Antenna and electronic device including the same

Abstract

According to various embodiments, the electronic device may comprise a housing and an antenna structure disposed in the internal space of the housing, the antenna structure comprising a first substrate surface and a second substrate surface facing in a direction opposite to the first substrate surface, a substrate having a first dielectric constant, a first plurality of antenna elements disposed at a specified interval on the substrate, and a first plurality of dielectrics disposed on the first surface and having a second dielectric constant, and a first wireless communication circuit disposed in the internal space and configured to transmit or receive a wireless signal in at least one first frequency band through the first plurality of antenna elements. Various other embodiments may be possible.

Description

Technology Field

[0001] Various embodiments of the present disclosure relate to an antenna and an electronic device comprising the same. Background Technology

[0003] With the advancement of wireless communication technology, electronic devices (e.g., communication electronic devices) are being widely used in daily life, and the use of content is on the rise. Due to this rapid increase in content usage, network capacity is gradually reaching its limits. Since the commercialization of 4G (4th generation) communication systems, communication systems that transmit and / or receive signals using high-frequency (e.g., mmWave) bands (e.g., 3 GHz to 300 GHz band) (e.g., 5G (5th generation), pre-5G communication systems, or new radio (NR)) are being researched to meet the increasing demand for wireless data traffic. The problem to be solved

[0005] Recent wireless communication technologies can effectively transmit or receive wireless signals using the mmWave band (e.g., a frequency band in the range of approximately 3 GHz to 100 GHz). Efficient mounting structures and corresponding new antenna structures (e.g., antenna modules) are being developed to overcome high free-space loss due to frequency characteristics and to increase antenna gain. An antenna structure may include an array antenna in which various numbers of antenna elements (e.g., conductive patches and / or conductive patterns) are arranged at regular intervals. These antenna elements may be positioned so that a beam pattern is formed in any one direction within the electronic device. For example, the antenna structure may be positioned so that a beam pattern is formed in the internal space of the electronic device toward the front, at least a portion excluding the display, the rear, and / or the side.

[0006] An antenna structure may include a wiring circuit (e.g., a logic section containing a wireless communication circuit) and at least one antenna element connected to the wiring circuit on a single substrate. For example, to reduce the size of the antenna structure in substantially the same frequency band, a method of laminating insulating layers having different dielectric constants onto a single substrate may be used. However, this method has limitations in that the materials capable of forming a multilayer substrate are limited, and it may be difficult to bond materials having partially different dielectric constants onto a single substrate.

[0007] In addition, a method may be used in which a substrate having a wiring structure is separated and combined with a dielectric material containing at least one antenna element. In this method, the overall rigidity of the antenna structure may be reduced because a plurality of dielectric materials containing a plurality of antenna elements are spaced apart on the substrate at specified intervals.

[0008] In addition, a method may be used in which a dielectric material comprising a plurality of antenna elements spaced apart at specified intervals is disposed on a substrate having a wiring structure. In this method, when a substrate and a dielectric material with different physical properties are bonded, warping may occur, which may increase the difficulty of manufacturing.

[0009] Various embodiments of the present disclosure may provide an antenna with reinforced rigidity and an electronic device including the same.

[0010] According to various embodiments, an antenna and an electronic device including the same can be provided, which can help to slim down an electronic device by reducing its size relatively within the same frequency band.

[0011] According to various embodiments, an antenna and an electronic device including the same can be provided, which can help in an efficient antenna placement structure by including at least two array antennas operating in various frequency bands on a single substrate.

[0012] However, the problems intended to be solved in this disclosure are not limited to those mentioned above, and may be expanded in various ways without departing from the spirit and scope of this disclosure. means of solving the problem

[0014] According to various embodiments, the electronic device may include a housing and an antenna structure disposed in the internal space of the housing, comprising a first substrate surface and a second substrate surface facing in a direction opposite to the first substrate surface, a substrate having a first dielectric constant, a first plurality of antenna elements disposed at a specified interval on the substrate and a first plurality of dielectrics disposed on the first surface and having a second dielectric constant, and a first wireless communication circuit disposed in the internal space and configured to transmit or receive a wireless signal in at least one first frequency band through the first plurality of antenna elements. Effects of the invention

[0016] A substrate comprising at least one antenna element according to exemplary embodiments of the present disclosure, and at least one dielectric having a permittivity different from that of the substrate disposed on the substrate at a position corresponding to the at least one antenna element, can help to slim down and reinforce the rigidity of the antenna structure.

[0017] In addition, various effects that can be identified directly or indirectly through this document may be provided. Brief explanation of the drawing

[0019] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components. FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure. FIG. 2 is a block diagram of an electronic device for supporting legacy network communication and 5G network communication according to various embodiments of the present disclosure. FIG. 3a is a perspective view of a mobile electronic device according to various embodiments of the present disclosure. FIG. 3b is a rear perspective view of a mobile electronic device according to various embodiments of the present disclosure. FIG. 3c is an exploded perspective view of a mobile electronic device according to various embodiments of the present disclosure. FIG. 4a illustrates an embodiment of the structure of a third antenna module described with reference to FIG. 2 according to various embodiments of the present disclosure. FIG. 4b illustrates a cross-section along line Y-Y' of the third antenna module shown in FIG. 4a (a) according to various embodiments of the present disclosure. FIG. 5a is an exploded perspective view of an antenna structure according to various embodiments of the present disclosure. FIG. 5b is a combined perspective view of an antenna structure according to various embodiments of the present disclosure. FIG. 5c is a perspective view looking at the rear side of a first genome according to various embodiments of the present disclosure. FIG. 6a is a partial cross-sectional view of an antenna structure viewed along line 6a-6a of FIG. 5b according to various embodiments of the present disclosure. FIG. 6b is a partial cross-sectional view of an antenna structure according to various embodiments of the present disclosure. FIG. 7a is a graph comparing the radiation characteristics of the antenna structure of FIG. 5a according to various embodiments of the present disclosure with the radiation characteristics of a conventional antenna structure. FIG. 7b is a graph illustrating the frequency change state according to the change in dielectric constant of the antenna structure of FIG. 5a according to various embodiments of the present disclosure. FIGS. 8a and FIGS. 8b are partial cross-sectional views of an antenna structure according to various embodiments of the present disclosure. FIG. 9a is a perspective view of an antenna structure according to various embodiments of the present disclosure. FIG. 9b is a cross-sectional view of an antenna structure viewed along line 9b-9b of FIG. 9a according to various embodiments of the present disclosure. FIGS. 10a to 10c are cross-sectional views of antenna structures according to various embodiments of the present disclosure. FIG. 11a is a plan view of an antenna structure according to various embodiments of the present disclosure. FIG. 11b is a cross-sectional view of an antenna structure viewed along line 11b-11b of FIG. 11a according to various embodiments of the present disclosure. FIG. 12a is a plan view of an antenna structure according to various embodiments of the present disclosure. FIG. 12b is a cross-sectional view of an antenna structure viewed along line 12b-12b of FIG. 12a according to various embodiments of the present disclosure. FIG. 13a is a cross-sectional view illustrating an antenna structure according to various embodiments of the present disclosure supported by a support member. FIG. 13b is a partial perspective view of the support member of FIG. 13a according to various embodiments of the present disclosure. FIG. 14a is a cross-sectional view illustrating an antenna structure according to various embodiments of the present disclosure supported by a support member. FIG. 14b is a partial perspective view of the support member of FIG. 14a according to various embodiments of the present disclosure. Specific details for implementing the invention

[0020] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments.

[0021] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0022] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0023] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0024] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0025] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0026] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0027] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0028] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0029] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0030] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0031] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0032] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0033] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0034] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0035] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0036] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0037] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0038] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0039] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0040] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0041] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0042] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0044] FIG. 2 is a block diagram (200) of an electronic device (101) for supporting legacy network communication and 5G network communication according to various embodiments.

[0045] Referring to FIG. 2, the electronic device (101) may include a first communication processor (212), a second communication processor (214), a first radio frequency integrated circuit (RFIC) (222), a second RFIC (224), a third RFIC (226), a fourth RFIC (228), a first radio frequency front end (RFFE) (232), a second RFFE (234), a first antenna module (242), a second antenna module (244), and an antenna (248). The electronic device (101) may further include a processor (120) and a memory (130). The network (199) may include a first network (292) and a second network (294). According to another embodiment, the electronic device (101) may further include at least one of the components described in FIG. 1, and the network (199) may further include at least one other network. According to one embodiment, a first communication processor (212), a second communication processor (214), a first RFIC (222), a second RFIC (224), a fourth RFIC (228), a first RFFE (232), and a second RFFE (234) may form at least a part of a wireless communication module (192). According to another embodiment, the fourth RFIC (228) may be omitted or included as part of a third RFIC (226).

[0046] The first communication processor (212) can establish a communication channel in a band to be used for wireless communication with the first network (292), and support legacy network communication through the established communication channel. According to various embodiments, the first network may be a legacy network including a second generation (2G), 3G, 4G, or long term evolution (LTE) network. The second communication processor (214) can establish a communication channel corresponding to a designated band (e.g., about 6 GHz to about 60 GHz) among the bands to be used for wireless communication with the second network (294), and support 5G network communication through the established communication channel. According to various embodiments, the second network (294) may be a 5G network as defined by 3GPP. Additionally, according to one embodiment, the first communication processor (212) or the second communication processor (214) may support the establishment of a communication channel corresponding to another designated band (e.g., about 6 GHz or less) among the bands to be used for wireless communication with the second network (294), and 5G network communication through the established communication channel. According to one embodiment, the first communication processor (212) and the second communication processor (214) may be implemented within a single chip or a single package. According to various embodiments, the first communication processor (212) or the second communication processor (214) may be formed within a single chip or a single package with the processor (120), the auxiliary processor (123), or the communication module (190).

[0047] The first RFIC (222) can convert a baseband signal generated by the first communication processor (212) during transmission into a radio frequency (RF) signal of about 700 MHz to about 3 GHz used in the first network (292) (e.g., legacy network). During reception, the RF signal is acquired from the first network (292) (e.g., legacy network) through an antenna (e.g., first antenna module (242)) and can be preprocessed through an RFFE (e.g., first RFFE (232)). The first RFIC (222) can convert the preprocessed RF signal into a baseband signal so that it can be processed by the first communication processor (212).

[0048] The second RFIC (224) can convert a baseband signal generated by the first communication processor (212) or the second communication processor (214) into an RF signal of the Sub6 band (e.g., about 6 GHz or less) used in the second network (294) (e.g., 5G network) (hereinafter, 5G Sub6 RF signal). When receiving, the 5G Sub6 RF signal is acquired from the second network (294) (e.g., 5G network) through an antenna (e.g., the second antenna module (244)) and can be preprocessed through an RFFE (e.g., the second RFFE (234)). The second RFIC (224) can convert the preprocessed 5G Sub6 RF signal into a baseband signal so that it can be processed by the corresponding communication processor among the first communication processor (212) or the second communication processor (214).

[0049] The third RFIC (226) can convert a baseband signal generated by the second communication processor (214) into an RF signal of the 5G Above6 band (e.g., approximately 6 GHz to approximately 60 GHz) to be used in the second network (294) (e.g., 5G network) (hereinafter, 5G Above6 RF signal). Upon reception, the 5G Above6 RF signal may be acquired from the second network (294) (e.g., 5G network) through an antenna (e.g., antenna (248)) and preprocessed through the third RFFE (236). The third RFIC (226) can convert the preprocessed 5G Above6 RF signal into a baseband signal so that it can be processed by the second communication processor (214). According to one embodiment, the third RFFE (236) may be formed as part of the third RFIC (226).

[0050] According to one embodiment, the electronic device (101) may include a fourth RFIC (228) separately from or at least as part of the third RFIC (226). In this case, the fourth RFIC (228) may convert a baseband signal generated by the second communication processor (214) into an RF signal (hereinafter referred to as an IF signal) in an intermediate frequency band (e.g., about 9 GHz to about 11 GHz) and then transmit the IF signal to the third RFIC (226). The third RFIC (226) may convert the IF signal into a 5G Above6 RF signal. Upon reception, the 5G Above6 RF signal may be received from the second network (294) (e.g., a 5G network) through an antenna (e.g., antenna (248)) and converted into an IF signal by the third RFIC (226). The fourth RFIC (228) can convert the IF signal into a baseband signal so that the second communication processor (214) can process it.

[0051] According to one embodiment, the first RFIC (222) and the second RFIC (224) may be implemented as at least part of a single chip or a single package. According to one embodiment, the first RFFE (232) and the second RFFE (234) may be implemented as at least part of a single chip or a single package. According to one embodiment, at least one of the first antenna module (242) or the second antenna module (244) may be omitted or combined with another antenna module to process RF signals of a plurality of corresponding bands.

[0052] According to one embodiment, the third RFIC (226) and the antenna (248) may be placed on the same substrate to form a third antenna module (246). For example, a wireless communication module (192) or a processor (120) may be placed on a first substrate (e.g., a main PCB). In this case, the third RFIC (226) may be placed on a portion of a second substrate (e.g., a sub PCB) separate from the first substrate (e.g., a bottom surface), and the antenna (248) may be placed on another portion of a second substrate (e.g., a sub PCB) to form a third antenna module (246). By placing the third RFIC (226) and the antenna (248) on the same substrate, it is possible to reduce the length of the transmission line between them. This can reduce the loss (e.g., attenuation) of signals in the high-frequency band (e.g., about 6 GHz to about 60 GHz) used for 5G network communication by the transmission line. As a result, the electronic device (101) can improve the quality or speed of communication with the second network (294) (e.g., 5G network).

[0053] According to one embodiment, the antenna (248) may be formed as an antenna array comprising a plurality of antenna elements that can be used for beamforming. In this case, the third RFIC (226) may include a plurality of phase shifters (238) corresponding to the plurality of antenna elements, for example, as part of the third RFFE (236). During transmission, each of the plurality of phase shifters (238) can change the phase of a 5G Above6 RF signal to be transmitted to the outside of the electronic device (101) (e.g., a base station of a 5G network) through the corresponding antenna element. During reception, each of the plurality of phase shifters (238) can change the phase of a 5G Above6 RF signal received from the outside through the corresponding antenna element to the same or substantially the same phase. This enables transmission or reception through beamforming between the electronic device (101) and the outside.

[0054] The second network (294) (e.g., 5G network) may be operated independently of the first network (292) (e.g., legacy network) (e.g., Stand-Alone (SA)) or connected to it (e.g., Non-Stand Alone (NSA)). For example, the 5G network may only have an access network (e.g., 5G radio access network (RAN) or next generation RAN (NG RAN)) and no core network (e.g., next generation core (NGC)). In this case, the electronic device (101) can access the access network of the 5G network and then access an external network (e.g., the Internet) under the control of the core network of the legacy network (e.g., evolved packed core (EPC)). Protocol information for communication with a legacy network (e.g., LTE protocol information) or protocol information for communication with a 5G network (e.g., New Radio (NR) protocol information) is stored in memory (230) and can be accessed by other parts (e.g., processor (120), first communication processor (212), or second communication processor (214)).

[0056] FIG. 3a is a front perspective view of an electronic device (300) according to various embodiments of the present invention. FIG. 3b is a rear perspective view of the electronic device (300) of FIG. 3a according to various embodiments of the present invention.

[0057] The electronic device (300) of FIGS. 3a and FIGS. 3b may be at least partially similar to the electronic device (101) of FIG. 1, or may include other embodiments of the electronic device.

[0058] Referring to FIGS. 3a and 3b, an electronic device (300) according to one embodiment may include a housing (310) comprising a first surface (or front) (310A), a second surface (or rear) (310B), and a side (310C) surrounding the space between the first surface (310A) and the second surface (310B). In other embodiments (not shown), the housing (310) may refer to a structure forming some of the first surface (310A), the second surface (310B), and the side (310C) of FIG. 1. According to one embodiment, the first surface (310A) may be formed by a front plate (302) (e.g., a glass plate or a polymer plate including various coating layers) in which at least a portion is substantially transparent. The second surface (310B) may be formed by a rear plate (311) that is substantially opaque. The rear plate (311) may be formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side (310C) may be formed by a side bezel structure (or "side member") (320) comprising metal and / or polymer, which is combined with the front plate (302) and the rear plate (311). In some embodiments, the rear plate (311) and the side bezel structure (320) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum).

[0059] In the illustrated embodiment, the front plate (302) may include a first region (310D) that curves seamlessly from the first surface (310A) toward the rear plate (311) at both ends of the long edge of the front plate (302). In the illustrated embodiment (see FIG. 3b), the rear plate (311) may include a second region (310E) that curves seamlessly from the second surface (310B) toward the front plate (302) at both ends of the long edge. In some embodiments, the front plate (302) or the rear plate (311) may include only one of the first region (310D) or the second region (310E). In some embodiments, the front plate (302) may not include the first region (310D) and the second region (310E), and may only include a flat plane arranged parallel to the second surface (310B). In the embodiments, when viewed from the side of the electronic device (300), the side bezel structure (320) may have a first thickness (or width) on the side that does not include the first region (310D) or the second region (310E), and a second thickness that is thinner than the first thickness on the side that includes the first region or the second region.

[0060] According to one embodiment, the electronic device (300) may include at least one of a display (301), an input device (303), an audio output device (307, 314), a sensor module (304, 319), a camera module (305, 312, 313), a key input device (317), an indicator (not shown), and a connector (308, 309). In some embodiments, the electronic device (300) may omit at least one of the components (e.g., a key input device (317), or an indicator) or additionally include other components.

[0061] The display (301) may be exposed, for example, through a substantial portion of the front plate (302). In some embodiments, at least a portion of the display (301) may be exposed through the front plate (302) forming the first surface (310A) and the first area (310D) of the side (310C). The display (301) may be combined with or placed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer that detects a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor module (304, 319) and / or at least a portion of the key input device (317) may be placed in the first area (310D) and / or the second area (310E).

[0062] The input device (303) may include a microphone (303). In some embodiments, the input device (303) may include a plurality of microphones (303) arranged to detect the direction of sound. The sound output device (307, 314) may include speakers (307, 314). The speakers (307, 314) may include an external speaker (307) and a call receiver (314). In some embodiments, the microphone (303), speakers (307, 314), and connectors (308, 309) are placed in the space of the electronic device (300) and may be exposed to the external environment through at least one hole formed in the housing (310). In some embodiments, the hole formed in the housing (310) may be used in common for the microphone (303) and the speakers (307, 314). In some embodiments, the acoustic output device (307, 314) may include a speaker (e.g., a piezo speaker) that is operated with the hole formed in the housing (310) excluded.

[0063] The sensor module (304, 319) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (300) or an external environmental state. The sensor module (304, 319) may include, for example, a first sensor module (304) (e.g., proximity sensor) and / or a second sensor module (not shown) (e.g., fingerprint sensor) disposed on a first surface (310A) of the housing (310), and / or a third sensor module (319) (e.g., HRM sensor) disposed on a second surface (310B) of the housing (310). The fingerprint sensor may be disposed on the first surface (310A) of the housing (310). The fingerprint sensor (e.g., ultrasonic or optical fingerprint sensor) may be disposed below the display (301) on the first surface (310A). The electronic device (300) may further include at least one of an unillustrated sensor module, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor (304).

[0064] The camera modules (305, 312, 313) may include a first camera device (305) disposed on a first surface (310A) of the electronic device (300), a second camera device (312) disposed on a second surface (310B), and / or a flash (313). The camera modules (305, 312) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (313) may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device (300).

[0065] A key input device (317) may be placed on the side (310C) of the housing (310). In another embodiment, the electronic device (300) may not include some or all of the aforementioned key input devices (317), and the key input device (317) that is not included may be implemented in other forms, such as soft keys, on the display (301). In another embodiment, the key input device (317) may be implemented using a pressure sensor included in the display (301).

[0066] The indicator may be placed, for example, on the first surface (310A) of the housing (310). The indicator may, for example, provide status information of the electronic device (300) in the form of light. In another embodiment, the light-emitting element may, for example, provide a light source that is coupled with the operation of the camera module (305). The indicator may include, for example, an LED, an IR LED, and a xenon lamp.

[0067] The connector holes (308, 309) may include a first connector hole (308) capable of accommodating a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device, and a second connector hole (or earphone jack) (309) capable of accommodating a connector for transmitting and receiving audio signals with an external electronic device.

[0068] Some of the camera modules (305, 312), some of the sensor modules (304, 319), or indicators may be positioned to be exposed through the display (101). For example, the camera module (305), sensor module (304), or indicator may be positioned in the internal space of the electronic device (300) to come into contact with the external environment through an opening perforated to the front plate (302) of the display (301). In another embodiment, some of the sensor modules (304) may be positioned to perform their function without being visually exposed through the front plate (302) in the internal space of the electronic device. For example, in this case, the perforated opening may not be necessary for the area of ​​the display (301) facing the sensor modules.

[0070] FIG. 3c is an exploded perspective view of the electronic device (300) of FIG. 3a according to various embodiments of the present invention.

[0071] Referring to FIG. 3c, the electronic device (300) may include a side member (320) (e.g., a side bezel structure), a first support member (3211) (e.g., a bracket), a front plate (302), a display (301), a printed circuit board (340), a battery (350), a second support member (360) (e.g., a rear case), an antenna (370), and a rear plate (311). In some embodiments, the electronic device (300) may omit at least one of the components (e.g., the first support member (3111), or the second support member (360)) or additionally include other components. At least one of the components of the electronic device (300) may be identical or similar to at least one of the components of the electronic device (300) of FIG. 3a or FIG. 3b, and redundant descriptions are omitted below.

[0072] The first support member (3211) may be disposed inside the electronic device (300) and connected to the side member (320), or may be formed integrally with the side member (320). The first support member (3211) may be formed, for example, from a metal material and / or a non-metal (e.g., polymer) material. The first support member (3211) may have a display (301) attached to one side and a printed circuit board (340) attached to the other side. The printed circuit board (340) may be equipped with a processor, memory, and / or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0073] Memory may include, for example, volatile memory or non-volatile memory.

[0074] The interface may include, for example, an HDMI (high definition multimedia interface), a USB (universal serial bus) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (300) to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0075] The battery (350) is a device for supplying power to at least one component of the electronic device (300) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially coplanar with, for example, the printed circuit board (340). The battery (350) may be disposed integrally inside the electronic device (300) or may be disposed detachably from the electronic device (300).

[0076] An antenna (370) may be positioned between the rear plate (311) and the battery (350). The antenna (370) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (370) may, for example, communicate near-field with an external device or wirelessly transmit and receive power required for charging. In other embodiments, the antenna structure may be formed by a part or combination thereof of the side member (320) and / or the first support member (3211).

[0078] FIG. 4a illustrates an embodiment of the structure of a third antenna module (246) described, for example, with reference to FIG. 2. FIG. 4a(a) is a perspective view of the third antenna module (246) viewed from one side, and FIG. 4a(b) is a perspective view of the third antenna module (246) viewed from the other side. FIG. 4a(c) is a cross-sectional view of the third antenna module (246) along X-X'.

[0079] Referring to FIG. 4a, in one embodiment, the third antenna module (246) may include a printed circuit board (410), an antenna array (430), a radio frequency integrate circuit (RFIC) (452), or a power manage integrate circuit (PMIC) (454). Optionally, the third antenna module (246) may further include a shielding member (490). In other embodiments, at least one of the aforementioned components may be omitted, or at least two of the components may be formed integrally.

[0080] A printed circuit board (410) may include a plurality of conductive layers and a plurality of non-conductive layers stacked alternately with said conductive layers. The printed circuit board (410) may provide electrical connections between various electronic components placed on the printed circuit board (410) and / or outside using wirings and conductive vias formed on said conductive layers.

[0081] An antenna array (430) (e.g., 248 in FIG. 2) may include a plurality of antenna elements (432, 434, 436, or 438) arranged to form a directional beam. The antenna elements (432, 434, 436, or 438) may be formed on a first surface of a printed circuit board (410) as illustrated. According to another embodiment, the antenna array (430) may be formed inside the printed circuit board (410). According to embodiments, the antenna array (430) may include a plurality of antenna arrays of the same or different shapes or types (e.g., dipole antenna arrays, and / or patch antenna arrays).

[0082] The RFIC (452) (e.g., 226 in FIG. 2) may be placed in another area of ​​the printed circuit board (410) spaced apart from the antenna array (e.g., a second side opposite the first side). The RFIC is configured to process signals of a selected frequency band transmitted and received through the antenna array (430). According to one embodiment, the RFIC (452) may convert a baseband signal obtained from a communication processor (not shown) into an RF signal of a specified band during transmission. The RFIC (452) may convert an RF signal received through the antenna array (430) into a baseband signal and transmit it to a communication processor during reception.

[0083] According to another embodiment, the RFIC (452) can up-convert an IF signal (e.g., about 9 GHz to about 11 GHz) obtained from an IFIC (intermediate frequency integrate circuit) (e.g., 228 in FIG. 2) during transmission into an RF signal of a selected band. The RFIC (452) can down-convert an RF signal obtained through an antenna array (430) during reception into an IF signal and transmit it to the IFIC.

[0084] The PMIC (454) may be placed in another part of the printed circuit board (410) (e.g., the second side) spaced apart from the antenna array (430). The PMIC receives voltage from the main PCB (not shown) and can provide the necessary power to various components (e.g., RFIC (452)) on the antenna module.

[0085] A shielding member (490) may be disposed on a part of the printed circuit board (410) (e.g., the second side) to electromagnetically shield at least one of the RFIC (452) or PMIC (454). According to one embodiment, the shielding member (490) may include a shield can.

[0086] Although not illustrated, in various embodiments, the third antenna module (246) may be electrically connected to another printed circuit board (e.g., main circuit board) through a module interface. The module interface may include a connecting member, e.g., a coaxial cable connector, a board-to-board connector, an interposer, or a flexible printed circuit board (FPCB). The RFIC (452) and / or PMIC (454) of the antenna module may be electrically connected to the printed circuit board through the connecting member.

[0088] FIG. 4b illustrates a cross-section along line Y-Y' of the third antenna module (246) illustrated in FIG. 4a (a). The printed circuit board (410) of the illustrated embodiment may include an antenna layer (411) and a network layer (413).

[0089] Referring to FIG. 4b, the antenna layer (411) may include at least one dielectric layer (437-1) and an antenna element (436) and / or a feed portion (425) formed on or inside the outer surface of the dielectric layer. The feed portion (425) may include a feed point (427) and / or a feed line (429).

[0090] The network layer (413) may include at least one dielectric layer (437-2), at least one ground layer (433) formed on or inside the outer surface of the dielectric layer, at least one conductive via (435), a transmission line (423), and / or a signal line (429).

[0091] Additionally, in the illustrated embodiment, the RFIC (452) of (c) illustrated in FIG. 4a (e.g., the third RFIC (226) of FIG. 2) may be electrically connected to the network layer (413), for example, through first and second connections (solder bumps) (440-1, 440-2). In other embodiments, various connection structures (e.g., solder or BGA) may be used instead of connections. The RFIC (452) may be electrically connected to the antenna element (436) through the first connection (440-1), the transmission line (423), and the feed (425). The RFIC (452) may also be electrically connected to the ground layer (433) through the second connection (440-2) and the conductive via (435). Although not shown, the RFIC (452) can also be electrically connected to the module interface mentioned above via the signal line (429).

[0093] FIG. 5a is an exploded perspective view of an antenna structure according to various embodiments of the present disclosure. FIG. 5b is an assembled perspective view of an antenna structure according to various embodiments of the present disclosure. FIG. 5c is a perspective view looking at the rear surface of a first dielectric according to various embodiments of the present disclosure.

[0094] The antenna structure (500) of FIGS. 5a and 5b may be at least partially similar to the third antenna module (246) of FIG. 2, or may include other embodiments of the antenna structure.

[0095] Referring to FIGS. 5a through 5c, an antenna structure (500) (e.g., an antenna module) may include a substrate (590) (e.g., a printed circuit board) comprising an array antenna (AR1) and a plurality of dielectrics (610, 620, 630, 640, 650) disposed on the substrate (590). According to one embodiment, the array antenna (AR1) may include a plurality of antenna elements (510, 520, 530, 540, 550) disposed on the substrate (590) at specified intervals. According to one embodiment, the plurality of antenna elements (510, 520, 530, 540, 550) may include a plurality of conductive patches and / or a plurality of conductive patterns. According to one embodiment, the substrate (590) may include a first substrate surface (5901) facing a first direction (direction ①), a second substrate surface (5902) facing a second direction (direction ②) opposite to the first substrate surface (5901), and a substrate side (5903) surrounding the spaces between the first substrate surface (5901) and the second substrate surface (5902). According to one embodiment, a plurality of antenna elements (510, 520, 530, 540, 550) may be arranged through the first substrate surface (5901). Accordingly, the array antenna (AR1) may be configured to form a directional beam in the first direction (direction ①) toward which the first substrate surface (5901) faces. For example, a plurality of antenna elements (510, 520, 530, 540, 550) may be arranged such that they are exposed to the first substrate surface (5901) or embedded inside the substrate (590). According to one embodiment, the antenna structure (500) may be arranged such that the first substrate surface (5901) of the substrate (590) faces at least a portion of the side (e.g., the side (310C) of FIG. 3a) of the electronic device (e.g., the electronic device (300) of FIG. 3a).In some embodiments, the antenna structure (500) may be positioned such that the first substrate surface (5901) of the substrate (590) faces at least a portion of the rear surface (e.g., rear surface (310B) of FIG. 3b) of the electronic device (e.g., electronic device (300) of FIG. 3a).

[0096] According to various embodiments, a plurality of dielectrics (610, 620, 630, 640, 650) may be placed at positions corresponding to each of the plurality of antenna elements (510, 520, 530, 540, 550) disposed on the substrate (590). For example, the plurality of dielectrics (610, 620, 630, 640, 650) may be fixed to the first substrate surface (5901) of the substrate (590) through a bonding process such as soldering, bonding, or taping. According to one embodiment, each of the plurality of dielectrics (610, 620, 630, 640, 650) may be disposed to overlap at least partially with each of the plurality of antenna elements (510, 520, 530, 540, 550) when the first substrate surface (5901) is viewed from above. For example, a plurality of genomes (610, 620, 630, 640, 650) may include a first genome (610) corresponding to a first antenna element (510) and including a first dummy patch (611), a second genome (620) corresponding to a second antenna element (520) and including a second dummy patch (621), a third genome (630) corresponding to a third antenna element (530) and including a third dummy patch (631), a fourth genome (640) corresponding to a fourth antenna element (540) and including a fourth dummy patch (641), and / or a fifth genome (650) corresponding to a fifth antenna element (550) and including a fifth dummy patch (651). According to one embodiment, a plurality of dummy patches (611, 621, 631, 641, 651) can help improve the radiation performance of an array antenna (AR1) operated by antenna elements (510, 520, 530, 540, 550). For example, the array antenna (AR1) can be operated to have an extended bandwidth through a plurality of dummy patches (611, 621, 631, 641, 651). In some embodiments, the plurality of dummy patches (611, 621, 631, 641, 651) may be omitted.

[0097] According to various embodiments, the substrate (590) may be formed from a material having a first dielectric constant. According to one embodiment, a plurality of dielectrics (610, 620, 630, 640, 650) may be formed from a material having a second dielectric constant different from the first dielectric constant. For example, the second dielectric constant may be greater than or equal to the first dielectric constant. According to one embodiment, the radiation performance of the array antenna (AR1) may be determined by the second dielectric constant. For example, at least one of the resonant frequency, bandwidth, beamforming gain, peak gain, or beam coverage of the array antenna (AR1) may be determined by the second dielectric constant of the plurality of dielectrics (610, 620, 630, 640, 650). According to one embodiment, the size of the antenna structure (500) may be determined by the second dielectric constant.

[0098] According to various embodiments, the antenna structure (500) may include a wireless communication circuit (597) (e.g., the wireless communication module (192) of FIG. 1) disposed on a second substrate surface (5902). According to one embodiment, the wireless communication circuit (597) may be electrically connected to a plurality of antenna elements (510, 520, 530, 540, 550). According to one embodiment, the wireless communication circuit (597) may be configured to transmit or receive a wireless signal in a frequency band ranging from about 3 GHz to about 100 GHz through an array antenna (AR1). In some embodiments, the wireless communication module (597) may be disposed in the internal space of an electronic device (e.g., the electronic device (300) of FIG. 3a) and may be electrically connected to the substrate (590) via an electrical connection cable (e.g., a flexible RF cable (FRC)).

[0099] According to various embodiments, the first dielectric (610) may include a first rigid surface (6101) facing a first direction (direction ①) and a second rigid surface (6102) facing a second direction (direction ②) opposite to the first direction (direction ①). According to one embodiment, the first dielectric (610) may be arranged such that the second rigid surface (6102) faces the first substrate surface (5901). According to one embodiment, the antenna structure (500) may include a first plurality of conductive pads (5911) disposed in at least a portion of the first substrate surface (5901) corresponding to the first dielectric (610). According to one embodiment, the first dielectric (610) may include a first plurality of solder pads (6111) disposed in a position corresponding to the first plurality of conductive pads (5911) and exposed to the second rigid surface (6102). According to one embodiment, the first dielectric (610) may be fixed to the first substrate surface (5901) of the substrate (590) in such a manner that the first conductive pads (5911) are joined through a soldering process with the first plurality of solder pads (6111) disposed on the second rigid surface (6102) of the first dielectric (610). According to one embodiment, at least some of the first plurality of conductive pads (5911) may be arranged to overlap with the first antenna element (510) when the first substrate surface (5901) is viewed from above. According to one embodiment, when the first antenna element (510) is exposed to the first substrate surface (5901), the first plurality of conductive pads (5911) may be replaced by a portion of the first antenna element (510). In this case, the first plurality of solder pads (6111) can be operated as an antenna pattern. In some embodiments, when the first antenna element (510) is embedded in the substrate (590) and the first plurality of conductive pads (5911) are individually arranged, the first plurality of conductive pads (5911) and the first plurality of solder pads (6111) can be formed as a dummy pattern for bonding.According to one embodiment, the second antenna element (520), the third antenna element (530), the fourth antenna element (540), and the fifth antenna element (550) may each include a second plurality of conductive pads (5921), a third plurality of conductive pads (5931), a fourth plurality of conductive pads (5941), and a fifth plurality of conductive pads (5951), and may be joined to a plurality of solder pads (not shown) disposed on each of the second dielectric (620) (e.g., the second solder pads (6211) of FIG. 6A), the third dielectric (630), the fourth dielectric (640), and the fifth dielectric (650) in substantially the same manner.

[0100] An antenna structure (500) according to exemplary embodiments of the present disclosure comprises, but is not limited to, five antenna elements (510, 520, 530, 540, 550) and five dielectrics (610, 620, 630, 640, 650) arranged to correspond thereto. For example, the antenna structure (500) may comprise one antenna element (510) and one dielectric (610) corresponding thereto. In some embodiments, the antenna structure (500) may be configured to comprise two, three, four, or six or more antenna elements and a corresponding number of dielectrics.

[0102] FIG. 6a is a partial cross-sectional view of an antenna structure viewed along line 6a-6a of FIG. 5b according to various embodiments of the present disclosure.

[0103] FIG. 6a illustrates and describes the arrangement structure of the first antenna element (510) and the first dielectric (610) and the arrangement structure of the second antenna element (520) and the second dielectric (620) on the substrate (590), but the remaining antenna elements (530, 540, 550) and the remaining dielectrics (630, 640, 650) may also have substantially the same arrangement structure.

[0104] Referring to FIG. 6a, the antenna structure (500) may include a first substrate surface (5901) facing a first direction (direction ①), a second substrate surface (5902) facing the opposite direction (direction ②) of the first substrate surface (5901), and a plurality of insulating layers filling the space (5903) between the first substrate surface (5901) and the second substrate surface (5902), a plurality of antenna elements (510, 520) disposed on the substrate (590), and a plurality of dielectrics (610, 620) disposed on the first substrate surface (5901) and correspondingly disposed to each of the plurality of antenna elements (510, 520). According to one embodiment, the substrate (590) may include at least one ground layer (G) (ground plane) disposed on at least some of the insulating layers. According to one embodiment, at least one ground layer (G) may be electrically connected through an electrical connection structure (CV) (e.g., a conductive via).

[0105] According to various embodiments, the antenna structure (500) may include a first antenna element (510) and a second antenna element (520) spaced apart from the first antenna element (510) at a specified distance. According to one embodiment, the antenna structure (500) may include a first dielectric (610) that is at least partially overlapped with the first antenna element (510) and a second dielectric (620) that is at least partially overlapped with the second antenna element (520) when viewed from above on the first substrate surface (5901). According to one embodiment, the first dielectric (610) may include a first dummy patch (611) that is at least partially overlapped with the first antenna element (510) when viewed from above on the first substrate surface (5901). According to one embodiment, the second dielectric (620) may include a second dummy patch (621) that is at least partially overlapped with the second antenna element (520) when viewed from above on the first substrate surface (5901). According to one embodiment, the first dielectric (610) and the second dielectric (620) may be formed from a high dielectric material. According to one embodiment, the first dielectric (610) and the second dielectric (620) may include a material having a dielectric constant in the range of 4 to 9. For example, the first dielectric (610) and the second dielectric (620) may be formed from a ceramic material (e.g., low temperature cofired ceramics (LLCC)) having a dielectric constant higher than that of the substrate (590) (e.g., printed circuit board). In some embodiments, the first dielectric (610) and the second dielectric (620) may be formed of a material having the same dielectric constant as the substrate (590).

[0106] According to various embodiments, the first antenna element (510) may be electrically connected to the wireless communication circuit (597) through a first feed section (511) and a wiring structure (5904) connecting the first feed section (511) and the wireless communication circuit (597). According to one embodiment, the second antenna element (520) may be electrically connected to the wireless communication circuit (597) through a second feed section (521) and a wiring structure (5904) connecting the second feed section (521) and the wireless communication circuit (597). According to one embodiment, the first feed section (511) and the second feed section (521) may include at least one conductive via arranged to cross the substrate (590) in a vertical direction (e.g., from the first substrate surface (5901) toward the second substrate surface (5902).

[0107] According to various embodiments, the first dielectric (610) may be fixed to the first substrate surface (5901) in such a way that a first plurality of conductive pads (5911) disposed on the first substrate surface (5901) and a first plurality of solder pads (6111) disposed on the second rigid surface (6102) of the first dielectric (610) are joined through a soldering process. According to one embodiment, the second dielectric (620) may be fixed to the first substrate surface (5901) in such a way that a second plurality of conductive pads (5921) disposed on the first substrate surface (5901) and a second plurality of solder pads (6211) disposed on the second rigid surface (6202) of the second dielectric (620) are joined through a soldering process. Here, reference numeral 6101 may be the first rigid surface of the first dielectric (610), and reference numeral 6201 may be the first rigid surface of the second dielectric (620). In some embodiments, the first dummy patch (611) and / or the second dummy patch (621) may be replaced with at least some of the solder pads (6111, 6211).

[0108] According to exemplary embodiments of the present disclosure, the radiation performance of an antenna structure (500) may be determined by the dielectric constant of dielectrics (610, 620) arranged to correspond to each of the antenna elements (510, 520). For example, the operating frequency band of the antenna structure (500) may be determined by the dielectric constant of the dielectrics (610, 620). In some embodiments, the size of the antenna structure (500) may be determined by the dielectric constant of dielectrics (610, 620) arranged to correspond to each of the antenna elements (510, 520). In some embodiments, the bandwidth of the antenna structure (500) may be determined by the placement position and / or shape of the first dummy patch (611) and the second dummy patch (621) arranged on the first dielectric (610) and the second dielectric (620), respectively.

[0110] FIG. 6b is a partial cross-sectional view of an antenna structure according to various embodiments of the present disclosure.

[0111] In describing the antenna structure (500) of FIG. 6b, the same reference numerals have been assigned to components that are substantially identical to those of the antenna structure (500) of FIG. 6a, and detailed descriptions thereof may be omitted.

[0112] Referring to FIG. 6b, the substrate (590) may include a plurality of recesses (5901a, 5901b) spaced apart at a specified interval on a first substrate surface (5901). According to one embodiment, the plurality of recesses (5901a, 5901b) may include a first recess (5901a) that accommodates at least a portion of a first dielectric (610) and a second recess (5901b) that accommodates at least a portion of a second dielectric (620). According to one embodiment, a first plurality of conductive pads (5911) and a second plurality of conductive pads (5921) may be arranged to be exposed to the outside in the first recess (5901a) and the second recess (5901b). According to one embodiment, a plurality of dielectrics (610, 620) are each accommodated in a plurality of recesses (5901a, 5901b), thereby reducing the displacement of the dielectrics (610, 620) due to external impact. Although not shown, the remaining dielectrics (e.g., the third dielectric (630), the fourth dielectric (640), and the fifth dielectric (650) of FIG. 5a) may also be disposed on the first substrate surface (5901) of the substrate (590) in substantially the same manner.

[0114] FIG. 7a is a graph comparing the radiation characteristics of the antenna structure of FIG. 5a according to various embodiments of the present disclosure with the radiation characteristics of a conventional antenna structure.

[0115] 701 is a reflection loss graph of an antenna structure (500) in which only at least one antenna element is in operation with dielectrics (610, 620, 630, 640, 650) omitted, and 702 is a reflection loss graph of an antenna structure in which the size of at least one antenna element is relatively reduced and dielectrics (610, 620, 630, 640, 650) having a permittivity to compensate for this are arranged.

[0116] Referring to FIG. 7a, when comparing the bandwidth of -6dB, the conventional antenna structure exhibits a bandwidth of 7.2GHz (graph 701), and the antenna structure (500) according to the present disclosure exhibits a bandwidth of 7.1GHz, which is equivalent to the conventional one (graph 702).

[0117] This means that when the size of the antenna elements (510, 520, 530, 540, 550) is reduced and dielectrics (610, 620, 630, 640, 650) formed of a material having a relatively high dielectric constant to compensate for this are applied, the antenna elements can be operated to have a bandwidth equivalent to the bandwidth before the reduction in size, and thus the size of the substrate (590) may be reduced.

[0119] FIG. 7b is a graph illustrating the frequency change state according to the change in dielectric constant of the antenna structure of FIG. 5a according to various embodiments of the present disclosure.

[0120] Referring to FIG. 7b, 703 is a graph of reflection loss of an antenna structure including dielectrics having a first permittivity (e.g., permittivity 1), 704 is a graph of reflection loss of an antenna structure including dielectrics having a second permittivity (e.g., permittivity 3) higher than the first permittivity, and 705 is a graph of reflection loss of an antenna structure including dielectrics having a third permittivity (e.g., permittivity 6) higher than the second permittivity.

[0121] Referring to Fig. 7b, it can be seen that the operating frequency band of the antenna structure shifts to a low band as the permittivity of the dielectric increases. This implies that, while keeping the size of the antenna elements fixed, the antenna structure can operate in various operating frequency bands by adjusting the permittivity of the dielectrics. Furthermore, even if the operating frequency band of the antenna structure shifts to an unwanted high band by reducing the size of the antenna elements, it can be shifted back to the original operating frequency band by applying dielectrics with a specified permittivity, which can help reduce the size of the antenna structure (e.g., substrate).

[0123] FIGS. 8a and FIGS. 8b are partial cross-sectional views of an antenna structure according to various embodiments of the present disclosure.

[0124] In describing the antenna structure (500) of FIG. 8a and FIG. 8b, the same reference numerals have been assigned to components that are substantially identical to the antenna structure (500) of FIG. 6a, and a detailed description thereof may be omitted.

[0125] Referring to FIG. 8a, the antenna structure (500) may include a first substrate surface (5901) facing a first direction (direction ①), a second substrate surface (5902) facing the opposite direction (direction ②) of the first substrate surface (5901), and a plurality of insulating layers filling the space (5903) between the first substrate surface (5901) and the second substrate surface (5902), a plurality of antenna elements (510, 520) disposed on the substrate (590), and a plurality of dielectrics (610, 620) disposed on the first substrate surface (5901), corresponding to each of the plurality of antenna elements (510, 520), and another plurality of antenna elements (661, 662). According to one embodiment, the substrate (590) may include at least one ground layer (G) (ground plane) disposed on at least some of the insulating layers among a plurality of insulating layers. According to one embodiment, the at least one ground layer (G) may be electrically connected through an electrical connection structure (CV) (e.g., a conductive via).

[0126] According to various embodiments, the antenna structure (500) may include a first antenna element (510) and a second antenna element (520) spaced apart from the first antenna element (510) by a specified distance. According to one embodiment, the antenna structure (500) may include a first dielectric (610) that is at least partially overlapped with the first antenna element (510) and a second dielectric (620) that is at least partially overlapped with the second antenna element (520) when viewed from above on the first substrate surface (5901). According to one embodiment, the first dielectric (610) may include a first additional antenna element (661) that is at least partially overlapped with the first antenna element (510) when viewed from above on the first substrate surface (5901). According to one embodiment, the first additional antenna element (661) may include a conductive patch disposed in the space between the first rigid surface (6101) and the second rigid surface (6102) of the first dielectric (610). According to one embodiment, the second dielectric (620) may include a second additional antenna element (662) disposed at least partially overlapping with the second antenna element (520) when viewed from above on the first substrate surface (5901). According to one embodiment, the second additional antenna element (662) may include a conductive patch disposed in the space between the first rigid surface (6201) and the second rigid surface (6202) of the second dielectric (620). According to one embodiment, the first dielectric (610) may include a first dummy patch (611) that is at least partially overlapped with the first additional antenna element (661) between the first rigid surface (6101) and the first additional antenna element (661) when viewed from above on the first substrate surface (5901). According to one embodiment, the second dielectric (620) may include a second dummy patch (621) that is at least partially overlapped with the second additional antenna element (662) between the first rigid surface (6201) and the second additional antenna element (662) when viewed from above on the first substrate surface (5901).

[0127] According to various embodiments, the first antenna element (510) may be electrically connected to the wireless communication circuit (597) through a first feed section (511) and a wiring structure (5904) connecting the first feed section (511) and the wireless communication circuit (597). According to one embodiment, the second antenna element (520) may be electrically connected to the wireless communication circuit (597) through a second feed section (521) and a wiring structure (5904) connecting the second feed section (521) and the wireless communication circuit (597). According to one embodiment, the first feed section (511) and the second feed section (521) may include at least one conductive via arranged to cross the substrate (590) in a vertical direction (e.g., from the first substrate surface (5901) toward the second substrate surface (5902).

[0128] According to various embodiments, a first additional antenna element (661) may be electrically connected to a wireless communication circuit (597) through a third feed portion (512) which is placed on a substrate (590) and electrically connected through a wiring structure (5905) connected to a wireless communication circuit (597), a first feed pad (5912) which is electrically connected to the third feed portion (512) and exposed on a first substrate surface (5901), a second feed pad (6112) which is exposed on a second rigid surface (6102) of a first dielectric (610) and joined to the first feed pad (5912) through soldering, and a first extension portion (6611) which connects the second feed pad (6112) and the first additional antenna element (661). According to one embodiment, a second additional antenna element (662) may be electrically connected to a wireless communication circuit (597) through a fourth feed portion (522) which is placed on a substrate (590) and electrically connected through a wiring structure (5905) connected to a wireless communication circuit (597), a third feed pad (5922) which is electrically connected to the fourth feed portion (522) and exposed on a first substrate surface (5901), a fourth feed pad (6212) which is exposed on a second rigid surface (6202) of a second dielectric (620) and joined to the third feed pad (5922) through soldering, and a second extension portion (6621) which connects the fourth feed pad (6212) and the second additional antenna element (662). According to one embodiment, the third feed portion (512) and the first feed pad (5912) may be positioned to penetrate a first through hole (510a) formed in at least a part of the first antenna element (510). According to one embodiment, the fourth feed portion (522) and the third feed pad (5922) may be positioned to penetrate a second through hole (520a) formed in at least a part of the second antenna element (520). According to one embodiment, the third feed portion (512) and the fourth feed portion (522) may include at least one conductive via positioned to cross the substrate (590) in a vertical direction (e.g., from the first substrate surface (5901) toward the second substrate surface (5902).According to one embodiment, the first extension (6611) may include a conductive via positioned vertically from the first rigid surface (6101) of the first dielectric (610) toward the second rigid surface (6102). According to one embodiment, the second extension (6621) may include a conductive via positioned vertically from the first rigid surface (6201) of the second dielectric (620) toward the second rigid surface (6202).

[0129] According to various embodiments, the wireless communication circuit (597) may be configured to transmit or receive a wireless signal in a first frequency band through a first antenna element (510) and a second antenna element (520). According to one embodiment, the wireless communication circuit (597) may be configured to transmit or receive a wireless signal in a second frequency band different from the first frequency band through a first additional antenna element (661) and a second additional antenna element (662). According to one embodiment, the first frequency band may be lower than the second frequency band. For example, the first frequency band may include a 28 GHz band, and the second frequency band may include a 39 GHz band. Thus, the antenna structure (500) may be used as a dual-band antenna operating in different frequency bands.

[0131] Referring to FIG. 8b, the first extension (6611) may be electrically connected capacitively without contacting the first additional antenna element (661) through a first coupling pad (661a) disposed at the end. According to one embodiment, the second extension (6621) may also be electrically connected capacitively without contacting the second additional antenna element (662) through a second coupling pad (662a) disposed at the end.

[0133] FIG. 9a is a perspective view of an antenna structure according to various embodiments of the present disclosure. FIG. 9b is a cross-sectional view of an antenna structure viewed along line 9b-9b of FIG. 9a according to various embodiments of the present disclosure.

[0134] The antenna structure (500-1) of FIGS. 9a and 9b may be at least partially similar to the third antenna module (246) of FIG. 2, or may include other embodiments of the antenna structure.

[0135] In describing the antenna structure (500-1) of FIGS. 9a and 9b, the same reference numerals have been used for components that are substantially identical to the antenna structure (500) of FIGS. 5a and 5b, and a detailed description thereof may be omitted.

[0136] Referring to FIGS. 9a and 9b, the antenna structure may include a substrate (590) formed of a material having a first dielectric constant, a first array antenna (AR1) disposed on the substrate (590) (e.g., the array antenna (AR1) of FIG. 5a), and a second array antenna (AR2) disposed near the first array antenna. According to one embodiment, the substrate (590) may include a first substrate surface (5901) facing a first direction (direction ①), a second substrate surface (5902) facing a second direction (direction ②) opposite to the first direction (direction ①), and a substrate side surface (5903) surrounding the space between the first substrate surface (5901) and the second substrate surface (5902). According to one embodiment, the first array antenna (AR1) may include a first plurality of antenna elements (510, 520, 530, 540, 550) arranged at specified intervals on a first substrate surface (5901). According to one embodiment, the first plurality of antenna elements (510, 520, 530, 540, 550) may include a first antenna element (510), a second antenna element (520), a third antenna element (530), a fourth antenna element (540), and a fifth antenna element (550) arranged at specified intervals relative to each other. According to one embodiment, the first plurality of antenna elements (510, 520, 530, 540, 550) may be electrically connected to a first wireless communication circuit (597) (e.g., the wireless communication circuit (597) of FIG. 5) disposed on a second substrate surface (5902) of the substrate (590). For example, the first wireless communication circuit (597) may be configured to form a directional beam in a first direction (direction ①) through a first array antenna (AR1). According to one embodiment, the first wireless communication circuit (597) may be configured to transmit and / or receive a wireless signal in a first frequency band through the first array antenna (AR1). According to one embodiment, the first frequency band may include a frequency band in the range of about 25 GHz to 45 GHz (e.g., mmWave).

[0137] According to various embodiments, the antenna structure (500-1) may include a first plurality of dielectrics (610, 620, 630, 640, 650) formed of a material having a second dielectric constant, which is disposed on the first substrate surface (5901) so as to overlap with each of the first plurality of antenna elements (510, 520, 530, 540, 550) when viewed from above on the first substrate surface (5901). According to one embodiment, the first plurality of dielectrics (610, 620, 630, 640, 650) may include a first dielectric (610) positioned to correspond to a first antenna element (510), a second dielectric (620) positioned to correspond to a second antenna element (620), a third dielectric (630) positioned to correspond to a third antenna element (530), a fourth dielectric (640) positioned to correspond to a fourth antenna element (540), and a fifth dielectric (650) positioned to correspond to a fifth antenna element (550). According to one embodiment, the first dielectric constant of the substrate (590) may be the same as or different from the second dielectric constant of the first plurality of dielectrics (610, 620, 630, 640, 650).

[0138] According to various embodiments, the second array antenna (AR2) may include a second plurality of antenna elements (571, 572, 573, 574, 575, 576, 577, 578) disposed near a first plurality of antenna elements (510, 520, 530, 540, 550) when viewed from above on the first substrate surface (5901). According to one embodiment, the second plurality of antenna elements (571, 572, 573, 574, 575, 576, 577, 578) may be disposed at least partially between the first plurality of antenna elements (510, 520, 530, 540, 550) when viewed from above on the first substrate surface. In this case, the first plurality of antenna elements (510, 520, 530, 540, 550) and the second plurality of antenna elements (571, 572, 573, 574, 575, 576, 577, 578) may be disposed on the same layer of the substrate. In some embodiments, at least one antenna element among the second plurality of antenna elements (571, 572, 573, 574, 575, 576, 577, 578) may be disposed to overlap at least partially with at least one antenna element among the first plurality of antenna elements (510, 520, 530, 540, 550) when the first substrate surface (5901) is viewed from above. In this case, the first plurality of antenna elements (510, 520, 530, 540, 550) and the second plurality of antenna elements (571, 572, 573, 574, 575, 576, 577, 578) may be disposed on different layers of the substrate (590). For example, the second plurality of antenna elements (571, 572, 573, 574, 575, 576, 577, 578) may be disposed on a layer of the substrate having a greater distance from the first substrate surface (5901) than the first plurality of antenna elements (510, 520, 530, 540, 550).According to one embodiment, the second plurality of antenna elements (571, 572, 573, 574, 575, 576, 577, 578) may include a sixth antenna element (571), a seventh antenna element (572), an eighth antenna element (573), a ninth antenna element (574), a tenth antenna element (575), an eleventh antenna element (576), a twelfth antenna element (577), and a thirteenth antenna element (578) arranged at specified intervals relative to one another. According to one embodiment, the second plurality of antenna elements (571, 572, 573, 574, 575, 576, 577, 578) may include conductive patches arranged on a substrate (590). According to one embodiment, the second plurality of antenna elements (571, 572, 573, 574, 575, 576, 577, 578) may be electrically connected to a second wireless communication circuit (598) disposed on the second substrate surface (5902) of the substrate (590). For example, the second wireless communication circuit (598) may be configured to form a directional beam in a first direction (direction ①) through the second array antenna (AR2). According to one embodiment, the second wireless communication circuit (598) may be configured to transmit and / or receive a wireless signal in a second frequency band different from the first frequency band through the second array antenna (AR2). According to one embodiment, the second frequency band may include a frequency band in the range of about 55 GHz to 70 GHz (e.g., 802.11ay band).

[0139] According to various embodiments, the antenna structure (500-1) may include a second plurality of dielectrics (671, 672, 673, 674, 675, 676, 677, 678) formed of a material having a third dielectric constant, which is disposed on the first substrate surface (5901) so as to overlap with each of the second plurality of antenna elements (671, 672, 673, 674, 675, 676, 677, 678) when viewed from above on the first substrate surface (5901). According to one embodiment, the second plurality of dielectrics (671, 672, 673, 674, 675, 676, 677, 678) are a sixth dielectric (671) arranged to correspond to a sixth antenna element (571), a seventh dielectric (672) arranged to correspond to a seventh antenna element (572), an eighth dielectric (673) arranged to correspond to an eighth antenna element (573), a ninth dielectric (674) arranged to correspond to a ninth antenna element (574), a tenth dielectric (675) arranged to correspond to a tenth antenna element (575), an eleventh dielectric (676) arranged to correspond to an eleventh antenna element (576), a twelveth dielectric (677) arranged to correspond to a twelveth antenna element (577), and a thirteenth antenna It may include a 13th dielectric (678) arranged to correspond to an element (578). According to one embodiment, the dielectric constant of the second plurality of dielectrics (671, 672, 673, 674, 675, 676, 677, 678) and the dielectric constant of the substrate (590) may be the same or different from each other. According to one embodiment, the second plurality of antenna elements (571, 572, 573, 574, 575, 576, 577, 578) may have a substrate arrangement structure substantially identical to the plurality of antenna elements presented in FIG. 5a to FIG. 6b (e.g., the plurality of antenna elements of FIG. 5a (510, 520, 530, 540, 550)).In some embodiments, each of the second plurality of dielectrics (671, 672, 673, 674, 675, 676, 677, 678) may include a plurality of dummy patches (6711, 6721, 6731, 6741) arranged to affect the radiation performance (e.g., bandwidth) of the second plurality of antenna elements (571, 572, 573, 574, 575, 576, 577, 578). According to one embodiment, the second permittivity of the first plurality of dielectrics (610, 620, 630, 640, 650) and the third permittivity of the second plurality of dielectrics (671, 672, 673, 674, 675, 676, 677, 678) may be the same or different from each other. In some embodiments, the first permittivity of the substrate (590), the second permittivity of the first plurality of dielectrics (610, 620, 630, 640, 650), and the third permittivity of the second plurality of dielectrics (671, 672, 673, 674, 675, 676, 677, 678) may be the same or different from each other. According to one embodiment, the number of first plurality of antenna elements (510, 520, 530, 540, 550) and second plurality of antenna elements (571, 572, 573, 574, 575, 576, 577, 578) may not be limited.

[0140] According to various embodiments, the radiation performance (e.g., operating frequency band) of the first array antenna (AR1) may be determined through the second permittivity of the first plurality of dielectrics (610, 620, 630, 640, 650) arranged to correspond to the first plurality of antenna elements (510, 520, 530, 540, 550). In some embodiments, the size of the antenna structure (500-1) (e.g., substrate (590)) may be determined through the second permittivity of the first plurality of dielectrics (610, 620, 630, 640, 650). According to one embodiment, the radiation performance (e.g., operating frequency band) of the second array antenna (AR2) can be determined through the third permittivity of the second plurality of dielectrics (671, 672, 673, 674, 674, 675, 676, 677, 678) arranged to correspond to the second plurality of antenna elements (571, 572, 573, 574, 575, 576, 577, 578).

[0142] FIGS. 10a to 10c are cross-sectional views of antenna structures according to various embodiments of the present disclosure.

[0143] In describing the antenna structures (500-2, 500-3, 500-4) of FIGS. 10a to 10c, the same reference numerals have been used for components that are substantially identical to the components of the antenna structure (500-1) of FIGS. 9a and 9b, and a detailed description thereof may be omitted.

[0144] Referring to FIG. 10a, the antenna structure (500-2) may include a fourth dielectric (680) formed of a material having a fourth dielectric constant that is laminated to a specified thickness on the first substrate surface (5901) in the antenna structure (500-1) of FIG. 9b. According to one embodiment, the fourth dielectric (680) may include a molded material laminated on the first substrate surface (5901) of the substrate (590). According to one embodiment, the fourth dielectric (680) may be laminated on the first substrate surface (5901) and arranged in a manner that covers a first plurality of dielectrics (610, 620, 630, 640, 650) and a second plurality of dielectrics (671, 672, 673, 674). In some embodiments, the fourth dielectric (680) may be laminated on the first substrate surface (5901) and arranged to cover only the second plurality of dielectrics (671, 672, 673, 674). In this case, the laminated thickness of the fourth dielectric (680) may be lower than or equal to the height of the first plurality of dielectrics (610, 620, 630, 640, 650). According to one embodiment, the fourth dielectric constant of the fourth dielectric (680) may be equal to or different from the dielectric constant of the substrate (590), the first plurality of dielectrics (610, 620, 630, 640, 650), or the second plurality of dielectrics (671, 672, 673, 674).

[0145] According to various embodiments, a fourth dielectric (680) additionally laminated on the first substrate surface (5901) may help determine the radiation performance of the first array antenna (AR1) and / or the second array antenna (AR2) or help reduce the size of the antenna structure (500-2). According to one embodiment, the fourth dielectric (680) may help reinforce the rigidity of the antenna structure (500-2) by being laminated on the first substrate surface (5901) of the substrate (590).

[0146] Referring to FIG. 10b, the antenna structure (500-3) may be formed in a state where the second plurality of dielectrics (e.g., the second plurality of dielectrics (671, 672, 673, 674) of FIG. 9b) are omitted from the antenna structure (500-1) of FIG. 9b.

[0147] Referring to FIG. 10c, the antenna structure (500-4) may include a fourth dielectric (680) laminated with a specified thickness on the upper surface of the first substrate surface (5901), wherein the second plurality of dielectrics (e.g., the second plurality of dielectrics (671, 672, 673, 674) of FIG. 9b) are omitted from the antenna structure (500-3) of FIG. 10b. In this case, the fourth dielectric (680) is formed with a thickness that covers the first plurality of dielectrics (610, 620, 630, 640, 650), thereby helping to determine the radiation performance of the first array antenna (AR1) and / or the second array antenna (AR2), help to reduce the size of the antenna structure (500-4), and help to reinforce the rigidity of the antenna structure (500-4).

[0149] FIG. 11a is a plan view of an antenna structure according to various embodiments of the present disclosure. FIG. 11b is a cross-sectional view of an antenna structure viewed along line 11b-11b of FIG. 11a according to various embodiments of the present disclosure.

[0150] In describing the antenna structure (500-5) of FIGS. 11a and 11b, the same reference numerals have been used for components that are substantially identical to the components of the antenna structure (500-1) of FIGS. 9a and 9b, and a detailed description thereof may be omitted.

[0151] Referring to FIGS. 11a and 11b, the antenna structure (500-2) may include a conductive layer (681) laminated to a specified thickness on the first substrate surface (5901) in the antenna structure (500-1) of FIGS. 9a and 9b. According to one embodiment, the conductive layer (681) may be placed on the first substrate surface (5901) of the substrate (590) through plating, sputtering, bonding, or a surface mounting device (SMD) process. In some embodiments, the conductive layer (681) may include a metal plate attached to the first substrate surface (5901). According to one embodiment, the conductive layer (681) may be laminated on the first substrate surface (5901) when viewed from above and may be arranged in a manner that avoids (does not overlap) the first plurality of dielectrics (610, 620, 630, 640, 650) and the second plurality of dielectrics (671, 672, 673, 674, 675, 676, 677, 678). According to one embodiment, the thickness of the conductive layer (681) may be formed so as not to be higher than the height of the first plurality of dielectrics (610, 620, 630, 640, 650) and the second plurality of dielectrics (671, 672, 673, 674, 675, 676, 677, 678). In some embodiments, the conductive layer (681) may be disposed as a part component of the substrate (590) on at least one layer close to the first substrate surface (5901) of the substrate (590).

[0152] According to various embodiments, the conductive layer (681) laminated on the first substrate surface (5901) can help improve the isolation of each of the first plurality of antenna elements (510, 520, 530, 540, 550) and each of the second plurality of antenna elements (571, 572, 573, 574, 575, 576, 577, 578) and reinforce the rigidity of the antenna structure (500-5).

[0154] FIG. 12a is a plan view of an antenna structure according to various embodiments of the present disclosure. FIG. 12b is a cross-sectional view of an antenna structure viewed along line 12b-12b of FIG. 12a according to various embodiments of the present disclosure.

[0155] In describing the antenna structure (500-6) of FIGS. 12a and 12b, the same reference numerals have been used for components that are substantially identical to the components of the antenna structures (500-1, 500-3) of FIGS. 9a, 9b, and 10b, and the detailed description thereof may be omitted.

[0156] Referring to FIGS. 12a and 12b, the antenna structure (500-6) may include a conductive layer (681) laminated to a specified thickness on the first substrate surface (5901) in the antenna structure (500-3) of FIG. 10b. According to one embodiment, the conductive layer (681) may be placed on the first substrate surface (5901) of the substrate (590) through plating, sputtering, bonding, or a surface mounting device (SMD) process. In some embodiments, the conductive layer (681) may include a metal plate attached to the first substrate surface (5901). According to one embodiment, the conductive layer (681) may be laminated on the first substrate surface (5901) when viewed from above and arranged in a manner that avoids (does not overlap) the second plurality of antenna elements (571, 572, 573, 574, 575, 576, 577, 578) and the second plurality of dielectrics (671, 672, 673, 674). According to one embodiment, since the antenna structure (500-6) does not include a second plurality of dielectrics (e.g., the second plurality of dielectrics of FIG. 9a (671, 672, 673, 674, 675, 676, 677, 678)), the conductive layer (681) may include non-conductive areas (6801) in which the area overlapping with the second plurality of antenna elements (571, 572, 573, 574, 575, 576, 577, 578) is omitted when the first substrate surface (5901) is viewed from above. In some embodiments, the conductive layer (681) may be disposed as a part component of the substrate (590) on at least one layer close to the first substrate surface (5901) of the substrate (590).

[0157] According to various embodiments, the conductive layer (681) laminated on the first substrate surface (5901) can help improve the isolation of each of the first plurality of antenna elements (510, 520, 530, 540, 550) and each of the second plurality of antenna elements (571, 572, 573, 574, 575, 576, 577, 578) and reinforce the rigidity of the antenna structure (500-5).

[0158] The arrangement configuration of the fourth dielectric (680) and / or conductive layer (681) according to exemplary embodiments of the present disclosure may be applied in substantially the same way to the antenna structure (500) shown in FIGS. 5a to 6a.

[0160] FIG. 13a is a cross-sectional view illustrating an antenna structure according to various embodiments of the present disclosure in a state supported by a support member. FIG. 13b is a partial perspective view of the support member of FIG. 13a according to various embodiments of the present disclosure.

[0161] The antenna structure (500) of FIGS. 13a and 13b may be substantially identical to the antenna structure (500) of FIGS. 5a to 6a, or may include other embodiments of the antenna structure. For example, the antenna structure (500) of FIGS. 13a and 13b may be replaced with any one of the antenna structures (500-1, 500-2, 500-3, 500-4, 500-5, 500-6) of FIGS. 9a to 11b.

[0162] Referring to FIGS. 13a and 13b, the antenna structure (500) may be arranged to be supported by some components of an electronic device (e.g., the electronic device (300) of FIG. 3c), thereby helping to reinforce rigidity. According to one embodiment, the antenna structure (500) may include a substrate (590), a plurality of antenna elements (510, 520, 530, 540, 550) arranged as an array antenna (AR) at specified intervals on the substrate (590), and a plurality of dielectrics (610, 620, 630, 640, 650) arranged at positions corresponding to each of the plurality of antenna elements (510, 520, 530, 540, 550) on the substrate (590).

[0163] According to various embodiments, the antenna structure (500) may be positioned between a cover member (730) (e.g., rear plate (311) of FIG. 3c) of an electronic device (e.g., electronic device (300) of FIG. 3c) and a support member (710) (e.g., first support member (3211) or second support member (360) of FIG. 3c) disposed in an internal space. According to one embodiment, the support member (710) may include a first support surface (7101) facing the cover member (730) and a second support surface (7102) facing the antenna structure (500). According to one embodiment, the support member (710) may be positioned such that the first support surface (7101) faces the inner surface of the cover member (730), and the second support surface (7102) faces the first substrate surface (5901) of the substrate (590). According to one embodiment, the support member (710) may include a plurality of recesses (711) formed at a specified depth from the second support surface (7102) and positioned corresponding to a plurality of dielectrics (610, 620, 630, 640, 650). According to one embodiment, the antenna structure (500) may be arranged such that each of the plurality of dielectrics (610, 620, 630, 640, 650) is received in each of the plurality of recesses (711) of the support member (710). According to one embodiment, the plurality of recesses (711) may be formed at a depth such that the plurality of dielectrics (610, 620, 630, 640, 650) are received and the second support surface (7102) of the support member (710) is induced to face at least the first substrate surface (5901) of the substrate (590). Accordingly, the antenna structure (500) can have a rigid reinforcement structure capable of withstanding external impacts through a seating structure in which a plurality of dielectrics (610, 620, 630, 640, 650) are accommodated in the recesses (711).

[0164] According to various embodiments, the support member (710) may be formed of a non-conductive material having a specified dielectric constant. In this case, the antenna structure (500) may be aided in determining radiation performance through the support member (710) which is superimposed with a plurality of dielectrics (610, 620, 630, 640, 650).

[0166] FIG. 14a is a cross-sectional view illustrating an antenna structure according to various embodiments of the present disclosure in a state supported by a support member. FIG. 14b is a partial perspective view of the support member of FIG. 14a according to various embodiments of the present disclosure.

[0167] The antenna structure (500) of FIGS. 14a and 14b may be substantially identical to the antenna structure (500) of FIGS. 5a to 6a, or may include other embodiments of the antenna structure. For example, the antenna structure (500) of FIGS. 14a and 14b may be replaced with any one of the antenna structures (500-1, 500-2, 500-3, 500-4, 500-5, 500-6) of FIGS. 9a to 11b.

[0168] Referring to FIGS. 14a and 14b, the antenna structure (500) may be arranged to be supported by some components of an electronic device (e.g., the electronic device (300) of FIG. 3c), thereby helping to reinforce rigidity. According to one embodiment, the antenna structure (500) may include a substrate (590), a plurality of antenna elements (510, 520, 530, 540, 550) arranged as an array antenna (AR) at specified intervals on the substrate (590), and a plurality of dielectrics (610, 620, 630, 640, 650) arranged at positions corresponding to each of the plurality of antenna elements (510, 520, 530, 540, 550) on the substrate (590).

[0169] According to various embodiments, the antenna structure (500) may be positioned between a cover member (730) (e.g., rear plate (311) of FIG. 3c) of an electronic device (e.g., electronic device (300) of FIG. 3c) and a support member (720) positioned in an internal space (e.g., first support member (3211) or second support member (360) of FIG. 3c). According to one embodiment, the support member (720) may include a first support surface (7201) facing the cover member (730) and a second support surface (7202) facing the antenna structure (500). According to one embodiment, the support member (710) may be positioned such that the first support surface (7201) faces the inner surface of the cover member (730), and the second support surface (7202) faces the first substrate surface (5901) of the substrate (590). According to one embodiment, the support member (720) may include a plurality of through holes (721) positioned at locations corresponding to a plurality of dielectrics (610, 620, 630, 640, 650). According to one embodiment, the antenna structure (500) may be arranged such that each of the plurality of dielectrics (610, 620, 630, 640, 650) is at least partially penetrated by each of the plurality of through holes (721) of the support member (710). Accordingly, the antenna structure (500) may have a rigid reinforcement structure capable of withstanding external impact through a through structure in which the plurality of dielectrics (610, 620, 630, 640, 650) are received in the through holes (721).

[0170] According to various embodiments, the support member (710) may be formed of a conductive material. In this case, the antenna structure (500) may be helped to improve isolation by having a placement structure that does not overlap with a plurality of antenna elements (510, 520, 530, 540, 550) through a through-hole (721) through which a plurality of dielectrics (610, 620, 630, 640, 650) are penetrated when viewed from above on the first substrate surface (5901).

[0172] According to various embodiments, an electronic device (e.g., the electronic device (300) of FIG. 3a) comprises a housing (e.g., the housing (310) of FIG. 3a) and an antenna structure (e.g., the antenna structure (500) of FIG. 5a) disposed in the internal space of the housing, comprising a first substrate surface (e.g., the first substrate surface (5901) of FIG. 5a) and a second substrate surface (e.g., the second substrate surface (5902) of FIG. 5a) facing in a direction opposite to the first substrate surface, a substrate having a first dielectric constant (e.g., the substrate (590) of FIG. 5a), first plurality of antenna elements (e.g., first plurality of antenna elements (510, 520, 530, 540, 550) of FIG. 5a) disposed at a specified interval on the substrate, and first plurality of dielectrics (e.g., first plurality of It may include an antenna structure comprising dielectrics (610, 620, 630, 640, 650)) and a first wireless communication circuit (e.g., wireless communication circuit (597) of FIG. 5a) disposed in the internal space and configured to transmit or receive a wireless signal in at least one first frequency band through the first plurality of antenna elements.

[0173] According to various embodiments, the second dielectric constant may be formed from a material that is equal to or greater than the first dielectric constant.

[0174] According to various embodiments, the radiation characteristics of the antenna structure can be determined by the second permittivity.

[0175] According to various embodiments, the size of the antenna structure can be determined by the second dielectric constant.

[0176] According to various embodiments, the second permittivity may be greater than the first permittivity.

[0177] According to various embodiments, each of the first plurality of dielectrics includes at least one solder pad formed on an outer surface, and each of the first plurality of dielectrics can be joined through a soldering process with at least one conductive pad exposed on a first substrate surface of the substrate.

[0178] According to various embodiments, the at least one conductive pad may be arranged to overlap at least partially with each of the first plurality of antenna elements when viewed from above on the first substrate surface.

[0179] According to various embodiments, the at least one conductive pad may be replaced with a portion of each of the first plurality of antenna elements exposed on the first substrate surface.

[0180] According to various embodiments, the substrate may include a plurality of recesses formed on the first substrate surface to accommodate at least a portion of each of the first plurality of dielectrics.

[0181] According to various embodiments, the apparatus further comprises at least one conductive member disposed on each of the first plurality of dielectrics, and the at least one conductive member may include a conductive dummy patch disposed at least partially overlapping with each of the first plurality of antenna elements when viewed from above the first substrate surface.

[0182] According to various embodiments, the apparatus further comprises at least one conductive member disposed on each of the first plurality of dielectrics, and the at least one conductive member may comprise a conductive patch or a conductive pattern electrically connected to the first wireless communication circuit.

[0183] According to various embodiments, the at least one first frequency band may include a range of 25 GHz to 45 GHz.

[0184] According to various embodiments, when viewed from above, the first substrate surface may include a second plurality of antenna elements disposed near the first plurality of antenna elements and a second wireless communication circuit disposed in the internal space and configured to transmit or receive a wireless signal in at least one second frequency band through the second plurality of antenna elements.

[0185] According to various embodiments, when viewed from above, the first substrate surface may include third dielectrics having a third dielectric constant disposed on the first substrate surface at a position corresponding to each of the second dielectrics.

[0186] According to various embodiments, a fourth dielectric having a fourth dielectric constant may be included, which is arranged in a stacked manner on the first substrate surface with a thickness covering at least the third plurality of dielectrics.

[0187] According to various embodiments, at least two of the first permittivity, the second permittivity, the third permittivity, or the fourth permittivity may be the same or different from each other.

[0188] According to various embodiments, the first substrate surface may further include a conductive layer laminated with a specified thickness that does not overlap with the first plurality of antenna elements and the second plurality of antenna elements when viewed from above.

[0189] According to various embodiments, the conductive layer may be formed with a thickness not higher than that of the first plurality of dielectrics and / or the second plurality of dielectrics.

[0190] According to various embodiments, the antenna structure may further include a support member disposed in the internal space and comprising recesses or through holes disposed at specified intervals, wherein at least some of the first plurality of dielectrics are at least partially accommodated in the recesses or through holes, and the first substrate surface may be disposed facing the support member.

[0191] According to various embodiments, the at least one second frequency band may include a range of 55 GHz to 70 GHz.

[0192] Furthermore, the embodiments of the present disclosure disclosed in this specification and drawings are merely specific examples provided to facilitate the explanation of the technical content according to the embodiments of the present disclosure and to aid in understanding the embodiments of the present disclosure, and are not intended to limit the scope of the embodiments of the present disclosure. Accordingly, the scope of the various embodiments of the present disclosure should be interpreted to include all modifications or variations derived based on the technical concept of the various embodiments of the present disclosure, in addition to the embodiments disclosed herein. Explanation of the symbols

[0194] 500: Antenna structure 590: Substrate 510, 520, 530, 540, 550: Multiple antenna elements 610, 620, 630, 640, 650: Multiple genomes 611, 621, 631, 641, 651: Multiple dummy patches AR1: Array antenna

Claims

Claim 1 An electronic device comprising: a housing that at least partially includes a support member comprising a plurality of recesses; an antenna structure disposed in the internal space of the housing, the antenna structure comprising a first substrate surface facing a first direction and a second substrate surface facing a second direction opposite to the first direction, a substrate disposed to correspond to the support member and having a first dielectric constant; a plurality of antenna elements disposed on the substrate and configured to form a directional beam in the first direction; and an antenna structure comprising at least one dielectric disposed on the first substrate surface, having a second dielectric constant, and disposed such that at least a portion thereof rests on at least one of the plurality of recesses; and a wireless communication circuit disposed in the internal space and configured to transmit or receive a wireless signal in at least one frequency band through the plurality of antenna elements. Claim 2 An electronic device according to claim 1, wherein the second permittivity is greater than the first permittivity. Claim 3 An electronic device according to claim 1, wherein at least one dielectric is arranged to cover the first substrate surface entirely. Claim 4 In claim 1, the at least one dielectric is an electronic device attached to the surface of the first substrate through bonding or taping. Claim 5 In claim 1, the wireless communication circuit is an electronic device configured to transmit or receive a wireless signal in a frequency band ranging from 3 GHz to 100 GHz through the antenna structure. Claim 6 An electronic device according to claim 1, wherein the portion of the at least one dielectric that is seated in at least one of the plurality of recesses is provided at a position corresponding to each of the plurality of antenna elements. Claim 7 In claim 1, the support member is an electronic device formed of a non-conductive material. Claim 8 An electronic device according to claim 1, wherein the housing comprises a front plate facing a third direction, a rear plate facing a fourth direction opposite to the third direction, and a side member comprising a conductive member and a non-conductive member, at least partially surrounding the space between the front plate and the rear plate. Claim 9 An electronic device according to claim 8, wherein the conductive member comprises a plurality of through holes, and each of the plurality of through holes is positioned at a location corresponding to each of the plurality of antenna elements. Claim 10 In claim 8, the directional beam is provided in the first direction toward which the side is oriented through at least a portion of the side member. Claim 11 An electronic device according to claim 8, further comprising a display positioned in the internal space so as to be visible from the outside of the housing through at least a portion of the front plate. Claim 12 An electronic device according to claim 1, further comprising at least one conductive patch or conductive pattern disposed on the at least one dielectric and, when the first substrate surface is viewed from above, at least partially overlapping with each of the plurality of antenna elements. Claim 13 An electronic device according to claim 12, wherein the at least one dielectric comprises at least one solder pad formed on an outer surface, and the at least one dielectric is joined to at least one conductive pad exposed on a first substrate surface of the substrate through a soldering process. Claim 14 An electronic device according to claim 13, wherein the wireless communication circuit is disposed on a second substrate surface, and at least one of the conductive patch or conductive pattern is electrically connected to the wireless communication circuit through at least one of the at least one dielectric or at least one conductive via disposed on the substrate. Claim 15 An electronic device according to claim 1, further comprising a conductive dummy patch disposed on at least one dielectric and, when the first substrate surface is viewed from above, at least partially overlapping with each of the plurality of antenna elements. Claim 16 An electronic device according to claim 1, wherein the plurality of antenna elements are arranged at regular intervals to form a linear array of antenna elements. Claim 17 In claim 1, the support member is an electronic device that is connected to or integrally formed with the side bezel of the housing. Claim 18 An electronic device having the same thickness of the at least one dielectric, wherein, in claim 1, the at least one dielectric is disposed at different locations on the first substrate surface with different thicknesses, and the location on the first substrate surface corresponding to the plurality of antenna elements is the greatest thickness of the at least one dielectric. Claim 19 An electronic device comprising: a housing that at least partially includes a support member comprising a plurality of recesses; an antenna structure disposed in the internal space of the housing, the antenna structure comprising a substrate having a first substrate surface facing a first direction and a second substrate surface facing a second direction opposite to the first direction, and having a first dielectric constant; a plurality of antenna elements disposed on the substrate; and an antenna structure comprising at least one dielectric disposed on the first substrate surface, having a second dielectric constant, and disposed such that at least a portion thereof rests on at least one of the plurality of recesses; and a wireless communication circuit disposed in the internal space and configured to transmit or receive a wireless signal in at least one frequency band through the plurality of antenna elements. Claim 20 In paragraph 19, an electronic device in which the second permittivity is greater than the first permittivity.

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