Linear electron beam source

Abstract

The linear electron beam source (1) according to the present invention is configured as follows. A housing (100) is configured in the shape of a rectangular tube that is open upward, and a channel (115) is formed in a longitudinal groove shape on the bottom surface (105) of the housing (100). Additionally, as shown in FIG. 6, a gas pipe (200) is configured to be housed in the channel (115), and a rectangular lower insulating plate (300) is configured to be seated on the bottom surface (105) and to cover the channel (115). Additionally, a rectangular electrode plate (400) is configured to be seated on the upper surface (307) of the lower insulating plate (300). Furthermore, a lower grid plate (810) and an upper grid plate (820) are arranged at the top of the housing (100) so as to be spaced apart from each other. Therefore, the following effects are achieved. First, unlike the background technology, gas (G) is injected into the interior of the housing (100) without injecting gas into a vacuum chamber, so the gas (G) can be concentrated on the upper part of the electrode plate (400), and since the gas (G) can be supplied uniformly on the upper part of the electrode plate (400), the concentration of electrons separated from the gas atoms becomes uniform, and thus the electrons (E) accelerated to the surface of the substrate become uniform, so the entire surface area of ​​the substrate can be processed evenly. Second, since electrons (E) can be accelerated upward by the lower grid plate (810) and the upper grid plate (820), electrons (E) can collide more strongly with the surface of the substrate compared to the background technology. Therefore, the surface of the substrate can be processed efficiently. In other words, there is an effect of improving the processing efficiency with respect to the amount of gas injected per hour. Third, unlike the background technology, the present invention injects gas into the housing rather than into the vacuum chamber, thereby concentrating the gas on the upper part of the electrode plate and significantly reducing the amount of gas emitted without being used for plasma. Consequently, this has the effect of increasing the gas's contribution to plasma generation.

Description

Technology Field

[0001] The present invention relates to a linear electron beam source, and more specifically, to a linear electron beam source characterized by being able to generate a stable plasma and realize a uniform electron concentration by uniformly spraying gas, and to efficiently treat the surface of a substrate by accelerating electrons to the surface of the substrate. Background Technology

[0002] Substrates such as glass plates or films must undergo a pretreatment process in which their surfaces are treated with plasma before undergoing the coating process.

[0003] This pretreatment process is carried out by a plasma treatment device, which comprises a vacuum chamber and an electrode plate disposed inside the vacuum chamber.

[0004] The pretreatment process carried out by the above-mentioned plasma treatment device is as follows.

[0005] The substrate is positioned to face the electrode plate within the vacuum chamber. Next, a supply pipe for injecting gases such as argon, oxygen, and nitrogen, and an exhaust pipe for exhausting are connected to the vacuum chamber, thereby ensuring that the interior is always filled with fresh gas.

[0006] Next, power is applied to the plasma treatment device to cause electrons to be emitted from the electrode plate. Then, the electrons collide with atoms of the inert gas, causing electrons to be ejected from the atoms. At this time, plasma is generated, and the electrons strike the surface of the substrate, causing minute activation and chemical and physical changes, thereby increasing the hydrophilicity of the surface, removing contaminants, and improving the adhesion of the coating material. Process gas is continuously introduced through the supply pipe and discharged through the discharge pipe.

[0007] These plasma processing devices had the following problems.

[0008] First, when gas is injected into a vacuum chamber, the gas concentration inside the chamber becomes non-uniform, resulting in an uneven concentration of electrons released from gas atoms. Consequently, the surface of the substrate is treated unevenly, leading to defects.

[0009] Second, the above plasma processing device had a problem in that it lacked the function to accelerate electrons to the surface of the substrate, resulting in a significant delay in processing the substrate to the desired degree.

[0010] Third, when gas is supplied into the vacuum chamber, only a portion of the gas involved in plasma and electron generation on the upper part of the electrode plate is used to treat the substrate surface, and the rest is simply exhausted, resulting in a problem where the gas's contribution to plasma generation is low. Prior art literature

[0011] (Reference 1) Korean Patent Publication No. 10-2020-0040183 (Publication Date: April 17, 2020) (Reference 2) Korean Patent Registration No. 10-0899768 (Registration Date: May 21, 2009) The problem to be solved

[0012] The problem to be solved through the linear electron beam source according to the present invention is as follows.

[0013] First, when gas is injected into a vacuum chamber, the gas concentration inside the chamber becomes non-uniform, resulting in an uneven concentration of electrons released from gas atoms. Consequently, this aims to resolve the problem of defects caused by the non-uniform surface treatment of the substrate.

[0014] Second, the above plasma processing device aims to solve the problem of significant time delay in processing the substrate to the desired degree because it lacks the function of accelerating electrons to the surface of the substrate.

[0015] Third, when gas is supplied into the vacuum chamber, only a portion of the gas involved in plasma and electron generation on the upper part of the electrode plate is used to treat the substrate surface, and the rest is simply exhausted, resulting in a problem where the gas's contribution to plasma generation is low. means of solving the problem

[0016] The linear electron beam source according to the present invention includes the following configuration to solve the above problem.

[0017] It includes a rectangular tubular housing open upwardly, a channel formed in a longitudinal groove shape on the bottom surface of the housing, a gas pipe housed in the channel with a plurality of exhaust ports formed at a specified pitch along the longitudinal direction, a rectangular lower insulating plate seated on the bottom surface and covering the channel, a rectangular electrode plate seated on the upper surface of the lower insulating plate and connected to a negative power source, a side insulating plate attached to the inner side of the housing, and an inner plate attached to the side insulating plate as a conductor connected to a negative power source.

[0018] Additionally, the lower insulating plate is perforated vertically and horizontally, connected to the channel, and includes a slot formed long along the length direction of the lower insulating plate.

[0019] Additionally, the gas exhausted from the exhaust port of the gas pipe passes through the slot, passes between the lower insulating plate and the electrode plate, passes between the side of the electrode plate and the inner side of the housing, and is exhausted into the inside of the housing.

[0020] In addition, the lower insulating plate is configured as follows so that the gas exhausted from the exhaust port of the gas pipe passes through the slot, passes between the lower insulating plate and the electrode plate, passes between the side of the electrode plate and the inner surface of the housing, and is exhausted into the inside of the housing.

[0021] It includes a rectangular plate-shaped body as an insulator, a flange formed at the upper edge of the body, and a gas groove connected to the slot and formed on the upper surface of the body, extending only to a portion of the flange on the long side, wherein the electrode plate is sized to be fitted into the inside of the flange of the body and includes a gap formed between the inner surfaces of the housing and a gap formed between the lower ends of the inner plate and the side insulating plate.

[0022] In addition, it includes a cooling channel formed on the inner side of the electrode plate through which cooling water passes.

[0023] Additionally, the gas pipe includes an inner pipe to which gas is supplied, and the inner pipe includes an exhaust port formed at a pitch specified along the longitudinal direction, and the exhaust port of the gas pipe and the exhaust port of the inner pipe are configured to be misaligned.

[0024] In addition, it includes an upper insulating plate placed on the top of the housing and not covering the open top of the housing, a lower grid plate placed on the upper insulating plate as a conductor connected to a negative power source, an upper grid plate placed on the upper grid plate as a conductor connected to a positive power source, a washer placed between the upper insulating plate and the lower grid plate, between the lower grid plate and the upper grid plate, and on the upper grid plate as an insulator, and a bolt fastened to the top of the housing by penetrating the washer, the upper grid plate, the lower grid plate, and the upper insulating plate. Effects of the invention

[0025] The linear electron beam source according to the present invention has the following effects through the above-mentioned solution.

[0026] First, unlike the background technology, gas is injected into the interior of the housing rather than into a vacuum chamber, so the gas can be concentrated on the upper part of the electrode plate and the gas can be supplied uniformly to the upper part of the electrode plate, so the concentration of electrons escaping from gas atoms becomes uniform, and thus the electrons accelerated to the surface of the substrate become uniform, so the entire surface area of ​​the substrate can be processed evenly.

[0027] Second, since electrons can be accelerated upward by the aforementioned lower and upper grid plates, electrons can collide more strongly with the surface of the substrate compared to the background technology. Therefore, the surface of the substrate can be processed efficiently. In other words, it has the effect of improving processing efficiency with respect to the amount of gas injected per hour.

[0028] Third, unlike the background technology, the present invention injects gas into the housing rather than into the vacuum chamber, thereby concentrating the gas on the upper part of the electrode plate and significantly reducing the amount of gas emitted without being used for plasma. Consequently, this has the effect of increasing the contribution of the gas to plasma generation. Brief explanation of the drawing

[0029] FIG. 1 is a perspective view illustrating a linear electron beam source according to the present invention. FIG. 2 is a perspective view showing the state in which the two end blocks are separated from the state of FIG. 1. FIG. 3 is a perspective view illustrating a linear electron beam source according to the present invention in which a one-sided end block is omitted and an upper grid plate, a lower grid plate, and an upper insulating plate are separated upward. FIG. 4 is a perspective view showing the state in which the upper grid plate, lower grid plate, upper insulation plate, and finishing block are omitted from the state of FIG. 3. FIG. 5 is a perspective view showing the state in which both side plates are omitted from the state of FIG. 4. FIG. 6 is a perspective view showing the state in which the lower plate, gas tube, insulating plate, and electrode plate are separated from the state of FIG. 5. Figure 7 is a partial enlarged view showing a portion of the lower insulating plate shown in Figure 6. FIG. 8 is a perspective view showing the lower insulating plate illustrated in FIG. 6 turned upside down so that the bottom surface faces upward. FIG. 9 is a partial enlarged view showing a portion of the electrode plate seated on the upper surface of the lower insulating plate shown in FIG. 6. FIG. 10 is a cross-sectional view showing a longitudinal cut along the line F-F' of FIG. 1. FIG. 11 is a cross-sectional view showing the gas pipe illustrated in FIG. 6 cut in the diameter direction. FIG. 12 is a cross-sectional view illustrating the process of electrons being discharged through an upper grid plate and a lower grid plate configured on the upper part of the present invention. FIG. 13 is a perspective view illustrating another embodiment of the present invention in which a cooling pipe through which cooling water circulates is attached to the upper surface of an upper grid plate and a lower grid plate. Specific details for implementing the invention

[0030] Hereinafter, various embodiments of this document are described with reference to the accompanying drawings. However, this is not intended to limit the technology described in this document to specific embodiments and should be understood to include various modifications, equivalents, and / or alternatives to the embodiments of this document. In relation to the description of the drawings, similar reference numerals may be used for similar components.

[0031] Furthermore, expressions such as "First," "Second," etc., used in this document may modify various components regardless of order and / or importance, and are used merely to distinguish one component from another without limiting such components. For example, "Part 1" and "Part 2" may refer to different parts regardless of order or importance. For instance, without departing from the scope of rights described in this document, Part 1 may be named Part 2, and similarly, Part 2 may be renamed Part 1.

[0032] Furthermore, the terms used in this document are used merely to describe specific embodiments and are not intended to limit the scope of other embodiments. Singular expressions may include plural expressions unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as generally understood by those skilled in the art described in this document. Terms used in this document that are defined in general dictionaries may be interpreted as having the same or similar meaning as they have in the context of the relevant technology, and are not to be interpreted in an ideal or overly formal sense unless explicitly defined in this document. In some cases, even terms defined in this document may not be interpreted to exclude the embodiments of this document.

[0033] Hereinafter, a detailed embodiment of the linear electron beam source (1) according to the present invention will be described together with the attached drawings.

[0034] FIG. 1 is a perspective view illustrating a linear electron beam source according to the present invention, and FIG. 2 is a perspective view illustrating the state in which the two end blocks are separated from the state of FIG. 1. In addition, FIG. 3 is a perspective view illustrating the linear electron beam source according to the present invention with one end block omitted and the upper grid plate, lower grid plate, and upper insulating plate separated upwards, and FIG. 4 is a perspective view illustrating the state in which the upper grid plate, lower grid plate, upper insulating plate, and end block are omitted from the state of FIG. 3. In addition, FIG. 5 is a perspective view illustrating the state in which the two side plates are omitted from the state of FIG. 4, and FIG. 6 is a perspective view illustrating the state in which the lower plate, gas tube, insulating plate, and electrode plate are separated from the state of FIG. 5.

[0035] As shown in FIGS. 2 and 3, a housing (100) is configured as a rectangular tube shape that is open upward and is a conductive material, and a channel (115) is formed in a groove shape along the length direction on the bottom surface (105) of the housing (100). The housing (100) is grounded. Additionally, as shown in FIG. 6, a gas pipe (200) is configured to be housed in the channel (115) and has a plurality of exhaust ports (210) formed along the length direction at a specified pitch, and a rectangular lower insulating plate (300) is configured to be seated on the bottom surface (105) and cover the channel (115).

[0036] In addition, a rectangular electrode plate (400) connected to a negative power source is configured to be seated on the upper surface (307) of the lower insulating plate (300), and a side insulating plate (500) attached to the inner surface (127) of the side of the housing (100) is configured, and is configured to be formed of, for example, a quartz material to provide heat resistance. In addition, an inner plate (600) connected to a negative power source is configured as a conductor attached to the side insulating plate (500).

[0037] Additionally, as shown in FIG. 3, an upper insulating plate (700) is configured to be placed on the top of the housing (100) and not cover the open top of the housing (100), and may be formed of a quartz material to provide heat resistance. At this time, the upper insulating plate (700) may be divided into several parts, and in a combined state, it forms a rectangular rim shape. Therefore, it is configured so that electrons (E) can pass upward when plasma is generated later.

[0038] In addition, a lower grid plate (810) connected to a negative power source is configured as a conductor disposed on the upper part of the upper insulating plate (700), and an upper grid plate (820) connected to a positive power source is configured as a conductor disposed on the upper part of the lower grid plate (810). The lower grid plate (810) and the upper grid plate (820) are each perforated with mutually corresponding through holes (811, 821) so that electrons (E) can be discharged thereafter.

[0039] Additionally, a washer (50), which is an insulator, for example, made of ceramic material, is configured between the upper insulating plate (700) and the lower grid plate (810), between the lower grid plate (810) and the upper grid plate (820), and on the upper grid plate (820). A bolt (60) is configured to be fastened to the top of the housing (100) by penetrating the washer (50), the upper grid plate (820), the lower grid plate (810), and the upper insulating plate (700). At this time, a tap hole is formed on the top of the housing (100). Since the fastening configuration of the bolt (60) and washer (50) is arranged in multiple numbers along the upper circumference of the housing (100), a strong connection is possible.

[0040] A detailed embodiment of the housing (100) is described in conjunction with FIGS. 2 to 4 as follows.

[0041] A rectangular lower plate (110) is formed, and a side plate (120) is erected on the upper surface of the lower plate (110) on the longer side. At this time, a bolt (140) penetrates the lower plate (110) and is fastened to a tap hole formed on the lower surface of the side plate (120). Additionally, since a finishing block (130) is attached to both ends (113) of the lower plate (110) and the side plate (120), a rectangular tube shape open upward is possible. A tap hole (117) is drilled in the end (113), and since a bolt (140) penetrates the finishing block (130) and is fastened to the tap hole (117), the finishing block (130) can be connected.

[0042] The upper part of the housing (100) refers to the upper part of the side plate (120), and the inner surface (127) refers to the inner surface of the side plate (120).

[0043] At this time, the gas pipe (200) is connected to a nipple (250) that penetrates one of the two end blocks (130), so that gas can be supplied from the outside.

[0044] The lower plate (110) and lower insulating plate (300) can be joined together by a bolt (not shown) penetrating through them and fastening them to the lower surface of the electrode plate (400). Of course, since a tap hole (not shown) is formed on the lower surface of the electrode plate (400), the bolt can be fastened.

[0045] A detailed example of the lower insulating plate (300) is as follows.

[0046] FIG. 7 is a partial enlarged view showing a portion of the lower insulating plate shown in FIG. 6, and FIG. 8 is a perspective view showing the lower insulating plate shown in FIG. 6 turned upside down so that its bottom surface faces upward. FIG. 9 is a partial enlarged view showing a portion of the lower insulating plate shown in FIG. 6 with an electrode plate seated on its upper surface, FIG. 10 is a cross-sectional view showing a longitudinal cut along the line F-F' of FIG. 1. FIG. 11 is a cross-sectional view showing the gas pipe shown in FIG. 6 cut in the diameter direction.

[0047] As shown in FIGS. 7 and 8, the lower insulating plate (300) is perforated vertically and connected to the channel (115), and a plurality of slots (310) formed longitudinally along the length direction of the lower insulating plate (300) are arranged longitudinally. And on the lower surface, a distribution channel (320) formed longitudinally is formed and simultaneously connected to the slots (310).

[0048] In addition, the lower insulating plate (300) is configured as follows so that the gas exhausted from the exhaust port (210) of the gas pipe (200) passes through the slot (310), passes between the lower insulating plate (300) and the electrode plate (400), passes between the side surface (403) of the electrode plate (400) and the inner side surface (127) of the side of the housing (100), and is exhausted into the housing (100).

[0049] A rectangular plate-shaped body (301) is formed as an insulator, which may be formed of, for example, polyether ether ketone (PEEK). This is a high-performance engineering thermoplastic plastic with chemical resistance, mechanical strength at high temperatures, low moisture absorption, excellent wear resistance, and electrical properties.

[0050] A flange (303, 305) is formed on the upper edge of the body (301), and a gas groove (330) is formed on the upper surface (307) of the body (301) and connected to the slot (310), extending only to a portion of the flange (305) on the longer side. It is preferable that the size of the slot (310) be the same so that the same amount of gas can be exhausted, and the gas groove (330) connected to the slot (310) is configured to have the same shape, the same length, and the same width. At this time, as shown in FIG. 7, the gas groove (330) formed only to a portion of the flange (305) is made the same size so that the amount of gas exhausted is uniform every hour.

[0051] Accordingly, as shown in FIGS. 9 and 10, when the electrode plate (400) is seated on the lower insulating plate (300), it is configured to be inserted into the inner side of the flange (303, 305). Accordingly, the gas groove (330) is opened upward in the part where the electrode plate (400) and the flange (305) are in close contact. At this time, the gas groove (330) formed on the upper surface of the slot (310) and the lower insulating plate (300) is also connected upward without being blocked.

[0052] Additionally, as shown in FIG. 10, the electrode plate (400) is fitted into the flange (303, 305) of the body (301), and the lower insulating plate (300) is in close contact with the side plate (120), so a gap (G1) is formed between the electrode plate (400) and the inner side surface (127) of the side of the housing (100). Additionally, a gap (G2) is formed between the bottom of the inner plate (600) and the side insulating plate (500) and the electrode plate (400), so that gas (G) can flow into the inside of the housing (100).

[0053] In addition, as shown in FIG. 10, a cooling channel (410) is formed on the inner side of the electrode plate (400) through which cooling water circulates, and since a nipple (450) penetrating both end blocks (130) is connected to the cooling channel (410), the circulation of cooling water is possible. Therefore, the phenomenon in which the gas groove (330) becomes blocked is prevented as the electrode plate (400) is overheated and twisted by the power supply.

[0054] Additionally, as shown in FIG. 11, the gas pipe (200) is configured with an inner pipe (230) to which gas is supplied, and the inner pipe (230) is configured with an exhaust port (233) formed at a pitch specified along the longitudinal direction. Furthermore, the exhaust port (210) of the gas pipe (200) and the exhaust port (233) of the inner pipe (230) are configured to be misaligned in direction. Preferably, the exhaust port (210) of the gas pipe (200) faces upward and the exhaust port (233) of the inner pipe (230) faces downward. Accordingly, the gas (G) introduced into the inner pipe (230) is exhausted through the exhaust port (233), filled inside the gas pipe (200), and then exhausted again through the exhaust port (210) of the gas pipe (200). Thus, it is configured so that a uniform amount of gas (G) can be discharged through each exhaust port (210).

[0055] The gas pipe (200) has both ends sealed, and the inner pipe (230) has one end sealed and the other end penetrates the one end of the gas pipe (200) to be airtight and is connected to the nipple (250), so that gas (G) is injected into the inner pipe (230).

[0056] As another embodiment of the present invention, the following configuration may be further included.

[0057] FIG. 13 is a perspective view illustrating another embodiment of the present invention in which a cooling pipe through which cooling water circulates is attached to the upper surface of an upper grid plate and a lower grid plate, and will be explained together.

[0058] A cooling pipe (900) capable of circulating cooling water is configured by being attached to the upper surface of the lower grid plate (820) and the upper grid plate (820). The cooling pipe (900) preferably has a rectangular ring shape formed along the outer perimeter of the area where through holes (811, 821) are formed in the lower grid plate (820) and the upper grid plate (820). Of course, an inlet and an outlet are formed to enable circulation in which cooling water introduced from the outside flows in and is then discharged. Accordingly, it is configured to prevent the lower grid plate (820) and the upper grid plate (820) from overheating and twisting due to electrical conduction, thereby preventing the through holes (811, 821) from being deformed and blocked.

[0059] The operation process of the linear electron beam source (1) according to the present invention, as examined above, is as follows.

[0060] First, the present invention is installed inside a vacuum chamber, and then a substrate (M) is positioned on the upper part of the present invention. By a roll-to-roll method, the substrate (M) wound on a roll can be unwound, allowing the upper part of the present invention to be transported at a constant speed.

[0061] As shown in FIG. 10, gas (G) is injected into the inner tube (230) of the gas pipe (200). At this time, an inert gas such as argon is used as the gas (G). Then, after the gas (G) is filled inside the gas pipe (200), it is discharged through the exhaust port (210) of the gas pipe (200). At this time, because the exhaust port (210) of the gas pipe (200) and the exhaust port (233) of the inner tube (230) are misaligned, there is an effect of uniformly discharging the gas (G) after it is filled inside the gas pipe (200).

[0062] The gas (G) discharged in this way is filled into the channel (115) of the housing (100) and the distribution channel (320) of the lower insulating plate (300), and then flows into each slot (310). Even at this time, since the gas (G) is discharged upward after being filled into the channel (115) and the distribution channel (320), a uniform amount of gas (G) flows into each slot (310).

[0063] Next, the gas (G) introduced into the slot (310) is exhausted along the gas groove (330) formed laterally and upward from the gas groove (330) formed in the flange (305). Then, it is introduced into the housing (100) through the gaps (G1, G2). In this way, because gas pressure is generated as the gas (G) passes through the multiple gas grooves (330) and gaps (G1, G2) in each slot (310), a uniform amount of gas (G) is discharged from both sides in the longitudinal direction of the electrode plate (400). That is, in a rectangular housing (100), a uniform amount of gas (G) is discharged from each area at the bottom of the side plates (120) on both sides, thereby supplying a uniform amount of gas (G) to the upper part of the electrode plate (400).

[0064] In this state, when a negative power source is applied to the electrode plate (400), electrons emitted from the electrode plate (400) collide with atoms constituting the gas (G), causing electrons (E) to be ejected from the atoms. At this time, plasma is generated.

[0065] Thus, the present invention has the advantage of easily processing the substrate (M) with a small amount of gas (G) without wasting gas (G) because the gas (G) is injected into the housing (100) instead of being injected into the vacuum chamber.

[0066] The principle by which the electrons (E) generated in this way are accelerated upward and ejected is as follows.

[0067] FIG. 12 is a cross-sectional view illustrating the process of electrons being discharged through an upper grid plate and a lower grid plate configured on the upper part of the present invention.

[0068] A negative power source is applied to the lower grid plate (810), and a positive power source is applied to the upper grid plate (820). Then, an electric field is formed that penetrates the upper and lower corresponding through holes (811, 821).

[0069] In addition, since the lower grid plate (810) has a negative charge, it pushes the electrons (E) downward, and since the inner plate (600) is also connected to a negative power source, it pushes the electrons (E) inward. Therefore, the electrons (E) flow into the through hole (811) of the lower grid plate (810). At this time, since the electric field flows from the positive to the negative direction, it flows from the upper grid plate (820) to the lower grid plate (810). However, in the electric field, the electrons (E) are accelerated in the opposite direction to the electric field, so they are ejected upward. Thus, according to the present invention, since the electrons (E) can be smoothly discharged by accelerating them upward while charged inside the housing (100), the electrons (E) can collide with the surface of the substrate (M) with a stronger intensity than in the background technology. Therefore, there is an effect of efficiently treating the surface of the substrate.

[0070] Therefore, when a substrate such as a glass plate or film is placed on the upper grid plate (820), surface treatment of the substrate becomes possible. At this time, since electrons (E) are evenly emitted upward, there is an effect of being able to treat the entire surface of the substrate evenly.

[0071] At this time, since cooling water circulates through the cooling channel (410) of the electrode plate (400), the phenomenon of the gas groove (330) becoming blocked due to overheating and twisting caused by the conduction of power is prevented. Explanation of the symbols

[0072] 1: Linear electron beam source 50: Washer 60: Bolt 100: Housing 105: Bottom surface 110: Bottom plate 115: Channel 120: Side plate 127: Inner side 130: Finishing block 200: Gas pipe 210: Exhaust port 230: Inner pipe 233: Exhaust port 250: Nipple 300: Lower insulation plate 301: Body 303, 305: Flange 307: Top surface 310: Slot 320: Distribution Channel 330: Gas Home 400: Electrode plate G1, G2: Gap 403: Side 410: Cooling channel 450: Nipple 500: Side insulation plate 600: Inner plate 700: Upper insulation plate 810: Lower grid plate 811, 821: Through holes 820: Upper grid plate 900: Cooling pipe

Claims

Claim 1 A rectangular tube-shaped housing that is open upward, a channel formed in a longitudinal groove shape on the bottom surface of the housing, a gas pipe housed in the channel having a plurality of exhaust ports formed along the longitudinal direction at a specified pitch, a rectangular lower insulating plate seated on the bottom surface and covering the channel, a rectangular electrode plate seated on the upper surface of the lower insulating plate and connected to a negative power source, a side insulating plate attached to the inner side of the housing, and an inner plate attached to the side insulating plate as a conductor connected to a negative power source, wherein the lower insulating plate is perforated vertically and horizontally, is connected to the channel, and includes a slot formed long along the longitudinal direction of the lower insulating plate, and gas exhausted from the exhaust port of the gas pipe passes through the slot, passes between the lower insulating plate and the electrode plate, passes between the side of the electrode plate and the inner side of the housing, and is configured to be exhausted into the housing. that, The gas exhausted from the exhaust port of the gas pipe passes through the slot, passes between the lower insulating plate and the electrode plate, passes between the side of the electrode plate and the inner surface of the housing, and is exhausted into the inside of the housing. The above lower insulating plate is, A rectangular plate-shaped body as an insulator, and A flange formed on the upper corner of the body, and It includes a gas groove connected to the slot and formed on the upper surface of the body, formed only up to a part of the flange on the long side, A linear electron beam source characterized in that the electrode plate is sized to be fitted into the flange of the body and includes a gap formed between the inner surfaces of the housing and a gap formed between the lower ends of the inner plate and the side insulating plate. Claim 2 delete Claim 3 In paragraph 1, A linear electron beam source characterized by including a cooling channel formed on the inner side of the electrode plate through which cooling water passes. Claim 4 In paragraph 1, A linear electron beam source characterized in that the gas tube includes an inner tube to which gas is supplied, the inner tube includes an exhaust port formed at a pitch defined along the longitudinal direction, and the exhaust port of the gas tube and the exhaust port of the inner tube are misaligned. Claim 5 In paragraph 1, A linear electron beam source characterized by comprising: an upper insulating plate placed on the top of the housing and not covering the open top of the housing; a lower grid plate placed on the upper insulating plate as a conductor connected to a negative power source; an upper grid plate placed on the upper grid plate as a conductor connected to a positive power source; a washer which is an insulator placed between the upper insulating plate and the lower grid plate, between the lower grid plate and the upper grid plate, and on the upper grid plate; and a bolt fastened to the top of the housing by penetrating the washer, the upper grid plate, the lower grid plate, and the upper insulating plate. Claim 6 A linear electron beam source according to claim 5, characterized by including a cooling pipe attached to the upper surface of the lower grid plate and the upper surface of the upper grid plate, capable of circulating cooling water.

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