Method and apparatus for measuring features of a glass-based substrate

Abstract

The device may include a light source positioned in a first region and at least one wavefront sensor. A reflector may be positioned in a second region. A measurement plane may be positioned between the first region and the second region. The reflector may be configured to reflect light. At least one wavefront sensor may be configured to detect light. A method for measuring features of a glass-based substrate may include the step of emitting light from a light source. The method may include the step of transmitting light through the thickness of the glass-based substrate. The method may include the step of transmitting light through a target location on a first main surface of the glass-based substrate. The method may include the step of detecting light with at least one wavefront sensor and the step of generating a signal based on the detected light.

Description

Technology Field

[0001] This application claims the benefit of priority under 35 USC §119 of U.S. Provisional Application No. 63 / 040,247 filed June 17, 2020, the contents of which are incorporated herein by reference and the entire text is incorporated by reference.

[0002] field

[0003] The present disclosure generally relates to a method and apparatus for measuring features of a glass-based substrate, and more specifically to a method and apparatus for measuring features of a glass-based substrate using a light source. Background Technology

[0004] Display devices include liquid crystal displays (LCDs), electrophoretic displays (EPDs), organic light-emitting diode displays (OLEDs), plasma display panels (PDPs), etc. Display devices may be part of portable electronic devices, for example, consumer electronics, smartphones, tablets, wearable devices, or laptops.

[0005] Display devices often include one or more glass-based substrates. Before using glass-based substrates in various applications (e.g., display devices), it is important to identify, characterize, and measure features of the glass-based substrates so that these features can be mitigated.

[0006] It is known to inspect glass-based substrates using various techniques, such as brightfield illumination, oblique illumination, or knife-edge illumination, using, for example, cameras (e.g., digital cameras, CCD cameras). These techniques can identify the location of features (e.g., inclusions, scratches, blisters, surface discontinuities) and / or qualitatively characterize the features. However, the increased resolution required to quantitatively characterize features using a given technique, whenever possible, may require careful calibration, extended exposure, multiple exposures, and / or exposures in multiple orientations.

[0007] Consequently, there may be a need to develop methods and devices that can be used to measure features on glass-based substrates. There may be a need for accurate and quantitative measurement of features. Additionally, it may be necessary to measure features using a method that may not require extensive calibration (e.g., a method that may be insensitive to vibration and / or may not require recalibration between each measurement). Furthermore, it may be necessary to measure features rapidly (e.g., in less than 1 second) so that the measurement can be performed inline with or integrated with the glass manufacturing device. means of solving the problem

[0008] An apparatus and method for measuring features on a glass-based substrate are described herein. The apparatus of the present disclosure facilitates rapid inline measurement of features, thereby increasing production efficiency and reducing processing time. The apparatus of the present disclosure can quantitatively characterize a wide range of feature sizes, thereby reducing the need for multiple inspections. The apparatus of the present disclosure can reduce downtime by minimizing the need for recalibration and / or realignment.

[0009] Providing at least one wavefront sensor enables quantitative and accurate measurement of vibration-insensitive features. For example, using a wavefront sensor can reduce the need for device recalibration. For instance, using a wavefront sensor allows for measurements while a glass-based substrate is in motion and / or has recently been moved. Similarly, providing a wavefront sensor enables rapid measurement of features (e.g., about 100 milliseconds or less). Additionally, the wavefront sensor can be integrated with additional (e.g., conventional) inspection devices (e.g., cameras).

[0010] Providing at least one wavefront sensor enables measurements at various distances from a measurement plane (e.g., a first main surface of a glass-based substrate). Adjusting the distance from the measurement plane allows various types of features (e.g., surface profiles, blisters, gas inclusions, metal inclusions) to be distinguishable. Additionally, adjusting the distance from the measurement plane can be used to control the size of features that can be detected accurately and quantitatively. Providing two or more wavefront sensors with different magnifications allows a wide range of feature sizes to be measured simultaneously. For example, using two or more wavefront sensors with different magnifications can reduce the need for subsequent inspection (e.g., re-inspection) of features.

[0011] If one or more wavefront sensors and a light source are provided in a first region facing a second region that includes a reflector having a measurement plane (e.g., a glass-based substrate) between the first region and the second region, alignment problems between the light source and the wavefront sensor can be reduced (e.g., mitigated). For example, if a common support is provided for both the light source and the wavefront sensor, alignment can be maintained even when subjected to vibration or intentional movement.

[0012] Some exemplary embodiments of the present disclosure are described below with the understanding that any feature of the various embodiments may be used alone or in combination with one another.

[0013] In some embodiments, the device may include a light source positioned in a first region and at least one wavefront sensor. The device may include a reflector positioned in a second region. The device may include a measurement plane positioned between the first region and the second region. The light source may be configured to emit light that strikes the measurement plane. The reflector may be configured to reflect light from the light source. At least one wavefront sensor may be configured to detect light reflected by the reflector.

[0014] In another embodiment, the path distance between the light source and the measurement plane may be adjustable.

[0015] In another embodiment, the detection distance between at least one wavefront sensor and the measurement plane may be adjustable.

[0016] In another embodiment, the light source may be configured to emit light containing coherent light.

[0017] In another embodiment, the light source may be configured to emit light containing pulses.

[0018] In another embodiment, the light source may include a laser.

[0019] In another embodiment, at least one wavefront sensor may include a Shack-Hartmann wavefront sensor.

[0020] In another embodiment, at least one wavefront sensor may include a lateral shear interferometer.

[0021] In another embodiment, the lateral shear interferometer may include a four-wavelength lateral shear interferometer.

[0022] In another embodiment, at least one wavefront sensor may include a pyramidal wavefront sensor.

[0023] In another embodiment, the device may further include a beam splitter configured to split light into a plurality of beams. At least one wavefront sensor may include a first wavefront sensor configured to detect a first beam among the plurality of beams and a second wavefront sensor configured to detect a second beam among the plurality of beams.

[0024] In another embodiment, the device may further include a second optical device configured to change the magnification of the second beam relative to the magnification of the first beam.

[0025] In another embodiment, the device may further include an optical device configured to change the magnification of the first beam.

[0026] In another embodiment, the device may further include an optical camera configured to detect a first beam among a plurality of beams.

[0027] In some embodiments, a method for measuring features of a glass-based substrate may include the step of striking light onto a measurement plane of the glass-based substrate. The measurement plane may extend across the thickness of the glass-based substrate. The thickness may be defined between a first main surface of the glass-based substrate and a second main surface of the glass-based substrate. The method may include the step of reflecting light toward the glass-based substrate. The method may include the step of transmitting reflected light toward the first main surface of the glass-based substrate through the thickness of the glass-based substrate and through a target location on the first main surface of the glass-based substrate. The method may include the step of detecting the light transmitted through the target location using at least one wavefront sensor. The method may include the step of generating a first signal with at least one wavefront sensor based on the detected light.

[0028] In another embodiment, the step of colliding light on the measurement plane may include the step of colliding light on the first main surface of the glass-based substrate.

[0029] In another embodiment, the method may further include the step of moving the glass-based substrate in a direction across the thickness of the glass-based substrate before transmitting light through the thickness. The method may further include the step of moving the glass-based substrate in a direction across the thickness of the glass-based substrate after detecting light transmitted through a target position using at least one wavefront sensor.

[0030] In another embodiment, after moving the glass-based substrate before transmitting light through the thickness and before generating a first signal with at least one wavefront sensor, a signal may not be generated by at least one wavefront sensor.

[0031] In another embodiment, the measurement time that can be defined between the end of moving the glass-based substrate before transmitting light through the thickness and the start of moving the glass-based substrate after detecting the light transmitted through the target position using at least one wavefront sensor may be about 100 milliseconds or less.

[0032] In another embodiment, the glass-based substrate can move in a direction across the thickness of the glass-based substrate when light is transmitted through the thickness of the glass-based substrate.

[0033] In some embodiments, a method for measuring features of a glass-based substrate may include the step of transmitting light through the thickness of the glass-based substrate toward a first main surface of the glass-based substrate and through a target location on the first main surface of the glass-based substrate. The thickness may be defined between the first main surface and a second main surface. The method may include the step of detecting the light transmitted through the target location using at least one wavefront sensor. The method may include the step of generating a first signal with at least one wavefront sensor based on the detected light. The glass-based substrate may move in a direction across the thickness of the glass-based substrate when the light is transmitted through the thickness of the glass-based substrate.

[0034] In some embodiments, the method may include the step of measuring a feature of a glass-based substrate, comprising the step of transmitting light through the thickness of the glass-based substrate toward a first main surface of the glass-based substrate and through a target location on the first main surface of the glass-based substrate. The thickness may be defined between the first main surface and a second main surface. The method may include the step of detecting the light transmitted through the target location using at least one wavefront sensor. The method may include the step of generating a first signal with at least one wavefront sensor based on the detected light. The method may include the step of moving the glass-based substrate in a direction across the thickness of the glass-based substrate before transmitting light through the thickness. The method may include the step of moving the glass-based substrate in a direction across the thickness of the glass-based substrate after detecting the light transmitted through the target location using at least one wavefront sensor. The measurement time that can be defined between the end of moving the glass-based substrate before transmitting light through the thickness and the start of moving the glass-based substrate after detecting the light transmitted through the target position using at least one wavefront sensor may be about 100 milliseconds or less.

[0035] In another method, the method may further include the step of striking light onto a measurement plane of a glass-based substrate. The measurement plane may extend across the thickness of the glass-based substrate. The thickness may be defined between a first main surface of the glass-based substrate and a second main surface of the glass-based substrate. The method may further include the step of reflecting light toward the glass-based substrate before transmitting light through the thickness.

[0036] In another embodiment, the method may further include the step of determining the height and / or width of a feature of a glass-based substrate based on a first signal generated.

[0037] In another embodiment, the step of determining the height and / or width of a feature of a glass-based substrate may additionally be based on the refractive index of the glass-based substrate.

[0038] In another embodiment, the feature may include a surface profile of a glass-based substrate at a target location.

[0039] In another embodiment, the feature may include an inclusion under the surface of the glass-based substrate at a target location.

[0040] In another embodiment, the inclusion may contain gas.

[0041] In another embodiment, the inclusion may include metal.

[0042] In another embodiment, at least one wavefront sensor may include a Shack-Hartmann wavefront sensor.

[0043] In another embodiment, at least one wavefront sensor may include a lateral shear interferometer.

[0044] In another embodiment, the lateral shear interferometer may include a four-wavelength lateral shear interferometer.

[0045] In another embodiment, at least one wavefront sensor may include a pyramidal wavefront sensor.

[0046] In another embodiment, the method may further include the step of splitting a first pulse transmitted through a target position into a plurality of beams, including a first beam and a second beam. The method may further include the step of changing the magnification of the first beam. The step of detecting the transmitted first pulse using at least one wavefront sensor may include the step of detecting the first beam with the first wavefront sensor of the at least one wavefront sensor. The step of detecting the transmitted first pulse using at least one wavefront sensor may further include the step of detecting the second beam with the second wavefront sensor of the at least one wavefront sensor.

[0047] In another embodiment, the method may further include the step of splitting light transmitted through a target position into a plurality of beams, including a first beam and a second beam. The method may further include the step of changing the magnification of the first beam. The step of detecting transmitted light using at least one wavefront sensor may include the step of detecting the first beam with the first wavefront sensor of the at least one wavefront sensor and the step of detecting the second beam with the second wavefront sensor of the at least one wavefront sensor.

[0048] In another embodiment, the step of changing the magnification of the first beam may be in the range of about 2 times to about 50 times magnification.

[0049] In another embodiment, the method may further include the step of changing the magnification of the second beam with respect to the magnification of the first beam.

[0050] In another embodiment, the magnification of the first beam may be about 150% to about 1000% of the magnification of the second beam.

[0051] In another embodiment, the method may further include the step of detecting a first beam with an optical camera.

[0052] In another embodiment, the light may include a first pulse. The method may further include the step of adjusting the detection distance between the first main surface and at least one wavefront sensor. The method may further include the step of striking a second pulse on a measurement plane. The method may further include the step of reflecting the second pulse toward a glass-based substrate. The method may further include the step of transmitting the reflected second pulse toward the first main surface of the glass-based substrate through the thickness of the glass-based substrate and through a target location on the first main surface of the glass-based substrate. The method may further include the step of detecting the second pulse transmitted through the target location using at least one wavefront sensor. The method may further include the step of generating a second signal with at least one wavefront sensor based on the detected second pulse.

[0053] In another embodiment, the method may further include the step of measuring a feature using a first signal and a second signal. Brief explanation of the drawing

[0054] The above and other features and advantages of the embodiments of the present disclosure are better understood when reading the following detailed description with reference to the accompanying drawings, and in the drawings: FIG. 1 illustrates an exemplary embodiment of a measuring device according to an embodiment of the present disclosure; FIG. 2 illustrates an exemplary embodiment of a measuring device according to an embodiment of the present disclosure; FIG. 3 illustrates an exemplary embodiment of a measuring device according to an embodiment of the present disclosure; FIG. 4 is an enlarged view (4) of FIG. 1; FIG. 5 is a schematic diagram of a detector comprising at least one wavefront sensor according to an embodiment of the present disclosure; FIG. 6 is a schematic diagram of a detector comprising at least one wavefront sensor according to an embodiment of the present disclosure; FIG. 7 is a schematic diagram of a wavefront sensor; FIG. 8 is a schematic diagram of a wavefront sensor; FIG. 9 is a cross-sectional view taken along line 9-9 of FIG. 7; FIG. 10 is a cross-sectional view taken along line 10-10 of FIG. 8; FIG. 11 is a flowchart illustrating an exemplary method of an embodiment of the present disclosure; FIG. 12 is a plot of the relationship between the measured feature height and the actual feature height according to an embodiment of the present disclosure. Throughout this disclosure, drawings are used to highlight specific embodiments. As such, the relative sizes of different regions, parts, and substrates shown in the drawings should not be assumed to be proportional to their actual relative sizes unless otherwise explicitly indicated. Specific details for implementing the invention

[0055] Now, the embodiments will be described more fully below with reference to the accompanying drawings, which illustrate exemplary embodiments. Where possible, the same reference numerals are used throughout the drawings to refer to identical or similar parts. However, the claims may include many different aspects of various embodiments and should not be interpreted as being limited to the embodiments described herein.

[0056] FIGS. 1 through 3 illustrate drawings of an apparatus (101, 301) according to an embodiment of the present disclosure. Unless otherwise noted, the description of a feature in some embodiment may be applied equally to a corresponding feature in any embodiment of the present disclosure. For example, the same part number throughout the present disclosure may indicate that in some embodiments, identified features are identical to each other, and the description of an identified feature in one embodiment may be applied equally to an identified feature in any other embodiment of the present disclosure unless otherwise noted.

[0057] As illustrated in FIGS. 1 through 3, the device (101, 301) may include a light source (121). In some embodiments, the light source (121) may include a laser, a light-emitting diode (LED), and / or an organic light-emitting diode. In another embodiment, the laser may include a gas laser, an excimer laser, a dye laser, or a solid-state laser. Exemplary embodiments of the gas laser include helium, neon, argon, krypton, xenon, helium-neon (HeNe), xenon-neon (XeNe), carbon dioxide (CO2), carbon monoxide (CO), copper (Cu) vapor, gold (Au) vapor, cadmium (Cd) vapor, ammonia, hydrogen fluoride (HF), and deuterium fluoride (DF). Exemplary embodiments of an excimer laser include chlorine, fluorine, iodine, or nitrous oxide (N2O) in an inert environment containing argon (Ar), krypton (Kr), xenon (Xe), or a combination thereof. Exemplary embodiments of a dye laser include using an organic dye dissolved in a liquid solvent, such as rhodamine, fluorescein, coumarin, stilbene, umbelliferone, tetracene, or malachite green. Exemplary embodiments of a solid-state laser include crystal lasers, fiber lasers, and laser diodes. A crystal-based laser includes a host crystal doped with lanthanide or a transition metal.Exemplary examples of host crystals include yttrium aluminum garnet (YAG), yttrium lithium fluoride (YLF), yttrium othoaluminate (YAL), yttrium scandium gallium garnet (YSSG), lithium aluminum hexafluoride (LiSAF), lithium calcium aluminum hexafluoride (LiCAF), zinc selenium (ZnSe), zinc sulfide (ZnS), ruby, forsterite, and sapphire. Exemplary examples of dopants include neodymium (Nd), titanium (Ti), chromium (Cr), cobalt (Co), iron (Fe), erbium (Er), holmium (Ho), thulium (Tm), ytterbium (Yb), dysprosium (Dy), cerium (Ce), gadolinium (Gd), samarium (Sm), and terbium (Tb). Exemplary examples of solid crystals include ruby, alexandrite, chromium fluoride, forsterite, lithium fluoride (LiF), sodium chloride (NaCl), potassium chloride (KCl), and rubidium chloride (RbCl). Laser diodes may include heterojunction or PIN diodes having three or more materials for each p-type, intrinsic, and n-type semiconductor layer. Exemplary embodiments of laser diodes include AlGaInP, AlGaAs, InGaN, InGaAs, InGaAsP, InGaAsN, InGaAsNSb, GaInP, GaAlAs, GaInAsSb, and lead (Pb) salts. Some laser diodes may represent exemplary embodiments due to their size, adjustable output power, and ability to operate at room temperature (i.e., about 20°C to about 25°C).

[0058] In some embodiments, as illustrated in FIGS. 1 to 3, the light source (121) may be configured to emit light. In another embodiment, the light may include optical wavelengths of the visible spectrum in the range of, for example, about 300 nanometers (nm) to about 1,000 nm, about 350 nm to about 900 nm, about 400 to about 800 nm, about 500 nm to about 700 nm, or any range or sub-range between these. In another embodiment, the first wavelength may be about 365 nm, about 415 nm, or about 590 nm. In another embodiment, the light may include optical wavelengths of an infrared spectrum in the range of, for example, about 1 micrometer (μm) to about 20 μm, about 5 μm to about 20 μm, about 5 μm to about 15 μm, about 8 μm to about 15 μm, about 8 μm to about 12 μm, or any range or sub-range between these.

[0059] In some embodiments, the light source may be configured to emit coherent light. As used herein, coherent light means that the photons constituting the light maintain a substantially constant phase difference over a coherent length of at least 1 meter. In another embodiment, the coherent light may be spatially coherent, meaning that the light may maintain a substantially constant interference pattern over time. In another embodiment, the coherent light may be temporally coherent, meaning that the light may maintain a substantially constant interference pattern at different distances from the light source. Exemplary embodiments of a coherent light source may include a laser, a light-emitting diode (LED), or an organic LED (OLED). In some embodiments, the light source may be configured to emit non-coherent light. Exemplary embodiments of a non-coherent light source may include an incandescent bulb or an LED that emits light through a pinhole.

[0060] In some embodiments, the light source may be configured to emit polarized light. As used herein, polarized light means that the photons constituting the light contain substantially the same polarization (e.g., linear, circular, elliptical, vertical, horizontal). In some embodiments, although not illustrated, the light source may include an optical compensator (e.g., a half-wave plate and / or a quarter-wave plate) capable of controlling the polarization of the emitted light. In another embodiment, although not illustrated, one of the half-wave plate or the quarter-wave plate may be rotatable relative to the other, which can change the polarization of the light beam passing through the plate. In another embodiment, although not illustrated, the optical compensator may include an electronically controlled polarization modulator, e.g., a liquid crystal-based modulator or a ferroelectric liquid crystal-based modulator. In some embodiments, the light source may be configured to emit unpolarized light (e.g., isotropic, Lambertian).

[0061] In some embodiments, the light source may be configured to continuously emit light. For example, the light source may include a laser operating in a continuous wave (CW) mode. In some embodiments, the light source may be configured to emit one or more light pulses. In another embodiment, the pulse of one or more pulses may include pulse times of about 0.5 nanoseconds (ns) to about 1 millisecond (ms), about 0.5 ns to about 1 microsecond (µs), about 0.5 ns to about 100 ns, about 0.5 ns to about 50 ns, about 0.5 ns to about 20 ns, about 2 ns to about 100 ns, about 2 ns to about 50 ns, about 2 ns to about 20 ns, about 5 ns to about 100 ns, about 5 ns to about 50 ns, about 5 ns to about 20 ns, or any range or sub-range between these. In another embodiment, the illumination may emit multiple pulses in one or more pulse bursts. In another embodiment, the pulses of the pulse burst may be separated by a time range of about 0.5 ns to about 100 ns, about 0.5 ns to about 50 ns, about 0.5 ns to about 20 ns, about 2 ns to about 100 ns, about 2 ns to about 50 ns, about 2 ns to about 20 ns, about 5 ns to about 100 ns, about 5 ns to about 50 ns, about 5 ns to about 20 ns, or any range or sub-range in between. A burst comprising one or more pulse bursts, each comprising a burst of about 10 kilohertz (kHz) to about 1 megahertz (MHz), about 10 kHz to about 500 kHz, 50 kHz to about 1 MHz, about 50 kHz to about 500 kHz, about 100 kHz to about 500 kHz, about 100 kHz to about 200 kHz, or any range or sub-range between these.In some embodiments, the number of pulses of the burst pulse may be about 20 or less or about 10 or less, for example, in the range of 1 to 10, 1 to 5, 1 to 3, 3 to 10, 3 to 5, or any range or sub-range in between. In some embodiments, the number of pulses of the pulse burst may be in the range of about 100 to about 1,500, about 100 to about 1,000, about 100 to about 800, about 300 to about 1,500, about 300 to about 1,000, about 300 to about 800, about 600 to about 1,500, about 600 to about 1,000, about 600 to about 800, or any range or sub-range in between.

[0062] In some embodiments, as illustrated in FIGS. 1 through 3, the light source (121) may be configured to emit light along the first light path (125). In another embodiment, although not illustrated, the device (e.g., light source) may include a focusing lens. The focusing lens may be positioned along the first light path (125). After passing through the focusing lens, the light may be focused along the first light path (125). The focusing lens may include a convex lens and / or an adjustable focal length lens. In another embodiment, the focusing lens may be configured to collimate the light along the first light path (125). In some embodiments, although not illustrated, a bandpass filter, an additional focusing lens, a light diffuser, a beam splitter, and / or an attenuator may be positioned along the first light path (125). In another embodiment, one or more of these additional elements may be controlled by the controller (119) through the first communication path (123).

[0063] As illustrated in FIGS. 1 through 3, the device (101, 301) may include a detector (131). As illustrated in FIGS. 5 and 6, the detector (131) may include at least one wavefront sensor. For example, as illustrated in FIGS. 5 and 6, the detector may include a first wavefront sensor (501) and a second wavefront sensor (503). It should be understood that the detector may include one wavefront sensor, or in another embodiment, more than two wavefront sensors may be provided. Without being bound by theory, the wavefront sensor may detect light to generate a signal corresponding to the wavefront gradient of the light. Without being bound by theory, the wavefront gradient of the light may correspond to the optical path difference between the optical path lengths of different parts of the light passing through a sample. As used herein, the optical path length of the light is the physical distance the light travels from the light source to the detector, scaled by the refractive index / index passing through. It should be understood that the description of the first wavefront sensor (501) can be applied in the same way to the second wavefront sensor (503) unless otherwise indicated.

[0064] In some embodiments, the first wavefront sensor (501) may include a Shack-Hartmann wavefront sensor. As schematically illustrated in FIGS. 7 and 8, the Shack-Hartmann wavefront sensor may include a lens array (701). As illustrated, the lens array (701) may include at least one row of lenses. In another embodiment, the lens array (701) may include a two-dimensional array. In another embodiment, the first lens of the lens array (701) may include a focal length that may be substantially the same as the focal length of the second lens of the lens array (701). In another embodiment, each lens of the lens array (701) may include substantially the same focal length. In another embodiment, each lens of the lens array (701) may be substantially the same.

[0065] In some embodiments, the Shack-Hartman wavefront sensor may include an image detector (703). In another embodiment, as schematically illustrated in FIGS. 7 and 8, the image detector (703) may include a plurality of photons (e.g., a charge-coupled device (CCD) array, a complementary metal-oxide-semiconductor (CMOS) array, or an optical quad cell array). In another embodiment, the plurality of photons may be arranged in at least one row. In another embodiment, the plurality of photons may include a two-dimensional array. In another embodiment, the number of photons in the plurality of photons including the image detector (703) may be greater than or equal to the number of lenses in the lens array (701).

[0066] As schematically illustrated in FIGS. 7 and 8, the Shack-Hartmann wavefront sensor may be configured to detect light and / or beams, including using a lens array (701) to focus the light and / or beams into a plurality of spots (707, 807) on the imaging plane (705) of an image detector (703). Without being bound by theory, the position of the spots on the imaging plane focused by the lenses of the lens array may correspond to the gradient of the wavefront of the light and / or beam to be detected. For example, referring to FIGS. 7 and 9, a uniform wavefront (711) incident on the wavefront sensor may be focused by the lens array (701) into a plurality of spots (707) on the imaging plane (705) of the image detector (703). Additionally, as illustrated in FIG. 9, a spot (903a-903e) comprising a plurality of spots (707) may substantially correspond to a neutral position (901a-901e) on the imaging plane (705). As illustrated, the alignment of the neutral position (901a-901e) and the spot (903a-903) may indicate that the gradient of the incident wavefront of the light and / or beam is substantially zero. For example, referring to FIG. 8 and FIG. 10, an aberration wavefront (811) incident on the wavefront sensor may be focused by a lens array (701) into a plurality of spots (807) on the imaging plane (705) of the image detector (703). Additionally, as illustrated in FIG. 10, spots (1003a-1003e) comprising a plurality of spots (807) may be shifted to varying degrees from corresponding neutral positions (901a-901e) on the imaging plane (705). Some spots, for example, spot (1003b), may be substantially aligned with the corresponding neutral position (901b), which may indicate that a portion of the detected aberration wavefront (811) may be substantially zero.Another spot, for example, spot (1003a), may be shifted from the corresponding neutral position (901a) by a first distance (1005) in the first direction (1001), which may correspond to a gradient of part of the wavefront (811). Spot (1003c) may be shifted from the corresponding neutral position (901c) by a second distance (1007) opposite to the first direction (1001). Additionally, the first distance (1005) may be substantially the same as the second distance (1007). Additional spots, for example, spots (1003d, 1003e), may be shifted from the corresponding neutral position (901d, 901e) by a distance (1009, 1011) which may be smaller than the first distance (1005) and / or the second distance (1007). The aberration wavefront (811) can be approximated (e.g., reconstructed) using the direction of a plurality of spots (807) (e.g., spots (1003a-1003e)) from the corresponding neutral position (901a-901e) as the measured distance (1005, 1007, 1009, 1011) and the gradient of the aberration wavefront (811).

[0067] In some embodiments, the first wavefront sensor (501) may include a lateral shear interferometer. In another embodiment, the lateral shear interferometer may include a diffraction grating configured to generate an interference pattern on the imaging plane of an image detector from incident light and / or a beam. In another embodiment, the first wavefront sensor (501) may include a four-wavelength lateral shear interferometer. In another embodiment, the four-wavelength lateral shear interferometer may include a beam splitter configured to split the incident light and / or beam into four beams, each of which can be incident on a diffraction grating configured to generate an interference pattern on the imaging plane of an image detector. In another embodiment, each diffraction grating of the four-wavelength lateral shear interferometer may include a different pattern and / or a different shear rate. Providing a four-wavelength lateral shear interferometer can generate high-resolution data (e.g., a signal) that can be used to accurately reconstruct the wavefront of the incident light and / or beam.

[0068] In some embodiments, the first wavefront sensor (501) may include a pyramidal wavefront sensor. In another embodiment, the pyramidal wavefront sensor may include a pyramidal prism configured to split incident light and / or a beam into a plurality of beams (e.g., four beams) that can be incident on the imaging plane of an image detector. In another embodiment, the plurality of beams from the pyramidal prism may be compared to detect information about the gradient of the wavefront of the incident light and / or beam.

[0069] As illustrated in FIGS. 1 to 3 and FIGS. 5 and 6, the detector (131) may be configured to detect light traveling along the second optical path (135). In some embodiments, as illustrated in FIGS. 5 and 6, the beam splitter (505) may be positioned along the second optical path (135) and configured to split light incident on the beam splitter (505) into a plurality of beams. In another embodiment, as illustrated, the light may be split by the beam splitter (505) into a plurality of beams including a first beam (507) and a second beam (509). In another embodiment, as illustrated, the first wavefront sensor (501) may be configured to detect the first beam (507) among the plurality of beams. In another embodiment, as illustrated, the second wavefront sensor (503) may be configured to detect the second beam (509) among the plurality of beams. In another embodiment, as illustrated, the mirror (511) may be configured to redirect the second beam (509) from the beam splitter (505) toward the second wavefront sensor (503).

[0070] In some embodiments, as illustrated in FIG. 6, the optical camera (601) may be configured to detect the first beam (507) among a plurality of beams. In another embodiment, the optical camera (601) may include a digital camera, a CCD, and / or an array of photodetectors. In another embodiment, as illustrated, the optical camera (601) and the first wavefront sensor (501) may both be configured to detect the first beam (507) generated by the beam splitter (505), for example, when an additional beam splitter (605) is configured to split the first beam (507) into a plurality of split beams and / or direct the first split beam among the plurality of split beams toward the optical camera (601) and direct the second split beam among the plurality of split beams toward the first wavefront sensor (501). By providing the wavefront sensor and the optical camera, inspection of a glass-based substrate may be possible using multiple techniques with the same detector. As shown in FIG. 6, by providing a wavefront sensor and an optical camera, it is possible to integrate the wavefront sensor into a detector of an inspection device for other technologies, for example, a detector including an optical camera.

[0071] In some embodiments, as illustrated in FIG. 5 and FIG. 6, the first detector may include one or more optical elements, such as a focusing lens, which may be configured to change the magnification of light and / or beams, for example. In another embodiment, as illustrated, the detector (131) may optionally include a first focusing lens (513) positioned along a second optical path (135) together with a beam splitter (505) positioned between the first focusing lens (513) and a plurality of wavefront sensors (e.g., a first wavefront sensor (501), a second wavefront sensor (503)). The first focusing lens may be configured to change the magnification of light traveling along the first optical path (125), if provided, which may change the magnification of a plurality of beams. In another embodiment, as illustrated in FIG. 5, the detector may optionally include a second focusing lens (517) positioned between the beam splitter (505) and the first wavefront sensor (501). In another embodiment, as illustrated in FIG. 6, the detector (131) may include a second focusing lens (603) positioned between the beam splitter (505) and the first wavefront sensor (501) and may be configured to change the magnification of the first beam (507) among a plurality of beams. For example, the second focusing lens (603) may be configured to change the magnification of the first beam (507) among a plurality of beams without changing the magnification of another beam (e.g., the second beam (509)) among a plurality of beams, which may change the magnification of the first beam (507) among a plurality of beams relative to the magnification of another beam (e.g., the second beam (509)). In another embodiment, the detector (131) may include both the first focusing lens (513) and the second focusing lens (517, 603).

[0072] In some embodiments, as illustrated in FIGS. 5 and 6, the detector (131) may include a third focusing lens (515) positioned between the beam splitter (505) and the second wavefront sensor (503) and may be configured to change the magnification of the second beam (509) among a plurality of beams. In another embodiment, the third focusing lens (515) may be configured to change the magnification of the second beam (509) among a plurality of beams without changing the magnification of another beam (e.g., the first beam (507)) among a plurality of beams, which may change the magnification of the second beam (509) among a plurality of beams relative to the magnification of another beam (e.g., the first beam (507)). In another embodiment, the detector (131) may include both the first focusing lens (513) and the third focusing lens (515). In another embodiment, the detector (131) may include both the second focusing lens (517, 603) and the third focusing lens (515). In another embodiment, the detector (131) may include the first focusing lens (513), the second focusing lens (517, 603), and the third focusing lens (515).

[0073] In some embodiments, the first focusing lens (513), the second focusing lens (517, 603), and / or the third focusing lens (515) may be configured to magnify the light and / or beam of a plurality of beams by about 2 times or more, about 5 times or more, about 10 times or more, about 50 times or less, about 30 times or less, or about 20 times or less. In some embodiments, the first focusing lens (513) and / or the second focusing lens (517, 603) may be configured to magnify the light and / or beam of a plurality of beams by a range of about 2 times to about 50 times, about 5 times to about 50 times, about 10 times to about 50 times, about 10 times to about 50 times, about 10 times to about 30 times, about 10 times to about 20 times, or any range or lower range between these.

[0074] In some embodiments, the total magnification of the first beam (507) from the first focusing lens (513) and / or the second focusing lens (517, 603) may be, if provided, about 2 times or more, about 5 times or more, about 10 times or more, about 50 times or less, about 30 times or less, or about 20 times or less. In some embodiments, the total magnification of the first beam (507) from the first focusing lens (513) and / or the second focusing lens (517, 603) may be, if provided, a range of about 2 times to about 50 times, about 5 times to about 50 times, about 10 times to about 50 times, about 10 times to about 30 times, about 10 times to about 20 times, or any range or sub-range between these.

[0075] In some embodiments, the magnification of the first beam (507) among the plurality of beams may differ from the magnification of the second beam (509) among the plurality of beams. In another embodiment, as a percentage of the magnification of the second beam (509) among the plurality of beams, the magnification of the first beam (507) among the plurality of beams may be about 150% or more, about 200% or more, about 400% or more, about 1000% or less, about 800% or less, or about 600% or less. In another embodiment, as a percentage of the magnification of the second beam (509) among the plurality of beams, the magnification of the first beam (507) among the plurality of beams may be in the range of about 150% to about 1000%, about 200% to about 1000%, about 200% to about 800%, about 200% to about 600%, about 400% to about 1000%, about 400% to about 800%, about 400% to about 600%, or any range or sub-range between these. In another embodiment, as a percentage of the magnification of the first beam (507) among the plurality of beams, the magnification of the second beam (509) among the plurality of beams may be about 150% or more, about 200% or more, about 400% or more, about 1000% or less, about 800% or less, or about 600% or less. In another embodiment, the magnification of the second beam (509) among the plurality of beams as a percentage of the magnification of the first beam (507) among the plurality of beams may be in the range of about 150% to about 1000%, about 200% to about 1000%, about 200% to about 800%, about 200% to about 600%, about 400% to about 1000%, about 400% to about 800%, about 400% to about 600%, or any range or sub-range between these. Providing a different magnification of the first beam relative to the magnification of the second beam may enable simultaneous measurement of a wide range of feature sizes and / or reduce the need for subsequent inspection (e.g., re-inspection) of the feature.

[0076] In some embodiments, as illustrated in FIGS. 1 and 2, the device (101) may include a controller (119) that can be connected to a detector (131) by a second communication path (133). In another embodiment, a signal detected by the detector (131) (e.g., a wavefront sensor) may be transmitted to the controller (119) along the second communication path (133). In another embodiment, the controller (119) may be configured to control the magnification, positioning, orientation, and / or data acquisition rate of the detector (131), for example, using the second communication path (133). In another embodiment, as illustrated, the controller (119) may be connected to a light source (121) by a first communication path (123). In another embodiment, the controller (119) may be configured to control the position and / or orientation of the light source (121) and / or the type of light emitted from the light source (121). As described below, it should be understood that the first communication path (123) and / or the second communication path (133) may be a physical connection or a wireless connection.

[0077] As used herein, the term “controller” may include, for example, any device, device, and machine for processing data, including a programmable processor, a computer, or a multiprocessor or computer. In addition to hardware, a processor may include code that creates an execution environment for the computer program in question, for example, processor firmware, a protocol stack, a database management system, an operating system, or a combination of one or more of these. In some embodiments, the controller may include and / or be implemented by digital electronic circuits, or computer software, firmware, or hardware comprising structures and structural equivalents disclosed herein and such structures, or a combination of one or more of these. An embodiment of the controller described herein may be implemented as one or more computer program products (for example, one or more modules of computer program instructions encoded in a program carrier of type for execution by a data processing device or for controlling the operation of a data processing device). A program carrier of type may be a computer-readable medium. A computer-readable medium may be a machine-readable storage device, a machine-readable storage substrate, a memory device, or a combination of one or more of these. A computer program (also known as a program, software, software application, script, or code) may be written in any form of programming language, including a compiled language or an interpreted language, or a declarative or procedural language, and may be distributed in any form, including a standalone program or modules, components, subroutines, or other units suitable for use in a computing environment. A computer program does not necessarily correspond to a file in a file system.A program may be stored in a part of a file containing other programs or data (e.g., one or more scripts stored in a markup language document), in a single file dedicated to that program, or in multiple coordinated files (e.g., files storing one or more modules, subprograms, or parts of code). A computer program may be distributed to be executed on a single computer, located in one place, or distributed across multiple locations and interconnected by a communication network. The process described herein may be performed by one or more programmable processors that execute one or more computer programs to perform a function by operating on input data and generating output. Processes and logic flows may also be performed by special-purpose logic circuits, for example, field programmable gate arrays (FPGAs) or application-specific integrated circuits (ASICs), and devices may also be implemented as such circuits. Processors suitable for the execution of a computer program include, for example, general-purpose and special-purpose microprocessors, and any one or more processors of any type of digital computer. Generally, the processor receives instructions and data from read-only memory, random access memory, or both. The essential components of a computer are a processor for executing instructions and one or more data memory devices for storing instructions and data. Generally, a computer may also include one or more mass storage devices for storing data, such as magnetic, magneto-optical disks, or optical disks, or be operably coupled to receive data from or transfer data to them, or both. However, a computer does not require such devices.Furthermore, the computer may be embedded in other devices, for example, mobile phones and personal digital assistants (PDAs). Computer-readable media suitable for storing computer program instructions and data include, for example, semiconductor memory devices, e.g., EPROM, EEPROM, and flash memory devices; magnetic disks, e.g., internal hard disks or removable disks; magneto-optical disks; and all forms of data memory including non-volatile memory, media, and memory devices, including CD-ROM and DVD-ROM disks. The processor and memory may be supplemented by or integrated into special-purpose logic circuits. To provide interaction with a user, the embodiments described herein may be implemented in a computer having a display device for displaying information to a user, e.g., a cathode ray tube (CRT) or liquid crystal display (LCD) monitor, and a keyboard and pointing device, e.g., a mouse or trackball, or a touch screen, to which the user can provide input to the computer. Other types of devices may also be used to provide interaction with a user; For example, input from a user may be received in any form, including acoustic, voice, or haptic input. The embodiments described herein may be implemented in a computing system that includes, for example, a backend component as a data server, or a middleware component, for example, an application server, or a frontend component, for example, a client computer having a graphical user interface or a web browser through which a user can interact with an implementation of the subject described herein, or any combination of one or more such backend, middleware, or frontend components.The components of the system may be interconnected by any form or medium of digital data communication, for example, a communication network. Examples of communication networks include a local area network (“LAN”) and a wide area network (“WAN”), for example, the Internet. A computing system may include clients and servers. Clients and servers are generally located far apart from each other and typically interact through a communication network. The relationship between the client and the server arises from computer programs running on their respective computers that have a client-server relationship with each other.

[0078] In some embodiments, as illustrated in FIGS. 1 and 2, the device (101) may include a reflector (115) comprising a reflective surface (117). In another embodiment, the reflector (115) may include an inherently reflective material such as aluminum, steel, or silver. In other such embodiments, the reflector (115) may include a material such as polyethylene terephthalate (PET) or polycarbonate (PC) which is reflective when placed adjacent to another material having a different refractive index. In another embodiment, the reflector (115) may include an average reflectance of at least 90%, at least 95%, at least 96%, or at least 98% over a wavelength range of at least 400 nm to at least 700 nm. In some embodiments, as illustrated, the reflective surface (117) of the reflector (115) may face a first main surface (105), a second main surface (107), and a sample (103) (e.g., a glass-based substrate) that may include a thickness (109) defined between the first main surface (105) and the second main surface (107) of the sample (103). As illustrated in FIGS. 1 and 2, the reflector (115) may face the second main surface (107) of the sample (103). In some embodiments, the reflector (115) may be configured to reflect light from a light source (121). In another embodiment, the reflector may be configured to reflect light traveling along a first light path (125) incident on a reflective surface (117) to travel through a sample (103) (e.g., a second main surface (107) of the sample (103), a thickness (109) of the sample (103), a first main surface (105) of the sample) and along a second light path (135) toward a detector (131). Throughout the disclosure, the reflector may reflect light by reflecting at least a portion of the light emitted from a light source.

[0079] As illustrated in FIGS. 1 through 4, the device (101, 301) may include a measurement plane (111). As used herein, the measurement plane includes a target location configured to be characterized (e.g., measured) by the device. Referring to FIG. 1, the measurement plane (111) includes a target location (141) on a first main surface (105) and extends in a first direction (113) (illustrated as the z-direction) and a second direction (illustrated as the x-direction). In some embodiments, the target location (141) may be a location on and / or within a sample (103) that the device (101, 301) may be configured to measure. In some embodiments, the measurement plane (111) may extend parallel to the first main surface (105) and / or the second main surface (107) of the sample (103). In another embodiment, as shown in FIGS. 1 to 4, the first main surface (105) may extend along the measurement plane (111).

[0080] In some embodiments, the sample (103) may include a thickness (109) defined between the first main surface (105) and the second main surface (107) opposite the first main surface (105). In another embodiment, the thickness (109) may be about 25 μm or more, about 100 μm or more, about 200 μm or more, about 400 μm or more, about 10 millimeters (mm) or less, about 5 mm or less, about 2 mm or less, or about 1 mm or less. In another embodiment, the thickness (109) may be in the range of about 25 µm to about 10 mm, about 100 µm to about 10 mm, about 200 µm to about 5 mm, about 400 µm to about 2 mm, about 400 µm to about 1 mm, about 25 µm to about 5 mm, about 25 µm to about 2 mm, about 25 µm to about 1 mm, about 100 µm to about 1 mm, or any range or sub-range between these. In some embodiments, the sample (103) may include a length across the first main surface (105) that may extend in a first direction (113) (illustrated as the z-direction). In some embodiments, the sample (103) may include a width in a direction perpendicular to the length (e.g., a second direction illustrated as the x-direction). In another embodiment, the dimensions of the sample (e.g., length, width) may correspond to the dimensions of the consumer electronic product. In some embodiments, the sample may include the consumer electronic product and / or be configured to be included in the consumer electronic product. The consumer electronic product may include a glass-based portion and may further include at least partially electrical components within the housing. The electrical components may include a controller, memory, and a display. The display may be on or adjacent to the front surface of the housing. The consumer electronic product may include a cover substrate placed over the display.

[0081] In some embodiments, the sample (103) may comprise a glass-based sample. As used herein, “glass-based” includes both glass and glass-ceramic, and the glass-ceramic has one or more crystalline phases and an amorphous residual glass phase. The glass-based material is cooled into glass, glass-ceramic, or has already cooled and / or becomes a glass-ceramic material upon further processing. The glass-based material (e.g., glass-based substrate) may comprise an amorphous material (e.g., glass) and optionally one or more crystalline materials (e.g., ceramic). The amorphous material and the glass-based material may be reinforced. As used herein, the term “reinforced” may refer to a material that is chemically reinforced through the ion exchange of larger ions for smaller ions on a substrate surface, for example, as described below. However, other reinforcement methods known in the art, such as thermal tempering, or utilizing a mismatch in the coefficient of thermal expansion between parts of the substrate to create compressive stress and a central tension region, may be used to form the reinforced substrate. Exemplary glass-based materials that may or may not contain lithium include soda-lime glass, alkali aluminosilicate glass, alkali-containing borosilicate glass, alkali-containing aluminoborosilicate glass, alkali-containing phosphosilicate glass, and alkali-containing aluminophosphosilicate glass. In one or more embodiments, the glass-based material may comprise the following in mol%: SiO2 in the range of about 40 mol% to about 80 mol%, Al2O3 in the range of about 10 mol% to about 30 mol%, B2O3 in the range of 0 mol% to about 10 mol%, ZrO2 in the range of 0 mol% to about 5 mol%, P2O5 in the range of 0 mol% to about 15 mol%, TiO2 in the range of 0 mol% to about 2 mol%, R2O in the range of 0 mol% to about 20 mol%, and RO in the range of 0 mol% to about 15 mol%.As used herein, R2O may refer to alkali metal oxides, e.g., Li2O, Na2O, K2O, Rb2O, and Cs2O. As used herein, RO may refer to MgO, CaO, SrO, BaO, and ZnO. In some embodiments, the glass-based material may optionally further comprise Na2SO4, NaCl, NaF, NaBr, K2SO4, KCl, KF, KBr, As2O3, Sb2O3, SnO2, Fe2O3, MnO, MnO2, MnO3, Mn2O3, Mn3O4, and Mn2O7, each in an amount ranging from 0 mol% to about 2 mol%. "Glass-ceramic" comprises a material produced through the controlled crystallization of glass. In some embodiments, the glass-ceramic has a degree of crystallization from about 1% to about 99%. Examples of suitable glass-ceramics may include Li2O-Al2O3-SiO2 system (i.e., LAS-system) glass-ceramics, MgO-Al2O3-SiO2 system (i.e., MAS-system) glass-ceramics, ZnO × Al2O3 × nSiO2 (i.e., ZAS-system), and / or glass-ceramics comprising a dominant crystalline phase including β-quartz solid solution, β-spodumene, cordierite, petalite, and / or lithium disilicate. Glass-ceramic materials may be reinforced using the reinforcement process described herein. In one or more embodiments, the MAS-system glass-ceramic substrate may be reinforced in a molten Li2SO4 salt, thereby Mg. 2+ 2Li for + An exchange of may occur.

[0082] In some embodiments, the sample (103) may be optically transparent. As used herein, “optically transparent” or “optically clear” means an average transmittance of 70% or more in the wavelength range of 400 nm to 700 nm through a 1.0 mm thick piece of material. In some embodiments, the “optically transparent material” or “optically clear material” may have an average transmittance of 75% or more, 80% or more, 85% or more, or 90% or more, 92% or more, 94% or more, 96% or more in the wavelength range of 400 nm to 700 nm through a 1.0 mm thick piece of material. The average transmittance in the wavelength range of 400 nm to 700 nm is calculated by measuring the transmittance of integer wavelengths from about 400 nm to about 700 nm and averaging the measurements.

[0083] In some embodiments, the sample (103) may have a first refractive index. The first refractive index may be a function of the wavelength of light passing through the sample. For light of the first wavelength, the refractive index of the material is defined as the ratio between the speed of light in vacuum and the speed of light in the corresponding material. Without being bound by theory, the refractive index of the sample may be determined using the ratio of the sine of the first angle to the sine of the second angle, where light of the first wavelength is incident from air on the surface of the sample at the first angle and refracts at the sample surface to propagate light at the second angle within the sample. Both the first angle and the second angle are measured with respect to the normal of the optically sharp adhesive surface. In some embodiments, the first refractive index of the sample may be about 1 or more, about 1.3 or more, about 1.4 or more, about 1.5 or more, about 3 or less, about 2 or less, or about 1.7 or less, or about 1.6 or less. In some embodiments, the first refractive index of the sample may be in the range of about 1 to about 3, about 1 to about 2, about 1 to about 1.7, about 1.3 to about 3, about 1.3 to about 2, about 1.3 to about 1.7, about 1.4 to about 2, about 1.4 to about 1.7, about 1.4 to about 1.6, about 1.5 to about 1.6, or any range or sub-range between these.

[0084] In some embodiments, light may be configured to travel through features of the sample to be measured. Throughout the disclosure, if at least a portion of the light emitted from a light source travels through the thickness of the sample and / or through features, the light may travel through the thickness of the sample and / or through features. In another embodiment, as illustrated in FIG. 4, in a light path (e.g., a second light path (135)), a surface feature (401) may include a height (403) and / or width (405) that can be determined using the device (101, 301). For example, the surface feature may affect the surface profile of the sample. In another embodiment, the surface feature may include blisters, bubbling, bumps, cracks, burnout effects, cracks, and / or wrinkles. In another embodiment, light may be configured to travel through subsurface features. In another embodiment, the device may be configured to measure subsurface features even when the measurement plane coincides with the surface of the sample (e.g., a first main surface). In another embodiment, although not illustrated, the measurement plane may affect the subsurface features. For example, as illustrated in FIG. 4, the subsurface features may include inclusions (411) below the first main surface (105) of the sample (103). As used herein, the inclusions include a local concentration of material having a different refractive index, transparency, hardness, Young's modulus, and / or coefficient of thermal expansion compared to the sample as a whole. In some embodiments, the inclusions may include gases, e.g., air, oxygen, nitrogen, hydrogen, carbon dioxide, or a combination thereof. In some embodiments, the inclusions may include metals, e.g., platinum, tin, rhodium, rhenium, osmium, palladium, iridium, or a combination thereof.

[0085] As illustrated in FIGS. 1 to 3, a measurement plane (111) may be positioned between a first region (102) and a second region (104). As illustrated, the first region (102) may face the first main surface (105) of the sample (103), while the second region (104) may face the second main surface (107) of the sample (103). In some embodiments, as illustrated in FIG. 3, a light source (121) may be positioned in the second region (104), while a detector (131) may be positioned in the first region (102). In some embodiments, as illustrated in FIGS. 1 and 2, the light source (121) and the detector (131) may be positioned in the first region (102). In another embodiment, as illustrated, a reflector (115) may be positioned in the second region (104). In another embodiment, the device (101) may be configured to maintain a fixed distance between the light source (121) and the detector (131). For example, as illustrated in FIGS. 1 and 2, the light source (121) and the detector (131) may be attached to a common support (151). By providing a detector comprising one or more wavefront sensors and a light source in a first region facing a second region that includes a reflector having a measurement plane (e.g., a glass-based substrate) between the first region and the second region, alignment problems between the light source and the wavefront sensor may be reduced (e.g., mitigated). Additionally, by providing a common support for both the light source and the wavefront sensor, alignment may be maintained even when subjected to vibration or intentional movement.

[0086] In some embodiments, as illustrated in FIGS. 1 and 2, the angle “A” may be defined between the first optical path (125) and the second optical path (135). In another embodiment, the angle “A” may be about 0.1° or more, about 0.5° or more, about 1° or more, about 2° or more, about 25° or less, about 15° or less, about 5° or less, or about 2° or less. In another embodiment, the angle “A” may be in the range of about 0.1° to about 25°, about 0.1° to about 15°, about 0.1° to about 5°, about 0.1° to about 2°, about 0.5° to about 2°, about 1° to about 2°, about 0.5° to about 15°, about 1° to about 15°, about 1° to about 5°, about 2° to about 5°, or any range or sub-range between these. In another embodiment, as shown in FIGS. 1 and 2, the light source (121) may be rotatable in a first direction (127). In another embodiment, as shown in FIGS. 1 and 2, the detector may be rotatable in a second direction (137) opposite to the first direction (127). In another embodiment, the device may be configured to rotate the light source (121) in a first direction (127) and the detector (131) in a second direction (137) as the path distance (129) and / or detection distance (139) increases.

[0087] As used herein, the path distance is defined as the minimum distance between a light source and a measurement plane. For example, as illustrated in FIGS. 1 to 3, the path distance (129) may be defined between a light source (121) and a measurement plane (111). In some embodiments, the path distance (129) may be adjustable. In another embodiment, the path distance (129) may be about 10 mm or more, about 50 mm or more, about 100 mm or more, about 500 mm or more, about 10 meters or less, about 5 meters or less, or about 1 meter or less. In another embodiment, the path distance (129) may be in the range of about 10 mm to about 10 meters, about 10 mm to about 5 meters, about 10 mm to about 1 meter, about 50 mm to about 1 meter, about 100 mm to about 1 meter, about 500 mm to about 1 meter, about 50 mm to about 10 meters, about 100 mm to about 10 meters, about 500 mm to about 10 meters, about 500 mm to about 5 meters, about 500 mm to about 2 meters, or any range or sub-range between these. In some embodiments, the path distance (129) may be substantially the same as the distance between the light source (121) and the first main surface (105) of the sample (103). By adjusting the distance from the measurement plane, various types of features (e.g., surface profiles, blisters, gas inclusions, metal inclusions) may be distinguishable.

[0088] As used herein, the detection distance is defined as the minimum distance between the detection and the measurement plane. For example, as illustrated in FIG. 1 and FIG. 2, the detection distance (139) may be defined between a detector (131) located in a first area (102) and a measurement plane (111). For example, as illustrated in FIG. 3, the detection distance (303) may be defined between a detector (131) located in a second area (104) and a measurement plane (111). In another embodiment, the detection distance (139, 303) may be about 10 mm or more, about 50 mm or more, about 100 mm or more, about 500 mm or more, about 10 meters or less, about 5 meters or less, or about 1 meter or less. In another embodiment, the detection distance (139, 303) may be a range of about 10 mm to about 10 meters, about 10 mm to about 5 meters, about 10 mm to about 1 meter, about 50 mm to about 1 meter, about 100 mm to about 1 meter, about 500 mm to about 1 meter, about 50 mm to about 10 meters, about 100 mm to about 10 meters, about 500 mm to about 10 meters, about 500 mm to about 5 meters, about 500 mm to about 2 meters, or any range or sub-range between these. In some embodiments, the detection distance (139, 303) may be substantially the same as the distance between the detector (131) and the first main surface (105) of the sample (103). Adjusting the distance from the measurement plane may be used to adjust the size of the feature that can be detected accurately and quantitatively.

[0089] An embodiment of a method for measuring features of a sample (e.g., a glass-based substrate) according to an embodiment of the present disclosure will be described with reference to the flowchart of FIG. 11.

[0090] In the first step (1101) of the method for measuring features of a sample, the method may begin by providing a sample (103). In some embodiments, the sample (103) may comprise a glass-based substrate. In some embodiments, the sample (103) may be provided by purchasing or otherwise acquiring a sample, or by forming a sample using a method known in the art. In another embodiment, a glass-based sample or a layer of a glass-based sample may be provided by forming it using various ribbon-forming processes, e.g., slot drawing, down-drawing, fusion down-drawing, up-drawing, press roll, re-drawing, or float. In some embodiments, the sample (103) may comprise a glass-based substrate manufactured in a glass manufacturing device located upstream of the device (101, 301) (e.g., in the opposite direction (113) in FIGS. 1 to 3). In some embodiments, the step (1101) of providing the sample (103) may arbitrarily provide the sample by moving the sample (103) (e.g., a glass-based substrate) in a direction (113) to position the sample (103). In another embodiment, as illustrated in FIGS. 1 and 2, the direction (113) may substantially cross the thickness (109) of the sample (103) (e.g., a glass-based substrate). As illustrated in the flowchart of FIG. 11, when the sample (103) is moved in the step (1101) of providing the sample (103), the movement may occur prior to the step (1105) described below and / or prior to the step (1109).

[0091] After step (1101), the method may proceed to step (1103), which includes the step of emitting light from the light source (121). In some embodiments, the light emitted from the light source (121) may travel toward the measurement plane (111) along the first light path (125). In some embodiments, the light source (121) may emit light substantially continuously. In some embodiments, the light source (121) may emit one or more light pulses. In some embodiments, the light source (121) may emit coherent light. In some embodiments, the path distance (129) between the light source (121) and the measurement plane (111) may be within one or more of the ranges described above for the path distance (129).

[0092] After step (1103), the method may proceed to step (1105), which includes the step of striking light onto a measurement plane (111). As described above, the measurement plane (111) may extend across (e.g., orthogonally) the thickness (109) of the sample (103) (e.g., a glass-based substrate), and the thickness may be defined between the first main surface (105) and the second main surface (107) of the sample (103) and may be within any of the aforementioned ranges for the thickness (109). In some embodiments, as shown in FIG. 1 and FIG. 2, the measurement plane (111) may be parallel to and / or coincide with the first main surface (105) of the sample (103). In another embodiment, as shown in FIG. 1, the step of striking light onto the measurement plane (111) may further include the step of striking light onto the first main surface (105) of the sample (103). In another embodiment, as shown in FIG. 2, light may strike the measurement plane (111) at a location where the sample (103) (e.g., the first main surface (105)) is not present.

[0093] After step (1105), the method may proceed to step (1107), which includes the step of reflecting light toward a sample (103) (e.g., a glass-based substrate). As illustrated in FIGS. 1 and 2, the step of reflecting light toward the sample (103) may include the step of reflecting light from a reflective surface (117) of a reflector (115). In some embodiments, as illustrated, the angle between the light incident on the reflective surface (117) and the reflected light may be within one or more of the aforementioned ranges for angle “A”.

[0094] After step (1107), the method may proceed to step (1109), which includes the step of transmitting light (e.g., reflected light) toward a first main surface (105) of the sample (103) (e.g., glass-based substrate) through the thickness (109) of the sample (103) (e.g., glass-based substrate). In some embodiments, step (1109) may further include the step of striking the light (e.g., reflected light) against a second main surface (107) of the sample (103) before transmitting the light through the thickness (109) of the sample (103). In some embodiments, step (1109) may include the step of moving the sample (103) (e.g., glass-based substrate) in a direction (113) when the light is transmitted through the thickness (109) of the sample. In another embodiment, as described above and illustrated in FIGS. 1 to 3, the direction (113) may substantially cross (e.g., orthogonal) the thickness (109) of the sample (103) (e.g., glass-based substrate).

[0095] After step (1109), the method may proceed to step (1111), which includes transmitting light (e.g., reflected light) through a target location (141) on a first main surface (105) of a sample (103) (e.g., a glass-based substrate) as illustrated in FIGS. 1 to 3. In some embodiments, the measurement plane (111) may include a target location (141) on the first main surface (105). In some embodiments, as illustrated in FIG. 4, the target location may include a surface feature (401) to be measured. As previously described, the surface feature may affect the surface profile of the sample and / or the surface feature may include blisters, bubbling, bumps, cracks, burn-out effects, cracks, and / or wrinkles. In some embodiments, as illustrated in FIG. 4, light may be configured to travel through a subsurface feature before being transmitted through a target location (141) on the first main surface (105) of the sample (103). In another embodiment, the device may be configured to measure a subsurface feature even when the measurement plane coincides with the surface of the sample (e.g., the first main surface). In another embodiment, although not illustrated, the measurement plane may affect an inclusion that may include a subsurface feature, e.g., a gas (e.g., air, oxygen, nitrogen, hydrogen, carbon dioxide) and / or a metal (e.g., platinum, tin, rhodium, rhenium, osmium, palladium, iridium).

[0096] After step (1111), the method may proceed to step (1113), which includes splitting light (e.g., reflected light) into a plurality of beams. In some embodiments, as illustrated in FIGS. 5 and 6, the light may be transmitted along a second light path (135) and strike a beam splitter (505). In some embodiments, as illustrated, the light may strike an optical system, e.g., a first focusing lens (513) capable of changing the magnification and / or focus of the light. In some embodiments, as described above, the light may be split by the beam splitter (505) into a plurality of beams including a first beam (507) and a second beam (509). For example, as illustrated, the first beam (507) may be directed toward a first wavefront sensor (501) and / or the second beam (509) may be directed toward a second wavefront sensor (503).

[0097] After step (1113), the method may proceed to step (1115), which includes changing the magnification of at least one of the plurality of beams. In some embodiments, as shown in FIGS. 5 and 6, the magnification of the first beam (507) may be changed by a second focusing lens (517, 603). In another embodiment, the magnification of the first beam (507) from the first focusing lens (513) and / or the second focusing lens (517, 603) may be within one or more of the aforementioned ranges (e.g., 2x magnification to about 50x magnification). In some embodiments, as shown in FIGS. 5 and 6, the magnification of the second beam (509) may be changed by a third focusing lens (515). In another embodiment, the magnification of the second beam (509) from the first focusing lens (513) and / or the third focusing lens (515) may be within one or more of the aforementioned ranges (e.g., about 2x magnification to about 50x magnification). In another embodiment, the third focusing lens (515) may change the magnification of the second beam (509) relative to the magnification of the first beam (507) (e.g., from the second focusing lens (517, 603)). In another embodiment, the magnification of the first beam (507) may be greater than the magnification of the second beam (509), and the magnification of the first beam (507) as a percentage of the magnification of the second beam (509) may be within one or more of the aforementioned ranges (e.g., about 150% to about 1000%). In another embodiment, the magnification of the second beam (509) may be greater than the magnification of the first beam (507), and as a percentage of the magnification of the first beam (507), the magnification of the second beam (509) may be within one or more of the aforementioned ranges (e.g., about 150% to about 1000%).

[0098] After step (1115), the method may proceed to step (1117), which includes detecting light (e.g., reflected light, transmitted light) using at least one wavefront sensor of the detector (131). Throughout the disclosure, the detector may reflect light when at least one wavefront sensor detects at least a portion of the light emitted from the light source. As previously described, light transmitted through the target location (141) may be detected using at least one wavefront sensor of the detector (131). In some embodiments, the detection distance (139) between the detector (131) and the measurement plane (111) may be within one or more of the ranges described above for the detection distance (139). In some embodiments, as illustrated in FIGS. 5 and 6, light may be detected by the first wavefront sensor (501) when the first wavefront sensor (501) detects the first beam (507) among a plurality of beams. In another embodiment, as illustrated in FIG. 6, light (e.g., the first beam (507)) may be further detected by an optical camera (601). In some embodiments, as illustrated in FIG. 6, light (e.g., the first beam (507)) may be detected by an optical camera (601). In some embodiments, as illustrated in FIG. 5 and FIG. 6, light may be detected using a second wavefront sensor (503) when the second wavefront sensor (503) detects the second beam (509) among a plurality of beams.

[0099] Step (1117) may further include the step of generating a first signal with at least one wavefront sensor based on light (e.g., detected light, transmitted light, detected light). In some embodiments, the signal may be generated by a first wavefront sensor (501) and / or a second wavefront sensor (503). In some embodiments, the first signal may include a series of distances between a neutral position and a corresponding spot as described above in relation to FIGS. 7 through 10. In some embodiments, the first signal may be transmitted to a controller (119) along a second communication path (133). In some embodiments, the first signal may be a first signal generated by at least one wavefront sensor for a sample (103) at a current position. In some embodiments, a signal may not be generated by at least one wavefront sensor after moving the sample (103) (e.g., a glass-based substrate) in step (1101) before the first signal is generated by at least one wavefront sensor. In some embodiments, at least no signal may be generated by a wavefront sensor after moving the sample (103) (e.g., a glass-based substrate) in step (1101) before transmitting light through the thickness (109) in step (1109). In some embodiments, the first signal may be a first signal generated by at least one wavefront sensor for the sample (103) at the current position.

[0100] After step (1117), the method may proceed to step (1119), which may include a step of adjusting the detection distance (139) between the measurement plane (111) of the sample (103) (e.g., the first main surface (105)) and the detector (131). In some embodiments, step (1119) may include a step of adjusting the path distance (129) between the measurement plane (111) (e.g., the first main surface (105)). In another embodiment, the path distance (129) may be adjusted by substantially the same amount as the detection distance (139) is adjusted. In some embodiments, the detection distance (139) may be increased. Without being bound by theory, wavefront distortion from subsurface features may decay faster than wavefront distortion from surface features. Consequently, wavefront distortion from surface features and subsurface features can be separated by comparing light (e.g., generated signal) detected at two or more different detection distances (139).

[0101] After step (1119), the method may proceed to step (1121), which includes the step of generating a second signal. In some embodiments, the light may include a plurality of pulses. A first pulse among the plurality of pulses may be detected by a detector (131) that includes at least one wavefront sensor (e.g., a first wavefront sensor (501), a second wavefront sensor (503)) to generate a first signal. In another embodiment, a second pulse among the plurality of pulses may be emitted from a light source (121). In another embodiment, the second pulse may strike a measurement plane (111) before being reflected from the reflective surface (117) of the reflector (115) toward the sample (103) (e.g., a glass-based substrate). The second pulse (e.g., the reflected second pulse) may be transmitted through the thickness (109) of the sample (103) (e.g., a glass-based substrate). The second pulse can be transmitted through a target location (141) on the first main surface (105) of the sample (103) (e.g., a glass-based substrate). The second pulse transmitted through the target location (141) can be detected using a detector (131) comprising at least one wavefront sensor. The detector (131) comprising at least one wavefront sensor can generate a second signal based on the detected second pulse.

[0102] After step (1121), the method may proceed to step (1123), which includes the step of moving the sample (103) in a direction (113). In some embodiments, as illustrated in FIGS. 1 through 3, step (1123) may include the step of moving the sample (103) (e.g., a glass-based substrate) in a direction (113) to position the sample (103). In another embodiment, as illustrated in FIGS. 1 through 3, the direction (113) may substantially cross (e.g., orthogonal) the thickness (109) of the sample (103) (e.g., a glass-based substrate). As illustrated in the flowchart of FIG. 11, the movement in step (1123) may occur after detecting light transmitted through the target position (141) in step (1117). In some embodiments, the measurement time may be defined between (i) the end of moving the sample (103) (e.g., glass-based substrate) in step (1101) before transmitting light through the thickness (109) in step (1109) and (ii) the start of moving the sample (103) (e.g., glass-based substrate) in step (1123) after detecting the transmitted light through the target position (141) using at least one wavefront sensor (e.g., first wavefront sensor (501), second wavefront sensor (503)) in step (1117). In another embodiment, the measurement time may be about 10 microseconds (μs) or more, about 100 μs or more, about 1 millisecond (ms) or more, about 10 ms or more, about 100 ms or less, about 50 ms or less, about 20 ms or less, or about 10 ms or less. In another embodiment, the measurement time may be in the range of about 10 μs to about 100 ms, about 100 μs to about 100 ms, about 1 ms to about 100 ms, about 1 ms to about 50 ms, about 10 ms to about 50 ms, about 10 ms to about 20 ms, or any range or sub-range between these.

[0103] After step (1123), the method may proceed to step (1125), which includes the step of measuring a feature using at least a first signal. In some embodiments, step (1125) may include the step of measuring a feature using a first signal and a second signal. In another embodiment, the first signal and the second signal may be compared to more accurately measure surface features and / or subsurface features. In another embodiment, a plurality of measurements corresponding to a plurality of detection signals may be combined (e.g., averaged) to generate a composite detection signal. In some embodiments, the step of measuring a feature may include the step of determining the surface profile of the sample (103) (e.g., a glass-based substrate) at a target location (141) of the first main surface (105). In some embodiments, the step of measuring a feature may include the step of determining the height and / or width of the feature of the sample (103) (e.g., a glass-based substrate) based on at least a first signal (e.g., a generated first signal). In some embodiments, the step of measuring a feature may include using at least one first signal and the refractive index of a sample (103) (e.g., a glass-based substrate).

[0104] In some embodiments, a method for measuring features of a sample (e.g., a glass-based substrate) according to an embodiment of the present disclosure may proceed sequentially along steps 1101, 1103, 1105, 1107, 1109, 1111, 1113, 1115, 1117, 1119, 1121, 1123, and 1125 as described above. In some embodiments, the method may follow the arrow (1102) from step (1103) to step (1109) when using, for example, the device (301) shown in FIG. 3. In another embodiment, the method of following the arrow (1102) may omit step (1105), which includes the step of colliding with the measurement plane (111) and / or reflecting light at step (1107) using the device (301) shown in FIG. 3. In some embodiments, the method may follow the arrow (1104) from step (1111) to step (1115) when the beam splitter (505) of FIGS. 5 and 6 is omitted, for example, when the signal is detected by a single wavefront sensor (e.g., a first wavefront sensor (501)). In some embodiments, the method may follow the arrow (1106) from step (1111) to step (1117) to detect light with a single wavefront sensor, for example, without splitting the light into multiple beams at step (1113) and / or without changing the magnification of the beam among the multiple beams at step (1115). In some embodiments, for example, when a feature is measured based on the first signal, the method may follow the arrow (1108) from step (1117) to step (1125). For example, the method of following the arrow (1108) may omit the step of generating a second signal in step (1121), as well as the step of adjusting the detection distance (139) in step (1119) and / or the step of moving the sample (103) in step (1123).In some embodiments, the method may follow the arrow (1110) from step (1117) to step (1121) when multiple signals are generated at the same detection distance (139) by omitting, for example, the step (1119) which includes adjusting the detection distance (139). In some embodiments, the method may follow the arrow (1112) from step (1121) to step (1125) by omitting the step of moving the sample (103) at step (1123) when, for example, the sample (103) is subsequently measured at the same location (e.g., when different features are measured at approximately the same location) and / or when the sample (103) is moved after the method is completed after step (1125). In some embodiments, the method may follow the arrow (1114) from step (1117) to step (1123) when the first signal is used to measure a feature and the next signal is used to measure another feature at a different location of the sample. For example, the following arrow (1114) may omit the step (1121) of generating a second signal and / or the step (1119) of adjusting the detection distance (139). It should be understood that any of the above options may be combined to measure features of a sample (e.g., a glass-based substrate) according to embodiments of the present disclosure.

[0105] yes

[0106] Various embodiments will be made clearer by the following examples. FIG. 12 demonstrates the accuracy and precision of the apparatus and method of the present disclosure for measuring features of a sample. In FIG. 12, the horizontal axis (1201) (e.g., x-axis) is the height of a surface feature in nanometers (nm) of a glass-based substrate measured using a Zygo NewView 9000 profilometer. The vertical axis (1203) (e.g., y-axis) is the height of a surface feature in nanometers (nm) of a glass-based substrate measured using the apparatus shown in FIG. 1, where the light source (121) includes an InGaAs laser diode. For most wavefront measurements of features having a height of 1,000 nm to 2,250 nm, the detector (131) includes a Shack-Hartman wavefront sensor with a total magnification of 10x. For other wavefront sensor measurements, the detector (131) includes a four-wavelength lateral shear interferometer with a total magnification of 20x, 40x, or 100x. Data corresponding to the heights of various features measured using a profilometer and a wavefront sensor are plotted in FIG. 12. Measurements from the Shack-Hartmann wavefront sensor and the four-wavelength lateral shear interferometer are combined in FIG. 12 because the measurements from the two detectors correspond well to the profilometer measurements. A guideline (1205) having a slope of substantially 1 has an R of 0.9977. 2 It is suitable for data points having. A linear fit indicates that the apparatus and method of the present disclosure can provide a measurement that directly corresponds to the actual feature being measured. A one-to-one correspondence indicates that the apparatus and method of the present disclosure can provide a quantitative measurement. A low deviation of the point from the line indicates that the apparatus and method of the present disclosure can provide an accurate measurement.

[0107] The above disclosure provides an apparatus and method for measuring features on a glass-based substrate that can facilitate rapid, inline, quantitative measurement and / or characterization of features while reducing the need for recalibration and / or realignment, which can increase production efficiency and reduce processing time. Providing at least one fracture sensor enables quantitative and accurate measurement of vibration-insensitive features, thereby reducing, for example, the need for recalibration of the apparatus. Providing a fracture sensor may enable measurement while the glass-based substrate is moving and / or recently moved. Providing a fracture sensor may enable rapid measurement of features (e.g., about 100 milliseconds or less). Additionally, the fracture sensor may be integrated with an additional (e.g., conventional) inspection device (e.g., a camera).

[0108] By providing at least one wavefront sensor, measurements may be possible at various distances from a measurement plane (e.g., a first main surface of a glass-based substrate). Adjusting the distance from the measurement plane may allow various types of features (e.g., surface profiles, blisters, gas inclusions, metal inclusions) to be distinguishable. Additionally, adjusting the distance from the measurement plane may be used to control the size of features that can be detected accurately and quantitatively. By providing two or more wavefront sensors with different magnifications, a wide range of feature sizes may be measured simultaneously. For example, using two or more wavefront sensors with different magnifications may reduce the need for subsequent inspection (e.g., re-inspection) of features. By providing one or more wavefront sensors and a light source in a first region facing a second region that includes a reflector having a measurement plane (e.g., a glass-based substrate) between the first region and the second region, alignment problems between the light source and the wavefront sensor may be reduced (e.g., mitigated). For example, providing a common support for both the light source and the wavefront sensor allows alignment to be maintained even when subjected to vibration or intentional movement.

[0109] As used herein, directional terms, e.g., up, down, right, left, front, rear, top, bottom, are used merely by reference to the drawings as illustrated and are not intended to imply absolute orientation.

[0110] It will be understood that various disclosed embodiments may include features, elements, or steps described in relation to such embodiments. Additionally, it will be understood that features, elements, or steps described in relation to one embodiment may be interchanged or combined with alternative embodiments in various unexemplified combinations or permutations.

[0111] Additionally, it should be understood that when used herein, the terms “the,” “a,” or “an” mean “at least one” and should not be limited to “only one” unless clearly indicated otherwise. For example, references to “components” include embodiments having two or more such components unless otherwise specified in the context. Likewise, “plural” is intended to indicate “two or more.”

[0112] As used herein, the term “about” means that the amount, size, formulation, parameter, and other quantity and characteristic are not precise and do not need to be precise, but are approximate and / or larger or smaller as necessary, reflecting tolerances, conversion factors, rounding, measurement errors, etc., and other factors known to those skilled in the art. A range may be expressed in this specification as “about” from one specific value and / or “about” another specific value. When such a range is expressed, the embodiment includes from one specific value and / or another specific value. Similarly, when a value is expressed as an approximation by the use of the antecedent “about,” it will be understood that the specific value forms another embodiment. Regardless of whether the numerical value or endpoint of the range in this specification refers to “about,” the numerical value or endpoint of the range is intended to include two embodiments: one modified by “about” and one not modified by “about.” It will be further understood that each endpoint of the range is important in relation to and independently of the other endpoint.

[0113] As used herein, the terms “substantial,” “substantially,” and variations thereof are intended to indicate that a described feature is identical or approximately identical to a value or description, unless otherwise noted. For example, a “substantially planar” surface is intended to indicate a surface that is planar or approximately planar. Additionally, as defined above, “substantially similar” is intended to indicate that two values ​​are identical or approximately identical. In some embodiments, “substantially similar” may indicate values ​​within approximately 10% of each other, for example, within approximately 5% of each other, or within approximately 2% of each other.

[0114] Unless otherwise explicitly stated, any method described herein is not to be interpreted as requiring the steps to be performed in a specific order. Accordingly, where a method claim does not specify the actual order in which the steps are followed, or where the claims or description do not specifically state that the steps must be limited to a specific order, it is not intended in any way to imply any specific order.

[0115] It should be understood that while various features, elements, or steps of a particular embodiment may be disclosed using the transition phrase "comprising," alternative embodiments are implied that which may be described using the transition phrases "comprising" or "essentially comprising." Thus, for example, an implied alternative embodiment for a device comprising A+B+C includes an embodiment in which the device comprises A+B+C and an embodiment in which the device essentially comprises A+B+C. As used herein, the terms "comprising" and "comprising" and variations thereof should be interpreted as synonyms and open-ended unless otherwise indicated.

[0116] The above embodiments and features of these embodiments are exemplary and may be provided alone or in any combination with any one or more features of other embodiments provided herein without departing from the scope of the present disclosure.

[0117] It will be apparent to those skilled in the art that various modifications and variations may be made to the present disclosure without departing from the spirit and scope of the present disclosure. Accordingly, the present disclosure is intended to include modifications and variations of the embodiments provided herein that fall within the scope of the appended claims and their equivalents.

Claims

Claim 1 A device for measuring features of a glass-based substrate, comprising: a light source positioned in a first region and at least one wavefront sensor positioned in the first region; a reflector positioned in a second region; and a measurement plane of the glass-based substrate positioned between the first region and the second region, wherein the light source is configured to emit light that strikes the measurement plane, the reflector is configured to reflect light from the light source, and at least one wavefront sensor is configured to detect light reflected by the reflector; a beam splitter configured to split the light into a plurality of beams; and at least one wavefront sensor comprises a first wavefront sensor configured to detect a first beam among a plurality of beams and a second wavefront sensor configured to detect a second beam among a plurality of beams. Claim 2 In claim 1, the device is adjustable in the path distance between the light source and the measurement plane. Claim 3 A device according to claim 1, wherein the detection distance between at least one wavefront sensor and a measurement plane is adjustable. Claim 4 A device according to claim 1, wherein the light source is configured to emit light including coherent light. Claim 5 In paragraph 1, the device is configured such that the light source emits light including pulses. Claim 6 In paragraph 1, the device, wherein the light source includes a laser. Claim 7 A device according to claim 1, further comprising an optical device configured to change the magnification of the first beam. Claim 8 A device according to claim 1, further comprising an optical camera configured to detect a first beam among a plurality of beams. Claim 9 A method for measuring features of a glass-based substrate, comprising: a step of transmitting reflected light toward a first main surface of the glass-based substrate through the thickness of the glass-based substrate and through a target position of the first main surface of the glass-based substrate, wherein the thickness is defined between the first main surface and the second main surface; a step of detecting the light transmitted through the target position using at least one wavefront sensor; a step of generating a first signal with at least one wavefront sensor based on the detected light; a step of moving the glass-based substrate in a direction across the thickness of the glass-based substrate before transmitting the light through the thickness; a step of moving the glass-based substrate in a direction across the thickness of the glass-based substrate after detecting the light transmitted through the target position using at least one wavefront sensor; a step of splitting the light transmitted through the target position into a plurality of beams including a first beam and a second beam; and a step of changing the magnification of the first beam, wherein the step of detecting the transmitted light using at least one wavefront sensor comprises: a step of detecting the first beam with a first wavefront sensor of at least one wavefront sensor; A method comprising the step of detecting a second beam with a second wavefront sensor of at least one wavefront sensor, wherein the measurement time defined between the end of moving the glass-based substrate before transmitting light through the thickness and the start of moving the glass-based substrate after detecting the light transmitted through the target position using at least one wavefront sensor is 100 milliseconds or less. Claim 10 A method according to claim 9, comprising the step of striking light onto a measurement plane of a glass-based substrate, wherein the measurement plane extends across the thickness of the glass-based substrate and the thickness is defined between a first main surface of the glass-based substrate and a second main surface of the glass-based substrate; and further comprising the step of reflecting light toward the glass-based substrate before transmitting the light through the thickness. Claim 11 A method according to claim 9, further comprising the step of determining the height, or width, or height and width of a feature of a glass-based substrate based on a first signal generated. Claim 12 In claim 11, the step of determining the height or width, or both height and width, of a feature of a glass-based substrate is additionally based on the refractive index of the glass-based substrate. Claim 13 A method according to claim 11, further comprising the step of detecting a first beam with an optical camera. Claim 14 In claim 9, the light comprises a first pulse, and the method further comprises: adjusting the detection distance between a first main surface and at least one wavefront sensor; striking a second pulse on a measurement plane; reflecting the second pulse toward a glass-based substrate and through the thickness of the glass-based substrate; transmitting the reflected second pulse toward a first main surface of the glass-based substrate and through a target position on the first main surface of the glass-based substrate; detecting the second pulse transmitted through the target position using at least one wavefront sensor; and generating a second signal with at least one wavefront sensor based on the detected second pulse. Claim 15 A method according to claim 14, further comprising the step of measuring a feature using a first signal and a second signal. Claim 16 delete Claim 17 delete Claim 18 delete Claim 19 delete Claim 20 delete Claim 21 delete Claim 22 delete Claim 23 delete Claim 24 delete Claim 25 delete Claim 26 delete Claim 27 delete Claim 28 delete Claim 29 delete Claim 30 delete Claim 31 delete Claim 32 delete Claim 33 delete Claim 34 delete Claim 35 delete Claim 36 delete Claim 37 delete Claim 38 delete Claim 39 delete Claim 40 delete

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