Semiconductor device handling apparatus and semiconductor device testing apparatus

Abstract

[Project] To provide a semiconductor device handling device capable of managing deformation of the probe needle of a probe card with high precision. [Solution] A semiconductor device handling device (30) for handling a DUT (100) has a first moving device (41) that moves the DUT (100) to bring the pad (110) of the DUT (100) into contact with the probe needle (22) of the probe card (20) and presses the DUT (100) against the probe card (20), and a first acquiring device (50, 71) that acquires a first state of the probe needle (22) which is deformed by the pressurization of the first moving device (41).

Description

Technology Field

[0001] The present invention relates to a semiconductor device handling device for handling a semiconductor device under test (DUT), such as a die formed by dicing a semiconductor wafer, in order to test the said DUT, and a semiconductor device testing device equipped with the said semiconductor device handling device. Background Technology

[0002] An electronic component testing device is known for testing the electrical characteristics of an electronic circuit made in a bare die (bare chip) after dicing a semiconductor wafer (see, for example, Patent Document 1). This electronic component testing device is equipped with a test head having a probe card and a handler that moves the bare die and presses it firmly against the probe card. The handler is equipped with an alignment unit that, after positioning the bare die relative to the probe card, presses the pads of the bare die firmly against the contactors of the probe card. Prior art literature

[0003] Japanese Patent Publication No. 2016-85203 The problem to be solved

[0004] In the electronic component testing device described above, when the pad of the bare die is pressed firmly against the contactor of the probe card, the contactor is deformed. If this deformation of the contactor is excessive, damage may occur to the contactor or the pad. Here, for example, one might consider managing the deformation of the contactor according to the amount of pressure stroke of the alignment unit. However, since the deformation of the contactor may be irregular with respect to the amount of pressure stroke, there is a problem in that the deformation of the contactor cannot be sufficiently managed by the amount of pressure stroke alone.

[0005] The problem that the present invention aims to solve is to provide a semiconductor device handling device and a semiconductor device testing device capable of managing the deformation of the probe needle of a probe card with high precision. means of solving the problem

[0006] [1] The first aspect of the present invention is a semiconductor device handling device for handling a DUT, comprising a first moving device that moves the DUT to bring the terminal of the DUT into contact with the probe needle of a probe card and presses the DUT against the probe card, and a first acquiring device that acquires a first state of the probe needle that is deformed by the pressurization of the first moving device.

[0007] [2] The present invention's 2nd aspect is a semiconductor device handling device of the present invention, wherein the acquisition device may be a semiconductor device handling device equipped with a first camera that captures the probe needle.

[0008] [3] The present invention's 3 is a semiconductor device handling device of the present invention, wherein the first camera is a semiconductor device handling device that captures the probe needle along a first direction substantially parallel to the main surface of the probe card.

[0009] [4] The present invention's Sun 4 is a semiconductor device handling device of Sun 2 or Sun 3, wherein the acquisition device may be a semiconductor device handling device having a second moving device that moves the first camera.

[0010] [5] The present invention may be a semiconductor device handling device, wherein the first camera captures the probe needle along a first direction substantially parallel to the main surface of the probe card, and the second moving device moves the first camera in a second direction, and the second direction is substantially parallel to the main surface of the probe card and also intersects the first direction.

[0011] [6] The present invention's Sun 6 may be a semiconductor device handling device in which the second direction is substantially parallel to the main surface of the probe card and also substantially perpendicular to the first direction.

[0012] [7] The present invention's 7 is a semiconductor device handling device of any one of 4 to 6, wherein the second moving device may be a semiconductor device handling device that moves the first camera along the outer circumference of the probe card.

[0013] [8] The present invention, in any one of the semiconductor device handling devices of the present invention, may be a semiconductor device handling device having a base having an opening into which the probe card is inserted, and the second moving device may be a semiconductor device handling device having a guide member provided on the base to surround the opening and a moving part that supports the first camera and is movable over the guide member.

[0014] [9] The present invention's 9 is a semiconductor device handling device of the present invention, wherein the acquisition device may be a semiconductor device handling device having a displacement sensor that irradiates a laser light onto the probe needle and a second moving device that moves the displacement sensor.

[0015]

[10] The present invention may be a semiconductor device handling device, wherein the displacement sensor irradiates the laser light along a first direction substantially parallel to the main surface of the probe card, and the second moving device moves the displacement sensor along a second direction, and the second direction is substantially parallel to the main surface of the probe card and also intersects the first direction.

[0016]

[11] The present invention may be a semiconductor device handling device in which the second direction is substantially parallel to the main surface of the probe card and also substantially perpendicular to the first direction.

[0017]

[12] The present invention's Sun 12 is a semiconductor device handling device of any one of Sun 9 to Sun 11, wherein the second moving device may be a semiconductor device handling device that moves the displacement sensor along the outer circumference of the probe card.

[0018]

[13] The present invention, in any one of the semiconductor device handling devices of the present invention 9 to 12, may be a semiconductor device handling device having a base having an opening into which the probe card is inserted, and a second moving device having a guide member provided on the base to surround the opening, and a moving part that supports the displacement sensor and is movable over the guide member.

[0019]

[14] The present invention 14 is a semiconductor device handling device of the present invention, wherein the acquisition device may be a semiconductor device handling device having a second camera that captures the probe card along a third direction substantially perpendicular to the main surface of the probe card, and an optical axis changing device that changes the optical axis of the second camera to a first direction substantially parallel to the main surface of the probe card.

[0020]

[15] The present invention, in a semiconductor device handling device of the present invention, the semiconductor device handling device comprises a position calculation device that calculates the relative position of the DUT with respect to the probe card, and a driving control device that controls the first moving device based on the relative position calculated by the position calculation device, and the position calculation device may be a semiconductor device handling device that calculates the relative position based on image information captured by the second camera along the third direction.

[0021]

[16] The present invention's embodiment 16 is a semiconductor device handling device of any one of embodiments 1 to 15, wherein the acquisition device may be a semiconductor device handling device that acquires three-dimensional shape data of the probe needle viewed from one direction.

[0022]

[17] The present invention, in any one of the semiconductor device handling devices from Sun 1 to Sun 16, may be a semiconductor device handling device having a memory device that stores a second state which is a normal state of the probe needle, and a determination device that determines whether the first state is normal or abnormal based on the first state and the second state.

[0023]

[18] The present invention, in the semiconductor device handling device of the present invention, may be a semiconductor device handling device in which the second state is a state of the probe needle that is not in contact with the terminal or a state of the probe needle that is deformed into a normal state.

[0024]

[19] The present invention, in a semiconductor device handling device of the present invention, may be a semiconductor device handling device having a deformation amount calculation unit that calculates the deformation amount of the probe needle based on the first state and the second state, and a determination unit that determines whether the first state is normal or abnormal based on the calculation result of the deformation amount calculation unit.

[0025]

[20] The present invention 20 may be a semiconductor device handling device of the present invention 19, wherein the determination unit determines whether the first state is normal or abnormal by comparing the deformation amount calculated by the deformation amount calculation unit with the threshold value stored in the memory device.

[0026]

[21] The present invention's Sun 21 is a semiconductor device handling device of Sun 19 or Sun 20, wherein the semiconductor device handling device may additionally be a semiconductor device handling device having a notification device that indicates that the deformation of the probe needle is abnormal when the judgment device determines that the first state is abnormal.

[0027]

[22] The present invention, in any one of the semiconductor device handling devices from sun 1 to sun 21, may be a semiconductor device handling device having a parallelism calculation device that calculates the parallelism between the probe card and the DUT based on the third state, wherein the acquisition device acquires a third state which is the state of the terminal and the probe needle that are spaced apart from each other.

[0028]

[23] The present invention's 23 is a semiconductor device handling device of the present invention, wherein the semiconductor device handling device may be a semiconductor device handling device having a parallelism adjustment device that adjusts the parallelism between the probe card and the DUT based on the parallelism calculated by the parallelism calculation device.

[0029]

[24] The present invention's Sun 24 is a semiconductor device handling device of any one of Sun 1 to Sun 23, wherein the DUT may be a semiconductor device handling device comprising a bare die unit, a 2.5D device intermediate in which a plurality of bare dies are placed on a silicon interposer, or a 3D device intermediate in which a plurality of bare dies are stacked on top of each other.

[0030]

[25] The present invention's Sun 25 is a semiconductor device handling device of any one of Sun 1 to Sun 24, wherein the first moving device may be a semiconductor device handling device that presses the DUT firmly against the probe card by raising the DUT upward in a vertical direction.

[0031]

[26] The present invention 26 is a semiconductor device test device for testing a DUT,

[0032] A semiconductor device test device comprising any one of Sun 1 to Sun 25, a probe card, and a tester that electrically connects the probe card and performs a test of the DUT. Effects of the invention

[0033] According to the present invention, since the acquisition device acquires a first state, which is the state of the probe needle deformed by the pressure of the first moving device, the deformation of the probe needle can be managed with high precision. Brief explanation of the drawing

[0034] FIG. 1 is a drawing showing the overall configuration of a semiconductor device test apparatus and the internal structure of a handler in an embodiment of the present invention. Figure 2 is an enlarged view showing Part II of Figure 1. FIG. 3 is a bottom view of an imaging unit seen from below in an embodiment of the present invention. FIG. 4 is a block diagram showing a control system of a handler in an embodiment of the present invention. FIG. 5 is a flowchart of a method for determining the deformation state of a probe needle in an embodiment of the present invention. FIG. 6 is a drawing showing an example of a first state image captured by a camera in an embodiment of the present invention. FIG. 7 is a drawing showing an example of a third state image captured by a camera in an embodiment of the present invention. FIG. 8 is a drawing showing a sensing unit in another embodiment of the present invention, corresponding to FIG. 2. FIG. 9 is a drawing showing an imaging unit in another embodiment of the present invention, corresponding to FIG. 2. Specific details for implementing the invention

[0035] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0036] FIG. 1 is a drawing showing the overall configuration of the semiconductor device test apparatus (1) and the internal structure of the handler (30) in the present embodiment, and FIG. 2 is an enlarged view showing part II of FIG. 1. FIG. 3 is a bottom view of the imaging unit (50) in the present embodiment viewed from below. FIG. 4 is a block diagram showing the control system of the handler (30) in the present embodiment.

[0037] In the present embodiment, the semiconductor device test apparatus (1) is a device for testing a DUT (100). As shown in FIG. 1, the semiconductor device test apparatus (1) is equipped with a tester (10) for performing a test of the DUT (100), a probe card (20) electrically connected to the tester (10), and a handler (30) for moving the DUT (100) and pressing it firmly against the probe card (20). The handler (30) corresponds to an example of a "semiconductor device handling apparatus" in an embodiment of the present invention.

[0038] Specific examples of the DUT (100) to be tested include, for example, a bare die (bare chip) formed by dicing a semiconductor wafer. The semiconductor device test device (1) tests the electrical characteristics of an electronic circuit created in this bare die (100). In addition, the DUT (100) is not limited to a single bare die, and for example, the DUT (100) may be a 2.5D device intermediate or a 3D device intermediate.

[0039] Here, a 2.5D device intermediate is a device intermediate comprising a silicon interposer and a plurality of bare dies arranged on the silicon interposer. This 2.5D device intermediate is, for example, mounted on a wiring board and packaged by a resin material to become a final product (i.e., a 2.5D device (2.5-dimensional device)).

[0040] Meanwhile, a 3D device intermediate is a device intermediate having a plurality of bare dies that are stacked together and electrically connected by through-silicon vias (TSVs). Like the 2.5D device intermediate described above, this 3D device intermediate is also mounted on a wiring board, for example, and packaged with a resin material to become a final product (i.e., a 3D device (three-dimensional device)).

[0041] As shown in FIG. 1, the tester (10) is equipped with a test head (11) and a main frame (tester body) (12). The test head (11) is connected to the main frame (12) via a cable. A probe card (20) is electrically connected to the test head (11). This probe card (20) is supported by a support mechanism (35) and enters the interior of the handler (30) through an opening (32) formed in the upper base (31) of the handler (30).

[0042] Although not specifically illustrated, this support mechanism (35) is equipped with a bridge beam to which the probe card (20) is fixed, and a tilt adjustment device that adjusts the tilt of the probe card (20) through the bridge beam. This support mechanism (35) is supported by a column member (not illustrated) installed on a lower base (34). The tilt adjustment device of this support mechanism (35) can adjust the parallelism between the probe card (20) and the DUT (100) by adjusting the tilt of the probe card (20).

[0043] As shown in FIG. 2, the probe card (20) is provided with a substrate (21) and a plurality of probe needles (22). The substrate (21) is, for example, a printed circuit board. A plurality of probe needles (22) are provided on the lower surface of the substrate (21). These plurality of probe needles (22) are arranged on the lower surface of the substrate (21) to correspond to an arrangement of a plurality of pads (110) provided by the DUT (100). The pads (110) of the DUT (100) correspond to an example of a "terminal" in an embodiment of the present invention.

[0044] This probe needle (22) is a needle-shaped member capable of elastic deformation in the vertical direction (Z direction in the drawing). This probe needle (22) is composed of a conductive material, such as a metal material, for example. Although not particularly limited, in this embodiment, this probe needle (22) is a vertical type probe needle having a straight shape that extends in a straight line in the vertical direction (Z direction in the drawing).

[0045] In addition, the probe needle (22) is not specifically limited to the above as long as it is elastically deformable in the direction of pressure of the DUT (100) on the probe card (20) (Z direction in the drawing). For example, the probe needle (22) may have one or more curved portions, and said curved portions may have an arc shape. The probe needle (22) may be a cantilever type probe needle. In this case, the probe needle (22) may have, for example, a shape inclined with respect to the planar direction of the main surface of the substrate (21) or one or more curved portions.

[0046] As shown in FIGS. 1 and 2, the handler (30) is equipped with an alignment unit (40), an imaging unit (50), a third camera (60), and a control device (70) (see FIG. 4).

[0047] The alignment unit (40) is equipped with a first moving device (41) and a second camera (44). The first moving device (41) moves the DUT (100) relative to the probe card (20) and presses the DUT (100) firmly against the probe card (20). This first moving device (41) is equipped with a thermal chuck (42) and a moving mechanism (43).

[0048] The thermal chuck (42) is a component that holds the DUT (100) and also adjusts the temperature of the DUT (100). The DUT (100), which is transported by the transport device (36) (described later), is placed on the upper surface (421) of the thermal chuck (42). As shown in FIG. 2, an adsorption nozzle (422) is opened on the upper surface (421) of the thermal chuck (42). This adsorption nozzle (422) is connected to a vacuum pump (not shown) through a flow path (423) formed within the thermal chuck (42), and is made capable of adsorbing and holding the DUT (100).

[0049] Additionally, a channel (424) through which a temperature-regulating fluid can flow is formed inside the thermal chuck (42). Although not specifically illustrated, a temperature-regulating device capable of supplying the temperature-regulating fluid is connected to this channel (424). For example, a plurality of fins are provided in this channel (424) to enable efficient heat exchange with the fluid. Furthermore, the thermal chuck (42) may be equipped with a heater or a Peltier element instead of the channel (424). Alternatively, the thermal chuck (42) may be equipped with a heater or a Peltier element in addition to the channel (424).

[0050] The moving mechanism (43) is a device for moving the thermal chuck (42). This moving mechanism (43) is equipped with an X-direction rail (431), an X-direction stage (432), a Y-direction rail (433), a Y-direction stage (434), a Z-direction rail (435), a Z-direction actuator (436), and a lifting block (437).

[0051] An X-direction rail (431) is provided on the lower base (34) of the handler (30) and extends along the X direction. An X-direction stage (432) is slidably held on this X-direction rail (431) and is made movable along the X direction by means of an actuator (not shown). A Y-direction rail (433) is provided on this X-direction stage (432) and extends along the Y direction. A Y-direction stage (434) is slidably held on this Y-direction rail (433) and is made movable along the Y direction by means of an actuator (not shown).

[0052] A Z-direction rail (435) is provided on the Y-direction stage (434) and extends along the Z-direction. A lifting block (437) is slidably held on the Z-direction rail (435) and is made capable of moving in the Z-direction by a Z-direction actuator (436). Specific examples of such a Z-direction actuator (436) are not particularly limited, but, for example, an electric motor equipped with a ball screw mechanism can be exemplified.

[0053] The thermal chuck (42) is fixed to the lifting block (437) and is movable together with the lifting block (437). As a result, the moving mechanism (43) is capable of moving the thermal chuck (42) in the XYZ direction. Additionally, the lifting block (437) has a rotational drive unit (438) that rotates the thermal chuck (42) around the Z-axis.

[0054] In addition, the lifting block (437) may be equipped with a tilt adjustment unit that adjusts the tilt of the DUT (100) held in the thermal chuck (42). This tilt adjustment unit can cancel the relative tilt of the DUT (100) with respect to the probe card (20) and suppress the occurrence of a contact miss between the probe card (20) and the DUT (100). In particular, the effect of suppressing the above-mentioned contact miss is significant in a 2.5D device intermediate or a 3D device intermediate having a stacked structure.

[0055] Additionally, the lifting block (437) may be equipped with a height adjustment unit that adjusts the height of the DUT (100) held in the thermal chuck (42). This height adjustment unit can cancel the displacement in the height direction of the DUT (100) that occurs due to the adjustment of the inclination of the DUT (100) by the inclination adjustment unit described above, and can further suppress the occurrence of the contact miss described above.

[0056] The second camera (44) is a camera that captures the probe card (20) from below. The second camera (44) is installed on the first moving device (41) such that its optical axis faces the +Z direction in the drawing. Specific examples of the second camera (44) include a camera equipped with an imaging element such as a CCD or CMOS. When the second camera (44) is moved downwards toward the probe card (20) by the first moving device (41), it is possible to capture the probe card (20) by the second camera (44). As shown in FIG. 4, the second camera (44) is electrically connected to a control device (70) and is capable of outputting captured image information to the control device (70).

[0057] As shown in FIGS. 2 and 3, the imaging unit (50) is equipped with a first camera (51) and a second moving device (52). The first camera (51) is a camera that captures a plurality of probe needles (22) provided by the probe card (20) from the side. The second moving device (52) is configured to enable the first camera (51) to move around the plurality of probe needles (22) of the probe card (20). The imaging unit (50) and the image processing unit (71) described later correspond to an example of an "acquisition device" in an embodiment of the present invention.

[0058] The first camera (51) is positioned so that its optical axis faces a first direction substantially parallel to the main surface (XY plane in the drawing) of the substrate (21) of the probe card (20). Specific examples of this first camera (51) may include a camera equipped with an imaging element such as a CCD or CMOS. As shown in FIG. 4, this first camera (51) is electrically connected to a control device (70) and is capable of outputting captured image information to the control device (70).

[0059] As shown in FIGS. 2 and 3, the second moving device (52) is equipped with a pair of guide rails (53) and a sliding block (54). The guide rails (53) are installed on the lower surface of the upper base (31). The guide rails (53) are extended in a ring shape to surround the opening (32) into which the probe card (20) is inserted. The sliding block (54) is made capable of sliding along the guide rails (53). The guide rails (53) correspond to an example of a "guide member" in an embodiment of the present invention, and the sliding block (54) corresponds to an example of a "moving part" in an embodiment of the present invention.

[0060] The first camera (51) is fixed to the sliding block (54) of the second moving device (52). The sliding block (54) moves along the guide rail (53) by means of an actuator not specifically shown, thereby causing the first camera (51) to move along the outer circumference of the probe card (20). During this movement, the first camera (51) continuously captures the probe needle (22) located at the outermost circumference among the plurality of probe needles (22) provided by the probe card (20). Additionally, the imaging unit (50) may not be equipped with the second moving device (52), in which case the first camera (51) is installed on the lower surface of the upper base (31).

[0061] The direction of travel (second direction) of this sliding block (54) is substantially parallel to the main surface (XY plane in the drawing) of the substrate (21) of the probe card (20) and is also substantially orthogonal to the first direction (direction of the optical axis of the first camera (51)). In addition, the direction of travel of the sliding block (54) is not particularly limited to the above, provided that it is substantially parallel to the main surface of the substrate (21) of the probe card (20) and is also a direction that intersects the first direction.

[0062] This imaging unit (50) is used to check the actual deformation state of the probe needle (22) before starting normal operation (normal test process), as described below. Accordingly, the first camera (51) captures the "first state." This "first state" is the state of the probe needle (22) that is deformed by the pressure of the first moving device (41) when the first moving device (41) of the alignment unit (40) presses the DUT (100) firmly against the probe card (20).

[0063] The third camera (60) is a camera that captures the DUT (100) held in the thermal chuck (42) of the first moving device (41) from above, as shown in FIG. 1. The third camera (60) is installed on the upper base (31) of the handler (30) such that its optical axis faces downward (the -Z direction in the drawing). Specific examples of the third camera (60) include a camera equipped with an imaging element such as a CCD or CMOS. When the thermal chuck (42) holding the DUT (100) moves downward to the third camera (60) by the first moving device (41), the DUT (100) is captured by the corresponding third camera (60). As shown in FIG. 4, this third camera (60) is electrically connected to a control device (70) and is capable of outputting captured image information to the control device (70).

[0064] The control device (70) is configured, for example, as a computer. Although not specifically illustrated, this computer is an electronic calculator equipped with a CPU (processor), main memory (RAM, etc.), auxiliary memory (hard disk or SSD, etc.), and an interface. As shown in FIG. 4, this control device (70) is functionally equipped with an image processing unit (71), a position calculation unit (72), a drive control unit (73), a memory unit (74), a deformation amount calculation unit (75), a judgment unit (76), and a notification unit (77). These functions (71 to 77) are functionally realized by the processor executing a program installed in the control device (70). In addition, this control device (70) may be configured as a circuit board instead of a computer.

[0065] The image processing unit (71) performs image processing on image information output from the first camera (51). The image processing unit (71) acquires three-dimensional shape data of the probe needle (22) viewed from one direction by, for example, using a combined focus method (focus shift method). Since the first camera (51) captures the probe needle (22) while moving along the outer circumference of the probe card (20) by the second moving device (52), the image processing unit (71) acquires shape data for all probe needles (22) located at the outermost circumference among the plurality of probe needles (22) provided by the probe card (20). In addition, the image processing unit (71) may acquire two-dimensional shape data of the probe needle (22) instead of three-dimensional shape data of the probe needle (22).

[0066] Additionally, the image processing unit (71) detects the position of the probe needle (22) of the probe card (20) by performing image processing on the image information output from the second camera (44). Furthermore, the image processing unit (71) detects the position of the pad (110) of the DUT (100) held in the thermal chuck (42) by performing image processing on the image information output from the third camera (60).

[0067] The position calculation unit (72) calculates a correction amount for the position of the DUT (100) relative to the probe card (20) based on the detection result of the image processing unit (71). Specifically, the position calculation unit (72) calculates the relative misalignment amount of the position of the DUT (100)'s pad (110) relative to the position of the probe needle (22) of the probe card (20) from the position of the probe needle (22) and the position of the pad (110) obtained by the image processing unit (71), and calculates a position correction amount that cancels this misalignment amount. That is, the position calculation unit (72) calculates a position correction amount that relatively matches the position of the probe needle (22) of the probe card (20) and the position of the DUT (100)'s pad (110) from the detection result of the image processing unit (71).

[0068] The drive control unit (73) controls the drive of the first moving device (41) of the alignment unit (40) and the second moving device (52) of the imaging unit (50). For example, the drive control unit (73) controls the drive of the first moving device (41) of the alignment unit (40) based on the position correction amount calculated by the position calculation unit (72) described above. In addition, the drive control unit (73) controls the drive of the second moving device (52) of the imaging unit (50) so that the first camera (51) moves around a plurality of probe needles (22) provided by the probe card (20) when the probe needle (22) is captured by the first camera (51).

[0069] The memory unit (74) stores three-dimensional shape data of the "second state," which is the normal state of the probe needle. Although not specifically limited, for example, this "second state" is the state of the probe needle (22) that is not in contact with the pad (110) of the DUT (100). Additionally, this "second state" may be the state of the probe needle (22) that is normally deformed by the pressure of the first moving device (41) when the first moving device (41) of the alignment unit (40) presses the DUT (100) firmly against the probe card (20).

[0070] This second state three-dimensional shape data is pre-set based on the design information of the probe needle (22) and is stored in the memory unit (74). Alternatively, this second state three-dimensional shape data may be pre-acquired by capturing the probe needle (22) with the first camera (51) and stored in the memory unit (74).

[0071] The deformation amount calculation unit (75) calculates the deformation amount of the probe needle (22) by comparing the shape data of the first state output from the image processing unit (71) with the shape data of the second state read from the memory unit (74). Since the first camera (51) moves along the outer circumference of the probe card (20) by the second moving device (52) and captures the probe needle (22), the deformation amount calculation unit (75) calculates the deformation amount for all probe needles (22) located at the outermost circumference.

[0072] The determination unit (76) determines whether the first state is normal or abnormal based on the calculation result of the deformation amount calculation unit (75) described above. Specifically, the determination unit (76) determines whether the first state is normal or abnormal by comparing the deformation amount of the probe needle (22) calculated by the deformation amount calculation unit (75) with a predetermined threshold value. In addition, the predetermined threshold value is stored in advance in the memory unit (74) described above.

[0073] The notification unit (77) notifies the result of the judgment unit (76). Specifically, when the judgment unit (76) determines that the first state is abnormal, the notification unit (77) notifies, for example, an operator of the semiconductor device test device (1) that the deformation of the probe needle (22) is abnormal through an output device provided by the control unit (70). The output device is, for example, a device capable of outputting light or sound to the outside, and specifically, may be a display, a warning light, a speaker, etc. The notification unit (77) can notify the operator that the deformation of the probe needle (22) is abnormal by sound or light.

[0074] The semiconductor device test device (1) described above performs the following handling operations by a handler (30) to perform a test of the DUT (100).

[0075] First, as indicated by the dashed line in FIG. 1, the moving mechanism (43) moves the thermal chuck (42) so that the thermal chuck (42) is positioned below the opening (33) of the upper base (31) of the handler (30). Then, the transfer device (36) picks up the DUT (100) before testing from the tray (not shown) and transfers the DUT (100) to the thermal chuck (42) through the opening (33). When the DUT (100) is placed on the thermal chuck (42) by the transfer device (36), the thermal chuck (42) adsorbs and holds the DUT (100).

[0076] In addition, specific examples of the transfer device (36) are not particularly limited, but a pick-and-place device equipped with an adsorption pad may be exemplified. Also, specific examples of the above-mentioned tray are not particularly limited, but for example, a customer tray conforming to JEDEC (Joint Electron Device Engineering Council) standards may be exemplified. Additionally, a plate may be used instead of the above-mentioned tray. As such a plate, for example, a buffer plate capable of holding the DUT (100) may be exemplified. Furthermore, if the DUT (100) is a single die, the DUT (100) before testing may be held in a ring frame (wafer ring) instead of the above-mentioned tray or plate.

[0077] Next, as indicated by the dashed line in FIG. 1, the moving mechanism (43) moves the thermal chuck (42) so that the DUT (100) faces the third camera (60) installed on the upper base (31) of the handler (30). Then, the third camera (60) captures the DUT (100). In addition, the probe card (20) is captured in advance by the second camera (44), and the position of the probe needle (22) of the probe card (20) is detected in advance by the image processing unit (71) and stored in the memory unit (74). The timing for capturing the probe card (20) by the second camera (44) is, for example, when the probe card (20) is replaced due to a change in the type of DUT (100). The position calculation unit (72) calculates the position correction amount of the DUT (100) from these detection results. Then, based on the position correction amount, the position of the thermal chuck (42) holding the DUT (100) is finely adjusted by the moving mechanism (43) to position the DUT (100) relative to the probe card (20).

[0078] Next, as indicated by the solid line in FIG. 1, the moving mechanism (43) moves the thermal chuck (42) so that the DUT (100) faces the probe card (20). Then, the moving mechanism (43) raises the thermal chuck (42) and brings the pad (110) into contact with the probe needle (22). Furthermore, the moving mechanism (43) is raised by a predetermined stroke amount to push the DUT (100) against the probe card (20), thereby electrically connecting the DUT (100) and the probe card (20).

[0079] Next, the tester (10) inputs an electrical signal to the DUT (100) through the probe card (20). Then, the tester (10) determines whether the DUT (100) is defective or has characteristics based on the electrical signal output from the DUT (100) through the probe card (20).

[0080] In this embodiment, before starting the normal operation (normal test process) of the semiconductor device test device (1) described above, a determination operation is performed to determine the state of the probe needle (22) that is deformed by the pressure of the first moving device (41). Although not specifically limited, for example, this determination operation is performed at the start of the operation or when replacing the probe card (20). Hereinafter, a method for determining the deformed state of the probe needle (22) will be explained with reference to FIGS. 5 and 6.

[0081] FIG. 5 is a flowchart of a method for determining the deformation state of a probe needle (22) in the present embodiment, and FIG. 6 is a diagram showing an example of an image captured by the first camera (51) in step S12 of FIG. 5.

[0082] First, in step S11 of FIG. 5, the first moving device (41) moves the DUT (100) downwards toward the probe card (20) in the same manner as described above. Then, the first moving device (41) raises the DUT (100), brings the pad (110) into contact with the probe needle (22), and presses the DUT (100) firmly against the probe card (20). At this time, the alignment unit (40) presses the DUT (100) firmly against the probe card (20) with a preset stroke amount. The probe needle (22) is deformed by the pressure of the first moving device (41).

[0083] Next, in step S12 of FIG. 5, the drive control unit (73) of the control device (70) drives and controls the imaging unit (50) so that the first camera (51) captures the probe needle (22) from the side, and the second moving device (52) moves the first camera (51) along the outer circumference of the probe card (20). At this time, since the probe needle (22) is deformed by the pressure of the first moving device (41), the first camera (51) captures the "first state."

[0084] Next, in step S13 of FIG. 5, an image processing unit (71) performs image processing on image information output from the first camera (51) and acquires three-dimensional shape data of the first state. Since the first camera (51) moves along the outer circumference of the probe card (20) by the second moving device (52) and captures the probe needle (22), in this step S13, the image processing unit (71) acquires shape data of the first state for all probe needles (22) located at the outermost circumference captured by the first camera (51).

[0085] Next, in step S14 of FIG. 5, the deformation amount calculation unit (75) calculates the deformation amount of the probe needle (22) by comparing the shape data of the first state output from the image processing unit (71) with the shape data of the second state read from the memory unit (74). In this step S14, the deformation amount calculation unit (75) calculates the deformation amount for all probe needles (22) located at the outermost circumference.

[0086] Next, in step S15 of FIG. 5, the determination unit (76) determines whether the first state is normal or abnormal by comparing the amount of deformation of the probe needle (22) calculated by the deformation amount calculation unit (75) with the threshold value read from the memory unit (74). In this step S15, the determination unit (76) determines the deformation state of all probe needles (22) located at the outermost circumference.

[0087] For example, FIG. 6 shows an example of a first state image captured by the first camera (51) in step S12 of FIG. 5. In the example shown in FIG. 6, the central probe needle (22A) is excessively deformed by the pressure of the first moving device (41), and the amount of deformation of this probe needle (22A) compared to the second state is δ. In the example shown in FIG. 6, since the amount of deformation (δ) of the central probe needle (22A) is greater than a predetermined threshold value (Th) (δ > Th), the judgment unit (76) determines that the deformation state of the corresponding probe needle (22A) is abnormal. Furthermore, FIG. 6 is illustrated as if deformation occurs only in the central probe needle (22A) for convenience, but in reality, normal deformation occurs in the four probe needles (22B) other than the central probe needle (22A), and the amount of deformation is less than or equal to the aforementioned threshold value (Th).

[0088] And, if there is a first state in which the deformation state of the probe needle (22) is determined to be abnormal in step S15 above (NO in step S15), then in step S16 of FIG. 5, the notification unit (77) notifies the operator of the semiconductor device test device (1) that the deformation of the probe needle (22) is abnormal. The operator, for example, adjusts the stroke amount based on this notification and then repeats steps S11 to S15 of FIG. 5.

[0089] Meanwhile, if there is no first state in which the deformation state of the probe needle (22) is determined to be abnormal in the above-described step S15 (i.e., the deformation state of all probe needles (22) located at the outermost periphery is determined to be normal) (YES in step S15), proceed to step S17 of FIG. 5 and start normal operation of the above-described semiconductor device test device (1).

[0090] As described above, in this embodiment, the imaging unit (50) acquires the first state of the probe needle (22) which is deformed by the pressure of the first moving device (41), so the deformation of the probe needle (22) can be managed with high precision.

[0091] Here, when the DUT is a bare die, a 2.5D device intermediate, or a 3D device intermediate, high precision is required for the pressure control of the DUT on the probe card compared to a packaged device. In this regard, since the deformation of the probe needle (22) can be managed with high precision in this embodiment, it is particularly effective when the DUT (100) is a bare die, a 2.5D device intermediate, or a 3D device intermediate.

[0092] In addition, in this embodiment, the judgment unit (76) determines whether the deformation state of the probe needle (22) is normal or abnormal, and if the deformation state of the probe needle (22) is abnormal, the notification unit (77) informs the operator of this fact, so that the test of the DUT (100) can be performed stably without causing damage to the probe needle (22) or the DUT (100).

[0093] In addition, in the above-mentioned judgment operation, in addition to determining the deformation state of the probe needle (22), the parallelism between the probe card (20) and the DUT (100) described below may be adjusted.

[0094] In this case, the "third state" is captured by the first camera (51) of the imaging unit (50). This "third state" is the state of the pad (110) and the probe needle (22) that are spaced apart from each other, and specifically, the state of the pad (110) of the DUT (100) and the probe needle (22) of the probe card (20) just before contact is made by the rise of the first moving device (41).

[0095] In addition, in this case, as shown in FIG. 4, the control device (70) is equipped with a parallelism calculation unit (78) that calculates the parallelism between the probe card (20) and the DUT (100) based on the third state described above. This parallelism calculation unit (78) is also functionally realized by a processor executing a program installed in the control device (70), just like the functions (71 to 77) described above.

[0096] Specifically, in step S11 of FIG. 5, just before the pad (110) contacts the probe needle (22) due to the rise of the first moving device (41), the first camera (51) captures the probe needle (22) and the pad (110) from the side, and the second moving device (52) moves the first camera (51) along the outer circumference of the probe card (20). At this time, since the pad (110) and the probe needle (22) are spaced apart from each other, the first camera (51) captures the "third state."

[0097] Next, an image processing unit (71) performs image processing on image information output from the first camera (51) and acquires three-dimensional shape data of a third state. Since the first camera (51) moves along the outer circumference of the probe card (20) by the second moving device (52) and captures the probe needle (22) and pad (110), the image processing unit (71) acquires shape data of a third state for all probe needles (22) and pads (110) located at the outermost circumference.

[0098] Next, a parallelism calculation unit (78) provided by the control device (70) calculates the parallelism between the probe card (20) and the DUT (100) based on the shape data of the third state. FIG. 7 is a drawing showing an example of a third state image captured by the first camera (51) in the present embodiment.

[0099] Specifically, as shown in FIG. 7, the parallelism calculation unit (78) first obtains a first virtual plane (VP1) and a second virtual plane (VP2) from the shape data of the third state. Here, the first virtual plane (VP1) is a virtual plane that passes through the tip of all probe needles (22) located at the outermost edge among the plurality of probe needles (22) provided by the probe card (20). Meanwhile, the second virtual plane (VP2) is a virtual plane that passes through the upper surface of all pads (110) located at the outermost edge among the plurality of pads (110) provided by the DUT (100). The parallelism calculation unit (78) calculates the intersection angle (θ) of the first virtual plane (VP1) and the second virtual plane (VP2) as the parallelism between the probe card (20) and the DUT (100).

[0100] Then, the support mechanism (35) adjusts the inclination of the probe card (20) so that the probe card (20) becomes parallel to the DUT (100) based on this parallelism. After that, the first moving device (41) raises the DUT (100), brings the pad (110) into contact with the probe needle (22), presses the DUT (100) firmly against the probe card (20), and performs the operation after step S12 of FIG. 5.

[0101] Additionally, as shown in FIG. 8, the handler (30) may be equipped with a sensing unit (50B) instead of an imaging unit (50). This sensing unit (50B) is equipped with a displacement sensor (51B) instead of a first camera (51). Furthermore, this sensing unit (50B) is equipped with the second moving device (52) described above in addition to the displacement sensor (51B). FIG. 8 is a drawing showing the sensing unit (50B) in another embodiment of the present invention and is a drawing corresponding to FIG. 2.

[0102] The displacement sensor (51B) is a laser displacement sensor that, for example, irradiates a strip-shaped (line-shaped) laser light onto a probe needle (22) and receives the laser light reflected from the probe needle (22). The displacement sensor (51B) is positioned to irradiate a laser light along a first direction substantially parallel to the main surface (XY plane in the drawing) of the substrate (21) of the probe card (20). The displacement sensor (51B) is fixed to the sliding block (54) of the second moving device (52) and is made capable of moving along the outer circumference of the probe card (20).

[0103] The direction of travel (second direction) of this sliding block (54) is substantially parallel to the main surface (XY plane in the drawing) of the substrate (21) of the probe card (20) and is also substantially orthogonal to the first direction (the direction of irradiation of the laser light of the displacement sensor (51B)). In addition, the direction of travel of the sliding block (54) is not particularly limited to the above, provided that it is substantially parallel to the main surface of the substrate (21) of the probe card (20) and is also a direction that intersects the first direction.

[0104] This displacement sensor (51B) acquires three-dimensional shape data of the probe needle (22) viewed from one direction by, for example, using an optical cutting method, and outputs the shape data to the control device (70). In the control device (70), the deformation amount calculation unit (75) calculates the deformation amount of the probe needle (22) based on the shape data in the same manner as described above, and the judgment unit (76) determines whether the first state is normal or abnormal based on the deformation amount, and if the first state is abnormal, the notification unit (77) informs of the reason.

[0105] Alternatively, as shown in FIG. 9, the imaging unit (50C) may use the second camera (44) of the alignment unit (40) instead of the first camera (51) and be equipped with a mirror (55) instead of the second moving device (52). FIG. 9 is a drawing showing the imaging unit (50C) in another embodiment of the present invention and corresponds to FIG. 2. This mirror (55) corresponds to an example of an "optical axis changing device" in an aspect of the present invention.

[0106] Specifically, the mirror (55) is supported by a support member (56), and the support member (56) is fixed to the upper base (31) of the handler (30). This mirror (55) changes the optical axis of the second camera (44), which is oriented in the +Z direction in the drawing, to a first direction substantially parallel to the main surface (XY plane in the drawing) of the substrate (21) of the probe card (20).

[0107] This second camera (44) captures a plurality of probe needles (22) provided by the probe card (20) from the side through a mirror (55). The image information captured by this second camera (44) is output to the control device (70). In the control device (70), the image processing unit (71) acquires three-dimensional shape data of the probe needles (22) viewed from one direction based on this image information in the same manner as described above, the deformation amount calculation unit (75) calculates the deformation amount of the probe needles (22) based on this shape data, the judgment unit (76) determines whether the first state is normal or abnormal based on this deformation amount, and if the first state is abnormal, the notification unit (77) informs of the fact.

[0108] In this way, the structure of the imaging unit (50C) can be simplified by using the second camera (44) instead of the first camera (51) and having a mirror (55) instead of the second moving device (52).

[0109] Furthermore, the embodiments described above are provided to facilitate understanding of the present invention and are not intended to limit the invention. Accordingly, each element disclosed in the above embodiments is intended to include all design modifications or equivalents that fall within the technical scope of the present invention.

[0110] For example, in the above-described embodiment, one DUT (100) is tested at a time by the semiconductor device test device (1), but the number of DUTs (100) tested simultaneously by the semiconductor device test device (1) is not particularly limited to the above, and the semiconductor device test device (1) may test multiple DUTs (100) simultaneously.

[0111] In addition, the semiconductor device test device (1) described above is equipped with a so-called die-level handler for testing a bare die, or is a semiconductor device test device equipped with a probe card, and the type of semiconductor device test device is not particularly limited thereto. Specifically, the semiconductor device test device (1) may be for a so-called post-processing, and, for example, may be a semiconductor device test device equipped with a TAB handler. Explanation of the symbols

[0112] 1: Semiconductor device test device 10: Tester 20: Probe Card 22: Probe Needle 30: Handler 31: Upper base 32, 33: Openings 40: Alignment unit 41: 1st moving device 42: Thermal chuck 43: Moving device 44: Second camera 50, 50C: Imaging unit 50B: Sensing unit 51: 1st Camera 51B: Displacement Sensor 52: Second moving device 53: Guide rail 54: Sliding block 55: Mirror 56: Support member 60: Third camera 70: Control unit 71: Image processing unit 72: Position calculation unit 73: Drive control unit 74: Memory Unit 75: Deformation Amount Calculation Unit 76: Judgment Department 77: Notification Department 78: Parallelism Calculation Unit 100: DUT

Claims

Claim 1 A semiconductor device handling device for handling a DUT, comprising: a first moving device that moves the DUT to bring the terminal of the DUT into contact with the probe needle of a probe card and presses the DUT against the probe card; and an acquiring device that acquires a first state of the probe needle, which is deformed by the pressure of the first moving device when the first moving device presses the DUT against the probe card; wherein the acquiring device comprises a first camera that captures the probe needle and a second moving device that moves the first camera; wherein the semiconductor device handling device comprises a base having an opening into which the probe card is inserted; and wherein the second moving device comprises a guide member provided on the base to surround the opening and a moving part that supports the first camera and is movable over the guide member. Claim 2 delete Claim 3 A semiconductor device handling device according to claim 1, wherein the first camera images the probe needle along a first direction parallel to the main surface of the probe card. Claim 4 delete Claim 5 A semiconductor device handling device according to claim 1, wherein the first camera captures the probe needle along a first direction parallel to the main surface of the probe card, and the second moving device moves the first camera in a second direction, and the second direction is a direction parallel to the main surface of the probe card and also intersects the first direction. Claim 6 delete Claim 7 delete Claim 8 A semiconductor device handling device for handling a DUT, comprising: a first moving device that moves the DUT to bring the terminal of the DUT into contact with the probe needle of a probe card and presses the DUT against the probe card; and an acquiring device that acquires a first state of the probe needle, which is deformed by the pressure of the first moving device when the first moving device presses the DUT against the probe card; wherein the acquiring device comprises a displacement sensor that irradiates a laser light onto the probe needle and a second moving device that moves the displacement sensor; wherein the semiconductor device handling device comprises a base having an opening into which the probe card is inserted; and wherein the second moving device comprises a guide member provided on the base to surround the opening and a moving part that supports the displacement sensor and is capable of moving over the guide member. Claim 9 A semiconductor device handling device according to claim 8, wherein the displacement sensor irradiates the laser light along a first direction parallel to the main surface of the probe card, and the second moving device moves the displacement sensor along a second direction, and the second direction is a direction parallel to the main surface of the probe card and also intersects the first direction. Claim 10 delete Claim 11 In claim 1, the acquisition device is a semiconductor device handling device that acquires three-dimensional shape data of the probe needle viewed from one direction. Claim 12 The semiconductor device handling device of claim 1, wherein the semiconductor device handling device comprises a memory device storing a second state which is a normal state of the probe needle, and a determination device determining whether the first state is normal or abnormal based on the first state and the second state. Claim 13 A semiconductor device handling device according to claim 12, wherein the determination device comprises a deformation amount calculation unit that calculates the deformation amount of the probe needle based on the first state and the second state, and a determination unit that determines whether the first state is normal or abnormal based on the calculation result of the deformation amount calculation unit. Claim 14 The semiconductor device handling device of claim 13, wherein the semiconductor device handling device further comprises a notification device that indicates that the deformation of the probe needle is abnormal when the judgment device determines that the first state is abnormal. Claim 15 A semiconductor device handling device according to claim 1, wherein the acquisition device acquires a third state which is the state of the terminal and the probe needle that are spaced apart from each other, and the semiconductor device handling device has a parallelism calculation device that calculates the parallelism between the probe card and the DUT based on the third state. Claim 16 A semiconductor device test apparatus for testing a DUT, comprising a semiconductor device handling apparatus described in any one of claims 1, 3, 5, 8 to 9 and 11 to 15, a probe card, and a tester electrically connected to the probe card and performing a test of the DUT.

Images