High-pressure substrate processing device and substrate processing method using it

Abstract

The present invention comprises: a chamber providing a processing space for a substrate; a boosting unit providing pressurized air to the chamber to maintain the pressure inside the chamber above a set pressure; and a processing liquid supply unit supplying a processing liquid to a substrate housed in the chamber and rotated therein, wherein the processing liquid supply unit comprises a flow tube made of an elastic material and inserted into the chamber to sequentially supply the processing liquid to a plurality of points inside the chamber.

Description

Technology Field

[0001] The present invention relates to a high-pressure substrate processing apparatus and a substrate processing method using the same, wherein a substrate processing process is performed inside a chamber in a high-pressure state exceeding a set pressure, and the processing liquid supplied into the chamber can be supplied while varying the direction. Background Technology

[0002] Generally, as light-emitting diode (LED) devices or semiconductor devices become more high-density, highly integrated, and high-performance, and as circuit pattern miniaturization progresses rapidly, the importance of substrate processing for etching the substrate surface or cleaning foreign substances such as flux, particles, organic contaminants, and metal contaminants remaining on the substrate surface is increasing.

[0003] A substrate processing device that etches or cleans a substrate processes the substrate surface using either a dry or a wet processing method. In particular, the wet processing method is a processing method using a processing liquid such as a chemical solution, and can be classified into a batch method that cleans multiple substrates simultaneously and a single-wafer method that cleans substrates individually.

[0004] A single-wafer processing device processes a substrate by spraying a chemical solution onto the surface of a substrate that is rotated at high speed while supported by a substrate support. The substrate support contacts the lower or outer surface of the substrate to support it, and a heating element is installed on the lower side of the substrate to heat the rotating substrate.

[0005] Multiple fluids are used to remove foreign substances remaining on the substrate, and since each requires a separate nozzle, there is a problem of increased installation costs. Therefore, there is a need to improve this.

[0006] The background technology of the present invention is disclosed in Korean Published Patent Application No. 2004-0023943 (published on March 20, 2004; Title of Invention: Single-wafer cleaning device capable of simultaneous cleaning of both sides). The problem to be solved

[0007] The present invention aims to provide a high-pressure substrate processing apparatus and a substrate processing method using the same, which can evenly supply a processing liquid to the entire substrate by varying the supply direction of the processing liquid in various directions while a substrate processing operation, such as an etching process, is performed in which a processing liquid is supplied to a substrate rotating at high speed inside a chamber where a set pressure is maintained, and can prevent a gap from being formed between the chamber and the processing liquid supply unit due to the operation of the processing liquid supply unit, thereby preventing the pressure inside the chamber from dropping below the set pressure. means of solving the problem

[0008] The present invention comprises: a chamber providing a processing space for a substrate; a boosting unit providing pressurized air to the chamber to maintain the pressure inside the chamber above a set pressure; and a processing liquid supply unit supplying a processing liquid to a substrate housed in the chamber and rotated therein, wherein the processing liquid supply unit comprises a flow tube made of an elastic material and inserted into the chamber to sequentially supply the processing liquid to a plurality of points inside the chamber.

[0009] The chamber may include a support member that rotatably supports a substrate; and a supply port into which a supply pipe is inserted to supply a processing liquid to the chamber and which is connected to the flow pipe.

[0010] The supply pipe and the flow pipe are connected by a first sealing member, and the first sealing member may include: a bracket inserted into the supply port and having a flange; a first connecting block fastened to one side of the bracket and connected to the supply pipe; a second connecting block connected to the flow pipe and fastened to the other side of the bracket to connect the supply pipe and the flow pipe; and a cover member coupled to the bracket to prevent the second connecting block from being separated from the bracket.

[0011] The bracket is connected to the supply port by a second sealing portion, and the second sealing portion comprises: a sealing member applied from the inner wall of the chamber along the inner wall of the supply port and interposed between the supply port and the bracket; and a sealing curve portion extending along the outer wall of the chamber and interposed between the flange and the chamber, wherein the sealing curve portion may provide a surface seal that is pressed by the flange and adheres to the chamber.

[0012] It may further include a mounting member that supports the above-mentioned flow tube and is installed to be movable to multiple points inside the chamber; and a driving member that provides power to the mounting member to move the above-mentioned flow tube to multiple points inside the chamber.

[0013] The above mounting member may include a mounting bracket rotatably installed in the chamber and extending toward the substrate; and a fixing member into which the fluid tube is inserted and which is detachably connected to the mounting bracket.

[0014] The above drive unit may include: a drive shaft rotatably disposed inside the chamber to which the mounting bracket is connected; a motor installed outside the chamber to provide power; and a power transmission unit installed in the chamber that provides magnetic force and is filled with a working fluid to transmit the power of the motor to the drive shaft without mechanical connection.

[0015] The present invention comprises: (a) a step of placing a substrate in a processing space of a chamber and rotating it; (b) a step of increasing the pressure inside the chamber to a set pressure by pumping pressurized air through an inlet of the chamber by the operation of a pressure boosting unit; and (c) a step of injecting a processing liquid through an outlet of the chamber by the operation of a processing liquid supply unit and spraying it onto the substrate when the pressure inside the chamber rises to the set pressure, wherein step (c) is characterized by a flow tube inserted into the chamber and made of an elastic material moving to multiple points by power provided from a driving unit to evenly supply the processing liquid to the entire substrate.

[0016] The above flow tube is supported by a mounting member extending from one side of the chamber in the direction of the rotation center of the substrate, and since the mounting member moves outward from the substrate by the power of the driving unit, the processing liquid can be supplied outward from the rotation center of the rotating substrate, thereby evenly supplying the processing liquid to the entire rotating substrate.

[0017] In the above chamber, a cup member is installed that surrounds a support member supporting a substrate, so the processing liquid supplied to the rotating substrate moves laterally by the centrifugal force of the substrate after being applied to the substrate and is collected along the cup member, so that no processing liquid remains inside the chamber and can be recycled. Effects of the invention

[0018] The high-pressure substrate processing device and the substrate processing method using the same according to the present invention have the advantage that the processing liquid can be supplied evenly to the entire substrate, as the mounting part facing one side of the substrate is installed so as to be rotatable by the operation of a driving part, and a flow pipe for discharging a processing liquid is connected to the mounting part, so that the mounting part and the flow pipe can move in various directions by the operation of the driving part.

[0019] In addition, the high-pressure substrate processing device and the substrate processing method using the same according to the present invention have the advantage that, since a flow tube made of an elastic material is installed between the supply tube and the mounting part, the flow tube deforms when the mounting part moves in various directions by the operation of the driving part, thereby preventing the load from concentrating at the connection part between the supply tube and the flow tube, so that the connection part with the supply tube is prevented from deforming or being damaged even when the flow tube is moved in various directions and the processing liquid is supplied for a long period of time.

[0020] In addition, the high-pressure substrate processing device and the substrate processing method using the same according to the present invention have the advantage that, since the connection portion between the supply pipe and the flow pipe is hermetically connected by a first sealing part, the processing liquid or pressure can be prevented from being lost through the gap between the flow pipe and the supply pipe even if the flow pipe moves in various directions by the operation of the driving part.

[0021] In addition, the high-pressure substrate processing device and the substrate processing method using the same according to the present invention have the advantage of preventing pressure loss due to the gap between the connection portion of the supply pipe and the flow pipe and the supply port, since the connection portion of the supply pipe and the flow pipe is installed at the supply port of the chamber by the second sealing portion.

[0022] In addition, the first sealing part of the high-pressure substrate processing device and the substrate processing method using the same according to the present invention is installed so as to be detachably connected to one end of the flow pipe and the supply pipe at the supply port of the chamber. Therefore, when replacement or repair work is performed on the flow pipe, the first sealing part can be easily separated from the supply port to perform repair or replacement work on the flow pipe, thereby providing the advantage of reducing the time and cost required for maintenance of the processing liquid supply part.

[0023] In addition, the high-pressure substrate processing device and the substrate processing method using the same according to the present invention have the advantage that, since the other end of the flow pipe is detachably connected to the end of the mounting part, when performing replacement or repair work on the flow pipe, one end of the flow pipe can be separated from the first sealing part and the other end of the flow pipe can be separated from the mounting part, thereby making the separation and replacement work of the flow pipe easier.

[0024] In addition, the high-pressure substrate processing device and the substrate processing method using the same according to the present invention transmit power to the mounting part through magnetic force and fluid rotational force by means of a power transmission part of a driving unit that transmits power to the mounting part, thereby eliminating the connection structure in which the motor's rotating shaft is rotatably inserted into the chamber, and thus preventing the loss of pressure or processing fluid along the gap between the rotating shaft and the chamber. Brief explanation of the drawing

[0025] FIG. 1 is a cross-sectional view showing the boosting section and the processing liquid supply section of a high-pressure substrate processing device according to one embodiment of the present invention. FIG. 2 is a perspective view showing a processing liquid supply unit of a high-pressure substrate processing device according to one embodiment of the present invention. FIG. 3 is an exploded perspective view showing a processing liquid supply unit of a high-pressure substrate processing device according to one embodiment of the present invention. FIG. 4 is a cross-sectional view showing a processing liquid supply unit of a high-pressure substrate processing device according to one embodiment of the present invention. FIG. 5 is an exploded perspective view showing the first sealing part of a high-pressure substrate processing device according to one embodiment of the present invention. Specific details for implementing the invention

[0026] Hereinafter, an embodiment of a high-pressure substrate processing apparatus according to the present invention and a substrate processing method using the same will be described with reference to the attached drawings.

[0027] In this process, the thickness of the lines or the size of the components shown in the drawings may be exaggerated for the sake of clarity and convenience of explanation.

[0028] In addition, the terms described below are defined considering their functions in the present invention, and these may vary depending on the intention or practice of the user or operator.

[0029] Therefore, the definitions of these terms should be based on the content throughout this specification.

[0030] FIG. 1 is a cross-sectional view showing a boosting unit and a processing liquid supply unit of a high-pressure substrate processing device according to one embodiment of the present invention, FIG. 2 is a perspective view showing a processing liquid supply unit of a high-pressure substrate processing device according to one embodiment of the present invention, and FIG. 3 is an exploded perspective view showing a processing liquid supply unit of a high-pressure substrate processing device according to one embodiment of the present invention.

[0031] In addition, FIG. 4 is a cross-sectional view showing a processing liquid supply unit of a high-pressure substrate processing device according to one embodiment of the present invention, and FIG. 5 is an exploded perspective view showing a first sealing unit of a high-pressure substrate processing device according to one embodiment of the present invention.

[0032] Referring to FIGS. 1 to 5, a high-pressure substrate processing device according to one embodiment of the present invention comprises: a flow pipe (74) made of an elastic material and inserted into the chamber (10) to sequentially supply a processing liquid to a plurality of points inside the chamber (10); a first sealing part (80) connecting the supply pipe (72) and the flow pipe (74); a second sealing part (90) preventing the loss of pressure and processing liquid through the gap between the first sealing part (80) and the supply port (16); a mounting part (76) that supports the flow pipe (74) and is installed to be movable to a plurality of points inside the chamber (10); and a driving part (78) that provides power to the mounting part (76) to move the flow pipe (74) to a plurality of points inside the chamber (10).

[0033] Accordingly, when the pressure and temperature inside the chamber (10) reach the set value, the substrate (100) is rotated by the operation of the support member (58), and the processing liquid is supplied to the substrate (100) by the operation of the processing liquid supply member (70). In this embodiment, the flow tube (74), made of an elastic material, is mounted at the end of the mounting member (76) and moves together with the mounting member (76), which is rotated by the operation of the driving member (78), thereby enabling the processing liquid to be evenly supplied to various parts of the substrate (100).

[0034] The mounting portion (76) of the present embodiment includes a mounting bracket (76a) that is rotatably installed in the chamber (10) and extends toward the substrate (100), and a fixing member (76b) into which a flow tube (74) is inserted and which is detachably connected to the mounting bracket (76a).

[0035] Accordingly, when power provided from the drive unit (78) is transmitted to the mounting bracket (76a), the inner end of the mounting bracket (76a) rotates around the outer end of the mounting bracket (76a) and moves from the rotation center of the substrate (100) toward the edge of the substrate (100), thereby supplying the processing liquid.

[0036] As described above, when a treatment liquid is supplied to the upper surface of a rotating disc-shaped substrate (100) while moving from the center of rotation of the substrate (100) toward the edge of the substrate (100), the treatment liquid is evenly applied to the entire substrate (100) by the rotating substrate (100).

[0037] As described above, since the pressure inside the chamber (10) of this embodiment is maintained above the set pressure even while the processing liquid is being supplied, pressure or processing liquid may be lost through the connection between the supply pipe (72) and the flow pipe (74), the gap between the first sealing part (80) and the supply port (16), etc., but this embodiment can prevent pressure or processing liquid from being lost through the gap between the supply pipe (72) and the flow pipe (74) by the first sealing part (80), and can prevent pressure or processing liquid from being lost through the gap between the first sealing part (80) and the supply port (16) by the second sealing part (90).

[0038] The first sealing part (80) of the present embodiment includes a bracket (82) that is inserted into a supply port (16) and is provided with a flange (84), a first connecting block (86) that is fastened to one side of the bracket (82) and to which a supply pipe (72) is connected, a second connecting block (87) that is fastened to the other side of the bracket (82) and to which a flow pipe (74) is connected and to which the supply pipe (72) and the flow pipe (74) are connected, and a cover member (88) that is coupled to the bracket (82) to prevent the second connecting block (87) from being separated from the bracket (82).

[0039] The bracket (82) is formed in the shape of a pipe that is inserted into the supply port (16), and the outer end of the bracket (82) forms a flange (84) that is bent and extended laterally. When the bracket (82) is inserted into the supply port (16), the outer part of the supply port (16) is wrapped by the flange (84), and the flange (84) and the outer wall of the supply port (16) make surface contact.

[0040] A first screw thread (84a) is formed on the inner wall of the outer end of the bracket (82), a second screw thread (84b) is formed on the inner wall of the inner end of the bracket (82), and a third screw thread (84c) is formed on the outer wall of the inner end of the bracket (82).

[0041] Additionally, a first connecting screw thread (86a) is formed on the outer wall of the first connecting block (86) into which the supply pipe (72) is inserted and is connected to the first screw thread (84a), and a second connecting screw thread (87a) is formed on the outer wall of the second connecting block (87) into which the flow pipe (74) is inserted and is connected to the second screw thread (84b).

[0042] As described above, when the first connecting block (86) and the second connecting block (87) are connected to the outer and inner ends of the bracket (82), the supply pipe (72) and the flow pipe (74) inserted into each connecting block come into contact with each other so that they can be connected and pass through.

[0043] As described above, after the first connecting block (86) and the second connecting block (87) are fastened to the bracket (82), a cover member (88) is connected to the inner end of the bracket (82) by the third connecting screw thread (88a) and the third screw thread (84c), thereby preventing the second connecting block (87) from being separated from the bracket (82).

[0044] Accordingly, when the inner end of the flow pipe (74) is moved to multiple points by the support (76a) to supply the processing liquid, the outer end of the flow pipe (74) is restrained by the second connecting block (87) and the cover member (88), thereby preventing the formation of a gap between the flow pipe (74) and the supply pipe (72), and preventing the loss of pressure and processing liquid due to the gap between the flow pipe (74) and the supply pipe (72).

[0045] In addition, a hole portion into which a second connecting block (88) is inserted is formed in a funnel shape at the end of the cover member (87), so that a gap is formed between the outer end of the second connecting block (88) and the inner wall of the cover member (87), thereby preventing interference between the flow pipe (74) and the cover member (88) even when the flow pipe (74) is operated while bending from the inner end of the cover member (88).

[0046] The second sealing portion (90) of the present embodiment includes a sealing member (92) that is applied from the inner wall of the chamber (10) along the inner wall of the supply port (16) and interposed between the supply port (16) and the bracket (82), and a sealing curve portion (94) that is extended along the outer wall of the chamber (10) and interposed between the flange (84) and the chamber (10), wherein the sealing curve portion (94) provides a surface seal that is pressed by the flange (84) and adheres to the chamber (10).

[0047] Therefore, it is possible to prevent pressure or processing fluid from being lost through the gap between the supply port (16) and the bracket (82).

[0048] Additionally, the driving unit (78) of the present embodiment includes a driving shaft (78b) which is rotatably positioned inside the chamber (10) to which a mounting bracket (76a) is connected, a motor (78c) which is installed outside the chamber (10) to provide power, and a power transmission unit (78a) which is installed in the chamber (10) and provides magnetic force, filled with a working fluid to transmit the power of the motor (78c) to the driving shaft (78b) without mechanical connection.

[0049] Here, the power transmission unit (78a) has a rotating shaft of a motor (78c) rotatably inserted into its upper portion and a driving shaft (78b) rotatably inserted into its lower portion, and a working fluid is filled inside the power transmission unit (78a) to transmit the rotational motion of the rotating shaft to the rotational motion of the driving shaft (78b), thereby enabling power to be transmitted between the rotating shaft and the driving shaft (78b) without a mechanical connection.

[0050] In addition, a magnetic material is provided inside the power transmission unit (78a) of this embodiment to connect the rotation shaft and the drive shaft (78b) with magnetic force, thereby enabling more effective power transmission.

[0051] A method for processing a substrate (100) using a high-pressure substrate (100) processing device configured as described above comprises the steps of: placing the substrate (100) in the processing space of the chamber (10) and rotating it; pressurizing air being sent through the injection port of the chamber (10) by the operation of the boosting unit to increase the pressure inside the chamber (10) to a set pressure; injecting a processing liquid through the supply port (16) of the chamber (10) by the operation of the processing liquid supply unit (70) when the pressure inside the chamber (10) rises to the set pressure and spraying it onto the substrate (100); and discharging the pressurized air and processing liquid that have passed through the substrate (100) to the outside of the chamber (10) along the discharge line.

[0052] Accordingly, when a substrate (100) is placed on a plurality of support protrusions (59) provided inside the chamber (10), the pressure inside the chamber (10) is pressurized to a set pressure by the operation of the first pressurizing part, and when the pressure and temperature inside the chamber (10) rise to a set value, the supply and discharge amounts of pressurized air are adjusted so that the pressure inside the chamber is maintained above the set pressure.

[0053] As described above, when the pressure inside the chamber (10) is maintained above a set value, the substrate (100) is rotated by the operation of the support member (58), and the processing liquid is sprayed onto the substrate (100) by the operation of the processing liquid supply member (70), thereby proceeding with a substrate (100) processing operation such as an etching process.

[0054] The step of injecting the treatment liquid of the present embodiment and spraying it onto the substrate (100) is achieved by evenly supplying the treatment liquid to the entire substrate (100) as a flow tube (74), which is inserted into the chamber (10) and made of an elastic material, moves to multiple points by power provided from the driving unit (78).

[0055] In this embodiment, the flow tube (74) is supported by a mounting part (76) extending from one side of the chamber (10) toward the center of rotation of the substrate (100), and since the mounting part (76) is moved toward the outside of the substrate (100) by the power of the driving part (78), the processing liquid is supplied toward the outside from the center of rotation of the rotating substrate (100), thereby enabling the processing liquid to be evenly supplied to the entire rotating substrate (100).

[0056] In addition, in the chamber (10) of the present embodiment, a cup member (57) is installed to surround a support member (58) that supports a substrate (100). Therefore, the processing liquid supplied to the rotating substrate (100) is moved laterally by the centrifugal force of the substrate (100) after being applied to the substrate (100) and collected along the cup member (57), so that no processing liquid remains inside the chamber (10) and can be recycled.

[0057] Unexplained reference numerals 88b and 76c are an O-ring member (88b) installed on a cover member (88) and a fixing hole portion (76c) formed on a fixing member (76b).

[0058] Thus, it is possible to provide a high-pressure substrate processing apparatus and a substrate processing method using the same, which can prevent the pressure inside the chamber from dropping below the set pressure by preventing a gap from forming between the chamber and the processing liquid supply unit due to the operation of the processing liquid supply unit, while the processing liquid is supplied to a substrate rotating at high speed inside a chamber where a set pressure is maintained and a substrate processing operation such as an etching process is performed, thereby evenly supplying the processing liquid to the entire substrate by varying the supply direction of the processing liquid in various directions.

[0059] Although the present invention has been described with reference to an embodiment illustrated in the drawings, this is merely illustrative, and those skilled in the art will understand that various modifications and equivalent alternative embodiments are possible therefrom.

[0060] In addition, although a high-pressure substrate processing device and a substrate processing method using the same have been described as examples, this is merely illustrative, and the processing device and the processing method using the same of the present invention may be used in products other than the high-pressure substrate processing device and the substrate processing method using the same.

[0061] Therefore, the true technical scope of protection of the present invention should be determined by the following patent claims. Explanation of the symbols

[0062] 10: Chamber 16: Supply port 57 : Cup part 58 : Support part 59 : Support projection 70 : Processing liquid supply section 72 : Supply pipe 74 : Flow pipe 76 : Mounting part 76a : Mount stand 76b : Fixing member 76c : Fixing hole part 78 : Drive unit 78a : Power transmission unit 78b : Drive shaft 78c : Motor 80 : 1st sealing part 82 : Bracket 84: Flange 84a: First thread 84b: Second thread 84c: Third thread 86: First connecting block 86a: First connecting screw thread 87 : Second connecting block 87a : Second connecting screw thread 88 : Cover member 88a : Third connecting screw thread 88b : O-ring member 90 : Second sealing part 92 : Sealing member 94 : Sealing curve 100 : Substrate

Claims

Claim 1 A high-pressure substrate processing device characterized by comprising: a chamber providing a processing space for a substrate; a boosting unit providing pressurized air to the chamber to maintain the pressure inside the chamber above a set pressure; and a processing liquid supply unit supplying a processing liquid to a substrate housed in the chamber and rotated therein, wherein the processing liquid supply unit includes a flow pipe inserted into the chamber to sequentially supply the processing liquid to a plurality of points inside the chamber, and the chamber includes a support member that rotatably supports the substrate; and a supply port into which a supply pipe is inserted to supply the processing liquid to the chamber and which is connected to the flow pipe, wherein the supply pipe and the flow pipe are connected by a first sealing member, wherein the first sealing member includes: a bracket inserted into the supply port and having a flange; a first connecting block fastened to one side of the bracket and to which the supply pipe is connected; and a second connecting block to which the flow pipe is connected and which is fastened to the other side of the bracket to connect the supply pipe and the flow pipe. Claim 2 A high-pressure substrate processing device according to claim 1, characterized in that the flow tube is made of an elastic material. Claim 3 A high-pressure substrate processing apparatus according to claim 1, wherein the first sealing portion comprises a cover member coupled to the bracket to prevent the second connecting block from being separated from the bracket. Claim 4 In paragraph 3, the bracket is connected to the supply port by a second sealing portion, and the second sealing portion comprises a sealing member applied from the inner wall of the chamber along the inner wall of the supply port and interposed between the supply port and the bracket; and a sealing curve portion extending along the outer wall of the chamber and interposed between the flange and the chamber, wherein the sealing curve portion provides a surface seal that is pressed by the flange and adheres to the chamber. Claim 5 A high-pressure substrate processing apparatus according to claim 1, further comprising: a mounting member that supports the flow tube and is installed to be movable to multiple points inside the chamber; and a driving member that provides power to the mounting member to move the flow tube to multiple points inside the chamber. Claim 6 A high-pressure substrate processing apparatus according to claim 5, wherein the mounting member comprises: a mounting bracket rotatably installed in the chamber and extending toward the substrate; and a fixing member into which the fluid pipe is inserted and which is detachably connected to the mounting bracket. Claim 7 A high-pressure substrate processing apparatus according to claim 6, wherein the driving unit comprises: a driving shaft rotatably disposed inside the chamber to which the mounting bracket is connected; a motor installed outside the chamber to provide power; and a power transmission unit installed in the chamber to provide magnetic force and filled with a working fluid to transmit the power of the motor to the driving shaft without mechanical connection. Claim 8 delete Claim 9 delete Claim 10 delete

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