Resin molding device, and method for manufacturing a resin molded article

Abstract

A resin molding apparatus capable of manufacturing a resin molded product with high precision is provided. The apparatus comprises a lower mold for mounting a substrate, a side block, and an upper mold for forming a cavity by means of a cavity block installed to be vertically movable relative to the side block, a clamping mechanism for clamping the lower mold and the upper mold, a transfer mechanism for supplying resin material to the cavity by means of a plunger, and a control unit for performing a filling rate corresponding control that controls an operation related to resin molding by utilizing the relationship between the position of the plunger and the resin filling rate of the cavity calculated based on the volume of a chip placed on the substrate and the volume of the resin material, wherein the plunger reaches a position corresponding to a predetermined resin filling rate.

Description

Technology Field

[0001] The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded article. Background Technology

[0002] Patent Document 1 discloses a resin molding device comprising a lower die on which a substrate is mounted, an upper die forming a cavity by means of an upper die cavity frame member and a cavity block, a die fastening mechanism for clamping the lower die and the upper die, and a plunger for supplying a resin material to the cavity. This resin molding device can adjust the depth of the cavity to an appropriate depth by adjusting the position of the cavity block relative to the upper die cavity frame member. Prior art literature

[0003] Patent Document 1: Japanese Patent Publication No. 2020-179604 The problem to be solved

[0004] Recently, the demand for precision in resin molded products has been increasing alongside the expansion of technological fields in which resin molded products are applied. Consequently, there is a need for technology capable of manufacturing resin molded products with higher precision.

[0005] The present invention has been made in consideration of the above-mentioned situation, and the problem to be solved is to provide a resin molding apparatus and a method for manufacturing a resin molded article capable of manufacturing a resin molded article with high precision. means of solving the problem

[0006] The problem to be solved by the present invention is as described above, and in order to solve this problem, the resin molding device according to the present invention comprises a lower mold for placing a substrate, a side block, and an upper mold for forming a cavity by means of a cavity block installed to be vertically movable with respect to the side block, a clamping mechanism for clamping the lower mold and the upper mold, a transfer mechanism for supplying a resin material to the cavity by means of a plunger, and a control unit for performing a filling rate corresponding control that controls an operation related to resin molding by using the relationship between the resin filling rate of the cavity calculated based on the volume of a chip placed on the substrate and the volume of the resin material and the position of the plunger, wherein the plunger reaches a position corresponding to a predetermined resin filling rate.

[0007] In addition, the method for manufacturing a resin molded article according to the present invention is to manufacture a resin molded article using the resin molding device.

[0008] In addition, the method for manufacturing a resin molded article according to the present invention comprises a chip volume measurement process for measuring the volume of a chip placed on a substrate, a resin volume measurement process for measuring the volume of a resin material, a plunger position calculation process for calculating the relationship between the resin filling rate of a cavity and the position of a plunger based on the measured volume of the chip and the volume of the resin material, and a filling rate corresponding control process for controlling an operation related to resin molding when the plunger reaches a position corresponding to a predetermined resin filling rate. Effects of the invention

[0009] According to the present invention, a resin molded article with high precision can be manufactured. Brief explanation of the drawing

[0010] [Fig. 1] A schematic plan view showing the overall configuration of a resin molding device according to one embodiment. [Fig. 2] A front cross-sectional view showing the configuration of a resin molding module according to one embodiment. [Fig. 3] (a) A plan view showing the configuration of a lower mold according to one embodiment as viewed from the mold surface side (upward). (b) A bottom view showing the configuration of an upper mold according to one embodiment as viewed from the mold surface side (downward). [Fig. 4] (a) Plan schematic diagram showing a connecting groove connecting the curl sections. (b) Plan schematic diagram showing an example where the curl sections are connected through a cavity. [Fig. 5] (a) Front cross-sectional view showing the cavity depth becoming shallow when clamped by a clamping mechanism. (b) Front cross-sectional view showing the cavity depth becoming deep when resin is supplied by a plunger. [Fig. 6] Flowchart showing an example of a method for manufacturing a resin molded article. [Fig. 7] A diagram showing the time variation of the clamp load, plunger position, and plunger load with respect to the first control mode. [Fig. 8] Flowchart showing a specific example of charging rate corresponding control. [Fig. 9] (a) Front cross-sectional view showing the lower and upper molds in a connected state. (b) Front cross-sectional view showing the lower and upper molds with the clamp load reduced. [Fig. 10] A diagram showing the time variation of clamp load, plunger position, and plunger load with respect to the second control mode. Specific details for implementing the invention

[0011] In the following, the directions indicated by arrows U, D, L, R, F, and B in the drawings are defined and described as the upward, downward, left, right, forward, and backward directions, respectively.

[0012] <Overall configuration of the resin molding device (1)>

[0013] First, the configuration of the resin molding apparatus (1) according to the first embodiment will be described using FIG. 1. The resin molding apparatus (1) manufactures a resin molded product by resin sealing an electronic device (hereinafter simply referred to as "chip (2a)") such as a semiconductor chip. In particular, this embodiment exemplifies a resin molding apparatus (1) that performs resin molding using a transfer molding method.

[0014] The resin molding device (1) includes a supply module (10), a resin molding module (20), and an output module (30) as components. Each component is detachable and interchangeable with respect to other components.

[0015] <Supply Module (10)>

[0016] The supply module (10) supplies a lead frame (hereinafter simply referred to as "substrate 2"), which is a type of substrate mounted with a chip (2a), and a resin tablet (T) to the resin molding module (20). In addition, although a lead frame is exemplified as the substrate (2) in this embodiment, it is possible to use various other substrates (glass epoxy substrate, ceramic substrate, resin substrate, metal substrate, etc.) in addition to the lead frame. The supply module (10) mainly comprises a frame output unit (11), a frame measurement unit (12), a frame supply unit (13), a resin output unit (14), a resin measurement unit (15), a resin supply unit (16), a loader (17), and a control unit (18).

[0017] The frame output unit (11) outputs a substrate (2) that is not resin-sealed and is contained in an in-magazine unit (not shown) to the frame measuring unit (12). The frame measuring unit (12) measures the volume of a chip (2a) mounted on the substrate (2). Additionally, the frame measuring unit (12) is an embodiment of the chip volume measuring unit of the present invention. The frame measuring unit (12) will be described later. The substrate (2) that has been measured at the frame measuring unit (12) is sent to the frame supply unit (13). The frame supply unit (13) receives the substrate (2) from the frame measuring unit (12), properly aligns the received substrate (2), and delivers it to the loader (17).

[0018] The resin dispensing unit (14) receives a resin tablet (T) from a stocker (not shown) and dispenses the resin tablet (T) to the resin measuring unit (15). The resin measuring unit (15) measures the weight (volume) of the resin tablet (T). Additionally, the resin measuring unit (15) is an embodiment of the resin volume measuring unit of the present invention. Details regarding the resin measuring unit (15) will be described later. The resin tablet (T) that has been measured at the resin measuring unit (15) is dispensed to the resin supply unit (16). The resin supply unit (16) receives the resin tablet (T) from the resin measuring unit (15), arranges the received resin tablet (T) appropriately, and delivers it to the loader (17).

[0019] The loader (17) returns the substrate (2) and resin tablet (T) received from the frame supply unit (13) and the resin supply unit (16) to the resin molding module (20).

[0020] The control unit (18) controls the operation of each module of the resin molding device (1). In addition, the control unit (18) is an embodiment of the output unit of the present invention. The operation of the supply module (10), the resin molding module (20), and the output module (30) is controlled by the control unit (18). Furthermore, the operation of each module can be arbitrarily changed (adjusted) using the control unit (18).

[0021] In addition, although the present embodiment shows an example in which the control unit (18) is installed in the supply module (10), it is also possible to install the control unit (18) in other modules. Furthermore, it is also possible to install multiple control units (18). For example, it is possible to install a control unit (18) for each module or for each device and control each module individually while linking their operations with one another.

[0022] <Resin molding module (20)>

[0023] The resin molding module (20) resin seals the chip (2a) mounted on the substrate (2). In this embodiment, two resin molding modules (20) are arranged side by side. By performing resin sealing of the substrate (2) in parallel using two resin molding modules (20), the manufacturing efficiency of the resin molded product can be improved. The resin molding module (20) mainly comprises a molding mold (lower mold (110) and upper mold (140)) and a mold fastening mechanism (190) (see FIG. 2).

[0024] The molding mold (lower mold (110) and upper mold (140)) uses molten resin material to resin seal a chip (2a) mounted on a substrate (2). The molding mold is equipped with a pair of upper and lower molds, namely the lower mold (110) and the upper mold (140) (see FIG. 2, etc.). A heating element (not shown), such as a heater, is installed in the molding mold.

[0025] The mechanism (190) for the mold connection (see FIG. 2) is to connect or open the molding mold (lower mold (110) and upper mold (140)) by moving the lower mold (110) up and down.

[0026] <Export Module (30)>

[0027] The discharge module (30) receives and discharges a resin-sealed substrate (2) from the resin molding module (20). The discharge module (30) mainly comprises an unloader (31) and a substrate receiving portion (32).

[0028] The unloader (31) holds the resin-sealed substrate (2) and transfers it to the substrate receiving section (32). The substrate receiving section (32) receives the resin-sealed substrate (2).

[0029] <Overview of operation of resin molding device (1)>

[0030] Next, an overview of the operation of the resin molding device (1) configured as described above (a method for manufacturing a resin molded product using the resin molding device (1)) is explained using FIGS. 1 and 2.

[0031] In the supply module (10), the frame output unit (11) transmits the substrate (2) received in the in-magazine unit (not shown) to the frame measurement unit (12). The frame measurement unit (12) measures the volume of the chip (2a) of the received substrate (2) and then transmits the substrate (2) to the frame supply unit (13). The frame supply unit (13) properly aligns the received substrate (2) and delivers it to the loader (17).

[0032] Additionally, the resin dispensing unit (14) transmits the resin tablet (T) received from the stocker (not shown) to the resin measuring unit (15). The resin measuring unit (15) measures the weight (volume) of the received resin tablet (T) and then transmits the resin tablet (T) to the resin supply unit (16). The resin supply unit (16) transmits the required number of the received resin tablets (T) to the loader (17). The loader (17) returns the received substrate (2) and the resin tablet (T) to the molding mold of the resin molding module (20).

[0033] In the resin molding module (20), the mold fastening mechanism (190) fastens the molding mold. Then, the resin tablet (T) is heated and melted by the heating part (not shown) of the molding mold, and the substrate (2) is resin-sealed using the generated molten resin.

[0034] After the resin sealing is completed, the mold fastening mechanism (190) opens the mold. Then, the resin-sealed substrate (2) is released. After that, the unloader (31) removes the substrate (2) from the mold and receives it in the substrate receiving portion (32) of the release module (30). At this time, unnecessary parts of the resin-molded substrate (2) (unnecessary resin such as curls and runners) are appropriately removed. In this way, the resin-sealed substrate (2) (resin-molded product) is manufactured.

[0035] <Detailed configuration of the resin molding module (20)>

[0036] Next, the configuration of the resin molding module (20) will be described in more detail. As shown in FIG. 2, the resin molding module (20) mainly comprises a lower mold installation part (100), a lower mold (110), a lower mold cavity adjustment mechanism (120), an upper mold installation part (130), an upper mold (140), a disc spring (150), an upper mold cavity adjustment mechanism (160), an air vent opening / closing mechanism (170), a transfer mechanism (180), and a mold fastening mechanism (190).

[0037] <Lower mold installation part (100)>

[0038] The lower mold installation part (100) shown in FIG. 2 is the part where the lower mold (110) is installed. The lower mold installation part (100) mainly comprises a lower mold movable base part (101) and a lower mold mounting part (102).

[0039] The lower mold movable base part (101) forms the lower part of the lower mold installation part (100). The lower mold mounting part (102) is the part to which the lower mold (110) is attached. The lower mold mounting part (102) is installed on the upper part of the lower mold movable base part (101).

[0040] <Ha-hyung (110)>

[0041] The lower mold (110) shown in FIGS. 2, FIGS. 3(a) and FIGS. 9 forms the lower part of the molding mold. The lower mold (110) mainly comprises a lower mold side block (111), a port block (112), a lower mold cavity block (113), a lower mold pillar (114), and a lower mold elastic member (115). In the lower mold (110) of the present embodiment, as shown in FIG. 3(a), a port block (112) is located in the center, lower mold cavity blocks (113) are arranged on the left and right sides thereof, and a lower mold side block (111) is arranged further outward from the lower mold cavity blocks (113).

[0042] The lower side block (111) forms the outer periphery of the lower mold (110). The lower side block (111) is installed on the upper surface of the lower mounting part (102).

[0043] The port block (112) is a portion that receives a resin tablet (T) supplied from the supply module (10). Multiple through holes (ports) for receiving the resin tablet (T) are formed in the port block (112). The port block (112) is positioned by fitting its left and right sides into the lower cavity block (113). The port block (112) is installed on the upper surface of the lower mounting portion (102).

[0044] The lower cavity block (113) is the part where the substrate (2) is mounted. The lower cavity block (113) is positioned between the lower side block (111) and the port block (112). The lower cavity block (113) is positioned to be movable in the vertical direction relative to the lower side block (111) and the port block (112).

[0045] The lower pillar (114) is a member positioned to extend downward from the lower cavity block (113). The upper end of the lower pillar (114) is fixed to the lower end of the lower cavity block (113).

[0046] The lower elastic member (115) applies upward force to the lower cavity block (113). The lower elastic member (115) is formed, for example, by a compression coil spring. The lower elastic member (115) is positioned between the lower cavity block (113) and the lower mounting part (102). Due to the applied force (positive force) of the lower elastic member (115), an upward force is always applied to the lower cavity block (113).

[0047] <Lower cavity adjustment mechanism (120)>

[0048] The lower cavity adjustment mechanism (120) illustrated in FIG. 2 adjusts the position of the lower cavity block (113). The lower cavity adjustment mechanism (120) mainly comprises a lower first wedge-shaped member (121), a lower second wedge-shaped member (122), and a lower wedge-shaped member driving unit (123).

[0049] The lower first wedge-shaped member (121) and the lower second wedge-shaped member (122) are a pair of members with tapered portions formed on surfaces facing each other. The lower second wedge-shaped member (122) is positioned above the lower first wedge-shaped member (121). The lower second wedge-shaped member (122) is positioned below the lower pillar (114). The downward movement of the lower cavity block (113) is restricted by the lower end of the lower pillar (114) coming into contact with the lower second wedge-shaped member (122). By doing so, the position of the lower cavity block (113) is defined.

[0050] The lower wedge-shaped member drive unit (123) moves the lower first wedge-shaped member (121) in a horizontal direction (left and right direction). The lower wedge-shaped member drive unit (123) is formed, for example, by a servo motor or an air cylinder. The lower wedge-shaped member drive unit (123) is connected to the lower first wedge-shaped member (121) through a suitable power transmission member. By driving the lower wedge-shaped member drive unit (123), the lower first wedge-shaped member (121) can be moved arbitrarily in the left and right directions.

[0051] The position of the lower cavity block (113) can be adjusted by the lower cavity adjustment mechanism (120) configured in this manner. Specifically, by driving the lower wedge-shaped member driving unit (123) to move the lower first wedge-shaped member (121) in the left and right directions, the lower second wedge-shaped member (122) in contact with the lower first wedge-shaped member (121) is displaced up and down along the tapered portion. As the lower second wedge-shaped member (122) is displaced up and down, the position where the downward movement of the lower column (114) is restricted is displaced, and furthermore, the position of the lower cavity block (113) can be adjusted.

[0052] <Image installation part (130)>

[0053] The upper mold installation part (130) shown in FIGS. 2 and FIGS. 9 is a part where the upper mold (140) is installed. The upper mold installation part (130) is one embodiment of the upper mold support part of the present invention. The upper mold installation part (130) mainly comprises an upper mold fixing base part (131), an upper mold mounting part (132), and a heater plate (133).

[0054] The upper mold fixed base portion (131) forms the upper part of the upper mold installation portion (130). The upper mold mounting portion (132) is the part to which the upper mold (140) is attached. The upper mold mounting portion (132) is formed by combining a plurality of members. The upper mold mounting portion (132) is installed at the lower part of the upper mold fixed base portion (131). A support portion (132a) is installed on the outer periphery of the upper mold mounting portion (132) to support the upper mold (140) (upper mold base portion (141)), which will be described later, from below. The heater plate (133) is for heating the upper mold (140). The heater plate (133) is installed on the bottom surface of the upper mold mounting portion (132).

[0055] <Pictogram (140)>

[0056] The upper die (140) shown in FIGS. 2, FIGS. 3b and FIGS. 9 forms the upper part of the molding die. The upper die (140) mainly comprises an upper die base part (141), an upper die side block (142), an upper die cavity block (143), an upper die support (145), and an upper die pillar (146). In this embodiment, as shown in FIG. 3b, there is a curl block (144) in the center, upper cavity blocks (143) are arranged on the left and right sides thereof, and an upper die side block (142) is arranged on the outer circumference (excluding the curl block side) of the upper cavity blocks (143).

[0057] The upper base portion (141) is a member that supports the upper side block (142) described later. The upper base portion (141) is formed in a plate shape having a predetermined thickness at the top and bottom. The outer circumference of the upper base portion (141) is supported from below by the support portion (132a) of the upper mounting portion (132). By this, the upper base portion (141) is supported so as to be movable in the up and down direction relative to the upper mounting portion (130).

[0058] The upper mold side block (142) forms the side of the cavity (C) formed by the upper mold (140). The upper mold side block (142) is one embodiment of the side block of the present invention. The upper mold side block (142) is formed in a frame shape with an opening formed at a position corresponding to the resin molded product (cavity (C)). The upper mold side block (142) is installed on the lower surface of the upper mold base part (141). An air vent groove (142a) is formed in the upper mold side block (142).

[0059] The air vent groove (142a) shown in FIG. 2 is for discharging air inside the cavity (C) to the outside. The air vent groove (142a) is formed at an appropriate location on the lower surface of the upper side block (142).

[0060] The upper mold cavity block (143) forms the upper surface of the cavity (C) formed by the upper mold (140). Additionally, the upper mold cavity block (143) is one embodiment of the cavity block of the present invention. The upper mold cavity block (143) is positioned inside the upper mold side block (142) (more specifically, inside the opening of the upper mold side block (142)). The upper mold cavity block (143) is positioned to be movable in the vertical direction relative to the upper mold side block (142).

[0061] The curl block (144) is positioned opposite the port block (112) of the lower mold (110) and forms the side of the cavity (C) formed by the upper mold (140). On the lower surface of the curl block (144), a groove-shaped curl portion (144a) and a runner portion (144b) are formed to guide the resin material into the cavity (C) (see FIG. 3b). Additionally, FIG. 2 schematically shows the through hole (port) of the port block (112) communicating with the cavity (C), which will be described later, through the curl portion (144a) and the runner portion (144b) so that the flow of the resin can be easily understood.

[0062] The upper mold support (145) restricts the upward movement of the upper mold (140) by contacting the upper mold installation part (130) and defines the position of the upper mold (140). The upper mold support (145) is fixed to the upper surface of the upper mold base part (141). Multiple upper mold supports (145) are installed at appropriate locations on the upper surface of the upper mold base part (141).

[0063] The upper pillar (146) is a member positioned to extend upward from the upper cavity block (143). The lower end of the upper pillar (146) is fixed to the upper end of the upper cavity block (143). The upper pillar (146) is positioned to penetrate the upper base portion (141).

[0064] In addition, Figure 2 shows a state in which a release film (F) is adsorbed onto the lower surface (the surface forming the cavity (C)) of the upper mold (140).

[0065] <Disk Spring 150>

[0066] The disc spring (150) applies force downward to the upper mold (140). Additionally, the disc spring (150) is one embodiment of the application part of the present invention. The disc spring (150) is positioned between the lower surface of the upper mold mounting part (130) (heater plate (133)) and the upper surface of the upper mold (140) (upper mold base part (141)). Due to the applied force (subjective force) of the disc spring (150), a force is always applied to the upper mold (140) in a direction away from the upper mold mounting part (130) (downward).

[0067] <Shape cavity adjustment mechanism (160)>

[0068] The upper cavity adjustment mechanism (160) adjusts the position of the upper cavity block (143). The upper cavity adjustment mechanism (160) is one embodiment of the position adjustment mechanism of the present invention. The upper cavity adjustment mechanism (160) is provided with an upper cavity block holding member (161), an upper cavity block driving part (162), a regulating member (163), an upper elastic member (164), an upper first wedge-shaped member (165), an upper second wedge-shaped member (166), and an upper wedge-shaped member driving part (167).

[0069] The upper cavity block retaining member (161) retains the upper cavity block (143). The upper cavity block retaining member (161) is formed in a hollow frame shape when viewed from the front. The upper cavity block retaining member (161) is formed by combining a plurality of members (such as upper and lower plate-shaped members and a plurality of cylindrical-shaped members connecting the upper and lower plate-shaped members). The upper cavity block retaining member (161) is positioned to penetrate the upper fixing base part (131) vertically. The upper cavity block retaining member (161) is installed to be movable vertically relative to the upper fixing base part (131). The upper end of the upper filler (146) is fixed to the lower surface of the upper cavity block retaining member (161). By this, the upper cavity block retaining member (161) can retain the upper cavity block (143) through the upper filler (146).

[0070] The upper cavity block drive unit (162) moves the upper cavity block holding member (161) in a vertical direction (up and down direction). The upper cavity block drive unit (162) is formed, for example, by a servo motor or an air cylinder. The upper cavity block drive unit (162) is installed on the upper part of the upper cavity block holding member (161). By driving the upper cavity block drive unit (162), the upper cavity block holding member (161) (furthermore, the upper cavity block (143)) can be moved arbitrarily in an up and down direction relative to the upper installation unit (130).

[0071] The regulating member (163) restricts the movement of the upper cavity block retaining member (161) by contacting the upper cavity block retaining member (161). The regulating member (163) is formed by combining a plurality of members (such as plate-shaped members). The regulating member (163) includes an upper portion that crosses the upper cavity block retaining member (161) from left to right and a central portion disposed inside the upper cavity block retaining member (161). The central portion of the regulating member (163) is positioned to contact the lower portion (bottom portion) of the upper cavity block retaining member (161) from above. By contacting the lower portion of the upper cavity block retaining member (161) from above, the regulating member (163) can restrict the upward movement of the upper cavity block retaining member (161). By doing so, the depth of the cavity (C) can be restricted.

[0072] The upper elastic member (164) applies upward force to the regulating member (163). The upper elastic member (164) is formed, for example, by a compression coil spring. The upper elastic member (164) is positioned between the regulating member (163) and the upper mounting part (132). Due to the pressure of the upper elastic member (164), an upward force is always applied to the regulating member (163).

[0073] The upper first wedge-shaped member (165) and the upper second wedge-shaped member (166) are a pair of members having tapered portions formed on surfaces facing each other. The upper second wedge-shaped member (166) is positioned below the upper first wedge-shaped member (165). The upper first wedge-shaped member (165) and the upper second wedge-shaped member (166) are positioned inside the upper cavity block retaining member (161). More specifically, the upper first wedge-shaped member (165) and the upper second wedge-shaped member (166) are positioned between the upper fixed base portion (131) and the regulating member (163). The upper second wedge-shaped member (166) is fixed to the upper surface of the regulating member (163).

[0074] The upper wedge-shaped member drive unit (167) moves the upper first wedge-shaped member (165) in a horizontal direction (left and right direction). The upper wedge-shaped member drive unit (167) is formed, for example, by a servo motor, an air cylinder, etc. The upper wedge-shaped member drive unit (167) is connected to the upper first wedge-shaped member (165) through a suitable power transmission member. By driving the upper wedge-shaped member drive unit (167), the upper wedge-shaped member drive unit (167) can be moved arbitrarily in the left and right direction.

[0075] The position of the upper cavity block (143) can be adjusted by the upper cavity adjustment mechanism (160) configured in this manner. Specifically, by driving the upper cavity block driving unit (162) to move the upper cavity block holding member (161) downward, a gap can be created between the regulating member (163) and the lower part of the upper cavity block holding member (161). That is, the regulating member (163) can move up and down using this gap. In this state, by driving the upper wedge-shaped member driving unit (167) to move the upper first wedge-shaped member (165) in the left and right directions, the upper second wedge-shaped member (166) in contact with the upper first wedge-shaped member (165) can be displaced up and down along the tapered portion. In addition, the regulating member (163) also displaces up and down together with the upper second wedge-shaped member (166). After adjusting the regulating member (163) to a predetermined position, the upper cavity block driving unit (162) is driven again to move the upper cavity block holding member (161) upward until it comes into contact with the regulating member (163). By displacing the regulating member (163) up and down in this way, the position where the upward movement of the upper cavity block holding member (161) is restricted is displaced, thereby allowing the position of the upper cavity block (143) to be adjusted.

[0076] <Air vent opening / closing mechanism (170)>

[0077] The air vent opening / closing mechanism (170) illustrated in FIG. 2 opens and closes an air vent groove (142a) that communicates the cavity (C) with the outside. The air vent opening / closing mechanism (170) mainly comprises an air vent pin (171) and an air vent driving part (172).

[0078] The air vent pin (171) is intended to block the air vent groove (142a). The air vent pin (171) is installed so as to be movable up and down in a through hole within an upper side block (142) that is in communication with the air vent groove (142a).

[0079] The air vent drive unit (172) moves the air vent pin (171) in an up-and-down direction. The air vent drive unit (172) is formed by, for example, a servo motor, an air cylinder, etc. The air vent drive unit (172) is connected to the air vent pin (171) through a suitable power transmission member. By driving the air vent drive unit (172), the air vent pin (171) can be moved up and down arbitrarily. For example, by moving the air vent pin (171) downward, the air vent groove (142a) can be closed.

[0080] <Transfer mechanism (180)>

[0081] The transfer mechanism (180) supplies resin material to the cavity (C). The transfer mechanism (180) mainly comprises a transfer drive unit (181), a plunger (182), and a plunger load measuring unit (183).

[0082] The transfer drive unit (181) is a driving source that moves the plunger (182), which will be described later, in a vertical direction (up and down direction). In addition, the transfer drive unit (181) is one embodiment of the driving source of the present invention. The transfer drive unit (181) is formed, for example, by a servo motor or an air cylinder. The transfer drive unit (181) is installed on the lower movable base unit (101) below the port block (112).

[0083] The plunger (182) injects a resin tablet (T) (resin material) contained in the port block (112) and supplies it to the cavity (C). The plunger (182) is positioned to be able to move up and down within the port block (112).

[0084] The plunger load measuring unit (183) measures the force (plunger load) applied to the plunger (182). Specifically, the force applied to the plunger (182) is the force with which the transfer drive unit (181) presses the plunger (182). The plunger load measuring unit (183) is formed, for example, by a load cell. The plunger load measuring unit (183) is installed between the transfer drive unit (181) and the plunger (182).

[0085] In addition, in this embodiment, an elastic member (equal pressure mechanism) for equalizing the force (furthermore, the resin pressure within the cavity (C)) applied to the resin material by each plunger (182) is not arranged between the transfer drive unit (181) and the plunger (182). Therefore, the plunger (182) moves by an amount proportional to the output of the transfer drive unit (181). For example, when the plunger (182) is pushed up from below using an air cylinder having an extendable rod as the transfer drive unit (181), the plunger (182) also moves by an amount equal to the amount of movement of the rod of the transfer drive unit (181). Additionally, when the transfer drive unit (181) moves the plunger (182) through a suitable reduction mechanism, the plunger (182) moves by an amount of movement obtained by multiplying the output of the transfer drive unit (181) by the reduction ratio of the reduction mechanism.

[0086] <Shape of the curl (144a)>

[0087] As such, since the plunger (182) is configured to move by an amount proportional to the output of the transfer drive unit (181), it is desirable that the resin pressure within the cavity (C) be uniform when supplying resin material to the cavity (C) through multiple plungers (182). In this embodiment, the configuration is such that resin material is supplied to a common cavity (C) from multiple plungers (182) (ports), and the resin pressure is uniform through the cavity (C). Other methods for making the resin pressure in the cavity (C) uniform include, for example, forming a connecting groove (144c) that connects the curl portions (144a) as shown in FIG. 4(a), or forming a connecting groove (144d) that connects the cavities (C) when there are multiple cavities (C) as shown in FIG. 4(b) (supplying resin material from multiple curl portions (144a) to a common cavity (C)). By connecting the curl portions (144a) in this way, it is possible to suppress the uneven pressure applied to the resin material caused by the unevenness of the plunger load of each plunger (182).

[0088] <Type fastening mechanism (190)>

[0089] The mold fastening mechanism (190) illustrated in FIG. 2 raises the lower mold (110) to clamp the lower mold (110) and the upper mold (140). Additionally, the mold fastening mechanism (190) is one embodiment of the clamp mechanism of the present invention. The mold fastening mechanism (190) mainly comprises a fixing plate (191), a support (192), a driving mechanism (193), and a clamp load measuring part (194).

[0090] The fixed plate (191) is a part installed on the ground to support other members. On the upper part of the fixed plate (191), a lower mold (110) (lower mold installation part (100)) is installed through a driving mechanism (193) described later.

[0091] The support (192) supports the upper mold (140) (upper mold installation part (130)). The support (192) is installed to extend upward from the fixing plate (191). The upper mold fixing base part (131) of the upper mold installation part (130) is fixed to the upper part of the support (192). By this, the upper mold (140) (upper installation part (130)) is positioned above the lower mold (110) (lower installation part (100)).

[0092] The driving mechanism (193) moves the lower mold (110) (lower mold installation part (100)) in a vertical direction (up and down direction). The driving mechanism (193) is formed by a driving source, such as a servo motor, and an appropriate power transmission mechanism. The driving mechanism (193) is positioned between the fixed plate (191) and the lower mold installation part (100). By driving the driving mechanism (193), the lower mold installation part (100) can be moved (raised) arbitrarily in the up and down direction. For example, the mold can be secured by raising the lower mold (110) toward the upper mold (140) by the driving mechanism (193). Additionally, the mold can be opened by lowering the lower mold (110) away from the upper mold (140) by the driving mechanism (193).

[0093] The clamp load measuring unit (194) measures the force (clamp load) when the lower mold (110) and the upper mold (140) are clamped together by the mold clamping mechanism (190). The clamp load measuring unit (194) is formed, for example, by a load cell or a strain gauge. The clamp load measuring unit (194) is installed on the support (192). The clamp load measuring unit (194) can measure the clamp load based on the load applied to the support (192).

[0094] In addition, FIG. 2 shows the state in which the lower mold (110) and the upper mold (140) are clamped after the substrate (2) and the resin tablet (T) are returned to the molding mold.

[0095] <Overview of Manufacturing Method for Resin Molded Products>

[0096] Below, a method for manufacturing a resin molded product using a resin molding device (1) configured as described above will be explained.

[0097] In this embodiment, when resin molding is performed in the resin molding module (20), control is performed to improve the dimensional accuracy of the product (specifically, the dimensional accuracy of the thickness of the molded resin). To help understand this control, the factors causing the product dimensions to change in the resin molding device (1) will first be explained with reference to FIG. 5.

[0098] As illustrated in FIG. 5(a), when the lower mold (110) is raised by the mold fastening mechanism (190) to clamp the lower mold (110) and the upper mold (140), the upper mold side block (142) of the upper mold (140) comes into contact with the lower mold (110). Therefore, the clamp load by the mold fastening mechanism (190) is mainly applied to the upper mold side block (142). When the clamp load is applied to the upper mold side block (142), the upper mold side block (142) is compressed vertically and deforms slightly, so there is a risk that the depth (thickness in the vertical direction) of the cavity (C) will become shallow.

[0099] Additionally, as shown in FIG. 5(b), when resin is supplied into the cavity (C) by the plunger (182) of the transfer mechanism (180), pressure from the resin material in the cavity (C) acts upward on the upper cavity block (143). Because of this, the upper cavity block (143) is pushed upward and moves or deforms slightly, so there is a risk that the depth of the cavity (C) will increase.

[0100] In this manner, when resin molding is performed using a resin molding device (1), the depth of the cavity (C) may change depending on the operation of each part; therefore, by suppressing this change, the dimensional accuracy of the resin molded product can be improved. Below, a method for manufacturing a resin molded product (a control mode of clamp load and plunger load) that enables such improvement in dimensional accuracy will be described.

[0101] In step S10 of FIG. 6, the volume of the chip (2a) on the resin tablet (T) and the substrate (2) is measured. This will be explained in detail below.

[0102] As described above, the volume of the resin tablet (T) is measured in the resin measuring unit (15) of the supply module (10). The resin measuring unit (15) may measure the volume of the resin tablet (T) using any measuring device. As an example of the resin measuring unit (15), a weighing scale that measures the weight of the resin tablet (T) may be used. The volume of the resin tablet (T) is calculated from the weight of the resin tablet (T) measured by the weighing scale and the specific gravity of the resin tablet (T). Furthermore, the method of measuring the volume of the resin tablet (T) is not particularly limited, and it is possible to measure it using various other devices. For example, it is possible to use various types of 3D scanners, laser volume meters using laser light, etc.

[0103] In addition, the volume of the chip (2a) on the substrate (2) is measured in the frame measuring unit (12) of the supply module (10) as described above. The frame measuring unit (12) can measure the volume of the chip (2a) on the substrate (2) using any measuring device. As an example of the frame measuring unit (12), a volume meter that measures the volume of the chip (2a) on the substrate (2) can be cited. The volume meter is a laser volume meter that measures the shape (and thus the volume) of the chip (2a) by detecting the distance to the chip (2a) on the substrate (2) using laser light. Furthermore, the method of measuring the volume of the chip (2a) is not particularly limited, and it is possible to measure it using various other devices. For example, it is possible to use various types of 3D scanners.

[0104] Next, in step S20 of FIG. 6, the position of the plunger (182) at a predetermined resin filling rate of the cavity (C) is calculated. This will be explained in detail below.

[0105] The control unit (18) calculates the capacity of the cavity (C) based on the dimensions of each part (upper side block (142), upper cavity block (143), port block (112), curl block (144), etc.) that are stored in advance and the upper and lower positions of the upper cavity block (143). Additionally, the upper and lower positions of the upper cavity block (143) can be determined based on the driving amount of the upper wedge-shaped member driving unit (167), etc. Based on the calculated capacity of the cavity (C) and the volume of the resin tablet (T) and chip (2a) measured in step (S10), the control unit (18) can calculate what percentage of the capacity of the cavity (C) is filled with molten resin material (resin filling rate) at a certain position to which the plunger (182) has risen.

[0106] In this embodiment, as shown in FIG. 5, the control unit (18) calculates the positions of the plunger (182) at resin filling rates of the cavity (C) of 0%, 25%, 50%, 75%, and 100% (hereinafter referred to as positions P0, P25, P50, P75, and P100, respectively).

[0107] In addition, strictly speaking, when the plunger (182) is in a position lower than position (P0), the resin filling rate of the cavity (C) becomes 0% regardless of the position of the plunger (182), but in this embodiment, the position where the plunger (182) rises and the resin material begins to be supplied into the cavity (C) is defined as the position (P0) where the resin filling rate is 0%.

[0108] Next, in step S30 of FIG. 6, the substrate (2) and the resin tablet (T) are each returned to the molding mold of the resin molding module (20). Specifically, the substrate (2) is mounted on the lower mold (110) while the resin tablet (T) is received within the port of the port block (112).

[0109] Next, in step S40 of FIG. 6, the lower mold (110) and the upper mold (140) are connected by the mold connecting mechanism (190). Specifically, the lower mold (110) is raised by the mold connecting mechanism (190), and the lower mold (110) comes into contact with the upper mold (140) from below. As a result, the cavity (C) is closed. At this time, as shown in FIG. 9(a), the upper mold (140) is raised to a position where the upper mold support (145) comes into contact with the upper mold installation part (130) (heater plate (133)).

[0110] Next, using the graph shown in FIG. 7, an example of the time variation of the clamp load (units are, for example, tonf, N, etc.), plunger position (up and down position of the plunger (182) with the initial position set to 0, units are, for example, mm, etc.), and plunger load (units are, for example, tonf, N, etc.) accompanying the operation of the resin molding device (1) will also be explained.

[0111] In step S40, the lower mold (110) and the upper mold (140) are joined together, and in FIG. 7, the clamp load is raised to CL1 at time t1.

[0112] Next, the rising of the plunger (182) begins at step S50 of FIG. 6 (time t2 of FIG. 7).

[0113] Next, in step S60 of FIG. 6, filling rate corresponding control is executed. Filling rate corresponding control is to control the operation of the resin molding device (1) based on the resin filling rate of the cavity (C).

[0114] An example of control corresponding to the filling rate is shown in FIG. 8. FIG. 8 illustrates an example of controlling the clamp load and the movement speed of the plunger (182) based on the resin filling rate.

[0115] Specifically, when the position of the plunger (182) reaches position P50 (a position where the resin filling rate is 50%) (YES in step S61), the clamp load is increased from CL1 to CL2 (step S62). In FIG. 7, the plunger (182) reaches position P50 at time t3, and the clamp load is increased from CL1 to CL2 over time t3 to time t4.

[0116] Additionally, when the position of the plunger (182) reaches position P50 (a position where the resin filling rate is 50%) (YES in step S61), the movement speed of the plunger (182) is adjusted (step S62). In FIG. 7, the time change of the plunger (182) at time t3 (the slope of the graph of the plunger position) is made gentle. That is, the movement speed of the plunger (182) is adjusted to slow down.

[0117] Next, when the position of the plunger (182) reaches position P100 (a position where the resin filling rate becomes 100%) (YES in step S63), the plunger (182) is stopped (step S64). In FIG. 7, at time t5, the plunger (182) reaches position P100 and the movement (upward movement) of the plunger (182) is stopped.

[0118] Additionally, FIG. 8 illustrates an example in which the clamp load and the movement speed of the plunger (182) are adjusted only once when the resin filling rate reaches 50%, but the number of adjustments is not limited to this, and it is possible to perform multiple adjustments. For example, it is possible to adjust the clamp load, etc. whenever the resin filling rate reaches 25%, 50%, and 75% (where the plunger (182) is at positions P25, P50, and P75). Furthermore, the resin filling rate that serves as the trigger for this adjustment is not limited to the above example and can be set arbitrarily.

[0119] In this way, changes in the depth of the cavity (C) can be suppressed by gradually increasing the clamp load according to the resin filling rate. Specifically, as the resin filling rate increases, the force of the resin material pushing the upper cavity block (143) upward increases, so the depth of the cavity (C) becomes deeper (see FIG. 5(b)). Therefore, as described above, by increasing the clamp load according to the resin filling rate to make the depth of the cavity (C) shallower (see FIG. 5(a)), the tendency of the depth of the cavity (C) to change (increase and decrease in depth) can be offset, thereby suppressing changes in the depth of the cavity (C).

[0120] In addition, by adjusting the movement speed of the plunger (182) according to the resin filling rate, the occurrence of incomplete filling of the resin material can be suppressed. Specifically, since the resin material flowing inside the cavity (C) flows through a relatively easy-to-flow part (e.g., a part where the chip (2a) of the substrate (2) is not installed) and a relatively difficult-to-flow part (e.g., the chip (2a) part of the substrate (2)), it is desirable to adjust the flow speed to ensure good condition around the resin. Therefore, as described above, by adjusting the movement speed of the plunger (182) according to the resin filling rate, improvement around the resin can be achieved.

[0121] In addition, in this embodiment, since the resin filling rate (the position of the plunger (182) corresponding to the resin filling rate) is calculated based on the actual measured values ​​of the volume of the resin tablet (T) and the chip (2a) of the substrate (2), the resin filling rate of the cavity (C) can be determined with high precision regardless of the non-uniformity of the volume of each resin tablet (T). By doing so, the change in the depth of the cavity (C) can be suppressed with higher precision.

[0122] In addition, the value of the appropriate clamp load for the resin filling rate or the appropriate moving speed of the plunger (182) can be determined in advance through experiments or numerical analysis.

[0123] Next, cavity control is performed in step S70 of FIG. 6. Cavity control is to adjust the position of the upper cavity block (143) before the pressure adjustment control described later.

[0124] Specifically, as shown in FIG. 9(a), the lower mold (110) and the upper mold (140) are clamped, and as shown in FIG. 9(b), the clamp load is reduced. At this time, the upper mold cavity block driving unit (162) presses the upper mold cavity block holding member (161) downwards, thereby reducing the clamp load. In FIG. 7, at time t6, the clamp load is reduced from CL2 to CLdown. At this time, there is a concern that the depth of the cavity (C) may increase as the clamp load is reduced, but since the upper mold cavity block driving unit (162) presses the upper mold cavity block holding member (161) downwards, the increase in depth of the cavity (C) can be suppressed.

[0125] When the clamp load is reduced, as shown in FIG. 9(b), the upper mold (140) moves relatively away from the upper mold installation part (130) by means of the disc spring (150), so a small gap (see part A in FIG. 9(b)) is formed between the regulating member (163) and the upper mold cavity block retaining member (161).

[0126] By forming such a gap, the operating range of the upper second wedge-shaped member (166) is secured. That is, the upper second wedge-shaped member (166) can move up and down. In this state, the position of the upper cavity block (143) can be arbitrarily adjusted by driving the upper wedge-shaped member driving unit (167).

[0127] For example, in the example illustrated in FIG. 7, the upper cavity block (143) is lowered slightly. This allows the depth of the cavity (C) to be made slightly shallower, and makes it easier to apply high pressure to the resin material in the cavity (C) during the pressure adjustment control (step S80), the first final adjustment control (step S90), and the second final adjustment control (step S100) described later.

[0128] Next, pressure adjustment control is performed in step S80 of FIG. 6. Pressure adjustment control is to increase the pressure applied to the resin material in the cavity (C) by adjusting the clamp load.

[0129] Specifically, as shown in FIG. 7, the clamp load is increased from CLdown to CLM (pre-set clamp load) (time t7). At this time, the plunger (182) is stationary. Because of this, the resin material filled in the cavity (C) supports the cavity (C) from becoming shallow as the clamp load increases, so the change in the depth of the cavity (C) is suppressed. In addition, the pressure applied to the resin material inside the cavity (C) increases, and the occurrence of incomplete filling of the resin is suppressed, thereby improving the precision of the resin molded product. FIG. 7 shows the plunger load increasing along with the increase in pressure inside the cavity (C).

[0130] Next, in step S90 of FIG. 6, the first final adjustment control is executed. The first final adjustment control is to adjust the clamp load to a preset final clamp load.

[0131] Specifically, as shown in FIG. 7, the clamp load is increased from CLM to CLf (final clamp load) (time t8). At this time, the plunger (182) is stopped. Because of this, the resin material filled in the cavity (C) supports the increase in the clamp load, which causes the cavity (C) to become shallower, and thus the change in the depth of the cavity (C) is suppressed. In addition, the pressure applied to the resin material inside the cavity (C) increases, and the occurrence of incomplete filling of the resin is suppressed, thereby improving the precision of the resin molded product.

[0132] Next, in step S100 of FIG. 6, a second final adjustment control is executed. The second final adjustment control is to adjust the plunger load to a preset final plunger load.

[0133] Specifically, as shown in FIG. 7, the plunger (182) is moved so that the plunger load becomes Trf (time t9). In the example shown in FIG. 7, since the plunger load at the time when the first final adjustment control is completed (time t8) does not reach Trf, the plunger (182) is raised to increase the plunger load to Trf.

[0134] In addition, if the plunger load is greater than Trf at the time when the first final adjustment control is completed (time t8), the plunger (182) is lowered in step S100 to reduce the plunger load to Trf. Also, if the plunger load is Trf at the time when the first final adjustment control is completed (time t8), the plunger (182) is not moved in step S100 and the plunger load is maintained at Trf. In this way, by adjusting the final plunger load to a preset value, the precision of the resin molded product can be improved.

[0135] In addition, moving the plunger (182) as in the second final adjustment control allows for efficient adjustment of the pressure applied to the resin material within the cavity (C), whereas the amount of resin material within the cavity (C) changes, making it easy for the depth of the cavity (C) to change. Therefore, in this embodiment, the clamping force is increased to the final clamping force in advance during the first final adjustment control, and accordingly, the plunger load is increased to a value close to the final plunger load. By doing so, the amount of movement of the plunger (182) during the second final adjustment control can be kept small, thereby suppressing changes in the depth of the cavity (C).

[0136] Next, in step S110 of Fig. 6, while maintaining the clamp load and plunger load, wait until the curing time (hardening time) has elapsed.

[0137] Next, in step S120 of FIG. 6, the plunger (182) is lowered to reduce the plunger load, and at the same time, the lower mold (110) and the upper mold (140) are opened by the mold fastening mechanism (190).

[0138] Next, the substrate (2) that has completed resin molding (resin sealing) in step S130 of FIG. 6 is removed from the molding mold. The removed substrate (2) is returned to the removal module (30).

[0139] As described above, by appropriately controlling the clamp load and plunger load, changes in the depth of the cavity (C) can be suppressed, and the dimensional accuracy of the resin molded product can be improved.

[0140] Other examples of control modes

[0141] Below, other examples of manufacturing methods for resin molded articles (modes of control for clamp load and plunger load) are described.

[0142] The example illustrated in FIG. 10 illustrates another example of a control mode, such as a clamp load, illustrated in FIG. 7. Furthermore, for convenience, the control mode illustrated in FIG. 7 will be referred to as the first control mode, and the control mode illustrated in FIG. 10 will be referred to as the second control mode. The second control mode illustrated in FIG. 10 differs from the first control mode of FIG. 7 mainly in the control content (steps S70 and S80 of FIG. 6) over time t6 to time t7. This difference will be explained below.

[0143] In the first control mode, in the cavity control at step S70 of FIG. 6, the position of the upper cavity block (143) is adjusted so that the depth of the cavity (C) becomes shallow, but in the second control mode, the position of the upper cavity block (143) is adjusted so that the depth of the cavity (C) becomes deep.

[0144] That is, in the second control mode, in step S70, the upper wedge-shaped member drive unit (167) is driven while the clamp load is lowered to CLdown to slightly raise the upper cavity block (143). By doing so, the depth of the cavity (C) becomes slightly deeper.

[0145] Next, pressure adjustment control is performed in step S80 of FIG. 6. Here, as described above, in the second control mode, the depth of the cavity (C) is adjusted to become deeper in step S70. As the depth of the cavity (C) becomes deeper in this way, the capacity of the cavity (C) also changes (increases), so the resin filling rate, which was 100%, decreases and falls below 100%.

[0146] Accordingly, the control unit (18) recalculates the relationship between the resin filling rate of the cavity (C) and the position of the plunger (182) at this point. This calculation method is the same as in step S20.

[0147] Next, the clamp load is increased from CLdown to CLM2 (time t7). At this time, since the resin filling rate is below 100%, the plunger (182) is raised to supply resin material into the cavity (C), and the clamp load (CL) is increased stepwise. That is, similar to the aforementioned filling rate corresponding control (step S60), the clamp load is increased stepwise when the plunger (182) reaches a position corresponding to a predetermined resin filling rate. In addition, it is possible to adjust the movement speed of the plunger (182) at this time. The example shown in FIG. 10 illustrates an example in which the clamp load is increased in two steps, CLM1 and CLM2.

[0148] In this way, in the pressure adjustment control (step S80), just like the aforementioned filling rate corresponding control (step S60), changes in the depth of the cavity (C) can be suppressed by gradually increasing the clamp load according to the resin filling rate. However, it is also possible to configure the pressure adjustment control without performing the aforementioned filling rate corresponding control.

[0149] Additionally, in the aforementioned filling rate corresponding control (step S60), an example was shown in which the clamp load or the movement speed of the plunger (182) is adjusted according to the resin filling rate; however, as another separate example, it is also possible to control the operation of the air vent opening / closing mechanism (170) (see FIG. 2) according to the resin filling rate. For example, when the resin filling rate reaches a predetermined value (when the plunger (182) reaches a position corresponding to the predetermined resin filling rate), the air vent pin (171) may be lowered to close the air vent groove (142a). By doing so, the opening and closing of the air vent groove (142a) can be controlled with high precision according to the resin filling rate.

[0150] In addition, in the above-described filling rate corresponding control (step S60), an example was shown in which each part is controlled based on the position of the plunger (182) corresponding to each resin filling rate (0%, 25%, 50%, 75%, and 100%), but the control method is not limited to this, and it is also possible to perform control based on other positions based on these positions, for example.

[0151] For example, when raising the plunger (182) (when supplying resin material to the cavity (C)), control such as closing the air vent groove (142a) that adjusts the movement speed of the plunger (182) is possible based on the position P0 of the plunger (182) where the resin filling rate is 0%, and the plunger (182) reaches a position below a predetermined distance (e.g., 5 mm, etc.) from position P0.

[0152] In this way, by performing control based on the point where the plunger (182) reaches a position below position P0, control based on the position of the plunger (182) before the resin material is supplied to the cavity (C) can be performed. Accordingly, control of each part can be performed, for example, just before the resin material begins to be supplied to the cavity (C) or at a timing that is simultaneous with the start of supply (a timing that does not depend on the resin filling rate).

[0153] As described above, the resin molding apparatus (1) according to the present embodiment comprises a lower mold (110) for mounting a substrate (2), an upper mold side block (142) (side block), and an upper mold cavity block (143) (cavity block) installed to be vertically movable relative to the upper mold side block (142), an upper mold (140) for forming a cavity (C), a mold fastening mechanism (190) (clamp mechanism) for clamping the lower mold (110) and the upper mold (140), a transfer mechanism (180) for supplying resin material to the cavity (C) by means of a plunger (182), a first final adjustment control (step S90) for adjusting the clamp load by the mold fastening mechanism (190) to become the final clamp load after the cavity (C) is filled by the resin material supplied from the transfer mechanism (180), and after the first final adjustment control is completed, the plunger (182) The apparatus is equipped with a control unit (18) that performs a second final adjustment control (step S100) to adjust the plunger load applied to the plunger (182) by driving it so that the plunger load becomes the final plunger load.

[0154] By configuring it in this way, a resin molded product with high precision can be manufactured. That is, by adjusting the clamp load with the first adjustment control in advance before the second final adjustment control (adjustment of the plunger load by the plunger (182)), the amount of movement of the plunger (182) in the second final adjustment control can be suppressed. By doing so, the change in the depth of the cavity (C) can be suppressed.

[0155] In addition, the control unit (18) increases the clamp load by the mold fastening mechanism (190) in the first final adjustment control.

[0156] By configuring it in this way, the amount of movement of the plunger (182) in the second final adjustment control can be effectively suppressed. This allows for suppression of changes in the depth of the cavity (C).

[0157] Additionally, the control unit (18) performs pressure adjustment control (step S80) to increase the resin pressure within the cavity (C) by adjusting the clamp load by the mold fastening mechanism (190) after the cavity (C) is filled with the resin material and before performing the first final adjustment control.

[0158] By configuring it in this way, the occurrence of resin incomplete filling is suppressed, and the precision of the resin molded product can be improved.

[0159] Additionally, the control unit (18) performs cavity control (step S70) to adjust the relative position of the upper cavity block (143) with respect to the upper side block (142) before performing the pressure adjustment control.

[0160] By configuring it in this way, the depth of the cavity (C) in the pressure adjustment control can be arbitrarily adjusted in advance.

[0161] In addition, the control unit (18) moves the upper mold cavity block (143) relative to the upper mold side block (142) while reducing the clamp load by the mold fastening mechanism (190) in the cavity control.

[0162] By configuring it in this way, the clamp load is reduced, allowing the upper cavity block (143) to be moved easily.

[0163] Additionally, the resin molding device (1) further comprises an upper mold installation part (130) (upper mold support part) that supports the upper mold (140) so that it can be moved up and down, an upper mold cavity adjustment mechanism (160) (position adjustment mechanism) installed on the upper mold installation part (130) and capable of adjusting the position of the upper mold cavity block (143), and a disc spring (150) (applying part) that applies force to the upper mold (140) in a direction that secures the operating area of ​​the upper mold cavity adjustment mechanism (160).

[0164] By configuring it in this way, the operating range of the upper cavity adjustment mechanism (160) (upper second wedge-shaped member (166)) is secured, and the position adjustment of the upper cavity block (143) by the upper cavity adjustment mechanism (160) can be easily performed.

[0165] Additionally, the control unit (18) adjusts the position of the upper cavity block (143) so that the cavity (C) becomes deeper by utilizing the movable area secured by the disc spring (150) in the cavity control, and in the pressure adjustment control, increases the clamp load by the mold fastening mechanism (190) while supplying the resin material to the cavity (C) by the transfer mechanism (180).

[0166] By configuring it in this way, the resin material is supplied again to the cavity (C) that has been filled with the resin material, thereby suppressing the occurrence of incomplete filling of the resin and improving the precision of the resin molded product.

[0167] Additionally, the transfer mechanism (180) is equipped with a transfer drive unit (181) (drive source) that drives the plunger (182), and moves the plunger (182) with a movement amount proportional to the output of the transfer drive unit (181).

[0168] By configuring it in this way, the clamp load or plunger load can be adjusted with greater precision. That is, since the plunger (182) can be moved to completely follow the output of the transfer drive unit (181) without interposing an elastic member or the like between the transfer drive unit (181) and the plunger (182), the control of each part based on the position of the plunger (182) (and furthermore, the resin filling rate) can be performed with greater precision. In addition, the adjustment of the plunger load by the plunger (182) can also be performed with greater precision.

[0169] In addition, the method for manufacturing a resin molded article according to the present embodiment is to manufacture a resin molded article using the resin molding device (1).

[0170] By configuring it in this way, a resin molded product with high precision can be manufactured.

[0171] In addition, the method for manufacturing a resin molded product according to the present embodiment comprises: a clamping process (step S40) in which an upper mold (140) is clamped by a mold fastening mechanism (190) to form a cavity (C) by means of a lower mold (110) that mounts a substrate (2), an upper mold side block (142), and an upper mold cavity block (143) installed to be vertically movable relative to the upper mold side block (142); a resin material supply process (step S50, step S60) in which a resin material is supplied to the cavity (C) by means of a plunger (182); a first final adjustment process (step S90) in which the clamp load by the mold fastening mechanism (190) is adjusted to become the final clamp load after the cavity (C) is filled with the resin material; and a plunger load applied to the plunger (182) in such a way that the clamp load by the mold fastening mechanism (190) becomes the final clamp load after the clamp load by the mold fastening mechanism (190) becomes the final clamp load. It includes a second final adjustment process (step S100) that drives the plunger (182).

[0172] By configuring it in this way, a resin molded product with high precision can be manufactured. That is, by adjusting the clamp load with the first adjustment control in advance before the second final adjustment control (adjustment of the plunger load by the plunger (182)), the amount of movement of the plunger (182) in the second final adjustment control can be suppressed. By doing so, the change in the depth of the cavity (C) can be suppressed.

[0173] In addition, as described above, the resin molding apparatus (1) according to the present embodiment comprises: a lower mold (110) for mounting a substrate (2), an upper mold side block (142) (side block), and an upper mold cavity block (143) (cavity block) installed to be vertically movable with respect to the upper mold side block (142) to form a cavity (C), a mold fastening mechanism (190) (clamp mechanism) for clamping the lower mold (110) and the upper mold (140), a transfer mechanism (180) for supplying a resin material to the cavity (C) by means of a plunger (182), and a relationship between the resin filling rate of the cavity (C) calculated based on the volume of a chip (2a) placed on the substrate (2) and the volume of the resin material (resin tablet (T)) and the position of the plunger (182) so that the plunger (182) reaches a position corresponding to a predetermined resin filling rate. Based on this, a control unit (18) is provided to perform a filling rate corresponding control (step S60, step S80 of the second control mode) that controls the operation regarding resin molding.

[0174] By configuring it in this way, a resin molded product with high precision can be manufactured. That is, since the resin filling rate can be determined with high precision based on the volume of the resin tablet (T) and the chip (2a) of the substrate (2) actually used, control of each part based on this resin filling rate can be performed. By doing so, the precision of the resin molded product can be improved.

[0175] In addition, the control unit (18) performs clamp force adjustment control (step S60) to adjust the clamp load by the mold fastening mechanism (190) when the plunger (182) reaches a position corresponding to a predetermined resin filling rate in the filling rate corresponding control.

[0176] By configuring it in this way, the precision of the resin molded product can be improved by adjusting the clamp load to suppress changes in the depth of the cavity (C) according to the resin filling rate.

[0177] In addition, the control unit (18) increases the clamp load by the clamping mechanism (190) in stages during the clamp force adjustment control.

[0178] By configuring it in this way, the tendency for the depth of the cavity (C) to deepen along with the increase in resin filling rate can be suppressed by increasing the clamp load.

[0179] In addition, the control unit (18) performs plunger speed adjustment control (step S60) to adjust the movement speed of the plunger (182) when the plunger (182) reaches a position corresponding to a predetermined resin filling rate in the charge rate corresponding control.

[0180] By configuring it in this way, the flow rate of the resin material can be adjusted according to the resin filling rate, and furthermore, the precision of the resin molded product can be improved.

[0181] In addition, the control unit (18) performs an air vent switching control (step S60) in which the opening and closing of the air vent groove (142a) connected to the cavity (C) is switched when the plunger (182) reaches a position corresponding to a predetermined resin filling rate in the filling rate corresponding control.

[0182] By configuring it in this way, the flow of the resin material can be precisely controlled by opening and closing the air vent groove (142a) according to the resin filling rate, and furthermore, the precision of the resin molded product can be improved.

[0183] Additionally, the resin molding device (1) further comprises a frame measuring unit (12) (chip volume measuring unit) for measuring the volume of a chip (2a) placed on the substrate (2), a resin measuring unit (15) (resin volume measuring unit) for measuring the volume of the resin material (resin tablet (T)), and a calculation unit (control unit (18)) for calculating the relationship between the resin filling rate and the position of the plunger (182) based on the measurement results of the frame measuring unit (12) and the resin measuring unit (15).

[0184] By configuring it in this way, the position of the plunger (182) (resin filling rate) can be determined based on the volume of the chip (2a) and the resin material actually measured, so high-precision control can be performed even if, for example, the volume of the resin material (resin tablet (T)) or the chip (2a) is non-uniform.

[0185] Additionally, the resin molding device (1) further comprises an upper mold installation part (130) (upper mold support part) that supports the upper mold (140) so that it can move freely up and down, an upper mold cavity adjustment mechanism (160) (position adjustment mechanism) installed on the upper mold installation part (130) to adjust the position of the upper mold cavity block (143), and a disc spring (150) (applying part) that applies force to the upper mold (140) in a direction that secures the operating area of ​​the upper mold cavity adjustment mechanism (160), and the control part (18) performs cavity control that adjusts the relative position of the upper mold cavity block (143) with respect to the upper mold side block (142) so that the cavity (C) becomes deeper using the operating area secured by the disc spring (150) after the cavity (C) is filled with the resin material, and the mold fastening after the cavity control. Pressure adjustment control is performed to increase the resin pressure in the cavity (C) by adjusting the clamp load by the mechanism (190), and the filling rate corresponding control is performed in the pressure adjustment control.

[0186] By configuring it in this way, control of each part based on the resin filling rate can be performed even in pressure adjustment control, thereby enabling improvement in the precision of the resin molded product.

[0187] In addition, the method for manufacturing a resin molded article according to the present embodiment is to manufacture a resin molded article using the resin molding device (1).

[0188] By configuring it in this way, a resin molded product with high precision can be manufactured.

[0189] In addition, the method for manufacturing a resin molded article according to the present embodiment comprises a chip volume measurement process (step S10) for measuring the volume of a chip (2a) placed on a substrate (2), a resin volume measurement process (step S10) for measuring the volume of a resin material, a plunger position calculation process (step S20) for calculating the relationship between the resin filling rate of the cavity (C) and the position of the plunger (182) based on the measured volume of the chip (2a) and the volume of the resin material, and a filling rate corresponding control process (step S60, step S80 in the second control mode) for controlling an operation regarding resin molding based on the fact that the plunger (182) has reached a position corresponding to a predetermined resin filling rate.

[0190] By configuring it in this way, a resin molded product with high precision can be manufactured. That is, since the resin filling rate can be determined with high precision based on the volume of the resin tablet (T) and the chip (2a) of the substrate (2) actually used, control of each part based on this resin filling rate can be performed. By doing so, the precision of the resin molded product can be improved.

[0191] Although embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and appropriate modifications are possible within the scope of the technical concept of the invention as described in the claims.

[0192] For example, the components (supply module (10), etc.) used in the resin molding device (1) of the above embodiment are examples and can be appropriately attached, detached, or replaced. For example, the number of resin molding modules (20) can be changed. In addition, the configuration or operation of the components (supply module (10), etc.) used in the resin molding device (1) of the present embodiment are examples and can be appropriately changed.

[0193] In addition, although the above embodiment shows an example of using a tablet-shaped resin material (resin tablet (T)), the present invention is not limited thereto. That is, as for the resin material, not only tablet-shaped materials but also any form such as granular, powder, or liquid materials can be used.

[0194] In addition, although the above embodiment shows an example in which the curl portion (144a) and the runner portion (144b) are formed in the curl block (144), for example, a part of the curl portion (144a) and the runner portion (144b) may be formed in the port block (112). Also, although the above embodiment shows an example in which a plurality of through holes (ports) are installed in the port block (112), there may be only one through hole.

[0195] Furthermore, the control mode exemplified in the above embodiment is merely an example, and detailed control contents (e.g., target values ​​for clamp load or plunger load, control timing, etc.) can be changed at will. For example, the above embodiment illustrates an example in which the second final adjustment control (step S100) is executed after the first final adjustment control (step S90) is completed, but it is also possible to initiate the second final adjustment control before the first final adjustment control is completed.

[0196] In addition, in the above embodiment, a disc spring (150) is exemplified as a force-applying part for the upper mold (140), but the present invention is not limited thereto, and various other configurations may be adopted. For example, it is possible to use an actuator such as various elastic members or an air cylinder as the force-applying part.

[0197] In addition, the above embodiment illustrates an example in which the volume of a chip (2a), etc., of a substrate (2) is measured in the frame measuring unit (12) and resin measuring unit (15) provided by the resin molding device (1), but the present invention is not limited thereto. For example, the resin molding device (1) may perform resin molding using a substrate (2) or a resin tablet (T) whose volume has been measured externally. In this case, the resin molding device (1) does not need to be provided with the frame measuring unit (12) or the resin measuring unit (15).

[0198] In addition, in the above embodiment, clamp force adjustment control for adjusting the clamp load, plunger speed adjustment control for adjusting the movement speed of the plunger (182), and air vent switching control for switching the opening and closing of the air vent groove (142a) were exemplified as examples of fill rate corresponding control, but the present invention is not limited thereto and it is possible to control any operation related to resin molding. Explanation of the symbols

[0199] 1 Resin molding device 12-frame measuring section 15 Resin measuring section 18 Control unit 110 Lower type 130 Figurative installation part 140 pictographs 142 Pictographic Side Block 143 Figurative cavity block 150 dish springs 160 Upper cavity adjustment mechanism 170 Air vent opening and closing mechanism 180 transfer mechanism 181 Transfer Drive 182 plunger Type 190 fastening mechanism

Claims

Claim 1 A resin molding apparatus comprising: a chip volume measuring unit for measuring the volume of a chip placed on a substrate to be subjected to resin molding; a resin volume measuring unit for measuring the volume of a resin material used for resin molding of the substrate; a lower mold for mounting the substrate; a side block; an upper mold for forming a cavity by means of a cavity block installed to be vertically movable relative to the side block; a clamping mechanism for clamping the lower mold and the upper mold; a transfer mechanism for supplying a resin material to the cavity by means of a plunger; a calculation unit for calculating the relationship between the resin filling rate of the cavity and the position of the plunger based on the measurement results of the chip volume measuring unit and the resin volume measuring unit; and a control unit for performing filling rate corresponding control, which controls the operation regarding resin molding by using the relationship between the resin filling rate of the cavity calculated by the calculation unit and the position of the plunger, and when resin molding is performed using the substrate and the resin material, the plunger reaches a position corresponding to a predetermined resin filling rate. Claim 2 A resin molding device according to claim 1, wherein the control unit performs clamp force adjustment control to adjust the clamp load by the clamp mechanism when the plunger reaches a position corresponding to a predetermined resin filling rate in the filling rate corresponding control. Claim 3 In claim 2, the control unit is a resin molding device that gradually increases the clamp load by the clamp mechanism in the clamp force adjustment control. Claim 4 A resin molding apparatus according to claim 1, wherein the control unit performs plunger speed adjustment control to adjust the movement speed of the plunger when the plunger reaches a position corresponding to a predetermined resin filling rate in the filling rate corresponding control. Claim 5 A resin molding apparatus according to claim 1, wherein the control unit performs air vent switching control in the filling rate corresponding control, wherein the control unit performs the opening and closing switching of an air vent groove connected to the cavity when the plunger reaches a position corresponding to a predetermined resin filling rate. Claim 6 A resin molding apparatus according to claim 1, further comprising: a mold support member that supports the mold so as to be movable up and down; a position adjustment mechanism installed on the mold support member and capable of adjusting the position of the cavity block; and an application member that applies force to the mold in a direction that secures the operating area of ​​the position adjustment mechanism; wherein the control member performs cavity control by adjusting the relative position of the cavity block with respect to the side block so that the cavity becomes deeper using the operating area secured by the application member after the cavity is filled with the resin material; and pressure adjustment control by adjusting the clamp load by the clamp mechanism after the cavity control to increase the resin pressure within the cavity, and wherein the filling rate corresponding control is performed in the pressure adjustment control. Claim 7 A method for manufacturing a resin molded article using a resin molding apparatus described in any one of claims 1 to 6. Claim 8 A method for manufacturing a resin molded article comprising: a chip volume measuring process for measuring the volume of a chip placed on a substrate; a resin volume measuring process for measuring the volume of a resin material; a plunger position calculating process for calculating the relationship between the resin filling rate of a cavity and the position of a plunger based on the measured volume of the chip and the volume of the resin material; and a filling rate corresponding control process for controlling an operation related to resin molding based on the fact that the plunger has reached a position corresponding to a predetermined resin filling rate. Claim 9 delete

Images