Non-contact type gripper

Abstract

A non-contact gripper may include a gripping plate, a plurality of pressure holes, a plurality of suction holes, and cavities. The pressure holes are formed in the gripping plate to spray gas onto an object. The suction holes are formed in the gripping plate to suck in the gas. The cavities extend from at least one of the pressure holes to suppress the pressure drop of the gas. In particular, among the suction holes, the gas flowing through the cavities extending from each of the pressure holes located between the corner suction hole located at the corner of the gripping plate and the adjacent suction hole may experience low flow resistance. Therefore, since the pressure drop of the gas sprayed from the pressure holes is suppressed by the cavities, the pressure of the gas can be maintained by the cavities, thereby preventing the corner portion of an object, such as a semiconductor chip, from sagging due to strong suction force.

Description

Technology Field

[0001] The present invention relates to a non-contact gripper. More specifically, the present invention relates to a gripper that grips a semiconductor chip in a non-contact manner. Background Technology

[0002] Among the processes for bonding semiconductor chips to wafers, there is a hybrid bonding process. Since this hybrid bonding process does not use adhesives, it is required to reduce surface contamination of the plasma-treated semiconductor chips. Therefore, the gripper that transfers the semiconductor chip attached to the film to the bonding head can have a non-contact structure that does not come into direct contact with the semiconductor chip. The non-contact gripper can grip the semiconductor chip non-contactually by spraying gas onto the semiconductor chip and sucking in the sprayed gas.

[0003] According to related technologies, as the thickness of a semiconductor chip gradually decreases, the edges of the semiconductor chip may frequently sag due to suction force. The sagging edges of the semiconductor chip may come into contact with a non-contact gripper, and the semiconductor chip may be contaminated due to such contact. The problem to be solved

[0004] The present invention provides a non-contact gripper capable of preventing sagging of the corner portions of an object such as a semiconductor chip. means of solving the problem

[0005] A non-contact gripper according to one aspect of the present invention may include a gripping plate, a plurality of pressure holes, a plurality of suction holes, and a cavity. The pressure holes may be formed in the gripping plate to spray gas onto an object. The suction holes may be formed in the gripping plate to suck in the gas. The cavity may extend from at least one of the pressure holes to suppress a pressure drop of the gas.

[0006] A non-contact gripper according to another aspect of the present invention may comprise a gripping plate, a plurality of pressure holes, a plurality of suction holes, and a plurality of corner cavities. The pressure holes may be formed at regular intervals in the gripping plate to spray gas onto a semiconductor chip. The suction holes may be formed in the gripping plate between the pressure holes to suck in the gas. The corner cavities may extend from each of the pressure holes located between the corner suction holes located at the corners of the gripping plate and the suction holes adjacent to the corner suction holes.

[0007] A non-contact gripper according to another aspect of the present invention may include a gripping plate, a plurality of pressure holes, a plurality of suction holes, a plurality of corner cavities, a plurality of edge cavities, and a plurality of central cavities. The pressure holes may be formed at regular intervals in the gripping plate to spray gas onto a semiconductor chip. The suction holes may be formed in the gripping plate between the pressure holes to suck in the gas. The corner cavities may extend from each of the pressure holes located between the corner suction holes positioned at the corners of the gripping plate and the suction holes adjacent to the corner suction holes. The edge cavities may extend from each of the pressure holes located between the suction holes positioned at the edges of the gripping plate. The central cavities may extend from the pressure holes positioned in the center of the gripping plate among the pressure holes. Effects of the invention

[0008] According to the present invention described above, the gas flowing through the cavities extending from each of the pressure holes located between the corner suction hole located at the corner of the gripping plate and the adjacent suction hole among the suction holes can receive low flow resistance. Therefore, since the pressure drop of the gas injected from the pressure holes is suppressed by the cavities, the pressure of the gas can be maintained by the cavities, thereby preventing the corner portion of an object, such as a semiconductor chip, from sagging due to strong suction force. As a result, the non-contact gripper can grip the object in a non-contact manner, thereby preventing the object from being contaminated. Brief explanation of the drawing

[0009] FIG. 1 is a perspective view showing a non-contact gripper according to embodiments of the present invention. Figure 2 is a cross-sectional view along the line A-A' of Figure 1. Figure 3 is a cross-sectional view along the line B-B' of Figure 1. FIG. 4 is an enlarged plan view of the gripping plate of the non-contact gripper illustrated in FIG. 1. Figure 5 is a plan view showing an enlarged view of section C of Figure 4. FIG. 6 is an enlarged plan view of the gripping plate of a non-contact gripper according to embodiments of the present invention. Figure 7 is a plan view showing an enlarged view of section D of Figure 6. FIG. 8 is an enlarged plan view of a gripping plate of a non-contact gripper according to embodiments of the present invention. Figure 9 is a plan view showing an enlarged view of section E of Figure 8. FIG. 10 is an enlarged plan view of a gripping plate of a non-contact gripper according to embodiments of the present invention. Figure 11 is a plan view showing an enlarged view of section F of Figure 10. FIG. 12 is an enlarged plan view of a gripping plate of a non-contact gripper according to embodiments of the present invention. Figure 13 is a plan view showing an enlarged view of region G of Figure 12. FIG. 14 is an enlarged plan view of a gripping plate of a non-contact gripper according to embodiments of the present invention. Figure 15 is a plan view showing an enlarged view of section H of Figure 14. Figure 16 is a diagram showing the airflow velocity around a suction hole that does not have a cavity. Figure 17 is a diagram showing the airflow velocity around a suction hole having a cavity. Figure 18 is a graph showing the pressure distribution on the bottom surface of a semiconductor chip depending on the presence or absence of a cavity. Figure 19 is a diagram showing the pressure field at the corner of a semiconductor chip by a suction hole that does not have a cavity. Figure 20 is a diagram showing a pressure field at the corner of a semiconductor chip by a suction hole having a cavity. Figure 21 is a diagram showing the amount of deformation of a semiconductor chip by a suction hole that does not have a cavity. Figure 22 is a diagram showing the amount of deformation of a semiconductor chip caused by a suction hole having a cavity. Figure 23 is a diagram showing the buoyancy height of a semiconductor chip by a suction hole that does not have a cavity. Figure 24 is a diagram showing the buoyancy height of a semiconductor chip by a suction hole having a cavity. FIG. 25 is a plan view showing a non-contact gripper according to embodiments of the present invention applied to a PLP for display. FIG. 26 is a cross-sectional view showing the non-contact gripper illustrated in FIG. 25. Specific details for implementing the invention

[0010] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0011] FIG. 1 is a perspective view showing a non-contact gripper according to embodiments of the present invention, FIG. 2 is a cross-sectional view along line A-A' of FIG. 1, FIG. 3 is a cross-sectional view along line B-B' of FIG. 1, FIG. 4 is an enlarged plan view showing the gripping plate of the non-contact gripper shown in FIG. 1, and FIG. 5 is an enlarged plan view showing part C of FIG. 4.

[0012] The non-contact type gripper (100) of the present embodiment can grip an object in a non-contact manner. For example, the non-contact type gripper (100) can be used in a hybrid bonding process for manufacturing a semiconductor package. The non-contact type gripper (100) can transfer a semiconductor chip to a bond head. However, the object to which the non-contact type gripper (100) of the present embodiment is applied is not limited to a semiconductor chip, but can be applied to various other parts as well.

[0013] Referring to FIGS. 1 to 5, the non-contact gripper (100) may include a gripping plate (110), a plurality of blowing holes (130), a plurality of suction holes (120), and a cavity.

[0014] The gripping plate (110) may have a roughly rectangular cross-sectional shape. The gripping plate (110) is positioned close to the semiconductor chip so that the semiconductor chip can be gripped non-contactually.

[0015] The pressure holes (130) can be formed through the gripping plate (110) along a vertical direction. A blower (112) can be connected to the pressure holes (130). The blower (112) can supply gas to the pressure holes (130). Thus, the pressure holes (130) can spray gas onto the semiconductor chip to lift the semiconductor chip from the gripping plate (110). That is, the pressure holes (130) can apply positive pressure to the semiconductor chip.

[0016] In this embodiment, the pressure holes (130) may be arranged at regular intervals. That is, the spacing between the pressure holes (130) may be substantially the same, but is not limited thereto.

[0017] Suction holes (120) can be formed through the gripping plate (110) along a vertical direction. The suction holes (120) can be connected to a vacuum pump (114). The vacuum pump (114) can provide a vacuum to the suction holes (120). Thus, the suction holes (120) can draw in gas sprayed from the pressurization holes (130) to pull the semiconductor chip to the gripping plate (110). That is, the suction holes (120) can apply negative pressure to the semiconductor chip.

[0018] In this embodiment, the suction holes (120) may be arranged at regular intervals. That is, the spacing between the suction holes (120) may be substantially the same, but is not limited thereto. In particular, the pressure holes (130) may be located between the suction holes (120). Additionally, the pressure holes (130) may also be located between adjacent suction holes (120) located diagonally across the gripping plate (110). Each of the pressure holes (130) may be positioned in the center between the suction holes (120). That is, the spacing between the pressure hole (130) and the adjacent suction hole (120) may be the same, but is not limited thereto. For example, the spacing between the pressure hole (130) and the adjacent suction hole (120) may be different from each other. Additionally, each of the suction holes (120) may have a diameter that is relatively longer than the diameter of each of the pressure holes (130), but is not limited thereto.

[0019] The suction holes (120) may include a plurality of central suction holes (122), a plurality of edge suction holes (124), and a plurality of corner suction holes (126). The central suction holes (122) may be formed in the center of the gripping plate (110). The edge suction holes (124) may be formed at the edges of the gripping plate (110). That is, the edge suction holes (124) may be located adjacent to the sides of the gripping plate (110). The corner suction holes (126) may be formed at the corners of the gripping plate (110). In this embodiment, since the gripping plate (110) has a rectangular shape with four corners, the corner suction holes (126) may also consist of four located at the four corners of the gripping plate (110).

[0020] In this embodiment, the diameter of each of the edge suction holes (124) may be substantially the same as the diameter of each of the corner suction holes (126), but is not limited thereto. For example, the diameter of the edge suction hole (124) may be longer or shorter than the diameter of the corner suction hole (126). Additionally, the diameter of each of the central suction holes (122) may be shorter than the diameter of the edge suction hole (124), but is not limited thereto. For example, the diameter of the central suction hole (122) may be longer or shorter than the diameter of the edge suction hole (124).

[0021] Thus, the reason for setting the diameters of the edge suction hole (124) and the corner suction hole (126) longer than the diameter of the central suction hole (122), that is, providing stronger sound pressure to the edges than to the center of the semiconductor chip, is that the edge suction hole (124) and the corner suction hole (126) have the function of pulling the semiconductor chip toward the gripping plate (110) as well as the function of preventing the semiconductor chip from moving out of the set position. However, since the edges and corners of the semiconductor chip have relatively weaker rigidity than the central part of the semiconductor chip, the semiconductor chip may sag due to the strong sound pressure applied to the edges and corners of the semiconductor chip through the edge suction hole (124) and the corner suction hole (126). In particular, the sagging of the semiconductor chip may mainly occur at the corners of the semiconductor chip.

[0022] The blowing holes (130) may include a plurality of central blowing holes (132), a plurality of edge blowing holes (134), and a plurality of corner blowing holes (136). The central blowing holes (132) may be positioned between the central suction holes (122). Thus, one central suction hole (122) may be surrounded by eight central blowing holes (132), but is not limited thereto. The edge blowing holes (134) may be positioned between the edge suction holes (124). Thus, one edge suction hole (124) may be surrounded by two edge blowing holes (134) and three central blowing holes (132), but is not limited thereto. Corner pressure holes (136) may be positioned between corner suction holes (126) and adjacent edge suction holes (124). Thus, one corner suction hole (126) may be surrounded by two edge pressure holes (134) and one central pressure hole (132), but is not limited thereto.

[0023] A cavity can be formed on the surface of a gripping plate (110) facing a semiconductor chip. The cavity can extend from each of the pressure holes (130). Although the top of the cavity is open, the semiconductor chip is positioned very close to the gripping plate (110) by the negative pressure provided through the suction holes (120), so the semiconductor chip can partially block the open top of the cavity. Thus, gas injected from the pressure holes (130) can flow through the cavity. The gas flowing through the cavity is subjected to low flow resistance, so the pressure drop of the gas injected from the pressure holes (130) can be suppressed by the cavity. As a result, strong gas pressure can be applied to the corners of the semiconductor chip, thereby suppressing the sagging of the semiconductor chip.

[0024] As described above, since the corners of the semiconductor chip have the weakest rigidity, the cavity of the present embodiment may include corner cavities (140). The corner cavities (140) may extend from two corner pressure holes (136) adjacent to the corner suction hole (126).

[0025] The corner cavity (140) formed in the corner pressure hole (136) located above the corner suction hole (126) may extend along opposite directions. For example, the corner cavity (140) may extend along a first direction (D1) and a second direction (D2) opposite to the first direction (D1). Additionally, the corner cavity (140) may have a straight shape, but is not limited thereto. That is, the corner cavity (140) may include a first corner cavity (142) extending toward the first direction (D1), i.e., the adjacent central pressure hole (132), and a second corner cavity (144) extending toward the side of the gripping plate (110) along the second direction (D2). The first corner cavity (142) extended along the first direction (D1) and the second corner cavity (144) extended along the second direction (D2) may have substantially the same length, but are not limited thereto. Additionally, the first corner cavity (142) extended along the first direction (D1) and the second corner cavity (144) extended along the second direction (D2) may have substantially the same width as the diameter of the corner pressure hole (136), but are not limited thereto. For example, the width of the first corner cavity (142) extended along the first direction (D1) and the second corner cavity (144) extended along the second direction (D2) may be wider or narrower than the diameter of the corner pressure hole (136). The length and width of the first corner cavity (142) extended along the first direction (D1) and the second corner cavity (144) extended along the second direction (D2) can be changed according to the thickness of the semiconductor chip.

[0026] The corner cavity (140) formed in the corner pressure hole (136) located to the left of the corner suction hole (126) may also extend along opposite directions. For example, the corner cavity (140) may extend along a third direction (D3) and a fourth direction (D4) opposite to the third direction (D3). The third direction (D3) and the fourth direction (D4) may be substantially orthogonal to the first direction (D1) and the second direction (D2). Additionally, the corner cavity (140) may have a straight shape, but is not limited thereto. That is, the corner cavity (140) may include a first corner cavity (142) extended along the third direction (D3) toward the adjacent pressure hole and a second corner cavity (144) extended along the fourth direction (D4) toward the side of the gripping plate (110). The first corner cavity (142) extended along the third direction (D3) and the second corner cavity (144) extended along the fourth direction (D4) may have substantially the same length, but are not limited thereto. Additionally, the first corner cavity (142) extended along the third direction (D3) and the second corner cavity (144) extended along the fourth direction (D4) may have substantially the same width as the diameter of the corner pressure hole (136), but are not limited thereto. For example, the width of the first corner cavity (142) extended along the third direction (D3) and the second corner cavity (144) extended along the fourth direction (D4) may be wider or narrower than the diameter of the corner pressure hole (136). The length and width of the first corner cavity (142) extended along the third direction (D3) and the second corner cavity (144) extended along the fourth direction (D4) can be changed according to the thickness of the semiconductor chip.

[0027] Gas injected through the corner pressure holes (136) can flow along the corner cavities (140). Therefore, the gas flowing through the corner cavities (140) receives low flow resistance, so that the pressure drop of the gas injected from the corner pressure holes (136) can be suppressed by the corner cavities (140). As a result, strong gas pressure can be applied to the corners of the semiconductor chip, thereby suppressing the phenomenon of the corners of the semiconductor chip sagging.

[0028] FIG. 6 is an enlarged plan view of a gripping plate of a non-contact gripper according to embodiments of the present invention, and FIG. 7 is an enlarged plan view of portion D of FIG. 6.

[0029] The non-contact gripper (100a) of the present embodiment may include substantially the same components as the components of the non-contact gripper (100) shown in FIG. 4, except for the corner cavity. Accordingly, the same components are indicated by the same reference numerals, and the repeated description of the same components may be omitted.

[0030] Referring to FIGS. 6 and 7, each of the corner cavities (140a) of the present embodiment may include a first corner cavity (142) and a second corner cavity (144a). Since the first corner cavity (142) is substantially the same as the first corner cavity (142) shown in FIG. 4, a repeated description of the first corner cavity (142) may be omitted.

[0031] The second corner cavity (144a) may be extended obliquely toward the first direction (D1) or the fourth direction (D4). In particular, the second corner cavity (144a) may be extended toward the corner suction hole (126). Thus, the second corner cavity (144a) may form an obtuse angle with the first corner cavity (142).

[0032] When the second corner cavity (144a) approaches the corner suction hole (126), the negative pressure applied from the corner suction hole (126) to the corner of the semiconductor chip can be weakened by the positive pressure flowing through the second corner cavity (144a). Although the semiconductor chip may be slightly misaligned due to the reduction in negative pressure, the strong pressure of the gas flowing through the second corner cavity (144a) can be applied to the corner of the semiconductor chip, thereby further suppressing the sagging phenomenon of the semiconductor chip.

[0033] FIG. 8 is an enlarged plan view of a gripping plate of a non-contact gripper according to embodiments of the present invention, and FIG. 9 is an enlarged plan view of portion E of FIG. 8.

[0034] The non-contact gripper (100b) of the present embodiment may include substantially the same components as the components of the non-contact gripper (100a) shown in FIG. 6, except that it further includes a connecting cavity. Accordingly, the same components are indicated by the same reference numerals, and the repeated description of the same components may be omitted.

[0035] Referring to FIGS. 8 and 9, each of the corner cavities (140b) of the present embodiment may further include a connection cavity (146). The connection cavity (146) may extend from the second corner cavity (144a). Additionally, the connection cavities (146) extending from the second corner cavities (144a) may be connected to each other. Thus, the second corner cavities (144a) may have a shape in which they are connected to each other via the connection cavities (146).

[0036] Accordingly, the corner suction hole (126) can be surrounded by the second corner cavities (144a) and the connecting cavities (146). Thus, the negative pressure applied from the corner suction hole (126) to the corner of the semiconductor chip can be further weakened by the positive pressure flowing through the second corner cavities (144a) and the connecting cavities (146). Although the semiconductor chip may be misaligned due to the reduction in negative pressure, the strong pressure of the gas flowing through the second corner cavities (144a) and the connecting cavities (146) can be applied to the corner of the semiconductor chip, thereby further suppressing the sagging phenomenon of the semiconductor chip.

[0037] FIG. 10 is an enlarged plan view of a gripping plate of a non-contact gripper according to embodiments of the present invention, and FIG. 11 is an enlarged plan view of portion F of FIG. 10.

[0038] The non-contact gripper (100c) of the present embodiment may include substantially the same components as the components of the non-contact gripper (100) illustrated in FIG. 4, except that it further includes edge cavities. Accordingly, the same components are indicated by the same reference numerals, and the repeated description of the same components may be omitted.

[0039] Referring to FIGS. 10 and 11, the cavity of the present embodiment may further include edge cavities (150). The edge cavities (150) may extend along directions opposite to each other from each of the edge pressure holes (134), but are not limited thereto. Additionally, each of the edge cavities (150) may have a straight shape, but is not limited thereto.

[0040] As described above, since the edge of the semiconductor chip has a weaker strength than the central part of the semiconductor chip, the pressure of the gas flowing through the edge cavities (150) can be applied to the edge of the semiconductor chip while maintaining the pressure. Therefore, the sagging phenomenon of the edge of the semiconductor chip can be suppressed.

[0041] FIG. 12 is an enlarged plan view of a gripping plate of a non-contact gripper according to embodiments of the present invention, and FIG. 13 is an enlarged plan view of section G of FIG. 12.

[0042] The non-contact gripper (100d) of the present embodiment may include substantially the same components as the components of the non-contact gripper (100c) illustrated in FIG. 10, except that it further includes central cavities. Accordingly, the same components are indicated by the same reference numerals, and the repeated description of the same components may be omitted.

[0043] Referring to FIGS. 12 and 13, the cavity of the present embodiment may further include central cavities (160). The central cavities (160) may extend from each of the central pressure holes (132). In the present embodiment, each of the central cavities (160) may have a roughly circular shape, but is not limited thereto. For example, the central cavity (160) may have a polygonal shape such as a triangle or a square.

[0044] When a semiconductor chip has a very thin thickness, sagging of the semiconductor chip can occur even in the central part of the semiconductor chip. Therefore, the pressure of the gas flowing through the central cavities (160) can be applied to the central part of the semiconductor chip while maintaining the pressure. Thus, the phenomenon of sagging in the central part of the semiconductor chip can be suppressed.

[0045] FIG. 14 is an enlarged plan view of a gripping plate of a non-contact gripper according to embodiments of the present invention, and FIG. 15 is an enlarged plan view of portion H of FIG. 14.

[0046] The non-contact gripper (100e) of the present embodiment may include substantially the same components as the components of the non-contact gripper (100d) shown in FIG. 11, except for the shape of the central cavity. Accordingly, the same components are indicated by the same reference numerals, and the repeated description of the same components may be omitted.

[0047] Referring to FIGS. 14 and 15, the central cavity (170) of the present embodiment may have a roughly cross shape. That is, the central cavity (170) may extend along a first direction (D1), a second direction (D2), a third direction (D3), and a fourth direction (D4) from the central pressure hole (132). The extension lengths of the central cavities (170) may be the same or different from each other.

[0048] FIG. 16 is a diagram showing the airflow velocity around a suction hole without a cavity, and FIG. 17 is a diagram showing the airflow velocity around a suction hole with a cavity.

[0049] As shown in Fig. 16, when the non-contact gripper does not have a cavity, the gas injected through the pressurization hole expands rapidly, and it can be seen that the pressure of the gas decreases rapidly.

[0050] On the other hand, as shown in FIG. 17, when the non-contact gripper has a cavity, the gas injected through the pressurization hole can flow into the cavity. Therefore, the expansion of the gas inside the cavity is suppressed, and the pressure of the gas inside the cavity can be maintained almost unchanged.

[0051] Figure 18 is a graph showing the pressure distribution on the bottom surface of a semiconductor chip depending on the presence or absence of a cavity.

[0052] In FIG. 18, the horizontal axis represents the position of the semiconductor chip, and the vertical axis represents the pressure. Line ① represents the pressure applied to the semiconductor chip when there is no cavity, and line ② represents the pressure applied to the semiconductor chip when there is a cavity. Also, L represents the length of the cavity.

[0053] As shown in Fig. 18, it can be seen that the pressure applied to the edge of the semiconductor chip in the case where there is a cavity is higher than the pressure applied to the edge of the semiconductor chip in the case where there is no cavity. Therefore, it can be confirmed that the pressure of the gas is maintained by the gas injected through the pressurization hole being guided into the cavity.

[0054] FIG. 19 is a diagram showing a pressure field at the corner of a semiconductor chip by a suction hole without a cavity, and FIG. 20 is a diagram showing a pressure field at the corner of a semiconductor chip by a suction hole with a cavity.

[0055] As shown in FIGS. 19 and 20, it can be seen that the pressure applied to the edge portions of the semiconductor chip corresponding to the ends of the cavity in the case where there is a cavity is relatively higher than the pressure applied to the edge portions of the semiconductor chip corresponding to the ends of the cavity in the case where there is no cavity.

[0056] FIG. 21 is a diagram showing the amount of deformation of a semiconductor chip by a suction hole without a cavity, and FIG. 22 is a diagram showing the amount of deformation of a semiconductor chip by a suction hole with a cavity.

[0057] As shown in Fig. 21, in the case where there is no cavity, it can be seen that the corners of the semiconductor chip are severely deformed downward. That is, it can be seen that the corners of the semiconductor chip are significantly sagging downward.

[0058] On the other hand, as shown in Fig. 22, when a cavity is present, it can be seen that the corners of the semiconductor chip are slightly deformed downward. That is, it can be seen that the corners of the semiconductor chip are slightly sagging.

[0059] FIG. 23 is a diagram showing the buoyancy height of a semiconductor chip by a suction hole without a cavity, and FIG. 24 is a diagram showing the buoyancy height of a semiconductor chip by a suction hole with a cavity.

[0060] As shown in FIG. 23, in the case where there is no cavity, it can be seen that the edge of the semiconductor chip is raised relatively high. The raised edge of the semiconductor chip can come into contact with the gripping plate.

[0061] On the other hand, as shown in FIG. 24, when a cavity is present, it can be seen that the edges of the semiconductor chip are relatively slightly raised. Therefore, the edges of the semiconductor chip may not come into contact with the gripping plate.

[0062] FIG. 25 is a plan view showing a non-contact gripper according to embodiments of the present invention applied to a PLP for display, and FIG. 26 is a cross-sectional view showing the non-contact gripper shown in FIG. 25.

[0063] Referring to FIGS. 25 and 26, the non-contact gripper (200) of the present embodiment can be used to grip a PLP for display in a non-contact manner. The non-contact gripper (200) may include a gripping plate (210), a plurality of pressure holes (220), and a plurality of cavities (230).

[0064] The pressure holes (220) may be arranged at regular intervals on the gripping plate (210). Cavities (230) may be formed to surround each of the pressure holes (220). In this embodiment, each of the cavities (230) may have a roughly circular shape, but is not limited thereto.

[0065] Although the central part of the thin PLP may sag downward due to its own weight, the gas injected through the pressure holes (220) and contained within the cavity (230) can support the central part of the PLP. Thus, the sagging of the central part of the PLP can be suppressed by the gas contained within the cavity (230).

[0066] According to the above-described embodiments, the gas flowing through the cavities extending from each of the pressure holes located between the corner suction hole (126) located at the corner of the gripping plate (110) and the adjacent suction hole among the suction holes can receive low flow resistance. Therefore, since the pressure drop of the gas sprayed from the pressure holes is suppressed by the cavities, the pressure of the gas can be maintained by the cavities, thereby preventing the corner portion of an object, such as a semiconductor chip, from sagging due to strong suction force. As a result, the non-contact gripper can grip the object in a non-contact manner, thereby preventing the object from being contaminated.

[0067] As described above, although the present invention has been explained with reference to preferred embodiments, those skilled in the art will understand that various modifications and changes can be made to the invention without departing from the spirit of the invention as set forth in the following claims. Explanation of the symbols

[0068] 110 ; Gripping plate 112 ; Blower 114 ; Vacuum pump 120 ; Suction port 122 ; Central suction hole 124 ; Edge suction hole 126 ; Corner suction hole 130 ; Pressurizing hole 132 ; Central pressure hole 134 ; Edge pressure hole 136 ; Corner pressure hole 140 ; ​​Corner cavity 142 ; 1st corner cavity 144 ; 2nd corner cavity 146 ; Connecting cavity 150 ; Edge cavity 160, 170 ; Central cavity

Claims

Claim 1 A non-contact gripper comprising: a gripping plate (110); a plurality of pressure holes (130) formed in the gripping plate (110) for spraying gas onto a semiconductor chip; a plurality of suction holes (120) formed in the gripping plate (110) for sucking in the gas; and a cavity extending from at least one of the pressure holes (130) to suppress a pressure drop of the gas, wherein the cavity is formed on the upper surface of the gripping plate, the lower surface of the cavity is parallel to the upper surface of the gripping plate and has a flat shape, and the pressure hole is formed penetrating vertically from the lower surface of the cavity. Claim 2 In claim 1, the cavity is a non-contact gripper having a straight shape. Claim 3 In claim 2, the cavity is a non-contact gripper extending along opposite directions from the pressure hole (130). Claim 4 In claim 1, the cavity is a non-contact gripper having a circular shape surrounding the pressure hole (130). Claim 5 In claim 1, the suction holes (120) are arranged at regular intervals, and the pressure holes (130) are located between the suction holes (120) in a non-contact gripper. Claim 6 A non-contact gripper comprising: a gripping plate (110); a plurality of pressure holes (130) formed in the gripping plate (110) for spraying gas onto a semiconductor chip; a plurality of suction holes (120) formed in the gripping plate (110) for sucking in the gas; and a cavity extending from at least one of the pressure holes (130) to suppress a pressure drop of the gas, wherein the cavity comprises a corner suction hole (126) located at the corner of the gripping plate (110) among the suction holes (120) and a plurality of corner cavities (140) extending from each of the pressure holes (130) located between the corner suction hole (126) and the suction holes (120) adjacent to the corner suction hole (126). Claim 7 In claim 6, each of the corner cavities (140) comprises a first corner cavity (142) extending from the pressure hole (130) toward an adjacent pressure hole (130); and a second corner cavity (144) extending from the pressure hole (130) toward the side of the gripping plate (110), forming a non-contact gripper. Claim 8 In claim 7, the second corner cavity (144) is a non-contact gripper extending along a direction that forms an obtuse angle with the first corner cavity (142) toward the suction hole (120). Claim 9 In claim 7, the second corner cavities (144) of the corner cavities (140) are connected to each other as non-contact grippers. Claim 10 In claim 6, the cavity is formed on the upper surface of the gripping plate, the lower surface of the cavity is parallel to the upper surface of the gripping plate and has a flat shape, and the pressure hole is formed penetrating vertically from the lower surface of the cavity, a non-contact gripper.

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