Flexible printed circuit board and electronic device therewith

Abstract

An electronic device according to various embodiments of the present disclosure comprises a printed circuit board, a flexible printed circuit board connected to the printed circuit board, which is configured by stacking at least three substrates including a first substrate, a second substrate, and a third substrate, and comprises a pad portion including a plurality of outer pads and a plurality of inner pads, and at least one via hole formed adjacent to the pad portion, and a shell disposed on the pad portion, and includes at least one connection terminal disposed inside the shell, wherein at least one via hole may include a pad portion ground via disposed between the outer pads or between the inner pads. A flexible printed circuit board according to various embodiments of the present disclosure comprises a pad portion including a first substrate, a second substrate, a third substrate, a plurality of outer pads and a plurality of inner pads, at least one via hole formed adjacent to the pad portion, and a shell disposed on the pad portion, and at least one connection terminal disposed inside the shell, wherein the via hole comprises a pad portion ground via disposed between the outer pads or between the inner pads, wherein the outer pads are disposed spaced apart from each other and the inner pads are disposed spaced apart from each other, and the outer pads and the inner pads may be disposed on the first substrate.

Description

Technology Field

[0001] Various embodiments of the present disclosure relate to flexible printed circuit boards and electronic devices including the same. Background Technology

[0003] To achieve high data transmission rates, 5G communication systems are being considered for implementation in the mmWave band (e.g., bands above 28 GHz). To mitigate path loss and increase transmission distance in the mmWave band, beamforming, massive multi-input multi-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antenna, analog beamforming, and large-scale antenna technologies are being discussed for 5G communication systems.

[0004] In addition, to improve the network of the system, the development of technologies such as advanced small cell, advanced small cell, cloud radio access network (cloud RAN), ultra-dense network, device-to-device communication (D2D), wireless backhaul, moving network, cooperative communication, CoMP (coordinated multi-points), and interference cancellation is taking place in 5G communication systems.

[0005] In addition, advanced coding modulation (ACM) methods such as FQAM (hybrid FSK and QAM modulation) and SWSC (sliding window superposition coding), as well as advanced access technologies such as FBMC (filter bank multi carrier), NOMA (non-orthogonal multiple access), and SCMA (sparse code multiple access), are being developed in 5G systems. The problem to be solved

[0007] To provide a compact product, printed circuit boards (e.g., PCBs, FPCBs) can be used to connect antennas and communication modules (e.g., 5G, WiFi, etc.) or for high-speed interfaces. In the printed circuit board of an electronic device, the ground in the area adjacent to the via pad may be removed to prevent signal interference. However, when the electronic device is used in the ultra-high frequency band, an aperture area where ground is not formed may experience impedance mismatching, which may result in radio frequency loss.

[0008] According to various embodiments of the present disclosure, a flexible printed circuit board can be provided that can reduce resonance and signal loss that may occur in an opening region formed in the ground where a via pad is located.

[0009] However, the problems intended to be solved in this disclosure are not limited to those mentioned above, and may be expanded in various ways without departing from the spirit and scope of this disclosure. means of solving the problem

[0011] An electronic device according to various embodiments of the present disclosure comprises a printed circuit board, a flexible printed circuit board connected to the printed circuit board, which is configured by stacking at least three substrates including a first substrate, a second substrate, and a third substrate, and comprises a pad portion including a plurality of outer pads and a plurality of inner pads, and at least one via hole formed adjacent to the pad portion, and a shell disposed on the pad portion, and includes at least one connection terminal disposed inside the shell, wherein at least one via hole may include a pad portion ground via disposed between the outer pads or between the inner pads.

[0012] A flexible printed circuit board according to various embodiments of the present disclosure comprises a pad portion including a first substrate, a second substrate, a third substrate, a plurality of outer pads and a plurality of inner pads, at least one via hole formed adjacent to the pad portion, and a shell disposed on the pad portion, and at least one connection terminal disposed inside the shell, wherein the via hole comprises a pad portion ground via disposed between the outer pads or between the inner pads, wherein the outer pads are disposed spaced apart from each other and the inner pads are disposed spaced apart from each other, and the outer pads and the inner pads may be disposed on the first substrate. Effects of the invention

[0014] According to various embodiments of the present disclosure, the connection portion of a flexible printed circuit board includes a pad and a first ground via disposed between the pads, thereby reducing the loss of high-frequency signals.

[0015] According to various embodiments of the present disclosure, the connection portion of a flexible printed circuit board includes a shell, thereby reducing the loss of high-frequency signals. Brief explanation of the drawing

[0017] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure. FIG. 2 is a front perspective view of an electronic device according to various embodiments of the present disclosure. FIG. 3 is a rear perspective view of an electronic device according to various embodiments of the present disclosure. FIG. 4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure. FIG. 5 is a rear perspective view of a first support member and a printed circuit board according to various embodiments of the present disclosure. FIG. 6 is a perspective view of a flexible printed circuit board according to various embodiments of the present disclosure. FIG. 7 is an exploded perspective view of a part of a flexible printed circuit board, a first connection part, and a first connection part according to various embodiments of the present disclosure. FIGS. 8a to 8c are perspective views of a part of a flexible printed circuit board and a first connection part according to various embodiments of the present disclosure, and FIG. 8d is a plan view schematically showing FIG. 8c. FIGS. 9a to 9c are perspective views of a part of a flexible printed circuit board and a second connection part according to various embodiments of the present disclosure, and FIG. 9d is a plan view schematically showing FIG. 9c. FIG. 10 is a graph of signal reduction in an electronic device with a flexible printed circuit board applied and signal reduction in an electronic device without a flexible printed circuit board applied, according to various embodiments of the present disclosure. Specific details for implementing the invention

[0018] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments.

[0019] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0020] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0021] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0022] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0023] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0024] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0025] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0026] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0027] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0028] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0029] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0030] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0031] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0032] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0033] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0034] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0035] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0036] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0037] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0038] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0039] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0040] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0041] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0042] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as “coupled” or “connected” to another (e.g., 2nd) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0043] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0044] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0045] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0046] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0048] FIG. 2 is a front perspective view of an electronic device (101) according to various embodiments of the present disclosure. FIG. 3 is a rear perspective view of an electronic device (101) according to various embodiments of the present disclosure.

[0049] Referring to FIGS. 2 and FIGS. 3, an electronic device (101) according to one embodiment may include a housing (310) (e.g., the housing (310) of FIGS. 2 and FIGS. 3) that includes a side (e.g., the side (310C) of FIGS. 2 and FIGS. 3) that surrounds the space between the front (310A) and the rear (310B). In another embodiment (not shown), the housing (310) may refer to a structure that forms part of the first surface (e.g., the front (310A) of FIGS. 2), the second surface (e.g., the rear (310B) of FIGS. 3), and the side (310C).

[0050] According to one embodiment, the front (310A) may be formed by a front plate (302) in which at least a portion is substantially transparent (e.g., a glass plate containing various coating layers, or a polymer plate). The rear (310B) may be formed by a rear plate (311). The rear plate (311) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side (310C) may be formed by a side bezel structure (or "side member") (318) comprising metal and / or polymer, which is combined with the front plate (302) and the rear plate (311). In some embodiments, the rear plate (311) and the side bezel structure (318) may be formed integrally and may comprise the same material (e.g., ceramic).

[0051] In the illustrated embodiment, the front plate (302) may include two first edge regions (310D) that curve seamlessly extend from the front (310A) toward the rear plate (311) at both ends of the long edge of the front plate (302). In the illustrated embodiment (see FIG. 3), the rear plate (311) may include two second edge regions (310E) that curve seamlessly extend from the rear (310B) toward the front plate (302) at both ends of the long edge. In some embodiments, the front plate (302) (or rear plate (311)) may include only one of the first edge regions (310D) (or second edge regions (310E)). In other embodiments, some of the first edge regions (310D) or the second edge regions (310E) may not be included. In the above embodiments, when viewed from the side of the electronic device (101), the side bezel structure (318) may have a first thickness (or width) on the side that does not include the first edge regions (310D) or the second edge regions (310E) as described above, and may have a second thickness that is thinner than the first thickness on the side that includes the first edge regions (310D) or the second edge regions (310E).

[0052] According to one embodiment, the electronic device (101) may include at least one of a display (301), an audio module (303, 307, 314) (e.g., the audio module (170) of FIG. 1), a sensor module (e.g., the sensor module (176) of FIG. 1), a camera module (305, 312), a key input device (317) (e.g., the input device (150) of FIG. 1), and a connector hole (308, 309) (e.g., the connection terminal (178) of FIG. 1). In some embodiments, the electronic device (101) may omit at least one of the components (e.g., the key input device (317) or the connector hole (308)) or additionally include other components.

[0053] According to one embodiment, the display (301) may be exposed, for example, through a substantial portion of the front plate (302). In some embodiments, at least a portion of the display (301) may be exposed through the front plate (302) forming first edge regions (310D) of the front (310A) and side (310C). In some embodiments, the corners of the display (301) may be formed to be largely identical to the adjacent outer shape of the front plate (302). In other embodiments (not shown), to expand the area where the display (301) is exposed, the gap between the outer edge of the display (301) and the outer edge of the front plate (302) may be formed to be largely identical.

[0054] In one embodiment, the surface of the housing (310) (or the front plate (302)) may include a screen display area formed as the display (301) is visually exposed. For example, the screen display area may include a front (310A) and a first edge area (310D) on the side.

[0055] In another embodiment, a recess or opening may be formed in a part of the screen display area (e.g., front (310A), first edge area (310D)) of the display (301), and at least one of an audio module (314), a sensor module (not shown), a light-emitting element (not shown), and a camera module (305) may be included that are aligned with the recess or the opening. In another embodiment (not shown), at least one of an audio module (314), a sensor module (not shown), a camera module (305), and a light-emitting element (not shown) may be included on the back surface of the screen display area of ​​the display (301). According to another embodiment, various sensors and modules may not be visually exposed. For example, the camera may be configured as an under-display camera (UDC). Pixels in one area of ​​the display (301) corresponding to the location of the UDC may be configured differently from pixels in other areas so that the image sensor and / or camera may not be visually exposed.

[0056] In another embodiment (not shown), the display (301) may be combined with or placed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer that detects a magnetic field type stylus pen.

[0057] In some embodiments, at least a portion of the key input device (317) may be placed in the first edge regions (310D) and / or the second edge regions (310E).

[0058] According to one embodiment, the audio module (303, 307, 314) may include, for example, a microphone hole (303) and a speaker hole (307, 314). A microphone for acquiring external sound may be placed inside the microphone hole (303), and in some embodiments, a plurality of microphones may be placed to detect the direction of sound. The speaker hole (307, 314) may include an external speaker hole (307) and a receiver hole (314) for calls. In some embodiments, the speaker hole (307, 314) and the microphone hole (303) may be implemented as a single hole, or a speaker may be included without the speaker hole (307, 314) (e.g., a piezo speaker).

[0059] According to one embodiment, a sensor module (not shown) may generate an electrical signal or data value corresponding to, for example, an internal operating state of the electronic device (101) or an external environmental state. The sensor module (not shown) may include, for example, a first sensor module (not shown) (e.g., proximity sensor) and / or a second sensor module (not shown) (e.g., fingerprint sensor) disposed on the front (310A) of the housing (310), and / or a third sensor module (not shown) (e.g., HRM sensor) and / or a fourth sensor module (not shown) (e.g., fingerprint sensor) disposed on the rear (310B) of the housing (310). In some embodiments (not shown), the fingerprint sensor may be disposed on the rear (310B) as well as on the front (310A) (e.g., display (301)) of the housing (310). The electronic device (101) may further include at least one of an unillustrated sensor module, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor (not illustrated).

[0060] According to one embodiment, the camera module (305, 312) may include, for example, a first camera module (305) disposed on the front (310A) of the electronic device (101), a second camera module (312) disposed on the rear (310B), and / or a flash (313). The camera module (305, 312) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (313) may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (101).

[0061] According to one embodiment, the key input device (317) may be placed on the side (310C) of the housing (310). In another embodiment, the electronic device (101) may not include some or all of the key input devices (317), and the key input devices (317) that are not included may be implemented in other forms, such as soft keys, on the display (301).

[0062] According to one embodiment, a light-emitting element (not shown) may be disposed, for example, on the front (310A) of the housing (310). The light-emitting element (not shown) may, for example, provide state information of the electronic device (101) in the form of light. In another embodiment, the light-emitting element (not shown) may, for example, provide a light source that is coupled with the operation of the first camera module (305). The light-emitting element (not shown) may include, for example, an LED, an IR LED, and / or a xenon lamp.

[0063] According to one embodiment, the connector holes (308, 309) may include, for example, a first connector hole (308) capable of receiving a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (309) capable of receiving a connector for transmitting and receiving audio signals with an external electronic device.

[0065] FIG. 4 is an exploded perspective view of an electronic device (101) according to various embodiments of the present disclosure. FIG. 5 is a rear perspective view of the first support member (332) of FIG. 4.

[0066] Referring to FIGS. 4 and 5, an electronic device (101) (e.g., electronic device (101) of FIGS. 2 to 3) may include a front plate (320) (e.g., front plate (302) of FIG. 2), a display (330) (e.g., display (301) of FIG. 2), a first support member (332) (e.g., bracket), a main printed circuit board (340) (e.g., PCB), a flexible printed circuit board (400) (e.g., FPCB), a battery (350), a second support member (360) (e.g., rear case), a first antenna (334), a second antenna (370), and a rear plate (380) (e.g., rear plate (311) of FIG. 3). In some embodiments, the electronic device (101) may omit at least one of the components (e.g., the first support member (332), or the second support member (360)) or additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 2 or FIG. 3, and redundant descriptions are omitted below.

[0067] According to one embodiment, the first support member (332) may be disposed inside the electronic device (101), for example, and connected to the side bezel structure (331) (e.g., the side bezel structure (318) of FIG. 2), or may be formed integrally with the side bezel structure (331). The first support member (332) may be formed from, for example, a metal material and / or a non-metal (e.g., a polymer) material. A display (330) may be attached to one side of the first support member (332), and a main printed circuit board (340) may be attached to the other side.

[0068] According to various embodiments, an antenna structure may be formed by a part or combination thereof of the side bezel structure (331) and / or the first support member (332). For example, a first antenna (334) may be formed by a part or combination thereof of the side bezel structure (331) and / or the first support member (332). The first antenna (334) may be located in at least a part of the space created by a part or combination thereof of the side bezel structure (331) and / or the first support member (332). According to one embodiment, the first antenna (334) may include at least one radiating conductor and may communicate a wireless signal by receiving power from a communication module (e.g., the communication module (190) of FIG. 1) disposed on the main printed circuit board (340). Here, communication may mean at least one of transmission, reception, or transmission and reception of a wireless signal. According to one embodiment, the first antenna (334) may be an antenna configured to transmit and receive wireless signals in a frequency band of tens of GHz or higher. For example, the first antenna (334) may be an antenna for millimeter wave communication. According to various embodiments, the first antenna (334) may include a plurality of antennas for communicating in a plurality of different frequency bands. According to one embodiment, the first antenna (334) may include at least two antennas. For example, the first antenna (334) may include a first-1 antenna (334a) for communicating in a first frequency band (e.g., 28 GHz) and a first-2 antenna (334b) for communicating in a second frequency band (e.g., 39 GHz). According to another embodiment, the first antenna (334) may be configured to support a plurality of bands. According to one embodiment, the first antenna (334) may support at least two frequency bands. For example, the first antenna (334) can support a first frequency band (e.g., 28 GHz) and a second frequency band (e.g., 39 GHz).The configuration of the first antenna (334) of FIG. 5 may be the same in whole or in part as the configuration of the antenna module (197) of FIG. 1.

[0069] According to one embodiment, the main printed circuit board (340) may be equipped with, for example, a processor, memory, and / or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0070] According to one embodiment, the memory may include volatile memory or non-volatile memory.

[0071] According to one embodiment, the interface may include, for example, an HDMI (high definition multimedia interface), a USB (universal serial bus) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (101) to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0072] According to one embodiment, the battery (350) is a device for supplying power to at least one component of the electronic device (101) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially coplanar with, for example, the main printed circuit board (340). The battery (350) may be disposed integrally inside the electronic device (101) or may be disposed detachably from the electronic device (101).

[0073] According to one embodiment, a second support member (360) (e.g., a rear case) may be positioned between a main printed circuit board (340) and a second antenna (370). According to one embodiment, the second support member (360) may include one side to which at least one of the main printed circuit board (340) or the battery (350) is connected, and the other side to which the second antenna (370) is connected.

[0074] According to one embodiment, the second antenna (370) may be positioned between the rear plate (380) and the battery (350). The second antenna (370) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The second antenna (370) may, for example, communicate near-field with an external device or wirelessly transmit and receive power required for charging. The rear plate (380) may form at least a portion of the rear of the electronic device (101) (e.g., the rear (310B) of FIG. 3). The configuration of the second antenna (370) of FIG. 5 may be all or part identical to the configuration of the antenna module (197) of FIG. 1.

[0075] According to one embodiment, the flexible printed circuit board (400) can electrically connect the first antenna (334) and the main printed circuit board (340). For example, the flexible printed circuit board (400) may be a flexible printed circuit board type radio frequency cable (FRC). According to one embodiment, the flexible printed circuit board (400) may be placed on at least a portion of the first support member (332). For example, the flexible printed circuit board (400) may be placed on at least a portion of the other side of the first support member (332) facing the second direction (-Z direction).

[0076] According to various embodiments, the flexible printed circuit board (400) may be electrically connected to a first antenna (334) and a communication module (e.g., the communication module (190) of FIG. 1) through a connection member (480). For example, the connection member (480) may include a first connection member (482) for connection with the first antenna (334) and a second connection member (484) for connection with the communication module (e.g., the communication module (190) of FIG. 1). According to one embodiment, the first connection member (482) may be connected to a plurality of first antennas (334). For example, the first connection member (482) may include a first-1 connection member (482a) connected to a first-1 antenna (334a) and a first-2 connection member (482b) connected to a first-2 antenna (334b).

[0078] FIG. 6 is a perspective view of a flexible printed circuit board according to various embodiments of the present disclosure.

[0079] The flexible printed circuit board (400) disclosed in FIG. 6 may be the same or similar as the flexible printed circuit board (400) disclosed in FIG. 5. Therefore, descriptions of identical configurations may be omitted.

[0080] According to various embodiments, as described in the description of FIG. 5, the flexible printed circuit board (400) can electrically connect a first antenna (e.g., the first antenna (334) of FIG. 5) and a main printed circuit board (e.g., the main printed circuit board (340) of FIG. 4). According to one embodiment, the flexible printed circuit board (400) may be a flexible printed circuit board type radio frequency cable (FRC). According to one embodiment, a first connection part (410) connected to the main printed circuit board (340) may be disposed in a first region (A) of the flexible printed circuit board (400) disclosed in FIG. 6, and a second connection part (410-1) connected to the first antenna (334) may be disposed in a second region (B) of the flexible printed circuit board (400). According to another embodiment, the first connection part (410) can be connected to the first antenna (334), and the second connection part (410-1) can be connected to the main circuit board (340).

[0081] According to various embodiments, the first connecting portion (410) may be placed at one end of the flexible printed circuit board (400), and the second connecting portion (410-1) may be placed at the other end of the flexible printed circuit board (400).

[0082] According to various embodiments, the first connecting portion (410) may be disposed on one side of the flexible printed circuit board (400), and the second connecting portion (410-1) may be disposed on the other side of the flexible printed circuit board (400). According to another embodiment, the first connecting portion (410) and the second connecting portion (410-1) may be disposed on one side of the flexible printed circuit board (400).

[0083] According to various embodiments, the first connection part (410) and the second connection part (410-1) may be electrically connected. The flexible printed circuit board (400) may be composed of one or more substrates. According to one embodiment, the flexible printed circuit board (400) may be composed of at least three substrates. For example, the flexible printed circuit board (400) may include a first substrate (e.g., the first substrate (401) of FIG. 7), a second substrate (e.g., the second substrate (402) of FIG. 7), and a third substrate (e.g., the third substrate (403) of FIG. 7). A plurality of circuit wires may be arranged on at least one substrate of the flexible printed circuit board (400), and the first connection part (410) and the second connection part (410-1) may be electrically connected through the circuit wires.

[0084] According to various embodiments, the first connecting part (410) is described later together with the description of FIGS. 8a to 8c, and the second connecting part (410-1) is described later together with the description of FIGS. 9a to 9c.

[0086] FIG. 7 is an exploded perspective view of a part of a flexible printed circuit board, a first connection part, and a first connection part according to various embodiments of the present disclosure.

[0087] The flexible printed circuit board (400) and the first connecting part (410) disclosed in FIG. 7 may be identical or similar to the flexible printed circuit board (400) and the first connecting part (410) disclosed in FIG. 4 to 6. Therefore, descriptions of identical configurations may be omitted.

[0088] According to various embodiments, at least a portion of the flexible printed circuit board (400) may include a first substrate (401), a second substrate (402), and a third substrate (403). According to another embodiment, the flexible printed circuit board (400) may include three or more substrates.

[0089] According to various embodiments, a first pad portion (510) may be disposed on one side of the first substrate (401). A second substrate (402) corresponding to the size of the first substrate (401) may be disposed on the other side of the first substrate (401). The first substrate (401) may be disposed on one side of the second substrate (402), and a third substrate (403) corresponding to the size of the second substrate (402) may be disposed on the other side of the second substrate (402). According to one embodiment, the first substrate (401) may be disposed on the upper side of the second substrate (402), and the third substrate (403) may be disposed on the lower side of the second substrate (402). According to one embodiment, at least one of the first to third substrates (401, 402, 403) may be composed of an electrically conductive material, and at least one of the other may be composed of a non-electrically conductive material. According to one embodiment, an insulating material that does not conduct electricity may be applied to at least a portion of one surface of the first substrate (401). According to one embodiment, an insulating material may be applied to at least a portion of the upper side of the first substrate (401). According to one embodiment, at least a portion of at least one of the first to third substrates (401, 402, 403) may be configured to be cut.

[0090] According to various embodiments, a first via hole (e.g., the first via hole (550) of FIG. 8a) may be formed in the flexible printed circuit board (400). According to one embodiment, the first via hole (550) may be formed to penetrate the first substrate (401), the second substrate (402), and the third substrate (403). According to another embodiment, the first via hole (550) may be formed to penetrate at least one of the first substrate (401), the second substrate (402), and the third substrate (403). The first via hole (550) will be described later in conjunction with the description of FIG. 8a through 8c.

[0091] According to various embodiments, the first pad portion (510) may be disposed on one side of the flexible printed circuit board (400). According to one embodiment, the first pad portion (510) may be disposed on one side of the first substrate (401) of the flexible printed circuit board (400). According to one embodiment, the first pad portion (510) may be disposed on the upper side of the first substrate (401). According to one embodiment, the first pad portion (510) may include a plurality of pads. A plurality of first pad portions (510) may be disposed on the upper side of the first substrate (401) so as to be spaced apart from each other.

[0092] According to various embodiments, the first pad portion (510) may include at least one first outer pad (511) and at least one first inner pad (512). The first outer pad (511) may be a pad positioned on the outer side of the first pad portion (510) positioned on the first substrate (401), and the first inner pad (512) may be a pad positioned on the inner side of the area where the first outer pad (511) is positioned. According to one embodiment, the first outer pad (511) may be positioned in a rectangular shape. The first inner pad (512) may be positioned on the inner side of the rectangular area formed by the first outer pad (511). According to one embodiment, as a plurality of first pad portions (510) are positioned on the upper side of the first substrate (401) so as to be spaced apart from each other, the first outer pad (511) and / or the first inner pad (512) may be positioned so as to be spaced apart from each other. According to one embodiment, the first shell (520) of the first connecting part (410) may be disposed on the upper side of the first pad part (510).

[0093] According to various embodiments, the first shell (520) may be positioned above the first pad portion (510). The first shell (520) may be formed in a ring shape. According to one embodiment, the first shell (520) may be positioned above the first outer pad (511) along the first outer pad (511). As the first shell (520) is positioned above the first outer pad (511) along the first outer pad (511), the first shell (520) may be formed in the shape of a square ring, and a space may be formed inside the first shell (520). According to one embodiment, the first pad portion (510) may be positioned between the first shell (520) and the first substrate (401). Due to the first pad portion (510) disposed between the first shell (520) and the first substrate (401), the first shell (520) may be disposed so as to be spaced apart from the first substrate (401) by a predetermined distance. According to one embodiment, the first shell (520) may be disposed so as to be spaced apart from the first substrate (410) by about 10 μm to about 20 μm. According to one embodiment, the thickness of the first pad portion (510) may be about 10 μm to about 20 μm. The first shell (520) may perform the role of shielding electromagnetic waves. Accordingly, as the first shell (520) is disposed on the upper side of the first substrate (401), it is possible to prevent electromagnetic waves from entering from the outside of the first shell (520) to the inside, and to prevent electromagnetic waves from going out from the inside of the first shell (520). As the first shell (520) performs a shielding function, signal loss inside the first shell (520) may be reduced or noise may be suppressed. According to one embodiment, at least one first connection terminal (530) and a first insulator (540) may be disposed inside the first shell (520).

[0094] According to various embodiments, at least one first connection terminal (530) may be disposed inside the first shell (520). The first connection terminal (530) may be disposed inside the first shell (520) and connected to at least one first via hole (550) formed in the flexible printed circuit board (400). The first connection terminals (530) may be formed to be connected to each other or spaced apart from each other. The first connection terminals (530) may be composed of an electrically conductive material (e.g., a conductor). According to one embodiment, an insulator (540) may be disposed inside the first shell (520) and / or between a plurality of first connection terminals (530).

[0095] According to various embodiments, the insulator (540) may be disposed between the inside of the first shell (520) and / or between the first connection terminals (530). As the insulator (540) is disposed between the inside of the first shell (520) and / or between a plurality of first connection terminals (530), contact between the first connection terminals (530) and the first shell (520) may be prevented, and unintended contact between the plurality of first connection terminals (530) may be prevented. According to one embodiment, the first connection portion (410) may be configured to be coupled with the first socket portion (611).

[0096] According to various embodiments, the first socket portion (611) may be configured to be coupled with the first connection portion (410). The first socket portion (611) may be placed in a configuration inside an electronic device (e.g., the electronic device (101) of FIG. 1). According to one embodiment, the first socket portion (611) may be placed on a main printed circuit board (e.g., the main printed circuit board (340) of FIG. 4). According to one embodiment, the first socket portion (611) may be coupled to the first connection portion (410) in a direction perpendicular to the surface of the flexible printed circuit board (400). The first socket portion (611) may include a socket portion shell (612), at least one socket portion connection terminal (613), and a socket portion insulator (614).

[0097] According to various embodiments, the socket shell (612) of the first socket part (611) may be formed to be coupled with the first shell (520) of the first connection part (410).

[0098] According to various embodiments, the socket portion connection terminal (613) may be formed to be in contact with the first connection terminal (530).

[0099] According to various embodiments, the socket insulator (614) may be positioned between the inside of the socket shell (612) and / or between the socket connection terminals (613). As the socket insulator (614) is positioned between the inside of the socket shell (612) and / or between a plurality of socket connection terminals (613), contact between the socket shell (612) and the socket connection terminals (613) may be prevented, and unintended contact between the plurality of socket connection terminals (613) may be prevented.

[0101] FIGS. 8a to 8c are perspective views of a part of a flexible printed circuit board and a first connection part according to various embodiments of the present disclosure, and FIG. 8d is a plan view schematically showing FIG. 8c.

[0102] The flexible printed circuit board (400), first substrate (401), second substrate (402), third substrate (403), first connection part (410), first pad part (510), first shell (520), first connection terminal (530), first insulator (540), and first via hole (550) disclosed in FIGS. 8a to 8d may be identical or similar to the flexible printed circuit board (400), first substrate (401), second substrate (402), third substrate (403), first connection part (410), first pad part (510), first shell (520), first connection terminal (530), first insulator (540), and first via hole (550) disclosed in FIGS. 5 to 7. Accordingly, descriptions of identical configurations may be omitted.

[0103] FIG. 8a is a perspective view of a first region (e.g., the first region (A) of FIG. 6) of a flexible printed circuit board (400), FIG. 8b is a perspective view of the first region (A) with the first insulator (e.g., the first insulator (540) of FIG. 8a) removed, FIG. 8c is a perspective view of the first region (A) with the first shell (e.g., the first shell (520) of FIG. 8a)) and the first connection terminal (e.g., the first connection terminal (530) of FIG. 8a) removed, and FIG. 8d is a plan view schematically illustrating FIG. 8c as seen from above.

[0104] At least a portion of the flexible printed circuit board (400) disclosed in FIGS. 8a to 8d and the first connection portion (410) may include a first pad portion (510), a first shell (520), a first connection terminal (530), a first insulator (540), and a first via hole (550) formed in a portion of the flexible printed circuit board (400).

[0105] Referring to FIGS. 8a through 8d, the first connecting portion (410) may be formed in a rectangular shape. According to one embodiment, the first connecting portion (410) may be formed in a rectangular shape. The first connecting portion (410) may be formed at one end of the flexible printed circuit board (400). According to one embodiment, the longitudinal direction of the rectangular first connecting portion (410) may be arranged parallel to the longitudinal direction of the flexible printed circuit board (400).

[0106] Referring to FIG. 8a and FIG. 8b, according to various embodiments, a flexible printed circuit board (400) may include a first substrate (401), a second substrate (402), and a third substrate (403). A first via hole (550) may be formed penetrating at least one of the first to third substrates (401, 402, 403).

[0107] According to various embodiments, a plurality of first pad portions (510) may be disposed on one surface of the first substrate (401). According to one embodiment, the first pad portion (510) may be disposed on the upper side of the first substrate (401). The thickness of the first pad portion (510) may be about 10 μm to about 20 μm. A first shell (520) may be disposed on one surface of the first pad portion (510).

[0108] According to various embodiments, the first shell (520) may be disposed on one side of the first pad portion (510). According to one embodiment, the first pad portion (510) may be disposed between the first shell (520) and the first substrate (401). The first shell (520) may be formed in a ring shape. According to one embodiment, the first shell (520) may be formed in a square ring shape. A first connection terminal (530) and a first insulator (540) may be disposed in the inner space of the first shell (520).

[0109] According to various embodiments, a plurality of first connection terminals (530) may be disposed in the inner space of the first shell (520). The plurality of first connection terminals (530) may be connected to each other or may be disposed spaced apart from each other. The first connection terminals (530) may be disposed to be connected to a first via hole (550) formed in the flexible printed circuit board (400).

[0110] According to various embodiments, the first insulator (540) may be disposed in the inner space of the first shell (520). The first insulator (540) may be disposed to prevent a plurality of first connection terminals (530) from coming into contact with each other. The first insulator (540) may be disposed to prevent the first connection terminals (530) from coming into contact with the first shell (520). As the first insulator (540) is disposed in the inner space of the first shell (520), at least a portion of the first connection terminals (530) may be disposed inside the first insulator (540).

[0111] According to various embodiments, the first via hole (550) may be formed in the flexible printed circuit board (400) to be connected to the first connection terminal (530). The first via hole (550) may be formed in at least one of the first to third substrates (401, 402, 403). According to one embodiment, the first via hole (550) may be formed in the first substrate (401) and the second substrate (402). The first via hole (550) may be formed outside the area where the first shell (520) is placed, or inside the area where the first shell (520) is placed.

[0112] Referring to FIG. 8c, according to various embodiments, the first pad portion (510) may include at least one first outer pad (511) and at least one first inner pad (512). According to one embodiment, the first outer pad (511) may be disposed between the first shell (520) and the first substrate (401), and the first inner pad (512) may be disposed inside the area formed by the first shell (520). According to one embodiment, the first inner pad (512) may be disposed inside the area formed by the first outer pad (511).

[0113] According to various embodiments, a plurality of first outer pads (511) may be disposed between the first shell (520) and the first substrate (401). A plurality of first outer pads (511) may be disposed spaced apart from each other. A plurality of first outer pads (511) may be spaced apart from each other by a distance of about 1000 μm. According to one embodiment, a plurality of first outer pads (511) may be spaced apart by a distance of about 300 μm to about 400 μm. A first via hole (550) may be formed between a plurality of first outer pads (511).

[0114] According to various embodiments, a plurality of first inner pads (512) may be disposed within the area formed by the first outer pad (511). A plurality of first inner pads (512) may be disposed spaced apart from each other. A plurality of first inner pads (512) may be spaced apart from each other by a distance of about 1000 μm. According to one embodiment, a plurality of first inner pads (512) may be spaced apart by a distance of about 300 μm to about 400 μm. A first via hole (550) may be formed between a plurality of first inner pads (512).

[0115] Referring to FIG. 8d, according to various embodiments, the first via hole (550) may include a first ground via (551), a first pad portion ground via (552), a first signal via (553), a first power via (554), and a first control via (555).

[0116] According to various embodiments, the first ground via (551) is a first via hole (550) connected to ground and can be formed on a flexible printed circuit board (400). As the first ground via (551) is formed on the flexible printed circuit board (400) and connected to ground, signal loss can be prevented and noise generation can be suppressed.

[0117] According to various embodiments, the first pad portion ground via (552) is a first via hole (550) connected to ground and can be formed on a flexible printed circuit board (400). The first pad portion ground via (552) can be placed between a plurality of first outer pads (511) and / or a plurality of first inner pads (512). As such, as the first pad portion (510) is composed of a plurality of first outer pads (511) and a plurality of first inner pads (512), the first pad portion ground via (552) can be placed between the first pad portions (510). As the first pad portion ground via (552) is placed between the first pad portions (510), the flexible printed circuit board (400) has an increased number of points connected to ground, which can prevent signal loss and suppress noise generation. Additionally, as the first pad portion ground via (552) is positioned between the first pad portions (510), the size of the area where the first shell (520) is positioned can be reduced by the first reduction area (560). Accordingly, the size of the flexible printed circuit board (400) can be reduced.

[0118] According to various embodiments, the first signal via (553) is a first via hole (550) connected to a signal wire (not shown) disposed on the flexible printed circuit board (400) and may be formed on the flexible printed circuit board (400). According to one embodiment, the first signal via (553) may be disposed on the inner side of the first outer pad (511). The flexible printed circuit board (400) may be able to communicate through the first signal via (553) connected to the signal wire.

[0119] According to various embodiments, the first power via (554) is a first via hole (550) connected to a power source and can be formed on a flexible printed circuit board (400). According to one embodiment, the first power via (554) can be placed on the inside and / or outside of the first outer pad (511). The flexible printed circuit board (400) can transmit power through the first power via (554) connected to a power source.

[0120] According to various embodiments, the first control via (555) is a first via hole (550) connected to wiring that transmits and receives control signals and can be formed on a flexible printed circuit board (400). According to one embodiment, the first control via (555) can be placed on the inside and / or outside of the first outer pad (511). The flexible printed circuit board (400) can transmit and receive control signals through the first control via (555) connected to wiring that transmits and receives control signals.

[0121] According to various embodiments, as the first shell (520) is placed on the flexible printed circuit board (400), the shielding function of the first connection part (410) is improved, so that signal loss in the flexible printed circuit board (400) is reduced and noise can be suppressed. As the first pad part ground via (552) is placed on the flexible printed circuit board (400), resonance in the flexible printed circuit board (400) is reduced, signal loss is reduced, and noise can be suppressed.

[0123] FIGS. 9a to 9c are perspective views of a part of a flexible printed circuit board and a second connection part according to various embodiments of the present disclosure, and FIG. 9d is a plan view schematically showing FIG. 9c.

[0124] The flexible printed circuit board (400), first substrate (401), second substrate (402), third substrate (403), first connection part (410), first pad part (510), first shell (520), first connection terminal (530), first insulator (540), and first via hole (550) disclosed in FIGS. 9a to 9d may be identical or similar to the flexible printed circuit board (400), first substrate (401), second substrate (402), third substrate (403), first connection part (410), first pad part (510), first shell (520), first connection terminal (530), first insulator (540), and first via hole (550) disclosed in FIGS. 5 to 8d. Accordingly, descriptions of identical configurations may be omitted.

[0125] FIG. 9a is a perspective view of a second region (e.g., the second region (B) of FIG. 6) of a flexible printed circuit board (400), FIG. 9b is a perspective view of the second region (B) with the second insulator (e.g., the second insulator (540-1) of FIG. 9a) removed, FIG. 9c is a perspective view of the second region (B) with the second shell (e.g., the second shell (520-1) of FIG. 9a)) and the second connection terminal (e.g., the second connection terminal (530-1) of FIG. 9a) removed, and FIG. 9d is a plan view schematically illustrating FIG. 9c as seen from above.

[0126] At least a portion of the flexible printed circuit board (400) disclosed in FIGS. 9a to 9d and the second connection portion (410-1) may include a second pad (510-1), a second shell (520-1), a second connection terminal (530-1), a second insulator (540-1), and a second via hole (550-1) formed in a portion of the flexible printed circuit board (400).

[0127] Referring to FIGS. 9a through 9d, the second connecting portion (410-1) may be formed in a rectangular shape. According to one embodiment, the second connecting portion (410-1) may be formed in a rectangular shape. The second connecting portion (410-1) may be formed at one end of the flexible printed circuit board (400). According to one embodiment, the longitudinal direction of the rectangular second connecting portion (410-1) may be arranged parallel to the width direction of the flexible printed circuit board (400).

[0128] Referring to FIG. 9a and FIG. 9b, according to various embodiments, a flexible printed circuit board (400) may include a first substrate (401), a second substrate (402), and a third substrate (403). A second via hole (550-1) may be formed penetrating at least one of the first to third substrates (401, 402, 403).

[0129] According to various embodiments, a plurality of second pads (510-1) may be disposed on one side of the first substrate (401). According to one embodiment, the second pads (510-1) may be disposed on the upper side of the first substrate (401). The thickness of the second pads (510-1) may be about 10 μm to about 20 μm. A second shell (520-1) may be disposed on one side of the second pads (510-1).

[0130] According to various embodiments, the second shell (520-1) may be disposed on one side of the second pad (510-1). According to one embodiment, the second pad (510-1) may be disposed between the second shell (520-1) and the first substrate (401). The second shell (520-1) may be formed in a ring shape. According to one embodiment, the second shell (520-1) may be formed in a square ring shape. A second connection terminal (530-1) and a second insulator (540-1) may be disposed in the inner space of the second shell (520-1).

[0131] According to various embodiments, a plurality of second connection terminals (530-1) may be disposed in the inner space of the second shell (520-1). The plurality of second connection terminals (530-1) may be connected to each other or may be disposed spaced apart from each other. The second connection terminals (530-1) may be disposed to be connected to a second via hole (550-1) formed in the flexible printed circuit board (400).

[0132] According to various embodiments, the second insulator (540-1) may be disposed in the inner space of the second shell (520-1). The second insulator (540-1) may be disposed to prevent a plurality of second connection terminals (530-1) from coming into contact with each other. The second insulator (540-1) may be disposed to prevent the second connection terminals (530-1) from coming into contact with the second shell (520-1). As the second insulator (540-1) is disposed in the inner space of the second shell (520-1), at least a portion of the second connection terminals (530-1) may be disposed inside the second insulator (540-1).

[0133] According to various embodiments, the second via hole (550-1) may be formed in the flexible printed circuit board (400) to be connected to the second connection terminal (530-1). The second via hole (550-1) may be formed in at least one of the first to third substrates (401, 402, 403). According to one embodiment, the second via hole (550-1) may be formed in the first substrate (401) and the second substrate (402). The second via hole (550-1) may be formed outside the area where the second shell (520-1) is placed, or inside the area where the second shell (520-1) is placed.

[0134] Referring to FIG. 9c, according to various embodiments, the second pad (510-1) may include at least one second outer pad (511-1) and at least one second inner pad (512-1). According to one embodiment, the second outer pad (511-1) may be disposed between the second shell (520-1) and the first substrate (401), and the second inner pad (512-1) may be disposed inside the area formed by the second shell (520-1). According to one embodiment, the second inner pad (512-1) may be disposed inside the area formed by the second outer pad (511-1).

[0135] According to various embodiments, a plurality of second outer pads (511-1) may be disposed between the second shell (520-1) and the first substrate (401). A plurality of second outer pads (511-1) may be disposed spaced apart from each other. A plurality of second outer pads (511-1) may be spaced apart from each other by a distance of about 1000 μm. According to one embodiment, a plurality of second outer pads (511-1) may be spaced apart by a distance of about 300 μm to about 400 μm. A second via hole (550-1) may be formed between a plurality of second outer pads (511-1).

[0136] According to various embodiments, a plurality of second inner pads (512-1) may be disposed within the area formed by the second outer pad (511-1). A plurality of second inner pads (512-1) may be disposed spaced apart from each other. A plurality of second inner pads (512-1) may be spaced apart from each other by a distance of about 1000 μm. According to one embodiment, a plurality of second inner pads (512-1) may be spaced apart by a distance of about 300 μm to about 400 μm. A second via hole (550-1) may be formed between a plurality of second inner pads (512-1).

[0137] Referring to FIG. 9d, according to various embodiments, the second via hole (550-1) may include a second ground via (551-1), a second pad ground via (552-1), a second signal via (553-1), a second power via (554-1), and a second control via (555-1).

[0138] According to various embodiments, the second ground via (551-1) is a second via hole (550-1) connected to ground and can be formed on a flexible printed circuit board (400). As the second ground via (551-1) is formed on the flexible printed circuit board (400) and connected to ground, signal loss can be prevented and noise generation can be suppressed.

[0139] According to various embodiments, the second pad ground via (552-1) is a second via hole (550-1) connected to ground and can be formed on a flexible printed circuit board (400). The second pad ground via (552-1) can be disposed between a plurality of second outer pads (511-1) and / or a plurality of second inner pads (512-1). Thus, as the second pad (510-1) is composed of a plurality of second outer pads (511-1) and a plurality of second inner pads (512-1), the second pad ground via (552-1) can be disposed between the second pads (510-1). As the second pad ground via (552-1) is placed between the second pads (510-1), the flexible printed circuit board (400) has an increased number of points connected to ground, which can prevent signal loss and suppress noise generation. Additionally, as the second pad ground via (552-1) is placed between the second pads (510-1), the size of the area where the second shell (520-1) is placed can be reduced by the second reduction area (560-1). Accordingly, the size of the flexible printed circuit board (400) can be reduced.

[0140] According to various embodiments, the second signal via (553-1) is a second via hole (550-1) connected to a signal wire (not shown) disposed on the flexible printed circuit board (400) and may be formed on the flexible printed circuit board (400). According to one embodiment, the second signal via (553-1) may be disposed on the inner side of the second outer pad (511-1). The flexible printed circuit board (400) may be able to communicate through the second signal via (553-1) connected to the signal wire.

[0141] According to various embodiments, the second power via (554-1) is a first via hole (550) connected to a power source and can be formed on a flexible printed circuit board (400). According to one embodiment, the second power via (554-1) can be placed on the inside and / or outside of the second outer pad (511-1). The flexible printed circuit board (400) can transmit power through the second power via (554-1) connected to a power source.

[0142] According to various embodiments, the second control via (555-1) is a second via hole (550-1) connected to wiring that transmits and receives control signals, and may be formed on a flexible printed circuit board (400). According to one embodiment, the second control via (555-1) may be placed on the inside and / or outside of the second outer pad (511-1). The flexible printed circuit board (400) may transmit and receive control signals through the second control via (555-1) connected to wiring that transmits and receives control signals.

[0144] FIG. 10 is a graph of signal reduction in an electronic device with a flexible printed circuit board applied and signal reduction in an electronic device without a flexible printed circuit board applied, according to various embodiments of the present disclosure.

[0145] Referring to FIG. 10, four graphs are shown in FIG. 10. The first graph (N1) is shown as a thick solid line, the second graph (O1) is shown as a thin solid line, the third graph (N2) is shown as a thick dotted line, and the fourth graph (O2) can be shown as a thin dotted line.

[0146] Referring to Fig. 10, the X-axis represents frequency (GHz), and the Y-axis represents the degree of signal loss (dB).

[0147] According to various embodiments, the first graph (N1) and the third graph (N2) can illustrate the degree of signal loss in an electronic device (101) to which a flexible printed circuit board (400) according to various embodiments is applied.

[0148] According to various embodiments, the second graph (O1) and the fourth graph (O2) can illustrate the degree of signal loss in an electronic device (101) to which a flexible printed circuit board (400) according to various embodiments is not applied.

[0149] According to various embodiments, the first graph (N1), the second graph (O1), the third graph (N2), and the fourth graph (O2) may have a signal loss level (dB) that increases as the frequency (GHz) increases.

[0150] According to one embodiment, at a frequency of about 8 GHz, the first graph (N1), the second graph (O1), the third graph (N2), and the fourth graph (O2) may show a value of about -1.2 dB.

[0151] According to one embodiment, at a frequency of about 12 GHz, the first graph (N1), the second graph (O1), the third graph (N2), and the fourth graph (O2) may show values ​​of about -1.3 dB to about -1.4 dB.

[0152] According to one embodiment, at a frequency of about 14 GHz, the first graph (N1), the second graph (O1), and the third graph (N2) may show a value of about -2.3 dB, and the fourth graph (O2) may show a value of about -2.0 dB.

[0153] According to one embodiment, at a frequency of about 15.7 GHz, the first graph (N1), the second graph (O1), and the third graph (N2) may show values ​​between about -1.9 dB and about -2.3 dB, and the fourth graph (O2) may show a value of about -4.0 dB.

[0154] According to one embodiment, at a frequency of about 17.5 GHz, the first graph (N1), the third graph (N2), and the fourth graph (O2) may show values ​​between about -1.8 dB and about -2.0 dB, and the second graph (O1) may show a value of about -5.7 dB.

[0155] According to one embodiment, at a frequency of about 18 GHz, the first graph (N1), the second graph (O1), and the third graph (N2) may show values ​​of about -2 dB to -2.5 dB, and the fourth graph (O2) may show a value of about -3.5 dB.

[0156] According to one embodiment, at a frequency of about 19 GHz, the first graph (N1), the second graph (O1), and the fourth graph (O2) may show values ​​of about -2.0 dB to -2.3 dB, and the third graph (N2) may show a value of about -4.0 dB.

[0157] According to one embodiment, in the frequency range exceeding 0 GHz, the first graph (N1) and the third graph (N2) may not exceed a maximum signal loss magnitude of about -4 dB. In contrast, the second graph (O1) and the fourth graph (O2) may exceed a signal loss magnitude of -4 dB.

[0158] In this way, the degree of signal loss of an electronic device (101) to which a flexible printed circuit board (400) according to various embodiments is applied can be reduced.

[0160] An electronic device according to various embodiments of the present disclosure (e.g., the electronic device (101) of FIG. 4) comprises a printed circuit board (e.g., the printed circuit board (340) of FIG. 4) and a flexible printed circuit board (e.g., the flexible printed circuit board (400) of FIG. 5) connected to the printed circuit board, wherein at least three substrates are stacked and configured to include a first substrate (e.g., the first substrate (401) of FIG. 7), a second substrate (e.g., the second substrate (402) of FIG. 7), and a third substrate (e.g., the third substrate (403) of FIG. 7), a pad portion (e.g., the pad portion (510) of FIG. 7) comprising a plurality of outer pads (e.g., the outer pad (511) of FIG. 7) and a plurality of inner pads (e.g., the inner pad (512) of FIG. 7), and at least one via hole formed adjacently to the pad portion (e.g., FIG. 8 A flexible printed circuit board including a via hole (550) and a shell (e.g., shell (520) of FIG. 7) disposed on the pad portion, and at least one connection terminal (e.g., connection terminal (530) of FIG. 7) disposed inside the pad portion within the shell, and at least one via hole may include a pad portion ground via (e.g., pad portion ground via (552) of FIG. 8d) disposed between the outer pads or between the inner pads.

[0161] According to various embodiments, the pad portion ground via may be formed under the shell.

[0162] According to various embodiments, the inner pad may be placed inside the area where the outer pad is placed.

[0163] According to various embodiments, the via hole may include a power via formed on the flexible printed circuit board (e.g., power via (554) of FIG. 8d).

[0164] According to various embodiments, the via hole may include a signal via formed on the flexible printed circuit board (e.g., the signal via (553) of FIG. 8d).

[0165] According to various embodiments, the via hole may include a control via formed on the flexible printed circuit board (e.g., the control via (555) of FIG. 8d).

[0166] According to various embodiments, the via hole may be formed to penetrate at least one of the first substrate, the second substrate, and the third substrate.

[0167] According to various embodiments, the spacing between the inner pads and the spacing between the outer pads may be 300 to 400 μm.

[0168] According to various embodiments, the thickness of the pad portion may be 10 to 20 μm.

[0169] According to various embodiments, an insulator (e.g., the insulator (540) of FIG. 7) is disposed inside the shell, and the insulator may be disposed between the shell and the connection terminal or between the connection terminals.

[0170] A flexible printed circuit board according to various embodiments of the present disclosure (e.g., the flexible printed circuit board (400) of FIG. 5) comprises a pad portion (e.g., the pad portion (510) of FIG. 7) including a first substrate (e.g., the first substrate (401) of FIG. 7), a second substrate (e.g., the second substrate (402) of FIG. 7), a third substrate (e.g., the third substrate (403) of FIG. 7), a plurality of outer pads (e.g., the outer pad (511) of FIG. 7), and a plurality of inner pads (e.g., the inner pad (512) of FIG. 7), at least one via hole (e.g., the via hole (550) of FIG. 8) formed adjacent to the pad portion, and a shell (e.g., the shell (520) of FIG. 7) disposed on the pad portion, and comprises at least one connection terminal (e.g., the connection terminal (530) of FIG. 7) disposed inside the shell, wherein the via hole It includes a pad portion ground via (e.g., pad portion ground via (552) of FIG. 8d) disposed between the outer pads or between the inner pads, wherein the outer pads are spaced apart from each other and the inner pads are spaced apart from each other, and the outer pads and the inner pads can be disposed on the first substrate.

[0171] According to various embodiments, the pad portion ground via may be formed under the shell.

[0172] According to various embodiments, the inner pad may be placed inside the area where the outer pad is placed.

[0173] According to various embodiments, the via hole may include a power via formed on the flexible printed circuit board (e.g., power via (554) of FIG. 8d).

[0174] According to various embodiments, the via hole may include a signal via formed on the flexible printed circuit board (e.g., the signal via (553) of FIG. 8d).

[0175] According to various embodiments, the via hole may include a control via formed on the flexible printed circuit board (e.g., the control via (555) of FIG. 8d).

[0176] According to various embodiments, the via hole may be formed to penetrate at least one of the first substrate, the second substrate, and the third substrate.

[0177] According to various embodiments, the spacing between the inner pads and the spacing between the outer pads may be 300 to 400 μm.

[0178] According to various embodiments, the thickness of the pad portion may be 10 to 20 μm.

[0179] According to various embodiments, an insulator (e.g., the insulator (540) of FIG. 7) is disposed inside the shell, and the insulator may be disposed between the shell and the connection terminal or between the connection terminals.

[0181] Although specific embodiments have been described in the detailed description of this document, it will be obvious to those skilled in the art that various modifications are possible within the scope of the invention. Explanation of the symbols

[0183] 101: Electronic devices 340: Main printed circuit board 400: Flexible printed circuit board 401: First substrate 402: Second substrate 403: Third board 410: First connection 410-1: Second connection 510: 1st pad section 511: 1st Outer Pad 512: 1st inner pad 520: 1st Shell 530: First connection terminal 540: First insulator 550: 1st Via Hole 551: 1st Ground Via 552: 1st pad section ground via 553: 1st signal via 554: 1st power via 555: 1st control via 560: 1st reduction area 611: 1st socket section 612: Socket shell 613: Socket connection terminal 614: Socket insulator

Claims

Claim 1 In an electronic device, the printed circuit board; a flexible printed circuit board connected to the printed circuit board, the flexible printed circuit board comprising at least three substrates including a first substrate, a second substrate, and a third substrate, stacked to form a pad portion including a plurality of outer pads and a plurality of inner pads, and a plurality of via holes formed in the pad portion; a shell disposed on the pad portion and electrically connected to the plurality of outer pads and the plurality of inner pads and configured to shield electromagnetic waves; and at least one connection terminal disposed inside the shell, wherein the plurality of outer pads are arranged in a ring shape along the edge of the shell from below the edge of the shell, and the plurality of via holes include: a pad portion ground via disposed between the plurality of outer pads or between the plurality of inner pads and electrically connected to the shell; An electronic device comprising a signal via electrically connected to at least one connection terminal and located in an inner region of the pad portion surrounded by the plurality of outer pads and the pad portion ground via. Claim 2 delete Claim 3 An electronic device according to claim 1, wherein the plurality of inner pads are disposed in the inner region of the pad portion surrounded by the plurality of outer pads and the pad portion ground via. Claim 4 An electronic device according to claim 1, wherein the plurality of via holes include power vias formed on the flexible printed circuit board. Claim 5 delete Claim 6 An electronic device according to claim 1, wherein the plurality of via holes include control vias formed on the flexible printed circuit board. Claim 7 An electronic device according to claim 1, wherein at least one of the plurality of via holes is formed to penetrate at least one of the first substrate, the second substrate, and the third substrate. Claim 8 An electronic device according to claim 1, wherein the spacing between the inner pads and the spacing between the outer pads is 300 to 400 μm. Claim 9 An electronic device according to claim 1, wherein the thickness of the pad portion is 10 to 20 μm. Claim 10 An electronic device according to claim 1, wherein an insulator is disposed inside the shell, and the insulator is disposed between the shell and the connection terminal or between the connection terminals. Claim 11 delete Claim 12 delete Claim 13 delete Claim 14 delete Claim 15 delete Claim 16 delete Claim 17 delete Claim 18 delete Claim 19 delete Claim 20 delete

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