using a post-exposure bake facility, and the degree of inclination of the inverse taper shape can be controlled by adjusting the heat treatment process conditions.

[0111] Next, referring to FIG. 18, silicon oxide (SiO₂) is placed on the first transparent organic film (TOLa). x ), silicon nitride (SiN x A transparent inorganic film (TIL) is formed by stacking an inorganic insulating material such as ) or a transparent conductive oxide (TCO) such as ITO or IZO and then etching it. The pattern of the transparent inorganic film (TIL) overlaps with the first transparent organic film (TOLa) on a planar surface.

[0112] Then, referring to FIG. 19, a transparent organic material is applied on a transparent inorganic film (TIL), and a second transparent organic film (TOLb) pattern is formed by patterning the transparent organic material using a photolithography process.

[0113] The second transparent organic film (TOLb) can be formed in a net taper shape in which the width decreases toward the top of the cross-section. Additional exposure can be performed using UV exposure equipment during the photolithography process, and the degree of inclination of the net taper shape can be controlled by adjusting the amount of additional exposure.

[0114] A transparent portion (TOL) comprising a first transparent organic film (TOLa), a transparent inorganic film (TIL), and a second transparent organic film (TOLb) may be formed with a second height (h2) in a third direction (DR3). For example, the second height (h2) of the transparent portion (TOL) may be in the range of 6 μm to 10 μm.

[0115] Referring to FIG. 19, an opening (600) with an hourglass cross-section is formed between the patterns of transparent portions (TOL), which include a first transparent organic film (TOLa) with an inverse taper shape, a transparent inorganic film (TIL) on the first transparent organic film (TOLa), and a second transparent organic film (TOLb) with a positive taper shape on the transparent inorganic film (TIL).

[0116] Next, in FIG. 20, a light-blocking material is applied over the entire area to fill the opening (600) between the transparent parts (TOL). The light-blocking material applied over the entire area can flow into the hourglass-shaped opening (600) formed between the patterns of the transparent parts (TOL) to form a light-blocking pattern (BL) corresponding to the opening (600) of the transparent parts (TOL).

[0117] Afterward, a light-blocking pattern (BL) can be formed through a flattening process, wherein the cross-section has a net taper structure at the bottom and a reverse taper structure at the top. The cross-section of the light-blocking pattern (BL) may have an hourglass shape corresponding to the opening (600) of the transparent part (TOL).

[0118] Since such a light-blocking pattern (BL) includes an inclined surface on the side, the side reflection angle can be limited, thereby improving the side blocking rate.

[0119] Additionally, the optical density (OD) of the light-blocking pattern (BL) can be controlled by the amount of pigment included and the thickness of the light-blocking pattern (BL). The optical density (OD) of the light-absorbing material included in the light-blocking pattern (BL) according to one embodiment may be in the range of approximately 1.5 to 2.0, and accordingly, the reflectance reflected from the side of the light-blocking pattern (BL) can be reduced.

[0120] Figure 21 is a light emission simulation diagram of comparative examples and embodiments.

[0121] FIG. 21(a) is a light emission simulation diagram according to a comparative example, FIG. 21(b) is a light emission simulation diagram according to an embodiment of FIG. 4, FIG. 21(c) is a light emission simulation diagram according to an embodiment of FIG. 11, and FIG. 21(d) is a light emission simulation diagram according to an embodiment of FIG. 16.

[0122] When comparing the comparative example of FIG. 21(a) with the embodiments of FIG. 21(b), FIG. 21(c), and FIG. 21(d), it can be seen that the side emission angle (θb) according to the embodiment of FIG. 21(b) and the side emission angle (θc) according to the embodiment of FIG. 21(c) are smaller than the side emission angle (θa) according to the comparative example of FIG. 21(a).

[0123] In fact, simulation results confirmed that the side emission angle (θa) according to the comparative example is 90 degrees, the side emission angle (θb) according to the embodiment of FIG. 21(b) is 25 degrees, and the side emission angle (θc) according to the embodiment of FIG. 21(c) is 35 degrees. Meanwhile, the side emission angle (θd) according to the embodiment of FIG. 21(d) is almost no different from the side emission angle (θa) according to the comparative example, but it can be confirmed that the amount of light transmitted to the side is less than that of the comparative example.

[0124] In this way, the side viewing angle (θb, θc, θd) of the display device according to the embodiment is narrower than the side viewing angle (θa) of the display device according to the comparative example, or the amount of side light emission is less than that of the comparative example, so the side blocking rate of the display device can be improved.

[0125] Below, the structure of a light-emitting element, etc., located at the bottom of the light control unit (10) is described through FIG. 22. FIG. 22 is a cross-sectional view schematically showing the stacked structure of a display panel according to one embodiment.

[0126] The display panel basically includes a substrate (SB), a transistor (TR) formed on the substrate (SB), and a light-emitting element (LED) connected to the transistor (TR). The light-emitting element (LED) can correspond to a pixel.

[0127] The substrate (SB) may be made of a material such as glass. The substrate (SB) may be a flexible substrate containing a polymer resin such as polyimide, polyamide, or polyethylene terephthalate.

[0128] A buffer layer (BFL) may be located on the substrate (SB). The buffer layer (BFL) can improve the characteristics of the semiconductor layer by blocking impurities from the substrate (SB) during the formation of the semiconductor layer, and can relieve stress in the semiconductor layer by flattening the surface of the substrate (SB). The buffer layer (BFL) may include inorganic insulating materials such as silicon nitride (SiNx), silicon oxide (SiOx), and silicon nitrate oxide (SiOxNy), and may be a single layer or a multilayer. The buffer layer (BFL) may also include amorphous silicon (Si).

[0129] A semiconductor layer (AL) of a transistor (TR) may be located on the buffer layer (BFL). The semiconductor layer (AL) may include a first region, a second region, and a channel region between these regions. The semiconductor layer (AL) may include any one of amorphous silicon, polycrystalline silicon, and oxide semiconductor. For example, the semiconductor layer (AL) may include low-temperature polycrystalline silicon (LTPS) or an oxide semiconductor material including at least one of zinc (Zn), indium (In), gallium (Ga), and tin (Sn). For example, the semiconductor layer (AL) may include IGZO (Indium-Gallium-Zinc Oxide).

[0130] A first gate insulating layer (GI1) may be located on the semiconductor layer (AL). The first gate insulating layer (GI1) may include an inorganic insulating material such as silicon nitride, silicon oxide, silicon nitrate, etc., and may be a single layer or a multilayer.

[0131] A first gate conductive layer may be positioned on the first gate insulating layer (GI1), which may include the gate electrode (GE) of a transistor (TR), a gate line (GL), and the first electrode (C1) of a capacitor (CS). The first gate conductive layer may include molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be a single layer or a multilayer.

[0132] A second gate insulating layer (GI2) may be located on the first gate conductive layer. The second gate insulating layer (GI2) may include an inorganic insulating material such as silicon nitride, silicon oxide, silicon nitrate, etc., and may be a single layer or a multilayer.

[0133] A second gate conductive layer, which may include a second electrode (C2) of a capacitor (CS), may be located on the second gate insulating layer (GI2). The second gate conductive layer may include molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be a single layer or a multilayer.

[0134] An interlayer insulating layer (ILD) may be located on the second gate insulating layer (GI2) and the second gate conductive layer. The interlayer insulating layer (ILD) may include an inorganic insulating material such as silicon nitride, silicon oxide, silicon nitrate, etc., and may be a single layer or a multilayer.

[0135] A first data conductive layer may be positioned on an interlayer insulating layer (ILD), which may include a first electrode (SE) and a second electrode (DE) of a transistor (TR), a data line (DL), etc. The first electrode (SE) and the second electrode (DE) may be connected to a first region and a second region of a semiconductor layer (AL), respectively, through contact holes of insulating layers (GI1, GI2, ILD). One of the first electrode (SE) and the second electrode (DE) may be a source electrode and the other may be a drain electrode. The first data conductive layer may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), nickel (Ni), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), copper (Cu), etc., and may be a single layer or a multilayer.

[0136] A first planarization layer (VIA1) may be located on the first data conductive layer. The first planarization layer (VIA1) may be an organic insulating layer. For example, the first planarization layer (VIA1) may include an organic insulating material such as a general-purpose polymer like polymethylmethacrylate or polystyrene, a polymer derivative having a phenolic group, an acrylic polymer, an imide polymer, a polyimide, or a siloxane polymer.

[0137] A second data conductive layer, which may include a voltage line (VL) and a connection line (CL), may be located on the first planarization layer (VIA1). The voltage line (VL) may transmit voltages such as a driving voltage, a common voltage, an initialization voltage, and a reference voltage. The connection line (CL) may be connected to the second electrode (DE) of the transistor (TR) through a contact hole of the first planarization layer (VIA1). The second data conductive layer may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), nickel (Ni), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), copper (Cu), etc., and may be a single layer or a multilayer.

[0138] A second planarization layer (VIA2) may be located on the second data conductive layer. The second planarization layer (VIA2) may be an organic insulating layer. For example, the second planarization layer (VIA2) may include an organic insulating material such as a general-purpose polymer like polymethyl methacrylate or polystyrene, a polymer derivative having a phenolic group, an acrylic polymer, an imide polymer, a polyimide, or a siloxane polymer.

[0139] A first electrode (E1) of a light-emitting element (LED) may be positioned on the second planarization layer (VIA2). The first electrode (E1) may be connected to a connecting line (CL) through a contact hole in the second planarization layer (VIA2). Thus, the first electrode (E1) may be electrically connected to the second electrode (DE) of a transistor (TR) to receive a data signal that controls the brightness of the light-emitting element. The transistor (TR) to which the first electrode (E1) is connected may be a driving transistor or a transistor electrically connected to a driving transistor. The first electrode (E1) may be formed of a reflective conductive material or a semi-transparent conductive material, or it may be formed of a transparent conductive material. The first electrode (E1) may include a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO). The first electrode (E1) may include a metal or metal alloy such as lithium (Li), calcium (Ca), aluminum (Al), silver (Ag), magnesium (Mg), or gold (Au).

[0140] A pixel defining layer (380), which may be an organic insulating layer, may be located on the second flattening layer (VIA2). The pixel defining layer (380) may be called a partition and may have an opening that overlaps with the first electrode (E1).

[0141] A light-emitting layer (EML) of a light-emitting element (LED) may be located on the first electrode (E1). In addition to the light-emitting layer (EML), at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer may be located on the first electrode (E1).

[0142] A second electrode (E2) of a light-emitting element (LED) may be positioned on the light-emitting layer (EML). The second electrode (E2) may be made to have light transmittance by forming a thin layer of a metal or metal alloy with a low work function, such as calcium (Ca), barium (Ba), magnesium (Mg), aluminum (Al), or silver (Ag). The second electrode (E2) may include a transparent conductive oxide such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0143] The first electrode (E1), the light-emitting layer (EML), and the second electrode (E2) of each pixel form a light-emitting element (LED), such as an organic light-emitting element. The first electrode (E1) may be the anode of the light-emitting element, and the second electrode (E2) may be the cathode of the light-emitting element.

[0144] A capping layer (CPL) may be positioned on the second electrode (E2). The capping layer (CPL) can increase light efficiency by adjusting the refractive index. The capping layer (CPL) may be positioned to completely cover the second electrode (E2). The capping layer (CPL) may include an organic insulating material or an inorganic insulating material.

[0145] An encapsulation layer (400) may be positioned on top of the capping layer (CPL). The encapsulation layer (400) can encapsulate a light-emitting element (LED) to prevent moisture or oxygen from penetrating from the outside. The encapsulation layer (400) may be a thin film encapsulation layer comprising one or more inorganic encapsulation films (401, 403) and one or more organic encapsulation films (402).

[0146] A touch sensor layer (TSL) including touch electrodes may be located on the encapsulation layer (400). The touch electrodes may have a mesh shape having an opening that overlaps with a light-emitting element (LED).

[0147] A light control unit (10) may be located on the touch sensor layer (TSL). A cover window for protecting the entire front surface of the display panel may be located on the light control unit (10).

[0148] A protective film for protecting the display panel may be located beneath the substrate (SB). Beneath the protective film, a functional sheet may be located that includes at least one of a cushion layer, a heat dissipation sheet, a light-blocking sheet, a waterproof tape, and an electromagnetic shielding layer.

[0149] Light emitted from the light-emitting layer (EML) of the display panel can be seen by the user through the light control unit (10) and the cover window. At this time, light emitted at an angle greater than a predetermined angle upward or downward relative to the direction perpendicular to the cover window can be blocked by the light-blocking patterns (BL) included in the light control unit (10). Since the light control unit (10) according to one embodiment includes an inclined surface with a tapered side, the side light reflectivity can be improved. Various modified embodiments of the light-blocking pattern (BL) constituting the light control unit (10), as seen in FIGS. 1 to 21, may be applied.

[0150] Hereinafter, various effects of a display device including a light control unit according to one embodiment will be examined through FIGS. 23 to 25.

[0151] FIG. 23 is a drawing of a display device according to one embodiment viewed from various angles.

[0152] Referring to FIG. 23, a display device (1000) according to one embodiment displays an image to a user in a direction facing the user, and the image may not be visible at an angle greater than a certain angle. Accordingly, it may have a privacy protection function that protects information displayed on the screen from people around in public places.

[0153] FIGS. 24 and FIGS. 25 show a case where a display device according to one embodiment is applied to a vehicle. FIG. 24 is a diagram showing a light path emitted from a display device according to an embodiment, and FIG. 25 is a diagram showing a light path emitted from a display device according to a comparative example.

[0154] Referring to FIG. 24, in the case of a display device including a light control unit, light emitted toward a car window (e.g., a windshield) can be blocked within the display device. Therefore, light emitted from the display device can be prevented from reflecting onto the car windshield. By blocking light directed toward the car windshield, the formation of a reflected image can be prevented, and the safety of the driver can be ensured.

[0155] Referring to Fig. 25, in the case of a display device that does not include a light control unit, the light emitted from the display device is emitted at various angles, and some of the light is emitted toward the windshield of a car, which may cause a problem where it is seen by the user as a reflected image.

[0156] Although embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements by those skilled in the art using the basic concept of the present invention as defined in the following claims also fall within the scope of the present invention. Explanation of the symbols

[0157] 10: Optical control unit LED: Light-emitting element EML, EMLr, EMLg, EMLb: Emissive layer BL: Light-blocking pattern TOL: Transmissive part TOLa, TOLb: Transparent organic film TIL: Transparent inorganic membrane 400: Bag layer 401: Lower Weapon Shield 402: Organic bag 403: Upper Weapon Shield 1000: Display device

Claims

Claim 1 A display device comprising a substrate, a light-emitting element positioned on the substrate and including a light-emitting layer, and a light control unit positioned on the light-emitting element, wherein the light control unit comprises a plurality of light-blocking patterns extending in a first direction and spaced apart along a second direction intersecting the first direction, and a transparent portion positioned between the plurality of light-blocking patterns and extending in the first direction, wherein the transparent portion comprises a first transparent organic film, a transparent inorganic film positioned on the first transparent organic film, and a second transparent organic film positioned on the transparent inorganic film. Claim 2 In claim 1, the first transparent organic film is a display device having a cross-section that is purely tapered. Claim 3 In paragraph 2, the second transparent organic film is a display device having a cross-section that is square in shape or inversely tapered. Claim 4 A display device according to claim 1, wherein the cross-section of the first transparent organic film is inversely tapered and the cross-section of the second transparent organic film is in a forward tapered shape. Claim 5 In claim 1, the transparent inorganic film is positioned to be in contact with the upper surface of the first transparent organic film and the lower surface of the second transparent organic film. Claim 6 In claim 1, the plurality of light-blocking patterns is a display device having a lower cross-section in the shape of an inverted tapere. Claim 7 In claim 1, the plurality of light-blocking patterns are a display device having a cross-section in the shape of a diamond or an hourglass. Claim 8 In claim 1, the first transparent organic film is a display device having a height of 3 μm to 5 μm in the thickness direction of the substrate. Claim 9 In claim 1, the transparent portion is a display device having a height of 6 μm to 10 μm in the thickness direction of the substrate. Claim 10 In claim 1, the plurality of light-blocking patterns comprises a light-absorbing material having an optical density (OD) of 1.5 to 2.0, in a display device. Claim 11 A method for manufacturing a display device comprising the steps of: forming a light-emitting element on a substrate; forming an encapsulation layer covering the light-emitting element; and forming a light-blocking pattern on the light-emitting element, wherein the step of forming the light-blocking pattern comprises: forming a first transparent organic film pattern extending in a first direction on the encapsulation layer; forming a transparent inorganic film pattern overlapping the first transparent organic film pattern; forming a second transparent organic film pattern overlapping the transparent inorganic film pattern; and applying a light-blocking material, and filling the openings between the first transparent organic film pattern, between the transparent inorganic film pattern, and between the second transparent organic film pattern with the light-blocking material. Claim 12 In claim 11, the first transparent organic film pattern is a method for manufacturing a display device having a cross-section that is a purely tapered shape. Claim 13 In claim 12, the method for manufacturing a display device wherein the second transparent organic film pattern has a cross-section that is square in shape or inversely tapered. Claim 14 A method for manufacturing a display device according to claim 11, wherein the cross-section of the first transparent organic film is inversely tapered and the cross-section of the second transparent organic film is in a positively tapered shape. Claim 15 A method for manufacturing a display device according to claim 11, wherein the transparent inorganic film pattern is formed to be in contact with the upper surface of the first transparent organic film pattern and the lower surface of the second transparent organic film pattern. Claim 16 In claim 11, the light-blocking pattern is a method for manufacturing a display device in which the lower cross-section has an inverted tapered shape. Claim 17 In claim 11, the above-mentioned light-blocking pattern is a method for manufacturing a display device in which the cross-section is in the shape of a diamond or an hourglass. Claim 18 A method for manufacturing a display device according to claim 11, wherein the first transparent organic film pattern is formed with a height of 3 μm to 5 μm in the thickness direction of the substrate. Claim 19 A method for manufacturing a display device according to claim 11, wherein the light-blocking pattern is formed with a height of 6 μm to 10 μm in the thickness direction of the substrate. Claim 20 In claim 11, the method for manufacturing a display device comprises a light-absorbing material having an optical density (OD) of 1.5 to 2.0, wherein the light-blocking pattern comprises a light-absorbing material.

Images