Display device and method for manufacturing of the same

Abstract

A display device according to one embodiment comprises a first display substrate including a light-emitting element layer, a second display substrate facing the first display substrate and including a light-blocking member and a color conversion layer, a coupling member for coupling the first display substrate and the second display substrate, and a filling member filled between the first display substrate and the second display substrate, wherein the filling member includes a photoinitiator that is initiated by absorbing light in a wavelength band of 380 nm to 500 nm, and the light-blocking member and the color conversion layer cover the entire surface of the second display substrate facing the first display substrate.

Description

Technology Field

[0001] The present invention relates to a display device and a method for manufacturing the same. Background Technology

[0002] The importance of display devices is increasing along with the development of multimedia. In response to this, various types of display devices, such as Organic Light Emitting Displays (OLEDs) and Liquid Crystal Displays (LCDs), are being used.

[0003] A device for displaying images of a display device includes a display panel such as an organic light-emitting display panel or a liquid crystal display panel. Among these, as a light-emitting display panel, it may include a light-emitting element; for example, in the case of a light-emitting diode (LED), there are organic light-emitting diodes (OLEDs) that use organic materials as light-emitting materials and inorganic light-emitting diodes that use inorganic materials as light-emitting materials. The problem to be solved

[0004] The problem that the present invention aims to solve is to provide a display device and a method for manufacturing the same, in which the curing of the filling member is facilitated by using a photocurable filling member.

[0005] The problems of the present invention are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art from the description below. means of solving the problem

[0006] A display device according to one embodiment for solving the above problem comprises a first display substrate including a light-emitting element layer, a second display substrate facing the first display substrate and including a light-blocking member and a color conversion layer, a coupling member for coupling the first display substrate and the second display substrate, and a filling member filled between the first display substrate and the second display substrate, wherein the filling member includes a photoinitiator that is initiated by absorbing light in a wavelength band of 380 nm to 500 nm, and the light-blocking member and the color conversion layer can cover the entire surface of the second display substrate facing the first display substrate.

[0007] The above-mentioned filling member may include an acrylate-based monomer, the above-mentioned photoinitiator, and a crosslinking agent.

[0008] The above photoinitiator may include one or more selected from the group consisting of diphenyl-(2,4,6-trimethylbenzoyl)-phosphine oxide (TPO), lucirin-diphenyl-(2,4,6-trimethylbenzoyl)-phosphine oxide (LTPO), bis-(4-methoxybenzoyl)diethylgermanium (Ivocerin), camphorquinone (CQ), and 1-phenyl-1,2-propanedione (PPD).

[0009] The refractive index of the above-mentioned filling member may be 1.5 to 1.7.

[0010] The light-emitting element layer can emit light in a wavelength range of 380 nm to 500 nm.

[0011] The light-emitting element layer emits white light, and the color conversion layer may include a color filter layer comprising at least a first color filter layer that transmits red light, a second color filter layer that transmits green light, and a third color filter layer that transmits blue light.

[0012] The color conversion layer comprises a wavelength conversion layer, a light-transmitting layer, and a color filter layer. The wavelength conversion layer comprises a first wavelength conversion pattern that converts blue light emitted from the light-emitting element layer into red light and a second wavelength conversion pattern that converts blue light emitted from the light-emitting element layer into green light. The color filter layer comprises a first color filter layer that overlaps with the first wavelength conversion pattern and transmits the red light, and a second color filter layer that overlaps with the second wavelength conversion pattern and transmits the green light. The light-transmitting layer does not overlap with the wavelength conversion layer and the color filter layer and can transmit the blue light emitted from the light-emitting element layer as is.

[0013] The color conversion layer comprises a wavelength conversion layer, a light-transmitting layer, and a color filter layer. The wavelength conversion layer comprises a first wavelength conversion pattern that converts blue light emitted from the light-emitting element layer into red light and a second wavelength conversion pattern that converts blue light emitted from the light-emitting element layer into green light. The color filter layer comprises a fourth color filter layer that overlaps with the first wavelength conversion pattern and the second wavelength conversion pattern and transmits the red light and the green light. The light-transmitting layer does not overlap with the wavelength conversion layer and the color filter layer and can transmit the blue light emitted from the light-emitting element layer as is.

[0014] The color conversion layer comprises a wavelength conversion layer, a light-transmitting layer, and a color filter layer. The wavelength conversion layer comprises a first wavelength conversion pattern that converts cyan light emitted from the light-emitting element layer into red light and a second wavelength conversion pattern that converts cyan light emitted from the light-emitting element layer into green light. The color filter layer comprises a first color filter layer that overlaps with the first wavelength conversion pattern and transmits the red light, a second color filter layer that overlaps with the second wavelength conversion pattern and transmits the green light, and a third color filter layer that transmits blue light from the cyan light emitted from the light-emitting element layer. The light-transmitting layer is disposed below the third color filter layer and can transmit the cyan light emitted from the light-emitting element layer as is.

[0015] The color conversion layer comprises a wavelength conversion layer, a light-transmitting layer, and a color filter layer. The wavelength conversion layer comprises a first wavelength conversion pattern that converts cyan light emitted from the light-emitting element layer into red light and a second wavelength conversion pattern that converts cyan light emitted from the light-emitting element layer into green light. The color filter layer comprises a fourth color filter layer that overlaps with the first wavelength conversion pattern and the second wavelength conversion pattern and transmits the red light and the green light. The light-transmitting layer does not overlap with the wavelength conversion layer and the color filter layer and can transmit the cyan light emitted from the light-emitting element layer as is.

[0016] The light-emitting element layer may include an organic light-emitting diode or an inorganic light-emitting diode.

[0017] In addition, a method for manufacturing a display device according to one embodiment may include the steps of: preparing a first display substrate including a light-emitting element layer; preparing a second display substrate including a light-blocking member and a color conversion layer; applying a bonding member and a filling member composition on the second display substrate; bonding the first display substrate and the second display substrate; and illuminating the light-emitting element layer and curing the filling member composition using light emitted from the light-emitting element layer to form a filling member.

[0018] The above-mentioned filling member composition may include an acrylate-based monomer, a crosslinking agent, and a photoinitiator that is initiated by absorbing light in the wavelength range of 380 nm to 500 nm.

[0019] The above photoinitiator may include one or more selected from the group consisting of diphenyl-(2,4,6-trimethylbenzoyl)-phosphine oxide (TPO), lucirin-diphenyl-(2,4,6-trimethylbenzoyl)-phosphine oxide (LTPO), bis-(4-methoxybenzoyl)diethylgermanium (Ivocerin), camphorquinone (CQ), and 1-phenyl-1,2-propanedione (PPD).

[0020] The content of the acrylate-based monomer may be 98% to 99.8% by weight of the entire filler composition, the content of the crosslinking agent may be 0.1% to 1% by weight of the entire filler composition, and the content of the photoinitiator may be 0.1% to 1% by weight of the entire filler composition.

[0021] The viscosity of the above-mentioned filling member composition may be 1 cp to 10 cp.

[0022] The refractive index of the above-mentioned filling member may be 1.5 to 1.7.

[0023] The light-emitting element layer can emit single-color light in a wavelength band of 380 nm to 500 nm.

[0024] The light-emitting element layer can emit any one of white light, blue light, or cyan light.

[0025] The method may further include a step of curing the bonding member by irradiating the bonding member with a separate light.

[0026] Specific details of other embodiments are included in the detailed description and drawings. Effects of the invention

[0027] According to the display device and the method for manufacturing the same according to the embodiments, a filling member comprising a photoinitiator that absorbs light in the wavelength range of 380 nm to 500 nm is formed, and the filling member can be photocured by light emitted from a light-emitting element layer within the display device. Therefore, there are no restrictions on equipment or processes when curing the filling member, and reliability issues of the light-emitting element that may occur during thermal curing can be prevented.

[0028] The effects according to the embodiments are not limited to those exemplified above, and a wider variety of effects are included in this specification. Brief explanation of the drawing

[0029] FIG. 1 is a plan view of a display device according to one embodiment. FIG. 2 is a schematic layout diagram showing wiring included in a display device according to one embodiment. FIG. 3 is an equivalent circuit diagram of a subpixel according to one embodiment. FIG. 4 is a cross-sectional view schematically showing a display device according to one embodiment. FIG. 5 is a cross-sectional view schematically showing a display device according to one embodiment. Figure 6 is a graph showing the absorption rates of photoinitiators by wavelength band. FIGS. 7 to 9 are cross-sectional views showing a method for manufacturing a display device according to one embodiment, by process. FIG. 10 is a cross-sectional view schematically illustrating an example of a display device according to another embodiment. FIG. 11 is a cross-sectional view schematically showing another example of a display device according to another embodiment. FIG. 12 is a cross-sectional view schematically illustrating an example of a display device according to another embodiment. FIG. 13 is a cross-sectional view schematically showing another example of a display device according to another embodiment. FIG. 14 is a cross-sectional view schematically showing a display device according to another embodiment. FIG. 15 is a perspective view schematically showing a light-emitting element of a display device according to another embodiment. Specific details for implementing the invention

[0030] The advantages and features of the present invention and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims.

[0031] When elements or layers are referred to as being "on" another element or layer, this includes cases where another layer or element is interposed directly on or in the middle of another element. Throughout the specification, the same reference numerals refer to the same components. Shapes, sizes, ratios, angles, numbers, etc., disclosed in the drawings for describing embodiments are exemplary and therefore the invention is not limited to the depicted details.

[0032] Although terms such as "first," "second," etc., are used to describe various components, it goes without saying that these components are not limited by these terms. These terms are used merely to distinguish one component from another. Therefore, it goes without saying that the first component mentioned below may also be the second component within the technical scope of the present invention.

[0033] The features of each of the various embodiments of the present invention may be combined or combined with one another, either partially or wholly, and may technically enable various interlocking and operation. Each embodiment may be implemented independently of one another or may be implemented together in an associated relationship.

[0034] Specific embodiments will be described below with reference to the attached drawings.

[0035] FIG. 1 is a plan view of a display device according to one embodiment.

[0036] Referring to FIG. 1, a display device (1) according to one embodiment can be applied to various home appliances or Internet of Things devices such as smartphones, mobile phones, tablet PCs, PDAs (Personal Digital Assistants), PMPs (Portable Multimedia Players), televisions, game consoles, wristwatch-type electronic devices, head-mounted displays, monitors of personal computers, laptop computers, car navigation systems, car dashboards, digital cameras, camcorders, external billboards, electronic display boards, medical devices, inspection devices, refrigerators and washing machines, etc. In this specification, a television is described as an example of a display device, and the TV may have high resolution or ultra-high resolution such as HD, UHD, 4K, 8K, etc.

[0037] Additionally, the display device (1) according to the embodiments may be classified in various ways depending on the display method. For example, the classification of display devices may include organic light-emitting display devices (OLED), inorganic light-emitting display devices (inorganic EL), quantum dot light-emitting display devices (QED), micro-LED display devices (micro-LED), nano-LED display devices (nano-LED), plasma display devices (PDP), field emission display devices (FED), cathode ray display devices (CRT), liquid crystal display devices (LCD), electrophoretic display devices (EPD), etc. In the following description, organic light-emitting display devices and inorganic light-emitting display devices are used as examples of display devices, and unless a special distinction is required, the display devices applied to the embodiments will be simply abbreviated as "display devices." However, the embodiments are not limited to organic light-emitting display devices or inorganic light-emitting display devices, and other display devices listed above or known in the art field may be applied within the scope of sharing the technical concept.

[0038] A display device (1) according to one embodiment may have a square shape in a plan view, for example, and may have a rectangular shape. If the display device (1) is a television, it is positioned so that the long side is located in the horizontal direction. However, it is not limited thereto, and the long side may be located in the vertical direction, and it may be installed to be rotatable so that the long side is variably positioned in the horizontal or vertical direction.

[0039] The display device (1) may include a display area (DPA) and a non-display area (NDA). The display area (DPA) may be an active area where an image is displayed. The display area (DPA) may have a rectangular shape in a plan view similar to the overall shape of the display device (1), but is not limited thereto.

[0040] The display area (DPA) may include a plurality of pixels (PX). The plurality of pixels (PX) may be arranged in a matrix direction. The shape of each pixel (PX) may be a rectangle or a square in a planar view, but is not limited thereto, and may be a rhombus shape with each side tilted toward one side direction of the display device (1). The plurality of pixels (PX) may include multiple color pixels (PX). For example, the plurality of pixels (PX) may include a first color pixel (PX) of red, a second color pixel (PX) of green, and a third color pixel (PX) of blue, though is not limited thereto. Each color pixel (PX) may be a stripe type or a pentile type. TM It can be arranged alternately as a type.

[0041] A non-display area (NDA) may be placed around a display area (DPA). The non-display area (NDA) may surround the display area (DPA) in whole or in part. The display area (DPA) is rectangular in shape, and the non-display area (NDA) may be placed adjacent to the four sides of the display area (DPA). The non-display area (NDA) may form the bezel of the display device (1).

[0042] A driving circuit or driving element for driving a display area (DPA) may be disposed in a non-display area (NDA). In one embodiment, a pad portion is provided on the display substrate of the display device (1) in a first non-display area (NDA) disposed adjacent to the first long side (lower side in FIG. 1) and a second non-display area (NDA) disposed adjacent to the second long side (upper side in FIG. 1), and an external device (EXD) may be mounted on the pad electrode of the pad portion. Examples of the external device (EXD) include a connecting film, a printed circuit board, a driving chip (DIC), a connector, a wiring connecting film, etc. A scan driving unit (SDR), etc., directly formed on the display substrate of the display device (1) may be disposed in a third non-display area (NDA) disposed adjacent to the first short side (left side in FIG. 1).

[0043] FIG. 2 is a schematic layout diagram showing wiring included in a display device according to one embodiment.

[0044] Referring to FIG. 2, the display device (1) may include a plurality of wires. The plurality of wires may include a scan line (SCL), a sensing line (SSL), a data line (DTL), an initial voltage wire (VIL), a first voltage wire (VDL), and a second voltage wire (VSL). Additionally, although not shown in the drawing, other wires may be arranged in the display device (1).

[0045] Scan line (SCL) and sensing line (SSL) may be extended in a first direction (DR1). Scan line (SCL) and sensing line (SSL) may be connected to a scan driver (SDR). The scan driver (SDR) may include a driving circuit. The scan driver (SDR) may be positioned on one side of the first direction (DR1) of the display area (DPA), but is not limited thereto. The scan driver (SDR) is connected to a signal connection wire (CWL), and at least one end of the signal connection wire (CWL) may be connected to an external device by forming a pad (WPD_CW) on the non-display area (NDA).

[0046] Meanwhile, in this specification, the meaning of "connection" may refer not only to one component being connected to another through mutual physical contact, but also to being connected through another component. Furthermore, this can be understood as one part and another part being interconnected due to the integrated component. Moreover, the connection between one component and another component may be interpreted to include electrical connection through another component in addition to direct contact.

[0047] The data line (DTL) and the initial voltage line (VIL) may extend into a second direction (DR2) that intersects the first direction (DR1). The initial voltage line (VIL) may further include a portion branched from the portion extended into the second direction (DR2) into the first direction (DR1). The first voltage line (VDL) and the second voltage line (VSL) may also include a portion extending into the second direction (DR2) and a portion connected thereto that extends into the first direction (DR1). The first voltage line (VDL) and the second voltage line (VSL) may have a mesh structure, but are not limited thereto. Although not shown in the drawing, each pixel (PX) of the display device (1) may be connected to at least one data line (DTL), an initial voltage line (VIL), a first voltage line (VDL), and a second voltage line (VSL).

[0048] Data line (DTL), initial voltage line (VIL), first voltage line (VDL), and second voltage line (VSL) may be electrically connected to at least one wiring pad (WPD). Each wiring pad (WPD) may be placed in a non-display area (NDA). In one embodiment, the wiring pad of the data line (DTL) (WPD_DT, hereinafter referred to as 'data pad') is placed in a pad area (PDA) on one side of the second direction (DR2) of the display area (DPA), and the wiring pad of the initial voltage line (VIL) (WPD_Vint, hereinafter referred to as 'initial voltage pad'), the wiring pad of the first voltage line (VDL) (WPD_VDD, hereinafter referred to as 'first power pad'), and the wiring pad of the second voltage line (VSL) (WPD_VSS, hereinafter referred to as 'second power pad') may be placed in a pad area (PDA) located on the other side of the second direction (DR2) of the display area (DPA). As another example, the data pad (WPD_DT), initialization voltage pad (WPD_Vint), first power pad (WPD_VDD), and second power pad (WPD_VSS) may all be placed in the same area, for instance, in a non-display area (NDA) located above the display area (DPA). An external device (EXD) may be mounted on the wiring pad (WPD). The external device (EXD) may be mounted on the wiring pad (WPD) through an anisotropic conductive film, ultrasonic bonding, etc.

[0049] Each pixel (PX) or subpixel (PXn, where n is an integer from 1 to 3) of the display device (1) includes a pixel driving circuit. The wiring described above may pass through each pixel (PX) or around it and apply a driving signal to each pixel driving circuit. The pixel driving circuit may include transistors and capacitors. The number of transistors and capacitors in each pixel driving circuit may vary. According to one embodiment, each subpixel (SPXn) of the display device (1) may have a pixel driving circuit with a 3T1C structure that includes three transistors and one capacitor. Hereinafter, the pixel driving circuit is described using the 3T1C structure as an example, but is not limited thereto, and various other modified pixel (PX) structures such as 2T1C structure, 7T1C structure, and 6T1C structure may be applied.

[0050] FIG. 3 is an equivalent circuit diagram of a subpixel according to one embodiment.

[0051] Referring to FIG. 3, each subpixel (SPX) of a display device (1) according to one embodiment includes, in addition to a light-emitting element (LE), three transistors (DTR, STR1, STR2) and one storage capacitor (CST).

[0052] The light-emitting element (LE) emits light according to the current supplied through the driving transistor (DTR). The light-emitting element (LE) can be implemented as an inorganic light-emitting diode, an organic light-emitting diode, a micro light-emitting diode, a nano light-emitting diode, etc.

[0053] The first electrode (i.e., anode electrode) of the light-emitting element (LE) is connected to the source electrode of the driving transistor (DTR), and the second electrode (i.e., cathode electrode) can be connected to a second power line (ELVSL) to which a low potential voltage (second power voltage) lower than the high potential voltage (first power voltage) of the first power line (ELVDL) is supplied.

[0054] The driving transistor (DTR) adjusts the current flowing from the first power line (ELVDL), to which the first power supply voltage is supplied, to the light-emitting element (LE) according to the voltage difference between the gate electrode and the source electrode. The gate electrode of the driving transistor (DTR) is connected to the first electrode of the first transistor (STR1), the source electrode is connected to the first electrode of the light-emitting element (LE), and the drain electrode can be connected to the first power line (ELVDL), to which the first power supply voltage is applied.

[0055] The first transistor (STR1) is turned on by a scan signal of the scan line (SCL) to connect the data line (DTL) to the gate electrode of the driving transistor (DTR). The gate electrode of the first transistor (STR1) is connected to the scan line (SCL), the first electrode is connected to the gate electrode of the driving transistor (DTR), and the second electrode can be connected to the data line (DTL).

[0056] The second transistor (STR2) is turned on by the sensing signal of the sensing signal line (SSL) to connect the initialization voltage line (VIL) to the source electrode of the driving transistor (DTR). The gate electrode of the second transistor (STR2) is connected to the sensing signal line (SSL), the first electrode is connected to the initialization voltage line (VIL), and the second electrode can be connected to the source electrode of the driving transistor (DTR).

[0057] In one embodiment, the first electrode of each of the first and second transistors (STR1, STR2) may be a source electrode and the second electrode may be a drain electrode, but is not limited thereto and may be the opposite case.

[0058] A capacitor (CST) is formed between the gate electrode and the source electrode of the driving transistor (DTR). The storage capacitor (CST) stores the voltage difference between the gate voltage and the source voltage of the driving transistor (DTR).

[0059] The driving transistor (DTR) and the first and second transistors (STR1, STR2) can be formed as thin film transistors. Additionally, while FIG. 3 describes the driving transistor (DTR) and the first and second switching transistors (STR1, STR2) as N-type MOSFETs (Metal Oxide Semiconductor Field Effect Transistors), it is not limited thereto. That is, the driving transistor (DTR) and the first and second switching transistors (STR1, STR2) may be P-type MOSFETs, or some may be N-type MOSFETs and others P-type MOSFETs.

[0060] FIG. 4 is a cross-sectional view schematically showing a display device according to one embodiment.

[0061] Referring to FIG. 4, a display device (1) according to one embodiment may include a first display substrate (100), a second display substrate (200) facing the first display substrate (100), a bonding member (SM) that bonds the first display substrate (100) and the second display substrate (200), and a filling member (300) filled between the first display substrate (100) and the second display substrate (200).

[0062] The first display substrate (100) may include a first substrate (110), a circuit layer (120), and a light-emitting element layer (LEL). The first substrate (110) may be an insulating substrate. The first substrate (110) may include a transparent material. For example, the first substrate (110) may include a transparent insulating material such as glass, quartz, etc. The first substrate (110) may be a rigid substrate. However, the first substrate (110) is not limited thereto and may include a plastic such as polyimide, etc., and may have flexible characteristics that allow it to be bent, folded, or rolled.

[0063] The circuit layer (120) drives each subpixel and can be disposed on the first substrate (110). The circuit layer (120) can be disposed between the first substrate (110) and the light-emitting element layer (LEL). The light-emitting element layer (LEL) can be disposed on the circuit layer (120). The description of the light-emitting element layer (LEL) and the circuit layer (120) has been described above and will be omitted.

[0064] The second display substrate (200) may include a second substrate (210), a light-blocking member (BML), and a color conversion layer (CCL). The second substrate (210) may be identical to the first substrate (110) described above.

[0065] A color conversion layer (CCL) may be disposed on one side of a second substrate (210) facing a first substrate (110). The color conversion layer (CCL) can convert, transmit, or block the wavelength of light emitted from a light-emitting element layer (LEL) to convert it into light of a desired wavelength band. The color conversion layer (CCL) may include a wavelength conversion member comprising a color filter and / or quantum dots.

[0066] A light-blocking member (BML) may be placed between color conversion layers (CCL) corresponding to the boundaries of each subpixel of the first substrate (110). Additionally, the light-blocking member (BML) may be placed in areas that partially correspond to the light-emitting element layer (LEL) and do not overlap with the light-emitting element layer (LEL). One side of the second substrate (210) facing the first substrate (110) may be entirely covered by the aforementioned color conversion layers (CCL) and light-blocking member (BML).

[0067] A bonding member (SM) may be placed between the first substrate (110) and the second substrate (210). The bonding member (SM) may be placed in a non-display area (NDA in FIG. 1) other than the display area (DPA in FIG. 1) where light is emitted. The bonding member (SM) may be placed to surround the display area to bond and bond the first substrate (110) and the second substrate (210).

[0068] The filling member (300) may be placed between the first display substrate (100) and the second display substrate (200). The filling member (300) may fill the space between the first display substrate (100) and the second display substrate (200) and serve to bond and bond them together. Additionally, the filling member (300) may minimize the difference in refractive index between the first display substrate (100) and the second display substrate (200) and prevent the penetration of moisture.

[0069] The above-described filling member (300) can be manufactured by applying it onto a first display substrate (100) or a second display substrate (200), bonding the first display substrate (100) and the second display substrate (200), and then curing it. The filling member (300) includes resin, and to cure this resin, a method of thermal curing or photocuring may be considered. Among these, as a method of curing the filling member (300) using photocuring, light can be irradiated from the bottom of the first display substrate (100) or from the top of the second display substrate (200). However, when light is irradiated from the bottom of the first display substrate (100), it is difficult for UV light to pass through due to the many wires of the circuit layer (120), and when light is irradiated from the top of the second display substrate (200), the light-blocking member (BML) and the color conversion layer (CCL) block the light, so consequently, it is difficult to irradiate UV light from both directions. In addition, in the case of a curing method for a filling member (300) using thermal curing, there is a concern that the heat may damage the light-emitting element layer (LEL), so the selection of temperature is limited, and if the heat is not evenly transferred, the uniformity of curing may decrease. Hereinafter, in one embodiment, a display device (1) capable of photocuring of a filling member (300) is disclosed.

[0070] FIG. 5 is a schematic cross-sectional view of a display device according to one embodiment. FIG. 6 is a graph showing the absorption rates of photoinitiators by wavelength band. FIG. 5 illustrates an embodiment in which the light-emitting element layer (LEL) includes an organic light-emitting diode.

[0071] Referring to FIG. 5, a top-emission type display device (1) is illustrated in which light (L) is emitted in the opposite direction (towards the second substrate (210)) rather than in the direction of the first substrate (110) on which the light-emitting layer (EML) is formed. However, it is not limited thereto, and it may be a bottom-emission type display device (1) on which light is emitted in the direction of the first substrate (110) on which the light-emitting layer (EML) is formed, or a double-sided light-emitting type display device (1) on which light is emitted in both directions of the first substrate (110) and the second substrate (210).

[0072] The display device (1) may include a first display substrate (100), a second display substrate (200) facing the first display substrate (100), a filling member (300), and a coupling member (SM).

[0073] The first display substrate (100) may include a first substrate (110), a circuit layer (120), and a light-emitting element layer (LEL). The circuit layer (120) may be positioned across a display area (DPA) and a non-display area (NDA), and the light-emitting element layer (LEL) may be positioned in the display area (DPA). The first substrate (110) and the circuit layer (120) have been described above, so a description is omitted.

[0074] A light-emitting element layer (LEL) may be disposed on a circuit layer (120). The light-emitting element layer (LEL) may include a pixel electrode (PXE), a light-emitting layer (EML), and a common electrode (CME).

[0075] Multiple pixel electrodes (PXE) may be arranged for each subpixel. The pixel electrodes (PXE) of adjacent subpixels may be separated from each other. The pixel electrode (PXE) may be a first electrode of a light-emitting diode, for example, an anode electrode. The pixel electrode (PXE) may have a stacked film structure in which a layer of a material with a high work function such as indium-tin-oxide (ITO), indium-zinc-oxide (IZO), zinc oxide (ZnO), or indium oxide (In2O3) is stacked with a layer of a reflective material such as silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), lead (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), or a mixture thereof is stacked. A material layer with a high work function can be positioned above the reflective material layer and close to the emissive layer (EML). The pixel electrode (PXE) may have a multilayer structure of ITO / Mg, ITO / MgF, ITO / Ag, or ITO / Ag / ITO, but is not limited thereto.

[0076] A pixel defining film (PDL) may be disposed along the boundary of a subpixel on one side of a first substrate (110). The pixel defining film (PDL) is disposed on a pixel electrode (PXE) and may include an opening that exposes the pixel electrode (PXE). A light-emitting region (EMA) and a non-light-emitting region (NEM) may be separated by the pixel defining film (PDL) and the opening. The pixel defining film (PDL) may include an organic insulating material such as polyacrylates resin, epoxy resin, phenolic resin, polyamides resin, polyimides resin, unsaturated polyesters resin, polyphenylene ethers resin, polyphenylenesulfides resin, or benzocyclobutene (BCB). The pixel defining film (PDL) may also include an inorganic material.

[0077] A light-emitting layer (EML) may be disposed on a pixel electrode (PXE) exposed by a pixel defining film (PDL). In one embodiment where the display device (1) is an organic light-emitting display device, the light-emitting layer (EML) may include an organic layer containing an organic material. The organic layer includes an organic light-emitting layer and, in some cases, may further include at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer as an auxiliary layer that assists in light emission.

[0078] In some embodiments, the light-emitting layer (EML) may have a tandem structure comprising a plurality of organic light-emitting layers overlapped in the thickness direction and a charge-generating layer disposed between them. Each overlapped organic light-emitting layer may emit light of the same wavelength, but may also emit light of different wavelengths. At least some of the layers of the light-emitting layer (EML) of each pixel (PX) may be separated from the same layer of an adjacent pixel (PX).

[0079] In one embodiment, the wavelength of light emitted by each light-emitting layer (EML) may be the same for each subpixel. For example, the light-emitting layer (EML) of each color pixel (PX) emits white light, and the color control structure described below includes a color conversion layer (CCL), thereby allowing the color of each subpixel to be displayed. For example, the light-emitting layer (EML) may emit white light by stacking organic light-emitting layers that emit blue and yellow light.

[0080] A common electrode (CME) may be disposed on the light-emitting layer (EML). The common electrode (CME) may be in contact not only with the light-emitting layer (EML) but also with the upper surface of the pixel defining film (PDL). The common electrode (CME) may be connected without distinction between each subpixel. The common electrode (CME) may be a front electrode disposed across the entire surface. The common electrode (CME) may be a second electrode of the light-emitting diode, for example, a cathode electrode.

[0081] The common electrode (CME) may include a layer of material with a low work function, such as Li, Ca, LiF / Ca, LiF / Al, Al, Mg, Ag, Pt, Pd, Ni, Au, Nd, Ir, Cr, BaF, Ba, or compounds or mixtures thereof (e.g., a mixture of Ag and Mg). The common electrode (CME) may further include a transparent metal oxide layer disposed on the layer of material with a low work function.

[0082] The pixel electrode (PXE), the light-emitting layer (EML), and the common electrode (CME) can form a light-emitting element layer (LEL). Light emitted from the light-emitting layer (EML) can be emitted upward through the common electrode (CME).

[0083] A thin film encapsulation structure (170) may be disposed on the upper portion of the common electrode (CME). The thin film encapsulation structure (170) may include at least one thin film encapsulation layer. For example, the thin film encapsulation layer may include a first inorganic film (171), an organic film (172), and a second inorganic film (173). The first inorganic film (171) and the second inorganic film (173) may each include silicon nitride (SiNx), silicon oxide (SiOx), or silicon oxynitride (SiOxNy), etc. The organic film (172) may include an organic insulating material such as an acrylic resin (polyacrylates resin), an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, an unsaturated polyester resin, a polyphenylene ethers resin, a polyphenylene sulfide resin, or benzocyclobutene (BCB).

[0084] The second display substrate (200) may be positioned opposite to the thin film encapsulation structure (170) on the upper side. The second display substrate (200) may include a second substrate (210) and a color conversion layer (CCL). The second substrate (210) may include a transparent insulating material such as glass, quartz, etc. The second substrate (210) may be a rigid substrate. However, the second substrate (210) is not limited thereto, and the second substrate (210) may include a plastic such as polyimide, etc., and may have flexible properties that allow it to be bent, folded, or rolled.

[0085] The second substrate (210) may be the same substrate as the first substrate (110), but may differ in material, thickness, transmittance, etc. For example, the second substrate (210) may have a higher transmittance than the first substrate (110). The second substrate (210) may be thicker than the first substrate (110) or thinner than it.

[0086] A light-blocking member (BML) may be disposed along the boundary of a subpixel on one side of a second substrate (210) facing the first substrate (110). The light-blocking member (BML) may overlap with the pixel defining film (PDL) of the first display substrate (100) and may be located in a non-emissive region (NEM). The light-blocking member (BML) may include an opening that exposes one side of the second substrate (210) that overlaps with an emissive region (EMA). The light-blocking member (BML) may be formed in a grid shape in a planar view.

[0087] The light-blocking element (BML) may be composed of organic materials. The light-blocking element (BML) can reduce color distortion caused by external light reflection by absorbing external light. Additionally, the light-blocking element (BML) can serve to prevent light emitted from the light-emitting layer (EML) from intruding into adjacent subpixels.

[0088] In one embodiment, the light-blocking member (BML) can absorb all visible light wavelengths. The light-blocking member (BML) may include a light-absorbing material. For example, the light-blocking member (BML) may be made of a material used as a black matrix of the display device (1).

[0089] A color filter layer (CFL) may be disposed as a color conversion layer on one side of a second substrate (210) on which a light-blocking member (BML) is disposed. The color filter layer (CFL) may be disposed on one side of the second substrate (210) that is exposed through an opening of the light-blocking member (BML). Furthermore, the color filter layer (CFL) may also be partially disposed on an adjacent light-blocking member (BML). The color filter layer (CFL) may be disposed overlapping the display area (DPA), and the light-blocking member (BML) may be disposed across the display area (DPA) and the non-display area (NDA).

[0090] A color filter layer (CFL) may include a first color filter layer (CFL1), a second color filter layer (CFL2), and a third color filter layer (CFL3). Each color filter layer (CFL) may include a colorant, such as a dye or pigment, that absorbs wavelengths other than the corresponding color wavelength. The first color filter layer (CFL1) may be a red color filter layer, the second color filter layer (CFL2) may be a green color filter, and the third color filter layer (CFL3) may be a blue color filter layer. Although the drawing illustrates a case where adjacent color filter layers (CFLs) are spaced apart from each other on a light-blocking member (BML), adjacent color filter layers (CFLs) may overlap at least partially on the light-blocking member (BML). The color filter layer (CFL) illustrated in FIG. 5 may emit three types of light, red, green, and blue, respectively, through red, green, and blue color filter layers. However, it is not limited to this, and may further include a white transparent portion in which the white light of the light-emitting element layer (LEL) is emitted as is, thereby emitting four types of light: white, red, green, and blue.

[0091] The light-blocking member (BML) and the color-converting layer (CCL) described above can cover one side of the second substrate (210) entirely. For example, the light-blocking member (BML) and the color-converting layer (CCL) may be disposed on one side of the second substrate (210) corresponding to the light-emitting element layer (LEL) of the first substrate (110), and the light-blocking member (BML) may be disposed on the area of ​​one side of the second substrate (210) that does not overlap with the light-emitting element layer (LEL). As the light-blocking member (BML) and the color-converting layer (CCL) cover one side of the second substrate (210) corresponding to the first substrate (110), light irradiated from the outside is blocked or absorbed by the light-blocking member (BML) and the color-converting layer (CCL). In one embodiment, as described below, since light cannot be incident from the outside, the filling member (300) can be cured using the light emitted from the light-emitting element layer (LEL).

[0092] A first capping layer (220) may be disposed on the color filter layer (CFL). The first capping layer (220) can prevent impurities, such as moisture or air, from penetrating from the outside and damaging or contaminating the color filter layer (CFL). Additionally, the first capping layer (220) can prevent the pigment of the color filter layer (CFL) from spreading to other compositions.

[0093] The first capping layer (220) may be in direct contact with one side of the color filter layer (CFL). The first capping layer (220) may be made of an inorganic material. For example, the first capping layer (220) may be made of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide, silicon oxynitride, etc.

[0094] A bonding member (SM) may be disposed between the first display substrate (100) and the second display substrate (200). The bonding member (SM) may be disposed overlappingly in the non-display area (NDA) and may bond and bond the first display substrate (100) and the second display substrate (200) to each other. The bonding member (SM) may include, but is not limited to, a sealant containing organic material or a frit containing inorganic material.

[0095] A filling member (300) may be disposed between the first display substrate (100) and the second display substrate (200). The filling member (300) fills the space between the first display substrate (100) and the second display substrate (200), while also serving to bond and bond them together. The filling member (300) may be disposed across the display area (DPA) and the non-display area (NDA). The filling member (300) may be disposed between the thin film encapsulation structure (170) of the first display substrate (100) and the first capping layer (220) of the second display substrate (200).

[0096] The filling member (300) can be formed by applying a filling member composition to one surface of the first display substrate (100) or the second display substrate (200), aligning and bonding the first display substrate (100) and the second display substrate (200), and curing the filling member composition by irradiating light.

[0097] In one embodiment, the filling member (300) may include an acrylate-based monomer, a photoinitiator, and a crosslinking agent.

[0098] Acrylate monomers may include materials with low viscosity to facilitate coating, for example, having a viscosity of 5 cp or less. Acrylate monomers may include one or more selected from the group consisting of hydroxyethyl acrylate (HEA), hydroxyethyl methacrylate (HEMA), hexanediol diacrylate (HDDA), tripropylene glycol diacrylate (TPGDA), ethylene glycol diacrylate (EGDA), trimethylolpropane triacrylate (TMPTA), trimethylolpropane ethoxy triacrylate (TMPEOTA), glycerin propoxylated triacrylate (GPTA), pentaerythritol tetraacrylate (PETA), and dipentaerythritol hexaacrylate (DPHA). However, they are not limited thereto.

[0099] The photoinitiator may include a material capable of being initiated by absorbing light in the visible light wavelength band. In one embodiment, the filling member (300) can be cured using light emitted from the light-emitting element layer (LEL). To this end, the photoinitiator may include a material capable of being initiated by absorbing light in the wavelength band of 380 nm to 500 nm, which corresponds to the wavelength band of light emitted from the light-emitting element layer (LEL).

[0100] For example, the photoinitiator may comprise one or more selected from the group consisting of diphenyl-(2,4,6-trimethylbenzoyl)-phosphine oxide (TPO), lucirin-diphenyl-(2,4,6-trimethylbenzoyl)-phosphine oxide (LTPO), bis-(4-methoxybenzoyl)diethylgermanium (Ivocerin), camphorquinone (CQ), and 1-phenyl-1,2-propanedione (PPD), but is not limited thereto.

[0102]

[0103]

[0104] As shown in FIG. 6, the above-described photoinitiators can be initiated by absorbing light in the wavelength range of 380 nm to 500 nm.

[0105] A crosslinking agent can serve to polymerize acrylate monomers. The crosslinking agent may include, for example, one or more selected from the group consisting of cyanur chloride, trimethoyl chloride, terephthaloyl chloride, epichlorohydrin, dibromobenzene, glutaraldehyde, phenylene diisocyanate, tolylein diisocyanate, divinylsulfone, 1,1'-carbonyldiimidazole, and alkoxysilanes. However, it is not limited thereto.

[0106] The acrylate-based monomer included in the above-described filling member (300) may be included in an amount of 98% to 99.8% by weight of the total weight of the filling member composition, the photoinitiator may be included in an amount of 0.1% to 1% by weight of the total weight of the filling member composition, and the crosslinking agent may be included in an amount of 0.1% to 1% by weight of the total weight of the filling member composition.

[0107] When the acrylate-based monomer, photoinitiator, and crosslinking agent are each mixed within the above-mentioned content ranges, the filling member (300) can provide the viscosity required for the process and can have rigidity and adhesive strength capable of resisting external forces. The filling member composition for manufacturing the filling member (300) can have a viscosity of 1 cp to 10 cp to facilitate application.

[0108] Additionally, the filling member (300) may further include additives. The additives may include, for example, adhesion promoters, anti-yellowing agents, antioxidants, etc., but are not limited thereto.

[0109] The filling member (300) may have a refractive index of 1 or greater to minimize the difference in refractive index at the interfaces between the first display substrate (100) and the filling member (300) and between the filling member (300) and the second display substrate (200). In an exemplary embodiment, the refractive index of the filling member (300) may be 1.5 to 1.7.

[0110] The above-described filling member (300) can be photocured by irradiating it with light in the visible light wavelength range. In one embodiment, the filling member (300) can be cured using light emitted from the light-emitting element layer (LEL) of the first display substrate (100).

[0111] FIGS. 7 to 9 are cross-sectional views showing a method for manufacturing a display device according to one embodiment, by process. FIGS. 7 to 9 may correspond to the schematic diagram of the display device shown in FIG. 4.

[0112] Referring to FIG. 7, a second substrate (210) is prepared, and a light-blocking member (BML) and a color conversion layer (CCL) are formed on the second substrate (210). The light-blocking member (BML) can be formed by photolithography, and the color conversion layer (CCL) can be formed in areas partitioned by the light-blocking member (BML). The color conversion layer (CCL) can be formed by photolithography or inkjet. A bonding member (SM) is formed on the second substrate (210) on which the color conversion layer (CCL) and the light-blocking member (BML) are formed. The bonding member (SM) can be formed by inkjet printing, dispensing, screen printing, etc. The bonding member (SM) is formed on the light-blocking member (BML) and can be formed to surround the color conversion layer (CCL).

[0113] Next, referring to FIG. 8, a filling member (300) is formed on one side of a second substrate (210) on which a light-blocking member (BML), a color conversion layer (CCL), and a bonding member (SM) are formed. The filling member (300) can be formed by inkjet printing, dispensing, screen printing, etc. When the filling member (300) is applied, the bonding member (SM) acts as a dam to prevent the filling member (300) from overflowing.

[0114] Next, referring to FIG. 9, a first substrate (110) having a circuit layer (120) and a light-emitting element layer (LEL) formed thereon is prepared. The circuit layer (120) is formed on the first substrate (110) by a photolithography method, etc., and the light-emitting element layer (LEL) can be formed on the circuit layer (120) by a photolithography or inkjet method, etc. Additionally, an inspection pad (IPP) capable of performing a lighting inspection, etc., can be formed on the edge of the first substrate (110).

[0115] Next, the first substrate (110) and the second substrate (210) are aligned and bonded together. In this case, the first substrate (110) and the second substrate (210) can be aligned and bonded so that the light-emitting element layer (LEL) of the first substrate (110) and the color conversion layer (CCL) of the second substrate (210) face each other. The filling member (300) can be in contact with the circuit layer (120) and the light-emitting element layer (LEL) formed on the first substrate (110). The bonding member (SM) can be in contact with the circuit layer (120) formed on the first substrate (110).

[0116] Next, a signal is applied to the circuit layer (120) to drive the light-emitting element layer (LEL). The entire light-emitting element layer (LEL) can be driven to emit light. In an exemplary embodiment, the process of driving the light-emitting element layer (LEL) can be performed simultaneously with an inspection process, such as a lighting inspection of the display device (1). The inspection process can drive the entire light-emitting element layer (LEL) to emit light by applying a signal through the inspection pad (IPP) of the first substrate (110). The light-emitting element layer (LEL) can emit white light from the light-emitting layer. This white light can be irradiated onto a filling member (300) disposed on the light-emitting element layer (LEL) to photo-cur the filling member (300). As described above, the filling member (300) may include a photoinitiator that can be initiated by absorbing light in the wavelength range of 380 nm to 500 nm. Accordingly, the filling member (300) can be initiated and photocured by white light emitted from the light-emitting element layer (LEL).

[0117] Since the light emitted from the light-emitting element layer (LEL) is emitted to the side and top of the light-emitting element layer (LEL), it can be irradiated entirely onto the filling member (300) covering the light-emitting element layer (LEL). Since the photoinitiator included in the filling member (300) initiates the reaction with only 1 to 2 photons, the filling member (300) can be cured entirely without any incomplete curing.

[0118] Next, light is irradiated onto the bonding member (SM) to photo-cure the bonding member (SM). At this time, even if there is a partially uncured filling member (300) located far from the light-emitting element layer (LEL), it can be photo-cured together with the bonding member (SM) by the light irradiated onto the bonding member (SM). In this way, a display device (1) according to one embodiment can be manufactured.

[0119] As described above, a display device (1) according to one embodiment forms a filling member (300) comprising a photoinitiator that absorbs light in the wavelength range of 380 nm to 500 nm, and can photo-cur the filling member (300) with light emitted from a light-emitting element layer (LEL) within the display device (1). Accordingly, there are no restrictions on equipment or processes when curing the filling member (300), and reliability issues of the light-emitting element that may occur during thermal curing can be prevented.

[0120] Meanwhile, the display device (1) illustrated in FIGS. 4 and 5 discloses an embodiment in which white light is emitted from the light-emitting element layer (LEL). Below, embodiments in which blue light is emitted from the light-emitting element layer (LEL) of the display device (1) are disclosed.

[0121] FIG. 10 is a schematic cross-sectional view illustrating one example of a display device according to another embodiment. FIG. 11 is a schematic cross-sectional view illustrating another example of a display device according to another embodiment.

[0122] Referring to FIG. 10, this embodiment differs from the previously described embodiment in that the light-emitting element layer (LEL) emits blue light and the color conversion layer (CCL) further includes a light-transmitting layer (TPL) and a wavelength conversion layer (WCL). Below, descriptions that overlap with the previously described embodiment will be omitted, and the differences will be explained.

[0123] The display device (1) may include a first display substrate (100), a second display substrate (200) facing the first display substrate (100), a filling member (300), and a coupling member (SM).

[0124] The first display substrate (100) may include a first substrate (110), a circuit layer (120), and a light-emitting element layer (LEL). The light-emitting element layer (LEL) may include a pixel electrode (PXE), a light-emitting layer (EML), and a common electrode (CME).

[0125] In one embodiment, the wavelength of light emitted by each light-emitting layer (EML) may be the same for each subpixel. For example, the light-emitting layer (EML) of each subpixel emits blue light and can display the color for each subpixel through the color conversion layer (CCL) described later.

[0126] The second display substrate (200) may include a second substrate (210) and a color conversion layer (CCL). The color conversion layer (CCL) may include a color filter layer (CFL), a light-transmitting layer (TPL), and a wavelength conversion layer (WCL).

[0127] A color filter layer (CFL) may be disposed on one side of a second substrate (210) on which a light-blocking member (BML) is disposed. The color filter layer (CFL) may include a first color filter layer (CFL1) and a second color filter layer (CFL2). The first color filter layer (CFL1) may be a red color filter layer, and the second color filter layer (CFL2) may be a green color filter. In the drawing, a color filter layer is not disposed on a subpixel adjacent to the second color filter layer (CFL2), so that blue light emitted from the light-emitting element layer (LEL) can be transmitted as is without color conversion. Therefore, three types of light, such as red, green, and blue, can be emitted.

[0128] A first capping layer (220) may be disposed on a color filter layer (CFL), and a partition (PTL) may be disposed on the first capping layer (220). The partition (PTL) may be located in a non-emissive region (NEM). The partition (PTL) may be disposed to overlap with a light-blocking member (BML). The partition (PTL) may include an opening that exposes the color filter layer (CFL). The partition (PTL) may be made of a photosensitive organic material, but is not limited thereto. The partition (PTL) may further include a light-blocking material.

[0129] A wavelength conversion layer (WCL) and a light-transmitting layer (TPL) may be disposed within the space exposed by the opening of the partition wall (PTL). The wavelength conversion layer (WCL) and the light-transmitting layer (TPL) may be formed by an inkjet process using the partition wall (PTL) as a bank, but are not limited thereto. In one embodiment, the wavelength conversion layer (WCL) may include a first wavelength conversion pattern (WCL1) overlapping with a first color filter layer (CFL1), and a second wavelength conversion pattern (WCL2) overlapping with a second color filter layer (CFL2). A light-transmitting layer (TPL) may be disposed in a subpixel adjacent to the second wavelength conversion pattern (WCL2).

[0130] The first wavelength conversion pattern (WCL1) may include a first base resin (BRS1) and a first wavelength conversion material (WCP1) disposed within the first base resin (BRS1). The second wavelength conversion pattern (WCL2) may include a second base resin (BRS2) and a second wavelength conversion material (WCP2) disposed within the second base resin (BRS2). The light-transmitting layer (TPL) may include a third base resin (BRS3) and a scatterer (SCP) disposed within it.

[0131] The first to third base resins (BRS1, BRS2, ​​BRS3) may include a transparent organic material. For example, the first to third base resins (BRS1, BRS2, ​​BRS3) may be composed of an epoxy resin, an acrylic resin, a cardo resin, or an imide resin. The first to third base resins (BRS1, BRS2, ​​BRS3) may all be composed of the same material, but are not limited thereto.

[0132] The scattering body (SCP) may be a metal oxide particle or an organic particle. Examples of the metal oxide may include titanium oxide (TiO2), zirconium oxide (ZrO2), aluminum oxide (Al2O3), indium oxide (In2O3), zinc oxide (ZnO), or tin oxide (SnO2), and examples of the organic particle material may include acrylic resin or urethane resin.

[0133] The first wavelength conversion material (WCP1) may be a material that converts blue light into red light, and the second wavelength conversion material (WCP2) may be a material that converts blue light into green light. The first wavelength conversion material (WCP1) and the second wavelength conversion material (WCP2) may be quantum dots, quantum rods, phosphors, etc. The quantum dots may include group IV nanocrystals, group II-VI compound nanocrystals, group III-V compound nanocrystals, group IV-VI nanocrystals, or a combination thereof. The first wavelength conversion pattern (WCL1) and the second wavelength conversion pattern (WCL2) may further include a scatterer (SCP) that increases wavelength conversion efficiency.

[0134] The light-transmitting layer (TPL) transmits the blue light emitted from the light-emitting element layer (LEL) as is. The scattering agent (SCP) of the light-transmitting layer (TPL) can play a role in controlling the emission path of light emitted through the light-transmitting layer (TPL). The light-transmitting layer (TPL) may not contain wavelength conversion material.

[0135] A second capping layer (230) is disposed on the wavelength conversion layer (WCL), the light-transmitting layer (TPL), and the barrier (PTL). The second capping layer (230) may be made of an inorganic material. The second capping layer (230) may be made of a material selected from among the materials listed as the material of the first capping layer (220). The second capping layer (230) and the first capping layer (220) may be made of the same material, but are not limited thereto.

[0136] In one embodiment, blue light emitted from the light-emitting element layer (LEL) can be converted into red light in a first wavelength conversion pattern (WCL1) and emitted as red light through a first color filter layer (CFL1). Additionally, blue light emitted from the light-emitting element layer (LEL) can be converted into green light in a second wavelength conversion pattern (WCL2) and emitted as green light through a second color filter layer (CFL2). Furthermore, blue light emitted from the light-emitting element layer (LEL) can be emitted as is through a light-transmitting layer (TPL). Accordingly, the display device (1) can implement red, green, and blue light.

[0137] A coupling member (SM) and a filling member (300) may be disposed between the first display substrate (100) and the second display substrate (200). According to one embodiment, the filling member (300) may be photocured by blue light emitted from the light-emitting element layer (LEL) in the display device (1) by including a photoinitiator in the visible light wavelength band.

[0138] Referring to FIG. 11, a display device (1) according to another example may include a fourth color filter layer (CFL4) in which the color conversion layer (CCL) is a yellow color filter, unlike the embodiment of FIG. 10. The fourth color filter layer (CFL4) can prevent blue light from being mixed with red light and green light converted from the first wavelength conversion pattern (WCL1) and the second wavelength conversion pattern (WCL2).

[0139] In one embodiment, blue light emitted from the light-emitting element layer (LEL) can be converted into red light at the first wavelength conversion pattern (WCL1) and emitted as red light through the fourth color filter layer (CFL4). Additionally, blue light emitted from the light-emitting element layer (LEL) can be converted into green light at the second wavelength conversion pattern (WCL2) and emitted as green light through the fourth color filter layer (CFL4). Furthermore, blue light emitted from the light-emitting element layer (LEL) can be emitted as is through the light-transmitting layer (TPL). Accordingly, the display device (1) can implement red, green, and blue light.

[0140] Meanwhile, the light-emitting element layer (LEL) of the display device (1) may emit cyan light.

[0141] FIG. 12 is a schematic cross-sectional view illustrating one example of a display device according to another embodiment. FIG. 13 is a schematic cross-sectional view illustrating another example of a display device according to another embodiment.

[0142] Referring to FIG. 12, this embodiment differs from the embodiments of FIG. 10 and FIG. 11 described above in that the light-emitting element layer (LEL) emits cyan light and the color filter layer (CFL) of the color conversion layer (CCL) further includes a third color filter layer (CFL3). Below, descriptions that overlap with the embodiments described above will be omitted, and the differences will be explained.

[0143] The display device (1) may include a first display substrate (100), a second display substrate (200) facing the first display substrate (100), a filling member (300), and a coupling member (SM).

[0144] The first display substrate (100) may include a first substrate (110), a circuit layer (120), and a light-emitting element layer (LEL). The light-emitting element layer (LEL) may include a pixel electrode (PXE), a light-emitting layer (EML), and a common electrode (CME).

[0145] In one embodiment, the wavelength of light emitted by each light-emitting layer (EML) may be the same for each subpixel. For example, the light-emitting layer (EML) of each subpixel may emit cyan light and display the color of each subpixel through the color conversion layer (CCL) described later. The light-emitting layer (EML) may emit cyan light by stacking a blue organic light-emitting layer and a green organic light-emitting layer.

[0146] The second display substrate (200) may include a second substrate (210) and a color conversion layer (CCL). The color conversion layer (CCL) may include a color filter layer (CFL), a light-transmitting layer (TPL), and a wavelength conversion layer (WCL).

[0147] A color filter layer (CFL) may be disposed on one side of a second substrate (210) on which a light-blocking member (BML) is disposed. The color filter layer (CFL) may include a first color filter layer (CFL1), a second color filter layer (CFL2), and a third color filter layer (CFL3). The first color filter layer (CFL1) may be a red color filter layer, the second color filter layer (CFL2) may be a green color filter, and the third color filter layer (CFL3) may be a blue color filter.

[0148] A wavelength conversion layer (WCL) and a light-transmitting layer (TPL) may be disposed within the space exposed by the opening of the partition wall (PTL). The wavelength conversion layer (WCL) and the light-transmitting layer (TPL) may be formed by an inkjet process using the partition wall (PTL) as a bank, but are not limited thereto. In one embodiment, the wavelength conversion layer (WCL) may include a first wavelength conversion pattern (WCL1) overlapping with a first color filter layer (CFL1), a second wavelength conversion pattern (WCL2) overlapping with a second color filter layer (CFL2), and a light-transmitting layer (TPL) overlapping with a third color filter layer (CFL3).

[0149] In one embodiment, cyan light emitted from the light-emitting element layer (LEL) can be converted into red light in the first wavelength conversion pattern (WCL1) and emitted as red light through the first color filter layer (CFL1). Additionally, cyan light emitted from the light-emitting element layer (LEL) can be converted into green light in the second wavelength conversion pattern (WCL2) and emitted as green light through the second color filter layer (CFL2). Furthermore, cyan light emitted from the light-emitting element layer (LEL) passes through the light-transmitting layer (TPL) as is, but can be emitted as blue light through the third color filter layer (CFL3). Accordingly, the display device (1) can implement red, green, and blue light.

[0150] Referring to FIG. 13, a display device (1) according to another example may include a fourth color filter layer (CFL4) which is a yellow color filter, instead of the first color filter layer and the second color filter layer of the color filter layer (CFL), unlike the embodiment of FIG. 12. The fourth color filter layer (CFL4) can increase the color purity of the transmitted light.

[0151] In one embodiment, cyan light emitted from the light-emitting element layer (LEL) can be converted into red light in the first wavelength conversion pattern (WCL1) and emitted as red light through the fourth color filter layer (CFL4). Additionally, cyan light emitted from the light-emitting element layer (LEL) can be converted into green light in the second wavelength conversion pattern (WCL2) and emitted as green light through the fourth color filter layer (CFL4). Furthermore, cyan light emitted from the light-emitting element layer (LEL) can pass through the light-transmitting layer (TPL) and be emitted as blue light through the third color filter layer (CFL3). Thus, the display device (1) can implement red, green, and blue light.

[0152] Meanwhile, the above-described embodiments disclosed an example in which the light-emitting element layer (LEL) of the display device (1) is an organic light-emitting diode. Below, an example in which the light-emitting element layer (LEL) of the display device (1) is an inorganic light-emitting diode is disclosed.

[0153] FIG. 14 is a cross-sectional view schematically showing a display device according to another embodiment. FIG. 15 is a perspective view schematically showing a light-emitting element of a display device according to another embodiment.

[0154] Referring to FIGS. 14 and 15, this embodiment differs from the embodiments described above in that the light-emitting element layer (LEL) is an inorganic light-emitting diode. Hereinafter, descriptions that overlap with the embodiments described above will be omitted, and the differences will be explained.

[0155] A display device (1) according to one embodiment may have a light-emitting element layer (LEL) that includes an inorganic light-emitting diode. The light-emitting element layer (LEL) may include a plurality of sub-banks (410, 420), a plurality of electrodes (430, 440), a plurality of light-emitting elements (ED), a bank (480), a first insulating layer (450), and a plurality of connecting electrodes (460, 470) disposed on a circuit layer (120).

[0156] A plurality of sub-banks (410, 420) may be disposed on the circuit layer (120). The plurality of sub-banks (410, 420) may include a first sub-bank (410) and a second sub-bank (420) that are spaced apart from each other. The first sub-bank (410) and the second sub-bank (420) may have a shape that extends in a second direction (DR2). A plurality of light-emitting elements (ED) may be disposed between the first sub-bank (410) and the second sub-bank (420). They may be disposed in a plurality of sub-pixels.

[0157] A plurality of sub-banks (410, 420) may have a structure in which at least a portion protrudes with respect to the upper surface of the circuit layer (120). The protruding portion of the plurality of sub-banks (410, 420) may have an inclined side, and light emitted from the light-emitting element (ED) may be reflected from the electrode (430, 440) disposed on the plurality of sub-banks (410, 420) and emitted in an upward direction. However, not limited thereto, the plurality of sub-banks (410, 420) may have a shape of a semicircle or semi-ellipse with an outer surface that is curved. The plurality of sub-banks (410, 420) may include an organic insulating material such as polyimide (PI), but are not limited thereto.

[0158] A plurality of electrodes (430, 440) may be extended in a second direction (DR2) and placed in each subpixel, and may be spaced apart from each other in a first direction (DR1). A plurality of electrodes (430, 440) may be electrically connected to a light-emitting element (ED). A plurality of electrodes (430, 440) may be connected to a light-emitting element (ED) through a connecting electrode (460, 470) described later, and may transmit an electrical signal applied from the lower circuit layer (120) to the light-emitting element (ED).

[0159] A plurality of electrodes (430, 440) may include a first electrode (430) and a second electrode (440). The first electrode (430) may be placed on a first sub-bank (410), and the second electrode (440) may be placed on a second sub-bank (420). The first electrode (430) and the second electrode (440) may be placed on at least an inclined side of the sub-bank (410, 420). In one embodiment, the width measured in the first direction (DR1) of each of the plurality of electrodes (430, 440) may be greater than the width measured in the first direction (DR1) of each of the sub-banks (410, 420). The first electrode (430) and the second electrode (440) may be placed to cover at least one side of the sub-bank (410, 420) to reflect light emitted from the light-emitting element (ED). Light emitted from the light-emitting elements (EDs) can be reflected from the electrodes (430, 440) placed on the sub-bank (410, 420) and emitted in an upward direction.

[0160] Each electrode (430, 440) may include a highly reflective conductive material to reflect light emitted from a light-emitting device (ED). Each electrode (430, 440) may include a material with high reflectivity and conductivity. For example, each electrode (430, 440) may include aluminum (Al) or an alloy material including aluminum (Al), nickel (Ni), lanthanum (La), copper (Cu), etc. Additionally, it may include materials such as ITO, IZO, and ITZO, or have a structure in which these are stacked in one or more layers.

[0161] Each electrode (430, 440) is electrically connected to a light-emitting element (ED) through connecting electrodes (460, 470) described later, and each electrode (430, 440) can come into direct contact with the connecting electrodes (460, 470). Although not illustrated, the first electrode (430) and the second electrode (440) can be connected to the circuit layer (120) through contact holes. For example, the first electrode (430) may have a first power supply voltage applied to it, and the second electrode (440) may have a second power supply voltage applied to it.

[0162] The first insulating layer (450) may be disposed on a plurality of electrodes (430, 440). The first insulating layer (450) may expose at least a portion of each electrode (430, 440) on the plurality of electrodes (430, 440). Each exposed electrode (430, 440) may be connected to the connecting electrodes (460, 470) described later. The first insulating layer (450) may be made of an inorganic material.

[0163] The bank (480) may be placed on the first insulating layer (450). The bank (480) includes a portion extending in the first direction (DR1) and the second direction (DR2) and may surround each subpixel. The bank (480) may be placed overlapping with the non-luminous region (NEM). The bank (480) can prevent ink from overflowing into the surrounding luminous region when the luminous element (ED) described later is applied by an inkjet method.

[0164] A plurality of light-emitting elements (EDs) may be disposed on the first insulating layer (450). The light-emitting elements (EDs) may have a shape that extends in one direction and may be disposed such that the extended one direction is parallel to the first substrate (110). The light-emitting elements (EDs) may include a plurality of semiconductor layers disposed along the extended one direction, and the plurality of semiconductor layers may be sequentially disposed along a direction parallel to the upper surface of the first substrate (110). However, this is not limited thereto, and if the light-emitting elements (EDs) have a different structure, the plurality of semiconductor layers may be disposed in a direction perpendicular to the first substrate (110).

[0165] Multiple light-emitting elements (EDs) may be placed on electrodes (430, 440) spaced apart in a first direction (DR1) between sub-banks (410, 420). The light-emitting elements (EDs) may be placed such that at least one end is placed on either of the different electrodes (430, 440), or both ends are placed on the different electrodes (430, 440). The light-emitting elements (EDs) may be placed such that both ends are placed on the different electrodes (430, 440). The direction in which each electrode (430, 440) extends and the direction in which the light-emitting element (ED) extends may be arranged substantially perpendicularly. The light-emitting elements (EDs) may be spaced apart from each other along a second direction (DR2) in which each electrode (430, 440) extends and may be aligned substantially parallel to each other. However, this is not limited thereto, and the light-emitting element (ED) may be positioned obliquely in the direction in which each electrode (430, 440) is extended.

[0166] The light-emitting elements (EDs) may include semiconductor layers of the same material and emit light of the same wavelength band. For example, the light-emitting elements (EDs) may emit blue light. The light-emitting elements (EDs) may emit light of a specific wavelength band by contacting the connecting electrodes (460, 470) and receiving an electrical signal applied through the electrodes (430, 440).

[0167] As illustrated in FIG. 15, the light-emitting element (ED) may be a light-emitting diode, and specifically, the light-emitting element (ED) may be an inorganic light-emitting diode made of inorganic material having a size in the nanometer to micrometer range. The light-emitting element (ED) may be aligned between two electrodes that form polarity when an electric field is formed in a specific direction between the two electrodes facing each other.

[0168] A light-emitting element (ED) according to one embodiment may have a shape that extends in one direction. The light-emitting element (ED) may have a shape such as a cylinder, a rod, a wire, or a tube. However, the shape of the light-emitting element (ED) is not limited thereto, and the light-emitting element (ED) may have various shapes, such as a polygonal prism shape like a cube, a rectangular prism, or a hexagonal prism, or a shape that extends in one direction but has a partially inclined outer surface.

[0169] The light-emitting element (ED) may include a semiconductor layer doped with any type of conductivity impurity (e.g., p-type or n-type). The semiconductor layer may emit light of a specific wavelength range when an electrical signal applied from an external power source is transmitted. The light-emitting element (ED) may include a first semiconductor layer (31), a second semiconductor layer (32), a light-emitting layer (36), an electrode layer (37), and an insulating film (38).

[0170] The first semiconductor layer (31) may be an n-type semiconductor. The first semiconductor layer (31) may include a semiconductor material having the chemical formula AlxGayIn1-x-yN (0≤x≤1, 0≤y≤1, 0≤x+y≤1). For example, the first semiconductor layer (31) may be one or more of n-type doped AlGaInN, GaN, AlGaN, InGaN, AlN, and InN. The n-type dopant doped in the first semiconductor layer (31) may be Si, Ge, Sn, etc.

[0171] The second semiconductor layer (32) may be disposed on the first semiconductor layer (31) with the light-emitting layer (36) in between. The second semiconductor layer (32) may be a p-type semiconductor, and the second semiconductor layer (32) may include a semiconductor material having the chemical formula AlxGayIn1-x-yN (0≤x≤1, 0≤y≤1, 0≤x+y≤1). For example, the second semiconductor layer (32) may be one or more of p-type doped AlGaInN, GaN, AlGaN, InGaN, AlN, and InN. The p-type dopant doped in the second semiconductor layer (32) may be Mg, Zn, Ca, Sr, Ba, etc.

[0172] Meanwhile, the drawing shows the first semiconductor layer (31) and the second semiconductor layer (32) as being composed of a single layer, but is not limited thereto. Depending on the material of the light-emitting layer (36), the first semiconductor layer (31) and the second semiconductor layer (32) may further include a larger number of layers, such as a clad layer or a TSBR (Tensile strain barrier reducing) layer.

[0173] The light-emitting layer (36) may be disposed between the first semiconductor layer (31) and the second semiconductor layer (32). The light-emitting layer (36) may include a material having a single or multiple quantum well structure. If the light-emitting layer (36) includes a material having a multiple quantum well structure, it may have a structure in which a quantum layer and a well layer are alternately stacked. The light-emitting layer (36) may emit light by the coupling of electron-hole pairs according to an electric signal applied through the first semiconductor layer (31) and the second semiconductor layer (32). The light-emitting layer (36) may include materials such as AlGaN, AlGaInN, etc. In particular, if the light-emitting layer (36) has a structure in which quantum layers and well layers are alternately stacked as a multiple quantum well structure, the quantum layer may include a material such as AlGaN or AlGaInN, and the well layer may include a material such as GaN or AlInN.

[0174] The light-emitting layer (36) may have a structure in which semiconductor materials with large band gap energy and semiconductor materials with small band gap energy are alternately stacked, and may include different group 3 to group 5 semiconductor materials depending on the wavelength range of the light emitted. The light emitted by the light-emitting layer (36) is not limited to light in the blue wavelength range, and may emit light in the red or green wavelength range depending on the case.

[0175] The electrode layer (37) may be an ohmic connection electrode. However, it is not limited thereto and may be a Schottky connection electrode. The light-emitting element (ED) may include at least one electrode layer (37). The light-emitting element (ED) may include one or more electrode layers (37), but is not limited thereto and the electrode layer (37) may be omitted.

[0176] The electrode layer (37) can reduce the resistance between the light-emitting element (ED) and the electrode or connecting electrode when the light-emitting element (ED) in the display device (10) is electrically connected to the electrode or connecting electrode. The electrode layer (37) may include a conductive metal. For example, the electrode layer (37) may include at least one of aluminum (Al), titanium (Ti), indium (In), gold (Au), silver (Ag), ITO, IZO, and ITZO.

[0177] The insulating film (38) may be arranged to surround the outer surface of the plurality of semiconductor layers and electrode layers described above. For example, the insulating film (38) may be arranged to surround the outer surface of at least the light-emitting layer (36), while the longitudinal ends of the light-emitting element (ED) may be formed to be exposed. Additionally, the insulating film (38) may be formed with a rounded upper surface in cross-section in an area adjacent to at least one end of the light-emitting element (ED).

[0178] The insulating film (38) is made of materials having insulating properties, for example, silicon oxide (SiO₂). x ), silicon nitride (SiN x ), silicon oxynitride (SiO₂ x N y ), aluminum nitride (AlN x ), aluminum oxide (AlO x It may include ) etc. In the drawing, the insulating film (38) is exemplified as being formed as a single layer, but is not limited thereto, and in some embodiments, the insulating film (38) may be formed as a multilayer structure in which a plurality of layers are stacked.

[0179] The insulating film (38) can perform the function of protecting the above members. The insulating film (38) can prevent an electrical short circuit that may occur in the light-emitting layer (36) when in direct contact with the electrode through which an electrical signal is transmitted to the light-emitting element (ED). In addition, the insulating film (38) can prevent a decrease in the light-emitting efficiency of the light-emitting element (ED).

[0180] Additionally, the outer surface of the insulating film (38) may be surface-treated. The light-emitting element (ED) may be sprayed onto the electrode and aligned in a dispersed state within a predetermined ink. Here, in order for the light-emitting element (ED) to remain dispersed without aggregating with other adjacent light-emitting elements (ED) within the ink, the surface of the insulating film (38) may be treated to be hydrophobic or hydrophilic.

[0181] Meanwhile, a plurality of connecting electrodes (460, 470) are disposed on a plurality of electrodes (430, 440) and light-emitting elements (ED) and can each come into contact with them. A connecting electrode (460, 470) can come into contact with at least one end of a light-emitting element (ED) and at least one of the electrodes (430, 440).

[0182] A plurality of connecting electrodes (460, 470) may include a first connecting electrode (460) and a second connecting electrode (470). The first connecting electrode (460) may have a shape extending in a second direction (DR2) and may be disposed on the first electrode (430). A portion of the first connecting electrode (460) disposed on the first sub-bank (410) may overlap with the first electrode (430) and extend from therein in a second direction (DR2). The first connecting electrode (460) may transmit an electrical signal applied from the circuit layer (120) to the light-emitting element (ED) by being connected to the first electrode (430) and contacting one end of the light-emitting element (ED).

[0183] The second connecting electrode (470) may have a shape extending in the second direction (DR2) and may be placed on the second electrode (440). The portion of the second connecting electrode (470) placed on the second sub-bank (420) overlaps with the second electrode (440) and may extend from therein in the second direction (DR2). The second connecting electrode (470) is connected to the second electrode (440) and contacts the other end of the light-emitting elements (ED), thereby transmitting an electrical signal applied from the power wiring to the light-emitting elements (ED).

[0184] A display device (1) according to one embodiment includes a light-emitting element layer (LEL) containing an inorganic light-emitting diode, and can photo-cur a filling member (300) with blue light emitted from the light-emitting element layer (LEL). Therefore, there are no restrictions on equipment or processes when curing the filling member (300), and reliability issues of the light-emitting element that may occur during thermal curing can be prevented.

[0185] Although embodiments of the present invention have been described above with reference to the attached drawings, those skilled in the art will understand that the present invention may be implemented in other specific forms without changing the technical concept or essential features thereof. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. Explanation of the symbols

[0186] 1: Display device 100: First display substrate 110: First substrate 200: Second display substrate 210: Second substrate 300: Filling member SM: Bonding member 120: Circuit layer CCL: Color conversion layer CFL: Color filter layer WCL: Wavelength conversion layer CFL1~4: 1st to 4th color filter layers WCL1~2: 1st and 2nd wavelength conversion patterns TPL: Light-transmitting layer

Claims

Claim 1 A display device comprising: a first display substrate including a light-emitting element layer; a second display substrate facing the first display substrate and including a light-blocking member and a color conversion layer; a coupling member for coupling the first display substrate and the second display substrate; and a filling member filled between the first display substrate and the second display substrate, wherein the filling member includes a photoinitiator that is initiated by absorbing light in a wavelength band of 380 nm to 500 nm, the light-blocking member and the color conversion layer cover the entire surface of the second display substrate facing the first display substrate, and the photoinitiator includes one or more selected from the group consisting of lucyl-diphenyl-(2,4,6-trimethylbenzoyl)-phosphine oxide (LTPO), bis-(4-methoxybenzoyl)diethylgermanium (Ivocerin), and 1-phenyl-1,2-propanedione (PPD). Claim 2 In claim 1, the filling member comprises an acrylate-based monomer, a photoinitiator, and a crosslinking agent, forming a display device. Claim 3 delete Claim 4 A display device according to claim 1, wherein the refractive index of the filling member is 1.5 to 1.

7. Claim 5 In claim 1, the light-emitting element layer is a display device that emits light in a wavelength band of 380 nm to 500 nm. Claim 6 A display device according to claim 5, wherein the light-emitting element layer emits white light, and the color conversion layer comprises a color filter layer including at least a first color filter layer that transmits red light, a second color filter layer that transmits green light, and a third color filter layer that transmits blue light. Claim 7 In claim 5, the color conversion layer comprises a wavelength conversion layer, a light-transmitting layer, and a color filter layer, wherein the wavelength conversion layer comprises a first wavelength conversion pattern that converts blue light emitted from the light-emitting element layer into red light and a second wavelength conversion pattern that converts blue light emitted from the light-emitting element layer into green light, and the color filter layer comprises a first color filter layer that overlaps with the first wavelength conversion pattern and transmits the red light and a second color filter layer that overlaps with the second wavelength conversion pattern and transmits the green light, and the light-transmitting layer does not overlap with the wavelength conversion layer and the color filter layer and transmits the blue light emitted from the light-emitting element layer as is. Claim 8 In claim 5, the color conversion layer comprises a wavelength conversion layer, a light-transmitting layer, and a color filter layer, wherein the wavelength conversion layer comprises a first wavelength conversion pattern that converts blue light emitted from the light-emitting element layer into red light and a second wavelength conversion pattern that converts blue light emitted from the light-emitting element layer into green light, and the color filter layer comprises a fourth color filter layer that overlaps with the first wavelength conversion pattern and the second wavelength conversion pattern and transmits the red light and the green light, and the light-transmitting layer does not overlap with the wavelength conversion layer and the color filter layer and transmits the blue light emitted from the light-emitting element layer as is. Claim 9 In claim 5, the color conversion layer comprises a wavelength conversion layer, a light-transmitting layer, and a color filter layer, wherein the wavelength conversion layer comprises a first wavelength conversion pattern that converts cyan light emitted from the light-emitting element layer into red light and a second wavelength conversion pattern that converts cyan light emitted from the light-emitting element layer into green light, and the color filter layer comprises a first color filter layer that overlaps with the first wavelength conversion pattern and transmits the red light, a second color filter layer that overlaps with the second wavelength conversion pattern and transmits the green light, and a third color filter layer that transmits blue light from the cyan light emitted from the light-emitting element layer, and the light-transmitting layer is disposed below the third color filter layer and transmits the cyan light emitted from the light-emitting element layer as is. Claim 10 In claim 5, the color conversion layer comprises a wavelength conversion layer, a light-transmitting layer, and a color filter layer, wherein the wavelength conversion layer comprises a first wavelength conversion pattern that converts cyan light emitted from the light-emitting element layer into red light and a second wavelength conversion pattern that converts cyan light emitted from the light-emitting element layer into green light, and the color filter layer comprises a fourth color filter layer that overlaps with the first wavelength conversion pattern and the second wavelength conversion pattern and transmits the red light and the green light, and the light-transmitting layer does not overlap with the wavelength conversion layer and the color filter layer and transmits the cyan light emitted from the light-emitting element layer as is. Claim 11 In claim 2, the light-emitting element layer is a display device comprising an organic light-emitting diode or an inorganic light-emitting diode. Claim 12 A method for manufacturing a display device comprising: a step of preparing a first display substrate including a light-emitting element layer; a step of preparing a second display substrate including a light-blocking member and a color conversion layer; a step of applying a bonding member and a filling member composition on the second display substrate; a step of bonding the first display substrate and the second display substrate; and a step of illuminating the light-emitting element layer and curing the filling member composition using light emitted from the light-emitting element layer to form a filling member. Claim 13 A method for manufacturing a display device according to claim 12, wherein the filling member composition comprises an acrylate-based monomer, a crosslinking agent, and a photoinitiator that is initiated by absorbing light in the wavelength band of 380 nm to 500 nm. Claim 14 A method for manufacturing a display device according to claim 13, wherein the photoinitiator comprises one or more selected from the group consisting of diphenyl-(2,4,6-trimethylbenzoyl)-phosphine oxide (TPO), lucyrin-diphenyl-(2,4,6-trimethylbenzoyl)-phosphine oxide (LTPO), bis-(4-methoxybenzoyl)diethylgermanium (Ivocerin), camphorquinone (CQ), and 1-phenyl-1,2-propanedione (PPD). Claim 15 A method for manufacturing a display device according to claim 13, wherein the content of the acrylate-based monomer is 98% to 99.8% by weight with respect to the entire filling member composition, the content of the crosslinking agent is 0.1% to 1% by weight with respect to the entire filling member composition, and the content of the photoinitiator is 0.1% to 1% by weight with respect to the entire filling member composition. Claim 16 A method for manufacturing a display device according to claim 13, wherein the viscosity of the filling member composition is 1 cp to 10 cp. Claim 17 A method for manufacturing a display device according to claim 12, wherein the refractive index of the filling member is 1.5 to 1.

7. Claim 18 In claim 12, the method for manufacturing a display device wherein the light-emitting element layer emits single-color light in a wavelength band of 380 nm to 500 nm. Claim 19 In claim 18, the method of manufacturing a display device wherein the light-emitting element layer emits any one of white light, blue light, or cyan light. Claim 20 A method for manufacturing a display device according to claim 12, further comprising the step of curing the bonding member by irradiating the bonding member with a separate light.

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