The Electro-conductive Contact Pin

Abstract

The present invention provides an electrically conductive contact pin with improved current allowable capacity.

Description

Technology Field

[0001] The present invention relates to an electrically conductive contact pin. Background Technology

[0002] Electrical characteristic testing of a semiconductor device is performed by a test device equipped with a plurality of electrically conductive contact pins. The test is performed by bringing a semiconductor device (semiconductor wafer or semiconductor package) into the test device and contacting the electrically conductive contact pins with external terminals (solder balls or bumps, etc.) of the semiconductor device. Examples of the test device include a probe card or a test socket, and the electrically conductive contact pins include probe pins or socket pins, but are not limited thereto.

[0003] More specifically, an electrical characteristic test of a semiconductor device is performed by bringing the semiconductor device to a test device having a plurality of electrically conductive contact pins formed on a circuit board and contacting each electrically conductive contact pin to a corresponding external terminal on the semiconductor device. When the electrically conductive contact pins and the external terminals are brought into contact, a process is performed to bring the semiconductor device further into contact with the test device after reaching a state where both begin to make contact. This process is called overdrive. Overdrive is a process that elastically deforms the electrically conductive contact pins, and by overdrive, all electrically conductive contact pins can be reliably brought into contact with the external terminals even if there is a variation in the height of the external terminals or the height of the electrically conductive contact pins. In addition, during overdrive, the electrically conductive contact pins are elastically deformed and their tips move on the external terminals, thereby performing scrubbing. Through this scrubbing, the oxide film on the surface of the external terminals is removed, and contact resistance can be reduced.

[0004] FIG. 1 is a schematic diagram illustrating a probe card (1) according to the prior art.

[0005] Generally, the probe card (1) is configured to include a circuit board (2), a space converter (3) provided on the lower side of the circuit board (2), and a probe head (7) provided on the lower side of the space converter (3).

[0006] The probe head (7) includes a plurality of electrically conductive contact pins (7) and guide plates (5, 6) having guide holes into which the electrically conductive contact pins (7) are inserted. The probe head (7) includes an upper guide plate (5) and a lower guide plate (6), and the upper guide plate (5) and the lower guide plate (6) are fixedly installed through spacers. The electrically conductive contact pins (7) are structured to be installed vertically between the upper guide plate (5) and the lower guide plate (6) and then elastically deformed in the horizontal direction, and a vertical probe card (1) is constructed by adopting such electrically conductive contact pins (7). An electrical characteristic test of a semiconductor device is performed by bringing a semiconductor wafer (W) to the probe card (1) formed with a plurality of electrically conductive contact pins (7) and contacting each electrically conductive contact pin (7) to a corresponding electrode pad (WP) on the semiconductor wafer (W).

[0007] FIG. 2 is a drawing showing an electrically conductive contact pin (7) that is the background of the conception of the present invention, FIG. 3a is a cross-sectional view along A-A' of FIG. 2, and FIG. 3b is a cross-sectional view along B-B' of FIG. 2.

[0008] As illustrated in FIG. 2, the electrically conductive contact pin (7) is configured by alternately stacking a first metal layer (23) and a second metal layer (25) in the thickness direction (±z direction). A total of nine metal layers are stacked by alternately stacking the first metal layer (23) and the second metal layer (25). The metal constituting the first metal layer (23) is palladium-cobalt (PdCo), and the metal constituting the second metal layer (25) is copper (Cu). The first metal layer (23) provides rigidity and elasticity to the electrically conductive contact pin (7), and the second metal layer (25) provides electrical conductivity to the electrically conductive contact pin (7).

[0009] The first connection portion (27) is a part that contacts the semiconductor wafer (W) and is formed with a cross-sectional area smaller than that of the elastic body portion (29). The first connection portion (27) is formed continuously while in contact with some (e.g., 1) of the second metal layers (22) among the plurality (e.g., 4) of second metal layers (22) constituting the elastic body portion (29).

[0010] As a first metal layer (25) with low electrical conductivity is interposed between the second metal layer (23) with high electrical conductivity, the first metal layer (25) with low electrical conductivity functions as a barrier layer that hinders current flow in the thickness direction. As a result, when current flows from the elastic body part (29) to the first connection part (27) or from the first connection part (27) to the elastic body part (29), only some of the multiple second metal layers (22) constituting the elastic body part (29) are individually connected to the first connection part (27). Consequently, there is a problem in that the current carrying capacity (abbreviated as CCC) of the electrically conductive contact pin (7) cannot be improved because the multiple second metal layers (22) constituting the elastic body part (29) cannot be effectively utilized. Prior art literature

[0012] Registration No. 10-1913355 Registered Patent Publication The problem to be solved

[0013] The present invention has been devised to solve the aforementioned problems, and the purpose of the present invention is to provide an electrically conductive contact pin with improved current allowable capacity. means of solving the problem

[0015] To achieve the objective of the present invention, an electrically conductive contact pin according to the present invention comprises: a laminated portion in which a plurality of metal layers, including a first metal layer and a second metal layer, are laminated in the thickness direction of the electrically conductive contact pin; and a vertical conductive portion provided in a through hole penetrating in the thickness direction of the electrically conductive contact pin and connected to the plurality of metal layers.

[0016] In addition, the above-mentioned vertical conductive part is provided as a single metal layer.

[0017] In addition, the metal constituting the first metal layer is selected from rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), phosphorus (Ph) or alloys thereof, or palladium-cobalt (PdCo) alloy, palladium-nickel (PdNi) alloy or nickel-phosphorus (NiPh) alloy, nickel-manganese (NiMn), nickel-cobalt (NiCo) or nickel-tungsten (NiW) alloy, the metal constituting the second metal layer is selected from copper (Cu), silver (Ag), gold (Au) or alloys thereof, and the metal constituting the vertical conductive part is selected from copper (Cu), silver (Ag), gold (Au) or alloys thereof.

[0018] In addition, the vertical conductive portion is formed of the same material as any one of the metal materials constituting the laminated portion.

[0019] In addition, the vertical conductive part is formed of a material different from the metal material constituting the laminated part.

[0020] In addition, the second metal layer and the vertical conductive portion are composed of a metal having a higher electrical conductivity than the first metal layer.

[0021] Additionally, the electrically conductive contact pin includes a plurality of slits formed along the longitudinal direction of the electrically conductive contact pin, wherein the vertical conductive portion is provided in at least one of the plurality of slits.

[0022] In addition, the vertical conductive portion completely fills the interior of the through hole.

[0023] In addition, the vertical conductive part incompletely fills the interior of the through hole.

[0024] In addition, the vertical conductive portion is connected to a plurality of the second metal layers.

[0025] In addition, the vertical conductive part has an internal hole by incompletely filling the interior of the through hole.

[0026] Additionally, it includes a surface layer formed on at least a portion of the surface of the electrically conductive contact pin so as not to expose the surface of the first metal layer to the outside, and composed of the same material as the vertical conductive portion.

[0027] Additionally, the electrically conductive contact pin comprises first and second connection portions provided at both ends; and an elastic body portion provided between the first and second connection portions and elastically deformed by a longitudinal pressure.

[0028] In addition, the vertical conductive part is provided in the elastic body part.

[0029] In addition, the vertical conductive portion is provided in at least one of the first and second connecting portions.

[0030] In addition, the side of the electrically conductive contact pin is provided with a groove formed long along the thickness direction and a plurality of micro-trenches formed parallel to each other along the side of the electrically conductive contact pin. Effects of the invention

[0032] The present invention provides an electrically conductive contact pin with improved current allowable capacity. Brief explanation of the drawing

[0034] FIG. 1 is a drawing illustrating a probe card according to the prior art. FIG. 2 is a perspective view of an electrically conductive contact pin that formed the background of the conception of the present invention. FIG. 3a is a cross-sectional view along A-A' of FIG. 2. FIG. 3b is a cross-sectional view of B-B' in FIG. 2. FIG. 4 is a perspective view of an electrically conductive contact pin according to a preferred first embodiment of the present invention. FIG. 5a is a cross-sectional view along A-A' of FIG. 4. FIG. 5b is a cross-sectional view of B-B' in FIG. 4. FIGS. 6a and 6b are perspective views illustrating modified examples of an electrically conductive contact pin according to a preferred first embodiment of the present invention. FIG. 7a is a perspective view illustrating a modified example of an electrically conductive contact pin according to a preferred first embodiment of the present invention, FIG. 7b is a cross-sectional view taken along A-A' of FIG. 7a, and FIG. 7c is a cross-sectional view taken along B-B' of FIG. 7a. FIG. 8a is a perspective view illustrating a modified example of an electrically conductive contact pin according to a preferred first embodiment of the present invention, FIG. 8b is a cross-sectional view taken along A-A' of FIG. 8a, and FIG. 8c is a cross-sectional view taken along B-B' of FIG. 8a. FIG. 9a is a perspective view illustrating a modified example of an electrically conductive contact pin according to a preferred first embodiment of the present invention, FIG. 9b is a cross-sectional view taken along A-A' of FIG. 9a, and FIG. 9c is a cross-sectional view taken along B-B' of FIG. 9a. FIG. 10a is a perspective view illustrating a modified example of an electrically conductive contact pin according to a preferred first embodiment of the present invention, FIG. 10b is a cross-sectional view taken along A-A' of FIG. 10a, and FIG. 10c is a cross-sectional view taken along B-B' of FIG. 10a. FIG. 11a is a perspective view illustrating a modified example of an electrically conductive contact pin according to a preferred first embodiment of the present invention, FIG. 11b is a cross-sectional view taken along A-A' of FIG. 11a, and FIG. 11c is a cross-sectional view taken along B-B' of FIG. 11a. FIG. 12a is a perspective view illustrating a modified example of an electrically conductive contact pin according to a preferred first embodiment of the present invention, FIG. 12b is a cross-sectional view taken along A-A' of FIG. 12a, and FIG. 12c is a cross-sectional view taken along B-B' of FIG. 12a. FIG. 13a is a perspective view illustrating a modified example of an electrically conductive contact pin according to a preferred first embodiment of the present invention, FIG. 13b is a cross-sectional view taken along A-A' of FIG. 13a, and FIG. 13c is a cross-sectional view taken along B-B' of FIG. 13a. FIG. 14a is a perspective view illustrating a modified example of an electrically conductive contact pin according to a preferred first embodiment of the present invention, FIG. 14b is a cross-sectional view taken along A-A' of FIG. 14a, and FIG. 14c is a cross-sectional view taken along B-B' of FIG. 14a. FIG. 15a is a perspective view illustrating a modified example of an electrically conductive contact pin according to a preferred first embodiment of the present invention, FIG. 15b is a cross-sectional view taken along A-A' of FIG. 15a, and FIG. 15c is a cross-sectional view taken along B-B' of FIG. 15a. FIG. 16a is a perspective view illustrating a modified example of an electrically conductive contact pin according to a preferred first embodiment of the present invention, FIG. 16b is a cross-sectional view taken along A-A' of FIG. 16a, and FIG. 16c is a cross-sectional view taken along B-B' of FIG. 16a. FIG. 17a is a perspective view illustrating a modified example of an electrically conductive contact pin according to a preferred first embodiment of the present invention, FIG. 17b is a cross-sectional view taken along A-A' of FIG. 17a, and FIG. 17c is a cross-sectional view taken along B-B' of FIG. 7a. FIG. 18a is a perspective view illustrating a modified example of an electrically conductive contact pin according to a preferred first embodiment of the present invention, FIG. 18b is a cross-sectional view taken along A-A' of FIG. 18a, and FIG. 18c is a cross-sectional view taken along B-B' of FIG. 18a. FIG. 19a is a perspective view illustrating a modified example of an electrically conductive contact pin according to a preferred first embodiment of the present invention, FIG. 19b is a cross-sectional view taken along A-A' of FIG. 19a, and FIG. 19c is a cross-sectional view taken along B-B' of FIG. 19a. FIG. 20a is a perspective view illustrating a modified example of an electrically conductive contact pin according to a preferred first embodiment of the present invention, FIG. 20b is a cross-sectional view taken along A-A' of FIG. 20a, and FIG. 20c is a cross-sectional view taken along B-B' of FIG. 20a. FIG. 21 is a drawing illustrating an inspection device equipped with an electrically conductive contact pin according to a preferred second embodiment of the present invention. FIG. 22 is a plan view of an electrically conductive contact pin according to a preferred second embodiment of the present invention. FIG. 23 is a perspective view of an electrically conductive contact pin according to a preferred second embodiment of the present invention. FIG. 24 is a drawing showing a part of the side of an electrically conductive contact pin according to a preferred first and second embodiment of the present invention. Specific details for implementing the invention

[0035] The following merely exemplifies the principles of the invention. Therefore, those skilled in the art may invent various devices that embody the principles of the invention and fall within the concept and scope of the invention, even if they are not explicitly described or illustrated in this specification. Furthermore, all conditional terms and embodiments listed in this specification are, in principle, explicitly intended only for the purpose of enabling an understanding of the concept of the invention and should be understood as not being limited to the embodiments and conditions specifically listed as such.

[0036] The aforementioned objectives, features, and advantages will become clearer through the following detailed description in conjunction with the attached drawings, and accordingly, a person skilled in the art to which the invention pertains will be able to easily implement the technical concept of the invention.

[0037] The embodiments described herein will be explained with reference to cross-sectional and / or perspective views, which are exemplary illustrations of the present invention. The thicknesses, etc., of the films and regions depicted in these drawings are exaggerated for the effective explanation of the technical content. The shapes of the exemplary drawings may be modified due to manufacturing techniques and / or tolerances. Furthermore, the number of molded articles depicted in the drawings is merely an illustrative representation of only a portion. Accordingly, the embodiments of the present invention are not limited to the specific shapes depicted but also include variations in shape resulting from the manufacturing process.

[0038] Preferred embodiments of the present invention will be described in detail below with reference to the attached drawings.

[0039] An electrically conductive contact pin (100, 200) according to a preferred embodiment of the present invention is provided in an inspection device and is used to transmit an electrical signal by making electrical and physical contact with an object to be inspected. The inspection device may be an inspection device used in a semiconductor manufacturing process, and as an example, it may be a probe card or a test socket. In this case, the object to be inspected may be a semiconductor device in the form of a semiconductor wafer or a semiconductor package.

[0040] The inspection device includes an electrically conductive contact pin (100, 200) and a guide plate having a through hole for receiving the electrically conductive contact pin (100, 200).

[0041] The electrically conductive contact pin (100, 200) may be a probe pin provided on a probe card or a socket pin provided on a test socket. The electrically conductive contact pin (200) according to the first embodiment below may be a probe pin, and the electrically conductive contact pin (100) according to the second embodiment may be a socket pin. However, the application field of the electrically conductive contact pin (100, 200) according to the preferred embodiment of the present invention is not limited thereto, and any pin used to apply electricity to check for defects in an object to be inspected is included.

[0042] The width direction of the electrically conductive contact pin (100, 200) described below is the ±x direction indicated in the drawing, the length direction of the electrically conductive contact pin (100, 200) is the ±y direction indicated in the drawing, and the thickness direction of the electrically conductive contact pin (100, 200) is the ±z direction indicated in the drawing.

[0043] The electrically conductive contact pin (100, 200) has an overall length dimension in the length direction (±y direction), an overall thickness dimension in the thickness direction perpendicular to the length direction (±z direction), and an overall width dimension in the width direction perpendicular to the length direction (±x direction).

[0044] In describing various embodiments below, for convenience, the same name and reference number will be assigned to components performing the same function, even if the embodiments differ. Additionally, configurations and operations already described in other embodiments will be omitted for convenience.

[0045] Although the first embodiment and its variations have been described separately below, the preferred embodiment of the present invention does not include only the first embodiment and its variations, but also includes variations that combine the configurations of the embodiment and each variation.

[0047] Electrically conductive contact pin (200) according to the first embodiment

[0049] The electrically conductive contact pin (200) according to the first embodiment may be a probe pin used in a probe card. More specifically, it may be a vertical probe pin that is inserted and installed in a guide hole of a guide plate to inspect a semiconductor wafer. Alternatively, the electrically conductive contact pin (200) according to the first embodiment may be a 2D MEMS cantilever pin that is directly connected to a wiring part, such as a space converter, without a guide plate. However, it is not limited thereto. Below, a vertical probe pin is described as an example. The vertical probe pin described here includes both a straight pin structure in which the guide plate is shifted in a specific direction after the probe pin is inserted into the guide plate so that the straight probe pin is elastically deformed in a specific direction, and a cobra pin structure in which the probe pin is elastically deformed through a pre-bent bending part.

[0050] Hereinafter, an electrically conductive contact pin (200) according to a preferred first embodiment of the present invention will be described with reference to FIGS. 4 and FIGS. 5. FIGS. 4 is a perspective view of an electrically conductive contact pin (200) according to a preferred first embodiment of the present invention, FIGS. 5a is a cross-sectional view taken along A-A' of FIGS. 4, and FIGS. 5b is a cross-sectional view taken along B-B' of FIGS. 4.

[0051] The electrically conductive contact pin (200) includes a stacked portion (210) in which a plurality of metal layers, including a first metal layer (101) and a second metal layer (102), are stacked in the thickness direction (±z direction) of the electrically conductive contact pin (200), and a vertical conductive portion (230) provided in a through hole penetrating in the thickness direction (±z direction) of the electrically conductive contact pin (200) and connected to the plurality of metal layers.

[0052] The vertical conductive portion (230) completely fills the interior of the through hole. That is, the vertical conductive portion (230) completely fills the interior of the through hole without any gaps.

[0053] The first metal layer (101) is a metal having relatively high wear resistance or elastic modulus compared to the second metal layer (102), and preferably can be formed from a metal selected from rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), phosphorus (Ph) or alloys thereof, or palladium-cobalt (PdCo) alloy, palladium-nickel (PdNi) alloy or nickel-phosphorus (NiPh) alloy, nickel-manganese (NiMn), nickel-cobalt (NiCo) or nickel-tungsten (NiW) alloy. The second metal layer (102) is a metal having relatively high electrical conductivity compared to the first metal layer (101), and preferably can be formed from a metal selected from copper (Cu), silver (Ag), gold (Au) or alloys thereof.

[0054] The first metal layer (101) is provided on the lower and upper surfaces in the thickness direction (±z direction) of the electrically conductive contact pin (100a), and the second metal layer (102) is provided between the first metal layer (101). For example, the stacked portion (210) is provided by alternately stacking the first metal layer (101), the second metal layer (102), and the first metal layer (101), and the number of stacked layers can be composed of three or more layers. For example, the stacked portion (210) is provided with a total of nine metal layers stacked in the thickness direction (±z direction), with five first metal layers (101) and four second metal layers (102).

[0055] The vertical conductive portion (230) may be formed of a metal selected from copper (Cu), silver (Ag), gold (Au), or an alloy thereof. The vertical conductive portion (230) is provided with a single metal layer. The vertical conductive portion (230) may be formed of the same material as any one of the metal materials constituting the laminated portion (210).

[0056] The second metal layer (102) and the vertical conductive part (230) may be made of the same metal material. The second metal layer (102) and the vertical conductive part (230) may be formed from the same metal selected from copper (Cu), silver (Ag), and gold (Au). For example, the stacked part (210) may be composed of layers stacked in the order of palladium-cobalt (PdCo) alloy - copper (Cu) - palladium-cobalt (PdCo) alloy - copper (Cu) - palladium-cobalt (PdCo) alloy, and the vertical conductive part (230) may be composed of copper (Cu).

[0057] The electrically conductive contact pin (200) includes first and second connection portions (253, 255) provided at both ends, and an elastic body portion (250) provided between the first and second connection portions (253, 255) and elastically deformed by a longitudinal pressure. The first connection portion (253) is a portion that contacts the semiconductor wafer side, and the second connection portion (255) is a portion that contacts the circuit board side. The first connection portion (253), the second connection portion (255), and the elastic body portion (250) may be provided by stacking a first metal layer (101) and a second metal layer (102). That is, the first connection portion (253), the second connection portion (255), and the elastic body portion (250) constitute a stacked portion (210).

[0058] A vertical conductive portion (230) is provided in an elastic body portion (250). The vertical conductive portion (230) is provided within the area of ​​the elastic body portion (250), and surfaces other than the upper and lower surfaces of the vertical conductive portion (230) are not exposed by the elastic body portion (250).

[0059] The vertical conductive section (230) connects a plurality of second metal layers (102) that are spaced apart from each other by the first metal layer (101) in the thickness direction (±z direction). The plurality of second metal layers (102) are connected to the vertical conductive section (230). That is, the second metal layers (102) provided in different layers are electrically connected to each other by the vertical conductive section (230). The second metal layer (102) constituting the elastic body section (250) and the second metal layer (102) constituting the first connection section (253) are connected to each other through the vertical conductive section (230), which has a higher electrical conductivity than the first metal layer (101).

[0060] The cross-sectional area of ​​the first connection part (253) may be configured to be smaller than the cross-sectional area of ​​the elastic body part (250). As a result, the number of metal layers constituting the first connection part (253) may be formed to be smaller than the number of metal layers constituting the elastic body part (250). The first connection part (253) may be composed of a total of three metal layers, in which two first metal layers (101) and one second metal layer (102) are stacked, and the second connection part (255) and the elastic body part (250) may be composed of a total of nine metal layers, in which five first metal layers (101) and four second metal layers (102) are stacked. The four second metal layers (102) constituting the elastic body part (250) are conductive with the one second metal layer (102) constituting the first connection part (253) through the vertical conductive part (230). That is, the second metal layer (102) located on the 2nd, 4th, 6th, and 8th layers of the elastic body part (250) is electrically connected to the second metal layer (102) located on the 2nd layer of the first connection part (253) through the vertical conduction part (230).

[0061] An electrically conductive contact pin (200) is provided between a test object (semiconductor wafer) and a circuit board, is electrically connected to the test object, and undergoes elastic deformation by pressure. In order for the electrically conductive contact pin (200) to have high rigidity and electrical conductivity simultaneously, the laminated portion (210) alternately laminates a first metal layer (101) that provides high elasticity and rigidity and a second metal layer (102) that provides high electrical conductivity. However, a first metal layer (101) with relatively low electrical conductivity is positioned between the second metal layers (102) with relatively high electrical conductivity. Since the first metal layer (101) interposed between the second metal layers (102) has relatively high electrical resistance, it hinders the flow of current between the second metal layers (102). As a result, the second metal layers (102) with high electrical conductivity cannot be utilized entirely, thus limiting the improvement of the current allowable capacity (CCC) of the electrically conductive contact pin (200).

[0062] However, according to a preferred embodiment of the present invention, the second metal layers (102) are electrically connected to each other through a vertical conduction section (230) composed of a metal having a higher electrical conductivity than the first metal layer (101). Even though the first metal layer (101) is interposed between the second metal layers (102), the second metal layers (102) are electrically connected to each other through the vertical conduction section (230). Since the second metal layers (102) and the vertical conduction section (230) have higher electrical conductivity than the first metal layer (101), all of the multiple second metal layers (102) can be effectively utilized as current flow paths. In other words, when current flows from the first connection part (253) to the second connection part (255) or from the first connection part (255) to the first connection part (253) along the longitudinal direction (±y direction) of the electrically conductive contact pin (200), all of the multiple second metal layers (102) in the current flow path can be effectively utilized as current flow paths. As a result, the current allowable capacity (CCC) of the electrically conductive contact pin (200) is improved.

[0063] The vertical conductive portion (230) is provided on the end side of the elastic body portion (250). Among the two ends of the elastic body portion (250), the vertical conductive portion (230) is located on the end side of the first connection portion (253). The first connection portion (253) functions as a tip portion that contacts the semiconductor wafer, and after long-term use, the first connection portion (253) is ground down and reused. This is because foreign matter accumulates on the end side of the first connection portion (253) when the electrically conductive contact pin (200) is used for a long time. When the first connection portion (253) functioning as a tip portion is completely worn out, the electrically conductive contact pin (200) is replaced with a new electrically conductive contact pin (200) and used. Therefore, to prevent a significant difference in current allowable capacity (CCC) during grinding and reuse, the current vertical conduction part (230) is not provided in the first connection part (253) which functions as a tip part, but is provided in the elastic body part (250).

[0064] A second metal layer (102) is positioned on one side (direction of the first connection part (253)) and the other side (direction of the second connection part (255)) in the longitudinal direction (±y direction) relative to the vertical conduction part (230). When examining the current flow along the second metal layer (102) from the second connection part (255) toward the first connection part (253), the current flowing through the second metal layer (102) located on the other side (direction of the second connection part (255)) in the longitudinal direction (±y direction) relative to the vertical conduction part (230) passes through the vertical conduction part (230) and flows to the second metal layer (102) of the first connection part (253). In this unidirectional current flow path, among the second metal layers (102) provided on one side of the vertical conduction section (230) (direction of the first connection section (253)), the second metal layer (102) that is not connected to the second metal layer (102) of the first connection section (253) is not involved. As the portion of the second metal layer (102) provided on one side of the vertical conduction section (230) (direction of the first connection section (253)) that is not connected to the second metal layer (102) of the first connection section (253) is smaller, the current allowable capacity (CCC) of the electrically conductive contact pin (200) is improved. Accordingly, the vertical conduction section (230) is provided on the end side of the elastic body section (250).

[0065] Hereinafter, a modified example of the electrically conductive contact pin (200) according to a preferred first embodiment of the present invention will be described. However, the description will focus on the characteristic components compared to the first embodiment described above, and descriptions of components identical or similar to those of the first embodiment will be omitted as much as possible.

[0066] FIGS. 6a and FIGS. 6b are perspective views illustrating modified examples of an electrically conductive contact pin (200) according to a preferred first embodiment of the present invention.

[0067] As shown in FIG. 6a, vertical conductive portions (230) are provided at each end of the electrically conductive contact pin (200). More specifically, vertical conductive portions (230) are provided at each end of the elastic body portion (250).

[0068] Or, as shown in FIG. 6b, the vertical conductive portion (230) is provided on the central side of the electrically conductive contact pin (200). More preferably, the vertical conductive portion (230) is provided on the central side of the elastic body portion (250).

[0069] FIG. 7a is a perspective view illustrating a modified example of an electrically conductive contact pin (200) according to a preferred first embodiment of the present invention, FIG. 7b is a cross-sectional view taken along A-A' of FIG. 7a, and FIG. 7c is a cross-sectional view taken along B-B' of FIG. 7a.

[0070] As illustrated in FIGS. 7a to 7c, the vertical conductive portion (230) is provided on the end surface of the elastic body portion (250). That is, the vertical conductive portion (230) is provided on the boundary surface between the first connection portion (253) and the elastic body portion (250). The second metal layer (102) constituting the elastic body portion (250) is located only on the other side relative to the vertical conductive portion (230). Through this, on a unidirectional current flow path, the second metal layer (102) located on the other side (direction of the second connection portion (255)) in the longitudinal direction (±y direction) relative to the vertical conductive portion (230) is entirely connected to the second metal layer (102) of the first connection portion (253). Through this, the current allowable capacity (CCC) of the electrically conductive contact pin (200) is improved.

[0071] FIG. 8a is a perspective view illustrating a modified example of an electrically conductive contact pin (200) according to a preferred first embodiment of the present invention, FIG. 8b is a cross-sectional view taken along A-A' of FIG. 8a, and FIG. 8c is a cross-sectional view taken along B-B' of FIG. 8a.

[0072] As illustrated in FIGS. 8a to 8c, the vertical conduction section (230) is formed to be long along the length direction of the electrically conductive contact pin (200). That is, the length in the width direction (±x direction) of the vertical conduction section (230) is formed to be shorter than the length in the length direction (±y direction) of the vertical conduction section (230).

[0073] FIG. 9a is a perspective view illustrating a modified example of an electrically conductive contact pin (200) according to a preferred first embodiment of the present invention, FIG. 9b is a cross-sectional view taken along A-A' of FIG. 9a, and FIG. 9c is a cross-sectional view taken along B-B' of FIG. 9a.

[0074] As illustrated in FIGS. 9a to 9c, the vertical conductive portion (230) incompletely fills the interior of the through hole. The through hole is provided to extend long along the width direction (±x direction) of the electrically conductive contact pin (200).

[0075] The vertical conduction section (230) covers the first metal layer (101) so that it is not exposed on the inner wall of the through hole, but does not completely fill the inside of the through hole. Accordingly, an inner hole (231) is provided inside the vertical conduction section (230).

[0076] The electrically conductive contact pin (200) is provided with a surface layer (263). The surface layer (263) is provided over the entire surface of the electrically conductive contact pin (200) and is provided continuously with the vertical conductive portion (230).

[0077] The surface layer (263) is formed on at least a portion of the surface of the electrically conductive contact pin (200) so that the surface of the first metal layer (101) is not exposed to the outside, and is composed of the same material or a different material as the vertical conductive portion (230).

[0078] The surface layer (263) may be a metal of the same material as the vertical conductive portion (230). For example, the laminated portion (210) may be composed of layers stacked in the order of palladium-cobalt (PdCo) alloy - gold (Au) - palladium-cobalt (PdCo) alloy - gold (Au) - palladium-cobalt (PdCo) alloy, and the vertical conductive portion (230) and the surface layer (263) may be composed of gold (Au). As a result, the entire surface of the electrically conductive contact pin (200) may be provided in a form in which a metal of gold (Au) material is formed. This may be a structure in which a palladium-cobalt (PdCo) alloy is provided within the gold (Au) metal while being spaced apart from each other vertically, and the inner wall of the inner hole (231) is coated with a metal of gold (Au). This allows the current allowable capacity (CCC) of the electrically conductive contact pin (200) to be improved.

[0079] Meanwhile, the surface layer (263) may be a metal of a different material than the vertical conductive part (230). The surface layer (263) may be a metal with high wear resistance. For example, the laminated part (210) may be composed of layers stacked in the order of palladium-cobalt (PdCo) alloy - gold (Au) - palladium-cobalt (PdCo) alloy - gold (Au) - palladium-cobalt (PdCo) alloy, the vertical conductive part (230) may be composed of gold (Au), and the surface layer (263) may be composed of palladium-cobalt (PdCo) alloy. This not only improves the current allowable capacity (CCC) of the electrically conductive contact pin (200) but also improves the wear resistance of the surface. In this case, the surface layer (263) is formed of a metal with high wear resistance, such as a palladium-cobalt (PdCo) alloy, but is not limited to a palladium-cobalt (PdCo) alloy and may be a metal selected from rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), phosphorus (Ph) or alloys thereof, or a palladium-cobalt (PdCo) alloy, a palladium-nickel (PdNi) alloy or a nickel-phosphorus (NiPh) alloy, a nickel-manganese (NiMn), a nickel-cobalt (NiCo) alloy or a nickel-tungsten (NiW) alloy.

[0080] Meanwhile, the surface layer (263) may be composed of an insulating material. For example, it may be composed of an insulating material such as parlene to prevent short circuits caused by contact between electrically conductive contact pins (200) when they are arranged in a narrow pitch.

[0081] FIG. 10a is a perspective view illustrating a modified example of an electrically conductive contact pin (200) according to a preferred first embodiment of the present invention, FIG. 10b is a cross-sectional view taken along A-A' of FIG. 10a, and FIG. 10c is a cross-sectional view taken along B-B' of FIG. 10a.

[0082] The modified example illustrated in FIGS. 9a to 9c is configured such that the surface layer (263) is formed entirely on the surface of the electrically conductive contact pin (200), whereas the modified example illustrated in FIGS. 10a to 10c is configured such that the surface layer (263) is formed only on a part of the surface of the electrically conductive contact pin (200), and the rest of the configuration is the same.

[0083] The surface layer (263) may be formed only in the surrounding area relative to the vertical conductive portion (230). There is an area where the surface layer (263) is not present between the surface layer (263) and one end of the electrically conductive contact pin (200), and there is also an area where the surface layer (263) is not present between the surface layer (263) and the other end of the electrically conductive contact pin (200). The vertical conductive portion (230) is provided within the area where the surface layer (263) is provided.

[0084] Generally, in the case of a vertical probe pin, two spaced-apart guide plates are used to support the probe pin. When the electrically conductive contact pin (200) according to an embodiment of the present invention is inserted into the two guide plates, the formation location of the vertical conductive portion (230) and the surface layer (263) is a location that is not inserted into the guide plate. In other words, the vertical conductive portion (230) and the surface layer (263) are preferably provided at a location that does not correspond to the hole location of the guide plate (reference numerals 5 and 6 in FIG. 1). The electrically conductive contact pin (200) is inserted into the hole of the guide plate and slides into contact with the inner wall of the hole of the guide plate by means of pressure. At this time, since the location of the vertical conductive portion (230) and the surface layer (263) does not correspond to the hole location of the guide plate, it is possible to prevent the vertical conductive portion (230) and the surface layer (263) from wearing out due to sliding contact.

[0085] FIG. 11a is a perspective view illustrating a modified example of an electrically conductive contact pin (200) according to a preferred first embodiment of the present invention, FIG. 11b is a cross-sectional view taken along A-A' of FIG. 11a, and FIG. 11c is a cross-sectional view taken along B-B' of FIG. 11a.

[0086] As illustrated in FIGS. 11a to 11c, the vertical conductive portion (230) incompletely fills the interior of the through hole. The through hole is provided by extending long along the longitudinal direction (±y direction) of the electrically conductive contact pin (200). Although only one through hole is shown, multiple through holes may be provided differently. The vertical conductive portion (230) covers the first metal layer (101) so that it is not exposed on the inner wall of the through hole, but does not completely fill the interior of the through hole. Accordingly, an inner hole (231) is provided inside the vertical conductive portion (230).

[0087] The electrically conductive contact pin (200) is provided with a surface layer (263). The surface layer (263) is formed on at least a portion of the surface of the electrically conductive contact pin (200) so that the surface of the first metal layer (101) is not exposed to the outside, and is made of the same material as the vertical conductive portion (230). As shown in FIGS. 11a to 11c, the surface layer (263) is provided over the entire surface of the electrically conductive contact pin (200) and is provided continuously with the vertical conductive portion (230).

[0088] The surface layer (263) is formed on at least a portion of the surface of the electrically conductive contact pin (200) so that the surface of the first metal layer (101) is not exposed to the outside, and is composed of the same material or a different material as the vertical conductive portion (230).

[0089] The surface layer (263) may be a metal of the same material as the vertical conductive portion (230). For example, the laminated portion (210) may be composed of layers stacked in the order of palladium-cobalt (PdCo) alloy - gold (Au) - palladium-cobalt (PdCo) alloy - gold (Au) - palladium-cobalt (PdCo) alloy, and the vertical conductive portion (230) and the surface layer (263) may be composed of gold (Au). As a result, the entire surface of the electrically conductive contact pin (200) may be provided in a form in which a metal of gold (Au) material is formed. This may be a structure in which a palladium-cobalt (PdCo) alloy is provided within the gold (Au) metal while being spaced apart from each other vertically, and the inner wall of the inner hole (231) is coated with a metal of gold (Au). This allows the current allowable capacity (CCC) of the electrically conductive contact pin (200) to be improved.

[0090] Meanwhile, the surface layer (263) may be a metal of a different material than the vertical conductive part (230). The surface layer (263) may be a metal with high wear resistance. For example, the laminated part (210) may be composed of layers stacked in the order of palladium-cobalt (PdCo) alloy - gold (Au) - palladium-cobalt (PdCo) alloy - gold (Au) - palladium-cobalt (PdCo) alloy, the vertical conductive part (230) may be composed of gold (Au), and the surface layer (263) may be composed of palladium-cobalt (PdCo) alloy. This not only improves the current allowable capacity (CCC) of the electrically conductive contact pin (200) but also improves the wear resistance of the surface. In this case, the surface layer (263) is formed of a metal with high wear resistance, such as a palladium-cobalt (PdCo) alloy, but is not limited to a palladium-cobalt (PdCo) alloy and may be a metal selected from rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), phosphorus (Ph) or alloys thereof, or a palladium-cobalt (PdCo) alloy, a palladium-nickel (PdNi) alloy or a nickel-phosphorus (NiPh) alloy, a nickel-manganese (NiMn), a nickel-cobalt (NiCo) alloy or a nickel-tungsten (NiW) alloy.

[0091] Meanwhile, the surface layer (263) may be composed of an insulating material. For example, it may be composed of an insulating material such as parlene to prevent short circuits caused by contact between electrically conductive contact pins (200) when they are arranged in a narrow pitch.

[0092] FIG. 12a is a perspective view illustrating a modified example of an electrically conductive contact pin (200) according to a preferred first embodiment of the present invention, FIG. 12b is a cross-sectional view taken along A-A' of FIG. 12a, and FIG. 12c is a cross-sectional view taken along B-B' of FIG. 12a.

[0093] As illustrated in FIGS. 12a to 12c, the vertical conduction section (230) is formed along the entire length along the longitudinal direction (±y direction) of the electrically conductive contact pin (200). One end of the vertical conduction section (230) is located at one end of the electrically conductive contact pin (200), and the other end of the vertical conduction section (230) is located at the other end of the electrically conductive contact pin (200). That is, the vertical conduction section (230) is formed continuously along the longitudinal direction of the electrically conductive contact pin (200) from one end to the other end of the electrically conductive contact pin (200).

[0094] FIG. 13a is a perspective view illustrating a modified example of an electrically conductive contact pin (200) according to a preferred first embodiment of the present invention, FIG. 13b is a cross-sectional view taken along A-A' of FIG. 13a, and FIG. 13c is a cross-sectional view taken along B-B' of FIG. 13a.

[0095] As illustrated in FIGS. 13a to 13c, the vertical conductive portion (230) is formed along the longitudinal direction (±y direction) of the electrically conductive contact pin (200) and is formed over a portion of the total length. That is, the vertical conductive portion (230) is formed on the elastic body portion (250) but not on the protruding first connection portion (253). This is to ensure that the amount of the vertical conductive portion (230) is not reduced when the first connection portion (253) is ground down and reused.

[0096] FIG. 14a is a perspective view illustrating a modified example of an electrically conductive contact pin (200) according to a preferred first embodiment of the present invention, FIG. 14b is a cross-sectional view taken along A-A' of FIG. 14a, and FIG. 14c is a cross-sectional view taken along B-B' of FIG. 14a.

[0097] As illustrated in FIGS. 14a to 14c, the electrically conductive contact pin (200) includes a plurality of slits (251) formed along the longitudinal direction of the electrically conductive contact pin (200), wherein a vertical conductive portion (230) is provided in at least one of the plurality of slits (251). The slit (251) in which the vertical conductive portion (230) is provided may correspond to the through hole described above. Among the plurality of slits (251), there are slits (251) in which the vertical conductive portion (230) is provided inside, and slits (251) in which the vertical conductive portion (230) is not provided inside. A vertical conductive portion (230) provided inside the slit (251) performs the function of connecting a plurality of second metal layers (102) constituting the laminated portion (210), and a slit (251) not provided with a vertical conductive portion (230) performs the function of allowing the elastic body portion (250) to be elastically deformed more easily.

[0098] For example, as illustrated in FIGS. 14a to 14c, three slits (251) are formed, a vertical conductive portion (230) is formed in the central slit (251), and the slits (251) located on both sides are provided in a form that penetrates in the thickness direction (±z direction) of the electrically conductive contact pin (200). Through this, the electrically conductive contact pin (200) is in a 3-beam shape, and the current allowable capacity (CCC) is improved.

[0099] FIG. 15a is a perspective view illustrating a modified example of an electrically conductive contact pin (200) according to a preferred first embodiment of the present invention, FIG. 15b is a cross-sectional view taken along A-A' of FIG. 15a, and FIG. 15c is a cross-sectional view taken along B-B' of FIG. 15a.

[0100] As illustrated in FIGS. 15a to 15c, a plurality of vertical conductive portions (230) are provided. The vertical conductive portions (230) are provided spaced apart from each other along the width direction (±x direction) of the electrically conductive contact pin (200). Although three vertical conductive portions (230) are shown in the drawings, they are not limited thereto.

[0101] FIG. 16a is a perspective view illustrating a modified example of an electrically conductive contact pin (200) according to a preferred first embodiment of the present invention, FIG. 16b is a cross-sectional view taken along A-A' of FIG. 16a, and FIG. 16c is a cross-sectional view taken along B-B' of FIG. 16a.

[0102] The vertical conductive portion (230) may be formed of a material different from any one of the metal materials constituting the laminated portion (210). The vertical conductive portion (230) may be formed of a metal selected from copper (Cu), silver (Ag), gold (Au), or an alloy thereof. The vertical conductive portion (230) is provided as a single metal layer.

[0103] For example, the laminated portion (210) is composed of layers stacked in the order of palladium-cobalt (PdCo) alloy - copper (Cu) - palladium-cobalt (PdCo) alloy - copper (Cu) - palladium-cobalt (PdCo) alloy, and the vertical conductive portion (230) can be composed of gold (Au).

[0104] FIG. 17a is a perspective view illustrating a modified example of an electrically conductive contact pin (200) according to a preferred first embodiment of the present invention, FIG. 17b is a cross-sectional view taken along A-A' of FIG. 17a, and FIG. 17c is a cross-sectional view taken along B-B' of FIG. 7a.

[0105] The vertical conduction section (230) may be configured such that at least a portion of its cross-sectional shape along the xy plane has curvature. For example, the vertical conduction section (230) may be configured such that its cross-sectional shape along the xy plane is circular. This prevents stress concentration at the boundary between the vertical conduction section (230) and the first metal layer (101).

[0106] FIG. 18a is a perspective view illustrating a modified example of an electrically conductive contact pin (200) according to a preferred first embodiment of the present invention, FIG. 18b is a cross-sectional view taken along A-A' of FIG. 18a, and FIG. 18c is a cross-sectional view taken along B-B' of FIG. 18a.

[0107] The first connection portion (253) of the electrically conductive contact pin (200) has a cross-sectional area smaller than that of the elastic body portion (250) and is provided on the central axis in the longitudinal direction (±y direction) of the elastic body portion (250).

[0108] FIG. 19a is a perspective view illustrating a modified example of an electrically conductive contact pin (200) according to a preferred first embodiment of the present invention, FIG. 19b is a cross-sectional view taken along A-A' of FIG. 19a, and FIG. 19c is a cross-sectional view taken along B-B' of FIG. 19a.

[0109] A portion of the first connection part (253) is embedded within the elastic body part (250).

[0110] The first connecting part (253) may be formed from a metal selected from rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), phosphorus (Ph) or alloys thereof, or palladium-cobalt (PdCo) alloy, palladium-nickel (PdNi) alloy or nickel-phosphorus (NiPh) alloy, nickel-manganese (NiMn), nickel-cobalt (NiCo) or nickel-tungsten (NiW) alloy in order to improve wear resistance.

[0111] The elastic body portion (250) is composed of a plurality of stacked metal layers, and the first connection portion (253) is composed of a single metal layer. Additionally, the first connection portion contacts a plurality of metal layers provided in the height direction (±z direction) of the elastic body portion (250) at the joint surface with the elastic body portion (250).

[0112] The first connecting portion (253) may be formed of a metal of the same material as the first metal layer (101) constituting the elastic body portion (250). The first metal layer (101) of the elastic body portion (250) and the first connecting portion (253) may be formed of a metal selected from rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), phosphorus (Ph), or alloys thereof, or a palladium-cobalt (PdCo) alloy, a palladium-nickel (PdNi) alloy, a nickel-phosphorus (NiPh) alloy, a nickel-manganese (NiMn), a nickel-cobalt (NiCo), or a nickel-tungsten (NiW) alloy, as a metal of the same material. For example, the elastic body part (250) is configured by stacking in the order of palladium-cobalt (PdCo) alloy - copper (Cu) - palladium-cobalt (PdCo) alloy - copper (Cu) - palladium-cobalt (PdCo) alloy, the vertical conduction part (230) is composed of copper (Cu), and the first connection part (253) can be composed of palladium-cobalt (PdCo) alloy.

[0113] The first connecting part (253) is composed of a different material as the first metal layer (101) constituting the elastic body part (250). For example, the laminated part (210) is composed of a stack of palladium-cobalt (PdCo) alloy - copper (Cu) - palladium-cobalt (PdCo) alloy - copper (Cu) - palladium-cobalt (PdCo) alloy, the vertical conductive part (230) is composed of copper (Cu), and the first connecting part (253) can be composed of rhodium (Rh).

[0114] The first connection portion (253) of the electrically conductive contact pin (200) has a cross-sectional area smaller than that of the elastic body portion (250) and is provided eccentrically in the thickness direction (±z direction) on the central axis in the length direction (±y direction) of the elastic body portion (250).

[0115] A portion of the vertical conduction section (230) is configured to be in contact with the first connection section (253), so that the current passing through the first connection section (253) can flow directly to the vertical conduction section (230). Since there is no metal with low electrical conductivity between the vertical conduction section (230) and the first connection section (253), it is possible to prevent the current allowable capacity (CCC) from decreasing.

[0116] FIG. 20a is a perspective view illustrating a modified example of an electrically conductive contact pin (200) according to a preferred first embodiment of the present invention, FIG. 20b is a cross-sectional view taken along A-A' of FIG. 20a, and FIG. 20c is a cross-sectional view taken along B-B' of FIG. 20a.

[0117] The vertical conductor (230) is configured in the shape of a “#”. That is, the vertical conductor (230) is configured such that two vertical conductors (230) extended in the length direction (±y direction) and two vertical conductors extended in the width direction (±x direction) intersect each other.

[0119] Electrically conductive contact pin (100) according to the second embodiment

[0121] The electrically conductive contact pin (100) according to the second embodiment may be a socket pin used in a test socket. More specifically, it may be a socket pin inserted and installed in a guide hole of a guide plate to inspect a semiconductor package. However, it is not limited thereto.

[0122] Hereinafter, an electrically conductive contact pin (100) according to a preferred second embodiment of the present invention will be described with reference to FIGS. 21 to 23. FIG. 21 is a drawing showing an inspection device (11) equipped with an electrically conductive contact pin (100) according to a preferred second embodiment of the present invention, FIG. 22 is a plan view of an electrically conductive contact pin (100) according to a preferred second embodiment of the present invention, and FIG. 23 is a perspective view of an electrically conductive contact pin (100) according to a preferred second embodiment of the present invention.

[0123] The electrically conductive contact pin (100) has an overall length dimension (L) in the length direction (±y direction), an overall thickness dimension (H) in the thickness direction (±z direction) perpendicular to the length direction, and an overall width dimension (W) in the width direction (±x direction) perpendicular to the length direction.

[0124] The inspection device (11) includes an insert (50) having a receiving portion for receiving a semiconductor package (80), a guide plate (30) into which an electrically conductive contact pin (100) is inserted and installed, and a pusher (40) for pressing the semiconductor package (100).

[0125] A plurality of electrically conductive contact pins (80) are installed on the guide plate (30). The insert (50) accommodates the semiconductor package (80) so that testing can be performed on the semiconductor package (80) in a stable state. An insert film (90) with a hole provided to guide the terminal (85) of the semiconductor package (80) is installed at the bottom of the insert (50). The insert film (90) is provided between the semiconductor package (80) and the electrically conductive contact pins (100). When inspecting the semiconductor package (80), the insert film (90) guides the terminal (85) of the semiconductor package (80) into the hole provided in the insert film (90) to guide the correct contact position. The pusher (40) serves to apply a constant pressure to the semiconductor package (80) seated in the storage portion of the insert (50). A semiconductor package (80) that is pressed by a pusher (40) can be electrically connected to a pad (65) of a circuit board (60) through an electrically conductive contact pin (100) installed on a guide plate (30).

[0126] The lower part of the insert (50) is provided with a fixing pin (21) for fixing the insert film (90) to the insert (50) and an alignment key (22) for precisely adjusting the position of the insert film (90). The fixing pin (21) and the alignment key (22) are provided as interference members (20) and are provided protruding downward from the lower part of the insert (50). A structure that supports the semiconductor package (8) without the insert film (9) is also possible, in which case the interference member (20) may be a support ledge (not shown) that supports the edge of the semiconductor package (8) on the lower part of the insert (5). The interference member (20) is provided protruding downward from the terminal of the semiconductor package (80) while the semiconductor package (80) is received in the receiving part of the insert (50).

[0127] The electrically conductive contact pin (100) includes first and second connection parts (110, 120) provided at both ends, and an elastic body part (150) provided between the first and second connection parts (110, 120) and elastically deformed by a longitudinal pressure. More specifically, the electrically conductive contact pin (100) includes a first connection part (110), a second connection part (120), a support part (130) extending in the longitudinal direction, an elastic body part (150) connected to the first connection part (110) and the second connection part (120) and elastically deformable along the longitudinal direction, and a connection part (140) connecting the elastic body part (150) to the support part (130).

[0128] The vertical conductive portion (230) may be provided in at least one of the first connecting portion (110), the second connecting portion (120), the support portion (130), the elastic body portion (150), and the connecting portion (140). Preferably, the vertical conductive portion (230) may be provided in at least one of the first connecting portion (110) and the second connecting portion (120), and in the drawing, the vertical conductive portion (230) is shown to be provided in the first connecting portion (110) and the second connecting portion (120).

[0129] The electrically conductive contact pin (100) includes a laminated portion (210) in which a plurality of metal layers, including a first metal layer (101) and a second metal layer (102), are laminated in the thickness direction (±z direction) of the electrically conductive contact pin (100), and a vertical conductive portion (230) that is provided in a through hole penetrating in the thickness direction (±z direction) of the electrically conductive contact pin (200) and is connected to the plurality of metal layers. Since the first connection portion (110), the second connection portion (120), the support portion (130), the elastic body portion (150), and the connection portion (140) are all provided by the first metal layer (101) and the second metal layer (102) being laminated, the laminated portion (210) may be a term referring to these.

[0130] The configuration of the vertical conduction section (230) in the second embodiment may adopt the configuration of the vertical conduction section (230) in the first embodiment and its variations. Therefore, the vertical conduction section (230) in the second embodiment is to adopt the configuration of the vertical conduction section (230) in the first embodiment and its variations, and a description thereof is omitted below.

[0131] The first connection part (110), the second connection part (120), the support part (130), the connecting part (140), and the elastic body part (150) are provided as a single unit. The first connection part (110), the second connection part (120), the support part (130), the connecting part (140), and the elastic body part (150) are manufactured all at once using a plating process.

[0132] The shape at each cross-section in the thickness direction (±z direction) of the electrically conductive contact pin (100) is identical. In other words, the same shape on the xy plane is extended and formed in the thickness direction (±z direction).

[0133] The electrically conductive contact pin (100) is provided with a plurality of heterogeneous metal layers stacked in the thickness direction (±z direction). The plurality of heterogeneous metal layers include a first metal layer (101) and a second metal layer (102).

[0134] The first metal layer (101) is a metal with relatively higher rigidity compared to the second metal layer (102), and preferably may be formed from a metal selected from rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), phosphorus (Ph), or alloys thereof, or from a palladium-cobalt (PdCo) alloy, a palladium-nickel (PdNi) alloy, a nickel-phosphorus (NiPh) alloy, a nickel-manganese (NiMn), a nickel-cobalt (NiCo), or a nickel-tungsten (NiW) alloy. The second metal layer (102) is a metal with relatively higher electrical conductivity compared to the first metal layer (101), and preferably may be formed from a metal selected from copper (Cu), silver (Ag), gold (Au), or alloys thereof. However, it is not limited thereto.

[0135] A first metal layer (101) is provided on the lower and upper surfaces in the thickness direction (±z direction) of the electrically conductive contact pin (100), and a second metal layer (102) is provided between the first metal layer (101). For example, the electrically conductive contact pin (100) is provided by alternately stacking the first metal layer (101), the second metal layer (102), and the first metal layer (101) in the thickness direction (±z direction), and the number of stacked layers can be composed of three or more layers.

[0136] The first connection portion (110) includes a first contact portion (111) that contacts a terminal (85) of a semiconductor package (80), and a first flange (113) that extends downward from the first contact portion (111). The first flange (113) is provided between the elastic body portion (150) and the support portion (130), and is provided to cover at least a portion of the elastic body portion (150) from the outside. When the elastic body portion (150) is elastically deformed, the first contact portion (111) and the first flange (113) behave as a single unit.

[0137] The first contact portion (111) is a part that contacts the terminal (85) of the semiconductor package (80).

[0138] Since the first contact portion (110) is connected to the elastic body portion (150), the first connection portion (110) can move vertically elastically by contact pressure.

[0139] When inspecting the semiconductor package (80), the terminal (85) of the semiconductor package (80) moves downward while coming into contact with the upper surface of the first connection part (110). Accordingly, the elastic body part (150) connected to the first connection part (110) is compressed and deformed. The first connection part (110) moves downward.

[0140] The first flange (113) of the first connection part (110) is configured to extend downward from the first contact part (111) and cover at least a portion of the side of the elastic body part (150). Here, the first flange (113) extends downward continuously from the width direction end of the first contact part (111). The first flange (113) extends downward from the first contact part (111) in the -y direction, and at least a portion of the first flange (113) is provided between the elastic body part (150) and the support part (130).

[0141] The elastic body part (150) elastically deforms so that the first connecting part (110) and the second connecting part (120) are displaced relative to each other. The connecting part (140) connects the elastic body part (150) and the support part (130) to each other. In other words, the connecting part (140) connects the elastic body part (150) to the support part (130). The elastic body part (150) is divided into an upper elastic body part (150a) located above the connecting part (140) and a lower elastic body part (150b) located below the connecting part (140).

[0142] When the elastic body portion (150) is compressed (more specifically, when the upper elastic body portion (150a) is compressed), the first flange (113) descends in the downward direction (-y direction) in the space between the elastic body portion (150) and the support portion (130). Conversely, when the elastic body portion (150) is restored, the first flange (113) rises in the upward direction (+y direction) in the space between the elastic body portion (150) and the support portion (130).

[0143] The support member (130) is opposite to the inner wall of the guide plate (30) and extends in the longitudinal direction (±y direction).

[0144] The support member (130) includes a first support member (130a) located on one side of the electrically conductive contact pin (100) and a second support member (130b) located on the other side of the electrically conductive contact pin (100). The width dimension of the first contact member (111) is smaller than the dimension between the first support member (130a) and the second support member (130b), and the first flange (113) is located within the area between the first support member (130a) and the second support member (130b).

[0145] The first support portion (130a) and the second support portion (130b) are formed along the length direction of the electrically conductive contact pin (100), and the first support portion (141) and the second support portion (145) are integrally connected to a connecting portion (140) that is formed by extending along the width direction of the electrically conductive contact pin (100). A first connecting portion (110) is connected to the upper part of the elastic body portion (150), and a second connecting portion (120) is connected to the lower part of the elastic body portion (150). The elastic body portion (150) is integrally connected to the first and second support portions (130a, 130b) through the connecting portion (140), and the electrically conductive contact pin (100) is composed of a single body overall.

[0146] The first flange (113) includes a first left flange (113a) located on one side of the elastic body part (150) and a first right flange (113b) located on the other side of the elastic body part (150) opposite the first left flange (113a). The first left flange (113a) and the first right flange (113b) are each connected to the first contact part (111).

[0147] The first flange (113) of the first connection part (110) is positioned to overlap with the support part (130) in the width direction. Specifically, the first flange (113) extends from the first contact part (111) so that at least a portion of the first flange (113) is provided in the space between the support part (130) and the elastic body part (150). More specifically, at least a portion of the first left flange (113a) is located between the first support part (130a) and the elastic body part (150), and at least a portion of the first right flange (113b) is located between the elastic body part (150) and the second support part (130b).

[0148] When the elastic body part (150) is compressed, the first left flange (113a) descends in the downward direction (-y direction) in the space between the elastic body part (150) and the first support part (130a), and the first right flange (113b) descends in the downward direction (-y direction) in the space between the elastic body part (150) and the second support part (130b). Conversely, when the elastic body part (150) is restored, the first left flange (113a) rises in the upward direction (+y direction) in the space between the elastic body part (150) and the first support part (130a), and the first right flange (113b) rises in the upward direction (+y direction) in the space between the elastic body part (150) and the second support part (130b).

[0149] When an eccentric pressure is applied by the terminal (85) in contact with the first connection part (110) and the first connection part (110) tilts to the left, the first left flange (113a) contacts the first support part (130a) and the first right flange (113b) contacts the second support part (130b). As a result, the upper end of the first support part (130a) supports the first left flange (113a), and the second support part (130b) supports the lower end of the first right flange (113b). This prevents the first connection part (110) from tilting excessively to the left.

[0150] Additionally, when an eccentric pressure is applied by the contact terminal (410) in contact with the first connection part (110) and the first connection part (110) tilts to the right, the first left flange (113a) contacts the first support part (130a) and the first right flange (113b) contacts the second support part (130b). As a result, the upper end of the second support part (130b) supports the second left flange (113b), and the first support part (130a) supports the lower end of the first left flange (113a). This prevents the first connection part (110) from tilting excessively to the right.

[0151] With the electrically conductive contact pin (100) inserted into the guide plate (30), at least a portion of the end side of the first flange (113) is located inside the through hole of the guide plate (30). Since the first flange (113) is in the form of a flat plate and has a structure such that the first flange (113) can come into contact with the inner wall of the through hole of the guide plate (30) when the electrically conductive contact pin (100) receives eccentric pressure in the front and back directions, the first flange (113) can resist excessive bending deformation in the front and back directions.

[0152] As such, according to a preferred embodiment of the present invention, even if an eccentric pressing force is applied in the left and right directions, the configuration of the first flange (113) and the support member (130) prevents the electrically conductive contact pin (100) from being deformed by tilting excessively in the left and right directions. In addition, even if an eccentric pressing force is applied in the front and back directions, the configuration in which the first flange (113) contacts the inner wall of the through hole of the guide plate (30) prevents the electrically conductive contact pin (100) from being deformed by tilting excessively in the front and back directions.

[0153] A first convex portion (114) protruding toward the support portion (130) is provided at the free end of the first flange (113). A first concave portion (133) is provided in the support portion (130) corresponding to the position of the first convex portion (114). Through the configuration of the first convex portion (114) and the first concave portion (133), the first flange (113) maintains a state of being spaced apart from the support portion (130) before the first flange (113) descends, and when the first flange (113) descends, the first flange (113) gently contacts the inner surface of the support portion (130) and continues to descend while maintaining the contact state. Here, the spacing between the first convex portion (114) and the first concave portion (133) can be formed in a range where the ratio of the distance between the spacing and the height of the spacing is 1:13 to 1:80. For example, the distance between the spacing may be in the range of 2 μm or more and 6 μm or less, and the height of the spacing may be in the range of 80 μm or more and 160 μm or less. By increasing the aspect ratio of the spacing between the first convex portion (114) and the first concave portion (133), it is possible to have a compact structure in the width direction (±x direction) while increasing the overall thickness dimension (H) of the electrically conductive contact pin (100).

[0154] When the elastic body portion (150) is not compressed, the first flange (113) and the support portion (130) are spaced apart from each other. As the elastic body portion (150) is compressed, the first flange (113) moves in the downward direction (-y direction), and the first flange (113) comes into contact with the inner surface of the support portion (130) to form a current path. More specifically, when the first flange (113) moves in the downward direction (-y direction), the first convex portion (114) of the first flange (113) moves away from the corresponding position of the first concave portion (133) and comes into contact with the inner surface of the support portion (130) to form a current path. Before compression of the elastic body part (150), the first flange (113) and the support part (130) are spaced apart from each other so as not to hinder the deformation of the elastic body part (150), and subsequently, as the elastic body part (150) is compressed, the outer surface of the first flange (113) and the inner surface of the support part (130) come into contact with each other so that a current path is formed between the support part (130) and the first flange (113).

[0155] The connecting portion (140) includes a first connecting portion (141) connecting the elastic body portion (150) and the first support portion (130a), and a second connecting portion (142) connecting the elastic body portion (150) and the second support portion (130b). The first connecting portion (141) connects the elastic body portion (150) and the first support portion (130a), and the second connecting portion (142) connects the elastic body portion (150) and the second support portion (130b).

[0156] The first connecting part (141) and the second connecting part (142) may be located at the same position or at different positions in the longitudinal direction. According to a preferred embodiment of the present invention, the first connecting part (141) and the second connecting part (142) are provided at the same position in the longitudinal direction.

[0157] By means of the connecting part (140), foreign substances introduced from the upper side cannot enter the second connecting part (120), and foreign substances introduced from the lower side cannot enter the first connecting part (110). By restricting the movement of foreign substances introduced into the interior, it is possible to prevent the operation of the first and second connecting parts (110, 120) from being hindered by foreign substances.

[0158] According to a preferred embodiment of the present invention, when the first connecting part (110) moves downward, the lower end of the first flange (113) includes a stopper that can be contacted, and the first flange comes into contact with the stopper before the maximum compression state of the elastic body part (150). More specifically, as the first flange (113) moves downward, the free end of the first flange (113) can come into contact with the connecting part (140). As the first flange (113) moves downward and the lower end of the first flange (113) comes into contact with the connecting part (140), further downward movement of the first contact part (111) is stopped. Through this, the connecting part (140) acts as a stopper that limits further downward movement of the first flange (113). With the first flange (113) in contact with the stopper (connecting part (140)), the vertically adjacent straight sections (153) do not come into contact with each other. Although the connecting part (140) has been described above as serving as the stopper, the stopper that limits the downward movement of the first flange (113) can be configured with a configuration other than the connecting part (140).

[0159] The second connection part (120) is in contact with the object to be connected (more preferably the pad (65) of the circuit board (60)).

[0160] The second connection portion (120) includes a second contact portion (121) that contacts a pad (65) of the circuit board (60), and a second flange (123) that extends upward from the second contact portion (111) and covers at least a portion of the elastic body portion (150). When the elastic body portion (150) is elastically deformed, the second contact portion (121) and the second flange (123) behave as a single unit.

[0161] The second contact portion (121) is a part that contacts the pad (65) of the circuit board (60). The second connection portion (120) is connected to the elastic body portion (150) and can move vertically elastically by contact pressure.

[0162] When inspecting the semiconductor package (80), the pad (65) of the circuit board (60) comes into contact with the lower surface of the second connection part (120), and the elastic body part (150) is compressed and deformed. As the second connection part (120) moves upward, the second connection part (120) comes into contact with the support part (130).

[0163] The second flange (123) of the second connection part (120) is configured to extend upward from the second contact part (121) and cover at least a portion of the elastic body part (150). The second flange (123) extends upward (+y direction) from the second contact part (121), and at least a portion of the second flange (123) is provided between the elastic body part (150) and the support part (130).

[0164] When the elastic body portion (150) is compressed (more specifically, when the lower elastic body portion (150b) is compressed), the second flange (123) rises in the upward direction (+y direction) in the space between the elastic body portion (150) and the support portion (130). Conversely, when the elastic body portion (150) is restored, the second flange (123) descends in the downward direction (-y direction) in the space between the elastic body portion (150) and the support portion (130).

[0165] The second flange (123) includes a second left flange (123a) located on one side of the elastic body part (150) and a second right flange (123b) located on the other side of the elastic body part (150) opposite the second left flange (123a). The second left flange (123a) and the second right flange (123b) are each connected to the second contact part (111).

[0166] The second flange (123) of the second connection part (120) is positioned to overlap with the support part (130) in the width direction. Specifically, the second flange (123) extends from the second contact part (121) so that at least a portion of the second flange (123) is provided in the space between the support part (130) and the elastic body part (150). More specifically, at least a portion of the second left flange (123a) is located between the first support part (130a) and the elastic body part (150), and at least a portion of the second right flange (123b) is located between the elastic body part (150) and the second support part (130b).

[0167] When the elastic body part (150) is compressed, the second left flange (123a) rises in the upward direction (+y direction) in the space between the elastic body part (150) and the first support part (130a), and the second right flange (123b) rises in the upward direction (+y direction) in the space between the elastic body part (150) and the second support part (130b). Conversely, when the elastic body part (150) is restored, the second left flange (123a) descends in the downward direction (-y direction) in the space between the elastic body part (150) and the first support part (130a), and the second right flange (123b) descends in the downward direction (-y direction) in the space between the elastic body part (150) and the second support part (130b).

[0168] A second convex portion (124) protruding toward the support portion (130) is provided at the free end of the second flange (123). A second concave portion (134) is provided in the support portion (130) corresponding to the position of the second convex portion (124). Through the configuration of the second convex portion (124) and the second concave portion (134), the second flange (123) maintains a state of being spaced apart from the support portion (130) before the second flange (123) rises, and when the second flange (123) rises, the second flange (123) gently contacts the inner surface of the support portion (130) and rises further while maintaining the contact state. Here, the space between the second convex portion (124) and the second concave portion (134) can be formed in a range of 1:13 to 1:80 for the ratio of the distance between the spaced spaces to the height of the spaced spaces. For example, the distance between the spacing spaces can be in the range of 2㎛ or more and 6㎛ or less, and the height of the spacing space can be in the range of 80㎛ or more and 160㎛ or less. By increasing the aspect ratio of the spacing space between the second convex portion (124) and the second concave portion (134), it is possible to have a compact structure in the width direction (±x direction) while increasing the overall thickness dimension (H) of the electrically conductive contact pin (100).

[0169] When the elastic body portion (150) is not compressed, the second flange (123) and the support portion (130) are spaced apart from each other. When the elastic body portion (150) is compressed and the second flange (123) moves in the upward direction (+y direction), the second flange (123) comes into contact with the inner surface of the support portion (130) to form a current path. More specifically, when the second flange (123) moves in the upward direction (+y direction), the second convex portion (124) of the second flange (123) comes into contact with the inner surface of the support portion (130) to form a current path. Before compression of the elastic body part (150), the second flange (123) and the support part (130) are spaced apart from each other so as not to hinder the deformation of the elastic body part (150), and subsequently, as the elastic body part (150) is compressed, the outer surface of the second flange (123) and the inner surface of the support part (130) come into contact with each other so that a current path is formed between the support part (130) and the second flange (123).

[0170] The elastic body portion (150) has a cross-sectional shape in the thickness direction of the electrically conductive contact pin (100) that is the same across all thickness sections. This is possible because the electrically conductive contact pin (100) is manufactured through a plating process.

[0171] The elastic body part (150) is connected to at least one of the first connection part (110) and the second connection part (120) and is elastically deformable along the length direction (±y direction).

[0172] The elastic body part (150) has a shape in which a plate-shaped plate having a substantial width (t) is repeatedly bent into an S-shape, and the substantial width (t) of the plate-shaped plate is constant overall.

[0173] The elastic body portion (150) is formed by alternately connecting a plurality of straight portions (153) and a plurality of curved portions (154). The straight portions (153) connect adjacent curved portions (154) to the left and right, and the curved portions (154) connect adjacent straight portions (153) to the top and bottom. The curved portions (154) are provided in an arc shape.

[0174] A straight section (153) is disposed in the central portion of the elastic body portion (150), and a curved section (154) is disposed in the outer portion of the elastic body portion (150). The straight section (153) is provided parallel to the width direction so that deformation of the curved section (154) due to contact pressure occurs more easily.

[0175] In order to prevent the electrically conductive contact pin (100) installed in the inspection device (11) from detaching from the guide plate (30), a first locking part (131) is provided at one end of the support part (130) and a second locking part (132) is provided at the other end.

[0176] The first locking part (131) and the second locking part (132) are configured to protrude outward in the width direction. This prevents the electrically conductive contact pin (100) from detaching from the guide plate (30) after it is inserted into the guide plate (30).

[0177] The first locking part (131) prevents the electrically conductive contact pin (100) from moving downward from the guide plate (30), and the second locking part (132) prevents the electrically conductive contact pin (100) from moving upward from the guide plate (30).

[0179] FIG. 24 is a drawing showing a part of the side of an electrically conductive contact pin according to a preferred first and second embodiment of the present invention.

[0180] Referring to FIG. 24, the electrically conductive contact pin (100, 200) according to the preferred first and second embodiments of the present invention includes a plurality of fine trenches (88) on its side. The electrically conductive contact pin (100, 200) according to the preferred first and second embodiments of the present invention can be formed by a mold made of an anodic oxide film material. Since an anodic oxide film mold is used, the total thickness dimension (H) of the electrically conductive contact pin (100, 200) can have a range of 80 μm or more and 160 μm or less. In addition, when forming an internal space in the anodic oxide film mold, since the anodic oxide film with high rigidity remains as a wall, it is possible to manufacture an electrically conductive contact pin (100, 200) having a gap (d), line width (t), and radius (r) of an opening hole with a high aspect ratio.

[0181] The anodic oxide mold contains numerous pores, and at least a portion of the anodic oxide mold is etched to form an internal space, and a metal filler is formed into the internal space by electroplating, so that a micro trench (88) is provided on the side of the electrically conductive contact pin (100, 200) in contact with the pores of the anodic oxide mold.

[0182] A micro trench (88) is formed by extending long along the thickness direction (±z direction) of the electrically conductive contact pin (100, 200) on the side of the electrically conductive contact pin (100, 200). Here, the thickness direction (±z direction) of the electrically conductive contact pin (100, 200) refers to the direction in which the metal filler grows during electroplating. The micro trench (88) is formed as a long groove along the thickness direction of the electrically conductive contact pin (100, 200) and several of them are formed side by side along the side of the electrically conductive contact pin (100, 200) across the entire side of the electrically conductive contact pin (100, 200).

[0183] The micro trench (88) has a depth ranging from 20 nm to 1 μm and a width ranging from 20 nm to 1 μm. Since the micro trench (88) is formed from a pore formed during the manufacture of the anodic oxide film mold, the width and depth of the micro trench (88) have values ​​less than or equal to the diameter range of the pore of the anodic oxide film mold (1000). Meanwhile, during the process of forming an internal space in the anodic oxide film mold, some of the pores of the anodic oxide film mold are crushed together by the etching solution, and at least some micro trenches (88) having a depth greater than the diameter range of the pore formed during anodic oxidation may be formed.

[0184] The above-mentioned micro trench (88) has the effect of increasing the surface area on the side of the electrically conductive contact pin (100, 200). By configuring the micro trench (88) formed on the side of the electrically conductive contact pin (100, 200), heat generated from the electrically conductive contact pin (100, 200) can be rapidly released, thereby suppressing the temperature rise of the electrically conductive contact pin (100, 200). In addition, by configuring the micro trench (88) formed on the side of the electrically conductive contact pin (100, 200), the torsional resistance ability during deformation of the electrically conductive contact pin (100, 200) can be improved.

[0185] As described above, although the present invention has been explained with reference to preferred embodiments, a person skilled in the art may implement the present invention with various modifications or variations without departing from the spirit and scope of the invention as described in the following claims. Explanation of the symbols

[0187] 100, 200: Electrically conductive contact pins 210: Laminated section 230: Vertical conduction section 150, 250: Elastic body part 110, 253: First connection part 120, 255: Second connection part

Claims

Claim 1 An electrically conductive contact pin comprising: a laminated portion comprising a plurality of metal layers including a first metal layer and a second metal layer in the thickness direction of the electrically conductive contact pin; and a vertical conductive portion provided in a through hole penetrating in the thickness direction of the electrically conductive contact pin and connected to the plurality of metal layers, wherein the vertical conductive portion is provided as a single metal layer. Claim 2 delete Claim 3 In an electrically conductive contact pin, a laminated portion is formed by stacking a plurality of metal layers, including a first metal layer and a second metal layer, in the thickness direction of the electrically conductive contact pin; An electrically conductive contact pin comprising a vertical conductive portion provided in a through hole penetrating in the thickness direction of the electrically conductive contact pin and connected to the plurality of metal layers, wherein the metal constituting the first metal layer is selected from rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), phosphorus (Ph) or alloys thereof, or palladium-cobalt (PdCo) alloy, palladium-nickel (PdNi) alloy or nickel-phosphorus (NiPh) alloy, nickel-manganese (NiMn), nickel-cobalt (NiCo) or nickel-tungsten (NiW) alloy, the metal constituting the second metal layer is selected from copper (Cu), silver (Ag), gold (Au) or alloys thereof, and the metal constituting the vertical conductive portion is selected from copper (Cu), silver (Ag), gold (Au) or alloys thereof. Claim 4 An electrically conductive contact pin comprising: a laminated portion comprising a plurality of metal layers including a first metal layer and a second metal layer in the thickness direction of the electrically conductive contact pin; and a vertical conductive portion provided in a through hole penetrating in the thickness direction of the electrically conductive contact pin and connected to the plurality of metal layers, wherein the vertical conductive portion is formed of the same material as any one of the metal materials constituting the laminated portion. Claim 5 In claim 1, the vertical conductive portion is an electrically conductive contact pin formed of a material different from the metal material constituting the laminated portion. Claim 6 An electrically conductive contact pin comprising: a laminated portion comprising a plurality of metal layers including a first metal layer and a second metal layer in the thickness direction of the electrically conductive contact pin; and a vertical conductive portion provided in a through hole penetrating in the thickness direction of the electrically conductive contact pin and connected to the plurality of metal layers, wherein the second metal layer and the vertical conductive portion are composed of a metal having a higher electrical conductivity than the first metal layer. Claim 7 An electrically conductive contact pin comprising: a laminated portion comprising a plurality of metal layers including a first metal layer and a second metal layer stacked in the thickness direction of the electrically conductive contact pin; and a vertical conductive portion provided in a through hole penetrating in the thickness direction of the electrically conductive contact pin and connected to the plurality of metal layers, wherein the electrically conductive contact pin comprises a plurality of slits formed along the length direction of the electrically conductive contact pin, and the vertical conductive portion is provided in at least one of the plurality of slits. Claim 8 In claim 1, the vertical conductive portion is an electrically conductive contact pin that completely fills the interior of the through hole. Claim 9 In claim 1, the vertical conductive portion is an electrically conductive contact pin that incompletely fills the interior of the through hole. Claim 10 In claim 1, the vertical conductive portion is an electrically conductive contact pin connected to a plurality of the second metal layers. Claim 11 An electrically conductive contact pin comprising: a laminated portion comprising a plurality of metal layers including a first metal layer and a second metal layer in the thickness direction of the electrically conductive contact pin; and a vertical conductive portion provided in a through hole penetrating in the thickness direction of the electrically conductive contact pin and connected to the plurality of metal layers, wherein the vertical conductive portion has an internal hole formed by incompletely filling the interior of the through hole. Claim 12 An electrically conductive contact pin comprising: a laminated portion comprising a plurality of metal layers including a first metal layer and a second metal layer in the thickness direction of the electrically conductive contact pin; and a vertical conductive portion provided in a through hole penetrating in the thickness direction of the electrically conductive contact pin and connected to the plurality of metal layers, and a surface layer formed on at least a portion of the surface of the electrically conductive contact pin such that the surface of the first metal layer is not exposed to the outside, and is composed of the same material as the vertical conductive portion. Claim 13 The electrically conductive contact pin according to claim 1, wherein the electrically conductive contact pin comprises: first and second connection portions provided at both ends; and an elastic body portion provided between the first and second connection portions and elastically deformed by a longitudinal pressure. Claim 14 In Clause 13, the vertical conductive portion is an electrically conductive contact pin provided in the elastic body portion. Claim 15 An electrically conductive contact pin comprising: a laminated portion formed by stacking a plurality of metal layers including a first metal layer and a second metal layer in the thickness direction of the electrically conductive contact pin; a vertical conductive portion provided in a through hole penetrating in the thickness direction of the electrically conductive contact pin and connected to the plurality of metal layers; first and second connecting portions provided at both ends; and an elastic body portion provided between the first and second connecting portions and elastically deformed by a longitudinal pressure; wherein the vertical conductive portion is provided in at least one of the first and second connecting portions. Claim 16 An electrically conductive contact pin according to claim 1, wherein the side of the electrically conductive contact pin is formed with a groove that is elongated along the thickness direction and a plurality of micro trenches are formed parallel to each other along the side of the entire side of the electrically conductive contact pin.

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