Glass substrate contact and non-contact hybrid cutting device

Abstract

A first groove forming unit that forms a first groove in the shape of a trench with a flat bottom surface from a first depth from the upper surface of a glass substrate; a first laser beam generating unit disposed above the upper surface and applying a first laser beam to the first groove in a non-contact manner to locally heat the glass substrate corresponding to the first groove to the phase transition temperature (Tg) of the glass substrate; a second groove forming unit that presses the bottom surface of the first groove of the glass substrate heated to the phase transition temperature to form a second groove having a V-shape that narrows toward the bottom and a second depth deeper than the first depth on the flat bottom surface; and a cooling gas supply unit disposed above the upper surface of the glass substrate and spraying a cooling gas having a temperature lower than the phase transition temperature in a line shape toward the second groove to form a cut portion at the bottom of the second groove due to thermal shock. The apparatus includes: a second laser beam generating unit disposed on the upper surface of the upper surface of the glass substrate and focusing a second laser beam on the cutting portion of the lower surface facing the upper surface of the glass substrate to heat the lower surface of the glass substrate corresponding to the cutting portion to the phase transition temperature of the glass substrate; and a third groove forming unit disposed facing the lower surface of the glass substrate corresponding to the cutting portion, contacting the cutting portion of the lower surface heated to the phase transition temperature of the glass substrate to form a V-shaped third groove along the cutting portion that communicates with the second groove, thereby connecting the second and third grooves to each other to completely cut the glass substrate.

Description

Technology Field

[0001] The present invention relates to a glass substrate contact and non-contact hybrid cutting device. Background Technology

[0002] Generally, to cut plate glass, a widely used method involves forming a crack on the surface of the glass using a diamond cutter and then cutting it by propagating the crack downward through thermal or physical impact.

[0003] Since the early 2000s, non-contact glass substrate cutting technology using a laser beam has been developed to cut glass for LCD panels.

[0004] Representatively, the published patent No. 2003-0065926, Method and apparatus for cutting a non-metallic substrate (August 9, 2003), discloses a technology that allows for the formation of an initial crack in a non-metallic substrate, propagation of the initial crack to form a cutting surface in the non-metallic substrate, and continuous formation of a crack intersecting the cutting surface without interruption of the cutting process. Through this technology, effects such as suppression of chipping, minimization of cutting defects, increased process speed, and minimization of the frequency of process defects can be obtained.

[0005] In addition, the technology disclosed in the non-metal substrate cutting device of the published patent No. 2003-0065926 includes a first laser beam supply device that forms an initial crack by supplying a first laser beam having a first energy along a planned cutting line for a specified length from a cutting start point where the edge of the non-metal substrate and the planned cutting line meet; a scribe crack forming device that forms a scribe crack on the planned cutting line by continuously supplying a second laser beam having a second energy having a size smaller than the first energy from the initial crack to the end of the planned cutting line and cooling with a cooling fluid; and a third laser beam supply device that forms a cutting surface along the planned cutting line by supplying a third laser beam having a third energy to the scribe crack.

[0006] However, the non-metallic substrate cutting device of published patent No. 2003-0065926 discloses a technology for cutting a non-metallic substrate in a non-contact manner using first to third laser beams, but has a problem in that the non-metallic substrate may be cut abnormally as cracks occur in a direction different from scribe cracks during the process of heating-cooling-heating the non-metallic substrate using first to third laser beams.

[0007] Recently, technology for producing semiconductor chips on glass substrates instead of wafers has been actively pursued; however, since yield drops significantly if the glass substrate is cut abnormally, technology for cutting the glass substrate with extreme precision is required. Prior art literature

[0008] Published Patent 특2003-0065926, Method and apparatus for cutting a non-metallic substrate (Publication Date: August 9, 2003) Registered Utility Model 20-0415435, Glass plate cutting apparatus for an upright LCD substrate (Registration Date: April 26, 2006) Published Patent 10-2015-0118312, Laser cutting and processing apparatus and method thereof (Publication Date: October 22, 2015) Registered Patent 10-1647991, Vertical multi-beam laser processing apparatus (Registration Date: August 8, 2016) Registered Patent 10-1924156, Method and cutting apparatus for cutting brittle materials (Registration Date: November 26, 2018) Published Patent 10-2022-0103068, Laser cutting Device (Disclosure Date: July 21, 2022) The problem to be solved

[0009] The present invention provides a glass substrate contact and non-contact hybrid cutting device capable of cutting a glass substrate using a combination of contact and non-contact methods by forming a groove in a line shape on a glass substrate using a contact method, processing the shape of the groove using a contact method, applying thermal shock to the processed groove using a non-contact method to form a cut portion along the groove, and processing the rear surface of the cut portion using a contact method. means of solving the problem

[0010] As an embodiment, a glass substrate contact and non-contact hybrid cutting device comprises: a first groove forming unit that forms a first groove in the shape of a trench with a flat bottom surface from a first depth from the upper surface of a glass substrate; a first laser beam generating unit disposed above the upper surface and applying a first laser beam to the first groove in a non-contact manner to locally heat the glass substrate corresponding to the first groove to the phase transition temperature (Tg) of the glass substrate; a second groove forming unit that presses the bottom surface of the first groove of the glass substrate heated to the phase transition temperature to form a second groove having a V-shape that narrows toward the bottom and a second depth deeper than the first depth by pressing the flat bottom surface; and a cooling gas supply unit disposed above the upper surface of the glass substrate and spraying a cooling gas having a temperature lower than the phase transition temperature in a line shape toward the second groove to form a cutting portion by thermal shock at the bottom of the second groove. The apparatus includes: a second laser beam generating unit disposed on the upper surface of the upper surface of the glass substrate and focusing a second laser beam on the cutting portion of the lower surface facing the upper surface of the glass substrate to heat the lower surface of the glass substrate corresponding to the cutting portion to the phase transition temperature of the glass substrate; and a third groove forming unit disposed facing the lower surface of the glass substrate corresponding to the cutting portion, contacting the cutting portion of the lower surface heated to the phase transition temperature of the glass substrate to form a V-shaped third groove along the cutting portion that communicates with the second groove, thereby connecting the second and third grooves to each other to completely cut the glass substrate.

[0011] The first groove forming unit of the glass substrate contact and non-contact hybrid cutting device includes a rotary saw blade that contacts the upper surface to form the first groove, a motor that rotates the rotary saw blade, a lifting and lowering unit that raises and lowers the rotary saw blade to adjust the depth of the first groove, and a suction unit that sucks in chips generated during the formation of the first groove by the rotary saw blade using vacuum pressure.

[0012] The second groove forming unit of the glass substrate contact and non-contact hybrid cutting device comprises a disc portion and a V-shaped protrusion formed on the outer circumference of the disc portion and inserted into the first groove to continuously form the second groove, wherein the inclined surfaces on both sides of the protrusion are formed as concave curved surfaces to prevent cracking at the portion where the upper surface of the glass substrate meets the second groove, and includes a heating unit that heats the disc portion to a temperature corresponding to the phase transition temperature to prevent the temperature of the disc portion from falling below the phase transition temperature of the glass substrate.

[0013] The cooling gas supply unit of the glass substrate contact and non-contact hybrid cutting device comprises a first body having a V-shaped cross-section to be inserted into the second groove and a slit-shaped discharge portion formed at the tip for discharging the cooling gas into the second groove, a second body coupled to one side of the first body and having a first intake port for sucking in the cooling gas sprayed from the first body, and a third body coupled to the other side of the first body and having a second intake port for sucking in the cooling gas sprayed from the first body; wherein the cooling gas supply unit and the second groove forming unit are arranged in a line along the first groove, and a partition member is disposed between the cooling gas supply unit and the second groove forming unit to prevent the cooling gas discharged from the first body from being supplied to the second groove forming unit and cooling the second groove forming unit, and the partition member is a partition that blocks the space between the cooling gas supply unit and the second groove forming unit. It includes a body and a partition portion that protrudes in a V-shape resembling the shape of the second groove from the bottom of the partition body and is inserted into the interior of the second groove.

[0014] The glass substrate contact and non-contact hybrid cutting device further includes a glass substrate rotation unit coupled to the lower surface of the glass substrate to rotate the glass substrate at a specified angle to form the first groove in a cover shape. Effects of the invention

[0015] The glass substrate contact and non-contact hybrid cutting device according to the present invention forms a groove in a line shape on a glass substrate using a contact method, processes the shape of the groove using a contact method, applies thermal shock to the processed groove using a non-contact method to form a cutting section along the groove, and processes the rear surface of the cutting section using a contact method, thereby cutting the glass substrate by combining contact and non-contact methods, which has the effect of preventing cracks from propagating in unexpected directions during the cutting of the glass substrate and causing cutting defects. Brief explanation of the drawing

[0016] FIG. 1 is a block diagram illustrating a glass substrate contact and non-contact hybrid cutting device according to an embodiment of the present invention. Figure 2 is a cross-sectional view of the glass substrate contact and non-contact hybrid cutting device shown in Figure 1. Figure 3 is a cross-sectional view of a glass substrate processed in parts A, B, C, and D as shown in Figure 2. FIG. 4 is a cross-sectional view of the first groove forming unit of FIG. 2. FIG. 5 is a cross-sectional view of the second groove forming unit shown in FIG. 2. Figure 6 is a cross-sectional view of the cooling gas supply unit shown in Figure 2. Figure 7 is an enlarged view of section 'A' of Figure 6. Specific details for implementing the invention

[0017] The present invention described below is capable of various modifications and may have various embodiments. Specific embodiments are illustrated in the drawings and described in detail in the detailed description.

[0018] However, this is not intended to limit the invention to specific embodiments, and it should be understood that it includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the invention. In describing the invention, detailed descriptions of related prior art are omitted if it is determined that such detailed descriptions may obscure the essence of the invention.

[0019] The terms used in this patent are used merely to describe specific embodiments and are not intended to limit the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this patent, terms such as "comprising" or "having" are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0020] Additionally, terms such as "first," "second," etc., may be used to distinguish and describe various components, but said components shall not be limited by said terms. These terms are used solely for the purpose of distinguishing one component from another.

[0021] In addition, if at least two different embodiments are described in this patent, each embodiment may use all or part of its components in combination and mixed with one another without further description, as long as it does not deviate from the technical concept of the present invention.

[0022] FIG. 1 is a block diagram illustrating a glass substrate contact and non-contact hybrid cutting device according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of the glass substrate contact and non-contact hybrid cutting device illustrated in FIG. 1. FIG. 3 is a cross-sectional view of a glass substrate processed at parts A, B, C, and D illustrated in FIG. 2.

[0023] Referring to FIGS. 1 to 3, a glass substrate contact and non-contact hybrid cutting device (900) includes a first groove forming unit (100), a first laser beam generating unit (200), a second groove forming unit (300), a cooling gas supply unit (400), a second laser beam generating unit (500), a third groove forming unit (600), and a control unit (700). Reference numeral 1 in FIG. 1 includes a glass substrate or a non-metallic substrate having brittleness that is to be cut.

[0024] Referring to FIG. 2, the first groove forming unit (100), the first laser beam generating unit (200), the second groove forming unit (300), the cooling gas supply unit (400), the second laser beam generating unit (500), the third groove forming unit (600), and the control unit (700) are coupled to the base body (10) and fixed at a designated position. In one embodiment of the present invention, the base body (10) may be moved in a designated direction and at a designated speed by, for example, a driving unit (not shown).

[0025] FIG. 4 is a cross-sectional view of the first groove forming unit of FIG. 2.

[0026] Referring to FIGS. 2 to 4, the first groove forming unit (100) forms a first groove (2) from the upper surface of the glass substrate (1) to a first depth (D1). The first groove (2) has a trench shape with a first depth (D1) and a flat bottom surface, as shown in FIG. 3 (a).

[0027] In one embodiment of the present invention, by forming the first groove (2) in a trench shape with a flat bottom surface, it is possible to prevent unintended cracks from occurring in the first groove (2) due to stress concentration. Although the bottom surface of the first groove (2) is shown and described as a trench shape with a flat bottom surface in one embodiment of the present invention, the bottom surface of the first groove (2) may be formed in a concave curved shape.

[0028] In order to form a first groove (2) in a line shape on the upper surface of a glass substrate (1), the first groove forming unit (100) includes a rotary saw blade (110), a motor (120), a lifting / lowering unit (130), and a suction unit (140).

[0029] In order to form a first groove (2) with a flat bottom surface, the rotary saw blade (110) has a flat cutting edge (115) formed on the outer surface of the rotary saw blade (110) in the shape of a spur gear. Alternatively, the cutting edge (115) formed on the outer surface of the rotary saw blade (110) can be formed in a curved shape suitable for processing the bottom surface of the first groove (2) into a concave curved shape.

[0030] The motor (120) is coupled to the rotational center of the rotating saw blade (110), and the motor (120) rotates the rotating saw blade (110) at high speed to form a first groove (2) on the upper surface of the glass substrate (1).

[0031] A rod (125) having a rod shape is attached to the rear of the motor (120).

[0032] The lifting / lowering unit (130) is coupled to a rod (125) to which a motor (120) is coupled, and the lifting / lowering unit (130) raises or lowers the rod (125) to adjust the depth of the first groove (2) by the rotating saw blade (110).

[0033] Meanwhile, during the process in which the rotary saw blade (110) cuts the upper surface of the glass substrate (1), a large amount of glass chips may be generated on the upper surface of the glass substrate (1), and the glass chips are removed by the suction unit (140).

[0034] In one embodiment of the present invention, the suction unit (140) is mounted on the lifting / lowering unit (130) so that it is raised or lowered with the same displacement as the lifting / lowering unit (130).

[0035] The suction unit (140) removes glass chips generated from the rotating saw blade (110) by suctioning them using a vacuum pressure lower than atmospheric pressure. The opening (145) of the suction unit (140) that sucks in the glass chips is formed with a concave curved shape corresponding to the outer surface of the suction unit (140) which has a disc shape, and the lower part of the suction unit (140) is processed into a shape suitable for insertion into the first groove (2), thereby preventing glass chips from remaining inside the first groove (2).

[0036] In order to more efficiently remove glass chips remaining inside the first groove (2), a brush (not shown) for scraping and removing chips remaining inside the first groove (2) may be additionally attached to the lower surface of the suction unit (140) facing the first groove (2).

[0037] Alternatively, to more efficiently remove glass chips remaining inside the first groove (2), an additional opening (not shown) is formed on the lower surface of the suction unit (140) facing the first groove (2) so that glass chips remaining inside the first groove (2) can be removed through the additional opening.

[0038] Referring again to FIGS. 1 and FIGS. 2, a first laser beam generating unit (200) is positioned on the upper surface of a glass substrate (1) and applies a first laser beam (210) to the glass substrate (1).

[0039] The first laser beam generating unit (200) can be positioned at the rear end of the first groove forming unit (100) relative to the first groove forming unit (100).

[0040] The first laser beam (210) generated from the first laser beam generating unit (200) may include a YAG laser or a CO2 laser, and the first laser beam (210) is focused on the upper surface of the glass substrate (1) to concentrate energy on the upper surface of the glass substrate (1).

[0041] In one embodiment of the present invention, the width of the first laser beam (210) may be formed to be wider than, for example, the width of the first groove (2). By forming the width of the first laser beam (210) to be wider than the width of the first groove (2), the inside of the first groove (2) as well as the surroundings of the first groove (2) can be rapidly heated by the first laser beam (210).

[0042] In this way, by rapidly heating the interior of the first groove (2) as well as the surroundings of the first groove (2) using the first laser beam (210), the second groove forming unit (300) to be described later can more easily process the shape of the first groove (2).

[0043] The first laser beam (210) heats the interior of the first groove (2) and the periphery of the first groove (2) to the phase transition temperature (Tg) of the glass substrate (1).

[0044] The interior of the first groove (2) and the periphery of the first groove (2), heated to a phase transition temperature by the first laser beam (210), become fluid, and the interior of the first groove (2) and the periphery of the first groove (2) are processed into a shape specified by the second groove forming unit (300) to be described later.

[0045] FIG. 5 is a cross-sectional view of the second groove forming unit shown in FIG. 2.

[0046] Referring to FIGS. 2 and FIGS. 5, the second groove forming unit (300) is positioned at the rear end of the first laser beam generating unit (200).

[0047] The second groove forming unit (300) physically contacts the flat bottom surface of the first groove (2) of the glass substrate (1), which is heated to a phase transition temperature (Tg) by the first laser beam generating unit (200), and presses the bottom surface to form a V-shaped second groove (3) in the glass substrate (1) that has a second depth (D2) deeper than the first depth (D1) and becomes narrower towards the bottom.

[0048] The second groove forming unit (300) includes a disc portion (310) and a protrusion portion (320). In addition, the second groove forming unit (300) may further include a heating unit (not shown).

[0049] The disc portion (310) is formed in the shape of a disc, and a through hole is formed at the rotation center of the disc portion (310).

[0050] The protrusion (320) is formed or arranged in a ring shape along the outer surface of the disc (310), and the protrusion (320) has a cross-sectional shape suitable for continuously forming a V-shaped second groove (3).

[0051] For example, the protrusion (320) may have a wedge-shaped cross-section in which the cross-sectional area decreases as it goes upward from the outer surface of the disc (310), and as a result, the protrusion (320) has two inclined surfaces (321, 322).

[0052] The two inclined surfaces (321, 322) of the protrusion (320) may be formed as flat surfaces, but the inclined surfaces (321, 322) forming the protrusion (320) may be formed as concave curved surfaces.

[0053] When the inclined surfaces (321, 322) forming the protrusion (320) are formed as concave curved surfaces, the two opposing sides (3a, 3b) of the second groove (3) processed by the inclined surfaces (321, 322) are formed as convex curved surfaces, as shown in Fig. 3 (b).

[0054] When the two opposing sides (3a, 3b) of the second groove (3) are formed as convex curved surfaces, the structure is such that stress is concentrated only in the deepest part of the second groove (3) which has a V-shape, and cracks can be prevented in the curved portion where the second groove (3) and the upper surface of the glass substrate (1) meet.

[0055] Meanwhile, the glass substrate (1), which is heated to a phase transition temperature by the first laser beam (210) of the first laser beam generating device (200), may have its temperature lower than the phase transition temperature as time passes. In order to prevent the glass substrate (1) from hardening by having its temperature drop below the phase transition temperature before the second groove (3) is formed on the glass substrate (1) by the second groove forming unit (300), a heating unit (not shown) is built into the disc portion (310).

[0056] A heating unit (not shown) embedded in the disc portion (310) may include an electric heater that generates heat by consuming electric energy. For example, the heating unit (not shown) may include an electric heater having a coil shape, and the heating unit (not shown) may be formed along the edge of the disc portion (310).

[0057] Although in one embodiment of the present invention, a heating unit (not shown) is shown and described as being embedded in the disc portion (310), alternatively, the heating unit (not shown) may be embedded in the protrusion (320).

[0058] A through hole is formed in the central part of the disc portion (310), and an axis (330) passes through the through hole, and the axis (330) is supported by a guide rod (340). The upper end of the guide rod (340) can be coupled to, for example, a base body (10).

[0059] After the shape of the first groove (2) having a flat bottom formed on the glass substrate (1) is transformed into a second groove (3) having a V-shaped cross-section, a thermal shock is applied to the second groove (3) so that a cut portion (4) is formed along the second groove (3) in the longitudinal direction of the glass substrate (1) as shown in (c) of FIG. 3.

[0060] In order to form the cut section (4), a cooling gas supply unit (400) is required to provide thermal shock to the second groove (3).

[0061] FIG. 6 is a cross-sectional view of the cooling gas supply unit shown in FIG. 2. FIG. 7 is an enlarged view of section 'A' of FIG. 6.

[0062] Referring again to FIGS. 2, 6, and 7, the cooling gas supply unit (400) is positioned on the upper surface of the glass substrate (1). The cooling gas supply unit (400) is positioned at the rear end of the second groove forming unit (300).

[0063] The cooling gas supply unit (400) is positioned at the rear end of the second groove forming unit (300), and the cooling gas supply unit (400) is arranged in a line along the second groove (3).

[0064] The cooling gas supply unit (400) sprays cooling gas having a temperature lower than the phase transition temperature of the glass substrate (1) toward the interior of the second groove (3), thereby forming a cutting section (4) that cuts the glass substrate (1) along the second groove (3) by thermal shock as shown in (c) of FIG. 3.

[0065] In one embodiment of the present invention, the gas supplied from the cooling gas supply unit (400) may include a cooling gas that is lower than room temperature, and the cooling gas may include cooled air, cooled nitrogen gas which is a low-reactivity inert gas, cooled argon gas, cooled helium gas, etc.

[0066] Referring again to FIGS. 6 and FIGS. 7, the cooling gas supply unit (400) includes a first body (410), a second body (420), and a third body (430).

[0067] The first body (410) serves to supply or discharge cooling gas into the interior of the second groove (3).

[0068] The tip of the first body (410) is formed with a V-shaped cross-section suitable for at least a portion to be inserted into the second groove (3), and a slit-shaped discharge portion (415) for discharging cooling gas into the second groove (3) is formed at the tip of the first body (410).

[0069] The discharge portion (415) having a slit shape can be formed in a rectangular shape that is narrow in width and long in length relative to its width when viewed in a planar view.

[0070] Alternatively, a plurality of discharge sections (415) having a slit shape may be formed intermittently in a row, and the lengths of the plurality of discharge sections (415) having a slit shape may be formed longer as they get closer to the first laser beam (210). By forming the lengths of the discharge sections (415) differently in this way, different amounts of cooling gas can be supplied to the second groove (3).

[0071] A cooling gas storage container (417) in which cooling gas is stored at high pressure is formed in the first body (410). The cooling gas stored in the cooling gas storage container (417) can be supplied to the first body (410) by means of a pump (not shown), etc.

[0072] The cooling gas discharged from the first body (410) cools the glass substrate (3) corresponding to the second groove (3) and is then discharged outside the second groove (3). However, the concentration of the cooling gas in the area surrounding the glass substrate (1) may increase excessively due to the cooling gas, or the temperature around the second groove (3) may decrease excessively, causing cracks to occur in the glass substrate (1) heated by the first laser beam generating unit (200).

[0073] To prevent this, a second body (420) may be attached to one side of the first body (410). The second body (420) is box-shaped, and a first suction port (425) is formed on the lower surface facing the glass substrate (1) to suck in cooling gas sprayed from the first body (410) to cool the second groove (3). Meanwhile, a first suction pump (437) for sucking in cooling gas is connected to the second body (420).

[0074] Additionally, a third body (430) may be coupled to the other side facing one side of the first body (410). The third body (430) is box-shaped, and a second suction port (435) is formed on its bottom surface to suck in cooling gas that is sprayed from the first body (410) and cools the second groove (3). Meanwhile, a second suction pump (437) for sucking in cooling gas is connected to the third body (430).

[0075] In one embodiment of the present invention, the cooling gas sucked from the second body (420) and the third body (430) can be compressed by a compressor or the like, then supplied to a cooling gas storage container (417) and discharged from the first body (410).

[0076] Meanwhile, since the first body (410) of the cooling gas supply unit (400) is positioned adjacent to the second groove forming unit (300), the cooling gas supplied from the cooling gas supply unit (400) is transferred to the second groove forming unit (300), and the glass substrate (1) is cooled to a temperature below the phase transition temperature before the second groove forming unit (300) sufficiently forms and processes the glass substrate (1), which may cause a defect in the shape processing of the second groove (3).

[0077] In this way, a partition member (450) can be coupled to the base body (10) to prevent the cooling gas supplied from the cooling gas supply unit (400) from moving to the second groove forming unit (300).

[0078] The partition member (450) is formed, for example, in the shape of a plate erected against the ground, and the partition member (450) physically blocks the space between the cooling gas supply unit (400) and the second groove forming unit (300) to suppress or prevent the cooling gas provided from the cooling gas supply unit (400) from moving to the second groove forming unit (300).

[0079] Meanwhile, despite the partition member (450), a small amount of cooling gas may be transferred to the second groove forming unit (300) through the second groove (3) as a passage; to prevent this, a partition part (455) may protrude from the bottom of the partition body (450) toward the second groove (3). The partition part (455) is formed in a V-shape resembling the shape of the second groove (3), and at least a portion of the partition part (455) is inserted into the interior of the second groove.

[0080] In one embodiment of the present invention, the partition portion (455) may be equipped with a partition heating unit (not shown) that maintains the temperature of the partition portion (455) at a constant temperature.

[0081] After a cutting section (4) that cuts the glass substrate (1) in the second groove (3) is formed by the cooling gas supply unit (400), there is a possibility that a number of cracks may occur at the corner formed where the lower surface of the glass substrate (1) and the cutting section (4) meet due to various causes, resulting in glass chips or unwanted cutting of the glass substrate (1) due to the cracks.

[0082] In order to prevent glass chips from forming or unwanted cutting of the glass substrate (1) from occurring due to multiple cracks at the portion where the lower surface of the glass substrate (1) and the cutting portion (4) meet and are formed, a second laser beam generating unit (500) and a third groove forming unit (600) are used in one embodiment of the present invention.

[0083] The second laser beam generating unit (500) may be positioned, for example, on the upper surface of the glass substrate (1). The second laser beam generating unit (500) generates a second laser beam (510) that heats the glass substrate (1) corresponding to the cutting portion (4) in the lower surface opposite to the upper surface of the glass substrate (1) to the phase transition temperature of the glass substrate (1).

[0084] The second laser beam (510) generated by the second laser beam generating unit (500) penetrates, for example, the glass substrate (1) and is focused on the rear surface of the glass substrate (1).

[0085] The rear surface of the glass substrate (1) is heated to the phase transition temperature (Tg) of the glass substrate (1) by the second laser beam generating unit (500), and the glass substrate (1) heated to the phase transition temperature is rounded by the third groove forming unit (600) so that no cutting or cracking occurs.

[0086] The third groove forming unit (600) is positioned facing the glass substrate (1) on the lower surface opposite to the upper surface of the glass substrate (1).

[0087] The third groove forming unit (600) is physically contacted with the cutting portion (4) on the lower surface of the glass substrate (1), which is heated to the phase transition temperature of the glass substrate (1) by the second laser beam (510), and forms a V-shaped third groove (5) that communicates with the second groove (3) along the cutting portion (4) as shown in (d) of FIG. 3. The third groove (5) communicates with the second groove (3), and as a result, the glass substrate (1) is completely cut.

[0088] The third groove (5) formed by the third groove forming unit (600) includes two sides (5a, 5b) similar to the two opposing sides (3a, 3b) of the second groove (3), and the third groove (5) formed by the third groove forming unit (600) is formed with a third depth (D3), and the third depth (D3) can be formed shallower than the depth (D2) of the second groove (3).

[0089] In one embodiment of the present invention, the third groove forming unit (600) may have substantially the same configuration as the second groove forming unit (600) previously shown and described in FIGS. 2 and FIGS. 5.

[0090] As shown in Fig. 3 (d), a second groove (3) is formed on the upper surface of the glass substrate (1), and a third groove (5) is formed on the lower surface of the glass substrate (1) that communicates with the second groove (3). When the glass substrate (1) is completely cut by a combination of contact and non-contact methods, the cut surface is processed into a curved shape, thereby preventing additional cracks and unexpected breakage of the glass substrate (1) from the cut surface.

[0091] As described in detail above, the glass substrate contact and non-contact hybrid cutting device forms a groove in a line shape on the glass substrate using a contact method, processes the shape of the groove using a contact method, applies thermal shock to the processed groove using a non-contact method to form a cutting section along the groove, and processes the rear surface of the cutting section using a contact method. By cutting the glass substrate using a combination of contact and non-contact methods, it has the effect of preventing cutting defects in the glass substrate caused by cracks propagating in unexpected directions during the cutting process.

[0092] Meanwhile, the embodiments disclosed in this drawing are merely specific examples provided to aid understanding and are not intended to limit the scope of the invention. It is obvious to those skilled in the art that other variations based on the technical concept of the invention are possible in addition to the embodiments disclosed herein. Explanation of the symbols

[0093] 100...1st groove forming unit 200...1st laser beam generating unit 300...2nd groove forming unit 400...Cooling gas supply unit 500...2nd laser beam generating unit 600...3rd groove forming unit 700...control unit

Claims

Claim 1 A first groove forming unit that forms a first groove in the shape of a trench with a flat bottom surface from the upper surface of a glass substrate to a first depth; a first laser beam generating unit disposed above the upper surface and applying a first laser beam to the first groove in a non-contact manner to locally heat the glass substrate corresponding to the first groove to the phase transition temperature (Tg) of the glass substrate; a second groove forming unit that presses the bottom surface of the first groove of the glass substrate heated to the phase transition temperature to form a second groove having a V-shape that narrows toward the bottom to a second depth deeper than the first depth by pressing the flat bottom surface; a cooling gas supply unit disposed above the upper surface of the glass substrate and spraying a cooling gas having a temperature lower than the phase transition temperature in a line shape toward the second groove to form a cut portion by thermal shock at the bottom of the second groove; and disposed above the upper surface of the glass substrate, and the glass substrate A second laser beam generating unit that focuses a second laser beam on a cutting portion of a lower surface facing an upper surface to heat the lower surface of the glass substrate corresponding to the cutting portion to the phase transition temperature of the glass substrate; and a third groove forming unit that is positioned facing the lower surface of the glass substrate corresponding to the cutting portion, contacts the cutting portion of the lower surface heated to the phase transition temperature of the glass substrate, and forms a V-shaped third groove that communicates with the second groove along the cutting portion to mutually communicate the second and third grooves to completely cut the glass substrate, wherein the width of the first laser beam generated by the first laser beam generating unit is formed wider than the width of the first groove so that the interior of the first groove and the periphery of the first groove are locally heated by the first laser beam, and the second laser beam generating unit is positioned spaced apart from the first laser beam generating unit and at the rear end of the cooling gas supply unit.Between the first and second laser beam generating units, the second groove forming unit and the cooling gas supply unit are arranged in a line, and the first groove forming unit includes a rotating saw blade that contacts the upper surface to form the first groove, a motor that rotates the rotating saw blade, a lifting unit that raises and lowers the rotating saw blade to adjust the depth of the first groove, and a suction unit that sucks in chips generated during the formation of the first groove by the rotating saw blade using vacuum pressure, and the second groove forming unit includes a rotating disc portion and a V-shaped protrusion formed on the outer surface of the disc portion to be inserted into the first groove of the glass substrate heated to the phase transition temperature by the first laser beam and to move along the first groove to continuously form the second groove, and to prevent the occurrence of cracks at the portion where the upper surface of the glass substrate and the second groove meet, the protrusion Both inclined surfaces are formed as concave curved surfaces, and a heating unit is included to heat the protrusion to a temperature corresponding to the phase transition temperature to prevent the temperature of the protrusion from falling below the phase transition temperature of the glass substrate, wherein the inclined surfaces forming the protrusion are formed as concave curved surfaces, and the two opposing sides of the second groove processed by the inclined surfaces are formed as convex curved surfaces so that stress is concentrated only at the deepest part of the second groove having a V shape, and the width of the protrusion meeting the disc portion is formed wider than the width of the first groove, the heating unit includes an electric heater having a coil shape, and the heating unit is embedded inside the protrusion, and the lower surface of the suction unit of the first groove forming unit facing the upper surface of the glass substrate is processed into a shape that is inserted into the first groove so that glass chips do not remain inside the first groove.A glass substrate contact and non-contact hybrid cutting device, wherein a brush is attached to the lower surface of the suction unit facing the first groove to scrape and remove the glass chips remaining inside the first groove, and an additional opening is formed on the lower surface of the suction unit facing the first groove to remove the glass chips remaining inside the first groove. Claim 2 delete Claim 3 delete Claim 4 In claim 1, the cooling gas supply unit comprises a first body having a V-shaped cross-section to be inserted into the second groove and a slit-shaped discharge portion formed at the tip for discharging the cooling gas into the second groove, a second body coupled to one side of the first body and having a first intake port for sucking in the cooling gas sprayed from the first body, and a third body coupled to the other side of the first body and having a second intake port for sucking in the cooling gas sprayed from the first body, wherein the cooling gas supply unit and the second groove forming unit are arranged in a line along the first groove, and a partition member is disposed between the cooling gas supply unit and the second groove forming unit to prevent the cooling gas discharged from the first body from being supplied to the second groove forming unit and cooling the second groove forming unit, and the partition member comprises a partition body that blocks the space between the cooling gas supply unit and the second groove forming unit and the partition A glass substrate contact and non-contact hybrid cutting device comprising a partition portion that protrudes from the bottom of the body in a V-shape resembling the shape of the second groove and is inserted into the interior of the second groove, wherein a plurality of discharge portions having a slit shape are formed intermittently in a row, and the length of each of the plurality of discharge portions having a slit shape is formed to be longer as it approaches the first laser beam, thereby supplying different amounts of cooling gas to the second groove. Claim 5 delete

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