Curable compositon

Abstract

The present application relates to a curable composition that allows the curing speed to be easily determined and the curing speed to be easily controlled, and a method for manufacturing the same.

Description

Technology Field

[0001] This application relates to a curable composition. Background Technology

[0002] With the recent remarkable advancements in ultra-high speed and miniaturization technologies, devices and machinery utilizing these technologies have acquired higher power and faster speeds. However, this has also led to the generation of more heat, causing thermal problems; consequently, there is an increasing demand for thermally conductive curable compositions with heat dissipation properties capable of effectively dispersing or removing heat.

[0003] Thermally conductive curable compositions must have an appropriate curing speed for the convenience of the operator. For example, it is required that the curable composition not cure until it has spread evenly over the parts of the application article requiring heat dissipation, and once spread, it must cure rapidly to allow for subsequent work to be performed.

[0004] Conventionally, to control the curing speed, methods have been used to adjust the type or amount of catalyst capable of controlling the reactivity between the main component and the curing agent constituting the curable composition. However, using such methods has made it difficult to achieve the desired level of curing speed. In particular, since the curing speed of the curable composition changes very sensitively even with the use of a small amount of catalyst, it has been difficult to accurately realize the target curing speed.

[0005] Therefore, there is a need for a new method that allows an operator to easily determine the curing speed of a curable composition and easily control the curing speed. The problem to be solved

[0006] The present application aims to provide a curable composition that allows the curing speed to be easily determined and the curing speed to be easily controlled.

[0007] In addition, the present application aims to provide a method for manufacturing a curable composition capable of achieving the above-mentioned purpose.

[0008] In addition, the present application aims to provide a battery module comprising a curable composition or a cured product as described above. means of solving the problem

[0009] Among the physical properties mentioned in this specification, those properties whose measurement temperature affects the property are properties measured at room temperature, unless otherwise specifically defined.

[0010] In this specification, the term “room temperature” refers to a natural temperature that has not been heated or cooled, for example, any temperature within the range of about 10°C to 30°C, for example, about 15°C, about 18°C, about 20°C, about 23°C, or about 25°C. In addition, unless otherwise specifically defined in this specification, the unit of temperature is °C.

[0011] In cases where the measured pressure affects the result among the physical properties mentioned in this specification, unless otherwise specifically defined, the physical property is the property measured at atmospheric pressure. The term “atmospheric pressure” refers to the natural temperature without being pressurized or depressurized, and typically refers to about 1 atmosphere.

[0012] Unless otherwise stated, the term “alkyl group” as used in this specification may mean a straight-chain or branched-chain acyclic alkyl group having 1 to 20 carbon atoms, or 1 to 16 carbon atoms, or 1 to 12 carbon atoms, or 1 to 8 carbon atoms, or 1 to 6 carbon atoms.

[0013] The terms “alkylene group” or “alkylidene group” as used in this specification may, unless otherwise stated, mean, for example, an alkylene group or an alkylidene group having 1 to 12 carbon atoms, 4 to 10 carbon atoms, or 6 to 9 carbon atoms. The alkylene group or alkylidene group may be, for example, a straight chain, a branched chain, or a cyclic type, and may optionally be substituted by one or more substituents.

[0014] Unless otherwise stated, the terms “alkenyl group” or “alkenylene group” as used in this specification may mean a straight or branched acyclic alkenyl group or alkenylene group having 2 to 20 carbon atoms, or 2 to 16 carbon atoms, or 2 to 12 carbon atoms, or 2 to 8 carbon atoms, or 2 to 6 carbon atoms.

[0015] Unless otherwise stated, the terms “alkynyl group” or “alkynylene group” as used in this specification may mean a straight or branched acyclic alkynyl group or alkynylene group having 2 to 20 carbon atoms, or 2 to 16 carbon atoms, or 2 to 12 carbon atoms, or 2 to 8 carbon atoms, or 2 to 6 carbon atoms.

[0016] Unless otherwise stated, the term “alkoxy group” as used in this specification may mean, for example, a straight-chain or branched-chain alkyl group having 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12 carbon atoms, 1 to 8 carbon atoms, or 1 to 4 carbon atoms, or, for example, a cycloalkyl group having 3 to 20 carbon atoms, 3 to 16 carbon atoms, or 4 to 12 carbon atoms. The alkyl group may optionally be substituted by one or more substituents.

[0017] Unless otherwise specifically defined, the term "aryl group" as used in this specification may refer to a compound comprising a benzene structure, a compound comprising a structure in which two or more benzenes are connected by a linker, a compound comprising a structure in which two benzenes each share one or two carbon atoms and are condensed or bonded, or a monovalent residue derived from a derivative of any one of the aforementioned compounds. The scope of aryl groups referred to in this application may include not only functional groups commonly referred to as aryl groups, but also so-called aralkyl groups or arylalkyl groups. An aryl group may be, for example, an aryl group having 6 to 25 carbon atoms, 6 to 21 carbon atoms, 6 to 18 carbon atoms, or 6 to 12 carbon atoms. Examples of aryl groups may include a phenyl group, dichlorophenyl, chlorophenyl, phenylethyl group, phenylpropyl group, benzyl group, tolyl group, xylyl group, or naphthyl group.

[0018] In this specification, the term “carboxylic acid-derived unit” used may refer to a portion of a carboxylic acid compound excluding the carboxyl group. Similarly, the term “polyol-derived unit” used in this specification may refer to a portion of a polyol compound structure excluding the hydroxyl group.

[0019] In this specification, the term “average particle size” refers to the so-called D50 particle size (median particle size), which may mean the particle diameter at 50% of the cumulative volume of the particle size distribution. It refers to the particle diameter at the point where the cumulative value reaches 50% on a cumulative curve in which the total volume is set to 100% and the particle size distribution is calculated based on volume. Such a D50 particle size can be measured by the laser diffraction method.

[0021] The curable composition of the present application comprises a main component comprising a resin component and a filler component, and a curing agent.

[0022] The main component and the curing agent included in the curable composition of the present application are mixed at room temperature and within a relative humidity range of 40 to 60%, and the compressive force when maintained for 1 hour under the same temperature and relative humidity conditions may be 7N or more. The said compressive force refers to the compressive force measured when the main component and the curing agent are mixed in a volume ratio of 1:1.

[0023] In one example, the curable composition may be a room temperature curable type. That is, the main component and the curing agent included in the curable composition of the present application may initiate and proceed with a curing reaction at room temperature immediately after mixing.

[0024] In one example, the above-mentioned main component and curing agent are mixed at room temperature and within a range of 40 to 60% relative humidity, and the compressive force when maintained for 1 hour under the same temperature and relative humidity conditions may be 7.5 N or more, 8 N or more, 8.5 N or more, 9 N or more, 9.5 N or more, 10 N or more, 10.5 N or more, 11 N or more, 11.5 N or more, 12 N or more, 12.5 N or more, 13 N or more, 13.5 N or more, or 14 N or more. The upper limit of the compressive force when the main component and the curing agent are mixed at room temperature and within a relative humidity range of 40 to 60% and maintained for 1 hour under the same temperature and relative humidity conditions is not specifically limited, but may be, for example, 30 N or less, 28 N or less, 26 N or less, 24 N or less, 22 N or less, 20 N or less, 18 N or less, 16 N or less, 14 N or less, 12 N or less, or 11 N or less. The compressive force may be measured by the measurement method in the examples described below.

[0025] When the main component and the curing agent in the above-mentioned curable composition are mixed at room temperature and 40 to 60% relative humidity conditions and the compressive force is maintained for 1 hour, the cured product of the curable composition may have an initial curing speed that satisfies the workability and processability required in the present application, and it may be determined that the curing speed is improved.

[0026] The main component and the curing agent included in the curable composition of the present application are mixed at room temperature and within a relative humidity range of 40 to 60%, and the compressive force when maintained for 2 hours under the same temperature and relative humidity conditions may exceed 35N. The said compressive force refers to the compressive force measured when the main component and the curing agent are mixed in a volume ratio of 1:1.

[0027] In one example, the main component and the curing agent are mixed at room temperature and within a relative humidity range of 40 to 60%, and the compressive force when maintained for 2 hours under the same temperature and relative humidity conditions may be 36 N or more, 38 N or more, 40 N or more, 42 N or more, 44 N or more, or 46 N or more, or 50 N or less, 45 N or less, 40 N or less, or 35 N or less. The compressive force may be measured by the measurement method in the examples described below. When the main component and the curing agent in the curable composition are mixed at room temperature and within a relative humidity range of 40 to 60% and the compressive force when maintained for 2 hours falls within the above range, the cured product of the curable composition may have an initial curing speed capable of satisfying the workability and processability required in this application, and it may be determined that the curing speed is improved.

[0028] The main component and the curing agent included in the curable composition of the present application are mixed at room temperature and within a relative humidity range of 40 to 60%, and the Shore A hardness may be 40 or higher when maintained for 3 hours under the same temperature and relative humidity conditions. The Shore A hardness refers to the Shore A hardness measured when the main component and the curing agent are mixed in a volume ratio of 1:1.

[0029] In one example, the main component and the hardener are mixed at room temperature and within a relative humidity range of 40 to 60%, and when maintained for 3 hours under the same temperature and relative humidity conditions, the Shore A hardness may be 42 or higher, 44 or higher, 46 or higher, 48 or higher, 50 or higher, 52 or higher, 54 or higher, 56 or higher, 58 or higher, 60 or higher, 62 or higher, or 64 or higher, or 75 or lower, 70 or lower, 65 or lower, or 60 or lower. The Shore A hardness may refer to the Shore A hardness measured by the measurement method in the examples described below according to ASTM D 2240. When the main component and the hardener in the curable composition are mixed at room temperature and within a relative humidity range of 40 to 60% and maintained for 3 hours, the compressive force appears within the above range, it may be determined that the curing speed is improved so that the cured product of the curable composition satisfies the workability and processability required in this application.

[0030] In one example, the curable composition of the present application may have a change rate of Shore A hardness according to Formula 1 below of 15 or less. The change rate of Shore A hardness according to Formula 1 below refers to the change rate of Shore A hardness measured when the main component and the curing agent are mixed in a volume ratio of 1:1.

[0031] [Equation 1]

[0032] Rate of change in Shore A hardness = 0.2 × (H8-H3)

[0033] In Formula 1, H8 is the Shore A hardness when the main component and the hardener are mixed at room temperature and relative humidity within the range of 40 to 60% and maintained for 8 hours at the same temperature and relative humidity conditions, and H3 is the Shore A hardness when the main component and the hardener are mixed at room temperature and relative humidity within the range of 40 to 60% and maintained for 3 hours at the same temperature and relative humidity conditions.

[0034] Specifically, the rate of change of Shore A hardness according to the above Equation 1 may be 14 or less, 13 or less, 12 or less, 11 or less, 10 or less, 9 or less, 8 or less, 7 or less, or 6 or less. The lower limit of the rate of change of Shore A hardness according to the above Equation 1 is not specifically limited, but may be 2 or more, 3 or more, 4 or more, 5 or more, 6 or more, or 7 or more. If the rate of change of Shore A hardness according to the above Equation 1 satisfies the above range, it can be determined that the curing speed is improved so that the cured product of the curable composition satisfies the workability and processability required in the present application.

[0035] The curable composition of the present application may have a TA hardness of 0.5 kgf or more when the main component and the curing agent are mixed at room temperature and within a relative humidity range of 40 to 60%, and maintained for 1 hour under the same temperature and relative humidity conditions. The TA hardness refers to the hardness measured by a Texture Analyzer (TA) using the measurement method of the following examples.

[0036] Specifically, the above-mentioned main component and curing agent are mixed at room temperature and within a range of 40 to 60% relative humidity, and when maintained for 1 hour under the same temperature and relative humidity conditions, the TA hardness may be 0.6 kgf or more, 0.7 kgf or more, 0.8 kgf or more, 0.9 kgf or more, 1 kgf or more, 1.1 kgf or more, 1.2 kgf or more, 1.3 kgf or more, 1.4 kgf or more, 1.5 kgf or more, 1.6 kgf or more, 1.7 kgf or more, 1.8 kgf or more, 1.9 kgf or more, or 2 kgf or more. The upper limit of the TA hardness value when the above-mentioned main component and curing agent are mixed at room temperature and within a relative humidity range of 40 to 60% and maintained for 1 hour under the same temperature and relative humidity conditions is not specifically limited, but may be 8 kgf or less, 7 kgf or less, 6 kgf or less, 5 kgf or less, 4 kgf or less, 3 kgf or less, 2 kgf or less, or 1.5 kgf or less. When the above-mentioned main component and curing agent are mixed at room temperature and within a relative humidity range of 40 to 60% and maintained for 1 hour, the TA hardness satisfies the above range, the cured product of the curable composition may have an initial curing speed capable of satisfying the workability and processability required in the present application, and it may be determined that the curing speed is improved.

[0037] The curable composition of the present application may have a rate of change in TA hardness according to Formula 2 below of 5 kgf or more. Mixing for measuring the rate of change in TA hardness according to Formula 2 below may mean mixing the main component and the curing agent in a volume ratio of 1:1.

[0038] [Equation 2]

[0039] Rate of change of TA hardness = 0.5 × (T3-T1)

[0040] In Equation 2, T3 is the TA hardness when the main component and the hardener are mixed at room temperature and a relative humidity within the range of 40 to 60% and maintained for 3 hours at the same temperature and relative humidity conditions, and T1 is the TA hardness when the main component and the hardener are mixed at room temperature and a relative humidity within the range of 40 to 60% and maintained for 1 hour at the same temperature and relative humidity conditions.

[0041] Specifically, the rate of change of the TA hardness may be 5.5 kgf or more, 6 kgf or more, 6.5 kgf or more, 7 kgf or more, 7.5 kgf or more, 8 kgf or more, 8.5 kgf or more, 9 kgf or more, 9.5 kgf or more, 10 kgf or more, 10.5 kgf or more, 11 kgf or more, or 11.5 kgf or more. The upper limit of the rate of change of the TA hardness is not specifically limited, but, for example, may be 20 kgf or less, 19 kgf or less, 18 kgf or less, 17 kgf or less, 16 kgf or less, 15 kgf or less, 14 kgf or less, 13 kgf or less, 12 kgf or less, 11 kgf or less, 10 kgf or less, or 9.5 kgf or less. If the rate of change of TA hardness according to Equation 2 above satisfies the above range, it can be determined that the curing speed has been improved so that the cured product of the curable composition can satisfy the workability and processability required in the present application.

[0042] In one example, the resin composition of the present application may be a two-component resin composition comprising a main component and a curing agent, and said main component may include a resin component and a filler component.

[0043] The subject included in the curable composition of the present application may have a moisture content of 200 ppm or more. The moisture content of the subject may be the moisture content measured by the Karl Fischer total titration method and by the measurement method in the following examples.

[0044] Specifically, the moisture content of the above-mentioned subject may be 210 ppm or more, 220 ppm or more, 230 ppm or more, 240 ppm or more, 250 ppm or more, 260 ppm or more, 270 ppm or more, 280 ppm or more, 290 ppm or more, 300 ppm or more, 310 ppm or more, 320 ppm or more, 330 ppm or more, 340 ppm or more, 350 ppm or more, 360 ppm or more, or 370 ppm or more. The upper limit of the moisture content of the above-mentioned subject may be 600 ppm or less, 550 ppm or less, 500 ppm or less, 450 ppm or less, 400 ppm or less, 350 ppm or less, 300 ppm or less, 250 ppm or less, or 220 ppm or less.

[0045] When the moisture content of the main component in the curable composition of the present application satisfies the above range, the main component and the curing agent of the curable composition can exhibit characteristics such as compressive strength, Shore A hardness, and TA hardness as described above when mixed at room temperature and within a relative humidity range of 40 to 60%. Accordingly, it can have a curing speed that satisfies the workability and processability required in the present application.

[0046] In one example, the curable composition of the present application may be a silicone-based resin composition, a urethane-based resin composition, an epoxy-based resin composition, or an acrylic-based resin composition. If the curable composition of the present application is a silicone-based resin composition, a silicone resin may be used as the main component and a siloxane compound may be used as the curing agent; if the curable composition of the present application is a urethane-based resin composition, a polyol resin may be used as the main component and an isocyanate compound may be used as the curing agent. If the curable composition of the present application is an epoxy-based resin composition, an epoxy resin may be used as the main component and an amine compound may be used as the curing agent; and if the curable composition of the present application is an acrylic-based resin composition, an acrylic resin may be used as the main component and an isocyanate compound may be used as the curing agent.

[0047] In one example, the curable composition of the present application may be a urethane-based resin composition. The urethane-based resin composition may be a two-component urethane resin composition, and the two-component urethane resin composition may include a main component including a polyol, etc. and a curing agent including a polyisocyanate compound, etc.

[0048] The above polyol refers to a compound containing two or more hydroxyl groups, and includes (poly)ethylene glycol, diethylene glycol, (poly)propylene glycol, 1,2-butylene glycol, 2,3-butylene glycol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, 1,6-hexanediol, neopentyl glycol, 1,2-ethylhexyldiol, 1,5-pentanediol, 1,9-nonanediol, 1,10-decanediol, 1,3-cyclohexanedimethanol and 1,4-cyclohexanedimethanol, (poly)ethylenetriol, diethylenetriol, (poly)propylenetriol, glycerin, 1,2,3-butanetriol, 1,2,4-butanetriol, 1,3,4-hexanetriol, 1,3,6-hexanetriol units and Examples may include trimethylolpropane, but are not specifically limited thereto.

[0049] In one example, a polyester-based polyol may be used as the polyol of the present application. The polyester-based polyol may include a carboxylic acid-based polyol and / or a caprolactone-based polyol.

[0050] The above carboxylic acid polyol can be formed by reacting a carboxylic acid with a component containing a polyol (e.g., a diol or a triol), and the caprolactone polyol can be formed by reacting caprolactone with a component containing a polyol (e.g., a diol or a triol). In this case, the carboxylic acid may be a dicarboxylic acid.

[0051] In one example, the polyol may be a polyol represented by the following chemical formula 1 or 2.

[0052] [Chemical Formula 1]

[0053]

[0054] [Chemical Formula 2]

[0055]

[0057] In the above chemical formulas 1 and 2, X is a unit derived from a carboxylic acid, and Y is a unit derived from a polyol. The unit derived from a polyol may be, for example, a triol unit or a diol unit. Additionally, n and m may be any number. For example, n may be a number within the range of 2 to 10 or 2 to 5, and m may be a number within the range of 1 to 10 or 1 to 5. In the above chemical formulas 1 and 2, R1 and R2 are each independently an alkylene group, and the specific types of alkylene groups are as described at the beginning of the means for solving the problem of this specification.

[0058] That is, when the hydroxyl group of a polyol reacts with the carboxyl group of a carboxylic acid, a water (H2O) molecule is detached through a condensation reaction, and an ester bond is formed. In this case, where a carboxylic acid forms an ester bond through a condensation reaction, the carboxylic acid-derived unit may refer to a portion of the carboxylic acid structure that does not participate in the condensation reaction. Additionally, the polyol-derived unit may refer to a portion of the polyol structure that does not participate in the condensation reaction.

[0059] In addition, Y in Chemical Formula 2 also represents the portion excluding the ester bond after the polyol forms an ester bond with caprolactone. That is, in Chemical Formula 2, the polyol-derived unit Y may refer to the portion of the polyol structure that does not participate in the ester bond when the polyol and caprolactone form an ester bond. The ester bonds are indicated in Chemical Formulas 1 and 2, respectively.

[0060] Meanwhile, in the above chemical formula Y, if the polyol-derived unit is a unit derived from a polyol containing three or more hydroxyl groups, such as a triol unit, a structure in which branches are formed in the Y portion of the above chemical formula structure can be implemented.

[0061] In the above chemical formula 1, the type of carboxylic acid-derived unit of X is not particularly limited, but in order to secure the desired physical properties, it may be a unit derived from one or more compounds selected from the group consisting of aromatic compounds having two or more carboxyl groups, alicyclic compounds having two or more carboxyl groups, and aliphatic compounds having two or more carboxyl groups.

[0062] The aromatic compound having two or more carboxyl groups may be, for example, phthalic acid, isophthalic acid, terephthalic acid, trimellitic acid, or tetrachlorophthalic acid. The alicyclic compound having two or more carboxyl groups may be, for example, tetrahydrophthalic acid or hexahydrophthalic tetrachlorophthalic acid. Additionally, the aliphatic compound having two or more carboxyl groups may be, for example, oxalic acid, adipic acid, azelaic acid, sebacic acid, succinic acid, malic acid, glutaric acid, malonic acid, pimelic acid, souveric acid, 2,2-dimethylsuccinic acid, 3,3-dimethylglutaric acid, 2,2-dimethylglutaric acid, maleic acid, fumaric acid, or itaconic acid.

[0063] Meanwhile, the type of polyol-derived unit of Y in chemical formulas 1 and 2 is not particularly limited, but in order to secure the desired physical properties, it may be derived from one or more compounds selected from the group consisting of alicyclic compounds having two or more hydroxyl groups and aliphatic compounds having two or more hydroxyl groups.

[0064] The above-mentioned alicyclic compound having two or more hydroxyl groups may be, for example, 1,3-cyclohexanedimethanol or 1,4-cyclohexanedimethanol. Additionally, the above-mentioned aliphatic compound having two or more hydroxyl groups may be, for example, ethylene glycol, propylene glycol, 1,2-butylene glycol, 2,3-butylene glycol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, 1,6-hexanediol, neopentyl glycol, 1,2-ethylhexyldiol, 1,5-pentanediol, 1,9-nonanediol, 1,10-decanediol, glycerin, or trimethylolpropane.

[0065] In one example, the filler component may be a thermally conductive filler. The thermal conductivity of the thermally conductive filler may be, for example, about 1 W / m·K or more, about 5 W / m·K or more, about 10 W / m·K or more, or about 15 W / m·K or more. In another example, the thermal conductivity of the thermally conductive filler may be about 400 W / m·K or less, about 350 W / m·K or less, or about 300 W / m·K or less.

[0066] The above thermally conductive filler may be, for example, oxides such as aluminum oxide (alumina), magnesium oxide, beryllium oxide, or titanium oxide; nitrides such as boron nitride, silicon nitride, or aluminum nitride; carbides such as silicon carbide; hydrated metals such as aluminum hydroxide or magnesium hydroxide; metal fillers such as copper, silver, iron, aluminum, or nickel; metal alloy fillers such as titanium; silicon powder such as quartz, glass, or silica, but is not limited thereto. In addition, if insulating properties can be ensured, the application of carbon fillers such as graphite may also be considered. For example, activated carbon may be used as the carbon filler.

[0067] The form or ratio of the above filler component is not particularly limited and can be selected considering the viscosity of the curable composition, the possibility of settling within the curable composition, the desired thermal resistance or thermal conductivity, insulation, filling effect or dispersibility, etc.

[0068] The shape of the filler component may be spherical and / or non-spherical (e.g., needle-shaped and plate-shaped, etc.) as appropriately selected as needed, but is not limited thereto.

[0069] The above filler component can be manufactured by mixing a filler component (C1) having a moisture content of 150 ppm or less and an average particle size of 10 µm or more, and a filler component (C2) having a moisture content of 250 ppm or more and an average particle size of less than 10 µm.

[0070] Specifically, the moisture content of the filler component (C1) may be 145 ppm or less, 140 ppm or less, 135 ppm or less, 130 ppm or less, 125 ppm or less, 120 ppm or less, 115 ppm or less, 110 ppm or less, 105 ppm or less, or 100 ppm or less. The lower limit of the moisture content of the filler component (C1) is not specifically limited, but may be 0 ppm or more, 10 ppm or more, 30 ppm or more, 50 ppm or more, 70 ppm or more, or 90 ppm or more. The moisture content of the filler component (C1) may be the moisture content measured by the Karl Fischer total titration method and the measurement method in the following examples.

[0071] In one example, the filler component (C1) may be composed of a first filler having an average particle size in the range of 30㎛ to 100㎛ and a second filler having an average particle size in the range of 10㎛ to 30㎛. At this time, the moisture content included in the filler component (C1) may be the average moisture content of the first filler and the second filler constituting the filler component (C1), and the moisture content of the first filler and the second filler may each be 150 ppm or less. In one example, the average particle size of the first filler may be 31㎛ or more, 32㎛ or more, 33㎛ or more, 34㎛ or more, 35㎛ or more, 36㎛ or more, 37㎛ or more, 38㎛ or more, 39㎛ or more, or 40㎛ or more, or 95㎛ or less, 90㎛ or less, 85㎛ or less, 80㎛ or less, 75㎛ or less, 70㎛ or less, 65㎛ or less, 60㎛ or less, 55㎛ or less, 50㎛ or less, 45㎛ or less, or 40㎛ or less.

[0072] In addition, in one example, the average particle size of the second filler may be 11㎛ or more, 12㎛ or more, 13㎛ or more, 14㎛ or more, 15㎛ or more, 16㎛ or more, 17㎛ or more, 18㎛ or more, 19㎛ or more, or 20㎛ or more, or 29㎛ or less, 28㎛ or less, 27㎛ or less, 26㎛ or less, 25㎛ or less, 24㎛ or less, 23㎛ or less, 22㎛ or less, or 21㎛ or less.

[0073] When the first filler and the second filler are mixed and used as the filler component (C1), the ratio (W1 / W2) of the weight (W1) of the first filler and the weight (W2) of the second filler may be in the range of 0.5 to 2. Specifically, the weight ratio (W1 / W2) may be 0.6 or more, 0.7 or more, 0.8 or more, 0.9 or more, 1 or more, 1.1 or more, 1.2 or more, or 1.3 or more, or 2 or less, 1.9 or less, 1.8 or less, 1.7 or less, 1.6 or less, 1.5 or less, or 1.4 or less.

[0074] The above filler component (C2) (hereinafter referred to as the third filler) may have a moisture content of 250 ppm or more. Specifically, the moisture content of the above third filler may be 300 ppm or more, 350 ppm or more, 400 ppm or more, 450 ppm or more, or 500 ppm or more. If the above third filler contains an excessive amount of moisture, clumping of the filler component may occur and dispersibility may decrease. Consequently, problems such as increased processing time or deterioration of the quality of the cured product of the curable composition may occur; therefore, it is preferable to set the upper limit of the moisture content of the above third filler to 1300 ppm or less, 1200 ppm or less, 1100 ppm or less, 1000 ppm or less, 900 ppm or less, 800 ppm or less, 700 ppm or less, 600 ppm or less, or 500 ppm or less. The moisture content of the third filler above may be the moisture content measured by the Karl Fischer total titration method and the measurement method in the following example.

[0075] The third filler, having an average particle size of less than 10 μm, has a larger specific surface area compared to the filler component (first filler or second filler) having an average particle size of 10 μm or more. Controlling the moisture content of the first or second filler component, which has a relatively small specific surface area, is more difficult than controlling the moisture content of the third filler component, which has a relatively large specific surface area. The present application can control the moisture content of the third filler with a small particle size to the above range so that the moisture content in the main component is 200 ppm or more as described above, and accordingly, a curing speed of the curable composition that satisfies the workability and processability required by the present application can be realized.

[0076] Specifically, the third filler may have an average particle size of 9.5㎛ or less, 9㎛ or less, 8.5㎛ or less, 8㎛ or less, 7.5㎛ or less, 7㎛ or less, 6.5㎛ or less, 6㎛ or less, 5.5㎛ or less, 5㎛ or less, 4.5㎛ or less, 4㎛ or less, 3.5㎛ or less, or 3㎛ or less. The lower limit of the average particle size of the third filler may be 0.001㎛ or more, 0.01㎛ or more, 0.1㎛ or more, 0.5㎛ or more, 1㎛ or more, 1.5㎛ or more, or 2㎛ or more.

[0077] In one example, the third filler may be included in an amount of 10 to 50 weight percent relative to the total filler components. Specifically, the third filler may be 12 weight percent or more, 14 weight percent or more, 16 weight percent or more, 18 weight percent or more, 20 weight percent or more, 22 weight percent or more, 24 weight percent or more, 26 weight percent or more, 28 weight percent or more, or 30 weight percent or more, or 48 weight percent or less, 46 weight percent or less, 44 weight percent or less, 42 weight percent or less, 40 weight percent or less, 38 weight percent or less, 35 weight percent or less, or 33 weight percent or less relative to the total filler components.

[0078] As described below, the moisture contained in the filler component according to the present application can activate the reaction of a catalyst capable of promoting the curing reaction of the main component and the curing agent within the curable composition. By adjusting the moisture content of the filler component included in the curable composition according to the present application to the above range, the curing speed of the curable composition can be appropriately controlled.

[0079] In one example, the subject may include 100 parts by weight or more of a filler component per 100 parts by weight of a resin component. Specifically, the filler component may be included in an amount of 120 parts by weight or more, 140 parts by weight or more, 160 parts by weight or more, 180 parts by weight or more, 200 parts by weight or more, 220 parts by weight or more, 240 parts by weight or more, 260 parts by weight or more, 280 parts by weight or more, or 300 parts by weight or more, per 100 parts by weight of the resin component. The upper limit of the content of the filler component is not particularly limited, but, for example, may be included in an amount of about 900 parts by weight or less, 800 parts by weight or less, 700 parts by weight or less, 600 parts by weight or less, 500 parts by weight or less, 400 parts by weight or less, or 350 parts by weight or less, per 100 parts by weight of the resin component. When the filler component of the present application is included in the above range relative to 100 parts by weight of the resin component, a resin composition with an improved curing speed can be provided.

[0080] In one example, the subject may further include a catalyst. The catalyst may serve to promote the curing reaction between the subject and the curing agent within the curable composition.

[0081] The catalyst that can be used in this application may be a metal catalyst or an amine catalyst that can promote the curing reaction of a curable composition.

[0082] As the metal catalyst mentioned above, organometallic compounds, such as organotin compounds, organobismuth compounds, organozirconium compounds, or organoaluminum compounds, may be applied, but it is preferable to use organotin compounds.

[0083] As the above organotin compound, dialkyltin dicarboxylates such as dibutyltin dilaurate (DBTL), stannous octoacte, dibutyltin diacetate, or dibutyltin dimercaptide may be applied.

[0084] In addition, as amine catalysts, 1,4-diazabicyclo[2,2,2]octane, bis(2-dimethylaminoethyl)ether, trimethylaminoethylethanolamine, N,N,N',N',N''-pentamethyldiethylenetriamine, N,N'-dimethylethanolamine, dimethylaminopropylamine, N-ethylmorpholine, N,N-dimethylaminoethylmorpholine, N,N-dimethylcyclohexylamine, or Tertiary amines such as 2-methyl-2-azanorbonne may be applied, but are not limited thereto.

[0085] In one example of the present application, the weight ratio (B / A) of the filler component (B) to the catalyst (A) may be 2500 or less. Specifically, the weight ratio (B / A) may be 2400 or less, 2300 or less, 2200 or less, 2100 or less, 2000 or less, 1900 or less, 1800 or less, 1700 or less, 1600 or less, 1500 or less, 1400 or less, 1300 or less, 1200 or less, 1100 or less, 1000 or less, 900 or less, or 800 or less. The lower limit of the weight ratio (B / A) may be 500 or more, 550 or more, 600 or more, 650 or more, 700 or more, or 750 or more. When the weight ratio (B / A) of the filler component (B) relative to the catalyst (A) is controlled within the above range, the moisture contained in the filler component activates the reaction of the catalyst, thereby allowing the curing speed of the curable composition to be appropriately controlled within the desired range.

[0086] In one example, the moisture content of the curing agent included in the curable composition of the present application may be 150 ppm or less. In another example, the moisture content of the curing agent may be 145 ppm or less, 140 ppm or less, 135 ppm or less, 130 ppm or less, 125 ppm or less, 120 ppm or less, or 115 ppm or less. The lower limit of the moisture content of the curing agent is not particularly limited, but may be 0 ppm or more, 10 ppm or more, 50 ppm or more, or 100 ppm or more. The moisture content may be the moisture content measured by the Karl Fischer total titration method, or by the measurement method in the examples described below.

[0087] The above curing agent may include a polyisocyanate compound. In one example, when the curing agent includes a polyisocyanate compound, it may include a polyfunctional polyisocyanate compound with three or more functions and a difunctional polyisocyanate compound.

[0088] The above-mentioned difunctional polyisocyanate compound refers to a compound containing two isocyanate groups (-N=C=O) within a single molecule, and the above-mentioned polyfunctional polyisocyanate compound refers to a compound containing three or more isocyanate groups. In another example, the above-mentioned polyfunctional polyisocyanate compound may contain 3 to 10, 3 to 9, 3 to 7, 3 to 6, 3 to 5, or 3 to 4 isocyanate groups.

[0089] The difunctional polyisocyanate compound of the present application may use at least one of an aliphatic difunctional polyisocyanate compound and an aliphatic cyclic difunctional polyisocyanate compound, but it is preferable to use an aliphatic cyclic difunctional polyisocyanate compound.

[0090] Aliphatic difunctional polyisocyanate compounds may be exemplified by, but are not particularly limited to, hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, lysine diisocyanate, norbornane diisocyanate methyl, ethylene diisocyanate, propylene diisocyanate, and tetramethylene diisocyanate. Aliphatic cyclic difunctional polyisocyanates may be exemplified by, but are not particularly limited to, transcyclohexane-1,4-diisocyanate, isophorone diisocyanate, bis(isocyanatemethyl)cyclohexane diisocyanate, and dicyclohexylmethane diisocyanate. Additionally, one or more of the above difunctional polyisocyanate compounds may be used.

[0091] The multifunctional polyisocyanate compound according to the present application may, for example, use a polymer of trimer or higher of the polyisocyanate compound, and may also use a biuret-type compound obtained by reacting the polyisocyanate compound with water. That is, the multifunctional polyisocyanate compound may use at least one selected from the polymer of the polyisocyanate compound and the biuret compound.

[0092] Specifically, examples of polyfunctional polyisocyanate compounds include polymers and biuret-type compounds such as hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, lysine diisocyanate, norbornane diisocyanate methyl, ethylene diisocyanate, propylene diisocyanate, tetramethylene diisocyanate, transcyclohexane-1,4-diisocyanate, isophorone diisocyanate, bis(isocyanatemethyl)cyclohexane diisocyanate, and dicyclohexylmethane diisocyanate.

[0093] In one example of the present application, the polyfunctional polyisocyanate compound may be a trifunctional polyisocyanate compound comprising three isocyanate groups. The trifunctional polyisocyanate compound may be a compound represented by the following chemical formula 3.

[0094] [Chemical Formula 3]

[0095]

[0096] In Chemical Formula 3, L7, L8, and L9 may each independently be an alkylene group, an alkenylene group, or an alkynyl group. The specific types of the alkylene group, alkenylene group, or alkynyl group in the definition of Chemical Formula 3 are as described at the beginning of the means for solving the problem of this specification.

[0097] When the above curing agent comprises a polyisocyanate compound including a polyfunctional polyisocyanate compound with three or more functional groups and a polyfunctional polyisocyanate compound with two functional groups, the polyfunctional polyisocyanate compound with three or more functional groups may be 20 wt% or more, 23 wt% or more, 25 wt% or more, 27 wt% or more, 30 wt% or more, 32 wt% or more, 35 wt% or more, 37 wt% or more, 40 wt% or more, or 42 wt% or more, or 85 wt% or less, 80 wt% or less, 75 wt% or less, 70 wt% or less, 65 wt% or less, 60 wt% or less, 55 wt% or less, 50 wt% or less, or 45 wt% or less.

[0098] In addition, the difunctional polyisocyanate compound may be 15 wt% or more, 17 wt% or more, 20 wt% or more, 22 wt% or more, 25 wt% or more, 28 wt% or more, 30 wt% or more, 32 wt% or more, 35 wt% or more, 37 wt% or more, 40 wt% or more, 42 wt% or more, 45 wt% or more, 47 wt% or more, 50 wt% or more, 52 wt% or more, 55 wt% or more, or 57 wt% or more, or 80 wt% or less, 75 wt% or less, 70 wt% or less, 65 wt% or less, or 60 wt% or less.

[0099] In one example of the present application, the curing agent may further include a filler component. The filler component included in the curing agent may also be a thermally conductive filler. The thermal conductivity, type, and form or ratio of the thermally conductive filler may be the same as those described in the filler component included in the subject matter.

[0100] The particle size of the filler component included in the curing agent may be in the range of 0.001㎛ to 100㎛. In other examples, the average particle size of the filler may be 0.005㎛ or more, 0.01㎛ or more, 0.05㎛ or more, 0.1㎛ or more, 0.5㎛ or more, 1㎛ or more, 1.5㎛ or more, or 2㎛ or more. The upper limit of the average particle size of the filler component included in the curing agent may be about 95㎛ or less, about 85㎛ or less, about 80㎛ or less, about 75㎛ or less, about 70㎛ or less, about 65㎛ or less, about 60㎛ or less, about 55㎛ or less, about 50㎛ or less, about 45㎛ or less, about 40㎛ or less, about 35㎛ or less, about 30㎛ or less, about 25㎛ or less, about 20㎛ or less, about 15㎛ or less, about 10㎛ or less, or about 5㎛ or less.

[0101] In one example, the curing agent may include 100 parts by weight or more of a filler component relative to 100 parts by weight of a polyisocyanate compound. Specifically, in one example, the filler component may include 100 parts by weight or more of a filler component relative to 100 parts by weight of a resin component relative to 100 parts by weight of a polyisocyanate compound. Specifically, the filler component may be included in an amount of 200 parts by weight or more, 300 parts by weight or more, 400 parts by weight or more, 500 parts by weight or more, 600 parts by weight or more, 700 parts by weight or more, 800 parts by weight or more, 900 parts by weight or more, or 1000 parts by weight or more relative to 100 parts by weight of a resin component. The upper limit of the content of the filler component in the above curing agent is not specifically limited, but, for example, it may be included in an amount of about 1500 parts by weight or less, 1450 parts by weight or less, 1400 parts by weight or less, 1350 parts by weight or less, 1300 parts by weight or less, 1250 parts by weight or less, 1200 parts by weight or less, 1150 parts by weight or less, 1100 parts by weight or less, or 1050 parts by weight or less relative to 100 parts by weight of the polyisocyanate compound.

[0102] The above curing agent may additionally include a hygroscopic agent. When the polyisocyanate included in the curing agent comes into direct contact with moisture, amine groups and carbon dioxide are formed, which can cause problems such as surface hardening or increased viscosity of the curable composition. When a hygroscopic agent is included in the curing agent, the storage stability of the curable composition can be ensured, and problems such as surface hardening or increased viscosity of the curable composition caused by moisture can be resolved.

[0103] The above-mentioned hygroscopic agent may be, for example, methyldiphenylethoxysilane, molecular sieves, p-toluenesulfonyl isocyanate (PTSI), p-toluene-sulfonyl isocyanate (TI), acid anhydride esters such as, for example, diethyl malonate and dimethyl succinate, unsaturated silane compounds represented by the following chemical formula 4, and mixtures thereof.

[0104] [Chemical Formula 4]

[0105] R 1 SiR 2 (n) R 3 (3-n)

[0106] In the above chemical formula 4, R 1 It can be an alkenyl group. In one example, the above R 1 It may be vinyl, allyl, propphenyl, isopropphenyl, butenyl, hexenyl, cyclohexenyl, or γ-methacryloxypropyl, etc. In the above chemical formula 4, R 2 and R 3 Each is a hydrogen, alkyl group, aryl group, aralkyl group, hydroxyl group, halogen, amine group, or -R independently bonded to a silicon atom. 4 R5 It can be. In one example, the above R 4 is an oxygen or sulfur atom and R 5 is an alkyl group, aryl group, aralkyl group, acyl group, or -R 6 R 7 and R 6 is an alkylene group or an alkylidene group, and R 7 ... may be an alkoxy group. Also, in the above chemical formula 4, n may be an integer from 1 to 3.

[0107] In the above chemical formula 4, the specific types of alkenyl groups, alkyl groups, aryl groups, aralkyl groups, alkylene groups, alkylidene groups, and alkoxy groups are as described at the beginning of the means for solving the problem of the present specification.

[0108] In the above chemical formula 4, the acyl group is a functional group represented by RC=O, where R represents an alkyl group or an aryl group, and includes, for example, formyl, acetyl, propionyl, or benzoyl, but is not limited thereto.

[0109] In one example of the present application, the unsaturated silane compound that can be used as a hygroscopic agent may be vinyltrimethoxysilane, vinyltriethoxysilane, vinyltripropoxysilane, vinyltriisopropoxysilane, vinyltributoxysilane, vinyltripentoxysilane, vinyltriphenoxysilane, vinyltriacetoxysilane, vinyltris(2-methoxyethoxy)silane, or a mixture of two or more of these, but is not particularly limited thereto.

[0110] Since the above hygroscopic agent can react preferentially with moisture rather than the -NCO groups in the polyisocyanate contained in the curing agent, it can improve the storage stability of the curing agent and the curable composition containing it.

[0111] The above-mentioned desiccant may be included in a range of 50 parts by weight or less based on 100 parts by weight of polyisocyanate. In another example, the above-mentioned desiccant may be included in an amount of 40 parts by weight or less, 30 parts by weight or less, 20 parts by weight or less, 10 parts by weight or less, 5 parts by weight or less, or 4 parts by weight or less based on 100 parts by weight of polyisocyanate, or may be included in an amount of 1 part by weight or more, 2 parts by weight or more, 3 parts by weight or more, or 3.5 parts by weight or more.

[0112] In addition, the above-mentioned curable composition may further include a viscosity modifier, such as a thixotropic agent, a diluent, a dispersant, a surface treatment agent, or a coupling agent, for controlling the required viscosity, for example, to increase or decrease the viscosity or to control the viscosity according to shear force.

[0113] In one example, fumed silica, etc., may be used as the thixotropic agent. The diluent or dispersant is typically used to lower the viscosity of the curable composition, and any of the various types known in the industry that can perform such an action may be used without limitation. The surface treatment agent is for surface treatment of the filler component, and any of the various types known in the industry that can perform such an action may be used without limitation. As for the coupling agent, it may be used to improve the dispersibility of the filler component, and any of the various types known in the industry that can perform such an action may be used without limitation.

[0114] In addition, the above-mentioned curable composition may further include a flame retardant or a flame retardant adjuvant. In this case, known flame retardants may be used without special limitations, and for example, solid filler-type flame retardants or liquid flame retardants may be applied. For example, organic flame retardants such as melamine cyanurate or inorganic flame retardants such as magnesium hydroxide may be used, or liquid-type flame retardant materials (TEP, Triethyl phosphate or TCPP, tris(1,3-chloro-2-propyl)phosphate, etc.) may be used when the amount of included filler component is large. Additionally, a silane coupling agent capable of acting as a flame retardant synergist may be added.

[0116] This application is also an invention regarding a method for manufacturing a curable composition.

[0117] The method for manufacturing a curable composition of the present application includes the step of preparing a main component by mixing a resin component and a filler component, and controlling the moisture content in the filler component to control the moisture content of the main component to 200 ppm or more.

[0118] Specifically, the method for manufacturing the curable composition of the present application can control the moisture content within the filler component to control the moisture content of the main component to 210 ppm or more, 220 ppm or more, 230 ppm or more, 240 ppm or more, 250 ppm or more, 260 ppm or more, 270 ppm or more, 280 ppm or more, 290 ppm or more, 300 ppm or more, 310 ppm or more, 320 ppm or more, 330 ppm or more, 340 ppm or more, 350 ppm or more, 360 ppm or more, or 370 ppm or more, or to 600 ppm or less, 550 ppm or less, 500 ppm or less, 450 ppm or less, 400 ppm or less, 350 ppm or less, 300 ppm or less, 250 ppm or less, or 220 ppm or less.

[0119] In the method for manufacturing the above-mentioned curable composition, the details regarding the resin component and filler component included in the subject matter may be applied in the same way as those described in the above-mentioned curable composition.

[0120] The above filler component can be manufactured by mixing a filler component (C1) having a moisture content of 150 ppm or less and an average particle size of 10 µm or more, and a filler component (C2) having a moisture content of 250 ppm or more and an average particle size of less than 10 µm.

[0121] Specifically, the moisture content of the filler component (C1) may be 145 ppm or less, 140 ppm or less, 135 ppm or less, 130 ppm or less, 125 ppm or less, 120 ppm or less, 115 ppm or less, 110 ppm or less, 105 ppm or less, or 100 ppm or less. The lower limit of the moisture content of the filler component (C1) is not specifically limited, but may be 0 ppm or more, 10 ppm or more, 30 ppm or more, 50 ppm or more, 70 ppm or more, or 90 ppm or more. The moisture content of the filler component (C1) may be the moisture content measured by the Karl Fischer total titration method and the measurement method in the following examples.

[0122] In one example, the filler component (C1) may be composed of a first filler having an average particle size in the range of 30㎛ to 100㎛ and a second filler having an average particle size in the range of 10㎛ to 30㎛. In this case, the moisture content of the filler component (C1) may be the average moisture content of the first filler and the second filler constituting the filler component (C1), and the moisture content of the first filler and the second filler may each be 150 ppm or less.

[0123] In one example, the average particle size of the first filler may be 31㎛ or more, 32㎛ or more, 33㎛ or more, 34㎛ or more, 35㎛ or more, 36㎛ or more, 37㎛ or more, 38㎛ or more, 39㎛ or more, or 40㎛ or more, or 95㎛ or less, 90㎛ or less, 85㎛ or less, 80㎛ or less, 75㎛ or less, 70㎛ or less, 65㎛ or less, 60㎛ or less, 55㎛ or less, 50㎛ or less, 45㎛ or less, or 40㎛ or less.

[0124] In addition, in one example, the average particle size of the second filler may be 11㎛ or more, 12㎛ or more, 13㎛ or more, 14㎛ or more, 15㎛ or more, 16㎛ or more, 17㎛ or more, 18㎛ or more, 19㎛ or more, or 20㎛ or more, or 29㎛ or less, 28㎛ or less, 27㎛ or less, 26㎛ or less, 25㎛ or less, 24㎛ or less, 23㎛ or less, 22㎛ or less, or 21㎛ or less.

[0125] When the first filler and the second filler are mixed and used as the filler component (C1), the ratio (W1 / W2) of the weight (W1) of the first filler and the weight (W2) of the second filler may be in the range of 0.5 to 2. Specifically, the weight ratio (W1 / W2) may be 0.6 or more, 0.7 or more, 0.8 or more, 0.9 or more, 1 or more, 1.1 or more, 1.2 or more, or 1.3 or more, or 2 or less, 1.9 or less, 1.8 or less, 1.7 or less, 1.6 or less, 1.5 or less, or 1.4 or less.

[0126] The above filler component (C2) (third filler) may have a moisture content of 250 ppm or more. Specifically, the moisture content of the third filler may be 300 ppm or more, 350 ppm or more, 400 ppm or more, 450 ppm or more, or 500 ppm or more. If the third filler contains an excessive amount of moisture, clumping of the filler component may occur and problems with reduced dispersibility may arise. Consequently, problems such as increased processing time or reduced quality of the cured product of the curable composition may occur; therefore, it is desirable to set the upper limit of the moisture content of the third filler to 1300 ppm or less, 1200 ppm or less, 1100 ppm or less, 1000 ppm or less, 900 ppm or less, 800 ppm or less, 700 ppm or less, 600 ppm or less, or 500 ppm or less. The moisture content of the third filler above may be the moisture content measured by the Karl Fischer total titration method and the measurement method in the following example.

[0127] The third filler, having an average particle size of less than 10 μm, has a larger specific surface area compared to the filler component (first filler or second filler) having an average particle size of 10 μm or more. Controlling the moisture content of the first or second filler component, which has a relatively small specific surface area, is more difficult than controlling the moisture content of the third filler component, which has a relatively large specific surface area. In the manufacturing method of the present application, specifically, the moisture content of the third filler with a small particle size is controlled to the above range, so that the moisture content in the main component is controlled to be 200 ppm or more as described above, and accordingly, a curing speed of the curable composition that satisfies the workability and processability required of the present application can be realized.

[0128] Specifically, the third filler may have an average particle size of 9.5㎛ or less, 9㎛ or less, 8.5㎛ or less, 8㎛ or less, 7.5㎛ or less, 7㎛ or less, 6.5㎛ or less, 6㎛ or less, 5.5㎛ or less, 5㎛ or less, 4.5㎛ or less, 4㎛ or less, 3.5㎛ or less, or 3㎛ or less. The lower limit of the average particle size of the third filler may be 0.001㎛ or more, 0.01㎛ or more, 0.1㎛ or more, 0.5㎛ or more, 1㎛ or more, 1.5㎛ or more, or 2㎛ or more.

[0129] In one example, the third filler may be included in an amount of 10 to 50 weight percent relative to the total filler components. Specifically, the third filler may be 12 weight percent or more, 14 weight percent or more, 16 weight percent or more, 18 weight percent or more, 20 weight percent or more, 22 weight percent or more, 24 weight percent or more, 26 weight percent or more, 28 weight percent or more, or 30 weight percent or more, or 48 weight percent or less, 46 weight percent or less, 44 weight percent or less, 42 weight percent or less, 40 weight percent or less, 38 weight percent or less, 35 weight percent or less, or 33 weight percent or less relative to the total filler components.

[0130] In one example, the filler component may be included in an amount of 100 parts by weight or more relative to 100 parts by weight of the resin component. Specifically, the filler component may be included in an amount of 120 parts by weight or more, 140 parts by weight or more, 160 parts by weight or more, 180 parts by weight or more, 200 parts by weight or more, 220 parts by weight or more, 240 parts by weight or more, 260 parts by weight or more, 280 parts by weight or more, or 300 parts by weight or more relative to 100 parts by weight of the resin component. The upper limit of the content of the filler component is not particularly limited, but, for example, may be included in an amount of about 900 parts by weight or less, 800 parts by weight or less, 700 parts by weight or less, 600 parts by weight or less, 500 parts by weight or less, 400 parts by weight or less, or 350 parts by weight or less relative to 100 parts by weight of the resin component. When the filler component of the present application is included in the above range relative to 100 parts by weight of the resin component, a resin composition with an improved curing speed can be provided.

[0131] In one example, a catalyst may be additionally incorporated during the manufacturing step of the above-mentioned subject. The catalyst may play a role in promoting the curing reaction between the subject included in the curable composition and the curing agent described below.

[0132] The catalyst that can be incorporated in this application may be a metal catalyst or an amine catalyst, etc., that can promote the curing reaction of the curable composition.

[0133] As the metal catalyst mentioned above, organometallic compounds, such as organotin compounds, organobismuth compounds, organozirconium compounds, or organoaluminum compounds, may be applied, but it is preferable to use organotin compounds.

[0134] As the above organotin compound, dialkyltin dicarboxylates such as dibutyltin dilaurate (DBTL), stannous octoacte, dibutyltin diacetate, or dibutyltin dimercaptide may be applied.

[0135] In addition, as amine catalysts, 1,4-diazabicyclo[2,2,2]octane, bis(2-dimethylaminoethyl)ether, trimethylaminoethylethanolamine, N,N,N',N',N''-pentamethyldiethylenetriamine, N,N'-dimethylethanolamine, dimethylaminopropylamine, N-ethylmorpholine, N,N-dimethylaminoethylmorpholine, N,N-dimethylcyclohexylamine, or Tertiary amines such as 2-methyl-2-azanorbonne may be applied, but are not limited thereto.

[0136] In one example, the method for preparing a curable composition according to the present application may control the content of the catalyst and the filler component such that the weight ratio (B / A) of the filler component (B) to the catalyst (A) is 2500 or less. Specifically, the weight ratio (B / A) may be 2400 or less, 2300 or less, 2200 or less, 2100 or less, 2000 or less, 1900 or less, 1800 or less, 1700 or less, 1600 or less, 1500 or less, 1400 or less, 1300 or less, 1200 or less, 1100 or less, 1000 or less, 900 or less, or 800 or less. The lower limit of the weight ratio (B / A) may be 500 or more, 550 or more, 600 or more, 650 or more, 700 or more, or 750 or more. When the weight ratio (B / A) of the filler component (B) relative to the catalyst (A) is controlled within the above range, the moisture contained in the filler component activates the reaction of the catalyst, thereby allowing the curing speed of the curable composition to be appropriately controlled within the desired range.

[0137] In one example, the method for manufacturing a curable composition according to the present application may additionally perform the step of manufacturing a curing agent having a moisture content of 150 ppm or less by combining a polyisocyanate compound and a hygroscopic agent.

[0138] In the above step, the desiccant may be included in a range of 50 parts by weight or less based on 100 parts by weight of the polyisocyanate compound. In another example, the desiccant may be included in an amount of 40 parts by weight or less, 30 parts by weight or less, 20 parts by weight or less, 10 parts by weight or less, 5 parts by weight or less, or 4 parts by weight or less based on 100 parts by weight of the polyisocyanate, or may be included in an amount of 1 part by weight or more, 2 parts by weight or more, 3 parts by weight or more, or 3.5 parts by weight or more.

[0139] Detailed information regarding the polyisocyanate compound and hygroscopic agent included in the above-mentioned curing agent can be applied in the same way as the description of the polyisocyanate compound and hygroscopic agent in the curing agent composition described above.

[0140] In addition, the curing agent may further include a filler component in addition to the polyisocyanate and hygroscopic agent, and the details regarding the filler component may also be applied in the same way as the details regarding the filler component in the curing agent composition described above.

[0141] In the present application, the moisture content of the curing agent may be manufactured to be 150 ppm or less. In one example, the moisture content of the curing agent may be manufactured to be 145 ppm or less, 140 ppm or less, 135 ppm or less, 130 ppm or less, 125 ppm or less, 120 ppm or less, or 115 ppm or less. The lower limit of the moisture content of the curing agent is not particularly limited, but may be 0 ppm or more, 10 ppm or more, 50 ppm or more, or 100 ppm or more. When the polyisocyanate included in the curing agent comes into direct contact with moisture, amine groups and carbon dioxide are formed, which can cause problems such as surface hardening or an increase in viscosity of the curable composition; therefore, as described above, by controlling the moisture content of the curing agent to 150 ppm or less, problems such as surface hardening or an increase in viscosity of the curable composition caused by moisture can be resolved. The moisture content of the above curing agent can be achieved by adjusting the mixing ratio of the polyisocyanate and hygroscopic agent included in the curing agent as described above.

[0142] The curable composition of the present application can be manufactured by the manufacturing method described above, and a cured product can be formed by the curing reaction of the main component and the curing agent.

[0143] According to the method for preparing the curable composition of the present application, when the main component and the curing agent are mixed at room temperature and under relative humidity conditions within the range of 40 to 60%, the characteristics of compressive strength, Shore A hardness, and TA hardness as described above can be exhibited. According to the method for preparing the curable composition of the present application, advantageous effects can be derived in which the curing speed can be easily determined and the curing speed can be easily controlled to satisfy the workability and processability required of the present application.

[0145] The present application also relates to a battery module comprising the above-mentioned curable composition or the cured product thereof. The battery module comprises a module case and a battery cell present inside the module case. The battery cell may be housed within the module case. One or more battery cells may exist within the module case, and a plurality of battery cells may be housed within the module case. The number of battery cells housed within the module case is not particularly limited and is adjusted according to the application, etc. The battery cells housed within the module case may be electrically connected to each other.

[0146] The battery module of the present application may also include a resin layer in contact with the plurality of battery cells and the module case. The resin layer may include the curable composition or the cured product thereof described above. The curable composition included in the resin layer may, in one example, be a heat dissipation composition. The heat dissipation composition refers to a composition capable of forming a cured product having heat dissipation performance. The term "heat dissipation performance" as used in the present application may refer to a case where the cured product of the heat dissipation composition, manufactured to a thickness of 4 mm, exhibits a thermal conductivity of about 2.5 W / m·K or more when measured along the thickness direction according to ASTM D5470 or ISO 22007-2.

[0147] In other examples, the above thermal conductivity may be 2.6 W / m·K or higher, 2.7 W / m·K or higher, 2.8 W / m·K or higher, 2.9 W / m·K or higher, or 3.0 W / m·K or higher. Since a higher value of the above thermal conductivity indicates higher thermal conductivity, there is no specific upper limit. For example, the above thermal conductivity may be 20 W / m·K or lower, 18 W / m·K or lower, 16 W / m·K or lower, 14 W / m·K or lower, 12 W / m·K or lower, 10 W / m·K or lower, 8 W / m·K or lower, 6 W / m·K or lower, or 4 W / m·K or lower.

[0148] The present application also relates to a battery pack, for example, a battery pack comprising two or more of the aforementioned battery modules. In the battery pack, the battery modules may be electrically connected to each other. The method of configuring the battery pack by electrically connecting two or more battery modules is not particularly limited, and any known method may be applied. Effects of the invention

[0149] The present application can provide a curable composition that can easily determine the curing speed and easily control the curing speed, and a method for manufacturing said curable composition. Specific details for implementing the invention

[0150] The present application will be specifically described through the following examples, but the scope of the present application is not limited by the following examples.

[0152] 1. Measurement of moisture content

[0153] The moisture content was measured by the Karl Fischer total titration method using a measuring instrument (Manufacturer: Metrohm, Model: 831KF Coulometer). The Karl Fischer total titration method is a method for calculating the moisture content of a sample from the number of moles of electrons used to generate iodine molecules, which are formed through electrolysis by the generator electrode of the measuring instrument when the Karl Fischer reagent reacts with moisture in the sample.

[0154] For the above Karl Fischer reagent, the HYDRANAL-Coulomat AK reagent from SIGMA-ALDRICH was used.

[0155] About 0.1 to 1 g of the sample is placed into the vial of the measuring instrument, and the vial is aligned with a blank vial in the Karl Fischer tray. Then, 1 g of the blank and the measured mass of the sample are input into the measuring instrument, and the instrument is operated to create an environment of 120°C inside the vial. After that, the amount of moisture consumed is measured until the moisture vaporized from the sample no longer reacts with the Karl Fischer reagent, and then divided by the measured mass of the sample to determine the moisture content in ppm units.

[0156] The above moisture content (%) was calculated according to Formula 1 below and converted into ppm units.

[0157] [Equation A]

[0158] Moisture content (%) = 100 × Amount of electricity consumed to generate iodine molecules / (10.72 × Mass of sample (mg))

[0159] In the above Equation 1, 10.72 represents the amount of electricity (C / mg) corresponding to 1 mg of water (H2O).

[0160] In the case where the sample to be measured is in liquid form, the moisture content can be obtained in the same way by adding about 20 drops (0.1 to 0.2 g) of the liquid sample to the Karl Fischer solution and reacting it.

[0161] The moisture content of the entire composition can be calculated based on the ratio of the components blended into the composition after measuring the moisture content of the individual components blended for the preparation of the composition in the above manner.

[0163] 2. filler's Particle size measurement

[0164] The average particle size of the filler is the D50 particle size, also known as the so-called median particle size, and this particle size is the particle diameter (median particle size) at the cumulative 50% of the volume-based cumulative curve of the particle size distribution. This particle size is defined as the particle diameter at the point where the cumulative value reaches 50% on the cumulative curve where the total volume is 100%, after calculating the particle size distribution based on volume.

[0165] The above D50 particle size can be measured using Marven’s MASTERSIZER 3000 instrument in accordance with ISO-13320, and ethanol was used as the solvent.

[0167] Examples 1.

[0168] filler Preparation of ingredients

[0169] The filler component was prepared by mixing a filler component (C1) with an average particle size of about 10 μm or more (an alumina with an average particle size (D50 particle size) of about 40 μm (first filler) and an alumina with an average particle size (D50 particle size) of about 20 μm (second filler)) and a filler component (C2) with an average particle size of less than 10 μm (an alumina with an average particle size (D50 particle size) of about 2 to 3 μm (third filler)).

[0170] Alumina has a large specific surface area and pores exist depending on the crystal phase of the particles. These pores may contain a certain level of moisture; since this moisture is recognized as having an adverse effect on the storage stability of the curable composition, it is typically removed before being incorporated into the composition.

[0171] When manufacturing the filler component for the main ingredient, the first and second fillers were each used after undergoing a drying process to remove moisture. Specifically, the first and second fillers were used after drying at a temperature of 200°C for about 24 hours to control the moisture content to 100 ppm.

[0172] When manufacturing the filler component for the main ingredient, the third filler was used by drying alumina with a moisture content of about 200 ppm at a temperature of 200°C for about 24 hours and then leaving it under humidification conditions (room temperature (25°C) and relative humidity of 85%) for about 30 minutes to adjust the moisture content to about 400 ppm. Specifically, about 1 kg of dried alumina was placed in a tray of about 30 cm × 20 cm × 5 cm and left under the humidification conditions. Afterward, alumina was collected from the middle position and middle height, and the moisture content was measured at 30-minute intervals, and the moisture content after 4 hours was measured and used.

[0173] A filler component for the main ingredient was prepared by mixing the first and second fillers as described above and a third filler with a moisture content of 400 ppm in a weight ratio of 4:3:3 (first filler: second filler: third filler).

[0174] For the filler components for the curing agent, the first and second fillers identical to the filler components for the main component were used, and the third filler was also used after removing moisture. That is, when manufacturing the filler components for the curing agent, the third filler was an alumina filler with a moisture content of about 200 ppm, dried at a temperature of 200°C for about 24 hours.

[0175] A filler component for a curing agent was prepared by mixing these first to third fillers in a weight ratio of 4:3:3 (first filler: second filler: third filler).

[0177] Manufacturing of the subject

[0178] A main component was prepared by mixing a polyol, a catalyst (DBTDL: dibutyltin dilaurate), a filler component for the main component, other additives (phosphate-based liquid and solid flame retardants and dispersants), and a colorant in a weight ratio of 30:0.121:93.15:9.31:0.028 (polyol:catalyst:filler component:additive:colorant).

[0179] The above ingredients were put into a paste mixer and dispersed by mixing twice for about 3 minutes under conditions of 600 rpm rotation and 500 rpm rotation, and after checking the heat generated, the main ingredient was prepared by degassing for 4 minutes under conditions of 600 rpm rotation and 200 rpm rotation in a vacuum state (2.5 torr).

[0180] The above polyol is a polycaprolactone polyol, and a reaction of 1,4-butanediol and caprolactone in a weight ratio of 1:2.78 (1,4-butanediol:caprolactone) was used.

[0181] The moisture content (%) of the subject prepared in this way was approximately 213 ppm.

[0183] Manufacturing of curing agents

[0184] The curing agent was prepared by mixing a polyisocyanate compound, a filler component for the curing agent, a hygroscopic agent (VTMO, vinyltrimethoxysilane), and other additives (phosphate-based liquid and solid flame retardants and dispersants) in a weight ratio of 8.54:88.36:0.3:2.8 (polyisocyanate compound: filler component for the curing agent: hygroscopic agent: other additives).

[0185] As the above polyisocyanate compound, a mixture of hexamethylene diisocyanate trimer and hexamethylene diisocyanate monomer in a weight ratio of 42.8:57.2 (hexamethylene diisocyanate trimer: hexamethylene diisocyanate monomer) was used, and the method of mixing the above components was the same as in the case of the main component.

[0186] The moisture content of this curing agent was about 100 ppm.

[0188] Examples 2

[0189] The main component and the hardener were prepared in the same manner as in Example 1, except that alumina with a moisture content adjusted to about 500 ppm was used as the third filler when preparing the main component filler. As the third filler, alumina with an average particle size (D50 particle size) of about 2 to 3 μm, the same as that used in Example 1, was used after adjusting the moisture content to about 500 ppm by leaving it for 1 hour at room temperature (25°C) and under humidification conditions of 85% relative humidity.

[0190] The moisture content of the subject prepared in this way was approximately 240 ppm.

[0192] Examples 3

[0193] The main component and the hardener were prepared in the same manner as in Example 1, except that alumina with a moisture content adjusted to about 600 ppm was used as the third filler when preparing the main component filler. As the third filler, alumina with an average particle size (D50 particle size) of about 2 to 3 μm, the same as that used in Example 1, was used after adjusting the moisture content to about 600 ppm by leaving it for 2 hours at room temperature (25°C) and under humidification conditions of 85% relative humidity.

[0194] The moisture content of the subject prepared in this way was approximately 266 ppm.

[0196] Examples 4

[0197] The main component and the hardener were prepared in the same manner as in Example 1, except that alumina with a moisture content adjusted to about 700 ppm was used as the third filler when preparing the main component filler. As the third filler, alumina with an average particle size (D50 particle size) of about 2 to 3 μm, the same as that used in Example 1, was used after adjusting the moisture content to about 700 ppm by leaving it at room temperature (25°C) and humidification conditions of 85% relative humidity for 5 hours.

[0198] The moisture content of the subject prepared in this way was approximately 293 ppm.

[0200] Examples 5

[0201] The main component and the curing agent were prepared in the same manner as in Example 1, except that alumina with a moisture content adjusted to about 1,000 ppm was used as the third filler when preparing the main component filler. As the third filler, alumina with an average particle size (D50 particle size) of about 2 to 3 μm, the same as that used in Example 1, was used after adjusting the moisture content to about 1,000 ppm by leaving it for 24 hours at room temperature (25°C) and under humidification conditions of 85% relative humidity.

[0202] The moisture content of the subject prepared in this way was approximately 373 ppm.

[0204] Comparative example 1

[0205] The main component and the curing agent were prepared in the same manner as in Example 1, except that alumina with a moisture content of approximately 200 ppm was used as the third filler when preparing the main component filler. The third filler was also an alumina filler with an average particle size (D50 particle size) of approximately 2 to 3 μm and a moisture content of approximately 200 ppm, which was dried at a temperature of 200°C for about 24 hours.

[0206] The moisture content of the subject prepared in this way was approximately 112 ppm.

[0208] Experimental Example 1. Shore A hardness measurement

[0209] With the temperature maintained at approximately 25°C and the relative humidity maintained at approximately 40 to 60%, the main component and the curing agent of each example or comparative example were mixed in a 1:1 volume ratio, and then the hardness (Shore A hardness) was measured at 1-hour intervals starting from the time of mixing.

[0210] The main component and the hardener were each injected into a two-component cartridge in the above volume ratio, and the main component and the hardener were supplied to a static mixer to which the cartridge was applied using pneumatic pressure and mixed to mix the main component and the hardener.

[0211] The above hardness was measured according to ASTM D 2240 standards.

[0212] Hardness (Shore A) was measured using an ASKER durometer hardness instrument. The surface of the mixture of the main component and the hardener was flattened, and a load of approximately 1.5 kg was applied to the surface to measure the initial hardness. The hardness was evaluated by confirming the stabilized measurement value after 5 seconds.

[0213] The measured hardness (Shore A) above is summarized in Table 1 below.

[0214] Examples Comparative example 1 2 3 4 5 1 1hr 0 0 0 0 0 0 2hr 50 20 20 25 25 0 3hr 65 65 60 65 65 10 4hr 75 80 80 80 80 20 5hr 80 90 85 85 85 40 6hr 85 90 90 90 90 50 7hr 90 95 95 95 95 72 8hr 95 95 95 95 95 90

[0216] Experimental Example 2. Hardness by Texture Analyzer ( TA Hardness measurement

[0217] With the temperature maintained at approximately 25℃ and the relative humidity maintained at approximately 40 to 60%, the main component and the curing agent of each example or comparative example were mixed in a 1:1 volume ratio, and then the hardness was measured using a Texture Analyzer at 1-hour intervals starting from the time of mixing (measurement of TA hardness).

[0218] At this time, the mixture of the main component and the hardener was carried out in the same manner as in Experimental Example 1.

[0219] Texture Analyzer (Stable Micro System, TAXT) plus) Using equipment, a pressing jig with a rounded bottom surface was lowered at a speed of 1 mm / s toward a mixture of main component and hardener (1:1 volume ratio), and the maximum force from the moment the pressing jig touched the surface of the mixture until it pressed a point 3 mm vertically from the surface was recorded as TA hardness.

[0220] The maximum force that the Texture Analyzer used in the experiment could measure was about 30 kgf, and if the value exceeded 30 kgf, it was recorded as Over.

[0221] The measured TA hardness (unit: kgf) is summarized in Table 2 below.

[0222] Examples Comparative example 1 2 3 4 5 1 1hr 1.1521 1.3879 1.7121 1.8618 2.0334 0.3152 2hr 10.3162 12.4486 13.6472 16.2188 16.4481 2.5499 3hr 19.4344 20.5811 22.6187 23.8833 25.4834 7.5567 4hr 29.7735 31.7756 Over Over Over 13.1195 5hr Over Over Over Over Over 18.7331 6hr Over Over Over Over Over 24.4642 7hr Over Over Over Over Over Over 8hr Over Over Over Over Over Over

[0224] Experimental Example 3. Compression force measurement

[0225] With the temperature maintained at approximately 25°C and the relative humidity maintained at approximately 40 to 60%, the main component and the curing agent of each example or comparative example were mixed in a volume ratio of 1:1, and then the compressive force was measured at 1-hour intervals starting from the time of mixing.

[0226] At this time, the mixing method is the same as in Experimental Example 1.

[0227] The compressive force was measured three times by pressing the surface of the mixture of the main component and the hardener (1:1 volume ratio) with the bottom surface of the force sensor, and the graph was recorded, with the highest value set as the compressive force. Lab Quest's DFS-BTA was used as the force sensor, and the evaluation was conducted by connecting it to Lab Quest's LQ2-LE interface.

[0228] The maximum measurement value of the force sensor above is 35N, and if the measured compressive force exceeds the 35N range, it is indicated as Over.

[0229] The measured compressive force (unit: N) values ​​are summarized in Table 3 below.

[0230] Examples Comparative example 1 2 3 4 5 1 1hr 10.32 11.08 11.84 13.50 14.49 6.42 2hr Over Over Over Over Over 15.27 3hr Over Over Over Over Over 30.22 4hr Over Over Over Over Over Over 5hr Over Over Over Over Over Over 6hr Over Over Over Over Over Over 7hr Over Over Over Over Over Over 8hr Over Over Over Over Over Over

Claims

Claim 1 A curable composition comprising a main component and a curing agent, wherein the moisture content of the main component is 200 ppm or more and 600 ppm or less, and the filler component included in the main component comprises a first filler and a second filler having a moisture content of 150 ppm or less and an average particle size of 10 μm or more, and a third filler having a moisture content of 250 ppm or more and 1300 ppm or less and an average particle size of less than 10 μm, wherein the main component and the curing agent are mixed under conditions of room temperature and relative humidity within the range of 40 to 60%, and the compressive force is 7 N or more when maintained for 1 hour under the same temperature and relative humidity conditions. Claim 2 A curable composition according to claim 1, wherein the main component and the curing agent are mixed at room temperature and within a range of 40 to 60% relative humidity, and the compressive force exceeds 35N when maintained for 2 hours under the same temperature and relative humidity conditions. Claim 3 A curable composition according to claim 1, wherein the main component and the curing agent are mixed at room temperature and within a range of 40 to 60% relative humidity, and the Shore A hardness is 40 or higher when maintained for 3 hours at the same temperature and relative humidity conditions. Claim 4 In claim 1, a curable composition having a change rate of Shore A hardness of 15 or less according to the following Formula 1: [Formula 1] Change rate of Shore A hardness = 0.2 × (H8-H3) In Formula 1, H8 is the Shore A hardness when the main component and the curing agent are mixed at room temperature and relative humidity within the range of 40 to 60% and maintained for 8 hours at the same temperature and relative humidity conditions, and H3 is the Shore A hardness when the main component and the curing agent are mixed at room temperature and relative humidity within the range of 40 to 60% and maintained for 3 hours at the same temperature and relative humidity conditions. Claim 5 A curable composition according to claim 1, wherein the main component and the curing agent are mixed at room temperature and a relative humidity within the range of 40 to 60%, and the TA hardness is 0.5 kgf or higher when maintained for 1 hour under the same temperature and relative humidity conditions. Claim 6 In claim 1, a curable composition having a rate of change in TA hardness of 5 kgf or more according to the following Formula 2: [Formula 2] Rate of change in TA hardness = 0.5 × (T3-T1) In Formula 2, T3 is the TA hardness when the main component and the curing agent are mixed at room temperature and relative humidity within the range of 40 to 60% and maintained for 3 hours at the same temperature and relative humidity conditions, and T1 is the TA hardness when the main component and the curing agent are mixed at room temperature and relative humidity within the range of 40 to 60% and maintained for 1 hour at the same temperature and relative humidity conditions. Claim 7 A curable composition of claim 1 that is room temperature curable. Claim 8 delete Claim 9 In claim 1, the resin component is a curable composition in which the resin component is a polyol. Claim 10 In claim 1, the subject is a curable composition comprising 100 parts by weight or more of a filler component per 100 parts by weight of a resin component. Claim 11 In claim 1, the subject is a curable composition further comprising a catalyst. Claim 12 A curable composition according to claim 11, wherein the weight ratio (B / A) of the filler component (B) to the catalyst (A) is 2500 or less. Claim 13 In claim 1, the curing agent is a curable composition having a moisture content of 150 ppm or less. Claim 14 In claim 1, the curing agent is a curable composition comprising a polyisocyanate compound. Claim 15 In claim 1, the curing agent is a curable composition comprising a polyfunctional polyisocyanate compound with three or more functional groups and a difunctional polyisocyanate compound. Claim 16 In claim 14, the curing agent is a curable composition further comprising a filler component. Claim 17 In claim 14, the curing agent is a curable composition further comprising a hygroscopic agent. Claim 18 A method for preparing a curable composition comprising the step of preparing a main component by mixing a resin component and a filler component, wherein the filler component included in the main component is prepared by mixing a first filler and a second filler having a moisture content of 150 ppm or less and an average particle size of 10 μm or more, and a third filler having a moisture content of 250 ppm or more and 1300 ppm or less and an average particle size of less than 10 μm, and controlling the moisture content within the filler component to control the moisture content of the main component to 200 ppm or more and 600 ppm or less. Claim 19 delete Claim 20 A method for manufacturing a curable composition according to claim 18, wherein a catalyst is additionally incorporated during the manufacture of the subject. Claim 21 A method for manufacturing a curable composition according to claim 18, further comprising the step of manufacturing a curing agent having a moisture content of 150 ppm or less by combining a polyisocyanate and a hygroscopic agent. Claim 22 A battery module comprising the curable composition of claim 1 or the cured product thereof.

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