Display devices and electronic devices

Abstract

A display device and an electronic device capable of improving the reliability of the light-emitting state of a pixel are provided. The display device comprises a plurality of light-emitting elements having a plurality of subpixels, an anode electrode, an organic layer, and a first cathode electrode, wherein the anode electrode, the organic layer, and the first cathode electrode are separated into each of the plurality of subpixels, a device protection layer covering the first cathode electrode, a second cathode electrode provided on the device protection layer, and a connection portion electrically connecting the second cathode electrode and the first cathode electrode, wherein the connection portion is formed along the sidewall of the device protection layer.

Description

Technology Field

[0001] The present disclosure relates to a display device and an electronic device using the same. Background Technology

[0002] A display device using an organic EL (Electro-Luminescence) element is proposed to have a structure in which an organic layer including at least an organic light-emitting layer and a first cathode electrode are stacked on an anode electrode formed spaced apart from each pixel. In this case, one pixel may be composed of multiple subpixels such as RGB.

[0003] In Patent Document 1, an organic light-emitting device is proposed in which the upper electrode is composed of a first upper electrode and a second upper electrode directly provided on the first upper electrode. Prior art literature

[0004] Japanese Patent Publication No. 2016-021380 The problem to be solved

[0005] In the technology disclosed in Patent Document 1, there is room for improvement in that damage to the organic light-emitting layer caused by gas or the like during processing is suppressed, thereby improving the reliability of the light-emitting state of the pixel.

[0006] The present disclosure is made in consideration of the above-described points and has one of the objectives of providing a display device and an electronic device capable of improving the reliability of the light emission state of a pixel. means of solving the problem

[0007] The present disclosure comprises, for example, (1) a plurality of light-emitting elements having an anode electrode, an organic light-emitting layer, and a first cathode electrode, wherein the anode electrode, the organic light-emitting layer, and the first cathode electrode are separated for each subpixel, and

[0008] A plurality of protective layers covering each of the above plurality of light-emitting elements, and

[0009] A second cathode electrode provided on the plurality of protective layers above, and

[0010] A connecting part that electrically connects the second cathode electrode and the first cathode electrode.

[0011] Equipped with,

[0012] The above connection portion is in contact with the side wall of the protective film,

[0013] It is a display device.

[0014] In addition, the present disclosure may be, for example, an electronic device having (2) the display device described in (1) above. Brief explanation of the drawing

[0015] FIG. 1 is a cross-sectional view for explaining one embodiment of a display device according to a first embodiment. FIG. 2A is a plan view for illustrating one embodiment of a display device. FIG. 2B is a partially enlarged plan view of the area XS enclosed by the dashed line in FIG. 2A. FIGS. 3A to FIGS. 3D are cross-sectional views showing an example of a method for manufacturing a display device according to a first embodiment. FIGS. 4A to FIGS. 4C are cross-sectional views showing one embodiment of a method for manufacturing a display device according to the first embodiment. FIG. 5 is a cross-sectional view showing a modified example of a display device according to the first embodiment. FIGS. 6A to FIGS. 6C are plan views for illustrating an example of the layout of a subpixel of a display device according to the first embodiment. FIGS. 7A to FIGS. 7D are plan views for illustrating an example of the layout of a subpixel of a display device according to the first embodiment. FIG. 8 is a cross-sectional view showing a modified example of a display device according to the first embodiment. FIG. 9 is a cross-sectional view showing a modified example of a display device according to the first embodiment. FIG. 10 is a cross-sectional view showing a modified example of a display device according to the first embodiment. FIG. 11A and FIG. 11B are cross-sectional views for illustrating variations of a display device according to a first embodiment. FIG. 12 is a cross-sectional view for explaining one embodiment of a display device according to a second embodiment. FIG. 13A and FIG. 13B are plan views for illustrating an embodiment of a display device according to a second embodiment. FIG. 14A and FIG. 14B are plan views for illustrating variations of a display device according to a second embodiment. FIG. 15 is a plan view illustrating a modified example of a display device according to a second embodiment. FIG. 16 is a cross-sectional view illustrating one embodiment of a display device according to a third embodiment. FIGS. 17A to FIGS. 17C are cross-sectional views for explaining an example of a method for manufacturing a display device according to a third embodiment. FIG. 18A and FIG. 18B are cross-sectional views for illustrating an example of a method for manufacturing a display device according to a third embodiment. FIG. 19 is a cross-sectional view illustrating a modified example of a display device according to a third embodiment. FIGS. 20A to FIGS. 20C are cross-sectional views for explaining a method of manufacturing a modified example of a display device according to a third embodiment. FIGS. 21A to FIGS. 21C are cross-sectional views for explaining a method of manufacturing a modified example of a display device according to the third embodiment. FIG. 22A and FIG. 22B are cross-sectional views for illustrating an embodiment of a display device according to a fourth embodiment. FIG. 23A and FIG. 23B are cross-sectional views for explaining a method of manufacturing a display device according to a fourth embodiment. FIG. 24 is a cross-sectional view illustrating a modified example of a display device according to a fourth embodiment. FIG. 25A and FIG. 25B are cross-sectional views for illustrating variations of a display device according to a fourth embodiment. FIGS. 26A to FIGS. 26C are plan views for illustrating an example of the layout of a subpixel of a display device according to the fourth embodiment. FIG. 27A and FIG. 27B are a cross-sectional view and a plan view for explaining an embodiment of a display device according to the fifth embodiment. FIG. 28A and FIG. 28B are a cross-sectional view and a plan view for explaining a method of manufacturing a display device according to a fifth embodiment. FIG. 29A and FIG. 29B are a cross-sectional view and a plan view for explaining a method of manufacturing a display device according to the fifth embodiment. FIG. 30A and FIG. 30B are a cross-sectional view and a plan view for explaining a method of manufacturing a display device according to the fifth embodiment. FIG. 31A and FIG. 31B are a cross-sectional view and a plan view, respectively, for illustrating a modified example of a display device according to the fifth embodiment. FIG. 32A and FIG. 32B are a cross-sectional view and a plan view for explaining a method of manufacturing a modified example of a display device according to the fifth embodiment. FIG. 33A and FIG. 33B are a cross-sectional view and a plan view for explaining a method of manufacturing a modified example of a display device according to the fifth embodiment. FIG. 34A and FIG. 34B are a cross-sectional view and a plan view for explaining a method of manufacturing a modified example of a display device according to the fifth embodiment. FIG. 35A and FIG. 35B are a cross-sectional view and a plan view for explaining a method of manufacturing a modified example of a display device according to the fifth embodiment. FIGS. 36A to FIGS. 36C are cross-sectional views for explaining variations of a display device according to the fifth embodiment. FIG. 37A and FIG. 37B are a cross-sectional view and a plan view for explaining a method of manufacturing a modified example of a display device according to the fifth embodiment. FIG. 38A and FIG. 38B are a cross-sectional view and a plan view for explaining a method of manufacturing a modified example of a display device according to the fifth embodiment. FIG. 39A and FIG. 39B are a cross-sectional view and a plan view for explaining a method of manufacturing a modified example of a display device according to the fifth embodiment. FIG. 40A and FIG. 40B are a cross-sectional view and a plan view for explaining a method of manufacturing a modified example of a display device according to the fifth embodiment. FIGS. 41A to FIGS. 41D are cross-sectional views for explaining a method of manufacturing a display device according to a sixth embodiment. FIG. 42A and FIG. 42B are plan views for illustrating a display device relating to the sixth embodiment. FIGS. 43A to FIGS. 43D are cross-sectional views for explaining variations of a display device according to the sixth embodiment. FIG. 44 is a drawing for explaining an embodiment of an electronic device using a display device. FIG. 45 is a drawing for explaining an embodiment of an electronic device using a display device. FIG. 46 is a drawing for illustrating an embodiment of an electronic device using a display device. Specific details for implementing the invention

[0016] Hereinafter, an embodiment relating to the present disclosure, etc., will be described with reference to the drawings. Furthermore, the description will be made in the following order. In this specification and drawings, components having substantially the same functional configuration are given the same number to omit redundant descriptions.

[0017] In addition, the explanation shall be carried out in the following order.

[0018] 1. First embodiment

[0019] 2. Second embodiment

[0020] 3. Third embodiment

[0021] 4. Fourth embodiment

[0022] 5. Fifth embodiment

[0023] 6. Sixth embodiment

[0024] 7. Seventh embodiment

[0025] 8. Electronic devices

[0026] The following description is a suitable embodiment of the present disclosure, and the content of the present disclosure is not limited to these embodiments. Furthermore, in the following description, directions such as front-back, left-right, and up-down are indicated for convenience of explanation, but the content of the present disclosure is not limited to these directions. In the examples of FIGS. 1 and 2, the Z-axis direction is defined as the up-down direction (upward side as +Z direction, downward side as -Z direction), the X-axis direction as the front-back direction (front side as +X direction, rear side as -X direction), and the Y-axis direction as the left-right direction (right side as +Y direction, left side as -Y direction), and the explanation is performed based on this. The same applies to FIGS. 3 to 13. The relative size or thickness ratios of each layer shown in FIG. 1 and other figures are described for convenience and do not limit the actual size ratios. The definitions and size ratios regarding these directions are also the same for FIGS. 2 to 16.

[0027] [1 First Embodiment]

[0028] [1-1 Configuration of the display device]

[0029] FIG. 1 is a cross-sectional view showing an example of the configuration of an organic EL (Electroluminescence) display device (10A) (hereinafter simply referred to as "display device (10A)") according to one embodiment of the present disclosure. The display device (10A) has a plurality of subpixels (101), a driving substrate (11), and a plurality of light-emitting elements (13).

[0030] The display device (10A) is a top-emission type display device. In the display device (10A), the driving substrate (11) is located on the back side of the display device (10A), and the direction (+Z direction) from the driving substrate (11) toward the light-emitting element (13) is oriented toward the surface side (display surface (110A) side, top side) of the display device (10A). In the following description, regarding each layer constituting the display device (10A), let the surface that becomes the display surface (110A) side of the display device (10A) be called the first surface (top side), and the surface that becomes the back side of the display device (10A) be called the second surface (bottom side). Also, in the example of the drawing, a peripheral portion (110B) is provided on the driving substrate (11) at the periphery of the area of ​​the display surface (110A). FIG. 2A is a plan view for explaining one embodiment of the display surface (110A) of the display device (10A). This applies equally to the second to sixth embodiments.

[0031] The display device (10A) is a micro-display formed in an array shape of self-emissive elements such as an OLED (Organic Light Emitting diode), Micro-OLED, or Micro-LED. The display device (10A) can be suitably mounted on a display device for VR (Virtual Reality), MR (Mixed Reality), or AR (Augmented Reality), an Electronic View Finder (EVF), or a small projector. This is also the same for the second to sixth embodiments.

[0032] (Composition of subpixels)

[0033] In the example of the display device (10A) shown in FIG. 1, a single pixel is formed by a combination of multiple subpixels (101) corresponding to multiple colors. In this example, three colors—red, green, and blue—are determined as multiple colors, and three types of subpixels (101) are provided: subpixel (101R), subpixel (101G), and subpixel (101B). Subpixels (101R), subpixel (101G), and subpixel (101B) are each red subpixel, green subpixel, and blue subpixel, and respectively display red, green, and blue. However, the example in FIG. 1 is merely an example, and the display device (10A) is not limited to having multiple subpixels (101) corresponding to multiple colors. There may be only one type of color, and one subpixel may form a single pixel. In addition, the wavelengths of light corresponding to each color type of red, green, and blue can be determined, for example, as wavelengths in the range of 610 nm to 650 nm, 510 nm to 590 nm, and 440 nm to 480 nm, respectively.

[0034] Additionally, subpixels (101R, 101G, 101B) are arranged in an area of ​​the display surface (110A). In the example of FIG. 1, the layout of the subpixels (101R, 101G, 101B) is a horizontally arranged stripe-shaped layout for a single pixel. The pixels are arranged in a matrix shape in the plane direction of the display surface (110A). FIG. 2 is a drawing for explaining the display surface (110A) of the display device (10A).

[0035] In the following description, unless the subpixels (101R, 101G, 101B) are specifically distinguished, the subpixels (101R, 101G, 101B) are collectively referred to as the word subpixel (101).

[0036] (Driver board)

[0037] The driving substrate (11) is provided with various circuits for driving a plurality of light-emitting elements (13) on the substrate (11A). Examples of the various circuits include a driving circuit for controlling the driving of the light-emitting elements (13) and a power circuit for supplying power to the plurality of light-emitting elements (13) (not all shown).

[0038] The substrate (11A) may be composed of, for example, glass or resin with low permeability to moisture and oxygen, or may be formed of a semiconductor that facilitates the formation of transistors, etc. Specifically, the substrate (11A) may be a glass substrate, a semiconductor substrate, or a resin substrate. The glass substrate includes, for example, high deformation point glass, soda glass, borosilicate glass, forsterite, lead glass, or quartz glass. The semiconductor substrate includes, for example, amorphous silicon, polycrystalline silicon, or single-crystal silicon. The resin substrate includes, for example, at least one selected from the group consisting of polymethyl methacrylate, polyvinyl alcohol, polyvinylphenol, polyethersulfone, polyimide, polycarbonate, polyethylene terephthalate, and polyethylene naphthalate.

[0039] On the first surface of the driving substrate (11), a plurality of contact plugs (not shown) are provided for connecting various circuits provided on the light-emitting element (13) and the substrate (11A).

[0040] (Light-emitting element)

[0041] In the display device (10A), a plurality of light-emitting elements (13) are provided on a first surface of a driving substrate (11). A light-emitting element (13) is provided for each subpixel (101). In the example of FIG. 1, as a plurality of light-emitting elements (13), individual light-emitting elements (13R, 13G, 13B) are provided to correspond to individual subpixels (101R, 101G, 101B). The light-emitting element (13R) shown in this example is a red OLED configured to emit red light. The light-emitting element (13G) is a green OLED configured to emit green light. The light-emitting element (13B) is a blue OLED configured to emit blue light. The light-emitting element (13) may be a Micro-OLED (MOLED) or a Micro-LED.

[0042] In the present specification, if the types of light-emitting elements (13R, 13G, 13B) are not specifically distinguished, the light-emitting elements (13R, 13G, 13B) are collectively referred to as light-emitting elements (13). A plurality of light-emitting elements (13) are arranged two-dimensionally in a specified arrangement pattern, such as a matrix shape. In the example of FIG. 2A, a plurality of light-emitting elements (13) are arranged two-dimensionally in two directions (X-axis direction and Y-axis direction in FIG. 2A) corresponding to the arrangement of subpixels (101).

[0043] The light-emitting element (13) comprises an anode electrode (130), an organic layer (131), and a first cathode electrode (132). The anode electrode (130), the organic layer (131), and the first cathode electrode (132) are arranged in this order in a direction spaced apart from the driving substrate (11) side (along the +Z direction). In the example of FIG. 1, the light-emitting element (13R) comprises an anode electrode (130) provided on the driving substrate (11), an organic layer (131R) provided on the anode electrode (130), and a first cathode electrode (132) provided on the organic layer (131R). The light-emitting element (13G) comprises an anode electrode (130) provided on a driving substrate (11), an organic layer (131G) provided on the anode electrode (130), and a first cathode electrode (132) provided on the organic layer (131G). The light-emitting element (13B) comprises an anode electrode (130) provided on a driving substrate (11), an organic layer (131B) provided on the anode electrode (130), and a first cathode electrode (132) provided on the organic layer (131B). Furthermore, in the following description, unless the organic layers (131R, 131G, 131B) are specifically distinguished, the organic layers (131R, 131G, 131B) are collectively referred to as organic layers (131).

[0044] (Light-emitting region of the light-emitting element)

[0045] In the present specification, the light-emitting region P of the light-emitting element (13) is defined as the region where the anode electrode (130), the organic layer (131), and the first cathode electrode (132) overlap on the first side of the first cathode electrode (132), with the thickness direction of the light-emitting element (13) as shown in FIG. 1.

[0046] (Anode electrode)

[0047] In the display device (10A), anode electrodes (130) are provided in multiple quantities on the first surface side of the driving substrate (11), electrically separated for each subpixel (101). In the example of FIG. 1, the anode electrodes (130) are electrically separated by an insulating layer (14) described later. It is preferable that the anode electrodes (130) also serve as a reflective layer. When this aspect is taken into consideration, it is preferable that the anode electrodes (130) have a reflectivity as high as possible. Furthermore, it is preferable that the anode electrodes (130) be composed of a material with a high work function to increase luminous efficiency.

[0048] The anode electrode (130) is composed of at least one layer among a metal layer and a metal oxide layer. For example, the anode electrode (130) may be composed of a single layer of a metal layer or a metal oxide layer, or a stacked layer of a metal layer and a metal oxide layer. When the anode electrode (130) is composed of a stacked layer, the metal oxide layer may be provided on the organic layer (131) side or the metal layer may be provided on the organic layer (131) side, but from the perspective of adjacencing a layer having a high work function to the organic layer (131), it is preferable that the metal oxide layer be provided on the organic layer (131) side.

[0049] The metal layer comprises, for example, at least one metal element selected from the group consisting of chromium (Cr), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), molybdenum (Mo), titanium (Ti), tantalum (Ta), aluminum (Al), magnesium (Mg), iron (Fe), tungsten (W), and silver (Ag). The metal layer may include the at least one metal element as a constituent element of the alloy. Specific examples of the alloy include aluminum alloys or silver alloys. Specific examples of aluminum alloys include AlNd or AlCu.

[0050] The metal oxide layer comprises, for example, at least one of a mixture of indium oxide and tin oxide (ITO), a mixture of indium oxide and zinc oxide (IZO), and titanium oxide (TiO).

[0051] (Organic layer)

[0052] An organic layer (131) is provided between the anode electrode (130) and the first cathode electrode (132). The organic layer (131) is provided in a state where it is electrically separated (divided) for each subpixel (101). In the example of the drawing, organic layers (131R, 131G, 131B) are provided. The organic layers (131R, 131G, and 131B) are made of colored paper corresponding to the light emission color of the subpixel (101), and each has red, blue, and green as the light emission colors.

[0053] The organic layer (131) has a configuration in which a hole injection layer, a hole transport layer, a light-emitting layer, and an electron transport layer are stacked in this order from the anode electrode (130) toward the first cathode electrode (132). In addition, the configuration of the organic layer (131) is not limited to this, and layers other than the light-emitting layer are provided as needed. This light-emitting layer is an organic light-emitting layer comprising an organic light-emitting material.

[0054] The hole injection layer is intended to increase the efficiency of hole injection into the light-emitting layer and is also a buffer layer to suppress leakage. The hole transport layer is intended to increase the efficiency of hole transport into the light-emitting layer. The light-emitting layer generates light by causing the recombination of electrons and holes to occur when an electric field is applied. The electron transport layer is intended to increase the efficiency of electron transport into the light-emitting layer. An electron injection layer may be provided between the electron transport layer and the first cathode electrode (132). This electron injection layer is intended to increase the efficiency of electron injection.

[0055] Additionally, the thickness of the organic layer (131) may be the same between different colors of the subpixel (101) or may have different values. For example, the thickness of each organic layer (131R, 131G, 131B) corresponding to the subpixels (101R, 101G, 101B) may be different from each other. In the example of FIG. 1, the thickness of the organic layer (131R, 131G, 131B) is different between different colors of the subpixel (101).

[0056] (1st cathode electrode)

[0057] The first cathode electrode (132) is provided facing the anode electrode (130). The first cathode electrode (132) is provided facing the second cathode electrode (134). The first cathode electrode (132) is provided electrically separated from each subpixel (101R, 101G, 101B).

[0058] The first cathode electrode (132) is a transparent electrode that is transparent to light generated from the organic layer (131). Here, in the present specification, the concept of a transparent electrode includes not only a transparent conductive layer but also a semi-transparent reflective layer and a combination thereof, unless specifically limited. The first cathode electrode (132) is composed of at least one layer among a metal layer and a metal oxide layer. More specifically, the first cathode electrode (132) is composed of a single layer of a metal layer or a metal oxide layer, or a stacked layer of a metal layer and a metal oxide layer. When the first cathode electrode (132) is composed of a stacked layer, the metal layer may be provided on the side of the organic layer (131) or the metal oxide layer may be provided on the side of the organic layer (131); however, from the perspective of placing a layer having a low work function adjacent to the organic layer (131), it is preferable that the metal layer be provided on the side of the organic layer (131).

[0059] The metal layer comprises, for example, at least one metal element selected from the group consisting of magnesium (Mg), aluminum (Al), silver (Ag), calcium (Ca), and sodium (Na). The metal layer may include the at least one metal element as a constituent element of the alloy. Specific examples of the alloy include MgAg alloy, MgAl alloy, or AlLi alloy. The metal oxide comprises, for example, at least one of a mixture of indium oxide and tin oxide (ITO), a mixture of indium oxide and zinc oxide (IZO), and zinc oxide (ZnO).

[0060] (Second cathode electrode)

[0061] The second cathode electrode (134) is provided as a common electrode for all subpixels (101R, 101G, 101B) in the area within the display surface (110A). The second cathode electrode (134) is connected to the first cathode electrode (132) separated for each subpixel (101) through the connection part (18) described later. The second cathode electrode (134) is provided on the lower protection layer (17) described later. In the example of FIG. 1, the second cathode electrode (134) is provided to cover the first surface side of the device protection layer (15) on the device protection layer (15) which is on the lower protection layer (17).

[0062] The second cathode electrode (134) is a transparent electrode that is transparent to light generated in the organic layer (131), just like the first cathode electrode (132). In addition, the second cathode electrode (134) is composed of at least one layer among a metal layer and a metal oxide layer, just like the first cathode electrode (132). The metal layer and metal oxide layer applicable to the second cathode electrode (134) are the same as the metal layer and metal oxide layer applicable to the first cathode electrode (132).

[0063] (Insulation layer)

[0064] In the display device (10A), as shown in FIG. 1, it is suitable for an insulating layer (14) to be provided on the first surface side of the driving substrate (11). The insulating layer (14) is provided between adjacent anode electrodes (130) and electrically separates each anode electrode (130) for each light-emitting element (13) (i.e., for each subpixel (101)). In addition, the insulating layer (14) has a plurality of openings (14A), and the first surface of the anode electrode (130) (the surface opposite to the first cathode electrode (132)) is exposed through the openings (14A). In addition, in the example of FIG. 1, the insulating layer (14) covers an area extending from the periphery (130A) of the first surface of the separated anode electrode (130) to the side (which may be referred to as an end surface or a side wall). In this case, each opening (14A) is positioned on the first surface of each anode electrode (130), and the opening end edge (140) of the opening (14A) is located inward from the end edge of the anode electrode (130). Also, at this time, the anode electrode (130) is exposed from the opening (14A), and this exposed area defines the light-emitting area P of the light-emitting element (13). In this specification, the peripheral portion (130A) of the first surface of the anode electrode (130) refers to an area having a predetermined width extending from the outer peripheral end edge of the first surface of each anode electrode (130) toward the inside of the first surface.

[0065] The insulating layer (14) is composed of, for example, an organic material or an inorganic material. The organic material includes, for example, at least one of polyimide and acrylic resin. The inorganic material includes, for example, at least one of silicon oxide, silicon nitride, silicon oxynitride, and aluminum oxide.

[0066] (Lower protection layer)

[0067] The lower protective layer (17) is a protective layer formed on the lower side (the second side of the second cathode electrode (134)) than the second cathode electrode (134), and protects the first cathode electrode (132) and the organic layer (131). In the example of FIG. 1, the lower protective layer (17) has a portion covering the first cathode electrode (132) and a portion formed between adjacent light-emitting elements (13). As described below, the portion covering the first cathode electrode (132) is referred to as the element protective layer (15). The portion formed between adjacent light-emitting elements (13) is referred to as the sidewall protective layer (16).

[0068] In this specification, the term "lower protection layer" (17) is used as a concept including the element protection layer (15) and the sidewall protection layer (16), which are protection layers, as needed.

[0069] (Devices protection layer)

[0070] On the first surface of each first cathode electrode (132), a device protection layer (15) is formed as a protective layer and covers the first surface of the first cathode electrode (132). The device protection layer (15) may cover the entire first cathode electrode (132) or avoid a portion of the first cathode electrode (132). The device protection layer (15) is located above the light-emitting element (13) and is interposed between the first cathode electrode (132) and the second cathode electrode (134). The device protection layer (15) blocks the light-emitting element (13) from the outside air and suppresses the intrusion of moisture from the external environment into the light-emitting element (13). The device protection layer (15) suppresses the organic layer (131) from being damaged by exposure to process gas or chemical solution during the manufacturing process. In addition, if the first cathode electrode (132) is composed of a metal layer, the device protection layer (15) may have a function to suppress oxidation of the metal layer.

[0071] The device protection layer (15) is formed from an insulating material. For example, a thermosetting resin may be used as the insulating material. In addition to this, SiO, SiON, AlO, TiO, etc. may be used as the insulating material. In this case, as the device protection layer (15), a CVD film including SiO, SiON, etc., or an ALD film including AlO, TiO, SiO, etc., may be exemplified. The device protection layer (15) may be formed as a single layer or may be formed in a stacked state of multiple layers. When the device protection layer (15) has a two-layer stacked structure, a first protection layer is provided on the first cathode electrode (132), and a second protection layer is provided to cover the first protection layer, it is preferable that the first protection layer is formed as a CVD film and the second protection layer is formed as an ALD film. Furthermore, a CVD film refers to a film formed using chemical vapor deposition. An ALD film refers to a film formed using atomic layer deposition.

[0072] The shape of the upper and lower direction (thickness direction) of the device protection layer (15) is not particularly limited, and the side wall of the device protection layer (15) may have a taper formed thereon, or it may be formed as a non-tapered shape as shown in FIG. 1.

[0073] When the normal direction of the display surface (110A) is the line of sight, the element protection layer (15) has a shape corresponding to the shape of the light-emitting element (13) and covers the light-emitting surface of the light-emitting element (13). This is suitable from the perspective of efficiently performing the function of protecting the light-emitting element (13) and from the perspective of forming the connection part (18) described later at an appropriate location.

[0074] Additionally, the thickness of the device protection layer (15) may be the same among different colors of the subpixel (101) or may have different values. For example, when the thicknesses of the organic layers (131R, 131G, 131B) corresponding to the subpixels (101R, 101G, 101B) are different from each other, the first surface for forming the second cathode electrode (134) can be flattened by making the thickness of the device protection layer (15) different.

[0075] (Sidewall protection layer)

[0076] In the example of FIG. 1, a sidewall protection layer (16) is formed as a protective layer between adjacent light-emitting elements (13), between the second cathode electrode (134) and the insulating layer (14). The sidewall protection layer (16) fills the space between adjacent light-emitting elements (13) and covers the side of the connection part (18) to prevent moisture from the external environment from entering the connection part (18). The sidewall protection layer (16) may be formed of the same material as the element protection layer (15).

[0077] (Upper protective layer)

[0078] The upper protective layer (19) is a protective layer covering the second cathode electrode (134). The upper protective layer (19) protects the second cathode electrode (134). Specifically, the upper protective layer (19) prevents moisture from reaching the second cathode electrode (134) from the external environment. In addition, the upper protective layer (19), like the lower protective layer (17), also prevents moisture from entering the light-emitting element (13) from the external environment. That is, the upper protective layer (19) reinforces the protection of the light-emitting element (13) by the lower protective layer (17). If the second cathode electrode (134) is composed of a metal layer, the upper protective layer (19) may have a function of preventing oxidation of this metal layer.

[0079] The material of the upper protective layer (19) is formed from an insulating material, just like the lower protective layer (17), such as the device protective layer (15). The types of insulating materials may be the same as those described in the description of the device protective layer (15). The upper protective layer (19) may also be formed as a single layer or as a stacked layer, just like the device protective layer (15).

[0080] (Connection part)

[0081] The connection part (18) is a part that electrically connects the first cathode electrode (132) and the second cathode electrode (134). In the display device (10A) according to the first embodiment, the connection part (18) is provided separately from the first cathode electrode (132) and the second cathode electrode (134). However, regarding the scope of application of the connection part (18), the technology of providing the connection part separately from the first cathode electrode (132) and the second cathode electrode (134) is not limited to the technology of providing the connection part separately from the first cathode electrode (132) and the second cathode electrode (134), and the connection part (18) can be applied to the technology in which a part of the first cathode electrode (132) or a part of the second cathode electrode (134) is used as a part that connects the first cathode electrode (132) and the second cathode electrode (134).

[0082] The connection portion (18) is formed along the side wall of the device protection layer (15). The connection portion (18) may be formed along a part of the side wall (15A) of the device protection layer (15), but as shown in FIG. 1, FIG. 2 B, etc., it is preferable to form it around the entire side wall (15A) of the device protection layer (15) to ensure connection between the first cathode electrode (132) and the second cathode electrode (134).

[0083] In addition, when the device protection layer (15) covers the light-emitting region P, the connection part (18) is provided on the outside of the light-emitting region P, and the influence on the light-emitting state by the connection part (18) is suppressed. Therefore, the decrease in brightness of the display device (10A) can be suppressed.

[0084] The base (18A) of the connection portion (18) is positioned so that the side wall (15A) of the element protection layer (15) and the first cathode electrode (132) are in contact, and the connection portion (18) extends from the base (18A) along the side wall (15A) of the element protection layer (15) toward the second cathode electrode (134). The tip (18B) of the connection portion (18) is in contact with the second surface side of the second cathode electrode (134).

[0085] The connection portion (18) contains a conductive material. It is preferable for the connection portion (18) to be formed from a regenerated material (so-called deposition) of the first cathode electrode (132) for the sake of process simplification. In this case, the connection portion (18) is formed to contain an element (metal element) that forms the first cathode electrode (132), thereby containing a conductive material and having conductivity. Additionally, the connection portion (18) may be newly formed using a side wall process. A side wall process refers to a technique for forming a layer on a side wall surface, etc., by appropriately combining lithography technology, CVD, etching technology, etc.

[0086] (Filling resin layer)

[0087] A filling resin layer (20) may be formed on the first surface side of the upper protective layer (19). The filling resin layer (20) may function as an adhesive layer for bonding the opposing substrate (21) described later. The filling resin layer (20) may be an example of a UV-curing resin or a thermosetting resin.

[0088] (Opposing substrate)

[0089] The opposing substrate (21) is provided on the filling resin layer (20) in a state facing the driving substrate (11). The opposing substrate (21) seals the light-emitting element (13) together with the filling resin layer (20). The opposing substrate (21) may be formed of the same material as the substrate (11A) forming the driving substrate (11), and it is preferable that it be composed of a material such as glass.

[0090] In addition, for convenience of explanation, the description of the filling resin layer (20) and the opposing substrate (21) is omitted in FIGS. 2 to 11 regarding the first embodiment and FIGS. 12 to 43 regarding the second to sixth embodiments. In addition, for convenience of explanation, the description of the upper protective layer (19) may also be omitted in the drawings.

[0091] [1-2 Manufacturing Method]

[0092] A method for manufacturing a display device (10A) according to the first embodiment is described using FIGS. 3 and 4. FIGS. 3 and 4 are drawings showing an example of a method for manufacturing a display device (10A) according to the first embodiment. First, an anode electrode (130) or an insulating layer (14) is formed on a driving substrate (11), and an organic layer (131), a first cathode electrode (132), and a lower protective layer (17) (device protective layer (15)) are formed (Fig. 3A). Next, the device protective layer (15) and the first cathode electrode (132) are patterned for each subpixel (101) (Fig. 3B). At this time, the side end of the first cathode electrode (132) is exposed. In addition, a conductive film (22) is formed on the first surface using the material of the first cathode electrode (132) (Fig. 3C). For the film formation method of the conductive film (22), it is suitable to use a method with excellent film coating properties, such as ALD. The conductive film (22) comes into contact with the first cathode electrode (132). Then, a dry etching method or the like is performed on the entire surface of the conductive film (22) (Fig. 3D). At this time, a connection portion (18) is formed on the conductive film (22) remaining on the side wall (15A) of the device protection layer (15). Additionally, the organic layer (131) is processed in segments for each subpixel (101). After that, a side wall protection layer (16) is formed (Fig. 4A), and a flattening treatment is performed using a dry etching method or the like (Fig. 4B). At this time, the upper portion of the device protection layer (15) and the connection portion (18) is exposed. Then, a second cathode electrode (134) is formed on the first surface (Fig. 4C). The second cathode electrode (134) is electrically connected to the first cathode electrode (132) through a connection part (18). Then, an upper protective layer (19) is formed on the second cathode electrode (134), and the upper protective layer (19) and the opposing substrate (21) are fixed through a filling resin layer (20). In this way, a display device (10A) is obtained.

[0093] [1-3 Effects]

[0094] According to the first embodiment, the connection portion (18) can be a self-aligned structure at a position along the side wall (15A) of the element protection layer (15), so the process of opening vias can be omitted. In addition, since the connection between the second cathode electrode (134) and the first cathode electrode (132) can be realized without securing an area of ​​a certain size inside the subpixel (101) for the purpose of securing the connection portion, it is advantageous for high precision of the subpixel (101).

[0095] Additionally, in the display device (10A), a device protection layer (15) is provided between the first cathode electrode (132) and the second cathode electrode (134). By doing so, the device protection layer (15) can prevent the organic layer (131) from being exposed to process gas or chemical solution during the etching process of the organic layer (131) and the first cathode electrode (132). That is, damage to the organic layer (131) can be prevented. Therefore, the reliability of the light-emitting state of the display device (10A) can be prevented.

[0096] Additionally, the anode electrode (130), the organic layer (131), and the first cathode electrode (132) are separated for each subpixel (101), and an insulating sidewall protection layer (16) is provided between each subpixel (101). By doing so, leakage current between adjacent subpixels (101) can be suppressed. Therefore, by suppressing color mixing and improving color reproduction and luminous efficiency, the reliability of the light emission state of the display device (10A) can be improved.

[0097] [1-4 Variations of display devices]

[0098] Next, a modified example of the display device (10A) according to the first embodiment is described.

[0099] (Variation Example 1)

[0100] In the description of the first embodiment, the light emission color of the organic layer (131) was a color type corresponding to the light emission color of the subpixel (101), but in the display device (10A) according to the first embodiment, the light emission color of the light-emitting element (13) may be a color type other than the light emission color corresponding to the light emission color of the subpixel (101). For example, specifically, a light-emitting element (13W) whose light emission color is white may be provided without being limited to the color type of the subpixel (101) (Fig. 5). Fig. 5 is a cross-sectional view showing one embodiment of the display device (10A) according to a modified example 1 of the first embodiment. In addition, in the display device (10A) according to modified example 1, a light-emitting element (13W) is provided, and a color filter (23) corresponding to the color type of the subpixel (101) is provided. By this, light corresponding to the color type of the subpixel (101) is displayed on the display surface (110A). However, this does not restrict the provision of a color filter (23) when a light-emitting element (13) corresponding to the light-emitting color of the subpixel (101) is provided.

[0101] (Organic layer)

[0102] The light-emitting element (13W) has an organic layer (131W) that emits white light. The structure of the organic layer (131W) is not specifically limited to the above, and for example, as a light-emitting layer, it may have a so-called 1stack structure having a combination of a red light-emitting layer, a green light-emitting layer, and a blue light-emitting layer. In addition, the thickness of the organic layer (131W) may be the same or different for each subpixel (101). In the example of FIG. 5, the thickness of the organic layer (131W) is uniform between the subpixels (101G, 101B, 101R).

[0103] (Color filter)

[0104] A color filter (23) is provided on the first surface side (upper side, +Z direction side) of the upper protective layer (19). Additionally, the color filter (23) shown in FIG. 5 is an On Chip Color Filter (OCCF). The color filter (23) may include, for example, a red color filter (red filter (23R)), a green color filter (green filter (23G)), and a blue color filter (blue filter (23B)), as shown in the example of FIG. 5. The red filter (23R), green filter (23G), and blue filter (23B) are each provided facing the light-emitting element (13W). Accordingly, white light emitted from each light-emitting element (13W) in each of the red subpixel (101R), green subpixel (101G), and blue subpixel (101B) passes through the red filter (23R), green filter (23G), and blue filter (23B) respectively, so that red light, green light, and blue light are emitted from the display surface (110A) respectively.

[0105] (Variation Example 2)

[0106] In the display device (10A) of the first embodiment, the layout of the subpixels (101R, 101G, 101B) may be a pattern other than the stripe-shaped pattern shown in the example of FIG. 2B. For example, it may be a delta-shaped layout pattern as shown in FIG. 6B and FIG. 6C, or a square arrangement pattern as shown in FIG. 6A. Also, a delta shape refers to an arrangement in which connecting the centers of three subpixels (101R, 101G, 101B) forms a triangle. A square arrangement refers to an arrangement in which connecting the centers of four subpixels (in the example of FIG. 3B, the subpixels (101R, 101G, 101B, 101B)) forms a square. Furthermore, the number of color types of the subpixels (101) is not limited to three. For example, as shown in FIG. 7A to FIG. 7D, there may be four types of color types of the subpixels (101). FIG. 7A to FIG. 7D are drawings showing an example of a layout in which the display device (10A) has subpixels (101R, 101G, 101B, 101W) corresponding to four types of color types (red, green, blue, and white). Even in this case, the layout of the subpixels (101) is not particularly limited, and for example, a delta shape ( FIG. 7C, FIG. 7D), a square arrangement ( FIG. It may be a stripe arrangement (Fig. 7A), a stripe arrangement (Fig. 7B), etc.

[0107] (Variation Example 3)

[0108] In the display device (10A) of the first embodiment, as shown in FIG. 8, the subpixel (101) may form a resonator structure (24) (Variation Example 3). FIG. 8 is a cross-sectional view showing one embodiment of the display device (10A) according to Variation Example 3.

[0109] In Variation Example 3, the resonator structure (24) is formed with a second cathode electrode (134) and a light-emitting element (13). The resonator structure (24) represents a structure that resonates light of a predetermined wavelength. In Variation Example 3, for example, the first cathode electrode (132) of the light-emitting element (13) is formed as a transparent electrode, and the second cathode electrode (134) preferably includes a semi-transparent reflective layer. Furthermore, when including a semi-transparent reflective layer, the case where it is formed only as a semi-transparent reflective layer is included. Additionally, it is preferable that the anode electrode (130) has light reflectivity. The optical distance between the second cathode electrode (134) and the anode electrode (130) is adjusted so that the resonator structure (24) resonates light corresponding to the color of the subpixel (101) for each subpixel (101). This is specifically realized by adjusting the thickness of the device protection layer (15), as shown in FIG. 8, for example. In the example of FIG. 8, the device protection layer (15) has different thicknesses between subpixels (101) corresponding to different colors. Also, in the example of FIG. 8, organic layers (131R, 131G, 131B) are provided corresponding to subpixels (101R, 101G, 101B). In this case, light that emphasizes red, green, and blue, respectively, is emitted from the display surface (110A) side for each of the organic layers (131R, 131G, 131B) by means of the resonator structure (24), thereby improving color purity. Additionally, the optical distance is defined as the sum of the products of the thickness and refractive index of each layer forming the resonator structure (24).

[0110] According to the display device (10A), even if the device protection layer (15) has a different thickness, a connection portion (18) is formed on the side wall (15A) of the device protection layer (15), so that the first cathode electrode (132) and the second cathode electrode (134) can be effectively connected at the connection portion (18).

[0111] (Variation Example 4)

[0112] In the display device (10A) of the above-mentioned Variant Example 3 of the first embodiment, as shown in FIG. 9, an organic layer (131W) that emits a white light color may be provided regardless of the color of the subpixel (101) (Variant Example 4). In the case of Variant Example 4, by means of the resonator structure (24), blue light among the light emitted from the organic layer (131W) is emphasized in the subpixel (101B). Likewise, green light among the light emitted from the organic layer (131W) is emphasized in the subpixel (101G). Also, likewise, red light among the light emitted from the organic layer (131W) is emphasized in the subpixel (101R). From the perspective of further increasing the color purity of the emphasized light, it is preferable to have a color filter (23) formed as shown in FIG. 9. The organic layer (131W) and the color filter (23) are the same as in Variant Example 1.

[0113] (Variation Example 5)

[0114] In the display device (10A) of the first embodiment, as shown in FIG. 10, a void portion (25) may be formed within the sidewall protection layer (16) formed between adjacent subpixels (101) (between adjacent light-emitting elements (13)) (Variation Example 5). In the display device (10A) of Variation Example 5 shown in FIG. 10, the void portion (25) is formed in a tapered shape, but the shape of the void portion (25) is not limited to this. The void portion (25) can be formed by adjusting the formation conditions when forming the sidewall protection layer (16).

[0115] (Variation Example 6)

[0116] In the display device (10A) of the first embodiment, as shown in FIG. 11, the side (18C) of the connection part (18) (the side facing the element protection layer (15)) may be connected to the second cathode electrode (134) (Variation Example 6). The display device (10A) according to Variation Example 6 can be manufactured as follows. A side wall protection layer (16) is formed in the same manner as described in the manufacturing method of the display device (10A) of the first embodiment, and the side wall protection layer (16) is selectively etched. At this time, the side (18C) of the connection part (18) is exposed (Fig. 11 A). Then, the second cathode electrode (134) is formed (Fig. 11 B). By doing so, the second cathode electrode (134) is connected to the side (18C) on the outside of the connection part (18). After the second cathode electrode (134) is formed, the same method as the manufacturing method of the display device (10A) of the first embodiment is applied. According to the display device (10A) of Variant Example 6, the first cathode electrode (132) and the second cathode electrode (134) can be connected even if a partial disconnection occurs in the connection part (18).

[0117] [2 Second Embodiment]

[0118] A display device (10B) according to a second embodiment will be described. As shown in FIG. 12, the display device (10B) is provided with an anode electrode (130), an organic layer (131), and a first cathode electrode (132), and is provided with a plurality of light-emitting elements (13) in which the anode electrode (130), the organic layer (131), and the first cathode electrode (132) are separated for each subpixel (101), and a second cathode electrode (134). Since these configurations are the same as those of the display device (10A) according to the first embodiment, the same reference numerals are used and the description is omitted. The fact that the display device (10B) has a plurality of subpixels (101) is also the same as that of the first embodiment. Furthermore, these configurations are the same for the third to sixth embodiments. Therefore, regarding these configurations, the reference numerals used in the first embodiment are used for the third to sixth embodiments described below, just as they were for the second embodiment, and the description is also omitted.

[0119] Additionally, the display device (10B) is provided with an upper protective layer (19), a filling resin layer (20), a counter substrate (21), and a color filter (23) as needed. Since these configurations are the same as those of the display device (10A) of the first embodiment, description and illustration are omitted. Unless specifically adopted in variations, the same applies to the third to sixth embodiments.

[0120] In the description of the first embodiment, the subpixel (101) and organic layer (131), etc., were described using general terms when no specific color type was distinguished, but this is also the case for the second to sixth embodiments.

[0121] For the second embodiment and the third to sixth embodiments described below, a different configuration from the first embodiment is described.

[0122] [2-1 Configuration of the Display Device]

[0123] In the display device (10B) according to the second embodiment, a lower protective layer (17) is provided as a protective layer, similar to the display device (10A) according to the first embodiment, and in the example of FIG. 12, a plurality of element protective layers (15) covering each of the plurality of light-emitting elements (13) are provided, and a side wall protective layer (16) is provided between adjacent light-emitting elements. In the second embodiment, when the Z-axis direction is the line of sight, the element protective layer (15) is formed in the light-emitting region P of the light-emitting element (13) for each subpixel (101). In FIG. 12, one of the subpixels (101) is shown to indicate the main part. The same applies to FIG. 13 to FIG. 15.

[0124] (Connection part)

[0125] In the display device (10B), as shown in FIG. 12, a connection part (30) is provided to electrically connect the second cathode electrode (134) and the first cathode electrode (132). The connection part (30) shown in FIG. 12 is an extension installation part (26) that extends from the second cathode electrode (134) toward the first cathode electrode (132). In addition, the end of the connection part (30) shown in this example (the extended protruding end of the extension installation part (26)) is connected to the outer circumference end (132A) of the upper surface (first surface) of the first cathode electrode (132).

[0126] The connection portion (30) is provided at a position around the area so as to surround the light-emitting region P of the light-emitting element (13), as shown in A of FIG. 13, when viewed from the plane of the display surface (110A) (when the Z-axis direction is the line of sight). FIG. 13 A is a plan view showing one embodiment of the second embodiment.

[0127] The connection portion (30) shown in the example of FIG. 12 has an outer portion (30A) formed of a conductive material such as ITO or IZO that can be used as a material for forming the second cathode electrode (134), and the inner portion (30B) of the connection portion (30) is a part having a refractive index different from the refractive index of the device protection layer (15), which is a protection layer. In the example of FIG. 12, the inner portion (30B) is a space portion. In this case, the inner portion (30B) of the connection portion (30) is a part having a refractive index lower than the refractive index of the device protection layer (15). Also, at this time, the connection portion (30) has a hollow shape. The space portion forming the inner portion (30B) of the connection portion (30) is formed as a continuous space surrounding the light-emitting region P, as shown in FIG. 13A.

[0128] The position where the connection portion (30) is formed is not particularly limited, but it is preferable that it be formed at a position around the outer circumference (141) of the opening (14A) when the Z-axis direction (the thickness direction of the light-emitting element (13)) is the line of sight. In this case, the connection portion (30) can be prevented from being positioned inside the light-emitting region P of the light-emitting element (13). The outer circumference (141) of the opening (14A) refers to an area of ​​a predetermined range outside from the edge (140) of the opening end.

[0129] [2-2 Effects of Action]

[0130] In this regard, according to the display device (10B) of the second embodiment, by making the inner part (30B) of the connection part (30) a part with a refractive index lower than that of the lower protection layer (17) (element protection layer (15)), the light emitted in an oblique direction from the organic layer (131) in the connection part (30) can be totally reflected, and the leakage of light to the adjacent subpixel (101) can be reduced, thereby increasing the efficiency of light utilization.

[0131] Additionally, the connection portion (30) is provided to surround the light-emitting area P. By doing so, as a connection structure between the first cathode electrode (132) and the second cathode electrode (134), an equivalent structure is formed at any position surrounding the light-emitting surface (an equivalent structure is formed in all directions), and fluctuations in the viewing angle characteristics can be suppressed, thereby improving the reliability of the light-emitting state of the display device (10B).

[0132] According to the display device (10B) of the second embodiment, the first cathode electrode (132) or the organic layer (131) is covered with a lower protective layer (17), such as a device protective layer (15), so that the deterioration of the organic layer (131) during the formation of the second cathode electrode (134) can be suppressed.

[0133] [2-3 Variation Example]

[0134] Next, a modified example of the display device (10B) regarding the second embodiment will be described.

[0135] (Variation Example 1)

[0136] In the display device (10B) according to the second embodiment, the connection portion (30) may be arranged in multiple units spaced apart from each other in a direction facing outward from the center of each subpixel (101) (a direction facing outward from the center of the element protection layer (15)), with the Z-axis direction as the line of sight, as shown in A of FIG. 14 (Variation Example 1). In this case, the spacing Wp1 of adjacent connection portions (30) is preferably set to a value that is less than or equal to the peak wavelength of the light emitted from the light-emitting element (13) for each subpixel (101), and more preferably to a value that is less than or equal to half of the peak wavelength. In addition, the width Ws1 of the inner portion (30B) is preferably less than or equal to the peak wavelength, and more preferably less than or equal to half of the peak wavelength.

[0137] In the display device (10B) according to the first variation of the second embodiment, in the multiple connected portions (30), the member forming the side wall protective layer (16) and the inner portion (30B) of the connected portion (30) are arranged in a direction toward the outside from the center of the element protective layer (15) in a plurality of connected portions (30), and are arranged in a periodic repeating manner with a period smaller than the peak wavelength of the emitted light. Accordingly, in the display device (10B), for each subpixel (101), a portion is formed around the light-emitting surface of the light-emitting element (13) in which the refractive index changes periodically at the wavelength level of the emitted light, so that the emitted light in the oblique direction is difficult to leak outward from the position of the connected portion (30).

[0138] (Variation Example 2)

[0139] In the display device (10B) according to the second embodiment, the inner portion (30B) of the connection portion (30) is formed to surround the light-emitting region P in a continuous space, but the connection portion (30) is not limited to this. For example, the connection portion (30) may be formed as a via (31) formed in the lower protective layer (17) as shown in B of FIG. 13, and a via row (32) formed by arranging a plurality of vias (31) may be formed.

[0140] (Lower protection layer)

[0141] In the second variation of the second embodiment, the element protection layer (15) and the sidewall protection layer (16) are connected (continuous) between adjacent vias (31), and in the example of FIG. 13 B, the lower protection layer (17) is continuous and integrated. In the second variation of the second embodiment, the periphery of each via (31) is surrounded by the lower protection layer (17).

[0142] (Via)

[0143] In this specification, a via (31) is defined as a hole-shaped structure having conductivity. The via (31) shown in Variation 2 of the second embodiment is a hole-shaped structure extending from the second cathode electrode (134) side to the first cathode electrode (132). The via (31) has a structure in which the second cathode electrode (134) is extended along the inner circumferential surface and bottom surface (first surface of the first cathode electrode (132)) of the hole portion formed in the lower protective layer (17). Accordingly, when the connection portion (30) is formed as a via (31), the outer circumferential portion (30A) is formed as the second cathode electrode (134). In addition, the interior of the via (31) forming the inner portion (30B) of the connection portion (30) is a portion having a refractive index lower than that of the lower protective layer (17). Specifically, in the example of Fig. 13B, the via (31) has a hollow shape. Therefore, when the connection portion (30) is formed as a via (31), the inner portion (30B) is a space. In addition, the three-dimensional shape of the via (31) is not particularly limited and may be, for example, a cylindrical shape or a prismatic shape. However, the case where the interior of the via (31) is hollow is an example, and the interior of the via (31) may be filled with a material having a lower refractive index than the lower protective layer (17). In this case, the inner portion (30B) is formed with the material having a lower refractive index.

[0144] (Non-fever)

[0145] A plurality of vias (31) are arranged to surround the light-emitting region P of the light-emitting element (13) and form a row of vias (32). The connection portion (30) is composed of a row of vias (32).

[0146] According to the display device (10B) of the second embodiment's modified example 2, a via (31) that serves as a connection part (30) is arranged to surround the light-emitting surface of the light-emitting element (13), thereby forming a via row (32). By doing so, an equivalent structure is formed at any position surrounding the light-emitting surface (an equivalent structure is formed in all directions), thereby suppressing fluctuations in the viewing angle characteristics.

[0147] In addition, in the display device (10B), a via row (32) is formed so that even if a disconnection occurs in a predetermined via (31) or a contact failure occurs between a part of the via (31) and the first cathode electrode (132), the connection between the first cathode electrode (132) and the second cathode electrode (134) can be secured in another via (31), thereby improving the reliability of the display device (10B).

[0148] (Variation Example 3)

[0149] In the display device (10B) according to Variation Example 2 of the second embodiment, the via row (32) forming the connection portion (30) may be arranged in multiple rows spaced apart in a direction facing outward from the center of each subpixel (101) (a direction spaced apart from the light-emitting element (13)), with the Z-axis direction as the line of sight (Variation Example 3).

[0150] In the third variation of the second embodiment, the spacing Wp1 (the spacing of the adjacent via row (32)) of the adjacent connection portion (30) is preferably set to a value less than or equal to the peak wavelength of the emitted light of the light-emitting element (13) for each subpixel (101), and more preferably to a value less than or equal to half the peak wavelength.

[0151] For each individual light-emitting element (13) constituting a plurality of light-emitting elements (13), it is preferable that the pitch of the plurality of vias surrounding the light-emitting region P of the individual light-emitting element (13) is smaller than the peak wavelength corresponding to the light emitted from the individual light-emitting element (13). That is, to describe a specific example, for example, among the light-emitting elements (13R, 13G, 13B), for the light-emitting element (13R), it is preferable that the pitch of the vias (31) arranged around the light-emitting region P of the light-emitting element (13R) is smaller than the peak wavelength of the red light emitted from the light-emitting element (13R). In the via row (32), the spacing Wp2 (pitch) of adjacent vias (31) is preferably set to a value that is less than or equal to the peak wavelength of the light emitted from the light-emitting element (13) for each subpixel (101), and it is more preferable that the value is less than or equal to half of the peak wavelength. In addition, the width of the space formed inside each via (31) is preferably less than or equal to the peak wavelength, and more preferably less than or equal to half the peak wavelength.

[0152] The peak wavelength of the emitted light from the light-emitting element (13) differs depending on the color of the subpixel (101). Taking this into account, the display device (10B) is provided with a plurality of subpixels (101) corresponding to a plurality of colors, and a connection portion (30) is provided for each subpixel (101). In this case, it is preferable that the pitch of adjacent vias (31) forming a via row (32) differs depending on the color of the subpixel (101).

[0153] In the display device (10B) according to the third variation of the second embodiment, the connection portion (30) is configured such that, for either the alignment direction of the via (31) within the via row (32) or the arrangement direction of the plurality of via rows (32), the material forming the via (31) and the lower protective layer (17) is arranged in a periodic repeating manner with a period smaller than the peak wavelength of the emitted light. In this case, in the display device (10B), for each subpixel (101), a portion is formed around the light-emitting region P of the light-emitting element (13) in which the refractive index changes periodically at the wavelength level of the emitted light, so that the emitted light in the oblique direction is difficult to leak outward from the position of the connection portion (30). Therefore, according to the display device (10B) according to the third variation of the second embodiment, light leakage can be suppressed more effectively, and the efficiency of light utilization can be improved.

[0154] (Variation Example 4)

[0155] In the display device (10B) according to the second embodiment, the connection portion (30) is not limited to being connected to the outer circumferential end (132A) of the upper surface of the first cathode electrode (132), but may also be connected at the location of the side wall (132B) of the first cathode electrode (132).

[0156] [3 Third Embodiment]

[0157] [3-1 Configuration of the Display Device]

[0158] A display device (10C) according to the third embodiment will be described. In the display device (10C) according to the third embodiment, as shown in FIG. 16, a side wall protective layer (16) (also a lower protective layer (17)) is formed as a protective layer between adjacent subpixels (101), similar to the display device (10A) according to the first embodiment. FIG. 16 is a cross-sectional view showing one embodiment of the display device according to the third embodiment. In addition, in the display device (10C) according to the third embodiment illustrated in FIG. 16, unlike the first embodiment, the insulating layer (14) between adjacent anode electrodes (130) is omitted, but the insulating layer (14) may be provided.

[0159] In addition, in the display device (10C) according to the third embodiment, as shown in FIG. 16, a first refractive index portion (33) and a second refractive index portion (34) are formed in the side wall protection layer (16) in the side area of ​​each light-emitting element (13). The first refractive index portion (33) and the second refractive index portion (34) are arranged in this order for each subpixel (101), from the side closer to the light-emitting element (13) toward the outside of the light-emitting element (13) (a direction spaced apart from the light-emitting element (13). The side area M of the light-emitting element (13) refers to a range from the position of the side wall (113) of the light-emitting element (13) toward a predetermined position toward the outside.

[0160] (1st refractive index section)

[0161] In the example of FIG. 16, the first refractive index portion (33) is formed as a layer covering the side (35A) of the connection portion (35) described later and the side wall of the organic layer (131). By covering the side (35A) of the connection portion (35) and the side wall of the organic layer (131) with the first refractive index portion (33) in this way, moisture and the like from the external environment are prevented from penetrating into the organic layer (131), thereby preventing the deterioration of the organic layer (131). The first refractive index portion (33) is formed from the material constituting the side wall protection layer (16) described in the first embodiment.

[0162] (2nd refractive index section)

[0163] The second refractive index portion (34) has a lower refractive index than the first refractive index portion (33). The second refractive index portion (34) is preferably a space portion. The space portion may be a portion filled with air or rare gas, but a vacuum portion is suitable from the perspective of lowering the refractive index of the second refractive index portion (34). The second refractive index portion (34) is formed as a space extending along the thickness direction of the light-emitting element (13) in a direction from the driving substrate (11) toward the light-emitting element (13).

[0164] (Connection part)

[0165] In the display device (10C), as shown in FIG. 16, a connection part (35) is provided to electrically connect the second cathode electrode (134) and the first cathode electrode (132). The connection part (35) shown in FIG. 16 is formed as a vertical wall section installed facing the second cathode electrode (134) with the outer edge of the first cathode electrode (132) as the base, and forms a part of the first cathode electrode (132). In addition, the tip (upper end) of the connection part (35) shown in this example is electrically connected to the lower surface (second surface) of the second cathode electrode (134).

[0166] [3-2 Method for manufacturing a display device]

[0167] A method for manufacturing a display device (10C) according to a third embodiment is described. Here, a method for manufacturing a display device (10C) shown in the drawing is described. However, an example is given in which the second refractive index part (34) is a space part.

[0168] After forming an anode electrode (130) separated for each subpixel (101) on the first surface of the driving substrate (11), a sidewall protection layer (16) is formed on the entire surface of the first surface by the PCVD method (plasma-enhanced chemical vapor deposition method) (e.g., a layer formed with a thickness of 2000 nm), and an opening (160) is also formed for each subpixel (101) using a lithography method or the like (Fig. 17A). At this time, the first surface of the anode electrode (130) is exposed through the opening (160). The formation of the above-mentioned sidewall protection layer (16) can be realized by forming a PSiO film (plasma silicon oxide film) by, for example, the PCVD method.

[0169] Next, an organic layer (131) (e.g., a layer with a thickness of about 1000 nm) is formed along the first surface side using a deposition method, and a first cathode electrode (132) is also formed. The formation of the first cathode electrode (132) can be realized by forming an IZO film (e.g., a film with a thickness of about 50 nm) on the first surface side using, for example, a reactive sputtering method. At this time, the organic layer (131) and the first cathode electrode (132) are also formed on the side portion (160A) formed at the opening (160) of the sidewall protection layer (16).

[0170] After that, a device protection layer (15) is formed on the first side (Fig. 17 B). The formation of the device protection layer (15) is realized by forming a PSiN film (e.g., a film with a thickness of about 2000 nm) using, for example, a low-temperature PCVD method.

[0171] As shown in Fig. 17C, dry etching is performed to remove the element protection layer (15) located above the upper surface position of the sidewall protection layer (16). It is preferable that the upper surface position of the sidewall protection layer (16) and the upper surface position of the element protection layer (15) be approximately the same, but they do not need to be exactly the same position.

[0172] In addition, as shown in FIG. 18A, regarding the portion of the organic layer (131) and the first cathode electrode (132) that is exposed above the upper surface position of the sidewall protection layer (16), both the organic layer (131) and the first cathode electrode (132) are removed using a dry etching method. This can be realized by selecting conditions such as an etching gas. Then, the organic layer (131) formed along the side portion (160A) formed in the opening (160) of the sidewall protection layer (16) is removed using a dry etching method. This can also be realized by selecting conditions such as an etching gas.

[0173] Next, a sidewall protection layer (16) is further formed on the first surface side using a low-temperature PCVD method or the like. The thickness of the portion of the sidewall protection layer (16) additionally formed in this process is, for example, about 50 nm. Then, the sidewall protection layer (16) formed on the end surface of the connection part (35) exposed on the first surface side or on the element protection layer (15) is removed by a dry etching method or the like. At this time, the sidewall protection layer (16) is formed to cover the portion of the first cathode electrode (132) that becomes the connection part (35) (B in FIG. 18). With the thickness direction of the light-emitting element (13) as the line of sight, the portion of the sidewall protection layer (16) formed at the position of the side region M of the light-emitting element (13) forms the first refractive index portion (33). In addition, at this time, the side end surface of the organic layer (131) is also covered with a side wall protection layer (16), so that a space facing the first surface is formed at the position of the side region M of the light-emitting element (13), in the thickness direction and line of sight direction of the light-emitting element (13). This space becomes the second refractive index portion (34).

[0174] And, as shown in FIG. 16, a second cathode electrode (134) is formed on one side of the first surface by using a sputtering method, etc. This can be realized by sputtering using a material for the second cathode electrode (134), such as IZO, for example. The second cathode electrode (134) may have a thickness of about 100 nm. In addition, by the conditions of the sputtering method using the material for the second cathode electrode (134), it is possible to avoid forming the second cathode electrode (134) within the space that becomes the second refractive index part (34).

[0175] After the second cathode electrode (134) is formed, a display device (10C) can be obtained in the same way as the method of manufacturing a display device described in the first embodiment.

[0176] In the description of the above manufacturing method, the second refractive index portion (34) was a space, but other materials may be filled instead of the space. For example, the sidewall protection layer (16) (and the first refractive index portion (33)) may be made of silicon nitride, and the second refractive index portion (34) may be made of a silicon oxide film.

[0177] [3-3 Effects]

[0178] In this regard, in the display device (10C) according to the third embodiment, a first refractive index portion (33) and a second refractive index portion (34) with different refractive indices are formed in the side wall protection layer (16) at the side of the light-emitting element (13) for each subpixel (101). Since the first refractive index portion (33) and the second refractive index portion (34) can be formed to surround the light-emitting element (13) on the side of the light-emitting element (13), total reflection can occur. Furthermore, in the display device (10C) according to the third embodiment, since the structure of the connection portion (35) connecting the second cathode electrode (134) and the first cathode electrode (132) can also be formed to surround the light-emitting element (13), it is difficult to cause structural changes in all directions.

[0179] In a display device using an organic EL element, the structure is formed such that an organic layer including at least an organic light-emitting layer and a first cathode electrode are stacked on an anode electrode formed spaced apart from each pixel, and the first cathode electrode is separated for each subpixel. For this reason, a display device is proposed in which a second cathode electrode is connected to the first cathode electrode. In such a display device, structural variation (asymmetry) may occur at the connection point and at other locations. In such a display device (10C), the reliability of the light-emitting state can be improved by resolving structural variation and improving light utilization efficiency.

[0180] [3-4 Variation Example]

[0181] (Variation Example 1)

[0182] (Configuration of the display device of Variant Example 1)

[0183] Next, a modified example of the display device (10C) according to the third embodiment will be described. In the display device (10C) according to the third embodiment, a second cathode electrode (134) was provided on the element protection layer (15) in the lower protection layer (17), but as shown in FIG. 19, the element protection layer (15) may be omitted (modified example 1). In addition, in the display device (10C) according to the third embodiment described above, a connection portion (35) was formed on a part of the first cathode electrode (132), but in the display device (10C) according to modified example 1 shown in FIG. 19, a connection portion (35) is formed on the second cathode electrode (134). Specifically, the second cathode electrode (134) is formed along the sidewall protection layer (16) as a protective layer, and a downward vertical portion (42) is formed along the wall surface of the sidewall protection layer (16) at a position corresponding to each subpixel (101), and the lower end of the downward vertical portion (42) is connected to the first cathode electrode. Accordingly, a connection portion (35) is formed in the portion corresponding to the downward vertical portion (42). In addition, in the example of the display device (10C) according to the modified example 1 of the third embodiment shown in FIG. 19, a third refractive index portion (36) is formed in the side region MA of the anode electrode (130) for each subpixel (101). The side region MA of the anode electrode (130) represents a range from the position of the sidewall (130B) of the anode electrode (130) to a predetermined position facing outward.

[0184] (Method for manufacturing the display device of Variant Example 1)

[0185] A method for manufacturing a display device (10C) is described, in particular, with the case where the second refractive index portion (34) is a space portion. After forming an anode electrode (130) separated for each subpixel (101) on the first surface of a driving substrate (11), an organic layer (131) is formed to a predetermined thickness (specifically, for example, a thickness of about 1000 nm) using a vacuum deposition method or the like. In addition, a first cathode electrode (132) is formed to a predetermined thickness (specifically, for example, a film of IZO with a thickness of about 50 nm) to cover the organic layer (131).

[0186] Next, a layer (37) is formed on the first surface using a material that forms the third refractive index portion (36). The material that forms the third refractive index portion (36) may be exemplified, for example, a PSiO film (plasma silicon oxide film). Also, regarding the thickness of this layer (37), a thickness of about 2000 nm may be exemplified. Then, a resist (40) with a pattern according to the organic layer (131) and the first cathode electrode (132) is formed on the first surface of this layer (37) (A of FIG. 20), and dry etching is performed (B of FIG. 20). At this time, a stacked structure of the anode electrode (130), the organic layer (131), and the first cathode electrode (132) is formed for each subpixel (101). Additionally, the layer (37) is left on the first cathode electrode (132).

[0187] Next, the resist (40) is removed, and a layer (38) of a material forming a sidewall protection layer (16) and a layer (39) of a material forming a third refractive index portion (36) are sequentially laminated (C of FIG. 20). This lamination can be realized by using a low-temperature PCVD method, etc. For example, if the material forming the sidewall protection layer (16) is PSiN, a PSiN of a predetermined thickness (e.g., a thickness of 50 nm) and a PSiO of a predetermined thickness (e.g., a thickness of 100 nm) are sequentially formed using a low-temperature PCVD method, etc. At this time, these layers (38) and layers (39) are formed along the first surface and are also formed on the sidewall surface of the laminated structure of the anode electrode (130), organic layer (131), and first cathode electrode (132).

[0188] Additionally, using a dry etching method or the like, the layer (38) of the material forming the sidewall protection layer (16) and the layer (39) forming the third refractive index portion (36) are partially removed (Fig. 21 A). At this time, the portion of the layer (38) and the layer (39) formed on the sidewall surface of the stacked structure of the anode electrode (130), the organic layer (131), and the first cathode electrode (132) is left.

[0189] Next, as shown in Fig. 21B, a layer (41) of a material forming a sidewall protection layer (16) is formed on the entire surface of the first side to a predetermined thickness (e.g., a thickness of 3000 nm) using a low-temperature PCVD method or the like. Then, by removing a part of the layer (41) by dry etching or the like, the upper surface (end surface of the first side) of the layer (37) and layer (39) of the material forming the third refractive index portion (36) (e.g., a film of PSiO) is exposed.

[0190] Additionally, the portion of the layer (37) and layer (39) of the material forming the third refractive index portion (36) that is exposed on the first surface side is selectively removed by dry etching. At this time, the portion of the layer (39) adjacent to the layer (37) with the layer (38) in between becomes a space portion. Also, the layer (37) formed around the anode electrode (130) is left embedded in the layer (41). Additionally, the space portion formed in the portion of layer (39) becomes the second refractive index portion (34). Also, the portion of layer (38) sandwiched between the space portion formed in the portion of layer (37) and the second refractive index portion (34) becomes the first refractive index portion (33) (C of FIG. 21).

[0191] Then, a second cathode electrode (134) is formed on the entire surface of the first side by a sputtering method or the like with a predetermined thickness (e.g., a thickness of 100 nm) (Fig. 19). If the material forming the second cathode electrode (134) is IZO, an IZO film is formed by sputtering or the like. The second cathode electrode (134) is formed along the side wall of the layer (39) up to the surface of the first cathode electrode (132) in the space portion on the first surface of the first cathode electrode (132), and is electrically connected to the first cathode electrode (132). At this time, the portion connected to the first cathode electrode (132) and the portion formed along the side wall of the layer (39) up to the surface of the first cathode electrode (132) correspond to the downward vertical portion (42) of the second cathode electrode (134).

[0192] In addition, by the conditions of the sputtering method using the material of the second cathode electrode (134), it is possible to avoid the second cathode electrode (134) being formed within the space portion that becomes the second refractive index portion (34).

[0193] After the second cathode electrode (134) is formed, a display device (10C) according to Variation 1 of the third embodiment can be obtained in the same way as the manufacturing method of the display device (10A) described in the first embodiment.

[0194] In addition, in Variation Example 1, a third refractive index portion (36) was formed around the anode electrode (130), but the third refractive index portion (36) may be omitted.

[0195] (Effective effects)

[0196] In this variant example 1, the same effect as described in the third embodiment can be obtained.

[0197] [4 Fourth Embodiment]

[0198] [4-1 Configuration of the Display Device]

[0199] A display device (10D) according to the fourth embodiment is described. In the display device (10D) according to the fourth embodiment, as shown in FIG. 22A, a device protection layer (15) (lower protection layer (17)) as a protection layer is formed on the first cathode electrode (132) for each subpixel (101), similar to the display device (10A) according to the first embodiment. In the example of the display device (10D) according to the fourth embodiment shown in FIG. 22A, unlike the first embodiment, the sidewall protection layer (16) between adjacent subpixels (101) is omitted. However, this does not prohibit the placement of the sidewall protection layer (16), and the sidewall protection layer (16) may be formed as in the first embodiment. FIG. 22A is a cross-sectional view showing one embodiment of the display device (10D) according to the fourth embodiment. In addition, in the example of FIG. 22A, three types of subpixels (101R, 101G, 101B) are provided as subpixels (101) forming a single pixel.

[0200] In the display device (10D) according to the fourth embodiment, a metal layer (46) is filled between adjacent connection parts (45) connected to the first cathode electrode (132) of each adjacent light-emitting element (13). That is, metal is filled between adjacent connection parts (45) connected to the first cathode electrode (132) of each subpixel (101), and a metal layer (46) is formed with the filled metal.

[0201] (Second cathode electrode and connection part)

[0202] In the display device (10D) of the fourth embodiment shown in example A of FIG. 22, the connection portion (45) is formed as part of the second cathode electrode (134). The second cathode electrode (134) is formed along the outer surface of the device protection layer (15). And, among the second cathode electrode (134), the portion extending along the side wall (15A) of the device protection layer (15) toward the side wall (132B) of the first cathode electrode (132) forms the connection portion (45). The second cathode electrode (134) is connected to the side wall (132B) of the first cathode electrode (132) at the lower end of the connection portion (45). Additionally, the second cathode electrode (134) has a connecting part (47) that connects the lower ends of adjacent connecting parts (45) to each other, and functions as a common electrode that is common to the subpixel (101) overall.

[0203] (metal layer)

[0204] In the display device (10D) according to the fourth embodiment, a metal layer (46) is filled between adjacent connection parts (45) that are connected to the adjacent first cathode electrode (132) as described above. In the example of FIG. 22A, the metal layer (46) is formed to be in contact with the connection part (47) and the adjacent connection part (45). The material of the metal layer (46) is used to have light reflectivity and conductivity, and examples include metals of Group 1, Group 2, and Groups 13 to 16, and transition metals. In addition, regarding light reflectivity and conductivity, aluminum, silver, alloys containing these, etc., can be suitably used as the material of the metal layer (46). At this time, AlCu, AlSi, etc., can be exemplified as the alloy that serves as the material of the metal layer (46). However, from the perspective of ease of processing, the material of the metal layer (46) is preferably a material in which the boiling point of the halide (fluoride, etc.) is 100°C or lower under vacuum. From this perspective, the material of the metal layer (46) is preferably one or more types of metal materials selected from aluminum and aluminum alloys.

[0205] Regarding the vertical dimensions of the metal layer (46), it is preferable that the upper end (the end on the first surface side) of the metal layer (46) be located at or near the upper end of the side wall (15A) of the element protection layer (15), and the lower end (the end on the second surface side) of the metal layer (46) be located at or near the formation location of the connection portion (47) of the second cathode electrode (134).

[0206] The upper end of the metal layer (46) may extend further upward than the upper end or near the side wall (15A) of the element protection layer (15), as shown in Fig. 22B, or may extend further from the upper surface of the upper protection layer (19). In addition, the metal layer (46) in the example of Fig. 22A is embedded inside the upper protection layer (19) as described later, but the metal layer (46) may be provided on the lower protection layer (17) side according to the shape of the second cathode electrode (134).

[0207] (Devices protection layer)

[0208] The material of the device protection layer (15) is not particularly limited and may use the material described in the first embodiment. For example, the material of the device protection layer (15) may be SiN, etc. Additionally, the device protection layer (15) may be a single layer or may have a multilayer structure. For example, the device protection layer (15) may have a stacked structure of a layer formed of SiN and an AlOx film formed by ALD (atomic layer deposition).

[0209] (Upper protective layer)

[0210] In the fourth embodiment, an upper protective layer (19) is formed to cover the second cathode electrode (134), just as in the first embodiment. In the example of FIG. 22A, a metal layer (46) is embedded inside the upper protective layer (19). The material of the upper protective layer (19) can be the same as the material of the element protective layer (15) as described in the first embodiment. Also, the upper protective layer (19) may be a single layer or have a multi-layer structure, just like the element protective layer (15).

[0211] [4-2 Method for manufacturing a display device]

[0212] A method for manufacturing a display device (10D) according to the fourth embodiment will be described. Here, a method for manufacturing a display device (10D) shown in A of FIG. 22 will be described.

[0213] First, an anode electrode (130) or an insulating layer (14) is formed on the driving substrate (11), and an organic layer (131), a first cathode electrode (132), and a device protection layer (15) are formed. Subsequently, a second cathode electrode (134) is formed on the first surface. For the method of forming the second cathode electrode (134), it is suitable to use a method with excellent film-forming properties, such as ALD. The second cathode electrode (134) covers the first cathode electrode (132) on the upper surface side of the device protection layer (15). Additionally, the second cathode electrode (134) forms a connection portion (45) in the portion extending toward the driving substrate (11) side along the sidewall (15A) of the device protection layer (15). The connection portion (45) formed on the second cathode electrode (134) is connected to the side wall (132B) of the first cathode electrode (132) at a predetermined position on the lower side. Additionally, the adjacent connection portion (45) connected to the adjacent first cathode electrode (132) is connected, and the part connecting this connection portion (45) forms the connection portion (47).

[0214] Next, a metal layer (46) is formed over the entire surface to cover the second cathode electrode (134) (Fig. 23 A). At this time, the metal forming the metal layer (46) is also filled in the gap between adjacent connection parts (45). Then, the metal layer (46) is etched to expose the portion formed on the upper surface of the device protection layer (15) of the second cathode electrode (134) (Fig. 23 B). At this time, the metal layer (46) filled in the gap between adjacent connection parts (45) is left.

[0215] Additionally, an upper protective layer (19) is formed on the first side, and the upper protective layer (19) and the opposing substrate (21) are fixed through a filling resin layer (20). In this way, a display device (10D) is obtained.

[0216] [4-3 Effects of Action]

[0217] In a display device using an organic EL element, the structure is formed such that an organic layer including at least an organic light-emitting layer and a first cathode electrode are stacked on an anode electrode formed spaced apart from each pixel, and the first cathode electrode is separated for each subpixel. Accordingly, a display device is proposed in which a second cathode electrode is connected to the first cathode electrode. In such a display device, the connection portion between the second cathode electrode and the first cathode electrode may be formed using film deposition technology. If a material that is difficult to deposit, such as ITO, is used as the material of the connection portion, it is difficult to form a film with sufficient thickness. Therefore, even if a material that is difficult to deposit is used as the material of the connection portion, it is required to suppress the disconnection failure of the connection portion and improve the reliability of the light-emitting state of the display device.

[0218] In the display device (10D) according to the fourth embodiment, since the metal layer (46) is filled in the gap of the adjacent connection part (45), conductivity can be maintained even if a wire breakage occurs in the connection part (45), thereby improving the reliability of the light emission state of the display device (10D). In addition, as shown in A of FIG. 22, light emitted in an oblique direction from the organic layer (131) becomes reflected light LW in the metal layer (46), thereby suppressing light leakage to the adjacent subpixel (101).

[0219] [4-4 Variation Example]

[0220] (Variation Example 1)

[0221] Next, a modified example of the display device (10D) regarding the fourth embodiment will be described.

[0222] (Composition of Variant Example 1)

[0223] In the description of the fourth embodiment, the light-emitting color of the organic layer (131) was a color type corresponding to the light-emitting color of the subpixel (101), but in the display device (10D) according to the fourth embodiment, the light-emitting color of the light-emitting element (13) may be a color type other than the light-emitting color of the subpixel (101), just like in Variation Example 1 of the display device (10A) according to the first embodiment (Variation Example 1). For example, in the display device (10D) according to Variation Example 1 of the fourth embodiment, as shown in the example of FIG. 24, a light-emitting element (13W) having an organic layer (131W) that emits white as the light-emitting color, without being limited to the color type of the subpixel (101), may be provided. In addition, in the example of the display device (10D) according to the variation 1 of the fourth embodiment shown in FIG. 24, a light-emitting element (13W) and a color filter (23) corresponding to the color of the subpixel (101) are provided, just like in the display device (10A) according to the variation 1 of the first embodiment. Accordingly, in the display device (10D), light corresponding to the color of the subpixel (101) is displayed on the display surface (110A). Also, the light-emitting element (13W) and the color filter (23) are the same as those described in the variation 1 of the first embodiment.

[0224] (Variation Example 2)

[0225] In the display device (10D) of the fourth embodiment, the layout of the subpixels (101R, 101G, 101B) is not limited. For example, the layout of the subpixels (101) may be a stripe-shaped pattern as shown in the example of B of FIG. 26, but may also be any other pattern as in Variation Example 2 of the display device (10A) of the first embodiment. That is, in the display device (10D) of the fourth embodiment, the layout pattern of the subpixels (101) may be a delta-shaped pattern as shown in C of FIG. 26, for example, or a square arrangement pattern as shown in A of FIG. 26. Furthermore, a delta shape refers to an arrangement in which connecting the centers of three subpixels (101R, 101G, 101B) forms a triangle. A square arrangement refers to an arrangement in which the centers of four subpixels (in the example of FIG. 26A, the subpixels (101R, 101G, 101B, 101B)) are connected to form a square. In these cases as well, a connection portion (45) of the second cathode electrode (134) is formed on the outer periphery of each subpixel (101), and a metal layer (46) is filled between adjacent connection portions (45).

[0226] (Variation Example 3)

[0227] In the display device (10D) of the fourth embodiment, as in Variant Example 3 of the first embodiment, the subpixel (101) may have a resonator structure (24) as shown in A of FIG. 25 (Variant Example 3). FIG. 25 A is a cross-sectional view showing one embodiment of the display device (10D) according to Variant Example 3 of the fourth embodiment.

[0228] In the display device (10D) according to the variation of the fourth embodiment, the resonator structure (24) is formed with the second cathode electrode (134) and the light-emitting element (13). The resonator structure (24) is the same as that described in the variation of the first embodiment. In the example of FIG. 25A, the element protection layer (15) between the subpixels (101) corresponding to different colors is of different thicknesses, just like in the variation of the first embodiment. In the display device (10D) according to the variation of the fourth embodiment, a light-emitting element (13R, 13G, 13B) that emits a color corresponding to the color type of the subpixel (101) is provided, and by means of a resonator structure (24), light of a predetermined color (each red light (KR), green light (KG), blue light (KB)) is emphasized, thereby improving the color purity of the light corresponding to the color type of the subpixel (101).

[0229] According to the display device (10D), even if the element protection layer (15) has a different thickness, a metal layer (46) is filled between adjacent connection parts (45), thereby suppressing a defect in the conductivity state caused by a disconnection defect in the connection part (45) of the second cathode electrode (134).

[0230] (Variation Example 4)

[0231] In the display device (10D) of the above-mentioned variation 3 of the fourth embodiment, as shown in Fig. 25B, an organic layer (131W) may be provided regardless of the color of the subpixel (101). The organic layer (131W) is the same as that of variation 1 of the fourth embodiment. In this case as well, light corresponding to the color of the subpixel (101) is emitted by the resonator structure (24).

[0232] In the display device (10D) of the above-mentioned variation 4 of the fourth embodiment, it is preferable that a color filter (23) be provided, as shown in B of FIG. 25. By providing a color filter (23), color purity can be improved. The color filter (23) is the same as that of variation 1 of the fourth embodiment.

[0233] [5 Fifth Embodiment]

[0234] [5-1 Configuration of the Display Device]

[0235] A display device (10E) according to the fifth embodiment will be described. In the example of the display device (10E) according to the fifth embodiment shown in FIG. 27A and FIG. 27B, an insulating layer (14) is provided that is disposed between adjacent anode electrodes (130) and also covers the periphery (130A) of the anode electrode (130). FIG. 27A and FIG. 27B are cross-sectional views showing one embodiment of the display device (10E) according to the fifth embodiment. In addition, in the example of FIG. 27A and FIG. 27B, three types of subpixels (101R, 101G, 101B) are provided as subpixels (101) that form a single pixel.

[0236] In the example of the display device (10E) shown in FIG. 27A, the opening end edge (140) of the insulating layer (14) is positioned on the anode electrode (130), and a step is formed at the periphery (130A) of the anode electrode (130) due to the thickness of the opening end edge (140) of the opening (14A). Additionally, an organic layer (131) is formed to cover the portion of the anode electrode (130) exposed from the opening (14A) and the insulating layer (14) by covering the portion of the anode electrode (130) that has this step formed. Additionally, a first cathode electrode (132) is formed to cover the organic layer (131). Also, as in the first embodiment, the organic layer (131) and the first cathode electrode (132) are formed separately for each subpixel (101). In the example of the fifth embodiment shown in FIG. 27A and FIG. 27B, the laminated structure (52) of the organic layer (131) and the first cathode electrode (132) forms a raised portion (53) at the position of the opening end edge (140) of the opening (14A). At a predetermined position further inside the periphery (130A) of each anode electrode (130) (a predetermined position further inside than the opening end edge (140) of the opening (14A)), the laminated structure (52) of the organic layer (131) and the first cathode electrode (132) is divided into a predetermined shape. In the example of FIG. 27B, the laminated structure (52) is separated into a rectangular portion (periphery inner (50)) inside the periphery (130A) and an outer periphery portion (outer periphery (51)). The inner side of the periphery (130A) of the anode electrode (130) refers to a region located in the inner side when the Z-axis direction is the line of sight (when the thickness direction of the light-emitting element (13) is the line of sight).

[0237] (Inside the main character)

[0238] The main inner portion (50) is a portion formed further inward than the main portion (130A) of the anode electrode (130) in the stacked structure (52) of the organic layer (131) and the first cathode electrode (132), and is formed further inward (central side) than the opening end edge (140) of the opening (14A). In the example shown in FIG. 27A, the main inner portion (50) is a portion that avoids the raised portion (53) in the stacked structure (52) of the organic layer (131) and the first cathode electrode (132). In the example of FIG. 27, the anode electrode (130) is formed in a flat shape, and the main inner portion (50) is easily formed in a flat shape. Regarding the main inner portion (50), the second cathode electrode (134) is connected to the first cathode electrode in the main inner portion (50).

[0239] (Outer margin)

[0240] The outer edge portion (51) is the outer part of the inner edge portion (50) of the stacked structure (52). A predetermined portion of the stacked structure (52) including the raised portion (53) becomes the outer edge portion (51). Since the outer edge portion (51) can avoid contact with the second cathode electrode (134), the organic layer (131) formed on the raised portion (53) can avoid contributing to light emission in the subpixel (101).

[0241] (Lower protection layer)

[0242] In the display device (10E) according to the fifth embodiment, a lower protective layer (17) is formed to cover the first cathode electrode (132). In the lower protective layer (17) shown in the example of FIG. 27 B, it is formed integrally with respect to both the portion on the first surface of the first cathode electrode (132) and the portion off from the first surface of the first cathode electrode (132), and the element protective layer (15) and the side wall protective layer (16) described in the first embodiment are integrally formed. However, this does not prohibit the lower protective layer (17) from being formed separately into the element protective layer (15) and the side wall protective layer (16) as shown in the first embodiment. The lower protective layer (17) may be formed of the same material as the element protective layer (15) in the display device (10A) according to the first embodiment.

[0243] (Second cathode electrode)

[0244] In the display device (10E) according to the fifth embodiment shown in example A of FIG. 27, a second cathode electrode (134) that serves as a common electrode for the subpixel (101) is formed on the lower protective layer (17). A hole portion (contact hole (55)) for contacting the first cathode electrode (132) in the inner periphery (50) is formed at a predetermined position in the lower protective layer (17), and the second cathode electrode (134) has an extended installation portion (56) that extends from the upper surface (first surface) of the lower protective layer (17) to the first surface of the first cathode electrode (132) along the inner circumference of the contact hole (55). The extended installation portion (56) of the second cathode electrode (134) becomes a connection portion (57). The connection between the second cathode electrode (134) and the first cathode electrode (132) is realized by connecting the extended installation end of the extended installation part (56) to the first cathode electrode (132).

[0245] [5-2 Method for manufacturing a display device]

[0246] A method for manufacturing a display device (10E) according to the fifth embodiment will be described. Here, a method for manufacturing a display device (10E) shown in FIG. 27A and FIG. 27B will be described.

[0247] An anode electrode (130) or an insulating layer (14) is formed on a driving substrate (11), and an organic layer (131B), a first cathode electrode (132), and a lower protective layer (17) are formed (Fig. 28A, Fig. 28B). Subsequently, the lower protective layer (17), the first cathode electrode (132), and the organic layer (131) are patterned to match the pattern of the subpixel (101B). At this time, in the subpixel (101B), a peripheral inner part (50) and an outer part (51) separated from each other are also formed. This can be realized by using lithography and etching. That is, by performing patterning and dry etching at a predetermined location within the anode electrode (130), a groove (58) is formed in the first cathode electrode (132) and the organic layer (131) to separate the inner periphery (50) and the outer periphery (51) (Fig. 29 A, Fig. 29 B). By doing so, the stacked structure (52) of the first cathode electrode (132) and the organic layer (131) is separated into the inner periphery (50) and the outer periphery (51). The distance between the inner periphery (50) and the outer periphery (51) can be appropriately determined according to the width of the groove (58). This is also performed for subpixels (101G, 101R) so that the inner periphery (50) and the outer periphery (51) are formed for each subpixel (101). Hereinafter, the process of separating the laminated structure (52) into the main body interior (50) and the outer body (51) is referred to as the main body interior forming process.

[0248] After the main body internal formation process, a lower protective layer (17) is additionally formed on the first surface side (Fig. 30 A, Fig. 30 B), and a contact hole (55) is formed at a predetermined position for each subpixel (101) with respect to the lower protective layer (17). The contact hole (55) can be formed using lithography and dry etching.

[0249] A second cathode electrode (134) is formed on one surface (the entire surface) of the first surface of the lower protective layer (17). For example, sputtering is suitable for forming the second cathode electrode (134). The contact hole (55) has a shape and diameter capable of forming a film of the material (e.g., IZO, etc.) that forms the second cathode electrode (134), and the second cathode electrode (134) is extended along the inner circumference of the contact hole (55) from the first surface side of the lower protective layer (17) to the first surface of the first cathode electrode (132). At this time, an extended installation part (56) is formed as a connection part (57). In addition, the first cathode electrode (132) and the second cathode electrode (134) are connected at the connection part (57) (A of FIG. 27, B of FIG. 27).

[0250] And, similar to the first embodiment, an upper protective layer (19) is formed on the second cathode electrode (134), and a display device (10E) is obtained by placing an opposing substrate (21) through a filling resin layer (20) (not shown).

[0251] [5-3 Effects of Action]

[0252] In a display device using an organic EL element, the end of an anode electrode may be covered by an insulating layer, and the anode electrode may be exposed through an opening formed in the insulating layer. In this case, the stacked structure of the first cathode electrode and the organic layer is raised at the edge of the opening end of the opening. If such a raised structure occurs in a subpixel, there may be cases where light emission different from that of the center of the subpixel is generated at the periphery of the subpixel (edge ​​light emission), or where light emission of an adjacent subpixel is generated (adjacent pixel light emission). Therefore, it is required to improve the reliability of the light emission state of the display device.

[0253] In the display device (10E) according to the fifth embodiment, the stacked structure (52) of the organic layer (131) and the first cathode electrode (132) is separated into a main inner portion (50) and an outer portion (51), and the second cathode electrode (134) is connected to the first cathode electrode (132) in the main inner portion (50). In the main inner portion (50), the raised portion (53) of the stacked structure (52) of the first cathode electrode (132) and the organic layer (131) is difficult to contain, and edge light emission or adjacent pixel light emission can be suppressed. Therefore, according to the display device (10E) according to the fifth embodiment, the reliability of the light emission state can be improved. In addition, since edge light emission or adjacent pixel light emission can be suppressed, it is also easy to increase the brightness and precision of the display device (10E).

[0254] [5-4 Variation Example]

[0255] (Variation Example 1)

[0256] Next, a modified example of the display device (10E) regarding the fifth embodiment will be described.

[0257] (Composition of Variant Example 1)

[0258] In the display device (10E) according to the fifth embodiment, as shown in FIG. 31A, the covering structure of the periphery (130A) of the anode electrode (130) by the insulating layer (14) may be omitted. In the examples of FIG. 31A and FIG. 31B, the insulating layer (14) is omitted and the arrangement of the outer periphery (51) is omitted. FIG. 31A and FIG. 31B are a cross-sectional view and a plan view showing an embodiment of the display device according to Variation Example 1 of the fifth embodiment.

[0259] In the example shown in A of FIG. 31, the anode electrode (130) is formed in a flat surface shape, and a stacked structure (52) of an organic layer (131) and a first cathode electrode (132) is formed on the anode electrode (130).

[0260] In addition, in the display device (10E) according to the first variation of the fifth embodiment, a side wall portion (60) is formed that rises in a direction (+Z direction) away from the driving substrate (11) on the first side. The side wall portion (60) may be a single layer or may be stacked in multiple layers. In the examples of FIG. 31 A and FIG. 31 B, in the subpixel (101R), the side wall portion (60) is formed as a single layer, and in the subpixels (101G, 101B), the side wall portion (60) is formed as multiple layers with the thickness direction of the light-emitting element (13) as the line of sight and the direction from the center of the light-emitting element (13) toward the outside as the stacking direction.

[0261] (Method for manufacturing the display device of Variant Example 1)

[0262] Next, a method for manufacturing a display device (10E) according to Variant Example 1 of the fifth embodiment will be described.

[0263] First, an anode electrode (130) is formed on a driving substrate (11), an organic layer (131B) and a first cathode electrode (132) are formed, and a layer (62) of a material that forms a lower protective layer (17) is also formed (Fig. 32A, Fig. 32B). Subsequently, the layer (62), the first cathode electrode (132), and the organic layer (131) are patterned to match the pattern of the subpixel (101B). This can be achieved by using lithography and etching. Additionally, a layer (61) of a material that forms a lower protective layer (17) is formed on the first surface side. At this time, the layer (61) is also formed on the sidewall (52A) of the stacked structure (52) of the organic layer (131) and the first cathode electrode (132), and on the sidewall (62A) of the layer (62). By means of a dry etching method or the like, parts other than the side wall (52A) of the stacked structure (52) and the layer (61) covering the side wall (62A) are removed. At this time, in the subpixel (101B), a side wall portion (60) covering the side wall (52A) of the stacked structure (52) is formed (Fig. 33A, Fig. 33B).

[0264] In the same manner as with the subpixel (101B), a side wall portion (60) is formed for the subpixel (101G). At this time, the side wall portion (60) is stacked for the subpixel (101B). Also, a side wall portion (60) is formed for the subpixel (101R). At this time, the side wall portion (60) is stacked for the subpixels (101G, 101B) (A of FIG. 34, B of FIG. 34).

[0265] In addition, a layer (63) of a material forming a lower protective layer (17) is formed on the entire surface of the first side (Fig. 35 A, Fig. 35 B). At this time, CMP (Chemical Mechanical Polishing) treatment may be performed as needed. At this time, the lower protective layer (17) is formed with the side wall portion (60), layer (62), and layer (63).

[0266] As described in the above-described manufacturing method of the display device (10E) according to the fifth embodiment, a contact hole (55) is formed at a predetermined position for each subpixel (101) in the lower protective layer (17), and a second cathode electrode (134) is formed, thereby connecting the first cathode electrode (132) and the second cathode electrode (134) at the extended installation part (56) forming the connection part (57). And as described in the above-described manufacturing method of the display device (10E) according to the fifth embodiment, an upper protective layer (19), a filling resin layer (20), and a counter substrate (21) are provided to obtain the display device (10E) according to the first modified example of the fifth embodiment.

[0267] (Effect of the display device of Variant Example 1)

[0268] In the display device (10E) according to the variation of the fifth embodiment, the same effect as shown in the effect of operation of the display device (10E) according to the fifth embodiment can be obtained.

[0269] (Variation Example 2)

[0270] In the display device (10E) according to the fifth embodiment, the anode electrode (130) was formed in a planar shape, but the shape of the anode electrode (130) is not limited to this and may be formed in a curved shape as shown in FIG. 36A (Variation Example 2). FIG. 36A is a cross-sectional view showing the main part of one embodiment of the display device (10E) according to Variation Example 2 of the fifth embodiment. In FIG. 36A, for convenience of explanation, descriptions of the lower protective layer (17), the second cathode electrode (134), the upper protective layer (19), the filling resin layer (20), the opposing substrate (21), etc. are omitted. This is also the case for FIG. 36B and FIG. 36C.

[0271] In the anode electrode (130), a curved portion (65) is formed in a concave shape in a predetermined area on its inner side. On the first surface of the anode electrode (130), a laminated structure (52) of an organic layer (131) and a first cathode electrode (132) is formed within the area where the curved portion (65) is formed, and in the example of FIG. 36A, an insulating layer (14) covers the periphery (130A) of the anode electrode (130). A step is formed at the location of the periphery (130A) by the edge (140) of the opening (14A). The laminated structure (52) is formed at a location avoiding the part where this step is formed. The second cathode electrode (134) is connected to the first cathode electrode (132) in the laminated structure (52).

[0272] (Method for manufacturing the display device of Variant Example 2)

[0273] The display device (10E) according to Variation Example 2 of the 5th embodiment can be manufactured, for example, as follows.

[0274] A concave shape portion (111) is formed at a predetermined location on the driving substrate (11), an anode electrode (130) or an insulating layer (14) is formed, and an organic layer (131), a first cathode electrode (132), and a lower protective layer (17) are formed (Fig. 37A, Fig. 37B). The portion formed on the concave shape portion (111) of the anode electrode (130) becomes a curved portion (65). The curved portion (65) is formed at a location that avoids the periphery portion (130A) of the anode electrode (130) (a predetermined location further inside than the periphery portion (130A) of the anode electrode (130).

[0275] Next, the lower protective layer (17), the first cathode electrode (132), and the organic layer (131) are patterned to match the pattern of the subpixel (101) (Fig. 38 A, Fig. 38 B). At this time, in the subpixel (101), the stacked structure (52) of the first cathode electrode (132) and the organic layer (131) is left on the portion formed on the inner side of the curved portion (65). This can be realized by using lithography and etching.

[0276] Next, a lower protective layer (17) is additionally formed on the entire surface of the first side (A of FIG. 39, B of FIG. 39).

[0277] In addition, as described in the above-described manufacturing method of the display device (10E) according to the fifth embodiment, a contact hole (55) is formed at a predetermined position for each subpixel (101) in the lower protective layer (17), and a second cathode electrode (134) is formed, thereby connecting the first cathode electrode (132) and the second cathode electrode (134) at the extended installation part (56) forming the connection part (57) (Fig. 40 A, Fig. 40 B). And, as described in the above-described manufacturing method of the display device (10E) according to the fifth embodiment, an upper protective layer (19), a filling resin layer (20), and a counter substrate (21) are provided to obtain the display device (10E) according to the second variation of the fifth embodiment.

[0278] (Effect of the display device of Variant Example 2)

[0279] In the case where the display device has a curved anode electrode, the curved slope is formed from the starting position of the curve toward the bottom of the curve, so the thickness of the organic layer tends to become thinner than near the bottom of the curve, and thus uniformity of the light emission state is required between the bottom of the curve and the starting position of the curve. In addition, it is required to suppress the influence on the light emission state caused by the step difference at the edge of the opening formed at the periphery of the anode electrode.

[0280] According to the display device (10E) of the modified example 2 of the fifth embodiment, since a stacked structure (52) of an organic layer (131) and a first cathode electrode (132) is formed within the region of the curved portion (65), the need to ensure uniformity of the light-emitting state between the bottom of the curved portion (65) and the end edge of the curved portion (65) can be eliminated. Additionally, the stacked structure (52) can be formed at a position that avoids the step difference at the opening end edge (140). Therefore, in the display device (10E) of the modified example 2 of the fifth embodiment, the reliability of the light-emitting state of the display device (10E) can be improved.

[0281] (Variation Example 3)

[0282] In Variation 2 of the above fifth embodiment, the stacked structure (52) of the first cathode electrode (132) and the organic layer (131) is removed with respect to the portion outside the curved portion (65), but as shown in Fig. 36 B, the organic layer (131) and the first cathode electrode (132) formed outside the region of the curved portion (65) may remain without being removed (Variation 3). In the display device (10E) according to Variation 3 of the fifth embodiment, the portion (66) of the stacked structure (52) of the organic layer (131) and the first cathode electrode (132) formed outside the region of the curved portion (65), and the portion (67) of the stacked structure (52) of the organic layer (131) and the first cathode electrode (132) formed inside the region of the curved portion (65) are separated by a dividing portion (68). The second cathode electrode (134) is connected to the first cathode electrode (132) of the part (67).

[0283] In the display device (10E) according to the third variation of the fifth embodiment, since the part (66) of the laminated structure (52) can be made not to contribute to light emission, the same effect as that of the display device (10E) according to the second variation of the fifth embodiment can be obtained.

[0284] (Variation Example 4)

[0285] In the above-mentioned fifth embodiment or variations 2 to 3 thereof, the shape of the curved portion (65) was curved in a hemispherical shape, but the shape of the curved portion (65) is not limited to this. As shown in Fig. 36 C, the curved portion (65) may have a curved surface having a plurality of irregularities.

[0286] [6 6th Embodiment]

[0287] [6-1 Configuration of the Display Device]

[0288] The display device for the sixth embodiment is, as shown in Fig. 41 D, a display device (10E) for the fifth embodiment in which the location and area of ​​the interior of the main body (50) are set to a specific location and area.

[0289] In the display device (10E) according to the fifth embodiment above, as described in the manufacturing method, a groove (58) for separating the inner periphery (50) and the outer periphery (51) is formed using a lithography method or etching method. Therefore, it is required to suppress misalignment of the groove (58) formation position when performing the lithography method. Furthermore, when the position for performing etching is determined by considering the misalignment of the groove (58) formation position in advance, it is required that the stacked structure (52) of the organic layer (131) and the first cathode electrode (132) be designed so that the groove (58) is not formed at a position further inward than necessary on the first surface of the anode electrode (130). In a state where the area of ​​the inner periphery (50) becomes smaller than necessary at a position misaligned with the opening end edge (140) of the opening (14A), for example, a state as shown in A of FIG. 42 occurs. As shown in Fig. 42B, the display device for the sixth embodiment is such that the position of the main body interior (50) is unlikely to deviate from the center position of the opening (14A), and the area of ​​the main body interior (50) is unlikely to become smaller than necessary.

[0290] [6-2 Method for manufacturing a display device]

[0291] A method for manufacturing a display device according to the sixth embodiment is described. As shown below, a process for forming the main body is carried out. Similar to the fifth embodiment, an anode electrode (130) and an insulating layer (14) are formed on a driving substrate (11), and an organic layer (131), a first cathode electrode (132), and a lower protective layer (17) are formed. At this time, as described in the fifth embodiment, a raised portion (53) is formed by the stacking structure (52) of the first cathode electrode (132) and the organic layer (131) so as to cover the step T formed by the opening end edge (140) at the location of the main body (130A) of the anode electrode (130). At this time, a raised portion (54) is also formed on the upper surface of the lower protective layer (17) formed on the stacking structure (52) at a position corresponding to the raised portion (53). Then, a resist (70) is applied to the entire surface of the first side of the lower protective layer (17) (A of FIG. 41).

[0292] The thickness of the lower protective layer (17) laminated on the first cathode electrode (132) is such that a ridge (54) can be formed in the lower protective layer (17) at the position of the opening end edge (140) of the opening (14A). Additionally, although it varies depending on the material of the lower protective layer (17) and the resist (70), considering the processing selectivity ratio during etching of the lower protective layer (17) described later, it is preferable that the thickness of the lower protective layer (17) be approximately three times the height of the step (step formed by the insulating layer (14) riding on the anode electrode (130)) at the position of the opening end edge (140) of the opening (14A). For example, if the height of the step at the position of the opening end edge (140) of the opening (14A) is 100 nm, it is preferable that the thickness of the lower protective layer (17) be about 300 nm.

[0293] Next, dry etching is performed to gradually remove the resist (70). Dry etching is performed until the raised edge of the raised portion (54) in the lower protective layer (17) begins to be exposed (Fig. 41 B). As a specific method for determining whether the raised portion (54) is exposed, for example, it can be achieved by monitoring the end point. In addition, it can also be achieved by, for example, managing the time of dry etching.

[0294] The remaining portion of the resist (70) that was not etched is used as a mask, and the lower protective layer (17), the first cathode electrode (132), and the organic layer (131) are removed by dry etching (C of FIG. 41).

[0295] Then, the resist (70) left on the lower protective layer (17) and used as a mask is removed by ashing or the like (D in FIG. 41). As a result, the laminated structure (52) of the organic layer (131) and the first cathode electrode (132) is separated into a main inner part (50) and an outer part (51). After the main inner part formation process, a method similar to the manufacturing method of the display device (10E) according to the fifth embodiment is carried out. By doing so, a display device according to the sixth embodiment is obtained.

[0296] [6-3 Effects of Action]

[0297] In the display device according to the sixth embodiment, the inner part of the main body (50) is kept within a range further inward than the edge of the opening end (140), and is prevented from becoming smaller than necessary. Therefore, the display device can easily achieve high brightness because the light-emitting area of ​​the pixel is not made too small than necessary, and thus the area of ​​the light-emitting area can be secured.

[0298] In addition, according to the manufacturing method of the display device for the sixth embodiment described above, since the position for etching the lower protective layer (17) to determine the outer edge position of the main body (50) is determined by the etching of the resist (70) at the raised end of the raised portion (54) or slightly inside the raised end, the main body (50) is formed in a self-aligned manner approximately in the center of the anode electrode (130) as shown in Fig. 42 B.

[0299] In addition, according to the manufacturing method of the display device according to the sixth embodiment described above, the total thickness of the organic layer (131), the first cathode electrode (132), and the lower protective layer (17) can be made uniform at the outer periphery position of the main body (50).

[0300] [6-4 Variation Example]

[0301] In the display device according to the sixth embodiment, as shown in Fig. 43 D, a step portion (71) may be formed on the first surface of the driving substrate (11) at the position of the side wall (130B) of the anode electrode (130) (modified example). The step portion (71) can be formed by etching not only the anode electrode (130) but also the driving substrate (11) side when patterning the anode electrode (130) for each subpixel (101).

[0302] According to the display device of the sixth embodiment, as shown in FIG. 43A, FIG. 43B, and FIG. 43C, when the method of manufacturing the display device of the sixth embodiment is executed, when an insulating layer (14) is formed between adjacent anode electrodes (130), the difference H (upward and downward difference) between the position of the first surface of the formed insulating layer (14) and the position of the first surface of the insulating layer (14) that is mounted on the periphery (130A) of the anode electrode (130) can be made larger. In addition, in this case, as shown in FIG. 43D, in the periphery internal formation process, the portion covering the edge of the opening end (140) can be made more prominent while the stacked structure (52) of the organic layer (131) and the first cathode electrode (132) is formed. Therefore, the raised portion (54) can be made more prominent even when the lower protective layer (17) is further formed.

[0303] Also, since the raised portion (54) is prominent, it becomes easy to recognize the raised portion (54) in the lower protective layer (17) during dry etching of the resist.

[0304] [8 7th Embodiment]

[0305] The display device (10A) for the first embodiment and each variation thereof may be a combination of the second to sixth embodiments (seventh embodiment). The seventh embodiment is a combination of the first embodiment and the second to sixth embodiments, but this does not limit the combination of each embodiment in the present specification.

[0306] (Combination of the first embodiment and the second embodiment)

[0307] When a display device (10A) according to the first embodiment is combined with a display device (10B) according to the second embodiment, in the display device (10A) according to the first embodiment, a connection part (18) is provided to surround the light-emitting region P of a light-emitting element (13), and a side wall protection layer (16) is provided between adjacent light-emitting elements (13), and the inner part of the connection part (18) is configured to have a refractive index different from the refractive index of the side wall protection layer (16). In addition, variations 1 to 3 of the display device (10B) according to the second embodiment may be combined with the display device (10A) according to the first embodiment. That is, for example, the connection part (18) may be configured as a via (31), similar to the connection part (30).

[0308] (Combination of the first and third embodiments)

[0309] For the display device (10A) according to the first embodiment, the display device (10C) according to the third embodiment and its variation 1 may be combined. That is, in the display device (10A) according to the first embodiment, the side wall protection layer (16) may have a first refractive index portion (33) formed from the side closer to the light-emitting element (13) at the position of the side region M of the light-emitting element (13), and a second refractive index portion (34) with a lower refractive index than the first refractive index portion (33) formed on the outer side. For the display device (10A) according to the first embodiment combined with the display device (10C) according to the third embodiment, the first refractive index portion (33) and the second refractive index portion (34) are formed on the side of the light-emitting element (13) just like in the third embodiment, thereby improving the efficiency of light utilization.

[0310] (Combination of the first and fourth embodiments)

[0311] Additionally, a display device (10D) according to a fourth embodiment may be combined with a display device (10A) according to a first embodiment. In this case as well, if a metal layer (46) is formed between adjacent connection parts (18), the metal layer (46) may be embedded in the side wall protection layer (16).

[0312] For the display device (10A) of the first embodiment combined with the display device (10D) of the fourth embodiment, just like the fourth embodiment, a defect in the conductivity state caused by a disconnection defect in the connection part can be suppressed.

[0313] (Combination of the first embodiment and the fifth embodiment)

[0314] A display device (10E) according to a fifth embodiment may be combined with a display device (10A) according to a first embodiment. As an example of this case, a device protection layer (15) may be formed on a first surface of the main inner portion (50) formed on the inner side of the anode electrode, and a connection portion (18) may be formed along the side wall (15A) of the device protection layer (15).

[0315] For the display device (10A) related to the first embodiment combined with the fifth embodiment, the same effect as the fifth embodiment can be obtained.

[0316] (Combination of the first and sixth embodiments)

[0317] When implementing the method for manufacturing a display device (10A) according to the first embodiment combined with the fifth embodiment, the method for manufacturing a display device according to the sixth embodiment may also be implemented.

[0318] [7 Application Examples]

[0319] (Electronic devices)

[0320] The display device (10) according to the above-described embodiment may be provided in various electronic devices. In particular, it is preferable to provide it in devices that require high resolution, such as electronic viewfinders of video cameras or SLR cameras, or head-mounted displays, and are used by magnifying them near the eyes. In addition, in the description of the application example, each display device (display device (10A), etc.) according to each of the above embodiments 1 to 7 is collectively referred to as the display device (10).

[0321] (Specific Example 1)

[0322] FIG. 44A is a front view showing an example of the exterior of a digital still camera (310). FIG. 44B is a rear view showing an example of the exterior of a digital still camera (310). This digital still camera (310) is of the interchangeable lens single-lens reflex type and has an interchangeable shooting lens unit (interchangeable lens) (312) located approximately in the center of the front of the camera body (camera body) (311), and has a grip portion (313) for the photographer to hold on the left side of the front.

[0323] A monitor (314) is provided at a position offset to the left from the center of the rear of the camera body (311). An electronic viewfinder (eyepiece) (315) is provided at the top of the monitor (314). By looking through the electronic viewfinder (315), the photographer can visualize the light image of the subject induced from the shooting lens unit (312) and make a composition decision. Any of the display devices (10) according to the above-described embodiment and variant may be used as the electronic viewfinder (315).

[0324] (Specific Example 2)

[0325] FIG. 45 is a perspective view showing an example of the appearance of a head-mounted display (320). The head-mounted display (320) has ear loops (322) for mounting on the user's head, for example, on both sides of a display portion (321) in the form of glasses. As the display portion (321), any of the display devices (10) according to the above-described embodiment and variations may be used.

[0326] (Specific Example 3)

[0327] FIG. 46 is a perspective view showing an example of the appearance of a television device (330). The television device (330) has an image display screen (331) including, for example, a front panel (332) and a filter glass (333), and the image display screen (331) is configured by any of the display devices (10) according to the above-described embodiment and variations.

[0328] Although the display device, manufacturing method, and application examples regarding the first to seventh embodiments and each variation of the present disclosure have been described in detail above, the present disclosure is not limited to the display device and application examples regarding the first to seventh embodiments and each variation described above, and various modifications based on the technical concept of the present disclosure are possible.

[0329] For example, the configurations, methods, processes, shapes, materials, and numerical values ​​exemplified in the display devices, manufacturing methods, and application examples relating to the first to seventh embodiments and each variation described above are merely examples, and different configurations, methods, processes, shapes, materials, and numerical values ​​may be used as needed.

[0330] The configuration, method, process, shape, material, and numerical values ​​of the display device, manufacturing method, and application example relating to the first to seventh embodiments and each variant described above can be combined with one another without departing from the common knowledge of the present disclosure.

[0331] The materials exemplified in the display device, manufacturing method, and application examples relating to the first to seventh embodiments and each variant described above may be used as a single type or in combination of two or more types, unless specifically stated otherwise.

[0332] In addition, the present disclosure may employ the following configuration.

[0333] (1) Multiple subpixels and,

[0334] A plurality of light-emitting elements having an anode electrode, an organic layer, and a first cathode electrode, wherein the anode electrode, the organic layer, and the first cathode electrode are separated into each of the plurality of subpixels, and

[0335] A device protection layer covering the first cathode electrode, and

[0336] A second cathode electrode provided on the above-mentioned device protection layer, and

[0337] A connecting part that electrically connects the second cathode electrode and the first cathode electrode.

[0338] Equipped with,

[0339] The above connection portion is formed along the sidewall of the element protection layer,

[0340] Display device.

[0341] (2) The above connection part comprises an element forming the first cathode electrode,

[0342] The display device described in (1) above.

[0343] (3) The side wall of the above-mentioned element protection layer is non-tapered,

[0344] The display device described in (1) or (2) above.

[0345] (4) The side of the above connection part is connected to the second cathode electrode,

[0346] A display device described in any one of claims (1) to (3) above.

[0347] (5) Each of the light-emitting elements has a light-emitting color corresponding to a color type corresponding to each of the light-emitting colors of the plurality of subpixels.

[0348] In each of the above subpixels, the light emission color of the light-emitting element is a color type according to the light emission color of the subpixel,

[0349] A display device described in any one of claims (1) to (4) above.

[0350] (6) The light emission color of the plurality of light-emitting elements is white,

[0351] A display device described in any one of claims (1) to (4) above.

[0352] (7) A color filter layer further provided,

[0353] A display device described in any one of claims (1) to (6) above.

[0354] (8) Each of the plurality of light-emitting elements and the second cathode electrode forms a resonator structure,

[0355] A display device described in any one of claims (1) to (7) above.

[0356] (9) The second cathode electrode includes a semi-transparent reflective layer,

[0357] The display device described in (8) above.

[0358] (10) The above connection part is provided to surround each of the light-emitting regions of the plurality of light-emitting elements, and

[0359] The inner portion of the above connection part has a refractive index different from that of the element protection layer,

[0360] A display device described in any one of claims (1) to (9) above.

[0361] (11) The inner part of the above connection part is a space,

[0362] The display device described in (10) above.

[0363] (12) The above connection part is formed as a via, and

[0364] A via row formed by arranging multiple vias as described above is formed,

[0365] The display device described in (10) or (11) above.

[0366] (13) For each individual light-emitting element constituting the plurality of light-emitting elements, the pitch of the plurality of vias surrounding the light-emitting region of each individual light-emitting element is smaller than the peak wavelength corresponding to the light emitted from each individual light-emitting element.

[0367] The display device described in (12) above.

[0368] (14) A sidewall protection layer that is continuous with respect to the above element protection layer, and

[0369] The above via rows are arranged in multiple rows, and

[0370] The portion forming the sidewall protection layer and the via are arranged in a repeating pattern at a period smaller than the peak wavelength of the emitted light from the light-emitting element.

[0371] The display device described in (13) above.

[0372] (15) A sidewall protection layer is provided between adjacent light-emitting elements, and

[0373] In the above-mentioned sidewall protection layer, a first refractive index portion is formed from the side closer to the light-emitting element, and a second refractive index portion with a lower refractive index is formed on the outer side of the first refractive index portion.

[0374] A display device described in any one of (1) to (14) above.

[0375] (16) The second refractive index part is a space part,

[0376] The display device described in (15) above.

[0377] (17) A metal layer filled between adjacent connecting parts connected to the first cathode electrode of the adjacent light-emitting element,

[0378] A display device described in any one of (1) to (16) above.

[0379] (18) having an opening and an insulating layer disposed on an adjacent anode electrode and also covering the periphery of the anode electrode, and

[0380] The opening end edge of the above opening is positioned on the anode electrode, and

[0381] The laminated structure of the above organic layer and the above first cathode electrode is separated into an inner periphery and an outer periphery at a predetermined position inward from the edge of the opening end, and

[0382] The above connection part is connected to the first cathode electrode inside the main body,

[0383] A display device described in any one of claims (1) to (17) above.

[0384] (19) The stacked structure of the organic layer and the first cathode electrode is formed in a predetermined area further inward than the end of the anode electrode, and

[0385] A side wall portion is formed on the side wall side of the above-mentioned laminated structure,

[0386] A display device described in any one of claims (1) to (17) above.

[0387] (20) A display device having the display device described in any one of (1) to (19) above,

[0388] Electronic devices.

[0389] In addition, according to a second embodiment of the present disclosure, the following configuration may be adopted.

[0390] (21) A plurality of light-emitting elements having an anode electrode, an organic layer, and a first cathode electrode, wherein the anode electrode, the organic layer, and the first cathode electrode are separated for each subpixel, and

[0391] A protective layer covering the above-mentioned light-emitting element, and

[0392] A second cathode electrode provided on the above protective layer, and

[0393] A connection portion electrically connecting the second cathode electrode and the first cathode electrode is provided to surround the light-emitting region of the light-emitting element.

[0394] Display device.

[0395] (22) The inner part of the above connection part has a refractive index different from that of the protective layer,

[0396] The display device described in (21) above.

[0397] (23) The inner part of the above connection part is a space,

[0398] The display device described in (21) above.

[0399] (24) The above connection part is formed as a via, and

[0400] A via row formed by arranging multiple vias as described above is formed,

[0401] A display device described in any one of claims (21) to (23) above.

[0402] (25) Each of the multiple colors has a plurality of subpixels corresponding to each of the multiple colors, and

[0403] The above connection part is provided for each of the above subpixels, and

[0404] The pitch of adjacent vias forming the above via row differs depending on the color type of the above subpixel,

[0405] The display device described in (24) above.

[0406] (26) For each individual light-emitting element constituting the plurality of light-emitting elements, the pitch of the plurality of vias surrounding the light-emitting region of each individual light-emitting element is smaller than the peak wavelength corresponding to the light emitted from each individual light-emitting element.

[0407] The display device described in (25) above.

[0408] (27) The above vias are arranged in multiple rows,

[0409] A display device described in any one of the above (24) to (26).

[0410] (28) The portion forming the protective layer and the via are arranged in a repeating pattern at a period smaller than the peak wavelength of the light emitted from the light-emitting element.

[0411] The display device described in (27) above.

[0412] (29) having an opening and also having an insulating layer disposed on the adjacent anode electrode, and

[0413] The above opening is formed on the surface of the electrode of the anode, and

[0414] The above connection portion is formed at the position of the edge of the opening end of the above opening,

[0415] A display device described in any one of the above (21) to (28).

[0416] In addition, according to the third embodiment of the present disclosure, the following configuration may be adopted.

[0417] (30) A plurality of light-emitting elements having an anode electrode, an organic layer, and a first cathode electrode, wherein the anode electrode, the organic layer, and the first cathode electrode are separated for each subpixel, and

[0418] A protective layer filling the space between the adjacent light-emitting elements, and

[0419] A second cathode electrode provided on the above protective layer, and

[0420] The second cathode electrode and the first cathode electrode are electrically connected, and

[0421] In the above protective layer, a first refractive index portion is formed from the side closer to the light-emitting element at a position on the side of the light-emitting element, and a second refractive index portion with a lower refractive index is formed on the outer side of the first refractive index portion.

[0422] Display device.

[0423] (31) The second refractive index part is a space part,

[0424] The display device described in (30) above.

[0425] (32) The orientation of the light-emitting surface of the light-emitting element is a direction from the anode electrode toward the first cathode electrode,

[0426] The display device described in (30) or (31) above.

[0427] (33) In the above protective layer, a third refractive index portion is formed around the anode electrode,

[0428] A display device described in any of the above (30) to (32).

[0429] According to the fourth embodiment of the present disclosure, the following configuration may be adopted.

[0430] (34) A plurality of light-emitting elements having an anode electrode, an organic layer, and a first cathode electrode, wherein the anode electrode, the organic layer, and the first cathode electrode are separated for each subpixel, and

[0431] A protective layer covering the above-mentioned light-emitting element, and

[0432] A second cathode electrode provided on the above protective layer, and

[0433] A connection portion is provided for electrically connecting the second cathode electrode and the first cathode electrode, and

[0434] A metal layer filled between adjacent connection portions connected to the first cathode electrode of the adjacent light-emitting element.

[0435] Display device.

[0436] (35) A display device described in (34) wherein the boiling point of the halogen compound of the metal forming the metal layer is 100°C or lower under vacuum conditions.

[0437] According to the fifth and sixth embodiments of the present disclosure, the following configurations may be adopted.

[0438] (36) A plurality of light-emitting elements having an anode electrode, an organic layer, and a first cathode electrode, wherein the anode electrode, the organic layer, and the first cathode electrode are separated for each subpixel, and

[0439] An insulating layer having an opening, disposed on an adjacent anode electrode, and also covering the periphery of the anode electrode, and

[0440] A protective layer covering the above-mentioned light-emitting element, and

[0441] A second cathode electrode provided on the above protective layer, and

[0442] A connection portion is provided for electrically connecting the second cathode electrode and the first cathode electrode, and

[0443] The opening end edge of the above opening is positioned on the anode electrode, and

[0444] The laminated structure of the above organic layer and the above first cathode electrode is separated into an inner periphery and an outer periphery at a predetermined position inward from the edge of the opening end, and

[0445] The above connection part is connected to the first cathode electrode inside the main body,

[0446] Display device.

[0447] (37) A plurality of light-emitting elements having an anode electrode, an organic layer, and a first cathode electrode, wherein the anode electrode, the organic layer, and the first cathode electrode are separated for each subpixel, and

[0448] A protective layer covering the above-mentioned light-emitting element, and

[0449] A second cathode electrode provided on the above protective layer, and

[0450] A connection portion is provided for electrically connecting the second cathode electrode and the first cathode electrode, and

[0451] The stacked structure of the above organic layer and the above first cathode electrode is formed in a predetermined region inward from the end of the above anode electrode, and

[0452] A side wall portion is formed on the side wall side of the above-mentioned laminated structure,

[0453] (38) The total thickness of the anode electrode, organic layer, and protective layer at the position of the outer end of the main body of the above-mentioned main body is constant,

[0454] The display device described in (36) above.

[0455] (39) The anode electrode has a contact surface between the anode electrode and the organic layer that is flat in shape.

[0456] The display device described in (36) to (38) above.

[0457] (40) The anode electrode has a contact surface between the anode electrode and the organic layer that is curved.

[0458] The display device described in (36) or (37) above.

[0459] (41) A process of forming an anode electrode, an organic layer, a first cathode electrode, and a protective layer in sequence, and

[0460] A process of applying a resist onto the above protective layer, and

[0461] A process for etching the above resist, and

[0462] A process of stopping the etching of the resist at the stage where the protective layer is exposed, and

[0463] A process comprising etching the organic layer, the first cathode electrode, and the protective layer using the above resist as a mask,

[0464] Method of manufacturing a display device.

[0465] According to the second to sixth embodiments of the present disclosure, the following configurations may be adopted.

[0466] (42) A display device having the display device described in any one of (21) to (41) above,

[0467] Electronic devices. Explanation of the symbols

[0468] 10A: Display device 10B: Display device 10C: Display device 10D: Display device 10E: Display device 11: Driving board 13: Light-emitting element 14: Insulating layer 14A: Opening 15: Element protection layer 15A: Sidewall 16: Sidewall protection layer 17: Lower protective layer 18: Connection part 19: Upper protective layer 20: Filling resin layer 21: Opposing substrate 31: Via 32: Non-fever 33: First refractive index section 34: Second refractive index section 46: Metal layer 50: Main Character Inside 51: Outer margin 52: Laminated structure 52A: Sidewall 53: Condensation 54: Condensation 60: Side Installment 101: Subpixel 131: Organic layer 132: First cathode electrode 132A: Outer end 132B: Sidewall 134: Second cathode electrode 140: Opening end edge 141: Around Outsourcing

Claims

Claim 1 A display device comprising a plurality of subpixels, an anode electrode, an organic layer, and a first cathode electrode, wherein the anode electrode, the organic layer, and the first cathode electrode are separated into each of the plurality of subpixels, a device protection layer covering the first cathode electrode, a second cathode electrode provided on the device protection layer, and a connection portion electrically connecting the second cathode electrode and the first cathode electrode, wherein the connection portion is formed along the side wall of the device protection layer and a metal layer is filled between adjacent connection portions that are connected to the first cathode electrode of an adjacent light-emitting element. Claim 2 A display device according to claim 1, wherein the connection portion comprises an element forming the first cathode electrode. Claim 3 A display device according to claim 1, wherein the sidewall of the element protection layer has a non-tapered shape. Claim 4 A display device according to claim 1, wherein the side of the connection portion is connected to the second cathode electrode. Claim 5 A display device according to claim 1, wherein each of the emission colors of the plurality of light-emitting elements corresponds to a color type corresponding to each of the emission colors of the plurality of subpixels. Claim 6 A display device according to claim 1, wherein the light emission color of the plurality of light-emitting elements is white. Claim 7 A display device according to claim 1, further comprising a color filter layer. Claim 8 A display device according to claim 1, wherein each of the plurality of light-emitting elements and the second cathode electrode form a resonator structure. Claim 9 In claim 8, the display device wherein the second cathode electrode comprises a semi-transparent reflective layer. Claim 10 A display device according to claim 1, wherein the connection portion is provided to individually surround each of the light-emitting regions of the plurality of light-emitting elements, and the inner portion of the connection portion has a refractive index different from the refractive index of the element protection layer. Claim 11 In item 10, the inner part of the above connection part is a space part, a display device. Claim 12 A display device according to claim 10, wherein the connection portion is formed as a via, and a row of vias formed by arranging multiple vias is formed. Claim 13 A display device according to claim 12, wherein, for each individual light-emitting element constituting the plurality of light-emitting elements, the pitch between adjacent vias of a plurality of vias surrounding the light-emitting region of the individual light-emitting element is smaller than the peak wavelength corresponding to the light emitted from the individual light-emitting element. Claim 14 A display device according to claim 13, comprising a sidewall protection layer continuous with respect to the element protection layer, wherein the via rows are arranged in multiple rows, and the portion forming the sidewall protection layer and the vias are arranged in a repeating pattern at a period smaller than the peak wavelength of the emitted light from the light-emitting element. Claim 15 A display device according to claim 1, wherein a sidewall protection layer is provided between adjacent light-emitting elements, and in the sidewall protection layer, a first refractive index portion is formed from the side closer to the light-emitting element, and a second refractive index portion with a lower refractive index is formed from the side closer to the light-emitting element. Claim 16 In item 15, the display device, wherein the second refractive index part is a space part. Claim 17 delete Claim 18 A display device according to claim 1, comprising an opening, an insulating layer disposed on an adjacent anode electrode and covering a peripheral portion of the anode electrode, wherein the opening end edge of the opening is disposed on the anode electrode, and the laminated structure of the organic layer and the first cathode electrode is separated into a peripheral inner portion and an outer portion at a predetermined position inward from the opening end edge, and the connecting portion is connected to the first cathode electrode in the peripheral inner portion. Claim 19 A display device according to claim 1, wherein the stacked structure of the organic layer and the first cathode electrode is formed in a predetermined area inward from the end of the anode electrode, and a side wall portion is formed on the side wall surface of the stacked structure. Claim 20 An electronic device equipped with the display device described in paragraph 1.

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