Multi-corrugated packaging box and manufacturing method thereof

Abstract

The present invention relates to a hot-melt root-bonding multi-corrugated packaging box and a method for manufacturing the same. The purpose is to enable a strong bond to be formed by preventing electrical and external damage to the packaging product during the bonding of the bonding surfaces of a multi-corrugated packaging box made of triple or more layers of multi-corrugated cardboard. That is, the present invention is characterized by a method for manufacturing a multi-corrugated packaging box, wherein the manufacturing is achieved through a root binding groove processing process, which involves perforating a root binding hole up to the second corrugated layer portion so that a hot melt can penetrate the outer adhesive binding surface formed on the upper surface of one end of the multi-corrugated board and the inner adhesive binding surface formed on the lower surface of the other end for adhesive binding, thereby forming a binding root; and a hot melt application process, which involves applying a hot melt to the adhesive binding surface located lower during the bonding process between the outer surface and the inner adhesive binding surface where the root binding hole is perforated through the root binding groove processing process. Therefore, the present invention has the effect of preventing electrical and external damage to the packaged product and enabling a robust bonding of the bonding surfaces of a multi-layer corrugated packaging box composed of triple or more layers of multi-layer corrugated cardboard.

Description

Technology Field

[0001] The present invention relates to a hot-melt root-bonding multi-corrugated packaging box and a method for manufacturing the same. More specifically, in a method for manufacturing a multi-corrugated packaging box, the invention aims to ensure that the bonding surfaces of a multi-corrugated packaging box made of triple or more multi-corrugated cardboard are bonded in a way that prevents electrical damage and external damage to the packaging product and enables a strong bond. This is achieved by manufacturing through a root-bonding groove processing process, which involves perforating a root-bonding hole up to the second corrugated layer portion so that hot-melt can penetrate the outer adhesive-bonding surface formed on the upper surface of one end of the multi-corrugated cardboard and the inner adhesive-bonding surface formed on the lower surface of the other end for adhesive bonding, thereby forming a bonding root, and a hot-melt application process, which involves applying hot-melt to the adhesive-bonding surface located below the outer surface and the inner adhesive-bonding surface where the root-bonding hole is perforated through the root-bonding groove processing process. Background Technology

[0004] Generally, multi-layered corrugated packaging boxes are formed by layering the corrugated cardboard material into three or more layers to increase the strength of the packaging box.

[0006] The multi-layered corrugated packaging box described above is made by cutting triple-layered corrugated cardboard and then joining both ends of the cut cardboard using a high-strength metal stapler.

[0008] However, the multi-corrugated packaging box made of triple corrugated cardboard as described above had problems such as the electronic device being damaged by the electrical influence generated by the metal stapler during packaging of electronic devices, and the metal stapler causing scratch damage to the packaged product. Prior art literature

[0010] Korean Patent Publication No. 10-2021-0044147 The problem to be solved

[0011] Accordingly, the present invention aims to solve the problem that the packaged electronic device is damaged by the electrical influence generated by the metal stapler when packaging electronic devices, etc., in a multi-corrugated packaging box made of triple corrugated cardboard as described above, where the binding for forming the box is made of metal staplers, and the problem that the metal staplers cause scratch damage to the packaged product. means of solving the problem

[0013] That is, the present invention is characterized by a method for manufacturing a multi-corrugated packaging box comprising: a root binding groove processing process comprising a process of forming a root binding hole up to the second corrugated layer so that a hot melt can penetrate the outer adhesive binding surface formed on the upper surface of one end of the multi-corrugated board and the inner adhesive binding surface formed on the lower surface of the other end for adhesive binding, thereby forming a binding root; a hot melt application process comprising a process of applying a hot melt to the adhesive binding surface located lower in the bonding process among the outer surface and the inner adhesive binding surface where the root binding hole is formed through the root binding groove processing process; and a bonding process comprising a process of bonding the adhesive binding surface to which the hot melt has been applied through the hot melt application process by facing and joining the other adhesive binding surface.

[0015] The present invention is characterized in that the root binding groove processing process comprises a process of processing root binding holes by rolling a root binding groove processing roller, having a root binding groove processing pin formed on its outer surface, onto a multi-layered corrugated cardboard.

[0017] The present invention is characterized in that the root binding groove processing process is performed by a root binding groove processing plate having a plurality of root binding groove processing pins on its lower surface, and the root binding groove processing process is operated by a lifting actuator to form a root binding hole in a multi-layered corrugated cardboard.

[0019] The present invention is characterized by a hot melt penetration injection step in which a hot melt discharge hole is formed in a root binding groove processing pin that processes the root binding hole during the root binding groove processing process, thereby enabling the hot melt to sufficiently penetrate into the root binding hole.

[0021] The present invention is characterized by a wire brushing process performed before or after the root binding groove processing process, wherein the hot melt applied through the hot melt application process to the outer adhesive binding surface and inner adhesive binding surface of the multi-corrugated cardboard is rolled with a wire brush to induce binding fluff, thereby impregnating and penetrating the surface.

[0023] The present invention relates to a multi-corrugated packaging box, characterized by having a support belt embedded in the inner side of the outer surface of the multi-corrugated cardboard to increase the durability of the packaging box manufactured continuously in the longitudinal direction; and having one inner side of the corrugated packaging box and the other outer side joined to form a root binding box joining part.

[0025] The present invention is characterized by comprising: a root binding hole that penetrates and perforates to the second bone layer in the outer adhesive binding surface and the inner adhesive binding surface of the root binding box coupling part; a binding root part formed by hot melt flowing through the root binding hole and spreading toward the bone side to harden; a binding core part that connects the binding root part of the outer adhesive binding surface and the inner adhesive binding surface to maintain the binding between the outer adhesive binding surface and the inner adhesive binding surface; and a binding surface part formed by applying and hardening hot melt on the opposing outer adhesive binding surface and the inner adhesive binding surface.

[0027] The present invention is characterized by forming a binding fluff on the binding surface by wire brushing. Effects of the invention

[0029] Accordingly, the present invention is manufactured through a root binding groove processing process, which involves perforating a root binding hole up to the second corrugated layer portion so that hot melt can penetrate the outer adhesive binding surface formed on the upper surface of one end of the multi-layer corrugated cardboard and the inner adhesive binding surface formed on the lower surface of the other end for adhesive binding, thereby forming a binding root; and a hot melt application process, which involves applying hot melt to the adhesive binding surface located lower during the bonding process between the outer surface and the inner adhesive binding surface where the root binding hole is perforated through the root binding groove processing process. By doing so, the bonding surface of a multi-layer corrugated packaging box composed of triple or more layers of multi-layer corrugated cardboard is bonded, thereby having the effect of preventing electrical and external damage to the packaged product and achieving a robust bond. Brief explanation of the drawing

[0031] FIG. 1 is a process block diagram according to an embodiment of the present invention. FIG. 2 is a process block diagram including a hot melt penetration injection step according to an embodiment of the present invention. FIG. 3 is a process block diagram including a wire brushing process according to an embodiment of the present invention. FIG. 4 is a process block diagram including a bending groove processing process according to an embodiment of the present invention. FIG. 5 is an example diagram of the root binding groove processing process according to an embodiment of the present invention. FIG. 6 is another process example of a root binding groove processing process according to an embodiment of the present invention. FIG. 7 is another process example diagram of the root binding groove processing process according to an embodiment of the present invention. FIG. 8 is an exemplary diagram showing a hot melt injection process according to the embodiment of FIG. 7. FIG. 9 is an example diagram of a process applying a root binding groove processing roller according to an embodiment of the present invention. FIG. 10 is an exemplary diagram showing a bending groove processing process according to an embodiment of the present invention. FIG. 11 is an example of a multi-corrugated packaging box with a support belt applied according to an embodiment of the present invention. FIG. 12 is an exemplary diagram showing a hot melt coating process according to an embodiment of the present invention. FIG. 13 is an exemplary diagram showing the process of forming a binding fluff after hot melt application according to an embodiment of the present invention. FIG. 14 is an exemplary diagram showing the bonding process of a multi-corrugated packaging box according to an embodiment of the present invention. Specific details for implementing the invention

[0032] The following is a detailed description based on the attached drawings.

[0033] The present invention enables a bonding surface of a multi-layer corrugated packaging box made of triple or more layers of multi-layer corrugated cardboard to prevent electrical and external damage to the packaged product and to ensure a robust bond. The terms and words used in this specification and claims should not be interpreted as being limited to their ordinary or dictionary meanings, and should be interpreted in a meaning and concept consistent with the technical spirit of the present invention, based on the principle that the inventor can appropriately define the concept of the terms to best describe his invention.

[0034] Therefore, the embodiments described in this specification and the configurations illustrated in the drawings are merely the most preferred embodiments of the present invention and do not represent all of the technical ideas of the present invention; thus, it should be understood that various equivalents and modifications that can replace them may exist at the time of filing this application.

[0036] That is, the present invention relates to a method for manufacturing a multi-layer corrugated packaging box, comprising a root binding groove processing process (S200), a hot melt coating process (S300), and a bonding process (S400).

[0038] Here, the root binding groove processing process (S200) is a process of forming a root binding hole (31) up to the second corrugated layer so that hot melt can penetrate the outer adhesive binding surface (21) formed on the upper surface of one end of the multi-corrugated cardboard (10) and the inner adhesive binding surface (22) formed on the lower surface of the other end for adhesive binding, thereby forming a binding root.

[0039] The above root binding groove processing process (S200) is a process of processing a root binding groove (31) by rolling a root binding groove processing roller (110), on which a root binding groove processing pin (130) is formed on the outer surface, onto a multi-corrugated cardboard (10).

[0040] The above root binding groove processing process (S200) is a process of processing a root binding hole (31) in a multi-corrugated cardboard (10) by means of a root binding groove processing plate (120) having a plurality of root binding groove processing pins (130) on its lower surface, which is moved up and down by a lifting actuator.

[0041] In the above root binding groove processing process (S200), a hot melt penetration injection step (S210) can be performed by forming a hot melt discharge hole (131) in the root binding groove processing pin (130) that processes the root binding hole (31) so that the hot melt can sufficiently penetrate into the root binding hole (31).

[0043] And, the above hot melt application process (S300) is a process of applying hot melt to the adhesive bonding surface located below the bonding process (S400) among the outer surface and inner adhesive bonding surface (22) in which the root bonding hole (31) is formed through the root bonding groove processing process (S200).

[0045] In addition, the bonding process (S400) is a process of bonding another adhesive bonding surface to an adhesive bonding surface to which hot melt has been applied through the hot melt application process (S300).

[0047] Meanwhile, in the implementation of the present invention, a wire brushing process (S110) can be performed to induce binding fluff by rolling with a wire brush (200) on the surface so that the hot melt applied through the hot melt application process (S300) on the outer adhesive bonding surface (21) and inner adhesive bonding surface (22) of the multi-corrugated cardboard (10) before or after the root bonding groove processing process (S200) is impregnated and penetrated onto the surface.

[0049] In addition, in the implementation of the present invention, a folding groove processing process (S120) can be performed to process a folding "V" groove on the inner surface of the folding portion for forming a box of the multi-corrugated cardboard (10) prior to the root binding groove processing process (S200).

[0051] In addition, in the implementation of the present invention, a support belt (11) can be provided that is embedded in the inner side of the outer surface of the multi-corrugated cardboard (10) to increase the durability of the packaging box manufactured continuously in the longitudinal direction.

[0053] The multi-layer corrugated packaging box manufactured through the above-described method is formed of triple corrugated cardboard, and the inner side of one end of the corrugated packaging box is joined to form a root binding box joint.

[0054] The above root binding box coupling part is composed of a root binding hole (31) that penetrates and perforates to the second bone layer in the outer adhesive binding surface (21) and inner adhesive binding surface (22) of the root binding box coupling part, a binding root part (41) formed by hot melt flowing through the root binding hole (31) and spreading toward the bone side to harden, a binding core part (42) that connects the binding root part (41) of the outer adhesive binding surface (21) and inner adhesive binding surface (22) to maintain the binding of the outer adhesive binding surface (21) and inner adhesive binding surface (22), and a binding surface part (50) formed by applying and hardening hot melt on the facing outer adhesive binding surface (21) and inner adhesive binding surface (22).

[0055] Meanwhile, in the implementation of the present invention, a binding fluff (51) formed by wire brushing can be formed on the binding surface portion (50).

[0057] The following describes the effects of the application of the present invention.

[0058] As described above, in a method for manufacturing a multi-corrugated packaging box, the method comprises a root binding groove processing process (S200) in which a root binding hole (31) is formed up to the second corrugated layer portion so that a root binding hole can be formed by penetrating a hot melt into an outer adhesive binding surface (21) formed on the upper surface of one end of the multi-corrugated cardboard (10) and an inner adhesive binding surface (22) formed on the lower surface of the other end for adhesive binding, thereby forming a binding root; a hot melt application process (S300) in which a hot melt is applied to the adhesive binding surface located below the bonding process (S400) among the outer surface and the inner adhesive binding surface (22) in which the root binding hole (31) is formed through the root binding groove processing process (S200); and a bonding process (S400) in which another adhesive binding surface is joined to the adhesive binding surface to which the hot melt is applied through the hot melt application process (S300). When the invention is applied and implemented, the bonding surface of the multi-layer corrugated packaging box made of triple or more multi-layer corrugated cardboard (10) is firmly formed.

[0059] In addition, the bonding surface of the multi-corrugated packaging box is not made of metal that causes static electricity or scratching, but is formed with hot melt, thereby preventing electrical damage and external damage to the packaging product packaged according to the present invention. Explanation of the symbols

[0061] 10 : Multi-layer corrugated cardboard 11 : Support belt 21: Outer adhesive bonding surface 22: Inner adhesive bonding surface 31 : Root binding hole 41: Binding root section 42: Binding core section 50 : Binding surface 51 : Binding fluff 110: Root binding groove processing roller 120: Root binding groove processing plate 130 : Root binding groove processing pin 131 : Hot melt discharge hole 200 : Wire brush S110: Wire brushing process S120: Bending groove processing process S200: Root binding groove processing process S210: Hot melt penetration injection step S300: Hot melt application process S400: Bonding process

Claims

Claim 1 A method for manufacturing a multi-corrugated packaging box comprises a root binding groove processing process (S200), a hot melt application process (S300), and a bonding process (S400). The root binding groove processing process (S200) is a process of forming a root binding hole (31) up to the second corrugated layer portion so that a hot melt can penetrate the outer adhesive binding surface (21) formed on the upper surface of one end of the multi-corrugated cardboard (10) and the inner adhesive binding surface (22) formed on the lower surface of the other end for adhesive binding, thereby forming a binding root; the root binding groove processing process (S200) is a process of processing the root binding hole (31) by rolling a root binding groove processing roller (110), which has a root binding groove processing pin (130) formed on the outer surface, onto the multi-corrugated cardboard (10), or is performed by a lifting actuator and on the lower surface The process is configured to process root binding holes (31) in a multi-corrugated cardboard (10) by means of a root binding groove processing plate (120) having a plurality of root binding groove processing pins (130); a hot melt penetration injection step (S210) is performed in which a hot melt discharge hole (131) is formed in the root binding groove processing pin (130) processing the root binding hole (31) so that the hot melt can sufficiently penetrate into the root binding hole (31); the hot melt application process (S300) is configured to apply hot melt to the adhesive binding surface located below the bonding process (S400) among the outer surface and the inner adhesive binding surface (22) in which the root binding hole (31) is formed through the root binding groove processing process (S200); The above bonding process (S400) is a process of bonding another adhesive bonding surface facing the adhesive bonding surface to which hot melt has been applied through the hot melt application process (S300); and a wire brushing process (S110) is performed before or after the root bonding groove processing process (S200) to induce bonding fluff by rolling the surface with a wire brush (200) so that the hot melt applied through the hot melt application process (S300) on the outer adhesive bonding surface (21) and inner adhesive bonding surface (22) of the multi-corrugated cardboard (10) is impregnated and penetrated onto the surface.A method for manufacturing a hot melt root-bonded multi-corrugated cardboard packaging box, characterized by performing a folding groove processing process (S120) to process a folding "V" groove on the inner side of the folding portion for forming a box of the multi-corrugated cardboard (10) prior to the root-bonding groove processing process (S200); and providing a support belt (11) embedded in the inner side of the outer surface of the multi-corrugated cardboard (10) to increase the durability of the packaging box manufactured continuously in the longitudinal direction. Claim 2 delete Claim 3 delete Claim 4 delete

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