Carbon byproduct removal module, system and operating method thereof

Abstract

A carbon byproduct removal module, a carbon byproduct removal system, and a method of operation thereof are provided. The carbon byproduct removal module comprises a vaporizer that generates vapor containing oxygen atoms, a carrier gas supplyer that supplies a carrier gas to the vaporizer to move the vapor to a UV activator, and a UV activator that irradiates light containing ultraviolet rays onto the vapor, wherein one end of the UV activator is connected to one end of the vaporizer, and the other end of the UV activator is attached to an exhaust module of a chamber where a semiconductor manufacturing process is performed.

Description

Technology Field

[0001] The present invention relates to a carbon byproduct removal module, a carbon byproduct removal system, and a method of operation thereof. Background Technology

[0002] Semiconductor manufacturing processes, such as etching and deposition, may utilize various chemical substances. Consequently, diverse contaminants can be generated during these processes. Since these contaminants can deposit on the wafer surface and potentially damage the wafer—such as by impurizing the thin film—they must be properly discharged outside the chamber.

[0003] Meanwhile, the interior of the chamber needs to be maintained in a vacuum state during the semiconductor manufacturing process, and a pump may be connected to the chamber for this purpose. The pump can function to regulate the pressure inside the chamber or to exhaust contaminants; however, if contaminants accumulate in the chamber's exhaust system, such as the pump, the system may not operate properly, potentially causing damage to the wafer inside the chamber. To prevent wafer damage and properly exhaust contaminants from the chamber, research is currently underway on methods to efficiently remove contaminants adsorbed onto the exhaust system. The problem to be solved

[0004] The technical problem that the present invention aims to solve is to provide a carbon byproduct removal module that efficiently removes carbon byproducts adsorbed on the exhaust module of a chamber during a semiconductor manufacturing process.

[0005] Another technical problem that the present invention aims to solve is to provide a carbon byproduct removal system that efficiently removes carbon byproducts adsorbed on the exhaust module of a chamber during a semiconductor manufacturing process.

[0006] Another technical problem that the present invention aims to solve is to provide a method for removing carbon byproducts that efficiently removes carbon byproducts adsorbed on the exhaust module of a chamber during a semiconductor manufacturing process.

[0007] The problems that the present invention aims to solve are not limited to those mentioned above, and other unmentioned problems will be clearly understood by those skilled in the art from the description below. means of solving the problem

[0008] A carbon byproduct removal module according to some embodiments of the present invention for achieving the above technical problem comprises a vaporizer that generates vapor containing oxygen atoms, a carrier gas supplyer that supplies a carrier gas to the vaporizer to move the vapor to a UV activator, and a UV activator that irradiates light containing ultraviolet rays onto the vapor, wherein one end of the UV activator is connected to one end of the vaporizer and the other end of the UV activator is attached to an exhaust module of a chamber where a semiconductor manufacturing process is performed.

[0009] A carbon byproduct removal system according to some embodiments of the present invention for achieving the above technical problem comprises a chamber in which a semiconductor manufacturing process is performed, an exhaust module for exhausting the inside of the chamber, and a carbon byproduct removal module attached to the exhaust module for removing carbon byproducts inside the exhaust module, wherein the exhaust module comprises a vacuum pump connected to the chamber and maintaining the inside of the chamber in a vacuum state or discharging byproducts generated inside the chamber while the semiconductor manufacturing process is in progress, a foreline connected between the chamber and the vacuum pump, a scrubber connected to the vacuum pump and removing byproducts generated inside the chamber, and a PS line connected between the vacuum pump and the scrubber, wherein the carbon byproduct removal module comprises a vaporizer for generating vapor containing oxygen atoms, a carrier gas supplyer for supplying a carrier gas to the vaporizer to move the vapor to a UV activator, and a UV activator for irradiating light containing ultraviolet rays onto the vapor.

[0010] A method for removing carbon byproducts according to some embodiments of the present invention for achieving the above technical problem comprises: providing a chamber in which a semiconductor manufacturing process is performed and an exhaust module for exhausting the inside of the chamber; providing a carbon byproduct removal module for removing carbon byproducts inside the exhaust module; and attaching the carbon byproduct removal module to the exhaust module to remove carbon byproducts inside the exhaust module, wherein removing carbon byproducts inside the exhaust module using the carbon byproduct removal module involves generating vapor containing oxygen atoms by means of a vaporizer, supplying a carrier gas to the vaporizer by means of a carrier gas supplyer to move the vapor together with the carrier gas to a UV activator, and irradiating the vapor with light containing ultraviolet rays by means of a UV activator to generate a first oxygen radical, and supplying the first oxygen radical to the carbon byproducts inside the exhaust module to remove the carbon byproducts.

[0011] Specific details of other embodiments are included in the detailed description and drawings. Brief explanation of the drawing

[0012] FIG. 1 is an exemplary drawing for illustrating a carbon byproduct removal module according to some embodiments. FIGS. 2 to 5 are exemplary drawings for illustrating a carbon byproduct removal system according to some embodiments. FIG. 6 is an exemplary drawing for illustrating a carbon byproduct removal system according to several other embodiments. FIG. 7 is an exemplary drawing for illustrating a carbon byproduct removal system according to some other embodiments. FIG. 8 is an exemplary drawing for illustrating a carbon byproduct removal system according to some other embodiments. FIG. 9 is an exemplary drawing for illustrating a carbon byproduct removal system according to some other embodiments. FIG. 10 is an exemplary drawing for illustrating a carbon byproduct removal system according to some other embodiments. FIG. 11 is an exemplary flowchart illustrating a method for removing carbon byproducts according to some embodiments. FIGS. 12 to 15 are intermediate step drawings for explaining a method for removing carbon byproducts according to some embodiments. FIGS. 16 and 17 are exemplary drawings illustrating the carbon byproduct removal effect according to some embodiments. Specific details for implementing the invention

[0013] Hereinafter, a carbon byproduct removal module, a carbon byproduct removal system, and a carbon byproduct removal method according to several embodiments will be described with reference to the attached drawings.

[0014] FIG. 1 is an exemplary drawing for illustrating a carbon byproduct removal module according to some embodiments.

[0015] Referring to FIG. 1, a carbon byproduct removal module (100) according to some embodiments may be attached to an exhaust module (300) of a chamber (200). Inside the chamber (200), a process for manufacturing a semiconductor device using a material containing carbon (C) may be performed. For example, a chemical vapor deposition (CVD) process for depositing a thin film on a wafer surface using a reaction gas such as methane (CH4), propene (C3H6), or benzene (C6H6) may be performed inside the chamber (200), but is not limited thereto. While such a process for manufacturing a semiconductor device using a material containing carbon is performed inside the chamber (200), a carbon byproduct may be generated as a result of the reaction inside the chamber (200). Since the carbon byproduct inside the chamber (200) can be deposited on the surface of the wafer and cause the thin film to become impure and rough, it is necessary to discharge it to the outside. Accordingly, the chamber (200) is provided with an exhaust module (300) so that carbon byproducts generated as a result of the reaction inside the chamber (200) can be discharged outside the chamber (200).

[0016] Meanwhile, while carbon byproducts inside the chamber (200) are discharged to the outside through the exhaust module (300), carbon byproducts (400) may accumulate inside the exhaust module (300) without being discharged to the outside of the exhaust module (300). The carbon byproduct removal module (100) can be attached to the point where carbon byproducts (400) are adsorbed within the internal area of ​​the exhaust module (300) to remove the carbon byproducts (400). The carbon byproduct removal module (100) may include a vaporizer (110), a carrier gas supply unit (120), and a UV lamp (130).

[0017] The evaporator (110) can generate vapor containing oxygen atoms (O). The evaporator (110) can generate mist vapor by applying ultrasonic vibrations to a liquid substance inside, but the method by which the evaporator (110) generates vapor is not limited thereto. The liquid substance for which the evaporator (110) generates vapor containing oxygen atoms may be, for example, hydrogen peroxide (H2O2). In some embodiments, ultrasonic waves may be generated at the bottom of the evaporator (110) containing liquid hydrogen peroxide (H2O2) to apply ultrasonic vibrations to the liquid hydrogen peroxide (H2O2) and generate vapor containing oxygen atoms. However, the embodiments are not limited thereto, and vapor containing oxygen atoms may be generated using other substances capable of generating vapor containing oxygen atoms. In addition, depending on the embodiment, a gaseous substance rather than a liquid substance, such as gaseous hydrogen peroxide (H2O2) capable of generating oxygen radicals, may be provided inside the evaporator (110).

[0018] A carrier gas supply unit (120) can supply a carrier gas to the evaporator (110) to move the steam generated in the evaporator (110) to the ultraviolet irradiator (130). The carrier gas may be an inert gas such as argon (Ar) or nitrogen (N2), or a gas containing oxygen atoms such as CDA (Clean Dry Air) or oxygen (O2). The carrier gas may consist of a single gas of the inert gas or the gas containing oxygen atoms, or it may consist of a combination of the inert gas and the gas containing oxygen atoms. One end (110A) of the evaporator (110) is connected to the carrier gas supply unit (120) so that the carrier gas can be supplied from the carrier gas supply unit (120) to the evaporator (110). The carrier gas supplied to the evaporator (110) can move to the ultraviolet irradiator (130) together with the steam containing oxygen atoms generated in the evaporator (110).

[0019] In some embodiments, a mass flow controller (140, Mass Flow Controller; MFC) may be connected between a carrier gas supply unit (120) and one end (110A) of an evaporator (110). The mass flow controller (140) may measure the amount of carrier gas flowing from the carrier gas supply unit (120) to one end (110A) of the evaporator (110) using an internal sensor, and may control the flow of the carrier gas using an internal valve so that the measured amount of carrier gas is compared with a preset amount of carrier gas and the two values ​​become equal. Accordingly, the mass flow controller (140) may control the amount of carrier gas (121) supplied to the evaporator (110) so that the amount of steam (111) generated in the evaporator (110) is sufficient to travel to the ultraviolet irradiator (130).

[0020] One end (130A) of the ultraviolet irradiator (130) is connected to the other end (110B) of the evaporator (110) to receive steam (111) containing oxygen atoms and a carrier gas (121) from the evaporator (110). The ultraviolet irradiator (130) may be, for example, an ultraviolet lamp that emits light containing ultraviolet rays. The ultraviolet irradiator (130) may irradiate light containing ultraviolet rays onto the steam (111) containing oxygen atoms and the carrier gas (121). The steam (111) containing oxygen atoms may receive energy from the ultraviolet rays emitted from the ultraviolet irradiator (130) and become highly reactive oxygen radicals. Highly reactive oxygen radicals can move into the exhaust module (300) of the chamber (200) connected to the other end (130B) of the ultraviolet irradiator (130) and react with carbon byproducts (400) adsorbed inside the exhaust module (300).

[0021] Oxygen radicals can react with carbon by-products (400) inside the exhaust module (300) to decompose the carbon by-products (400). Alternatively, oxygen radicals can react with carbon by-products (400) inside the exhaust module (300) to transform the carbon by-products (400) into a form that is easy to remove. For example, oxygen radicals can change the carbon by-products (400) into a substance that can be vaporized at a low temperature. Accordingly, when heat above the boiling point of the carbon by-products (400) is applied to the exhaust module (300) to vaporize or sublimate the carbon by-products (400) and remove them from the exhaust module (300), the carbon by-products (400) can be removed at a lower temperature than before. The process of removing carbon by-products (400) by applying heat to the exhaust module (300) will be described later with reference to FIGS. 8 to 10.

[0022] Generally, the carbon byproduct (400) adsorbed inside the exhaust module (300) as a result of the semiconductor manufacturing process may be a high-viscosity polymer material. At this time, if the internal temperature of the exhaust module (300) is lower than the boiling point of the carbon byproduct (400), the carbon byproduct (400) may be adsorbed inside the exhaust module (300). In some embodiments of the present invention, the carbon byproduct (400) can be efficiently removed by attaching a carbon byproduct removal module (100) to the exhaust module (300) of the chamber (200) and reacting the carbon byproduct (400) adsorbed inside the exhaust module (300) with oxygen radicals.

[0023] FIGS. 2 through 5 are exemplary drawings for illustrating a carbon byproduct removal system according to several embodiments. In the following description, explanations that overlap with the description of the preceding embodiments will be omitted, and the differences will be described in detail.

[0024] First, referring to FIG. 2, the carbon byproduct removal system (1000) may include a chamber (200), an exhaust module (300), and a carbon byproduct removal module (100). The exhaust module (300) may include a vacuum pump (320), a foreline (310), a scrubber (340), and a PS line (330).

[0025] A vacuum pump (320) may be provided to maintain a vacuum inside the chamber (200) or to discharge by-products generated inside the chamber (200) while a semiconductor manufacturing process is being performed inside the chamber (200). The vacuum pump (320) may be a dry pump and may be implemented with a Roots rotor, a screw rotor, or a combination of a Roots rotor and a screw rotor. The Roots rotor may be connected to the chamber (200) to suck in and compress by-products generated in the chamber (200). Additionally, the screw rotor may discharge gases and by-products sucked in from the Roots rotor to the outside of the chamber (200).

[0026] A vacuum pump (320) can be connected to a chamber (200) through a foreline (310). The foreline (310) is connected to the vacuum pump (320) and can discharge pumped gas and by-products to create a vacuum inside the chamber (200). The inside of the foreline (310) is maintained at a pressure of about 1 Torr, which prevents by-products from flowing back into the chamber (200). As such, the foreline (310) acts as a passage for by-products inside the chamber (200) to be discharged outside the chamber (200), so carbon by-products (400) can be adsorbed inside it. Therefore, a carbon by-product removal module (100) can be attached to the point where carbon by-products (400) are adsorbed inside the foreline (310) to remove the carbon by-products (400) or to transform it into a shape that is easy to remove.

[0027] The scrubber (340) is connected to the vacuum pump (320) and can remove by-products generated inside the chamber (200). For example, the scrubber (340) may be a burn-wet scrubber, which can remove by-products by burning exhaust gas and then spraying a cleaning solution onto the burned exhaust gas. However, the method by which the scrubber (340) removes by-products is not limited to this, and by-products inside the chamber (200) may be removed using plasma, adsorption, catalysts, etc. The PS line (330) may be an exhaust line connecting the vacuum pump (320) and the scrubber (340). The inside of the PS line (330) may be maintained at a pressure of approximately 760 Torr.

[0028] As such, carbon byproducts generated during the semiconductor manufacturing process can be adsorbed not only inside the chamber (200) but also on the entire components of the exhaust module (300). If carbon byproducts (400) remain adsorbed on any component of the exhaust module (300), the performance of the exhaust module (300) may deteriorate, or in severe cases, the operation of the exhaust module (300) may stop. To prevent this, it is necessary to periodically check the condition inside the exhaust module (300) to ensure that carbon byproducts (400) do not accumulate more than a certain amount inside the exhaust module (300). In some embodiments of the present invention, a carbon byproduct removal module (100) is attached to the exhaust module (300) to remove carbon byproducts (400) whenever necessary or to transform the exhaust module (300) into a state that is easy to remove, thereby extending the inspection cycle of the exhaust module (300).

[0029] FIG. 2 illustrates an example where the carbon byproduct removal module (100) is attached to the foreline (310) of the exhaust module (300), and the carbon byproduct removal module (100) may also be attached to other components of the exhaust module (300). For example, referring to FIG. 3, in the case of a carbon byproduct removal system (1000A), the carbon byproduct removal module (100) is attached to a vacuum pump (320) to remove carbon byproducts (400) adsorbed inside the vacuum pump (320) or to transform them into a substance that can be vaporized at low temperatures. If carbon byproducts (400) become stuck and adhere to the Roots-type rotor and / or screw-type rotor installed inside the vacuum pump (320), or in the gap between the Roots-type rotor and / or screw-type rotor and the inner wall of the vacuum pump (320), damage may occur to the rotor, and the performance of the vacuum pump (320) may be degraded. Accordingly, a carbon byproduct removal module (100) can be attached to the point where carbon byproduct (400) is adsorbed inside the vacuum pump (320) to properly remove the carbon byproduct (400).

[0030] Next, referring to FIG. 4, in the carbon byproduct removal system (1000B), the carbon byproduct removal module (100) is attached to the point where carbon byproducts (400) are adsorbed inside the PS line (330), thereby allowing the byproducts to be moved from the vacuum pump (320) to the scrubber (340) and finally removed to be efficiently removed. Additionally, referring to FIG. 5, in the carbon byproduct removal system (1000C), the carbon byproduct removal module (100) is attached to the point where carbon byproducts (400) are adsorbed inside the scrubber (340), thereby increasing the efficiency of the scrubber (340) in finally removing the carbon byproducts (400).

[0031] FIG. 6 is an exemplary drawing illustrating a carbon byproduct removal system according to several other embodiments. Below, descriptions that overlap with the preceding embodiments will be omitted, and the differences will be described in detail.

[0032] Referring to FIG. 6, the carbon byproduct removal system (1000D) may further include an AGV (350, Auto Gate Shutoff Valve; AGV) connected between the chamber (200) and the vacuum pump (320). The AGV (350) may be provided to prevent the operation of the vacuum pump (320) from stopping due to an external defect or an internal defect of the vacuum pump (320), thereby preventing contamination of the wafer inside the chamber (200). For example, if carbon byproducts (400) get stuck in the screw rotor inside the vacuum pump (320) and the operation of the vacuum pump (320) stops, the byproducts may flow back into the chamber (200) and contaminate the wafer. At this time, the AGV (350) can prevent backflow of by-products by receiving a stop signal from the vacuum pump (320) from an external controller and blocking the first exhaust line (351) between the AGV (350) and the vacuum pump (320) and the fore line (310) between the AGV (350) and the chamber (200).

[0033] Additionally, the carbon byproduct removal system (1000D) may further include a throttle valve (360) connected between the chamber (200) and the foreline (310). The throttle valve (360) can regulate the exhaust pressure inside the chamber (200) by opening and closing the conduit to control the amount of gaseous material flowing into the chamber (200) through the second exhaust line (361) and the amount of gaseous material being discharged outside the chamber (200) through the second exhaust line (361).

[0034] FIG. 6 illustrates an exemplary case in which a carbon byproduct removal module (100) is attached to a vacuum pump (320), but the embodiment is not limited thereto. That is, the carbon byproduct removal module (100) can be attached to any point in the exhaust module (300) where carbon byproducts (400) are adsorbed, thereby removing carbon byproducts (400) or modifying the structure to facilitate the removal of carbon byproducts (400). For example, the carbon byproduct removal module (100) can be attached to the AGEV (360) or throttle valve (360) of the exhaust module (300). Accordingly, damage to the wafer inside the chamber (200) can be prevented, or contaminants adsorbed on the valve controlling the exhaust pressure inside the chamber (200) can be prevented, thereby preventing defects from occurring in the semiconductor manufacturing process inside the chamber (200).

[0035] FIG. 7 is an exemplary drawing for illustrating a carbon byproduct removal system according to some other embodiments.

[0036] Referring to FIG. 7, the carbon byproduct removal system (1000E) may further include a booster pump (321) connected between the foreline (310) and the vacuum pump (320). The booster pump (321) may be provided to increase the exhaust speed. For example, the booster pump (321) may be provided together with the vacuum pump (320) in the form of a dry pump to obtain a higher pump speed and a lower vacuum than when the vacuum pump (320) is used alone.

[0037] FIG. 8 is an exemplary drawing for illustrating a carbon byproduct removal system according to some other embodiments.

[0038] Referring to FIG. 8, the carbon byproduct removal system (1000F) may include a heat jacket (510) that covers the outer surface of an exhaust module (300) connected to a chamber (200). As illustrated in FIG. 8, the heat jacket (510) may be provided to cover the entire outer surface of the exhaust module (300). For example, the heat jacket (510) may be provided in the form of an insulating material that integrally covers the outer surfaces of the foreline (310), vacuum pump (320), PS line (330), and scrubber (340). Alternatively, in a different embodiment, it may be provided to cover only the outer surface of some components of the exhaust module (300). For example, if there is a need to remove only the carbon byproduct () adsorbed inside the scrubber (340), the heat jacket (510) may cover only the outer surface of the scrubber (340) of the exhaust module (300). Below, an example is given in which the heat jacket (510) covers the entire outer surface of the exhaust module (300).

[0039] The heat jacket (510) can apply heat to the exhaust module (300) and prevent heat from being released, thereby maintaining the interior of the exhaust module (300) at a constant temperature. According to an embodiment, the heat jacket (510) can maintain the interior of the exhaust module (300) at 120°C to 250°C or lower. Accordingly, by heating the carbon byproduct (400) adsorbed inside the foreline (310), vacuum pump (320), PS line (330), and scrubber (340) of the exhaust module (300), it is possible to prevent reaction byproducts discharged from the chamber (200) from adhering to the interior of the exhaust module (300). For example, the carbon byproduct (400) adsorbed inside the exhaust module (300) may be in a high-viscosity liquid state. These carbon byproducts (400) can be removed from the exhaust module (300) by applying heat above their boiling point to make the carbon byproducts (400) into a gaseous state or solidify them.

[0040] FIG. 9 is an exemplary drawing for illustrating a carbon byproduct removal system according to some other embodiments.

[0041] Referring to FIG. 9, the carbon byproduct removal system (1000G) may include a heating module (500) provided in at least a part of the exhaust module (300). The heating module (500) may include a heat jacket (510) covering the outer surface of the exhaust module (300) and a heater (520) placed inside the exhaust module (300). The heater (510) is formed in a coil shape so as to maintain a uniform temperature throughout the exhaust module (300). FIG. 9 illustrates an example where the heating module (500) is applied to the foreline (310) of the exhaust module (300), but the heating module (500) may be applied to any part of the exhaust module (300) where carbon byproducts (400) are adsorbed.

[0042] FIG. 10 is an exemplary drawing for illustrating a carbon byproduct removal system according to some other embodiments.

[0043] Referring to FIG. 10, the carbon byproduct removal system (1000H) can be implemented in a combined form of a carbon byproduct removal module (100) attached to an exhaust module (300) and a heating module (500) applied to the exhaust module (300). By attaching the carbon byproduct removal module (100) to a point inside the exhaust module (300) where carbon byproducts (400) discharged from the chamber (200) are adsorbed, the carbon byproducts (400) can be made into a form that can be easily vaporized when heat is applied, and the adsorbed carbon byproducts (400) can be removed by applying heat to the deformed carbon byproducts (400) using the heating module (500). Of course, the combination of the carbon byproduct removal module (100) and the heating module (500) can be applied to any component of the exhaust module (300) where carbon byproducts (400) are adsorbed.

[0044] In some embodiments, carbon byproducts (400) need to be removed as they are adsorbed inside the exhaust module (300), but carbon byproducts (400) can be efficiently removed by introducing a carbon byproduct removal module (100) in a location where it is difficult to introduce a heating module (500). Additionally, even if only one of the heating module (500) or the carbon byproduct removal module (100) is introduced into the exhaust module (300), it may be effective to remove carbon byproducts (400). However, by combining the heating module (500) and the carbon byproduct removal module (100) to transform the carbon byproducts (400) into a state where they can be easily vaporized even at low temperatures, and then applying heat to the exhaust module (300), damage to the exhaust module (300) due to high temperatures can be prevented.

[0045] FIG. 11 is an exemplary flowchart illustrating a carbon byproduct removal method according to some embodiments. FIGS. 12 to 15 are intermediate step diagrams illustrating a carbon byproduct removal method according to some embodiments. Hereinafter, with reference to FIGS. 11 to 15, a method for removing carbon byproducts (400) adsorbed on the exhaust module (300) of a chamber (200) using a carbon byproduct removal module (100) will be described.

[0046] First, referring to FIGS. 11 and 12, a chamber (200) in which a semiconductor manufacturing process is performed and an exhaust module (300) connected to the chamber (200) are provided (S100). Next, a carbon byproduct removal module (100) is attached to a component (e.g., a foreline (310)) in which carbon byproducts (400) are adsorbed inside, among the components (310, 320, 330, 340) of the exhaust module (300) (S110). Next, vapor (111, Vapor) containing oxygen atoms is generated using an evaporator (110) (S120). For example, vapor (111) can be generated by generating ultrasonic waves at the bottom of the evaporator (110) and applying ultrasonic vibrations to the liquid contained in the evaporator (110). At this time, the liquid contained inside the evaporator (110) may be a substance capable of generating highly reactive oxygen radicals when energy is applied in a vapor state, such as hydrogen peroxide (H2O2).

[0047] Next, referring to FIGS. 11 and FIGS. 13, a carrier gas (121) is supplied from a carrier gas supply unit (120) to an evaporator (110) to move the steam (111) generated in the evaporator (110) and the carrier gas (121) together to an ultraviolet irradiator (130) (S130). At this time, a mass flow controller (140) is positioned between the carrier gas supply unit (120) and one end (110A) of the evaporator (110) so that the carrier gas (121) can be moved from the carrier gas supply unit (120) to the evaporator (110) and the amount of carrier gas (121) moving from the carrier gas supply unit (120) to the evaporator (110) can be controlled.

[0048] Next, referring to FIGS. 11 and 14, ultraviolet rays are irradiated onto steam (111) using an ultraviolet irradiator (130) to generate a first oxygen radical (131) (S140). At this time, if the carrier gas (121) that moved to the ultraviolet irradiator (130) together with the steam (111) contains a gas containing oxygen atoms such as CDA or oxygen (O2), the carrier gas (121) can generate a second oxygen radical by receiving energy from the ultraviolet rays emitted from the ultraviolet irradiator (130).

[0049] Next, referring to FIGS. 11 and FIGS. 15, a first oxygen radical (131) is supplied to the carbon byproduct (400) inside the exhaust module (300) connected to one end (130A) of the ultraviolet irradiator (130) to remove the carbon byproduct (400) or to transform it into a form that is easy to remove (S150). At this time, if a second oxygen radical with high reactivity is generated from the carrier gas (121), the second oxygen radical may be supplied into the exhaust module (300) to remove the carbon byproduct (400). In addition, in some embodiments, a heating module (500) may be provided to at least a part of the exhaust module (300) to remove the carbon byproduct (400) adsorbed inside the exhaust module (300).

[0050] FIGS. 16 and 17 are exemplary drawings illustrating the carbon byproduct removal effect according to some embodiments.

[0051] Referring to FIG. 16, A1 is a graph corresponding to the case where only a heating module (500) is introduced into the exhaust module (300) without applying a carbon byproduct removal module (100) to the exhaust module (300). Referring to A1, when the exhaust module (300) is heated using the heating module (500), the byproduct can be removed at a specific temperature or higher. A2 is a graph corresponding to the case where a carbon byproduct removal module (100) using CDA as a carrier gas (121) is applied to the exhaust module (300). Referring to A2, when oxygen radicals are reacted with the carbon byproduct (400) inside the exhaust module (300) in addition to heating the inside of the exhaust module (300), the temperature at which the byproduct is removed can be reduced compared to A1. In addition, the amount of byproduct remaining at the same temperature can be reduced compared to A1. In this way, carbon byproducts (400) inside the exhaust module (300) can be directly decomposed and removed by reacting them with oxygen radicals using the carbon byproduct removal module (100), but carbon byproducts (400) can also be transformed into a form that can be easily vaporized even at low temperatures, thereby allowing for the efficient removal of carbon byproducts (400) without applying excessive heat to the exhaust module (300).

[0052] Next, referring to FIG. 17, B is a graph showing the remaining amount of byproduct when the temperature of the foreline (310) is gradually increased to 130°C, 150°C, and 180°C while the temperature of the vacuum pump (320) is maintained at approximately 150°C by the heating module (500). C is a graph showing the remaining amount of byproduct when the temperature of the vacuum pump (320) is gradually increased to 150°C and 190°C while the temperature of the foreline (310) is maintained at approximately 180°C by the heating module (500). In this way, by selectively heating at least a part of the components of the exhaust module (300), including the foreline (310) and the vacuum pump (320), by the heating module (500), carbon byproduct (400) adsorbed inside the exhaust module (300) can be removed. At this time, the higher the temperature applied to the exhaust module (300), the more carbon byproducts (400) can be removed; however, if the temperature of the exhaust module (300) rises above a certain temperature, damage may occur. Accordingly, by using the carbon byproduct removal module (100) to transform the carbon byproducts (400) into a state where they can be easily vaporized at a relatively low temperature, the carbon byproducts (400) can be efficiently removed while preventing damage to the exhaust module (300).

[0053] Although embodiments of the present invention have been described above with reference to the attached drawings, those skilled in the art will understand that the present invention may be implemented in other specific forms without changing its technical concept or essential features. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. Explanation of the symbols

[0054] 100: Carbon byproduct removal module 110: Evaporator 120: Carrier gas supplier 130: UV irradiator 140: Mass flow controller 200: Chamber 300: Exhaust Module 310: Foreline 320: Vacuum pump 330: PS line 340: Scrubber 400: Carbon byproduct 500: Heating module 510: Heat jacket 520: Heater 1000: Carbon byproduct removal system

Claims

Claim 1 A carbon byproduct removal module comprising: a vaporizer that generates vapor containing oxygen atoms; a carrier gas supplyer that supplies a carrier gas to the vaporizer to move the vapor to a UV activator; and the UV activator that irradiates light containing ultraviolet rays onto the vapor, wherein one end of the UV activator is connected to one end of the vaporizer and the other end of the UV activator is attached to an exhaust module of a chamber where a semiconductor manufacturing process is performed. Claim 2 A carbon byproduct removal module according to claim 1, wherein the exhaust module includes a vacuum pump that maintains the inside of the chamber in a vacuum state or discharges byproducts generated inside the chamber while the semiconductor manufacturing process is performed. Claim 3 In claim 1, the evaporator is a carbon byproduct removal module that generates the steam using ultrasound. Claim 4 A carbon byproduct removal system comprising: a chamber in which a semiconductor manufacturing process is performed; an exhaust module for exhausting the interior of the chamber; and a carbon byproduct removal module attached to the exhaust module for removing carbon byproducts inside the exhaust module, wherein the exhaust module comprises: a vacuum pump connected to the chamber and maintaining the interior of the chamber in a vacuum state or discharging byproducts generated inside the chamber while the semiconductor manufacturing process is in progress; a foreline connected between the chamber and the vacuum pump; a scrubber connected to the vacuum pump for removing byproducts generated inside the chamber; and a PS line connected between the vacuum pump and the scrubber, wherein the carbon byproduct removal module comprises: a vaporizer for generating vapor containing oxygen atoms; a carrier gas supplyer for supplying a carrier gas to the vaporizer to move the vapor to a UV activator; and the UV activator for irradiating light containing ultraviolet rays onto the vapor. Claim 5 A carbon byproduct removal system according to claim 4, further comprising a heating module provided to at least a portion of the exhaust module. Claim 6 A carbon byproduct removal system according to claim 5, wherein the heating module comprises a heat jacket provided to cover at least a portion of the outer surface of the exhaust module. Claim 7 In paragraph 5, the carbon byproduct removal system comprises a heating module including a coil-shaped heater provided inside the exhaust module. Claim 8 A method for removing carbon byproducts, comprising: a chamber in which a semiconductor manufacturing process is performed; an exhaust module for exhausting the interior of the chamber; a carbon byproduct removal module for removing carbon byproducts inside the exhaust module; and attaching the carbon byproduct removal module to the exhaust module to remove carbon byproducts inside the exhaust module, wherein removing carbon byproducts inside the exhaust module using the carbon byproduct removal module comprises generating vapor containing oxygen atoms by means of a vaporizer, supplying a carrier gas to the vaporizer by means of a carrier gas supplyer to move the vapor together with the carrier gas to a UV activator, irradiating the vapor with light containing ultraviolet rays by means of the UV activator to generate a first oxygen radical, and supplying the first oxygen radical to the carbon byproducts inside the exhaust module to remove the carbon byproducts. Claim 9 A method for removing carbon byproducts according to claim 8, further comprising irradiating the carrier gas with light containing ultraviolet rays using the ultraviolet irradiator to generate a second oxygen radical, and supplying the second oxygen radical to carbon byproducts inside the exhaust module to remove the carbon byproducts, wherein the carrier gas contains oxygen atoms. Claim 10 A method for removing carbon byproducts according to claim 8, further comprising providing a heat jacket covering at least a portion of the outer surface of the exhaust module and providing a coil-shaped heater inside the exhaust module.

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