Back-light unit having light-emitting chips and Display apparatus having the same

Abstract

The present invention relates to a backlight unit comprising light-emitting chips and a display device comprising the same. The backlight unit may include a driving voltage line located on a light source substrate and a ground voltage line spaced apart from the driving voltage line. The light-emitting chips may be located on a lower insulating film covering the driving voltage line and the ground voltage line. A driving chip electrically connected to the ground voltage line may be located on the light source substrate. Each light-emitting chip may be electrically connected between the driving voltage line and the driving chip by light-emitting connection lines. A driving dummy pattern and / or a ground dummy pattern may be located between the light-emitting chips and the light-emitting connection lines. The driving dummy pattern may be electrically connected to the driving voltage line, and the ground dummy pattern may be electrically connected to the ground voltage line. Accordingly, a variation in brightness of the light-emitting chips may be prevented in the backlight unit and the display device comprising the same.

Description

Technology Field

[0001] The present invention relates to a backlight unit comprising light-emitting chips positioned side by side on a light source substrate, and a display device comprising the same. Background Technology

[0002] Generally, a display device provides an image to a user. For example, the display device may include a liquid crystal panel located on a backlight unit. The backlight unit may provide light to the liquid crystal panel. For example, the backlight unit may have a laminated structure of a light source module and an optical sheet.

[0003] The light source module may include light-emitting chips. Each light-emitting chip may emit light. For example, the light-emitting chips may be positioned side by side on a light source substrate. A driving voltage line, a ground voltage line, and a driving chip may be positioned on the light source substrate. The driving chip may be electrically connected to the ground voltage line. Each light-emitting chip may be electrically connected between the driving voltage line and the driving chip by light-emitting connection lines.

[0004] However, in the backlight unit and the display device including the same, the driving voltage applied to each light-emitting chip or the ground voltage applied to the driving chip may vary depending on the resistance of the driving voltage line and / or the resistance of the ground voltage line. Accordingly, a variation in brightness of each light-emitting chip may occur in the backlight unit and the display device including the same. The problem to be solved

[0005] The problem that the present invention aims to solve is to provide a backlight unit capable of preventing brightness deviation of each light-emitting chip and a display device including the same.

[0006] Another problem that the present invention aims to solve is to provide a backlight unit capable of lowering the resistance of the driving voltage line and / or the resistance of the ground voltage line without reducing process efficiency, and a display device including the same.

[0007] The problems that the present invention aims to solve are not limited to those mentioned above. Problems not mentioned herein will be clearly understood by a person skilled in the art from the description below. means of solving the problem

[0008] A backlight unit according to the technical concept of the present invention for achieving the above-mentioned problem includes a light source substrate. A ground voltage line and a lower insulating film are located on the light source substrate. The lower insulating film covers the ground voltage line. Light-emitting chips and light-emitting connection lines are located on the lower insulating film. The light-emitting chips are spaced apart from the ground voltage line. The light-emitting connection lines electrically connect the light-emitting chips. A ground dummy pattern is located between the light-emitting chips and the light-emitting connection lines. The ground dummy pattern overlaps with the ground voltage line. The ground dummy pattern is electrically connected to the ground voltage line.

[0009] The ground pile pattern may contain the same material as the light-emitting connection lines.

[0010] A driving voltage line may be located between the light source substrate and the lower insulating film. The driving voltage line may be spaced apart from the ground voltage line. A driving chip may be located outside the light-emitting chips, light-emitting connection lines, and ground dummy pattern. The driving chip may be electrically connected to the ground voltage line. Each light-emitting chip may be electrically connected between the driving voltage line and the driving chip.

[0011] Light-emitting chips can be connected in series between the driving voltage line and the driving chip by light-emitting connection lines.

[0012] A driving dummy pattern may be located between the light-emitting chips and the light-emitting connection lines. The driving dummy pattern may overlap with the driving voltage line. The driving dummy pattern may be electrically connected to the driving voltage line.

[0013] The driving dummy pattern may contain the same material as the ground dummy pattern.

[0014] The lower insulating film may have a laminated structure of an inorganic film made of an inorganic insulating material and an organic film made of an organic insulating material.

[0015] The lowest layer of the lower insulating film located near the ground voltage line and the uppermost layer of the lower insulating film located near the ground pile pattern may be inorganic films.

[0016] A display device according to the technical concept of the present invention for achieving the above-mentioned problem includes a backlight unit. The backlight unit has a laminated structure of a light source module and an optical sheet. A liquid crystal panel is located on the optical sheet of the backlight unit. The light source module includes a light source substrate, a driving voltage line, a lower insulating film, light-emitting chips, a driving chip, light-emitting connection lines, and a driving dummy pattern. The driving voltage line is located on the light source substrate. The lower insulating film covers the driving voltage line. The light-emitting chips are located on the lower insulating film. The driving chip is located on the outside of the light-emitting chips. The light-emitting connection lines electrically connect each light-emitting chip between the driving voltage line and the driving chip. The driving dummy pattern is located between the light-emitting chips and the light-emitting connection lines. The light-emitting chips are located on the outside of the driving voltage line. The driving dummy pattern is electrically connected to the driving voltage line.

[0017] The driving dummy pattern may contain the same material as the light-emitting connection lines.

[0018] An upper insulating film may be positioned over the light-emitting connection lines and the driving dummy pattern. The upper insulating film may surround the light-emitting chips. An optical sheet may include a reflector positioned on the upper insulating film. The reflector may include a reflection pattern and a scattering layer. The reflection pattern may include a conductive material. The scattering layer may cover the reflection pattern. The reflection pattern may be electrically connected to the driving dummy pattern.

[0019] The reflection pattern may include metal. The scattering layer may include an insulating material.

[0020] A ground voltage line may be located between the light source substrate and the lower insulating film. The ground voltage line may be located on the outside of the light-emitting chips. A ground dummy pattern may be located between the lower insulating film and the upper insulating film. The ground dummy pattern may be electrically connected to the ground voltage line and the reflection pattern.

[0021] The ground voltage line may contain the same material as the driving voltage line.

[0022] The ground voltage line can be located on the same layer as the driving voltage line. The ground dummy pattern can be located on the same layer as the driving dummy pattern and the light-emitting connection lines. Effects of the invention

[0023] A backlight unit and a display device including the same according to the technical concept of the present invention include a lower insulating film covering a driving voltage line and a ground voltage line, light-emitting chips located on the lower insulating film, and light-emitting connection lines connecting the light-emitting chips, wherein a driving dummy pattern electrically connected to the driving voltage line and / or a ground dummy pattern electrically connected to the ground voltage line may be located between the light-emitting chips and the light-emitting connection lines. Accordingly, in the backlight unit and the display device including the same according to the technical concept of the present invention, the resistance of the driving voltage line and / or the resistance of the ground voltage line may be reduced. Therefore, in the backlight unit and the display device including the same according to the technical concept of the present invention, a variation in brightness of the light-emitting chips may be prevented. Brief explanation of the drawing

[0024] FIG. 1 is a schematic diagram showing a display device according to an embodiment of the present invention. FIG. 2 is a drawing showing a part of a light source module in a display device according to an embodiment of the present invention. Figure 3 is a drawing showing a cross-section cut along the line I-I' of Figure 2. FIGS. 4 to 8 are schematic drawings illustrating a method for forming a backlight unit in a display device according to an embodiment of the present invention. FIGS. 9 and 10 are drawings showing a display device according to another embodiment of the present invention. Specific details for implementing the invention

[0025] Detailed information regarding the above-mentioned objectives, technical configuration, and resulting effects of the present invention will be more clearly understood through the following detailed description with reference to the drawings illustrating embodiments of the present invention. Here, since the embodiments of the present invention are provided to ensure that the technical concept of the present invention is sufficiently conveyed to those skilled in the art, the present invention may be embodied in other forms so as not to be limited to the embodiments described below.

[0026] Additionally, parts indicated by the same reference number throughout the specification refer to the same components, and the length and thickness of layers or regions in the drawings may be exaggerated for convenience. Furthermore, where it is stated that a first component is "on" a second component, this includes not only the case where the first component is located on the upper side in direct contact with the second component, but also the case where a third component is located between the first component and the second component.

[0027] Here, the terms first, second, etc. are used to describe various components and to distinguish one component from another. However, within the scope of the technical concept of the present invention, the first component and the second component may be named arbitrarily for the convenience of those skilled in the art.

[0028] The terms used in the specification of the present invention are used merely to describe specific embodiments and are not intended to limit the invention. For example, a component expressed in the singular includes a plurality of components unless the context clearly implies only the singular. Furthermore, in the specification of the present invention, terms such as "comprising" or "having" are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0029] Additionally, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in the specification of the present invention.

[0030] (Example)

[0031] FIG. 1 is a schematic diagram showing a display device according to an embodiment of the present invention. FIG. 2 is a diagram showing a part of a light source module in a display device according to an embodiment of the present invention. FIG. 3 is a diagram showing a cross-section cut along the line I-I' of FIG. 2.

[0032] Referring to FIGS. 1 to 3, a display device according to an embodiment of the present invention may include a backlight unit (BL) and a liquid crystal panel (LP). The liquid crystal panel (LP) may generate an image to be provided to a user using light supplied from the backlight unit (BL). For example, the liquid crystal panel (LP) may include a first substrate having a plurality of pixel electrodes formed thereon, a second substrate having a common electrode formed thereon, and a liquid crystal layer located between the first substrate and the second substrate.

[0033] The backlight unit (BL) can supply light to the entire liquid crystal panel (LP). For example, the backlight unit (BL) may have a stacked structure of a light source module (100) and an optical sheet (200).

[0034] The light source module (100) can generate light to be supplied to the liquid crystal panel (LP). For example, the light source module (100) may include light-emitting chips (150) located on a light source substrate (110). The light source substrate (110) may support the light-emitting chips (150). The light source substrate (110) may include an insulating material. For example, the light source substrate (110) may include glass or plastic. Each light-emitting chip (150) may emit light. For example, each light-emitting chip (150) may include a light-emitting diode. The light-emitting chips (150) may be located side by side on the surface of the light source substrate (110). For example, the backlight unit (BL) of the display device according to an embodiment of the present invention may be a direct light type.

[0035] On the light source substrate (110), a ground voltage line (120) for transmitting a ground voltage, a driving voltage line (130) for supplying a driving voltage to the light-emitting chips (150), and a driving chip (140) for controlling the on / off of the light-emitting chips (150) may be located.

[0036] The ground voltage line (120) may include a conductive material. The ground voltage line (120) may include a material having relatively low resistance. For example, the ground voltage line (120) may include a metal such as copper (Cu), nickel (Ni), silver (Ag), gold (Au), platinum (Pt), and aluminum (Al). The ground voltage line (120) may extend in one direction.

[0037] The driving voltage line (130) may include a conductive material. The driving voltage line (130) may include a material having relatively low resistance. For example, the driving voltage line (130) may include a metal such as copper (Cu), nickel (Ni), silver (Ag), gold (Au), platinum (Pt), and aluminum (Al). The driving voltage line (130) may include the same material as the ground voltage line (120). The driving voltage line (130) may be formed by the same process as the ground voltage line (120). For example, the driving voltage line (130) may be formed simultaneously with the ground voltage line (120). The driving voltage line (130) may be located on the same layer as the ground voltage line (120). The driving voltage line (130) may be spaced apart from the ground voltage line (120). For example, the drive anchor line (130) can be extended parallel to the ground voltage line (120).

[0038] The driving chip (140) may include a first input terminal (I1) into which an address signal is input, a second input terminal (I2) into which a ground voltage is input, and a first output terminal (O1) into which a control signal for controlling the operation of the light-emitting chips (150) is output. For example, the second input terminal (I2) of the driving chip (140) may be electrically connected to the ground voltage line (120). Each light-emitting chip (150) may be electrically connected between the driving voltage line (130) and the first output terminal (O1) of the driving chip (140). For example, each light-emitting chip (150) may include a first chip pad (150a) into which the driving voltage is applied by the driving voltage line (130) and a second chip pad (150b) into which the control signal is applied by the driving chip (140).

[0039] The driving chip (140) and the light-emitting chips (150) may be located on a different layer from the ground voltage line (120) and the driving voltage line (130). For example, a lower insulating film (111) covering the ground voltage line (120) and the driving voltage line (130) may be located on the light source substrate (110), and the driving chip (140) and the light-emitting chips (150) may be located on the lower insulating film (111). The lower insulating film (111) may include an insulating material. For example, the lower insulating film (111) may be an inorganic film made of an inorganic insulating material such as silicon oxide (SiOx) and silicon nitride (SiNx). The lower insulating film (111) may have a multilayer structure. For example, the lower insulating film (111) may have a stacked structure of an inorganic film made of silicon nitride (SiNx) and an inorganic film made of silicon oxide (SiOx). Accordingly, in a display device according to an embodiment of the present invention, diffusion and / or movement of the metal constituting the ground voltage line (120) and the metal constituting the driving voltage line (130) through adjacent components may be prevented. That is, in a display device according to an embodiment of the present invention, migration of the metal constituting the ground voltage line (120) and the metal constituting the driving voltage line (130) may be prevented by the lower insulating film (111).

[0040] The light-emitting chips (150) may be located outside the ground voltage line (120) and the driving voltage line (130). For example, the ground voltage line (120) and the driving voltage line (130) may extend in one direction between the light-emitting chips (150). The light-emitting chips (150) may be spaced apart from the outside of the ground voltage line (120) and the driving voltage line (130). Accordingly, in a display device according to an embodiment of the present invention, malfunction of the light-emitting chips (150) due to parasitic capacitance formed between the ground voltage line (120) and the light-emitting chips (150) and / or between the driving voltage line (130) and the light-emitting chips (150) can be prevented.

[0041] Each light-emitting chip (150) can be controlled differently from adjacent light-emitting chips (150). For example, in the backlight unit (BL) of a display device according to an embodiment of the present invention, the light source substrate (110) is separated into a plurality of light-emitting blocks (LB), and the light-emitting chips (150) located within each light-emitting block (LB) can be simultaneously controlled by a single driving chip (140). Accordingly, in the display device according to an embodiment of the present invention, local dimming can be implemented in which light of different brightness is provided to the liquid crystal panel (LP) by the backlight unit (BL) in different regions. The driving chip (140) of each light-emitting block (LB) can transmit the address signal to the driving chip (140) of an adjacent light-emitting block (LB). For example, the driving chip (140) of each light-emitting block (LB) includes a second output terminal (O2) for transmitting the address signal, and the first input terminal (I1) of some of the driving chips (140) may be electrically connected to the second output terminal (O2) of an adjacent driving chip (140) via an address connection line (162). The address connection line (162) may include a conductive material. The address connection line (162) may include a material having relatively low resistance. For example, the address connection line (162) may include a metal such as copper (Cu), nickel (Ni), silver (Ag), gold (Au), platinum (Pt), and aluminum (Al). The address connection line (162) may be located on the lower insulating film (111).

[0042] The light-emitting chips (150) may be connected by light-emitting connection lines (161). For example, the light-emitting chips (150) located within each light-emitting block (LB) may be connected in series between the driving voltage line (130) and the driving chip (140) by the light-emitting connection lines (161). The light-emitting connection lines (161) may include a conductive material. The light-emitting connection lines (161) may include a material having relatively low resistance. For example, the light-emitting connection lines (161) may include metals such as copper (Cu), nickel (Ni), silver (Ag), gold (Au), platinum (Pt), and aluminum (Al). The light-emitting connection lines (161) may be located on the lower insulating film (111). For example, each light-emitting connection line (161) located between the light-emitting chips (150) may include a first end (161a) in direct contact with the first chip pad (150a) of one of the light-emitting chips (150) and a second end (161b) in direct contact with the second chip pad (150b) of one of the light-emitting chips (150). The light-emitting connection lines (161) may include the same material as the address connection line (162). The light-emitting connection lines (161) may be formed by the same process as the address connection line (162). For example, the light-emitting connection lines (161) may be formed simultaneously with the address connection line (162). The light-emitting connection lines (161) may be located on the same layer as the address connection line (162).

[0043] A ground dummy pattern (171) and a driving dummy pattern (172) may be located between the light-emitting chips (150), between the light-emitting connection lines (161), and / or between the light-emitting chips (150) and the light-emitting connection lines (161). The ground dummy pattern (171) and the driving dummy pattern (172) may include a conductive material. The ground dummy pattern (171) and the driving dummy pattern (172) may include a material having relatively low resistance. For example, the ground dummy pattern (171) and the driving dummy pattern (172) may include metals such as copper (Cu), nickel (Ni), silver (Ag), gold (Au), platinum (Pt), and aluminum (Al).

[0044] The ground dummy pattern (171) may be electrically connected to the ground voltage line (120). The ground dummy pattern (171) may overlap with the ground voltage line (120). For example, the lower insulating film (111) may include at least one ground contact hole that partially exposes the ground voltage line (120). The ground dummy pattern (171) may come into direct contact with the ground voltage line (120) through the ground contact hole. Accordingly, in a display device according to an embodiment of the present invention, the resistance of the ground voltage line (120) may be reduced.

[0045] The ground dummy pattern (171) may include the same material as the light-emitting connection lines (161). The ground dummy pattern (171) may be formed by the same process as the light-emitting connection lines (161). For example, the ground dummy pattern (171) may be formed simultaneously with the light-emitting connection lines (161). The ground dummy pattern (171) may be located on the same layer as the light-emitting connection lines (161). Accordingly, in a display device according to an embodiment of the present invention, the resistance of the ground voltage line (120) can be reduced without a decrease in process efficiency.

[0046] The driving dummy pattern (172) may be electrically connected to the driving voltage line (130). The driving dummy pattern (172) may overlap with the driving voltage line (130). For example, the lower insulating film (111) may include at least one driving contact hole that partially exposes the driving voltage line (130). The driving dummy pattern (172) may come into direct contact with the driving voltage line (130) through the driving contact hole. Accordingly, in a display device according to an embodiment of the present invention, the resistance of the driving voltage line (130) may be reduced.

[0047] The driving dummy pattern (172) may include the same material as the ground dummy pattern (171). For example, the driving dummy pattern (172) may be formed simultaneously with the ground dummy pattern (171). The driving dummy pattern (172) may be located on the same layer as the ground dummy pattern (171). Accordingly, in a display device according to an embodiment of the present invention, the resistance of the driving voltage line (130) can be reduced without a decrease in process efficiency.

[0048] An upper insulating film (112) may be positioned on the light-emitting connection lines (161), the address connection line (162), the ground dummy pattern (171), and the driving dummy pattern (172). The upper insulating film (112) may include an insulating material. For example, the upper insulating film (112) may be an inorganic film made of an inorganic insulating material such as silicon oxide (SiOx) and silicon nitride (SiNx). The upper insulating film (112) may have a multilayer structure. For example, the upper insulating film (112) may have a stacked structure of an inorganic film made of silicon nitride (SiNx) and an inorganic film made of silicon oxide (SiOx). Accordingly, in a display device according to an embodiment of the present invention, diffusion and / or movement of the metal constituting the light-emitting connection lines (161), the metal constituting the address connection line (162), the metal constituting the ground dummy pattern (171), and the metal constituting the driving dummy pattern (172) through adjacent components can be prevented. That is, in a display device according to an embodiment of the present invention, migration of the metal constituting the light-emitting connection lines (161), the metal constituting the address connection line (162), the metal constituting the ground dummy pattern (171), and the metal constituting the driving dummy pattern (172) can be prevented. The upper insulating film (112) can surround the light-emitting chips (150). For example, the first end (161a) and the second end (161b) of each light-emitting connection line (161) can be located outside the upper insulating film (112). The ground dummy pattern (171) and the driving dummy pattern (172) can be covered by the upper insulating film (112).Accordingly, in a display device according to an embodiment of the present invention, electrical connection between the light-emitting connection lines (161) and the ground dummy pattern (171) and / or between the light-emitting connection lines (161) and the driving dummy pattern (172) can be prevented.

[0049] The optical sheet (200) can uniformly supply light emitted from the optical module (100) to the entire liquid crystal panel (LP). For example, the optical sheet (200) may include a reflector (210), a diffuser (220), a phosphor sheet (230), and a prism sheet (240). The liquid crystal panel (LP) may be positioned on the optical sheet (200) of the backlight unit (BL).

[0050] The reflector (210) can reflect light reflected by the diffuser (220), the phosphor sheet (230), and the prism sheet (240) back toward the liquid crystal panel (LP). For example, the reflector (210) may include a reflection pattern (211). The reflection pattern (211) may include a material having a high reflectivity. For example, the reflection pattern (211) may include a metal such as aluminum (Al) and silver (Ag).

[0051] The reflector (210) can reflect light emitted through the side of each light-emitting chip (150) toward the liquid crystal panel (LP). For example, the reflection pattern (211) may be in contact with the upper insulating film (112) of the optical module (100), and the reflector (210) may include a scattering layer (212) covering the reflection pattern (211). The scattering layer (212) may surround the side of each light-emitting chip (150). For example, the reflector (210) may include through holes (210h) into which the light-emitting chips (150) are inserted. Accordingly, in a display device according to an embodiment of the present invention, light emitted through the side of each light-emitting chip (150) is scattered by the scattering layer (212), and the light scattered by the scattering layer (212) may be reflected toward the liquid crystal panel (LP) by the reflection pattern (211). That is, in the display device according to the embodiment of the present invention, the efficiency of the light source module (100) can be improved. The scattering layer (212) may include an insulating material. Accordingly, in the display device according to the embodiment of the present invention, electrical connection between the light-emitting chips (150) by the reflector (210) can be prevented.

[0052] The above diffuser plate (220) can diffuse the light emitted by each light-emitting chip (150). The above phosphor sheet (230) can produce various colors using the light emitted by the light-emitting chips (150). For example, the light provided to the liquid crystal panel (LP) through the phosphor sheet (230) may be white light. The above prism sheet (240) can concentrate light to improve the brightness of the light supplied to the liquid crystal panel (LP).

[0053] FIGS. 4 to 8 are schematic drawings illustrating a method for forming a backlight unit in a display device according to an embodiment of the present invention.

[0054] A method for forming a backlight unit in a display device according to an embodiment of the present invention is described with reference to FIG. 3 to 8. First, as shown in FIG. 4, the method for forming a backlight unit in a display device according to an embodiment of the present invention may include the step of forming the ground voltage line (120) and the driving voltage line (130) on the light source substrate (110).

[0055] The ground voltage line (120) and the driving voltage line (130) may be formed of a conductive material. The ground voltage line (120) and the driving voltage line (130) may be formed of a material having relatively low resistance. For example, the ground voltage line (120) and the driving voltage line (130) may be formed of metals such as copper (Cu), nickel (Ni), silver (Ag), gold (Au), platinum (Pt), and aluminum (Al). The driving voltage line (130) may be formed of the same material as the ground voltage line (120). The driving voltage line (130) may be formed by the same process as the ground voltage line (120). The driving voltage line (130) may be formed simultaneously with the ground voltage line (120). For example, the step of forming the ground voltage line (120) and the driving voltage line (130) may include the step of forming a metal layer on the light source substrate (110) and the step of patterning the metal layer. The ground voltage line (120) and the driving voltage line (130) may be formed on the same layer.

[0056] As illustrated in FIG. 5, a method for forming a backlight unit in a display device according to an embodiment of the present invention may include the steps of forming a lower insulating film (111) on a light source substrate (110) on which the ground voltage line (120) and the driving voltage line (130) are formed, and forming a ground contact hole (h1) that partially exposes the ground voltage line (120) and a driving contact hole (h2) that partially exposes the driving voltage line (130) in the lower insulating film (111).

[0057] The lower insulating film (111) may be formed of an insulating material. For example, the lower insulating film (111) may be formed of an inorganic insulating material such as silicon oxide (SiOx) and silicon nitride (SiNx). The ground voltage line (120) and the driving voltage line (130) may be covered by the lower insulating film (111).

[0058] As illustrated in FIG. 6, a method for forming a backlight unit in a display device according to an embodiment of the present invention may include the step of forming the light-emitting connection lines (161a, 161b), the ground dummy pattern (171), and the driving dummy pattern (172) on the lower insulating film (111).

[0059] The light-emitting connection lines (161a, 161b), the ground dummy pattern (171), and the driving dummy pattern (172) may be formed of a conductive material. The light-emitting connection lines (161a, 161b), the ground dummy pattern (171), and the driving dummy pattern (172) may be formed of a material having relatively low resistance. For example, the light-emitting connection lines (161a, 161b), the ground dummy pattern (171), and the driving dummy pattern (172) may be formed of metals such as copper (Cu), nickel (Ni), silver (Ag), gold (Au), platinum (Pt), and aluminum (Al). The light-emitting connection lines (161a, 161b), the ground dummy pattern (171), and the driving dummy pattern (172) may be formed of the same material. The light-emitting connection lines (161a, 161b), the ground dummy pattern (171), and the driving dummy pattern (172) can be formed by the same process. The light-emitting connection lines (161a, 161b), the ground dummy pattern (171), and the driving dummy pattern (172) can be formed simultaneously. For example, the step of forming the light-emitting connection lines (161a, 161b), the ground dummy pattern (171), and the driving dummy pattern (172) may include the step of forming a metal layer on the lower insulating film (111) and the step of patterning the metal layer. The light-emitting connection lines (161a, 161b), the ground dummy pattern (171), and the driving dummy pattern (172) can be formed on the same layer.

[0060] The light-emitting connection lines (161a, 161b) may be formed between the ground voltage line (120) and the driving voltage line (130). For example, the light-emitting connection lines (161a, 161b) may be spaced apart from the ground voltage line (120) and the driving voltage line (130). The ground dummy pattern (171) may be formed on the ground voltage line (120). For example, the ground dummy pattern (171) may be electrically connected to the ground voltage line (120) through the ground contact hole. The ground dummy pattern (171) may overlap with the ground voltage line (120). The driving dummy pattern (172) may be formed on the driving voltage line (130). For example, the driving dummy pattern (172) may be electrically connected to the driving voltage line (130) through the driving contact hole. The above driving dummy pattern (172) can overlap with the driving voltage line (130).

[0061] As illustrated in FIG. 7, a method for forming a backlight unit in a display device according to an embodiment of the present invention may include the step of forming the upper insulating film (112) on the light source substrate (110) on which the light-emitting connection lines (161a, 161b), the ground dummy pattern (171), and the driving dummy pattern (172) are formed.

[0062] The upper insulating film (112) may be formed of an insulating material. For example, the upper insulating film (112) may be formed of an inorganic insulating material such as silicon oxide (SiOx) and silicon nitride (SiNx). The ground dummy pattern (171) and the driving dummy pattern (172) may be covered by the upper insulating film (112). The upper insulating film (112) may expose both ends of each light-emitting connection line (161a, 161b). For example, the upper insulating film (112) may surround the area where the light-emitting chips (150) are placed by a subsequent process.

[0063] As illustrated in FIG. 8, a method for forming a backlight unit in a display device according to an embodiment of the present invention may include the step of bonding the light-emitting chips (150) on the light source substrate (110) on which the upper insulating film (112) is formed.

[0064] Each light-emitting chip (150) may include a first chip pad (150a) and a second chip pad (150b). For example, the first chip pad (150a) of each light-emitting chip (150) may be connected to the first end (161a) of one of the light-emitting connection lines (161a, 161b), and the second chip pad (150b) of each light-emitting chip (150) may be connected to the second end (161b) of one of the light-emitting connection lines (161a, 161b). Accordingly, the light-emitting chips (150) may be connected to each other by the light-emitting connection lines (161a, 161b).

[0065] As illustrated in FIG. 3, a method for forming a backlight unit in a display device according to an embodiment of the present invention may include the step of placing the reflector plate (210) having through holes (210h) corresponding to the light-emitting chips (150) on the upper insulating film (112).

[0066] Consequently, in a display device according to an embodiment of the present invention, the light source module (100) of the backlight unit (BL) may include a lower insulating film (111) covering the ground voltage line (120) and the driving voltage line (130), light-emitting chips (150) located on the lower insulating film (111), light-emitting connection lines (161) connecting the light-emitting chips (150), a ground dummy pattern (171) overlapping the ground voltage line (120), and a driving dummy pattern (172) overlapping the driving voltage line (130). The ground dummy pattern (171) and the driving dummy pattern (172) may be located between the light-emitting chips (150) and the light-emitting connection lines (161), and the ground dummy pattern (171) may penetrate the lower insulating film (111) and be electrically connected to the ground voltage line (120). The driving dummy pattern (172) can penetrate the lower insulating film (111) and be electrically connected to the driving voltage line (130). Accordingly, in the display device according to the embodiment of the present invention, the resistance of the ground voltage line (120) and the resistance of the driving voltage line (130) can be reduced. Additionally, in the display device according to the embodiment of the present invention, the ground dummy pattern (171) and the driving dummy pattern (172) can be formed by the same process as the light-emitting connection lines (161). For example, in the display device according to the embodiment of the present invention, the ground dummy pattern (171) and the driving dummy pattern (172) can be formed simultaneously with the light-emitting connection lines (161). Therefore, in the display device according to the embodiment of the present invention, brightness deviation of the light-emitting chips (150) can be prevented without a decrease in process efficiency.

[0067] Additionally, in a display device according to an embodiment of the present invention, the ground dummy pattern (171) and the driving dummy pattern (172) may be formed between the light-emitting chips (150), between the light-emitting connection lines (161), and / or between the light-emitting chips (150) and the light-emitting connection lines (161). Accordingly, in a display device according to an embodiment of the present invention, the resistance of the ground voltage line (120) and the resistance of the driving voltage line (130) may be reduced without increasing the non-light-emitting area where the light-emitting chips (150) are not located. That is, in a display device according to an embodiment of the present invention, the size of the light-emitting area where light is emitted by the light-emitting chips (150) is maintained, and the brightness variation of the light-emitting chips (150) may be prevented. Therefore, in a display device according to an embodiment of the present invention, the quality of the image provided to the user may be effectively improved.

[0068] A display device according to an embodiment of the present invention is described such that the second output terminal (O2) of each driving chip (140) is connected to the first input terminal (I1) of the driving chip (140) adjacent in the first direction through the address connection line (162). That is, in a display device according to an embodiment of the present invention, an address wiring to which the address signal is applied from the outside through a pad portion may be connected to one of the first input terminals (I1) located at the outermost position among the driving chips (140) positioned side by side in the first direction. However, in a display device according to another embodiment of the present invention, the first input terminal (I1) of each driving chip (140) may be individually connected to the address wiring. For example, in a display device according to another embodiment of the present invention, the first input terminal (I1) of each driving chip (140) may be electrically connected to an address wiring different from the first input terminal (I1) of the driving chip (140) adjacent in the first direction. In a display device according to another embodiment of the present invention, the address connection line (162) and the second output terminal (O2) of each driving chip (140) may be omitted. Accordingly, in a display device according to another embodiment of the present invention, the on / off and brightness of each light-emitting block (LB) may be controlled independently. Thus, local dimming can be effectively implemented in a display device according to another embodiment of the present invention.

[0069] A display device according to an embodiment of the present invention is described such that the driving voltage line (130), which is electrically connected to the light-emitting chips (150), applies a signal different from the ground voltage line (120), which is electrically connected to the driving chip (140). However, in a display device according to another embodiment of the present invention, the driving voltage line (130) may be electrically connected to the ground voltage line (120). For example, in a display device according to another embodiment of the present invention, a driving voltage corresponding to the brightness of each light-emitting chip (150) may be generated / applied by the driving chip (140).

[0070] A display device according to an embodiment of the present invention is described as having the ground dummy pattern (171) and the driving dummy pattern (172) located on the lower insulating film (111). However, in a display device according to another embodiment of the present invention, only one of the ground dummy pattern (171) and the driving dummy pattern (172) may be formed. Accordingly, in a display device according to another embodiment of the present invention, the degree of freedom regarding the configuration of the light source module (100) may be improved.

[0071] In a display device according to an embodiment of the present invention, the lower insulating film (111) is described as being composed of an inorganic insulating material such as silicon oxide (SiOx) and silicon nitride (SiNx). However, in a display device according to another embodiment of the present invention, the lower insulating film (111) may have a multilayer structure of an inorganic film composed of an inorganic insulating material and an organic film composed of an organic insulating material. For example, as shown in FIG. 9, in a display device according to another embodiment of the present invention, the lower insulating film (111) may have a stacked structure of a first lower layer (111a), a second lower layer (111b), and a third lower layer (111c). The second lower layer (111b) may include a material different from the first lower layer (111a) and the third lower layer (111c). For example, the first lower layer (111a), which is the lowest layer of the lower insulating film (111) located close to the ground voltage line (120) and the driving voltage line (130), and the third lower layer (111c), which is the uppermost layer of the lower insulating film (111) located close to the ground dummy pattern (171) and the driving dummy pattern (172), are inorganic films made of inorganic insulating materials such as silicon oxide (SiOx) and silicon nitride (SiNx), and the second lower layer (111b), which is located between the first lower layer (111a) and the third lower layer (111c), may be an organic film made of an organic insulating material. Accordingly, in a display device according to another embodiment of the present invention, the metal constituting the ground voltage line (120), the metal constituting the driving voltage line (130), the metal constituting the ground dummy pattern (171), and the metal constituting the driving dummy pattern (172) can be prevented from diffusing through the second lower layer (111b), which is an organic film.

[0072] In a display device according to another embodiment of the present invention, the reflection pattern (211) may include a conductive material. For example, as shown in FIG. 10, in a display device according to another embodiment of the present invention, the reflection pattern (211) may penetrate the upper insulating film (112) and be electrically connected to the ground dummy pattern (171) and the driving dummy pattern (172). Accordingly, in a display device according to another embodiment of the present invention, the resistance of the ground voltage line (120) and the resistance of the driving voltage line (130) may be significantly reduced. Thus, in a display device according to another embodiment of the present invention, the brightness variation of the light-emitting chips (150) can be effectively prevented. Explanation of the symbols

[0073] 100: Light source component 110: Light source substrate 120: Ground voltage line 130: Driving voltage line 140: Driving chip 150: Light-emitting chip 161: Light emission connection line 162: Address connection line 171: Ground dummy pattern 172: Drive dummy pattern 200: Optical sheet LP: Liquid crystal panel BL: Backlight unit

Claims

Claim 1 A backlight unit comprising: a ground voltage line located on a light source substrate; a lower insulating film located on the light source substrate and covering the ground voltage line; light-emitting chips located on the lower insulating film and spaced apart from the ground voltage line; light-emitting connection lines located on the lower insulating film and electrically connecting the light-emitting chips; a ground dummy pattern located between the light-emitting chips and the light-emitting connection lines and overlapping with the ground voltage line; an upper insulating film spaced apart from the light-emitting chips and covering the light-emitting connection lines and the ground voltage line; and a reflective pattern located on the upper insulating film and comprising a conductive material, wherein the ground dummy pattern is electrically connected to the ground voltage line and the reflective pattern is electrically connected to the ground dummy pattern. Claim 2 In claim 1, the ground dummy pattern comprises a backlight unit having the same material as the light-emitting connection lines. Claim 3 A backlight unit according to claim 1, further comprising: a driving voltage line located between the light source substrate and the lower insulating film and spaced apart from the ground voltage line; and a driving chip located outside the light-emitting chips, the light-emitting connection lines and the ground dummy pattern and electrically connected to the ground voltage line, wherein each light-emitting chip is electrically connected between the driving voltage line and the driving chip. Claim 4 In claim 3, the light-emitting chips are a backlight unit serially connected between the driving voltage line and the driving chip by the light-emitting connection lines. Claim 5 In claim 3, the backlight unit further comprises a driving dummy pattern located between the light-emitting chips and the light-emitting connection lines and overlapping with the driving voltage line, wherein the driving dummy pattern is electrically connected to the driving voltage line. Claim 6 In claim 5, the driving dummy pattern comprises a backlight unit having the same material as the ground dummy pattern. Claim 7 In claim 1, the lower insulating film is a backlight unit having a laminated structure of an inorganic film made of an inorganic insulating material and an organic film made of an organic insulating material. Claim 8 In claim 7, the lowermost layer of the lower insulating film located close to the ground voltage line and the uppermost layer of the lower insulating film located close to the ground dummy pattern are inorganic films in the backlight unit. Claim 9 A display device comprising: a backlight unit including a light source module; and a liquid crystal panel located on an optical sheet of the backlight unit, wherein the light source module includes a driving voltage line located on a light source substrate, a lower insulating film covering the driving voltage line, light-emitting chips located on the lower insulating film, a driving chip located outside the light-emitting chips, light-emitting connection lines electrically connecting each light-emitting chip between the driving voltage line and the driving chip, a driving dummy pattern located between the light-emitting chips and the light-emitting connection lines, an upper insulating film located on the light-emitting connection lines and the driving dummy pattern, and a reflection pattern located on the upper insulating film, wherein the light-emitting chips surrounded by the upper insulating film are located outside the driving voltage line, and the reflection pattern including a conductive material is electrically connected to the driving dummy pattern, and the driving dummy pattern is electrically connected to the driving voltage line. Claim 10 In claim 9, the driving dummy pattern comprises the same material as the light-emitting connection lines in a display device. Claim 11 A display device according to claim 9, further comprising a scattering layer located on the upper insulating film and covering the reflection pattern. Claim 12 A display device according to claim 11, wherein the reflection pattern comprises a metal and the scattering layer comprises an insulating material. Claim 13 In claim 9, the light source module further comprises a ground voltage line located between the light source substrate and the lower insulating film and a ground dummy pattern located between the lower insulating film and the upper insulating film, wherein the ground voltage line is located outside the light-emitting chips and the ground dummy pattern is electrically connected to the ground voltage line and the reflection pattern. Claim 14 In claim 13, the ground voltage line comprises the same material as the driving voltage line in the display device. Claim 15 A display device according to claim 13, wherein the ground voltage line is located on the same layer as the driving voltage line, and the ground dummy pattern is located on the same layer as the driving dummy pattern and the light-emitting connection lines.

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