Handler for testing electronic components

Abstract

The present invention relates to a handler for testing electronic components that supports testing of electronic components. A handler for testing electronic components according to the present invention comprises: a first gripping plate for gripping electronic components moved from a loading tray in which electronic components are loaded in a live bug state; a rotating device for changing electronic components from a live bug state to a dead bug state by rotating the first gripping plate 180 degrees; a second gripping plate for directly receiving and gripping electronic components in a dead bug state from the first gripping plate rotated by the rotating device; and a connecting device for electrically connecting the second gripping plate to a connector so that electronic components can be tested by a tester. According to the present invention, even when the terminal size or the spacing between terminals of an electronic component is very fine, the electronic component and the tester are precisely electrically connected so that testing of the electronic component can be performed, thereby ultimately eliminating unnecessary processes to improve productivity and reduce waste of resources.

Description

Technology Field

[0001] The present invention relates to a handler for testing electronic components, and in particular to a technology applicable when the terminal size of an electronic component or the spacing between terminals is minute. Background Technology

[0002] Electronic components, such as manufactured semiconductor devices, are tested by a tester and then classified into good and defective products, with only the good products being shipped.

[0003] Generally, the electrical connection between the tester and the electronic components is made by a handler.

[0004] A handler is equipment that enables electronic components to be tested by a tester by electrically connecting multiple electronic components to the tester simultaneously. The present invention relates to the development of a handler capable of testing semiconductor devices in a stacked die (DIE) state before reaching the finished product stage.

[0005] Currently, testing of semiconductor devices in wafer form is being properly performed using probe cards, and testing of semiconductor devices in package form is being properly performed by handlers presented in numerous patent documents, including Korean Patent Publication No. 10-2015-0096912.

[0006] Since the dies are interconnected into a single large plate called a wafer before sawing, all dies can be aligned simply by accurately positioning the wafer, enabling electrical connection between the dies and the tester via a probe card.

[0007] In addition, the packaged semiconductor devices have terminals with a relatively large diameter of about 100 micrometers, and the spacing between the terminals is also relatively wide, so a technology to electrically connect a large number of semiconductor devices to a tester at once can be implemented relatively easily.

[0008] However, regarding the technology to test stacked dies—which can be considered an intermediate stage between the wafer and package states—while the importance and necessity have been raised, it remains an impossible technology to date. This is because the bump size of the stacked dies is extremely fine and the spacing between them is very narrow, preventing the development of a technology to accurately connect the stacked die bumps to a tester.

[0009] Recently, an example of a package-type semiconductor device (PS) requiring multiple dies, as shown in FIG. 19, is presented. Referring to FIG. 19, four stacked dies (Ld) form a single package-type semiconductor device (PS). Therefore, even if a defect occurs in one of the four stacked dies (Ld), the controller and the remaining stacked dies (Ld) must also be discarded. Referring further to FIG. 20, the stacked die (Ld) exemplified in FIG. 20 is formed in a stacked form consisting of four memory devices (MS) and one logic device (LS). Of course, the stacked die may be completed with only four memory devices (MS).

[0010] A stacked die is a semiconductor device in which multiple dies are stacked to increase capacity or realize required functions, often to overcome the limitations of integration technology or implement specific functionalities. Consequently, the defect rate of stacked dies, which have undergone the stacking process, is higher than that of dies simply sawn at the wafer stage. For this reason, there is a continuous demand for the development of technologies to test stacked dies. This is because enabling automated testing of stacked dies can prevent losses resulting from packaging defective dies or other electronic components packaged alongside them, thereby saving time and costs and ultimately increasing productivity.

[0011] In particular, as shown in the example of Fig. 20, a stacked die (Ld) in which a memory device (MS) and a logic device (LS) are stacked together requires additional separate equipment and processes to stack heterogeneous devices. Therefore, compared to a stacked die made of homogeneous devices where sawing and stacking are performed in one place, a stacked die (Ld) in which heterogeneous devices are stacked is more difficult to stack precisely and the defect rate increases, so more rigorous testing is required for the stacked die (Ld).

[0012] In response to such demands, one may consider applying a technology that connects a large number of packaged semiconductor devices to a tester simultaneously to the electrical connection between the stacked die and the tester.

[0013] Packaged semiconductor devices are tested while loaded onto a test tray to test a large quantity at once. Here, the semiconductor devices are electrically connected to a tester while inserted into inserts provided in the test tray.

[0014] However, as shown in FIG. 20, the terminal (T3) of the packaged semiconductor device (PS) is very small compared to the terminal of the stacked die (Ld). Of course, even in a stacked die in which four memory devices (MS) are stacked, the terminal (T1) of the bottommost memory device (MS) is very small. On the other hand, it is inevitable that the tolerance during the process of manufacturing and assembling the test tray will exceed 10 micrometers, and the cumulative tolerance when various other tolerances are combined will exceed 20 micrometers.

[0015] Generally, in the case of a stacked die (Ld) after sawing and stacking is completed, the size of the terminals (T1, T2 / BUMP) is 20 to 25 micrometers, and the spacing between the terminals (T1, T2) is only about 50 micrometers. Therefore, with current electrical connection technology, an electrical connection between the stacked die (Ld) and the tester cannot be guaranteed.

[0016] Furthermore, the insert of the test tray is installed to be somewhat movable for proper electrical connection between the packaged semiconductor device (PS) and the tester, but this also makes it difficult to approach a structure that electrically connects the stacked die (Ld) to the tester using a conventional test tray, considering the size of the terminals (T1, T2) of the stacked die (Ld). The problem to be solved

[0017] The purpose of the present invention is to provide a handler capable of connecting electronic components with very fine terminal sizes and spacing between terminals to a tester. means of solving the problem

[0018] A handler for testing electronic components according to a first embodiment of the present invention comprises: a first gripping plate for gripping electronic components moved from a loading tray in which electronic components are loaded in a live bug state; a picker device provided for moving electronic components from the loading tray to the first gripping plate and having at least one picker capable of gripping or releasing electronic components; a rotating device for rotating the first gripping plate 180 degrees to cause electronic components to change from a live bug state to a dead bug state; a second gripping plate for receiving and gripping electronic components in a dead bug state from the first gripping plate rotated by the rotating device; and a connecting device for electrically connecting electronic components gripped by the second gripping plate to a connector so that electronic components can be tested by a tester.

[0019] It further includes: a camera installed on the first gripping plate that rotates together with the rotation of the first gripping plate and can confirm the position of the second gripping plate; and an alignment device for aligning the position of the second gripping plate confirmed by the camera.

[0020] It further includes a vacuum generating device that applies vacuum pressure to the first gripping plate or the second gripping plate, wherein the first gripping plate or the second gripping plate has vacuum holes formed therein for applying vacuum pressure from the vacuum generating device to the electronic components, and thereby fixes the position of the electronic components in the position placed by the picker by adsorbing and gripping the electronic components with the vacuum pressure from the vacuum generating device.

[0021] The first gripping plate or the second gripping plate has multiple gripping areas and spaced-out areas, and the vacuum holes are formed only in the gripping areas.

[0022] The first gripping plate or the second gripping plate has a flat gripping surface for gripping electronic components.

[0023] The diameter of the above vacuum holes is smaller than the diameter of the terminal of the electronic component to be tested.

[0024] The apparatus further includes a stimulating device for applying heat or cold to electronic components gripped by the first gripping plate or the second gripping plate, wherein the first gripping plate or the second gripping plate is made of a metal material to transfer the heat or cold applied by the stimulating device to the electronic components.

[0025] The above connecting device can narrow the gap between the first gripping plate and the second gripping plate while maintaining parallelism so that the electronic components in a dead bug state gripped by the first gripping plate can be moved directly to the second gripping plate while preventing positional disarray caused by the rotation of the first gripping plate, thereby allowing one side of the electronic components to be gripped by the first gripping plate and the other side of the electronic components to come into contact with the second gripping plate.

[0026] A handler for testing electronic components according to a second embodiment of the present invention comprises: a gripping plate for gripping electronic components that have been moved from a loading tray in a dead bug state; a picker device provided for moving electronic components from the loading tray to the gripping plate and having at least one picker capable of gripping or releasing the electronic components; and a connection device that electrically connects the electronic components gripped by the gripping plate to a connector so that the electronic components can be tested by a tester.

[0027] A vacuum generating device that applies vacuum pressure to the above-mentioned gripping plate; further comprising,

[0028] The above gripping plate has vacuum holes formed therein to apply vacuum pressure from the vacuum generator to the electronic components, and by adsorbing and gripping the electronic components with the vacuum pressure from the vacuum generator, the position of the electronic components is fixed exactly as it is placed by the picker.

[0029] The above gripping plate has multiple gripping areas and spacing areas, and the vacuum holes are formed only in the gripping areas.

[0030] The above gripping plate has a flat gripping surface for gripping electronic components. Effects of the invention

[0031] According to the present invention, since the electronic component can be maintained in a fixed state at an accurate position, even in the case of electronic components such as stacked dies with very fine terminal sizes or spacing between terminals, it is possible to electrically connect them properly to a tester, thereby providing the following effects.

[0032] First, productivity is improved because even electronic components with very fine terminal sizes or spacing between terminals, such as stacked dies, can be tested in large quantities at once through an automated testing process.

[0033] Second, electronic components determined to be defective by the automated testing process can be discarded without proceeding to the next stage, thereby saving time and conserving resources by avoiding the waste of resources that would otherwise be consumed in the next stage.

[0034] Third, since defective products are filtered out at intermediate stages, the testing process time for finished products is shortened, thereby reducing the overall time and costs required for testing finished products. Brief explanation of the drawing

[0035] FIG. 1 is a schematic plan view of a handler for testing electronic components according to a first embodiment of the present invention. FIGS. 2 to 5 are reference drawings for explaining a first gripping plate applied to an electronic component test handler of FIG. 1. Figure 6 is a schematic diagram of a picker device applied to the electronic component test handler of Figure 1. FIGS. 7 and FIGS. 8 are reference diagrams for explaining the picker device of FIG. 6. FIG. 9 is a reference diagram for explaining a rotating device applied to the electronic component test handler of FIG. 1. FIG. 10 is a schematic diagram of an alignment device applied to the electronic component test handler of FIG. 1. FIG. 11 is a reference diagram for explaining a stimulation device applied to the electronic component test handler of FIG. 1. FIG. 12 is a reference diagram for explaining a connection device applied to the electronic component test handler of FIG. 1. FIG. 13 is a reference diagram for explaining the process of moving an electronic component from the first gripping plate to the second gripping plate in the electronic component test handler of FIG. 1. FIG. 14 is a schematic plan view of a handler according to a first example that modifies the handler of FIG. 1. FIG. 15 is a reference diagram for explaining the specific operation of the handler of FIG. 14. FIG. 16 is a schematic plan view of a handler according to a second example that modifies the handler of FIG. 1. FIG. 17 is a schematic plan view of a handler for testing electronic components according to a second embodiment of the present invention. FIG. 18 is a schematic plan view of a handler for testing electronic components according to a third embodiment of the present invention. Figures 19 and 20 are reference diagrams for explaining a stacked die. Specific details for implementing the invention

[0036] Preferred embodiments according to the present invention are described with reference to the accompanying drawings, provided that for the sake of brevity, descriptions of redundant or substantially identical components are omitted or compressed as much as possible.

[0037] <Description of the First Embodiment>

[0038] FIG. 1 is a schematic plan view of an electronic component test handler (100, hereinafter abbreviated as 'handler') according to a first embodiment of the present invention.

[0039] The handler (100) of FIG. 1 includes a first gripping plate (110), a picker device (120), a rotating device (130), a second gripping plate (140), an alignment device (150), a moving device (160), a connecting device (170), a first camera (181), a second camera (182), a third camera (183), a fourth camera (184), a vacuum generating device (191), a stimulating device (192), and a control device (CU).

[0040] The first gripping plate (110) grips electronic components moved from the loading tray (LT) on the right. Here, the loading tray (LT) is a loading element for supplying electronic components to be tested, and its shape can vary, such as being circular or a general square.

[0041] The electronic component loaded on the first gripping plate (100) maintains a Live Bug state in which the terminal (T) of the electronic component (D) faces downward, as shown in the exaggerated figure 2. This first gripping plate (100) has fine vacuum holes (VH1), as shown in figure 3.

[0042] And the first gripping plate (110) has several (8 in this embodiment) gripping areas (HF) for gripping electronic components (D) and a spacing area (IF) between the gripping areas (HF), and vacuum holes (VH1) are formed to form a cluster in the gripping areas (HF) to grip one electronic component (D). Thus, as shown in comparison in FIG. 4 (a) and (b), electronic components (D1, D2) with different widths can be properly fixed in the gripping areas (HF), so there is no need to replace the first gripping plate (110) even if the specifications of the electronic components (D1, D2) to be tested change.

[0043] Meanwhile, in order to apply vacuum force to an electronic component (D) in a live bug state through a vacuum hole (VH1), the diameter of the vacuum hole (VH1) needs to be smaller than the diameter of the terminal (T) of the electronic component (D), as shown in the exaggerated reference diagram of FIG. 5. Thus, the terminal (T) located on the side of the vacuum hole (VH1) blocks the vacuum hole (VH1), thereby allowing vacuum pressure to be applied to the electronic component (D). Of course, there are vacuum holes (VH1) located away from the position of the terminal (T), so vacuum pressure may leak into those vacuum holes (VH1), but to compensate for the leakage, a larger vacuum pressure is applied so that the first gripping plate (110) can properly grip the electronic components (D).

[0044] Furthermore, unlike the loading elements (test trays, etc.) provided in conventional handlers, the first gripping plate (110) has a flat shape without a receiving groove formed on the gripping surface (VF) for receiving electronic components (D). The receiving groove in the conventional test tray serves the function of aligning the position of the electronic components (D). However, the tolerance resulting from the configuration of such receiving grooves hinders the automated testing of electronic components (D), such as stacked dies with fine terminals (T) and spacing between terminals (T). Therefore, in the present invention, a separate receiving groove is not formed in the first gripping plate (110). Instead, the picker device (120) is configured to place the electronic components (D) at the correct position on the gripping surface (VF), and to allow the electronic components (D) to adhere and be fixed in the exact position they are placed in by vacuum pressure.

[0045] A picker device (120) is provided to move electronic components (D) from a loading tray (LT) to a first gripping plate (110). To this end, as shown in the schematic diagram of FIG. 6, the picker device (120) has at least one picker (121), a horizontal mover (122), a vertical mover (123), and a rotary drive (124).

[0046] As is known, the picker (121) can grasp the electronic component (D) by vacuum pressure, and releases the grasp of the electronic component (D) when the vacuum pressure is released. However, the picker (121) to be applied to the handler (100) according to the present invention has a picking element (121a) with a flat bottom surface as shown in the schematic diagram of FIG. 7, so that the posture or position of the electronic component (D) is prevented from being disturbed by the picking element (121a) during the process of grasping the electronic component (D). In addition, fine vacuum holes (VH2) are formed in the picking element (121a) to transmit vacuum pressure to the electronic component (D). Likewise, the vacuum holes (VH2) have a diameter smaller than the diameter of the terminal (T).

[0047] A horizontal moving device (122) is provided to selectively position the picker (121) above the loading plate (LT) and above the first gripping plate (110). It is preferable that this horizontal moving device (122) be equipped with a forward / backward movement means (122a) and a left / right movement means (122b) so that the picker (121) can be moved in both forward / backward and left / right directions.

[0048] The vertical mover (123) raises the picker (121) so that the picker (121) can be lowered to a position where it can grasp an electronic component (D) on the loading plate (LT) or to a position where it can place an electronic component on the first gripping plate (110). Of course, when the picker (121) moves horizontally by the horizontal mover (122), the vertical mover (123) maintains the picker (121) in a raised state.

[0049] The rotary drive (124) is provided to correct the posture of the picker (121) so that the picker (121) maintains an accurately vertical state. That is, due to various causes, the picker (121) may fail to maintain an appropriate upright state, and in such cases, a defect may occur in the gripping operation of the electronic component (D). Therefore, if the uprightness of the picker (121) is disrupted as in FIG. 8 (b), the posture of the picker (121) is corrected by the rotary drive (124) so ​​that the picker (121) can be accurately upright as in FIG. 8 (a). Of course, if there is a guarantee that the upright state of the picker (121) will not be disrupted, the rotary drive (124) may be omitted.

[0050] A rotating device (130) is provided to rotate the first gripping plate (110) 180 degrees using a horizontal line in the left-right direction as the axis of rotation. It is preferable for space-saving purposes that such a rotating device (130) be provided to rotate the first gripping plate (110) using a horizontal line crossing the center of the first gripping plate (110) as the axis of rotation. When the first gripping plate (110) is rotated by the rotating device (130) in this manner, as can be seen from the comparison of FIG. 9 (a) and (b), the electronic components (D) gripped on the first gripping plate (110) change from a live bug state as in FIG. 9 (a) to a dead bug state (a state where the terminals face upward) as in FIG. 9 (b). At this time, it is preferable that the rotational speed of the first gripping plate (110) by the rotating device (130) is such that no impact exceeding the gripping force holding the electronic component (D) is applied.

[0051] The second gripping plate (140) is provided to receive an electronic component (D) from the first gripping plate (110) located above, and its basic structure is the same as that of the first gripping plate (110). However, since the second gripping plate (140) grips an electronic component (D) in a dead bug state, there is less need to impose a specific limit on the size of the vacuum hole being particularly fine; however, like the first gripping plate (110), it has the same spacing area between the gripping areas where vacuum holes are formed, and its gripping surface is also flat. Of course, the gripping area where vacuum holes are formed must be located at a position corresponding to the gripping area (HF) of the first gripping plate (110).

[0052] An alignment device (150) is provided to align the position of the second gripping plate (140). Accordingly, as shown in the conceptual diagram of FIG. 10, the alignment device (150) includes a rotating device (151) and a position moving device (152).

[0053] A rotating device (151) is provided to rotate the second gripping plate (140) and includes a rotating plate (151a) and a rotating motor (151b). This rotating device (151) can rotate clockwise or counterclockwise when viewed in a plane.

[0054] Additionally, the rotating device (151) may rotate to change the inclination of the second gripping plate (140). This is because there is a need to align the inclination of the second gripping plate (140) with respect to the first gripping plate (110).

[0055] The rotating plate (151a) is rotated by a rotating motor (151b), and a second gripping plate (140) is fixed to the rotating plate (151a). Of course, it is also possible to fully consider utilizing the rotating plate (151a) itself as the second gripping plate (meaning that the second gripping plate is formed integrally).

[0056] The rotary motor (151b) rotates the rotating plate (151a) using a vertical line (P) passing through the center of the rotating plate (151a) as the axis of rotation. Of course, designing the rotation axis of the rotating plate (151a) so that it does not pass through the center of the rotating plate (151a) can be considered, but designing the rotation axis of the rotating plate (151a) so that it passes through the center of the rotating plate (151a) is more desirable as it can save space.

[0057] A position mover (152) is provided to move the second gripping plate (140) in a second direction (indicated as left-right direction in the drawing) perpendicular to the first direction (indicated as front-back direction in the drawing).

[0058] The moving device (160) moves the second gripping plate (140) in the forward and backward direction so that the second gripping plate (140) can be selectively positioned below the connector (C, which may be, for example, a probe card) on the tester side or below the first gripping plate (110). Accordingly, the second gripping plate (140) can move in both the forward and backward directions and the left and right directions, and can even rotate by the rotating device (151).

[0059] The connecting device (170) raises the second gripping plate (140) when the second gripping plate (140) is located below the connector (C), thereby allowing the electronic component (D) held in a dead bug state on the second gripping plate (140) to be electrically connected to the connector (C). Additionally, the connecting device (160) raises the second gripping plate (140) so that the electronic component (D) can be moved directly from the first gripping plate (110) to the second gripping plate (140) when the first gripping plate (110) rotates and the electronic component (D) is held in a dead bug state on the first gripping plate (110). Of course, when the second gripping plate (140) is moved horizontally by the moving device (160), the connecting device (160) lowers the second gripping plate (140). And to enable this structure, as referenced in FIG. 10, the connecting device (170) is provided to be coupled with the alignment device (150), and the moving device (160) moves the connecting device (170) in the forward and backward direction, thereby ultimately moving the second gripping plate (140) in the forward and backward direction.

[0060] A first camera (181) is provided to determine whether the posture of the picker (121) is correct. To this end, the first camera (181) photographs the picker (121), and the control unit (CU) compares the image of the picker (121) photographed by the first camera (181) with a previously stored image of the picker (121) in an appropriate posture to determine the posture of the picker (121). If it is determined that the posture of the picker (121) is improper, the rotary actuator (124) is operated to rotate the picker (121) so that it is in an appropriate upright position. Of course, the image of the picker (121) photographed by the first camera (181) can also be used to set the zero point for the horizontal position of the picker (121), and in this case, the picker (121) can move horizontally to a more accurate position.

[0061] Additionally, the first camera (181) can also be used to verify whether the electronic component (D) is accurately grasped when the electronic component (D) is grasped by the picker (121). For example, while the picker (121) is moving to the first grasping plate (110) after grasping the electronic component (D) from the loading tray (LT), the first camera (181) photographs the electronic component (D) grasped by the picker (121). Then, the control unit (CU) compares a previously stored image with the image obtained by the first camera (181) to verify the grasping state of the electronic component (D) grasped by the picker (121). When the gripping state of the electronic component (D) is confirmed in this way, the control device (CU) appropriately operates the horizontal mover (122), the vertical mover (123), and the rotary drive (124) according to the confirmed gripping state of the electronic component (D), thereby allowing the electronic component (D) to be placed at the correct position on the first gripping plate (110). Here, since the first camera (181) must be located below the picker (121), it may be considered to be installed so as to be fixed on the bottom surface.

[0062] A second camera (182) is provided to accurately verify the position of an electronic component (D) loaded on a loading tray (LT). Thus, the control unit (CU) can verify the exact position of the electronic component (D) through an image captured by the second camera (182) and then precisely position the picker (121) at that location. Consequently, the electronic component (D) can be grasped very precisely by the picker (121). This second camera (182) may be fixed to the ceiling above the loading tray (D), but it may also be configured to move together integrally with the picker (121).

[0063] A third camera (183) is provided to check whether the position of the electronic component (D) held by the second gripping plate (140) is accurate. To this end, the third camera (183) is positioned above the ceiling of the path where the second gripping plate (140) moves, and photographs the electronic component (D) while the second gripping plate (140) is moving. Accordingly, the control device (CU) checks the position of the electronic component (D) held by the second gripping plate (140) through the image captured by the second camera (182), and then controls the movement distance of the moving device (160) so that the electronic component (D) is accurately positioned below the connector (C) or causes a jam.

[0064] The fourth camera (184) is installed on the rotating plate (151a) on the side of the second gripping plate (140) and is provided to precisely set the position of the connector (C) and the second gripping plate (140). That is, when the second gripping plate (140) is positioned on the lower side of the connector (C), the fourth camera (184) photographs the connector (C), and the control unit (CU) compares the acquired image with a pre-stored appropriate image and then controls the aforementioned moving device (160), rotating device (151), and position moving device (152) to adjust the horizontal or angular position of the second gripping plate (140). Accordingly, the electronic components (D) gripped on the second gripping plate (140) can be accurately electrically connected to the connector (C).

[0065] The vacuum generator (191) generates vacuum pressure to be applied to the electronic component (D) through the vacuum holes (VH1, VH2). This vacuum generator (191) may be provided in the handler (100) itself, but may also be utilized from one built in the test factory.

[0066] The stimulation device (192) is provided to apply high-temperature heat or low-temperature cold air to an electronic component (D) held in the first gripping plate (110) and the second gripping plate (140). To this end, as referenced in FIGS. 1 and FIGS. 11, the stimulation device (192) may include a heater (192a) for heating, a cooling pipe (192b) for cooling, and a supply device (192c) for supplying cooling fluid to the cooling pipe (192b). Accordingly, the electronic component (D) can be preheated or precooled, and the electronic component (D) can be returned to room temperature.

[0067] Referring further to FIG. 11, the heater (192a) and the cooling tube (192b) are preferably installed to be in contact with the first gripping plate (110) or the second gripping plate (140) and are covered by a receiving cover (EC). Accordingly, the thermal stimulus applied through the heater (192a) or the cooling tube (192b) is transmitted to the electronic component (D) via the first gripping plate (110) or the second gripping plate (140), and for this purpose, the first gripping plate (110) and the second gripping plate (120) are preferably provided with a metal material having good thermal conductivity. Since the thermal stimulus can be applied to the electronic component (D) in this way, the electronic component (D) can be properly tested according to various usage environments.

[0068] For reference, the internal space (IS) formed by the receiving cover (EC) in FIG. 11 can be utilized as a vacuum space for transmitting vacuum pressure to the vacuum hole (VH1).

[0069] The control unit (CU) controls the operation of each of the above components.

[0070] Next, the operation of the handler having the above configuration will be explained.

[0071] S1. Supply and movement of loading trays

[0072] The operator supplies the electronic components (D) to the handler (100) by loading the loading trays (LT) loaded with the electronic components (D) onto the stacker (ST). Then, the loading trays (LT) are withdrawn one by one from the stacker (ST) and moved to the rear, so that they are positioned to the right side of the first gripping plate (110).

[0073] S2. Picker Posture Correction

[0074] When the first camera (181) photographs the picker (121) while the picker (121) is moving to the loading tray (LT), the control unit (CU) corrects the posture of the picker (121) through the image acquired by the first camera (181). Of course, at this time, it may also be implemented to calculate an accurate teaching point (a gripping point for gripping electronic components) by establishing the zero position of the picker (121).

[0075] S3. Location verification of electronic components <s3>< / s3>

[0076] The second camera (182) photographs the electronic component (D) loaded on the loading tray (LT), and the control unit (CU) confirms the exact position of the electronic component (D) to be picked up by the picker (121) through the image obtained from the second camera (182).

[0077] S4. Grasp, move, and verify electronic components

[0078] When steps S1 and S2 above are completed, the control unit (CU) controls the picker (121) to pick up an electronic component (D) from the loading tray (LT), and when the picker (121) picks up the electronic component (D), the picker (121) is moved upward on the first gripping plate (110).

[0079] At this time, when the picker (121) moves or stops briefly while moving, the first camera (181) photographs the electronic component (D) held by the picker (121), and the control unit (CU) checks the holding state of the electronic component (D) held by the picker (121) through the image obtained by the first camera (181). Through the image obtained by the first camera (181), the control unit (CU) can accurately determine the end point of the picker (121)'s movement and can also accurately correct the electronic component (D) by operating the rotary drive (184) according to the degree of misalignment of the electronic component (D). For example, even if there is a minute error in the teaching point and the center of the picker (121) and the center of the electronic component (D) do not coincide slightly, the accurate gripping state of the electronic component (D) is confirmed during this process, so the control device (CU) can accurately determine the destination point of the movement of the electronic component (D). In addition, since the horizontal alignment of the electronic component (D) may be disrupted depending on the structure or shape of the picking element (121), such disruption is also corrected.

[0080] S5. Gripping by the first gripping plate

[0081] When the picker (121) moves accurately to the destination point by step S4, the picker device (120) operates to place the electronic component (D) at the correct position and then releases the grip on the electronic component (D). Accordingly, vacuum pressure is applied to the first gripping plate (110), so that the electronic component (D) is gripped by the first gripping plate (110) and fixed in the position where it was placed by the picker (121).

[0082] As steps S2 through S5 are repeated in this manner, electronic components (D) are placed in all gripping areas (HF) of the first gripping plate (110), and the electronic components (D) are gripped and fixed by the first gripping plate (110) by vacuum pressure.

[0083] S6. Rotation of the first gripping plate

[0084] As mentioned above, when the first gripping plate (110) grips all eight electronic components (D), the rotating device (130) operates to rotate the first gripping plate (110) 180 degrees. Accordingly, the electronic components (D) are switched from a live bug state to a dead bug state.

[0085] S7. Movement of electronic components

[0086] When step S6 is completed, the second gripping plate (140), which was waiting below the first gripping plate (110), is raised by the connecting device (170). Accordingly, when the electronic component (D) in a dead bug state is placed on the second gripping plate (140), the vacuum pressure applied to the first gripping plate (110) gradually weakens, while the vacuum pressure of the second gripping plate (140) gradually rises. As a result, the electronic component (D) is moved directly from the first gripping plate (110) to the second gripping plate (140). In order to prevent the position of the electronic components (D) from being disturbed during the movement process of the electronic components (D) that adopt this movement method, the connecting device (170) moves the second gripping plate (140) upward so that the other side of the electronic components (D) come into contact with the second gripping plate (140), while the first gripping plate (110) is gripping the electronic components (D) in a dead bug state toward the side where the terminal (T) is located, as referenced in FIG. 12. Of course, for the accurate movement of the electronic components (D), the first gripping plate (110) and the second gripping plate (140) must remain parallel to each other. And the upward movement distance of the second gripping plate (140) should be set so that the gap between the first gripping plate (110) and the second gripping plate (140) can be narrowed by a value accurately calculated by the height (t, thickness) of the electronic components to prevent damage to the electronic components (D). Of course, it is also possible to consider providing the gripping surface of the first gripping plate (110) or the second gripping plate (140) with a very thin, soft conductive rubber or silicone pad so that the somewhat excessive upward movement of the second gripping plate (140) can be compensated, thereby preventing damage to the electronic components (D). In addition, the first gripping plate (110) and the second gripping plate (140) may have a correction block to correct the gap between them, or they may have a correction block and a corresponding block, and in this case, one or more correction blocks or corresponding blocks may be provided for each.Of course, the correction block or corresponding block may be installed detachably to fit the height of the electronic component (D), or may be precisely controlled by a separate motor.

[0087] S8. Movement of the second gripping plate and verification of gripping status

[0088] When step S7 is completed, the moving device (160) operates to move the second gripping plate (140) to the lower side of the connector (C). Then, as referenced in FIG. 13, the position of the electronic component (D) gripped by the second gripping plate (140) is accurately verified by the third camera (183) while the second gripping plate (140) is moving or temporarily stopped during this process, thereby accurately calculating the end point of the movement of the second gripping plate (140). When this operation is completed, the control device (CU) moves the second gripping plate (140) further to the end point of movement so that the second gripping plate (140) is positioned on the lower side of the connector.

[0089] 9. Correction of the second gripping plate

[0090] Meanwhile, when the second gripping plate (140) is positioned below the connector (C), the fourth camera (184) photographs the connector (C). Then, the control unit (CU) checks whether the electronic component (D) can be precisely connected to the connector (C) by comparing the image obtained by the fourth camera (184) with a previously stored good image. At this time, if it is determined that a defect will occur in the connection between the electronic component (D) and the connector (C), the control unit (CU) controls the moving device (160), the rotating device (151), and the position moving device (152) to precisely correct the horizontal or angular position of the second gripping plate (140). To this end, the fourth camera (184) may be positioned below the second gripping plate (140), or it may photograph the connector (C) in advance before or during the operation.

[0091] 10. Connection of Electronic Components and Connectors

[0092] When the movement and position correction of the second gripping plate (140) is completed, the connecting device (170) moves the second gripping plate (140) upward, and accordingly, the electronic components (D) gripped on the second gripping plate (140) and the connector (C) are electrically connected. In this state, a test of the electronic components (D) is performed.

[0093] When all of the above processes are completed, the electronic component (D) that has completed testing operates in the reverse order above, is transferred from the second gripping plate (140) to the first gripping tray (110), and then separated into good and defective products by the picker device (120) and transferred to the empty loading tray (LT) on the left.

[0094] For reference, in this embodiment, the second gripping plate (140) is implemented to rise in order to move the electronic component (D) on the first gripping plate (110) to the second gripping plate (140), but depending on the implementation, it is also sufficient to consider lowering the first gripping plate (110). In addition, it is entirely possible to implement the first gripping plate (110) so that its horizontal position or angular position is corrected in order to set the exact position between the first gripping plate (110) and the second gripping plate (140).

[0095] <Description of the First Variation>

[0096] FIG. 14 illustrates a first variation of the first embodiment.

[0097] The handler (100) of FIG. 14 is also equipped with a first gripping plate (110), a picker device (120), a rotating device (130), a second gripping plate (140), an alignment device (150), a moving device (160), a connecting device (170), a first camera (181), a second camera (182), a third camera (183), a fourth camera (184), a vacuum generator (191), a stimulation device (192), and a control device (CU), just like in the first embodiment.

[0098] However, a fifth camera (185) that can be paired with the fourth camera (184) is further provided.

[0099] The fifth camera (185) is fixedly installed on the first gripping plate (110) and rotates together with the first gripping plate (110) according to the operation of the rotation device (130). If the fifth camera (185) is switched from a state facing upward to a state facing downward by rotation as referenced in FIG. 15, the fifth camera (185) comes to face the fourth camera (184) installed on the lower side of the second gripping plate (140). When the fifth camera (185) and the fourth camera (184) face each other and take pictures, the other side functions as a alignment mark. Therefore, the control device (CU) can compare the image acquired by the fourth camera (184) and the fifth camera (185) with a previously stored image to verify whether the first gripping plate (110) and the second gripping plate (140) are accurately positioned relative to each other. If the positions of the first gripping plate (110) and the second gripping plate (140) are misaligned even slightly, the control device (CU) operates the moving device (160), the rotating device (151), and the position moving device (152) to correct the position of the second gripping plate (140) so that the first gripping plate (110) and the second gripping plate (140) can face each other accurately. Then, with the position corrected, the second gripping plate (140) is moved backward by a set amount to a position where the first gripping plate (110) and the second gripping plate (140) can be aligned. Here, alignment means that the gripping area (HF) on the first gripping plate (110) and the gripping area on the second gripping plate (140) match in the vertical direction. Of course, even if another mark identifiable by the fourth camera (184) instead of the fifth camera (185) is provided on the first gripping plate (110), the position verification function of the second gripping plate (140) can be performed.

[0100] According to the present variation, the second camera (182) may be omitted and the fifth camera (185) may be used to check the position of the picker (121) or to check the position of the electronic component (D) held by the picker (121). Of course, in this case, a more complex movement path of the picker (121) will be required.

[0101] In addition, according to the present variation, since the electronic components (D) can be accurately moved from the first gripping plate (110) to the second gripping plate (140), the third camera (183) may also be omitted.

[0102] <Explanation of the Second Variation>

[0103] FIG. 16 illustrates a second variation of the first embodiment.

[0104] The handler (100) of FIG. 16 also has all of the first gripping plate (110), picker device (120), rotation device (130), second gripping plate (140), alignment device (150), moving device (160), connecting device (170), first camera (181), second camera (182), third camera (183), fourth camera (184), vacuum generator (191), stimulation device (192), and control device (CU), just like in the first embodiment.

[0105] However, in this example, the flow of electronic components (D) is different from that of the first embodiment in that the electronic components (D) that have completed testing are loaded again onto a loading tray (LT) for supplying electronic components (D) to be tested.

[0106] <Description of the Second Embodiment>

[0108] The first embodiment above assumes a case where the electronic component (D) is supplied to the handler (100) in a live bug state. However, in the production process, the electronic component (D) may be loaded onto the loading tray (LT) in a dead bug state, and this loading tray (LT) may be supplied to the handler. Therefore, this example assumes a case where the electronic component (D) is supplied in a dead bug state. Thus, the first gripping plate (110) or the rotating device (130) presented in the previously mentioned examples may not be configured. Accordingly, as referenced in FIG. 17, the handler (200) according to the second embodiment includes a picker device (220), a gripping plate (240), an alignment device (250), a moving device (260), a connecting device (270), a first camera (281), a second camera (282), a third camera (283), a fourth camera (284), a vacuum generator (291), a stimulation device (292), and a control device (CU).

[0109] According to the present example, a picker (221) directly moves an electronic component (D) in a dead bug state on a loading tray (LT) to a gripping plate (240). To do this, the gripping plate (240) is raised by a connecting device (270) while positioned at the rear by a moving device (260). Here, since the picker (221) must grip the electronic component (D) on the side where the terminal (T) is formed, it is preferable to apply a technique in which the diameter of the vacuum hole (VH2) is smaller than the diameter of the terminal (T), as in the example of FIG. 7.

[0110] In the handler (200) according to the present embodiment, when all eight electronic components (D) are gripped by the gripping plate (240), the gripping plate (240) is lowered and moved forward so as to be positioned below the connector (C), and in that state, the gripping plate (240) is raised to electrically connect the connector (C) and the electronic components (D).

[0111] Likewise, when the test is finished, the electronic components (D) that have completed testing are moved to the loading tray (LT) on the left.

[0112] <Description of the Third Embodiment>

[0113] FIG. 18 illustrates a handler (300) according to a third embodiment of the present invention.

[0114] The handler (300) of FIG. 18, like the handler according to the first embodiment, includes a first gripping plate (310), a picker device (320), a rotating device (330), a second gripping plate (340), an alignment device (350), a moving device (360), a connecting device (370), a first camera (381), a second camera (382), a third camera (383), a fourth camera (384), a vacuum generating device (391), a stimulating device (392), and a control device (CU).

[0115] The handler (300) according to the present embodiment operates in the first mode as in the first embodiment when the electronic component (D) is supplied in a live bug state.

[0116] However, if the electronic component (D) is supplied in a dead bug state, the functions of the first gripping plate (310) and the rotating device (330) are not required. Therefore, the handler (300) according to the present example operates in a second mode.

[0117] In the second mode, the first gripping plate (310) and the rotating device (330) are lowered by the lowering means (DM), and the second gripping plate (340) can move backward while in a raised state and be positioned above the first gripping plate (310). Then, it operates as in the second embodiment. The width of both guide rails (GR) that guide forward and backward movement for the lowering of the first gripping plate (310) is provided to be wider than the width of the first gripping plate (310).

[0118] According to the third embodiment as described above, the handler (300) can be operated appropriately regardless of whether the electronic component (D) is supplied as a live bug or as a dead bug.

[0119] As described above, the specific description of the present invention has been made through embodiments with reference to the attached drawings, but since the above-described embodiments are merely preferred examples of the present invention, the present invention should not be understood as being limited only to the above-described embodiments, and the scope of the rights of the present invention should be understood as the claims set forth below and their equivalents. Explanation of the symbols

[0120] 100 : Handler for testing electronic components 110 : 1st gripping plate HF: Grasp area IF: Separation area VH1: Vacuum hole 120 : Picker device 121 : Picker 130 : Rotating device 140 : Second gripping plate 150 : Alignment device 170 : Connecting device 185: 5th camera 191 : Vacuum generator 192 : Stimulation device

Claims

Claim 1 A first gripping plate for gripping electronic components supplied in a live bug state; a second gripping plate for gripping electronic components supplied in a dead bug state; a picker device provided for moving electronic components from a loading tray to the first gripping plate or the second gripping plate, and having at least one picker capable of gripping or releasing electronic components; a rotating device that causes electronic components to change from a live bug state to a dead bug state by rotating the first gripping plate 180 degrees; and a connecting device that enables electronic components to be tested by a tester by electrically connecting the electronic components gripped by the second gripping plate to a connector. An electronic component test handler comprising: a first mode when electronic components are supplied from a loading tray in a live bug state, wherein the first gripping plate receives and grips the electronic components in a live bug state from the picker device, and the second gripping plate receives and grips the electronic components in a dead bug state from the first gripping plate rotated by the rotating device, and wherein the second mode operates when electronic components are supplied from a loading tray in a dead bug state, wherein the second gripping plate receives and grips the electronic components in a dead bug state from the picker device. Claim 2 An electronic component test handler according to claim 1, further comprising: a lowering means for lowering the first gripping plate and the rotating device; and a moving device for moving the second gripping plate in a forward and backward direction so that the second gripping plate can be selectively positioned below or above the first gripping plate or below the connector; wherein in the first mode, the second gripping plate can be positioned below the first gripping plate by the moving device, and in the second mode, the first gripping plate and the rotating device are lowered by the lowering means, and the second gripping plate can be positioned above the first gripping plate by the moving device. Claim 3 An electronic component test handler according to claim 2, further comprising two guide rails that guide the forward and backward movement of the moving device that moves the second gripping plate, wherein the width of the two guide rails is wider than the width of the first gripping plate.

Images