Debris reduction apparatus and light source apparatus having the same

Abstract

[Project] To provide a debris reduction device that enables an improved probability of capturing debris, and a light source device equipped with the same. [Solution] A debris reduction device according to one embodiment of the present invention comprises a fixed foil trap. The fixed foil trap comprises a housing portion, a plurality of foils, an inlet hole, and a pressure increasing mechanism. The housing portion comprises an inlet port into which light emitted from a light source enters, an outlet port into which light incident from the inlet port exits, and an internal space through which the light travels. A plurality of foils are fixed in the area of ​​the internal space through which the light travels. The inlet hole is configured to communicate with the internal space of the housing portion, and a transparent gas that is transparent to the light is introduced. The pressure increasing mechanism includes at least one of an inlet-side member disposed at the inlet port such that the opening area of ​​the inlet port is reduced without blocking the travel of light, or an outlet-side member disposed at the outlet port such that the opening area of ​​the outlet port is reduced without blocking the travel of light, and increases the pressure in the internal space.

Description

Technology Field

[0001] The present invention relates to a debris reduction device for capturing debris and a light source device equipped with the same. Background Technology

[0002] Recently, as semiconductor integrated circuits become more miniaturized and highly integrated, the wavelength of light sources for lithography is becoming shorter. As a light source for next-generation semiconductor lithography, in particular, the development of an extreme ultraviolet light source device (hereinafter also referred to as an “EUV light source device”) that emits extreme ultraviolet light with a wavelength of 13.5 nm (hereinafter also referred to as “EUV light”) is underway.

[0003] In EUV light source devices, several methods for generating EUV light (EUV radiation) are known. One of these methods involves generating plasma by heating and exciting an extreme ultraviolet radiation species (hereinafter also referred to as EUV radiation species) and extracting EUV light from the plasma.

[0004] EUV light source devices employing this method are classified into LPP (Laser Produced Plasma) and DPP (Discharge Produced Plasma) types based on the plasma generation method.

[0005] A DPP type EUV light source device applies a high voltage between electrodes supplied with a discharge gas containing EUV radiation species (plasma raw material in the gas phase), generates a high-density plasma by discharge, and utilizes the extreme ultraviolet light emitted therefrom.

[0006] Patent Document 1 discloses a light source device of the DPP method. In this light source device, a liquid plasma material (e.g., tin (Sn) or lithium (Li), etc.) containing EUV radiation species is supplied to the surface of an electrode that generates a discharge, and an energy beam such as a laser beam is irradiated onto the material to vaporize the material, and subsequently, plasma is generated by discharge. This method is sometimes referred to as the LDP (Laser Assisted Discharge Produced Plasma) method.

[0007] In addition, the LPP-type EUV light source device irradiates laser light onto a target material and excites the target material to generate plasma.

[0008] As mentioned above, the EUV light source device is used as a light source device for a semiconductor exposure device (lithography device) in the manufacture of semiconductor devices. Alternatively, the EUV light source device is used as a light source device for an inspection device for masks used in lithography. That is, the EUV light source device is used as a light source device for other optical system devices (utilizing devices) that utilize EUV light.

[0009] In an EUV light source device, debris is emitted from the plasma. The debris includes particles of the plasma source (tin particles if the plasma source is tin). Additionally, when plasma is generated by the DPP method or the LDP method, the debris includes material particles of the discharge electrode that are sputtered along with the generation of the plasma.

[0010] When debris reaches a user device, it can damage or contaminate the reflective film of optical elements within the device, thereby degrading its performance. Consequently, a debris mitigation device (also known as a Debris Mitigation Tool (DMT)) has been proposed to capture emitted debris and prevent it from entering the user device.

[0011] As a debris reduction device, it is common to use a foil trap. In the light source device described in Patent Document 1, a debris reduction device employing a foil trap is used. This technology comprises a foil trap having a rotational function (rotary foil trap) and a foil trap that is fixed without rotating (fixed foil trap).

[0012] A rotary foil trap comprises a plurality of foils (thin films or thin plates) arranged radially around a centrally positioned rotation axis, and captures debris flying from a plasma by rotating the plurality of foils around the rotation axis. Here, the rotation axis is, for example, an axis penetrating approximately the center of the plasma.

[0013] A stationary foil trap captures high-speed moving debris (particularly ions, neutral atoms, and electrons of high-speed moving plasma source) that is not fully captured by a rotary foil trap. The stationary foil trap has a central axis on the same axis as the rotation axis of the rotary foil trap and comprises a plurality of foils (thin films or thin plates) arranged radially from the central axis.

[0014] The multiple foils of a fixed foil trap act to lower the conductance and increase the pressure in a specific area by finely dividing the space in which they are placed. In other words, high-speed debris that is not fully captured by a rotary foil trap has a higher probability of collision in the pressure-raised area of ​​the fixed foil trap, causing its speed to decrease and making it easier to be captured by the foils or the foil supports of the fixed foil trap.

[0015] In addition, depending on the device being used, the EUV light emitted from the EUV light source device is appropriately shaped. For example, when the EUV light source device is used as a light source device for a mask inspection device, an aperture member having an opening of a predetermined shape (equivalent to a heat shield described later) is disposed between the high-temperature plasma and the device being used.

[0016] Patent Document 2 discloses a debris trap having an aperture member. In this debris trap, a fixed foil trap is positioned on the main beam of EUV extraction light emitted from the aperture member and has a shape corresponding to the area through which the EUV extraction light passes. Prior art literature

[0017] Japanese Patent Publication No. 6075096 Japanese Patent Publication No. 6759732 The problem to be solved

[0018] As described above, a fixed foil trap captures debris moving at high speed in the area where the pressure between the foils rises. The probability of capturing this debris depends on the pressure between the foils.

[0019] Accordingly, the present invention aims to provide a debris reduction device capable of improving the probability of capturing debris, and a light source device equipped with the same.

[0020] Taking into account the above circumstances, the objective of the present technology is to provide a debris reduction device that enables an improved probability of capturing debris, and a light source device equipped with the same. means of solving the problem

[0021] To achieve the above objective, a debris reduction device according to one embodiment of the present technology is equipped with a fixed foil trap.

[0022] The above fixed foil trap has a housing part, a plurality of foils, an inlet hole, and a pressure increasing mechanism.

[0023] The above housing part has an inlet port into which light emitted from the light source enters, an outlet port into which the light incident from the inlet port exits, and an internal space through which the light travels.

[0024] The plurality of foils are fixed to the area where the light travels in the internal space.

[0025] The above-mentioned inlet hole is configured to communicate with the internal space of the housing part, and a transparent gas that is transparent to the light is introduced.

[0026] The pressure increasing mechanism comprises at least one of an incident-side member disposed at the incident port such that the opening area of ​​the incident port is reduced without blocking the propagation of the light, or an exit-side member disposed at the exit port such that the opening area of ​​the exit port is reduced without blocking the propagation of the light, and increases the pressure of the internal space.

[0027] In this debris reduction device, multiple foils are arranged within the internal space of the housing. Additionally, a transparent gas is introduced into the internal space. Furthermore, a pressure increasing mechanism is provided to increase the pressure within the internal space. This makes it possible to improve the probability of debris capture.

[0028] At least one of the above-mentioned incident side member or the above-mentioned exit side member may be a cover member having a plate shape and an opening through which the light passes.

[0029] At least one of the above-mentioned incident side member or the above-mentioned exit side member may be a block member formed in a block shape, having an opening through which the light passes, and arranged to fill the internal space.

[0030] The above fixed foil trap may have an electromagnetic field generating part that generates an electric field or magnetic field that moves charged particles excited by the light among the particles contained in the transparent gas in a direction away from the plurality of foils.

[0031] The above internal space may include a buffer space in which the plurality of foils are not present. In this case, the inlet hole may be configured to communicate with the buffer space.

[0032] The above fixed foil trap may be placed between the light source and a user device that uses light emitted from the light source, and between the light source and a monitoring device that monitors the state of light emitted from the light source.

[0033] The above light source may be plasma.

[0034] The above debris reduction device may additionally comprise an inlet port into which light emitted from the light source is incident, an outlet port into which the light incident from the inlet port is emitted, a cover member having an internal space through which the light travels, and a plurality of rotating foils rotatably mounted on the area through which the light travels in the internal space.

[0035] The rotary foil trap may include at least one of an incident-side member disposed at the incident port such that the opening area of ​​the incident port is reduced without blocking the propagation of the light, or an exit-side member disposed at the exit port such that the opening area of ​​the exit port is reduced without blocking the propagation of the light, and may have a pressure increasing mechanism that increases the pressure in the internal space.

[0036] The fixed foil trap and the rotary foil trap may be positioned such that the discharge port of the rotary foil trap and the inlet port of the fixed foil trap face each other. In this case, the debris reduction device may additionally be provided with a connecting member connecting the discharge port of the rotary foil trap and the inlet port of the fixed foil trap.

[0037] The above debris reduction device may additionally comprise an aperture member disposed between the light source and the rotary foil trap and having an opening that extracts a portion of the light emitted from the light source.

[0038] A light source device according to one embodiment of the present technology comprises a plasma generation chamber that excites a light-emitting material to generate plasma, a light extraction unit that extracts light emitted from the plasma, and a debris reduction device having the fixed foil trap.

[0039] The above debris reduction device may additionally have the above rotary foil trap. Effects of the invention

[0040] According to the present invention, it is possible to improve the probability of capturing debris. Furthermore, the effects described herein are not necessarily limited and may be any one of the effects described in the present disclosure. Brief explanation of the drawing

[0041] FIG. 1 is a schematic diagram showing an example of the configuration of a light source device according to one embodiment of the present technology. FIG. 2 is a schematic diagram showing an example of the configuration of a light source device according to one embodiment of the present technology. Figure 3 is a schematic diagram showing an example of the configuration of a rotary foil trap. FIG. 4 is a schematic diagram showing an example of the configuration of a fixed foil trap in a reference example. FIG. 5 is a schematic diagram showing an example of the configuration of a fixed foil trap in a reference example. Figure 6 is a schematic diagram showing an example of the configuration of a fixed foil trap. Figure 7 is a schematic diagram showing an example of the configuration of a fixed foil trap. FIG. 8 is a schematic diagram showing an example of the configuration of a fixed foil trap. Figure 9 is a schematic diagram showing an example of the configuration of a pressure adjustment plate. Figure 10 is a schematic diagram showing an example of the configuration of a pressure adjustment plate. FIG. 11 is a schematic diagram showing the flow of argon gas in a debris reduction device of a comparative example. FIG. 12 is a schematic diagram showing the flow of argon gas in the debris reduction device of the present invention. FIG. 13 is a schematic diagram showing an example of the configuration of a cavity limiting member. FIG. 14 is a schematic diagram showing an example of the configuration of a joint limiting member. FIG. 15 is a schematic diagram showing an example of the configuration of a joint limiting member. FIG. 16 is a schematic diagram showing an example of the configuration of a space connection member. Figure 17 is a schematic diagram showing an example of the configuration of an anterior occlusion part. FIG. 18 is a schematic diagram showing an example configuration in which a fixed foil trap is placed between a rotary foil trap and a monitoring device. FIG. 19 is a schematic diagram showing an example of the configuration of a magnetic field application means. FIG. 20 is a schematic diagram showing an example of the configuration of a magnetic field application means. FIG. 21 is a schematic diagram showing an example of the configuration of a magnetic field application means. FIG. 22 is a schematic diagram showing an example of the configuration of a buffer space. Specific details for implementing the invention

[0042] Hereinafter, embodiments according to the present technology will be described with reference to the drawings.

[0043] [Light source device]

[0044] Figures 1 and 2 are schematic diagrams showing examples of the configuration of a light source device.

[0045] FIG. 1 is a schematic cross-section of a light source device (1) when cut along the horizontal direction at a predetermined height from the installation surface, viewed from the positive side of the Z direction. Hereinafter, the X direction is described as the left-right direction (the positive side of the X-axis is the right, the negative side is the left), the Y direction as the depth direction (the positive side of the Y-axis is the front, the negative side is the inside), and the Z direction as the up-down direction (the positive side of the Z-axis is the upper side, the negative side is the lower side). Of course, regarding the application of this technology, the direction in which the light source device (1) is used is not limited.

[0046] FIG. 2 is a schematic diagram showing a part of the debris reduction device (3) of the light source device (1). FIG. 2 shows a cross-section of the light source device (1) when cut along the XZ plane, viewed from the front.

[0047] The light source device (1) is an LDP-type EUV light source device and emits extreme ultraviolet light (EUV light). The light source device (1) can be used, for example, as a light source device for a lithography device in the manufacture of semiconductor devices, or as a light source device for an inspection device for a mask used in lithography. For example, when the light source device (1) is used as a light source device for a mask inspection device, a portion of the EUV light emitted from the plasma is extracted and directed to the mask inspection device. Then, the mask inspection device uses the EUV light emitted from the light source device (1) as inspection light to perform a blank inspection or pattern inspection of the mask.

[0048] The light source device (1) has a light source section (2), a debris reduction device (3), a debris receiving section (4), a debris guide section (5), a control section (12), a pulse power supply section (13), a laser source (14), a focusing lens (15), a movable mirror (16), and a connection chamber (21).

[0049] [Light Source]

[0050] The light source unit (2) has a chamber (11), containers (CA and CB), discharge electrodes (EA and EB), and motors (MA and MB). In FIG. 1, the light source unit (2) is shown as a rectangular shape with dashed lines.

[0051] The chamber (11) is a housing that accommodates various mechanisms of the light source unit (2). In this embodiment, the chamber (11) has the shape of a rectangular body. The chamber (11) is constructed of a rigid body, such as metal. Of course, the specific shape or material of the chamber (11) is not limited.

[0052] The interior of the chamber (11) is maintained at a reduced pressure atmosphere below a predetermined pressure by a vacuum pump not shown. A feed through (FA and FB) is disposed on the left side wall (11a) of the chamber (11). The feed through (FA and FB) is a sealing member that enables the insertion of wires, etc. into the interior of the chamber (11) while maintaining the reduced pressure atmosphere inside the chamber (11).

[0053] A transparent window (20) is disposed on the front side wall (11b) of the chamber (11). A first window portion (17), which is a through hole, is formed on the right side wall (11c) of the chamber (11). In this embodiment, the transparent window (20) is formed by a material that is transparent to a laser beam. The specific configuration of the shape of the first window portion (17), and the material or shape of the transparent window (20), is not limited.

[0054] The containers (CA and CB) are vessels for storing plasma raw materials. In the present embodiment, the containers (CA and CB) are made of a conductive material. Plasma raw material (SA) is stored in the container (CA). Also, plasma raw material (SB) is stored in the container (CB). Plasma raw materials (SA and SB) are heated liquid raw materials. In the present embodiment, tin (Sn) is used as the plasma raw material (SA and SB). Alternatively, other raw materials capable of generating plasma, such as lithium (Li), may be used.

[0055] The discharge electrodes (EA and EB) have a disc shape. The discharge electrodes (EA and EB) are composed of high-melting-point metals such as molybdenum (Mo), tungsten (W), or tantalum (Ta), for example. The specific materials of the discharge electrodes (EA and EB) are not limited.

[0056] For example, a discharge electrode (EA) is used as a cathode (negative electrode), and a discharge electrode (EB) is used as an anode (positive electrode). The discharge electrodes (EA and EB) are spaced apart from each other. Also, the discharge electrodes (EA and EB) are arranged so that a portion of the periphery of each discharge electrode (EA and EB) is in close proximity. The gap at the position where the periphery of the discharge electrodes (EA and EB) is closest to each other becomes the discharge region (D) by the discharge electrodes (EA and EB).

[0057] In addition, the discharge electrode (EA) is positioned so that the lower part of the discharge electrode (EA) (inside of FIG. 1) is immersed in the plasma material (SA) stored in the container (CA). Likewise, the discharge electrode (EB) is also positioned so that its lower part is immersed in the plasma material (SB).

[0058] The motor (MA) rotates the discharge electrode (EA). The motor (MA) has a rotation shaft (JA). The body of the motor (MA) is positioned on the outside of the left side of the chamber (11), and the rotation shaft (JA), connected to the body, extends from the outside of the chamber (11) to the inside. The end of the rotation shaft (JA) on the inside side of the chamber (11) is connected to the center (center of the circular surface) of the discharge electrode (EA).

[0059] The gap between the rotation axis (JA) and the wall of the chamber (11) is sealed by a seal member (PA). For example, a mechanical seal is used as the seal member (PA). By the seal member (PA), the rotation axis (JA) is rotatably supported while maintaining a reduced pressure atmosphere within the chamber (11).

[0060] Likewise, the motor (MB) has a rotating shaft (JB), and the rotating shaft (JB) is connected to the center of the discharge electrode (EB). Also, the gap between the rotating shaft (JB) and the wall of the chamber (11) is sealed with a sealing member (PB).

[0061] In addition, the discharge electrodes (EA and EB) are arranged such that their respective axes (the extension direction of the rotation axis) are not parallel. Specifically, as shown in FIG. 1, the discharge electrode (EA) is positioned with its front (lower side of FIG. 1) tilted to the right and its inner side (upper side of FIG. 1) tilted to the left. Meanwhile, the discharge electrode (EB) is positioned with its front side tilted to the left and its inner side tilted to the right. The spacing in the depth direction (up-down direction, Z direction in FIG. 1) of the rotation axis (JA and JB) is also narrower on the motor (MA and MB) side and wider on the discharge electrode (EA and EB) side. Furthermore, the discharge electrode (EB), motor (MB), and rotation axis (JB) are positioned slightly to the left of the discharge electrode (EA), motor (MA), and rotation axis (JA).

[0062] The light source unit (2) corresponds to one embodiment of the plasma generation chamber according to the present technology.

[0063] The control unit (12) controls the operation of each part of the light source device (1). For example, the rotational drive of the motors (MA and MB) is controlled by the control unit (12), and the discharge electrodes (EA and EB) are rotated at a predetermined rotational speed. Also, the operation of the pulse power supply unit (13) and the irradiation timing of the laser beam by the laser source (14) are controlled by the control unit (12).

[0064] For example, the control unit (12) is realized by a controller having hardware necessary for the configuration of a computer, such as a processor such as a CPU, GPU, DSP, memory such as ROM or RAM, and a storage device such as an HDD. Specifically, the control unit (12) is realized as a functional block by the CPU of the controller executing a program according to the present technology (for example, an application program).

[0065] The pulse power supply unit (13) generates a discharge in the discharge region (D) by supplying pulse power to the discharge electrodes (EA and EB). A power supply line (QA and QB) is connected to the pulse power supply unit (13). The power supply line (QA) is inserted into the interior of the chamber (11) through a feed-through (FA) and connected to a container (CA). The power supply line (QB) is inserted into the interior of the chamber (11) through a feed-through (FB) and connected to a container (CB).

[0066] The laser source (14) emits an energy beam that vaporizes the plasma source (SA and SB). The laser source (14) is positioned outside the chamber (11). For example, an Nd:YVO4 (Neodymium-doped Yttrium Orthovanadate) laser device is used as the laser source (14). In this case, the laser source (14) emits a laser beam (LB) in the infrared region with a wavelength of 1064 nm. Of course, as long as it is possible to vaporize the plasma source (SA and SB), the specific configuration of the laser source (14), such as the type of device of the laser source (14) or the wavelength of the laser beam (LB) being irradiated, is not limited.

[0067] A focusing lens (15) is positioned in the optical path of a laser beam (LB) outside the chamber (11). As the laser beam (LB) emitted by the laser source (14) enters the focusing lens (15), the spot diameter of the laser beam (LB) is adjusted.

[0068] A movable mirror (16) is positioned in the optical path of a laser beam (LB) outside the chamber (11). The movable mirror (16) is positioned behind a focusing lens (15) in the optical path of the laser beam (LB). That is, the laser beam (LB) passing through the focusing lens (15) is incident on the movable mirror (16).

[0069] A laser beam (LB) incident on the movable mirror (16) is reflected by the movable mirror (16) and passes through the transparent window (20) of the chamber (11). Then, the laser beam (LB) reaches the peripheral portion of the discharge electrode (EA) near the discharge area (D) inside the chamber (11). Additionally, by changing the position of the movable mirror (16), it is possible to adjust the irradiation position of the laser beam (LB) toward the discharge electrode (EA).

[0070] The connection chamber (21) is a housing that accommodates a device such as a debris reduction device (3). The connection chamber (21) has a rectangular shape, and one of its six sides is entirely a rectangular opening. The connection chamber (21) is connected to the chamber (11) such that the frame forming the opening comes into contact with the right side wall (11c) of the chamber (11).

[0071] The connection chamber (21) is constructed of a rigid body, such as metal, for example. Of course, the specific shape or material of the connection chamber (21) is not limited. The interior of the connection chamber (21) is maintained in a reduced pressure atmosphere below a predetermined pressure.

[0072] A second window (27) is formed on the upper part of the right side wall (21a) of the connection chamber (21). The second window (27) is a through hole of a predetermined shape. An EUV light guide hole (28) is formed on the lower part of the right side wall (21a). Additionally, a guide tube (29) is formed to extend from the EUV light guide hole (28) toward the lower right side. Furthermore, an opening (37) for connecting a debris receiving portion (4) is formed on the lower side wall (21b).

[0073] [Operation of the light source]

[0074] The light source unit (2) excites a light-emitting raw material (plasma raw material (SA and SB)) to generate plasma (P). In addition, the light source unit (2) generates EUV light (6) using the plasma (P) as a light-emitting point. Below, specific details regarding the generation of plasma (P) and EUV light (6) by the light source unit (2) will be explained.

[0075] First, the operation of the pulse power supply unit (13) is controlled by the control unit (12), and pulse power is supplied to the container (CA) by the pulse power supply unit (13). The pulse power is supplied through the power supply line (QA).

[0076] The container (CA) is composed of a conductive material. Additionally, plasma source (SA) is stored in the container (CA), and the lower part of the discharge electrode (EA) is immersed in the plasma source (SA). Accordingly, the pulse power supply unit (13), the container (CA), the plasma source (SA), and the discharge electrode (EA) are each electrically connected. That is, pulse power is supplied to the discharge electrode (EA) by the pulse power supply unit (13). Likewise, pulse power is supplied to the discharge electrode (EB) by the pulse power supply unit (13).

[0077] Additionally, the rotational drive of the motor (MA) is controlled by the control unit (12), and the discharge electrode (EA) rotates. As the discharge electrode (EA) rotates, the plasma material (SA) is transported to the vicinity of the discharge area (D) while attached to the surface of the discharge electrode (EA). Likewise, the plasma material (SB) is transported to the vicinity of the discharge area (D) while attached to the surface of the discharge electrode (EB).

[0078] Also, the operation of the laser source (14) is controlled by the control unit (12), and a laser beam (LB) is emitted by the laser source (14). The laser beam (LB) is emitted in a rightward direction and reaches the movable mirror (16) through the focusing lens (15). Additionally, the laser beam (LB) is reflected inward (upper side of FIG. 1) by the movable mirror (16), proceeds into the interior of the chamber (11) through the transparent window (20), and reaches the peripheral portion of the discharge electrode (EA) near the discharge area (D).

[0079] In addition, the discharge electrode (EB) is positioned with its front (lower side of FIG. 1) tilted to the left. Also, the discharge electrode (EB) is positioned slightly to the left of the discharge electrode (EA). Therefore, the optical path of the laser beam (LB) is not blocked by the discharge electrode (EB). By positioning the discharge electrode (EB) in this way, it becomes possible to easily irradiate the discharge electrode (EA) with the laser beam (LB).

[0080] The plasma source (SA) transported to the vicinity of the discharge region (D) by the discharge electrode (EA) is vaporized by irradiation with the laser beam (LB) and becomes a gaseous plasma source (SA) in the discharge region (D). Likewise, the plasma source (SB) also becomes a gaseous plasma source (SB) in the discharge region (D).

[0081] Additionally, as pulse power is supplied to the discharge electrodes (EA and EB), a discharge occurs between the discharge electrodes (EA and EB) (discharge region (D)). Due to the discharge, the gaseous plasma source (SA and SB) present in the discharge region (D) is heated and excited by the current, and plasma (P) is generated.

[0082] Additionally, EUV light (6) is emitted from the plasma (P). A portion of the emitted EUV light (6) (light directed to the right) passes through the first window (17) and is emitted into the interior of the connection chamber (21). In FIG. 1, an example of the light path of the EUV light (6) passing through the first window (17) is shown by a dashed arrow. The plasma (P) corresponds to an embodiment of a light source according to the present invention.

[0083] In addition, in this embodiment, the interior of the chamber (11) and the connection chamber (21) is maintained in a reduced pressure atmosphere below a predetermined pressure. By doing so, it becomes possible to generate a discharge to heat and excite the plasma raw materials (SA and SB) effectively. In addition, it becomes possible to suppress the attenuation of the EUV light (6).

[0084] Debris (DB) is emitted from the plasma (P) at high speed in various directions along with EUV light (6). The debris (DB) contains tin particles, which are plasma raw materials (SA, SB). Additionally, the debris (DB) contains material particles of the discharge electrodes (EA and EB) that are sputtered along with the generation of the plasma (P). Specifically, the debris (DB) contains ions, neutral atoms, and electrons moving at high speed. These debris (DB) gain large kinetic energy through the contraction and expansion process of the plasma (P). A portion of the debris (DB) passes through the first window (17) and is emitted into the interior of the connection chamber (21).

[0085] [Debris Reduction Device]

[0086] The debris reduction device (3) captures debris (DB) emitted from the plasma (P). The debris reduction device (3) has a rotary foil trap (22), a heat shield (23), and a fixed foil trap (24). All of these mechanisms are placed inside the connection chamber (21).

[0087] The heat shield (23) is a plate-shaped member and is positioned parallel to the YZ plane. Additionally, the heat shield (23) is positioned between the plasma (P) and the rotary foil trap (22). An opening (KA) is formed at the upper part of the heat shield (23). Additionally, an opening (KB) is formed at the lower part of the heat shield (23). EUV light (6) emitted by the plasma (P) is incident on the left side of the heat shield (23) and passes through the openings (KA and KB). Therefore, the shape of the EUV light (6) emitted from the right side of the heat shield (23) is a shape that corresponds to the shape of the openings (KA) and (KB).

[0088] In this way, a portion of the EUV light (6) emitted from the plasma (P) is extracted through the apertures (KA and KB). For example, the shape of the apertures (KA and KB) is appropriately set to a shape such as a circle to match the shape of the EUV light (6) to be extracted. Of course, the specific shape of the apertures (KA and KB) is not limited.

[0089] Also, the heat shield (23) is composed of a high melting point metal such as tungsten (W) or molybdenum (Mo). The specific material or shape of the heat shield (23) is not limited. The heat shield (23) corresponds to one embodiment of the aperture member according to the present invention.

[0090] The rotary foil trap (22) captures debris (DB) emitted from the plasma (P). The rotary foil trap (22) has a cover member (25), a plurality of rotary foils (51), an outer ring (52), a central support (53), and a motor (MC).

[0091] FIG. 3 is a schematic diagram showing an example of the configuration of a rotary foil trap (22).

[0092] In FIG. 3, a plurality of rotating foils (51), an outer ring (52), and a central support (53) among the rotating foil traps (22) are shown as viewed from the left side (incident side of EUV light (6)) in FIG. 1 and 2.

[0093] The outer ring (52) is a member having a ring shape. The outer ring (52) is positioned concentrically with the central support (53). The rotation foil (51) is a thin film or a thin plate. Each rotation foil (51) is positioned between the outer ring (52) and the central support (53). Each rotation foil (51) is arranged radially with approximately equal angular spacing relative to the central support (53). Thus, each rotation foil (51) is located on a plane including the central axis line (JM) of the central support (53). The rotation foil (51), the outer ring (52), and the central support (53) are configured such that the position of each member protrudes toward the right side of FIGS. 1 and 2 (inside of FIG. 3) as they move from the outer circumference toward the center.

[0094] The rotating foil (51), outer ring (52), and central support (53) are made of a high melting point metal such as tungsten or molybdenum, for example. The specific composition of the materials of the rotating foil (51), outer ring (52), and central support (53) is not limited.

[0095] The motor (MC) rotates the rotating foil (51), the outer ring (52), and the center support (53). The motor (MC) has a rotation shaft (JC). The body of the motor (MC) is positioned outside the right side of the connection chamber (21), and the rotation shaft (JC) connected to the body extends from the outside of the connection chamber (21) to the inside. The end of the rotation shaft (JC) on the inside side of the connection chamber (21) is connected to the center of the right side of the center support (53).

[0096] The gap between the rotation axis (JC) and the wall of the connection chamber (21) is sealed by a sealing member (PC). By the sealing member (PC), the rotation axis (JC) is rotatably supported while maintaining a reduced pressure atmosphere in the connection chamber (21).

[0097] The central axis line (JM) of the central support (53) coincides with the central axis line of the rotation axis (JC). That is, the rotation axis (JC) can be considered as the rotation axis of the rotation foil (51), the outer ring (52), and the central support (53). The rotation foil (51), the outer ring (52), and the central support (53) rotate as a single unit by the drive of the motor (MC).

[0098] The cover member (25) is a member that surrounds the rotating foil (51), the outer ring (52), and the central support (53). In this embodiment, the cover member (25) has a shape that is generally similar to the rotating foil (51), the outer ring (52), and the central support (53).

[0099] The cover member (25) has an internal space (8), and a rotating foil (51), an outer ring (52), and a central support (53) are arranged in the internal space (8). At the center of the right side of the cover member (25), a through hole (7) protruding to the right is formed, and the rotation shaft (JC) of the motor (MC) is inserted. In addition, a discharge pipe (26) protruding downward is formed at the bottom of the cover member (25).

[0100] Additionally, an opening (KI) is formed on the left side of the cover member (25). The opening (KI) is formed over the entire area of ​​the left side. An opening (KOA) is formed on the upper part of the right side of the cover member (25). An opening (KOB) is formed on the lower part of the right side of the cover member (25).

[0101] The openings (KI, KOA, and KOB) all have a shape that does not block the propagation of the EUV light (6). In FIG. 2, the area where the EUV light (6) propagates is indicated by a dashed line. The shape of the openings (KI, KOA, and KOB) is such that it includes the area where the EUV light (6) propagates. That is, the EUV light (6) passes through the opening (KI), propagates through the internal space (8) of the cover member (25), and passes through the openings (KOA and KOB) to the outside of the rotary foil trap (22), and during this time, the propagation of the EUV light (6) is not blocked by the cover member (25).

[0102] The specific shapes of the openings (KI, KOA, and KOB) are not limited. The opening (KI) corresponds to one embodiment of an inlet port having a cover member according to the present technology. The openings (KOA and KOB) correspond to one embodiment of an outlet port having a cover member according to the present technology.

[0103] FIGS. 4 and 5 are schematic diagrams showing an example of the configuration of a fixed foil trap (24) in a reference example.

[0104] In addition, the fixed foil trap (24) in the present technology will be explained later in the first embodiment.

[0105] In FIG. 4, a fixed foil trap (24) is shown in a state viewed from the positive side in the Z direction (upper side in FIG. 2). Also, in FIG. 4, the housing part (60) is omitted from the illustration. In FIG. 5, a cross-section of the fixed foil trap (24) when cut along the YZ plane is shown in a state viewed from the negative side in the X direction (left side in FIG. 2). Additionally, in FIG. 2, the fixed foil trap (24) is positioned in a slightly tilted state; however, to facilitate understanding of the explanation, FIG. 4 and FIG. 5 describe the fixed foil trap (24) as not being tilted with respect to the X, Y, and Z directions.

[0106] The fixed foil trap (24) has a housing part (60) and a plurality of foils (61). The housing part (60) has the shape of a rectangular body. A rectangular inlet port (62) is formed on the left side of the housing part (60). A rectangular outlet port (63) is formed on the right side of the housing part (60). In addition, the housing part (60) has an internal space (9) as a space enclosed by four sides: the front, inside, upper side, and lower side (right, left, upper, and lower sides in FIG. 6).

[0107] The fixed foil trap (24) is positioned such that the opening (KOA) of the rotary foil trap (22) and the inlet port (62) of the fixed foil trap (24) face each other. The specific configuration, such as the shape or material of the housing part (60), is not limited.

[0108] A plurality of foils (61) are thin films or thin flat plates. Each foil (61) is placed in the internal space (9) of the housing part (60). Each foil (61) is placed at equal intervals in the Y direction. Also, as shown in FIG. 4, each foil (61) is arranged in a radial shape such that the spacing between foils (61) widens as it faces both sides in the Z direction. That is, the central foil (61) is placed parallel to the XZ plane, and the other foils (61) are placed in a slightly inclined state in the Y direction. The upper edge and lower edge (the front edge and inner edge in FIG. 4) of the foil (61) are fixed to the inner surface of the housing part (60).

[0109] The foil (61) is composed of a high melting point metal such as tungsten or molybdenum, for example. The specific composition of the foil (61), such as the material, number of sheets, and arrangement, is not limited.

[0110] The debris receiving section (4) is a container for receiving debris (DB). The debris receiving section (4) has a debris receiving container (31) and heater wiring (34). The debris receiving container (31) has a rectangular shape. On the upper surface of the debris receiving container (31), a rectangular opening surrounded by a flange (32) is formed. The debris receiving container (31) is connected to the connection chamber (21) such that the flange (32) overlaps with the opening (37) of the connection chamber (21). Specifically, for example, the flange (32) is fixed to the connection chamber (21) by screw fastening. Also, the gap between the flange (32) and the connection chamber (21) is sealed by a gasket (33). Of course, the specific configuration, such as the material or shape of the debris receiving container (31) and the method of connection to the connection chamber (21), is not limited.

[0111] The heater wiring (34) heats the debris receiving container (31). In this embodiment, the heater wiring (34) is wrapped around the debris receiving container (31). It is not limited to this, and other heating means may be embedded in the debris receiving container (31).

[0112] The debris guide (5) guides the debris (DB) to the debris receiving section (4). The debris guide (5) has a base plate member (18) and a support (44). The support (44) is configured at the corner of the lower left side inside the connection chamber (21) in a state inclined toward the lower right side.

[0113] The base plate member (18) is a member that serves as a base plate for the debris (DB). The base plate member (18) is placed on top of the support (44). Also, the base plate member (18) has a rectangular shape. The left edge of the base plate member (18) is positioned so that it penetrates the first window portion (17) and protrudes slightly into the interior of the chamber (11). Additionally, the right edge of the base plate member (18) is positioned near the opening (37). The specific configuration of the base plate member (18), such as its shape or material, is not limited.

[0114] [Progress of EUV light]

[0115] The progression of the EUV light (6) emitted from the light source unit (2) is described. The EUV light (6) emitted from the plasma (P) in the light source unit (2) passes through the first window unit (17) and proceeds into the interior of the connection chamber (21). The EUV light (6) first reaches the heat shield (23). Part of the EUV light (6) is blocked from proceeding by the heat shield (23), and part passes through the openings (KA and KB). Accordingly, the EUV light (6) is emitted to the right of the heat shield (23) in a shape corresponding to the shape of the openings (KA and KB).

[0116] Next, the EUV light (6) enters the rotary foil trap (22) through the opening (KI) of the cover member (25). In the internal space (8) of the cover member (25), a plurality of rotary foils (51) are rotatably attached to the area where the EUV light (6) travels in the internal space (8). That is, the plurality of rotary foils (51) rotate over the area where the EUV light (6) travels. For example, the rotary foils (51) rotate by controlling the drive of the motor (MC) by the control unit (12).

[0117] Each rotating foil (51) is positioned parallel to the direction of travel of the EUV light (6). Accordingly, the EUV light (6) is blocked only by the thickness of the rotating foil (51), and most of the EUV light (6) is emitted outside the rotating foil trap (22). With this arrangement configuration of the rotating foil (51), it is possible to maximize the ratio (also called transmittance) of the EUV light (6) passing through the rotating foil trap (22).

[0118] EUV light (6) emitted from the opening (KOA) to the outside of the rotary foil trap (22) enters the entrance port (62) of the fixed foil trap (24). Then, it travels through the internal space (9) of the housing part (60). In the internal space (9), a plurality of foils (61) are fixed in the area of ​​the internal space (9) where the EUV light (6) travels.

[0119] Each foil (61) is positioned parallel to the direction of travel of the EUV light (6). Therefore, the EUV light (6) is blocked only by the thickness of the foil (61), and most of the EUV light (6) is emitted outside the fixed foil trap (24).

[0120] EUV light (6) emitted from the outlet (63) of the fixed foil trap (24) passes through the second window (27) and is emitted toward the utilization device (42). The utilization device (42) is a device that utilizes the EUV light (6). That is, considering the overall operation of the light source device (1), it can be said that light emitted from the plasma (P) is extracted by the second window (27) and utilized by the utilization device (42). The second window (27) corresponds to one embodiment of the light extraction unit according to the present invention.

[0121] Meanwhile, the EUV light (6) passing through the opening (KB) passes through the lower part of the rotary foil trap (22) and is emitted from the opening (KOB). Additionally, the EUV light (6) enters the EUV light guide hole (28) and passes through the inside of the guide tube (29).

[0122] A monitoring device (43) is installed at the exit of the guide tube (29). The monitoring device (43) is a detector that detects EUV light (6) or a measuring device that measures the intensity of EUV light (6). For example, the emission intensity or emission timing of EUV light (6) may be controlled based on the monitoring results by the monitoring device (43).

[0123] [Debris's Capture]

[0124] The specific details regarding the capture of debris (DB) by the debris reduction device (3) are explained. Debris (DB) is emitted from the plasma (P) along with EUV light (6). The debris (DB) is emitted in various directions, and some of it passes through the first window (17) and enters the interior of the connection chamber (21).

[0125] A portion of the debris (DB) that has entered the interior of the connection chamber (21) is deposited on the left side of the heat shield (23). The debris (DB) deposited on the heat shield (23) is melted by radiation from the plasma (P), and when it reaches a certain amount, it becomes a droplet and moves to the bottom of the heat shield (23) by gravity. Then, the debris (DB) is removed from the heat shield (23) and is received in a debris receiving container (31) located below the heat shield (23). FIG. 2 schematically illustrates the debris (DB) that has become a droplet on the heat shield (23) and flows into the debris receiving container (31).

[0126] By placing the heat shield (23), the amount of debris (DB) proceeding to the rotary foil trap (22) is reduced. As a result, the load on the rotary foil trap (22) is reduced. In addition, heat conduction from the plasma (P) to the rotary foil trap (22) is suppressed by the heat shield (23), thereby preventing overheating of the rotary foil trap (22). Furthermore, since the heat shield (23) is made of a high melting point material, deformation caused by the heat of the plasma (P) is minimal.

[0127] Meanwhile, some of the debris (DB) passes through the openings (KA and KB) and proceeds to the right side of the heat shield (23). These debris (DB) enter the rotary foil trap (22). Since the rotary foil (51) is rotating inside the rotary foil trap (22), the rotary foil (51) actively collides with the debris (DB). As a result, the debris (DB) is captured by the rotary foil (51).

[0128] Debris (DB) captured by the rotating foil (51) moves along the radial direction on the rotating foil (51) by centrifugal force, detaches from the end of the rotating foil (51), and attaches to the inner surface of the cover member (25). In this way, since the rotating foil (51) is surrounded by the cover member (25), scattering of debris (DB) into the connection chamber (21) is prevented.

[0129] The cover member (25) is heated by a heating means, which is omitted from the illustration. Alternatively, it is heated by secondary radiation from a heat shield (23) that receives EUV radiation. As the cover member (25) is heated, the debris (DB) attached to the inner surface of the cover member (25) is not solidified and remains in a liquid state. The debris (DB) attached to the inner surface of the cover member (25) is collected at the bottom of the cover member (25) by gravity, discharged from the bottom of the cover member (25) through a discharge pipe (26) and received in a debris receiving container (31). Fig. 2 schematically illustrates the debris (DB) discharged from the discharge pipe (26) flowing into the debris receiving container (31).

[0130] In the rotary foil trap (22), debris (DB) moving at a relatively low speed is captured. Therefore, debris (DB) moving at a high speed is not captured by the rotary foil trap (22) and may pass through the opening (KOA) and proceed to the right side of the rotary foil trap (22). These debris (DB) enter the fixed foil trap (24) from the entrance (62). Then, the debris (DB) collides with the foil (61). In this way, the debris (DB) moving at a high speed that is not fully captured by the rotary foil trap (22) is captured by the fixed foil trap (24).

[0131] [Waste Material Recovery]

[0132] Among the plasma source (SA) (tin) attached to the discharge electrode (EA) and transported to the discharge region (D), the amount of plasma source (SA) that is vaporized by irradiation with an energy beam and used to generate plasma (P) is minimal. Consequently, most of the plasma source (SA) attached to the discharge electrode (EA) returns to the container (CA) unused, but some of it falls due to gravity and does not return to the container (CA). Additionally, due to some problem, some of the liquid plasma source (SA) stored in the container (CA) may overflow from the container (CA). Likewise, some of the plasma source (SB) may overflow from the container (CB).

[0133] The waste material that falls in the direction of gravity in this manner is collected from the support plate member (18). The support plate member (18) is heated by a heating means not shown and maintained at a temperature above the melting point (about 232°C) of the waste material, tin. Thus, the waste material moves along the support surface of the inclined support plate member (18) while remaining in a liquid state and flows into the debris receiving container (31).

[0134] FIG. 2 schematically illustrates a state in which a container (SU) containing waste material and debris (DB) is collected in a debris receiving container (31). Since the waste material is tin and most of the debris (DB) is also tin, the debris receiving container (31) can also be called a tin recovery container.

[0135] During operation of the light source device (1), power is supplied to the heater wiring (34), and the inside of the debris receiving container (31) is heated to a temperature above the melting point of tin. Accordingly, the tin collected inside the debris receiving container (31) becomes liquid.

[0136] When tin solidifies inside the debris receiving container (31), the accumulated debris (DB) at a point within the debris receiving container (31) where the debris (DB) is likely to fall grows like a stalagmite in a stalactite cave. When the accumulated debris (DB) grows into a stalagmite shape, for example, the discharge pipe (26) of the cover member (25) is blocked by the debris (DB), and the debris (DB) accumulates inside the cover member (25). Additionally, the debris (DB) accumulated inside the cover member (25) may come into contact with the rotary foil trap (22), thereby hindering the rotation of the rotary foil trap (22) or damaging the rotary foil trap (22).

[0137] Alternatively, there may be cases where a portion of the openings (KOA and KOB) installed in the cover member (25) is blocked by debris (DB) accumulated within the cover member (25), thereby hindering the progress of EUV light (6) in the openings (KOA and KOB).

[0138] To prevent this from happening, the tin is kept in a liquid state by heating. As a result, the tin is flattened within the debris storage container (31), making it possible to collect the tin while avoiding the growth of stalactites.

[0139] Additionally, when recovering the tin collected in the debris receiving container (31), power supply to the heater wiring (34) is stopped, and heating inside the debris receiving container (31) is stopped. Then, when the temperature of the debris receiving container (31) returns to room temperature and the stored tin is solidified, the air pressure inside the connection chamber (21) is returned to atmospheric pressure. After that, the debris receiving container (31) is removed from the connection chamber (21), and a new debris receiving container (31) in which no tin has collected is installed in the connection chamber (21).

[0140] The tin inside the detached debris receiving container (31) is in a solid state, but by reheating the debris receiving container (31) to make the tin inside a liquid state again, it is possible to remove the tin from the debris receiving container (31). In this way, it becomes possible to reuse the detached debris receiving container (31).

[0141] <First Embodiment>

[0142] With reference to FIGS. 6 to 12, a more detailed embodiment of the light source device (1) according to the present technology will be described. In the following description, the description of parts identical to the configuration and operation of the light source device (1) described above will be omitted or simplified.

[0143] [Fixed Foil Trap]

[0144] Below, a more detailed configuration of the fixed foil trap (24) according to the present technology will be described.

[0145] FIGS. 6 to 8 are schematic diagrams showing examples of the configuration of a fixed foil trap (24).

[0146] In FIG. 6, a cross-section of the fixed foil trap (24) when cut along a plane parallel to the XZ plane is shown as viewed from the front of FIG. 2. In FIG. 7, the fixed foil trap (24) is shown as viewed from the direction of arrow A in FIG. 6. In FIG. 8, a cross-section of the fixed foil trap (24) on the BB plane of FIG. 6 is shown as viewed from the top. Additionally, the housing part (60) is omitted in FIG. 8.

[0147] The fixed foil trap (24) additionally has an inlet hole (70) and a pressure adjustment plate (71). The inlet hole (70) is a hole for introducing gas into the internal space (9) of the fixed foil trap (24). The inlet hole (70) is configured to communicate with the internal space (9) of the housing part (60). Specifically, five inlet holes (70) are arranged at equal intervals in the Y direction at a position slightly to the left (lower side in FIG. 8) from the center of each of the upper surface (front side in FIG. 8) and lower surface (inner side in FIG. 8) of the housing part (60). Of course, the specific configuration, such as the number or location of the inlet holes (70), is not limited. Also, gas supply to the inlet holes (70) is carried out, for example, by a gas supply means not shown in FIG. 2, through a gas pipe not shown that connects the gas supply means and the inlet holes (70). Additionally, when the gas supply means is positioned outside the connection chamber (21), the gas piping is introduced from the gas supply means into the connection chamber (21) through a feed-through installed in the connection chamber (21) so as not to destroy the pressure atmosphere (reduction atmosphere) inside the connection chamber.

[0148] In this embodiment, argon (Ar) gas (80) is introduced through the inlet hole (70). For example, the operation of an unillustrated mechanism (e.g., the gas supply means described above) for introducing argon gas (80) is controlled by the control unit (12). Argon gas (80) is a transparent gas that is transparent to EUV light (6). That is, the propagation of EUV light (6) is not obstructed by the argon gas (80) (e.g., reflection or refraction of EUV light (6) occurs). In addition, other types of transparent gases, such as helium (He) or hydrogen (H2), may be introduced.

[0149] The pressure adjustment plate (71) is a component that increases the pressure in the internal space (9). The pressure adjustment plate (71) is formed in a plate shape and has a circular opening (72) in the center. The pressure adjustment plate (71) is fitted over the entire outlet (63) of the housing part (60). That is, the outlet (63) is sealed by the pressure adjustment plate (71) in a state where the part other than the opening (72) is sealed. In this way, the pressure adjustment plate (71) is placed in the outlet (63) so that the opening area of ​​the outlet (63) becomes smaller.

[0150] Additionally, the shape of the opening (72) of the pressure adjustment plate (71) is set so as not to block the progress of the EUV light (6). In this embodiment, as shown in FIG. 7, since the area of ​​progress of the EUV light (6) at the location of the pressure adjustment plate (71) is circular, the shape of the opening (72) is set to a circular shape with a diameter slightly larger than the area of ​​progress of the EUV light (6). As a result, the progress of the EUV light (6) is not blocked by the pressure adjustment plate (71).

[0151] Additionally, among the EUV light (6) traveling inside the light source device (1), there may be cases where there is EUV light (6) that is finally utilized by the utilization device (42) and EUV light (6) that is not utilized. In such cases, the pressure adjustment plate (71) is configured so as not to block the progress of the necessary light that is finally utilized. That is, a configuration that does not block the progress of the necessary light is included in the configuration that does not block the progress of the EUV light (6) in the present technology.

[0152] The specific shape of the opening (72) of the pressure adjustment plate (71) is not limited. For example, any shape that does not block the propagation of EUV light (6), such as a square shape, may be adopted. The pressure adjustment plate (71) corresponds to one embodiment of the emission side member and cover member according to the present invention. In addition, the pressure increase mechanism according to the present invention is realized by the pressure adjustment plate (71).

[0153] Additionally, each foil (61) has an opening (73). As shown in FIG. 6, the opening (73) has a rectangular shape and is formed at the same location as the inlet hole (70) in the X direction, which is in the center of the foil in the Z direction. That is, as shown in FIG. 8, by each opening (73), a buffer space (74) is formed that has a rectangular shape and is not present in the foil (61). Each inlet hole (70) is connected to the buffer space (74).

[0154] [Configuration with 2 pressure adjustment plates installed]

[0155] Figures 9 and 10 are schematic diagrams showing examples of the configuration of a pressure adjustment plate.

[0156] FIG. 10 is a cross-sectional view of a fixed foil trap (24) in the CC plane of FIG. 9. Also, in FIG. 10, the housing part (60) is omitted from the illustration.

[0157] As shown in FIGS. 9 and 10, a pressure adjustment plate may be installed at each of the inlet port (62) and outlet port (63) of the housing part (60).

[0158] In this example, the fixed foil trap (24) additionally has a pressure adjustment plate (88). The pressure adjustment plate (88) is formed in a plate shape similar to the pressure adjustment plate (71) and has a circular opening (89) in the center. The pressure adjustment plate (88) is fitted over the entire inlet port (62) of the housing part (60). That is, the inlet port (62) is sealed by the pressure adjustment plate (88) in a state where the part other than the opening (89) is sealed. In this way, the pressure adjustment plate (88) is placed in the inlet port (62) so that the opening area of ​​the inlet port (62) becomes smaller.

[0159] The shape of the opening (89) of the pressure adjustment plate (88) is set to be the same as the shape of the opening (72) of the pressure adjustment plate (71) so as not to block the progress of the EUV light (6). In this example, the shape of each opening (72 and 89) is the same circular shape, but the shapes of each may be different. The pressure adjustment plate (88) corresponds to one embodiment of the incident side member and cover member according to the present technology. In addition, the pressure increase mechanism according to the present technology is realized by the pressure adjustment plate (71) and the pressure adjustment plate (88).

[0160] Alternatively, a configuration may be adopted in which the pressure adjustment plate (71) is not installed in the discharge port (63), and the pressure adjustment plate (88) is installed only in the inlet port (62).

[0161] By introducing argon gas (80) into the internal space (9) of the fixed foil trap (24), it becomes possible to increase the probability of capturing debris (DB). Specifically, in the space where the argon gas (80) is present, the speed of the debris (DB) moving is reduced due to the collision between the debris (DB) and the argon gas (80). Also, the direction of the debris (DB) moving changes due to the collision. The debris (DB) whose speed has been reduced and whose direction of moving has changed in this way is captured by the foil (61) or the housing part (60). That is, compared to the case where transparent gas is not introduced into the internal space (9) of the fixed foil trap (24), more debris (DB) is captured.

[0162] In addition, in this embodiment, an inlet hole (70) for introducing argon gas (80) is formed. By doing so, it becomes possible to increase the pressure of the argon gas (80) in the internal space (9).

[0163] FIG. 11 is a schematic diagram showing the flow of argon gas (80) in a debris reduction device (77) of a comparative example.

[0164] In the debris reduction device (77) of the comparative example, argon gas (80) is introduced from the upper side of the gap between the rotary foil trap (78) and the fixed foil trap (79). In FIG. 11, the direction in which the introduced argon gas (80) spreads is schematically illustrated by a dashed arrow.

[0165] Argon gas (80) is introduced, for example, by a gas nozzle not shown. Argon gas (80) introduced from the upper side of the gap diffuses from the interior of the gap toward the lower side. As a result of the diffusion, the pressure of the argon gas (80) decreases at the lower side of the gap. Therefore, the upper side of the gap becomes a region where the pressure of the argon gas (80) is relatively high. In FIG. 11, the region where the pressure of the argon gas (80) is relatively high is shown in a droplet shape.

[0166] The gap is in communication with the internal space (83) of the fixed foil trap (79). As a result, argon gas (80) enters the internal space (83) from the inlet port (81) of the fixed foil trap (79) and diffuses within the internal space (83). However, the argon gas (80) present in the upper part of the gap has a high pressure, so it is easy for it to flow into the upper part of the internal space (83). On the other hand, the argon gas (80) present in the lower part of the gap has a low pressure, so it is difficult for it to flow into the lower part of the internal space (83). Therefore, in the upper part of the internal space (83), the pressure of the argon gas (80) is relatively higher compared to the lower part.

[0167] In this way, a pressure difference of argon gas (80) occurs in the internal space (83) as well. That is, the pressure distribution of argon gas (80) in the propagation area of ​​the EUV light (6) becomes non-uniform, and spatial distribution (non-uniformity) occurs in the debris (DB) capture capability of the fixed foil trap (79).

[0168] Additionally, the gap is in communication with the internal space (82) of the rotary foil trap (78). As a result, argon gas (80) enters the internal space (82) from the opening (KOA) of the rotary foil trap (78) and diffuses within the internal space (82).

[0169] In the fixed foil trap (79), the internal space (83) is divided by each foil (84). As a result, argon gas (80) is relatively easy to flow into compared to the rotary foil trap (78) and relatively difficult to flow into compared to the fixed foil trap (79). That is, in the fixed foil trap (79), sufficient pressure of argon gas (80) is not obtained, so the ability to capture debris (DB) cannot be improved.

[0170] In the debris reduction device (3) of the present embodiment, argon gas (80) is directly introduced into the internal space (9) of the fixed foil trap (24) through the inlet hole (70). As a result, the pressure distribution of the argon gas (80) in the internal space (9) does not become uneven. Furthermore, it is possible to maintain a high pressure of the argon gas (80) in the internal space (9). That is, it is possible to improve the probability of capturing debris (DB) by the fixed foil trap (24).

[0171] Additionally, by arranging the pressure adjustment plate (71), it becomes possible to increase the pressure of the argon gas (80) in the internal space (9). In the fixed foil trap (79) of the comparative example, the incoming argon gas (80) spreads to the right in the internal space (83) and leaks out through the outlet (85). On the other hand, in the fixed foil trap (24) of the present embodiment, since a part of the outlet (63) is sealed by the pressure adjustment plate (71), the leakage of the argon gas (80) is suppressed. Therefore, the pressure of the argon gas (80) in the internal space (9) increases.

[0172] In addition, by arranging the pressure adjustment plate (71), it is also possible to increase the pressure of the argon gas (80) in the rotary foil trap (22).

[0173] FIG. 12 is a schematic diagram showing the flow of argon gas (80) in the debris reduction device (3) of the present invention.

[0174] A pressure regulating plate (71) is not placed in the inlet port (62) of the fixed foil trap (24), and a pressure regulating plate (71) is placed only in the outlet port (63). Therefore, the argon gas (80) introduced from the inlet port (70) flows easily toward the inlet port (62). As a result, the area near the inlet port (62) in the internal space (9) becomes an area where the pressure of the argon gas (80) is relatively high. In FIG. 12, the area where the pressure of the argon gas (80) is relatively high is shown in the shape of a droplet.

[0175] Accordingly, the argon gas (80) flowing out from the inlet port (62) at a relatively high pressure enters the internal space (8) through the opening (KOA) of the rotary foil trap (22) as is. As a result, the argon gas (80) is introduced into the rotary foil trap (22), further improving the debris (DB) capture performance.

[0176] When two pressure adjustment plates (71 and 88) are installed, it becomes difficult for argon gas (80) to leak out from the inlet port (62), and the pressure of argon gas (80) in the internal space (9) increases further. That is, it becomes possible to further improve the probability of capturing debris (DB).

[0177] In addition, in the debris reduction device (3) of the present embodiment, a buffer space (74) is formed in the internal space (9) of the fixed foil trap (24). Argon gas (80) introduced from the inlet hole (70) first diffuses within the buffer space (74). Then, it is introduced into the gap between each foil (61) located on the left and right sides (up and down, X direction in FIG. 8) of the buffer space (74). Then, the argon gas (80) diffuses in the X direction within the gap between the foils (61). In FIG. 8, the direction of diffusion of the argon gas (80) within the gap between the foils (61) is schematically indicated by an arrow.

[0178] The argon gas (80) stays in the buffer space (74) for a while and then flows into the gaps of each foil (61) after the pressure becomes uniform. As a result, it is difficult for there to be a difference in the pressure of the argon gas (80) in each gap. By configuring the buffer space (74), the pressure of the argon gas (80) in the internal space (9) becomes uniform, thereby further improving the probability of capturing debris (DB).

[0179] In addition, in this embodiment, debris is captured by both the rotary foil trap (22) and the fixed foil trap (24). As a result, compared to the case where only one of the rotary foil trap (22) or the fixed foil trap (24) is installed, it is possible to handle both low-speed debris (DB) and high-speed debris, thereby improving the probability of capturing debris (DB).

[0180] In addition, in this embodiment, a heat shield (23) is placed between the plasma (P) and the rotary foil trap (22). By appropriately setting the shape of the opening (KA) of the heat shield (23), it becomes possible to arbitrarily change the shape of the EUV light (6) emitted from the light source device (1). In addition, it becomes possible to reduce the amount of debris (DB) moving toward the rotary foil trap (22). Furthermore, it becomes possible to prevent overheating of the rotary foil trap (22), etc., caused by the heat of the plasma (P).

[0181] In the above, in the debris reduction device (3) according to the present embodiment, a plurality of foils (61) are arranged in the internal space (9) of the housing part (60). Also, transparent gas is introduced into the internal space (9). Additionally, a pressure adjustment plate (71) that increases the pressure in the internal space (9) is arranged. By doing so, it is possible to improve the probability of capturing debris (DB).

[0182] EUV light source devices emit extreme ultraviolet light (EUV light) with a wavelength of approximately 13.5 nm. This EUV light is used, for example, in lithography during the manufacturing of semiconductor devices. Alternatively, EUV light is used as an inspection light to perform mask blank inspection or pattern inspection. In this way, EUV light source devices are also utilized in mask inspection devices. By utilizing EUV light, it becomes possible to support 5 nm to 7 nm processes.

[0183] However, in EUV light source devices, debris is emitted along with the EUV light. When debris reaches the device, it can damage or contaminate the reflective films of optical elements within the device, thereby degrading the device's performance. Consequently, to prevent debris from entering the device, a debris reduction device is built into the EUV light source device to capture the debris. Technology is required to improve the debris capture performance of such debris reduction devices.

[0184] In the debris reduction device (3) of the present invention, the pressure of the argon gas (80) in the internal space (9) is increased by the placement of the pressure adjustment plate (71). By doing so, it becomes possible to achieve high capture performance by the debris reduction device (3).

[0185] <Second Embodiment>

[0186] Referring to FIGS. 13 to 15, a light source device (1) of a second embodiment according to the present technology will be described. In the following description, the description of parts identical to the configuration and operation of the light source device (1) described in the above embodiment will be omitted or simplified.

[0187] [Absence of Joint Restriction]

[0188] FIGS. 13 to 15 are schematic diagrams showing examples of configurations of joint limiting members.

[0189] FIG. 14 shows the fixed foil trap (24) as viewed from the direction of arrow D shown in FIG. 13. FIG. 15 is a cross-sectional view of the fixed foil trap (24) from the EE plane of FIG. 13. Also, the housing part (60) is omitted in FIG. 15.

[0190] As shown in FIGS. 13 to 15, a joint limiting member may be installed in the outlet (63) of the housing part (60).

[0191] In this example, the fixed foil trap (24) has a cavity limiting member (91). The cavity limiting member (91) has a block-like shape. Specifically, the cavity limiting member (91) generally has a rectangular shape. Also, the cavity limiting member (91) has an opening (92). The opening (92) is configured to communicate with two opposing surfaces of the cavity limiting member (91). The shape of the opening (92) is set to be the same as the shape of the opening (72) of the pressure adjustment plate (71) so as not to block the progress of the EUV light (6).

[0192] A joint limiting member (91) is placed in the outlet (63) of the housing part (60). Specifically, the joint limiting member (91) is embedded in the internal space (9) of the housing part (60) so that the opening (92) faces the outlet (63). That is, the joint limiting member (91) is placed to fill the internal space (9). In addition, the specific shape of the joint limiting member (91) is not limited, and any block-shaped shape may be adopted. For example, the shape of the joint limiting member (91) is appropriately set to match the shape of the housing part (60) so that the joint limiting member (91) can be embedded in the housing part (60) without gaps. In addition, the specific thickness of the joint limiting member (91) is not limited.

[0193] A groove is formed in the joint limiting member (91), and each foil (61) is inserted into the groove. FIG. 14 schematically shows the state in which the foil (61) is inserted into the groove. In the area of ​​the internal space (9) where the joint limiting member (91) is present, the foil (61) is fixed to the joint limiting member (91) in this manner. In addition, in the area where the joint limiting member (91) is not present, the foil (61) is fixed to the housing part (60).

[0194] By placing the joint limiting member (91), the volume of the internal space (9) is reduced. Also, it becomes difficult for argon gas (80) to leak out from the outlet (63). As a result, it becomes possible to maintain a higher pressure of argon gas (80) in the fixed foil trap (24).

[0195] The joint limiting member (91) can be seen as having a shape that extends the length of the gas flow direction of the opening (72) of the pressure regulating plate (71). As a result, the conductance of the joint limiting member (91) is smaller than the conductance of the opening (72) of the pressure regulating plate (71) in which the outlet (63) is placed. Therefore, compared to the case where the pressure regulating plate (71) is placed in the outlet (63), it is possible to increase the pressure of the argon gas (80) in the internal space (9) by placing the joint limiting member (91) as described above.

[0196] Any combination as follows may be adopted as the arrangement configuration of the pressure adjustment plate (71) or joint limiting member (91).

[0197] (1) No placement at the inlet port (62), pressure adjustment plate (71) at the outlet port (63)

[0198] (2) No placement in the inlet port (62), joint restriction member (91) in the outlet port (63)

[0199] (3) Pressure adjustment plate (88) at the inlet port (62), no placement at the outlet port (63).

[0200] (4) Pressure adjustment plate (88) at the inlet port (62), pressure adjustment plate (71) at the outlet port (63)

[0201] (5) Pressure adjustment plate (88) at the inlet port (62), joint limiting member (91) at the outlet port (63)

[0202] (6) Joint limiting member (91) in the inlet port (62), no placement in the outlet port (63).

[0203] (7) Joint limiting member (91) at the inlet port (62), pressure adjusting plate (71) at the outlet port (63)

[0204] (8) Joint limiting member (91) at the inlet port (62), joint limiting member (91) at the outlet port (63)

[0205] The joint limiting member (91) corresponds to an embodiment of the incident side member, the exit side member, and the block member according to the present invention. In addition, the pressure increase mechanism according to the present invention is realized by the joint limiting member (91).

[0206] <Other embodiments>

[0207] The present technology is not limited to the embodiments described above and can realize various other embodiments.

[0208] [Lack of spatial connection]

[0209] FIG. 16 is a schematic diagram showing an example of the configuration of a space connection member.

[0210] As shown in FIG. 16, a space connecting member connecting the rotary foil trap (22) and the fixed foil trap (24) may be installed.

[0211] In this example, the debris reduction device (3) has a space connecting member (94). The space connecting member (94) has, for example, a ring shape. Also, the diameter of the opening of the ring of the space connecting member (94) is configured to be the same size as the diameter of the inlet port (62) of the fixed foil trap (24).

[0212] The space connecting member (94) is positioned so that the gap between the rotary foil trap (22) and the fixed foil trap (24) is sealed by the ring portion of the space connecting member (94). That is, the opening (KOA) of the rotary foil trap (22) and the inlet port (62) of the fixed foil trap (24) are connected by the space connecting member (94).

[0213] Accordingly, the argon gas (80) flowing out from the inlet port (62) of the fixed foil trap (24) flows entirely into the rotary foil trap (22) without leaking out to the upper or lower side in the gap. That is, it becomes possible to further increase the pressure of the argon gas (80) in the internal space (8) of the rotary foil trap (22). The space connecting member (94) corresponds to one embodiment of the connecting member according to the present invention.

[0214] [Anterior occlusion]

[0215] Figure 17 is a schematic diagram showing an example of the configuration of an anterior occlusion part.

[0216] As shown in FIG. 17, a front blocking part may be installed in the rotary foil trap (22).

[0217] In this example, the rotary foil trap (22) additionally has a front sealing portion (97). The front sealing portion (97) is configured to seal the opening (KI) on the left side of the cover member (25). That is, the front sealing portion (97) can also be considered as part of the cover member (25). The front sealing portion (97) has a plate shape that is circular when viewed from the left, and has a shape that protrudes to the right as it faces the center of the circular shape.

[0218] Openings (98 and 99) are formed in the anterior occlusion portion (97). The opening (98) has a circular shape and is positioned at the center in the Y direction of the anterior occlusion portion (97) and on the positive side in the Z direction. The opening (99) has a circular shape and is positioned at the center in the Y direction of the anterior occlusion portion (97) and on the negative side in the Z direction. The specific shape or location of the openings (98 and 99) is not limited.

[0219] As a result, since most of the opening (KI) of the cover member (25) is sealed, the outflow of argon gas (80) introduced from the fixed foil trap (24) into the rotary foil trap (22) through the opening (KI) is suppressed. That is, it becomes possible to maintain a high pressure of argon gas (80) in the rotary foil trap (22).

[0220] Additionally, the front occlusion portion (97) is positioned in the opening (KI) such that the opening area of ​​the opening (KI) becomes smaller. Therefore, the front occlusion portion (97) can be considered as a pressure adjustment plate (71) positioned in the rotary foil trap (22). Likewise, the right side of the cover member (25) can be considered as a pressure adjustment plate (71). Alternatively, a cavity limiting member (91) may be positioned in the opening (KI) or on the right side of the cover member (25).

[0221] The front blocking part (97) corresponds to one embodiment of the incident side member and cover member according to the present technology. In addition, the pressure increasing mechanism according to the present technology is realized by the front blocking part (97).

[0222] [Expansion of Fixed Foil Traps]

[0223] FIG. 18 is a schematic diagram showing an example configuration in which a fixed foil trap (24) is placed between a rotary foil trap (22) and a monitoring device (43).

[0224] As shown in FIG. 18, a fixed foil trap (24) may be added between the rotary foil trap (22) and the monitoring device (43).

[0225] In this example, the debris reduction device (3) has a fixed foil trap (24 and 102). The fixed foil trap (24) is positioned between the rotary foil trap (22) and the utilization device (42), just like the fixed foil trap (24) shown in FIG. 1, etc. The fixed foil trap (24) is positioned between the rotary foil trap (22) and the monitoring device (43). That is, the fixed foil trap (24 and 102) can be said to be positioned between the plasma (P) and the utilization device (42), and between the plasma (P) and the monitoring device (43), respectively.

[0226] As a result, debris (DB) is captured by the fixed foil trap (102), and the progression of debris (DB) toward the monitoring device (43) is suppressed. In other words, it is possible to prevent damage to the monitoring device (43) caused by collision with the debris (DB). Additionally, since the argon gas (80) introduced into the fixed foil trap (102) flows into the rotary foil trap (22), it is possible to further increase the pressure of the argon gas (80) in the rotary foil trap (22).

[0227] [Means of imparting a magnetic field]

[0228] FIGS. 19–21 are schematic diagrams showing examples of configurations of magnetic field application means.

[0229] FIG. 19 shows a fixed foil trap (24) in which a pressure adjustment plate (71) is disposed at the discharge port (63), and a magnetic field applying means (105) is installed therein. FIG. 20 shows a fixed foil trap (24) in which a joint limiting member (91) is disposed at the discharge port (63), and a magnetic field applying means (105) is installed therein.

[0230] As shown in FIGS. 19–21, a magnetic field applying means for applying a magnetic field may be installed in the fixed foil trap (24).

[0231] In this example, the fixed foil trap (24) has a magnetic field applying means (105). The magnetic field applying means (105) is a means for applying a magnetic field to the surrounding space. For example, a permanent magnet is used as the magnetic field applying means (105). The magnetic field applying means (105) is positioned above and below the inlet port (62) of the housing part (60).

[0232] The magnetic field application means (105) generates a magnetic field that moves charged particles, which are excited by EUV light (6) among the particles contained in the argon gas (80), in a direction away from the plurality of foils (61). That is, the charged particles travel in various directions between each foil (61), but when a magnetic field is applied, the direction of travel of the charged particles changes, for example, to the left. In this case, the charged particles pass through the inlet port (62) and move outside the fixed foil trap (24). That is, they move in a direction away from the foil (61).

[0233] Alternatively, a magnetic field may be applied to change the direction of travel of the charged particles to the right, thereby moving the charged particles from the discharge port (63) to the outside of the fixed foil trap (24). For example, the direction or strength of the magnetic field can be adjusted by appropriately setting the type (permanent magnet, electromagnet, etc.), position, or number of the magnetic field application means (105).

[0234] The inventors have confirmed that, as the light source device (1) is operated, damage occurs to a part of the foil (61) of the fixed foil trap (24). The cause of this damage is thought to be a collision with the foil (61) by high-energy particles, specifically debris (DB) (e.g., ions, electrons, etc. of plasma source (SA) moving at high speed). However, it is thought that most of these high-energy debris (DB) moving at high speeds become neutral particles by colliding with relatively high-pressure argon gas (80) before colliding with the foil (61), thereby reducing the energy of the debris (DB). Therefore, the main cause of the damage to the foil (61) is not necessarily the collision between the foil (61) and the debris (DB).

[0235] Here, when investigating the damaged areas of the foil (61), it was confirmed that the damage to the foil (61) is particularly significant in the region where the pressure (density) of the argon gas (80) is relatively high and near the region where the EUV light (6) passes. From this trend, it is presumed that the damage to the foil (61) is caused by at least a portion of the argon gas (80) being excited by the irradiation of the EUV light (6) to become charged particles with relatively high energy, and the foil (61) coming into contact with these charged particles of argon.

[0236] In this example, a magnetic field application means (105) is installed so that a magnetic field is applied to an area near the inlet port (62), which is a region where the pressure (density) of the argon gas (80) is relatively high. As a result, the frequency of charged particles colliding with the foil (61) is reduced, thereby suppressing damage to the foil (61).

[0237] Additionally, an electric field imparting means may be installed to generate an electric field that moves charged particles away from the plurality of foils (61). By installing the electric field imparting means, it becomes possible to suppress damage to the foils (61) in the same way. The magnetic field imparting means (105) and the electric field imparting means correspond to one embodiment of the electromagnetic field generating unit according to the present invention.

[0238] [Location of buffer space]

[0239] FIG. 22 is a schematic diagram showing an example of the configuration of a buffer space (74). Also, in FIG. 22, the housing part (60) is omitted.

[0240] The location of the buffer space (74) may be set arbitrarily.

[0241] In this example, the buffer space (74) is configured such that the center of the buffer space (74) in the left-right direction (up-down direction in FIG. 22) is located at a distance (L1) from the left end (bottom in FIG. 22) of the foil (61) and a distance (L2) from the right end (top in FIG. 22). Here, L1 is a smaller value than L2. That is, the buffer space (74) is configured to the left (bottom in FIG. 22) of the center of the internal space (9).

[0242] The foil (61) is arranged in a radial shape so as to extend in the direction of the EUV light (6), and the spacing between the foils (61) is narrower on the side of the EUV light (6) entrance port (62) and wider on the side of the exit port (63). As a result, the argon gas (80) supplied from the inlet hole (70) into the partition space of the foil (61) is difficult to flow toward the entrance port (62) and easy to flow toward the exit port (63). As a result, the pressure in the space near the exit port (63) tends to be higher than the pressure in the space near the entrance port (62). Then, the attenuation of the intensity of the EUV light (6) by the argon gas (80) may, in some cases, not be negligible.

[0243] Here, by positioning the buffer space (74) close to the entrance port (62) side (i.e., making L1 < L2), the pressure of the argon gas (80) in the downstream (right) side of the EUV light (6) passage area can be made relatively low. In FIG. 22, the region with relatively low pressure is shown as a dashed ellipse. As a result, the optical path length in the space with high pressure of the argon gas (80) is shortened, making it possible to suppress the attenuation of the intensity of the EUV light (6) by the argon gas (80). Furthermore, the buffer space (74) may be configured at any location, not limited to this example.

[0244] [Components of the Debris Reduction Device]

[0245] As a configuration of the debris reduction device (3), a configuration in which a rotary foil trap (22) is not installed and only a fixed foil trap (24) is installed may be adopted. Of course, a configuration in which both the rotary foil trap (22) and the fixed foil trap (24) shown in FIG. 1 are installed may also be adopted. Alternatively, multiple rotary foil traps (22) or fixed foil traps (24) may be installed.

[0246] The components of the light source device, light source unit, debris reduction device, rotary foil trap, and fixed foil trap described with reference to each drawing are merely illustrative embodiments and may be modified at will without departing from the spirit of the present technology. In other words, any other configuration for implementing the present technology may be adopted.

[0247] In the present disclosure, where the word “approximately” is used, it is used solely to facilitate understanding of the explanation, and there is no special significance to the use or non-use of the word “approximately.” That is, in the present disclosure, concepts defining shapes, sizes, positional relationships, states, etc., such as “center,” “middle,” “uniform,” “equal,” “identical,” “orthogonal,” “parallel,” “symmetrical,” “extended,” “axial,” “cylindrical shape,” “cylindrical shape,” “ring shape,” “annular shape,” “rectangular shape,” “circular shape,” “rectangular shape,” “rectangular shape,” “square shape,” “block shape,” etc., are “substantially center,” “substantially center,” “substantially uniform,” “substantially equal,” “substantially identical,” “substantially orthogonal,” “substantially parallel,” “substantially symmetrical,” “substantially extended,” “substantially axial,” “substantially cylindrical shape,” “substantially cylindrical shape,” “substantially ring shape,” “substantially annular shape,” “substantially rectangular shape,” “substantially The concept includes "disk shape," "substantially plate shape," "substantially circular shape," "substantially rectangular shape," "substantially square shape," "substantially block shape," etc. For example, states that fall within a predetermined range (e.g., ±10%) based on "completely centered," "completely central," "completely uniform," "completely equal," "completely identical," "completely orthogonal," "completely parallel," "completely symmetrical," "completely extended," "completely axial," "completely cylindrical shape," "completely cylindrical shape," "completely ring shape," "completely toroidal shape," "completely rectangular shape," "completely disc shape," "completely plate shape," "completely circular shape," "completely rectangular shape," "completely square shape," "completely block shape," etc., are also included. Therefore, even if the word "approximately" is not added, the concept expressed by adding the so-called "approximately" may be included. Conversely, regarding the state expressed by adding "approximately," the complete state is not excluded.

[0248] In the present disclosure, expressions using "greater than," such as "greater than A" and "less than A," are expressions that comprehensively include both concepts that include cases equivalent to A and concepts that do not include cases equivalent to A. For example, "greater than A" is not limited to cases that do not include cases equivalent to A, but also includes "A or greater." Furthermore, "less than A" is not limited to "less than A," but also includes "A or less." When implementing the present technology, specific settings, etc., may be appropriately adopted from the concepts included in "greater than A" and "less than A" so that the effects described above are exhibited.

[0249] It is also possible to combine at least two of the feature parts according to the present technology described above. That is, the various feature parts described in each embodiment may be combined arbitrarily without distinction between each embodiment. Furthermore, the various effects described above are merely examples and are not limited thereto, and other effects may be exhibited. Explanation of the symbols

[0250] DB: Debris KA: Opening KB: Opening KI: Opening KOA: Frog KOB: Frog P: Plasma 1: Light source device 2: Light source unit 3: Debris reduction device 6: EUV light 8: Interior space 9: Interior space 22: Rotating foil trap 23: Heat shield 24: Fixed foil trap 25: Missing Cover 27: Second Prostitute 42: Usage device 43: Monitoring device 51: Rotating foil 60: Housing part 61: Foil 62: Entrance 63: Outlet 70: Inlet hole 71: Pressure adjustment plate 74: Buffer space 80: Argon gas 88: Pressure regulating plate 89: Opening 91: Absence of joint restriction 92: Opening 94: Spatial connection absence 97: Anterior obstruction 98: Opening 99: Opening 102: Fixed foil trap 105: Means of imparting a magnetic field

Claims

Claim 1 A debris reduction device for capturing debris emitted from a light source, comprising: an inlet port into which light emitted from the light source is incident; an outlet port into which the light incident from the inlet port is emitted; a housing portion having an internal space through which the light travels; a plurality of foils fixed to the area through which the light travels in the internal space; an inlet hole configured to communicate with the internal space in the housing portion and through which a transparent gas transparent to the light is introduced; an incident-side member disposed at the inlet port such that the opening area of ​​the inlet port is reduced without blocking the travel of the light, or an outlet-side member disposed at the outlet port such that the opening area of ​​the outlet port is reduced without blocking the travel of the light, and a fixed foil trap having a pressure increasing mechanism for increasing the pressure in the internal space. Claim 2 A debris reduction device according to claim 1, wherein at least one of the incident side member or the exit side member is formed in a plate shape and is a cover member having an opening through which light passes. Claim 3 A debris reduction device according to claim 1 or claim 2, wherein at least one of the incident side member or the exit side member is formed in a block shape, has an opening through which the light passes, and is a block member arranged to fill the internal space. Claim 4 A debris reduction device according to claim 1 or claim 2, wherein the fixed foil trap has an electromagnetic field generating part that generates an electric field or magnetic field that moves charged particles excited by light among the particles contained in the transparent gas in a direction away from the plurality of foils. Claim 5 A debris reduction device according to claim 1 or claim 2, wherein the internal space includes a buffer space in which the plurality of foils are not present, and the inlet hole is configured to communicate with the buffer space. Claim 6 A debris reduction device according to claim 1 or claim 2, wherein the fixed foil trap is disposed between the light source and a utilizing device that uses light emitted from the light source, and between the light source and a monitoring device that monitors the state of light emitted from the light source. Claim 7 Claim 1 or Claim 2, wherein the light source is plasma, debris reduction device. Claim 8 A debris reduction device according to claim 1 or claim 2, further comprising: an inlet opening into which light emitted from the light source is incident; an outlet opening into which the light incident from the inlet opening is emitted; a cover member having an internal space through which the light travels; and a rotary foil trap having a plurality of rotary foils rotatably attached to the area through which the light travels in the internal space. Claim 9 A debris reduction device according to claim 8, wherein the rotary foil trap comprises at least one of an incident-side member disposed at the incident port such that the opening area of ​​the incident port is reduced without blocking the propagation of light, or an exit-side member disposed at the exit port such that the opening area of ​​the exit port is reduced without blocking the propagation of light, and having a pressure increasing mechanism for increasing the pressure in the internal space. Claim 10 A debris reduction device according to claim 8, wherein the fixed foil trap and the rotary foil trap are positioned such that the discharge port of the rotary foil trap and the inlet port of the fixed foil trap face each other, and the debris reduction device further comprises a connecting member connecting the discharge port of the rotary foil trap and the inlet port of the fixed foil trap. Claim 11 A debris reduction device according to claim 8, further comprising an aperture member disposed between the light source and the rotary foil trap and having an opening for extracting a portion of the light emitted from the light source. Claim 12 A debris reduction device comprising a plasma generation chamber that generates plasma by exciting a light-emitting raw material, a light extraction unit that extracts light emitted from the plasma, and a fixed foil trap disposed between the plasma generation chamber and the light extraction unit, and a debris reduction device that captures debris emitted from the plasma, wherein the fixed foil trap comprises an inlet port into which light emitted from the plasma is incident, an outlet port into which the light incident from the inlet port is emitted, a housing unit having an internal space through which the light travels, a plurality of foils fixed to the area of ​​the internal space through which the light travels, an inlet hole configured to communicate with the internal space in the housing unit and through which a transparent gas transparent to the light is introduced, and at least one of an inlet side member disposed at the inlet port such that the opening area of ​​the inlet port is reduced without blocking the travel of the light, or an outlet side member disposed at the outlet port such that the opening area of ​​the outlet port is reduced without blocking the travel of the light. A light source device having a pressure increasing mechanism that increases the pressure of the internal space. Claim 13 A light source device according to claim 12, wherein the debris reduction device comprises an inlet port into which light emitted from the plasma is incident, an outlet port into which the light incident from the inlet port is emitted, a cover member having an internal space through which the light travels, and a rotary foil trap having a plurality of rotary foils rotatably attached to the area through which the light travels in the internal space.

Images