Cooling device

Abstract

The present specification relates to a cooling device, and more specifically, to a device for cooling a semiconductor device. A cooling device according to one embodiment may include a main body, a fluid supply unit connected to the main body and supplying fluid supplied from a fluid supply device to the main body, and a fluid discharge unit connected to the main body and delivering the fluid discharged from the main body to the fluid supply device. In one embodiment, the main body may include an upper plate, an intermediate plate, and a lower plate.

Description

Technology Field

[0001] This specification relates to a cooling device, and more specifically, to a device for cooling a semiconductor device. Background Technology

[0003] Semiconductor devices are devices used to control and process electrical signals in electronic devices, and are primarily made based on semiconductor materials such as silicon. Examples of semiconductor devices include CPUs (Central Processor Units) and RAMs (Random Access Memory), but the types of semiconductor devices are not limited to these.

[0004] Semiconductor devices operate using electrical energy. When electricity flows through a semiconductor device, the device consumes power, and some of this electrical energy is converted into heat. The heat generated during the testing or use of semiconductor devices can degrade their electrical performance or reduce their stability. Therefore, it is essential to introduce an appropriate cooling device to resolve heat generation issues that may occur during the testing or use of semiconductor devices. The problem to be solved

[0006] The purpose of this specification is to provide a cooling device capable of efficiently cooling a semiconductor device during the operation of the semiconductor device.

[0007] The purpose of this specification is not limited to the purposes mentioned above, and other purposes and advantages of this specification not mentioned will be more clearly understood by the embodiments of this specification described below. Furthermore, the purposes and advantages of this specification may be realized by the components and combinations thereof described in the claims. means of solving the problem

[0009] A cooling device according to one embodiment may include a main body, a fluid supply unit connected to the main body and supplying fluid supplied from a fluid supply device to the main body, and a fluid discharge unit connected to the main body and delivering the fluid discharged from the main body to the fluid supply device.

[0010] In one embodiment, the main body may include an upper plate, an intermediate plate, and a lower plate.

[0011] In one embodiment, the upper plate may include a plurality of first walls formed on the lower surface of the upper plate and a plurality of first channels formed between each of the first walls.

[0012] In one embodiment, the intermediate plate may include a plurality of second walls formed on the lower surface of the intermediate plate and a plurality of second channels formed between each of the second walls.

[0013] In one embodiment, the lower plate may include a cooling area formed on the lower surface of the lower plate.

[0014] In one embodiment, the fluid supply unit may include an inlet into which the fluid flows, a first opening formed in the upper plate, and a first circulation unit communicating with the inlet.

[0015] In one embodiment, the fluid discharge section may include a discharge port through which the fluid is discharged, a second opening formed in the upper plate, and a second circulation section communicating with the discharge port.

[0016] In one embodiment, the upper plate may further include a first opening formed at a position corresponding to a first circulation section formed in the fluid supply section and a second opening formed at a position corresponding to a second circulation section formed in the fluid discharge section.

[0017] In one embodiment, the intermediate plate may further include a third opening formed at a position corresponding to a first opening formed in the upper plate and a fourth opening formed at a position corresponding to a second opening formed in the upper plate.

[0018] In one embodiment, the upper plate may further include a blocking wall disposed on one side of the plurality of first flow paths.

[0019] In one embodiment, the blocking wall may be positioned between the second opening formed in the upper plate and the plurality of first flow paths.

[0020] In one embodiment, the upper plate may further include resistance protrusions formed on the sides of each first wall.

[0021] In one embodiment, the resistance projection may include a first resistance projection protruding in a first direction that intersects the extension direction of each first wall, and a second resistance projection protruding in a second direction opposite to the first direction.

[0022] In one embodiment, the intermediate plate may further include one or more through holes formed in each of the second channels.

[0023] In one embodiment, the intermediate plate may further include resistance protrusions formed on the sides of each second wall.

[0024] In one embodiment, the resistance projection may include a third resistance projection protruding in a first direction that intersects the extension direction of each second wall, and a fourth resistance projection protruding in a second direction opposite to the first direction.

[0025] In one embodiment, the resistance protrusion may be positioned adjacent to a through hole formed in each second flow path. Effects of the invention

[0027] The cooling device according to the embodiments has higher cooling performance compared to conventional devices and can efficiently cool the semiconductor device during the operation of the semiconductor device. Accordingly, the performance and reliability of the semiconductor device can be improved during the operation of the semiconductor device. Brief explanation of the drawing

[0029] FIG. 1 is a top perspective view of a cooling device according to one embodiment. FIG. 2 is a lower perspective view of a cooling device according to one embodiment. FIG. 3 is a lower perspective view of the fluid supply section and fluid discharge section of a cooling device according to one embodiment. FIG. 4 is an upper perspective view of an upper plate constituting the main body of a cooling device according to one embodiment. FIG. 5 is a lower perspective view of an upper plate constituting the main body of a cooling device according to one embodiment. FIG. 6 is a lower perspective view of an upper plate constituting the main body of a cooling device according to another embodiment. FIG. 7 is an upper perspective view of an intermediate plate constituting the main body of a cooling device according to one embodiment. FIG. 8 is a lower perspective view of an intermediate plate constituting the main body of a cooling device according to one embodiment. FIG. 9 is a lower perspective view of an intermediate plate constituting the main body of a cooling device according to another embodiment. FIG. 10 is an upper perspective view of a lower plate constituting the main body of a cooling device according to one embodiment. FIG. 11 is a lower perspective view of a lower plate constituting the main body of a cooling device according to one embodiment. FIG. 12 is a top perspective view of a cooling device according to another embodiment. Specific details for implementing the invention

[0030] The aforementioned objectives, features, and advantages are described in detail below with reference to the attached drawings, and accordingly, a person skilled in the art to which this specification pertains will be able to easily implement the embodiments of this specification. In describing this specification, detailed descriptions of known technologies related to this specification are omitted if it is determined that such descriptions would unnecessarily obscure the gist of this specification. Hereinafter, preferred embodiments of this specification will be described in detail with reference to the attached drawings. In the drawings, the same reference numerals indicate the same or similar components.

[0031] FIG. 1 is a top perspective view of a cooling device according to one embodiment. FIG. 2 is a bottom perspective view of a cooling device according to one embodiment. FIG. 3 is a bottom perspective view of a fluid supply unit and a fluid discharge unit of a cooling device according to one embodiment.

[0032] Referring to FIGS. 1 and 2, a cooling device (1) according to one embodiment may include a main body (10), a fluid supply part (21) coupled to one side of the upper surface of the main body (10), and a fluid discharge part (22) coupled to the other side of the upper surface of the main body (10).

[0033] The main body (10) may have a plate shape. Inside the main body (10), an opening and a receiving portion formed at a position corresponding to the fluid supply portion (21), a fluid flow path, and an opening and a receiving portion formed at a position corresponding to the fluid discharge portion (22) may be formed. The fluid flowing inside the main body (10) may be a refrigerant. The fluid may be supplied into the main body (10) through the fluid supply portion (21) and the opening and receiving portion formed in the main body (10). The fluid flowing inside the main body (10) may flow in a direction from the fluid supply portion (21) toward the fluid discharge portion (22). The fluid flowing inside the main body (10) may be discharged to the outside through the opening and receiving portion formed at a position corresponding to the fluid discharge portion (22) and the fluid discharge portion (22).

[0034] As described below, a cooling region may be formed on the lower surface of the main body (10) in contact with a semiconductor element to be cooled. A semiconductor element positioned to be in contact with the cooling region may be cooled by a fluid flowing inside the main body (10).

[0035] The main body (10), the fluid supply unit (21), and the fluid discharge unit (22) may each be made of metal. However, the materials of the main body (10), the fluid supply unit (21), and the fluid discharge unit (22) are not limited to this.

[0036] Figure 3 shows a lower perspective view of the fluid supply section and the fluid discharge section.

[0037] Referring to FIG. 3, the fluid supply unit (21) may include an inlet (211) and a first circulation unit (212).

[0038] Fluid supplied from an external device (e.g., a refrigerant supply device or a refrigerant circulation device) can be introduced into the interior of the fluid supply unit (21) through the inlet (211). A first connector (31) as shown in FIG. 1 can be connected to the inlet (211). A component such as a pipe or hose can be connected between the first connector (31) and the external device.

[0039] The first circulation section (212) is a space formed inside the fluid supply section (21) and can be in communication with the inlet (211). Accordingly, fluid flowing in through the inlet (211) can flow into the first circulation section (212). As described below, the first circulation section (212) can be in communication with the opening (first opening, or first opening and third opening) and the first receiving section formed in the main body (10). Accordingly, fluid flowing into the first circulation section (212) can flow into the interior of the main body (10) through the opening and the first receiving section.

[0040] In one embodiment, the fluid supply unit (21) may include a first coupling hole (21a) and a second coupling hole (21b). The first coupling hole (21a) and the second coupling hole (21b) may each be formed at a position corresponding to the first coupling hole and the second coupling hole formed in the main body (10). A fixing member (e.g., a bolt) for coupling and fixing the fluid supply unit (21) and the main body (10) may be inserted into the first coupling hole (21a) and the second coupling hole (21b), and into the first coupling hole and the second coupling hole formed in the main body.

[0041] Referring again to FIG. 3, the fluid discharge section (22) may include an outlet (221) and a second circulation section (222).

[0042] The second circulation section (222) is a space formed inside the fluid discharge section (22). As described below, the second circulation section (222) may be in communication with the opening (second opening, or the second opening and the fourth opening) and the second receiving section formed in the main body (10). Accordingly, fluid flowing in the flow path formed inside the main body (10) may flow into the second circulation section (222) through the opening and the second receiving section.

[0043] The second circulation unit (222) can be connected to the discharge port (221). Accordingly, fluid flowing into the second circulation unit (222) can be discharged to an external device (e.g., a refrigerant supply device or a refrigerant circulation device) through the discharge port (221). A second connector (32) as shown in FIG. 1 can be connected to the discharge port (221). A component such as a pipe or hose can be connected between the second connector (32) and the external device.

[0044] In one embodiment, the fluid discharge portion (22) may include a first coupling hole (22a) and a second coupling hole (22b). The first coupling hole (22a) and the second coupling hole (22b) may each be formed at a position corresponding to the first coupling hole and the second coupling hole formed in the main body (10). A fixing member (e.g., a bolt) for coupling and fixing the fluid discharge portion (22) and the main body (10) may be inserted into the first coupling hole (22a) and the second coupling hole (22b), and into the first coupling hole and the second coupling hole formed in the main body.

[0045] The main body (10) of the cooling device (1) according to one embodiment may include an upper plate, an intermediate plate coupled to the lower surface of the upper plate, and a lower plate coupled to the lower surface of the intermediate plate. Examples of the upper plate, intermediate plate, and lower plate are described below.

[0046] FIG. 4 is an upper perspective view of an upper plate constituting the main body of a cooling device according to one embodiment. FIG. 5 is a lower perspective view of an upper plate constituting the main body of a cooling device according to one embodiment.

[0047] Referring to FIGS. 4 and 5, the upper plate (11a) of the main body (10) according to one embodiment may include a first opening (111) formed at one end of the upper plate (11a) and a second opening (112) formed at the other end of the upper plate (11a).

[0048] The first opening (111) may be formed at a position corresponding to the first circulation section (212) formed in the fluid supply section (21). The first opening (111) may have a shape corresponding to the first circulation section (212).

[0049] A first coupling hole (111a) and a second coupling hole (111b) may be formed on both sides of the first opening (111). The first coupling hole (111a) and the second coupling hole (111b) may be formed at positions corresponding to the first coupling hole (21a) and the second coupling hole (21b) formed in the fluid supply part (21), respectively.

[0050] The second opening (112) may be formed at a position corresponding to the second circulation section (222) formed in the fluid discharge section (22). The second opening (112) may have a shape corresponding to the second circulation section (222).

[0051] A first coupling hole (112a) and a second coupling hole (112b) may be formed on both sides of the second opening (112). The first coupling hole (112a) and the second coupling hole (112b) may be formed at positions corresponding to the first coupling hole (22a) and the second coupling hole (22b) formed in the fluid discharge portion (22), respectively.

[0052] Referring to FIG. 5, a plurality of first walls (113) arranged at predetermined intervals may be formed on the lower surface of an upper plate (11a) according to one embodiment. A first flow path (114), which is a space for fluid flow, may be formed between each of the first walls (113). When the upper plate (11a) and the intermediate plate (12a or 12b) described later are combined, the lower surface of each first wall (113) formed on the lower surface of the upper plate (11a) may come into contact with the upper surface of the intermediate plate (12a or 12b). Each first wall (113) and each first flow path (114) may be arranged in a direction that crosses the first opening (111) and the second opening (112).

[0053] In one embodiment, a blocking wall (115) may be disposed on one side of a plurality of first walls (113). In one embodiment, the blocking wall (115) may be disposed between a second opening (112) and a plurality of first walls (113). According to this structure, the flow of fluid entering the first flow path (114) through the first opening (111) can be blocked by the blocking wall (115). Therefore, the fluid flowing through the first flow path (114) cannot enter the second opening (112). Thus, the low-temperature fluid entering through the first opening (111) does not flow out through the second opening (112) and remains in the first flow path (114) for a longer period of time, thereby improving cooling efficiency.

[0054] In addition, the temperature of the fluid can be lowered as the fluid flowing through the first flow path (114) is mixed with the fluid flowing through the second flow path (124) through the through hole (125) formed in the intermediate plate (12a or 12b) described later. The fluid that is mixed in the first flow path (114) and has its temperature lowered is not introduced into the second opening (112) by the blocking wall (115) and remains in the first flow path (114) for a longer period of time, thereby improving cooling efficiency.

[0055] FIG. 6 is a lower perspective view of an upper plate constituting the main body of a cooling device according to another embodiment.

[0056] Although not illustrated, the upper surface of the upper plate (11b) of the cooling device (10) according to another embodiment may have the same structure as the upper surface of the upper plate (11a) illustrated in FIG. 4.

[0057] Referring to FIG. 6, the upper plate (11b) of the cooling device (10) according to another embodiment may include a first opening (111) formed at one end of the upper plate (11b) and a second opening (112) formed at the other end of the upper plate (11b).

[0058] The first opening (111) may be formed at a position corresponding to the first circulation section (212) formed in the fluid supply section (21). The first opening (111) may have a shape corresponding to the first circulation section (212).

[0059] A first coupling hole (111a) and a second coupling hole (111b) may be formed on both sides of the first opening (111). The first coupling hole (111a) and the second coupling hole (111b) may be formed at positions corresponding to the first coupling hole (21a) and the second coupling hole (21b) formed in the fluid supply part (21), respectively.

[0060] The second opening (112) may be formed at a position corresponding to the second circulation section (222) formed in the fluid discharge section (22). The second opening (112) may have a shape corresponding to the second circulation section (222).

[0061] A first coupling hole (112a) and a second coupling hole (112b) may be formed on both sides of the second opening (112). The first coupling hole (112a) and the second coupling hole (112b) may be formed at positions corresponding to the first coupling hole (22a) and the second coupling hole (22b) formed in the fluid discharge portion (22), respectively.

[0062] Referring to FIG. 6, a plurality of first walls (113) arranged at predetermined intervals may be formed on the lower surface of an upper plate (11b) according to another embodiment. A first flow path (114), which is a space for fluid flow, may be formed between each of the first walls (113). When the upper plate (11a) and the intermediate plate (12a or 12b) described later are combined, the lower surface of each first wall (113) formed on the lower surface of the upper plate (11a) may come into contact with the upper surface of the intermediate plate (12a or 12b). Each first wall (113) and each first flow path (114) may be arranged in a direction that crosses the first opening (111) and the second opening (112).

[0063] In one embodiment, a blocking wall (115) may be disposed on one side of a plurality of first walls (113). In one embodiment, the blocking wall (115) may be disposed between a second opening (112) and a plurality of first walls (113). According to this structure, the flow of fluid entering the first flow path (114) through the first opening (111) can be blocked by the blocking wall (115). Therefore, the fluid flowing through the first flow path (114) cannot enter the second opening (112). Thus, the low-temperature fluid entering through the first opening (111) does not flow out through the second opening (112) and remains in the first flow path (114) for a longer period of time, thereby improving cooling efficiency.

[0064] In addition, the temperature of the fluid can be lowered as the fluid flowing through the first flow path (114) is mixed with the fluid flowing through the second flow path (124) through the through hole (125) formed in the intermediate plate (12a or 12b) described later. The fluid that is mixed in the first flow path (114) and has its temperature lowered is not introduced into the second opening (112) by the blocking wall (115) and remains in the first flow path (114) for a longer period of time, thereby improving cooling efficiency.

[0065] Referring again to FIG. 6, resistance protrusions (116, 117) may be formed on the sides of each first wall (113) disposed on the lower surface of the upper plate (11b) according to another embodiment. In one embodiment, a first resistance protrusion (116) protruding in a first direction that intersects the extension direction of the first wall (113) may be formed on one side of each first wall (113). In one embodiment, a second resistance protrusion (117) protruding in a second direction opposite to the first direction may be formed on the other side of each first wall (113). The first resistance protrusion (116) and the second resistance protrusion (117) may be alternately disposed on each first wall (113).

[0066] According to this structure, when the fluid flows in the first flow path (114), the flow velocity of the fluid can be reduced due to resistance caused by the resistance protrusions (116, 117). Accordingly, the fluid stays in the first flow path (114) for a longer period of time, thereby improving the cooling efficiency of the cooling device (1).

[0067] FIG. 7 is an upper perspective view of an intermediate plate constituting the main body of a cooling device according to one embodiment. FIG. 8 is a lower perspective view of an intermediate plate constituting the main body of a cooling device according to one embodiment.

[0068] Referring to FIGS. 7 and 8, an intermediate plate (12a) of a main body (10) according to one embodiment may include a third opening (121) formed at one end of the intermediate plate (12a) and a fourth opening (122) formed at the other end of the intermediate plate (12a).

[0069] The third opening (121) may be formed at a position corresponding to the first circulation section (212) formed in the fluid supply section (21) and the first opening (111) formed in the upper plate (11a or 11b). The third opening (121) may have a shape corresponding to the first circulation section (212) and the first opening (111).

[0070] A first coupling hole (121a) and a second coupling hole (121b) may be formed on both sides of the third opening (121). The first coupling hole (121a) and the second coupling hole (121b) may be formed at positions corresponding to the first coupling hole (21a) and the second coupling hole (21b) formed in the fluid supply part (21), and the first coupling hole (111a) and the second coupling hole (111b) formed in the upper plate (11a or 11b), respectively.

[0071] The fourth opening (122) may be formed at a position corresponding to the second circulation section (222) formed in the fluid discharge section (22) and the second opening (112) formed in the upper plate (11a or 11b). The fourth opening (122) may have a shape corresponding to the second circulation section (222) and the second opening (112).

[0072] A first coupling hole (122a) and a second coupling hole (122b) may be formed on both sides of the fourth opening (122). The first coupling hole (122a) and the second coupling hole (122b) may be formed at positions corresponding to the first coupling hole (22a) and the second coupling hole (22b) formed in the fluid discharge portion (22), and the first coupling hole (112a) and the second coupling hole (112b) formed in the upper plate (11a or 11b), respectively.

[0073] Referring to FIG. 8, a plurality of second walls (123) arranged at predetermined intervals may be formed on the lower surface of an intermediate plate (12a) according to one embodiment. A second flow path (124), which is a space for fluid flow, may be formed between each of the second walls (123). When the intermediate plate (12a) and the lower plate (13) described later are combined, the lower surface of each second wall (123) formed on the lower surface of the intermediate plate (12a) may come into contact with the upper surface of the lower plate (13). Each second wall (123) and each second flow path (124) may be arranged in a direction that crosses the third opening (121) and the fourth opening (122).

[0074] Referring to FIG. 8, a plurality of through holes (125) may be formed in each second flow path (124). Each through hole (125) may be formed in the second flow path (124) according to a predetermined interval. With this structure, heat exchange occurs as the fluid moving through the second flow path (124) and the fluid moving through the first flow path (114) mix with each other, so the cooling efficiency of the cooling device (1) can be improved.

[0075] In one embodiment, a greater number of through holes (145) may be formed in the central region (128) of the intermediate plate (12a) than in the peripheral region. The central region (128) may be formed at a position corresponding to the cooling region (135) formed on the lower surface of the lower plate (13) described later.

[0076] FIG. 9 is a lower perspective view of an intermediate plate constituting the main body of a cooling device according to another embodiment.

[0077] Although not illustrated, the upper surface of the intermediate plate (12b) of the cooling device (10) according to another embodiment may have the same structure as the upper surface of the intermediate plate (12a) illustrated in FIG. 7.

[0078] Referring to FIG. 9, the intermediate plate (12b) of the cooling device (10) according to another embodiment may include a third opening (121) formed at one end of the intermediate plate (12a) and a fourth opening (122) formed at the other end of the intermediate plate (12a).

[0079] The third opening (121) may be formed at a position corresponding to the first circulation section (212) formed in the fluid supply section (21) and the first opening (111) formed in the upper plate (11a or 11b). The third opening (121) may have a shape corresponding to the first circulation section (212) and the first opening (111).

[0080] A first coupling hole (121a) and a second coupling hole (121b) may be formed on both sides of the third opening (121). The first coupling hole (121a) and the second coupling hole (121b) may be formed at positions corresponding to the first coupling hole (21a) and the second coupling hole (21b) formed in the fluid supply part (21), and the first coupling hole (111a) and the second coupling hole (111b) formed in the upper plate (11a or 11b), respectively.

[0081] The fourth opening (122) may be formed at a position corresponding to the second circulation section (222) formed in the fluid discharge section (22) and the second opening (112) formed in the upper plate (11a or 11b). The fourth opening (122) may have a shape corresponding to the second circulation section (222) and the second opening (112).

[0082] A first coupling hole (122a) and a second coupling hole (122b) may be formed on both sides of the fourth opening (122). The first coupling hole (122a) and the second coupling hole (122b) may be formed at positions corresponding to the first coupling hole (22a) and the second coupling hole (22b) formed in the fluid discharge portion (22), and the first coupling hole (112a) and the second coupling hole (112b) formed in the upper plate (11a or 11b), respectively.

[0083] According to another embodiment, a plurality of second walls (123) arranged at predetermined intervals may be formed on the lower surface of the intermediate plate (12b). A second flow path (124), which is a space for fluid flow, may be formed between each of the second walls (123). When the intermediate plate (12b) and the lower plate (13) described later are combined, the lower surface of each second wall (123) formed on the lower surface of the intermediate plate (12b) may come into contact with the upper surface of the lower plate (13). Each second wall (123) and each second flow path (124) may be arranged in a direction that crosses the third opening (121) and the fourth opening (122).

[0084] Referring to FIG. 9, a plurality of through holes (125) may be formed in each second flow path (124). Each through hole (125) may be formed in the second flow path (124) according to a predetermined interval. With this structure, heat exchange occurs as the fluid moving through the second flow path (124) and the fluid moving through the first flow path (114) mix with each other, so the cooling efficiency of the cooling device (1) can be improved.

[0085] In one embodiment, a greater number of through holes (145) may be formed in the central region (128) of the intermediate plate (12b) than in the peripheral region. The central region (128) may be formed at a position corresponding to the cooling region (135) formed on the lower surface of the lower plate (13) described later.

[0086] Referring again to FIG. 9, resistance protrusions (126, 127) may be formed on the sides of each second wall (123) disposed on the lower surface of the intermediate plate (12b) according to another embodiment. In one embodiment, a third resistance protrusion (126) protruding in a first direction that intersects the extension direction of the second wall (123) may be formed on one side of each second wall (123). In one embodiment, a fourth resistance protrusion (127) protruding in a second direction opposite to the first direction may be formed on the other side of each second wall (123). The third resistance protrusion (126) and the fourth resistance protrusion (127) may be alternately disposed on each second wall (123).

[0087] According to this structure, when the fluid flows in the second flow path (124), the flow velocity of the fluid can be reduced due to resistance caused by the resistance protrusions (126, 127). Accordingly, the fluid stays in the second flow path (124) for a longer period of time, thereby improving the cooling efficiency of the cooling device (1).

[0088] Additionally, each resistance projection (126, 127) may be positioned adjacent to each through hole (125). According to this structure, the fluid flowing in the second flow path (124) can move more quickly to the first flow path (114) through the through hole (125) adjacent to the resistance projection (126, 127) while colliding with the resistance projection (126, 127). Accordingly, the circulation of the fluid through the through hole (125) occurs more quickly, and the cooling efficiency of the cooling device (1) can be improved.

[0089] FIG. 10 is an upper perspective view of a lower plate constituting the main body of a cooling device according to one embodiment. FIG. 11 is a lower perspective view of a lower plate constituting the main body of a cooling device according to one embodiment.

[0090] As illustrated in FIGS. 10 and 11, a first coupling hole (131a) and a second coupling hole (131b) may be formed on one side of the lower plate (13). The first coupling hole (131a) and the second coupling hole (131b) may be formed at positions corresponding to the first coupling hole (21a) and the second coupling hole (21b) formed in the fluid supply unit (21), the first coupling hole (111a) and the second coupling hole (111b) formed in the upper plate (11a or 11b), and the first coupling hole (121a) and the second coupling hole (121b) formed in the intermediate plate (12a or 12b), respectively.

[0091] Additionally, a first coupling hole (132a) and a second coupling hole (132b) may be formed on the other side of the lower plate (13). The first coupling hole (132a) and the second coupling hole (132b) may be formed at positions corresponding to the first coupling hole (22a) and the second coupling hole (22b) formed in the fluid discharge portion (22), the first coupling hole (112a) and the second coupling hole (112b) formed in the upper plate (11a or 11b), and the first coupling hole (122a) and the second coupling hole (122b) formed in the intermediate plate (12a or 12b), respectively.

[0092] Referring to FIG. 11, a cooling area (135) having a flat shape may be formed on the lower surface of the lower plate (13), and a plurality of inclined surfaces (135a, 135b, 135c, 135d) extending from the cooling area (135) and formed in the periphery of the cooling area (135).

[0093] In one embodiment, the cooling device (1) is positioned on a substrate having a flat shape and may be positioned to be in contact with the upper surface of a semiconductor device to be cooled. At this time, a cooling area (135) formed on the lower surface of the lower plate (13) may be in direct contact or close contact with the upper surface of the semiconductor device to be cooled. Accordingly, the semiconductor device in contact with the cooling area (135) may be cooled by a fluid (e.g., a refrigerant) flowing through a second flow path (124) positioned above the cooling area (135).

[0094] Each inclined surface (135a, 135b, 135c, 135d) may have a predetermined angle of inclination such that as it moves further away from the cooling area (135), it becomes lower than the cooling area (135).

[0095] FIG. 12 is a top perspective view of a cooling device according to another embodiment.

[0096] Referring to FIG. 12, a cooling device (2) according to another embodiment may include a main body (10), a fluid supply part (21) coupled to one side of the upper surface of the main body (10), and a fluid discharge part (22) coupled to the other side of the upper surface of the main body (10).

[0097] The main body (10) may have a triple-layer structure including an upper plate (11a or 11b), a middle plate (12a or 12b) and a lower plate (13) as described above.

[0098] The cooling device (2) may further include a connecting part (23) that connects the fluid supply part (21) and the fluid discharge part (22) and is formed integrally with the fluid supply part (21) and the fluid discharge part (22).

[0099] Additionally, the cooling device (2) may include a first holder (41a) and a second holder (41b) that are connected to one end of the fluid supply unit (21) and formed integrally with the fluid supply unit (21). The first holder (41a) and the second holder (41b) may each have a first hole (43b) and a second hole (43b) into which a fixing member (e.g., a bolt) can be inserted.

[0100] Additionally, the cooling device (2) may include a first holder (42a) and a second holder (42b) that are connected to one end of the fluid discharge section (22) and formed integrally with the fluid discharge section (22). The first holder (42a) and the second holder (42b) may each have a first hole (44b) and a second hole (44b) into which a fixing member (e.g., a bolt) can be inserted.

[0101] In order to cool a semiconductor device placed on a substrate using a cooling device (2), the cooling area (125, 155) of the cooling device (2) must be in close contact with the upper surface of the semiconductor device. The cooling device (2) can be fixed to the substrate by inserting a fixing member (e.g., a bolt) into the first hole (43b) and the second hole (43b) formed in the first holder (41a) and the second holder (41b), respectively, the first hole (44b) and the second hole (44b) formed in the first holder (42a) and the second holder (42b), respectively, and into the holes of the substrate corresponding to the first hole (43b), the second hole (43b), the first hole (44b), and the second hole (44b). When the cooling device (2) is fixed to the substrate by a fixing member inserted into the first hole (43b), the second hole (43b), the first hole (44b), and the second hole (44b), the pressure applied to the fluid supply part (21) and the fluid discharge part (22) can be dispersed by the connecting part (23). Thus, a stable connection between the substrate and the cooling device (2) can be ensured, and the cooling area (125, 155) and the upper surface of the semiconductor device can be more closely attached.

[0102] Although the present specification has been described above with reference to the illustrative drawings, the present specification is not limited by the embodiments and drawings disclosed herein, and various modifications may be made by those skilled in the art. Furthermore, even if the effects according to the configuration of the present specification were not explicitly described while explaining the embodiments of the present specification above, the effects predictable by said configuration should also be acknowledged.

Claims

Claim 1 A cooling device comprising: a main body; a fluid supply unit connected to the main body and supplying fluid supplied from a fluid supply device to the main body; and a fluid discharge unit connected to the main body and delivering the fluid discharged from the main body to the fluid supply device, wherein the main body comprises an upper plate; an intermediate plate; and a lower plate, wherein the upper plate comprises a plurality of first walls formed on the lower surface of the upper plate; and a plurality of first flow paths formed between each of the first walls, wherein the intermediate plate comprises a plurality of second walls formed on the lower surface of the intermediate plate; and a plurality of second flow paths formed between each of the second walls, and wherein the lower plate comprises a cooling area formed on the lower surface of the lower plate. Claim 2 A cooling device according to claim 1, wherein the fluid supply unit comprises an inlet into which the fluid is introduced; and a first opening formed in the upper plate and a first circulation unit communicating with the inlet. Claim 3 A cooling device according to claim 1, wherein the fluid discharge portion comprises: a discharge port through which the fluid is discharged; and a second opening formed in the upper plate and a second circulation portion communicating with the discharge port. Claim 4 A cooling device according to claim 1, wherein the upper plate further comprises: a first opening formed at a position corresponding to a first circulation section formed in the fluid supply section; and a second opening formed at a position corresponding to a second circulation section formed in the fluid discharge section. Claim 5 A cooling device according to claim 1, wherein the intermediate plate further comprises: a third opening formed at a position corresponding to a first opening formed in the upper plate; and a fourth opening formed at a position corresponding to a second opening formed in the upper plate. Claim 6 A cooling device according to claim 1, wherein the upper plate further comprises a blocking wall disposed on one side of the plurality of first flow paths. Claim 7 In paragraph 6, the blocking wall is a cooling device disposed between a second opening formed in the upper plate and a plurality of first flow paths. Claim 8 A cooling device according to claim 1, wherein the upper plate further comprises resistance protrusions formed on the side of each first wall. Claim 9 In claim 8, the cooling device comprises: a first resistance projection protruding in a first direction that intersects the extension direction of each first wall; and a second resistance projection protruding in a second direction opposite to the first direction. Claim 10 A cooling device according to claim 1, wherein the intermediate plate further comprises one or more through holes formed in each of the second channels. Claim 11 A cooling device according to claim 1, wherein the intermediate plate further comprises resistance protrusions formed on the side of each second wall. Claim 12 A cooling device according to claim 11, wherein the resistance protrusions include a third resistance protrusion protruding in a first direction that intersects the extension direction of each second wall; and a fourth resistance protrusion protruding in a second direction opposite to the first direction. Claim 13 In claim 11, the above resistance protrusion is a cooling device positioned adjacent to a through hole formed in each second flow path.

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