In-line deposition system

Abstract

The present invention relates to an inline deposition system comprising: an alignment chamber positioned inline with respect to a load lock chamber into which a substrate is introduced and a deposition chamber for performing deposition on the substrate; a carrier module for transporting the substrate along a transfer rail installed in the alignment chamber; an alignment module installed in the alignment chamber and aligning the substrate with respect to a mask positioned below the carrier module; an alignment shaft movably installed in the alignment module; and a coupling part provided at the end of the alignment shaft and detachably coupled to a connecting part provided in the carrier module; wherein the coupling part comprises: a bottom support part supporting the bottom surface of the connecting part; and a restraining part connecting the bottom support part and the alignment shaft and restraining the horizontal and height direction movement of the connecting part.

Description

Technology Field

[0001] The present invention relates to an inline deposition system in which an alignment chamber for aligning a substrate and a mask and one or more process jambers for performing a deposition process are arranged inline, wherein a carrier loaded with a substrate moves between each chamber to perform each process. Background Technology

[0003] Organic Light Emitting Diodes (OLEDs) are self-luminous devices that emit light by utilizing the electroluminescence phenomenon in which light is emitted when an electric current flows through a fluorescent organic compound. Since a backlight is not required to apply light to non-luminous devices, lightweight and thin flat panel display devices can be manufactured.

[0004] In an organic light-emitting diode, the remaining constituent layers, such as the hole injection layer, hole transport layer, light-emitting layer, electron transport layer, and electron injection layer, excluding the anode and cathode electrodes, are made of organic thin films, and these organic thin films can be formed on a substrate by vacuum deposition or the like.

[0005] Vacuum deposition is performed by placing a substrate inside a vacuum chamber, aligning a mask with a specific pattern onto the substrate, and then applying heat to an evaporation source containing deposition material to deposit the material evaporating from the source onto the substrate.

[0006] To improve the mass production capabilities of organic light-emitting diodes, an inline deposition system is being applied in which a substrate loading chamber, an alignment chamber for aligning the substrate mask, and process chambers for organic deposition or electrode formation are arranged in a line. According to this system, a carrier module (or shuttle) loaded with a substrate is moved between chambers to perform processes in each chamber.

[0007] Due to the recent trend toward larger substrate areas, substrate fixing means, such as electrostatic chucks, are being applied to carrier modules to prevent substrate sagging. The carrier module with the chucked substrate enters the alignment chamber to perform alignment and bonding with the mask, and then moves to the process chamber to perform the deposition process.

[0008] An alignment module is installed in the alignment chamber to align the substrate with respect to the mask. When the carrier module, with the chucked substrate, enters the alignment chamber, the alignment module connects the alignment shaft to the carrier module and performs alignment between the substrate and the mask by moving the carrier module relative to the mask through the actuation of the alignment shaft.

[0009] The carrier module is coupled to the alignment shaft of the alignment module for alignment and separated from the alignment shaft once alignment is complete. To minimize alignment errors between the substrate and the mask, it is crucial to firmly secure the carrier module to the alignment shaft to prevent movement during alignment. Prior art literature

[0011] Published Patent Application No. 10-2014-0015751 (February 7, 2014) The problem to be solved

[0012] The present invention has been devised in consideration of the above points, and its technical objective is to enable a robust coupling between the alignment shaft of an alignment module installed in the alignment chamber of an inline deposition system and a carrier module for substrate transfer, and to simplify the connection process and driving process between the alignment shaft and the carrier module.

[0013] The technical problems that the present invention aims to solve are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art to which the present invention belongs from the description below. means of solving the problem

[0015] According to one embodiment of the present invention, an inline deposition system is disclosed, comprising: an alignment chamber arranged inline with respect to a load lock chamber into which a substrate is introduced and a deposition chamber for performing deposition on the substrate; a carrier module for transporting the substrate along a transfer rail installed in the alignment chamber; an alignment module installed in the alignment chamber and aligning the substrate with respect to a mask arranged below the carrier module; an alignment shaft movably installed in the alignment module; and a coupling part provided at the end of the alignment shaft and detachably coupled to a connection part provided in the carrier module; wherein the coupling part comprises: a bottom support part that supports the bottom surface of the connection part; and a restraining part that connects the bottom support part and the alignment shaft and restrains the horizontal and height direction movement of the connection part.

[0016] Additionally, the restraining member may include: a side restraining member extending upward from the bottom support member and restraining lateral movement of the connecting member; and an upper restraining member formed between the side restraining member and the alignment shaft and restraining vertical movement of the connecting member together with the bottom support member.

[0017] In addition, the above connection may have an area larger than the vertical axis protruding vertically from the carrier module.

[0018] Additionally, the alignment module can be configured to connect the alignment shaft and the carrier module through a downward movement that drives the alignment shaft downward; and a waiting movement that waits until the connecting part is inserted and fixed between the bottom support part and the restraining part of the coupling part according to the horizontal movement of the carrier module.

[0019] The bottom support member and the restraint member may be provided as a pair at positions symmetrical to each other with respect to the alignment shaft.

[0020] Additionally, the alignment module may further include an actuator that horizontally drives the coupling portion with respect to the alignment shaft.

[0021] In addition, a linear guide that guides the linear movement of the restraining part may be installed between the alignment shaft and the restraining part of the coupling part.

[0022] Additionally, the alignment module can be configured to connect the alignment shaft and the carrier module through a waiting operation in which the carrier module enters the alignment chamber and waits until it reaches a preset position while the alignment shaft is in an elevated state; a lowering operation in which the alignment shaft is lowered; and an actuator driving operation in which the actuator is driven so that the coupling part moves horizontally and is coupled with the connecting part.

[0023] In addition, the above-mentioned connecting portions may be installed in multiple numbers along the horizontal movement direction of the carrier module, and the coupling portions may be configured to be coupled simultaneously to the multiple connecting portions by driving the actuator.

[0024] In addition, the bottom support members of the joint portion are provided in a plurality along the arrangement direction of the plurality of connecting portions, and one or more of the bottom support members may be configured to be positioned between adjacent connecting portions to jointly support the bottom surfaces of adjacent connecting portions.

[0025] Meanwhile, according to another embodiment of the present invention, an inline deposition system is disclosed, comprising: an alignment chamber positioned inline with respect to a load lock chamber into which a substrate is introduced and a deposition chamber for performing deposition on the substrate; a carrier module for transporting the substrate along a transfer rail installed in the alignment chamber; an alignment module installed in the alignment chamber and aligning the substrate with respect to a mask positioned below the carrier module; an alignment shaft movably installed in the alignment module; and a coupling part provided at the end of the alignment shaft and coupled to a connecting part provided in the carrier module according to the horizontal movement of the carrier module.

[0026] Furthermore, according to another embodiment of the present invention, an inline deposition system is disclosed, comprising: an alignment chamber positioned inline with respect to a load lock chamber into which a substrate is introduced and a deposition chamber for performing deposition on the substrate; a carrier module for transporting the substrate along a transfer rail installed in the alignment chamber; an alignment module installed in the alignment chamber and aligning the substrate with respect to a mask positioned below the carrier module; an alignment shaft movably installed in the alignment module; a coupling part provided at the end of the alignment shaft and capable of being coupled with a connection part provided in the carrier module; and an actuator installed between the alignment shaft and the coupling part, which moves the coupling part horizontally to be coupled with the connection part. Effects of the invention

[0028] According to an embodiment of the present invention, when the alignment shaft of the alignment module and the connection part of the carrier module are combined, a coupling structure capable of reducing horizontal and vertical flow can be used to minimize the alignment error between the substrate and the mask.

[0029] In addition, there is an advantage in providing a coupling and driving mechanism that can simplify the connection process and the driving process for it when combining the alignment shaft of the alignment module and the connection part of the carrier module. Brief explanation of the drawing

[0031] FIG. 1 is a schematic diagram showing the configuration of an inline deposition system according to one embodiment of the present invention. FIG. 2 is a cross-sectional view showing the configuration of an alignment module according to one embodiment of the present invention. FIG. 3 is a plan view showing the process of the carrier module illustrated in FIG. 2 being coupled to the coupling part. FIG. 4 is an operational state diagram showing the operation of an alignment module according to one embodiment of the present invention. FIGS. 5 and 6 are drawings showing the configuration of a coupling portion of an alignment module according to another embodiment of the present invention. FIG. 7 is an operational state diagram showing the operation of an alignment module according to another embodiment of the present invention. Specific details for implementing the invention

[0032] The present invention is capable of various modifications and may have various embodiments; specific embodiments are illustrated in the drawings and described in detail in the detailed description. However, this is not intended to limit the present invention to specific embodiments, and it should be understood that it includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the present invention. In describing the present invention, detailed descriptions of related prior art are omitted if it is determined that such detailed descriptions may obscure the essence of the present invention.

[0033] Terms such as "first," "second," etc., may be used to describe various components, but said components should not be limited by said terms. These terms are used solely for the purpose of distinguishing one component from another.

[0034] The terms used in this application are used merely to describe specific embodiments and are not intended to limit the invention. The singular expression includes the plural expression unless the context clearly indicates otherwise. In this application, terms such as "comprising" or "having" are intended to indicate the presence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0035] Hereinafter, embodiments of an inline deposition system according to the present invention will be described in detail with reference to the accompanying drawings. In describing with reference to the accompanying drawings, identical or corresponding components are given the same reference numerals, and redundant descriptions thereof will be omitted.

[0036] FIG. 1 is a schematic diagram showing the configuration of an inline deposition system according to one embodiment of the present invention.

[0037] Referring to FIG. 1, the inline deposition system according to the present embodiment includes a load lock chamber (10), an alignment chamber (40), and a process chamber (50) arranged inline.

[0038] Between the load lock chamber (10) and the alignment chamber (30), a transfer chamber (20) for transferring a substrate (1, see FIG. 3), an attach chamber (30) for attaching the transferred substrate to a carrier module (100), etc., may be arranged in line (in a row).

[0039] When a substrate (1) is fed into the load lock chamber (10), a transfer robot (21) installed in the transfer chamber (20) transfers the substrate (1) from the load lock chamber (10) to the attach chamber (30) so that it is attached to the carrier module (100). A loading pin (not shown) may be installed in the attach chamber (30) to support the transferred substrate (1) and raise it to the position of the carrier module (100).

[0040] An alignment module (70, see FIG. 2) for aligning between the substrate (1) and the mask (2) is installed in the alignment chamber (40), and an evaporation source for depositing organic material is installed in the process chamber (50). In this embodiment, a case in which one process chamber (50) is provided is illustrated, but a configuration in which multiple process chambers are arranged in a row to sequentially deposit different organic materials is also possible.

[0041] A transfer rail (61) for transporting a carrier module (100) may be installed in the attachment chamber (30) and the alignment chamber (40). Additionally, a lower transfer rail (62) for transporting a mask shuttle (not shown) that supports a mask (2) may be installed in the alignment chamber (40) and the process chamber (50). The transfer rail (61) and the lower transfer rail (62) may have the form of a magnetic levitation rail, in which case an electromagnet is provided in the magnetic levitation rail, and a permanent magnet or an electromagnet may be installed in the carrier module (100) to enable magnetic levitation movement relative to the magnetic levitation rail.

[0042] In the attachment chamber (30), the carrier module (100) with the substrate (1) attached moves along the transfer rail (61) into the alignment chamber (40), and the alignment module (70) moves the carrier module (100) relative to the mask (2) of the mask shuttle to perform alignment between the substrate (1) and the mask (2).

[0043] After alignment is complete, the carrier module (100) is fixed to the mask shuttle, and the mask shuttle moves along the lower transfer rail (62) to the process chamber (50) to perform the deposition process. However, in addition to this configuration, a configuration in which the lower transfer rail (62) is not installed and the transfer rail (61) extends to the process chamber (50) is also possible. In this case, after the mask (2) is bonded to the carrier module (100), the carrier module (100) is transferred to the process chamber (50) via the transfer rail (61) to perform the deposition process.

[0044] FIG. 2 is a cross-sectional view showing the configuration of an alignment module according to an embodiment of the present invention, showing the internal structure of the alignment chamber (40) shown in FIG. 1. FIG. 3 is a plan view showing the process of the carrier module shown in FIG. 2 being coupled to the coupling part.

[0045] Referring to FIG. 2, the alignment module (70) is installed on the upper part of the alignment chamber (40), and the alignment module (70) is equipped with an alignment shaft (805) that can be coupled with the carrier module (100). The alignment shaft (80) is configured to be movable in various directions, such as the Z-axis direction and the XY-axis direction, with respect to the operation of the driving device within the alignment module (70).

[0046] The alignment module (70) moves the carrier module (100) by moving the alignment shaft (80) while the alignment shaft (780) and the carrier module (100) are combined, and can perform alignment between the substrate (1) of the carrier module (100) and the mask (2) located below it according to the movement of the carrier module (100).

[0047] The carrier module (100) may be equipped with a fixing chuck (e.g., an electrostatic chuck) for fixing a substrate (1), a battery for supplying power to the fixing chuck, and a wireless communication module for busbar communication with the controller of the inline deposition system.

[0048] The carrier module (100) is provided with a connecting portion (110), and the end of the alignment shaft (80) is provided with a connecting portion (90) that is detachably coupled to the connecting portion (110) of the carrier module (100). The alignment shaft (80) may be provided as a left and right pair, and the connecting portion (110) and the connecting portion (90) may also be provided as a pair.

[0049] The connecting portion (110) may be formed on a vertical axis (111) protruding vertically from the carrier module (100) and may have an area larger than that of the vertical axis (111). A supporting portion (112) that is supported and fixed to the upper surface of the carrier module (100) may be formed at the lower part of the vertical axis (111).

[0050] The connecting part (90) includes a bottom support part (91) and a restraining part (92).

[0051] The bottom support member (91) is configured to support the bottom surface of the connecting member (110). The restraining member (92) connects the bottom support member (91) and the alignment shaft (80) and is configured to restrain the horizontal and height-direction movement of the connecting member (110).

[0052] The restraining member (92) may have a configuration including a side restraining member (93) and an upper high-speed member (94). The side restraining member (93) is extended upward from the bottom support member (91) and is configured to restrain the lateral direction of the connecting member (110). The upper restraining member (94) is formed between the side restraining member (93) and the alignment shaft (80) and is configured to restrain the vertical movement of the connecting member (110) together with the bottom support member (91).

[0053] The bottom support member (91) and the restraining member (92) may be provided as a pair at positions symmetrical to each other with respect to the alignment shaft (80), and accordingly, the flow of both directions of the connecting member (110) may be restrained.

[0054] As shown in FIG. 3, a pair of connecting parts (110) may have a shape that extends continuously for a certain length on the upper part of the carrier module (100), and may be formed to have a transport direction (arrow direction in FIG. 3) in the longitudinal direction. A pair of coupling parts (110) may also be configured in a corresponding shape so that the connecting parts (110) are inserted into the internal space of the coupling part (90) and coupled according to the horizontal movement of the carrier module (100).

[0055] FIG. 4 is an operational state diagram showing the operation of an alignment module according to one embodiment of the present invention.

[0056] In state (a) of FIG. 4, the alignment module (70) performs a downward movement to drive the alignment shaft (80) downward, and this is performed until the coupling part (90) is positioned at a height corresponding to the height of the carrier module (100) as in (b).

[0057] Next, the alignment module (70) connects the alignment shaft (80) and the carrier module (100) by performing a waiting operation in which the connecting part (110) is inserted and fixed between the bottom support part (91) and the restraining part (92) of the coupling part (90) as in (c) during the horizontal movement of the carrier module (110).

[0058] When the connection between the alignment shaft (80) and the carrier module (100) is completed, as in (d), the alignment module (100) moves the carrier module (100) to the alignment height by raising the alignment shaft (80) in the vertical direction (Z-axis direction), and moves the carrier module (100) in the horizontal direction (e.g., X, Y, θ directions, etc.) to perform an alignment operation for the mask (2). In this process, the bottom support part (91) and the restraining part (92) of the coupling part (90) restrain the vertical and horizontal movement of the connecting part (110), thereby minimizing the effect of the movement of the connecting part (110) on the alignment precision.

[0059] In addition, since connection with the carrier module (100) is possible solely through the vertical driving of the alignment shaft (80), the connection process and driving process between the alignment shaft (80) and the carrier module (100) can be simplified, and the driving device used therein can be configured compactly.

[0060] When alignment between the substrate (1) and the mask (2) is completed, the carrier module (100) can release the connection between the connecting part (110) and the connecting part (90) of the alignment shaft (80) by moving horizontally in the direction of travel.

[0061] FIGS. 5 and 6 are drawings showing the configuration of a coupling part of an alignment module according to another embodiment of the present invention.

[0062] According to the present embodiment, the coupling member (90) is installed so as to be movable with respect to the alignment shaft (80). An actuator (120) for horizontally driving the coupling member (90) with respect to the alignment shaft (80) may be installed between the coupling member (90) and the alignment shaft (80). The actuator (120) may have the form of a driving device using a rack-pinion mechanism or may include various other types of driving devices. The actuator (120) may be electrically connected to the alignment module (70) and configured to operate by an electrical signal applied from the alignment module (70).

[0063] An actuator (120) may be installed between the alignment shaft (80) and the upper restraint (96), and a linear guide that guides the linear movement of the restraint (92) may be installed between the alignment shaft (80) and the restraint (92).

[0064] As the coupling part (90) moves horizontally by the driving of the actuator (120), the connecting part (110) is inserted between the bottom support part (91) and the restraining part (92) of the coupling part (90), thereby forming a connection between the coupling part (90) and the connecting part (110).

[0065] FIG. 6 shows a top view of the process in which the coupling part (90) according to the present embodiment is coupled to the connecting part of the carrier module (100), and for convenience of illustration, the upper restraining part (94) is omitted.

[0066] According to this, the connecting members (110) may be installed in multiple numbers along the horizontal movement direction of the carrier module (100), and according to the present embodiment, the connecting members (110) are arranged in four numbers along the horizontal direction, with one pair on the left and one on the right, so that a total of eight connecting members (110) are placed on the carrier module (100).

[0067] The coupling member (90) is configured to be coupled simultaneously with a plurality of connecting members (110) by driving an actuator (120). To this end, the bottom support members (91) of the coupling member (90) are provided in a plurality along the arrangement direction of the plurality of connecting members (110), and one or more of the bottom support members (91) may be configured to support the bottom surface of an adjacent connecting member (91) together. According to the present embodiment, one coupling member (90) includes five bottom support members (91), and three of the bottom support members (91) are arranged between adjacent connecting members (110) to support the bottom surface of the adjacent connecting member (110) together.

[0068] In this case, a pair of left and right connecting parts (90) move in a direction that moves closer to or further away from each other, so that they are connected to or disconnected from each connecting part (110).

[0069] FIG. 7 is an operational state diagram showing the operation of an alignment module according to another embodiment of the present invention.

[0070] Referring to FIG. 7, the alignment module (70) waits until the carrier module (100) enters the alignment chamber (40) in the raised state of the alignment shaft (80) as in (a) and reaches a preset position (i.e., a coupling position).

[0071] Then, as in (b), the alignment shaft (80) is lowered so that the coupling unit (90) reaches the same height as the connection part (110).

[0072] Then, as in (c), the actuator (120) is driven so that the coupling part (90) moves horizontally and is coupled with the connecting part (110), and accordingly, the alignment shaft (80) and the carrier module (100) are physically connected.

[0073] When the connection between the alignment shaft (80) and the carrier module (100) is completed, as in (d), the alignment module (100) raises the alignment shaft (80) in the vertical direction (Z-axis direction) to move the carrier module (100) to the alignment height, and moves the carrier module (100) in the horizontal direction (e.g., X, Y, θ directions, etc.) to perform an alignment operation for the mask (2).

[0074] When alignment between the substrate (1) and the mask (2) is completed, the alignment module (70) releases the connection state between the alignment shaft (60) and the connecting part (110) of the carrier module (100). In the case of this embodiment, the connection state can be released by moving the connecting part (90) horizontally in the opposite direction to the connection process.

[0075] Although the present invention has been described above with reference to specific embodiments, those skilled in the art will understand that various modifications and changes can be made to the invention without departing from the spirit and scope of the invention as set forth in the following claims. Explanation of the symbols

[0077] 10: Load lock chamber 20: Transfer chamber 21: Transfer robot 30: Attach chamber 40: Alignment chamber 50: Process chamber 61: Transfer rail 62: Lower transfer rail 70: Align Module 80: Align Shaft 90: Connecting part 91: Bottom support part 92: Restraint section 93: Lateral restraint section 94: Upper restraint part 100: Carrier module 110: Connection part 111: Vertical axis 112: Support part 120: Actuator

Claims

Claim 1 An inline deposition system comprising: an alignment chamber positioned inline with respect to a load lock chamber into which a substrate is introduced and a deposition chamber for performing deposition on the substrate; a carrier module for transporting the substrate along a transfer rail installed in the alignment chamber; an alignment module installed in the alignment chamber and aligning the substrate with respect to a mask positioned below the carrier module; an alignment shaft movably installed in the alignment module; and a coupling part provided at the end of the alignment shaft and detachably coupled to a connection part provided in the carrier module; wherein the coupling part comprises: a bottom support part supporting the bottom surface of the connection part; and a restraining part connecting the bottom support part and the alignment shaft and restraining the horizontal and height direction movement of the connection part. Claim 2 An inline deposition system according to claim 1, wherein the restraining member comprises: a side restraining member extending upward from the bottom support member and restraining lateral flow of the connecting member; and an upper restraining member formed between the side restraining member and the alignment shaft and restraining vertical flow of the connecting member together with the bottom support member. Claim 3 An inline deposition system according to claim 1, wherein the connecting portion has an area larger than the vertical axis protruding vertically from the carrier module. Claim 4 An inline deposition system according to claim 1, characterized in that the alignment module is configured to connect the alignment shaft and the carrier module through: a downward movement that drives the alignment shaft downward; and a waiting movement that waits until the connecting part is inserted and fixed between the bottom support part and the restraining part of the coupling part according to the horizontal movement of the carrier module. Claim 5 An inline deposition system according to claim 1, wherein the bottom support member and the restraining member are provided as a pair at positions symmetrical to each other with respect to the alignment shaft. Claim 6 An inline deposition system characterized by further including, in claim 1, an actuator that horizontally drives the coupling portion with respect to the alignment shaft. Claim 7 An inline deposition system according to claim 6, characterized in that a linear guide is installed between the alignment shaft and the restraining part of the coupling part to guide the linear movement of the restraining part. Claim 8 An inline deposition system according to claim 6, wherein the alignment module is configured to connect the alignment shaft and the carrier module through: a waiting operation in which the carrier module enters the alignment chamber and waits until it reaches a preset position while the alignment shaft is in a raised state; a lowering operation in which the alignment shaft is lowered; and an actuator driving operation in which the actuator is driven so that the coupling part moves horizontally and is coupled with the connecting part. Claim 9 An inline deposition system according to claim 6, characterized in that the connecting portion is installed in a plurality along the horizontal movement direction of the carrier module, and the coupling portion is configured to be coupled simultaneously to the plurality of connecting portions by driving the actuator. Claim 10 An inline deposition system according to claim 9, wherein the bottom support portions of the coupling portions are provided in a plurality of numbers along the arrangement direction of the plurality of connecting portions, and at least one of the bottom support portions is configured to be positioned between adjacent connecting portions to jointly support the bottom surfaces of adjacent connecting portions. Claim 11 An inline deposition system comprising: an alignment chamber positioned inline with respect to a load lock chamber into which a substrate is introduced and a deposition chamber for performing deposition on the substrate; a carrier module for transporting the substrate along a transfer rail installed in the alignment chamber; an alignment module installed in the alignment chamber and aligning the substrate with respect to a mask positioned below the carrier module; an alignment shaft movably installed in the alignment module; and a coupling part provided at the end of the alignment shaft and coupled to a connecting part provided in the carrier module according to the horizontal movement of the carrier module. Claim 12 An inline deposition system comprising: an alignment chamber positioned inline with respect to a load lock chamber into which a substrate is fed and a deposition chamber for performing deposition on the substrate; a carrier module for transporting the substrate along a transfer rail installed in the alignment chamber; an alignment module installed in the alignment chamber and aligning the substrate with respect to a mask positioned below the carrier module; an alignment shaft movably installed in the alignment module; a coupling part provided at the end of the alignment shaft and capable of being coupled with a connection part provided in the carrier module; and an actuator installed between the alignment shaft and the coupling part, which moves the coupling part horizontally to be coupled with the connection part.

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