Heat treatment apparatus

Abstract

A heat treatment apparatus according to one embodiment of the present invention comprises: a process tube in which a heat treatment process is performed internally; a door disposed on one side of the process tube to open and close the process tube; a heater disposed on the outside of the process tube, spaced apart from the process tube, and heating the process tube; a space disposed between the process tube and the heater; and a flow path disposed on the process tube within the space and provided with a refrigerant inside.

Description

Technology Field

[0001] Embodiments of the present invention relate to a heat treatment apparatus comprising a process tube in which a diffusion gas is injected internally in a heat treatment process for a silicon wafer. Background Technology

[0002] The heat treatment apparatus of the present invention may include a heat treatment chamber. The heat treatment chamber is for heat-treating a silicon wafer at a high temperature and includes a process tube in which the heat treatment process is performed, and a door for opening and closing one or both ends of the process tube.

[0003] At this time, when maintaining the heat treatment chamber after the heat treatment process, the chamber must be cooled from a high temperature to a low temperature; however, if natural cooling is used, the slow cooling rate causes a problem where the maintenance time becomes prolonged. The problem to be solved

[0004] The problem to be solved by the present invention is to provide a heat treatment device capable of improving the cooling speed of a heat treatment chamber during maintenance of the heat treatment chamber.

[0005] However, these problems are exemplary, and the problems to be solved by the present invention are not limited thereto. means of solving the problem

[0006] A heat treatment apparatus according to one embodiment of the present invention comprises: a process tube in which a heat treatment process is performed internally; a door disposed on one side of the process tube to open and close the process tube; a heater disposed on the outside of the process tube, spaced apart from the process tube, and heating the process tube; a space disposed between the process tube and the heater; and a flow path disposed on the process tube within the space and provided with a refrigerant inside.

[0007] The above-mentioned flow path is formed as a spiral pipe structure to wrap around the process tube, and the height of the space portion may be greater than the thickness of the flow path.

[0008] The above-mentioned flow path may include an inlet connected to one end of the flow path and supplying the refrigerant to the flow path; and an outlet connected to the other end opposite to the one end of the flow path and discharging the refrigerant that has flowed through the flow path.

[0009] The process tube includes first to third regions arranged sequentially toward the door, the inlet includes first to third inlets arranged in regions corresponding to the first to third regions, and the outlet includes first to third outlets arranged in regions corresponding to the first to third regions, and the first gap between the first inlet and the first outlet, the second gap between the second inlet and the second outlet, and the third gap between the third inlet and the third outlet can be increased sequentially.

[0010] The above-mentioned flow path includes a plurality of holes penetrating the inside and outside of the flow path, and the holes may be adjacent to the process tube than the heater.

[0011] The above plurality of holes may face the process tube.

[0012] Based on the above door, the diameter of the hole may increase as it moves further away from the above door.

[0013] The above-mentioned flow path is positioned outside the heater and penetrating the heater, and the end of the flow path may face the process tube and be spaced apart from the process tube.

[0014] The above-mentioned flow paths are provided in multiple numbers, and the multiple flow paths may be spaced apart from each other in the extension direction of the process tube.

[0015] The process tube includes first to third regions arranged sequentially toward the door, and the flow path includes a plurality of first to third flow paths arranged in regions corresponding to the first to third regions, and the first gap between two adjacent first flow paths in the first region, the second gap between two adjacent second flow paths in the second region, and the third gap between two adjacent third flow paths in the third region may increase sequentially.

[0016] The process tube includes first to third regions arranged sequentially toward the door, and after the heat treatment process, the temperature of the process tube may decrease as it moves from the first region to the third region.

[0017] The above refrigerant may include cooling water or air.

[0018] Other aspects, features, and advantages other than those described above will become clear from the specific details, claims, and drawings for implementing the invention below. Effects of the invention

[0019] The heat treatment device according to the embodiments of the present invention can reduce maintenance time by allowing the temperature of the heat treatment chamber to drop rapidly overall by inserting a refrigerant through a flow path into the heater when the heater is turned off and the temperature of the process tube is lowered.

[0020] In addition, the heat treatment device according to the embodiments of the present invention can rapidly control the temperature of the heater through a flow path into which a refrigerant is inserted, thereby enabling the heat treatment process to be performed at various temperature ranges.

[0021] The effects of the present invention are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art from the description in the claims. Brief explanation of the drawing

[0022] FIG. 1 is a perspective view showing a heat treatment apparatus according to one embodiment of the present invention. Figure 2 is a drawing showing the heater removed from Figure 1. Figure 3 is a cross-section of AA in Figure 1. FIG. 4 is a perspective view showing a heat treatment apparatus according to another embodiment of the present invention. Figure 5 is a drawing showing the heater removed from Figure 4. Figure 6 is a cross-section of the BB in Figure 4. FIG. 7 is a cross-sectional view of FIG. 4 showing the longitudinal ends of a heat treatment device according to the present embodiment. Figure 8 is an enlarged view of section D of Figure 5. FIG. 9 is a drawing comparing the sizes of holes according to the present embodiment. FIG. 10 is a drawing showing a heat treatment device according to the present embodiment having a plurality of regions formed and an inlet and an outlet arranged for each region. FIG. 11 is a perspective view showing a heat treatment apparatus according to another embodiment of the present invention. FIG. 12 is a perspective view showing a heat treatment apparatus according to another embodiment of the present invention. Fig. 13 is a cross-section of the EE of Fig. 12. FIG. 14 is a drawing showing a heat treatment device according to the present embodiment in which a plurality of regions are formed and an inlet and an outlet are arranged for each region. Specific details for implementing the invention

[0023] The present invention is capable of various modifications and may have various embodiments; specific embodiments are illustrated in the drawings and described in detail in the description of the invention. However, this is not intended to limit the present invention to specific embodiments, and it should be understood that the invention includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the invention. In describing the present invention, the same identification numerals are used for identical components, even if they are illustrated in different embodiments.

[0024] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. When describing with reference to the drawings, identical or corresponding components are given the same reference numerals, and redundant descriptions thereof will be omitted.

[0025] In the following embodiments, terms such as first, second, etc. are used not in a limiting sense, but for the purpose of distinguishing one component from another component.

[0026] In the following examples, singular expressions include plural expressions unless the context clearly indicates otherwise.

[0027] In the following embodiments, terms such as "include" or "have" mean that the features or components described in the specification are present, and do not preclude the possibility that one or more other features or components may be added.

[0028] In the drawings, the size of components may be exaggerated or reduced for convenience of explanation. For example, the size and thickness of each component shown in the drawings are depicted arbitrarily for convenience of explanation, so the present invention is not necessarily limited to what is illustrated.

[0029] Where an embodiment can be implemented differently, a specific process sequence may be performed differently from the order described. For example, two processes described consecutively may be performed substantially simultaneously or proceed in the reverse order of the description.

[0030] The terms used in this application are used merely to describe specific embodiments and are not intended to limit the invention. In this application, terms such as “comprising” or “having” are intended to indicate the presence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0031] Hereinafter, a heat treatment apparatus according to an embodiment of the present invention will be described with reference to FIGS. 1 to 3.

[0032] FIG. 1 is a perspective view showing a heat treatment apparatus according to an embodiment of the present invention. FIG. 2 is a drawing showing FIG. 1 with the heater removed. FIG. 3 is a cross-sectional view of FIG. 1.

[0033] Referring to FIGS. 1 to 3, a heat treatment device according to one embodiment of the present invention comprises a process tube (110) in which a heat treatment process is performed internally, a door (101) disposed on one side of the process tube to open and close the process tube, a heater (120) that heats the process tube from the outside of the process tube, a space (130) disposed between the process tube and the heater, and a flow path (140) disposed on the process tube (110) within the space (130) and provided with a refrigerant inside.

[0034] The process tube (110) is formed in the shape of a cylindrical tube, and inside the process tube (110), a diffusion gas is sprayed onto a silicon wafer and a heat treatment process can be carried out.

[0035] One side and / or the other side of the process tube (110) can be opened and closed by a door (101), and in the open state, a wafer can be moved in and out of the process tube (110), and in the closed state, a heat treatment process can be performed inside a heat treatment chamber (100) that accommodates the wafer. A reaction gas supply unit (160) is disposed in the internal space (150) of the process tube (10), so that a reaction gas required for heat treatment can be injected through the reaction gas supply unit (160). According to the present embodiment, three reaction gas supply units (160) are disposed, but are not limited thereto, and at least one reaction gas supply unit may be disposed inside the process tube (10). The number of reaction gas supply units may be provided in multiple numbers depending on the length of the process tube and the number of supply materials supplied inside the process tube.

[0036] A wafer requiring doping or other heat treatment can be housed in the process tube (10), and a boat loaded with multiple wafers can be introduced into the process tube (10) to heat-treat multiple wafers simultaneously under the same conditions. Wafer processing is possible by positioning the boat loaded with wafers inside the process tube (10), heating the inside of the process tube (10) with a heater (120) to be described later, and spraying an atmosphere gas through a nozzle.

[0037] A process tube (110) may be arranged to surround the process tube, and a heater (120) that generates heat using electricity may be arranged. The heater (120) can heat the process tube (110) during the heat treatment process.

[0038] According to the present embodiment, as shown in FIG. 3, a space (130) may be disposed between the process tube (110) and the heater (120). The space (130) may be disposed along the circumference of the process tube (110). Thus, heat generated from the heater (120) can be transferred to the process tube (110) through the space (130).

[0039] According to the present embodiment, a flow path (140) through which a refrigerant flows may be formed inside the space portion (130). The flow path (140) is positioned inside the space portion (130), and the temperature of the heat generated in the heater (120) may be lowered by the refrigerant flowing inside the flow path (140).

[0040] In order to turn off the heater (120) and proceed with maintenance work on the heat treatment chamber (100), it is necessary to cool the temperature of the heat treatment chamber (100). At this time, if the heat treatment chamber (100) is cooled naturally only with the heater of the heat treatment chamber (100) turned off, the cooling speed of the heat treatment chamber (100) may be significantly slow. Accordingly, according to the present embodiment, heat generated from the heater (120) and the process tube (110) can be cooled quickly through the space (130) placed between the heater (120) and the process tube (110). In addition, heat generated from the heater (120) and the process tube (110) can be cooled even faster through the flow path (140) placed in the space (130) through which a refrigerant flows.

[0041] In this way, the temperature of the heat treatment chamber (100) can be rapidly lowered through the space (130) disposed between the heater (120) and the process tube (110) and the flow path (140) disposed in the space (130) through which a refrigerant flows, thereby shortening the time required for maintenance of the heat treatment chamber (100) and improving the productivity of the wafer heat treatment process.

[0042] In addition, by controlling the amount and / or temperature of the refrigerant flowing in the flow path (140), the heat generated in the heater (120) and transferred to the process tube (110) can be controlled. Therefore, during the heat treatment process occurring inside the process tube (110), by controlling the refrigerant flowing in the flow path (140), the heat treatment process can be carried out by setting conditions that may vary depending on the type of wafer, that is, a temperature range suitable for the type of wafer, thereby allowing the heat treatment process to be carried out more effectively according to the conditions.

[0043] According to the present embodiment, the flow path (140) may be formed as a spiral pipe structure to surround the process tube (110). Through this, the refrigerant in the flow path can flow evenly along the outer surface of the process tube (110), thereby allowing the temperature of the process tube (110) to be lowered uniformly.

[0044] According to the present embodiment, the flow path (140) is connected to at least one inlet (141), and the inlet (141) can be connected to the flow path (140) by penetrating the heater (120) from the outside of the heater (120). The inlet (141) is connected to one end of the flow path (140) and can supply refrigerant to the flow path (140).

[0045] According to the present embodiment, the flow path (140) is connected to at least one outlet (142), and the outlet (142) may be connected to the flow path (140) by penetrating the heater (120) from the outside of the heater (120). The outlet (142) is connected to the other end opposite to one end of the flow path (140) and can discharge the refrigerant that has flowed through the flow path (140).

[0046] The temperature of the refrigerant discharged through the outlet (142) at the inlet (141) and outlet (142), respectively connected to both ends of a single flow path (140), may be higher than the temperature of the refrigerant supplied through the inlet (141). As a result, the inlet (141) and outlet (142) may be positioned at a set location. Specifically, the temperature of the process tube (110) may be higher as it moves further away from the door (101). Therefore, the inlet (141) connected to one end of the single flow path (140) may be positioned further from the door (101) than the outlet (142) connected to the end.

[0047] In this embodiment, an inlet (141) and an outlet (142) are each arranged as one, but this is not limited thereto, and the number of inlets (141) and outlets (142) can be formed as multiple. That is, if there are multiple routes through which the refrigerant is supplied, the refrigerant can easily fill and flow within the flow path, thereby allowing the heat generated in the process tube (110) and heater (120) to be lowered more quickly.

[0048] The refrigerant in this embodiment may be process cooling water. The cooling water may be supplied to the flow path (140) through the inlet (141) and circulate along the flow path. The cooling water flowing inside the flow path (140) may absorb heat generated from the process tube (110) and the heater (120), thereby becoming a liquid at a higher temperature than at the time of supply. In this way, as the cooling water supplied to the heat treatment chamber (100) flows through the flow path (140) and absorbs heat generated in the heat treatment chamber (100) and exits the heat treatment chamber (100), the temperature of the heat treatment chamber (100) can be rapidly lowered.

[0049] According to the present embodiment, the height (h) of the space portion (130) may be greater than the thickness (t) of the flow path (140). This allows the flow path (140) to be accommodated inside the space portion (130).

[0050] According to the present embodiment, the height (h) of the space portion (130) may be 5 mm to 20 mm. If the height of the space portion (130) is less than 5 mm, it may be difficult to insert the flow path (140) within the space portion (130) while having a sufficient cross-sectional area for the flow of refrigerant. Also, if the height of the space portion (130) is greater than 20 mm, the distance between the heater (120) and the process tube (110) increases, making it difficult for heat generated from the heater (120) to be transferred to the process tube (110) during the heat treatment process of the heat treatment chamber (100).

[0051] Hereinafter, a heat treatment apparatus according to another embodiment of the present invention will be described with reference to FIGS. 4 to 9. For contents not shown in FIGS. 4 to 9 and descriptions thereof, refer to FIGS. 1 to 3 and descriptions thereof.

[0052] FIG. 4 is a perspective view showing a heat treatment apparatus according to another embodiment of the present invention. FIG. 5 is a drawing showing FIG. 4 with the heater removed. FIG. 6 is a cross-section of BB of FIG. 4. FIG. 7 is a cross-section of CC of FIG. 4 showing both longitudinal ends of the heat treatment apparatus according to the present embodiment. FIG. 8 is an enlarged view of section D of FIG. 5. FIG. 9 is a drawing comparing the sizes of holes according to the present embodiment.

[0053] Referring to FIGS. 4 to 9, another heat treatment device of another embodiment of the present invention includes a process tube (110) in which a heat treatment process is performed internally, a door (101) disposed on one side of the process tube to open and close the process tube, a heater (120) to heat the process tube, and a space (130) disposed between the process tube and the heater, wherein a flow path (140) through which a refrigerant flows is formed in the space, and the flow path is formed in a spiral pipe structure to surround the process tube.

[0054] The process tube (110) is formed in the shape of a cylindrical tube, and inside the process tube (110), a diffusion gas is sprayed onto a silicon wafer and a heat treatment process can be carried out.

[0055] One side and / or the other side of the process tube (110) can be opened and closed by a door (101), and a wafer can be moved in and out of the process tube (110) in the open state, and a heat treatment process can be carried out inside a heat treatment chamber (100) that accommodates the wafer in the closed state.

[0056] A reaction gas supply unit (160) is disposed in the internal space (150) of the process tube (10), so that a reaction gas required for heat treatment can be injected through the reaction gas supply unit (160). According to the present embodiment, three reaction gas supply units (160) are disposed, but are not limited thereto, and at least one reaction gas supply unit may be disposed inside the process tube (10). The number of reaction gas supply units may be provided in multiple numbers depending on the length of the process tube and the number of supply materials supplied inside the process tube.

[0057] A wafer requiring doping or other heat treatment can be housed in the process tube (10), and a boat loaded with multiple wafers can be introduced into the process tube (10) to heat-treat multiple wafers simultaneously under the same conditions. Wafer processing is possible by positioning the boat loaded with wafers inside the process tube (10), heating the inside of the process tube (10) with a heater (120) to be described later, and spraying an atmosphere gas through a nozzle.

[0058] A process tube (110) may be arranged to surround the process tube, and a heater (120) that generates heat using electricity may be arranged. The heater (120) can heat the process tube (110) during the heat treatment process.

[0059] According to the present embodiment, as shown in FIG. 6, a space (130) may be disposed between the process tube (110) and the heater (120). The space (130) may be disposed along the circumference of the process tube (110). Thus, heat generated from the heater (120) can be transferred to the process tube (110) through the space (130).

[0060] According to the present embodiment, a flow path (140) through which a refrigerant flows may be formed inside the space portion (130). The flow path (140) is positioned inside the space portion (130), and the temperature of the heat generated in the heater (120) may be lowered by the refrigerant flowing inside the flow path (140).

[0061] In order to turn off the heater (120) and proceed with maintenance work on the heat treatment chamber (100), it is necessary to cool the temperature of the heat treatment chamber (100). At this time, if the heat treatment chamber (100) is cooled naturally only with the heater (120) of the heat treatment chamber (100) turned off, the cooling speed of the heat treatment chamber (100) may be significantly slow. Accordingly, according to the present embodiment, heat generated from the heater (120) and the process tube (110) can be cooled quickly through the space (130) placed between the heater (120) and the process tube (110). In addition, heat generated from the heater (120) and the process tube (110) can be cooled even faster through the flow path (140) placed in the space (130) through which a refrigerant flows.

[0062] In this way, the temperature of the heat treatment chamber (100) can be rapidly lowered through the space (130) disposed between the heater (120) and the process tube (110) and the flow path (140) disposed in the space (130) through which a refrigerant flows, thereby shortening the time required for maintenance of the heat treatment chamber (100) and improving the productivity of the wafer heat treatment process.

[0063] In addition, by controlling the amount and / or temperature of the refrigerant flowing in the flow path (140), the heat generated in the heater (120) and transferred to the process tube (110) can be controlled. Therefore, during the heat treatment process occurring inside the process tube (110), by controlling the refrigerant flowing in the flow path (140), the heat treatment process can be carried out by setting conditions that may vary depending on the type of wafer, that is, a temperature range suitable for the type of wafer, thereby allowing the heat treatment process to be carried out more effectively according to the conditions.

[0064] According to the present embodiment, the flow path (140) may be formed as a spiral pipe structure to surround the process tube (110). Through this, the refrigerant in the flow path can flow evenly along the outer surface of the process tube (110), thereby allowing the temperature of the process tube (110) to be lowered uniformly.

[0065] According to the present embodiment, the flow path (140) is connected to at least one inlet (141'), and the inlet (141') can be connected to the flow path (140) by penetrating the heater (120) from the outside of the heater (120). Refrigerant can be supplied to the flow path (140) through the inlet (141').

[0066] According to the present embodiment, inlets (141') may be disposed at each end of the flow path (140). If an inlet is formed only at one end of the flow path, the pressure of the air supplied to the other end of the flow path where no inlet is formed is lowered, and the cooling performance at the other end of the flow path where no inlet is formed may be reduced. Accordingly, according to the present embodiment, by installing inlets (141') at each end of the flow path (140) and introducing air from both ends of the flow path (140), the air supplied to the flow path (140) can be supplied while converging on the middle part of the flow path (140), thereby maintaining the overall air pressure inside the flow path (140) and ensuring cooling performance.

[0067] Referring to the drawing, the inlets (141') are formed as two, but the number of inlets is not limited to this, and multiple inlets may be arranged. That is, if there are multiple routes through which the refrigerant is supplied, the refrigerant can easily fill and flow within the flow path, so the heat generated in the process tube (110) and heater (120) can be lowered more quickly.

[0068] According to the present embodiment, a plurality of holes (140a) are formed in the flow path (140), and a refrigerant within the flow path (140) can be injected into the space (130) through the holes (140a). The refrigerant injected through the space (130) remains inside the space (130) and absorbs heat generated from the process tube (110) and the heater (120), thereby lowering the temperature of the process tube (110) and the heater (120).

[0069] According to the present embodiment, the refrigerant may be air. The air may be supplied to the flow path (140) through the inlet (141') and circulate along the flow path. Additionally, it may be injected into the space (130) through a plurality of holes (140a) formed in the flow path (140). The air injected into the space (130) may absorb heat generated from the process tube (110) and the heater (120) and become air at a higher temperature than at the time of supply.

[0070] Referring to FIG. 7, high-temperature air is formed between the heater (120) and the process tube (110) located in the part adjacent to the door (101) and can exit to the outside of the heat treatment chamber (100) through a first discharge passage (PA1) connected to a space (130) and / or a second discharge passage (PA2) connected to a space (130) between the heater (120) and the process tube (110) located on the opposite side of the door (101). In this way, the air supplied to the heat treatment chamber (100) absorbs the heat generated in the heat treatment chamber (100) and exits the heat treatment chamber (100), thereby rapidly lowering the temperature of the heat treatment chamber (100).

[0071] According to the present embodiment, the height (h) of the space portion (130) may be greater than the thickness (t) of the flow path. That is, the space portion (130) may have a larger volume than the volume occupied by the flow path so that the refrigerant sprayed from the flow path (140) can be filled inside the space portion (130). At this time, the thickness (t) of the flow path may be formed to be 30 percent to 50 percent of the height (h) of the space portion (130). If the thickness (t) of the flow path is less than 30 percent of the height (h) of the space portion (130), the amount of refrigerant flowing inside the flow path decreases, and the cooling performance of the heat treatment chamber (100) may be reduced. In addition, if the thickness (t) of the channel is 50 percent or more of the height (h) of the space (130), the channel (140) takes up a large volume inside the space (130), making it difficult to accommodate the refrigerant sprayed from the channel (140), and the refrigerant may escape outside the heat treatment chamber (100) before absorbing heat, which may reduce the cooling efficiency of the refrigerant.

[0072] According to the present embodiment, the height of the space portion (130) may be 5 mm to 20 mm. If the height of the space portion (130) is less than 5 mm, it may be difficult to insert the flow path (140) within the space portion (130) while having a sufficient cross-sectional area for the flow of refrigerant. Also, if the height of the space portion (130) is greater than 20 mm, the distance between the heater (120) and the process tube (110) increases, making it difficult for heat generated from the heater (120) to be transferred to the process tube (110) during the heat treatment process of the heat treatment chamber (100).

[0073] In addition, according to the present embodiment, the diameter of the hole (140a) may be 0.5 mm to 2 mm. If the diameter of the hole (140a) is less than 0.5 mm, the amount of air injected into the space (130) is reduced, making it difficult to secure cooling performance. In addition, if the diameter of the hole (140a) is greater than 2 mm, the injection pressure when air is injected into the space (130) becomes too low, causing the pressure of the air injected locally to be concentrated only in a specific part of the space (130), making it difficult for the air to be distributed uniformly in the space (130).

[0074] Referring to FIG. 8, the flow path (140) may include a plurality of holes (140a) penetrating the inside and outside of the flow path. In this case, the plurality of holes (140a) may be adjacent to the process tube (110) rather than the heater (120). Additionally, the plurality of holes (140a) may face the process tube (110). By doing so, air is blown in the direction in which the process tube (110) is located, thereby further improving the cooling performance of the process tube (110).

[0075] Referring to FIG. 9, the diameter of a plurality of holes (140a) can increase as they move further away from the door (101). That is, in FIG. 9, the diameter (d2) of a hole (140a2) that is relatively far from the door (101) can be larger than the diameter (d1) of a hole (140a1) that is relatively close to the door (101). At this time, the door (101) can be positioned only on one side of the process tube (110).

[0076] The temperature of the process tube (110) may be higher as it moves further away from the door (101). This is because, in the case of the door (101), when a wafer is moved in and out of the process tube (110), the door (101) remains open, so the temperature of the space adjacent to the door (101) is affected by the outside air and can remain lower than the temperature of the space far from the door (101).

[0077] According to the present embodiment, in a plurality of holes (140a) of the Euro (140), the diameter of the holes is arranged to gradually increase as they move further away from the door (101), thereby increasing the supply amount and supply pressure of air supplied to the space (130) as they move further away from the door (101). Through this, the cooling performance of the part far from the door (101) can be further improved, allowing the temperature of the heat treatment chamber (100) to be lowered uniformly throughout.

[0078] Hereinafter, a heat treatment apparatus according to other embodiments of the present invention will be described with reference to FIGS. 10 and 11. For contents not shown in FIGS. 10 and 11 and descriptions thereof, refer to FIGS. 1 to 9 and descriptions thereof.

[0079] Referring to FIG. 10, the process tube (110) may include a plurality of regions (A1, A2, A3). In this case, the plurality of regions (A1, A2, A3) may be cooled independently. Although the present embodiment was described based on three regions, the number and size of the regions may be set differently depending on the heat treatment process.

[0080] According to the present embodiment, the temperatures of a plurality of regions (A1, A2, A3) may be lower as they move toward the door (101). That is, the temperature of the third region (A3) may be lower than the temperature of the second region (A2), and the temperature of the second region (A2) may be lower than the temperature of the first region (A1). This is because, in the case of the door (101), when a wafer is moved in and out of the process tube (110), the door (101) is kept in an open state, so the temperature of the space adjacent to the door (101) is affected by the outside air and can be maintained at a lower temperature than the space far from the door (101).

[0081] Here, separate flow paths can be arranged for each area. That is, a first flow path (140a) can be arranged in the first area (A1), a second flow path (140b) in the second area (A2), and a third flow path (140c) in the third area (A3). This allows for separate cooling control for each area.

[0082] For example, separate inlets and outlets may be provided for each of the fluid paths in each area. In this case, the refrigerant supplied to the fluid paths may be cooling water. In this case, the number of inlets and outlets may increase as the area is further from the door (101). Also, the spacing between inlets and outlets may become more dense as the area is further from the door (101). By increasing the number of inlets and outlets in the area far from the door (101) to further improve the cooling performance in the area far from the door (101), the supply amount and supply pressure of the cooling water supplied and discharged through the inlets and outlets may increase as the distance from the door (101), thereby allowing the temperature of the heat treatment chamber (100) to be lowered uniformly throughout.

[0083] More specifically, in the third area (A3), a third inlet (1413) and a third outlet (1423) may be arranged with a third gap (w3). In the second area (A2), more second inlets (1412a, 1412b) and second outlets (1422a, 1422b) than in the third area (A3) may be arranged, and adjacent inlets and outlets among the second inlets and second outlets may be arranged with a second gap (w2). In the first area (A1), a plurality of first inlets (1411a, 1411b, 1411c, 1411d) and a plurality of first outlets (1421a, 1421b, 1421c, 1421d) corresponding to each of these are arranged, which is greater than in the second area (A2), and adjacent inlets and outlets among the first inlets and first outlets may be arranged with a first gap (w1). At this time, the first gap (w1), the second gap (w2), and the third gap (w3) may increase sequentially. That is, by forming the number and spacing of inlets and outlets capable of supplying and discharging cooling water to separate channels in each area more densely as they get further away from the door, the supply volume and supply pressure of the cooling water supplied and discharged through the inlets and outlets can be increased as they get further away from the door (101), thereby allowing the temperature of the heat treatment chamber (100) to be lowered uniformly throughout.

[0084] At this time, the number of inlets and outlets arranged in the first area (A1), the second area (A2), and the third area (A3) may be arranged in various ways, unlike the present embodiment, provided that the number of inlets and outlets arranged in the third area (A3) may be greater than the number of inlets and outlets arranged in the second area (A2), and the number of inlets and outlets arranged in the second area (A2) needs to be greater than the number of inlets and outlets arranged in the first area (A1).

[0085] As another example, separate inlets may be provided for each of the passages arranged in each area. In this case, multiple holes (140a) may be formed in the passages (140a, 140b, 140c), and the refrigerant supplied to the passages may be air. In this case, the number of inlets may increase as the area is further from the door (101). Also, the spacing between inlets may become denser as the area is further from the door (101). By increasing the number of inlets in the area far from the door (101) in order to further improve the cooling performance of the area far from the door (101), the supply amount and supply pressure of the air supplied and discharged through the inlets may increase as it gets further from the door (101), thereby allowing the temperature of the heat treatment chamber (100) to be lowered uniformly throughout.

[0086] More specifically, in the third area (A3), third inlets (1413, 1413') may be arranged with a third gap (w3) between them. In the second area (A2), more second inlets (1412a, 1412a', 1412b, 1412b') than in the third area (A3) may be arranged, and two adjacent inlets among the second inlets may be arranged with a second gap (w2). In the first area (A1), more first inlets (1411a, 1411a', 1411b, 1411b', 1411c, 1411c', 1411d, 1411d') than in the second area (A2) may be arranged, and two adjacent inlets among the first inlets may be arranged with a first gap (w1). At this time, the first gap (w1), the second gap (w2), and the third gap (w3) can be increased sequentially. That is, by forming the number and spacing of inlets capable of supplying air to separate channels in each area more densely as they move further away from the door, the supply amount and supply pressure of the refrigerant supplied and discharged through the inlets can be increased as they move further away from the door (101), thereby allowing the temperature of the heat treatment chamber (100) to be lowered uniformly throughout.

[0087] At this time, the number of inlets placed in the first area (A1), the second area (A2), and the third area (A3) may be arranged in various ways, unlike the present embodiment, provided that the number of inlets placed in the third area (A3) may be greater than the number of inlets placed in the second area (A2), and the number of inlets placed in the second area (A2) needs to be greater than the number of inlets placed in the first area (A1).

[0088] Referring to FIG. 11, the pitch spacing (P) may decrease as the area further away from the door (101) is relative to the door (101). That is, the third pitch spacing (P3) of the flow path (140c') in the third area (A3) constituting the flow path (140') may be greater than the second pitch spacing (P2) of the flow path (140b') in the second area (A2). Also, the first pitch spacing (P1) of the flow path (140a') in the first area (A1) may be greater than the second pitch spacing (P2) of the flow path (140b') in the second area (A2). At this time, the door (101) may be based on a state in which it is placed only on one side of the process tube (110).

[0089] The temperature of the process tube (110) may be higher as it moves further away from the door (101). This is because, in the case of the door (101), when a wafer is moved in and out of the process tube (110), the door (101) remains open, so the temperature of the space adjacent to the door (101) is affected by the outside air and can remain lower than the temperature of the space far from the door (101).

[0090] According to the present embodiment, the flow path (140) is arranged such that the pitch spacing (P) gradually decreases as it moves further away from the door (101), thereby increasing the density of the flow paths as it moves further away from the door. That is, by increasing the volume occupied by the flow paths per unit volume of the process tube (110) as it moves further away from the door, the cooling performance of the part far from the door (101) is further improved, allowing the temperature of the heat treatment chamber (100) to be lowered uniformly.

[0091] Hereinafter, a heat treatment apparatus according to another embodiment of the present invention will be described with reference to FIGS. 12 to 14. For contents not shown in FIGS. 12 to 14 and descriptions thereof, reference may be made to contents shown in FIGS. 1 to 11 and descriptions thereof.

[0092] FIG. 12 is a perspective view showing a heat treatment apparatus according to another embodiment of the present invention. FIG. 13 is a cross-sectional view of FIG. 12. FIG. 14 is a drawing showing a heat treatment apparatus according to the present embodiment having a plurality of regions formed and an inlet and an outlet arranged for each region.

[0093] Referring to FIGS. 12 to 14, in a heat treatment apparatus according to another embodiment of the present invention, a flow path (140'') is disposed outside the heater (120) and penetrates the heater (120), and the end of the flow path (140'') faces the process tube (110) and may be spaced apart from the process tube (110). That is, the flow path (140'') may be provided in multiple numbers, and the multiple flow paths (140'') may be disposed spaced apart from each other in the extension direction of the process tube (110).

[0094] In this embodiment, there is no flow path that is arranged inside the space section (130) and wraps around the process tube in a spiral shape. However, the flow path (140'') is formed to be connected to the inside of the space section (130) so that air can be injected into the space section (130). At this time, the end injection section of the flow path (140'') is arranged in a direction perpendicular to the tangent of the process tube (110), so that the air injected through the flow path (140'') can be injected into the process tube (110) in a direction perpendicular to the tangent of the process tube (110).

[0095] At this time, the air injected can exit to the outside of the heat treatment chamber (100) through a first discharge passage (PA1) formed between a heater (120) located in a part adjacent to the door (101) and a process tube (110) and / or a second discharge passage (PA2) between a heater (120) and a process tube (110) located on the opposite side of the door (101), referring to FIG. 7.

[0096] Referring to FIG. 14, the process tube (110) may include a plurality of regions (A1, A2, A3). In this case, the plurality of regions (A1, A2, A3) may be cooled independently. Although the present embodiment was described based on three regions, the number and size of the regions may be set differently depending on the heat treatment process.

[0097] According to the present embodiment, the temperatures of a plurality of regions (A1, A2, A3) may be lower as they move toward the door (101). That is, the temperature of the third region (A3) may be lower than the temperature of the second region (A2), and the temperature of the second region (A2) may be lower than the temperature of the first region (A1). This is because, in the case of the door (101), when a wafer is moved in and out of the process tube (110), the door (101) is kept in an open state, so the temperature of the space adjacent to the door (101) is affected by the outside air and can be maintained at a lower temperature than the space far from the door (101).

[0098] Here, separate flow paths can be arranged for each area. That is, a first flow path (140a'') can be arranged in the first area (A1), a second flow path (140b'') in the second area (A2), and a third flow path (140c'') in the third area (A3). This allows for separate cooling control for each area.

[0099] At this time, the refrigerant supplied to the passages may be air. Here, the number of passages may increase as the area is further from the door (101). Also, the spacing between the passages may become denser as the area is further from the door (101). By increasing the number and density of passages in the area far from the door (101) in order to further improve the cooling performance in the area far from the door (101), the supply amount and supply pressure of the air supplied and discharged through the passages may increase as the distance from the door (101), thereby allowing the temperature of the heat treatment chamber (100) to be lowered uniformly throughout.

[0100] More specifically, in the third area (A3), a third flow path (140c'') may be arranged with a third gap (w3'). In the second area (A2), more second flow paths (140b'') than in the third area (A3) may be arranged, and two adjacent flow paths among the second flow paths may be arranged with a second gap (w2'). In the first area (A1), more first flow paths (140c) than in the second area (A2) may be arranged, and two adjacent flow paths among the first flow paths may be arranged with a first gap (w1'). At this time, the first gap (w1'), the second gap (w2'), and the third gap (w3') may increase sequentially. That is, by forming the number and spacing of inlets capable of supplying air to separate Euros in each area more densely as they get further away from the door, the supply amount and supply pressure of the cooling water supplied and discharged through the inlets can be increased as they get further away from the door (101), thereby allowing the temperature of the heat treatment chamber (100) to be lowered uniformly throughout.

[0101] At this time, the number of inlets placed in the first area (A1), the second area (A2), and the third area (A3) may be arranged in various ways, unlike the present embodiment, provided that the number of inlets placed in the third area (A3) may be greater than the number of inlets placed in the second area (A2), and the number of inlets placed in the second area (A2) needs to be greater than the number of inlets placed in the first area (A1).

[0102] Although the present invention has been described with reference to the embodiments illustrated in the drawings, this is merely illustrative. Those skilled in the art will fully understand that various modifications and equivalent alternative embodiments are possible from the embodiments. Accordingly, the true technical scope of protection of the present invention should be determined based on the appended claims.

[0103] The specific technical details described in the embodiments are merely examples and do not limit the technical scope of the embodiments. To make the description of the invention concise and clear, descriptions of general prior art and configurations may be omitted. Furthermore, the connections of lines or connecting members between components depicted in the drawings are illustrative of functional connections and / or physical or circuit connections, and may be replaced or represented by various additional functional, physical, or circuit connections in actual devices. Additionally, unless specifically stated with terms such as "essential" or "importantly," a component may not be strictly necessary for the application of the present invention.

[0104] The term "the above" or similar designations in the description of the invention and claims may refer to both singular and plural forms unless specifically limited otherwise. Furthermore, where a range is described in the embodiments, it is considered to include the invention with respect to individual values ​​within said range (unless otherwise stated), and is equivalent to describing each individual value constituting said range in the description of the invention. Additionally, regarding the steps constituting the method according to the embodiments, the steps may be performed in a suitable order unless explicitly stated or otherwise stated. The embodiments are not necessarily limited by the order in which the steps are described. The use of all examples or exemplary terms (e.g., etc.) in the embodiments is merely for the purpose of describing the embodiments in detail, and the scope of the embodiments is not limited by said examples or exemplary terms unless otherwise limited by the claims. Furthermore, a person skilled in the art will understand that various modifications, combinations, and changes may be made according to design conditions and factors within the scope of the claims or equivalents to which they are added. Explanation of the symbols

[0105] 100: Heat treatment chamber 101: Door 110: Process tube 120: Heater 130: Space section 140: Euro 140a(140a1, 140a2): hole 141: Inlet 142: Outlet 150: Interior space 160: Reaction gas supply unit PA1, PA2: 1st and 2nd discharge passages h: Height of the space t: Thickness of the Euro P(P1, P2, P3): Pitch interval

Claims

Claim 1 A heat treatment apparatus comprising: a process tube in which a heat treatment process is performed internally; a door disposed on one side of the process tube to open and close the process tube; a heater disposed on the outside of the process tube and spaced apart from the process tube to heat the process tube; a space disposed between the process tube and the heater; and a flow path disposed on the process tube within the space and provided with a refrigerant inside, wherein the flow path is disposed on the outside of the heater and penetrates the heater, and the end of the flow path faces the process tube and is spaced apart from the process tube. Claim 2 delete Claim 3 delete Claim 4 delete Claim 5 delete Claim 6 delete Claim 7 delete Claim 8 delete Claim 9 A heat treatment device according to claim 1, wherein the above-mentioned flow paths are provided in plurality and the plurality of flow paths are spaced apart from each other in the extension direction of the process tube. Claim 10 In claim 9, the process tube comprises first to third regions arranged sequentially toward the door, and the flow path comprises a plurality of first to third flow paths arranged in regions corresponding to the first to third regions, and the heat treatment apparatus wherein the first gap between two adjacent first flow paths in the first region, the second gap between two adjacent second flow paths in the second region, and the third gap between two adjacent third flow paths in the third region increase sequentially. Claim 11 A heat treatment apparatus according to claim 1, wherein the process tube comprises first to third regions arranged sequentially toward the door, and the temperature of the process tube decreases from the first region to the third region after the heat treatment process. Claim 12 In claim 1, the refrigerant is a heat treatment device comprising cooling water or air.

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