Apparatus of mounting solder balls

Abstract

The present invention provides a solder ball mounting device. The solder ball mounting device of the present invention comprises a stage supporting a substrate, a mounting unit for mounting a solder ball on the substrate, and a solder ball mask interposed between the mounting unit and the substrate, comprising a first surface facing the substrate and a second surface facing the first surface, wherein the solder ball mask includes a plurality of penetration portions through which the solder ball moves, penetrating from the second surface to the first surface, and each penetration portion includes a first opening on the first surface and a second opening on the second surface, and the first width at which the first openings are spaced apart is different from the second width at which the second openings are spaced apart.

Description

Technology Field

[0001] The present invention relates to a solder ball mounting device. Background Technology

[0002] As electronic devices undergo rapid miniaturization and thinning, electronic components such as semiconductor devices mounted in these devices are also required to be miniaturized and thinned. These electronic components are becoming more densely packed, leading to a tendency for the number of connection terminals to increase. To meet these demands, a method of mounting electronic components in which conductive solder balls serving as external connection terminals are mounted on a mounting board, such as a printed circuit board, using methods like the pick-and-place technique is generally utilized. The problem to be solved

[0003] The technical problem that the present invention aims to solve is to provide a solder ball mounting device that mounts solder balls onto a substrate using a solder ball mask.

[0004] The problems that the present invention aims to solve are not limited to those mentioned above, and other unmentioned problems will be clearly understood by a person skilled in the art from the description below. means of solving the problem

[0005] A solder ball mounting device according to some embodiments of the present invention for achieving the above technical problem comprises a stage supporting a substrate, a mounting unit for mounting a solder ball on the substrate, and a solder ball mask interposed between the mounting unit and the substrate, the solder ball mask comprising a first surface facing the substrate and a second surface facing the first surface, wherein the solder ball mask comprises a plurality of penetration portions through which the solder ball moves, penetrating from the second surface to the first surface, and each penetration portion comprises a first opening on the first surface and a second opening on the second surface, and the first width at which the first openings are spaced apart is different from the second width at which the second openings are spaced apart.

[0006] A solder ball mounting device according to some embodiments of the present invention for achieving the above technical problem comprises a stage supporting a substrate, a solder ball providing unit adjacent to the stage and providing a solder ball, a mounting unit holding a solder ball within the solder ball providing unit and mounting the solder ball on the substrate, and a solder ball mask interposed between the mounting unit and the substrate, wherein the solder ball mask comprises a plurality of through-holes that penetrate the solder ball mask and move the solder ball from the mounting unit toward the substrate, and the through-holes comprise a first opening and a second opening facing each other, and the first opening and the second opening are not aligned in a planar view.

[0007] Specific details of other embodiments are included in the description of the invention and the drawings. Brief explanation of the drawing

[0008] FIG. 1 is an exemplary drawing of a solder ball mounting device according to some embodiments. Figure 2 is an enlarged view of the P region of Figure 1. FIG. 3 is an exemplary cross-sectional view of the solder ball mask of FIG. 1. FIG. 4 is an exemplary plan view of the solder ball mask of FIG. 1. FIG. 5 is an exemplary cross-sectional view of a solder ball mask according to some embodiments. Figure 6 is a plan view of the solder ball mask of Figure 5. FIG. 7 is an exemplary cross-sectional view of a solder ball mask according to some embodiments. Figure 8 is a plan view of the solder ball mask of Figure 7. FIG. 9 is an exemplary cross-sectional view of a solder ball mask according to some embodiments. Figure 10 is an enlarged view of the Q region of Figure 1. FIGS. 11 and FIGS. 12 are drawings for illustrating a solder ball mounting device according to some embodiments. FIG. 13 is a flowchart illustrating a solder ball mounting method according to some embodiments. FIGS. 14 to 18 are intermediate drawings for explaining a solder ball mounting method according to some embodiments. Specific details for implementing the invention

[0009] Hereinafter, a solder ball mounting device according to several embodiments will be described with reference to FIGS. 1 to 10.

[0010] FIG. 1 is an exemplary drawing of a solder ball mounting device according to some embodiments. FIG. 2 is an enlarged view of region P of FIG. 1.

[0011] First, referring to FIG. 1, a solder ball mounting device according to some embodiments may include a stage (100), a solder ball mask (200), a mounting unit (300), and a solder ball providing unit (400).

[0012] The stage (100) may include a base unit (110), a solder ball mask support unit (120), and a substrate support unit (130). The base unit (110) may support the solder ball mask support unit (120) and the substrate support unit (130). The base unit (110) may include driving elements capable of vertically raising and lowering the substrate support unit (130) and horizontally rotating it.

[0013] A substrate support unit (130) can support a mounted semiconductor package (500, 600, 700). The semiconductor package may include a substrate (500). The substrate (500) may be a circuit board. The substrate support unit (130) may be equipped with a vacuum suction means capable of fixing the semiconductor package. The substrate support unit (130) may include an upward and downward driving means capable of moving vertically independently. The distance between the solder ball mask (200) and the substrate (500) can be controlled by the upward and downward movement of the substrate support unit (130). A solder ball mask support unit (120) may be installed on the periphery of the base unit (110) to support the solder ball mask (200). Additionally, the solder ball mask support unit (120) may be equipped with a vacuum suction means capable of fixing the solder ball mask (200).

[0014] A solder ball mask (200) may be interposed on a substrate (500). A solder ball mask (200) may be interposed between a mounting unit (300) and a substrate (500). A solder ball mask (200) may be installed on a solder ball mask support unit (120) and may be fixed to the solder ball mask support unit (120). The solder ball mask (200) will be described in detail later using FIGS. 3 to 9.

[0015] A mounting unit (300) may be placed on a substrate (500). A mounting unit (300) may be placed on a solder ball mask (200). A mounting unit (300) may be spaced apart from the solder ball mask (200) in a third direction (Z). A mounting unit (300) may be movable in a first direction (X), a second direction (Y), and a third direction (Z). The first direction (X), the second direction (Y), and the third direction (Z) may be substantially perpendicular to each other.

[0016] Referring to FIG. 2, the mounting unit (300) may include a body portion (310) and a suction portion (320). The body portion (310) may enclose the suction portion (320). The suction portion (320) may be a part that fixes a solder ball (SB). For example, the suction portion (320) may suck in air (see Drawing No. 330). The suction portion (320) may fix the solder ball (SB) by suctioning it. However, the technical concept of the present invention is not limited thereto.

[0017] Referring again to FIG. 1, a solder ball providing unit (400) may be located in an area adjacent to the stage (100). The solder ball providing unit (400) may provide a solder ball (SB). The solder ball providing unit (400) may be spaced apart from the stage (100) in a first direction (X). Alternatively, the solder ball providing unit (400) may be spaced apart from the stage (100) in a second direction (Y). When mounting a solder ball (SB) on a substrate (500) using a solder ball mounting device according to some embodiments, a mounting unit (300) may move onto the solder ball providing unit (400) to pick a solder ball (SB) within the solder ball providing unit (400). Subsequently, the mounting unit (300) may move onto the substrate (500) to place a solder ball (SB) on the substrate (500).

[0018] A solder ball (SB) can be provided by a solder ball providing unit (400). The solder ball (SB) can electrically connect a semiconductor package to a main board of an electronic device, etc. The solder ball (SB) may be, for example, a solder bump comprising a low-melting-point metal, for example, tin (Sn) and a tin (Sn) alloy, but is not limited thereto. The solder ball (SB) may have various shapes such as a land, a ball, a pin, a pillar, etc. In this specification, the solder ball (SB) is described as having a ball shape.

[0019] FIG. 3 is an exemplary cross-sectional view of the solder ball mask of FIG. 1. FIG. 4 is an exemplary top view of the solder ball mask of FIG. 1. Using FIG. 3 and FIG. 4, a solder ball mask according to some embodiments will be described in detail.

[0020] Referring to FIGS. 3 and 4, the solder ball mask (200) may include a first surface (200a) and a second surface (200b) facing each other. The first surface (200a) may be a surface facing the substrate (500 in FIG. 1), and the second surface (200b) may be a surface facing the mounting unit (300 in FIG. 1).

[0021] In some embodiments, the solder ball mask (200) may include a through-hole (210) and an exhaust section (220). The through-hole (210) may be a passage through which a solder ball (SB in FIG. 1) moves. Through the through-hole (210), the solder ball (SB) may be mounted on a substrate (500 in FIG. 1). The exhaust section (220) may be a passage through which the solder ball (SB) is discharged. Through the exhaust section (220), the solder ball (SB) may be discharged to the outside of the substrate (500).

[0022] The penetration (210) may penetrate from the second surface (200b) to the first surface (100a). A solder ball (SB) may move into the penetrated area. The penetration (210) may include a first opening (210a) and a second opening (210b). The first opening (210a) may be provided on the first surface (200a). The second opening (210b) may be provided on the second surface (200b).

[0023] In some embodiments, the first opening (210a) and the second opening (210b) may not be aligned with each other. "A and B are aligned" may mean that the center of A and the center of B coincide in a planar view. "A and B are not aligned" may mean that the center of A and the center of B do not coincide in a planar view.

[0024] The first opening (210a) includes a first center point (210a_C). The first center point (210a_C) is the center of the first opening (210a). The second opening (210b) includes a second center point (210b_C). The second center point (210b_C) is the center of the second opening (210b). In FIG. 4, from a planar perspective, the first center point (210a_C) may not coincide with the second center point (210b_C). The first center point (210a_C) and the second center point (210b_C) do not overlap each other in the third direction (Z). That is, the first opening (210a) and the second opening (210b) are not aligned with each other.

[0025] In some embodiments, the first width (W1) between the first openings (210a) may differ from the second width (W2) between the second openings (210b). For example, the first width (W1) may be smaller than the second width (W2). "Width between the openings" may mean the width between the centers of the openings.

[0026] According to this, the first width (W1) between the first openings (210a) may be the width between the first center point (210a_C) of the first opening (210a) and the first center point (210a_C) of the adjacent other first opening (210a). The second width (W2) between the second openings (210b) may be the width between the second center point (210b_C) of the second opening (210b) and the second center point (210b_C) of the adjacent other second opening (210b). In FIG. 3, the first width (W1) may be smaller than the second width (W2).

[0027] In this way, since the first width (W1) is smaller than the second width (W2), the distance between the solder balls (SB) mounted on the mounting unit (300) is large, but the distance between the solder balls (SB) mounted on the substrate (500) can be small. According to this, depending on the design of the solder ball mask (200), solder balls (SB) can be mounted on the substrate (500) at various pitches even when using the same mounting unit (300).

[0028] In some embodiments, the penetration (210) may include a first side wall (210SW1) and a second side wall (210SW2). The first side wall (210SW1) and the second side wall (210SW2) may face each other. The slope of the first side wall (210SW1) and the slope of the second side wall (210SW2) may be different from each other. The slope of the first side wall (210SW1) may be smaller than the slope of the second side wall (210SW2). That is, the width between the first side wall (210SW1) and the second side wall (210SW2) may gradually decrease as it faces from the second surface (200b) toward the first surface (200a).

[0029] In some embodiments, the first diameter (d1) of the first opening (210a) may differ from the second diameter (d2) of the second opening (210b). The first diameter (d1) of the first opening (210a) may be the diameter of the first opening (210a), and the second diameter (d2) of the second opening (210b) may be the diameter of the second opening (210b). In FIG. 4, from a planar perspective, the first diameter (d1) may be smaller than the second diameter (d2). That is, from a planar perspective, the area of ​​the first opening (210a) may be smaller than the area of ​​the second opening (210b).

[0030] FIG. 5 is an exemplary cross-sectional view of a solder ball mask according to some embodiment. FIG. 6 is a top view of the solder ball mask of FIG. 5. For convenience of explanation, the description will focus on the differences from FIG. 3 and FIG. 4.

[0031] Referring to FIGS. 5 and 6, some of the first openings (210a) may not overlap with the second opening (210b) in the third direction (Z).

[0032] For example, among the plurality of first openings (210a), the first opening (210a) located at the edge may not overlap with the corresponding second opening (210b) in the third direction (Z). As the difference between the slope of the first side wall (210SW1) and the slope of the second side wall (210SW2) of the penetration (210) located at the edge becomes smaller, some of the first openings (210a) may not overlap with the second opening (210b) in the third direction (Z).

[0033] In this case as well, the first width (W1) of the first openings (210a) may be smaller than the second width (W2) of the second openings (210b). The first diameter (d1) of the first opening (210a) may be smaller than the second diameter (d2) of the second opening (210b).

[0034] FIG. 7 is an exemplary cross-sectional view of a solder ball mask according to some embodiment. FIG. 8 is a top view of the solder ball mask of FIG. 7. For convenience of explanation, the description will focus on the differences from FIG. 3 and FIG. 4.

[0035] Referring to FIGS. 7 and 8, the first diameter (d1) of the first opening (210a) may be the same as the second diameter (d2) of the second opening (210b). In a planar view, the area of ​​the first opening (210a) may be the same as the area of ​​the second opening (210b).

[0036] The slope of the first side wall (210SW1) of the penetration section (210) and the slope of the second side wall (210SW2) may be the same. The width of the penetration section (210) in the first direction (X) may be the same as the second surface (200b) toward the first surface (200b).

[0037] In this case as well, the first width (W1) in which the first openings (210a) are spaced apart may be smaller than the second width (W2) in which the second openings (210b) are spaced apart.

[0038] FIG. 9 is an exemplary cross-sectional view of a solder ball mask according to some embodiments. For convenience of explanation, the description will focus on the differences from FIG. 3 and FIG. 4.

[0039] Referring to FIG. 9, a solder ball mask according to some embodiments may not include an ejection portion. Since it does not include an ejection portion, the penetration portion (210) and the suction portion (320) of the mounting unit (300) may correspond one-to-one.

[0040] FIG. 10 is an enlarged view of the Q region of FIG. 1. Referring to FIG. 10, a semiconductor package according to some embodiments may be a 2.5D package. However, this is merely illustrative and the technical concept of the present invention is not limited thereto.

[0041] A semiconductor package according to some embodiments may include a substrate (500), an interposer structure (600), a semiconductor chip (700), and a molding member (740).

[0042] An interposer structure (600) may be mounted on a substrate (500). A semiconductor chip (700) may be mounted on the interposer structure (600). The semiconductor chip (700) may include a first semiconductor chip (710) and a second semiconductor chip (720). The first semiconductor chip (710) and the second semiconductor chip (720) may be spaced apart from each other in a first direction (X). The second semiconductor chip (720) may be placed on one side and the other side of the first semiconductor chip (710).

[0043] The substrate (500) may be a substrate for a package. The substrate (500) may be a printed circuit board (PCB). The substrate (500) may include a lower surface and an upper surface opposite each other.

[0044] A substrate (500) may include an insulating core (501), a first substrate pad (502), and a second substrate pad (504). The first substrate pad (502) and the second substrate pad (504) may each be used to electrically connect the substrate (500) to other components. For example, the first substrate pad (502) may be exposed from the upper surface of the insulating core (501), and the second substrate pad (504) may be exposed from the lower surface of the insulating core (501). The first substrate pad (502) and the second substrate pad (504) may include a metallic material such as copper (Cu) or aluminum (Al), for example, but are not limited thereto.

[0045] Wiring patterns for electrically connecting the first substrate pad (502) and the second substrate pad (504) may be formed within the insulating core (501). Although the insulating core (501) is depicted as a single layer, this is merely for convenience of explanation. For example, the insulating core (501) may be composed of multiple layers, and multilayer wiring patterns may be formed therein.

[0046] The substrate (500) may be mounted on the main board of an electronic device, etc. For example, a solder ball connected to the first substrate pad (502) may be provided on the first substrate pad (502). The solder ball may be mounted using a solder ball mounting device according to some embodiments. The substrate (500) may be mounted on the main board of an electronic device, etc. through the solder balls. The substrate (500) may be a Ball Grid Array (BGA) substrate, but is not limited thereto.

[0047] In some embodiments, the insulating core (501) may include an organic material. For example, the insulating core (501) may include a prepreg. The prepreg is a composite fiber in which a reinforcing fiber, such as carbon fiber, glass fiber, or aramid fiber, is impregnated with a thermosetting polymer binder (e.g., epoxy resin) or a thermoplastic resin.

[0048] In some embodiments, the substrate (500) may include a copper clad laminate (CCL). For example, the substrate (500) may have a structure in which a copper laminate is laminated on one or both sides of a heat-cured prepreg (e.g., prepreg of a C-Stage).

[0049] Flux (550) may be interposed on the first substrate pad (502). The flux (550) may completely cover the first substrate pad (502). The flux (550) may subsequently enable the solder ball to be smoothly attached to the first substrate pad (502).

[0050] The interposer structure (600) may be disposed on the upper surface of the substrate (500). The interposer structure (600) may be, for example, a silicon interposer, but is not limited thereto. The interposer structure (600) may include a lower surface and an upper surface opposite each other. The interposer structure (600) can facilitate the connection between the substrate (500) and the semiconductor chips (700) described later, and prevent warpage of the semiconductor package.

[0051] The interposer structure (600) may include a first interposer pad (602) and a second interposer pad (604). The first interposer pad (602) and the second interposer pad (604) may each be used to electrically connect the interposer structure (600) to other components. For example, the first interposer pad (602) may be exposed from the upper surface of the interposer structure (600), and the second interposer pad (604) may be exposed from the lower surface of the interposer structure (600). The first interposer pad (602) and the second interposer pad (604) may include a metallic material such as copper (Cu) or aluminum (Al), for example, but are not limited thereto. Wiring patterns for electrically connecting the first interposer pad (602) and the second interposer pad (604) can be formed within the interposer structure (600).

[0052] The interposer structure (600) can be mounted on the lower surface of the substrate (500). For example, a first connecting member (620) can be formed between the substrate (500) and the interposer structure (600). The first connecting member (620) can connect the second substrate pad (504) and the first interposer pad (602). Accordingly, the substrate (500) and the interposer structure (600) can be electrically connected.

[0053] The first connecting member (620) may be a solder bump comprising a low-melting-point metal, such as tin (Sn) and tin (Sn) alloy, but is not limited thereto. The first connecting member (620) may have various shapes such as a land, ball, pin, or pillar. The first connecting member (620) may be formed as a single layer or a multilayer. When the first connecting member (620) is formed as a single layer, the first connecting member (620) may, for example, include tin-silver (Sn-Ag) solder or copper (Cu). When the first connecting member (620) is formed as a multilayer, the first connecting member (620) may, for example, include copper (Cu) filler and solder. The number, spacing, arrangement shape, etc. of the first connecting members (620) are not limited to those illustrated and may vary depending on the design.

[0054] In some embodiments, the interposer structure (600) may include an interposer (610) and a redistribution layer (640). The interposer (610) may be, for example, a silicon film, but is not limited thereto.

[0055] In some embodiments, a first underfill (630) may be formed between the substrate (500) and the interposer structure (600). The first underfill (630) may fill the space between the substrate (500) and the interposer structure (600). Additionally, the first underfill (630) may cover the first connecting member (620). The first underfill (630) may prevent breakage of the interposer structure (600) by fixing the interposer structure (600) on the substrate (500). The first underfill (630) may include, for example, an insulating polymer material such as an EMC (epoxy molding compound), but is not limited thereto.

[0056] The first semiconductor chip (710) and the second semiconductor chip (720) may be spaced apart from each other in a first direction (X) and placed on the lower surface of the interposer structure (600). The first semiconductor chip (710) and the second semiconductor chip (720) may each be an integrated circuit (IC) in which hundreds to millions or more semiconductor elements are integrated into a single chip.

[0057] In some embodiments, the first semiconductor chip (710) may be a logic semiconductor chip. For example, the first semiconductor chip (710) may be an application processor (AP) such as a CPU (Central Processing Unit), GPU (Graphic Processing Unit), FPGA (Field-Programmable Gate Array), digital signal processor, encryption processor, microprocessor, microcontroller, or ASIC (Application-Specific IC), but is not limited thereto.

[0058] In some embodiments, the second semiconductor chip (720) may be a memory semiconductor chip. For example, the second semiconductor chip (720) may be a volatile memory such as DRAM (dynamic random access memory) or SRAM (static random access memory), or a non-volatile memory such as Flash Memory, PRAM (Phase-change Random Access Memory), MRAM (Magnetoresistive Random Access Memory), FeRAM (Ferroelectric Random Access Memory), or RRAM (Resistive Random Access Memory).

[0059] For example, the first semiconductor chip (710) may be an ASIC such as a GPU, and the second semiconductor chip (720) may be a stacked memory such as High Bandwidth Memory (HBM). This stacked memory may be in the form of multiple integrated circuits stacked together. The stacked integrated circuits may be electrically connected to each other through TSVs (Through Silicon Via), etc.

[0060] In some embodiments, the second semiconductor chips (720) may be arranged in a greater number than the first semiconductor chips (710). For example, a plurality of second semiconductor chips (720) may be arranged around the first semiconductor chip (710). For example, as shown in FIG. 10, two second semiconductor chips (720) may be arranged on each side of the first semiconductor chip (710).

[0061] The first semiconductor chip (710) may include a first chip pad (712). The first chip pad (712) may be used to electrically connect the first semiconductor chip (710) to other components. For example, the first chip pad (712) may be exposed from the upper surface of the first semiconductor chip (710).

[0062] The second semiconductor chip (720) may include a second chip pad (714). The second chip pad (714) may be used to electrically connect the second semiconductor chip (720) to other components. For example, the second chip pad (714) may be exposed from the upper surface of the second semiconductor chip (720).

[0063] The first chip pad (712) and the second chip pad (714) may each include a metallic material such as copper (Cu) or aluminum (Al), for example, but are not limited thereto.

[0064] The first semiconductor chip (710) and the second semiconductor chip (720) may be mounted on the lower surface of the interposer structure (600). For example, a second connecting member (732) may be formed between the interposer structure (600) and the first semiconductor chip (710). The second connecting member (732) may connect some of the plurality of second interposer pads (604) with the first chip pad (712). Accordingly, the interposer structure (600) and the first semiconductor chip (710) may be electrically connected.

[0065] Additionally, for example, a third connection member (734) may be formed between the interposer structure (600) and the second semiconductor chip (720). The third connection member (734) may connect the second chip pad (714) with some of the other parts of the plurality of second interposer pads (604). Accordingly, the interposer structure (600) and the second semiconductor chip (720) may be electrically connected.

[0066] In some embodiments, a portion of the redistribution layer (640) may electrically connect the second connection member (732) and the third connection member (734). For example, although not illustrated, a portion of the redistribution layer (640) may connect the second interposer pad (604) connected to the second connection member (732) and the second interposer pad (604) connected to the third connection member (734). Accordingly, the first semiconductor chip (710) and the second semiconductor chip (720) may be electrically connected.

[0067] The second connecting member (732) and the third connecting member (734) may each be solder bumps comprising a low-melting-point metal, such as tin (Sn) and tin (Sn) alloy, but are not limited thereto. The second connecting member (732) and the third connecting member (734) may each have various shapes such as land, ball, pin, and pillar. The second connecting member (732) and the third connecting member (734) may each include UBM (Under Bump Metallurgy), but are not limited thereto.

[0068] In some embodiments, a second underfill (730) may be formed between the interposer structure (600) and the first semiconductor chip (710) and between the interposer structure (600) and the second semiconductor chip (720). A portion of the second underfill (730) may fill the space between the interposer structure (600) and the first semiconductor chip (710), and another portion of the second underfill (730) may fill the space between the interposer structure (600) and the second semiconductor chip (720). The second underfill (730) may prevent breakage, etc. of the first and second semiconductor chips (710, 720) by fixing the first and second semiconductor chips (710, 720) on the interposer structure (600). The second underfill (730) may include, for example, an insulating polymer material such as EMC, but is not limited thereto.

[0069] A molding member (740) may be formed on the lower surface of an interposer structure (600). The molding member (740) may be formed to cover at least a portion of the first and second semiconductor chips (710, 720). For example, the molding member (740) may cover the side of the first semiconductor chip (710), the side of the second semiconductor chip (720), and the second underfill (730). Although the molding member (740) is illustrated only as exposing the upper surface of the first semiconductor chip (710) and the upper surface of the second semiconductor chip (720), this is merely exemplary, and the molding member (740) may also cover the upper surface of the first semiconductor chip (710) and the upper surface of the second semiconductor chip (720).

[0070] The molding member (740) may include, for example, an insulating polymer material such as EMC, but is not limited thereto. In some embodiments, the first underfill (630) and the second underfill (730) may include a material different from that of the molding member (740). For example, the first underfill (630) and the second underfill (730) may each include an insulating material having better fluidity than the molding member (740). Accordingly, the first underfill (630) and the second underfill (730) can efficiently fill the narrow space between the substrate (500) and the interposer structure (600) or between the interposer structure (600) and the first and second semiconductor chips (710, 720).

[0071] FIGS. 11 and 12 are drawings illustrating a solder ball mounting device according to some embodiments. For convenience of explanation, the description will focus on the differences from the description using FIGS. 1 to 10.

[0072] Referring to FIG. 11, in a solder ball mounting device according to some embodiments, the semiconductor package according to some embodiments may include only a substrate (500). The substrate (500) may be a substrate for the package. For example, the substrate (500) may be a printed circuit board (PCB). The substrate support unit (130) may rise in a third direction (Z) to position the substrate (500) close to the solder ball mask (200).

[0073] Referring to FIG. 12, in a solder ball mounting device according to some embodiment, a semiconductor package according to some embodiment may include semiconductor chips (700) on a substrate (500). The semiconductor package may not include an interposer. The semiconductor chips (700) may have a wire bonding structure.

[0074] However, the technical concept of the present invention is not limited thereto. Semiconductor packages according to some embodiments are not limited to structures or shapes, and may be circuit board units or package unit units.

[0075] FIG. 13 is a flowchart illustrating a solder ball mounting method according to some embodiments. FIGS. 14 to 18 are intermediate drawings illustrating a solder ball mounting method according to some embodiments.

[0076] Referring to FIG. 13, a solder ball mounting method according to some embodiments may include a mounting unit lifting a solder ball within a solder ball providing unit (S100), the mounting unit moving onto a solder ball mask (S200), and the solder ball being aligned on a substrate using the solder ball mask (S300).

[0077] Referring to FIGS. 1, 13 and 14, the mounting unit (300) can be moved in a first direction (X). The mounting unit (300) can be moved to a position that overlaps with the solder ball providing part (400) in a third direction (Z). The mounting unit (300) can be positioned on the solder ball providing part (400).

[0078] Next, the mounting unit (300) can descend in the third direction (Z). The mounting unit (300) can lift the solder ball (SB) within the solder ball providing part (400). For example, the suction part (320 in FIG. 2) of the mounting unit (300) can suction and fix the solder ball (SB). Next, the mounting unit (300) can ascend in the third direction (Z).

[0079] Referring to FIG. 13 and FIG. 15, the mounting unit (300) can rise in a third direction (Z) while holding the solder ball (SB) in place. After rising in the third direction (Z), the mounting unit (300) can move in a first direction (X). The mounting unit (300) can move onto the solder ball mask (200) (S200). If the stage (100) and the solder ball providing unit (400) are separated in a second direction (Y), the mounting unit (300) can move in the second direction (Y) to a position that overlaps with the solder ball mask (200) in the third direction (Z).

[0080] Referring to FIG. 16, a mounting unit (300) may be positioned on a solder ball mask (200). Each solder ball (SB) fixed by the mounting unit (300) may correspond one-to-one with a penetration part (210) and an ejection part (220) of the solder ball mask (200). Some of the solder balls (SB) fixed by the mounting unit (300) may correspond to the penetration part (210), and other parts of the solder balls (SB) fixed by the mounting unit (300) may correspond to the ejection part (220).

[0081] Referring to FIGS. 13 and 17, the mounting unit (300) can mount a solder ball (SB) on a substrate (500). The solder ball (SB) can be aligned on the substrate (500) using a solder ball mask (200) (S300).

[0082] Some of the solder balls (SB) can be mounted onto the substrate (500) through the through-hole (210) of the solder ball mask (200). Other parts of the solder balls (SB) can be discharged outside the substrate (500) through the discharge section (220).

[0083] Referring to FIG. 18, a solder ball (SB) can be aligned on a substrate (500). The solder ball (SB) can be electrically connected to a first substrate pad (502) within the substrate (500). The substrate (500) and the main board, etc., can be electrically connected through the solder ball (SB).

[0084] Although embodiments of the present invention have been described above with reference to the attached drawings, the present invention is not limited to the above embodiments and can be manufactured in various different forms, and those skilled in the art will understand that the present invention can be implemented in other specific forms without changing the technical concept or essential features of the present invention. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. Explanation of the symbols

[0085] 100: Stage 110: Base Unit 120: Solder ball mask support unit 130: Substrate support unit 200: Solder ball mask 210: Penetration part 220: Ejection part 300: Mounting unit 400: Solder ball supply unit SB: Solder ball

Claims

Claim 1 A stage supporting a substrate; a mounting unit for mounting solder balls on the substrate; A solder ball mounting device comprising a solder ball mask interposed between the mounting unit and the substrate, the solder ball mask comprising a first surface facing the substrate and a second surface facing the first surface, wherein the solder ball mask comprises a plurality of penetrations through which the solder ball moves, penetrating from the second surface to the first surface, and each of the penetrations comprises a first opening on the first surface and a second opening on the second surface, and at least one of the plurality of penetrations comprises a first side wall and a second side wall facing each other, wherein the first side wall and the second side wall each extend from the second surface to the first surface, the inclination of the first side wall and the inclination of the second side wall are different from each other, the first side wall and the second side wall are formed asymmetrically from each other, the first width at which the first openings are spaced apart is different from the second width at which the second openings are spaced apart, and the center of the first opening and the center of the second opening are not aligned with each other in a planar view. Claim 2 A solder ball mounting device according to claim 1, wherein the first width is smaller than the second width. Claim 3 A solder ball mounting device according to claim 1, wherein the first opening has a first diameter and the second opening has a second diameter different from the first diameter. Claim 4 A solder ball mounting device according to claim 3, wherein the first diameter is smaller than the second diameter. Claim 5 A solder ball mounting device according to claim 1, wherein the solder ball mask includes a discharge portion recessed from the second surface, and the solder ball is discharged to the outside of the substrate through the discharge portion. Claim 6 A solder ball mounting device according to claim 5, wherein the discharge portion does not penetrate to the first surface. Claim 7 A solder ball mounting device according to claim 1, wherein the mounting unit includes a suction part that sucks in air, and the suction part suctions and fixes the solder ball. Claim 8 A stage supporting a substrate; a solder ball providing unit adjacent to the stage and providing a solder ball; and a mounting unit holding the solder ball within the solder ball providing unit and mounting the solder ball on the substrate; A solder ball mounting device comprising a solder ball mask interposed between the mounting unit and the substrate, the solder ball mask comprising a first surface facing the substrate and a second surface facing the first surface, wherein the solder ball mask comprises a plurality of through-holes that penetrate the solder ball mask to move the solder ball from the mounting unit toward the substrate, wherein the through-holes comprise a first opening and a second opening facing each other, and at least one of the plurality of through-holes comprises a first side wall and a second side wall facing each other, wherein the first side wall and the second side wall each extend from the second surface to the first surface, wherein the inclination of the first side wall and the inclination of the second side wall are different from each other, wherein the first side wall and the second side wall are formed asymmetrically with respect to each other, and wherein the center of the first opening and the center of the second opening are not aligned with each other in a planar view. Claim 9 A solder ball mounting device according to claim 8, wherein the first opening has a first diameter and the second opening has a second diameter different from the first diameter. Claim 10 In claim 8, the solder ball mask comprises an exhaust portion for discharging the solder ball to the outside of the substrate, and the exhaust portion does not penetrate the solder ball mask, forming a solder ball mounting device.

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