Probe-head for electrical device inspection and manufacturing method thereof

Abstract

A probe head capable of measuring multiple inspection target devices simultaneously is disclosed. The probe head according to the present invention is characterized by an elastic body formed by stacking a plurality of elastic layers and an electrode portion embedded within the elastic body. Through this, shocks or loads generated upon contact with the inspection target device are efficiently absorbed, thereby preventing damage to the inspection target device and the probe head. Furthermore, according to the present invention, multiple electrical devices can be inspected simultaneously, thereby reducing the required inspection time. In addition, independent elasticity is provided between each probe pin, further enhancing inspection stability and reliability.

Description

Technology Field

[0001] The present invention relates to a probe head for inspecting electrical devices. More specifically, the present invention relates to a probe head capable of inspecting minute electrical devices of micrometer (μm) size and absorbing shocks or loads generated during inspection through an elastic body. Background Technology

[0002] After an electrical device is manufactured, it is necessary to connect inspection equipment to the device to test its electrical characteristics. While inspection could be performed simply by a person connecting the inspection equipment to the device's electrodes, manually inspecting each product individually during the mass production process consumes significant time and cost. Therefore, probe heads that mechanically contact the electrical device to provide an electrical connection have been developed and are in use.

[0003] However, there is a problem in that the probe head may break as it repeatedly contacts the device under inspection, leading to the accumulation of impact or load resulting from the contact action. Additionally, if the heights of the various contact terminals of the device under inspection do not match, not all terminals are contacted simultaneously, making it difficult to inspect multiple terminals at the same time. Prior art literature

[0004] Republic of Korea Registered Utility Model No. 20-0458537 (Registered February 3, 2012) Republic of Korea Registered Utility Model No. 20-0399963 (Registered October 24, 2005) The problem to be solved

[0005] The technical problem of the present invention is to provide a probe head capable of measuring multiple inspection target devices simultaneously.

[0006] Another technical objective of the present invention is to efficiently absorb the impact or load generated upon contact to prevent damage to the device under inspection and the probe head. means of solving the problem

[0007] To solve the above-mentioned problem, the present invention provides a probe head characterized by an elastic body formed by stacking a plurality of elastic layers and an electrode portion embedded inside the elastic body. Effects of the invention

[0008] According to the present invention, the inspection time required can be reduced by simultaneously inspecting a number of electrical devices.

[0009] In addition, according to the present invention, damage to the device under inspection is prevented and the durability of the probe head is increased.

[0010] Furthermore, the probe head according to the present invention has independent elasticity between each probe pin, thereby further improving inspection stability and inspection reliability. Brief explanation of the drawing

[0011] Figure 1 shows the vertical cross-sectional structure of a probe head according to a first embodiment of the present invention. Figure 2 shows a state in which a load is applied to one probe pin of a probe head according to the first embodiment of the present invention. Figure 3 shows the vertical cross-sectional shape of the electrode portion according to the first embodiment of the present invention. Figure 4 shows the vertical cross-sectional structure of a probe head according to a second embodiment of the present invention. FIG. 5 is a flowchart illustrating a method for manufacturing a probe head according to a first embodiment of the present invention. FIG. 6 illustrates the step of laminating a first elastic layer according to a first embodiment of the present invention. FIG. 7 illustrates the step of laminating a second elastic layer according to a first embodiment of the present invention. FIG. 8 illustrates the step of forming an inclined surface by etching a first elastic layer and a second elastic layer according to a first embodiment of the present invention. FIG. 9 illustrates the step of laminating a third elastic layer according to the first embodiment of the present invention. FIG. 10 illustrates the step of forming an electrode portion according to the first embodiment of the present invention. FIG. 11 shows a plan view of a probe head according to a first embodiment of the present invention. FIG. 12 illustrates the step of laminating a fourth elastic layer according to the first embodiment of the present invention. FIG. 13 shows the state of forming a hole mask during the step of forming a via hole according to the first embodiment of the present invention. FIG. 14 shows the formation of a via hole according to a first embodiment of the present invention. FIG. 15 illustrates the step of forming a probe pin according to the first embodiment of the present invention. FIG. 16 illustrates the step of protruding the upper part of the probe pin according to the first embodiment of the present invention. FIG. 17 shows a step of forming a groove according to a first embodiment of the present invention. Figure 18 is an enlarged view of part (A) of Figure 17. Figure 19 shows the high-temperature plasma treatment step. Figure 20 shows the wet etching process step. Figure 21 shows the step of connecting a flexible printed circuit board to the electrode portion. FIG. 22 illustrates the step of depositing a first electrode according to a second embodiment of the present invention. FIG. 23 illustrates the steps of laminating a first elastic layer and laminating a second elastic layer according to a second embodiment of the present invention. FIG. 24 illustrates the step of forming an inclined surface by etching the first elastic layer and the second elastic layer according to the second embodiment of the present invention. FIG. 25 illustrates the step of laminating a third elastic layer according to a second embodiment of the present invention. FIG. 26 illustrates the step of forming a first via mask according to a second embodiment of the present invention. FIG. 27 illustrates the step of forming a first via hole and exposing the edge portion of a first electrode according to a second embodiment of the present invention. FIG. 28 illustrates the step of forming a via electrode according to a second embodiment of the present invention. FIG. 29 illustrates the step of depositing a second electrode according to a second embodiment of the present invention. FIG. 30 illustrates the step of laminating a fourth elastic layer according to a second embodiment of the present invention. FIG. 31 illustrates the step of forming a second via mask according to a second embodiment of the present invention. FIG. 32 illustrates the step of forming a second via hole according to a second embodiment of the present invention. FIG. 33 illustrates the step of forming a probe pin according to a second embodiment of the present invention. FIG. 34 illustrates the step of protruding the upper part of the probe pin and the edge portion of the first electrode according to the second embodiment of the present invention. FIG. 35 shows a step of forming a groove according to a second embodiment of the present invention. FIG. 36 illustrates the step of connecting a flexible printed circuit board to a first electrode according to a second embodiment of the present invention. Specific details for implementing the invention

[0012] The terms used in this specification will be briefly explained, and an embodiment of the present invention will be described in detail. The terms used in this specification have been selected to be as generally used as possible, taking into account their functions in the present invention; however, these terms may vary depending on the intent of those skilled in the art, case law, the emergence of new technologies, etc. Additionally, in specific cases, terms may be arbitrarily selected by the applicant, and in such cases, their meanings will be described in detail in the relevant description of the invention. Therefore, the terms used in this specification should be defined not merely by their names, but based on their meanings and the overall content of the present invention.

[0014] Hereinafter, embodiments according to the present invention will be described in detail with reference to the attached drawings.

[0016] FIG. 1 shows a vertical cross-sectional structure of a probe head according to a first embodiment of the present invention. In the drawings below, including FIG. 1, "upper side" is defined as the direction of the surface where the device under inspection (DUT) contacts the probe head. Additionally, the description is based on the assumption that the upward direction of each drawing is the upper side.

[0017] A probe head according to a first embodiment of the present invention comprises: an elastic body (10) formed with a predetermined thickness on the upper surface of a substrate; an electrode portion (20) embedded inside the elastic body (10); a probe pin (30) protruding upward from the elastic body (10); and a second elastic layer (12) embedded inside the elastic body (10).

[0019] The substrate (Sub) is configured to facilitate the formation of the probe head structure and to support the manufactured probe head.

[0020] The substrate (Sub) may be provided with the same material as a commonly used substrate. Preferably, the substrate (Sub) of the probe head according to the present invention is an insulating material and may be provided with a material and thickness having sufficient hardness to withstand the load applied when the probe pin (30) comes into contact with the device under test (DUT).

[0021] In a preferred embodiment, the substrate (Sub) may be provided with a transparent material with a thickness of approximately 300 μm. This is to align the probe pin (30) with the device to be inspected, and the material may be selected from aluminum oxide (Al2O3), glass, quartz, ceramic, or silicon (Si).

[0023] The elastic body (10) is configured to absorb and disperse the impact and load applied to the probe head when the device to be inspected and the probe pin (30) come into contact. To this end, the elastic body (10) is laminated in the form of a flat plate with a predetermined thickness on the upper surface of a substrate (Sub) using a synthetic resin material having a predetermined elasticity. Preferably, the elastic body (10) may be provided with a thickness of at least 50 μm.

[0024] The elastic body (10) can be formed by coating a synthetic resin material onto the upper surface of a substrate (Sub). According to one embodiment, the elastic body (10) can be formed on the upper surface of a substrate (Sub) by a spin-coating method.

[0025] Preferably, the elastomer (10) may be made of polydimethylsiloxane (PDMS). More preferably, the elastomer (10) may be a combination of PDMS and silicon-based materials, and may be a material with improved adhesion. Accordingly, a strong bond is formed with the substrate, and durability can be improved.

[0026] Additionally, it is preferable that the elastic body (10) be made of a material having a lower coefficient of thermal expansion than the second elastic layer (12). This is because the second elastic layer (12) primarily performs the role of absorbing shock and load, while the elastic body (10) suppresses deformation under thermal or chemical conditions during the semiconductor process to improve quality. Specifically, since the probe head is utilized in the semiconductor manufacturing process, it may be exposed to heat generated during the semiconductor manufacturing process and chemicals used. If the second elastic body (10) is deformed by heat, its elasticity may be lost, and it may lose its function of absorbing shock and load. Furthermore, since the probe head may be manufactured through a process similar to the semiconductor manufacturing process, there is a need to protect the second elastic layer (12) and the electrode part (20) from the heat generated and chemicals used during the manufacturing of the probe head.

[0027] In particular, if the second elastic layer (12) is deformed by heat, the surface may be formed unevenly, or buckling or cracking may occur, making it difficult to deposit the electrode and causing problems such as malfunction or breakage of the manufactured probe head.

[0028] Preferably, the elastomer (10) may be a synthetic resin material comprising 1-Methoxy-2-propanol acetate, Modified epoxy acrylate, Aliphatic acrylate, Urethane acrylate, Photoactive additives and Polysiloxane additives. Accordingly, the coefficient of thermal expansion of the elastomer (10) is 100 ppm / °C (Linear CTE by DMA) or less, which is lower than the coefficient of thermal expansion Linear CTE (by DMA) of PDMS, which can be used as the second elastic layer (12), 340 ppm / °C.

[0030] Referring to FIG. 1, the second elastic layer (12) is embedded inside the elastic body (10), so the second elastic layer (12) can be protected during a heat generation process such as the deposition of the electrode part (20). In addition, since the electrode part (20) is also embedded inside the elastic body (10), corrosion by chemical substances can be prevented.

[0032] The probe pin (30) is configured to provide an electrical connection with the inspection device by coming into contact with the inspection target device. To this end, the probe pin (30) is provided in the form of a pin made of metal material that protrudes upward from the elastic body (10) and is connected to the electrode part (20). The probe pin (30) may be composed of a metal material such as Cu, Au, Ni, Be, NiCo, NiPd, or BeNi, or a combination thereof.

[0034] The electrode portion (20) is configured to provide an electrical connection between the probe pin (30) and the inspection device. To this end, the electrode portion (20) is provided with a metal material on the upper surface of the substrate (Sub), and a plurality of electrode portions (20) can be appropriately arranged according to the size of the device to be inspected and the size of the electrode of the device to be inspected. The electrode portion (20) can be provided with a material of a commonly used metal such as Ti, Cr, Cu, Au, or Al, or a combination thereof.

[0036] In addition, the electrode portion (20) according to the present invention is characterized by being embedded inside the elastic body (10). That is, the elastic body (10) is formed on the upper surface of the substrate (Sub), the electrode portion (20) is embedded inside the elastic body (10), and the probe pin (30) protrudes upward by penetrating the elastic body (10) vertically from the electrode portion (20). However, the term 'embedded' here does not mean that the entire electrode portion (20) is embedded, but that at least a part of it may be exposed to the outside of the elastic body (10). This is to allow for electrical connection with the inspection device.

[0037] In detail, one end of the electrode portion (20) protrudes from the side of the elastic body (10) and is connected to a flexible printed circuit board (F-PCB), and the other end is connected to a probe pin (30). The probe pin (30) is formed to protrude upward from the upper surface of the electrode portion (20), and an electrical connection is established between the electrode portion (20), the probe pin (30), the flexible printed circuit board (F-PCB), and the device to be inspected by the probe pin (30) coming into contact with the device to be inspected.

[0039] The second elastic layer (12) is configured to absorb and disperse impact and load applied to the probe head portion as described above. Preferably, the second elastic layer (12) may be a material comprising at least one selected from the group consisting of elastolefin, thermoplastic olefin, thermoplastic polyurethane, synthetic polyisoprene, chloroprene rubber, styrene-butadiene, epichlorohydrin rubber, polyacrylic rubber, silicone rubber, fluorosilicone rubber, fluoroelastomers, and polydimethylsiloxane.

[0040] Preferably, the second elastic layer (12) may be provided with a shape in which the width increases from the upper side to the lower side. Referring to FIG. 1, it can be seen that the second elastic layer (12) has a vertical cross-section in the shape of a parallelogram, with the lower side being larger than the upper side. This is to facilitate the distribution of the load applied from the upper side to the lower side. Specifically, since the area of ​​the second elastic layer (12) increases towards the lower side, the applied force is distributed over a wider area, preventing the force from being concentrated only at a narrow point.

[0041] In addition, the shape of this second elastic layer (12) facilitates the formation of the shape of the electrode portion (20) to be described later. This will be described later with reference to FIGS. 9 and FIGS. 10.

[0043] FIG. 2 shows a state in which a load is applied to one probe pin (30) of a probe head according to the first embodiment of the present invention.

[0044] As the electrode portion (20) is embedded inside the elastic body (10), when a plurality of electrode portions (20) are provided, each electrode portion (20) is insulated so that electrical interference between them can be prevented.

[0045] In addition, as shown in FIG. 3, the impact and load that may occur when the device under inspection (DUT) comes into contact with the probe tip are absorbed and dispersed by the elasticity of the elastic part. Accordingly, damage to the device under inspection and the probe head is prevented, thereby improving the operational stability of the probe head and enabling the inspection work to be processed quickly.

[0047] Preferably, an isolation portion may be formed in the elastic body (10). The isolation portion is a space between the probe pin (30) and the elastic body (10) formed by being spaced apart from the outer surface of the probe pin (30) by a predetermined width.

[0048] By forming an isolation, each probe pin (30) maintains a fine gap with the elastic body (10), thereby reducing friction with the elastic body (10).

[0049] Referring to FIG. 2, it can be seen that friction with the elastic layer is prevented even when the probe pin (30) is retracted downward by the load during measurement (refer to the right probe pin in FIG. 2) and restored to its normal position after measurement (refer to the left probe pin in FIG. 2). Accordingly, the risk of malfunction or damage to the probe head caused by friction with the elastic layer can be reduced.

[0050] Furthermore, each probe pin (30) can have an independent elastic force without interference with other adjacent probe pins (30). Referring to FIG. 2, as the probe pin (30) is separated from the elastic body (10) by the isolation, it can be seen that even if the elastic body (10) is deformed due to the retraction of the probe pin, such as the right probe pin, adjacent probe pins, such as the left probe pin, are not affected.

[0052] FIG. 3 shows the vertical cross-sectional shape of the electrode portion (20) according to the first embodiment of the present invention.

[0053] The electrode portion (20) may be provided in a stepped shape to easily transmit impact and load to the elastic body (10) and the second elastic layer (12).

[0054] In detail, the first end (201) and the other end (203) of the electrode portion (20) are formed at different heights. The height of the other end (203) of the electrode portion (20) is located higher than the height of the first end (201), and between the first end (201) and the other end (203) of the electrode portion (20), a sloped portion (202) is formed in which the height increases from the first end (201) to the other end (203).

[0055] The reason the inclined section (202) is formed instead of a right-angled step shape is to prevent damage to the electrode section (20) by dispersing the transmitted force. If it were provided in a right-angled shape, it would be difficult to transmit force in the vertical direction, so the force would be concentrated at the bending part and the electrode section (20) could be damaged.

[0056] To prevent this, the electrode portion (20) is provided in a stepped shape with an inclined portion (202) formed therein to facilitate the transmission of force. Since the other end (203) and the inclined portion (202) form a gentle angle rather than a vertical one, when an impact or load is applied to the other end (203), the force is easily transmitted to the inclined portion (202), and the force is transmitted to the elastic body (10) and the second elastic layer (12) through the elastic deformation of the entire electrode portion (20).

[0058] Figure 4 shows the vertical cross-sectional structure of a probe head according to a second embodiment of the present invention.

[0059] A probe head according to a second embodiment of the present invention comprises: an elastic body (10') formed with a predetermined thickness on the upper surface of a substrate; a first electrode (21) located on the lower side of the elastic body (10'); a second electrode (22) embedded inside the elastic body (10') and located on the upper side of the first electrode (21); a via electrode (31) electrically connecting the first electrode (21) and the second electrode (22); a probe pin (30') protruding upward from the elastic body (10'); and a second elastic layer (12') embedded inside the elastic body (10').

[0061] The first electrode (21) is a component that provides an electrical connection with the inspection device. To this end, the first electrode (21) is provided with a metal material on the upper surface of the substrate (Sub), and a plurality of first electrodes (21) can be appropriately arranged according to the size of the device to be inspected and the size of the electrode of the device to be inspected. Both lateral ends protrude beyond the side of the elastic body (10'). The first electrode (21) may be provided with a material of a commonly used metal such as Ti, Cr, Cu, Au, or Al, or a combination thereof.

[0063] The elastic body (10') is configured to absorb and disperse the impact and load applied to the probe head when the device to be inspected and the probe pin (30') come into contact, as in the first embodiment. To this end, the elastic body (10') is laminated in the form of a flat plate with a predetermined thickness on the upper surface of a substrate (Sub) using a synthetic resin material having a predetermined elasticity. Preferably, the elastic body (10') may be provided with a thickness of at least 50 μm.

[0064] The elastic body (10') can be formed by coating on the upper surface of the substrate (Sub). According to one embodiment, the elastic layer (10') can be formed on the upper surface of the substrate (Sub) by spin-coating.

[0066] The second electrode (22) is configured to provide an electrical connection to the probe pin (30') and to transmit an impact or load to the elastic body (10'). Specifically, the second electrode (22) is embedded inside the elastic body (10') and is located above the first electrode (21).

[0067] The second electrode (22) is electrically connected to the first electrode (21) through a via electrode (31). Specifically, the via electrode (31) is formed to penetrate vertically through the interior of the elastic body (10') from one end of the second electrode (22) and to be electrically connected to the upper surface of the first electrode (21).

[0069] One end of the probe pin (30') is connected to the other end of the second electrode (22), and the other end penetrates the elastic body (10') and protrudes upward from the elastic body (10').

[0070] That is, a via electrode (31) is connected to one end of the second electrode (22), and a probe pin (30) is connected to the other end of the second electrode (22). Accordingly, the impact or load applied to the probe pin (30) is not directly transmitted to the via electrode (31), but is transmitted to the elastic body (10') and the second elastic layer (12') through the elastic deformation of the second electrode (22).

[0072] In this way, unlike the electrode portion (20) in the first embodiment, the second embodiment is formed with a structure of a first electrode (21), a via electrode (31), and a second electrode (22). In the first embodiment, the electrode portion (20) does not come into direct contact with the second elastic layer (12'), whereas in the second embodiment, the via electrode (31) penetrates the second elastic layer (12') vertically and comes into direct contact with it. Accordingly, the force applied to the via electrode (31) is directly transmitted to the second elastic layer (12'), making it easier for the second elastic layer (12') to absorb impact or load.

[0074] Similar to the first embodiment, the second elastic layer (12') may be provided with a shape in which the width increases from the upper side to the lower side. This allows the load applied from the upper side to be easily distributed to the lower side.

[0076] In addition, as in the first embodiment, an isolation portion may be formed in the elastic body (10'). By forming the isolation portion, each probe pin (30') maintains a fine gap with the elastic body (10'), thereby reducing friction with the elastic body (10').

[0078] As described above, the probe head according to the first and second embodiments of the present invention can easily absorb shocks or loads generated during inspection, thereby preventing damage to the probe head or the device to be inspected, and can improve inspection stability and inspection reliability.

[0079] In addition, the loss of elasticity due to deformation of part and all of the second elastic layer (12, 12') under thermal and chemical conditions, and corrosion of the electrode part (20) or each electrode can be prevented, thereby improving quality and increasing durability.

[0080] Furthermore, the deformation of the array of probe pins (30, 30') formed on the elastic body (10, 10') is minimized, and independent elastic action of each probe pin (30, 30') is possible, thereby further improving the reliability during measurement.

[0082] Hereinafter, a method for manufacturing a probe head according to each embodiment of the present invention will be described with reference to FIGS. 5 to 36.

[0083] A method for manufacturing a probe head according to a first embodiment of the present invention will be described with reference to FIGS. 5 to 21, and a method for manufacturing a probe head according to a second embodiment of the present invention will be described with reference to FIGS. 22 to 36.

[0085] FIG. 5 is a flowchart illustrating a method for manufacturing a probe head according to a first embodiment of the present invention. A probe head according to a first embodiment of the present invention can be manufactured through a manufacturing method comprising each of the following steps.

[0086] (S101) Step of laminating a first elastic layer (11) on the upper surface of a substrate;

[0087] (S102) A step of laminating a second elastic layer (12) on the upper surface of the first elastic layer (11);

[0088] (S103) A step of etching the first elastic layer (11) and the second elastic layer (12) to form an inclined surface;

[0089] (S104) A step of laminating a third elastic layer (13) on the upper surface of the substrate, the inclined surface, and the second elastic layer (12);

[0090] (S105) A step of forming an electrode portion (20) by depositing metal on the upper surface of the third elastic layer (13);

[0091] (S106) A step of laminating a fourth elastic layer (14) on the upper surface of the electrode portion (20);

[0092] (S107) A step of forming a hole mask on the upper surface of the fourth elastic layer (14) and etching up to the upper surface of the electrode portion (20) to form a via hole (H1);

[0093] (S108) A step of forming a probe pin (30) by filling the via hole (H1) with metal;

[0094] (S109) A step of etching the upper side of the fourth elastic layer (14) to a predetermined thickness to protrude the upper part of the probe pin (30);

[0096] FIG. 6 illustrates the step (S101) of laminating a first elastic layer (11) according to the first embodiment of the present invention. The first elastic layer (11) is configured to form an elastic body (10) by combining with the third elastic layer (13) and the fourth elastic layer (14) to be described later. Specifically, the first elastic layer (11) is laminated by coating a synthetic resin material on the upper surface of a substrate. Preferably, the first elastic layer (11) can be formed on the upper surface of a substrate (Sub) by a spin-coating method.

[0097] In addition, it is preferable that the first elastic layer (11) be made of a material with the highest adhesion among the plurality of elastic layers described later. Accordingly, the elastic body (10) formed by stacking the plurality of elastic layers is strongly bonded to the substrate, thereby improving the durability of the probe head.

[0099] FIG. 7 illustrates the step (S102) of laminating a second elastic layer (12) according to the first embodiment of the present invention. A second elastic layer (12) is laminated by coating a synthetic resin material on the upper surface of the first elastic layer (11).

[0101] FIG. 8 illustrates a step (S103) of etching the first elastic layer (11) and the second elastic layer (12) according to the first embodiment of the present invention to form a slope. As described above, the second elastic layer (12) is provided with a shape in which the width increases from the upper side to the lower side. To this end, the first elastic layer (11) and the second elastic layer (12) are etched so that the side surface forms a slope.

[0102] Preferably, the interior angle (a) of the slope can be formed to be 80° or less.

[0104] FIG. 9 illustrates the step (104) of laminating a third elastic layer (13) according to the first embodiment of the present invention. The third elastic layer (13) is configured to form an elastic body (10) by combining with the first elastic layer (11) described above and the fourth elastic layer (14) described later. Specifically, the third elastic layer (13) is laminated by coating a synthetic resin with a predetermined thickness on the upper surface of the first elastic layer (11), the inclined surface, and the second elastic layer (12). By laminating the third elastic layer (13) with a uniform thickness, an incline corresponding to the inclined surface is formed in the third elastic layer (13).

[0105] The third elastic layer (13) may be made of the same material as the first elastic layer (11). Alternatively, it may be made of a material different from the first elastic layer (11), but with a thermal expansion coefficient smaller than that of the second elastic layer (12).

[0106] By stacking the third elastic layer (13), the second elastic layer (12) is embedded between the first elastic layer (11) and the third elastic layer (13).

[0107] In the drawings below, the first elastic layer (11) and the third elastic layer (13) are combined and shown as the drawing reference of the elastic body (10).

[0109] FIG. 10 illustrates the step (S105) of forming an electrode portion (20) according to the first embodiment of the present invention. An electrode portion (20) is formed by depositing a metal on the upper surface of the third elastic layer (13). More specifically, the electrode portion (20) is deposited on the upper surface of the first elastic layer (11), the slope of the third elastic layer (13), and the upper surface of the third elastic layer (13). Considering that a plurality of electrode portions (20) are spaced apart, a deposition technique known in the past, such as photolithography, may be utilized. A detailed description thereof is omitted in this specification.

[0110] FIG. 11 shows a plan view of a probe head according to a first embodiment of the present invention. Referring to FIG. 11, the shape of the electrode portion (20) on the planar surface can be changed considering the arrangement of each probe pin (30) and is not limited to a specific shape.

[0112] FIG. 12 illustrates the step (S106) of laminating a fourth elastic layer (14) according to the first embodiment of the present invention. The fourth elastic layer (14) is configured to be combined with the first elastic layer (11) and the third elastic layer (13) described above to form an elastic body (10). Specifically, the fourth elastic layer (14) is laminated by coating a synthetic resin with a predetermined thickness on the upper surface of the electrode portion (20) and the third elastic layer (13). However, the fourth elastic layer (14) is laminated so that its upper surface forms a flat plane. This can be achieved by repeatedly laminating a plurality of elastic layers.

[0113] The fourth elastic layer (14) may be made of the same material as the first elastic layer (11) or the third elastic layer (13). Alternatively, it may be made of a material different from the first elastic layer (11) and the third elastic layer (13), but with a thermal expansion coefficient smaller than that of the third elastic layer (13).

[0114] By stacking the fourth elastic layer (14), the electrode portion (20) is embedded between the third elastic layer (13) and the fourth elastic layer (14).

[0115] In the drawings below, the first elastic layer (11), the third elastic layer (13), and the fourth elastic layer (14) are combined and shown as the drawing reference of the elastic body (10).

[0117] FIG. 13 shows the state (S1071) in which a hole mask is formed during the step (S107) of forming a via hole (H1) according to the first embodiment of the present invention. In order to form the via hole (H1) to be described later, a hole mask is formed on the upper surface of the fourth elastic layer (14). Here, the via hole (H1) refers to a hole formed to penetrate vertically from the upper surface of the elastic body (10) to the upper surface of the electrode part (20) at the location where the probe pin (30) is to be formed. The hole mask is formed to expose the location (P) where the via hole (H1) is to be formed on the upper surface of the fourth elastic layer (14) and to mask the remaining part.

[0118] Additionally, it is preferable that the hole mask be masked so that the outer edge portion (B1) of the fourth elastic layer (14) is exposed. This is because the outer portion of the fourth elastic layer (14) must also be etched so that one end of the electrode portion (20) is exposed to the side of the probe head.

[0120] FIG. 14 illustrates the formation of a via hole (H1) (S1072) according to a first embodiment of the present invention. A via hole (H1) is formed by etching through a hole mask. Here, the via hole (H1) is etched to a depth where the upper surface of the electrode portion (20) is exposed. At the same time, as shown in FIG. 14, it is preferable that the edge portion of the fourth elastic layer (14) is also etched, leaving a predetermined thickness.

[0122] FIG. 15 illustrates the step (S108) of forming a probe pin (30) according to the first embodiment of the present invention. The probe pin (30) is formed by filling a via hole (H1) with metal.

[0124] FIG. 16 illustrates a step (S109) of protruding the upper portion of a probe pin (30) according to a first embodiment of the present invention. The upper portion of the probe pin (30) is protruded by etching the upper portion of the fourth elastic layer (14) to a predetermined thickness. At the same time, the edge portion of the fourth elastic layer (14) is etched together so that one end of the electrode portion (20) is exposed to the side of the probe head.

[0126] FIG. 17 shows a step (S110) of forming an isolation portion according to a first embodiment of the present invention, and FIG. 18 shows an enlarged view of a part (A) of FIG. 17.

[0127] As described above, as a preferred embodiment of the present invention, an isolation portion may be formed. The isolation portion is formed by etching the fourth elastic layer (14) within a predetermined width (d1 in FIG. 18) from the outer surface of the probe pin (30) after the step of protruding the upper part of the probe pin (30), thereby separating a part of the outer surface of the probe pin (30) from the fourth elastic layer (14).

[0129] Preferably, the isolation can be formed through wet etching using NMP (N-methyl-2-pyrrolidinone), a mixture of NMP and TBAF (Tetrabutylammonium fluoride), or a hydrofluoric acid-based solution after high temperature plasma treatment of the elastomer (10).

[0130] FIG. 19 illustrates a high-temperature plasma treatment step. When the upper surface of the fourth elastic layer (14) is treated with high-temperature plasma, the corner portion adjacent to the probe pin (30) is deformed and separated from the outer surface of the probe pin (30).

[0131] Figure 20 illustrates the wet etching process step. The gaps separated during the high-temperature plasma treatment step are further widened through wet etching. This forms an isolation.

[0133] FIG. 21 shows the step (S111) of connecting a flexible printed circuit board (F-PCB) to an electrode portion (20).

[0134] Finally, the manufacturing of the probe head according to the first embodiment of the present invention is completed by connecting a flexible printed circuit board (F-PCB) to the exposed portion of the electrode portion (20).

[0136] Hereinafter, a method for manufacturing a probe head according to a second embodiment of the present invention will be described with reference to FIGS. 22 to 36.

[0138] A probe head according to a second embodiment of the present invention can be manufactured through a manufacturing method comprising each of the following steps.

[0139] (S201) A step of depositing a first electrode (21) on the upper surface of a substrate;

[0140] (S202) Step of laminating a first elastic layer (11') on the upper surface of the first electrode (21);

[0141] (S203) Step of laminating a second elastic layer (12') on the upper surface of the first elastic layer (11');

[0142] (S204) A step of etching the first elastic layer (11') and the second elastic layer (12') to form a slope;

[0143] (S205) A step of laminating a third elastic layer (13') on the upper surface of the substrate, the slope, and the second elastic layer (12');

[0144] (S206) A step of forming a first via mask (M1') that masks a portion of the upper surface of the third elastic layer (13), excluding the location of the first via hole (H1') and the edge portion;

[0145] (S207) A step of etching the third elastic layer (13') through the first via mask (M1') to form a first via hole (H1') that penetrates vertically from the first electrode (21) to the upper surface of the third elastic layer (13') and exposing the edge portion of the first electrode (21);

[0146] (S208) A step of forming a via electrode (31) by filling the first via hole (H1') with metal;

[0147] (S209) A step of depositing a second electrode (22) on the upper surface of the via electrode (31) and the third elastic layer (13');

[0148] (S210) A step of laminating a fourth elastic layer (14') on the upper surface of the third elastic layer (13') and the second electrode (22);

[0149] (S211) A step of forming a second via mask (M2') that masks a portion of the upper surface of the fourth elastic layer (14'), excluding the location of the second via hole (H2') and the edge portion;

[0150] (S212) A step of etching the fourth elastic layer (14') through the second via mask (M2') to form a second via hole (H2') that penetrates vertically from the second electrode (22) to the upper surface of the fourth elastic layer (14');

[0151] (S213) A step of forming a probe pin (30') by filling the first via hole (H1') with metal;

[0152] (S214) Step of etching the upper side of the fourth elastic layer (14') to a predetermined thickness to protrude the upper part of the probe pin (30') and the edge portion of the first electrode (21).

[0154] FIG. 22 illustrates a step (S201) of depositing a first electrode (21) according to a second embodiment of the present invention. A first electrode (21) is formed by depositing a metal to a predetermined thickness on the upper surface of a substrate.

[0155] FIG. 22 is a simplified vertical cross-sectional view in which the first electrode (21) is shown covering the entire upper surface of the substrate, but is not limited thereto and can be changed to various shapes considering the arrangement of the probe pins (30'). Additionally, the shape of the first electrode (21) on the plane can be changed considering the arrangement of each probe pin (30') and is not limited to a specific shape.

[0157] FIG. 23 illustrates the step (S202) of stacking a first elastic layer (11') and the step (S203) of stacking a second elastic layer (12') according to a second embodiment of the present invention.

[0158] The first elastic layer (11') is configured to be combined with the third elastic layer (13') and the fourth elastic layer (14'), which will be described later, to form an elastic body (10'). Specifically, the first elastic layer (11') is laminated by coating a synthetic resin material on the upper surface of a substrate. Preferably, the first elastic layer (11') can be formed on the upper surface of a substrate (Sub) by a spin-coating method.

[0159] In addition, it is preferable that the first elastic layer (11') be made of a material with the highest adhesion among the plurality of elastic layers described later. Accordingly, the elastic body (10) formed by stacking the plurality of elastic layers is strongly bonded to the substrate, thereby improving the durability of the probe head.

[0160] After laminating the first elastic layer (11'), a synthetic resin material is coated on the upper surface of the first elastic layer (11') to laminate the second elastic layer (12').

[0162] FIG. 24 illustrates a step (S204) of etching the first elastic layer (11') and the second elastic layer (12') to form an inclined surface according to the second embodiment of the present invention. As described above, the second elastic layer (12') is provided with a shape in which the width increases from the upper side to the lower side. To this end, the first elastic layer (11') and the second elastic layer (12') are etched so that the side surface forms an incline.

[0163] Preferably, the interior angle of the slope (slope') can be formed to be 80° or less.

[0165] FIG. 25 illustrates the step (S205) of laminating a third elastic layer (13') according to a second embodiment of the present invention. The third elastic layer (13') is configured to form an elastic body (10') by combining with the first elastic layer (11') described above and the fourth elastic layer (14') described later. Specifically, the third elastic layer (13') is laminated by coating a synthetic resin on the upper surface of the first elastic layer (11'), the inclined surface, and the second elastic layer (12').

[0166] The third elastic layer (13') may be made of the same material as the first elastic layer (11'). Alternatively, it may be made of a material different from the first elastic layer (11'), but with a thermal expansion coefficient smaller than that of the second elastic layer (12').

[0167] By stacking the third elastic layer (13'), the second elastic layer (12') is embedded between the first elastic layer (11') and the third elastic layer (13').

[0168] In the drawings below, the first elastic layer (11') and the third elastic layer (13') are combined and shown as the drawing reference of an elastic body (10').

[0170] FIG. 26 illustrates the step (S206) of forming a first via mask (M1') according to a second embodiment of the present invention. To form a first via hole (H1') to be described later, a first via mask (M1') is formed on the upper surface of the third elastic layer (13). Here, the first via hole (H1') refers to a hole formed to penetrate vertically from the upper surface of the third elastic layer (13') to the upper surface of the first electrode (21) at the location where the via electrode (31) is to be formed. The first via mask (M1') is formed to expose the location where the first via hole (H1') is to be formed on the upper surface of the third elastic layer (13') and to mask the remaining portion.

[0171] Additionally, it is preferable that the first via mask (M1') be masked so that the outer edge of the third elastic layer (13') is exposed. This is because the outer edge of the third elastic layer (13') must also be etched so that one end of the first electrode (21) is exposed to the side of the probe head.

[0173] FIG. 27 illustrates a step (S207) of forming a first via hole (H1') and exposing the edge portion of the first electrode (21) according to a second embodiment of the present invention. The first via hole (H1') is formed by etching through a first via mask (M1'). Here, the first via hole (H1') is etched to a depth where the upper surface of the first electrode (21) is exposed. At the same time, as shown in FIG. 27, the edge portion of the third elastic layer (13') is also etched, and it is preferable that a slope surrounding the second elastic layer (12') is formed.

[0175] FIG. 28 illustrates the step (S208) of forming a via electrode (31) according to a second embodiment of the present invention. The via electrode (31) is formed by filling a first via hole (H1') with metal.

[0177] FIG. 29 illustrates the step (S209) of depositing a second electrode (22) according to a second embodiment of the present invention. As described above, one end of the second electrode (22) is formed at a location connected to the via electrode (31), and the other end of the second electrode (22) is formed at a location connected to the probe pin (30').

[0179] FIG. 30 illustrates the step (S210) of laminating a fourth elastic layer (14') according to a second embodiment of the present invention. The fourth elastic layer (14') is configured to be combined with the first elastic layer (11') and the third elastic layer (13') described above to form an elastic body (10'). Specifically, the fourth elastic layer (14') is laminated by coating a synthetic resin to a predetermined thickness on the upper surface of both sides of the first electrode (21), the upper surface of the second electrode (22), and the upper surface of the third elastic layer (13'). However, the fourth elastic layer (14') is laminated so that its upper surface forms a flat plane. This can be achieved by repeatedly laminating a plurality of elastic layers.

[0180] The fourth elastic layer (14') may be made of the same material as the first elastic layer (11') or the third elastic layer (13'). Alternatively, it may be made of a material different from the first elastic layer (11') and the third elastic layer (13'), but with a thermal expansion coefficient smaller than that of the third elastic layer (13').

[0181] By stacking the fourth elastic layer (14'), the second electrode (22) is embedded between the third elastic layer (13') and the fourth elastic layer (14').

[0182] In the drawings below, the first elastic layer (11'), the third elastic layer (13'), and the fourth elastic layer (14') are combined and shown as the drawing reference number of the elastic body (10').

[0184] FIG. 31 illustrates the step (S211) of forming a second via mask (M2') according to a second embodiment of the present invention. To form a second via hole (H2') to be described later, a second via mask (M2') is formed on the upper surface of the fourth elastic layer (14'). Here, the second via hole (H2') refers to a hole formed to penetrate vertically from the upper surface of the fourth elastic layer (14') to the upper surface of the second electrode (22) at the location where the probe pin (30') is to be formed. The second via mask (M2') is formed to expose the location where the second via hole (H2') is to be formed on the upper surface of the fourth elastic layer (14') and to mask the remaining portion.

[0185] Additionally, it is preferable that the second via mask (M2') be masked so that the outer edge of the fourth elastic layer (14') is exposed. This is because the outer edge of the fourth elastic layer (14') must also be etched so that one end of the first electrode (21) is exposed to the side of the probe head.

[0187] FIG. 32 illustrates a step (S212) of forming a second via hole (H2') according to a second embodiment of the present invention. The second via hole (H2') is formed by etching through a second via mask (M2'). Here, the second via hole (H2') is etched to a depth where the upper surface of the second electrode (22) is exposed. At the same time, as shown in FIG. 32, it is preferable that the edge portion of the fourth elastic layer (14') is also etched, leaving a predetermined thickness.

[0189] FIG. 33 illustrates the step (S213) of forming a probe pin (30') according to a second embodiment of the present invention. The probe pin (30') is formed by filling the second via hole (H2') with metal.

[0191] FIG. 34 illustrates a step (S214) of protruding the upper portion of the probe pin (30') and the edge portion of the first electrode (21) according to a second embodiment of the present invention. The upper portion of the probe pin (30') is protruded by etching the upper portion of the fourth elastic layer (14') to a predetermined thickness. At the same time, the edge portion of the fourth elastic layer (14') is etched together so that both lateral ends of the first electrode (21) are exposed to the side of the probe head.

[0193] FIG. 35 shows a step (S215) of forming an isolation portion according to a second embodiment of the present invention.

[0194] As described above, an isolation portion may be formed as a preferred embodiment of the present invention. The isolation portion is formed by etching the fourth elastic layer (14') within a predetermined width from the outer surface of the probe pin (30') after the step of protruding the upper portion of the probe pin (30'), thereby separating a portion of the outer surface of the probe pin (30') from the fourth elastic layer (14').

[0196] FIG. 36 illustrates the step (S216) of connecting a flexible printed circuit board (F-PCB) to a first electrode (21) according to a second embodiment of the present invention.

[0197] Finally, the manufacturing of the probe head according to the second embodiment of the present invention is completed by connecting a flexible printed circuit board (F-PCB) to the exposed portion of the first electrode (21).

[0199] The preferred embodiments of the present invention described above are disclosed for illustrative purposes only, and those skilled in the art with ordinary knowledge of the present invention will be able to make various modifications, changes, and additions within the spirit and scope of the present invention, and such modifications, changes, and additions should be considered to fall within the scope of the above claims.

[0200] Since various substitutions, modifications, and changes are possible within the scope of the technical concept of the present invention for those skilled in the art to which the present invention pertains, the present invention is not limited by the aforementioned embodiments and attached drawings. Explanation of the symbols

[0201] 10: Elastomer 11: First elastic layer 12: Second elastic layer 13: Third elastic layer 14: Fourth elastic layer 20: Electrode part 21: First electrode 22: Second electrode 30: Probe pin 31: Via electrode

Claims

Claim 1 A probe head comprising: an elastic body (10) formed with a predetermined thickness on the upper surface of a substrate; an electrode part (20) embedded inside the elastic body (10), with one end (201) protruding above the side of the elastic body (10); a probe pin (30) with one end connected to the other end (203) of the electrode part (20) and the other end penetrating the elastic body (10) and protruding upward from the elastic body (10); and a second elastic layer (12) embedded inside the elastic body (10) and located in the lower direction of the other end (203) of the electrode part (20); wherein the elastic body (10) is made of a material having a lower coefficient of thermal expansion than the second elastic layer (12), and the second elastic layer (12) is characterized by having a shape in which the width increases from the upper side to the lower side. Claim 2 delete Claim 3 A probe head characterized in that, in claim 1, the height of the other end (203) of the electrode portion (20) is located at a higher position than the height of the first end (201), and between the first end (201) and the other end (203) of the electrode portion (20), an inclined portion (202) is formed such that the height increases from the first end (201) to the other end (203). Claim 4 In claim 1, the probe head is characterized in that the elastic body (10) has an isolation portion formed therein that is spaced apart from the outer surface of the probe pin (30) by a predetermined width. Claim 5 An elastic body (10') formed on the upper surface of a substrate with a predetermined thickness; a first electrode (21) formed on the upper surface of the substrate and located on the lower side of the elastic body (10'), with both lateral ends protruding beyond the side of the elastic body (10'); a second electrode (22) embedded inside the elastic body (10') and located on the upper side of the first electrode (21); a via electrode (31) that penetrates vertically through the interior of the elastic body (10') from one end of the second electrode (22) and is electrically connected to the upper surface of the first electrode (21); a probe pin (30') with one end connected to the other end of the second electrode (22) and the other end penetrating the elastic body (10') and protruding upward from the elastic body (10'). A probe head comprising: a second elastic layer (12') embedded inside the elastic body (10') and positioned in the upper direction of the first electrode (21) and the lower direction of the second electrode (22); wherein the elastic body (10') is made of a material having a lower coefficient of thermal expansion than the second elastic layer (12'). Claim 6 In claim 5, the probe head is characterized in that the second elastic layer (12') has a shape in which the width increases from the upper side to the lower side. Claim 7 In claim 5, the probe head is characterized in that the via electrode (31) penetrates the second elastic layer (12') vertically. Claim 8 In claim 5, the probe head is characterized in that the elastic body (10') has an isolation portion formed by being spaced apart from the outer surface of the probe pin (30') by a predetermined width. Claim 9 A step of stacking a first elastic layer (11) on the upper surface of a substrate; a step of stacking a second elastic layer (12) on the upper surface of the first elastic layer (11); a step of etching the first elastic layer (11) and the second elastic layer (12) to form a slope; a step of stacking a third elastic layer (13) on the upper surface of the substrate, the slope, and the second elastic layer (12); a step of depositing metal on the upper surface of the third elastic layer (13) to form an electrode portion (20); a step of stacking a fourth elastic layer (14) on the upper surface of the electrode portion (20) and the third elastic layer (13); a step of forming a hole mask on the upper surface of the fourth elastic layer (14) and etching up to the upper surface of the electrode portion (20) to form a via hole (H1); a step of filling the via hole (H1) with metal to form a probe pin (30); the fourth elastic layer (14) A method for manufacturing a probe head characterized by including the step of etching the upper side to a predetermined thickness to protrude the upper part of the probe pin (30). Claim 10 A method for manufacturing a probe head according to claim 9, wherein the first elastic layer (11) is made of a material having a lower coefficient of thermal expansion than the second elastic layer (12). Claim 11 A method for manufacturing a probe head according to claim 9, further comprising the step of, after the step of protruding the upper portion of the probe pin (30), etching the fourth elastic layer (14) within a predetermined width from the outer surface of the probe pin (30) to separate a portion of the outer surface of the probe pin (30) from the fourth elastic layer (14). Claim 12 A step of depositing a first electrode (21) on the upper surface of a substrate; a step of stacking a first elastic layer (11') on the upper surface of the first electrode (21); a step of stacking a second elastic layer (12') on the upper surface of the first elastic layer (11'); a step of etching the first elastic layer (11') and the second elastic layer (12') to form a slope (slope'); a step of stacking a third elastic layer (13') on the upper surface of the substrate, the slope (slope'), and the second elastic layer (12'); a step of forming a first via mask (M1') that masks a portion of the upper surface of the third elastic layer (13') excluding the location of the first via hole (H1') and the edge portion; a step of etching the third elastic layer (13') through the first via mask (M1') to vertically penetrate from the first electrode (21) to the upper surface of the third elastic layer (13'). A step of forming a first via hole (H1') and exposing the edge portion of the first electrode (21); a step of forming a via electrode (31) by filling the first via hole (H1') with metal; a step of depositing a second electrode (22) on the upper surface of the via electrode (31) and the third elastic layer (13'); a step of stacking a fourth elastic layer (14') on the upper surface of the third elastic layer (13') and the second electrode (22); a step of forming a second via mask (M2') that masks a portion of the upper surface of the fourth elastic layer (14') excluding the location of the second via hole (H2') and the edge portion; a step of etching the fourth elastic layer (14') through the second via mask (M2') to form a second via hole (H2') that penetrates vertically from the second electrode (22) to the upper surface of the fourth elastic layer (14'); A method for manufacturing a probe head, characterized by comprising: a step of forming a probe pin (30') by filling a first via hole (H1') with metal; and a step of etching the upper side of the fourth elastic layer (14') to a predetermined thickness to protrude the upper part of the probe pin (30') and the edge portion of the first electrode (21). Claim 13 A method for manufacturing a probe head according to claim 12, wherein the first elastic layer (11') is made of a material having a lower coefficient of thermal expansion than the second elastic layer (12'). Claim 14 A method for manufacturing a probe head according to claim 12, further comprising the step of, after the step of protruding the upper portion of the probe pin (30'), etching the fourth elastic layer (14') within a predetermined width from the outer surface of the probe pin (30') to separate a portion of the outer surface of the probe pin (30') from the fourth elastic layer (14').

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