Substrate processing apparatus

Abstract

A technology advantageous for stably performing a drying process of a substrate is provided. A substrate processing device comprises a processing vessel that accommodates a substrate inside, a holding part that holds the substrate at a holding position inside the processing vessel, a fluid supply part having a supply opening that discharges a processing fluid toward the inside of the processing vessel, and a supply guide member that faces the supply opening between the supply opening and the holding position and guides the processing fluid from the supply opening to spread to an area larger than the opening area of ​​the supply opening.

Description

Technology Field

[0001] The present disclosure relates to a substrate processing apparatus. Background Technology

[0002] A technology is known for drying a substrate, such as a semiconductor wafer, to which a processing solution is attached, using a processing fluid in a supercritical state (see Patent Document 1). Prior art literature

[0003] Japanese Patent Publication No. 2013-251550 The problem to be solved

[0004] When a supercritical processing fluid is forcefully ejected from a small opening, vortices of the processing fluid may occur or the processing fluid may remain stagnant. In such cases, the processing fluid cannot necessarily be efficiently guided to the surroundings of the substrate (especially the surface to be dried), and as a result, the drying process of the substrate may take a long time. In addition, as the processing fluid forcefully ejected from the opening is sprayed onto the substrate, liquid may unintentionally scatter from the substrate.

[0005] For this reason, the drying treatment of the entire substrate surface cannot be reliably performed.

[0006] The present disclosure provides a technology advantageous for stably performing a drying process of a substrate. means of solving the problem

[0007] One aspect of the present disclosure relates to a substrate processing apparatus for drying a substrate to which a liquid is attached using a supercritical processing fluid, comprising: a processing vessel for receiving the substrate inside; a holding portion for holding the substrate at a holding position inside the processing vessel; a fluid supply portion having a supply opening for discharging a processing fluid toward the inside of the processing vessel; and a supply guide member that is opposite to the supply opening between the supply opening and the holding position and guides the processing fluid from the supply opening to spread to an area larger than the opening area of ​​the supply opening. Effects of the invention

[0008] According to the present disclosure, it is advantageous to stably perform the drying treatment of a substrate. Brief explanation of the drawing

[0009] Figure 1 is a plan view showing an example of a substrate processing device. Figure 2 is a figure showing a specific configuration example of a drying unit and a supply unit. FIG. 3 is a side view showing an example of a drying unit according to a first embodiment. FIG. 4 is a side view showing an example of a drying unit according to a first embodiment. FIG. 5 is a side view showing an example of a drying unit according to a first embodiment. FIG. 6 is a front view showing an example of a drying unit according to a first embodiment. FIG. 7 is a front view showing an example of a drying unit according to a first embodiment. FIG. 8 is a cross-sectional view of an example of a drying unit according to a first embodiment, viewed from above. FIG. 9 is an enlarged cross-sectional view showing a first structural example of a supply guide member. FIG. 10 is an enlarged cross-sectional view showing a second structural example of a supply guide member. FIG. 11 is an enlarged cross-sectional view showing a third structural example of a supply guide member. FIG. 12 is an enlarged cross-sectional view showing a fourth structural example of a supply guide member. FIG. 13 is an enlarged cross-sectional view showing a fifth structural example of a supply guide member. FIG. 14 is an enlarged cross-sectional view showing a sixth structural example of a supply guide member. FIG. 15 is an enlarged cross-sectional view showing a seventh structural example of a supply guide member. FIG. 16 is a cross-sectional view from above of an example of a drying unit according to a third embodiment. FIG. 17 is a cross-sectional view of an example of a drying unit according to a third embodiment, viewed from the side. FIG. 18 is a cross-sectional view of an example of a drying unit according to the first modified example, viewed from the side. Specific details for implementing the invention

[0010] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. The present disclosure is not limited to the forms described below and the forms shown in each drawing.

[0011] In each drawing, each element is shown in a simplified and illustrative manner. Therefore, the form of each element (e.g., shape and size) and the dimensional ratios between elements do not necessarily match across the drawings.

[0012] FIG. 1 is a plan view showing an example of a substrate processing device (1). The X-axis, Y-axis, and Z-axis directions shown in the drawing are directions perpendicular to each other. The X-axis and Y-axis directions are horizontal directions, and the Z-axis direction is a height direction following the vertical direction in which gravity acts.

[0013] The substrate processing device (1) shown in FIG. 1 is equipped with an incoming / outgoing station (2) and a processing station (3) arranged in the X-axis direction.

[0014] The incoming / outgoing station (2) has a placement table (21), a return section (22), and a delivery section (23) arranged in the X-axis direction.

[0015] A plurality of carriers (C) are provided on the placement platform (21). Each carrier (C) accommodates a plurality of substrates (W). A movable first conveying device (22a) capable of conveying one or more substrates (W) is provided in the conveying section (22). A transition device (23a) capable of temporarily holding one or more substrates (W) is provided in the transfer section (23). The conveying of the substrates (W) between each carrier (C) and the transition device (23a) is performed by the first conveying device (22a).

[0016] The substrate (W) is not limited, but is typically a semiconductor substrate (e.g., a silicon wafer or a compound semiconductor wafer) or a glass substrate. On the surface of the substrate (W), a device such as an electronic circuit may be provided, or a fine uneven pattern may be formed.

[0017] The processing station (3) has a return block (31) and a processing block (32).

[0018] The return block (31) is provided adjacent to the transfer unit (23) in the X-axis direction. The return block (31) is provided with a movable second return device (31a) capable of returning a substrate (W). The second return device (31a) returns the substrate (W) between the transition device (23a) and each unit of the processing block (32), and between each unit of the processing block (32).

[0019] The processing block (32) is arranged to be adjacent to the return block (31) in the Y-axis direction. The number of processing blocks (32) is not limited. In the example shown in FIG. 1, two processing blocks (32) are arranged to interpose the return block (31) in the Y-axis direction. Additionally, a plurality of processing blocks (32) may be arranged in the Z-axis direction.

[0020] Each processing block (32) has a liquid film forming unit (32a), a drying unit (32b), and a supply unit (32c). The number of each of the liquid film forming unit (32a), the drying unit (32b), and the supply unit (32c) is not limited. In the example shown in FIG. 1, in each processing block (32), two liquid film forming units (32a), two drying units (32b), and two supply units (32c) are provided.

[0021] The liquid film forming unit (32a) applies liquid to the substrate (W) to form a liquid film on the upper surface of the substrate (W). The specific configuration of the liquid film forming unit (32a) is not limited. As an example, the liquid film forming unit (32a) has a spin chuck that holds the substrate (W) rotatably and a nozzle that discharges liquid toward the upper surface of the substrate (W). The liquid applied to the substrate (W) is not limited. As an example, a chemical solution (SC1 (aqueous solution of ammonia and hydrogen peroxide) or DHF (dilute hydrofluoric acid), etc.), a rinse solution (deionized water, etc.), and a drying solution (an organic solvent such as IPA (isopropyl alcohol), etc.) may be discharged from the nozzle in this order and supplied to the substrate (W).

[0022] The drying unit (32b) dries the substrate (W) by replacing the liquid film formed on the substrate (W) in the liquid film forming unit (32a) with a supercritical processing fluid. The supercritical processing fluid has a temperature above the critical temperature and also has a pressure above the critical pressure. By using the supercritical processing fluid, the substrate (W) can be dried while suppressing the collapse of the uneven pattern of the substrate (W) caused by the surface tension of the liquid on the substrate (W). The processing fluid is not limited, and for example, carbon dioxide (CO2) can be used as the processing fluid.

[0023] The supply unit (32c) supplies fluid to the drying unit (32b). The specific configuration of the supply unit (32c) is not limited. Specific configuration examples of the drying unit (32b) and the supply unit (32c) will be described later (see FIG. 2, etc.).

[0024] The substrate processing device (1) further comprises a control device (4) that controls each component of the substrate processing device (1). The control device (4) shown in FIG. 1 is configured, for example, by a computer and comprises an operation processing unit (41) and a memory unit (42).

[0025] The operation processing unit (41) controls each component of the substrate processing device (1) and performs various processing by appropriately reading and executing a program stored in the memory unit (42). The memory unit (42) stores programs and data for various processing performed in the substrate processing device (1). The programs and data stored in the memory unit of the control unit (93) are recorded on a memory medium readable by a computer, and may be installed in the memory unit from said memory medium. Examples of memory media readable by a computer include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnet optical disk (MO), and a memory card.

[0026] FIG. 2 is a figure showing a specific configuration example of a drying unit (32b) and a supply unit (32c).

[0027] In the example shown in FIG. 2, the supply line of the processing fluid includes an upstream supply line (50), a first supply line (51), and a second supply line (52).

[0028] The upstream supply line (50) is connected to the first fluid source (55), the first supply line (51), and the second supply line (52). The first fluid source (55) is a source of the processing fluid, for example, a tank that stores the processing fluid. The processing fluid is supplied from the first fluid source (55) to the first supply line (51) and the second supply line (52) through the upstream supply line (50).

[0029] In the upstream supply line (50), a valve (101), a heater (102), a pressure sensor (103), an orifice (104), a temperature sensor (105), and a filter (106) are provided in order from upstream to downstream. The terms upstream and downstream mentioned herein are based on the normal flow direction of the processing fluid in the drying process of the substrate (W).

[0030] The valve (101) is a valve that turns on and off the supply of a treatment fluid from the first fluid source (55), and in the open state, allows the inflow of the treatment fluid into the downstream supply line (i.e., the upstream supply line (50)), and in the closed state, does not allow the inflow of the treatment fluid into the downstream supply line. The heater (102) heats the treatment fluid flowing through the upstream supply line (50). The pressure sensor (103) detects the pressure of the treatment fluid flowing through the upstream supply line (50) between the heater (102) and the orifice (104). The orifice (104) adjusts the pressure of the treatment fluid sent downstream to a desired pressure (e.g., about 16 MPa). The temperature sensor (105) detects the temperature of the treatment fluid flowing through the upstream supply line (50) between the orifice (104) and the filter (106). The filter (106) removes foreign matter from the processing fluid flowing through the upstream supply line (50).

[0031] In the upstream supply line (50) shown in FIG. 2, not only the first fluid source (55) but also the second fluid source (56) and the third fluid source (57) are connected. The second fluid source (56) is a source of IPA and is connected to the upstream supply line (50) in the portion between the valve (101) and the heater (102) via a valve (107). The third fluid source (57) is a source of inert gas (e.g., N2) and is connected to the upstream supply line (50) in the portion between the valve (101) and the heater (102) via a valve (108).

[0032] In the first supply line (51), a valve (111), an orifice (112), a pressure sensor (113), and a temperature sensor (114) are provided in order from upstream to downstream.

[0033] The valve (111) turns on and off the flow of the processing fluid in the first supply line (51). The orifice (112) adjusts the pressure of the processing fluid sent downstream to a desired pressure. The pressure sensor (113) detects the pressure of the processing fluid flowing through the first supply line (51). The temperature sensor (114) detects the temperature of the processing fluid flowing through the first supply line (51).

[0034] In the portion of the first supply line (51) downstream from the temperature sensor (114), it is connected to a purge line (54). The purge line (54) is connected to the first supply line (51) and is also connected to a purge gas supply source (121). The purge gas supply source (121) is a source of purge gas (e.g., an inert gas such as N2) and is, for example, a tank for storing purge gas. In the purge line (54), a check valve (122) and a valve (123) are provided sequentially from the purge gas supply source (121) toward the first supply line (51). The valve (123) turns on and off the flow of purge gas in the purge line (54). The purge gas is supplied from the purge gas source (121) through the purge line (54) and the first supply line (51) to the processing space of the drying unit (32b) while the supply of the processing fluid to the processing space of the drying unit (32b) is stopped, for example.

[0035] The second supply line (52) includes a first branch supply line (52a) and a second branch supply line (52b). The first branch supply line (52a) and the second branch supply line (52b) extend in different directions from the part where the upstream supply line (50) is connected, but are connected to the supply header of the drying unit (32b) (in particular, the supply guide (see reference numeral '66' in FIG. 8, for example)). A valve (131) is provided in the first branch supply line (52a), and a valve (132) is provided in the second branch supply line (52b). The valve (131) and the valve (132) are valves that turn on and off the supply of the processing fluid to the supply header.

[0036] A temperature sensor (141) is provided in the drying unit (32b). The temperature sensor (141) detects the temperature of the processing space in the drying unit (32b).

[0037] The discharge line (53) has a first branch discharge line (53a), a second branch discharge line (53b), and a downstream discharge line (53c). The first branch discharge line (53a) and the second branch discharge line (53b) are connected to the discharge path of gas (including processing fluid) from the processing space of the drying unit (32b) (see reference numeral '70' in FIG. 8, for example), and are also connected to the downstream discharge line (53c).

[0038] In the first branch discharge line (53a), a temperature sensor (151), a pressure sensor (152), and a valve (153) are provided sequentially from upstream to downstream. The temperature sensor (151) detects the temperature of the processing fluid flowing through the first branch discharge line (53a). The pressure sensor (152) detects the pressure of the processing fluid flowing through the first branch discharge line (53a). The valve (153) is a valve that turns on and off the flow of the processing fluid in the first branch discharge line (53a). A valve (154) is provided in the second branch discharge line (53b), and the valve (154) turns on and off the flow of the processing fluid in the second branch discharge line (53b).

[0039] In the downstream discharge line (53c), a pressure regulating valve (155), a pressure sensor (156), a temperature sensor (157), and a valve (158) are provided in sequence from upstream to downstream. The pressure regulating valve (155) is a valve that regulates the pressure of the processing fluid flowing through the downstream discharge line (53c). The degree of opening of the pressure regulating valve (155) is adaptively adjusted under the control of the control device (4) according to the pressure of the processing space of the drying unit (32b). The pressure sensor (156) detects the pressure of the processing fluid flowing through the downstream discharge line (53c). The temperature sensor (157) detects the temperature of the processing fluid flowing through the downstream discharge line (53c). The valve (158) turns the flow of the processing fluid in the downstream discharge line (53c) on and off. When the processing fluid is discharged to the outside, the valve (158) is opened, and when the processing fluid is not discharged to the outside, the valve (158) is closed.

[0040] The measurement results of each pressure sensor and each temperature sensor described above are transmitted to the control device (4) and are used as needed in the processing for controlling the components of the substrate processing device (1) (i.e., the valve, heater (102), pressure regulating valve (155), and other devices described above).

[0041] The above-described configuration of the drying unit (32b) and supply unit (32c) shown in FIG. 2 is merely an example, and at least one of the drying unit (32b) and the supply unit (32c) may have a different configuration. For example, as a line supplying a processing fluid to the processing space of the drying unit (32b), only one of the first supply line (51) and the second supply line (52) may be provided. Additionally, the second supply line (52) may include three or more branch supply lines connected to the processing space of the drying unit (32b), or it may be a single line. Likewise, the discharge line (53) may include three or more branch discharge lines connected to the processing space of the drying unit (32b), or it may be a single line. Additionally, the second fluid supply source (56) and the third fluid supply source (57) may not be provided.

[0042] Next, a typical example of the drying treatment of a substrate (W) in the drying unit (32b) will be described. Each process included in the substrate drying treatment (substrate treatment method) described below is performed by appropriately driving the components (e.g., each valve) of the substrate treatment device (1) under the control of the control device (4), although detailed descriptions are omitted.

[0043] First, a substrate (W) is placed in the processing space of the drying unit (32b) via the second conveying device (31a) (see FIG. 1), and the processing space is sealed (incoming processing process). The term 'sealed' here refers to a state in which the processing space is hermetically blocked from the outside, but it does not necessarily refer to a strictly sealed state (i.e., a completely sealed state). Even when the processing space is sealed, a flow path (supply path and discharge path) of the processing fluid (F) is connected, and the processing space is connected to a line and device provided on the outside of the drying unit (32b) via the flow path.

[0044] Afterwards, the processing fluid from the first fluid supply source (55) is supplied to the processing space of the drying unit (32b), thereby increasing the pressure in the processing space, and as a result, the processing fluid in a supercritical state is supplied to the processing space (pressure boosting process).

[0045] Afterward, while maintaining the pressure in the processing space of the drying unit (32b) at a pressure that maintains the supercritical state of the processing fluid, a laminar flow of the processing fluid is formed to flow along the surface of the substrate (W) in the processing space (flow processing process). As a result, the liquid attached to the substrate (W) (e.g., IPA liquid between the uneven patterns) is gradually replaced with the supercritical processing fluid, and the liquid is gradually removed from the substrate (W).

[0046] After the liquid is sufficiently removed from the substrate (W), the supply of the processing fluid to the processing space of the drying unit (32b) is stopped, and the processing fluid is discharged from the processing space, so that the pressure in the processing space is gradually lowered to a desired pressure (e.g., atmospheric pressure) (depressurization process).

[0047] Afterwards, the substrate (W) is ejected from the processing space of the drying unit (32b) via the second return device (31a) (see FIG. 1) (ejection processing process).

[0048] The substrate (W) is dried through the aforementioned series of processes.

[0049] Next, a specific example of the drying unit (32b) will be described.

[0050] [First Embodiment]

[0051] FIGS. 3 to 5 are side views showing an example of a drying unit (32b) according to a first embodiment. FIGS. 6 and 7 are front views showing an example of a drying unit (32b) according to a first embodiment. FIG. 8 is a cross-sectional view of an example of a drying unit (32b) according to a first embodiment seen from above.

[0052] In the example shown in FIGS. 3 to 8, the first supply line (51) described above (see FIG. 2) is not provided. That is, the first supply line (51) is not connected to the processing space (S) of the drying unit (32b), and the processing fluid (F) is supplied only from the second supply line (52) (first branch supply line (52a) and second branch supply line (52b)). However, the technology described below is also applicable to a device and method in which the first supply line (51) is connected to the drying unit (32b) and the processing fluid (F) is supplied to the processing space (S) from both the first supply line (51) and the second supply line (52).

[0053] As described above, the drying unit (32b) functions as a substrate processing device that dries a substrate (W) to which a liquid is attached using a supercritical processing fluid (F). The drying unit (32b) shown in FIGS. 3 to 8 has a pressure vessel (processing vessel) (60) having a processing space (S), a supply header (61) for supplying the processing fluid (F) to the processing space (S), and a discharge header (62) for discharging the processing fluid (F) from the processing space (S).

[0054] The pressure vessel (60) has a hollow structure and has a processing space (S) on the inside. The processing space (S) is covered and partitioned from the outside by the pressure vessel (60), but both ends of the processing space (S) in the horizontal direction (Y-axis direction) are not covered by the pressure vessel (60) and are open. The openings at both ends of the processing space (S) are positioned so as to face each other and have a substrate (W) placed in a holding position within the processing space (S) between them.

[0055] In the pressure vessel (60) of the present example, as shown in FIG. 8, two vessel discharge passages (70) are formed through. These vessel discharge passages (70) are each connected to a first branch discharge line (53a) and a second branch discharge line (53b), and form part of the discharge passage of the processing fluid (F) as described below.

[0056] As a substrate (W) is introduced and placed in the processing space (S), the pressure vessel (60) accommodates the substrate (W) to be dried inside. The substrate (W) is held in a holding position inside the pressure vessel (60) by a holding member (65) (see FIG. 7).

[0057] The specific structure of the holding portion (65) is not limited. The holding portion (65) of the present example is composed of a plurality of pins extending upward in the processing space (S). Each pin may be fixedly provided with respect to the pressure vessel (60), may be movably provided with respect to the pressure vessel (60), or, for example, may be provided to move up and down in the height direction. By placing a substrate (W) on these pins, the substrate (W) is supported from below by the plurality of pins.

[0058] The supply header (61) is provided to cover an opening on one side of the processing space (S). The supply header (61) has a plurality of supply openings (67) that discharge a processing fluid (F) toward the processing space (S) inside the pressure vessel (60), and functions as a fluid supply unit that supplies the processing fluid (F) to the processing space (S).

[0059] A sealing member (not shown) is provided between the supply header (61) and the pressure vessel (60), and the airtightness of the processing space (S) between the supply header (61) and the pressure vessel (60) is ensured by said sealing member.

[0060] The specific structure of the supply header (61) is not limited. As shown in FIG. 8, the supply header (61) of the present example has a supply main body (61a), a supply guide (66) formed by a space formed in the supply main body (61a), a plurality of supply openings (67), and supply recesses (63).

[0061] The supply guide (66) extends in a horizontal direction (in the X-axis direction in this example). A first branch supply line (52a) and a second branch supply line (52b) are connected to the openings at both ends of the supply guide (66), respectively. A processing fluid (F) is supplied to the supply guide (66) through the first branch supply line (52a) and the second branch supply line (52b).

[0062] A plurality of supply openings (67) are arranged horizontally along the supply guide (66) (in the X-axis direction in this example) and are connected to each of the supply guide (66) and the supply recess (63). In the example shown in FIG. 8, a plurality of supply openings (67) are distributed over a range covering the entire range of the substrate (W) placed in the holding position with respect to the X-axis direction.

[0063] The specific arrangement of the plurality of supply openings (67) is not limited. For example, the plurality of supply openings (67) may be arranged in a row at different positions in the horizontal direction (especially in the X-axis direction). In addition, a row of supply openings composed of two or more supply openings (67) arranged in the horizontal direction (X-axis direction) may be arranged in two or more positions in the height direction (Z-axis direction).

[0064] In the case of the structure shown in FIG. 8, the ejection state of the processing fluid (F) from each supply opening (67) can change depending on the distance from the first branch supply line (52a) and the second branch supply line (52b). For example, the processing fluid (F) from the first branch supply line (52a) and the processing fluid (F) from the second branch supply line (52b) tend to be ejected more forcefully from the supply opening (67) facing the central part of the supply guide (66) where the processing fluid (F) from the first branch supply line (52a) and the processing fluid (F) from the second branch supply line (52b) join.

[0065] Accordingly, depending on the distance from the first branch supply line (52a) and the second branch supply line (52b), at least one of the number density, hole diameter, and hole shape of each supply opening (67) may be changed. By doing so, for example, it is possible to equalize the ejection state (e.g., ejection speed and ejection amount, etc.) of the processing fluid (F) from the plurality of supply openings (67).

[0066] Alternatively, at least one of the number density, hole diameter, and hole shape of each supply opening (67) may be determined regardless of the distance from the first branch supply line (52a) and the second branch supply line (52b). For example, at least one of the number density, hole diameter, and hole shape of each supply opening (67) may be uniform regardless of the distance from the first branch supply line (52a) and the second branch supply line (52b). In this case, it is possible to intentionally make the flow of the processing fluid (F) in the processing space (S) non-uniform. Additionally, if necessary, a portion of the plurality of supply openings (67) may be sealed, and the processing fluid (F) may be ejected from the supply header (61) only toward a portion of the processing space (S).

[0067] The supply recess (63) forms a transverse fluid discharge section (71) that opens into the processing space (S). The processing fluid (F) is discharged from the transverse fluid discharge section (71) toward the processing space (S) and reaches the discharge header (62) through the periphery of the substrate (W) placed in the holding position.

[0068] In this example, a supply path is configured to guide the processing fluid (F) into the processing space (S) by means of a supply header (61) (supply guide path (66), each supply opening (67) and supply recess (63)) positioned horizontally away from the substrate (W) placed in the maintenance position.

[0069] At least a portion of the supply guide member (first supply guide member) (80) is located in the supply concave portion (63).

[0070] The supply guide member (80) is positioned between a plurality of supply openings (67) and a holding position in which a substrate (W) is located in the processing space (S), and faces each supply opening (67). The supply guide member (80) guides the processing fluid (F) flowing from each supply opening (67) into the supply recess (63) and discharges it toward the processing space (S) from the transverse fluid discharge part (71).

[0071] Specifically, the supply guide member (80) guides the processing fluid (F) from each supply opening (67) toward the processing space (S) (particularly the substrate (W) placed in the holding position) and guides it to spread over an area larger than the opening area of ​​each supply opening (67). By doing so, the processing fluid (F), with its flow homogenized, can be sent toward the substrate (W) (particularly the upper surface of the substrate (W)), thereby stabilizing the drying process of the substrate (W).

[0072] Additionally, the 'area' referred to here may be based on, for example, a plane (XZ plane) perpendicular to the Y-axis direction (horizontal direction). The specific direction in which the range of the processing fluid (F) is spread by the supply guide member (80) is not limited. The range of the processing fluid (F) may be spread in one or more radial directions based on the Y-axis by the supply guide member (80). For example, the range of the processing fluid (F) may be spread in the X-axis direction, spread in the Z-axis direction, or spread in a direction inclined with respect to both the X-axis direction and the Z-axis direction.

[0073] As such, the supply guide member (80) shown in FIG. 8 is positioned horizontally apart from the substrate (W) placed at the holding position between each supply opening (67) and the holding position.

[0074] The specific structure of the supply guide member (80) is not limited, and specific examples of the structure of the supply guide member (80) are described later (see FIGS. 9 to 12).

[0075] The discharge header (62) is provided to cover an opening on the other side of the processing space (S). The discharge header (62) has a plurality of discharge openings (68) into which a processing fluid (F) flows from the processing space (S) inside the pressure vessel (60), and functions as a fluid discharge section that promotes the discharge of the processing fluid (F) from the processing space (S).

[0076] The specific structure of the discharge header (62) is not limited. The discharge header (62) of the present example has a discharge main body part (62a), a discharge rotating shaft part (62b) mounted on the discharge main body part (62a), and a discharge path forming part (62c). The discharge main body part (62a), the discharge rotating shaft part (62b), and the discharge path forming part (62c) shown in FIGS. 3 to 8 are integrally formed by the same member.

[0077] The discharge header (62) is movably provided and can be positioned in a closed position that covers an opening on the other side of the processing space (S) and in an open position that does not cover an opening on the other side of the processing space (S). Specifically, under the control of a control device (4) (see FIG. 1), power from an opening / closing drive device (not shown) is transmitted to the discharge rotation shaft (62b), thereby causing the entire discharge header (62) to move horizontally and rotate.

[0078] For example, the discharge header (62) moves horizontally (in the Y-axis direction in this example) from the closed position (see FIG. 3 and FIG. 6) away from the pressure vessel (60) (see FIG. 4). Then, the discharge header (62) is positioned in an open position by rotating around the discharge rotation axis (62b) so as not to come into contact with or collide with the pressure vessel (60) (see FIG. 5 and FIG. 7).

[0079] Meanwhile, when moving the discharge header (62) from the open position to the closed position, the series of operations described above, 'a series of operations for moving from the closed position to the open position,' is performed in the reverse order.

[0080] With the discharge header (62) positioned in a closed position, a sealing member (not shown) is positioned between the discharge header (62) and the pressure vessel (60). By means of the sealing member, the airtightness of the processing space (S) between the discharge header (62) and the pressure vessel (60) is ensured.

[0081] When the discharge header (62) is positioned in an open position, the processing space (S) is open in the horizontal direction, as shown in FIG. 7. The discharge path forming part (62c) of the present example has a C-shaped cross-section. Accordingly, when the discharge header (62) is positioned in an open position, the discharge path forming part (62c) does not cover part or all of the processing space (S) from the horizontal direction.

[0082] Each of the processes of bringing the substrate (W) into the processing space (S) and taking out the substrate (W) from the processing space (S) is performed with the discharge header (62) positioned in an open position. That is, the second conveyor device (31a) (see FIG. 1) moves horizontally together with the substrate (W), enters the processing space (S) through a horizontally open opening of the processing space (S), and hands over the substrate (W) to the holding unit (65). In addition, the second conveyor device (31a) enters the processing space (S) through a horizontally open opening of the processing space (S), receives the substrate (W) from the holding unit (65), moves horizontally together with the substrate (W), and exits the processing space (S).

[0083] By movably configuring the discharge header (62) in this manner, an appropriate clearance is secured for the introduction and removal of the substrate (W) into the processing space (S). Additionally, a supply header (61) may be movably configured in addition to or instead of the discharge header (62). In these cases as well, it is possible to secure an appropriate clearance for the transport of the substrate (W) into the processing space (S).

[0084] The discharge path forming part (62c) has a plurality of discharge openings (68) and discharge guide paths (69), as shown in FIG. 8.

[0085] A plurality of discharge openings (68) are arranged in a horizontal direction (in the X-axis direction in this example) along the discharge guide path (69) and are connected to the discharge guide path (69). In the example shown in FIG. 8, a plurality of discharge openings (68) are distributed over a range covering the entire range of the substrate (W) placed in the holding position with respect to the X-axis direction. The discharge guide path (69) extends in a horizontal direction (in the X-axis direction in this example).

[0086] With the discharge header (62) positioned in a closed position, the discharge path forming part (62c) is located inside the pressure vessel (60) (i.e., the processing space (S)). In this state, a plurality of discharge openings (68) are connected to the processing space (S) and the discharge guide path (69), and the openings at both ends of the discharge guide path (69) are each connected to the vessel discharge path (70). As a result, each discharge opening (68), the discharge guide path (69), and each vessel discharge path (70) are connected to each other.

[0087] Because of this, the processing fluid (F) flows from the processing space (S) into the discharge guide (69) through each discharge opening (68), and then flows out from the discharge guide (69) to the first branch discharge line (53a) and the second branch discharge line (53b) through the container discharge line (70).

[0088] In this example, a discharge path is configured to guide the processing fluid (F) from the processing space (S) inside the pressure vessel (60) out of the pressure vessel (60) by means of a discharge header (62) (each discharge opening (68) and discharge guide path (69)) and a pressure vessel (60) (each vessel discharge path (70)).

[0089] The drying treatment of the substrate (W) in the drying unit (32b) having the above-described configuration is performed, for example, as follows.

[0090] First, with the discharge header (62) positioned in an open position, the substrate (W) is brought into the processing space (S) and held by the holding member (65) in the holding position (introduction processing process).

[0091] Afterward, the discharge header (62) is positioned in a closed position. By doing so, the processing space (S) is closed by the pressure vessel (60), the supply header (61), and the discharge header (62). However, the processing space (S) is connected to the first branch supply line (52a) and the second branch supply line (52b) via the supply path (supply recess (63), each supply opening (67), and supply guide path (66)). Additionally, the processing space (S) is connected to the first branch discharge line (53a) and the second branch discharge line (53b) via the discharge path (each discharge opening (68), the discharge guide path (69), and each vessel discharge path (70)).

[0092] Then, the processing fluid (F) supplied through the first branch supply line (52a) and the second branch supply line (52b) flows into the supply guide (66), each supply opening (67), and the supply recess (63) (pressure boosting process and flow processing process). After being rectified by the supply opening (67), the processing fluid (F) is discharged from the transverse fluid discharge section (71) into the processing space (S) and flows in a laminar flow state around the substrate (W) toward the discharge header (62). Then, the processing fluid (F) flows out to the first branch discharge line (53a) and the second branch discharge line (53b) through each discharge opening (68), the discharge guide (69), and each container discharge line (70).

[0093] In this way, the substrate (W) is dried by the processing fluid (F) that flows continuously around the substrate (W). In particular, since the processing fluid (F) flows around the substrate (W) in a state where vortex and stagnation are prevented by the supply guide member (80), the drying process of the substrate (W) can be performed stably. As a result, the collapse of the uneven pattern of the substrate (W) and the generation of particles can be suppressed.

[0094] After the substrate (W) is sufficiently dried, the pressure of the processing space (S) is lowered (depressurization process).

[0095] Then, the discharge header (62) is placed in an open position, and the substrate (W) is discharged from the processing space (S) (discharge processing process).

[0096] Next, a specific structural example of the supply guide member (80) according to the first embodiment will be described.

[0097] [First structural example of a supply guide member]

[0098] FIG. 9 is an enlarged cross-sectional view showing a first structural example of a supply guide member (80).

[0099] In this example, a plurality of supply openings (67) are arranged in a row at different positions in the horizontal direction (particularly in the X-axis direction).

[0100] The supply guide member (80) has an integral structure extending in a horizontal direction (particularly in the X-axis direction) and faces these supply openings (67). The supply guide member (80) is fixed to the supply main body (61a) by means of a fastener (not shown) such as a screw, bolt, or screw.

[0101] The supply guide member (80) may have any shape that contributes to the homogenization of the flow of the treatment fluid (F) while adjusting the diffusion and flow rate of the treatment fluid (F) ejected from each supply opening (67). It is preferable that the shape of the supply guide member (80) be determined according to actual design conditions and application.

[0102] The supply guide member (80) shown in FIG. 9 has a wing shape and guides the processing fluid (F) from the supply opening (67) to spread in the height direction (Z-axis direction). The supply guide member (80) is positioned such that the front edge of the wing faces the supply opening (67) and the rear edge of the wing faces the processing space (S) (substrate (W) placed in the holding position). The upper and lower surfaces of the supply guide member (80) have a smooth surface shape and do not hinder the flow of the processing fluid (F) from the supply opening (67) toward the processing space (S) (particularly the substrate (W) placed in the holding position).

[0103] The flow path of the processing fluid (F) in the supply recess (63) is partitioned by the supply main body (61a) and the supply guide member (80). The supply guide member (80) shown in FIG. 9 gradually increases in height and then gradually decreases in height with respect to the direction (Y-axis direction) from the supply opening (67) toward the processing space (S). Because of this, the flow path of the processing fluid (F) in the supply recess (63) gradually narrows in height and then gradually expands in height with respect to the direction (Y-axis direction) from the supply opening (67) toward the processing space (S).

[0104] A supply guide member (80) having such a wing shape is effective for guiding the processing fluid (F) to diffuse in a direction perpendicular to the Y-axis direction while ensuring the flow of the processing fluid (F) from each supply opening (67) toward the substrate (W) (holding position) in the Y-axis direction. However, the specific wing shape of the supply guide member (80) (e.g., chord length, centerline, maximum wing thickness, and maximum camper) is not limited.

[0105] The processing fluid (F) is guided by the supply guide member (80) and, as it moves toward the rear of the supply guide member (80) (i.e., toward the substrate (W) positioned in the holding position), is separated from the supply guide member (80) in stages. The processing fluid (F) separated from the supply guide member (80) in the early stages has a strong tendency to proceed toward the height direction end (upper and lower end) of the transverse fluid discharge section (71). The processing fluid (F) separated from the supply guide member (80) in the later stages has a strong tendency to proceed toward the height direction center of the transverse fluid discharge section (71).

[0106] By using a supply guide member (80) having an optimal wing cross-section (air foil) to discharge the processing fluid (F) into the processing space (S), the flow velocity distribution of the processing fluid (F) in the processing space (S) is improved, thereby suppressing the scattering of liquid from the substrate (W) and localized drying during the initial pressurization.

[0107] The opening area of ​​the supply recess (63) gradually increases as it moves away from each supply opening (67) (i.e., as it approaches the processing space (S) (particularly the substrate (W) placed in the holding position). The processing fluid (F) collides with the supply guide member (80) immediately after being discharged from each supply opening (67) and spreads, and the flow velocity distribution of the processing fluid (F) is smoothed.

[0108] Specifically, the processing fluid (F) is diffused in the X-axis direction (horizontal direction) by the supply guide (66), and then diffused in the Z-axis direction by being ejected from each supply opening (67) and colliding with the supply guide member (80). Afterwards, the flow velocity of the processing fluid (F) in the Y-axis direction (horizontal direction) is uniformized in the locally narrowed portion between the supply main body (61a) and the supply guide member (80) in the supply recess (63). Afterwards, the processing fluid (F) is diffused again in the Z-axis direction by the stepwise peeling of the processing fluid (F) from the surface of the supply guide member (80).

[0109] The treatment fluid (F) undergoes these multi-stage diffusion processes, and after the flow is homogenized in the X-axis direction, Y-axis direction, and Z-axis direction, it is introduced into the treatment space (S) from the transverse fluid discharge section (71).

[0110] According to the supply guide member (80) of the present structural example, the processing fluid (F) is sent from the transverse fluid discharge section (71) to the processing space (S) in a state where the flow velocity is reduced and the momentum is suppressed immediately after ejection from each supply opening (67) and the flow state is uniform. Because of this, the processing fluid (F) in a supercritical state is guided to a uniform state over the entire substrate (W) (especially the upper surface), thereby suppressing localized progress of drying of the substrate (W) and stably performing the drying process of the entire substrate (W).

[0111] In addition, the supply guide member (80) of the present structural example is positioned at least partially inside the supply header (61) (i.e., the supply recess (63)). By doing so, the supply header (61) and the supply guide member (80) can be unitized, thereby simplifying the configuration of the pressure vessel (60). Additionally, a supply header (61) and a supply guide member (80) with a space-saving structure can be used.

[0112] [Simulation Results]

[0113] The inventor of the present invention actually performed a computer simulation and examined the simulation results of the flow state of the processing fluid (F) when using the supply header (61) and supply guide member (80) of the first structural example shown in FIG. 9.

[0114] At this time, a simulation was also performed under basically the same conditions for a drying unit (32b) that is equipped with a supply header (61) shown in FIG. 9 but is not equipped with a supply guide member (80).

[0115] When the drying unit (32b) is not equipped with a supply guide member (80), the difference in flow velocity of the processing fluid (F) between the location facing the supply opening (67) and the location not facing the supply opening (67) was large. Because of this, it was confirmed that vortices and stagnation of the processing fluid (F) are likely to occur at the location corresponding to the adjacent supply openings (67) (i.e., the location not facing the supply opening (67)).

[0116] In addition, it was found that even if a supply guide member (80) is not provided, the occurrence of vortices and retention of the processing fluid (F) in the supply recess (63) can be reduced by making the cross-sectional area (especially the height direction size) of the transverse fluid discharge part (71) smaller. However, in this case, it was confirmed that vortices and retention of the processing fluid (F) are likely to occur in places in the processing space (S) that do not face the transverse fluid discharge part (71) because the processing fluid (F) is discharged forcefully from the transverse fluid discharge part (71).

[0117] As such, it was found that when the drying unit (32b) is not equipped with a supply guide member (80), vortices and retention of the processing fluid (F) occur, making it difficult to homogenize and stabilize the flow of the processing fluid (F).

[0118] Meanwhile, it was found that when the drying unit (32b) is equipped with a supply guide member (80), the occurrence of vortices and stagnation of the processing fluid (F) is effectively reduced, so that the processing fluid (F) flows smoothly around the substrate (W) without stagnation, thereby promoting the uniformity and stabilization of the flow of the processing fluid (F).

[0119] [Second structural example of supply guide absence]

[0120] In this structural example, details identical to those in the first structural example described above are omitted.

[0121] FIG. 10 is an enlarged cross-sectional view showing a second structural example of a supply guide member (80).

[0122] A plurality of supply guide members (80) are provided in the supply recess (63). Each supply guide member (80) has a wing shape and extends along the entire X-axis direction of the supply recess (63) and is fixed to the supply main body (61a).

[0123] These supply guide members (80) are arranged in multiple stages in a direction (Y-axis direction) toward a holding position from each supply opening (67). That is, one or more supply guide members (80) are provided at a first placement position with respect to the Y-axis direction, and one or more supply guide members (80) are provided at a second placement position different from the first placement position with respect to the Y-axis direction.

[0124] In the example shown in FIG. 10, another supply guide member (80) is positioned at the upper and lower sides in the height direction, respectively, with respect to the supply guide member (80) located at the front end (i.e., the supply opening (67) side) with respect to the Y-axis direction. By doing so, the processing fluid (F) that has been diffused in the up and down direction by the supply guide member (80) at the front end is further diffused in the up and down direction by the supply guide member (80) at the rear end (i.e., the holding position side). As a result, the diffusion of the processing fluid (F) in the height direction can be promoted more effectively while securing the flow of the processing fluid (F) in the direction (Y-axis direction) toward the substrate (W) (holding position) from each supply opening (67).

[0125] In addition, a plurality of supply guide members (80) are shown in a simplified manner in FIG. 10, and the number, shape, and placement position of the supply guide members (80) are not limited.

[0126] In this way, according to the plurality of supply guide members (80) of the present structural example, the processing fluid (F) can be diffused in the height direction over a plurality of stages and discharged from the transverse fluid discharge part (71) in a more uniform flow state.

[0127] [Third structural example of supply guide absence]

[0128] In this structural example, details identical to those in the first structural example described above are omitted.

[0129] FIG. 11 is an enlarged cross-sectional view showing a third structural example of a supply guide member (80).

[0130] The supply guide member (80) is movably configured to change the state of guiding the processing fluid (F) from each supply opening (67). The wing-shaped supply guide member (80) shown in FIG. 11 rotates (oscillates) in the supply recess (63) as indicated by the solid line and dotted line.

[0131] The supply guide member (80) may be operated by a driving device not shown under the control of the control device (4), or the direction of the supply guide member (80) may be adjusted manually by an operator rotating the supply guide member (80).

[0132] According to the supply guide member (80) of the present structural example, it is possible to appropriately change the balance of the flow rate (flow rate) of the processing fluid (F) with respect to the height direction.

[0133] [Fourth structural example of supply guide member]

[0134] In this structural example, details identical to those in the first structural example described above are omitted.

[0135] FIG. 12 is an enlarged cross-sectional view showing a fourth structural example of a supply guide member (80).

[0136] The plurality of supply openings (67) may include two or more supply openings (67) provided at different positions in the height direction. And the supply guide member (80) may have an integral structure facing the plurality of supply openings (67) provided at different positions in the height direction.

[0137] In the example shown in FIG. 12, three supply openings (67) are arranged in the height direction, and a wing-shaped supply guide member (80) faces these three supply openings (67) in the supply recess (63).

[0138] A confluence passage (72) is provided between a plurality of supply openings (67) that are provided at different positions in the height direction and a supply guide member (80). The confluence passage (72) is formed at least partially by a supply recess (63). The processing fluid (F) ejected from the plurality of supply openings (67) is at least partially combined in the confluence passage (72) and subsequently collides with the supply guide member (80) and is guided by the supply guide member (80).

[0139] According to the present structural example, the processing fluid (F) is diffused in the height direction by means of a plurality of supply openings (67) provided at different positions in the height direction before reaching the supply guide member (80).

[0140] In addition, the treatment fluid (F) ejected from a plurality of supply openings (67) provided at different positions in the height direction is combined in the confluence (72), thereby promoting the homogenization of the flow before reaching the supply guide member (80).

[0141] [Second Embodiment]

[0142] In the drying unit (32b) of the present embodiment, the same reference numeral is assigned to elements identical or corresponding to the elements in the drying unit (32b) of the first embodiment described above, and the detailed description thereof is omitted.

[0143] FIGS. 13 to 15 are cross-sectional views of an example of a drying unit (32b) according to a second embodiment, viewed from above, and each illustrate a supply guide member (80) of a fifth to seventh structural example.

[0144] The supply body (61a) of the supply header (61) of the present embodiment has a supply guide (66) and a plurality of supply openings (67), but does not have a supply recess (63). Because of this, the processing fluid (F) enters the processing space (S) immediately after being ejected from each supply opening (67).

[0145] A supply guide member (80) is provided in a processing space (S) and partially surrounds a substrate (W) (holding position) positioned in a holding position from the outside in a horizontal direction, facing each supply opening (67) between each supply opening (67) and the substrate (W). The method of fixing the supply guide member (80) is not limited, but typically, the supply guide member (80) is fixed directly or indirectly by a pressure vessel (60).

[0146] In the drying unit (32b) of the present embodiment, the processing fluid (F) is diffused by the supply guide member (80) after being ejected from each supply opening (67), thereby promoting the uniformity of the flow of the processing fluid (F). Because of this, the occurrence of vortices and stagnation of the processing fluid (F) in the processing space (S) can be suppressed.

[0147] In addition, by providing a supply guide member (80) to partially surround the substrate (W) from the outside in the horizontal direction, the processing fluid (F) can be flowed around the substrate (W) immediately after rectification by the supply guide member (80).

[0148] Additionally, the supply guide member (80) is provided between the holding position (substrate (W)) and the supply header (61) (each supply opening (67)) because it is necessary to diffuse and rectify the processing fluid (F) before it reaches the substrate (W) placed in the holding position. For this reason, from the perspective of smoothly bringing the substrate (W) into and out of the processing space (S), it is preferable that the substrate (W) be brought into and out of the processing space (S) through the opening on the discharge header (62) side.

[0149] Additionally, it is preferable that the installation range of the supply guide member (80) be set to a range that does not hinder the entry and exit of the substrate (W) into and out of the processing space (S). Accordingly, it is preferable that the supply guide member (80) not be provided between the holding position (substrate (W)) and the discharge header (62) so that an opening for the entry and exit of the substrate (W) in the processing space (S) is secured.

[0150] Next, a specific structural example of the supply guide member (80) according to the second embodiment will be described.

[0151] [Fifth structural example of a supply guide member]

[0152] In this structural example, details identical to those in the first structural example described above are omitted.

[0153] FIG. 13 is an enlarged cross-sectional view showing a fifth structural example of a supply guide member (80).

[0154] The supply guide member (80) provided in the processing space (S) has an integral structure and also has a shape that follows the outer circumference of the substrate (W) placed in the holding position.

[0155] In this case as well, the supply guide member (80) may have a wing shape, so that the front edge portion of the supply guide member (80) is positioned on the supply header (61) side, and the rear edge portion of the supply guide member (80) is positioned on the substrate (W) side that is placed in the holding position.

[0156] According to the supply guide member (80) of the present structure example, the processing fluid (F) that has been diffused in the height direction and rectified immediately after by the supply guide member (80) can be flowed around the substrate (W).

[0157] [Sixth structural example of a supply guide absence]

[0158] In this structural example, details identical to those in the fifth structural example described above are omitted.

[0159] FIG. 14 is an enlarged cross-sectional view showing a sixth structural example of a supply guide member (80).

[0160] In the present structural example, a plurality of supply guide members (80) are arranged in the arrangement direction of a plurality of supply openings (67) (in the example shown in FIG. 14, the X-axis direction).

[0161] That is, the substrate (W) placed in the holding position in the processing space (S) is separated from each supply opening (67) in a first horizontal direction (in the example shown in FIG. 14, the Y-axis direction). And a plurality of supply guide members (80) are arranged to be arranged in a second horizontal direction (in the example shown in FIG. 14, the X-axis direction) which is perpendicular to the first horizontal direction.

[0162] In this way, one end of a plurality of supply guide members (80) arranged in the second horizontal direction faces each supply opening (67) at a position close to each supply opening (67), and the other end partially surrounds the substrate (W) from the outside in the horizontal direction at a position close to the substrate (W) placed in the holding position.

[0163] In the example shown in FIG. 14, the Y-axis position of the end of each supply guide member (80) on the supply header (61) side is the same among the supply guide members (80). Meanwhile, the Y-axis position of the end of each supply guide member (80) on the substrate (W) side (i.e., the discharge header (62) side) is determined according to the X-axis position and is not necessarily the same among the supply guide members (80). Accordingly, the length of each supply guide member (80) in the Y-axis direction changes according to the X-axis position.

[0164] According to the supply guide member (80) of the present structural example, the processing fluid (F) is guided by a plurality of supply guide members (80) immediately after being discharged from each supply opening (67), and the processing fluid (F) that has been diffused and rectified by the supply guide member (80) can be flowed around the substrate (W).

[0165] Additionally, in the example shown in FIG. 14, each supply guide member (80) has a wing shape that guides the processing fluid (F) from each supply opening (67) to spread in a horizontal direction (in the example shown in FIG. 14, the X-axis direction). That is, the streamlined surface of each supply guide member (80) is oriented toward the X-axis direction, and the processing fluid (F) guided by each supply guide member (80) is separated from the supply guide member (80) to spread in the X-axis direction. Thus, the processing fluid (F) that has spread uniformly in the X-axis direction can be flowed around the substrate (W) placed in the holding position.

[0166] [Seventh structural example of a supply guide absence]

[0167] In this structural example, details identical to those in the fifth structural example described above are omitted.

[0168] FIG. 15 is an enlarged cross-sectional view showing a seventh structural example of a supply guide member (80).

[0169] In the present structural example, a plurality of supply guide members (80) are arranged in both directions in the processing space (S), in the arrangement direction (X-axis direction) of the plurality of supply openings (67) and in the horizontal direction (Y-axis direction) perpendicular to the arrangement direction of the plurality of supply openings (67).

[0170] That is, the substrate (W) placed in the holding position is separated from each supply opening (67) in a first horizontal direction (in the example shown in FIG. 15, in the Y-axis direction). A plurality of supply guide members (80) include two or more supply guide members (80) arranged in the first horizontal direction (Y-axis direction) and two or more supply guide members (80) arranged in a second horizontal direction (X-axis direction) perpendicular to the first horizontal direction.

[0171] A substrate (W) placed in a holding position is partially surrounded from the outside in the horizontal direction by two or more supply guide members (80) placed at different positions with respect to both the first horizontal direction (Y-axis direction) and the second horizontal direction (X-axis direction).

[0172] Specifically, in addition to a plurality of supply guide members (80) facing each supply opening (67) at a position close to each supply opening (67), a plurality of supply guide members (80) are also provided that partially surround the substrate (W) from the outside in the horizontal direction at a position close to the substrate (W) placed in the holding position.

[0173] In addition, a plurality of supply guide members (80) are shown in a simplified manner in FIG. 15, and the number, shape, and placement position of the supply guide members (80) are not limited.

[0174] According to the supply guide member (80) of the present structural example, the processing fluid (F) is guided by a plurality of supply guide members (80) immediately after being discharged from each supply opening (67), and the processing fluid (F) that has been diffused and rectified by the supply guide member (80) can be flowed around the substrate (W).

[0175] Additionally, each supply guide member (80) shown in FIG. 15 has a wing shape that guides the processing fluid (F) from each supply opening (67) to diffuse in a horizontal direction (in the example shown in FIG. 14, in the X-axis direction). Thus, the processing fluid (F) that has been uniformly diffused in the X-axis direction can be flowed around a substrate (W) placed in a holding position.

[0176] In addition, in the example shown in FIG. 15, another supply guide member (80) is positioned on one side and the other side in the X-axis direction relative to the supply guide member (80) located at the front end with respect to the Y-axis direction. By doing so, the processing fluid (F) that has been diffused in the X-axis direction by the supply guide member (80) at the front end is further diffused in the X-axis direction by the supply guide member (80) at the rear end. As a result, the diffusion of the processing fluid (F) in the X-axis direction can be promoted more effectively while securing the flow of the processing fluid (F) in the direction (Y-axis direction) toward the substrate (W) (holding position) from each supply opening (67).

[0177] [Third Embodiment]

[0178] In the drying unit (32b) of the present embodiment, the same reference numeral is assigned to elements identical or corresponding to the elements in the drying unit (32b) of the first embodiment described above, and the detailed description thereof is omitted.

[0179] FIG. 16 is a cross-sectional view of an example of a drying unit (32b) according to a third embodiment, viewed from above. FIG. 17 is a cross-sectional view of an example of a drying unit (32b) according to a third embodiment, viewed from the side.

[0180] As a fluid supply unit for supplying a processing fluid (F) to a processing space (S), a pressure vessel (60) (second fluid supply unit) having a plurality of downward branches (second supply openings) (76) is provided in addition to a supply header (61) (first fluid supply unit) having a plurality of supply openings (67) (first supply openings).

[0181] In the lower portion of the pressure vessel (60), a downward guide passage (75), a plurality of downward branch passages (76), and a plurality of downward supply recesses (77) are formed. The downward guide passage (75), the plurality of downward branch passages (76), and the plurality of downward supply recesses (77) are located downward from the substrate (W) positioned at the holding position.

[0182] The downward guide (75) includes a portion extending in the height direction and a portion extending in the horizontal direction connected to the height direction. A first supply line (51) (see FIG. 2) is connected to the portion extending in the height direction of the downward guide (75). A processing fluid (F) supplied from the first supply line (51) flows through the portion extending in the height direction of the downward guide (75) and into the portion extending in the horizontal direction.

[0183] A plurality of downward branch paths (76) are connected to a portion extending in the horizontal direction of the downward guide path (75) and are each provided along a plurality of concentric circles with different radii.

[0184] A plurality of downward supply recesses (77) are each connected to a plurality of downward branching paths (76) and are arranged along a plurality of concentric circles with different radii. Each downward supply recess (77) constitutes a downward fluid discharge section (73) that opens into a processing space (S).

[0185] In this embodiment, as a guide member, in addition to the first supply guide member (80a) located between each supply opening (67) and the holding position with respect to the horizontal direction, a plurality of second supply guide members (80b) located between each downward branch (76) and the holding position with respect to the height direction are provided.

[0186] A plurality of second supply guide members (80b) shown in FIGS. 16 and 17 are each disposed in a plurality of downward supply recesses (77) and are arranged along a plurality of concentric circles having different radii. Each second supply guide member (80b) guides the processing fluid (F) from the opposing downward branch (76) to spread to an area larger than the opening area of ​​the downward branch (76).

[0187] In the example shown in FIGS. 16 and 17, the first supply guide member (80a) has the same configuration as the supply guide member (80) of the first structural example described above (see FIG. 9), and the second supply guide member (80b) has the same wing shape as the supply guide member (80) of the first structural example.

[0188] In order to rapidly increase the pressure of the processing space (S) in the aforementioned pressure increase processing process, it is required to send a large amount of processing fluid (F) into the processing space (S) in a short period of time. In this case, in order to prevent the scattering of liquid on the upper surface of the substrate (W) and the progression of local drying on the upper surface of the substrate (W), the supply of processing fluid (F) from the lower side of the substrate (W) may be started prior to the start of supplying processing fluid (F) from the lateral direction of the substrate (W).

[0189] In this embodiment, the processing fluid (F) supplied from below the substrate (W) to the processing space (S) is also diffused and rectified by a guide member (i.e., a second supply guide member (80b)). In this way, the momentum of the processing fluid (F) supplied from below the substrate (W) to the processing space (S) is suppressed by each second supply guide member (80b), thereby sending a uniform flow of processing fluid (F) from below the substrate (W) to the processing space (S), so that liquid scattering from the substrate (W) and localized drying of the substrate (W) can be suppressed.

[0190] [First Variation Example]

[0191] FIG. 18 is a cross-sectional view of an example of a drying unit (32b) according to the first modified example, viewed from the side.

[0192] In this modified example, in the processing space (S), a plurality of substrates (W) (two substrates (W) in the example shown in FIG. 18) are arranged and maintained in a height direction at a holding position by a holding member (not shown). Additionally, a plurality of supply guide members (80) corresponding to each substrate (W) are arranged and provided in a height direction. Additionally, a plurality of discharge guide members (83) corresponding to each substrate (W) are arranged and provided in a height direction.

[0193] A holding member (not shown) that holds the substrate (W) may have any configuration. For example, a plurality of supporting members that support the corresponding substrate (W) from below may be provided as the holding member, such as a plurality of supporting members fixed to the pressure vessel (60).

[0194] Each supply guide member (80) is provided at a height direction position according to the height direction position of the corresponding substrate (W). Each supply guide member (80) is positioned to face the corresponding supply opening (67).

[0195] In the example shown in FIG. 18, as in the example shown in FIG. 9 described above, one supply opening (67) corresponds to one supply guide member (80), and two supply openings (67) are arranged in the height direction. Each supply opening (67) is connected to a supply guide path (66) and a corresponding supply recess (63) having a supply main body part (61a). In the example shown in FIG. 18, a common supply guide path (66) is connected to a plurality of supply openings (67), but the plurality of supply openings (67) may be connected to a supply guide path (66) provided individually.

[0196] Each supply guide member (80) is located in part or in whole in the corresponding supply recess (63).

[0197] Each supply guide member (80) shown in FIG. 18 has the same wing shape as the supply guide member (80) shown in FIG. 9, but may have a different shape (e.g., see FIG. 10 to FIG. 12).

[0198] Each discharge guide member (83) is provided at a height direction position according to the height direction position of the corresponding substrate (W) and is positioned to face the corresponding discharge opening (68).

[0199] In the example shown in FIG. 18, one discharge opening (68) is corresponded to one discharge guide member (83), and two discharge openings (68) are arranged in the height direction. Each discharge opening (68) is connected to a discharge guide path (69) and a corresponding discharge recess (84) having a discharge main body part (62a). In the example shown in FIG. 18, a common discharge guide path (69) is connected to multiple discharge openings (68), but multiple discharge openings (68) may be connected to discharge guide paths (69) provided individually.

[0200] Each discharge guide member (83) is located in part or in whole in each corresponding discharge recess (84). Each discharge recess (84) forms a fluid outlet (85) that opens into a processing space (S). Each discharge guide member (83) shown in FIG. 18 has the same wing shape as the supply guide member (80), but may have a different shape (e.g., see FIG. 10 to FIG. 12).

[0201] According to the drying unit (32b) of the present variation, the processing fluid (F) is guided from the processing space (S) to the processing opening (68) by the discharge guide member (83) facing the discharge opening (68) between the processing opening (68) into which the processing fluid (F) flows from the processing space (S) inside the pressure vessel (60) and the holding position (substrate (W)). Because of this, the flow of the processing fluid (F) toward each discharge opening (68) from the substrate (W) placed at the holding position can be straightened by the discharge guide member (83), thereby suppressing the occurrence of vortices and retention of the processing fluid (F).

[0202] In addition, by providing a plurality of supply guide members (80) in the height direction, even if the height size of the processing space (S) is large, the flow of the processing fluid (F) throughout the processing space (S) can be straightened, thereby suppressing the occurrence of vortices and stagnation of the processing fluid (F).

[0203] In addition, when a plurality of substrates (W) are arranged in a processing space (S), a plurality of supply guide members (80) are provided to guide the processing fluid (F) toward each substrate (W), thereby allowing the processing fluid (F) with a uniform flow to be sent toward each substrate (W).

[0204] In addition, the above-described device configuration in which a plurality of substrates (W) are arranged in a processing space (S) and the above-described device configuration in which an discharge guide member (83) is provided can be applied to various devices and methods, and, for example, can be applied to each of the above-described embodiments and each of the structural examples.

[0205] [Other variations]

[0206] The substrate (W) may be brought into and taken out of the processing space (S) together with said holding part while being held by a holding part (not shown), such as a tray. Such a holding part may be mounted, for example, on a movable header among the supply header (61) and the discharge header (62).

[0207] For example, when the discharge header (62) is movably arranged, the substrate (W) may be loaded onto a tray (not shown) mounted on the discharge header (62) by the second conveying device (31a) (see FIG. 1) while the discharge header (62) is positioned in an open position. In this case, as the discharge header (62) moves from the open position to the closed position, the substrate (W) is brought into the processing space (S) together with the tray. Additionally, as the discharge header (62) moves from the closed position to the open position, the substrate (W) is removed from the processing space (S) together with the tray.

[0208] Additionally, when a liquid film (L) is formed on the upper surface of the substrate (W), the substrate (W) is placed on a tray with the upper surface of the substrate (W) facing upward. Then, while maintaining the state where the upper surface of the substrate (W) faces upward, the discharge header (62) moves between a closed position and an open position.

[0209] It should be noted that the embodiments and variations disclosed herein are merely illustrative in all respects and should not be interpreted restrictively. The embodiments and variations described above may be omitted, substituted, and modified in various forms without departing from the scope and spirit of the appended claims. For example, the embodiments and variations described above may be combined, and embodiments other than those described above may be combined with the embodiments or variations described above.

[0210] Furthermore, the technical categories for embodying the technical concept described above are not limited. For example, the substrate processing device described above may be applied to other devices. In addition, the technical concept described above may be embodied by a computer program for executing one or more sequences (steps) included in the substrate processing method described above on a computer. In addition, the technical concept described above may be embodied by a computer-readable, non-transitory recording medium on which such a computer program is recorded.

Claims

Claim 1 A substrate processing apparatus for drying a substrate to which a liquid is attached using a supercritical processing fluid, comprising: a processing vessel for receiving the substrate inside; a holding portion for holding the substrate at a holding position inside the processing vessel; a fluid supply portion having a supply opening for discharging the processing fluid toward the inside of the processing vessel; and a supply guide member that is opposite to the supply opening between the supply opening and the holding position and guides the processing fluid from the supply opening to diffuse into an area larger than the opening area of ​​the supply opening, wherein the supply guide member is provided in plurality, and the plurality of supply guide members include one or more supply guide members provided at a first placement position in a direction from the supply opening toward the holding position, and one or more supply guide members provided at a second placement position that is different from the first placement position in a direction from the supply opening toward the holding position, wherein the second placement position is relatively closer to the holding position than the first placement position, and the first placement position A substrate processing apparatus comprising: one or more supply guide members provided for diffusing the processing fluid in a direction perpendicular to the direction from the supply opening toward the holding position; and one or more supply guide members provided for the second placement position for further diffusing the processing fluid diffused by the one or more supply guide members provided for the first placement position in a direction perpendicular to the direction from the supply opening toward the holding position. Claim 2 In claim 1, the supply guide member is a substrate processing device having a wing shape. Claim 3 A substrate processing device according to claim 1 or 2, wherein the supply guide member guides the processing fluid from the supply opening to diffuse in the height direction. Claim 4 In claim 1 or 2, the supply guide member is a substrate processing device that guides the processing fluid from the supply opening to diffuse in a horizontal direction. Claim 5 In claim 1 or 2, the fluid supply portion is a supply recess connected to the supply opening, having a supply recess whose opening area gradually increases as it moves away from the supply opening, and at least some of the supply guide members are located in the supply recess. Claim 6 A substrate processing device according to claim 1 or 2, wherein the supply guide member is movably configured to change the state of guiding the processing fluid from the supply opening. Claim 7 A substrate processing device according to claim 1 or 2, wherein the supply guide member partially surrounds the substrate positioned at the holding position from the outside in the horizontal direction. Claim 8 A substrate processing apparatus according to claim 1 or 2, wherein the supply opening is provided in plurality, the plurality of supply openings includes two or more supply openings provided at different positions in the horizontal direction, and the supply guide member has an integral structure facing the two or more supply openings provided at different positions in the horizontal direction. Claim 9 A substrate processing apparatus according to claim 1 or 2, wherein the supply opening is provided in plurality, the plurality of supply openings includes two or more supply openings provided at different positions in the height direction, and the supply guide member has an integral structure facing the two or more supply openings provided at different positions in the height direction. Claim 10 delete Claim 11 A substrate processing apparatus according to claim 1 or 2, wherein the supply guide members are provided in plurality, the substrate disposed at the holding position is separated from the supply opening in a first horizontal direction, the plurality of supply guide members include two or more supply guide members arranged in a second horizontal direction perpendicular to the first horizontal direction, and the two or more supply guide members arranged in the second horizontal direction partially surround the substrate disposed at the holding position from the outside in a horizontal direction. Claim 12 A substrate processing apparatus according to claim 1 or 2, wherein the supply guide members are provided in plurality, the substrate disposed at the holding position is separated from the supply opening in a first horizontal direction, and the plurality of supply guide members include two or more supply guide members arranged in the first horizontal direction and two or more supply guide members arranged in a second horizontal direction perpendicular to the first horizontal direction, and the two or more supply guide members disposed at positions different from each other with respect to both the first horizontal direction and the second horizontal direction partially surround the substrate disposed at the holding position from the outside in the horizontal direction. Claim 13 A substrate processing apparatus according to claim 1 or 2, wherein a first fluid supply unit having a first supply opening is provided as the fluid supply unit, the first supply opening is positioned horizontally apart from the substrate disposed at the holding position, and a first supply guide member is provided as the supply guide member positioned between the first supply opening and the holding position, and the first supply guide member guides the processing fluid from the first supply opening to spread to a range of area larger than the opening area of ​​the first supply opening. Claim 14 A substrate processing apparatus according to claim 1 or 2, wherein a second fluid supply unit having a second supply opening is provided as the fluid supply unit, the second supply opening is positioned downwardly away from the substrate disposed at the holding position, and a second supply guide member is provided as the supply guide member, positioned between the second supply opening and the holding position, and the second supply guide member guides the processing fluid from the second supply opening to spread to an area larger than the opening area of ​​the second supply opening. Claim 15 A substrate processing apparatus according to claim 14, wherein the second supply guide members are provided in plurality, and the plurality of second supply guide members are each provided along a plurality of concentric circles having different radii from each other. Claim 16 A substrate processing apparatus according to claim 1 or 2, comprising a fluid discharge portion having a discharge opening into which the processing fluid flows from the inside of the processing vessel, and a discharge guide member facing the discharge opening between the holding position and the discharge opening, and guiding the processing fluid from the inside of the processing vessel to the discharge opening. Claim 17 delete Claim 18 A substrate processing apparatus according to claim 1, wherein the fluid supply portion is a supply recess connected to the supply opening, and the opening area gradually increases as it moves away from the supply opening, and the plurality of supply guide members are located in the supply recess, and the number of supply guide members arranged in a direction perpendicular to the direction from the supply opening toward the holding position increases as the opening area increases as it moves away from the supply opening.

Images