Encapsulation film

Abstract

The present application relates to a sealing film, an organic electronic device including the same, and a method for manufacturing an organic electronic device using the same. It provides a sealing film capable of forming a structure that blocks moisture or oxygen from entering the organic electronic device from the outside, and capable of preventing the occurrence of bright spots, dark spots, and white spots in the organic electronic device.

Description

Technology Field

[0001] The present application relates to a packaging film, an organic electronic device comprising the same, and a method for manufacturing said organic electronic device. Background Technology

[0002] An organic electronic device (OED) refers to a device comprising an organic material layer that generates an alternating current of charge using holes and electrons, and examples include photovoltaic devices, rectifiers, transmitters, and organic light-emitting diodes (OLEDs).

[0003] Among the aforementioned organic electronic devices, Organic Light Emitting Diodes (OLEDs) consume less power and have faster response speeds compared to conventional light sources, making them advantageous for the miniaturization of display devices or lighting. Furthermore, due to their excellent space efficiency, OLEDs are expected to be applied in a wide range of fields, including portable devices, monitors, laptops, and TVs.

[0004] The most critical issue regarding the commercialization and expansion of OLED applications is durability. Organic materials and metal electrodes contained in OLEDs oxidize very easily due to external factors such as moisture. Furthermore, there is the problem of bright spots occurring on the OLED due to outgases that may be generated inside the device. Additionally, white spots may occur on the device due to the introduction of foreign substances during the OLED panel manufacturing process. In other words, products containing OLEDs are highly sensitive to environmental factors. The problem to be solved

[0005] The present application provides a sealing film capable of forming a structure that can block moisture or oxygen from entering an organic electronic device from the outside, and capable of preventing the occurrence of bright spots, dark spots, and white spots in an organic electronic device. means of solving the problem

[0006] The present application relates to a packaging film. The packaging film may be applied to encapsulate or encapsulate organic electronic devices, such as OLEDs, for example.

[0007] In this specification, the term “organic electronic device” refers to an article or device having a structure comprising an organic material layer that generates an alternating charge using holes and electrons between a pair of opposing electrodes, examples of which include, but are not limited to, photovoltaic devices, rectifiers, transmitters, and organic light-emitting diodes (OLEDs). In one example of this application, the organic electronic device may be an OLED.

[0008] An exemplary encapsulation film (1) for an organic electronic device may include an encapsulation layer (11) and a substrate layer (12), as illustrated in FIG. 1. The encapsulation film may seal the front surface of an organic electronic device formed on a substrate. In one example, the encapsulation film may include an encapsulation resin comprising an olefin-based resin and an oxazolidine compound. Since organic electronic devices are highly sensitive to environmental factors, various device defects may occur during the panel manufacturing process, and these defects appear in the form of bright spots, dark spots, and white spots. Each pixel defect is caused by various factors, and in particular, white spots are predicted to occur when foreign substances penetrate during the panel manufacturing process. The present application provides an encapsulation film that can prevent the occurrence of bright spots and dark spots while suppressing the occurrence of white spots, along with moisture barrier properties.

[0009] In a specific embodiment of the present application, the encapsulation film may comprise an encapsulation resin and an oxazolidine compound. The encapsulation resin may be a crosslinkable resin or a curable resin, and in a specific embodiment, may be an olefin-based resin.

[0010] In one example, the encapsulation resin may have a glass transition temperature of less than 0°C, less than -10°C, less than -30°C, less than -50°C, or less than -60°C. The lower limit is not particularly limited and may be -150°C or higher. The glass transition temperature mentioned above may refer to the glass transition temperature after curing, and in one embodiment, an irradiation dose of approximately 1 J / cm² 2 It may mean the glass transition temperature after irradiation with the above ultraviolet rays; or the glass transition temperature after further thermal curing is performed following ultraviolet irradiation.

[0011] In one embodiment of the present invention, the encapsulating resin may be an olefinic resin. In one example, the olefinic resin may be a homopolymer of a butylene monomer; a copolymer of a butylene monomer and another polymerizable monomer; a reactive oligomer using a butylene monomer; or a mixture thereof. The butylene monomer may include, for example, 1-butene, 2-butene, or isobutylene. In one example, the olefinic resin may include an isobutylene monomer as a polymerization unit.

[0012] Other monomers capable of polymerizing with the above butylene monomer or derivative may include, for example, isoprene, styrene, or butadiene. By using the above copolymer, physical properties such as processability and degree of crosslinking can be maintained, thereby ensuring the heat resistance of the adhesive itself when applied to organic electronic devices.

[0013] Additionally, the reactive oligomer using a butylene monomer may comprise a butylene polymer having reactive functional groups. The oligomer may have a weight-average molecular weight in the range of 500 to 5000 g / mol. Furthermore, the butylene polymer may be bonded to another polymer having reactive functional groups. The other polymer may be an alkyl (meth)acrylate, but is not limited thereto. The reactive functional group may be a hydroxyl group, a carboxyl group, an isocyanate group, or a nitrogen-containing group. Additionally, the reactive oligomer and the other polymer may be crosslinked by a polyfunctional crosslinking agent, and the polyfunctional crosslinking agent may be one or more selected from the group consisting of isocyanate crosslinking agents, epoxy crosslinking agents, aziridine crosslinking agents, and metal chelate crosslinking agents.

[0014] In one example, the encapsulation resin of the present application may comprise a copolymer of a diene and an olefinic compound containing one carbon-carbon double bond. Here, the olefinic compound may include butylene, etc., and the diene may be a monomer capable of polymerizing with said olefinic compound, such as isoprene or butadiene. For example, the copolymer of the olefinic compound containing one carbon-carbon double bond and the diene may be butyl rubber.

[0015] In the encapsulation layer, the resin or elastomer component may have a weight average molecular weight (Mw) such that the adhesive composition can be molded into a film shape. For example, the resin or elastomer may have a weight average molecular weight of approximately 100,000 to 2 million g / mol, 120,000 to 1.5 million g / mol, or 150,000 to 1 million g / mol. In this specification, the term weight average molecular weight refers to a converted value relative to standard polystyrene measured by a Gel Permeation Chromatograph (GPC), and unless otherwise specified, the unit is g / mol. However, the resin or elastomer component must not necessarily have the weight average molecular weight mentioned above. For example, if the molecular weight of the resin or elastomer component is not at a level sufficient to form a film, a separate binder resin may be incorporated into the adhesive composition.

[0016] In one example, the above-mentioned bag resin may be included in the bag layer in an amount of 60 wt% or less, 55 wt% or less, 53 wt% or less, 50 wt% or less, 48 ​​wt% or less, 45 wt% or less, 40 wt% or less, 38 wt% or less, or 35 wt% or less. The lower limit is not particularly limited, but may be 20 wt%, 25 wt% or more, or 30 wt% or more. Since the above-mentioned bag resin has the disadvantage of having good moisture barrier properties but poor heat resistance, the present application can maintain heat resistance at high temperature and high humidity while sufficiently realizing the moisture barrier performance inherent in the resin itself by controlling the content of the above-mentioned bag resin.

[0017] Additionally, in one embodiment, the packaging film of the present application may comprise an oxazolidine compound. The present application may comprise, for example, a compound capable of chemically reacting with moisture and / or oxygen, said compound reacting first with moisture, and the decomposed product reacting with oxygen. An example of said compound may be an oxazolidine compound.

[0018] The above oxazolidine compound can satisfy the following chemical formula 1.

[0019] [Chemical Formula 1]

[0020]

[0021] In the above formula 1, n is any integer from 1 to 4. In one embodiment, n may be 1 or 2. R1 to R7 may each independently be hydrogen, an alkyl group, an alkenyl group, or an alkynyl group. The alkyl group, alkenyl group, or alkynyl group may be straight-chain, branched-chain, or cyclic, and may have a carbon number in the range of 1 to 30 or 1 to 10. The lower limit of the carbon number may be 1, 2, 3, or 4, and the upper limit may be 30, 25, 20, 15, 10, or 8 or less. In the above formula 1, when n is 2 or more, R1 may represent an alkylene group, an alkylidene group, or a residue derived from -A1-X1-A2-X2-A3-. When n is 2 or more, there are 2 or more oxazolidins, and 2 or more oxazolidins may be bonded to R1. A1, A2, or A3 may each independently be a single bond, an alkylene group, or an alkylidene group, and X1 or X2 may each independently represent a single bond, a ketone, an ester, or an amide.

[0022] In this specification, the term “residue derived from an alkylene group” may mean a residue of a specific compound composed of an alkylene group. In one example, in the above formula 1, when n is 2, R1 may be an alkylene group and may be bonded to the oxazolidine of the above formula 1 after 2 or more hydrogens have been removed.

[0023] In this specification, the term “alkyl group” may mean an alkyl group having 1 to 30 carbon atoms, 1 to 25 carbon atoms, 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12 carbon atoms, 1 to 8 carbon atoms, or 1 to 4 carbon atoms, unless specifically defined otherwise. The alkyl group may have a straight-chain, branched-chain, or cyclic structure and may optionally be substituted by one or more substituents. Examples of such substituents include polar functional groups.

[0024] In this specification, the term “alkenyl group” may mean an alkenyl group having 1 to 30 carbon atoms, 1 to 25 carbon atoms, 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12 carbon atoms, 1 to 8 carbon atoms, or 1 to 4 carbon atoms, unless specifically otherwise defined. The alkenyl group may have a straight-chain, branched-chain, or cyclic structure and may optionally be substituted by one or more substituents. Examples of such substituents include polar functional groups.

[0025] In this specification, the term “alkynyl group” may mean an alkynyl group having 1 to 30 carbon atoms, 1 to 25 carbon atoms, 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12 carbon atoms, 1 to 8 carbon atoms, or 1 to 4 carbon atoms, unless specifically otherwise defined. The alkynyl group may have a straight-chain, branched-chain, or cyclic structure and may optionally be substituted by one or more substituents. Examples of such substituents include polar functional groups.

[0026] In this specification, the term “alkylene group” may mean an alkylene group having 2 to 30 carbon atoms, 2 to 25 carbon atoms, 2 to 20 carbon atoms, 2 to 16 carbon atoms, 2 to 12 carbon atoms, 2 to 10 carbon atoms, or 2 to 8 carbon atoms, unless specifically defined otherwise. The alkylene group may have a straight-chain, branched-chain, or cyclic structure and may optionally be substituted by one or more substituents. Examples of such substituents include polar functional groups.

[0027] In this specification, the term “alkylidene group” may mean an alkylidene group having 2 to 30 carbon atoms, 2 to 25 carbon atoms, 2 to 20 carbon atoms, 2 to 16 carbon atoms, 2 to 12 carbon atoms, 2 to 10 carbon atoms, or 2 to 8 carbon atoms, unless specifically defined otherwise. The alkylidene group may have a straight-chain, branched-chain, or cyclic structure and may optionally be substituted by one or more substituents. Examples of such substituents include polar functional groups.

[0028] In this specification, the term “single bond” may mean a bond connecting two atoms without any atoms. For example, in -A1-X1-A2-X2-A3-, if X1 is a single bond, it may be represented as -A1-A2-X2-A3-.

[0029] In a specific embodiment of the present application, the oxazolidine compound may be included in a range of 0.05 to 20 parts by weight per 100 parts by weight of the encapsulating resin. The lower limit of the content may be, for example, 0.1 parts by weight, 1 part by weight, 3 parts by weight, 5 parts by weight, 8 parts by weight, or 10 parts by weight or more, and the upper limit may be, for example, 18 parts by weight, 15 parts by weight, 13 parts by weight, 11 parts by weight, or 9 parts by weight or less. The present application is distinguished from the following moisture adsorbents and anti-white spot agents, and by including the specific oxazolidine compound above, it is possible to prevent foreign substances and moisture penetrating from the outside as well as white spots caused by oxygen, and also to achieve the physical properties of the encapsulating film required conventionally.

[0030] In one example, the bag film may include a moisture absorbent. In this specification, the term "moisture absorbent" may refer to a chemically reactive absorbent capable of removing moisture or humidity that has penetrated the bag film described below through a chemical reaction.

[0031] For example, the moisture adsorbent may exist in a particle form, evenly dispersed within the bag layer or bag film. Here, an evenly dispersed state may mean a state in which the moisture adsorbent exists at the same or substantially the same density in any part of the bag layer or bag film. Examples of moisture adsorbents that can be used above include metal oxides, sulfates, or organometallic oxides. Specifically, examples of the sulfates include magnesium sulfate, sodium sulfate, or nickel sulfate, and examples of the organometallic oxides include aluminum oxide octylate. Specific examples of the metal oxides mentioned above include phosphorus pentoxide (P2O5), lithium oxide (Li2O), sodium oxide (Na2O), barium oxide (BaO), calcium oxide (CaO), or magnesium oxide (MgO), and examples of metal salts include sulfates such as lithium sulfate (Li2SO4), sodium sulfate (Na2SO4), calcium sulfate (CaSO4), magnesium sulfate (MgSO4), cobalt sulfate (CoSO4), gallium sulfate (Ga2(SO4)3), titanium sulfate (Ti(SO4)2), or nickel sulfate (NiSO4), calcium chloride (CaCl2), magnesium chloride (MgCl2), strontium chloride (SrCl2), yttrium chloride (YCl3), copper chloride (CuCl2), cesium fluoride (CsF), tantalum fluoride (TaF5), niobium fluoride (NbF5), and lithium bromide (LiBr). Examples include metal halides such as calcium bromide (CaBr2), cesium bromide (CeBr3), selenium bromide (SeBr4), vanadium bromide (VBr3), magnesium bromide (MgBr2), barium iodide (BaI2) or magnesium iodide (MgI2); or metal chlorates such as barium perchlorate (Ba(ClO4)2) or magnesium perchlorate (Mg(ClO4)2), but are not limited thereto. As for the moisture adsorbent that may be included in the bag layer, one of the above-described compositions may be used, or two or more may be used.In one example, when two or more types of moisture adsorbents are used, calcined dolomite, etc., may be used.

[0032] These moisture adsorbents can be controlled to an appropriate size depending on the application. In one example, the average particle size of the moisture adsorbent can be controlled to 100 to 15,000 nm, 500 nm to 10,000 nm, 800 nm to 8,000 nm, 1 µm to 7 µm, 2 µm to 5 µm, or 2.5 µm to 4.5 µm. Moisture adsorbents having sizes within the above ranges can effectively remove moisture without causing damage to the device to be encapsulated, as the reaction rate with moisture is not too fast, making storage easy, and without interfering with the hydrogen adsorption process in relation to the anti-spot agent described below. In this specification, particle size may refer to the average particle size and may be measured by a known method using a D50 particle size analyzer.

[0033] The content of the moisture adsorbent is not particularly limited and can be appropriately selected considering the desired blocking characteristics. The above moisture adsorbent may be included within the range of 20 to 370 parts by weight, 25 to 360 parts by weight, 30 to 350 parts by weight, 35 to 340 parts by weight, 40 to 330 parts by weight, 45 to 320 parts by weight, 50 to 310 parts by weight, 55 to 300 parts by weight, 60 to 290 parts by weight, 70 to 280 parts by weight, 80 to 270 parts by weight, 90 to 260 parts by weight, 100 to 250 parts by weight, 110 to 240 parts by weight, 120 to 230 parts by weight, 130 to 220 parts by weight, 140 to 210 parts by weight, 150 to 200 parts by weight, 160 to 190 parts by weight, or 170 to 185 parts by weight, based on 100 parts by weight of the encapsulation resin. There is. In addition, the encapsulation film of the present application may have a weight ratio of the oxazolidine compound to the moisture adsorbent within the range of 0.0001 to 0.3, 0.001 to 0.25, 0.01 to 0.2, 0.03 to 0.15, or 0.05 to 0.13. The present application disperses inorganic particles within the film to prevent white spots, but considering the prevention of white spots along with moisture barrier properties and device reliability, the oxazolidine compound may be included in a specific content ratio with the moisture adsorbent.

[0034] In one example, the encapsulating film may further include a tackifier. The tackifier may be, for example, a compound having a softening point of 70°C or higher, and in specific examples, may be 75°C or higher, 78°C or higher, 83°C or higher, 85°C or higher, 90°C or higher, or 95°C or higher, and the upper limit may be 150°C or lower, 140°C or lower, 130°C or lower, 120°C or lower, 110°C or lower, or 100°C or lower, although the upper limit is not particularly limited. The tackifier may be a compound having a cyclic structure within its molecular structure, and the cyclic structure may have a carbon number in the range of 5 to 15. The carbon number may be, for example, in the range of 6 to 14, 7 to 13, or 8 to 12. The above-mentioned cyclic structure may be a monocyclic compound, but is not limited thereto, and may be a dicyclic or tricyclic compound. The above-mentioned tackifier may also be an olefin-based polymer, and the polymer may be a homopolymer or a copolymer. Furthermore, the tackifier of the present application may be a hydrogenated compound. The above-mentioned hydrogenated compound may be a partially or completely hydrogenated compound. Such a tackifier may have good compatibility with other components within the encapsulation film, excellent moisture barrier properties, and external stress relief properties. Specific examples of the tackifier include hydrogenated terpene resins, hydrogenated ester resins, or hydrogenated dicyclopentadiene resins. The weight-average molecular weight of the above-mentioned tackifier may be in the range of about 200 to 5,000 g / mol, 300 to 4,000 g / mol, 400 to 3,000 g / mol, or 500 to 2,000 g / mol. The content of the above tackifier can be appropriately adjusted as needed.For example, the content of the tackifier may be included in a ratio of 15 to 200 parts by weight, 20 to 190 parts by weight, 25 to 180 parts by weight, or 30 to 150 parts by weight relative to 100 parts by weight of the encapsulating resin. By using the specific tackifier described above, the present application can provide an encapsulating film having excellent moisture barrier properties and external stress relief properties.

[0035] The encapsulation film of the present application may include an anti-bright spot agent in the encapsulation layer. The anti-bright spot agent may have an adsorption energy for outgas calculated by Density Functional Theory (DF) at 0 eV or less. The lower limit of the adsorption energy is not specifically limited, but may be -20 eV. The type of outgas is not specifically limited, but may include oxygen, H atoms, H2 molecules, and / or NH3. The present application can prevent bright spots caused by outgas generated in an organic electronic device by the encapsulation film including the anti-bright spot agent. Furthermore, the encapsulation layer of the present application can prevent damage to the organic electronic device due to stress concentration caused by the anti-bright spot agent by including the anti-bright spot agent in a second layer located opposite the device attachment surface of the first layer facing the organic electronic device during encapsulation. In this regard, the first layer may include or not include the anti-bright spot agent at 15% or less of the total mass of the anti-bright spot agent within the encapsulation film. In addition, the layer that does not come into contact with the organic electronic device, excluding the first layer mentioned above, may contain at least 85% of an anti-bright spot agent based on the mass of the total anti-bright spot agent within the encapsulation film. That is, in the present application, when encapsulating the device, the other encapsulation layer that does not come into contact with the organic electronic device may contain a higher amount of anti-bright spot agent compared to the first layer facing the organic electronic device, and thereby, while realizing the moisture barrier and anti-bright spot characteristics of the film, physical damage to the device can be prevented.

[0036] In a specific embodiment of the present application, the adsorption energy between the anti-spot agent and the atoms or molecules causing the spot can be calculated through electronic structure calculations based on density functional theory. The above calculation can be performed by methods known in the art. For example, the present application creates a two-dimensional slab structure in which the closest packed plane of the anti-spot agent having a crystalline structure is exposed to the surface, and then performs structural optimization. After performing structural optimization on a structure in which the molecules causing the spot are adsorbed on this vacuum surface, the adsorption energy is defined as the value obtained by subtracting the total energy of the molecules causing the spot from the difference in total energy between the two systems. To calculate the total energy for each system, the revised-PBE function, a function of the GGA (generalized gradient approximation) family, was used as the exchange-correlation to simulate electron-electron interaction. The cutoff for electron kinetic energy was set to 500 eV, and the calculation was performed by including only the gamma point corresponding to the origin of the reciprocal space. The conjugate gradient method was used to optimize the atomic structure of each system, and iterative calculations were performed until the interatomic force was less than 0.01 eV / Å. The series of calculations was performed using the commercial code VASP.

[0037] The material of the anti-bright spot agent is not limited as long as it is a material that has the effect of preventing bright spots on the panel of the organic electronic device when the above-mentioned encapsulation film is applied to the organic electronic device. For example, the anti-bright spot agent is an outgassing generated from an inorganic deposition layer of silicon oxide, silicon nitride, or silicon oxynitride deposited on the electrode of an organic electronic device, such as, for example, oxygen, H2 gas, ammonia (NH3) gas, H + , NH 2+, it may be a substance capable of adsorbing a substance exemplified by NHR2 or NH2R. In the above, R may be an organic group, and examples include, but are not limited to, alkyl groups, alkenyl groups, alkynyl groups.

[0038] In one example, the material of the anti-spot agent is not limited as long as it satisfies the adsorption energy value and may be a metal or a non-metal. The anti-spot agent may include, for example, Li, Ni, Ti, Rb, Be, Mg, Ca, Sr, Ba, Al, Zn, In, Pt, Pd, Fe, Cr, Si, or a combination thereof, may include an oxide or nitride of the material, and may include an alloy of the material. In one example, the anti-spot agent may include nickel particles, nickel oxide particles, titanium nitride, iron-titanium titanium alloy particles, iron-manganese manganese alloy particles, magnesium-nickel magnesium alloy particles, rare earth alloy particles, carbon nanotubes, graphite, aluminophosphate molecular sieve particles, or mesosilica particles. The above anti-bright spot agent may be included in an amount of 3 to 150 parts by weight, 6 to 143 parts by weight, 8 to 131 parts by weight, 9 to 123 parts by weight, 10 to 116 parts by weight, 10 to 95 parts by weight, 10 to 50 parts by weight, or 10 to 35 parts by weight, relative to 100 parts by weight of the encapsulating resin. Within the above content range, the present application can achieve anti-bright spot of an organic electronic device while improving the adhesion and durability of the film. In addition, the particle size of the above anti-bright spot agent may be within the range of 10 nm to 30 µm, 50 nm to 21 µm, 105 nm to 18 µm, 110 nm to 12 µm, 120 nm to 9 µm, 140 nm to 4 µm, 150 nm to 2 µm, 180 nm to 900 nm, 230 nm to 700 nm, or 270 nm to 400 nm. The above particle size may be based on D50 particle size analysis. By including the above anti-bright spot agent, the present application can efficiently adsorb hydrogen generated within an organic electronic device while simultaneously achieving moisture barrier properties and durability reliability of the encapsulation film.

[0039] In addition, the present application may have a particle size analysis result of the anti-spot agent for a sample filtered through 300-mesh nylon after dissolving the above-mentioned encapsulation layer in an organic solvent, such that the ratio of the average particle size according to D50 to the average particle size according to D10 may be in the range of 1.0 to 5.0. The lower limit of the ratio may be, for example, 1.5, 1.8, 2.0, 2.2, 2.4, 2.5, 2.6, or 2.7, and the upper limit may be, for example, 4.5, 4.3, 4.0, 3.8, 3.5, 3.4, 3.3, 3.2, 3.1, 3.0, 2.95, or 2.93. The present application also provides that, in the particle size analysis results of the moisture adsorbent, for a sample filtered through 300-mesh nylon after dissolving the encapsulation layer in an organic solvent (a sample that passed through the filter), the ratio of the average particle size according to D50 to the average particle size according to D10 may be in the range of 1.0 to 5.0. The lower limit of the ratio may be, for example, 1.5, 1.8, 2.0, 2.2, 2.4, 2.5, 2.6, or 2.7, and the upper limit may be, for example, 4.5, 4.3, 4.0, 3.8, 3.5, 3.4, 3.3, 3.2, 3.1, 3.0, 2.95, or 2.93. The type of organic solvent mentioned above may be, for example, toluene, and the sample may be, for example, a sample cut to 1.5 cm x 1.5 cm. Additionally, the unit mesh in this specification may be a unit according to the American ASTM standard. By controlling the particle size distribution, the present application can prevent bright spots through hydrogen adsorption while achieving moisture barrier properties, thereby enabling long-term durability reliability of organic electronic devices.

[0040] In one example, the ratio of the particle size of the anti-spot agent to the particle size of the moisture adsorbent may be 2.0 or less. The ratio of the particle sizes may be based on D50 particle size analysis. The lower limit of the particle size ratio may be 0.3, 0.5, 0.6, 0.7, 0.8, 0.9, 1.0, or 1.1 or greater, and the upper limit may be 1.9, 1.8, 1.7, 1.6, 1.5, 1.4, 1.3, 1.2, 1.1, 1.0, or 0.9 or less. Additionally, the weight ratio of the anti-spot agent to the moisture adsorbent may be in the range of 0.01 to 0.8. The lower limit of the above range may be, for example, 0.02, 0.03, 0.04, 0.05, 0.06, 0.08, 0.1, or 0.2 or higher, and the upper limit may be, for example, 0.6, 0.4, 0.25, 0.15, or 0.09 or lower. The original purpose of the encapsulation film of the present application is to block moisture from the outside, but a new anti-blur agent is introduced to solve another technical problem of hydrogen adsorption; however, there was a technical problem in that it was difficult to maintain the original moisture blocking effect while including the anti-blur agent. The present application achieves excellent anti-blur performance and desired mechanical properties while maintaining the original moisture blocking effect by adjusting the relationship between the particle size or weight ratio of the moisture adsorbent and the anti-blur agent.

[0041] In one example, the encapsulation layer of the present application may be a single layer or a multilayer structure comprising at least two or more encapsulation layers. When comprising the two or more encapsulation layers, the encapsulation layer may include a first layer facing the device when encapsulating the organic electronic device and a second layer located on a side opposite to the side of the first layer facing the device. In one embodiment, the encapsulation film comprises at least two or more encapsulation layers, and the encapsulation layer may include a first layer facing the organic electronic device when encapsulating and a second layer not facing the organic electronic device.

[0042] As described above, the bag layer may have a multilayer structure of two or more layers. When two or more layers constitute the bag layer, the composition of each layer of the bag layer may be the same or different. In one example, the bag layer may include a bag resin and / or a moisture adsorbent, and the bag layer may be an adhesive layer or an adhesive layer.

[0043] The above-mentioned encapsulation layer may include a first layer and a second layer, and the second layer of the encapsulation layer may include an anti-bright spot agent. Additionally, the second layer may include both an anti-bright spot agent and a moisture adsorbent. However, when the encapsulation film is applied to an organic electronic device, the first layer, which is the encapsulation layer facing the organic electronic device, may not include the anti-bright spot agent and the moisture adsorbent, or even if it does include them, it may include a small amount of 15% or less or 5% or less based on the total weight of the anti-bright spot agent and the moisture adsorbent.

[0044] In addition, in one example, the encapsulation layer of the present application may include an active energy beam polymerizable compound that has high compatibility with the encapsulation resin and can form a specific cross-linked structure together with the encapsulation resin.

[0045] For example, the encapsulation layer of the present application may include a polyfunctional active energy beam polymerizable compound that can be polymerized together with the encapsulation resin by irradiation with an active energy beam. The active energy beam polymerizable compound may refer to a compound comprising two or more functional groups that can participate in a polymerization reaction by irradiation with an active energy beam, for example, a functional group containing an ethylenically unsaturated double bond such as an acryloyl group or a methacryloyl group, an epoxy group or an oxetane group.

[0046] As a multifunctional active energy beam polymerizable compound, for example, multifunctional acrylate (MFA) can be used.

[0047] In addition, the above active energy beam polymerizable compound may be included in an amount of 3 to 30 parts by weight, 5 to 25 parts by weight, 8 to 20 parts by weight, 10 to 18 parts by weight, or 12 to 18 parts by weight, based on 100 parts by weight of the encapsulating resin. Within the above range, the present application provides an encapsulating film with excellent durability and reliability even under harsh conditions such as high temperature and high humidity.

[0048] Polyfunctional active energy-polymerizable compounds that can be polymerized by irradiation with the above active energy rays may be used without limitation. For example, the above compounds are 1,4-butanediol di(meth)acrylate, 1,3-butylene glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate (HDDA), 1,8-octanediol di(meth)acrylate, 1,12-dodecanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, dicyclopentanyl di(meth)acrylate, cyclohexane-1,4-dimethanol di(meth)acrylate, tricyclodecanedimethanol (meth)diacrylate, dimethylol dicyclopentane di(meth)acrylate, neopentyl glycol modified trimethylpropane di(meth)acrylate, and adamantane. It may include di(meth)acrylate, trimethylolpropane tri(meth)acrylate (TMPTA), or a mixture thereof.

[0049] As a polyfunctional active energy beam polymerizable compound, for example, a compound having a molecular weight of 100 or more and less than 1,000 g / mol and containing two or more functional groups may be used. The ring structure included in the polyfunctional active energy beam polymerizable compound may be a carbon-cyclic structure or a heterocyclic structure; or either a monocyclic or polycyclic structure.

[0050] In a specific embodiment of the present application, the encapsulation layer may further include a radical initiator. The radical initiator may be a photoinitiator or a thermal initiator. The specific type of photoinitiator may be appropriately selected considering the curing speed and the possibility of yellowing. For example, benzoin-based, hydroxy ketone-based, amino ketone-based, or phosphine oxide-based photoinitiators, etc., may be used, and specifically, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin n-butyl ether, benzoin isobutyl ether, acetophenone, dimethylaninoacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-hydroxycyclohexylphenyl ketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-propan-1-one, 4-(2-hydroxyethoxy)phenyl-2-(hydroxy-2-propyl)ketone, benzophenone, p-phenylbenzophenone, 4,4'-diethylaminobenzophenone, dichlorobenzophenone, 2-methylanthraquinone, 2-ethylanthraquinone, 2-t-butylanthraquinone, 2-aminoanthraquinone, 2-methylthioxanthone, 2-ethylthioxanthone, 2-chlorothioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, benzyldimethylketal, acetophenone dimethylketal, p-dimethylaminobenzoic acid ester, oligo[2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propanone] and 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, etc. may be used.

[0051] The radical initiator may be included in a ratio of 0.2 to 20 parts by weight, 0.5 to 18 parts by weight, 1 to 15 parts by weight, or 2 to 13 parts by weight per 100 parts by weight of the active energy polymerizable compound. This effectively induces the reaction of the active energy polymerizable compound and also prevents the physical properties of the encapsulation layer composition from deteriorating due to residual components after curing.

[0052] In addition to the composition described above, the encapsulation layer may include various additives depending on the application and the manufacturing process of the encapsulation film described below. For example, the encapsulation layer may include curable materials, crosslinking agents, or fillers in an appropriate range of content depending on the desired physical properties.

[0053] When the above-mentioned encapsulation layer is formed with two or more layers, the second layer that does not come into contact with the organic electronic device may include the moisture adsorbent. For example, when formed with two or more layers, the layer among the above-mentioned encapsulation layers that comes into contact with the organic electronic device may not include the moisture adsorbent, or may include the moisture adsorbent in a small amount of less than 5 parts by weight or less than 4 parts by weight relative to 100 parts by weight of the encapsulation resin.

[0054] Specifically, the content of the moisture adsorbent can be controlled considering that the encapsulation film is applied to encapsulate an organic electronic device, taking into account potential damage to the device. For example, a small amount of moisture adsorbent may be included in the first layer facing the device during encapsulation, or the moisture adsorbent may not be included. In one example, the first encapsulation layer facing the device during encapsulation may contain 0 to 20% of the moisture adsorbent relative to the total mass of the moisture adsorbent contained in the encapsulation film. Additionally, the encapsulation layer not in contact with the device may contain 80 to 100% of the moisture adsorbent relative to the total mass of the moisture adsorbent contained in the encapsulation film.

[0055] In a specific embodiment of the present application, the encapsulation film may further include a metal layer formed on the encapsulation layer. The metal layer of the present application may have a thermal conductivity of 20 W / m·K or more, 50 W / m·K or more, 60 W / m·K or more, 70 W / m·K or more, 80 W / m·K or more, 90 W / m·K or more, 100 W / m·K or more, 110 W / m·K or more, 120 W / m·K or more, 130 W / m·K or more, 140 W / m·K or more, 150 W / m·K or more, 200 W / m·K or more, or 210 W / m·K or more. The upper limit of the thermal conductivity is not particularly limited and may be 800 W / m·K or less. By having such high thermal conductivity, heat generated at the bonding interface during the metal layer bonding process can be released more quickly. In addition, high thermal conductivity rapidly releases heat accumulated during the operation of the organic electronic device to the outside, thereby allowing the temperature of the organic electronic device itself to be maintained at a lower level and reducing the occurrence of cracks and defects. The thermal conductivity may be measured at any one temperature within the temperature range of 15 to 30°C.

[0056] In this specification, the term "thermal conductivity" refers to the degree of a material's ability to transfer heat by conduction, and its unit may be expressed as W / mK. The said unit represents the degree of heat transfer by a material at the same temperature and distance, and signifies the unit of heat (watt) relative to the unit of distance (meter) and the unit of temperature (Kelvin).

[0057] In a specific embodiment of the present application, the metal layer of the encapsulation film may be transparent or opaque. The thickness of the metal layer may be within the range of 3 µm to 200 µm, 10 µm to 100 µm, 20 µm to 90 µm, 30 µm to 80 µm, or 40 µm to 75 µm. By controlling the thickness of the metal layer, the present application can provide a thin film encapsulation film while sufficiently realizing a heat dissipation effect. The metal layer may have metal deposited on a thin film metal foil or a polymer substrate layer. The metal layer is not particularly limited as long as it satisfies the aforementioned thermal conductivity and is a material containing metal. The metal layer may include any one of metal, metal oxide, metal nitride, metal carbide, metal oxynitride, metal oxyboride, and a combination thereof. For example, the metal layer may include an alloy in which one or more metal elements or non-metal elements are added to a single metal, and for example, may include stainless steel (SUS). Additionally, in one example, the metal layer may comprise iron, chromium, copper, aluminum, nickel, iron oxide, chromium oxide, silicon oxide, aluminum oxide, titanium oxide, indium oxide, tin oxide, indium tin oxide, tantalum oxide, zirconium oxide, niobium oxide, and mixtures thereof. The metal layer may be deposited by means of electrolysis, rolling, thermal evaporation, electron beam evaporation, sputtering, reactive sputtering, chemical vapor deposition, plasma chemical vapor deposition, or electron cyclotron resonance source plasma chemical vapor deposition. In one embodiment of the present application, the metal layer may be deposited by reactive sputtering.

[0058] The encapsulation film may additionally include a base film or a release film (hereinafter referred to as the "first film"), and may have a structure in which the encapsulation layer is formed on the base film or the release film. The structure may also additionally include a base film, a protective film, or a release film (hereinafter referred to as the "second film") formed on the metal layer.

[0059] The specific type of the first film that can be used in the present application is not particularly limited. In the present application, for example, a general polymer film in the field may be used as the first film. In the present application, for example, as the substrate or release film, a polyethylene terephthalate film, a polytetrafluoroethylene film, a polyethylene film, a polypropylene film, a polybutene film, a polybutadiene film, a vinyl chloride copolymer film, a polyurethane film, an ethylene-vinyl acetate film, an ethylene-propylene copolymer film, an ethylene-ethyl acrylate copolymer film, a ethylene-methyl acrylate copolymer film, or a polyimide film may be used. Additionally, a suitable release treatment may be performed on one or both sides of the substrate film or release film of the present application. Examples of release agents used for the release treatment of a substrate film include alkyd-based, silicone-based, fluorine-based, unsaturated ester-based, polyolefin-based, or wax-based agents. Among these, it is preferable to use alkyd-based, silicone-based, or fluorine-based release agents in terms of heat resistance, but the system is not limited thereto.

[0060] In the present application, the thickness of the substrate film or release film (first film) as described above is not particularly limited and can be appropriately selected depending on the application. For example, in the present application, the thickness of the first film may be 10 μm to 500 μm, preferably 20 μm to 200 μm. If the thickness is less than 10 μm, there is a risk that deformation of the substrate film may easily occur during the manufacturing process, and if it exceeds 500 μm, economic efficiency decreases.

[0061] The thickness of the encapsulation layer included in the encapsulation film of the present application is not particularly limited and can be appropriately selected according to the following conditions considering the application to which the film is applied. The thickness of the encapsulation layer may be 5 μm to 200 μm, preferably 5 μm to 100 μm. The thickness of the encapsulation layer may be the total thickness of the multilayer encapsulation layer. If the thickness of the encapsulation layer is less than 5 μm, it cannot exhibit sufficient moisture barrier ability, and if it exceeds 200 μm, it is difficult to ensure processability, and due to moisture reactivity, thickness expansion is large, which may damage the deposited film of the organic light-emitting diode and reduce economic efficiency.

[0063] The present application also relates to an organic electronic device. The organic electronic device may include, as illustrated in FIG. 2, a substrate (31); an organic electronic element (32) formed on the substrate (31); and the aforementioned encapsulating film (33, 34) encapsulating the organic electronic element (32). The encapsulating film may encapsulate the front surface, for example, both the top and the side surfaces, of the organic electronic element formed on the substrate. The encapsulating film may include an encapsulating layer containing an adhesive composition or an adhesive composition in a cross-linked or cured state. Additionally, the organic electronic device may be formed by sealing the encapsulating layer so as to contact the front surface of the organic electronic element formed on the substrate.

[0064] In a specific embodiment of the present application, the organic electronic device may comprise a pair of electrodes, an organic layer comprising at least a light-emitting layer, and a passivation film. Specifically, the organic electronic device may comprise a first electrode layer, an organic layer formed on the first electrode layer comprising at least a light-emitting layer, and a second electrode layer formed on the organic layer, and may comprise a passivation film on the second electrode layer that protects the electrode and the organic layer. The first electrode layer may be a transparent electrode layer or a reflective electrode layer, and the second electrode layer may also be a transparent electrode layer or a reflective electrode layer. More specifically, the organic electronic device may comprise a transparent electrode layer formed on a substrate, an organic layer formed on the transparent electrode layer comprising at least a light-emitting layer, and a reflective electrode layer formed on the organic layer.

[0065] The organic electronic device mentioned above may be, for example, an organic light-emitting diode.

[0066] The passivation film may comprise an inorganic film and an organic film. In one embodiment, the inorganic film may be one or more metal oxides or nitrides selected from the group consisting of Al, Zr, Ti, Hf, Ta, In, Sn, Zn, and Si. The thickness of the inorganic film may be 0.01 μm to 50 μm, 0.1 μm to 20 μm, or 1 μm to 10 μm. In one example, the inorganic film of the present application may be an inorganic material that does not contain a dopant, or an inorganic material that contains a dopant. The dopant that may be doped may be one or more elements selected from the group consisting of Ga, Si, Ge, Al, Sn, Ge, B, In, Tl, Sc, V, Cr, Mn, Fe, Co, and Ni, or oxides of said elements, but is not limited thereto. The organic film is distinguished from the organic layer comprising at least the light-emitting layer described above in that it does not include a light-emitting layer, and may be an organic deposition layer comprising an epoxy compound.

[0067] The above inorganic film or organic film may be formed by chemical vapor deposition (CVD). For example, silicon nitride (SiNx) may be used as the inorganic film. In one example, silicon nitride (SiNx) used as the inorganic film may be deposited with a thickness of 0.01 μm to 50 μm. In one example, the thickness of the organic film may be within the range of 2 μm to 20 μm, 2.5 μm to 15 μm, or 2.8 μm to 9 μm.

[0069] The present application also provides a method for manufacturing an organic electronic device. The manufacturing method may include the step of applying the aforementioned encapsulation film to a substrate having an organic electronic device formed thereon so as to cover the organic electronic device. Additionally, the manufacturing method may include the step of curing the encapsulation film. The curing step of the encapsulation film may refer to the curing of an encapsulation layer and may be performed before or after the encapsulation film covers the organic electronic device.

[0070] In this specification, the term "curing" may mean that the adhesive composition of the present invention forms a cross-linked structure and is manufactured into the form of an adhesive through a heating or UV irradiation process, etc. Alternatively, it may mean that the adhesive composition solidifies and adheres as an adhesive.

[0071] Specifically, an electrode can be formed on a glass or polymer film used as a substrate by a method such as vacuum deposition or sputtering, and a layer of a luminescent organic material, for example, composed of a hole transport layer, a light-emitting layer, and an electron transport layer, is formed on the electrode, and then an additional electrode layer is formed on top thereof to form an organic electronic device. Subsequently, the front surface of the organic electronic device on the substrate that has undergone the above process is positioned so that the encapsulation layer of the encapsulation film covers it. Effects of the invention

[0072] The encapsulation film of the present application can be applied to the encapsulation or encapsulation of organic electronic devices such as OLEDs. The film can be formed with a structure capable of blocking moisture or oxygen from entering the organic electronic device from the outside, and provides an encapsulation film capable of preventing the occurrence of bright spots, dark spots, and white spots in the organic electronic device. Brief explanation of the drawing

[0073] FIG. 1 is a cross-sectional view showing a packaging film according to one example of the present application. FIG. 2 is a cross-sectional view showing an organic electronic device according to one example of the present application. Specific details for implementing the invention

[0074] The present invention will be explained in more detail below through embodiments according to the present invention and comparative examples not according to the present invention, but the scope of the present invention is not limited by the embodiments presented below.

[0076] Example 1

[0077] Manufacturing of the pouch layer

[0078] To prepare the first layer solution, 250 kg of butyl rubber resin (BR268, EXXON, 20% solid content) dissolved in toluene, 71 kg of dicyclopentadiene hydrogenated resin (SU500, Kolon, 70% solid content) dissolved in toluene, and 5 kg of an oxazolidine compound of the following chemical formula 1-1 were homogenized. To the homogenized solution, 10 kg of polyfunctional acrylate (trimethylolpropane triacrylate, Miwon, 50% solid content) dissolved in toluene and 5 kg of photoinitiator (Irgacure651, Ciba, 20% solid content) dissolved in toluene were added, and 164 kg of toluene was added as an additional solvent. The first layer solution was prepared by high-speed stirring for 1 hour after homogenization.

[0079] [Chemical Formula 1-1]

[0080]

[0081] To prepare the second layer solution, CaO (Sigma-Aldrich, average particle size 2 μm) was prepared as a solution (solid content 50%) as a moisture adsorbent. Additionally, separately, 181 kg of the CaO solution was added to 414 kg of a solution of the same composition as the first layer solution, except that the oxazolidine compound of Formula 1-1 was not added and 78 kg of toluene was added as an additional solvent, and the mixture was homogenized and then high-speed stirred for 1 hour to prepare the second layer solution.

[0082] After passing the above-prepared encapsulation layer solution through a 400-mesh nylon filter, the first layer (10 µm thickness) and the second layer (40 µm thickness) were each separately applied to the release surface of a release PET using a comma coater, and dried in a dryer at 110°C for 4 minutes to form an encapsulation layer, after which the two layers were laminated. The thickness mentioned above refers to the thickness after drying is complete. Ultraviolet rays were applied to the encapsulation layer at 2 J / cm² 2 investigated.

[0083] Manufacturing of encapsulation film

[0084] A release-treated PET attached to the second layer of the encapsulation layer was peeled off on a pre-prepared metal layer (INVAR, thickness 80㎛) and laminated at 70°C using a roll-to-roll process to produce an encapsulation film such that the second layer comes into contact with the metal layer.

[0085] The above-mentioned encapsulation film was cut to produce an encapsulation film for organic electronic devices. The physical properties of the produced film were measured.

[0087] Example 2

[0088] Manufacturing of the pouch layer

[0089] To prepare the first layer solution, 250 kg of butyl rubber resin (BR268, EXXON, 20% solids) dissolved in toluene, 71 kg of dicyclopentadiene hydrogenated resin (SU500, Kolon, 70% solids) dissolved in toluene, and 5 kg of an oxazolidine compound having the chemical formula of Example 1 were homogenized. To the homogenized solution, 10 kg of polyfunctional acrylate (trimethylolpropane triacrylate, Miwon, 50% solids) dissolved in toluene and 5 kg of photoinitiator (Irgacure651, Ciba, 20% solids) dissolved in toluene were added, and 78 kg of toluene was added as an additional solvent. The first layer solution was prepared by high-speed stirring for 1 hour after homogenization.

[0090] As a moisture adsorbent, CaO (Sigma-Aldrich, average particle size 2 μm) was prepared as a solution (solid content 50%) dispersed in toluene. 181 kg of the above CaO solution was added to the above first layer solution, homogenized, and then high-speed stirred for 1 hour.

[0091] The above-prepared encapsulation layer solution was filtered through a 400-mesh nylon filter, applied to the release surface of a release PET using a comma coater, and dried in a dryer at 110°C for 4 minutes to form an encapsulation layer with a thickness of 40㎛. Ultraviolet rays were applied to the encapsulation layer at 2 J / cm² 2 investigated.

[0092] Manufacturing of encapsulation film

[0093] A release-treated PET attached to the first layer of the encapsulation layer was peeled off onto a pre-prepared metal layer (INVAR, thickness 80㎛), and laminated at 70°C using a roll-to-roll process to produce an encapsulation film such that the first layer is in contact with the metal layer.

[0094] The above-mentioned encapsulation film was cut to produce an encapsulation film for organic electronic devices. The physical properties of the produced film were measured.

[0096] Example 3

[0097] A packaging film was prepared in the same manner as in Example 1, except that the oxazolidine compound of Formula 1-1 in Example 1 was mixed into the second layer solution instead of the first layer.

[0099] Example 4

[0100] A packaging film was prepared in the same manner as in Example 1, except that the oxazolidine compound of Formula 1-1 in Example 1 was additionally mixed into the second layer solution.

[0102] Example 5

[0103] A packaging film was prepared in the same manner as in Example 1, except that the oxazolidine compound in Example 1 was changed to the oxazolidine compound of Chemical Formula 1-2 below.

[0104] [Chemical Formula 1-2]

[0105]

[0106] In the above, R1 is H and R2 is CH3.

[0108] Example 6

[0109] A packaging film was prepared in the same manner as in Example 1, except that the oxazolidine compound in Example 1 was changed to the oxazolidine compound of Chemical Formula 1-3 below.

[0110] [Chemical Formula 1-3]

[0111]

[0112] In the above, R1 is H and R2 is CH2CH3.

[0114] Example 7

[0115] A packaging film was prepared in the same manner as in Example 1, except that the oxazolidine compound in Example 1 was changed to the oxazolidine compound of Chemical Formula 1-4 below.

[0116] [Chemical Formula 1-4]

[0117]

[0118] In the above, R1 is CH2CH2OH and R2 is CH3.

[0120] Example 8

[0121] A packaging film was prepared in the same manner as in Example 1, except that the oxazolidine compound in Example 1 was changed to the oxazolidine compound of Chemical Formula 1-5 below.

[0122] [Chemical Formula 1-5]

[0123]

[0124] In the above, R1 is CH2CH2OH and R2 is CH2CH3.

[0126] Example 9

[0127] A packaging film was prepared in the same manner as in Example 1, except that the oxazolidine compound in Example 1 was changed to the oxazolidine compound of Chemical Formula 1-6 below.

[0128] [Chemical Formula 1-6]

[0129]

[0131] Example 10

[0132] A packaging film was prepared in the same manner as in Example 1, except that the oxazolidine compound in Example 1 was changed to the oxazolidine compound of Chemical Formula 1-7 below.

[0133] [Chemical Formula 1-7]

[0134]

[0136] Example 11

[0137] A packaging film was prepared in the same manner as in Example 1, except that the oxazolidine compound in Example 1 was changed to the oxazolidine compound of Chemical Formula 1-8 below.

[0138] [Chemical Formula 1-8]

[0139]

[0141] Example 12

[0142] A packaging film was prepared in the same manner as in Example 1, except that the oxazolidine compound in Example 1 was changed to the oxazolidine compound of Chemical Formula 1-9 below.

[0143] [Chemical Formula 1-9]

[0144]

[0146] Example 13

[0147] In preparing the second layer solution of the encapsulation layer, 10 kg of a solution (solid content 40%) diluted with toluene containing butyl resin (BR268, EXXON) in a weight ratio of 10:100 (butyl rubber:Ni) and Ni particles (particle size about 300 nm) was additionally added, except that an encapsulation film was prepared in the same manner as in Example 1.

[0149] Comparative Example 1

[0150] A packaging film was prepared in the same manner as in Example 1, except that the oxazolidine compound was not mixed into the first layer solution.

[0152] Comparative Example 2

[0153] A packaging film was prepared in the same manner as in Example 1, except that a CaO solution was not mixed as a moisture adsorbent in the second layer solution.

[0155] Experimental Example 1 - Panel Defect Measurement

[0156] After depositing organic electronic devices on a thin-film transistor glass substrate, the encapsulation films prepared in the examples and comparative examples were bonded onto the devices using a vacuum bonder under conditions of 50°C, a vacuum of 50 mtorr, and 0.4 MPa, such that the effective bezel length was 2 to 3 mm, thereby manufacturing a 55-inch organic electronic panel. The effective bezel refers to the distance between the outer and inner edges of the edge region where the encapsulation layer directly contacts the glass substrate without any organic electronic devices on the edge of the glass substrate. After operating the manufactured panel for 1,000 hours at 85°C and 85% relative humidity, the panel was illuminated in a dark room to visually check for the occurrence of defective pixels. White spots that were brighter than the surroundings or dark spots that were darker than the surroundings were identified as defective pixels. It was classified as O if there were 3 or fewer defective pixels, △ if there were fewer than 10 defective pixels, and X if 10 or more defective pixels occurred.

[0158] Panel defect measurement Example 1 O Example 2 O Example 3 O Example 4 O Example 5 O Example 6 O Example 7 O Example 8 O Example 9 O Example 10 O Example 11 O Example 12 O Example 13 O Comparative Example 1 X Comparative Example 2 X Explanation of the symbols

[0160] 1: Bag film 11: Bag layer 12: Base layer 3: Organic Electronic Devices 31: Substrate 32: Organic electronic devices 33: Bag layer 34: Metal layer

Claims

Claim 1 A packaging film comprising a packaging resin including an olefin-based resin and an oxazolidine compound, wherein the oxazolidine compound satisfies the following Chemical Formula 1: [Chemical Formula 1] In the above formula 1, n is any integer from 1 to 4, and R1 to R7 are each independently hydrogen, an alkyl group, an alkenyl group, or an alkynyl group; where n is 2 or more, R1 represents an alkylene group, an alkylidene group, or a residue derived from -A1-X1-A2-X2-A3-, and A1A2 or A3 are each independently a single bond, an alkylene group, or an alkylidene group, and X1 or X2 are each independently a single bond, a ketone, an ester, or an amide. Claim 2 In claim 1, the olefin resin is a packaging film comprising a copolymer of an olefin compound having a diene and one carbon-carbon double bond. Claim 3 In claim 1, the olefin resin is a packaging film comprising isobutylene monomer as a polymerization unit. Claim 4 A bag film according to claim 1, wherein the bag resin is included in an amount of 60% by weight or less within the bag layer. Claim 5 delete Claim 6 A bag film according to claim 1, wherein the oxazolidine compound is included in a range of 0.05 to 20 parts by weight per 100 parts by weight of bag resin. Claim 7 A bag film according to claim 1, further comprising a moisture adsorbent. Claim 8 In claim 7, the moisture adsorbent is a bag film that is a chemically reactive adsorbent. Claim 9 In claim 7, the moisture adsorbent is included in a range of 20 to 370 parts by weight per 100 parts by weight of the bag resin in the bag film. Claim 10 A packaging film according to claim 7, wherein the weight ratio of the oxazolidine compound to the moisture adsorbent is within the range of 0.0001 to 0.

3. Claim 11 A bag film according to claim 1, further comprising an adhesion promoter. Claim 12 In claim 11, the tackifier is included in a range of 15 to 200 parts by weight per 100 parts by weight of the encapsulating resin in the encapsulating film. Claim 13 A sealing film according to claim 1, further comprising an anti-spot agent having an adsorption energy for outgas calculated by Density Functional Theory of 0 eV or less. Claim 14 In claim 13, the sealing film comprises 3 to 150 parts by weight of the anti-brightness agent per 100 parts by weight of the sealing resin. Claim 15 The encapsulation film according to claim 1, further comprising an active energy beam polymerizable compound. Claim 16 In claim 15, the encapsulation film comprises an active energy beam polymerizable compound in a range of 3 to 30 parts by weight per 100 parts by weight of encapsulation resin. Claim 17 In claim 1, a bag film comprising a bag layer and a metal layer. Claim 18 In claim 1, the encapsulation film comprises an encapsulation layer, wherein the encapsulation layer comprises a first layer encapsulating the front surface of an organic electronic device on a substrate and a second layer formed on the first layer. Claim 19 An organic electronic device comprising: a substrate; an organic electronic element formed on the substrate; and an encapsulation film according to claim 1 for encapsulating the organic electronic element. Claim 20 A method for manufacturing an organic electronic device comprising the step of applying a sealing film according to claim 1 to a substrate having an organic electronic device formed thereon so as to cover the organic electronic device.

Images