Encapsulating composition and Organic electronic device comprising the same

Abstract

The present application provides a sealant composition applicable via an inkjet method, a method for manufacturing the same, and an organic electronic device comprising the same, which can secure the lifespan of an organic electronic device by effectively blocking moisture or oxygen entering the organic electronic device from the outside and enables the realization of a front-emitting organic electronic device.

Description

Technology Field

[0001] The present invention relates to a sealant composition and an organic electronic device comprising the same. Background Technology

[0002] A touch sensor refers to a type of input device installed in image display devices such as a Liquid Crystal Display (LCD), Field Emission Display (FED), Plasma Display Panel (PDP), Electroluminescence Device (EL), and Electrophoretic Display, which inputs predetermined information by pressing (pressing or touching) a touch panel while viewing the image display device.

[0003] Recently, in line with the trend toward larger and thinner display devices, the form factor of the structure of touch sensors used in the aforementioned display devices is changing. Accordingly, display devices in which the touch sensor is formed on a sealing layer are being developed.

[0004] Meanwhile, as the display device becomes thinner, the gap between the electrode for the touch sensor and the upper electrode within the image display device narrows, which can cause parasitic current to be generated, resulting in a problem where the touch sensitivity of the touch sensor is reduced.

[0005] Therefore, the main challenge is to increase user touch sensitivity by lowering the dielectric constant of the sealing layer. The problem to be solved

[0006] The problem that the present invention aims to solve is to provide a sealant composition capable of realizing excellent touch sensitivity based on the characteristics of low dielectric constant. The technical problems of the present invention are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art from the description below. means of solving the problem

[0007] The present invention is capable of various modifications and may have various embodiments, and specific embodiments are illustrated in the drawings and described in detail. However, this is not intended to limit the invention to specific embodiments, and it should be understood that the invention includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the invention.

[0008] When an element such as a layer, region, or substrate is referred to as existing "on" another component, it can be understood that this exists directly on the other element, or that an intermediate element may exist between them.

[0009] The terms used in this application are used merely to describe specific embodiments and are not intended to limit the invention. The singular expression includes the plural expression unless the context clearly indicates otherwise. In this application, terms such as "comprising" or "having" are intended to specify the presence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0010] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this application.

[0012] <Sealing material composition>

[0013] The present application relates to a sealing composition for organic electronic devices. The sealing composition may be a sealing material applied to encapsulate or encapsulate an organic electronic device, such as, for example, an OLED. In one example, the sealing composition of the present application may be applied to encapsulate or encapsulate the front surface of an organic electronic device. Thus, after the sealing composition is applied to encapsulate, it may exist in a form that seals the front surface of the organic electronic device.

[0014] In this specification, the term “organic electronic device” refers to an article or device having a structure comprising an organic material layer that generates an alternating charge using holes and electrons between a pair of opposing electrodes, examples of which include, but are not limited to, photovoltaic devices, rectifiers, transmitters, and organic light-emitting diodes (OLEDs). In one example of this application, the organic electronic device may be an OLED.

[0015] The sealant composition of the present application is applied to a front-emitting organic electronic device to come into direct contact with the device. It must possess excellent optical properties after curing, achieve excellent low viscosity for application in inkjet processes, and, in particular, enable excellent touch sensitivity in thin-film organic electronic devices based on low dielectric constant properties. Accordingly, the present application can provide a composition for encapsulating organic electronic devices that can simultaneously achieve the aforementioned optical properties, device reliability, low viscosity, high hardness, and low dielectric constant by controlling the compound polarization rate to a specific range as described below.

[0016] In the present application, the sealant composition may comprise a curable compound having at least one curable functional group, and the curable compound may be a photocurable or thermocurable compound. As an example, the sealant composition according to the present application may comprise a cationic curable compound having a cationic curable functional group as a curable functional group.

[0017] In one embodiment, the sealant composition of the present application comprises a cationic curable compound having at least one cationic curable functional group, and the polarization rate of the composition may be 1.53 or less, 1.52 or less, 1.51 or less, 1.5 or less, 1.49 or less, 1.48 or less, 1.47 or less, 1.46 or less, 1.45 or less, 1.44 or less, 1.43 or less, 1.42 or less, 1.41 or less, 1.4 or less, 1.39 or less, 1.38 or less, 1.37 or less, 1.36 or less, 1.35 or less, 1.34 or less, or 1.33 or less, and the lower limit of the polarization rate of the composition may be 1 or more.

[0018] Here, the composition polarization rate is the sum of the values ​​obtained by multiplying the compound polarization rate for each cationic curable compound constituting the sealant composition by the weight ratio of said compound, and said compound polarization rate can be calculated by the following general formula 1.

[0019] [General Formula 1]

[0020] Compound Polarization = (Sum of the number of carbons and oxygens in the molecular structure of the compound) / (Number of carbons minus the number of oxygens in the molecular structure of the compound)

[0021] In General Formula 1, the number of carbons (or hydrogens) included in the molecular structure of the compound refers to the number of carbons (or hydrogens) forming the compound. When the sealant composition consists of compound (a), compound (b), compound (c), and compound (d), the polarization of the composition can be calculated as (polarization of compound a * weight ratio of compound a) + (polarization of compound b * weight ratio of compound b) + (polarization of compound c * weight ratio of compound c) + (polarization of compound d * weight ratio of compound d).

[0022] That is, the sealing material composition according to the present application can lower the dielectric constant of the composition by controlling the compositional polarization rate of the cationic curable compound constituting the composition, and consequently increase the touch sensitivity of a touch sensor adjacent to the sealing layer.

[0023] In one example, the cationic curable compound may include a cycloaliphatic epoxy compound (C) having a fused ring in which two or more rings are fused within the molecular structure. In this specification, the cycloaliphatic epoxy compound may include an epoxy group as a cationic curable functional group and may not include an oxetane group. As an example, the cycloaliphatic epoxy compound (C) may include at least 2 to 12 rings, 2 to 6 rings, or 2 to 4 rings within the molecular structure, and the rings may be formed from 3 to 12, 4 to 10, or 5 to 8 ring constituent atoms. Additionally, as an example, the cycloaliphatic epoxy compound (C) may include two or more different compounds.

[0024] In one example, the cycloaliphatic epoxy compound (C) may include a unit of the following chemical formula 1 or the following chemical formula 2.

[0025] [Chemical Formula 1]

[0026]

[0027] [Chemical Formula 2]

[0028]

[0029] In Formula 1, R1 and R2 may each independently comprise at least one alkyl group having 1 to 4 carbon atoms, and in Formula 2, R3, R4, and R5 may each independently comprise at least one alkyl group having 1 to 4 carbon atoms, and the alkyl group may form a bridged ring. The sealant composition according to the present application can achieve a low dielectric constant by including a cycloaliphatic compound.

[0030] In one example, a cycloaliphatic epoxy compound (C) having a fused ring in which two or more rings are fused within the molecular structure based on the sealant composition may be included in an amount of 5 to 50 weight%, and as an example, the lower limit thereof may be 6 weight% or more, 7 weight% or more, 8 weight% or more, 9 weight% or more, 10 weight% or more, 11 weight% or more, 12 weight% or more, 13 weight% or more, 14 weight% or more, 15 weight% or more, 17 weight% or more, 20 weight% or more, 23 weight% or more, 25 weight% or more, 27 weight% or more, 30 weight% or more, or 33 weight% or more, and the upper limit thereof may be 45 weight% or less, 40 weight% or less, 36 weight% or less, 34 weight% or less, 30 weight% or less, 27 weight% or less, 23 weight% or less, 20 weight% or less, or 18 weight% or less. It is possible. By including it within a specific range in this way, the physical properties intended by the present invention can be satisfied.

[0031] In addition, in one embodiment, the cationic curable compound may include an aliphatic epoxy compound (A). The aliphatic epoxy compound (A) may include at least one epoxy group as a cationic curable functional group, and may not include an oxetane group or a cyclic structure within the molecular structure. Furthermore, the aliphatic epoxy compound (A) may include two or more different compounds, and the types thereof are not particularly limited, but as an example, a polyfunctional epoxy compound having two or more epoxy groups may not be included. In addition, the aliphatic epoxy compound (C) may be a straight chain or a branched chain having 8 to 16 carbon atoms, 10 to 14 carbon atoms, or 11 to 13 carbon atoms.

[0032] In one example, the aliphatic epoxy compound (A) may be included in an amount of 60 to 250 parts by weight per 100 parts by weight of the alicyclic epoxy compound (C), and as an example, the lower limit may be 70 parts by weight or more, 75 parts by weight or more, 80 parts by weight or more, 90 parts by weight or more, 100 parts by weight or more, 105 parts by weight or more, 110 parts by weight or more, 120 parts by weight or more, 130 parts by weight or more, 140 parts by weight or more, 150 parts by weight or more, 160 parts by weight or more, 170 parts by weight or more, 180 parts by weight or more, 190 parts by weight or more, or 200 parts by weight or more, and the upper limit may be 245 parts by weight or less, 235 parts by weight or less, 225 parts by weight or less, 215 parts by weight or less, 205 parts by weight or less, 195 parts by weight or less, 185 parts by weight or less, 155 parts by weight or less. The content may be 125 parts by weight or less, 115 parts by weight or less, 95 parts by weight or less, or 85 parts by weight or less. By controlling the above content range, the present application enables the sealant composition to prevent device damage when fully sealing an organic electronic device, to have appropriate inkjet-compatible properties, and to achieve a low dielectric constant after curing.

[0033] In one embodiment, the cationic curable compound may include an oxetane compound (B). Here, the oxetane compound includes a quaternary ether group having an oxetanyl group as a cationic curable functional group, and may not include an epoxy group. Although not limited thereto, the oxetane compound (B) may include two or more different compounds, and the types are not significantly limited, but may include a monofunctional oxetane compound or a polyfunctional oxetane compound including two or more oxetane groups, and as an example, may not include an aromatic oxetane compound including at least one aromatic ring.

[0034] In one example, the oxetane compound (B) can be represented by the following chemical formula 3.

[0035] [Chemical Formula 3]

[0036]

[0037] In Chemical Formula 3, Z1 to Z2 may each independently be a straight-chain or branched-chain alkylene group having 1 to 4 carbon atoms or 1 to 2 carbon atoms. Additionally, R6 to R7 may each independently be a hydrogen atom; or a straight-chain or branched-chain alkyl group having 1 to 8 carbon atoms, 1 to 6 carbon atoms, or 1 to 4 carbon atoms.

[0038] In one example, the oxetane compound (B) may be included in an amount of 60 to 230 parts by weight per 100 parts by weight of the alicyclic epoxy compound (C), the lower limit may be 65 parts by weight or more, 70 parts by weight or more, 75 parts by weight or more, 80 parts by weight or more, 83 parts by weight or more, 90 parts by weight or more, 100 parts by weight or more, 110 parts by weight or more, 113 parts by weight or more, 120 parts by weight or more, 130 parts by weight or more, 140 parts by weight or more, or 145 parts by weight or more, and the upper limit may be 220 parts by weight or less, 210 parts by weight or less, 200 parts by weight or less, 190 parts by weight or less, 180 parts by weight or less, 170 parts by weight or less, 160 parts by weight or less, 150 parts by weight or less, 140 parts by weight or less, 130 parts by weight or less, 120 parts by weight or less, 110 parts by weight The amount may be 100 parts by weight or less, or 90 parts by weight or less. By adjusting the oxetane compound (B) to the above content ratio, the present application can provide a composition that enables a uniform coating film and ensures sufficient pot life in a process of encapsulating an organic electronic device. In one embodiment, the cationic curable compound may further include a siloxane epoxy compound (D). In this specification, the siloxane epoxy compound may include both siloxane groups (Si-O-Si) and epoxy groups. In particular, the siloxane epoxy compound (D) may include rings within its molecular structure in a number of at least 2 and 12, 2 to 6 and less, or 2 to 4 and less, and the rings may be formed from 3 to 12, 4 to 10, or 5 to 8 ring constituent atoms. The sealant composition according to the present invention may achieve the physical properties intended by the present application by further including the siloxane epoxy compound (D).

[0039] In one example, the siloxane epoxy compound (D) may be included in an amount of 40 to 300 parts by weight per 100 parts by weight of the alicyclic epoxy compound (C), and as an example, the lower limit may be 50 parts by weight or more, 60 parts by weight or more, 70 parts by weight or more, 75 parts by weight or more, 90 parts by weight or more, 100 parts by weight or more, 150 parts by weight or more, 170 parts by weight or more, and the upper limit may be 250 parts by weight or less, 230 parts by weight or less, 210 parts by weight or less, 180 parts by weight or less, 150 parts by weight or less, 130 parts by weight or less, 110 parts by weight or less, 95 parts by weight or less, or 80 parts by weight or less.

[0041] In one embodiment, the sealant composition according to the present invention may include a photoinitiator. The photoinitiator may be a cationic photopolymerization initiator, and the specific type may be appropriately selected considering the curing speed, etc. As an example of a cationic photopolymerization initiator, a cationic part comprising aromatic sulfonium, aromatic iodinium, aromatic diazonium, or aromatic ammonium and AsF6 - , SbF6 - , PF6 -It may include a compound having an anionic portion comprising tetrakis(pentafluorophenyl)borate, or tetrakis(pentafluorophenyl)borate. Additionally, examples of cationic photopolymerization initiators may include onium salt or organometallic salt series ionizing cationic initiators, or organosilane or latent sulfonic acid series or non-ionizing cationic photopolymerization initiators. Examples of onium salt series initiators include diaryliodonium salt, triarylsulfonium salt, or aryldiazonium salt; examples of organometallic salt series initiators include iron arene; examples of organosilane series initiators include o-nitrobenzyl triaryl silyl ether, triaryl silyl peroxide, or acyl silane; examples of latent sulfuric acid series initiators include α-sulfonyloxy ketone or α-hydroxymethylbenzoin sulfonate, but are not limited thereto. Currently available products include Irgacure 250, Irgacure 270, Irgacure 290, CPI-100P, CPI-101A, CPI-210S, Omnicat 440, Omnicat 550, and Omnicat 650, and these photopolymerization initiators can be used alone or in a mixture of two or more types.

[0042] In one example, the photoinitiator may be included in an amount of 0.01 to 10 weight% or less, specifically 0.01 to 5 weight% or less, based on the sealant composition. By controlling the photoinitiator content range, physical and chemical damage to the device can be minimized due to the characteristics of the sealant composition of the present application, which is applied directly to an organic electronic device.

[0043] In one example, the photoinitiator may be included in an amount of 0.01 to 10 weight% or less, specifically 0.01 to 5 weight% or less, based on the sealant composition. By controlling the photoinitiator content range, physical and chemical damage to the device can be minimized due to the characteristics of the sealant composition of the present application, which is applied directly to an organic electronic device.

[0044] In one embodiment, the sealant composition may include a surfactant. The surfactant is not limited to, but is preferably a silicone-based surfactant, a fluorine-based surfactant, or an acrylic-based surfactant.

[0045] Specific examples of silicone-based surfactants include BYK-077, BYK-085, BYK-300, BYK-301, BYK-302, BYK-306, BYK-307, BYK-310, BYK-320, BYK-322, BYK-323, BYK-325, BYK-330, BYK-331, BYK-333, BYK-335, BYK-341v344, BYK-345v346, BYK-348, BYK-354, BYK-355, BYK-356, BYK-358, BYK-361, BYK-370, BYK-371, and BYK-375 from BYK-Chemie. Examples include BYK-380 or BYK-390, and specific examples of the above-mentioned fluorine-based surfactants include F-114, F-177, F-410, F-411, F-450, F-493, F-494, F-443, F-444, F-445, F-446, F-470, F-471, F-472SF, F-474, F-475, F-477, F-478, F-479, F-553, F-554, F-555, F-556, F-557, F-558, F-559, F-560, F-561, F-562, F-563, F-565, F-568, F-569 of DIC (DaiNippon Ink & Chemicals). Examples include F-570, F-571, F-572, F-480SF, F-482, F-483, F-484, F-486, F-487, F-172D, MCF-350SF, TF-1025SF, TF-1117SF, TF-1026SF, TF-1128, TF-1127, TF-1129, TF-1126, TF-1130, TF-1116SF, TF-1131, TF1132, TF1027SF, TF-1441, or TF-1442, but are not limited thereto. To control the surface tension of the sealant composition according to the present invention, the surfactant added to the composition may be included in an amount of 0.1 to 1 weight% based on the sealant composition.

[0046] In addition to the composition described above, the sealant composition according to the present application may include various additives within a range that does not affect the effects of the aforementioned invention. For example, the sealant composition may include sensitizers, defoaming agents, tackifiers, UV stabilizers, or antioxidants in an appropriate range of content depending on the desired physical properties.

[0047] In a specific embodiment of the present application, the sealant composition of the present application may be in a liquid state at room temperature, for example, 25°C. In one embodiment, the sealant composition may be a solvent-free type liquid state. Here, a solvent-free type means containing 0.05% or less of a solvent. In addition, in one embodiment, the sealant composition may be an ink composition. That is, the sealant composition according to the present application may be designed to have appropriate physical properties when ejected onto a substrate using non-contact inkjet printing capable of patterning.

[0048] In one example, the sealant composition may have a viscosity measured by Brookfield’s DV-3 at a temperature of 25°C, 90% torque, and a shear rate of 20 rpm, within the range of 50 cP or less, 1 to 46 cP, 3 to 44 cP, 4 to 38 cP, 5 to 33 cP, or 14 to 24 cP. By controlling the viscosity of the composition to the above range, the present application can achieve inkjet-compatible properties at the time of application to an organic electronic device and also provide a thin film encapsulant with excellent coating properties.

[0049] In one example, the sealant composition may have a dielectric constant of 2.9 or less, 2.8 or less, 2.79 or less, 2.78 or less, 2.77 or less, 2.76 or less, 2.75 or less, 2.74 or less, 2.73 or less, 2.72 or less, 2.71 or less, or 2.7 or less after curing under conditions of any frequency from 1 to 250 kHz and a temperature of 25 °C, and the lower limit thereof may be 1 or greater, although not significantly limited. As an example, the dielectric constant may be measured at any frequency from 100 to 250 kHz, and more specifically, at a frequency of 250 kHz.

[0050] As described in detail below, the sealant composition can form an organic layer by inducing crosslinking through light irradiation. The light irradiation is performed using light having a wavelength range of about 250 to about 450 nm or about 300 to about 450 nm at a pressure of 300 to 6,000 mJ / cm² 2 light intensity of or 500 to 4,000 mJ / cm² 2 It may include irradiating with the amount of light.

[0051] At this time, as described below, the organic layer may have a thickness of 25 μm or less. For example, the thickness may be 23 μm or less, 22 μm or less, 21 μm or less, or 20 μm or less, and the lower limit may be 1 μm or more or 2 μm or more. The present application may provide a thin organic electronic device by providing a thin organic layer.

[0052] In a specific embodiment of the present application, the surface tension of the cured product after curing of the sealant composition may be within the range of 10 to 50 mN / m, 12 to 45 mN / m, 15 to 40 mN / m, 18 to 35 mN / m, or 20 mN / m to 30 mN / m. The surface tension may be measured by a method known in the art, for example, by the ring method. Since the present application satisfies the above surface tension range, ejection from an inkjet head in an inkjet process may be easy.

[0053] The above surface tension may refer to a value measured by the Ring Method using a dynamic wettability tester at 25°C. As an example, a surface tension tester (Tensiometer) from Kruss can be used. Specifically, a ring made of platinum or platinum-iridium material is immersed in a sealant composition and then pulled vertically. When the force applied to the ring reaches its maximum, the contact angle becomes zero, and the surface tension value calculated based on the force at that time and the distance the ring moved is displayed on the surface tension tester (Tensiometer) and can be measured.

[0054] In addition, in a specific embodiment of the present application, the sealant composition may have a light transmittance in the visible light region of 90% or more, 92% or more, or 95% or more after curing. Within this range, the present application applies the sealant composition to a front-emitting organic electronic device to provide an organic electronic device with high resolution, low power consumption, and long lifespan. Furthermore, the sealant composition of the present application may have a haze of 3% or less, 2% or less, or 1% or less according to the JIS K7105 standard test after curing, and the lower limit may be 0%, although the lower limit is not specifically limited. Within the haze range, the sealant composition may have excellent optical properties after curing. In this specification, the aforementioned light transmittance or haze may be measured when the sealant composition is cured into an organic layer, and may be an optical property measured when the thickness of the organic layer is any one of 2 to 20 μm. In a specific embodiment of the present application, the aforementioned moisture adsorbent or inorganic filler may not be included to realize the optical properties.

[0056] Organic Electronic Devices

[0057] The present application also relates to an organic electronic device. An exemplary organic electronic device (3) may include, as illustrated in FIG. 1, a substrate (31); an organic electronic element (32) formed on the substrate (31); and an organic layer (33) formed by the aforementioned sealing material composition that seals the front surface of the organic electronic element (32).

[0058] In a specific embodiment of the present application, the organic electronic device (32) may include a first electrode layer, an organic material layer formed on the first electrode layer and comprising at least a light-emitting layer, and a second electrode layer formed on the organic material layer. The first electrode layer may be a transparent electrode layer or a reflective electrode layer, and the second electrode layer may also be a transparent electrode layer or a reflective electrode layer. More specifically, the organic electronic device (32) may include a reflective electrode layer formed on a substrate, an organic material layer formed on the reflective electrode layer and comprising at least a light-emitting layer, and a transparent electrode layer formed on the organic material layer.

[0059] In the present application, the organic electronic device (32) may be an organic light-emitting diode.

[0060] In one example, the organic electronic device according to the present application may be of the top emission type, but is not limited thereto and may be applied to the bottom emission type.

[0061] The above organic electronic device (3) may additionally include an inorganic layer (35) between the organic electronic device (32) and the organic layer to protect the electrode and light-emitting layer of the above organic electronic device (32). The inorganic layer (35) may be a protective layer formed by chemical vapor deposition (CVD). For example, the inorganic layer (34) may be one or more metal oxides or nitrides selected from the group consisting of Al, Zr, Ti, Hf, Ta, In, Sn, Zn, and Si. The thickness of the inorganic layer may be 10 to 70 nm or about 20 to about 60 nm. In one example, the inorganic layer (34) of the present application may be an inorganic material that does not contain a dopant, or an inorganic material that contains a dopant. The dopant that can be doped may be one or more elements selected from the group consisting of Ga, Si, Ge, Al, Sn, Ge, B, In, Tl, Sc, V, Cr, Mn, Fe, Co, and Ni, or oxides of said elements, but is not limited thereto.

[0062] As an example, the organic electronic device (3) may additionally include an inorganic layer (34) formed on the organic layer (33). The inorganic layer (34) may use a material that is the same or different from the inorganic layer (35) formed between the organic electronic device (32) and the organic layer, and the inorganic layer (34) may be formed in the same way as the protective film (35).

[0063] Additionally, the organic layer may have a thickness of 25 μm or less. The thickness may be 23 μm or less, 22 μm or less, 21 μm or less, or 20 μm or less, and the lower limit may be 1 μm or more or 2 μm or more. The present application may provide a thin organic electronic device by providing a thin organic layer.

[0064] As one example, the organic electronic device (3) of the present application may include a packaging structure comprising the aforementioned organic layer (33) and inorganic layer (34), wherein the packaging structure comprises at least one organic layer (33) and at least one inorganic layer (34), and the organic layer (33) and the inorganic layer (34) may be repeatedly stacked. For example, the organic electronic device may have a structure of substrate / organic electronic device / protective film / (organic layer / inorganic layer)n, and n may be a number within the range of 1 to 100. FIG. 1 is a cross-sectional view exemplarily showing when n is 1.

[0065] In one embodiment, the structure may include a sealing structure (36) comprising at least one organic layer and at least one inorganic layer, and a touch sensor (37) formed on the sealing structure. This laminated structure may be referred to as a TOE (Touch On Encapsulation) structure. In such a structure, an organic layer for the sealing material having a low dielectric constant is required to increase touch sensitivity.

[0066] A touch sensor (37) refers to a device capable of recognizing input information obtained through contact with a user, and may be a sensor known in the relevant technical field. For example, the touch sensor may be a capacitive sensor that recognizes a touch based on static electricity generated at a user's body contact area (e.g., hand) and the resulting change in current; or a pressure-sensitive sensor that recognizes a touch based on a change in electrical capacitance generated when the conductive layers of the upper and lower plates of the touch sensor come into contact due to pressure applied by the user. The configuration of the sensor capable of recognizing user contact in each method may be known in the relevant technical field.

[0067] In one example, the touch sensor (37) may include a conductive layer (not shown) on one or both sides. The material of the conductive layer is not particularly limited and, for example, a transparent conductive film such as ITO or metal nanowires may be used. The conductive layer may have electric current-carrying channels and non-electric current-carrying non-channel regions. These regions may be formed by methods such as etching or photolithography.

[0068] In one example, the organic electronic device (3) may further include a cover substrate (not shown) on its uppermost surface. That is, the organic electronic device (3) according to the present invention may sequentially include a sealing structure (36), a touch sensor (37), and a cover substrate. At this time, the cover substrate and the touch sensor may be collectively referred to as a touch panel (37). A sealing material may be positioned on the touch panel to implement a TOE structure.

[0069] In one embodiment, the touch sensor (37) may be formed directly on the packaging structure (36). That is, there may not be a separate adhesive layer or adhesive layer between the stacked components.

[0070] The above cover substrate may be transparent, for example, when the transmittance to visible light is 80% or more. When transparent, the type of material included in the cover substrate is not particularly limited. For example, the cover substrate may include a polymer resin or a glass component. In one example, if it is necessary to impart flexible properties, the cover substrate may include a polymer resin. Although not particularly limited, for example, the cover substrate may include a polyester film such as PC (Polycarbonate), PEN (poly(ethylene naphthalate)), or PET (poly(ethylene terephthalate)); an acrylic film such as PMMA (poly(methylmethacrylate)); a polyolefin film such as PE (polyethylene) or PP (polypropylene); a polyimide film; or a polyamide film, etc.

[0072] Method for manufacturing an organic electronic device

[0073] The present application also relates to a method for manufacturing an organic electronic device.

[0074] In one example, the manufacturing method may include the step of forming an organic layer (33) on a substrate (31) on which an organic electronic element (32) is formed, such that the aforementioned sealing material composition seals the front surface of the organic electronic element (32).

[0075] In the above, as a substrate (31) of the organic electronic device (32), a reflective electrode or a transparent electrode may be formed on a substrate (31), such as glass or a polymer film, by a method such as vacuum deposition or sputtering, and an organic material layer may be formed on the reflective electrode. The organic material layer may include a hole injection layer, a hole transport layer, a light-emitting layer, an electron injection layer, and / or an electron transport layer. Subsequently, a second electrode is additionally formed on the organic material layer. The second electrode may be a transparent electrode or a reflective electrode.

[0076] The manufacturing method of the present application may further include the step of forming an inorganic layer (35) on a first electrode, an organic material layer, and a second electrode formed on the substrate (31). After that, the aforementioned organic layer (33) is applied to the substrate (31) to fully cover the organic electronic device (32). At this time, the step of forming the organic layer (33) is not particularly limited, and the aforementioned sealing material composition may be applied to the front surface of the substrate (31) using processes such as inkjet printing, gravure coating, spin coating, screen printing, or reverse offset coating.

[0077] The above manufacturing method may also additionally include a step of irradiating the organic layer with light. In the present invention, a curing process may be performed on the organic layer encapsulating the organic electronic device; such curing process may be carried out, for example, in a heating chamber or a UV chamber, and preferably in a UV chamber. In one example, the aforementioned sealant composition may be applied by an inkjet printing method, and an organic layer may be formed by inducing crosslinking of the applied sealant composition by irradiating light, which, as previously described, has a wavelength range of 250 to 450 nm and 300 to 6,000 mJ / cm² 2 An organic layer can be formed by irradiating light within the range of light intensity.

[0078] The manufacturing method of the present application may further include the step of forming an inorganic layer (34) on the organic layer (33). The step of forming the inorganic layer (34) may use a method known in the art and may be the same as or different from the method of forming the protective film ((35) of FIG. 1) described above.

[0079] Additionally, a step of placing a touch sensor (37) on the organic layer (33) or inorganic layer (34, 35) may be added. Effects of the invention

[0080] As described above, the sealant composition according to the embodiments of the present invention can improve the touch sensitivity of adjacent touch sensors and provide excellent protection against the external environment. However, the effects of the present invention are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art from the description below. Brief explanation of the drawing

[0081] FIG. 1 is a cross-sectional view showing an organic electronic device according to one example of the present invention. Specific details for implementing the invention

[0082] Hereinafter, preferred experimental examples are presented to aid in understanding the present invention. However, the following experimental examples are intended only to aid in understanding the present invention, and the present invention is not limited by the following experimental examples.

[0084] Experimental Example

[0085] 1. Polarization rate of the composition

[0086] The composition polarization rate is the sum of the values ​​obtained by multiplying the compound polarization rate for each cationic curable compound constituting the sealant composition by the weight ratio of said compound, and said compound polarization rate was calculated using the following general formula 1.

[0087] That is, when the sealant composition consists of compound (X), compound (Y), and compound (Z), the composition polarization rate can be calculated as (polarization rate of compound X × weight ratio of compound X) + (polarization rate of compound Y × weight ratio of compound Y) + (polarization rate of compound Z × weight ratio of compound Z).

[0088] [General Formula 1]

[0089] Compound Polarization = (Sum of the number of carbons and oxygens in the molecular structure of the compound) / (Number of carbons minus the number of oxygens in the molecular structure of the compound)

[0091] 2. Curing rate

[0092] The sealant composition prepared according to the examples and comparative examples was inkjet coated onto cleaned bare glass, and an LED UV lamp at 1,000 mJ / cm² was used in an N2 atmosphere. 2 Curing was carried out with a light intensity to form an organic layer 10 μm thick. Subsequently, the peaks of the composition and the cured organic layer were measured using a Cary 5660 FT-IR instrument (manufacturer: Agilent), and at 980 cm⁻¹ -1 The hardening rate was measured through the integral value of the region.

[0093] Curing rate (%) = (1 - 980 cm -1 Integral value of the organic layer of the region / 980 cm -1 (Integral value of composition of the region) × 100

[0095] 3. Permittivity

[0096] An Al plate (conductive plate) was deposited to a thickness of 150 nm on a cleaned bare glass. The sealant compositions prepared in the examples and comparative examples were inkjet coated onto the surface of the deposited Al plate, and the coated composition was irradiated at 1000 mJ / cm² using an LED UV lamp. 2Curing was carried out with a light intensity to form an organic layer with a thickness of 10 μm. An Al plate (conductive plate) with a thickness of 150 nm was deposited on the organic layer to prepare a specimen. Subsequently, the dielectric constant of the specimen prepared under conditions of 250 kHz and 25 °C was measured using an Impedance / Gain-Phase Meter HP 4194A.

[0098] Examples

[0099] Examples 1 to 4

[0100] The composition and content (each weight ratio is indicated) according to Table 1 below were prepared, and the compositions according to Examples 1 to 4 were prepared by mixing at 25 °C for at least 3 hours.

[0102] Comparative Examples 1 to 2

[0103] Compositions and contents (each weight ratio indicated) according to Table 1 below were prepared, and the compositions according to Comparative Examples 1 and 2 were prepared by mixing at 25 °C for at least 3 hours.

[0104] Example 1 Example 2 Example 3 Example 4 Comparative Example 1 Comparative Example 2 Aliphatic epoxy (A) a 30 35 33 20 25 20 Oxetane (B) b 20 28 27 30 21 8.8 cycloaliphatic epoxy (C) c-1 - 15.2 - 26.2 - - c-2 15 18 18 - - - c-3 - - - - 50.2 27.4 c-4 - - - - - 40 Siloxane epoxy (D) d 31.2 - 18.2 20 - - Photoinitiator (Irgacure 290) 3.3 3.3 3.3 3.3 3.3 3.3 Surfactant (F-557) 0.5 0.5 0.5 0.5 0.5 0.5 a: 1,2-EPOXYTETRADECANEb: OXT-221 (Toagosei) c-1: THI-DE (JXTG Nippon Oil&Energy) c-2: DE-103 (JXTG Nippon Oil&Energy) c-3: CEL2081 (Daicel) c-4: CEL 2021P (Daicel)d: SIB1092.0 (Gelest, 1,3-BIS[2-(3,4-EPOXYCYCLOHEXYL)ETHYL]TETRAMETHYLDISILOXANE)

[0105] Table 2 below summarizes the experimental example data according to the above examples and comparative examples.

[0106] Example 1 Example 2 Example 3 Example 4 Comparative Example 1 Comparative Example 2 composition polarization rate 1.33 1.34 1.33 1.43 1.54 1.59 Curing rate (%) 93 88 86 84 88 92 Permittivity (250 kHz, 25°C) 2.71 2.76 2.7 2.79 3.13 3.18

[0107] Although the invention has been described with reference to the above embodiments, those skilled in the art will understand that various modifications and changes can be made to the invention without departing from the spirit and scope of the invention as described in the following claims. Explanation of the symbols

[0110] 3 : Organic Electronic Devices 31 : Substrate 32 : Organic electronic devices 36: Bag structure 35 : Weapon Layer 33 : Organic layer 34: Weapon Layer

Claims

Claim 1 A sealant composition comprising a curable compound composed of a cationic curable compound having at least one cationic curable functional group, wherein the cationic curable compound comprises 5 to 50 weight% of a cycloaliphatic epoxy compound (C) having a fused ring in which two or more rings are fused within the molecular structure, and wherein the composition polarization factor (wherein the composition polarization factor is the sum of the values ​​obtained by multiplying the compound polarization factor for each cationic curable compound constituting the sealant composition by the weight ratio of said compound, and said compound polarization factor is calculated by the following general formula 1) is 1.53 or less: [General Formula 1] Compound polarization factor = (Sum of the number of carbons and oxygens included in the molecular structure of said compound) / (Value obtained by subtracting the number of oxygens from the number of carbons included in the molecular structure of said compound) Claim 2 delete Claim 3 In claim 1, the cationic curable compound further comprises an aliphatic epoxy compound (A), forming a sealant composition. Claim 4 In claim 3, the aliphatic epoxy compound (A) is a monofunctional compound having 8 to 16 carbon atoms and a straight or branched chain, forming a sealant composition. Claim 5 A sealant composition according to claim 3, wherein the aliphatic epoxy compound (A) is included in an amount of 60 to 250 parts by weight per 100 parts by weight of the alicyclic epoxy compound (C). Claim 6 In claim 1, the cationic curable compound further comprises an oxetane compound (B) in the sealant composition. Claim 7 A sealant composition according to claim 6, wherein the oxetane compound (B) is included in an amount of 60 to 230 parts by weight per 100 parts by weight of the alicyclic epoxy compound (C). Claim 8 In claim 1, the cationic curable compound further comprises a siloxane epoxy compound (D) in the sealant composition. Claim 9 A sealant composition according to claim 8, comprising 40 to 300 parts by weight of a siloxane epoxy compound (D) per 100 parts by weight of a cycloaliphatic epoxy compound (C). Claim 10 A sealant composition according to claim 1, further comprising a surfactant. Claim 11 A sealant composition according to claim 1, further comprising a photoinitiator. Claim 12 A sealant composition according to claim 1, wherein the viscosity measured at 25°C and 90% torque is 50 cP or less. Claim 13 In claim 1, a sealant composition which is a solvent-free type ink composition. Claim 14 A sealant composition according to claim 1, having a dielectric constant of 2.9 or less at a frequency of any one of 1 to 250 kHz and a temperature of 25°C after curing. Claim 15 An organic electronic device comprising: a substrate; an organic electronic element formed on the substrate; and an organic layer formed by a sealing material composition according to any one of claims 1 and 3 to 14, which seals the front surface of the organic electronic element. Claim 16 An organic electronic device according to claim 15, comprising an inorganic layer formed between the organic electronic element and the organic layer or on the organic layer. Claim 17 A method for manufacturing an organic electronic device comprising the step of forming an organic layer on a substrate having an organic electronic device formed thereon, such that a sealing material composition according to any one of claims 1 and 3 to 14 seals the front surface of the organic electronic device.

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