Chip manufacturing method

Abstract

The present invention suppresses the increase in manufacturing costs of chips produced in a cutting device and the prolonged time required for manufacturing chips. The present invention, prior to dividing a workpiece to produce a plurality of chips, forms a groove in an area of ​​a porous plate that is scheduled to overlap with the workpiece's planned division line, and then seals the inner surface of the groove. In this case, a groove can be easily formed on the retaining surface according to the arrangement of the planned division line set in the workpiece. As a result, in a cutting device equipped with a chuck table including a porous plate having this retaining surface, it is possible to suppress an increase in the cost of producing chips and a prolonged time required for chip production.

Description

Technology Field

[0001] The present invention relates to a method for manufacturing a plurality of chips by dividing a workpiece along a planned division line. Background Technology

[0002] A workpiece, such as a package substrate, is divided into multiple regions by, for example, a grid-like arrangement of planned division lines (streets), and a semiconductor device is formed in each of the multiple regions. Then, when this workpiece is divided along the planned division lines, multiple chips are manufactured, each containing a semiconductor device.

[0003] For dividing such a package substrate, a cutting device is used that comprises, for example, a chuck table that holds a workpiece by applying a suction force to a workpiece placed on a holding surface, and a cutting unit having a spindle with a toroidal cutting blade mounted at its tip. In this cutting device, the workpiece is divided into a plurality of chips by rotating the cutting blade and contacting the cutting blade with the workpiece along a line to be divided.

[0004] However, in order to divide a workpiece into multiple chips, it is necessary to feed the rotating cutting blade into the workpiece so that it penetrates it. In this case, there is a risk that the chuck table holding the workpiece may be damaged by being cut by the cutting blade.

[0005] Therefore, when dividing a workpiece into multiple chips in this manner, a dicing tape is often adhered to the workpiece, and the workpiece is held in place on the chuck table through this dicing tape. As a result, the workpiece can be divided into multiple chips while positioning the outer edge of the cutting blade penetrating the workpiece within the dicing tape. Consequently, damage to the chuck table is prevented.

[0006] Furthermore, in this case, the dicing tape is not divided. Also, even after the workpiece is divided into multiple chips, the multiple chips remain integrated through the dicing tape. Therefore, the likelihood of some chips scattering when the workpiece is divided into multiple chips can be reduced.

[0007] Such dicing tapes are consumables. Therefore, there is a concern that the cost of manufacturing chips may increase if chips are manufactured according to this method. Taking this into account, it has been proposed to divide a workpiece into multiple chips while the workpiece is held on a chuck table including a jig having a holding surface that directly holds the workpiece (e.g., see Patent Document 1).

[0008] Specifically, a groove (cutting blade clearance groove) is formed in the area of ​​the retaining surface of this jig corresponding to the planned division line of the workpiece. In addition, a through hole (eject hole) is formed in each of the multiple areas (chip corresponding areas) partitioned by this groove to apply suction force to the workpiece and the multiple chips, respectively.

[0009] In addition, when the cutting device is equipped with such a chuck table, the workpiece can be divided into multiple chips with the outer edge of the cutting blade penetrating the workpiece positioned within the internal space of the groove. Furthermore, in this case, since the workpiece can be divided into multiple chips while applying a suction force to the workpiece through the through hole, the probability of several chips scattering during this division can be reduced. Prior art literature

[0010] Patent Document 1: Japanese Patent Publication No. 2007-273546 The problem to be solved

[0011] The chuck table including the aforementioned jig is a dedicated product usable only for specific workpieces. That is, if the arrangement of the planned division lines set in the workpiece and the arrangement of the grooves formed in the jig do not correspond, the chuck table including the jig cannot be used for dividing the workpiece.

[0012] Therefore, if the cutting device is equipped with a chuck table that includes a jig, a number of jigs corresponding to different types of workpieces with different arrangements of lines to be divided must be prepared in advance. Consequently, the manufacturing cost of chips produced using this cutting device increases, and / or, there is a risk that the time required for chip production will be prolonged.

[0013] Taking the above points into consideration, the objective of the present invention is to suppress the increase in manufacturing costs of chips produced in a cutting device and the prolonged time required for manufacturing the chips. means of solving the problem

[0014] According to the present invention, a cutting device comprising a porous plate having a retaining surface that holds a workpiece and includes a first synthetic resin, a chuck table having a frame body that surrounds the porous plate in a manner in which the retaining surface of the porous plate is exposed and includes a second synthetic resin, and a cutting unit having a spindle having an annular cutting blade mounted at its tip, wherein a method for manufacturing a plurality of chips by dividing the workpiece along a planned division line comprises: a groove forming step of forming a groove on the retaining surface by rotating the first cutting blade and contacting the first cutting blade on the porous plate along an area of ​​the porous plate that is scheduled to overlap with the planned division line; an application step of applying a resin that seals the inner surface of the groove to the retaining surface after the groove forming step; a workpiece holding step of holding the workpiece on the retaining surface after the application step; and a second cutting blade having a narrower blade width than the first cutting blade, and contacting the second workpiece on the workpiece along the planned division line after the workpiece holding step. A method for manufacturing chips is provided, comprising a dividing step of dividing the workpiece into the plurality of chips by contacting a cutting blade.

[0015] Preferably, the present invention further comprises a groove-forming workpiece holding step for holding a groove-forming workpiece on a holding surface before the groove-forming step, and a separation step for separating the groove-forming workpiece from the holding surface after the coating step and before the workpiece holding step, wherein in the groove-forming step, a groove is formed on the holding surface that penetrates the groove-forming workpiece and extends to the porous plate, and in the coating step, the groove-forming workpiece functions as a mask that prevents the resin from being applied to an area other than the area where the groove is formed on the holding surface.

[0016] Alternatively, the present invention further includes a removal step for removing the resin applied to an area other than the area where the groove is formed on the retaining surface, after the application step and before the workpiece retention step. Effects of the invention

[0017] In the present invention, prior to dividing a workpiece to produce a plurality of chips, a groove is formed in an area of ​​a porous plate that is scheduled to overlap with the line of division of the workpiece, and then the inner surface of the groove is sealed. Accordingly, in the present invention, a chuck table can be formed that includes a porous plate having a retaining surface capable of retaining both the workpiece and the plurality of chips produced by dividing the workpiece.

[0018] Specifically, when the workpiece is divided while being held on this holding surface, an attractive force can be applied to the holding surface through an area other than the region where the groove of the porous plate is formed. Furthermore, since the inner surface of this groove is sealed, no attractive force is applied to the holding surface through the region where the groove of the porous plate is formed. In other words, there is no leakage when holding a workpiece or multiple chips on this holding surface.

[0019] In this way, according to the present invention, a groove can be easily formed on the retaining surface according to the arrangement of the planned division lines set in the workpiece. As a result, in a cutting device equipped with a chuck table including a porous plate having this retaining surface, it is possible to suppress the increase in the manufacturing cost of the chip and the prolonged time required for manufacturing the chip. Brief explanation of the drawing

[0020] FIG. 1 is a perspective view schematically showing an example of a cutting device. FIG. 2 is an exploded perspective view schematically showing an example of a table base and an example of a chuck table. FIG. 3 is a perspective view schematically showing an example of a workpiece. FIG. 4 is a flowchart schematically illustrating an example of a method for manufacturing a chip. Figure 5 (A) is a partial cross-sectional side view schematically showing the appearance of the workpiece holding step for forming a groove, Figure 5 (B) is a partial cross-sectional side view schematically showing the appearance of the groove forming step, and Figure 5 (C) is a partial cross-sectional side view schematically showing the chuck table, etc. after the coating step. FIG. 6 (A) is a partial cross-sectional side view schematically showing a chuck table, etc. after a separation step, FIG. 6 (B) is a partial cross-sectional side view schematically showing the appearance of a workpiece holding step, and FIG. 6 (C) is a partial cross-sectional side view schematically showing the appearance of a dividing step. FIG. 7 is a flowchart schematically illustrating a modified example of a method for manufacturing a chip. FIG. 8 (A) is a partial cross-sectional side view schematically showing the appearance of the groove forming step, and FIG. 8 (B) is a partial cross-sectional side view schematically showing the chuck table, etc. after the coating step. FIG. 9 is a partial cross-sectional side view schematically showing the appearance of the removal step. Specific details for implementing the invention

[0021] An embodiment of the present invention will be described with reference to the attached drawings. FIG. 1 is a schematic perspective view showing an example of a cutting device used to divide a workpiece to produce a plurality of chips. In addition, the X-axis direction (front-back direction) and the Y-axis direction (left-right direction) shown in FIG. 1 are directions perpendicular to each other on a horizontal plane, and the Z-axis direction (up-down direction) is a direction perpendicular to the X-axis direction and the Y-axis direction (vertical direction).

[0022] The cutting device (2) shown in FIG. 1 has a base (4) that supports a plurality of components. An opening (4a) extending along the X-axis direction is formed on the upper surface of the base (4). Inside this opening (4a), an X-axis moving table (not shown) and a table moving mechanism (6) that moves the X-axis moving table along the X-axis direction are arranged.

[0023] The table moving mechanism (6) includes, for example, a ball screw. The upper side of the X-axis moving table and the table moving mechanism (6) is covered by a table cover (8) and a bellows-shaped cover (10). Additionally, on the X-axis moving table, a rectangular table base (12), for example, is arranged so as to be exposed upward from the table cover (8).

[0024] This table base (12) is connected to a rotary drive source (not shown), such as a motor, for example, and rotates with a straight line parallel to the Z-axis direction as the axis of rotation. Additionally, the table base (12) moves along the X-axis direction together with the aforementioned X-axis moving table. Furthermore, a chuck table (14) for holding a rectangular workpiece is mounted on the upper part of the table base (12) in a detachable manner.

[0025] FIG. 2 is an exploded perspective view schematically showing a table base (12) and a chuck table (14). The table base (12) has an upper surface (12a) and a lower surface (12b) that are parallel to each other, and a rectangular concave portion (12c) is formed on the upper surface (12a) side. In addition, a cylindrical through hole (12d) is formed in the center of the table base (12), and this through hole (12d) is open on the bottom surface of the concave portion (12c) and the lower surface (12b).

[0026] And, this through hole (12d) is connected to a suction source such as an ejector. Also, on the bottom surface of the concave portion (12c), an inner wall (12e) is provided that surrounds the through hole (12d) and has an upper surface lower than the upper surface (12a). Additionally, near each of the four corners of the table base (12), a cylindrical groove (12f) is formed that opens on the upper surface (12a). And, a spiral groove (screw groove) is formed on the side of this groove (12f).

[0027] A chuck table (14) mounted on a table base (12) has a rectangular frame body (16). This frame body (16) includes a synthetic resin (second synthetic resin) such as polyurethane and has an upper surface (16a) and a lower surface (16b) that are parallel to each other. Additionally, on the upper surface (16a) side of the frame body (16), a rectangular concave portion is formed, defined by the bottom wall and the side wall of the frame body (16).

[0028] A rectangular porous plate (18) is fixed to a concave portion formed on the upper surface (16a) of the frame body (16). That is, this porous plate (18) is surrounded by the side wall of the frame body (16), and its lower surface (not shown in FIG. 2) faces the bottom wall of the porous plate (18). And the upper surface (holding surface) (18a) of the porous plate (18) is exposed and located on the same plane as the upper surface (16a) of the frame body (16).

[0029] Additionally, the porous plate (18) includes a porous synthetic resin (first synthetic resin), such as expanded polyurethane. Furthermore, the synthetic resin constituting the frame body (16) and the porous synthetic resin constituting the porous plate (18) may be the same material or different materials.

[0030] Additionally, a cylindrical through hole (not shown) is formed in the central part of the frame body (16), which opens on the bottom surface and lower surface (16b) of the concave part of the frame body (16). Accordingly, the concave part (12c) and the through hole (12d) of the table base (12) and the lower surface of the porous plate (18) communicate with each other through the through hole formed in the central part of the frame body (16).

[0031] Additionally, the upper surface (16a) of the frame body (16) has a shape almost identical to the upper surface (12a) of the table base (12). Additionally, the lower surface (16b) of the frame body (16) has a shape almost identical to the lower surface (12b) of the table base (12). Furthermore, near each of the four corners of the frame body (16), a cylindrical through hole (16c) is formed that opens in the upper surface (16a) and the lower surface (16b).

[0032] Additionally, a spiral groove (screw groove) may be formed on the side of this through hole (16c). Furthermore, this through hole (16c) is provided to overlap with the groove (12f) formed in the table base (12) when the table base (12) and the chuck table (14) are overlapped so that the side of the table base (12) and the side of the chuck table (14) (the outer side of the frame body (16)) are on the same plane.

[0033] Then, with the table base (12) and the chuck table (14) overlapped in this manner, the bolt (20) is inserted into the through hole (16c) and the groove (12f) to fasten them, thereby fixing the frame body (16) to the table base (12). That is, by fastening the bolt (20) in this way, the chuck table (14) having the frame body (16) is mounted on the table base (12).

[0034] Additionally, when a suction source communicating with the through hole (12d) is operated while the chuck table (14) is mounted on the table base (12), a suction force is applied to the retaining surface (18a) of the porous plate (18) through the through hole (12d), the concave portion (12c), and the porous plate (18). By doing so, the workpiece can be held on the retaining surface (18a) of the porous plate (18). Then, in the cutting device (2), the workpiece held on the retaining surface (18a) is divided to produce a plurality of chips.

[0035] FIG. 3 is a schematic perspective view showing an example of a workpiece being divided in a cutting device (2). The workpiece (11) is, for example, a package substrate obtained by sealing a plurality of devices with resin. The workpiece (11) shown in FIG. 3 includes a rectangular substrate (13) having a surface that is slightly wider than the retaining surface (18a) of the porous plate (18).

[0036] This substrate (13) includes a metal material such as, for example, 42 alloy (an alloy of iron and nickel) or copper, and includes a plurality of device regions (15) (here, three device regions (15)) and a surplus region (17) surrounding each of the plurality of device regions (15). In addition, each of the plurality of device regions (15) is divided into a plurality of regions (here, 16 regions) by a grid-shaped planned division line (19).

[0037] Additionally, on the surface (11a) side of the workpiece (11), a plurality of stages (21) partitioned by a planned division line (19) are exposed. Around each of the plurality of stages (21) (in the area overlapping with the planned division line (19)), a plurality of metal layers (not shown) that are insulated from each other by, for example, resin, etc. are arranged.

[0038] On the back side of each of the multiple stages (21), a semiconductor device (not shown), such as an IC (Integrated Circuit), LED (Light Emitting Diode), or MEMS (Micro Electro Mechanical Systems), is mounted.

[0039] Additionally, the metal layer placed around the electrode and stage (21) of this semiconductor device is connected by a metal wire (not shown), etc. And, a part of this metal layer becomes the respective electrode of a plurality of chips obtained by dividing the workpiece (11).

[0040] Referring again to FIG. 1, the remaining components of the cutting device (2) will be described. On the upper surface of the base (4), a gantry-shaped support structure (22) is positioned to span the opening (4a). On the front side of the support structure (22), a pair of cutting unit moving mechanisms (24) are provided. The pair of cutting unit moving mechanisms (24) are positioned on the upper part of the front surface of the support structure (22) and also share a pair of Y-axis guide rails (26) that extend along the Y-axis direction.

[0041] A Y-axis moving plate (28), which is included in each of the pair of cutting unit moving mechanisms (24), is attached to this Y-axis guide rail (26) in a manner that allows it to slide along the Y-axis direction. On the back (rear) side of this Y-axis moving plate (28), a nut portion (not shown) included in a ball screw is fixed. A screw shaft (30) extending along the Y-axis direction is rotatably connected to this nut portion.

[0042] Additionally, a Y-axis pulse motor (32) is connected to one end of the screw shaft (30). When the screw shaft (30) is rotated by this Y-axis pulse motor (32), the Y-axis moving plate (28) moves along the Y-axis direction. Additionally, a pair of Z-axis guide rails (34) extending along the Z-axis direction are arranged on the surface (front) of the Y-axis moving plate (28).

[0043] A Z-axis moving plate (36) is attached to this Z-axis guide rail (34) in a manner that allows it to slide along the Z-axis direction. Additionally, a nut portion (not shown) included in a ball screw is fixed to the back (rear) side of the Z-axis moving plate (36). A screw shaft (38) extending along the Z-axis direction is connected to this nut portion in a manner that allows it to rotate.

[0044] Additionally, a Z-axis pulse motor (40) is connected to one end of the screw shaft (38). When the screw shaft (38) is rotated by this Z-axis pulse motor (40), the Z-axis moving plate (36) moves along the Z-axis direction. A cutting unit (42) is provided at the bottom of the Z-axis moving plate (36).

[0045] This cutting unit (42) has, for example, a spindle housing configured in a tubular shape, and the spindle housing accommodates a spindle extending along the Y-axis direction and a rotational driving source, such as a motor, connected to the base end of the spindle. Additionally, the front end of the spindle is exposed to the outside from the spindle housing.

[0046] An annular cutting blade (44) is mounted on the tip of the spindle exposed to the outside from the spindle housing via a blade mounter. When a rotational drive source connected to the base of the spindle operates, the cutting blade (44) rotates together with the spindle, with a straight line along the Y-axis as the axis of rotation.

[0047] This cutting blade (44) is a hub-type cutting blade formed integrally with a toroidal base containing, for example, metal, and a toroidal cutting edge that follows the outer edge of the base. The cutting edge of the hub-type cutting blade is obtained by fixing abrasive grains containing, for example, diamond or cubic boron nitride (cBN) by a bonding material such as nickel.

[0048] Additionally, as a cutting blade (44), a washer-type cutting blade composed solely of annular cutting edges may be applied. A washer-type cutting blade (cutting edge) is obtained by fixing abrasive particles, such as diamond or cBN, with a bonding material such as resin.

[0049] Additionally, an imaging unit (46) is fixed to the lower part of the Z-axis moving plate (36) and positioned adjacent to the cutting unit (42) in the X-axis direction. The imaging unit (46) includes, for example, a two-dimensional light sensor such as a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor that is sensitive to visible light, and a lens for imaging.

[0050] Additionally, when the Y-axis moving plate (28) of the cutting unit moving mechanism (24) is moved along the Y-axis direction, the cutting unit (42) and the imaging unit (46) move together along the Y-axis direction. Additionally, when the Z-axis moving plate (36) of the cutting unit moving mechanism (24) is moved along the Z-axis direction, the cutting unit (42) and the imaging unit (46) move together along the Z-axis direction.

[0051] FIG. 4 is a flowchart schematically illustrating an example of a method for manufacturing a chip in which a workpiece (11) is divided along a planned division line (19) to produce a plurality of chips. Additionally, FIG. 5 (A), FIG. 5 (B), FIG. 5 (C) and FIG. 6 (A), FIG. 6 (B), FIG. 6 (C) are partial cross-sectional side views schematically illustrating the appearance of each step included in this method.

[0052] In this method, first, a groove-forming work is held on the holding surface (18a) of the porous plate (18) (groove-forming work holding step: S1). Figure 5 (A) is a partial cross-sectional side view schematically showing the appearance of the groove-forming work holding step (S1).

[0053] Additionally, the groove-forming workpiece (23) has the same rectangular shape as the workpiece (11). Furthermore, the groove-forming workpiece (23) includes a synthetic resin identical to the synthetic resin (e.g., polyurethane) that is the material of the porous plate (18). Alternatively, the groove-forming workpiece (23) may be a protective tape such as polyolefin.

[0054] In this groove-forming workpiece holding step (S1), the groove-forming workpiece (23) is placed on the chuck table (14) so ​​that the center of the holding surface (18a) of the porous plate (18) aligns with the center of one surface (23a) of the groove-forming workpiece (23). Then, a suction source communicating with the through hole (12d) of the table base (12) is operated.

[0055] Accordingly, an attractive force is applied to the retaining surface (18a) of the porous plate (18) through the through hole (12d) and the concave portion (12c) of the table base (12) and the porous plate (18). As a result, the groove-forming work (23) is retained on the retaining surface (18a) of the porous plate (18).

[0056] In addition, if the groove-forming work (23) is a protective tape, the groove-forming work (23) can be adhered to the retaining surface (18a) of the porous plate (18). Therefore, in this case, it is preferable not to operate the suction source as described above. In addition, in this case, it is preferable not to have the problem of being unable to maintain the groove-forming work (23) due to leakage through the gap between the groove-forming work (23) and the retaining surface (18a).

[0057] Next, a groove is formed by penetrating the groove-forming workpiece (23) along the area of ​​the porous plate (18) that is scheduled to overlap with the planned division line (19) of the workpiece (11), and also extending to the porous plate (18) (groove forming step: S2). Figure 5 (B) is a partial cross-sectional side view schematically showing the appearance of the groove forming step (S2). Additionally, prior to the groove forming step (S2), a groove-forming cutting blade (first cutting blade) (44a) is mounted on the tip of the spindle (48) of the cutting unit (42).

[0058] In this groove forming step (S2), first, the chuck table (14) is rotated so that a linearly extended portion of the area of ​​the porous plate (18) that is to overlap with the planned division line (19) of the workpiece (11) becomes parallel to the X-axis direction. Then, the chuck table (14) and / or the cutting unit (42) are moved so that, when viewed in a plane, this portion is positioned in the X-axis direction as seen from the groove forming cutting blade (44a).

[0059] Next, the cutting unit (42) is lowered so that the lower end of the groove-forming cutting blade (44a) is positioned lower than the retaining surface (18a) of the porous plate (18) and also higher than the lower surface (18b). Next, while rotating the groove-forming cutting blade (44a) through the spindle (48), the chuck table (14) is moved so that the groove-forming work (23), the frame body (16), and the porous plate (18) come into contact with the groove-forming cutting blade (44a) from one end to the other in the X-axis direction.

[0060] Accordingly, the groove-forming work (23) and the porous plate (18) are cut, and a straight groove (25) is formed that penetrates the groove-forming work (23) and extends to the porous plate (18). Subsequently, the same operation is repeated to form a groove (25) in the entire area of ​​the porous plate (18) that is scheduled to overlap with the planned division line (19) of the workpiece (11).

[0061] Next, a resin that seals the inner surface of the groove (25) formed on the retaining surface (18a) of the porous plate (18) is applied to the retaining surface (18a) (application step: S3). (C) of FIG. 5 is a partial cross-sectional side view schematically showing the chuck table (14), etc. after the application step (S3). In addition, the resin used in the application step (S3) may be a thermosetting resin such as polyurethane, epoxy resin, or melamine resin, or a thermoplastic resin such as polypropylene or polyethylene.

[0062] In this application step (S3), the resin is applied to the groove (25) using, for example, a known spray gun. At this time, the resin is also applied to the area near the groove (25) of the groove-forming work (23). As a result, a resin film (27) is formed that covers the inner surface of the groove (25) and the area near the groove (25) of the groove-forming work (23).

[0063] This resin film (27) seals the inner surface of the groove (25). Additionally, the groove-forming work (23) functions as a mask to prevent resin from being applied to areas other than the area where the groove (25) is formed on the retaining surface (18a) of the porous plate (18) (areas overlapping with the groove-forming work (23)). Therefore, the area of ​​the retaining surface (18a) of the porous plate (18) that overlaps with the groove-forming work (23) is not sealed.

[0064] Next, the workpiece (23) for forming the groove is separated from the retaining surface (18a) of the porous plate (18) (separation step: S4). Figure 6 (A) is a partial cross-sectional side view schematically showing the chuck table (14), etc. after the separation step (S4).

[0065] If the groove-forming work (23) is suctioned and held, in this separation step (S4), the operation of the suction source communicating with the through hole (12d) of the table base (12) is stopped, and then the groove-forming work (23) is removed from the chuck table (14). Additionally, if the groove-forming work (23) is a protective tape, in this separation step (S4), an external force is applied to separate the groove-forming work (23) from the holding surface (18a).

[0066] Next, the workpiece (11) is held on the holding surface (18a) of the porous plate (18) (workpiece holding step: S5). Figure 6 (B) is a partial cross-sectional side view schematically showing the workpiece holding step (S5).

[0067] In this workpiece holding step (S5), the workpiece (11) is placed on the chuck table (14) so ​​that the center of the holding surface (18a) of the porous plate (18) aligns with the center of the back surface (11b) of the workpiece (11). Then, a suction source communicating with the through hole (12d) of the table base (12) is operated.

[0068] Accordingly, an attractive force is applied to the retaining surface (18a) side through the through hole (12d) and the concave portion (12c) of the table base (12) and the porous plate (18), through the area other than the area where the groove (25) of the porous plate (18) is formed. In addition, since the inner surface of the groove (25) is sealed, there is no leakage through the groove (25). As a result, the workpiece (11) is retained on the retaining surface (18a) of the porous plate (18).

[0069] Next, the workpiece (11) is divided into multiple chips (dividing step: S6). Figure 6 (C) is a partial cross-sectional side view schematically showing the appearance of the dividing step (S6). Also, prior to the dividing step (S6), a cutting blade for the workpiece (second cutting blade) (44b) with a narrower blade width than the groove-forming cutting blade (44a) is mounted on the tip of the spindle (48) of the cutting unit (42).

[0070] In this dividing step (S6), first, the chuck table (14) is rotated so that a linearly extended portion of the planned dividing line (19) of the workpiece (11) becomes parallel to the X-axis direction. Then, the chuck table (14) and / or the cutting unit (42) are moved so that, when viewed in a plane, this portion is positioned in the X-axis direction as seen from the cutting blade (44b) for the workpiece.

[0071] Next, the cutting unit (42) is lowered so that the lower end of the cutting blade (44b) for the workpiece is lower than the back surface (11b) of the workpiece (11) and also higher than the bottom surface of the groove (25). Next, while rotating the cutting blade (44b) for the workpiece through the spindle (48), the chuck table (14) is moved so that the end from one end to the other end in the X-axis direction of the workpiece (11) comes into contact with the cutting blade (44b) for the workpiece.

[0072] Accordingly, the workpiece (11) is cut and divided along a straightly extended portion of the planned division line (19). At this time, the area where the groove (25) of the porous plate (18) is formed is exposed, but since the inner surface of the groove (25) is sealed, there is no leakage through the groove (25). Subsequently, the same operation is repeated to divide the workpiece (11) into multiple chips along the planned division line (19).

[0073] In the method shown in FIG. 4, prior to dividing the workpiece (11) to produce a plurality of chips, a groove (25) is formed in an area of ​​the porous plate (18) that is scheduled to overlap with the planned dividing line (19) of the workpiece (11), and then the inner surface of the groove (25) is sealed. Therefore, in this method, a chuck table (14) can be formed that includes a porous plate (18) having a retaining surface (18a) capable of retaining both the workpiece (11) and the plurality of chips produced by dividing the workpiece (11).

[0074] Specifically, when the workpiece (11) is divided while being held on this retaining surface (18a), a suction force can be applied to the retaining surface (18a) side through an area other than the area where the groove (25) of the porous plate (18) is formed. Furthermore, since the inner surface of this groove (25) is sealed, no suction force is applied to the retaining surface (18a) side through the area where the groove (25) of the porous plate (18) is formed. In other words, there is no leakage when holding the workpiece (11) or a plurality of chips on this retaining surface (18a).

[0075] In this way, in this method, a groove (25) according to the arrangement of the planned division line (19) set in the workpiece (11) can be easily formed on the retaining surface (18a). As a result, in a cutting device (2) equipped with a chuck table (14) including a porous plate (18) having the retaining surface (18a), the increase in the cost of manufacturing chips and the lengthening of the time required for manufacturing chips can be suppressed.

[0076] Furthermore, the above-described method is one embodiment of the present invention, and the present invention is not limited to the above-described method. For example, in the coating step (S3) of the present invention, the resin may be applied so that the portion of the groove (25) located below the groove-forming work (23) is filled with the resin. In addition, in this case, in the dividing step (S6), the resin filling the groove (25) together with the workpiece (11) may be cut.

[0077] In addition, in the present invention, a workpiece (23) for forming a groove may not be used. FIG. 7 is a flowchart schematically illustrating an example of a method for manufacturing such a chip. Also, FIG. 8 (A) and FIG. 8 (B) and FIG. 9 are partial cross-sectional side views schematically illustrating each step included in this method.

[0078] In this method, first, a groove is formed on the retaining surface (18a) of the porous plate (18) along the area of ​​the porous plate (18) that is to overlap with the planned division line (19) of the workpiece (11) (groove forming step: S10). Figure 8 (A) is a partial cross-sectional side view schematically showing the appearance of the groove forming step (S10). Also, prior to the groove forming step (S10), a groove forming cutting blade (first cutting blade) (44a) is mounted on the tip of the spindle (48) of the cutting unit (42).

[0079] In this groove forming step (S10), first, the chuck table (14) is rotated so that the entire retaining surface (18a) of the porous plate (18) is exposed, and the linearly extending portion of the area of ​​the porous plate (18) that is to overlap with the planned division line (19) of the workpiece (11) becomes parallel to the X-axis direction. Then, the chuck table (14) and / or cutting unit (42) are moved so that, when viewed in a plane, this portion is positioned in the X-axis direction as seen from the groove forming cutting blade (44a).

[0080] Next, the cutting unit (42) is lowered so that the lower end of the groove-forming cutting blade (44a) is positioned lower than the retaining surface (18a) of the porous plate (18) and also higher than the lower surface (18b). Next, while rotating the groove-forming cutting blade (44a) through the spindle (48), the chuck table (14) is moved so that the ends from one end to the other in the X-axis direction of the frame body (16) and the porous plate (18) come into contact with the groove-forming cutting blade (44a).

[0081] As a result, the porous plate (18) is cut, and a straight groove (29) is formed on the retaining surface (18a). Subsequently, the same operation is repeated to form a groove (29) in the entire area of ​​the porous plate (18) that is scheduled to overlap with the planned division line (19) of the workpiece (11).

[0082] Next, a resin that seals the inner surface of the groove (29) formed on the retaining surface (18a) of the porous plate (18) is applied to the retaining surface (18a) (application step: S20). Figure 8 (B) is a partial cross-sectional side view schematically showing the chuck table (14), etc. after the application step (S20). In addition, the resin used in the application step (S20) may be a thermosetting resin such as polyurethane, epoxy resin, or melamine resin, or a thermoplastic resin such as polypropylene or polyethylene.

[0083] In this application step (S20), resin is applied to the groove (29) using, for example, a known spray gun. At this time, resin is also applied to the area (peripheral area) of the retaining surface (18a) of the porous plate (18) located around the groove (29). By doing so, a resin film (31) covering the inner surface and peripheral area of ​​the groove (29) is formed. This resin film (31) seals the inner surface and peripheral area of ​​the groove (29).

[0084] Next, the resin applied to the area other than the area where the groove (29) of the retaining surface (18a) of the porous plate (18) is formed (here, the area surrounding the groove (29)) is removed (removal step: S30). This removal step (S30) is performed, for example, by grinding the retaining surface (18a) side of the porous plate (18) in a known grinding device.

[0085] FIG. 9 is a partial cross-sectional side view schematically illustrating the appearance of a removal step (S30) performed in a known grinding device. Specifically, in this removal step (S30), first, the chuck table (14) is separated from the table base (12) of the cutting device (2). Next, a back grind tape (BG tape) (33) is attached to the lower surface of the chuck table (14) (the lower surface (16b) of the frame body (16)).

[0086] Next, the chuck table (14) is placed on the retaining surface (52a) of the chuck table (52) of the grinding device (50) through the BG tape (33). This chuck table (52) has the same structure as, for example, the chuck table (14). In addition, the chuck table (52) is connected to a suction source (not shown) that applies a suction force to the retaining surface (52a) side, and to a horizontal movement mechanism that moves the chuck table (52) along the horizontal direction.

[0087] Additionally, a grinding unit (54) is provided above the chuck table (52). This grinding unit (54) is connected to a vertical movement mechanism that moves the grinding unit (54) along the vertical direction. Additionally, the grinding unit (54) has a cylindrical spindle (56) that extends along the vertical direction.

[0088] A disc-shaped mount (58) containing metal or the like is fixed to the front end (bottom end) of the spindle (56). Additionally, a rotational driving source (not shown), such as a motor, for rotating the spindle (56) is connected to the base end (top end) of the spindle (56). When the rotational driving source connected to the base end of the spindle (56) operates, the spindle (56) rotates with a straight line approximately parallel to the vertical direction as the axis of rotation.

[0089] Additionally, a toroidal grinding wheel (60) is mounted on the lower side of the mount (58). This grinding wheel (60) is fixed to the mount (58) using a fastener (not shown), such as a bolt, for instance. In this way, the grinding wheel (60) is mounted to the tip of the spindle (56) through the mount (58). Then, when the spindle (56) rotates, the grinding wheel (60) mounted to the tip also rotates with a straight line approximately parallel to the vertical direction as its axis of rotation.

[0090] Additionally, the grinding wheel (60) has a wheel base (62) and a plurality of grinding stones (64) fixed to the lower surface of the wheel base (62). The wheel base (62) has an annular shape with an outer diameter approximately equal to the diameter of the mount (58), and includes, for example, a metal such as stainless steel or aluminum or a resin.

[0091] Additionally, a plurality of grinding wheels (64) are arranged apart from each other along the circumferential direction of the grinding wheel (60) (wheel base (62)). Each of the plurality of grinding wheels (64) has a rectangular shape and includes abrasive particles, such as diamond or cBN (cubic boron nitride), and a binder (bond material) that fixes the abrasive particles. In addition, as the binder, for example, metal bond, resin bond, or vitrified bond may be used.

[0092] When the chuck table (14) is placed on the holding surface (52a) of the chuck table (52) via the BG tape (33), the suction source connected to the chuck table (52) is operated. By this, the chuck table (14) is held on the holding surface (52a). Subsequently, the chuck table (52) is moved so that the trajectory of the plurality of grinding wheels (64) when the spindle (56) is rotated is positioned directly above the center of the chuck table (14).

[0093] Continuing, while rotating both the chuck table (52) and the grinding wheel (60), the grinding unit (54) is lowered until the lower surface of each of the plurality of grinding wheels (64) comes into contact with the resin film (31) provided on the chuck table (14). By doing so, a portion of the resin film (31) is ground and removed. Additionally, while rotating both the chuck table (52) and the grinding wheel (60), the grinding unit (54) is lowered until the entire portion covering the surrounding area of ​​the groove (29) of the resin film (31) is removed.

[0094] When the entire portion covering the surrounding area of ​​the groove (29) of the resin film (31) is removed, the chuck table (52) and the grinding wheel (60) are separated, and the operation of the suction source connected to the chuck table (52) is stopped. Next, the chuck table (14) is removed from the chuck table (52) of the grinding device (50) along with the BG tape (33). Next, the BG tape (33) is peeled off from the lower surface of the chuck table (14) (the lower surface (16b) of the frame body (16).

[0095] Next, the chuck table (14) is mounted again on the table base (12) of the cutting device (2). Next, the workpiece (11) is held on the holding surface (18a) of the porous plate (18) (workpiece holding step: S40), and then the workpiece (11) is divided into a plurality of chips (dividing step: S50). Also, since the workpiece holding step (S40) and the dividing step (S50) correspond respectively to the workpiece holding step (S5) and the dividing step (S6) shown in FIG. 4, a detailed description of these steps is omitted.

[0096] In addition, in the method for manufacturing a chip shown in FIG. 7, after applying resin to the entire surface (18a) of the retaining surface (18) of the porous plate (18) in the application step (S20), the resin applied to the area other than the area where the groove (29) of the retaining surface (18a) is formed may be removed in the removal step (S30).

[0097] In addition, the structure and method according to the above-described embodiment may be appropriately modified and implemented as long as it does not deviate from the scope of the purpose of the present invention. Explanation of the symbols

[0098] 2 : Cutting device 4 : Base (4a: Opening) 6: Table moving mechanism 8 : Table cover 10 : Bellows cover 11 : Workpiece (11a: Surface, 11b: Back side) 12 : Table base (12a: Top surface, 12b: Bottom surface, 12c: Recess) (12d: through hole, 12e: inner wall, 12f: groove) 13 : Substrate 14 : Chuck Table 15: Device area 16 : Frame body (16a: Top surface, 16b: Bottom surface, 16c: Through hole) 17 : Redundant area 18 : Porous plate (18a: Top surface (holding surface), 18b: Bottom surface) 19: Line scheduled for division 20 : Bolt 21: Stage 22 : Support structure 23: Home forming work 24: Cutting unit moving mechanism 25 : Home 26 : Y-axis guide rail 27 : Sujimak 28 : Y-axis movement plate 29 : Home 30 : Screw shaft 31 : Sujimaek 32 : Y-axis pulse motor 33 : Backgrind Tape (BG Tape) 34 : Z-axis guide rail 36 : Z-axis movement plate 38 : Screw shaft 40 : Z-axis pulse motor 42 : Cutting unit 44: Cutting blade 46 : Imaging unit 48 : Spindle 50 : Grinding device 52 : Chuck table (52a: retaining surface) 54: Grinding unit 56 : Spindle 58 : Mount 60: Grinding wheel 62: Wheelbase 64: Grinding wheel

Claims

Claim 1 A cutting device comprising a first synthetic resin and a retaining surface for holding a workpiece, a chuck table comprising a second synthetic resin and a frame body surrounding the porous plate in a manner in which the retaining surface of the porous plate is exposed, and a cutting unit having a spindle having a toroidal cutting blade mounted at its tip, wherein a method for manufacturing a plurality of chips by dividing the workpiece along a planned dividing line comprises: a groove forming step of forming a groove on the retaining surface by contacting the first cutting blade to the porous plate along an area of ​​the porous plate that is scheduled to overlap with the planned dividing line while rotating the first cutting blade; an application step of applying a resin that seals the inner surface of the groove to the retaining surface after the groove forming step; a removal step of removing the resin applied to an area other than the area where the groove is formed on the retaining surface after the application step; a workpiece holding step of holding the workpiece on the retaining surface after the removal step; and after the workpiece holding step, a A method for manufacturing chips comprising a dividing step of dividing a workpiece into a plurality of chips by rotating a second cutting blade with a narrow blade width and contacting the second cutting blade with the workpiece along a planned dividing line. Claim 2 delete Claim 3 delete

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