Collet assembly, collet unit and manufacturing method of the collet assembly

Abstract

A collet assembly according to one embodiment of the present disclosure comprises: a base plate having a base hole formed through it that communicates with a vacuum hole of the collet holder; an intermediate plate coupled to the lower side of the base plate and having a plurality of intermediate holes formed through it; and an elastic member coupled to the lower side of the intermediate plate and having a plurality of adsorption holes formed through it that correspond to each of the plurality of intermediate holes, wherein a vibration-inducing space communicating with the base hole and the plurality of intermediate holes may be formed between the base plate and the intermediate plate.

Description

Technology Field

[0001] The present disclosure relates to a collet assembly, a collet unit, and a method for manufacturing a collet assembly. Background Technology

[0002] Collets can be used in the semiconductor manufacturing process to transport semiconductor chips or to bond them to substrates. A collet is a component that comes into contact with a semiconductor chip, capable of picking up and securing the chip through suction. The problem to be solved

[0003] At least one embodiment of the present disclosure may provide a collet assembly, a collet unit, or a method for manufacturing a collet assembly, etc. means of solving the problem

[0004] A collet assembly according to one embodiment of the present disclosure may be configured to be mounted on a collet holder. A collet assembly according to one embodiment of the present disclosure may include: a base plate having a base hole formed through it that communicates with a vacuum hole of the collet holder; an intermediate plate coupled to the lower side of the base plate and having a plurality of intermediate holes formed through it; and an elastic member coupled to the lower side of the intermediate plate and having a plurality of adsorption holes formed through it that correspond to each of the plurality of intermediate holes. A vacuum induction space communicating with the base hole and the plurality of intermediate holes may be formed between the base plate and the intermediate plate.

[0005] In one embodiment, the elastic member may have a dome-shaped surface on its lower surface that is convex downward.

[0006] In one embodiment, the dome shape may be inclined upward from the highest point to the edge of the dome shape.

[0007] In one embodiment, the base plate and the intermediate plate may be made of a metal material.

[0008] In one embodiment, the intermediate plate defines a protrusion protruding upward on its upper surface, and the base plate defines a receiving portion on its lower surface that accommodates the protrusion, and the vacuum induction space may be formed between the upper surface of the protrusion and the lower surface of the receiving portion.

[0009] In one embodiment, the outer surface of the protrusion and the inner surface of the receiving portion may be sealed by an adhesive.

[0010] A collet unit according to one embodiment of the present disclosure may include: a collet holder including a vacuum hole; a base plate configured to be attached to the collet holder and having a base hole formed through it that communicates with the vacuum hole; an intermediate plate coupled to the lower side of the base plate and having a plurality of intermediate holes formed through it; and an elastic member coupled to the lower side of the intermediate plate and having a plurality of adsorption holes formed through it that correspond to each of the plurality of intermediate holes. A vibration-inducing space communicating with the base hole and the plurality of intermediate holes may be formed between the base plate and the intermediate plate.

[0011] A method for manufacturing a collet assembly configured to be mounted on a collet holder according to one embodiment of the present disclosure may include: a step of placing an intermediate plate having a plurality of intermediate holes formed therein in a lower mold having a plurality of pins so that the plurality of pins each penetrate the plurality of intermediate holes; a step of positioning an elastic material on the upper part of the intermediate plate; a step of compression molding the elastic material using an upper mold to form an elastic part having a plurality of adsorption holes corresponding to the plurality of intermediate holes formed by the plurality of pins; and a step of combining the assembly of the intermediate plate and the elastic part with a base plate having a base hole formed therein to form a collet assembly including a vacuum induction space between the base plate and the intermediate plate.

[0012] In one embodiment, the upper mold may have a molding surface for forming a convex dome-shaped surface toward the upper mold on the elastic part. Effects of the invention

[0013] According to at least one embodiment of the present disclosure, technology such as, for example, a collet assembly, a collet holder, or a method for manufacturing a collet assembly may be provided. Brief explanation of the drawing

[0014] FIG. 1 illustrates a collet assembly and a collet holder according to one embodiment. FIG. 2 is an exploded perspective view of a collet assembly according to one embodiment. Figure 3 is a cross-sectional view of a collet assembly cut along line II' of Figure 1. FIGS. 4 to 8 schematically illustrate a method for manufacturing a collet assembly in one embodiment. Specific details for implementing the invention

[0015] The embodiments of the present disclosure are illustrative for the purpose of explaining the technical concept of the present disclosure. The scope of rights according to the present disclosure is not limited to the embodiments presented below or the specific description thereof.

[0016] The technical and scientific terms used in this disclosure, unless otherwise defined, have the meanings generally understood by those skilled in the art to which this disclosure pertains. The terms used in this disclosure are selected for the purpose of further clarifying this disclosure and are not selected to limit the scope of the rights under this disclosure.

[0017] Expressions such as “comprising,” “comprising,” “having,” etc. used in this disclosure should be understood as open-ended terms implying the possibility of including other embodiments, unless otherwise stated in the phrase or sentence containing such expressions.

[0018] Unless otherwise stated, singular expressions described in this disclosure may include a plural meaning, and this applies likewise to singular expressions described in the claims.

[0019] Expressions such as "first," "second," etc. used in this disclosure are used to distinguish multiple components from one another and do not limit the order or importance of said components.

[0020] In the present disclosure, where it is stated that a component is "connected" or "connected" to another component, it should be understood that the component may be directly connected or connected to the other component, or connected or connected through a new component.

[0021] The dimensions and numbers described in this disclosure are not limited to the stated dimensions and numbers. Unless otherwise specified, such dimensions and numbers may be understood to mean the stated values ​​and equivalent ranges including them.

[0022] Directional indicators used in the present disclosure, such as "upward" and "up," are based on the direction in which the collet holder (200) is positioned relative to the collet assembly (100) in the attached drawings, or the direction in which the plate (110, 130) is positioned relative to the elastic part (150), and directional indicators, such as "downward" and "downward," mean the opposite direction (see FIG. 1). The collet holder and collet assembly shown in the attached drawings may be oriented differently, and the directional indicators may be interpreted accordingly.

[0023] Embodiments of the present disclosure will be described below with reference to the attached drawings. In the attached drawings, identical or corresponding components are given the same reference numerals. Furthermore, in the description of the embodiments below, the description of identical or corresponding components may be omitted. However, even if a description of a component is omitted, it is not intended that such component is not included in any embodiment.

[0024] FIG. 1 illustrates a collet assembly and a collet holder according to one embodiment. FIG. 2 is an exploded perspective view of a collet assembly according to one embodiment. FIG. 3 is a cross-sectional view of a collet assembly cut along line II' of FIG. 1.

[0025] Referring to FIGS. 1 to 3, the collet assembly (100) includes a base plate (110), an intermediate plate (130), and an elastic part (150). The collet assembly (100) is mounted on a collet holder (200) and used, and is coupled to the lower part of the collet holder (200) to perform the function of adsorbing a semiconductor chip. The combination of the collet assembly (100) and the collet holder (200) may be referred to as a collet unit. The collet assembly (100) or the collet unit may be referred to as a collet.

[0026] The collet holder (200) includes a holder vacuum hole (201). The holder vacuum hole (201) is connected to a vacuum generating device and communicates with the base hole (111) of the base plate (110). In the drawing, the holder vacuum hole (201) is provided as one, but in other embodiments, the holder vacuum hole (201) may be provided as two or more.

[0027] The process of adsorbing a semiconductor chip using a collet assembly is described in detail. First, with the elastic part (150) of the collet assembly in close proximity to the upper surface of the semiconductor chip, an external vacuum generator sucks in air through the holder vacuum hole (201) of the collet holder (200). The air sucked in through the holder vacuum hole (201) is transferred to the base hole (111) of the base plate (110). Negative pressure is formed in the vacuum induction space (160) through the base hole (111). The negative pressure in the vacuum induction space (160) is dispersed and transferred to the plurality of adsorption holes (151) of the elastic part (150) through the plurality of intermediate holes (131) of the intermediate plate (130). When negative pressure acts through the plurality of adsorption holes (151) open on the adsorption surface (or lower surface) (152) of the elastic part (150), a vacuum state is formed between the adsorption surface (152) and the upper surface of the semiconductor chip. Accordingly, the semiconductor chip is adhered to and adsorbed to the adsorption surface (152) of the elastic part (150) due to the difference between atmospheric pressure and vacuum pressure. By controlling the collet assembly that adsorbs the semiconductor chip, the semiconductor chip can be mounted at a target location (e.g., lead frame, substrate, etc.).

[0028] The collet assembly (100) includes a base plate (110) comprising at least one base hole (111). The base hole (111) is located on the same axis as and communicates with the holder vacuum hole (201) of the collet holder (200). The diameter of the base hole (111) may be formed to be the same or similar in size to the holder vacuum hole (201) of the collet holder (200).

[0029] The collet assembly (100) includes an intermediate plate (130) that is coupled to the lower side of the base plate (110). A plurality of intermediate holes (131) are formed in the intermediate plate (130). The arrangement pattern of the plurality of intermediate holes (131) can be configured in various ways. For example, as shown in FIG. 2, they can be arranged along the edges of a square. The plurality of intermediate holes (131) may have the same diameter from each other, or they may have different diameters depending on their location. The base plate (110) and the intermediate plate (130) may be made of metal.

[0030] The collet assembly (100) includes an elastic member (150) that is coupled to the lower surface (132) of the intermediate plate (130). The elastic member (150) defines a plurality of adsorption holes (151) that penetrate from the adsorption surface (152) to the upper surface (153). The plurality of adsorption holes (151) are arranged to be in the same vertical line as the plurality of intermediate holes (131) of the intermediate plate (130) and are in communication with the intermediate holes (131). The number and arrangement pattern of the plurality of adsorption holes (151) are formed to correspond to the plurality of intermediate holes (131) of the intermediate plate (130). The diameter of the adsorption holes (151) may be equal to or smaller than the diameter of the intermediate holes (131). The lower portion (151a) of the adsorption holes (151) may have a smaller diameter than the other portion (151b).

[0031] The material of the elastic part (150) may be non-conductive rubber, silicone, urethane, etc. In one embodiment, the elastic part (150) may be formed from a rubber material with minimized surface stickiness. This material prevents foreign matter from adhering to the chip surface or the chip from being deformed. The Shore hardness of the elastic part (150) may be formed in the range of 40 to 80. In particular, in a bonding structure with a multi-layered stacking method such as hybrid bonding, the Shore hardness of the elastic part (150) may be relatively low, around 60, to minimize impact damage.

[0032] The adsorption surface (152) of the elastic part (150) may include a dome-shaped surface that is convex downward. The dome shape (or dome-shaped surface) may be provided by a surface whose height (h) decreases radially from the central axis (C) of the elastic part (150). Here, the height (h) of the curved surface refers to the vertical distance from any reference point located above the adsorption surface (152) of the elastic part (150) to the adsorption surface (152). The height difference between the highest point (152a) and the edge (152b) of the dome shape may be in the range of approximately 50 to 300 μm. The highest point (152a) refers to the point with the highest height (h) of the dome shape. The dome shape may be defined by a surface that slopes upward from the highest point (152a) to the edge (152b) of the dome shape. The slope of the incline may be gentle or gradually steep from the center.

[0033] The dome shape can be formed, for example, as part of a spherical surface. As another example, the dome shape can be formed as part of a parabolic surface or an elliptical surface. As yet another example, the dome shape can be formed as a complex surface in which the curvature changes from the center to the outer edge. For example, the center can be formed to have a gentle curvature, while the outer edge can be formed to have a steep curvature.

[0034] The dome shape formed on the adsorption surface (152) of the elastic part (150) prevents or minimizes the formation of voids between the semiconductor chip and the adsorption surface (152). Since the dome shape is formed such that the central part is higher than the outer part, when adsorbing the semiconductor chip, the central part contacts first, and then the outer part contacts gradually. Accordingly, air or residual gas existing between the adsorption surface (152) and the semiconductor chip is pushed out from the central part to the outer part and discharged to the outside. In addition, in the case of a semiconductor chip with a relatively thin thickness, when the semiconductor chip is adsorbed to the adsorption surface (152) of the elastic part (150), the semiconductor chip can be deformed into a shape with a convex center along the curvature of the adsorption surface (152). In this state, when the collet assembly adsorbing the chip descends toward the lead frame, it contacts the lead frame starting from the center of the semiconductor chip, and when the adsorption force is removed, it naturally adheres radially from the center due to the restoring force of the semiconductor chip. As described above, if adhesion is naturally achieved radially from the center, air bubbles remaining inside the adhesive used to bond the semiconductor chip to the lead frame are completely removed, thereby completely preventing the occurrence of voids during adhesion.

[0035] The collet assembly (100) includes a vacuum induction space (160) between the base plate (110) and the intermediate plate (130). The vacuum induction space (160) functions as a vacuum line connecting the base hole (111) of the base plate (110) and the intermediate hole (131) of the intermediate plate (130). Specifically, the upper end of the vacuum induction space (160) is connected to the base hole (111) of the base plate (110), and the lower end of the vacuum induction space (160) is connected to the intermediate hole (131) of the intermediate plate (130). Due to this structure, the vacuum suction force supplied through the base hole (111) of the base plate (110) is uniformly distributed within the vacuum induction space (160) and transmitted to the adsorption hole (151) of the elastic part (150) through the intermediate hole (131) of the intermediate plate (130).

[0036] The intermediate plate (130) and the base plate (110) are configured such that a vacuum induction space (160) is formed inside when joined together. The intermediate plate (130) and the base plate (110) are sealed together so that air does not pass through the vacuum induction space (160) to the outside, except for the intermediate hole (131) and the holder vacuum hole (201). For example, when the intermediate plate (130) and the base plate (110) are joined, an adhesive may be applied to the surfaces in contact with each other.

[0037] In one embodiment, the base plate (110) may define a receiving portion (112), and the intermediate plate (130) may define a protrusion (133) protruding upward. The receiving portion (112) may be configured to receive the protrusion (133) of the intermediate plate (130) and to define a part of the vacuum induction space (160). An adhesive is applied between the outer surface (133a) of the protrusion (133) and the inner surface (112a) of the receiving portion (112) to bond the base plate (110) and the intermediate plate (130), and at the same time, the gap between the outer surface (133a) of the protrusion (133) and the inner surface (112a) of the receiving portion (112) is sealed. Accordingly, the vacuum induction space (160) is only connected to the intermediate hole (131) and the holder vacuum hole (201).

[0038] The protrusion (133) and the receiving portion (112) are configured such that when the protrusion (133) is inserted into the receiving portion (112), a vacuum induction space (160) is formed between the intermediate plate (130) and the base plate (110). For example, the height of the protrusion (133) is formed to be smaller than the depth of the receiving portion (112). Accordingly, an empty space is formed between the upper surface of the protrusion (133) and the lower surface (112b) of the receiving portion (112), and this space functions as a vacuum induction space (160). In another embodiment, a protrusion may be formed on the base plate (110), and a receiving portion may be formed on the intermediate plate (130). In this case as well, a vacuum induction space (160) may be formed between the intermediate plate (130) and the base plate (110).

[0039] The two-stage plate structure of the present disclosure (intermediate plate (130) + base plate (110)) provides the following effects compared to a conventional single plate structure.

[0040] First, the vacuum dispersion effect is enhanced. The vacuum suction force supplied from one base hole (111) of the base plate (110) is uniformly distributed through the vacuum induction space (160) to a plurality of intermediate holes (131) of the intermediate plate (130). Accordingly, a uniform suction force is applied to the entire suction surface (152) of the elastic part (150), enabling stable suction of the semiconductor chip.

[0041] Second, structural rigidity is improved. Since both the intermediate plate (130) and the base plate (110) are made of metal, the volume of the vacuum induction space (160) is firmly maintained even during vacuum suction. In the case of a conventional collet made only of elastic material, there was a problem in that the elastic part contracted during vacuum suction, reducing the cross-sectional area of ​​the vacuum line and consequently lowering the vacuum suction efficiency. However, in the present disclosure, since metal plates support the vacuum induction space (160), the volume of the space is maintained even during vacuum suction, providing stable suction performance.

[0042] Third, the dome shape maintenance effect is enhanced. Forming a vacuum induction space (160) through a two-stage plate structure helps the elastic part (150) maintain the dome-shaped adsorption surface (152). Since the metal intermediate plate (130) supports the elastic part (150) from below, even if a curved surface such as a dome shape is formed on the adsorption surface (152) of the elastic part (150), the curved surface is maintained and does not collapse even after repeated use. Accordingly, the performance of the collet is improved and its lifespan is extended. Specifically, the pore discharge effect due to the curved surface of the elastic part (150) is enhanced, and the effect can be maintained for a long time.

[0043] Fourth, vacuum leakage is minimized. A vacuum is formed up to the collet edge through the two-stage plate structure, and since the joint between the intermediate plate (130) and the base plate (110) is sealed with adhesive, vacuum leakage is minimized.

[0044] Fifth, simultaneous application of vacuum force is possible. Since the volume of the vacuum induction space (160) is firmly maintained by two plates, the vacuum suction force supplied from the base hole (111) is uniformly distributed throughout the space and then transmitted to a plurality of intermediate holes (131). Accordingly, the difference in the timing of when the vacuum is applied to each intermediate hole (131) is minimized, so that the suction force acts simultaneously on the entire surface of the semiconductor chip.

[0045] Sixth, the degree of design freedom is improved. In conventional collets, the suction holes of the collet plate had to be designed according to the arrangement of the vacuum holes of the collet holder (200), but in the present disclosure, the vacuum induction space (160) disperses the vacuum suction force regardless of the arrangement of the vacuum holes of the collet holder (200), so the degree of design freedom of the collet plate is improved.

[0046] FIGS. 4 to 8 schematically illustrate a method for manufacturing a collet assembly in one embodiment. FIG. 4 illustrates the step of seating an intermediate plate inside a mold. FIG. 5 illustrates the step of positioning the raw material of an elastic part inside a mold. FIG. 6 illustrates the step of forming an elastic part having a dome-shaped surface through compression of the mold. FIG. 7 illustrates the step of separating the upper mold. FIG. 8 illustrates the step of joining the assembly of the intermediate plate and the elastic part to a base plate. Hereinafter, the manufacturing method will be described with reference to FIGS. 4 to 8.

[0047] A mold may be provided for integrally forming an elastic part (150) and an intermediate plate (130). The mold may be composed of an upper mold (310) and a lower mold (320). A seating portion is formed in the lower mold (320) for seating the intermediate plate (130). The seating portion has a shape corresponding to the outer shape of the intermediate plate (130) and ensures that the intermediate plate (130) is placed in an accurate position. A molding surface (311) is formed in the upper mold (310) to form the shape of the elastic part (150), particularly the dome shape of the adsorption surface (152). The molding surface (311) has a surface corresponding to the dome shape of the adsorption surface (152). For example, the molding surface (311) may include a curved surface that is concavely sunken upward. The lower mold (320) may be provided with a plurality of pins for forming a plurality of adsorption holes (151) of the elastic part (150). Multiple pins are arranged to be aligned with multiple intermediate holes (131) of the intermediate plate (130).

[0048] First, the intermediate plate (130) is placed in the lower die (320) such that its lower surface (132) faces upward, that is, in an inverted state. At this time, a plurality of pins of the lower die (320) each penetrate a plurality of intermediate holes (131) of the intermediate plate (130).

[0049] Next, an elastic material is prepared to form the elastic part (150). The elastic material is placed between the intermediate plate (130) seated on the lower mold (320) and the upper mold (310).

[0050] Afterward, the upper mold (310) is lowered and combined with the lower mold (320), and the mold is closed. Pressure and / or heat are applied to the elastic material through the mold. The elastic material flows within the cavity of the mold to form the shape of the elastic part (150). The elastic material is in close contact with the lower surface (132) of the intermediate plate (130) and is integrally bonded.

[0051] In this process, the elastic material flows around a plurality of pins of the lower mold (320), and accordingly, a plurality of adsorption holes (151) are formed in the elastic part (150). The formed plurality of adsorption holes (151) are connected to a plurality of intermediate holes (131) of the intermediate plate (130). The adsorption surface (152) of the elastic part (150) is formed to include a dome shape by the molding surface (311) of the upper mold (310).

[0052] Optionally, a surface treatment to improve adhesion to the elastic part (150) may be performed on the lower surface (132) of the intermediate plate (130), i.e., the surface to which the elastic part (150) is attached. For example, the surface roughness may be increased through sandblasting, chemical etching, plasma treatment, etc., or a primer coating may be applied.

[0053] When molding is completed, the upper mold (310) is opened and the assembly, in which the intermediate plate (130) and the elastic part (150) are integrally formed, is ejected from the mold.

[0054] Subsequently, the intermediate plate (130) and the base plate (110) are joined. The two can be joined using an adhesive. For example, after the adhesive is applied to the outer surface (133a) of the protrusion (133) or the inner surface (112a) of the receiving portion (112), the protrusion (133) is inserted into the receiving portion (112). During the insertion process, the adhesive is uniformly distributed between the outer surface (133a) of the protrusion (133) and the inner surface (112a) of the receiving portion (112). As the adhesive, epoxy resin, acrylic adhesive, urethane adhesive, etc., may be used.

[0055] When the adhesive hardens, the intermediate plate (130) and the base plate (110) are firmly joined. Additionally, the space between the outer surface (133a) of the protrusion (133) and the inner surface (112a) of the receiving portion (112) is sealed, thereby isolating the vacuum induction space (160) from the outside.

[0056] Conventionally, in order to form a curved surface on the adsorption surface of the elastic part of a collet, a basic shape is obtained through thermal compression molding in a collet mold, and then the curved surface is formed through post-processing such as polishing. At this time, an alignment error (Off-center) may occur between the center axis of the collet and the highest point of the curved surface during post-processing, which is a cause of unsuitability for bonding processes requiring high precision. In contrast, the elastic part (150) of the collet assembly (100) of the present disclosure is manufactured with a mold having a surface corresponding to a dome shape, so the highest point (152a) of the dome shape of the elastic part (150) and the center axis (C) can be aligned with only the molding process. Specifically, a dome shape is formed on the adsorption surface (152) of the elastic part (150) through the concave molding surface (311) of the upper mold (310), and the highest point (152a) of the dome shape is formed to be accurately positioned on the central axis (C) of the collet assembly (100) (see FIG. 3). This provides high precision during the bonding process of a semiconductor chip using the collet assembly (100).

[0057] Although the technical concept of the present disclosure has been described by some embodiments and examples illustrated in the accompanying drawings, it should be understood that various substitutions, modifications, and changes may be made without departing from the technical concept and scope of the present disclosure as understood by those skilled in the art to which the present disclosure pertains. Furthermore, such substitutions, modifications, and changes should be considered to fall within the scope of the appended claims. Explanation of the symbols

[0058] 100: Collet assembly, 110: Base plate, 130: Intermediate plate, 150: Elastic part, 160: Vacuum induction space, 200: Collet holder, 310: Upper die, 320: Lower die, 330: Pin

Claims

Claim 1 A collet assembly configured to be mounted on a collet holder, comprising: a base plate having a base hole formed through it that communicates with a vacuum hole of the collet holder; an intermediate plate coupled to the lower side of the base plate and having a plurality of intermediate holes formed through it; and an elastic part coupled to the lower side of the intermediate plate and having a plurality of adsorption holes formed through it that are arranged to form a vertical line with the plurality of intermediate holes and communicate with each other, wherein a vacuum induction space communicating with the base hole and the plurality of intermediate holes is formed between the base plate and the intermediate plate. Claim 2 A collet assembly having, in claim 1, an elastic part having a downwardly convex dome-shaped surface on its lower surface. Claim 3 In paragraph 2, the surface of the dome shape is a collet assembly defined by a surface inclined upward from the highest point of the dome shape to the edge of the dome shape. Claim 4 In claim 1, the base plate and the intermediate plate are made of metal material, forming a collet assembly. Claim 5 A collet assembly according to claim 1, wherein the intermediate plate includes a protrusion protruding upwardly on the upper surface, the base plate includes a receiving portion on the lower surface that receives the protrusion, and the vacuum induction space is formed between the upper surface of the protrusion and the lower surface of the receiving portion. Claim 6 A collet assembly according to claim 5, wherein the outer surface of the protrusion and the inner surface of the receiving portion are sealed by an adhesive. Claim 7 A collet unit comprising: a collet holder including a vacuum hole; a base plate configured to be mounted on the collet holder and having a base hole formed through it that communicates with the vacuum hole; an intermediate plate coupled to the lower side of the base plate and having a plurality of intermediate holes formed through it; and an elastic part coupled to the lower side of the intermediate plate and having a plurality of adsorption holes formed through it that communicate with each of the intermediate holes and arranged to be in the same vertical line as the plurality of intermediate holes, wherein a vacuum induction space communicating with the base hole and the plurality of intermediate holes is formed between the base plate and the intermediate plate. Claim 8 A method for manufacturing a collet assembly configured to be mounted in a collet holder, comprising: a step of placing an intermediate plate in a lower mold such that a plurality of pins provided in the lower mold each penetrate a plurality of intermediate holes formed in the intermediate plate; a step of positioning an elastic body on the upper part of the intermediate plate; a step of compression molding the elastic body using an upper mold to form an elastic part on the intermediate plate having a plurality of adsorption holes formed by the plurality of pins corresponding to the plurality of intermediate holes; and a step of combining the assembly of the intermediate plate and the elastic part with a base plate having a base hole formed therein to form a collet assembly including a vacuum induction space between the base plate and the intermediate plate. Claim 9 A method for manufacturing a collet assembly according to claim 8, wherein the upper mold has a molding surface for forming a dome-shaped surface convex toward the upper mold on the elastic part.

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