Electronic device for reinforcing strenghth and inhibiting bending of metal segments

Abstract

An electronic device according to various embodiments may include: a first metal segment including a first fastening portion; a second metal segment spaced apart from the first metal segment to form a slit with the first metal segment and including a second fastening portion; a supporting insulator connected to the first fastening portion and the second fastening portion, supporting the first metal segment and the second metal segment, and insulating between the first metal segment and the second metal segment; and a filler surrounding at least a portion of the supporting insulator and filling at least a portion of the slit.

Description

Technology Field

[0001] The following various embodiments relate to an electronic device comprising metal segments, for example, an electronic device for reinforcing the strength of metal segments and suppressing bending. Background Technology

[0002] The electronic device includes a communication module and an antenna module to provide various services to the user. For example, the electronic device may include multiple metal segments depending on the number of increased antenna modules. The problem to be solved

[0003] According to various embodiments, an electronic device can be provided that reinforces the strength of metal segments while maintaining the gap between metal segments and suppresses bending of metal segments. means of solving the problem

[0004] An electronic device according to various embodiments may include: a first metal segment including a first fastening portion; a second metal segment spaced apart from the first metal segment to form a slit with the first metal segment and including a second fastening portion; a supporting insulator connected to the first fastening portion and the second fastening portion, supporting the first metal segment and the second metal segment, and insulating between the first metal segment and the second metal segment; and a filler surrounding at least a portion of the supporting insulator and filling at least a portion of the slit.

[0005] A method for manufacturing an electronic device according to various embodiments may include: processing a first metal segment including a first fastening portion and a second metal segment including a second fastening portion spaced apart from the first metal segment to form a slit with the first metal segment; fastening a support insulator that supports the first metal segment and the second metal segment and insulates the first metal segment and the second metal segment to the first fastening portion and the second fastening portion; and forming a filler by filling at least a portion of the slit with an injection molded material while surrounding at least a portion of the support insulator. Effects of the invention

[0006] According to various embodiments, the strength of the metal segments can be reinforced and bending of the metal segments can be suppressed while maintaining the gap between the metal segments. Brief explanation of the drawing

[0007] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments. FIG. 2a is a drawing showing a first surface (e.g., front) and a second surface (e.g., side) of an electronic device according to one embodiment. FIG. 2b is a drawing showing a third side (e.g., rear) of an electronic device according to one embodiment. FIG. 2c is a drawing showing the internal structure of the electronic device in the first side of FIG. 2a together with the second side. FIG. 2d is a drawing showing the internal structure of an electronic device on the second side of the electronic device of FIG. 2b. FIG. 2e is a drawing showing metal segments excluding the region of the filler in an electronic device according to one embodiment. FIG. 2f is a drawing showing metal segments including a region of a filler in an electronic device according to one embodiment. FIG. 2g is a drawing showing a part of a second surface of an electronic device according to one embodiment. Figure 2h is an enlarged view of 2H of an electronic device of 2g. FIG. 3a is a drawing showing the internal structure of an electronic device including metal segments according to one embodiment. Figure 3b is an enlarged view of 3B of the electronic device in Figure 3a. FIG. 3c is a partially exploded perspective view showing the fastening structure of a pair of adjacent metal segments in the electronic device of FIG. 3a. Fig. 3d is a plan view of the electronic device of Fig. 3b. Figure 3e is a cross-sectional view of the electronic device of Figure 3d viewed from 3E-3E. FIG. 4a is a drawing illustrating the operation of processing metal segments in a method for manufacturing an electronic device according to one embodiment. FIGS. 4b and FIGS. 4c are drawings illustrating the operation of joining metal segments in a method for manufacturing an electronic device according to one embodiment. FIG. 4d is a diagram illustrating the operation of supporting a support insulator before charging a filler in a method for manufacturing an electronic device according to one embodiment. FIG. 4e is a diagram illustrating the operation of charging a filler while supporting a support insulator in a method for manufacturing an electronic device according to one embodiment. FIGS. 4f and FIGS. 4g are drawings illustrating the operation of releasing the support of a support insulator after the charge is filled in a method for manufacturing an electronic device according to one embodiment. FIG. 5 is a perspective view of a part of the structure of an electronic device according to one embodiment. FIG. 6 is a plan view of a part of the structure of an electronic device according to one embodiment. FIG. 7 is a plan view of a part of the structure of an electronic device according to one embodiment. FIG. 8 is a cross-sectional view of a part of the structure of an electronic device according to one embodiment. Specific details for implementing the invention

[0008] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0009] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0010] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0011] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, software (e.g., program (140)) and input or output data for related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0012] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0013] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0014] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0015] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0016] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0017] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0018] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0019] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0020] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0021] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0022] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0023] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0024] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0025] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0026] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0027] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0028] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0029] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0030] The electronic device according to the various embodiments disclosed in this document may be a device of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0031] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, each of phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as “first,” “second,” or “first” or “second” may be used simply to distinguish a component from another component and do not limit the components in any other aspect (e.g., importance or order). Where any (e.g., first) component is referred to as “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicationally,” it means that said component may be connected to said other component directly (e.g., wired), wirelessly, or through a third component.

[0032] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0033] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0034] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0035] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0036] Referring to FIGS. 2a through 2h, an electronic device (201) (e.g., electronic device (101)) according to one embodiment may include a housing (210) having a first surface (210a) (e.g., front), a second surface (210b) (e.g., rear), and a plurality of third surfaces (210c) (e.g., sides) surrounding the space between the first surface (210a) and the second surface (210b).

[0037] In one embodiment, the first surface (210a) may be substantially formed by a display (261) (e.g., a display module (160)). The edges of the display (261) may be directly connected to a plurality of third surfaces (210c). In another embodiment, a substantially transparent plate may be formed between the display (261) and the plurality of third surfaces (210c). For example, the plate may include a glass plate, a polymer plate, and any other suitable plate having various coating layers.

[0038] In one embodiment, the second surface (210b) may be formed by a substantially opaque plate (211). For example, the plate (211) may be formed by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, magnesium), and / or a combination of at least two of the materials.

[0039] In one embodiment, a plurality of third surfaces (210c) may be combined with the plate (211). In one embodiment, the plurality of third surfaces (210c) may be formed by at least a portion of a plurality of spaced-apart metal members (218) (e.g., metal segments) and at least a portion of at least one non-metal member (219) (e.g., filler) between a pair of adjacent metal members (218). In one embodiment, at least a portion of the plurality of metal members (218) and at least one non-metal member (219) may form at least a portion of the second surface (210b). In one embodiment, at least one of the plurality of metal members (218) may function as an antenna.

[0040] In one embodiment, the electronic device (201) may include an input module (250) (e.g., input module (150)), an audio module (270) (e.g., audio module (170)), a sensor module (e.g., sensor module (176)), a camera module (280) (e.g., camera module (180)), a connection terminal (278) (e.g., connection terminal (178)), and / or other components (e.g., processor (120), memory (130), sound output module (155), audio module (170), interface (177), haptic module (179), power management module (188), battery (189), communication module (190), subscriber identification module (196), and / or antenna module (197)).

[0041] In one embodiment, the audio module (270) may be formed on at least one of the plurality of metal members (218). In one embodiment, the camera module (280) may be positioned on the plate (211). In one embodiment, the camera module (280) may be exposed to at least a portion of the recess area (211b) formed on the plate (211). In one embodiment, the connection terminal (278) may be formed on at least one of the plurality of metal members (218).

[0042] In one embodiment, the plate (211) and the plurality of metal members (218) may be spaced apart from each other to form a slit (S). For example, the plurality of metal members (218) may include a first metal segment (218a), a second metal segment (218b), a third metal segment (218c), and a fourth metal segment (218d), and one or more of the plurality of metal segments (218a, 218b, 218c, 218d) may function as an antenna operating at a predetermined resonant frequency.

[0043] In one embodiment, at least one non-metallic member (219) may join the plate (211) and a plurality of metal members (218) and may join a pair of adjacent metal members (218). For example, the non-metallic member (219) may be filled and injected into at least a portion of the slit (S) during the manufacture of the electronic device (201) and may connect a pair of adjacent metal members (218) over a predetermined period of time. In one embodiment, at least one non-metallic member (219) may extend across one area and another area of ​​the third surface (210c). In one embodiment, at least one non-metallic member (219) may form at least a portion of the exterior of the electronic device (201) and may be formed of a material (e.g., resin) that may exhibit any suitable color and texture in consideration of the exterior of the electronic device (201).

[0044] In one embodiment, in a structure of adjacent pairs of metal members (218) and non-metal members (219) joining them (e.g., FIG. 2h), for example, by contraction of the non-metal member (219) or by pressing due to an external force, the adjacent pairs of metal members (218) may apply a first stress or a first force (F1) to a first region of the non-metal member (219) (e.g., an upper region based on FIG. 2h), and may apply a second stress or a second force (F2) different from the first stress or first force (F1) to a second region of the non-metal member (219) that is different from the first region (e.g., a lower region based on FIG. 2h). The non-metallic member (219) can secure the rigidity of an adjacent pair of metal members (218) by suppressing or delaying bending of an adjacent pair of metal members (218) that may occur when the dimensions (e.g., horizontal dimensions) of a second region (e.g., lower region) become smaller than the dimensions (e.g., horizontal dimensions) of a first region (e.g., upper region).

[0045] Referring to FIGS. 3a through 3e, an electronic device (301) (e.g., electronic device (201)) according to one embodiment may include a housing (310) (e.g., housing (210)) comprising a first surface (e.g., first surface (210a)), a second surface (310b) (e.g., second surface (210b)), and a plurality of third surfaces (310c) (e.g., third surfaces (310c)). The second surface (310b) may include a plate (311) (e.g., plate (211)). The electronic device (301) may include a plurality of metal segments (318a, 318b, 318c, 318d) (e.g., a plurality of metal segments (218a, 318b, 318c, 318d) formed on at least a portion of the second surface (310b) and at least a portion of the plurality of third surfaces (310c). It may include at least a portion of the slit (S) between adjacent pairs of metal segments (318a, 318b; 318b, 318c; 318c, 318d) and a filler (319) (e.g., non-metallic member (219)) that fills the slit (e.g., slit (S) of FIG. 2e) between a plurality of metal segments (318a, 318b, 318c, 318d) and a plate (311), and a supporting insulator (321).

[0046] In one embodiment, the first metal segment (318a) may include a first wall (331a) forming at least a portion of the third surface (310c), a first sheet (332a) forming at least a portion of the second surface (310b), and a second wall (333a) formed between the first wall (331a) and the first sheet (332a). In one embodiment, the height of the first wall (331a) relative to the first sheet (332a) may be greater than the height of the second wall (333a) relative to the first sheet (332a). In one embodiment, a step may be formed between the first wall (331a) and the second wall (333a).

[0047] In one embodiment, the second metal segment (318b) may include a third wall (331b) forming at least a portion of the third surface (310c), a second sheet (332b) forming at least a portion of the second surface (310b), and a fourth wall (333b) formed between the third wall (331b) and the second sheet (332b). In one embodiment, the height of the third wall (331b) relative to the second sheet (332b) may be greater than the height of the fourth wall (333b) relative to the second sheet (332b). In one embodiment, a step may be formed between the third wall (331b) and the fourth wall (333b).

[0048] In one embodiment, the first metal segment (318a) may include a first fastening portion (334a). The first fastening portion (334a) may be configured to be fastened to at least a portion of the supporting insulator (321) (e.g., the first link (323)).

[0049] In one embodiment, the first fastening portion (334a) may include a first metal support layer (3341a) formed on the second wall (333a). The first metal support layer (3341a) may be configured to support at least a portion (e.g., base (322)) of the support insulator (321). The first metal support layer (3341a) may include a first hole (H1).

[0050] In one embodiment, the first fastening portion (334a) may include a plurality of first metal support layers (3341a, 3342a) spaced apart from each other along the second wall (333a). One of the plurality of first metal support layers (3341a, 3342a) may be formed on the second wall (333a), and the other first metal support layer (3342a) may be formed on the first sheet (332a) and the second wall (333a). In one embodiment, the other first metal support layer (3342a) may be located on a different plane from the first sheet (332a). The other first metal support layer (3342a) may include a first groove (G1). In another embodiment, the first groove (G1) may be formed in the first sheet (332a) without the first metal support layer (3342a).

[0051] In one embodiment, the second fastening portion (334b) may include a second metal support layer (3341b) formed on the fourth wall (333b). The second metal support layer (3341b) may be configured to support at least a portion (e.g., base (322)) of the support insulator (321). The second metal support layer (3341b) may include a second hole (H2).

[0052] In one embodiment, the second fastening portion (334b) may include a plurality of second metal support layers (3341b, 3342b) spaced apart from each other along the fourth wall (333b). One of the plurality of second metal support layers (3341b, 3342b) may be formed on the fourth wall (333b), and the other second metal support layer (3342b) may be formed on the second sheet (322b) and the fourth wall (333b). In one embodiment, the other second metal support layer (3342b) may be located on a different plane from the second sheet (332b). The other second metal support layer (3342b) may include a second groove (G2). In another embodiment, the second groove (G2) may be formed in the second sheet (332b) without the second metal support layer (3342b).

[0053] The supporting insulator (321) can connect adjacent pairs of metal segments (318a, 318b; 318b, 318c; 318c, 318d), support adjacent pairs of metal segments (318a, 318b; 318b, 318c; 318c, 318d), and insulate between adjacent pairs of metal segments (318a, 318b; 318b, 318c; 318c, 318d). The supporting insulator (321) can improve the bending stiffness and bending stiffness between adjacent pairs of metal segments (318a, 318b; 318b, 318c; 318c, 318d) by suppressing or delaying, together with the filler (319), bending that may occur due to a difference in stress or force that may be applied to different parts of the filler (319) while maintaining a separation between adjacent pairs of metal segments (318a, 318b; 318b, 318c; 318c, 318d) and maintaining a separation between adjacent pairs of metal segments (318a, 318b; 318b, 318c; 318c, 318d).

[0054] In one embodiment, the support insulator (321) may include a base (322), a first link (323) extending from a part of the base (322) (e.g., the lower left part with reference to FIG. 3e), and a second link (324) extending from the opposite part of the base (322) (e.g., the lower right part with reference to FIG. 3e).

[0055] The base (322) can connect the first link (323) and the second link (324). The base (322) can be supported by the first metal support layer (3341a) and / or the second metal support layer (3341b) when the support insulator (321) is fastened.

[0056] The first link (323) may be configured to pass through the first hole (H1). In one embodiment, the movement of the first link (323) in one direction (e.g., horizontal direction with respect to FIG. 3e) may be substantially restricted by the first hole (H1). In one embodiment, at least a portion (e.g., end) of the first link (323) may be received in the first groove (G1). In one embodiment, the movement of the first link (323) in one direction (e.g., horizontal direction with respect to FIG. 3e) may be substantially restricted by the first groove (G1).

[0057] In one embodiment, the first link (323) may include a first extension (3231) extending from a first part of the base (322) (e.g., the lower left part with reference to FIG. 3e) and passing through a first hole (H1), and a first receiving end (3232) formed at the end of the first extension (3231) and received in a first groove (G1). In one embodiment, the first extension (3231) may have a cross-section of a shape (e.g., circular) having substantially the same numerical value (e.g., diameter). In one embodiment, the first receiving end (3232) may have a tapered shape.

[0058] The second link (324) may be configured to pass through the second hole (H2). In one embodiment, the movement of the second link (324) in one direction (e.g., horizontal direction with respect to FIG. 3e) may be substantially restricted by the second hole (H2). In one embodiment, at least a portion (e.g., end) of the second link (324) may be received in the second groove (G2). In one embodiment, the movement of the second link (324) in one direction (e.g., horizontal direction with respect to FIG. 3e) may be substantially restricted by the second groove (G2).

[0059] In one embodiment, the second link (324) may include a second extension (3241) extending from a second part of the base (322) (e.g., the lower right part with reference to FIG. 3e) and passing through a second hole (H2), and a second receiving end (3242) formed at the end of the first extension (3241) and received in a second groove (G2). In one embodiment, the second extension (3241) may have a cross-section of a shape (e.g., circular) having substantially the same numerical value (e.g., diameter). In one embodiment, the second receiving end (3242) may have a tapered shape.

[0060] In one embodiment, the base (322), the first link (323), and the second link (324) can be seamlessly formed as a single unit.

[0061] The filler (319) can surround at least a portion of the support insulator (321) and fill the slit (S) between the first metal segment (318a) and the second metal segment (318b) when the first metal segment (318a), the second metal segment (318b) and the support insulator (321) are joined.

[0062] In one embodiment, the filler (319) may be formed of a material capable of exhibiting any suitable color and / or texture considering the appearance of the electronic device (301). For example, the filler (319) may be formed of polybutylene terephthalate (PBT). Meanwhile, the filler (319) and the supporting insulator (321) may be formed of different materials.

[0063] In one embodiment, the supporting insulator (321) may be formed of a material having a stiffness greater than that of the material of the filler (319). This can improve the bending stiffness and bending stiffness between adjacent pairs of metal segments (318a, 318b; 318b, 318c; 318c, 318d).

[0064] In one embodiment, the supporting insulator (321) may be formed of a material having substantially the same heat resistance as or greater than the heat resistance of the material of the filler (319). This can substantially prevent shrinkage of the supporting insulator (321) due to an exemplary operation of manufacturing the electronic device (301) (e.g., a color application operation on the plate (311) and / or a plurality of metal segments (318a, 318b, 318c, 318d) by high heat), thereby improving the bending stiffness and bending stiffness between adjacent pairs of metal segments (318a, 318b; 318b, 318c; 318c, 318d).

[0065] In one embodiment, the supporting insulator (321) may be formed of a material having a permittivity substantially equal to that of the filler (319) or a permittivity greater than that of the filler (319). This ensures the operational performance (e.g., operation at a defined resonant frequency) of the first metal segment (318a) and / or the second metal segment (318b) which can function as an antenna.

[0066] In one embodiment, the support insulator (321) may comprise an amorphous thermoplastic plastic. For example, the support insulator (321) may comprise polyetherimide (PEI). Forming the support insulator (321) with an amorphous thermoplastic plastic allows for an increased heat deformation threshold temperature (e.g., about 200°C or higher), thereby ensuring excellent heat resistance and injection moldability while also ensuring dimensional stability during processing.

[0067] In one embodiment, the support insulator (321) may comprise a crystalline thermoplastic plastic. For example, the support insulator (321) may comprise polyether ether ketone (PEEK). Forming the support insulator (321) with a crystalline thermoplastic plastic can ensure excellent heat resistance and injection moldability by having an increased heat deformation critical temperature (e.g., about 150°C or higher).

[0068] In one embodiment, the support insulator (321) may comprise a fiber-reinforcing material. In one example, the support insulator (321) may be reinforced with glass fiber. In one example, the support insulator (321) may be reinforced with about 20% glass fiber and may comprise polyetherimide. In another example, the support insulator (321) may be reinforced with about 30% glass fiber and may comprise polyetheretherketone. In yet another example, the support insulator (321) may also be reinforced with carbon fiber.

[0069] In one embodiment, the filler (319) may include a visibility hole (341). Here, "visibility" may mean that the presence of the hole (341) can be confirmed from outside the electronic device (301), and the presence of the supporting insulator (321) can be confirmed through the hole (341). The visibility hole (341) may extend from the outer surface of the filler (319) to one side of the base (322) (e.g., the top surface in FIG. 3e). In one embodiment, the visibility hole (341) may be a substantially circular hole. In one embodiment, the visibility hole (341) may be formed at a location on the outer surface of the filler (319) corresponding to a substantially middle portion of one side of the base (322).

[0070] Hereinafter, a method for manufacturing an electronic device according to one embodiment will be described with reference to FIGS. 4a to 4g. FIGS. 4a to 4g is merely an illustrative sequence for explaining the operations of the manufacturing method, and it can be understood that the operations of the manufacturing method are not necessarily performed in the given sequence, and that one or more operations(s) may be omitted, one or more operations(s) may be added, or the order of some operations may be changed.

[0071] Referring to FIG. 4a, a method according to one embodiment may include the operation of processing a first metal segment (418a) (e.g., first metal segment (318a)) including a first fastening portion (434a) (e.g., first fastening portion (334a)) and a second metal segment (418b) (e.g., second metal segment (318b)) including a second fastening portion (434b) (e.g., second fastening portion (334b)). The first metal segment (418a) and the second metal segment (418b) may be spaced apart from each other to define a slit (S) so that they are not electrically connected to each other. In one embodiment, the operation of processing the first metal segment (418a) and the second metal segment (418b) may be performed in a layout determined by computer numerical control.

[0072] Referring to FIG. 4b and FIG. 4c, a method according to one embodiment may include the operation of injecting a support insulator (421) comprising a base (422) (e.g., base (322)), a first link (423) (e.g., first link (323)), and a second link (424) (e.g., second link (324)). A method according to one embodiment may include the operation of connecting the first link (423) of the support insulator (421) to the first fastening portion (434a) of the first metal segment (418a) and connecting the second link (424) of the support insulator (421) to the second fastening portion (434b) of the second metal segment (418b) while substantially maintaining the gap of the slit (S) between the first metal segment (418a) and the second metal segment (418b).

[0073] Referring to FIG. 4d, a method according to one embodiment may include the operation of pushing a base (422) using a metal support (451) so that the support insulator (421) can be supported and maintained by the first fastening part (434a) and the second fastening part (434b). In one embodiment, the metal support (451) may have a substantially circular cross-section.

[0074] Referring to FIG. 4e, a method according to one embodiment may include the operation of pushing the base (422) using a metal support (451) and filling the space (e.g., slit (S)) between the first metal segment (418a) and the second metal segment (418b) with an injection molded material, while surrounding the support insulator (421) except for the portion supported by the metal support (451). A method according to one embodiment may include the operation of waiting until the filled injection molded material is formed into a filler (419) of a desired shape.

[0075] Referring to FIG. 4f and FIG. 4g, a method according to one embodiment may include the operation of removing a metal support (451) that was pushing the base (422). When the metal support (451) is removed, a visibility hole (441) (e.g., visibility hole (341)) may be formed on a portion of the outer surface of the filler (419) where the metal support (451) was located, so that one side (e.g., upper surface) of the base (422) of the support insulator (421) can be seen. The shape of the visibility hole (441) may be substantially the same as the cross-sectional shape of the metal support (451).

[0076] In an embodiment not illustrated, the method according to one embodiment may perform anodizing to apply color to the first metal segment (418a) and the second metal segment (418b).

[0077] Referring to FIG. 5, an electronic device (501) (e.g., electronic device (301)) according to one embodiment may include a first metal segment (518a) (e.g., first metal segment (318a)) including a first fastening part (534a) (e.g., first fastening part (334a)), a second metal segment (518b) (e.g., second metal segment (318b)) including a second fastening part (534b) (e.g., second fastening part (334b)), a filler (519) (e.g., filler (319)), and a supporting insulator (521) (e.g., supporting insulator (321)). The first fastening part (534a) may include a plurality of first metal support layers (5341a, 5342a) (e.g., a plurality of first metal support layers (3341a, 3342a)), and the second fastening part (534b) may include a plurality of second metal support layers (5341b, 5342b) (e.g., a plurality of second metal support layers (3341b, 3342b)). The filler (519) may include a visibility hole (541) (e.g., a visibility hole (341)).

[0078] In one embodiment, the support insulator (521) may include a base (522) (e.g., base (322)), a plurality of first links (523) (e.g., first links (323)) formed in a first part of the base (522), and a plurality of second links (524) (e.g., second links (324)) formed in a second part of the base (522). The plurality of first links (523) may be arranged spaced apart from each other in the first part of the base (522), in a direction toward the second part of the base (522) or in the opposite direction. The plurality of second links (524) may be arranged spaced apart from each other in the second part of the base (522), in a direction toward the first part of the base (522) or in the opposite direction.

[0079] In one embodiment, any one of the plurality of first metal support layers (5341a, 5342a) may include a plurality of first holes (e.g., first holes (H1)) through which a plurality of first links (523) pass, and the other first metal support layer (5342a) may include a plurality of first grooves (e.g., first grooves (G1)) in which the ends of the plurality of first links (523) are each received.

[0080] In one embodiment, any one of the plurality of second metal support layers (5341b, 5342b) may include a plurality of second holes (e.g., second holes (H2)) through which a plurality of second links (524) pass, and the other second metal support layer (5342b) may include a plurality of second grooves (e.g., second grooves (G2)) in which the ends of the plurality of second links (524) are each received.

[0081] Referring to FIG. 6, an electronic device (601) (e.g., electronic device (301)) according to one embodiment may include a first metal segment (618a) (e.g., first metal segment (318a)) including a first fastening part (634a) (e.g., first fastening part (334a)), a second metal segment (618b) (e.g., second metal segment (318b)) including a second fastening part (634b) (e.g., second fastening part (334b)), a filler (619) (e.g., filler (319)), and a supporting insulator (621) (e.g., supporting insulator (321)). The supporting insulator (621) may include a base (622) (e.g., base (322)), a first link (e.g., first link (323)), and a second link (e.g., second link (324)).

[0082] In one embodiment, the filler (619) may include a plurality of visibility holes (641) (e.g., visibility holes (341)) that allow visibility of the base (622). The plurality of visibility holes (641) may be spaced apart from each other along the formation direction (e.g., horizontal direction) of the base (622). The arrangement structure of the plurality of visibility holes (641) in this embodiment is derived from the fact that when forming the filler (619), the base (622) is pushed using a plurality of metal supports (e.g., metal supports (451)), thereby preventing the supporting insulator (621) from floating due to the injection molding.

[0083] Referring to FIG. 7, an electronic device (701) (e.g., electronic device (301)) according to one embodiment may include a first metal segment (718a) (e.g., first metal segment (318a)) including a first fastening part (734a) (e.g., first fastening part (334a)), a second metal segment (718b) (e.g., second metal segment (318b)) including a second fastening part (734b) (e.g., second fastening part (334b)), a filler (719) (e.g., filler (319)), and a supporting insulator (721) (e.g., supporting insulator (321)). The supporting insulator (721) may include a base (722) (e.g., base (322)), a first link (e.g., first link (323)), and a second link (e.g., second link (324)). The filler (719) may include a visibility hole (741) (e.g., visibility hole (341)) that allows the base (722) to be visible. In one embodiment, the visibility hole (741) may have various geometric shapes. For example, the visibility hole (741) may have a substantially elliptical shape.

[0084] Referring to FIG. 8, an electronic device (801) (e.g., electronic device (301)) according to one embodiment may include a first metal segment (818a) (e.g., first metal segment (318a)) including a first fastening part (834a) (e.g., first fastening part (334a)), a second metal segment (818b) (e.g., second metal segment (318b)) including a second fastening part (834b) (e.g., second fastening part (334b)), a filler (819) (e.g., filler (319)), and a supporting insulator (821) (e.g., supporting insulator (321)). The first fastening portion (834a) may include at least one first metal support layer (8341a) (e.g., first metal support layer (3341a)) including at least one first hole (e.g., first hole (H1)), and the second fastening portion (834b) may include at least one second metal support layer (8341b) (e.g., second metal support layer (3341b)) including at least one second hole (e.g., second hole (H2)). The filler (819) may include a visibility hole (841) (e.g., visibility hole (341)).

[0085] In one embodiment, the first metal segment (818a) may include a substantially flat first sheet (832a) (e.g., the first sheet (332a)). No fastening structure of any supporting insulator (821) (e.g., the first metal supporting layer (3342a)) may be formed on the first sheet (832a).

[0086] In one embodiment, the second metal segment (818b) may include a substantially flat second sheet (832b) (e.g., second sheet (332b)). No fastening structure of any supporting insulator (821) (e.g., second metal support layer (3342b)) may be formed in the second sheet (832b).

[0087] In one embodiment, the supporting insulator (821) may be implemented as a longitudinal member that passes through a first hole (e.g., first hole (H1)) and a second hole (e.g., second hole (H2)) and forms a substantially closed loop. For example, the longitudinal member may include a cable.

[0088] An electronic device (301) according to various embodiments may include: a first metal segment (318a) comprising a first fastening portion (334a); a second metal segment (318b) spaced apart from the first metal segment (318a) to form a slit (S) with the first metal segment (318a) and comprising a second fastening portion (334b); a supporting insulator (321) connected to the first fastening portion (334a) and the second fastening portion (334b), supporting the first metal segment (318a) and the second metal segment (318b) and insulating between the first metal segment (318a) and the second metal segment (318b); and a filling body (319) surrounding at least a portion of the supporting insulator (321) and filling at least a portion of the slit (S).

[0089] In one embodiment, the stiffness of the support insulator (321) may be greater than the stiffness of the filler (319).

[0090] In one embodiment, the heat resistance of the support insulator (321) may be greater than the heat resistance of the filler (319).

[0091] In one embodiment, the dielectric constant of the support insulator (321) may be substantially the same as or greater than the dielectric constant of the filler (319).

[0092] In one embodiment, the support insulator (321) may include a thermoplastic plastic.

[0093] In one embodiment, the thermoplastic plastic may be an amorphous thermoplastic plastic.

[0094] In one embodiment, the support insulator (321) may further include glass fibers.

[0095] In one embodiment, the support insulator (321) may further include carbon fibers.

[0096] In one embodiment, the first fastening portion (334a) includes a first metal support layer (3341a) formed on one surface of the first metal segment (318a), and the first metal support layer (3341a) includes a first hole (H1); the second fastening portion (334b) includes a second metal support layer (3341b) formed on one surface of the second metal segment (318b), and the second metal support layer (3341b) includes a second hole (H2); and the support insulator (321) includes a first link (323) connected to the first hole (H1); and a second link (324) connected to the second hole (H2). It may include a base (322) that connects the first link (323) and the second link (324) and is supported by the first metal support layer (3341a) and the second metal support layer (3341b).

[0097] In one embodiment, the first fastening portion (334a) includes a first groove (G1) formed on the other side of the first metal segment (318a), the second fastening portion (334b) includes a second groove (G2) formed on the other side of the second metal segment (318b), the first link (323) includes a first extension portion (3231) extending from a first part of the base (322) and passing through the first hole (H1); and a first receiving end portion (3232) formed at the end of the first extension portion (3231) and received in the first groove (G1), and the second link (324) includes a second extension portion (3241) extending from a second part different from the first part of the base (322) and passing through the second hole (H2); and may include a second receiving end (3242) formed at the end of the second extension part (3241) and received in the second groove (G2).

[0098] In one embodiment, the filler (319) may include a visibility hole (341) formed between the outer surface of the filler (319) and the base (322).

[0099] In one embodiment, the first fastening portion (834a) includes a first metal support layer (8341a) formed on one side of the first metal segment (818a), and the first metal support layer (8341a) includes a first hole, the second fastening portion (834b) includes a second metal support layer (8341b) formed on one side of the second metal segment (818b), and the second metal support layer (8341b) includes a second hole, and the support insulator (821) may include a longitudinal member that passes through the first hole and the second hole and forms a closed loop.

[0100] In one embodiment, the first fastening portion (534a) includes a plurality of first metal support layers (5341a, 5341b) formed along one surface of the first metal segment (518a), and the plurality of first metal support layers (5341a, 5342a) each include a plurality of first holes, the second fastening portion (534b) includes a plurality of second metal support layers (5341b, 5342b) formed along one surface of the second metal segment (518b), and the plurality of second metal support layers (5341b, 5342b) each include a plurality of second holes, and the support insulator (521) includes a plurality of first It may include links (523); a plurality of second links (524) each connected to a plurality of second holes of each of the plurality of second metal support layers (5341b, 5342b); and a base (522) that connects the plurality of first links (523) and the plurality of second links (524), and is supported by a first metal support layer (5341a) of any one of the plurality of first metal support layers (5341a, 5342a) and a second metal support layer (5341b) of any one of the plurality of second metal support layers (5341b, 5342b).

[0101] In one embodiment, the filler (619) may include a plurality of visibility holes (641) formed between the outer surface of the filler (619) and the base (622).

[0102] In one embodiment, the visibility hole (741) may be formed in a substantially elliptical shape.

[0103] A method for manufacturing an electronic device according to various embodiments may include: processing a first metal segment (418a) including a first fastening portion (434a), and a second metal segment (418b) including a second fastening portion (434b) spaced apart from the first metal segment (418a) to form a slit (S) with the first metal segment (418a); fastening a support insulator (421) to the first fastening portion (434a) and the second fastening portion (434b) to support the first metal segment (418a) and the second metal segment (418b) and to insulate between the first metal segment (418a) and the second metal segment (418b); and forming a filler (419) by filling at least a portion of the slit (S) with an injection molded material while surrounding at least a portion of the support insulator (421).

[0104] In one embodiment, the operation of forming the filler (419) may include supporting the support insulator (421) using a metal support (451) and filling at least a portion of the slit (S) with the injection molded material.

[0105] In one embodiment, the operation of forming the filler (419) may further include the operation of removing the metal support (451).

[0106] In one embodiment, the operation may further include processing at least one of the first metal segment (418a), the second metal segment (418b), and the filler (419).

[0107] In one embodiment, the operation of forming the support insulator (421) with a material having a stiffness greater than that of the filler (419) may be further included.

Claims

Claim 1 An electronic device comprising: a first metal segment including a first fastening portion; a second metal segment spaced apart from the first metal segment to form a slit with the first metal segment and including a second fastening portion; a supporting insulator connected to the first fastening portion and the second fastening portion, supporting the first metal segment and the second metal segment, and insulating between the first metal segment and the second metal segment; and a filling body surrounding at least a portion of the supporting insulator and filling at least a portion of the slit; wherein the rigidity of the supporting insulator is greater than the rigidity of the filling body. Claim 2 delete Claim 3 An electronic device according to claim 1, wherein the heat resistance of the supporting insulator is greater than the heat resistance of the filler. Claim 4 An electronic device according to claim 1, wherein the dielectric constant of the supporting insulator is equal to or greater than the dielectric constant of the filler. Claim 5 In claim 1, the supporting insulator is an electronic device comprising a thermoplastic plastic. Claim 6 In claim 5, the electronic device wherein the thermoplastic plastic is an amorphous thermoplastic plastic. Claim 7 In claim 5, the supporting insulator is an electronic device further comprising glass fibers. Claim 8 In claim 5, the supporting insulator is an electronic device further comprising carbon fibers. Claim 9 An electronic device according to claim 1, wherein the first fastening portion comprises a first metal support layer formed on one surface of the first metal segment, and the first metal support layer comprises a first hole; the second fastening portion comprises a second metal support layer formed on one surface of the second metal segment, and the second metal support layer comprises a second hole; and the support insulator comprises a first link connected to the first hole; a second link connected to the second hole; and a base connecting the first link and the second link and supported by the first metal support layer and the second metal support layer. Claim 10 An electronic device according to claim 9, wherein the first fastening portion comprises a first groove formed on the other side of the first metal segment, the second fastening portion comprises a second groove formed on the other side of the second metal segment, the first link comprises a first extension portion extending from a first part of the base and passing through the first hole; and a first receiving end portion formed at the end of the first extension portion and received in the first groove; and the second link comprises a second extension portion extending from a second part different from the first part of the base and passing through the second hole; and a second receiving end portion formed at the end of the second extension portion and received in the second groove. Claim 11 In claim 9, the electronic device comprises a visible hole formed between the outer surface of the filler and the base. Claim 12 An electronic device according to claim 1, wherein the first fastening portion comprises a first metal support layer formed on one surface of the first metal segment, and the first metal support layer comprises a first hole, the second fastening portion comprises a second metal support layer formed on one surface of the second metal segment, and the second metal support layer comprises a second hole, and the supporting insulator comprises a longitudinal member passing through the first hole and the second hole and forming a closed loop. Claim 13 An electronic device according to claim 1, wherein the first fastening portion comprises a plurality of first metal support layers formed along one surface of the first metal segment, and the plurality of first metal support layers each comprise a plurality of first holes; the second fastening portion comprises a plurality of second metal support layers formed along one surface of the second metal segment, and the plurality of second metal support layers each comprise a plurality of second holes; and the supporting insulator comprises a plurality of first links each connected to a plurality of first holes of each of the plurality of first metal support layers; a plurality of second links each connected to a plurality of second holes of each of the plurality of second metal support layers; and a base connecting the plurality of first links and the plurality of second links, and supported by a first metal support layer of any one of the plurality of first metal support layers and a second metal support layer of any one of the plurality of second metal support layers. Claim 14 In claim 9, the electronic device comprises a plurality of visibility holes formed between the outer surface of the filler and the base. Claim 15 In claim 11, the visibility hole is an electronic device formed in an elliptical shape. Claim 16 A method for manufacturing an electronic device comprising: processing a first metal segment including a first fastening portion and a second metal segment including a second fastening portion spaced apart from the first metal segment to form a slit with the first metal segment; connecting a support insulator that supports the first metal segment and the second metal segment and insulates the first metal segment and the second metal segment to the first fastening portion and the second fastening portion; forming a filler by filling at least a portion of the slit with an injection molded material while surrounding at least a portion of the support insulator; and forming the support insulator with a material having a stiffness greater than the stiffness of the filler. Claim 17 In claim 16, the operation of forming the filler comprises supporting the support insulator using a metal support and filling at least a portion of the slit with the injection molded material. Claim 18 In claim 17, the operation of forming the filler further includes the operation of removing the metal support. Claim 19 delete Claim 20 delete

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