An electric inspection apparatus for large area substrate

Abstract

The present invention is the result of research conducted on the 2023 Chungbuk Technology Development Support Project for Materials, Parts, and Equipment, 550x650 Work Size Substrate Inspection Device Development Project, which is being carried out with the support of Chungcheongbuk-do and the Chungbuk Institute of Science and Technology Innovation. An electrical inspection device for a large-area substrate according to one embodiment of the present invention comprises: a shuttle module formed to be movable while a large-area substrate is fixedly mounted; and an inspection module that performs an electrical inspection of the large-area substrate mounted on the shuttle module; wherein the shuttle module and the inspection module are driven simultaneously.

Description

Technology Field

[0001] The present invention relates to an electrical inspection device, and more specifically, to an electrical inspection device capable of performing electrical inspection of a large-area substrate quickly and accurately using a single shuttle. Background Technology

[0003] The present invention is the result of research conducted on the 2023 Chungbuk Technology Development Support Project for Materials, Parts, and Equipment, 550x650 Work Size Substrate Inspection Device Development Project, which is being carried out with the support of Chungcheongbuk-do and the Chungbuk Institute of Science and Technology Innovation.

[0004] Printed Circuit Boards (PCBs) are configured to allow the attachment of various semiconductors and passive components and to connect these parts to one another. As core components forming the foundation of all electronic products—ranging from small home appliances to advanced communication devices, military equipment, and the aerospace industry—PCBs hold significant importance, capable of influencing the technology and production activities of electronic products.

[0005] A large-area substrate has multiple pads formed for mounting electronic components, and an electrical inspection is performed to verify the electrical connections between each pad before the large-area substrate is shipped.

[0006] Recently, as the integration density of electronic components has increased and the demand for thin-type large-area substrates has grown, there is a growing need for high-reliability electrical inspection devices capable of performing electrical inspections on fine-patterned and thin-type large-area substrates.

[0007] In particular, a device that performs electrical inspection of large-area substrates by operating two shuttles simultaneously to improve not only high reliability but also inspection speed has been proposed. However, there is a problem that the accuracy of the electrical inspection is somewhat reduced due to vibrations that may occur during shuttle movement, so it is necessary to propose an electrical inspection device and method to improve this.

[0008] Meanwhile, the following prior art documents disclose an electrical inspection device for a printed circuit board, an inspection jig, and a method for verifying the fixation of the inspection jig, which enable miniaturization and cost reduction of the device while eliminating the need for adjustment work, but do not disclose the technical essence of the present invention. Prior art literature

[0010] Republic of Korea Published Patent Application No. 10-2007-0045099 The problem to be solved

[0011] An electrical inspection device for a large-area substrate according to one embodiment of the present invention aims to solve the following problems in order to solve the aforementioned problems.

[0012] The invention provides an electrical inspection device capable of performing accurate and rapid electrical inspection of large-area substrates using a single shuttle.

[0013] In addition, it provides an electrical inspection device capable of preventing sagging of a thin-type large-area substrate.

[0014] The problems solved by the present invention are not limited to those mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below. means of solving the problem

[0016] An electrical inspection device for a large-area substrate according to one embodiment of the present invention comprises: a stacker module configured to load a large-area substrate and including at least one of a load stacker, a pass stacker, a re-inspection stacker, and a fail stacker; a first pickup module for picking up a large-area substrate loaded on the load stacker; a shuttle module formed to receive the large-area substrate from the first pickup module and to be movable while the large-area substrate is fixedly seated thereon; an inspection module for performing an electrical inspection of the large-area substrate seated on the shuttle module; and a second pickup module for picking up a large-area substrate for which an electrical inspection has been completed by the inspection module and transferring it to at least one of the pass stacker, the re-inspection stacker, and the fail stacker; wherein at least two of the shuttle module, the first pickup module, the inspection module, and the second pickup module are driven simultaneously.

[0017] The above shuttle module preferably comprises: a clamp unit that receives and places the large-area substrate from the first pickup module and then fixes the large-area substrate; a first transfer rail and a second transfer rail respectively disposed at the lower sides of one and the other of the clamp unit to guide the movement of the clamp unit to the inspection module; and a base plate respectively disposed at the lower sides of the first transfer rail and the second transfer rail to support the first transfer rail and the second transfer rail.

[0018] The clamp unit comprises: a first clamp portion for clamping one side of the large-area substrate; and a second clamp portion arranged opposite to the first clamp portion for clamping the other side of the large-area substrate; wherein at least one of the first clamp portion and the second clamp portion is formed to be movable in the X-axis direction, and the first clamp portion and the second clamp portion each have a plurality of clamps arranged spaced apart from each other.

[0019] It is preferable that at least one of the plurality of clamps included in the first clamp part is configured to move in the Y-axis direction or rotate about the Z-axis, and at least one of the plurality of clamps included in the second clamp part is configured to move in the Y-axis direction or rotate about the Z-axis.

[0020] The apparatus includes a first camera for photographing a large-area substrate transferred to the clamp unit by the first pickup module, and a second camera for photographing a large-area substrate transferred to the inspection module by the first transfer rail and the second transfer rail, wherein the shuttle module further includes a clamping control unit for controlling the clamp unit, and the clamping control unit preferably controls the clamp unit based on a first image of the large-area substrate captured by the first camera and a second image of the large-area substrate captured by the second camera.

[0021] The clamping control unit comprises: a substrate information acquisition unit that acquires large-area substrate information including the size, thickness, shape, pad arrangement, and material of the large-area substrate based on the first image; a substrate damage information acquisition unit that acquires substrate damage information including whether the large-area substrate transferred to the inspection module is damaged and the location of the damage based on the second image; a first big data storage unit that stores the large-area substrate information, the substrate damage information, and clamping parameters of the corresponding large-area substrate; a first machine learning unit that defines the large-area substrate information and clamping parameters stored in the first big data storage unit as input factors, defines the substrate damage information as output factors, and derives a correlation between the input factors and output factors; and a first parameter generation unit that generates an optimal clamping parameter corresponding to the large-area substrate mounted on the clamp unit by selecting a clamping parameter corresponding to a condition in which no damage to the large-area substrate occurs among the correlations derived by the first machine learning unit, based on the large-area substrate information acquired by the substrate information acquisition unit. It is preferable to include a clamp driving unit that drives the clamps of the first clamp unit and the second clamp unit based on the optimal clamping parameters above.

[0022] It is preferable to further include a vibration sensor that detects vibrations generated in at least one of the first pickup module, the shuttle module, and the second pickup module, and an excitation module that generates a canceling vibration having an opposite phase to the vibration detected by the vibration sensor and applies it to the inspection module.

[0023] The apparatus further includes a laser marking module that performs laser marking before transferring a large-area substrate, which has been judged defective by the second pickup module, to the fail stacker; wherein the laser marking module comprises: a laser marking table on which the large-area substrate judged defective is placed; a laser marking unit that marks a defect mark on the large-area substrate; a dust suction unit that removes dust generated during the marking process of the laser marking unit; and a laser marking module control unit that controls the laser marking unit and the dust suction unit; and the second pickup unit preferably transfers the large-area substrate marked with a defect mark to the fail stacker.

[0024] The laser marking module control unit comprises: a second big data storage unit that stores large-area substrate information including the size, thickness, shape, pad arrangement, and material of the large-area substrate, state information of a defect mark marked by the laser marking unit, state information of dust generated during the laser marking process of the large-area substrate, and control state information including the laser output state of the laser marking unit and the suction state of the dust suction unit; a second machine learning unit that defines the large-area substrate information and control state information as input factors, defines the state information of the defect mark and the state information of the dust as output factors, and derives a correlation between the input factors and the output factors; a second parameter generation unit that generates an optimal laser output of the laser marking unit and an optimal suction force of the dust suction unit based on the correlation derived from the second machine learning unit and information of the large-area substrate mounted on the laser marking table; and a laser marking unit driving unit that drives the laser marking unit based on the optimal laser output. It is preferable to include a dust suction unit driving unit that drives the dust suction unit based on the optimal suction force. Effects of the invention

[0026] In an electrical inspection device for a large-area substrate according to one embodiment of the present invention, since multiple shuttles are not driven simultaneously, the effect of preventing a decrease in inspection accuracy caused by vibration that may occur during the process of one shuttle performing an electrical inspection can be expected.

[0027] In addition, in the case of the conventional 2-shuttle method, when mounting the inspection jig, two shuttles must be set to the same alignment, which has the problem of requiring a long time for setting by a skilled technician. However, since the large-area substrate electrical inspection device and electrical inspection method according to one embodiment of the present invention operate only one shuttle, the inspection jig can be easily set even by a non-highly skilled technician, so the effect of solving the problem of the aforementioned 2-shuttle method can be expected.

[0028] In addition, by minimizing vibration even when applying a high-output motor for rapid electrical inspection using only a single shuttle, it is possible to expect improvements in the reliability and increased inspection efficiency of electrical inspections on large-area boards.

[0029] Furthermore, by providing various types of large-area substrate planarization processes, it is possible to expect the effect of performing accurate electrical inspection of thin large-area substrates.

[0030] The effects of the present invention are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art from the description below. Brief explanation of the drawing

[0032] FIG. 1 is a conceptual diagram briefly illustrating an electrical inspection device for a large-area substrate according to one embodiment of the present invention. FIG. 3 is a perspective view of a shuttle module among the components of an electrical inspection device for a large-area substrate according to one embodiment of the present invention. FIG. 4 is a plan view of a shuttle module among the configurations of an electrical inspection device for a large-area substrate according to one embodiment of the present invention. FIG. 5 is a block diagram illustrating the detailed configuration of a clamping control unit of a shuttle module in an electrical inspection device for a large-area substrate according to one embodiment of the present invention. FIG. 6 is a block diagram illustrating the detailed configuration of a laser marking module of an electrical inspection device for a large-area substrate according to one embodiment of the present invention. FIG. 7 is a block diagram illustrating the detailed configuration of a laser marking module control unit of a laser marking module in an electrical inspection device for a large-area substrate according to one embodiment of the present invention. Specific details for implementing the invention

[0033] Preferred embodiments according to the present invention will be described in detail with reference to the attached drawings, provided that identical or similar components are given the same reference number regardless of the drawing symbols, and redundant descriptions thereof will be omitted.

[0034] Furthermore, in describing the present invention, detailed descriptions of related prior art are omitted if it is determined that such descriptions could obscure the essence of the invention. Additionally, it should be noted that the attached drawings are intended only to facilitate an understanding of the concept of the present invention and should not be interpreted as limiting the concept of the present invention.

[0036] Hereinafter, an electrical inspection device for a large-area substrate according to an embodiment of the present invention will be described with reference to FIGS. 1 to 7.

[0037] An electrical inspection device for a large-area substrate according to one embodiment of the present invention is configured to inspect the connection status between pads formed on a large-area substrate and basically includes a shuttle module (300) and an inspection module (400) as shown in FIG. 1.

[0038] In addition, as shown in FIG. 2, a stacker module (100), a second pickup module (210), a second pickup module (220), and a laser marking module (500) may be additionally configured, and these additional modules may be configured to be detachably attached to an electrical inspection device for a large-area substrate.

[0039] Hereinafter, the basic module and additional module of the present invention will be described in their entirety with reference to FIG. 2.

[0040] The stacker module (100) is configured to load a large-area substrate before electrical inspection and a large-area substrate after electrical inspection, and can be divided into a plurality of stacker units as shown in FIG. 2. Specifically, the stacker module (100) can be divided and arranged into a load stacker (110), a pass stacker (120), a re-inspection stacker (130), and a fail stacker (140).

[0041] The load stacker (110) is configured to load a large-area substrate prior to electrical inspection, and the pass stacker (120) is configured to load a large-area substrate that has been judged as good by the inspection module (400) after electrical inspection.

[0042] The re-inspection stacker (130) is configured to load a large-area substrate that has been determined to require re-inspection by the inspection module (400) after an electrical inspection, and the fail stacker (140) is configured to load a large-area substrate that has been determined to be defective by the inspection module (400).

[0043] The first pickup module (210) is configured to perform the function of picking up a large-area substrate loaded on the load stacker (110) among the stacker modules (100) and transferring it to the shuttle module (300).

[0044] It is preferable that the first pickup module (210) be configured to be movable in three axes, X-axis, Y-axis, and Z-axis so as to be able to pick up a large-area substrate by vacuum adsorbing the upper surface of the large-area substrate and to transfer the picked-up large-area substrate to the shuttle module (300).

[0045] The shuttle module (300) is configured to receive a large-area substrate from the first pickup module (210) and to be movable while the large-area substrate is fixedly seated, and is configured to include a clamp unit (310), a first transfer rail (320), a second transfer rail (330), and a platen (340) as shown in FIGS. 3 and 4.

[0046] The clamp unit (310) receives a large-area substrate from the first pickup module (210), places it, and performs the function of fixing the large-area substrate. It is configured to be composed of a pair of clamp parts (350, 360) to clamp one side and the other side of the large-area substrate, and specifically, as shown in FIG. 4, it is configured to include a first clamp part (350) and a second clamp part (360).

[0047] The first clamp part (350) is configured to clamp one side of a large-area substrate, and the second clamp part (360) is positioned opposite to the first clamp part (350) to perform the function of clamping the other side of the large-area substrate, and at least one of the first clamp part (350) and the second clamp part (360) is formed to be movable along the X-axis direction, that is, the width direction of the large-area substrate.

[0048] In particular, the first clamp part (350) and the second clamp part (360) may each be equipped with a plurality of clamps as shown in FIG. 4, and in particular, for stable fixing and support of a large-area substrate, each may be equipped with five clamps as shown in FIG. 4.

[0049] That is, the first clamp section (350) may include first clamps (350a) to fifth clamps (350e) arranged sequentially spaced apart at preset intervals, and the second clamp section (360) may include sixth clamps (360a) to tenth clamps (360e) corresponding to each of the first clamps (350a) to fifth clamps (350e).

[0050] Here, at least one of the second clamp (350b) to the fourth clamp (350d) may correspond to the center clamp of the first clamp section (350), and at least one of the sixth clamp (360b) to the ninth clamp (360d) may correspond to the center clamp of the second clamp section (360), and the center clamps of the first clamp section (350) and the second clamp section (360) are fixedly installed on the first clamp section (350) and the second clamp section (360), respectively.

[0051] In addition, the first clamp (350a) and the fifth clamp (350e) correspond to the side clamps of the first clamp part (350) and are configured to move a preset distance or rotate by a preset angle within the first clamp part (350).

[0052] Likewise, the 6th clamp (360a) and the 10th clamp (360e) correspond to the side clamps of the 2nd clamp section (360) and are configured to move a preset distance or rotate by a preset angle within the 2nd clamp section (360).

[0053] With the configuration of this clamp unit (320), even a large-area thin substrate can be flattened efficiently and precisely.

[0054] To explain the flattening process of a large-area substrate by the clamp unit (320) described above in more detail, first, at least one of the first clamp part (350) and the second clamp part (360), which are formed to face each other, moves along the X-axis direction, that is, the width direction of the large-area substrate, and comes into contact with one side and the other side of the large-area substrate.

[0055] Subsequently, the center clamps of the first clamp section (350) and the second clamp section (360) clamp one side and the other side of the large-area substrate, respectively, and subsequently, the side clamps of the first clamp section (350) and the second clamp section (360) clamp the large-area substrate.

[0056] Next, while all clamps are clamping the large-area substrate, at least one of the first clamp part (350) and the second clamp part (360) moves away from each other along the X-axis direction, that is, the width direction of the large-area substrate, and applies tension in the X-axis direction of the large-area substrate, thereby applying tension in the X-axis direction to the large-area substrate.

[0057] Afterwards, a step of applying tension in the X-axis direction to the edge area of ​​a large-area substrate may be performed. Specifically, the first clamp (350a) and the fifth clamp (350e), which are side clamps of the first clamp part (350), and the sixth clamp (360a) and the tenth clamp (360e), which are side clamps of the second clamp part (360), are moved in mutually opposing directions along the X-axis to apply tension in the X-axis direction to the edge area of ​​the large-area substrate.

[0058] Meanwhile, considering that a more precise planarization process is required for thin-type large-area substrates, a step of applying tension in the Y-axis direction, that is, in the longitudinal direction of the large-area substrate, to the edge area of ​​the large-area substrate may be performed.

[0059] Specifically, the first clamp (350a) and the sixth clamp (360a), and the fifth clamp (350e) and the tenth clamp (360e) are moved in mutually opposing directions to apply tension in the Y-axis direction to the large-area substrate.

[0060] Although the technical feature of applying tension to the edge area of ​​a large-area substrate described above was explained on the premise that the side clamp is formed to be movable in the X-axis or Y-axis direction by a preset distance within the first clamp part (350) or the second clamp part (360), it is also possible to apply tension to the edge area of ​​a large-area substrate by forming the side clamp to be rotatable at a preset angle within the first clamp part (350) or the second clamp part (360).

[0061] In this case, if the first clamp (350a) and the tenth clamp (360e) are rotated in one direction at a preset angle, and at the same time the fifth clamp (350e) and the sixth clamp (360a) are rotated in the other direction at a preset angle, tension can be applied simultaneously in the X-axis direction and the Y-axis direction to the edge area of ​​the large-area substrate (theta tension).

[0062] Meanwhile, during the flattening process of a thin, large-area substrate, if the clamp unit (310) applies excessive tension to the large-area substrate, damage such as tearing of the large-area substrate or cracking of the pads may occur, so it is necessary to check for such damage. Furthermore, accurate alignment of the large-area substrate is required in the inspection module (400) to be described later. To this end, an electrical inspection device for a large-area substrate according to one embodiment of the present invention may be equipped with a first camera (610), a second camera (620), and a third camera (630) as shown in FIG. 1.

[0063] The first camera (610) performs the function of photographing a large-area substrate transferred to a clamp unit (310) by the first pickup module (210), and the second camera (620) performs the function of identifying the location of a pad formed within the large-area substrate based on the fiducial mark by photographing a large-area substrate transferred to an inspection module (400) by the first transfer rail (320) and the second transfer rail (330) before inspecting the large-area substrate.

[0064] The third camera (630) performs the function of verifying whether there is a match between the position of the pad confirmed by the second camera (620) and the position of the inspection jig of the inspection module (400), and the second camera (620) and the third camera (630) enable the probe or inspection jig to be accurately aligned to a position corresponding to the pad of the large-area substrate during the electrical inspection process by the inspection module (400).

[0065] In particular, optimized control is required to prevent damage to a large-area substrate by a clamp unit (310) using a first camera (610) and a second camera (620). To this end, the shuttle module (300) may further include a clamping control unit (370) that controls the clamp unit (310) based on a first image of the large-area substrate captured by the first camera (610) and a second image of the large-area substrate captured by the second camera (620).

[0066] Specifically, as shown in FIG. 5, this clamping control unit (370) is configured to include a substrate information acquisition unit (371), a substrate damage information acquisition unit (372), a first big data storage unit (373), a first machine learning unit (374), a first parameter generation unit (375), and a clamp driving unit (376).

[0067] The substrate information acquisition unit (371) performs the function of acquiring large-area substrate information including the size, thickness, shape, pad arrangement, and material of the large-area substrate based on the first image, and the substrate damage information acquisition unit (372) performs the function of acquiring substrate damage information including whether the large-area substrate transferred to the inspection module (400) is damaged and the location of the damage based on the second image.

[0068] The first big data storage unit (373) stores the large-area substrate information, the substrate damage information, and the clamping parameters of the large-area substrate, and the first machine learning unit (374) defines the large-area substrate information and clamping parameters stored in the first big data storage unit (373) as input factors, defines the substrate damage information as output factors, and performs the function of deriving the correlation between the input factors and the output factors.

[0069] The first parameter generation unit (375) generates an optimal clamping parameter corresponding to a large-area substrate mounted on a clamp unit (310) by selecting a clamping parameter corresponding to a condition in which damage to the large-area substrate does not occur among the correlations derived from the first machine learning unit (374) based on the large-area substrate information obtained from the substrate information acquisition unit (371), and the clamp driving unit (376) drives the clamps of the first clamp unit (350) and the second clamp unit (360) based on the optimal clamping parameter generated by the first parameter generation unit (375).

[0070] The transfer rails (320, 330) perform the function of guiding the movement of the clamp unit (310) to the inspection module (400), and in order to ensure stable movement of a large-area substrate, it is preferable to have two transfer rails, a first transfer rail (320) and a second transfer rail (330), as shown in FIGS. 3 and 4.

[0071] In addition, the clamp unit (310) may be equipped with a drive motor that generates power to move along the first transfer rail (320) and the second transfer rail (330).

[0072] Specifically, using a ball-screw method, the clamp unit (310) can move in a straight direction along the first transfer rail (320) and the second transfer rail (330), and it is desirable to use a high-output motor to facilitate rapid electrical inspection.

[0073] However, if a high-output motor is used, rapid movement of the clamp unit (310) can be guaranteed, but vibration may occur in the electrical inspection device for large-area substrates due to the movement of the clamp unit (310), and there is a possibility that an error may occur during the process in which the inspection module (400) performs electrical inspection of the large-area substrate due to such vibration.

[0074] In order to prevent the aforementioned problems, the shuttle module (300) can be configured such that the heavy plate (340) supports the transfer rail (330) by placing a heavy plate (340) under the first transfer rail (320) and the second transfer rail (330), respectively.

[0075] By using such a heavy plate (340), the center of gravity of the entire electrical inspection device for a large-area substrate is lowered, and at the same time, even if the clamp unit (310) moves quickly along the first transfer rail (320) and the second transfer rail (330) using a high-output motor, the vibration generated during the movement of the clamp unit (310) is cushioned by the plate (340), so the vibration generated in the entire electrical inspection device for a large-area substrate can be reduced.

[0076] Ultimately, by applying a platen (340) to the shuttle module (300), vibration caused by high speed can be reduced, and through this, the accuracy of the electrical inspection in the inspection module (400) can be guaranteed.

[0077] The inspection module (400) is configured to perform electrical inspection of a large-area substrate mounted on a shuttle module (300), and consists of a probe unit having a plurality of probes arranged therein and an inspection jig corresponding to the inserted large-area substrate, and inspects the electrical connections of a pattern formed inside the large-area substrate.

[0078] In addition, when other components such as the shuttle module (300), the first pickup module (210), the second pickup module (220), and the laser marking module (500) described later are driven simultaneously during the process of electrical inspection of a large-area substrate in the inspection module (400), vibration may occur, and as a result, it may be difficult to perform accurate electrical inspection in the inspection module (400).

[0079] Considering these problems, an electrical inspection device for a large-area substrate according to one embodiment of the present invention may be equipped with a vibration sensor that detects vibrations generated in at least one of a shuttle module (300), a first pickup module (210), a second pickup module (220), and a laser marking module (500), and an excitation module (700) that generates a canceling vibration having a phase opposite to the vibration detected by the vibration sensor and applies it to an inspection module (400).

[0080] The second pickup module (220) performs the function of picking up a large-area substrate that has been inspected by the inspection module (400) and transferring it to the stacker module (100).

[0081] Specifically, the second pickup module (220) transfers a large-area substrate that has been judged as good by the inspection module (400) to the pass stacker (120), and transfers a large-area substrate that has been judged to require re-inspection to the re-inspection stacker (130).

[0082] Meanwhile, in the case of a large-area substrate that has been deemed defective by the inspection module (400), the second pickup module (220) does not immediately transfer the large-area substrate to the stacker module (100), i.e., the fail stacker (140), but first transfers it to the laser marking module (500).

[0083] The laser marking module (500) is configured to perform laser marking on a large-area substrate that has been judged defective by the second pickup module (220) before transferring it to the fail stacker (120).

[0084] As shown in FIG. 6, this laser marking module (500) is configured to include a laser marking table (510) for placing a large-area substrate that has been judged to be defective, a laser marking unit (520) for marking a defect mark on the large-area substrate using a laser, and a dust removal unit (530) for removing dust generated during the marking process of the laser marking unit (520).

[0085] A large-area substrate marked with a defect mark by a laser marking module (500) is transferred to a fail stacker (140) by a second pickup unit (220).

[0086] Meanwhile, if a defect mark is marked on a large-area substrate when the laser output of the laser marking unit (520) is too high, too much dust may be generated, and conversely, if a defect mark is marked on a large-area substrate when the laser output is too low, the marking may not be done properly, so it is necessary to set the optimal laser output by considering the thickness and material of the large-area substrate.

[0087] In addition, if the suction power of the dust suction unit (530) is set too strong, unnecessary power may be consumed, and conversely, if the suction power is set too weak, dust cannot be properly sucked in, so it is necessary to set the optimal suction amount by considering the thickness, material, shape, etc. of the large-area substrate.

[0088] To this end, the laser marking module (500) may include a laser marking module control unit (540) that controls the laser marking unit (520) and the dust absorption unit (530), and the laser marking module control unit (540) may include a second big data storage unit (541), a second machine learning unit (542), a second parameter generation unit (543), a laser marking unit driving unit (544), and a dust absorption unit driving unit (545), as shown in FIG. 7.

[0089] The second big data storage unit (541) performs the function of storing large-area substrate information including the size, thickness, shape, pad arrangement, and material of the large-area substrate, status information of a defect mark marked by the laser marking unit (520), status information of dust generated during the laser marking process of the large-area substrate, and control status information including the laser output status of the laser marking unit (520) and the suction status of the dust suction unit (530).

[0090] The second machine learning unit (542) defines the above-described large-area substrate information and control state information as input factors, defines the state information of the defect mark and the state information of the dust as output factors, and performs the function of deriving the correlation between the input factors and the output factors.

[0091] The second parameter generation unit (543) performs the function of generating the optimal laser output of the laser marking unit (520) and the optimal suction power of the suction unit (530) based on the correlation derived from the second machine learning unit (542) and the information of the large-area substrate placed on the laser marking table (510).

[0092] The laser marking unit driving unit (544) drives the laser marking unit (520) based on the optimal laser output generated by the second parameter generating unit (543), and the dust suction unit driving unit (545) also drives the dust suction unit (530) based on the optimal suction power generated by the second parameter generating unit (543).

[0094] Although the present invention has been described in detail using preferred embodiments, the scope of the invention is not limited to specific embodiments and should be interpreted by the appended claims. Furthermore, those skilled in the art will understand that many modifications and variations are possible without departing from the scope of the invention. Explanation of the symbols

[0096] 100: Stacker Module 210: 1st Pickup Module 220: 2nd Pickup Module 310: Clamp unit 320: 1st transfer rail 330: 2nd transfer rail 340: The opposite 350: 1st clamp section 360: Second clamp section 370: Clamping control unit 400: Inspection Module 500: Laser marking module 510: Laser Marking Table 520: Laser Marking Unit 530: Dust absorption unit 540: Laser Marking Module Control Unit 610, 620, 630: Camera 700: Excitation module

Claims

Claim 1 A shuttle module formed to be movable while a large-area substrate is fixedly mounted; and an inspection module that performs an electrical inspection of the large-area substrate mounted on the shuttle module; wherein the shuttle module and the inspection module are driven simultaneously, and the shuttle module includes: a clamp unit that receives and mounts the large-area substrate and then fixes the large-area substrate; and a first transfer rail and a second transfer rail respectively disposed on the lower sides of one side and the other side of the clamp unit to guide the movement of the clamp unit to the inspection module; and a first camera that photographs the large-area substrate transported to the clamp unit and a second camera that photographs the large-area substrate transported to the inspection module by the first transfer rail and the second transfer rail; and the shuttle module further includes a clamping control unit that controls the clamp unit; wherein the clamping control unit controls the clamp unit based on a first image of the large-area substrate captured by the first camera and a second image of the large-area substrate captured by the second camera, and the clamping The control unit comprises: a substrate information acquisition unit that acquires large-area substrate information including the size, thickness, shape, pad arrangement, and material of the large-area substrate based on the first image; a substrate damage information acquisition unit that acquires substrate damage information including whether the large-area substrate transferred to the inspection module is damaged and the location of the damage based on the second image; a first big data storage unit that stores the large-area substrate information, the substrate damage information, and clamping parameters of the corresponding large-area substrate; and a first machine learning unit that defines the large-area substrate information and clamping parameters stored in the first big data storage unit as input factors, defines the substrate damage information as an output factor, and derives a correlation between the input factors and the output factors.An electrical inspection device for a large-area substrate, characterized by comprising: a first parameter generation unit that generates an optimal clamping parameter corresponding to a large-area substrate mounted on a clamp unit by selecting, based on large-area substrate information obtained from a substrate information acquisition unit, a clamping parameter corresponding to a condition in which damage to the large-area substrate does not occur among the correlations derived from the first machine learning unit; and a clamp driving unit that drives the clamp unit based on the optimal clamping parameter. Claim 2 An electrical inspection device for a large-area substrate according to claim 1, wherein the shuttle module further comprises a platen that is disposed below the first transfer rail and the second transfer rail, respectively, and supports the first transfer rail and the second transfer rail. Claim 3 An electrical inspection device for a large-area substrate according to claim 1, wherein the clamp unit comprises: a first clamp portion for clamping one side of the large-area substrate; and a second clamp portion disposed opposite to the first clamp portion for clamping the other side of the large-area substrate, wherein at least one of the first clamp portion and the second clamp portion is formed to be movable in the X-axis direction, and the first clamp portion and the second clamp portion each have a plurality of clamps arranged spaced apart from each other. Claim 4 An electrical inspection device for a large-area substrate according to claim 3, wherein at least one of the plurality of clamps included in the first clamp part is configured to move in the Y-axis direction or rotate about the Z-axis, and at least one of the plurality of clamps included in the second clamp part is configured to move in the Y-axis direction or rotate about the Z-axis. Claim 5 delete Claim 6 An electrical inspection device for a large-area substrate according to claim 1, further comprising: a stacker module configured to load the large-area substrate and including at least one of a load stacker, a pass stacker, a re-inspection stacker, and a fail stacker; a first pickup module that picks up the large-area substrate loaded on the load stacker and transmits it to the shuttle module; a second pickup module that picks up the large-area substrate for which electrical inspection has been completed by the inspection module and transmits it to at least one of the pass stacker, the re-inspection stacker, and the fail stacker; and a laser marking module that performs laser marking on the large-area substrate that has been judged defective and transmitted from the second pickup module before transmitting it to the fail stacker; wherein the stacker module, the first pickup module, the second pickup module, and the laser marking module are formed to be detachably attachable to the electrical inspection device for a large-area substrate.

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