Electronic device including antenna

Abstract

According to one embodiment of the present document, an electronic device comprises a printed circuit board including a first part, a second part, and a flexible third part connecting the first part and the second part, wherein the first part comprises a first surface of the printed circuit board and a second surface disposed opposite to the first surface, and the second part comprises a third surface of the printed circuit board and a fourth surface disposed opposite to the third surface, a microphone disposed on the first surface, a conductive pattern disposed on the first surface and at least partially surrounding the microphone, and a wireless communication circuit disposed on the first part, wherein the printed circuit board may include a first electrical path electrically connecting the conductive pattern and the wireless communication circuit, and a second electrical path included in the second part that electrically connects a ground area included in the printed circuit board to the first electrical path or the conductive pattern. Various other embodiments may be possible.

Description

Technology Field

[0001] Various embodiments of this document relate to electronic devices including antennas. Background Technology

[0002] With the advancement of digital technology, electronic devices are being provided in various forms, such as smartphones, tablet PCs, or PDAs. Electronic devices are also being developed in wearable forms to enhance portability and user accessibility. Electronic devices may include antennas for wireless communication with external electronic devices. The problem to be solved

[0003] The electronic device may be, for example, an ear wearable device that can be worn on the ear. Ear wearable devices are becoming smaller, which can make it difficult to place components within the limited space of the ear wearable device while reducing electromagnetic interference between components. Additionally, because the user's body can affect components such as antennas or touch-sensing circuits that use electromagnetics while the ear wearable device is worn on the ear, it can be difficult to place components that use electromagnetics within the limited space of the ear wearable device while reducing the impact of the user's body.

[0004] Various embodiments of this document may provide an electronic device including an antenna for securing antenna radiation performance.

[0005] The technical problems to be solved in this document are not limited to those mentioned above, and other technical problems not mentioned will be understood by those skilled in the art to which this invention belongs from the description below. means of solving the problem

[0006] According to one embodiment of the present document, an electronic device comprises a printed circuit board including a first part, a second part, and a flexible third part connecting the first part and the second part, wherein the first part includes a first surface of the printed circuit board and a second surface disposed opposite to the first surface, and the second part includes a third surface of the printed circuit board and a fourth surface disposed opposite to the third surface, and comprises a microphone disposed on the first surface, a conductive pattern disposed on the first surface and at least partially surrounding the microphone, and a wireless communication circuit disposed on the first part, wherein the printed circuit board may include a first electrical path electrically connecting the conductive pattern and the wireless communication circuit, and a second electrical path included in the second part that electrically connects a ground area included in the printed circuit board to the first electrical path or the conductive pattern. Effects of the invention

[0007] An electronic device including an antenna according to one embodiment of the present document can secure antenna radiation performance.

[0008] Furthermore, other effects that can be obtained or predicted by the various embodiments of this document will be disclosed directly or implicitly in the detailed description of the embodiments of this document. For example, various effects predicted according to the various embodiments of this document will be disclosed in the detailed description that follows. Brief explanation of the drawing

[0009] FIG. 1 illustrates an electronic device according to one embodiment being coupled to an ear. FIG. 2 is a front view of an electronic device according to one embodiment. FIG. 3 is a rear view of an electronic device according to one embodiment. FIG. 4 is a side view of an electronic device according to one embodiment. FIG. 5 is a block diagram relating to an electronic device according to one embodiment. FIG. 6 is an exploded perspective view relating to a part of an electronic device according to one embodiment. FIG. 7 is a cross-sectional view of a substrate assembly in an unfolded state in one embodiment. FIG. 8 is a cross-sectional view of a substrate assembly in a folded state in one embodiment. FIG. 9 is a block diagram relating to a circuit included in an electronic device in one embodiment. FIG. 10 is an xy plan view of a first layer included in a printed circuit board in one embodiment. FIG. 11 is an xy plan view of a second layer included in a printed circuit board in one embodiment. FIG. 12 is an xy plan view of a third layer included in a printed circuit board in one embodiment. FIG. 13 is an xy plan view of a fourth layer included in a printed circuit board in one embodiment. FIG. 14 is an xy plan view of a fifth layer included in a printed circuit board in one embodiment. FIG. 15 is an xy plan view of a sixth layer included in a printed circuit board in one embodiment. Specific details for implementing the invention

[0010] Hereinafter, various embodiments of this document are described with reference to the attached drawings.

[0011] The terms in this document are not intended to limit the technology described herein to specific embodiments and should be understood to include various modifications, equivalents, and / or substitutions of such embodiments. In relation to the description of the drawings, similar reference numerals may be used for similar components. A singular expression may include a plural expression unless the context clearly indicates otherwise. In this document, expressions such as "A or B" or "at least one of A and / or B" may include all possible combinations of items listed together. Expressions such as "first," "second," "first," or "second" may modify the components, regardless of order or importance, and are used only to distinguish one component from another and do not limit the components. Where it is mentioned that a certain component (e.g., a first component) is "(functionally or telecommunicationally) connected" or "connected" to another (e.g., a second component), said certain component may be directly connected to said other component or connected through another component (e.g., a third component).

[0012] In this document, "configured to" may be used interchangeably with, depending on the context, for example, in hardware or software, "suitable for," "capable of," "modified to," "made to," "capable of," or "designed to." In some situations, the expression "device configured to" may mean that the device is "capable of" doing something together with other devices or components.

[0013] FIG. 1 illustrates an electronic device (1) according to one embodiment in a state coupled to an ear (2). FIG. 2 is a front view of an electronic device (1) according to one embodiment. FIG. 3 is a rear view of an electronic device (1) according to one embodiment. FIG. 4 is a side view of an electronic device (1) according to one embodiment.

[0014] Referring to FIGS. 1, 2, 3, and 4, the electronic device (1) may be an ear wearable device. The electronic device (1) may include a housing (10) that can be formed in a shape that is detachably attached to an ear (2). The housing (10) may be, for example, in a shape that can be stably seated in a groove of the auricle connected to the external auditory canal of the ear (2). In one embodiment, the housing (10) may include a first housing (11) and a second housing (12). The first housing (11) and the second housing (12) may be combined to form an internal space of the electronic device (1) in which one or more electronic components are accommodated. At least one electronic component included in the electronic device (1) may be placed in or coupled to the first housing (11) and / or the second housing (12). The outer surface of the electronic device (1) may include a first outer surface (10A) formed by a first housing (11) and a second outer surface (10B) formed by a second housing (12) and located opposite to the first outer surface (10A). The electronic device (1) may be worn on the ear (2) with the second outer surface (10B) facing the ear (2). When the electronic device (1) is worn on the ear (2), the first region of the outer surface of the electronic device (1) is covered by the ear (2) and is not exposed to the outside, while the remaining second region of the outer surface of the electronic device (1) may be exposed to the outside. The second region may substantially be contained within the second outer surface (10B) of the second housing (12). In some embodiments, although not illustrated, the housing (10) is not limited to a form including a first housing (11) and a second housing (12), but may be implemented in a form where three or more housings are combined to form a first outer surface (10A) and a second outer surface (10B). At least a portion of the housing (10) may include a non-metallic material (e.g., a polymer) and / or a metallic material.

[0015] According to one embodiment, the housing (10) may include a first microphone hole (101), a second microphone hole (102), and / or a speaker hole (103). The first microphone hole (101) and the second microphone hole (102) may be formed on a first outer surface (10A), and the speaker hole (103) may be formed on a second outer surface (10B). When the electronic device (1) is worn on the ear (2), the first microphone hole (101) and the second microphone hole (102) are exposed to the outside, and the speaker hole (103) may be positioned corresponding to the external auditory canal of the ear (2). The electronic device (1) may include a first microphone (or first microphone) located inside the electronic device (1) corresponding to a first microphone hole (101), and a second microphone (or second microphone) located inside the electronic device (1) corresponding to a second microphone hole (102). The electronic device (1) may include a speaker located inside the electronic device (1) corresponding to a speaker hole (103). Sound waves, such as voice, are introduced into the first microphone through the first microphone hole (101) and into the second microphone through the second microphone hole (102), and the first microphone and the second microphone may generate electrical signals for the sound waves. The electrical signals generated by the first microphone and / or the second microphone may be output as sound through the speaker or utilized as input signals corresponding to various functions of the electronic device (1). The location or number of microphone holes or microphones corresponding to the microphone holes may vary and are not limited to the illustrated examples. The sound output from the speaker can be emitted through the speaker hole (103) aligned with the external auditory canal of the ear (2) and transmitted to the eardrum of the ear (2).

[0016] According to one embodiment, a first microphone corresponding to a first microphone hole (101) and a second microphone corresponding to a second microphone hole (102) can be used for noise-cancelling.

[0017] According to one embodiment, the housing (10) may include a duct structure including an opening (104) formed on a first outer surface (10A). The duct structure can improve the quality of sound output through the speaker. The duct structure including the opening may be formed in various ways, not limited to the illustrated example. For example, the duct structure may contribute to enriching the mid-low frequency sound. In one embodiment, the electronic device (1) may include an opening (105) (e.g., air vent) formed in the housing (10) to enable airflow between the inside of the electronic device (1) and the outside of the ear wearable device. The opening (105) may contribute to enabling rich sound transmission through the speaker. The location or number of openings as air vents may vary, not limited to the illustrated example.

[0018] According to one embodiment, a portion of the first outer surface (10A) of the housing (10) may be utilized as a user input area (or key area) (10C) for receiving or detecting user input. For example, touch input, hovering input, or gesture input may be possible through the user input area (10C) of the first outer surface (10A) while the electronic device (1) is worn on the ear (2). Touch input may refer to user input generated when a dielectric, such as a finger, comes into contact with the user input area (10C) of the first outer surface (10A). Hovering input may refer to user input generated without contacting the user input area (10C) of the first outer surface (10A), such as a finger. Gesture input may refer to user input regarding the movement of a dielectric, such as a finger (e.g., finger movements or finger movement patterns). In one embodiment, the electronic device (1) may include a first conductive pattern (13) located inside the electronic device (1) corresponding to a user input area (10C) of a first outer surface (10A). The first conductive pattern (13) may be included, for example, in a printed circuit board (e.g., a flexible printed circuit (FPCB)) located inside the electronic device (1). In one embodiment, the first conductive pattern (13) and a first microphone corresponding to the first microphone hole (101) may be placed on the same printed circuit board. For example, the first microphone may be placed on a first surface of the printed circuit board, and the first conductive pattern (13) may be placed on a second surface of the printed circuit board facing in the opposite direction to the first surface. In some embodiments, the first conductive pattern (13) may be located inside the printed circuit board closer to the second surface than the first surface, or closer to the first surface than the second surface.In some embodiments, the first conductive pattern (13) may be placed in the first housing (11) or located inside the first housing (11). In some embodiments, the first conductive pattern (13) may be placed on a non-conductive support member located in the internal space of the electronic device (1). The first conductive pattern (13) may be, for example, in a form of laser direct structuring (LDS) placed in the first housing (11) or the non-conductive support member, or in a form implemented by plating or printing. The first conductive pattern (13) may overlap at least partially with the user input area (10C) of the first outer surface (10A). The electronic device (1) applies voltage to the first conductive pattern (13), and the first conductive pattern (13) may form an electromagnetic field. When a finger comes into contact with the user input area (10C) of the first outer surface (10A) or reaches within a critical distance, the change in capacitance based on the change in the electromagnetic field may exceed a critical value. When the change in capacitance exceeds the critical value, the electronic device (1) may generate an electrical signal as a valid user input. In one embodiment, the user input area (10C) of the first outer surface (10A) and the first conductive pattern (13) corresponding to the user input area (10C) may be referred to as a 'touch key'. In some embodiments, the first conductive pattern (13) may be referred to as a 'touch sensing circuit'.

[0019] According to one embodiment, when viewed from above on the first outer surface (10A) (e.g., when viewed in the -z axis direction), the first microphone corresponding to the first microphone hole (101) may overlap at least partially with the first conductive pattern (13). For example, the first conductive pattern (13) may be located between the first microphone and the first microphone hole (101). The first conductive pattern (13) may include a first opening aligned with the first microphone hole (101). Sound waves may be provided to the first microphone from outside the electronic device (1) through the first microphone hole (101) and the first opening aligned with the first microphone hole (101). In one embodiment, the first microphone may be placed on a first surface of the printed circuit board, and the first conductive pattern (13) may be placed on a second surface of the printed circuit board facing in the opposite direction to the first surface. The printed circuit board may include a first microphone hole (101) of the housing (10) and a second opening aligned with a first opening of a first conductive pattern (13). The first opening may be located between the first microphone hole (101) and the second opening. Sound waves may be provided to the first microphone from outside the electronic device (1) through the first microphone hole (101), the first opening, and the second opening.

[0020] According to one embodiment, the first housing (11) may include a non-conductive material. An electromagnetic field generated from the first conductive pattern (13) may be formed by passing through the first housing (11) of the non-conductive material. The first housing (11) formed of a non-conductive material may contribute to securing performance regarding a touch key using the first conductive pattern (13) by reducing the effect on the electromagnetic field generated from the first conductive pattern (13) compared to a comparative example where the first housing (11) is formed of a conductive material. In some embodiments, a first portion of the first housing (11) that overlaps with the first conductive pattern (13) to form a user input area (10C) may include a non-conductive material, and the remaining second portion of the first housing (11) may include a conductive material. A housing (11) formed of a non-conductive material, or a portion of the first housing (11) that forms a user input area (10C) may have a dielectric constant (e.g., low dielectric constant) that can reduce the impact on the performance of a touch key using a first conductive pattern (13).

[0021] According to one embodiment, the electronic device (1) may include a second conductive pattern (14) utilized as a radiating part. The second conductive pattern (14) may not overlap with the first conductive pattern (13) utilized as a touch sensing circuit when viewed from above the first outer surface (10A). For example, the second conductive pattern (14) may be arranged to surround at least a portion of the first conductive pattern (13) when viewed from above the first outer surface (10A). The second conductive pattern (14) may be included, for example, in a printed circuit board (e.g., FPCB) located inside the electronic device (1). In one embodiment, the first conductive pattern (13) utilized as a touch sensing circuit and the second conductive pattern (14) utilized as a radiating part may be included in the same printed circuit board. For example, a first microphone corresponding to a first microphone hole (101) may be placed on a first surface of a printed circuit board, and a second conductive pattern (14) may be placed on the first surface or on a second surface of the printed circuit board opposite to the first surface. In some embodiments, the second conductive pattern (14) may be placed in a first housing (11) or located inside the first housing (11). In some embodiments, the second conductive pattern (14) may be placed on a non-conductive support member located in the internal space of the electronic device (1). The second conductive pattern (14) may be, for example, in the form of an LDS placed on the first housing (11) or the non-conductive support member, or in a form implemented by plating or printing. The second conductive pattern (14) is electrically connected to a wireless communication circuit (e.g., a communication module) included in the electronic device (1) to form an electromagnetic field capable of transmitting and / or receiving a signal of at least one frequency in a selected or designated frequency band. The wireless communication circuit may, for example, provide a radiated current (or electromagnetic signal) to the second conductive pattern (14), and the second conductive pattern (14) may radiate radio waves.The second conductive pattern (14) can operate as a radiating unit that radiates a fed electromagnetic signal to the outside or transmits and receives an electromagnetic signal from the outside. The wireless communication circuit can process a transmitted signal or a received signal in at least one designated frequency band through the second conductive pattern (14). The designated frequency band may include, for example, at least one of LB (low band) (about 600 MHz to about 1 GHz), MB (middle band) (about 1 GHz to about 2.3 GHz), HB (high band) (about 2.3 GHz to about 2.7 GHz), or UHB (ultra-high band) (about 2.7 GHz to about 6 GHz). The designated frequency band may include various other frequency bands.

[0022] According to one embodiment, energy (e.g., electromagnetic waves) radiated from the second conductive pattern (14) can pass through the first housing (11) and proceed to the outside. The first housing (11), formed of a non-conductive material, can contribute to securing antenna radiation performance of an antenna (or antenna device) using the second conductive pattern (14) by reducing the effect on the electromagnetic field generated from the second conductive pattern (14) compared to a comparative example where the first housing (11) is formed of a conductive material. In some embodiments, a first portion of the first housing (11) that overlaps with the first conductive pattern (13) and the second conductive pattern (14) may include a non-conductive material, and the remaining second portion of the first housing (11) may include a conductive material. A housing (11) formed of a non-conductive material, or a portion of the first housing (11) that overlaps with the first conductive pattern (13) and the second conductive pattern (14) may have a dielectric constant (e.g., low dielectric constant) that can reduce the impact on the performance of a touch key using the first conductive pattern (13) and the impact on the antenna radiation performance of an antenna using the second conductive pattern (14). According to one embodiment, the electronic device (1) may include a connection terminal portion (15). The connection terminal portion (15) may include a plurality of terminals (151, 152) disposed on the second outer surface (10B) of the second housing (12). The second housing (12) may include a shape protruding in a direction toward the ear (2) (hereinafter referred to as a 'protrusion'), and the connection terminal portion (15) may include the protrusion. The connection terminal portion (15) may be inserted into the groove of the earlobe when the electronic device (1) is worn on the ear (2) and may not be exposed to the outside. When the electronic device (1) is placed on an external electronic device, the plurality of terminals (151, 152) may be electrically connected to the plurality of terminals included in the external electronic device (e.g., flexible terminals such as pogo pins).The electronic device (1) can receive power to charge the battery of the electronic device (1) from an external electronic device through the connection terminal (15). The electronic device (1) can receive data or information from an external electronic device through the connection terminal (15). The electronic device (1) can transmit data or information to an external electronic device through the connection terminal (15). Although not illustrated, the electronic device (1) may further include various other types of connectors (e.g., USB connectors) or interface terminals capable of connecting to an external electronic device, not limited to the connection terminal (15) of the illustrated example. Although not illustrated, the electronic device (1) may further include a connector (e.g., card connector) or interface terminal for connecting to an external storage medium, such as an external memory.

[0023] FIG. 5 is a block diagram relating to an electronic device (1) according to one embodiment.

[0024] Referring to FIG. 5, the electronic device (1) may include a processor (510), memory (520), touchpad (530), audio module (540), speaker (541), microphone (or microphone) (542), sensor module (550), connection terminal (560), power management module (570), battery (580), communication module (590), and / or antenna radiator (591). In some embodiments, the electronic device (1) may omit at least one of the components of FIG. 5 or include one or more additional components. In some embodiments, some of these components may be implemented as a single integrated circuit.

[0025] The processor (510) can, for example, execute software to control at least one other component (e.g., a hardware or software component) of the electronic device (1) connected to the processor (510) and can perform various data processing or operations. As at least part of the data processing or operations, the processor (510) can load commands or data received from other components (e.g., a sensor module (550) or a communication module (590)) into the volatile memory of the memory (520), process the commands or data stored in the volatile memory, and store the resulting data in the non-volatile memory.

[0026] Memory (520) can store various data used by, for example, at least one component of the electronic device (1) (e.g., processor (510) or sensor module (550)). The data may include, for example, software (e.g., a program) and input data or output data for instructions related thereto. Memory (520) may include volatile memory and / or non-volatile memory. A program may be stored in memory (520) as software and may include, for example, an operating system, middleware, or an application. Memory (520) may store instructions related to various operations performed by, for example, the processor (510).

[0027] A touch pad (530) may include a touch detection circuit (531) and a touch sensor IC (integrated circuit) (or touch sensor) (532), as a pointing device utilizing, for example, a user input area (10C) (see FIG. 2) of a housing (10). In one embodiment, the touch detection circuit (531) may include a conductive pattern located in the internal space of the electronic device (1). The touch detection circuit (531) may include, for example, a first conductive pattern (13) (see FIG. 1 and 2). The touch pad (530) may be implemented based on a capacitive method. The touch sensor IC (532) (e.g., a touch controller IC (touch controller integrated circuit)) applies voltage to the touch detection circuit (531), and the touch detection circuit (531) may form an electromagnetic field. For example, when a dielectric material such as a finger comes into contact with the user input area (10C) of the housing (10) or reaches within a critical distance from the user input area (10C), the change in capacitance based on the change in the electromagnetic field may exceed a critical value. When the change in capacitance exceeds the critical value, the touch sensor IC (532) may generate an electrical signal regarding coordinates as a valid user input and transmit it to the processor (510). The processor (510) may recognize the coordinates based on the electrical signal received from the touch sensor IC (532). The touch detection circuit (531) and the touch sensor IC (532) may be referred to as a 'sensor circuit' for touch detection. In some embodiments, the user input area (10C) of the housing (10) and the touch detection circuit (531) corresponding to the user input area (10C) may be referred to as a 'touch key'.

[0028] According to one embodiment, the touch sensor IC (532) can convert an analog signal obtained through the touch detection circuit (531) into a digital signal. The touch sensor IC (532) can perform various functions such as noise filtering, noise removal, or sensing data extraction in relation to the touch detection circuit (531). The touch sensor IC (532) may include various circuits such as, for example, an analog-digital converter (ADC), a digital signal processor (DSP), and / or a micro control unit (MCU).

[0029] According to one embodiment, user input regarding audio data (or audio content) can be generated through the touchpad (530). For example, functions such as starting playback of audio data, pausing playback, stopping playback, adjusting playback speed, adjusting playback volume, or muting can be executed based on user input through the touchpad (530). For example, various gesture inputs can be made through the user input area (10C) (see FIG. 2) of the housing (10) using a finger, and various functions regarding audio data can be executed based on such gesture inputs. For example, when a single tap is made in the user input area (10C), the processor (510) can play the audio data or pause the playback. For example, when two taps are made in the user input area (10C), the processor (510) can switch the playback to the next audio data. For example, if three taps are performed in the user input area (10C), the processor (510) can switch the playback to the previous audio data. For example, if swiping is performed in the user input area (10C), the processor (510) can adjust the volume regarding the playback of the audio data. Gesture input can be utilized for various other functions in addition to functions related to audio data. For example, when a call comes in, if two taps are performed in the user input area (10C), the processor (510) can connect the call.

[0030] According to some embodiments, the touch pad (530) may further include a tactile layer. The touch pad (530) including the tactile layer can provide a tactile response to the user.

[0031] According to some embodiments, there may be a click button aligned with the touchpad (530), and when the user input area (10C) (see FIG. 2) is pressed, an input such as clicking a mouse button may occur. In this case, the user input area (10C) may be implemented to be flexible or to be movable in response to the pressure. In some embodiments, the touchpad (530) may include a sensor circuit (e.g., a pressure sensor) (not shown) configured to measure the intensity of the force generated by the user input.

[0032] According to some embodiments, although not illustrated, the electronic device (1) is not limited to a touch pad (530) and may further include various other input devices for receiving commands or data to be used on a component of the electronic device (1) (e.g., a processor (510)) from outside the electronic device (1) (e.g., a user). The input devices may vary, such as, for example, physical buttons or optical keys.

[0033] A speaker (541) can, for example, output an audio signal to the outside of the electronic device (1). In one embodiment, the speaker (541) may be located in the internal space of the electronic device (1) corresponding to the speaker hole (103) of FIG. 3. Sound waves, such as voice, may be provided to a microphone (542) from the outside of the electronic device (1) through a microphone hole (e.g., the first microphone hole (101) or the second microphone hole (102) in FIG. 2), and the microphone (542) may generate an electrical signal therefrom. The microphone (542) may include, for example, a first microphone corresponding to the first microphone hole (101) (see FIG. 2), or a second microphone corresponding to the second microphone hole (102) (see FIG. 2). The audio module (540) may convert sound into an electrical signal, or conversely, convert an electrical signal into sound. The audio module (540) can acquire sound through the microphone (542) or output sound through the speaker (541).

[0034] According to one embodiment, the audio module (540) may support an audio data collection function. The audio module (540) may play the collected audio data. The audio module (540) may include an audio decoder, a digital-to-analog converter, or an analog-to-digital converter. The audio decoder may convert audio data stored in memory (520) into a digital audio signal. The D / A converter may convert the digital audio signal converted by the audio decoder into an analog audio signal. The speaker (541) may output the analog audio signal converted by the D / A converter. The A / D converter may convert the analog audio signal obtained through the microphone (542) into a digital audio signal.

[0035] The sensor module (550) can detect, for example, the operating state of the electronic device (1) (e.g., power or temperature) or the external environmental state (e.g., user state), and can generate an electrical signal or data value corresponding to the detected state. In one embodiment, the sensor module (550) may include an accelerometer, a gyroscope, a geomagnetic sensor, a magnetic sensor, a proximity sensor, a temperature sensor, a gesture sensor, a grip sensor, and / or a biosensor.

[0036] The electronic device (1) may include, for example, an optical sensor located in at least a portion of the internal space or housing (10) (see FIG. 2) of the electronic device (1). When the optical sensor is located in the internal space of the electronic device (1), a portion of the housing (10) facing the optical sensor may be implemented to allow light to pass through or may include an opening. The optical sensor may include a light-emitting part (e.g., a light-emitting diode (LED)) that outputs light of at least one wavelength band, or a light-receiving part (e.g., a photodiode) that receives light of one or more wavelength bands and generates an electrical signal. In one embodiment, the optical sensor may be a sensor for detecting the state in which the electronic device (1) is worn on the ear. In some embodiments, the optical sensor may be a biosensor. When the electronic device (1) is worn on the ear, light output from the light-emitting part of the optical sensor may be reflected from the user's skin and enter the light-receiving part of the optical sensor. The light-receiving part of the optical sensor may provide an electrical signal based on the incoming light to a processor (510). The processor (510) can transmit electrical signals obtained from an optical sensor to an external electronic device (e.g., a smartphone) via a communication module (590). The external electronic device can obtain various biometric information, such as heart rate or skin temperature, based on electrical signals obtained from the electronic device (1). In some embodiments, the processor (510) can obtain biometric information based on electrical signals obtained from an optical sensor, and can transmit the obtained biometric information to an external electronic device via the communication module (590) or output it via a speaker (541).

[0037] According to one embodiment, information or a signal regarding whether the electronic device (1) is connected to the ear can be obtained through the sensor module (550). In some embodiments, information or a signal regarding whether the electronic device (1) is connected to an external device (e.g., a power supply device or a charging device) can be obtained through the sensor module (550).

[0038] According to some embodiments, although not illustrated, the electronic device (1) may include a member for detection corresponding to a sensor of an external electronic device (e.g., a power supply). For example, the external electronic device may include a Hall IC placed in a mounting portion, and the electronic device (1) may include a magnet (or magnetic material). When the electronic device (1) is coupled to the mounting portion of the external electronic device, the Hall IC of the external electronic device may detect the magnet placed in the electronic device (1) and transmit an electrical signal regarding the coupling of the external electronic device and the electronic device (1) to the processor (510). In some embodiments, the magnet may be placed in the connection terminal portion (15) of FIGS. 3 and 4 and may contribute to forming an attractive force that facilitates the connection between the electronic device (1) and the external electronic device.

[0039] The connection terminal (560) may include, for example, a connector through which the electronic device (1) can be electrically connected to an external electronic device (e.g., a smartphone or a power supply). According to one embodiment, the connection terminal (560) may include, for example, a USB connector or an SD card connector.

[0040] According to one embodiment, the connection terminal (560) may include a plurality of terminals (151, 152) included in the connection terminal portion (15) of FIGS. 3 and 4. The connection terminal (560) may receive power for charging the battery (580) from an external electronic device and transmit it to a power management module (570). The electronic device (1) may perform power line communication (PLC) to an external electronic device (e.g., a power supply device or a charging device) through the connection terminal (560).

[0041] The power management module (570) can manage power supplied to or consumed by the electronic device (1), for example. In one embodiment, the power management module (570) may be implemented as at least part of a power management integrated circuit (PMIC).

[0042] The battery (580) can supply power to at least one component of the electronic device (1), for example. In one embodiment, the battery (580) may include a rechargeable secondary battery.

[0043] A communication module (or communication circuit) (590) can support, for example, the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (1) and an external electronic device (e.g., a server, a smartphone, a PC (personal computer), a PDA (personal digital assistant), or an access point), and the performance of communication through the established communication channel. In some embodiments, the communication module (590) may operate independently of the processor (510) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication.

[0044] The communication module (590) may transmit a signal or power to an external electronic device or receive it from an external electronic device, for example, through an antenna radiator (591). In one embodiment, the antenna radiator (591) may include the second conductive pattern (14) of FIGS. 1 and 2. The communication module (590) may include a wireless communication module (e.g., a short-range wireless communication module, or a GNSS (global navigation satellite system) communication module) or a wired communication module (e.g., a LAN (local area network) communication module, or a power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device through a first network (e.g., a short-range communication network such as Bluetooth, BLE (Bluetooth low energy), NFC (near field communication), WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (e.g., the Internet, or a long-range communication network such as a computer network (e.g., LAN or WAN (wide area network)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). In some embodiments, the electronic device (1) may include multiple antenna radiators, and the communication module (590) may select at least one antenna radiator suitable for the communication method used in the communication network from the multiple antenna radiators. A signal or power may be transmitted or received between the communication module (590) and the external electronic device through the selected at least one antenna radiator.

[0045] According to one embodiment, all or part of the operations performed on the electronic device (1) may be performed on at least one external electronic device (e.g., a smartphone). For example, when the electronic device (1) needs to perform a function or service automatically or in response to a request from a user or another device, instead of performing the electronic device (1) function or service itself, or additionally, it may request at least one external electronic device to perform at least part of the function or service. Upon receiving the request, at least one external electronic device may perform at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (1). The electronic device (1) may provide the result as is or additionally processed as at least part of the response to the request.

[0046] According to some embodiments, commands or data received by the processor (510) may be transmitted or received between the electronic device (1) and an external electronic device (e.g., a smartphone) through a server connected to a second network (e.g., the Internet, or a remote communication network such as a computer network (e.g., a LAN or WAN).

[0047] According to one embodiment, the processor (510) may be configured to control various signal flow controls regarding audio data and to control information collection and output. The processor (510) may be configured to receive audio data from an external electronic device (e.g., server, smartphone, PC, PDA, or access point) through a communication module (590) and to store the received audio data in memory (520). The processor (510) may be configured to receive non-volatile audio data (or, downloaded audio data) from an external electronic device and to store the received non-volatile audio data in non-volatile memory included in memory (520). The processor (510) may be configured to receive volatile audio data (or, streaming audio data) from an external electronic device and to store the received volatile audio data in volatile memory included in memory (520).

[0048] According to one embodiment, the processor (510) may be configured to play audio data (e.g., non-volatile audio data or volatile audio data) stored in memory (520) and output it through a speaker (541). For example, an audio module (540) may decode the audio data to generate an audio signal that can be output through a speaker (541) (e.g., playing audio data), and the generated audio signal may be output through the speaker (541).

[0049] According to some embodiments, the processor (510) may be configured to receive an audio signal from an external electronic device and output the received audio signal through a speaker (541). For example, an external electronic device (e.g., an audio player) may decode audio data to generate an audio signal and transmit the generated audio signal to the electronic device (1).

[0050] According to some embodiments, a mode in which an electronic device (1) plays volatile audio data or non-volatile audio data stored in memory (520) and outputs it through a speaker (541) may be paused when it is confirmed using a sensor module (550) that the electronic device (1) is not coupled to the ear. When it is confirmed through the sensor module (550) that the electronic device (1) is coupled to the ear, the mode may be resumed.

[0051] According to one embodiment, a mode for receiving an audio signal from an external electronic device and outputting it through a speaker (541) may be paused when the state in which the electronic device (1) is not coupled to the ear is confirmed through the sensor module (550). When the state in which the electronic device (1) is coupled to the ear is confirmed through the sensor module (550), the mode may be resumed.

[0052] According to some embodiments, when an electronic device (1) is connected to another electronic device (not shown) in the form of a wearable device, one electronic device may become a master device and the other electronic device may become a slave device. For example, the master device may not only output an audio signal received from an external electronic device (e.g., a smartphone) to a speaker (541), but also transmit it to the slave device. The slave device may be implemented substantially identically to the master device and may output an audio signal received from the master device through its own speaker.

[0053] According to some embodiments, the electronic device (1) may provide a voice recognition function that generates a voice command from an analog audio signal received through a microphone (542). The voice command may be utilized for various functions regarding audio data.

[0054] According to one embodiment, the electronic device (1) can detect the direction of sound using a plurality of microphones. At least some of the plurality of microphones can be used for noise canceling.

[0055] According to some embodiments, the electronic device (1) may further include various modules depending on the form in which it is provided. Although variations are so diverse due to the convergence trend of digital devices that they cannot all be listed, components equivalent to the components mentioned above may be additionally included in the electronic device (1). Furthermore, according to one embodiment, the electronic device (1) may exclude certain components from the above components or replace them with other components depending on the form in which it is provided. This will be easily understood by those skilled in the art.

[0056] FIG. 6 is an exploded perspective view of a part of an electronic device (1) according to one embodiment.

[0057] Referring to FIG. 6, the electronic device (1) may include a first housing (11), a second housing (12), a speaker (541), a battery (580), a support structure (6), a printed circuit board (7), a first conductive pattern (13), and / or a second conductive pattern (14).

[0058] According to one embodiment, the support structure (6) may be connected to the first housing (11) and / or the second housing (12) within the internal space of the electronic device (1). The support structure (6) may be positioned within the electronic device (1) to withstand loads and contribute to the durability or rigidity of the electronic device (1). The support structure (6) may be formed, for example, from a metal material and / or a non-metal material (e.g., a polymer). Electronic components such as a speaker (541), a battery (580), or a printed circuit board (7), or various components related to electronic components may be placed in the support structure (6), the first housing (11), or the second housing (12), or supported by the support structure (6), the first housing (11), or the second housing (12). The printed circuit board (7) may be placed in or coupled to the support structure (6), for example, between the support structure (6) and the first housing (11). A speaker (541) or battery (580) may be placed or coupled to the support structure (6), for example, between the support structure (6) and the second housing (12). In some embodiments, the housing (10) (see FIG. 4) and / or the support structure (6) may be referred to by various other terms such as 'frame', 'frame structure', or 'framework'. The support structure (6) is an internal structure located in the internal space of the electronic device (1), and in some embodiments may be referred to by various other terms such as 'bracket' or 'support member'. In some embodiments, the support structure (6) may be interpreted as part of the housing (10).

[0059] According to one embodiment, the printed circuit board (7) may include a first part (71), a second part (72), and / or a third part (73). The third part (73) may electrically connect the first part (71) and the second part (72). In one embodiment, the third part (73) may have greater flexibility than the first part (71) and / or the second part (72). The third part (73) may have bending characteristics (e.g., flexibility) that allow it to bend without breakage while reducing stress generation under the same conditions compared to, for example, the first part (71) or the second part (72). In one embodiment, the third part (73) may be a substantially flexible part (or flexible section) of the printed circuit board (7), and the first part (71) or the second part (72) may be a substantially rigid part (or rigid section) of the printed circuit board (7). In one embodiment, the third part (73) may have a thinner thickness or fewer layers than the first part (71) or the second part (72), and thus may have greater flexibility than the first part (71) or the second part (72). In some embodiments, the third part (73) may contain a different material than the first part (71) or the second part (72) and may have greater flexibility than the first part (71) or the second part (72). A printed circuit board (7) may be formed by utilizing various other structures, including flexible parts and rigid parts, or parts having different flexibility. The printed circuit board (7) may be formed in a form including flexible parts and rigid parts, for example, as a rigid-flexible printed circuit board (FPCB). In some embodiments, the printed circuit board (7) may be formed in a form including parts having different flexibility, for example, as a flexible printed circuit board (FPCB).In some embodiments, the first part (71) or the second part (72) may be implemented substantially flexibly.

[0060] According to one embodiment, a first part (71) of the printed circuit board (7) may be placed or coupled to a support structure (6). A third part (73) of the printed circuit board (7) may be bent so that a second part (72) of the printed circuit board (7) may be placed overlapping the first part (71) of the printed circuit board (7).

[0061] In some embodiments, the second part (72) and the third part (73) of the printed circuit board (7) are formed integrally, and the third part (73) may be connected to the first part (71) of the printed circuit board (7) using a connector (e.g., FPCB connector) or a conductive adhesive material such as solder.

[0062] According to one embodiment, the printed circuit board (7) may include a front surface (7A) and a rear surface (7B) positioned opposite to the front surface (7A). A first microphone corresponding to a first microphone hole (101) of the first housing (11) may be positioned in a second part (72) of the printed circuit board (7). The first microphone may be positioned on the front surface (7A) between the first part (71) and the second part (72) of the printed circuit board (7). The second part (72) may include a second opening (702) corresponding to the first microphone. Sound waves, such as voice, may be provided to the first microphone from outside the electronic device (1) through the first microphone hole (101) and the second opening (702) aligned with the first microphone hole (101). In some embodiments, although not illustrated, the electronic device (1) may include a leak-prevention member positioned between the first housing (11) and the second part (72). The leak-prevention member may prevent or reduce the leakage of sound waves between the first housing (11) and the second part (72) of the printed circuit board (7), thereby contributing to allowing sound waves entering through the first microphone hole (101) to substantially move to the second opening (702).

[0063] According to one embodiment, a second microphone corresponding to a second microphone hole (102) of a first housing (11) may be placed in a first part (71) of a printed circuit board (7). The second part (72) of the printed circuit board (7) may be placed so as not to overlap with the second microphone or the second microphone hole (102). The second microphone may be placed, for example, on the rear surface (7B) of the printed circuit board (7) between the first part (71) and the support structure (6). The first part (71) may include a third opening (703) corresponding to the second microphone. Sound waves, such as voice, may be provided to the second microphone from outside the electronic device (1) through the second microphone hole (102) and the third opening (703) aligned with the second microphone hole (102). In some embodiments, although not illustrated, the electronic device (1) may include a leak-prevention member positioned between the first housing (11) and the first part (71). The leak-prevention member may prevent or reduce the leakage of sound waves between the first housing (11) and the first part (71) of the printed circuit board (7), thereby contributing to allowing sound waves entering through the second microphone hole (102) to be substantially moved to the third opening (703).

[0064] According to one embodiment, a first conductive pattern (13) (e.g., touch sensing circuit (531) of FIG. 5) may be placed in a second part (72) of a printed circuit board (7). The first conductive pattern (13) may be placed on the rear surface (7B) of the printed circuit board (7) between the second part (72) and the first housing (11). In one embodiment, the first conductive pattern (13) may include a first opening aligned with a first microphone hole (101). The first opening may be located between a second opening (702) of the printed circuit board (7) and a first microphone hole (101) of the first housing (11), and may be aligned with the second opening (702) and the first microphone hole (101). Sound waves can be provided to the first microphone from outside the electronic device (1) through the first microphone hole (101), the first opening, and the second opening (702). In some embodiments, although not illustrated, the first conductive pattern (13) may be implemented by modifying it to include a first opening in the form of a notch.

[0065] According to one embodiment, a second conductive pattern (14) (e.g., at least a portion of the antenna radiator (591) of FIG. 5) may be placed in a second portion (72) of the printed circuit board (7). The second conductive pattern (14) may be placed on the front (7A) of the printed circuit board (7) between the first portion (71) and the second portion (71) of the printed circuit board (7). In some embodiments, the second conductive pattern (14) may be placed on the rear (7B) of the printed circuit board (7) between the second portion (72) and the first housing (11). In some embodiments, the second conductive pattern (14) may be located inside the printed circuit board (7) between the front (7A) and the rear (7B) of the printed circuit board (7). For example, the second conductive pattern (14) may be located inside the printed circuit board closer to the rear (7B) than the front (7A), or closer to the front (7A) than the rear (7B).

[0066] According to one embodiment, when viewed from above (e.g., in the direction of the -z axis) of the surface on which the first conductive pattern (13) is placed in the second part (72) of the printed circuit board (7), the first conductive pattern (13) and the second conductive pattern (14) may not overlap. In one embodiment, when viewed from above of the surface on which the first conductive pattern (13) is placed in the second part (72) of the printed circuit board (7), the first conductive pattern (13) may overlap with the first microphone corresponding to the first microphone hole (101), and the second conductive pattern (14) may not overlap with the first microphone. In some embodiments, when viewed from above the surface on which the first conductive pattern (13) is placed in the second part (72) of the printed circuit board (7), the second conductive pattern (14) may partially overlap with the first conductive pattern (13).

[0067] FIG. 7 is a cross-sectional view relating to a substrate assembly (70) in an unfolded state in one embodiment. FIG. 8 is a cross-sectional view relating to a substrate assembly (70) in a folded state in one embodiment.

[0068] Referring to FIGS. 7 and 8, the substrate assembly (70) may include a printed circuit board (7), a processor (510), a communication module (590), a touch sensor IC (532), a first conductive pattern (13), a second conductive pattern (14), a first microphone (810), and / or a matching circuit (820).

[0069] The printed circuit board (7) can be deformed from the unfolded state of FIG. 7 to the folded state of FIG. 8 and positioned in the internal space of the electronic device (1). In the folded state of the printed circuit board (7), the second part (72) may be overlapped facing the first part (71). In the folded state of the printed circuit board (7), the third part (73) of the printed circuit board (7) may be arranged in a curved shape. Although not illustrated, a support member (or support structure) for maintaining the folded state of the printed circuit board (8) may be positioned between the first part (71) and the second part (72), and the first part (71) and the second part (72) may be positioned or coupled to the support member. In the folded state of the printed circuit board (7), the first part (71) and the second part (72) may be arranged in the form of substantially flat plates and may be substantially parallel. The front surface (7A) of the printed circuit board (7) may include a first surface (801) included in the second part (72) and a third surface (803) included in the first part (71). The rear surface (7B) of the printed circuit board (7) may include a second surface (802) included in the second part (72) and a fourth surface (804) included in the first part (71). In the folded state of the printed circuit board (7) (see FIG. 8), the first surface (801) may face the third surface (803) at a distance. In the folded state of the printed circuit board (7), the second side (802) and the third side (803) may face in a first direction (e.g., +z axis direction), and the first side (801) and the fourth side (804) may face in a second direction (e.g., -z axis direction) opposite to the first direction. The coordinate axes shown in FIGS. 7 and 8 are presented with respect to the first part (71) of the printed circuit board (7), and, for example, the +z axis may correspond to the direction in which the third side (803) substantially faces.

[0070] According to one embodiment, a processor (510), a communication module (590), or a touch sensor IC (532) may be placed on a first portion (71) of a printed circuit board (7). The processor (510) or the communication module (or communication circuit) (590) may be placed, for example, on a third side (803) of the front (7A) of the printed circuit board (7). The touch sensor IC (532) may be placed, for example, on a fourth side (804) of the front (7A) of the printed circuit board (7). In some embodiments, the processor (510) or the communication module (590) may be placed on a fourth side (804) of the front (7A) of the printed circuit board (7). In some embodiments, the touch sensor IC (532) may be placed on a third side (803) of the rear (7B) of the printed circuit board (7).

[0071] According to one embodiment, the first conductive pattern (13), the second conductive pattern (14), the first microphone (810), or the matching circuit (820) may be placed on a second portion (72) of the printed circuit board (7). The first conductive pattern (13) may be placed on the second surface (802) of the rear surface (7B) of the printed circuit board (7). The second conductive pattern (14) may be placed on the first surface (801) of the front surface (7A) of the printed circuit board (7). In one embodiment, the first conductive pattern (13) and / or the second conductive pattern (14) may be interpreted as components included in the printed circuit board (7). In some embodiments, the first conductive pattern (13) or the second conductive pattern (14) may be a separate metal member placed on the printed circuit board (7). The first microphone (810) may be placed on the first surface (801) of the front surface (7A) of the printed circuit board (7). The matching circuit (820) may be placed on the first surface (801) of the front surface (7A) of the printed circuit board (7). In the folded state of the printed circuit board (7) (see FIG. 8), the second conductive pattern (14), the first microphone (810), and the matching circuit (820) may be located between the first part (71) and the second part (72) of the printed circuit board (7).

[0072] According to some embodiments, the second conductive pattern (14) may be placed on a second surface (802) included in a second part (72) of the printed circuit board (7). In this case, the second conductive pattern (14) may be placed in an area of ​​the second surface (802) different from the area where the first conductive pattern (13) is placed. When viewed from above on the second surface (802) of the printed circuit board (7) (e.g., when viewed in the +z axis direction in the unfolded state of FIG. 7, or when viewed in the -z axis direction in the folded state of FIG. 8), the first conductive pattern (13) and the second conductive pattern (14) may be placed spaced apart without overlapping.

[0073] According to some embodiments, although not illustrated, the second conductive pattern (14) may be disposed at least partially inside the second part (72) of the printed circuit board (7). The second conductive pattern (14) may be disposed inside the second part (72) closer to the second surface (802) than to the first surface (801), for example, or closer to the first surface (801) than to the second surface (802).

[0074] According to some embodiments, the matching circuit (820) may be placed on a second surface (802) included in a second part (72) of the printed circuit board (7).

[0075] According to one embodiment, the processor (510) may be electrically connected to the first microphone (810) through a third electrical path (EP3) included in the printed circuit board (7). The processor (510) may be electrically connected to the communication module (590) through an electrical path (not shown) included in the printed circuit board (7). The processor (510) may be electrically connected to the touch sensor IC (532) through an electrical path (not shown) included in the printed circuit board (7).

[0076] According to one embodiment, the touch sensor IC (532) can be electrically connected to the first conductive pattern (13) (e.g., the touch sensing circuit (531) of FIG. 5) through a fourth electrical path (EP4) included in the printed circuit board (7).

[0077] According to one embodiment, a communication module (590) may be electrically connected to a second conductive pattern (14) (e.g., antenna radiator (591) of FIG. 5) through a first electrical path (EP1) included in a printed circuit board (7). The first electrical path (EP1) may be, for example, a feeding line (or transmission line) through which the communication module (590) supplies radiated current to the second conductive pattern (14).

[0078] According to one embodiment, in a folded state of the printed circuit board (7) (see FIG. 8), when viewed from above (e.g., in the -z axis direction) of the second surface (802) of the printed circuit board (7), the first conductive pattern (13) may overlap with the first microphone (810). The first conductive pattern (13) may include a first opening (701) aligned with the first microphone hole (101) (see FIG. 6) of the first housing (11). The second portion (72) of the printed circuit board (7) may include a second opening (702) corresponding to the first microphone (810). The first opening (701) may be located between the second opening (702) of the printed circuit board (7) and the first microphone hole (101) of the first housing (11) (see FIG. 6), and may be aligned with the second opening (702) and the first microphone hole (101). Sound waves may be provided to the first microphone (810) from outside the electronic device (1) through the first microphone hole (101), the first opening, and the second opening (702).

[0079] According to one embodiment, when viewed from above on the second surface (802) of the printed circuit board (7) (e.g., when viewed in the +z axis direction in the unfolded state of FIG. 7, or when viewed in the -z axis direction in the folded state of FIG. 8), the first conductive pattern (13) may not overlap with the second conductive pattern (14). In some embodiments, when viewed from above on the second surface (802) of the printed circuit board (7), the first conductive pattern (13) and the second conductive pattern (14) may overlap.

[0080] A printed circuit board (7) may include, for example, a plurality of stacked conductive layers and a dielectric (or insulator) disposed at least partially between the plurality of conductive layers. A conductive layer may include at least one conductive pattern. At least one conductive pattern included in any of the plurality of conductive layers may be utilized as a signal line (or electrical path). At least one conductive pattern included in any of the plurality of conductive layers may be utilized as a ground plane. Hereinafter, a conductive pattern utilized as at least part of a signal line may be referred to as a 'signal line pattern,' and a conductive pattern utilized as at least part of a ground plane may be referred to as a 'ground pattern.' The printed circuit board (7) may include a plurality of conductive vias. A conductive via may be a conductive hole in which a connecting wire is disposed to electrically connect the conductive patterns of different conductive layers. Conductive vias may include, for example, PTH (plated through hole), LVH (laser via hole), BVH (buried via hole), or stacked vias.

[0081] The printed circuit board (7) may include, for example, a ground structure. The ground structure is not short-circuited with at least one signal line, so that the signal or power transmitted through at least one signal line can be maintained. The ground structure can serve as an electromagnetic shielding structure to reduce electromagnetic effects (e.g., electromagnetic interference (EMI)) on at least one signal line. The ground structure can, for example, reduce electromagnetic interference between multiple signal lines. The ground structure can, for example, reduce the effect (e.g., signal loss or signal distortion) of electromagnetic noise (e.g., EMI) generated inside the electronic device (1) (see FIG. 2) or introduced from outside the electronic device (1) on a signal transmitted through at least one signal line included in the printed circuit board (7). The ground structure can, for example, reduce the effect of an electromagnetic field generated when current flows through at least one signal line on electrical elements around the printed circuit board (7). In one embodiment, the ground structure may include multiple ground patterns located on different layers included in the printed circuit board (7), and multiple conductive vias electrically connecting the multiple ground patterns. In one embodiment, the folded state of the printed circuit board (7) (Fig. 8 In the reference, the ground structure can reduce electromagnetic influence between the first part (71) and the second part (72). In one embodiment, when the printed circuit board (7) is in a folded state, the ground structure can reduce electromagnetic influence between one or more components (e.g., the first microphone (810) or the second conductive pattern (14)) placed on the first side (801) of the front surface (7A) of the printed circuit board (7) and one or more components placed on the third side (803) of the front surface (7A) of the printed circuit board (7).

[0082] According to one embodiment, although not illustrated, an electromagnetic shielding structure (or electromagnetic shielding member) of a conductive material may be positioned between a first part (71) and a second part (72) of a printed circuit board (7). The electromagnetic shielding structure may include, for example, a shield can. The electromagnetic shielding structure may reduce electromagnetic influence between the first part (71) and the second part (72). In a folded state of the printed circuit board (7) (see FIG. 8), the electromagnetic shielding structure may reduce electromagnetic influence between one or more components (e.g., a first microphone (810) or a second conductive pattern (14)) positioned on the first side (801) of the front surface (7A) of the printed circuit board (7) and one or more components positioned on the third side (803) of the front surface (7A) of the printed circuit board (7).

[0083] According to one embodiment, a first part (71), a second part (72), and a third part (73) of a printed circuit board (7) may form an impedance that is substantially the same or included in a critical range. Impedance matching between the first part (71), the second part (72), and the third part (73) can reduce power loss and / or transmission loss when a signal having a selected or specified frequency is transmitted through at least one signal line. Signal integrity can be ensured due to impedance matching between the first part (71), the second part (72), and the third part (73).

[0084] An antenna (or antenna device, or antenna system) may include, for example, a wireless communication circuit (e.g., the communication module (590) of FIG. 5 or 8), an antenna radiator (e.g., the antenna radiator (591) of FIG. 5), ground, or a transmission line. In one embodiment, the antenna radiator, ground, and transmission line may be included in a printed circuit board (7). The antenna radiator may include, for example, at least one conductive pattern included in the printed circuit board (7). The transmission line may include, for example, at least one electrical path included in the printed circuit board (7). The transmission line electrically connects the wireless communication circuit and at least one antenna radiator and can transmit a signal (voltage, current) of RF (radio frequency). The at least one antenna radiator may form an electromagnetic field capable of transmitting and / or receiving a signal of at least one frequency in a selected or designated frequency band when a radiated current is provided from the wireless communication circuit. The wireless communication circuit may process a transmitted signal or a received signal in at least one designated frequency band through the at least one antenna radiator. The ground (or antenna ground) may include, for example, a ground plane (or ground structure) included in the printed circuit board (7).

[0085] According to one embodiment, the printed circuit board (7) may include a first layer (81), a second layer (82), a third layer (83), a fourth layer (84), a fifth layer (85), and / or a sixth layer (86). The second layer (82) may be disposed between the first layer (81) and the third layer (83). The third layer (83) may be disposed between the second layer (82) and the fourth layer (84). The fourth layer (84) may be disposed between the third layer (83) and the fifth layer (85). The fifth layer (85) may be disposed between the fourth layer (84) and the sixth layer (86). The front surface (7A) of the printed circuit board (7) may be formed by the first layer (81). The back surface (7B) of the printed circuit board (7) may be formed by a sixth layer (86). Although not illustrated, an insulating layer (or dielectric) (e.g., prepreg (preimpregnated materials)) (e.g., insulating resin layer) may be disposed between two adjacent layers to electrically separate a conductive pattern contained in one layer and a conductive pattern contained in another layer. In some embodiments, at least one of the two adjacent layers may be interpreted to include an insulating layer to electrically separate a conductive pattern contained in one layer and a conductive pattern contained in another layer, as well as a conductive pattern. The printed circuit board (7) may be implemented by modification to include various other laminated structures, not limited to the illustrated example. The number of layers contained in the first part (71), the second part (72), or the third part (73) of the printed circuit board (7) may vary, not limited to the illustrated example.

[0086] According to some embodiments, the third part (73) of the printed circuit board (7) may have fewer layers or a thinner thickness than the first part (71) or the second part (72) of the printed circuit board (7).

[0087] According to some embodiments, the second part (72) of the printed circuit board (7) may have a smaller number of layers or a different thickness than the first part (71) of the printed circuit board (7).

[0088] According to one embodiment, the printed circuit board (7) may include a second electrical path (EP2). The second electrical path (EP2) may be a shunt line that electrically connects a ground structure included in the printed circuit board (7) to a circuit (hereinafter referred to as the 'radiating circuit') that includes a first electrical path (EP1) (e.g., a feed line) and a second conductive pattern (14). The second electrical path (EP2) may be included in a second part (72) of the printed circuit board (7). The second electrical path (EP2) may, for example, branch off from the first electrical path (EP1) and be electrically connected to the ground structure of the printed circuit board (7) in the second part (72) of the printed circuit board (7). The second electrical path (EP2) may, for another example, branch off from the second conductive pattern (14) and be electrically connected to the ground structure of the printed circuit board (7) at the second part (72) of the printed circuit board (7).

[0089] According to one embodiment, a ground structure of a printed circuit board (7) may include a first ground structure included in a first part (71), a second ground structure included in a second part (72), and a third ground structure included in a third part (73). The first ground structure may include at least one ground pattern included in at least some of a plurality of layers included in the first part (71). The second ground structure may include at least one ground pattern included in at least some of a plurality of layers included in the second part (72). The third ground structure may include at least one ground pattern included in at least some of one or more layers included in the third part (73). At least some of the third ground structure may electrically connect at least some of the first ground structure and at least some of the second ground structure. A second electrical path (EP2) may branch off from a radiating circuit (e.g., a circuit including a first electrical path (EP1) and a second conductive pattern (14)) and be electrically connected to at least a portion of a second ground structure. A matching circuit (820) may be placed in the second electrical path (EP2) of the printed circuit board (7). The radiating circuit may be electrically connected to at least a portion of the second ground structure through the matching circuit (820). The second electrical path (EP2) and the matching circuit (820) placed in the second electrical path (EP2) may contribute to enabling at least a portion of the ground structure included in the printed circuit board (7) to be utilized as an antenna ground (or antenna ground area) for the radiating circuit. The second electrical path (EP2) and the matching circuit (820) placed in the second electrical path (EP2) can strengthen the ground connection between the radiating circuit and the ground structure of the printed circuit board (7).The matching circuit (820) may have a component value that enables at least a portion of the ground structure included in the printed circuit board (7) to function better as an antenna ground for a radiating circuit that transmits and / or receives an electromagnetic signal in a selected or specified frequency band. The matching circuit (820) may have a component value that enables matching the impedance (e.g., characteristic impedance) between the transmission line and the load to enable maximum power transfer (or, minimize power loss) or efficient signal transfer by reducing reflection of the electromagnetic signal. In one embodiment, the matching circuit (820) may include an inductor (e.g., a shunt inductor). In some embodiments, the matching circuit (820) is not limited to an inductor and may be implemented as at least one electrical element (e.g., a lumped element or a passive element) having a component such as inductance, capacitance, or conductance, or as a shunt circuit or shunt element implemented as a combination of such electrical elements.

[0090] According to one embodiment, the second electrical path (EP2) and the matching circuit (820) placed in the second electrical path (EP2) can strengthen the ground connection between the radiating circuit (e.g., a circuit including the first electrical path (EP1) and the second conductive pattern (14)) and the ground structure of the printed circuit board (7), thereby reducing the impact of the second part (72) of the printed circuit board (7) and at least one electronic component placed therein (e.g., the first microphone (810)) on the radiating circuit. The second electrical path (EP2) and the matching circuit (820) placed in the second electrical path (EP2) can contribute to securing isolation of the radiating circuit by strengthening the ground connection between the radiating circuit and the ground structure of the printed circuit board (7).

[0091] According to one embodiment, when the communication module (590) provides a radiating current (or electromagnetic signal) to a first electrical path (EP1), a portion of the radiating current may flow to a second conductive pattern (14), and a portion of the radiating current may flow to a ground structure of the printed circuit board (7) through a second electrical path (EP2) in which a matching circuit (820) is disposed. The second conductive pattern (14) may function as a first radiating region (or first radiating part) having a distribution of radiating current that forms a radiating field (or electric field). At least a portion of the second ground structure included in the second part (72) of the printed circuit board (7) may function as a second radiating region (or second radiating part) having a distribution of radiating current that forms a radiating field. The antenna radiator (591) of FIG. 5 may include, for example, a second conductive pattern (14) operating as a first radiation region and at least a portion of a second ground structure operating as a second radiation region. The second electrical path (EP2) and the matching circuit (820) placed in the second electrical path (EP2) can match the impedance (e.g., characteristic impedance) to improve the electromagnetic coupling characteristics (or electromagnetic coupling effect) between the first radiation region and the second radiation region so as to secure antenna radiation performance in a selected or specified frequency band while reducing interference between the second radiation region and the first radiation region.

[0092] According to one embodiment, a communication module (590) can transmit and / or receive an electromagnetic signal in a first frequency band by using an antenna radiator comprising at least a portion of a second conductive pattern (14) operating as a first radiation area and a second ground structure operating as a second radiation area. The signal used by other components (e.g., a first microphone (810), or a first conductive pattern (13)) placed in the second part (72) of the printed circuit board (7) may be included in a second frequency band different from the first frequency band. Because the first frequency band and the second frequency band are different from each other, there may be substantially no electromagnetic influence between the antenna radiator and other components placed in the second part (72).

[0093] FIG. 9 is a block diagram relating to a circuit (900) included in an electronic device (1) in one embodiment. FIG. 10 is an xy plan view relating to a first layer (81) included in a printed circuit board (7) in one embodiment. FIG. 11 is an xy plan view relating to a second layer (82) included in a printed circuit board (7) in one embodiment. FIG. 12 is an xy plan view relating to a third layer (83) included in a printed circuit board (7) in one embodiment. FIG. 13 is an xy plan view relating to a fourth layer (84) included in a printed circuit board (7) in one embodiment. FIG. 14 is an xy plan view relating to a fifth layer (85) included in a printed circuit board (7) in one embodiment. FIG. 15 is an xy plan view relating to a sixth layer (86) included in a printed circuit board (7) in one embodiment.

[0094] Referring to FIG. 9, the circuit (900) may include a processor (510), a communication module (590), a touch sensor IC (532), a first conductive pattern (13), a second conductive pattern (14), a first microphone (810), a matching circuit (820), and / or a ground structure (G). The ground structure (G) may include a first ground structure (G1), a second ground structure (G2), and / or a third ground structure (G3).

[0095] According to one embodiment, the first ground structure (G1) may include a plurality of ground patterns (GP11, GP21, GP31, GP41, GP51, GP61) included in the first part (71) of the printed circuit board (7). The second ground structure (G2) may include a plurality of ground patterns (GP12, GP22, GP32, GP42) included in the second part (72) of the printed circuit board (7). The third ground structure (G3) may include one or more ground patterns (GP33, GP43) included in the third part (73) of the printed circuit board (7). Hereinafter, at least some of the ground structures included in any layer of the printed circuit board (7) may be referred to by various other terms such as 'ground layer', 'ground region', or 'ground plane', not limited to the term 'ground pattern'.

[0096] Referring to FIGS. 9 and 10, the first layer (81) of the printed circuit board (7) may include, for example, a first ground pattern (GP1), a first signal line pattern (SP), and a second conductive pattern (14). The first ground pattern (GP1) may include a ground pattern (GP11) included in a first part (71) of the printed circuit board (7), and a ground pattern (GP12) included in a second part (72) of the printed circuit board (7). The first signal line pattern (SP) may extend from the first part (71) through the third part (73) to the second part (72). A first electrical path (EP1) (see FIGS. 7 and 8) electrically connecting the second conductive pattern (14) and the communication module (590) may include the first signal line pattern (SP). The first layer (81) may include other signal line patterns other than the first signal line pattern (SP), although not indicated by a reference numeral. For example, the portion included in the first part (71) of the first layer (81) may include multiple signal line patterns used to electrically connect multiple electronic components placed in the first part (71). For example, the portion included in the second part (72) of the first layer (81) may include multiple signal line patterns used to electrically connect multiple electronic components placed in the second part (72). The portion included in the first part (71) of the first layer (81) may include a conductive pad portion (1001) for placing a processor (510) using a conductive adhesive material (e.g., solder). The portion included in the first part (71) of the first layer (81) may include a conductive pad portion (1002) for placing a communication module (590) using a conductive adhesive material. The portion included in the second part (72) of the first layer (81) may include a conductive pad portion (1003) for placing a first microphone (810) using a conductive adhesive material.

[0097] According to one embodiment, the portion included in the second part (72) of the first layer (81) may include a conductive pad portion (1004) for placing a matching circuit (820) using a conductive adhesive material. The conductive pad portion (1004) may include a first terminal (or first land) (1004a) and a second terminal (or second land) (1004b). The first terminal (1004a) may be connected to a first signal line pattern (SP). The second terminal (1004b) may be positioned spaced apart from the first terminal (1004a) and may be electrically connected to a ground pattern (G12). A matching circuit (820) can be placed on a first terminal (1004a) and a second terminal (1004b) using a conductive adhesive material, and the first terminal (1004a) and the second terminal (1004b) can be electrically connected through the matching circuit (820).

[0098] According to one embodiment, the portion included in the second portion (72) of the first layer (81) may further include a conductive pad portion (1005) for placing another matching circuit (830). The matching circuit (830) may be placed in a feed line between the communication module (590) and the radiating area (901) (see FIG. 9) (or the athena radiator (591) of FIG. 5). The matching circuit (830) may be placed in the wiring between the communication module (590) and the first signal line pattern (SP). The matching circuit (830) may be referred to as the 'matching circuit of the feed portion'. The matching circuit (830) may include at least one electrical element (e.g., a lumped element or a passive element) having a component such as inductance, capacitance, or conductance, or a combination of such electrical elements. The matching circuit (830) of the power supply section may have a component value capable of matching the impedance between the transmission line and the load to enable maximum power delivery (or, minimize power loss) or efficient signal delivery by reducing reflection of the electromagnetic signal.

[0099] According to one embodiment, the portion included in the third part (73) of the first layer (81) can be implemented as a non-ground area with substantially no ground pattern.

[0100] According to one embodiment, the portion included in the second part (72) of the first layer (81) may include a hole (702a) for a second opening (702) (see FIG. 8).

[0101] Referring to FIGS. 9 and 11, the second layer (82) of the printed circuit board (7) may include, for example, a second ground pattern (GP2). The second ground pattern (GP2) may include a ground pattern (G21) included in the first part (71) of the printed circuit board (7), and a ground pattern (GP22) included in the second part (72) of the printed circuit board (7). The portion of the second layer (82) included in the third part (73) may be implemented as a non-ground region (1101) that is substantially free of ground patterns. The portion of the second layer (82) included in the first part (71) or the second part (72) may include one or more signal line patterns, although not indicated by reference numerals. For example, a portion of the second layer (82) included in the first portion (71) may include a plurality of signal line patterns used to electrically connect a plurality of electronic components placed in the first portion (71). For example, a portion of the second layer (82) included in the second portion (72) may include a plurality of signal line patterns used to electrically connect a plurality of electronic components placed in the second portion (72).

[0102] According to one embodiment, the portion included in the second part (72) of the second layer (82) may include a hole (702b) for a second opening (702) (see FIG. 8). Referring to FIG. 9 and 12, the third layer (83) of the printed circuit board (7) may include, for example, a third ground pattern (GP3). The third ground pattern (GP3) may include a ground pattern (GP31) included in the first part (71) of the printed circuit board (7), a ground pattern (GP32) included in the second part (72) of the printed circuit board (7), and a ground pattern (GP33) included in the third part (73) of the printed circuit board (7). The ground pattern (GP33) included in the third part (73) can electrically connect the ground pattern (GP31) included in the first part (71) and the ground pattern (GP32) included in the second part (72). The substrate assembly (70) (see FIG. 8) may include two regions (e.g., an upper region and a lower region) separated by the third layer (83), and the third ground pattern (GP3) can reduce electromagnetic interference between the two regions. The portion of the third layer included in the first part (71) or the second part (72) may include one or more signal line patterns, although not indicated by reference numerals. For example, the portion of the third layer (83) included in the first part (71) may include a plurality of signal line patterns used to electrically connect a plurality of electronic components placed in the first part (71). For example, the portion included in the second part (72) of the third layer (83) may include a plurality of signal line patterns used to electrically connect a plurality of electronic components placed in the second part (72).

[0103] According to one embodiment, the portion included in the second part (72) of the third layer (83) may include a hole (702c) for the second opening (702) (see FIG. 8).

[0104] Referring to FIGS. 9 and 13, the fourth layer (84) of the printed circuit board (7) may include, for example, a fourth ground pattern (GP4). The fourth ground pattern (GP4) may include a ground pattern (GP41) included in the first part (71) of the printed circuit board (7), a ground pattern (GP42) included in the second part (72) of the printed circuit board (7), and a ground pattern (GP43) included in the third part (73) of the printed circuit board (7). The ground pattern (GP43) included in the third part (73) may electrically connect the ground pattern (GP41) included in the first part (71) and the ground pattern (GP42) included in the second part (72). The fourth layer (83) may include a plurality of second signal line patterns extending from the first part (71) through the third part (73) to the second part (72), although not indicated by a reference numeral. For example, a third electrical path (EP3) (see FIGS. 7 and 8) electrically connecting the processor (510) and the first microphone (810) may include at least one of the plurality of second signal line patterns. For example, a fourth electrical path (EP4) (see FIGS. 7 and 8) electrically connecting the touch sensor IC (532) and the first conductive pattern (13) may include at least one of the plurality of second signal line patterns. A portion of the fourth layer (84) included in the first part (71) or the second part (72) may include one or more signal line patterns, although not indicated by a reference numeral. For example, a portion included in the first portion (71) of the fourth layer (84) may include a plurality of signal line patterns used to electrically connect a plurality of electronic components placed in the first portion (71). For example, a portion included in the second portion (72) of the fourth layer (84) may include a plurality of signal line patterns used to electrically connect a plurality of electronic components placed in the second portion (72).

[0105] According to one embodiment, at least one of the plurality of second signal line patterns included in the fourth layer (84) may be electrically connected to a processor (510) placed in the first part (71) through a conductive via included in the first part (71) of the printed circuit board (7). At least one of the plurality of second signal line patterns included in the fourth layer (84) may be electrically connected to a first microphone (810) placed in the second part (72) through a conductive via included in the second part (72) of the printed circuit board (7). A third electrical path (EP3) (see FIG. 7 and 8) electrically connecting the first microphone (810) and the processor (510) may include at least one second signal line pattern, a conductive via electrically connecting the processor (510) and at least one second signal line pattern, and a conductive via electrically connecting the first microphone (810) and at least one second signal line.

[0106] According to one embodiment, at least one of the plurality of second signal line patterns included in the fourth layer (84) may be electrically connected to a touch sensor IC (532) placed in the first part (71) through a conductive via included in the first part (71) of the printed circuit board (7). At least one of the plurality of second signal line patterns included in the fourth layer (84) may be electrically connected to a first conductive pattern (13) (e.g., touch detection circuit (531) of FIG. 5) placed in the second part (72) through a conductive via included in the second part (72) of the printed circuit board (7). A fourth electrical path (EP4) (see FIG. 7 and 8) electrically connecting the first conductive pattern (13) and the touch sensor IC (532) may include at least one second signal line pattern, a conductive via electrically connecting the touch sensor IC (532) and at least one second signal line pattern, and a conductive via electrically connecting the first conductive pattern (13) and at least one second signal line pattern.

[0107] According to one embodiment, the portion included in the second part (72) of the fourth layer (84) may include a hole (702d) for a second opening (702) (see FIG. 8).

[0108] Referring to FIGS. 9 and 14, the fifth layer (85) of the printed circuit board (7) may include, for example, a fifth ground pattern (GP51). The fifth ground pattern (GP51) may be included in the first portion (71) of the printed circuit board (7). The portion of the fifth layer (85) included in the first portion (71) may include one or more signal line patterns, although not indicated by reference numerals. For example, the portion of the fifth layer (85) included in the first portion (71) may include a plurality of signal line patterns used to electrically connect a plurality of electronic components placed in the first portion (71).

[0109] According to one embodiment, the portion included in the second portion (72) of the fifth layer (85) and / or the portion included in the third portion (73) of the fifth layer (82) may be implemented as a non-ground region with substantially no ground pattern.

[0110] According to one embodiment, the portion included in the second part (72) of the fifth layer (85) may include a hole (702e) for the second opening (702) (see FIG. 8).

[0111] Referring to FIGS. 9 and 15, the sixth layer (86) of the printed circuit board (7) may include, for example, a second conductive pattern (14) and a sixth ground pattern (G61). The second conductive pattern (14) may be included in a second portion (72) of the printed circuit board (7). The second conductive pattern (14) may include a first opening (701) corresponding to a first microphone (810) (see FIG. 10). The sixth ground pattern (GP61) may be included in a first portion (71) of the printed circuit board (7). The portion of the sixth layer (86) included in the first portion (71) of the printed circuit board (7) may include, for example, conductive pad portions for placing electronic components such as a touch sensor IC (532) using a conductive adhesive material (e.g., solder), although not indicated by a reference numeral. The portion included in the first part (71) of the sixth layer (86) may include one or more signal line patterns, although not indicated by drawing symbols. For example, the portion included in the first part (71) of the sixth layer (86) may include multiple signal line patterns used to electrically connect multiple electronic components placed in the first part (71).

[0112] According to one embodiment, the portion included in the third part (73) of the sixth layer (86) may be implemented as a non-ground region with substantially no ground pattern.

[0113] According to one embodiment, the portion included in the second part (72) of the sixth layer (86) may include a hole (702f) for the second opening (702) (see FIG. 8).

[0114] According to one embodiment, a first portion (71) of a printed circuit board (7) may include a plurality of conductive vias (e.g., PTH, LVH, BVH, or stacked via) that electrically connect a plurality of ground patterns included in different layers. One or more conductive vias included in the first portion (71) may electrically connect at least two of a plurality of ground patterns (GP11, GP21, GP31, GP41, GP51, GP61) included in a first ground structure (G1). The first ground structure (G1) may be a structure including a plurality of ground patterns (GP11, GP21, GP31, GP41, GP51, GP61) and a plurality of conductive vias.

[0115] According to one embodiment, a second part (72) of a printed circuit board (7) may include a plurality of conductive vias (e.g., PTH, LVH, BVH, or stacked via) that electrically connect a plurality of ground patterns included in different layers. One or more conductive vias included in the second part (72) may electrically connect at least two of a plurality of ground patterns (GP12, GP22, GP32, GP42) included in a second ground structure (G2). The second ground structure (G2) may be a structure including a plurality of ground patterns (GP11, GP21, GP31, GP41, GP51, GP61) and a plurality of conductive vias.

[0116] According to one embodiment, because damage to the vias (e.g., via cracks) may occur when the third part (73) is bent, the third part (73) of the printed circuit board (7) may not include a plurality of conductive vias electrically connecting ground patterns (GP33, GP43) of different layers. In some embodiments, the third part (73) may include one or more conductive vias provided at a location where damage to the vias does not substantially occur when the third part (73) is bent.

[0117] According to one embodiment, a second part (72) of a printed circuit board (7) may not include a conductive via that electrically connects a ground pattern (GP32) included in a third ground pattern (GP3) of a third layer (83) and a ground pattern (GP42) included in a fourth ground pattern (GP4) of a fourth layer (84). In the second part (72), the ground pattern (GP32) included in the third ground pattern (GP3) of the third layer (83) and the ground pattern (GP42) included in the fourth ground pattern (GP4) of the fourth layer (84) may be electrically separated. In the second part (72), the ground pattern (G12) of the first layer (81), the ground pattern (G22) of the second layer (82), and the ground pattern (G32) of the third layer (83) may be electrically connected through one or more conductive vias. In one embodiment, a portion of the second ground structure (G2) including the ground pattern (G12) of the first layer (81), the ground pattern (G22) of the second layer (82), and the ground pattern (G32) of the third layer (83) (hereinafter referred to as 'at least one third conductive pattern') may be electrically connected to a second electrical path (EP2) in which a matching circuit (820) is disposed. A radiating circuit (e.g., a circuit including a first electrical path (EP1) and a second conductive pattern (14)) may be electrically connected to at least one third conductive pattern of a second ground structure (G2) through a second electrical path (EP2) in which a matching circuit (820) is placed. The second electrical path (EP2) and the matching circuit (820) placed in the second electrical path (EP2) may contribute to enabling at least a portion of the ground structure (G) included in the printed circuit board (7) to be utilized as an antenna ground (or antenna ground area) for the second conductive pattern (14).The second electrical path (EP2) and the matching circuit (820) placed in the second electrical path (EP2) can strengthen the ground connection between the radiating circuit and the ground structure (G) of the printed circuit board (7). At least one third conductive pattern of the second part (72) can be electrically connected to the first ground structure (G1) of the first part (71) through the ground pattern (GP33) included in the third part (73) of the third layer (83). A ground pattern (GP33) included in the third part (73) of the third layer (83) may contribute to expanding or reinforcing the antenna ground so that the antenna ground for the radiating circuit is not limited to at least one third conductive pattern of the second part (72) but further includes at least one third conductive pattern of the second part (72) and a first ground structure (G1) of the first part (71). In some embodiments, the ground pattern (GP32) included in the second part (72) of the third layer (83) and the ground pattern (GP42) included in the second part (72) of the fourth layer (84) may be electrically connected through one or more conductive vias, and the antenna ground may be further expanded or reinforcing. The portion of the first ground structure (G1) of the first part (71) used as an antenna ground may vary, not limited to the illustrated example, depending on the omission or addition of a ground pattern, electrical connection between any two ground patterns of different layers, or electrical separation between any two ground patterns of different layers. The portion of the second ground structure (G2) of the second part (72) used as an antenna ground may vary, not limited to the illustrated example, depending on the omission or addition of a ground pattern, electrical connection between any two ground patterns of different layers, or electrical separation between any two ground patterns of different layers.The portion of the third ground structure (G3) of the third part (73) used as an antenna ground may vary, not limited to the illustrated example, depending on the omission or addition of any ground pattern, electrical connection between any two ground patterns of different layers, or electrical separation between any two ground patterns of different layers.

[0118] According to one embodiment, the matching circuit (820) may have a component value that enables at least a portion of the ground structure (G) included in the printed circuit board (7) to better function as an antenna ground for a circuit that transmits and / or radiates an electromagnetic signal in a selected or specified frequency band (e.g., a circuit including a first electrical path (EP1) and a second conductive pattern (14). The matching circuit (820) may have a component value that enables matching the impedance (e.g., characteristic impedance) between the transmission line and the load to enable maximum power transfer (or, minimize power loss) or efficient signal transfer by reducing reflection of the electromagnetic signal. In one embodiment, the matching circuit (820) may include an inductor (e.g., a shunt inductor).

[0119] According to one embodiment, the second electrical path (EP2) and the matching circuit (820) placed in the second electrical path (EP2) can strengthen the ground connection between the radiating circuit (e.g., a circuit including the first electrical path (EP1) and the second conductive pattern (14)) and the ground structure (G) of the printed circuit board (7) to reduce the impact of the second part (72) of the printed circuit board (7) and at least one electronic component (e.g., the first microphone (810)) placed thereon on the radiating circuit. The second electrical path (EP2) and the matching circuit (820) placed in the second electrical path (EP2) can contribute to securing isolation of the radiating circuit by strengthening the ground connection between the radiating circuit and the ground structure of the printed circuit board (7).

[0120] According to one embodiment, when a communication module (590) provides a radiating current (or electromagnetic signal) to a first electrical path (EP1), a portion of the radiating current may flow to a second conductive pattern (14), and a portion of the radiating current may flow to a ground structure (G) of a printed circuit board (7) through a second electrical path (EP2) in which a matching circuit (820) is disposed. The second conductive pattern (14) may function as a first radiating region (or first radiating part) having a distribution of radiating current that forms a radiating field (or electric field). At least a portion of the second ground structure (G) included in the second part (72) of the printed circuit board (7) (e.g., ground pattern (G12), ground pattern (G22), and ground pattern (G32)) may function as a second radiating region (or second radiating part) having a distribution of radiating current that forms a radiating field. The second electrical path (EP2) and the matching circuit (820) placed in the second electrical path (EP2) can match the impedance (e.g., characteristic impedance) to improve the electromagnetic coupling characteristics (or electromagnetic coupling effect) with the first radiation area so that antenna radiation performance can be secured in a selected or specified frequency band while reducing interference between the second radiation area and the first radiation area. In a comparative example where the second electrical path (EP2) and the matching circuit (820) are omitted, the radiation circuit (e.g., a circuit including the first electrical path (EP1) and the second conductive pattern (14)) may be the actual radiation area (902). One embodiment of the present document, comprising a second electrical path (EP2) and a matching circuit (820) placed in the second electrical path (EP2), may have a more extended radiation area (901) compared to a comparative example, which may be more advantageous for securing antenna radiation performance or radio wave transmission and reception performance. One embodiment of the present document may reduce the influence (or interference) on the radiation circuit by the second part (72) of the printed circuit board (7) and at least one electronic component placed thereon compared to a comparative example.

[0121] According to one embodiment of the present document, an electronic device (e.g., electronic device (1) of FIG. 2) may include a printed circuit board (e.g., printed circuit board (7) of FIG. 8). The printed circuit board may include a first part (e.g., first part (71) of FIG. 8), a second part (e.g., second part (72) of FIG. 8), and a third part (e.g., third part (73) of FIG. 8) connecting the first part and the second part. The first part may include a first surface of the printed circuit board (e.g., first surface (801) of FIG. 8) and a second surface (e.g., second surface (802) of FIG. 8) positioned opposite to the first surface. The second portion may form a third surface of the printed circuit board (e.g., the third surface (803) in FIG. 8) and a fourth surface (e.g., the fourth surface (804) in FIG. 8) positioned opposite to the third surface. The electronic device may include a microphone (e.g., the first microphone (810) in FIG. 8) positioned on the first surface. The electronic device may include a conductive pattern (e.g., the second conductive pattern (14) in FIG. 8) positioned on the first surface. The conductive pattern may surround at least a portion of the microphone. The electronic device may include a wireless communication circuit (e.g., the communication module (590) in FIG. 8) positioned on the first portion. The printed circuit board may include a first electrical path (e.g., the first electrical path (EP1) of FIG. 8) and a second electrical path (e.g., the second electrical path (EP2) of FIG. 8). The first electrical path may electrically connect the conductive pattern and the wireless communication circuit. The second electrical path may be included in the second part. The second electrical path may electrically connect a ground area included in the printed circuit board (e.g., the ground structure (G) of FIG. 9) to the first electrical path or the conductive pattern.

[0122] According to one embodiment of the present document, the electronic device may further include a matching circuit (e.g., a matching circuit of FIG. 8 (820)) disposed in the second electrical path (e.g., a second electrical path (EP2) of FIG. 8) on the first surface (e.g., the first surface (801) of FIG. 8).

[0123] According to one embodiment of the present document, the matching circuit (e.g., the matching circuit of FIG. 8 (820)) may include an inductor.

[0124] According to one embodiment of the present document, at least a portion included in the second part of the ground area (e.g., at least a portion of the second ground structure (G2) of FIG. 9) is electrically connected to the second electrical path (e.g., the second electrical path (EP2) of FIG. 9) in which the matching circuit (e.g., the matching circuit (820) of FIG. 9) is placed, so as to operate as an antenna radiator together with the conductive pattern (e.g., the second conductive pattern (14) of FIG. 9).

[0125] According to one embodiment of the present document, the ground region may include a first ground region included in the first part (e.g., at least a part of the first ground structure (G1) of FIG. 9). The ground region may include a second ground region included in the second part (e.g., at least a part of the second ground structure (G2) of FIG. 9). The ground region may include a third ground region included in the third part and connecting the first ground region and the second ground region (e.g., at least a part of the third ground structure (G3) of FIG. 9). The second electrical path (e.g., the second electrical path (EP2) of FIG. 9) may electrically connect the first electrical path (e.g., the first electrical path (EP1) of FIG. 9) or the conductive pattern (e.g., the second conductive pattern (14) of FIG. 9) to the third ground region.

[0126] According to one embodiment of the present document, the second part (e.g., the second part (72) of FIG. 8) may further include another ground region (e.g., the ground pattern (G12 or G22) of FIG. 9). The other ground region may be included in a layer different from the second ground region (e.g., the ground pattern (G32) of FIG. 9). The other ground region may be electrically connected to the second ground region through a conductive via.

[0127] According to one embodiment of the present document, the first part (e.g., the first part (71) of FIG. 8) may further include another ground region (e.g., the ground pattern (G11, G21, G41, G51, or G61) of FIG. 9). The other ground region may be included in a different layer from the first ground region (e.g., the ground pattern (G31) of FIG. 9). The other ground region may be electrically connected to the first ground region through a conductive via.

[0128] According to one embodiment of the present document, the printed circuit board may include a plurality of layers (e.g., a first layer (81), a second layer (82), a third layer (83), a fourth layer (84), a fifth layer (85), and a sixth layer (86) of FIG. 8). The first electrical path (e.g., a first electrical path (EP1) of FIG. 9) may include a portion (e.g., a first signal line pattern (SP) of FIG. 10) disposed on the layer that is closest to the first surface (e.g., a first surface (801) of FIG. 8) among the plurality of layers or on the layer that forms the first surface (e.g., a first layer (81) of FIG. 8).

[0129] According to one embodiment of the present document, the third part (e.g., the third part (73) of FIG. 8) may have greater flexibility than the first part (e.g., the first part (71) of FIG. 8) or the second part (e.g., the second part (72) of FIG. 8).

[0130] According to one embodiment of the present document, the third part (e.g., the third part (73) of FIG. 8) may have a thinner thickness or fewer layers than the first part (e.g., the first part (71) of FIG. 8) or the second part (e.g., the second part (72) of FIG. 8).

[0131] According to one embodiment of the present document, the third part (e.g., the third part (73) of FIG. 8) is bent so that the first surface (e.g., the first surface (801) of FIG. 8) and the third surface (e.g., the third surface (803) of FIG. 8) are spaced apart and face each other. The microphone (e.g., the first microphone (810) of FIG. 8) and the conductive pattern (e.g., the second conductive pattern (14) of FIG. 8) may be positioned between the first surface and the third.

[0132] According to one embodiment of the present document, the second part (e.g., the second part (72) of FIG. 8) may include an opening (e.g., the second opening (802) of FIG. 8) that penetrates between the first surface (e.g., the first surface (801) of FIG. 8) and the second surface (e.g., the second surface (802) of FIG. 8) in correspondence with the microphone (e.g., the first microphone (810) of FIG. 8).

[0133] According to one embodiment of the present document, the electronic device may further include a touch sensing circuit (e.g., a first conductive pattern (13) of FIG. 8) disposed on the second surface (e.g., the second surface (802) of FIG. 8). The electronic device may further include a touch sensor IC (e.g., a touch sensor IC (532) of FIG. 8) disposed on the first portion. The touch sensor IC may be electrically connected to the touch sensing circuit.

[0134] According to one embodiment of the present document, the conductive pattern (e.g., the second conductive pattern (14) of FIG. 8) may not overlap with the touch sensing circuit (e.g., the first conductive pattern (13) of FIG. 8) when viewed from above the first surface (e.g., the first surface (801) of FIG. 8).

[0135] According to one embodiment of the present document, the electronic device may include a wearable device.

[0136] The embodiments disclosed in this document and drawings are provided merely as specific examples to facilitate the explanation of the technical content according to the embodiments and to aid in understanding the embodiments, and are not intended to limit the scope of the embodiments. Therefore, the scope of the various embodiments of this document should be interpreted to include modified or altered forms in addition to the embodiments disclosed herein. Explanation of the symbols

[0137] 800: Cross-sectional structure 7: Printed circuit board 71: Part 1 72: Part 2 73: Part 3 7A: Front 7B: Rear 801: Page 1 802: Page 2 803: Page 3 804: Page 4 510: Processor 590: Communication module 532: Touch Sensor IC 13: The first conductive pattern 14: Second Conductivity Pattern 810: 1st Microphone 820: Matching circuit EP1: First Electrical Path EP2: Second Electrical Path EP3: Third Electrical Path EP4: The 4th Electrical Path

Claims

Claim 1 An electronic device comprising a printed circuit board including a first part, a second part, and a third part extending between the first part and the second part, wherein the first part includes a first surface of the printed circuit board and a second surface disposed opposite to the first surface, and the second part includes a third surface of the printed circuit board and a fourth surface disposed opposite to the third surface; a microphone disposed on the first surface; a conductive pattern disposed on the first surface and at least partially surrounding the microphone; and a wireless communication circuit disposed on the first part, wherein the printed circuit board comprises: a first electrical path electrically connecting the conductive pattern and the wireless communication circuit; and a second electrical path included in the second part that electrically connects a ground area included in the printed circuit board to the first electrical path or the conductive pattern. Claim 2 An electronic device according to claim 1, further comprising a matching circuit disposed in the second electrical path on the first surface. Claim 3 delete Claim 4 An electronic device according to claim 2, wherein at least a portion of the ground region included in the second part is electrically connected to the second electrical path on which the matching circuit is placed, and configured to operate as an antenna radiator together with the conductive pattern. Claim 5 An electronic device according to claim 1, wherein the ground region comprises a first ground region included in the first part, a second ground region included in the second part, and a third ground region included in the third part and connecting the first ground region and the second ground region, and the second electrical path electrically connects the first electrical path or the conductive pattern to the third ground region. Claim 6 delete Claim 7 delete Claim 8 An electronic device according to claim 1, wherein the printed circuit board comprises a plurality of layers, and the first electrical path comprises a portion disposed in the layer closest to the first surface among the plurality of layers or forming the first surface. Claim 9 In claim 1, the third part is an electronic device having greater flexibility than the first part or the second part. Claim 10 delete Claim 11 An electronic device according to claim 1, wherein the third part is bent so that the first surface and the third surface are spaced apart and face each other, and the microphone and the conductive pattern are located between the first surface and the third surface. Claim 12 An electronic device according to claim 1, wherein the second part includes an opening penetrating between the first surface and the second surface corresponding to the microphone. Claim 13 An electronic device according to claim 1, further comprising: a touch sensing circuit disposed on the second surface; and a touch sensor IC (integrated circuit) disposed on the first portion and electrically connected to the touch sensing circuit. Claim 14 delete Claim 15 In claim 1, the electronic device is an electronic device including an ear wearable device.

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