Power and Signal Separated E-Fuse Device for High-Current Transmission and Power Distribution System Including the Same
Patent Information
- Application Number
- KR1020260064348
- Authority / Receiving Office
- KR · KR
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2026-04-09
- Publication Date
- 2026-09-01
- Estimated Expiration
- 2046-04-09
Smart Images

Figure 112026043388121-PAT00001_ABST
Abstract
Description
Technology Field
[0001] The present invention relates to power distribution and circuit protection technology, and more specifically, to an electronic fuse device and system that prevents electromagnetic interference (EMI) and minimizes heat generation by physically and mechanically separating the power path and the signal path in an environment handling high currents of 30A or more, such as a power distribution unit (PDU) and an energy storage unit (ESS) of an electric vehicle (EV). Background Technology
[0002] The following description merely provides background information related to the present embodiment and does not constitute prior art.
[0003] Recently, as the amount of power required for industrial automation equipment and high-performance mobility electronic systems has increased rapidly, the role of electronic fuses (E-Fuses) that stably switch large currents of tens of amperes (A) or more and protect the system from overcurrent or short circuits is becoming essential.
[0004] Conventional electronic fuse devices have mainly adopted an integrated connector structure in which a power pin carrying a large current and a signal pin carrying a small current are integrated into a single housing for ease of maintenance and assembly. However, when a large current of 30A or more is applied, this structure generates severe Joule heating due to contact resistance, causing component burnout.
[0005] Furthermore, there was a critical limitation in which strong electromagnetic interference (EMI) and switching noise generated from power lines were induced into adjacent control signal lines, causing false triggering in the control logic. Therefore, there is an urgent need for a new architecture that can perfectly guarantee the integrity of control signals while ensuring mechanical connection stability and heat dissipation efficiency. Prior art literature
[0006] Republic of Korea Published Patent No. 10-2012-0139361 (Published Dec. 27, 2012) The problem to be solved
[0007] The present invention provides an electronic fuse device having a robust power connection structure capable of transmitting a large current of 30A or more without bottlenecks or excessive heat generation by minimizing contact resistance, and a power distribution system including the same.
[0008] In addition, the present invention provides an electronic fuse device that fundamentally blocks distortion of a control signal caused by switching noise by spatially and physically separating a high-current transmission path and a micro-current control signal path, and a power distribution system including the same.
[0009] In addition, the present invention provides an electronic fuse device and a power distribution system including the same, which minimizes power loss and maximizes circuit survivability in extreme electrical environments by optimizing the placement phase of a switching element and a surge protection element.
[0010] The purpose of the present invention is not limited to the purposes mentioned above, and other unmentioned purposes will be clearly understood by those skilled in the art from the description below. means of solving the problem
[0012] As a technical means for achieving the above-mentioned technical problem, an electronic fuse device according to an embodiment of the present invention comprises a substrate portion having a predetermined electrical circuit pattern formed thereon, a power terminal portion connected to a first area of the substrate portion and functioning as a means for introducing and outputting a large current from an external device, a signal transmitting and receiving portion mounted on a second area spaced apart from the power terminal portion by a predetermined distance and transmitting and receiving a control signal, and a control portion mounted in a power path between the power terminal portions to control the conduction state of the large current and process the control signal through the signal transmitting and receiving portion, wherein the power terminal portion and the signal transmitting and receiving portion may be provided as independent structures that are mechanically separated from each other.
[0013] According to an embodiment of the present invention, the power terminal may be composed of one or more of a bracket-shaped terminal in which an external cable or busbar is fixed by a mechanical fastening means, a press-fit terminal in which a plurality of pins are pressed into a substrate, a fusion-type terminal, and an elastic spring clamp terminal.
[0014] According to an embodiment of the present invention, the signal transceiver may be composed of one or more of a multi-pin connector, a pogo-pin connector, a flexible circuit insertion type ZIF connector, and an optical communication interface unit that provides electrical isolation, all of which are mounted on the edge region of the substrate.
[0015] According to an embodiment of the present invention, the control unit is positioned adjacent to the geometric central region between the high-current inflow terminal and the output terminal of the power terminal unit, thereby minimizing the transmission distance of the high-current passing through the copper pattern plane formed on the substrate unit.
[0016] According to an embodiment of the present invention, it may further include a first protection unit disposed at the outermost input end of the power path to suppress a first transient voltage applied from the external device, and a second protection unit disposed at the outermost output end of the power path to suppress a second transient voltage generated by a phenomenon on the load side.
[0017] According to an embodiment of the present invention, the first protection unit and the second protection unit may each be composed of at least one of a transient voltage suppression (TVS) diode, a metal oxide varistor (MOV), a gas discharge tube (GDT), and an active clamping discharge circuit.
[0018] The above substrate may be made of any one of a multilayer FR-4 substrate, a metal core substrate (MCPCB), a ceramic substrate, and a rigid-flexible mixed substrate (Rigid-Flexible PCB) to enhance heat dissipation performance.
[0019] According to an embodiment of the present invention, the control unit may be composed of one or more of a monolithic control IC in which a power MOSFET and protection logic are integrated in a single chip form, a separated switching module in which a plurality of physically separated unit switching elements and a separate driving driver are combined, a wide bandgap (SiC or GaN) based switching element, and a relay-semiconductor hybrid switch.
[0020] According to an embodiment of the present invention, the control unit may immediately cut off conduction when it detects an abnormal condition in which a measured current value or voltage value exceeds a preset threshold range during the high-current transmission process, and may output a fault signal to notify the outside of the abnormal condition through the signal transceiver.
[0021] According to an embodiment of the present invention, the input power supply and output power supply of the power terminal portion have a multilayer surface treatment structure in which a nickel (Ni) layer is plated on a copper (Cu) alloy substrate and a silver (Ag) or tin (Sn) layer is plated on the outermost layer on the nickel layer, and the outermost plating material of the first surface in contact with an external power cable and the second surface coupled to the substrate portion may be different from each other.
[0022] According to an embodiment of the present invention, the input and output power supply portions of the power terminal portion include an upper fastening portion to which an external fastening means is coupled and a lower coupling portion inserted into or mounted on the substrate portion, and are provided with a stepped structure in which the thickness of the upper fastening portion is formed to be relatively thicker than the thickness of the lower coupling portion, thereby securing mechanical fastening strength and simultaneously mitigating thermal stress transmitted to the substrate portion.
[0023] According to an embodiment of the present invention, the power terminal portion has at least one heat dissipation slit or uneven pattern formed on its body to release heat generated when the high current is conducted into the air, and the surface area of the input power bracket into which external power is introduced is formed to be larger than the surface area of the output power bracket connected to the load, so that it can function as a main heat sink.
[0024] As a technical means for achieving the above-mentioned technical problem, a power distribution system including an electronic fuse device according to an embodiment of the present invention includes a higher-level controller connected to the signal transmitting and receiving unit of the electronic fuse device via a communication line to apply the control signal and receive an abnormal state, and the power terminal unit of the electronic fuse device may directly combine an external power source and a load without passing through the higher-level controller, thereby allowing the high-current path and the signal control path to be dualized.
[0025] According to an embodiment of the present invention, the power distribution system may be a system that distributes a large current connected to a drive system or battery management system within an electric vehicle (EV). Effects of the invention
[0026] According to the embodiments of the present invention described above, by configuring the power terminal portion with an independent and robust coupling structure such as screw fastening or press-fit, a high current of 30A to 100A can be stably transmitted without heat generation.
[0027] In addition, according to the embodiments of the present invention described above, by completely separating the signal transceiver from the power terminal and placing it in the edge area of the substrate, the ingress of magnetic field noise generated during switching can be blocked, thereby maximizing the reliability of system control.
[0028] In addition, according to the embodiments of the present invention described above, the durability of the module can be dramatically improved by placing the control unit at the shortest distance of the power path and placing the surge protection unit in advance near the external connection terminal to immediately clamp the transient voltage. Brief explanation of the drawing
[0029] FIG. 1 is a diagram illustrating the configuration of an electronic fuse device according to an embodiment of the present invention. FIG. 2 is a drawing for explaining the specific structure, material, and thickness of the input power supply and output power supply of the power terminal section according to an embodiment of the present invention. FIG. 3 is a system block diagram of the entire electronic fuse device according to an embodiment of the present invention when integrated into an actual application environment. Specific details for implementing the invention
[0030] Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. The following detailed description is provided to facilitate a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, this is merely illustrative and the present invention is not limited thereto.
[0031] In describing the embodiments of the present invention, detailed descriptions of known technologies related to the present invention are omitted if it is determined that such detailed descriptions may unnecessarily obscure the essence of the present invention. Furthermore, the terms described below are defined in consideration of their functions within the present invention, and these may vary depending on the intentions or practices of the user or operator. Therefore, such definitions should be based on the content throughout this specification. Terms used in the detailed description are intended merely to describe the embodiments of the present invention and should not be limiting in any way. Unless explicitly stated otherwise, expressions in the singular form include the meaning of the plural form. In this description, expressions such as "include" or "comprise" are intended to refer to certain characteristics, numbers, steps, actions, elements, parts thereof, or combinations thereof, and should not be interpreted to exclude the existence or possibility of one or more other characteristics, numbers, steps, actions, elements, parts thereof, or combinations thereof other than those described.
[0032] Hereinafter, with reference to the attached drawings, a power and signal separation type electronic fuse device for high-current transmission and a power distribution system including the same according to an embodiment of the present invention will be described.
[0033] FIG. 1 is a diagram illustrating the configuration of an electronic fuse device (100) according to an embodiment of the present invention.
[0034] As illustrated in FIG. 1, an electronic fuse device (100) according to an embodiment of the present invention may include a substrate part (110), a power terminal part (120), a signal transmitting / receiving part (130), a control part (141), and a protection part (143, 145).
[0035] The substrate portion (110) is a base member that physically supports each component and provides an electrical path, and is implemented as a multilayer FR-4 printed circuit board (PCB) including a large-area copper plane of a predetermined thickness, so as to be able to distribute heat from the power path to the entire substrate.
[0036] Additionally, the substrate portion (110) may be implemented as a metal core substrate (MCPCB) including an aluminum or copper base to maximize heat dissipation performance.
[0037] Additionally, the substrate portion (110) may be implemented as a ceramic substrate based on aluminum nitride (AlN) or aluminum oxide (Al2O3) to withstand a harsh environment of high temperature and high voltage.
[0038] Additionally, the substrate portion (110) can be implemented in a rigid-flexible form by combining a flexible circuit board (FPCB) with a high current pattern printed thereon and a rigid substrate for a packing environment where flexibility is required.
[0039] The power terminal section (120) includes an input section that receives a large current (e.g., 30A to 100A) from the outside and an output section that outputs a large current to the load side, and can be placed in a first area (e.g., both edges) of the substrate section (110).
[0040] In particular, the power terminal section (120) may be implemented as an 'L'-shaped or 'U'-shaped large metal bracket structure in which ring terminals or busbars are forcibly fastened through screws or bolts. In this case, it may be directly soldered to the substrate section (110) or joined via a through-hole method.
[0041] Additionally, the power terminal portion (120) can be implemented as a high-current press-fit pin block that is strongly pressed into a hole of the substrate portion (110) without separate soldering to achieve mechanical and electrical coupling simultaneously.
[0042] Additionally, the power terminal portion (120) can be implemented as a fused terminal in which the copper foil of the substrate portion (110) and the external power line are permanently integrated through ultrasonic welding or laser welding.
[0043] Additionally, the power terminal (120) can be implemented as a high-tension spring clamp terminal that physically compresses and fixes the power cable by a strong elastic spring to be robust against vibration environments.
[0044] The input power supply unit (121) of the power terminal unit (120) described above is a wide metal structure and is equipped with a large hole in the center for fastening a screw or bolt, and may serve as a gateway for introducing a large current from an external power source, such as a battery, into the interior of the electronic fuse device (100). The input power supply unit (121) may use a forced fastening method rather than a thin pin shape to minimize contact resistance and prevent heat generation.
[0045] The output power supply unit (123) has a structure symmetrical to the input power supply unit (121) and can finally output the passed high current to the device (load) to be protected through the switching operation of the control unit (141).
[0046] Below, the specific structure, material, thickness, etc. of the power terminal part (120) will be explained with reference to FIG. 2.
[0047] FIG. 2 is a drawing for explaining the specific structure, material, and thickness of the input power supply unit (121) and output power supply unit (123) of the power terminal unit (120) according to an embodiment of the present invention.
[0048] As shown in FIG. 2, the input power supply (121) of the power terminal section (120) may have an asymmetric structure with a significantly expanded surface area compared to the output power supply (123) to serve as a heat sink in order to solve the problem of the greatest heat load by being directly connected to an external battery.
[0049] Additionally, the input power supply (121) may have a concave or convex pattern (121g) formed on the top surface of the bracket. By maximizing the surface area and increasing the contact area with air, the natural convection cooling efficiency can be increased.
[0050] Additionally, the bracket body of the input power supply unit (121) may have a heating slit (121h) that is a long perforated gap. This provides an airflow passage so that the heated air is smoothly discharged outside the electronic fuse device (100) without becoming stagnant.
[0051] Meanwhile, the output power supply unit (123) is a component that delivers power to a device (load) to be protected, and can have a flat basic structure designed to be compact and reduce unnecessary volume by reflecting the characteristics of the output stage, which has a relatively low thermal load.
[0052] The base material (121b) of the input power supply unit (121) and the base material (123a) of the output power supply unit (123) are made of high-purity oxygen-free copper (OFC) with maximized electrical and thermal conductivity or beryllium copper with excellent mechanical strength, and the underlayer plating layer (121a, 123b) may be a nickel (Ni) layer coated first on the base material (121b, 123a).
[0053] Additionally, the outermost plating layer (121c) on the upper first surface of the input power supply unit (121) is the upper part of the input power supply unit (121) where the ring terminal or bolt of an external power cable comes into direct contact, and silver (Ag) plating is applied to lower contact resistance and withstand high-current arcs, and the outermost plating layer (121d) on the lower second surface of the input power supply unit (121) is the part where soldering is performed in contact with the substrate unit (110) (PCB), and may have a heterogeneous plating structure in which tin plating is applied to increase bonding strength with the substrate unit (110) and ensure reliability of the SMT process.
[0054] The outermost plating layer (123c) of the output power supply (123) can have tin (Sn) plating applied uniformly.
[0055] Meanwhile, the upper thickness (d1) of the input power supply (121) may be 2.0mm to 2.5mm or more to withstand the mechanical torque generated when the bolt is tightened strongly, and may have a stepped structure, i.e., a cut structure extending from the thick upper thickness (d1) to the thin lower (d2).
[0056] Additionally, the lower mounting portion of the input power supply (121) is a part that is coupled to the substrate portion (110). Since a thickness that is too thick causes all heat to be absorbed during soldering, resulting in defects, or stress that causes the solder to break during thermal expansion and contraction of the substrate portion (110), it may have a thickness (d2) thinner than d1, for example, a thickness (d2) of 1.00 mm to 1.5 mm.
[0057] The signal transmitting and receiving unit (130) transmits and receives control signals (activation signals, status diagnosis signals, etc.) in the form of microcurrents, and can be mounted in a second area (e.g., bottom edge) that is spaced apart from the power terminal unit (120) by a certain distance or more to prevent noise interference. Specifically, the signal transmitting and receiving unit (130) is installed in a multi-pin connector area located in a space carved out on the bottom center edge (edge) of the board unit (110) and is connected to the control unit (141) to receive a control signal (EN) to turn the electronic fuse device (100) on and off, or to transmit a warning signal (FLT) when an abnormal condition occurs.
[0058] In particular, the signal transceiver (130) according to the embodiment of the present invention is physically separated from the input power supply (121) and output power supply (123) terminals through which a large current flows, thereby blocking signal interference caused by switching noise (EMI) at the source.
[0059] This signal transceiver (130) can be implemented as a surface mount (SMD) multi-pin header connector that is coupled with an upper controller (20 in FIG. 3) via a wire harness.
[0060] Additionally, the signal transceiver (130) can be implemented with an elastic pogo-pin array contact structure to reduce physical wear and absorb coupling tolerances.
[0061] Additionally, the signal transceiver (130) may be configured with a ZIF (Zero Insertion Force) connector that directly inserts and connects a flexible flat cable (FFC) or FPCB to save space.
[0062] In addition, the signal transceiver (130) can be implemented as an optical communication interface module based on a photocoupler that converts an electrical signal into an optical signal and transmits and receives it in order to achieve perfect electrical isolation in an extreme EMI environment.
[0063] The control unit (141) is positioned on the power path to directly switch the flow of power and monitors voltage / current to cut off power when an abnormality occurs. It may be mounted in the center of the board unit (110) for path optimization. Specifically, the control unit (141) is an integrated control IC and is positioned in the center of the power path flowing from the input power unit (121) to the output power unit (123) to minimize conduction loss. It can protect the circuit by cutting off the internal power MOSFET in 0.001-second intervals when an overcurrent or short circuit is detected while passing a large current.
[0064] This control unit (141) can be implemented as a monolithic integrated control IC (Smart Power Switch) in which a power MOSFET for high-current switching and overcurrent / short circuit detection logic are stacked on a single silicon die or package.
[0065] Additionally, the control unit (141) can be implemented in a separated topology in which a number of discrete MOSFETs performing switching functions are arranged in parallel to increase heat dissipation and switching capacity, and a separate gate driver and monitoring IC that control them are indirectly combined.
[0066] Additionally, the control unit (141) may be composed of a power semiconductor based on silicon carbide (SiC) or gallium nitride (GaN), which is a wide bandgap (WBG) material, in order to reduce conduction loss to the extreme and respond to a high voltage (e.g., 400V to 800V) environment.
[0067] Additionally, the control unit (141) can be implemented as a hybrid switching module that maintains conduction loss close to '0' through a mechanical relay in a normal state and utilizes a semiconductor switch only when cut off.
[0068] The first and second protection sections (143, 145) divert energy from transient voltages (surge, kickback, etc.) generated from an external power source or load side to ground. They can be symmetrically positioned at both outermost points of the power path immediately following the power terminal section (120).
[0069] The first protection unit (143) is a large diode positioned immediately above (immediately after) the input power unit (121), and when lightning strikes or spike-type transient voltages (surges) suddenly enter from the external power line, it can perform the function of immediately clamping the high voltage before it reaches the central sensitive control unit (141) and diverting the energy to ground (GND).
[0070] The second protection unit (145) is a diode positioned vertically at the immediate end of the output power unit (123), and can prevent damage to the module by suppressing the inductive kickback high voltage that comes in reverse when a short circuit occurs on the load (motor, etc.) or when the power is cut off.
[0071] The first and second protection sections (143, 145) can be implemented with transient voltage suppression (TVS) diodes with a response speed of picoseconds (ps).
[0072] Additionally, the first and second protection units (143, 145) can be implemented as metal oxide varistors (MOV) when a larger energy (Joule) capacity is required.
[0073] In addition, the first and second protection sections (143, 145) can be implemented as a Gas Discharge Tube (GDT) structure to prepare for strong surge environments at the level of lightning strikes.
[0074] In addition, the first and second protection units (143, 145) may be configured as an active clamping circuit that does not rely on passive components and actively opens a separate discharge circuit upon detection of overvoltage.
[0075] The first protection unit (143) described above is a large diode positioned immediately above (immediately after) the input power unit (121), and when lightning strikes or spike-type transient voltages (surges) suddenly occur from the external power line, it can perform the function of immediately clamping the high voltage before it reaches the central sensitive control unit (141) and diverting the energy to ground (GND).
[0076] The second protection unit (145) is a diode positioned vertically at the immediate end of the output power unit (123), and can prevent damage to the module by suppressing the inductive kickback high voltage that comes in reverse when a short circuit occurs on the load (motor, etc.) or when the power is cut off.
[0077] Other protection elements and peripheral circuit groups (140) are composed of resistors, capacitors, etc. and are placed around the control unit (141) to perform auxiliary roles such as stabilizing the operating voltage (decoupling capacitor) or setting an overcurrent cutoff reference value (sensing resistor) so that the control unit (141) can operate accurately.
[0078] Hereinafter, the process of operation of the electronic fuse device (100) according to an embodiment of the present invention will be described.
[0079] As the signal transmission / reception unit (130) receives an enable (EN) signal instructing to turn on from the upper controller (20 in FIG. 3) and transmits it to the control unit (141), a large current of 30A or more can be flowed into the substrate unit (110) from an external power source through the input power unit (121) of the power terminal unit (120).
[0080] At this time, the first protection unit (143) positioned at the input end clamps the input surge to remove noise in the first step, and the control unit (141) can conduct the internal power switch in response to the enable signal. Accordingly, the large current flows through the shortest path (shortest distance pattern), and the control unit (141) can measure the amount of current flow in real time through a current shunt resistor or current mirroring.
[0081] Afterwards, the large current passing through the switch can be transmitted to the load device through the second protection unit (145) and the output power unit (123) of the power terminal unit (120).
[0082] When an overcurrent exceeding a threshold (e.g., 150% of the rating) is detected due to a short circuit on the load side while a large current is flowing through the process described above, the control unit (141) immediately turns off the switch and, at the same time, outputs a fault (FLT) signal to the upper controller (20 in FIG. 3) through the signal transmission and reception unit (130) to induce fail-safe of the entire system.
[0083] Hereinafter, with reference to FIG. 3, we will explain the process of applying an electronic fuse device (100) having the structure described above to an actual application environment, such as a power distribution network of an electric vehicle, an energy storage device, etc.
[0084] FIG. 3 is a system block diagram of the entire electronic fuse device (100) according to an embodiment of the present invention when it is integrated into an actual application environment.
[0085] As shown in FIG. 3, the power line (150) and the control signal line (40) can be completely separated and operated at the system level.
[0086] In this entire system, the external power source (10) supplies high voltage / high current of 30A to 100A from a battery pack or generator, and can be directly applied to the input power supply (121) of the electronic fuse device (100) through a thick power cable without passing through the main board on which the upper controller (20) is mounted. This completely eliminates the risk of deterioration or damage to the main board.
[0087] That is, the upper controller (20) is a main controller for remotely controlling the electronic fuse device (100), and may include a main ECU (electronic control unit) or a battery management system (BMS).
[0088] In particular, the upper controller (20) is physically completely separated from the high-current power grid and can transmit and receive microcurrent (control signal) to and from the electronic fuse device (100) only through the signal wire harness (40).
[0089] A signal wire harness (40) in the form of a dotted line is a communication line for connecting the upper controller (20) and the signal transceiver (130) of the electronic fuse device (100) (100), and can transmit an activation signal (EN) for turning the electronic fuse device (100) on and off, and feed back a fault signal (FLT) indicating a cutoff state in case of an abnormality to the upper controller (20).
[0090] The electronic fuse device (100) safely controls the flow of power between an external power source (10) and a device to be protected (30), and can first form a thick power path (150) through which a large current is introduced (121) through an input power source (121) and output through an output power source (123).
[0091] The signal transmitting and receiving unit (130) is completely isolated at the bottom and can only communicate with the wire harness (40).
[0092] The control unit (141) can physically switch the flow of the power path (150) by receiving a command from the signal transmission / reception unit (130).
[0093] The first and second protection units (143, 145) are placed at both ends of the power path and can block surge voltages generated at the input / output terminals.
[0094] The device to be protected (30) is a device that operates by finally receiving safe power that has passed through the electronic fuse device (100), such as a drive motor, a compressor, a high-performance server line, etc.
[0095] In the process of supplying a large current as described above to a device to be protected (30), if a short circuit occurs inside the device and an excessive current surges in reverse, the control unit (141) of the electronic fuse device (100) can immediately detect this, cut off the power, and send a warning to the upper controller (20).
[0096] The above description is merely an illustrative explanation of the technical concept of the present invention, and those skilled in the art to which the present invention pertains may make various modifications and variations within the scope of the essential characteristics of the present invention. Accordingly, the embodiments expressed in the present invention are intended to explain, not limit, the technical concept of the present invention, and the scope of rights of the present invention is not limited by such embodiments. The scope of protection of the present invention shall be interpreted by the claims below, and all technical concepts equivalent to or within an equivalent scope shall be interpreted as being included within the scope of rights of the present invention. Explanation of the symbols
[0097] 10, 20: External power, upper controller 30: Protected devices 40: Signal wire harness 100: Electronic fuse device 110 : Substrate part 120 : Power terminal 140: Peripheral circuit group 141 : Control unit 143: 1st Protection Unit 145 : 2nd Protection Unit 150 : Power line
Claims
Claim 1 A power and signal separation type electronic fuse device comprising: a substrate portion having a predetermined electrical circuit pattern formed thereon; a power terminal portion connected to a first area of the substrate portion and functioning as a means for introducing and outputting a large current from an external device; a signal transmitting and receiving portion mounted on a second area spaced apart from the power terminal portion by a predetermined distance on the substrate portion and transmitting and receiving a control signal; and a control portion mounted in a power path between the power terminal portions to interrupt the conduction state of the large current and process the control signal through the signal transmitting and receiving portion, wherein the power terminal portion and the signal transmitting and receiving portion are provided as independent structures that are mechanically separated from each other, and the input and output power portions of the power terminal portion include an upper connecting portion to which an external connecting means is connected and a lower connecting portion inserted or mounted on the substrate portion, and are provided with a stepped structure in which the thickness of the upper connecting portion is formed to be relatively thicker than the thickness of the lower connecting portion, thereby securing mechanical connecting strength and simultaneously alleviating thermal stress transmitted to the substrate portion. Claim 2 A power and signal separation type electronic fuse device according to claim 1, wherein the power terminal portion comprises one or more of a bracket-shaped terminal in which an external cable or busbar is fixed by a mechanical fastening means, a press-fit terminal in which a plurality of pins are pressed into a substrate, a fusion-type terminal, and an elastic spring clamp terminal. Claim 3 A power and signal separation type electronic fuse device according to claim 1, wherein the signal transmitting and receiving unit comprises one or more of a multi-pin connector, a pogo-pin connector, a flexible circuit insertion type ZIF connector, and an optical communication interface unit providing electrical isolation, which are mounted in the edge area of the substrate. Claim 4 A power and signal separation type electronic fuse device according to claim 1, wherein the control unit is positioned adjacent to the geometric central region between the high-current inflow terminal and the output terminal of the power terminal unit, thereby minimizing the transmission distance of the high-current passing through the copper pattern plane formed on the substrate unit. Claim 5 A power and signal separation type electronic fuse device according to claim 4, further comprising a first protection unit disposed at the outermost input end of the power path to suppress a first transient voltage applied from the external device, and a second protection unit disposed at the outermost output end of the power path to suppress a second transient voltage generated by a phenomenon on the load side. Claim 6 A power and signal separation type electronic fuse device according to claim 5, wherein the first protection unit and the second protection unit are each composed of at least one of a transient voltage suppression (TVS) diode, a metal oxide varistor (MOV), a gas discharge tube (GDT), and an active clamping discharge circuit. Claim 7 A power and signal separation type electronic fuse device according to claim 1, wherein the substrate portion is formed from any one of a multilayer FR-4 substrate, a metal core substrate (MCPCB), a ceramic substrate, and a rigid-flexible mixed substrate (Rigid-Flexible PCB) to enhance heat dissipation performance. Claim 8 A power and signal separation type electronic fuse device according to claim 1, wherein the control unit comprises one or more of a monolithic control IC in which a power MOSFET and protection logic are integrated in a single chip form, a separable switching module in which a plurality of physically separated unit switching elements and a separate driving driver are combined, a wide bandgap (SiC or GaN) based switching element, and a relay-semiconductor hybrid switch. Claim 9 A power and signal separation type electronic fuse device according to claim 1, wherein the control unit immediately cuts off conduction when it detects an abnormal condition in which a current value or voltage value measured during the high-current transmission process exceeds a preset threshold range, and outputs a fault signal to notify the outside of the abnormal condition through the signal transmission and reception unit. Claim 10 A power and signal separation type electronic fuse device comprising: a substrate portion having a predetermined electrical circuit pattern formed thereon; a power terminal portion connected to a first area of the substrate portion and functioning as a means for introducing and outputting a large current from an external device; a signal transmitting and receiving portion mounted on a second area spaced apart from the power terminal portion by a predetermined distance and transmitting and receiving a control signal; and a control portion mounted in a power path between the power terminal portions to interrupt the conduction state of the large current and process the control signal through the signal transmitting and receiving portion, wherein the power terminal portion and the signal transmitting and receiving portion are provided as independent structures that are mechanically separated from each other, and the input power portion and output power portion of the power terminal portion have a multilayer surface treatment structure in which a nickel (Ni) layer is underplated on a copper (Cu) alloy base material and a silver (Ag) or tin (Sn) layer is plated as the outermost layer on the nickel layer, and the outermost plating material of the first surface in contact with an external power cable and the second surface coupled to the substrate portion are different from each other. Claim 11 delete Claim 12 delete Claim 13 A power distribution system comprising a power and signal separation type electronic fuse device described in any one of claims 1 to 10, and a higher controller connected to the signal transmitting and receiving unit of the electronic fuse device via a communication line to apply the control signal and receive an abnormal state, wherein the power terminal unit of the electronic fuse device directly combines an external power source and a load without passing through the higher controller, and the high-current path and the signal control path are dualized. Claim 14 A power distribution system according to claim 13, characterized in that the power distribution system is a system that distributes a large current connected to a drive system or battery management system within an electric vehicle (EV).
Citation Information
Patent Citations
Power supply distribution system
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Power supply system
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Vehicle communication controlling apparatus
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Apparatus for monitoring battery status, battery management system and ignition circuit thereof
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