Organic light emitting display device

Abstract

An organic light-emitting display device according to the present specification comprises: a substrate including a display area where a plurality of pixels are located and a non-display area surrounding the display area; a dam pattern surrounding the display area and located in the non-display area; a first barrier pattern located in a first barrier area between the dam pattern and the display area; a second barrier pattern located in a second barrier area outside the dam pattern; an organic light-emitting element layer located in the pixels of the substrate, the first barrier area, and the second barrier area, and separated or disconnected by the first barrier pattern and the second barrier pattern; and an encapsulation portion covering the display area, the organic light-emitting element, the first barrier pattern, and the second barrier pattern.

Description

Technology Field

[0001] This specification relates to an organic light-emitting display device, and more specifically, to an organic light-emitting display device capable of improving the reliability of an organic light-emitting element by blocking the penetration paths of moisture and oxygen into the organic light-emitting element. Background Technology

[0002] Display devices are applied to various electronic devices such as TVs, mobile phones, laptops, and tablets. Furthermore, there has recently been an increasing demand for large-screen displays that realize a large screen area by arranging multiple displays in a grid pattern. Accordingly, research is continuing to develop thinner, lighter, and lower-power display devices.

[0003] An organic light-emitting display (OLED) includes a display area where an image is displayed and a non-display area surrounding the display area. A plurality of pixel areas are arranged in the display area of ​​the organic light-emitting display, and a plurality of organic light-emitting elements corresponding to the plurality of pixel areas are included. Since organic light-emitting elements are self-emissive elements that emit light on their own, the organic light-emitting display has the advantages of faster response speed compared to liquid crystal displays, higher luminous efficiency, brightness, and viewing angle, and superior contrast ratio and color reproduction rate.

[0004] These organic light-emitting diodes contain organic materials that can easily degrade due to moisture and oxygen. Accordingly, research is being conducted on methods to prevent the degradation of organic materials by blocking the pathways through which moisture and oxygen enter, thereby preventing the organic materials from being exposed to these substances.

[0005] In particular, as the demand for large-screen displays that implement a large-area screen by arranging multiple display devices increases, blocking the penetration paths of moisture and oxygen into organic light-emitting diodes is becoming an important issue.

[0006] An organic light-emitting display device includes a display area implemented to display images. In the non-display area surrounding the display area, circuits and pads are arranged, and a mechanism, such as a bezel, is placed to block them from the user's field of vision. However, when implementing a large-screen display device, a seam, which is the area of ​​the bezel, appears due to the bezels placed between adjacent display devices. This seam causes a problem in that when displaying a single image on a large-screen display device, the image is displayed in a discontinuous manner, thereby reducing the user's immersion in the image.

[0007] Accordingly, research is being conducted to reduce the width of the bezel in order to remove the core, but when the width of the bezel is reduced to an extreme, moisture or oxygen penetration becomes easier, which leads to the degradation of the organic light-emitting diode and reduces the reliability of the organic light-emitting display device. The problem to be solved

[0008] The problem to be solved according to one embodiment of the present specification is to provide an organic light-emitting display device capable of maintaining the performance of a light-emitting element by blocking the cause of degradation of the light-emitting element even when the bezel width between adjacent display devices is reduced in a large-screen display device implemented through a plurality of display devices.

[0009] In addition, the invention according to one embodiment of the present specification is to provide an organic light-emitting display device capable of preventing the performance of a light-emitting element placed inside the display device from degrading by blocking moisture from penetrating from the lateral direction of the substrate by introducing a plurality of barrier patterns on the bezel area.

[0010] In addition, the invention provides an organic light-emitting display device capable of preventing a decrease in reliability of the display device by ensuring the lifespan of the light-emitting element through blocking the path for moisture penetration by arranging a plurality of barrier patterns on the bezel area to disconnect the light-emitting element, thereby preventing a decrease in reliability of the display device.

[0011] The problems solved according to one embodiment of this specification are not limited to the purposes mentioned above, and other unmentioned purposes and advantages of the present invention may be understood from the following description and will be more clearly understood by the embodiments of this specification. Furthermore, it will be readily apparent that the purposes and advantages of this specification can be realized by the means and combinations thereof set forth in the claims. means of solving the problem

[0012] An organic light-emitting display device according to one embodiment of the present specification comprises: a substrate including a display area where a plurality of pixels are located and a non-display area surrounding the display area; a dam pattern surrounding the display area and located in the non-display area; a first barrier pattern located in a first barrier area between the dam pattern and the display area; a second barrier pattern located in a second barrier area outside the dam pattern; an organic light-emitting element layer located in the pixels of the substrate, the first barrier area, and the second barrier area, and separated or disconnected by the first barrier pattern and the second barrier pattern; and an encapsulation portion covering the display area, the organic light-emitting element, the first barrier pattern, and the second barrier pattern.

[0013] In addition, a large screen display device according to another example of the present invention comprises a plurality of organic light-emitting display devices arranged to be in mutual contact along a first direction and a second direction intersecting the first direction, wherein the organic light-emitting display device comprises: a substrate including a display area where a plurality of pixels are located and a non-display area surrounding the display area; a dam pattern surrounding the display area and located in the non-display area; a first barrier pattern located in a first barrier area between the dam pattern and the display area; a second barrier pattern located in a second barrier area outside the dam pattern; an organic light-emitting element layer located in the pixels of the substrate, the first barrier area, and the second barrier area, and separated or disconnected by the first barrier pattern and the second barrier pattern; and an encapsulation portion covering the display area, the organic light-emitting element, the first barrier pattern, and the second barrier pattern. Effects of the invention

[0014] According to one embodiment of the present specification, by introducing a plurality of barrier patterns on a bezel area to block moisture from penetrating from the lateral direction of the substrate, an advantage is provided in that the performance of a light-emitting element placed inside a display device can be prevented from degrading.

[0015] In addition, according to the embodiments of the present specification, forming a barrier pattern using a material having orthogonal characteristics provides the advantage of securing the lifespan of an organic light-emitting display device.

[0016] In addition, by forming a barrier pattern using a fluorine polymer containing a large amount of fluorine, the use of a fluorine-based organic solvent is possible, thereby providing the advantage of preventing damage to the organic material constituting the light-emitting device during the lift-off process.

[0017] In addition, by limiting the thickness of the barrier pattern to within a critical range, it prevents the surface of the barrier pattern from sinking or defects such as cracks from occurring inside the barrier pattern, thereby providing the advantage of preventing defects caused by arcing.

[0018] The effects of this specification are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art from the description below. Brief explanation of the drawing

[0019] Figure 1 is a schematic diagram illustrating a large screen display device. Figure 2 is a drawing showing an enlarged view of section I' of Figure 1. FIG. 3 is a schematic plan view illustrating an organic light-emitting display device according to one embodiment of the present specification. Figure 4 is a cross-sectional view taken by cutting the section II-II' of Figure 3. Figures 5 and 6 are drawings showing enlarged views of the X1 and X2 sections of Figure 4. FIGS. 7 to 19 are drawings shown to explain a method for manufacturing an organic light-emitting display device according to one embodiment of the present specification. Specific details for implementing the invention

[0020] The advantages and features of this specification and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, this specification is not limited to the embodiments disclosed below but may be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of this specification is complete and to fully inform those skilled in the art of the scope of the invention, and this specification is defined only by the scope of the claims.

[0021] Shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of this specification are exemplary and are not limited to the depicted items. Throughout the specification, the same reference numerals refer to the same components. Furthermore, in describing this specification, if it is determined that a detailed description of related prior art could unnecessarily obscure the essence of this specification, such detailed description is omitted. Where terms such as "includes," "has," or "is made up" are used in this specification, other parts may be added unless "only" is used. Where a component is expressed in the singular, it includes cases where it is included in the plural unless specifically stated otherwise.

[0022] In interpreting the components, they are interpreted to include a margin of error even in the absence of a separate explicit statement.

[0023] In the case of describing a positional relationship, for example, when the positional relationship between two parts is described using expressions such as 'on,' 'upper,' 'lower,' or 'next to,' one or more other parts may be located between the two parts unless 'immediately' or 'directly' is used.

[0024] In the case of an explanation of a temporal relationship, for example, when a temporal sequence is explained using 'after', 'following', 'next', 'before', etc., it may include cases where the sequence is not continuous unless 'immediately' or 'directly' is used.

[0025] Although terms such as "first," "second," etc. are used to describe various components, these components are not limited by these terms. These terms are used merely to distinguish one component from another. Accordingly, the first component mentioned below may be the second component within the technical scope of this specification.

[0026] The features of each of the various embodiments of this specification may be combined or combined with one another, either partially or wholly, and may technically enable various interlocking and operation. Each embodiment may be implemented independently of one another or may be implemented together in an associated relationship.

[0028] Hereinafter, an organic light-emitting display device according to an embodiment of the present invention will be described with reference to the attached drawings.

[0029] FIG. 1 is a schematic diagram illustrating a large screen display device. FIG. 2 is an enlarged view of section I' of FIG. 1.

[0030] Referring to FIGS. 1 and 2, a large screen display device (100) may comprise a plurality of display devices (100-1, 100-2, 100-3, 100-4…100-n, 100-m). Here, n and m may be natural numbers. Each of the plurality of display devices (100-1, 100-2, 100-3, 100-4…100-n, 100-m) may be implemented by tiling so that adjacent display devices come into contact with each other along a first direction (X) and a second direction (Y) that intersects the first direction (X). Although not shown in the drawings, a plurality of display devices (100-1, 100-2, 100-3, 100-4…100-n, 100-m) may be fixed by a frame (not shown) placed on the rear to support the display devices, but are not limited thereto.

[0031] Each of the multiple display devices (100-1, 100-2, 100-3, 100-4…100-n, 100-m) includes a display area which is an area for displaying an image, provided with multiple pixels (P). Each of the multiple pixels (P) is composed of multiple subpixels (SP). A subpixel (SP) is the most basic color element from which actual light is emitted and can be understood as a minimum unit area of ​​light emission. In one example, as shown in FIG. 2, four adjacent subpixels (SP) may comprise a red subpixel (R), a white subpixel (W), a blue subpixel (B), and a green subpixel (G) to form a single pixel area (P), but is not limited thereto. For example, the subpixel (SP) may be composed of three subpixels (SP) including a red subpixel (R), a blue subpixel (B), and a green subpixel (G). Here, a plurality of subpixels (SP) may each include an organic light-emitting diode that is a self-emitting diode.

[0032] Meanwhile, a bezel (BZ1, BZ2) may be placed on each of the multiple display devices (100-1, 100-2, 100-3, 100-4…100-n, 100-m) to block the non-display area surrounding the display area from the user's field of view. However, each bezel (BZ1, BZ2) placed between adjacent display devices (100-1, 100-2, 100-3, 100-4…100-n, 100-m) is visually connected so that a seam (S) appears in the dark area.

[0033] When displaying a single image on a large screen display device (100), such a seam (S) causes the image to be displayed in a discontinuous manner, as shown in FIG. 1, thereby acting as a problem that reduces the user's immersion in the image. In order for the user to perceive the image as appearing continuously without interruption, the size of the seam (S) must be implemented in a size that the user cannot perceive. Accordingly, one of the methods to remove the seam (S) that reduces the user's immersion in the image is to reduce the width of the bezels (BZ1, BZ2). In one example, the width of each bezel (BZ1, BZ2) can be formed to be smaller than the size of the pixel pitch (PP). If the width of each bezel (BZ1, BZ2) is formed to be smaller than the size of the pixel pitch (PP), the size of the seam (S), which is the area between adjacent bezels, can be formed to be at least equal to or smaller than the size of the pixel pitch (PP), so the user perceives the image as appearing continuously without interruption, thereby improving the immersion in the image.

[0034] However, if the width of the bezel (BZ1, BZ2) is reduced, the penetration of moisture or oxygen into the lateral direction of the substrate becomes easier due to the reduced width, which may degrade the performance of the organic light-emitting diode.

[0035] Specifically, organic light-emitting diodes (OLEDs) are composed of organic materials whose performance can be easily degraded by moisture and oxygen. In other words, as the degree to which the penetration of moisture and oxygen into the OLEDs can be blocked can affect the overall performance of the display device, the prevention of defects, and the consequent overall reliability of the display device, the importance of methods to block the pathways through which moisture and oxygen enter is increasing.

[0036] An organic light-emitting diode can be configured to include an organic light-emitting diode layer comprising a first electrode, an organic light-emitting layer, and a second electrode. In particular, when the organic light-emitting layer is formed continuously from a display area to a non-display area, it can serve as a pathway for the introduction of moisture and oxygen. Accordingly, the organic light-emitting layer in the bezel area can be separated or disconnected to block the pathway for the introduction of moisture and oxygen in the lateral direction of the substrate.

[0037] Among the methods for separating or disconnecting such organic light-emitting layers, processes using organic solvents, laser ablation processes, or the introduction of undercut structures to prevent moisture penetration can be employed. However, the aforementioned methods present a problem in that, when the bezel width is reduced to decrease the size of the core, it is difficult to selectively separate or disconnect only the portion of the organic light-emitting layer within the bezel area without affecting the display area. Furthermore, as the bezel width decreases, problems may arise during the separation or disconnection process where structures composed of the organic light-emitting layer detach, detached structures act as foreign matter causing defects, defects occur due to foreign matter generated during the separation or disconnection process, or the organic light-emitting layer is damaged by the organic solvent.

[0038] Accordingly, an organic light-emitting display device according to one embodiment of the present specification is described as an organic light-emitting display device capable of preventing damage to the organic light-emitting layer while blocking moisture from penetrating from the lateral direction of the substrate. The description will be made below with reference to the drawings.

[0039] FIG. 3 is a schematic plan view illustrating an organic light-emitting display device according to one embodiment of the present specification. FIG. 4 is a cross-sectional view taken by cutting along the II-II' section of FIG. 3. FIG. 5 and FIG. 6 are enlarged drawings showing the X1 and X2 sections of FIG. 4. Meanwhile, FIG. 3 is a drawing in which components are selectively shown to explain the dam pattern and barrier pattern constituting the organic light-emitting display device.

[0040] Referring to FIGS. 3 to 6, a substrate (200) of an organic light-emitting display device according to one embodiment of the present specification includes a display area (AA) and a non-display area (NA), and a plurality of pixels (P, see FIG. 2) are arranged in the display area (AA). The non-display area (NA) is formed to surround the display area (AA) and may be configured to include a bezel area (BZ) and a pad portion (PAD). Additionally, a first barrier area (BA1), a dam pattern area (DA), and a second barrier area (BA2) may be provided in the non-display area (NA).

[0041] On the substrate (200) of the display area (AA), a light blocking layer (205), a buffer layer (210), a driving thin-film transistor (DTr), an interlayer insulating film (230), a passivation film (245), a planarization layer (250), a bank (265), and an organic light-emitting diode (OLED) may be provided.

[0042] A light-blocking layer (205) may be disposed on a substrate (200) so as to overlap with a driving thin-film transistor (DTr). A buffer layer (210) may be disposed on the light-blocking layer (205) and formed to cover the light-blocking layer (205). The buffer layer (210) may be formed from an inorganic insulating film, an organic insulating film, or a composite of an inorganic insulating film and an organic insulating film, and may be formed as a single layer or a multilayer structure.

[0043] A driving thin-film transistor (DTr) may be disposed on a buffer layer (210). In one embodiment of the present specification, the driving transistor (DTr) may include an active region (215), a gate insulating layer (220), a gate electrode (225), a source electrode (SE), and a drain electrode (DE) disposed on the buffer layer (210). The source electrode (SE) and the drain electrode (DE) may be disposed in direct contact with the active region (215) and may be disposed spaced apart from each other with the gate electrode (225) in between.

[0044] The interlayer insulating film (230) may be arranged to cover the active region (215), the gate insulating layer (220), the gate electrode (225), the source electrode (SE), and the drain electrode (DE). The interlayer insulating film (230) may include a contact hole that exposes a portion of the surface of the active region (215) so that the source electrode (SE) and the drain electrode (DE) can come into contact with the active region (215). In one example, the source electrode (SE) and the drain electrode (DE) may be formed to extend and cover a portion of the upper surface of the interlayer insulating film (230) while filling the contact hole, but is not limited thereto.

[0045] A plurality of data lines (DL) may be disposed on the upper surface of the interlayer insulating film (230). A passivation film (245) may be disposed on the plurality of data lines (DL). The passivation film (245) serves to protect the lower components and may be composed of an inorganic insulating film or an organic insulating film.

[0046] A flattening layer (250) may be disposed on the passivation film (245). Another contact hole (255) may be provided on the flattening layer (250). The other contact hole (255), formed by penetrating the flattening layer (250) and the passivation film (245), exposes a portion of the surface of the drain electrode (DE). The flattening layer (250) may be formed to have a sufficient thickness to flatten the surface of the display area (AA) on the substrate (200).

[0047] Here, the surface of the interlayer insulating film (230) may be exposed as the flattening layer (250) is not covered in the remaining area excluding the display area (AA), for example, the bezel area (BZ) and the pad portion (PAD), and the non-display area (NA).

[0048] A first electrode (260) is disposed on the planarization layer (250). The first electrode (260) can be electrically connected to the gate electrode (225) through a drain electrode (DE) exposed by another contact hole (255). Here, the first electrode (260) may be composed of a transparent metal oxide such as indium tin oxide (ITO) or indium zinc oxide (IZO). The first electrode (260) may also be referred to as an anode electrode or a pixel electrode.

[0049] The first electrode (260) is arranged spaced apart from each other for each pixel composed of multiple pixels. In the embodiment of this specification, the outermost pixel area (OPA; outermost pixel area) in which the outermost pixel (270, outermost pixel) is arranged in the display area (AA) is described, but it is not limited thereto. For example, as shown in FIGS. 1 and 2, multiple pixels may be arranged on the front of the display area (AA). Hereinafter, the outermost pixel may be referred to as the pixel (270).

[0050] The first electrode (260) may be arranged to extend from the display area (AA) to the pad portion (PAD) of the non-display area (AA) in the outermost region (OPA) where the outermost pixel (270) is arranged in the display area (AA). When the first electrode (260) extends to the pad portion (PAD), it may be used as a metal layer that implements a plurality of pads arranged on the pad portion (PAD).

[0051] A bank (265) may be placed on the flattening layer (250). The bank (265) serves to separate each pixel by defining a boundary area that defines the light-emitting region of the pixel (270). The bank (265) serves as a barrier to prevent light of different colors from adjacent pixels from mixing and being output. The bank (265) may be placed to cover the remaining part while exposing a part of the first electrode (260).

[0052] Bank (265) can arrange the first electrode (260) at a distance from each other pixel and can fill the second contact hole (255) arranged in each pixel. Bank (265a) in the part of Bank (265) that is close to the non-display area (NA) can be arranged to extend to the boundary area between the display area (AA) and the non-display area (NA).

[0053] An organic light-emitting diode layer (283) including an organic light-emitting diode (OLED) that is implemented in a stacked structure of a first electrode (260), an organic light-emitting layer (280), and a second electrode (282) may be disposed in each individual pixel (270) separated by a bank (265). A capping film (284) is disposed on the second electrode (282). The organic light-emitting layer (280) is disposed to be connected to the first electrode (260) formed on the substrate (200). In one example, the organic light-emitting layer (280) and the second electrode (282) may be disposed extending from the outermost region (OPA) where the outermost pixel is disposed to a part of the bezel region (BZ). For example, the organic light-emitting layer (280) and the second electrode (282) may be arranged to extend to a portion of the first barrier region (BA1), the dam pattern region (DA), and the second barrier region (BA2).

[0054] The organic light-emitting layer (280) may be configured to include a hole transport layer (HTL), a light-emitting layer (EML), and an electron transport layer (ETL), as well as a hole blocking layer (HBL), a hole injecting layer (HIL), an electron blocking layer (EBL), and an electron injecting layer (EIL).

[0055] A dam pattern (275) may be placed on the non-display area (NA) of the substrate (200). The dam pattern (275) may be placed on the dam pattern area (DA) located on the bezel area (BZ) in the middle of the non-display area (NA). Specifically, the dam pattern (275) may be placed at a position spaced apart by a predetermined distance from the outer surface of the bank (265a) placed in the outermost area (OPA).

[0056] Referring to FIG. 3, the dam pattern (275) can be formed to have a rectangular frame shape that surrounds the four sides of the substrate (200). Here, the dam pattern (275) is formed to have at least the same height as the bank (265) or to have a height such that the upper surface is positioned higher than the upper surface of the bank (265). In one example, the dam pattern (275) can be formed from the same material as the bank (265), but is not limited thereto.

[0057] A first barrier area (BA1) and a second barrier area (BA2) may be disposed on the non-display area (NA) of the substrate (200). A plurality of barrier patterns (285-1, 285-2) are disposed on the first barrier area (BA1) and the second barrier area (BA2) to block oxygen and moisture from penetrating toward the display area (AA).

[0058] The first barrier region (BA1) is positioned between the bank (265a) and the dam pattern (275) placed on the outermost region (OPA) and may have a first width. Additionally, the second barrier region (BA2) is positioned between the end portion of the substrate (200) and the dam pattern (275) and may have a second width. Here, the end portion of the substrate (200) can be understood as an outer surface portion located at the outermost edge of the display device.

[0059] The first barrier area (BA1) may have a relatively narrower width than the second barrier area (BA2) as it is positioned between the bank (265a) and the dam pattern (275) placed on the outermost area (OPA). In another example, the first barrier area (BA1) and the second barrier area (BA2) may have the same width.

[0060] A plurality of first barrier patterns (285-1) are disposed on the first barrier area (BA1). A plurality of second barrier patterns (285-2) are disposed on the second barrier area (BA2). It is preferable that at least two patterns (285a, 285b, 285c, 285d) are disposed in each of the first barrier patterns (285-1) and the second barrier patterns (285-2) to easily block the penetration paths of moisture and oxygen.

[0061] In the embodiments of this specification, the first barrier pattern (285-1) placed on the first barrier region (BA1) and the second barrier pattern (285-2) placed on the second barrier region (BA2) are described as having the same number, but are not limited thereto. In one example, the number of the first barrier pattern (285-1) placed on the first barrier region (BA1) may be formed to have a greater number than the number of the second barrier pattern (285-2) placed on the second barrier region (BA2). In another example, the number of the second barrier pattern (285-2) placed on the second barrier region (BA2) may be formed to have a greater number than the number of the first barrier pattern (285-1) placed on the first barrier region (BA1).

[0062] As illustrated in FIG. 3, the first barrier pattern (285-1) may be arranged to have a frame shape that surrounds the four sides of the display area (AA) when viewed from a planar view. Additionally, as illustrated in FIG. 3, the second barrier pattern (285-1) may be arranged to have a frame shape that surrounds the four sides of the dam pattern (275) while being placed on the outer edge of the dam pattern (275) when viewed from a planar view.

[0063] Additionally, the cross-sectional shape of each of the first barrier pattern (285-1) and the second barrier pattern (285-2) can be implemented as a shape having a 'U'-shaped valley arranged inside, composed of two side portions and a bottom surface having a predetermined thickness. Here, the two side portions and the bottom surface of the first barrier pattern (285-1) and the second barrier pattern (285-2) are arranged to have a thickness of several nanometers.

[0064] If the thickness of the first barrier pattern (285-1) and the second barrier pattern (285-2) exceeds several nanometers and is formed to be tens of nanometers or hundreds of nanometers, it causes defects in the display device; therefore, the first barrier pattern (285-1) and the second barrier pattern (285-2) are limited so as not to exceed a critical range. This will be explained in detail later. In one example, the first barrier pattern (285-1) and the second barrier pattern (285-2) are limited to a range that is thicker than 1 nm and does not exceed 10 nm.

[0065] The first barrier pattern (285-1) and the second barrier pattern (285-2) may be composed of a fluoropolymer material containing a large amount of fluorine (F) in the functional group, in which carbon-carbon bonds are continuously formed in a chain structure to have orthogonality. Orthogonality can be understood as a characteristic in which two things exist independently without mutual relationship. In other words, the first barrier pattern (285-1) and the second barrier pattern (285-2) possess both hydrophobic (low affinity for water) and oleophobic (low affinity for oil) characteristics. Due to these orthogonal characteristics, the first barrier pattern (285-1) and the second barrier pattern (285-2) can separate from or repel moisture.

[0066] The first barrier pattern (285-1) and the second barrier pattern (285-2) each separate or disconnect the organic light-emitting diode layer (283) disposed in the bezel region (BZ), in which the structure comprising the first electrode (260), the organic light-emitting layer (280), the second electrode (282), and the capping film (284) is stacked. Here, the second electrode (282) has a shape that surrounds the disconnected surface of the organic light-emitting layer (280) that is disconnected by the first barrier pattern (285-1) or the second barrier pattern (285-2) in the first barrier region (BA1) and the second barrier region (BA2).

[0067] Due to the orthogonal characteristics of the first barrier pattern (285-1) and the second barrier pattern (285-2) described above, the structure in which the first electrode (260), the organic light-emitting layer (280), the second electrode (282), and the capping film (284) are stacked is separated or disconnected into a plurality of first barrier patterns (285-1) and second barrier patterns (285-2) disposed in the bezel region (BZ), thereby blocking the path through which moisture penetrates through the organic light-emitting layer (280). Specifically, due to the orthogonal characteristics of the first barrier pattern (285-1) and the second barrier pattern (285-2), moisture can be separated from or repelled, thereby blocking the penetration of moisture.

[0068] The height of the first barrier pattern (285-1) and the second barrier pattern (285-2) is formed to have a height that covers at least all of the sidewalls of the second electrode (282) and the capping film (284). That is, the height of the first barrier pattern (285-1) and the second barrier pattern (285-2) is formed to have a thickness (or height) that covers at least all of the sidewalls of the second electrode (282) surrounding the single-line plane of the organic light-emitting layer (280). In another example, the first barrier pattern (285-1) and the second barrier pattern (285-2) may be formed to have a height higher than the upper surface of the capping film (284).

[0069] Encapsulation portions (286, 288, 292) may be disposed on the capping film (284). The encapsulation portions (286, 288, 292) may comprise a first encapsulation film (286), a cover film (288), and a second encapsulation film (292). The encapsulation portions (286, 288, 292) serve to prevent moisture, oxygen, or particles from penetrating into the organic light-emitting display device from the front direction of the substrate (200).

[0070] The first sealing film (286) and the second sealing film (292) may be formed by including the same inorganic insulating film. In one example, the first and second sealing films (286, 292) may be formed by including at least one material among materials with high insulating properties such as silicon oxide (SiOx), silicon nitride (SiNx), aluminum oxide (AlOx) and aluminum nitride (AlNx).

[0071] The first sealing layer (286) can be placed to fill all of the 'U'-shaped valleys placed inside the first barrier pattern (285-1) and the second barrier pattern (285-2), and extend to the bezel area (BZ) along the shape of the dam pattern (275).

[0072] The cover film (288) serves to prevent particles generated during the process or from the outside from flowing inside. The cover film (420) may be formed using a transparent organic material, such as epoxy resin, polyimide resin, or acrylic resin, but is not limited thereto. The dam pattern (275) is placed on the non-display area (NA) to block the cover film (288) from overflowing or spreading toward the pad portion (PAD).

[0073] The second sealing film (292) is placed on the cover film (288) and may be placed extending beyond the dam pattern (275) to the bezel area (BZ). Accordingly, the second barrier pattern (285-2) placed on the second barrier area (BA2) may be covered by the first sealing film (286) and the second sealing film (292). Additionally, the first barrier pattern (285-1) placed on the first barrier area (BA1) may be covered by the first sealing film (286), the cover film (288), and the second sealing film (292).

[0074] A plurality of wavelength conversion patterns (290) may be disposed on the second sealing layer (292). The wavelength conversion layer (290) converts the wavelength of light incident on each pixel area (270). For example, when white light is incident on the pixel area (270), the wavelength conversion pattern (290) can convert it into light of a color corresponding to each subpixel. Alternatively, it can selectively allow only the light source of the color corresponding to the subpixel to pass through.

[0075] A protective layer (295) is disposed on the wavelength conversion pattern (290) to cover the wavelength conversion pattern (290) and provide a flat surface. The protective layer (295) covers the encapsulation portions (286, 288, 292) in the portions where the wavelength conversion pattern (290) is not disposed. In one example, the protective layer (295) may be made of an organic insulating material. The protective layer (295) may be disposed to extend to the non-display area (NA) and cover the bezel area (BZ).

[0076] A side sealing material (294) may be further included and disposed on the non-display area (NA) of the substrate (200). The side sealing material (294) may cover the entire pad portion (PAD) at one edge portion of the substrate (200). Additionally, the side sealing material (294) may cover the entire exposed side portion of the protective layer (295). The side sealing material (294) may serve to prevent the reflection of external light by the first electrode (260) extending to the pad portion (PAD) by being formed to overlap with the pad portion (PAD).

[0077] An optical film (296) may be placed on the protective layer (295) and the side sealing material (294). The optical film (296) may have a form in which one or more functional layers are laminated, but is not limited thereto. For example, the optical film (296) may include an anti-reflection layer, such as a polarizing film (POL), which can prevent reflection of external light to improve outdoor visibility and contrast ratio for an image displayed on a display device. In another example, the optical film (296) may further include a barrier layer to prevent moisture or oxygen penetration from the front direction of the substrate (200). In this case, the barrier layer may be made of a material with low moisture permeability, such as a polymer material.

[0078] An organic light-emitting display device according to one embodiment of the present specification may be structured such that a first barrier region (BA1) and a second barrier region (BA2) are disposed in a bezel region (BZ), and the organic light-emitting layer is separated or disconnected by a plurality of first barrier patterns (285-1) and second barrier patterns (285-2) disposed on each of the first barrier region (BA1) and second barrier region (BA2). Accordingly, moisture can penetrate through the lateral direction of the substrate (200), thereby blocking the organic light-emitting layer (280) from becoming a path for moisture penetration. In particular, moisture can be separated from or repelled by the orthogonal characteristics of the materials constituting the first barrier pattern (285-1) and the second barrier pattern (285-2), thereby blocking moisture penetration. Accordingly, the performance of the organic light-emitting element (OLED) is prevented from degrading, thereby ensuring reliability regarding the lifespan of the organic light-emitting display device.

[0080] A method for manufacturing an organic light-emitting display device according to one embodiment of the present specification will be described below with reference to the drawings.

[0081] FIGS. 7 to 19 are drawings shown to explain a method for manufacturing an organic light-emitting display device according to one embodiment of the present specification. FIGS. 7 to 19 are cross-sectional views taken by cutting the section II-II' from the plan view of FIG. 3.

[0082] Referring to FIG. 7 and FIG. 8, which shows an enlarged view of portion A of FIG. 7, a light-blocking layer (305) is formed on a substrate (300), and a buffer layer (310) covering the front surface of the substrate (300) is formed on the light-blocking layer (305). A driving transistor (DTr) may be disposed on the buffer layer (310).

[0083] The driving transistor (DTr) may include an active region (315) disposed on a buffer layer (310), a gate insulating layer (320) disposed on a channel region of the active region (315), a gate electrode (325) disposed on the gate insulating layer (320), a source electrode (SE) connected to a source region of the active region (315), and a drain electrode (DE) connected to a drain region of the active region (315).

[0084] The substrate (300) may be made of a flat insulating material. For example, the substrate (300) may be a transparent substrate. The substrate (300) may be made of a hard material such as glass or reinforced glass, or may be made of a flexible material such as plastic, but is not limited thereto.

[0085] The light-blocking layer (305) is positioned between the substrate (300) and the active region (315) and can be positioned in an isolated island shape. The light-blocking layer (305) blocks external light input to the driving transistor (DTr) to prevent off-current from occurring in the driving transistor (DTr) due to a change in threshold voltage caused by external light.

[0086] The buffer layer (310) may be made of an insulating material that facilitates adhesion to the active region (315). The buffer layer (310) not only helps to fix the active region (315), but also blocks the penetration of moisture or oxygen from the substrate (300) toward the upper organic light-emitting diode, and can block substances such as hydrogen within the substrate (300) from being transferred to the upper part of the substrate (300) during the process of manufacturing the driving transistor (DTr).

[0087] In one example, the buffer layer (310) may be formed from an inorganic insulating film, an organic insulating film, or a composite of an inorganic insulating film and an organic insulating film, including silicon oxide (SiOx), silicon nitride (SiNx), or silicon oxynitride (SiON). The buffer layer (310) may be formed as a single layer or as a multilayer structure consisting of an inorganic insulating film and an organic insulating film.

[0088] The active region (315) includes a source region and a drain region containing p-type or n-type impurity ions, and a channel region is disposed between the source region and the drain region. The active region (315) can be formed by including at least one of amorphous silicon, polycrystalline silicon, or oxide semiconductor.

[0089] The gate insulating layer (320) disposed on the active region (315) may be composed of a single layer of insulating material including silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto. For example, the gate insulating layer (320) may be formed as a multilayer structure of silicon oxide (SiOx) or silicon nitride (SiNx). The gate electrode (325) may be formed of any one selected from metals including chromium (Cr), molybdenum (Mo), aluminum (Al), gold (Au), titanium (Ti), nickel (Ni), copper (Cu), etc., or an alloy thereof.

[0090] An interlayer insulating film (330) is disposed on the gate electrode (325). The interlayer insulating film (330) can be formed over the entire surface of the substrate (300) including the gate electrode (325) and the active region (315), and can be formed with a thickness that covers the entire upper surface of the gate electrode (325). The interlayer insulating film (330) serves to electrically insulate the gate electrode (325) from the source electrode (SE) and the drain electrode (DE).

[0091] The interlayer insulating film (330) may be composed of a single layer of insulating material, either an inorganic insulating film or an organic insulating film, or may be composed of a structure in which two or more insulating materials are stacked.

[0092] Examples of inorganic insulating films may include silicon oxide (SiOx) or silicon nitride (SiNx). Examples of organic insulating films may include acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

[0093] A first contact hole (335) is disposed on the interlayer insulating film (330) to expose a portion of the surface of the active region (315), and the first contact hole (335) can be filled with a source electrode (SE) and a drain electrode (DE). The source electrode (SE) and the drain electrode (DE) can be disposed spaced apart from each other with a gate electrode (325) in between. The source electrode (SE) and the drain electrode (DE) are each electrically connected to the source region and the drain region through the exposed surface of the active region (315). In one example, the source electrode (SE) and the drain electrode (DE) can be formed to extend and partially cover the upper surface of the interlayer insulating film (330) while filling the first contact hole (335).

[0094] The source electrode (SE) and drain electrode (DE) can be formed from any one selected from metals including chromium (Cr), molybdenum (Mo), aluminum (Al), gold (Au), titanium (Ti), nickel (Ni), copper (Cu), or an alloy thereof.

[0095] A plurality of data lines (340) may be arranged on the interlayer insulating film (330). The data lines (340) serve to supply data signals to each pixel area. Although not shown in the drawing, the data lines (340) may be connected to either the source electrode or the drain electrode of a switching thin-film transistor (ST).

[0096] A passivation film (345) may be disposed on the upper portion of the interlayer insulating film (330). The passivation film (345) is an insulating film that covers the data line (340) and protects the lower components, and may be composed of a single layer of an insulating material, either an inorganic insulating film or an organic insulating film, or may be composed of a structure in which two or more insulating materials are stacked.

[0097] A planarization layer (350) having a second contact hole (355) may be disposed on the passivation film (345). Similar to the interlayer insulating film (330), the planarization layer (350) may be formed in a structure in which one or more insulating materials, such as an inorganic insulating film and an organic insulating film, are laminated. The planarization layer (350) may be formed to have a sufficient thickness to cover the display area (AA) of the substrate (300) and to be implemented as a flat surface. Here, the interlayer insulating film (330) is exposed because the planarization layer (350) is not covered in the remaining area excluding the display area (AA), for example, the non-display area (NA) including the bezel area (BZ) and the pad portion (PAD).

[0098] The second contact hole (355) is formed to penetrate the flattening layer (350) and the passivation film (345), exposing a portion of the surface of the drain electrode (DE).

[0099] A first electrode (360) is formed on the planarization layer (350). The first electrode (360) can be electrically connected to the gate electrode (325) through a drain electrode (DE) exposed by the second contact hole (355). The first electrode (360) may be composed of a transparent metal oxide such as indium tin oxide (ITO) or indium zinc oxide (IZO). The first electrode (360) may also be referred to as an anode electrode or a pixel electrode. Although not shown in the drawing, the first electrode (360) may be spaced apart from each other for each pixel composed of multiple elements. The first electrode (360) may be positioned extending from the display area (AA) to the pad portion (PAD) of the non-display area (AA) in the outermost region (OPA) where the outermost pixel is to be placed as it approaches the non-display area (NA). When the first electrode (360) extends to the pad portion (PAD), it may be used as a metal layer that implements a plurality of pads placed on the pad portion (PAD).

[0100] Referring to FIG. 9, a bank (365) is formed on the flattening layer (350). The bank (365) may be positioned to cover the remaining portion while exposing a portion of the first electrode (360). The bank (365) serves to separate each pixel by defining a boundary area that defines the light-emitting region of the area (370) where the pixel is to be formed. The bank (365) acts as a barrier to prevent light of different colors from adjacent pixels from mixing and being output.

[0101] Bank (365) can be formed such that the first electrode (360) is spaced apart from each other by pixel and fills the second contact hole (355) placed in each pixel. Bank (365a) in the part of Bank (365) that is close to the non-display area (NA) can be formed to extend to the boundary area between the display area (AA) and the non-display area (NA). For example, Bank (365a) in the part close to the non-display area (NA) may be Bank (396a) placed in the outermost area (OPA).

[0102] The dam pattern (375) may be placed on the non-display area (NA) of the substrate (300). For example, the dam pattern (375) may be placed on the first electrode (360) of the bezel area (BZ) in the middle of the non-display area (NA). The dam pattern (375) may be placed at a position spaced by a first distance (d1) from the outer surface of the bank (365a) placed in the outermost area (OPA).

[0103] As illustrated in FIG. 3, the dam pattern (375) can be formed to have a rectangular frame shape that surrounds the four sides of the substrate (300) and exposes the display area (AA). The dam pattern (375) serves to block the encapsulation layer to be formed later from overflowing or spreading toward the pad portion (PAD). In one example, the dam pattern (375) can be formed with the same material as the bank (365). Here, the dam pattern (375) is formed to have at least the same height as the bank (365), or to have a height such that the upper surface is positioned higher than the upper surface of the bank (365).

[0104] The substrate (300) may further include a first barrier area (BA1) and a second barrier area (BA2) on the non-display area (NA). The first barrier area (BA1) may be positioned between a bank (365a) and a dam pattern (375) positioned on the outermost area (OPA). The second barrier area (BA2) may be positioned between the end portion of the substrate (300) and the dam pattern (375). The dam pattern area (DA) may be positioned between the first barrier area (BA1) and the second barrier area (BA2) and may be formed with a size equal to the width of the dam pattern (375). Here, the end portion of the substrate (300) may be an outer surface portion located at the outermost edge of the display device.

[0105] The first barrier area (BA1) may have a first width in the direction of the display area (AA) based on the dam pattern area (DA) where the dam pattern (375) is placed, and the second barrier area (BA2) may have a second width in the direction of the pad portion (PAD) based on the dam pattern area (DA). As the first barrier area (BA1) is placed between the bank (365a) and the dam pattern (375) placed on the outermost area (OP), it may be formed to have a relatively narrower width than the second barrier area (BA2), but is not limited thereto. In another example, the first barrier area (BA1) and the second barrier area (BA2) may be formed to have the same width.

[0106] The first barrier region (BA1) and the second barrier region (BA2) serve to prevent oxygen and moisture from penetrating toward the display region (AA) where the organic light-emitting diode is placed, which is the region where the barrier pattern will be placed thereafter.

[0107] Referring to FIG. 10, a barrier layer (380) is formed on the front surface of the substrate (300). The barrier layer (380) subsequently prevents moisture penetration from the lateral direction of the substrate (300), thereby preventing the organic light-emitting element from being damaged by lateral moisture penetration and thus preventing the performance of the display device from degrading.

[0108] The barrier layer (380) may be composed of a fluoropolymer material in which carbon-carbon bonds are continuously formed in a chain structure (carbon-carbon backbone) and the functional group contains a large amount of fluorine (F).

[0109] In [Chemical Formula 1] below, according to one example of the present specification, the chemical structural formula of a fluoropolymer material containing a large amount of fluorine (F) in the functional group is shown.

[0110] [Chemical Formula 1]

[0111]

[0112] As shown in [Chemical Formula 1], the fluoropolymer used as the material for the barrier layer (380) of this specification contains a large amount of fluorine (F) in its functional groups. A fluoropolymer containing a large amount of fluorine (F) in its functional groups has orthogonality. Orthogonality can be understood as a characteristic in which two things exist independently without mutual relationship. Accordingly, the barrier layer (380) has both hydrophobic characteristics, which have low affinity for water, and oleophobic characteristics, which have low affinity for oil. Due to this orthogonality, the barrier layer (380) can block the path through which moisture permeates by separating from or repelling moisture. In addition, it is less affected by the developer containing the organic solvent used during the process steps. Accordingly, damage caused by the organic solvent can also be prevented.

[0113] The barrier layer (380) is formed with a thickness sufficient to secure a height that can serve as a moisture-proof pattern, taking into account the height of the protective pattern to be formed by selectively removing it during the subsequent lift-off process.

[0114] After forming a barrier layer (380), a mask pattern (385) is formed on the barrier layer (380). To do this, a mask film is formed on the barrier layer (380). The mask film can be formed by applying a photoresist material. Subsequently, an exposure process and a development process are performed on the mask film to form the mask pattern (385). The mask pattern (385) defines areas (385a, 385b) where a protective pattern is to be formed in the first barrier region (BA1) and the second barrier region (BA2), respectively. In one example, the mask pattern (385) can be formed to block the areas (385a, 385b) where the barrier pattern is to be formed and expose the remaining areas. Here, the size (or width) of the mask pattern (385) formed on the first barrier region (BA1) and the mask pattern (385) formed on the second barrier region (BA2) can be formed to have the same size (or width) or different sizes (or widths).

[0115] Referring to FIG. 11 and FIG. 12, which shows an enlarged view of portion B of FIG. 11, a mask pattern (385) is etched using an etching mask to form a preliminary barrier pattern (390). In one example, the etching process may be performed using a wet etching method. The preliminary barrier pattern (390) may be over-etched into an undercut shape with respect to the mask pattern (385) by an isotropic wet etching process. An undercut can be understood as a phenomenon in which the etching is additionally etched below the shape of the mask pattern (385).

[0116] In other words, the preliminary barrier pattern (390) is not vertically cut and aligned with the ends of the mask pattern (385), but is additionally etched inwardly by a first depth (d2) from both ends of the mask pattern (385). Accordingly, the second width (387b) between adjacent preliminary barrier patterns (390) is formed to have a relatively wider width than the first width (387a) between adjacent mask patterns (385). Here, the preliminary barrier pattern (390) may be formed to have a thickness (or first height, h1) equal to the thickness (or height) of the barrier layer (380).

[0117] Referring to FIG. 13 and FIG. 14, which shows an enlarged view of part B of FIG. 13, an organic light-emitting layer (395) and a second electrode (400) are formed on a first electrode (360) to form an organic light-emitting element layer (402) comprising an organic light-emitting element (OLED) composed of the first electrode (360), the organic light-emitting layer (395), and the second electrode (400). Then, a capping film (405) is formed on the second electrode (400) located on the uppermost layer of the organic light-emitting element layer (402).

[0118] The organic light-emitting layer (395) is formed by connecting to the first electrode (360) formed on the substrate (300). In one example, the organic light-emitting layer (395) may be arranged extending from the outermost region (OPA), where the outermost pixel (OP) among the pixels is placed, to the bezel region (BZ). Accordingly, the organic light-emitting layer (395) may be formed by covering the shape of the exposed surface of the dam pattern (375) placed in the dam pattern region (DA) of the non-display region (NA).

[0119] The organic light-emitting layer (395) may also be formed in the space between adjacent preliminary barrier patterns (390) disposed on the first barrier region (BA1) and preliminary barrier patterns (390) disposed on the second barrier region (BA2). Here, since a mask pattern (385) is disposed on the upper surface of each preliminary barrier pattern (390), the organic light-emitting layer (395) is formed at a position spaced apart by a first distance (a1) from the side wall of the preliminary barrier pattern (390), as shown in FIG. 14.

[0120] Although not shown in the drawing, the organic light-emitting layer (395) may include a stacked structure of a hole transport layer (HTL), a light-emitting layer (EML), and an electron transport layer (ETL). The organic light-emitting layer (395) may also be configured to include a hole blocking layer (HBL), a hole injection layer (HIL), an electron blocking layer (EBL), and an electron injection layer (EIL) together with the hole transport layer (HTL), the light-emitting layer (EML), and the electron transport layer (ETL).

[0121] Specifically, the hole transport layer (HTL) and the electron transport layer (ETL) of the organic light-emitting layer (395) serve to balance electrons and holes. Here, the hole transport layer (HTL) serves to transport holes supplied from the first electrode (360) to the light-emitting layer, and the electron transport layer (ETL) serves to transport electrons supplied from the second electrode (400) to the light-emitting layer without loss.

[0122] Additionally, the hole injection layer (HIL) and electron injection layer (EIL) of the organic light-emitting layer (395) serve to facilitate the injection of electrons and holes. Here, the hole injection layer (HIL) can facilitate hole injection by lowering the injection energy barrier of holes supplied from the first electrode (360). The electron injection layer (EIL) can facilitate electron injection by lowering the potential barrier when electrons supplied from the second electrode (400) are injected. The hole blocking layer (HBL) serves to suppress the movement of holes that have not combined with electrons in the light-emitting layer (EML), and the electron blocking layer (EBL) serves to suppress electrons from moving from the light-emitting layer (EML) to the hole transport layer (HTL). The light-emitting layer (EML) of the organic light-emitting layer (395) is a layer that emits light through the recombination of holes injected from the first electrode (360) and electrons injected from the second electrode (400).

[0123] The second electrode (400) can be formed to be connected to the organic light-emitting layer (395) and to cover the entire exposed surface of the organic light-emitting layer (395). Accordingly, the second electrode (400) can be formed to extend to the bezel area (BA) of the non-display area (NA) and to cover the organic light-emitting layer (395) along the shape of the dam pattern (375) placed in the dam pattern area (DA). The second electrode (400) can be formed as a common electrode that applies voltage by making common contact with adjacent pixels on the display area (AA), including the outermost pixel (OP). The second electrode (400) may also be referred to as a cathode electrode.

[0124] In one example, the second electrode (400) may be composed of a transparent metal oxide such as indium tin oxide (ITO) or indium zinc oxide (IZO). Alternatively, the second electrode (400) may be formed of a semipermeable metal material composed of molybdenum (Mo), tungsten (W), silver (Ag) or aluminum (Al) and an alloy containing at least one of these.

[0125] As the second electrode (400) is formed extending to the bezel area (BA) of the non-display area (NA), it can also be formed between adjacent preliminary barrier patterns (390) placed on the first barrier area (BA1) and preliminary barrier patterns (390) placed on the second barrier area (BA2). In one example, the second electrode (400) is formed on the organic light-emitting layer (395) placed on the first barrier area (BA1) and the second barrier area (BA2). Specifically, because the second electrode (400) has good step coverage characteristics compared to the organic light-emitting layer (395), it can be formed to fill the entire empty space between the side of the organic light-emitting layer (395) and the preliminary barrier pattern (390), which is spaced apart by a first gap (a1) from the side wall of the preliminary barrier pattern (390). Accordingly, the second electrode (400) can be formed to cover both the exposed side and top surfaces of the organic light-emitting layer (395).

[0126] The capping film (405) can be formed to be connected to the second electrode (400) and to cover the entire exposed surface of the second electrode (400). Accordingly, the capping film (405) can be formed to extend to the bezel area (BA) of the non-display area (NA) where the second electrode (400) is placed. The capping film (405) can be formed to cover the second electrode (400) along the shape of the dam pattern (375) placed in the dam pattern area (DA).

[0127] The capping film (405) serves to increase the amount of light directed toward the display area (AA) by reducing the loss of light that may occur during the process in which light emitted from the light-emitting layer (EML) of the organic light-emitting layer (395) is repeatedly reflected between the first electrode (360) and the second electrode (400), and can be formed by including a material having a high refractive index. In one example, the capping film (405) can be formed by including an insulating film made of an organic material having a high refractive index. Once the capping film (405) is formed, the preliminary barrier pattern (390) protrudes by a predetermined height (h2) from the upper surface of the capping film (405), so that a portion of both side walls of the preliminary barrier pattern (390) may be exposed.

[0128] Referring to FIG. 15 and FIG. 16, which shows an enlarged view of part B of FIG. 15, a lift-off process is performed to form a plurality of barrier patterns (390a) on the first barrier region (BA1) and the second barrier region (BA2).

[0129] The lift-off process can be carried out using a fluorine (F)-based organic solvent. The fluorine (F)-based organic solvent may consist of monomeric or polymeric materials containing a large amount of fluorine (F) in functional groups, with carbon-carbon bonds forming a continuous chain structure (carbon-carbon backbone).

[0130] [Chemical Formula 2] below shows the chemical structural formula of a fluorine (F)-based organic solvent according to one example.

[0131] [Chemical Formula 2]

[0132]

[0133] As shown in [Chemical Formula 2], a fluorine (F)-based organic solvent according to one example of the present specification contains a large amount of fluorine (F) in its functional group. A fluorine (F)-based organic solvent containing a large amount of fluorine (F) in its functional group can penetrate into a pre-barrier pattern (390, see FIG. 12) made of a fluorine polymer material that also contains a large amount of fluorine (F) in its functional group and can selectively remove it. Here, since the organic material constituting the organic light-emitting layer (395) has resistance to the fluorine (F)-based organic solvent, it does not deteriorate or change during the lift-off process, so no damage to the organic material occurs.

[0134] A plurality of barrier patterns (390a) formed on the first barrier area (BA1) and the second barrier area (BA2) can be arranged to have a frame shape that surrounds the four sides of the substrate (300) when viewed from a planar perspective, as shown in FIG. 3. Here, some of the barrier patterns (390a) may be arranged inside the dam pattern (375) to surround the four sides of the display area (AA), and some may be arranged outside the dam pattern (375) to have a frame shape that surrounds the four sides of the dam pattern (375).

[0135] Referring again to FIGS. 13 and 14, the preliminary barrier pattern (390) protrudes by a predetermined height (h2) from the upper surface of the capping film (405), so that a portion of both side walls is exposed. Then, a fluorine (F) organic solvent penetrates inward from the exposed portions of both side walls of the preliminary barrier pattern (390), and removal proceeds starting from the exposed portions.

[0136] As the mask pattern (385) is removed inwardly from the exposed sidewall portions of the preliminary barrier pattern (390) during the lift-off process, the mask pattern (385) can also be detached and removed from the preliminary barrier pattern (390).

[0137] The barrier pattern (390a) formed through this lift-off process has a predetermined thickness (T1) from the side wall while covering the exposed surface of the side wall of the second electrode (400) and the capping film (405) and the exposed surface of the first electrode (395), as shown in FIG. 16.

[0138] The cross-sectional shape of the barrier pattern (390a) can be implemented as a shape having a U-shaped valley (410) arranged inside, consisting of two side sections and a bottom surface having a predetermined thickness. Additionally, referring to FIG. 3, which is shown as a plan view, it can be formed to have a rectangular frame shape that surrounds four sides of the display area (AA) on the substrate (300) when viewed from a plan view.

[0139] The lift-off process proceeds until the barrier pattern (390a) is formed with a thickness of several nanometers, protruding from both side portions and the bottom surface. In one example, the barrier pattern (390a) may be formed with a thickness greater than 1 nm and not exceeding 10 nm. At least one barrier pattern (390a) may be placed on the first barrier region (BA1) between the bank (365a) and the dam pattern (375) placed on the outermost region (OP). In one example, two or more barrier patterns (390a) may be placed to further enhance the effect of blocking the moisture permeability path. Additionally, at least one barrier pattern (390a) may be placed on the second barrier region (BA2) between the end portion of the substrate (300) and the dam pattern (375). In one example, two or more barrier patterns (390a) may be placed on the second barrier area (BA2) to further enhance the effect of blocking the moisture passage.

[0140] The barrier pattern (390a) formed by performing a lift-off process is formed to have a height that covers both the sidewalls of the second electrode (400) and the capping film (405), i.e., a second height (h3). The barrier pattern (390a) is formed to have a height that covers at least both the sidewalls of the second electrode (400) and the capping film (405) in order to prevent moisture from penetrating through the organic light-emitting layer (395).

[0141] In one example, the preliminary barrier pattern (390) may be formed to have a second height (h3, see FIG. 16) lower than the first height (h1, see FIG. 12). In another example, the barrier pattern (390a) may be formed to have a height higher than the upper surface of the capping film (405).

[0142] Meanwhile, the cross-sectional shape of the barrier pattern (390a) may be composed of two side portions and a bottom surface, having a shape in which a 'U'-shaped groove (410) is arranged inside. Additionally, the lift-off process proceeds until the thickness of the barrier pattern (390a) protruding from both side portions and the bottom surface is formed to a thickness of several nanometers. In one example, it is preferable to limit the barrier pattern (390a) to a critical range that is thicker than 1 nm but does not exceed 10 nm. If the thickness of the barrier pattern (390a) exceeds the critical range and is formed to tens of nanometers or hundreds of nanometers, it may cause defects in the display device. The following description will be explained with reference to FIG. 17.

[0143] Figure 17 is a drawing shown to explain the problems that occur when a barrier pattern is formed with a thickness exceeding a critical range.

[0144] Referring to FIG. 17, a barrier pattern (390b) is formed with a thickness that completely fills the space between adjacent organic light-emitting diode layers (402). This barrier pattern (390b) is formed with a thickness exceeding a critical range, for example, tens of nm or hundreds of nm. In this way, when sealing layers (415, 425) are formed on top of the barrier pattern (390b) while it is formed with a thickness exceeding a critical range, defects may occur during the process of forming the first sealing layer (415), such as the surface of the barrier pattern (390b) sinking or a crack forming inside the barrier pattern (390b), as indicated by the arrow in the drawing. If the process of forming the subsequent second sealing layer (425) is carried out while such defects exist, an arcing phenomenon may occur in the part adjacent to the pad, causing defects inside the display device.

[0145] Accordingly, in one embodiment according to the present specification, the thickness of the barrier pattern (390a) is limited to a critical range that is thicker than 1 nm and does not exceed 10 nm.

[0146] Referring to FIG. 18, a sealing portion (427) covering the front surface of the substrate (300) is formed. The sealing portion (427) may comprise a first sealing film (415), a cover film (420), and a second sealing film (425). The sealing portion (427) serves to prevent moisture, oxygen, or particles from penetrating into the organic light-emitting display device.

[0147] The first sealing film (415) may be formed by including an inorganic insulating film. In one example, the first sealing film (415) may be formed by including at least one material among materials with high insulating properties such as silicon oxide (SiOx), silicon nitride (SiNx), aluminum oxide (AlOx) and aluminum nitride (AlNx).

[0148] The cover film (420) serves to prevent particles, etc. generated during the process or from the outside from flowing inside. The cover film (420) can be formed with a thickness sufficient to cover the particles in order to prevent particles, etc. from penetrating into the organic light-emitting diode layer (403) and the second electrode (400) from the front direction of the substrate (300). The cover film (420) can be formed using a transparent organic material, for example, epoxy resin, polyimide resin, or acrylic resin, but is not limited thereto.

[0149] The second sealing film (425) can be formed by including an inorganic insulating film identical to the first sealing film (415). In one example, the second sealing film (425) can be formed by including at least one material among materials with high insulating properties such as silicon oxide (SiOx), silicon nitride (SiNx), aluminum oxide (AlOx) and aluminum nitride (AlNx).

[0150] Referring to FIG. 19, a plurality of wavelength conversion patterns (430) disposed on the second sealing film (425) may be further included. The wavelength conversion patterns (430) convert the wavelength of light incident from each pixel area. For example, when white light is incident on each pixel area, the wavelength conversion patterns (430) may convert it into light of a color corresponding to each subpixel (SP, see FIG. 2). Additionally, only the light source of the color corresponding to the subpixel (SP) may be selectively allowed to pass through. In one example, the plurality of wavelength conversion patterns (430) may be divided into a red light filter, a green light filter, and a blue light filter that converts to blue light.

[0151] The protective layer (435) can be positioned to provide a flat surface while covering a plurality of wavelength conversion patterns (430). The protective layer (435) can be implemented to cover the encapsulation portion (427) in the portion where the wavelength conversion pattern (430) is not positioned. Accordingly, the protective layer (435) can be positioned to extend to the non-display area (NA) and cover the bezel area (BZ). In one example, the protective layer (435) may be made of an organic insulating material.

[0152] A side sealing material (440) may be further formed on the non-display area (NA) of the substrate (300) including the pad portion (PAD). The side sealing material (440) may be formed to completely cover the pad portion (PAD) at one edge portion of the substrate (300). Additionally, the side sealing material (440) may cover the entire exposed side of the protective layer (435). By being formed in overlap with the pad portion (PAD), this side sealing material (440) may serve to prevent the reflection of external light by the first electrode (360) extending to the pad portion (PAD).

[0153] Additionally, the side sealing material (440) can serve to prevent light from leaking out to the side of the substrate (300) by light traveling from the wavelength conversion pattern (430) in the direction of the outer surface among the light emitted from each subpixel.

[0154] An optical film (445) may be placed on the protective layer (435) and the side sealing material (440). The optical film (445) may have a form in which one or more functional layers are laminated, but is not limited thereto. For example, the optical film (445) may include an anti-reflection layer, such as a polarizing film (POL), which can prevent the reflection of external light to improve outdoor visibility and contrast ratio for an image displayed on a display device. In another example, the optical film (445) may further include a barrier layer to prevent moisture or oxygen penetration in the front face direction of the substrate (300). In this case, the barrier layer may be made of a material with low moisture permeability, such as a polymer material.

[0155] As described above, according to one embodiment of the present specification, the penetration of moisture from the lateral direction of the substrate (300) by barrier patterns (390a) disposed on the bezel area (BZ) can prevent the degradation of the performance of the organic light-emitting element disposed inside the display device. For example, the organic light-emitting element (OLED) of the organic light-emitting element layer (402) can be disposed as an outermost pixel (OP) not only in the central part of the display area (AA) but also in the outermost part (OPA) of the edge portion. In particular, if moisture penetrates from the lateral direction of the substrate (300), the organic light-emitting element (OLED) disposed in the outermost part (OPA) of the display area (AA) may degrade and its lifespan may be reduced, thereby lowering the reliability of the display device. To prevent this, a plurality of barrier patterns (390a) are placed on the bezel area (BZ) to ensure the reliability of the non-display area (NA), thereby disconnecting or isolating the organic light-emitting diode (OLED) and blocking the path through which moisture can penetrate.

[0156] Accordingly, moisture penetration from the lateral direction of the substrate (300) can be prevented, so that no defects occur in each pixel, and the light source that the user intends to implement can be generated on the display area. That is, by preventing moisture penetration that causes performance degradation of the organic light-emitting diode through a plurality of barrier patterns (390a), the lifespan of the organic light-emitting diode can be further improved.

[0157] In addition, if a method such as an undercut structure is introduced to prevent moisture penetration, defects may occur where the structure itself detaches, which can act as foreign matter and defects. On the other hand, if a barrier pattern is introduced according to the embodiments of this specification, the occurrence of foreign matter and defects can be prevented. As described above, by introducing a barrier pattern, the lifespan of the organic light-emitting diode (OLED) can be secured, and by preventing defects such as foreign matter, the reliability of the display device can be ensured.

[0158] According to an embodiment of the present specification, even when the width of the bezel is reduced to eliminate a seam that reduces user immersion when displaying a single image in a large screen display device implemented through a plurality of display devices, the reliability of the organic light-emitting display device can be ensured by blocking the moisture penetration path by a plurality of barrier patterns disposed on the bezel area (BZ).

[0159] Accordingly, it is possible to prevent defects caused by moisture penetration of the display device while sufficiently reducing the bezel width, so that even when implementing a large-screen display device, the image can be displayed as a continuous sequence even in the boundary areas between multiple display devices, thereby enhancing the viewer's immersion in the image.

[0160] In addition, according to the embodiments of the present specification, by forming a barrier pattern using a fluorine polymer containing a large amount of fluorine in the functional group, a fluorine-based organic solvent can be used, thereby preventing damage to the organic material constituting the light-emitting element during the lift-off process.

[0161] In addition, by limiting the thickness of the barrier pattern to within a critical range, defects such as sinking of the surface of the barrier pattern or cracks occurring inside the barrier pattern can be prevented, thereby preventing defects caused by arcing. Explanation of the symbols

[0162] 100: Large screen display 200, 300: Substrate 205, 305: Light-blocking layer 210, 310: Buffer layer DTr: Driving transistor 230, 330: Interlayer insulation film 245, 345: Passivation film 250, 350: Flattening layer 265, 365: Bank 275, 375: Dam Pattern 285-1, 285-2, 390a: Barrier Pattern 260, 360: First electrode 280, 395: Organic light-emitting layer 282, 400: Second electrode 284, 405: Capping membrane 286, 415; 1st sealing membrane 288, 420: cover membrane 292, 425: Second encapsulation layer 290, 430: Wavelength conversion pattern 295, 435: Protective layer 294, 440: Side sealant 296, 445: Optical film

Claims

Claim 1 A substrate comprising a display area where a plurality of pixels are located and a non-display area surrounding the display area; a dam pattern surrounding the display area and located in the non-display area; a first barrier pattern located in a first barrier area between the dam pattern and the display area; a second barrier pattern located in a second barrier area outside the dam pattern; and an organic light-emitting diode layer located in the pixels of the substrate, the first barrier area, and the second barrier area. An organic light-emitting display device comprising: a display area, an organic light-emitting element layer, a first barrier pattern, and a second barrier pattern covering an encapsulation portion, wherein the first barrier pattern or the second barrier pattern comprises a polymer material having a large amount of fluorine (F) in functional groups, wherein carbon-carbon bonds are continuously formed in a chain structure to have orthogonality, and in the first barrier area and the second barrier area, the organic light-emitting element layer comprises: an organic light-emitting layer disposed on a first electrode and divided into a plurality of portions spaced apart or separated from each other by the first barrier pattern and the second barrier pattern; and a second electrode surrounding each separated plane of the organic light-emitting layer and comprising a plurality of portions spaced apart from each other, wherein the first barrier pattern and the second barrier pattern are disposed on the first electrode in the area between the separated portions of the second electrode adjacent to each other. Claim 2 delete Claim 3 An organic light-emitting display device according to claim 1, wherein the second electrode surrounds the disconnected plane of the organic light-emitting layer that is disconnected by the first barrier pattern and the second barrier pattern. Claim 4 In claim 1, the second barrier region is an organic light-emitting display device located between the end portion of the substrate and the dam pattern. Claim 5 An organic light-emitting display device according to claim 1, wherein the first barrier region has a narrower width than the second barrier region. Claim 6 delete Claim 7 An organic light-emitting display device according to claim 1, wherein the first barrier pattern is formed in a frame shape that surrounds the four sides of the display area when viewed from a planar view, and the second barrier pattern is formed in a frame shape that surrounds the four sides of the dam pattern while located outside the dam pattern when viewed from a planar view. Claim 8 An organic light-emitting display device according to claim 1, wherein the first barrier pattern or the second barrier pattern is composed of at least two or more multiple patterns. Claim 9 An organic light-emitting display device according to claim 1, wherein the first barrier pattern or the second barrier pattern each has a cross-sectional shape consisting of two side portions and a bottom surface, and has a shape in which a 'U'-shaped valley is arranged inside. Claim 10 An organic light-emitting display device according to claim 9, wherein both side portions and the bottom surface of the first barrier pattern or the second barrier pattern each have a thickness greater than 1 nm and not exceeding 10 nm. Claim 11 An organic light-emitting display device according to paragraph 3, wherein the first barrier pattern or the second barrier pattern has at least the same height as or a thicker height than the side wall surface of the second electrode surrounding the single-line plane of the organic light-emitting layer. Claim 12 An organic light-emitting display device according to claim 1, wherein the encapsulation portion comprises: a first encapsulation film that seals the organic light-emitting diode layer, the first barrier pattern, the dam pattern, and the second barrier pattern; a cover film disposed on the first encapsulation film and sealing up to the inside of the dam pattern; and a second encapsulation film located on the cover film and covering the first encapsulation film disposed on the dam pattern while sealing the second barrier pattern. Claim 13 A plurality of organic light-emitting display devices arranged to be in mutual contact along a first direction and a second direction intersecting the first direction, wherein the organic light-emitting display device comprises: a substrate including a display area where a plurality of pixels are located and a non-display area having a bezel area surrounding the display area; a dam pattern surrounding the display area and located in the bezel area of ​​the non-display area; a first barrier pattern located in a first barrier area between the dam pattern and the display area; a second barrier pattern located in a second barrier area outside the dam pattern; and an organic light-emitting element layer located in the pixels of the substrate, the first barrier area, and the second barrier area. A large screen display device comprising: a display area, an organic light-emitting diode layer, a first barrier pattern, and a second barrier pattern covering an encapsulation portion, wherein the first barrier pattern or the second barrier pattern comprises a polymer material having a large amount of fluorine (F) in functional groups, wherein carbon-carbon bonds are continuously formed in a chain structure to have orthogonality, and in the first barrier area and the second barrier area, the organic light-emitting diode layer comprises: an organic light-emitting layer disposed on a first electrode and divided into a plurality of portions separated or disconnected from each other by the first barrier pattern and the second barrier pattern; and a second electrode comprising a plurality of portions separated from each other and surrounding each disconnected plane of the organic light-emitting layer, wherein the first barrier pattern and the second barrier pattern are disposed on the first electrode in the area between the separated portions of the second electrode adjacent to each other. Claim 14 In claim 13, a large screen display device in which a plurality of organic light-emitting display devices are arranged to be in mutual contact along the first direction and a second direction intersecting the first direction, wherein the width of the bezel area arranged between adjacent organic light-emitting display devices is smaller than the pixel pitch between adjacent organic light-emitting display devices. Claim 15 delete Claim 16 In claim 13, the second electrode is a large screen display device that surrounds the disconnected plane of the organic light-emitting layer, which is disconnected by the first barrier pattern and the second barrier pattern. Claim 17 delete Claim 18 A large screen display device according to claim 13, wherein the first barrier pattern is formed in a frame shape that surrounds the four sides of the display area when viewed from a planar view, and the second barrier pattern is formed in a frame shape that surrounds the four sides of the dam pattern while being located outside the dam pattern when viewed from a planar view. Claim 19 In claim 13, the first barrier pattern or the second barrier pattern each has a cross-sectional shape consisting of two side portions and a bottom surface, and has a shape in which a 'U'-shaped valley is arranged inside, forming a large screen display device. Claim 20 In claim 16, the first barrier pattern or the second barrier pattern has at least the same height as or a thicker height than the side wall surface of the second electrode surrounding the single-line plane of the organic light-emitting layer.

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