Chuck for securing a wafer

Abstract

The present invention has the advantage of being able to stably flatten a wafer (1) that has warped, by individually supporting and correcting the edge (2) of a warped wafer (1) through a rotating plate assembly (200) placed at the edge of a plate (100).

Description

Technology Field

[0001] The present invention relates to a chuck for fixing a wafer, and more specifically, to a chuck for fixing a curved wafer. Background Technology

[0002] Wafers are processed into flat discs, but they can warp due to the effects of heat, mechanical stress, chemical action, etc. Warpage is a critical issue in the semiconductor manufacturing process and can degrade wafer quality.

[0003] The causes of wafer warping can be broadly divided into two categories. The first is warping caused by heat. Since wafers have a high coefficient of thermal expansion, they expand when heat is applied and contract when cooled. If the wafer does not expand or contract uniformly, warping may occur. The second is warping caused by mechanical stress. Warping can occur due to uneven mechanical stress between the upper and lower surfaces of the wafer during the process of moving or processing the wafer.

[0004] When the degree of wafer warping is severe, air leakage occurs through the gap between the surface of the vacuum chuck and the back of the wafer, preventing the wafer from being fixed to the surface of the vacuum chuck. Consequently, there was a problem in that the wafer could not be fixed to the vacuum chuck of various equipment used in the semiconductor manufacturing process, making it impossible to proceed with the manufacturing process.

[0005] To prevent such wafer warping, methods to lower the coefficient of thermal expansion of the wafer or minimize mechanical stress are being studied.

[0006] In addition, a vacuum chuck was developed to keep warped wafers flat during the manufacturing process.

[0007] For example, Korean Published Patents No. 10-2017-0122275, No. 10-2018-0065945, and Korean Published Patent No. 10-2001-0074368 disclose vacuum chucks that maintain a bent wafer flat using a vacuum adsorption means. Prior art literature

[0008] Republic of Korea Published Patent No. 10-2017-0122275 Republic of Korea Published Patent No. 10-2018-0065945 Republic of Korea Published Patent No. 10-2001-0074368 The problem to be solved

[0009] The present invention was devised to solve the aforementioned conventional problems and aims to provide a chuck for fixing a bent wafer. means of solving the problem

[0010] The present invention provides a chuck for fixing a curved wafer comprising a plate (100) supporting a wafer (1), a rotating plate assembly (200) disposed at the edge of the plate (100) and rotated relative to the plate (100) in an up-and-down direction, a main vacuum assembly (300) for fixing the wafer (1) by forming a vacuum on the upper surface of the plate (100), and a rotating vacuum assembly (400) for fixing the edge of the wafer (1) by forming a vacuum in the rotating plate assembly (200).

[0011] The above-mentioned rotating plate assembly (200) may include a first rotating plate assembly (201), a second rotating plate assembly (202), a third rotating plate assembly (203), and a fourth rotating plate assembly (204).

[0012] The above plate (100) may include a rotation groove (110) into which the above-mentioned rotating plate assembly (200) is inserted.

[0013] The above rotation groove (110) may include a first rotation groove (111) into which the first rotational plate assembly (201) is inserted, a second rotation groove (112) into which the second rotational plate assembly (202) is inserted, a third rotation groove (113) into which the third rotational plate assembly (203) is inserted, and a fourth rotation groove (114) into which the fourth rotational plate assembly (204) is inserted.

[0014] It may further include an angle rotation assembly (500) that is assembled to the plate (100) and the rotating plate assembly (200) and rotates the rotating plate assembly (200) in an up-and-down direction. Effects of the invention

[0015] First, the present invention has the advantage of being able to stably flatten a wafer (1) that has warped, by individually supporting and correcting the edge (2) of a warped wafer (1) through a rotating plate assembly (200) placed at the edge of a plate (100).

[0016] Second, the present invention has the advantage of being able to stably fix a wafer (1) with a large degree of bending by providing vacuum suction force to the entire upper surface of the plate (100) through the main vacuum assembly (300) and additionally suctioning and fixing the edge (2) of the wafer (1) through the rotating vacuum assembly (400).

[0017] Third, the present invention has the advantage of being able to flatten the curved edge (2) of the wafer (1) stepwise by controlling the rotation angle of the rotating plate (210) through the angle rotation assembly (500), thereby reducing local stress applied to the wafer (1) and minimizing damage.

[0018] Fourth, since the present invention can individually control a plurality of rotating plate assemblies (200) and each rotating assembly (500), it can selectively correct according to the bending direction or degree of bending of the wafer (1), thus having the advantage of being able to respond to various types of wafer bending.

[0019] Fifth, the present invention has the advantage of being able to maintain a stable adsorption state even during the rotation of the rotating plate (210) because it is possible to adsorb closely to the edge (2) of the wafer (1) through the adsorption bellows (440).

[0020] Sixth, the present invention has the advantage of being able to efficiently implement the arrangement of vacuum channels and achieve miniaturization and structural simplification of the device by configuring the plate (100) with an upper plate (101) and a lower plate (102) to form a rotary connecting channel inside. Brief explanation of the drawing

[0021] FIG. 1 is a plan view of a chuck for fixing a curved wafer according to a first embodiment of the present invention. Figure 2 is a bottom view of Figure 1. Figure 3 is a cross-sectional view of Figure 1. Figure 4 is an example diagram of Figure 1 before operation. Figure 5 is a partial enlarged view of Figure 3. Figure 6 is a partial enlarged view of Figure 4. Specific details for implementing the invention

[0022] The present invention is susceptible to various modifications and may have various embodiments; specific embodiments are illustrated in the drawings and described in detail in the detailed description. However, this is not intended to limit the invention to specific embodiments, and it should be understood that the invention includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the invention. Similar reference numerals have been used for similar components in the description of each drawing.

[0023] Terms such as first, second, A, B, etc., may be used to describe various components, but said components shall not be limited by said terms. These terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component. The term "and / or" includes a combination of a plurality of related described items or any of a plurality of related described items.

[0024] When it is stated that one component is "connected" or "connected" to another component, it should be understood that while it may be directly connected or connected to that other component, there may also be other components in between. On the other hand, when it is stated that one component is "directly connected" or "directly connected" to another component, it should be understood that there are no other components in between.

[0025] The terms used in this application are used merely to describe specific embodiments and are not intended to limit the invention. The singular expression includes the plural expression unless the context clearly indicates otherwise. In this application, terms such as "comprising" or "having" are intended to specify the presence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0026] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this application.

[0027] In this document, "configured to" may be used interchangeably with, depending on the context, for example, in hardware or software, "suitable for," "capable of," "modified to," "made to," "capable of," or "designed to." In some situations, the expression "device configured to" may mean that the device is "capable of" doing something together with other devices or components.

[0028] Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the attached drawings. In order to facilitate an overall understanding of the present invention, the same reference numerals are used for identical components in the drawings, and redundant descriptions of identical components are omitted.

[0029] FIG. 1 is a plan view of a chuck for fixing a curved wafer according to a first embodiment of the present invention, FIG. 2 is a bottom view of FIG. 1, FIG. 3 is a front cross-sectional view of FIG. 1, FIG. 4 is an example view of FIG. 1 before operation, FIG. 5 is a partial enlarged view of FIG. 3, and FIG. 6 is a partial enlarged view of FIG. 4.

[0030] A chuck for fixing a curved wafer according to the present embodiment comprises a plate (100) supporting a wafer (1), a rotating plate assembly (200) disposed at the edge of the plate (100) and rotated relative to the plate (100) in an up-and-down direction, a main vacuum assembly (300) that fixes the wafer (1) by forming a vacuum on the upper surface of the plate (100), and a rotating vacuum assembly (400) that fixes the edge of the wafer (1) by forming a vacuum in the rotating plate assembly (200).

[0031] The chuck for fixing a curved wafer according to the present embodiment further includes an angle rotation assembly (500) that is assembled to the plate (100) and the rotating plate assembly (200) and rotates the rotating plate assembly (200) in an up-and-down direction.

[0032] In this embodiment, the plate (100) is formed in the shape of a disc.

[0033] At least one of the above-mentioned rotating plate assemblies (200) is disposed at the edge of the plate (100), and in this embodiment, four are disposed. Unlike this embodiment, the number of the above-mentioned rotating plate assemblies (200) can be set in various ways.

[0034] When viewed from the top view, the rotating plate assembly (200) is arranged at 90-degree intervals based on the planar center of the plate (100).

[0035] The above-mentioned rotating plate assembly (200) includes a first rotating plate assembly (201), a second rotating plate assembly (202), a third rotating plate assembly (203), and a fourth rotating plate assembly (204). The structures of the first rotating plate assembly (201), the second rotating plate assembly (202), the third rotating plate assembly (203), and the fourth rotating plate assembly (204) are identical.

[0036] The plate (100) includes a rotation groove (110) into which the rotating plate assembly (200) is inserted, and the rotation groove (110) includes a first rotation groove (111) into which the first rotating plate assembly (201) is inserted, a second rotation groove (112) into which the second rotating plate assembly (202) is inserted, a third rotation groove (113) into which the third rotating plate assembly (203) is inserted, and a fourth rotation groove (114) into which the fourth rotating plate assembly (204) is inserted.

[0037] The above plate (100) is formed concavely from the upper side (105) downward and includes an upper channel (120) that receives pressure control of the main vacuum assembly (300), and a main vacuum hole (130) disposed in the upper channel (120) and connected to the main vacuum assembly (300) by penetrating the plate (100) in the thickness direction (upward and downward direction in this embodiment).

[0038] The upper channel (120) comprises an inner ring channel (121) which is positioned on the planar center side of the plate (100) and formed in a ring shape when viewed from the top, an outer ring channel (122) which is positioned radially outward from the inner ring channel (121) when viewed from the top, and a radial channel (125) which is positioned radially from the inner ring channel (121).

[0039] When viewed from the top view, the upper channel (120) may further include a middle channel (123) that is positioned between the inner ring channel (121) and the outer ring channel (122) and is formed in a ring shape.

[0040] A plurality of protrusions are arranged on the inner side of the inner ring channel (121). The protrusions support the bottom surface of the wafer (1) and can minimize the contact area with the wafer.

[0041] Although not shown, a plurality of protrusions may also be arranged on the inner side of the middleing channel (123) or outering channel (122).

[0042] The above radial channels (125) are arranged in 12 numbers and are spaced at 15-degree intervals based on the planar center (center of the circle in this embodiment) of the inner ring channel (121).

[0043] The inner end of the radial channel (125) is connected to the inner ring channel (121), and the outer end is connected to the outer ring channel (122).

[0044] The main vacuum hole (130) is formed to penetrate the plate (100) in the vertical direction. The upper end of the main vacuum hole (130) is positioned between the widths of the upper channel (120).

[0045] In this embodiment, six main vacuum holes (130) are arranged. The main vacuum holes (130) are arranged in the radial channels (125). In this embodiment, since 12 radial channels (125) are arranged, the main vacuum holes (130) are arranged at 30-degree intervals when viewed from the top view.

[0046] In this embodiment, the main vacuum hole (130) is positioned between the inner ring channel (121) and the middle ring channel (123).

[0047] The above main vacuum hole (130) includes a first main vacuum hole, a second main vacuum hole, a third main vacuum hole, a fourth main vacuum hole, a fifth main vacuum hole, and a sixth main vacuum hole.

[0048] The above-described rotating plate assembly (200) includes a rotating plate (210) and a rotating shaft (220) that rotatably connects the rotating plate (210) and the plate (100).

[0049] The above-mentioned rotating plate (210) is formed with the same thickness as the plate (100) and includes a rotating plate body (211) into which the rotating groove (110) is inserted and positioned, and a rotating plate installation hole (212) formed to penetrate the rotating plate body (211) in the vertical direction.

[0050] The radial outer edge of the above-mentioned rotating plate body (211) is formed in an arc shape to form a curved surface continuous with the plate (100), and when viewed from the top, it is formed to be the same as the radius of curvature of the plate (100).

[0051] A part of the rotary vacuum assembly (400) described later is inserted and installed in the above-mentioned rotary plate installation hole (212).

[0052] The above-mentioned rotating plate (210) further includes a one-sided rotating plate extension (213) that protrudes from one edge of the rotating plate body (211) toward the planar center of the plate (100), and a other-sided rotating plate extension (214) that protrudes from the other edge of the rotating plate body (211) toward the planar center of the plate (100).

[0053] A rotating plate groove (215) is formed between the one-sided rotating plate extension (213) and the other-sided rotating plate extension (214). The rotating plate groove (215) is formed concavely outwardly in the radial direction of the plate (100).

[0054] The above-mentioned one-sided rotating plate extension (213) and the other-sided rotating plate extension (214) are arranged facing each other.

[0055] In this embodiment, the rotation shaft (220) includes a one-sided rotation shaft (221) that rotatably connects the one-sided rotational plate extension (213) and the plate (100), and a other-sided rotation shaft (222) that rotatably connects the other-sided rotational plate extension (214) and the plate (100).

[0056] When viewed from the top view, the one-sided rotation axis (221) and the other-sided rotation axis (222) are arranged in a straight line.

[0057] The first rotating plate assembly (201), the second rotating plate assembly (202), the third rotating plate assembly (203), and the fourth rotating plate assembly (204) are identical to the respective components of the rotating plate assembly (200), and if it is necessary to distinguish each component thereafter, the prefixes "first," "second," "third," and "fourth" are attached to distinguish them.

[0058] The above plate (100) further includes a plate support portion (115) inserted into the rotating plate groove (215).

[0059] The above plate support member (115) includes a first plate support member that protrudes into a first rotation groove (111) and is inserted into a first rotation groove of a first rotational plate assembly (201), a second plate support member that protrudes into a second rotation groove (112) and is inserted into a second rotation groove of a second rotational plate assembly (202), a third plate support member that protrudes into a third rotation groove (113) and is inserted into a third rotation groove of a third rotational plate assembly (203), and a fourth plate support member that protrudes into a fourth rotation groove (114) and is inserted into a fourth rotation groove of a fourth rotational plate assembly (204).

[0060] The radial outer edge of each plate support (115) is formed as a rounded surface (115a) to minimize mutual interference when each rotating plate (210) rotates.

[0061] The radial outer surface (115b) of each plate support member (115) is formed vertically and is connected to the bottom of the round surface (115a). Since the outer surface (115b) of each plate support member (115) is formed vertically, it has the characteristic of being able to limit the downward rotation of the rotating plate (210).

[0062] The main vacuum assembly (300) controls the vacuum of the upper channel (120).

[0063] The main vacuum assembly (300) includes a main vacuum pump (310) and a main hose (320) connecting the main vacuum pump (310) and the plate (100).

[0064] The chuck for fixing a bent wafer according to the present embodiment further includes a connecting plate (150) assembled at the lower part of the plate (100) and to which the main vacuum assembly (300) and the rotary vacuum assembly (400) are connected.

[0065] In this embodiment, a main chamber (160) is formed between the plate (100) and the connecting plate (150) and communicates with the main hose (320).

[0066] A main vacuum channel (not shown) connecting the main chamber (160) and the main vacuum hole (130) is further formed on the plate (100).

[0067] A pressure sensor (165) is placed in the main chamber (160), and a flow control valve and a check valve are further placed in the main hose (320). The pressure inside the main chamber (160) can be controlled through the flow control valve and the check valve.

[0068] When viewed from the top view, the main chamber (160) is formed in a ring shape.

[0069] The above-mentioned connecting plate (150) is penetrated in the thickness direction and further includes a main connection hole (154) to which the main hose (320) is connected. A plurality of main connection holes (154) may be arranged, and a main hose (320) may be connected to each of the plurality of main connection holes (154).

[0070] In this embodiment, the main chamber (160) is formed as a single space. Unlike this embodiment, if a main hose (320) is connected to each of the multiple main connection holes (154), the main chamber (160) can be divided into multiple sections and controlled by pressure in each section.

[0071] The rotary vacuum assembly (400) includes a rotary vacuum pump (410), a rotary supply hose (420) connecting the rotary vacuum pump (410) and a plate (100), and a rotary connecting hose (430) connecting the plate (100) and a rotary plate (210).

[0072] It further includes a rotating chamber (170) disposed inside the plate (100) and connecting the rotating supply hose (420) and the rotating connecting hose (430).

[0073] When viewed from the top view, the rotating chamber (170) is positioned inside the main chamber (160).

[0074] In this embodiment, the plate (100) includes an upper plate (101) and a lower plate (102) assembled to the lower part of the upper plate (101), and a rotation chamber (170) is formed between the upper plate (101) and the lower plate (102).

[0075] It further includes a rotation chamber upper groove (117) that is formed concavely upward from the bottom surface of the upper plate (101) and forms the upper part of the rotation chamber (170). It further includes a rotation chamber lower groove (118) that penetrates the lower plate (102) in the vertical direction and forms the lower part of the rotation chamber (170). The connecting plate (150) is inserted into the rotation chamber lower groove (118) to close the lower part of the rotation chamber (170).

[0076] The above rotary supply hose (420) is connected to the above rotary chamber (170) to transmit the pressure of the above rotary vacuum pump (410).

[0077] The above rotary connecting hose (430) includes a first rotary connecting hose (431) connected to the first rotary plate of the first rotary plate assembly (201), a second rotary connecting hose (432) connected to the second rotary plate of the second rotary plate assembly (202), a third rotary connecting hose (433) connected to the third rotary plate of the third rotary plate assembly (203), and a fourth rotary connecting hose (433) connected to the fourth rotary plate of the fourth rotary plate assembly (204).

[0078] The plate (100) further includes a rotary connection channel that connects the rotary chamber (170) and the rotary connection hose (430).

[0079] The above rotary connection channel is placed inside the plate (100).

[0080] The above rotary connection channel includes a first rotary connection channel (171) disposed inside the plate (100) and formed to communicate with the first rotary connection hose (431), a second rotary connection channel (172) disposed inside the plate (100) and formed to communicate with the second rotary connection hose (432), a third rotary connection channel (173) disposed inside the plate (100) and formed to communicate with the third rotary connection hose (433), and a fourth rotary connection channel (174) disposed inside the plate (100) and formed to communicate with the fourth rotary connection hose (434).

[0081] The first rotary connecting hose (431), the second rotary connecting hose (432), the third rotary connecting hose (433), and the fourth rotary connecting hose (434) are connected to the radially outer ends of the first rotary connecting channel (171), the second rotary connecting channel (172), the third rotary connecting channel (173), and the fourth rotary connecting channel (174).

[0082] Each hole for inserting the first rotary connecting hose (431), the second rotary connecting hose (432), the third rotary connecting hose (433), and the fourth rotary connecting hose (434) is formed to penetrate the lower plate (102) in the thickness direction.

[0083] When viewed from the top view, the first rotational connecting channel (171), the second rotational connecting channel (172), the third rotational connecting channel (173), and the fourth rotational connecting channel (174) are arranged radially with respect to the planar center of the plate (100), and in this embodiment, are arranged in a "+" shape.

[0084] The first rotary connecting channel (171), the second rotary connecting channel (172), the third rotary connecting channel (173), and the fourth rotary connecting channel (174) are arranged within the thickness of the plate (100).

[0085] The first rotational connection channel (171), the second rotational connection channel (172), the third rotational connection channel (173), and the fourth rotational connection channel (174) are formed between the upper plate (101) and the lower plate (102).

[0086] The above plate (100) is composed of an upper plate (101) and a lower plate (102), so that the above-mentioned rotary connection path can be easily implemented.

[0087] The upper channel (120) and the main vacuum hole (130) are formed on the upper side of the upper plate (101). The lower plate (102) is formed in a disc shape with a smaller diameter than the upper plate (101).

[0088] The planar center of the lower plate (102) penetrates in the thickness direction to form a part of the rotation chamber (170). In this embodiment, the connecting plate (150) is assembled to the lower part of the lower plate (102).

[0089] In this embodiment, the connecting plate (150) is assembled to the lower plate (102) to form the main chamber (160), and the rotating chamber (170) is positioned above the main chamber (160).

[0090] The above connecting plate (150) includes a connecting base (151) formed in a disc shape, a connecting core part (152) that protrudes upward from the center of the connecting base (151) and seals the rotating chamber lower groove (118), and a connecting ring part (153) that is disposed on the radial outer side of the connecting base (151) and protrudes upward from the connecting base (151) to form the main chamber (160).

[0091] The above connecting core part (152) is formed in a cylindrical shape.

[0092] A connecting core hole (155) is formed that penetrates the connecting core part (152) in the thickness direction, and the rotating supply hose (420) is connected to the connecting core hole (155).

[0093] The above connecting ring portion (153) is formed in a ring shape. The main chamber (160) is formed between the above connecting ring portion (153) and the connecting core portion (152).

[0094] The main connection hole (154) is positioned between the connection core part (152) and the connection ring part (153) and penetrates the connection base (151) in the thickness direction.

[0095] The above rotary vacuum assembly (400) further includes an adsorption bellows (440) connected to the rotary connecting hose (430) and disposed in the rotary plate installation hole (212) of the rotary plate (210), and a fixing plate (450) coupled to the bottom surface of the rotary plate (210) to fix the adsorption bellows (440).

[0096] The suction bellows (440) is inserted and placed in the above-mentioned rotating plate installation hole (212).

[0097] One end of the above rotary connecting hose (430) is connected to the above rotary connecting channel, and the other end is connected to the above suction bellows (440).

[0098] With the above-mentioned rotating plate (210) in an upwardly rotated state, the suction bellows (440) can be suction-fixed to the edge (2) of the curved wafer (1) through the vacuum of the rotating vacuum assembly (400).

[0099] After the suction bellows (440) is fixed to the bottom surface of the upwardly curved edge (2), the angle rotation assembly (500) can be operated to flatten the upwardly curved edge (2).

[0100] The above-described angle rotation assembly (500) includes an angle rotation pump (510), a slide link (520) disposed on the plate (100) and slidable in the up and down direction, an angle rotation link (530) with one end assembled to rotate relative to the slide link (520) and the other end assembled to rotate relative to the rotating plate (210), and a link supporter (540) disposed on the plate (100) and providing a rotation center of the angle rotation link (530).

[0101] The slide link (520) slides up and down by the pressure provided by the above-mentioned rotary pump (510).

[0102] A slide hole (180) is formed in the plate (100) into which the upper end of the slide link (520) is inserted. Positive or negative pressure from the angle rotation pump (510) is provided in the slide hole (180).

[0103] The slide link (520) can be moved up and down by positive or negative pressure provided to the slide hole (180). It further includes a slider (185) disposed in the slide hole (180) and providing driving force to the top of the slide link (520).

[0104] It further includes a stopper (181) positioned at the bottom of the slide hole (180) and protruding inwardly into the slide hole (180). The stopper (181) restricts the downward movement of the slide link (520) and prevents the slide link (520) from being separated from the slide hole (180).

[0105] The airtightness of the slide hole (180) can be effectively maintained through the slider (185).

[0106] The above slide link (520) includes a slide bar (521) whose upper end is inserted into the slide hole (180) and whose lower end is rotatably assembled with the angular rotation link (530), and a link head (522) positioned at the top of the slide bar (521) and moving up and down along the slide hole (180).

[0107] The above link head (522) can form a seal on the slide hole (180).

[0108] The above link head (522) is supported by the above stopper (181) to form a mutual lock.

[0109] The above slider (185) is fixed to the above link head (522).

[0110] Each of the above-mentioned rotating links (530) is formed by being bent into an "L" shape.

[0111] Each of the above-mentioned rotating links (530) includes a horizontal link portion (531) connected to the slide link (520), and a vertical link portion (532) formed to be bent upward from the horizontal link portion (531) and assembled with the rotating plate (210).

[0112] The above-mentioned rotating assembly (500) further includes a one-sided link shaft (533) that rotatably assembles the horizontal link portion (531) and the slide link (520), a other-sided link shaft (534) that rotatably assembles the vertical link portion (532) and the rotating plate (210), and a middle link shaft (535) that rotatably assembles the link supporter (540) and the horizontal link portion (531).

[0113] The above-mentioned rotating assembly (500) further includes a link bracket (536) fixed to the rotating plate (210), and the other link shaft (534) can rotatably assemble the vertical link part (532) and the link bracket (536).

[0114] The other link axis (534) can be moved up and down around the middle link axis (535) to rotate the rotating plate (210) up and down.

[0115] Interference with the plate (100) can be prevented through the shape of the above-mentioned one-sided link shaft (533) and the other-sided link shaft (534).

[0116] As shown in Fig. 6, when the rotating plate (210) is rotated, it can be brought close to the edge (2) of the curved wafer (1), and thereby the adsorption bellows (440) can be brought closer to the bottom surface of the edge (2).

[0117] With the curved edge (2) of the wafer (1) fixed through the adsorption bellows (440), the slide link (520) is raised to form the rotating plate (210) and plate (100) into a flat state as shown in FIG. 5, and thereby the edge (2) of the wafer (1) can be formed flat.

[0118] The rotation angle of the rotating plate (210) can be controlled by adjusting the travel distance of the slide link (520).

[0119] Even if the slide link (520) rises excessively, the rotating plate (210) is supported on the radial outer surface (115b) of the plate support (115), so the wafer (1) can be prevented from bending in the reverse direction.

[0120] The above-mentioned angle rotation assembly (500) includes a first angle rotation assembly (501) that rotates a first rotating plate in an up-and-down direction, a second angle rotation assembly (502) that rotates a second rotating plate in an up-and-down direction, a third angle rotation assembly (503) that rotates a third rotating plate in an up-and-down direction, and a fourth angle rotation assembly (504) that rotates a fourth rotating plate in an up-and-down direction.

[0121] Since the configurations of the first angle rotation assembly (501), the second angle rotation assembly (502), the third angle rotation assembly (503), and the fourth angle rotation assembly (504) are identical, a detailed description is omitted.

[0122] The present invention has the feature of being able to flatten the edges of a curved wafer (1) by controlling the first angle rotation assembly (501), the second angle rotation assembly (502), the third angle rotation assembly (503), and the fourth angle rotation assembly (504) simultaneously or individually.

[0124] Although specific embodiments have been described in the detailed description of the present invention, it is understood that various modifications are possible within the scope of the invention. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be defined by the claims set forth below as well as equivalents thereof. Explanation of the symbols

[0126] 1 : Wafer 2 : Edge 100 : Plate 101 : Upper Plate 102 : Lower Plate 105 : Upper side 110 : Rotating groove 111: 1st rotation groove 112: Second rotating groove 113: 3rd rotation groove 114: 4th turning groove 115 : Plate support 115a : Rounded surface 115b : Outer surface 117 : Rotating chamber upper groove 118 : Rotating chamber lower groove 120 : Upper channel 121 : Inner ring channel 122 : Outer Ring Channel 123 : Middleing Channel 125 : Radial channel 130 : Main vacuum hole 150 : Connecting plate 151 : Connection Base 152 : Connection core part 153 : Connecting ring part 154 : Main connection hole 155 : Connection core hole 160 : Main Chamber 165 : Pressure sensor 170 : Rotating chamber 171 : First rotary connecting channel 172 : Second rotary connecting channel 173 : 3rd rotary connecting channel 174 : 4th rotary connecting channel 180 : Slide hole 181 : Stopper 185 : Slider 200 : Turntable Assembly 201: First turntable assembly 202 : Second turntable assembly 203 : 3rd turntable assembly 204 : 4th turntable assembly 210: Turntable 211 : Rotating plate body 212: Rotating plate installation hole 213 : One-sided rotating plate extension 214 : Other side rotating plate extension 215 : Rotating plate groove 220 : Rotation axis 221 : One-sided rotation axis 222 : Other side rotation axis 300 : Main vacuum assembly 310 : Main vacuum pump 320 : Main hose 400 : Rotary vacuum assembly 410 : Rotary vacuum pump 420 : Rotating supply hose 430 : Rotary connecting hose 431 : 1st rotary connecting hose 432 : 2nd rotary connecting hose 433 : 3rd rotary connecting hose 434 : 4th rotary connecting hose 440 : Suction bellows 450 : Fixed plate 500 : Each rotation assembly 501: 1st Angle Rotation Assembly 502 : Second angle rotation assembly 503 : 3rd Angle Rotation Assembly 504 : 4th Angle Rotation Assembly 510 : Each rotary pump 520 : Slide Link 521 : Slidebar 522 : Linkhead 530 : Each rotating link 531 : Horizontal link section 532 : Vertical link section 533 : One-sided link axis 534 : Other link axis 535 : Middle Link Axis 536 : Link bracket 540 : Link Supporter

Claims

Claim 1 A chuck for fixing a wafer, comprising: a plate (100) supporting a wafer (1); a rotating plate assembly (200) disposed at the edge of the plate (100) and rotated relative to the plate (100) in an up-and-down direction; a main vacuum assembly (300) for fixing the wafer (1) by forming a vacuum on the upper side of the plate (100); and a rotating vacuum assembly (400) for fixing the edge of the wafer (1) by forming a vacuum in the rotating plate assembly (200). Claim 2 A chuck for fixing a curved wafer according to claim 1, wherein the rotating plate assembly (200) comprises a first rotating plate assembly (201), a second rotating plate assembly (202), a third rotating plate assembly (203), and a fourth rotating plate assembly (204), and the plate (100) comprises a rotating groove (110) into which the rotating plate assembly (200) is inserted, and the rotating groove (110) comprises a first rotating groove (111) into which the first rotating plate assembly (201) is inserted, a second rotating groove (112) into which the second rotating plate assembly (202) is inserted, a third rotating groove (113) into which the third rotating plate assembly (203) is inserted, and a fourth rotating groove (114) into which the fourth rotating plate assembly (204) is inserted. Claim 3 A chuck for fixing a curved wafer according to claim 2, further comprising an angle rotation assembly (500) assembled to the plate (100) and the rotating plate assembly (200) and which rotates the rotating plate assembly (200) in an up-and-down direction.

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