Semiconductor device testing apparatus, and method for estimating amount of deformation

Abstract

[Project] To provide a semiconductor device test apparatus capable of predicting the amount of deformation of a contact when a terminal of a DUT is pressed against a contact of a contact device. [Solution] A semiconductor device test device (1) comprises a holding unit (30) for holding a DUT (100), a probe card (10) having a contactor (12) that contacts a terminal (101) of the DUT (100), a driving unit (37) that presses the terminal (101) toward the contactor (12) by moving the holding unit (30) in the +Z direction, a pressing unit (35) having a lower base (36) that supports the driving unit (37), a supporting unit (40) that supports the probe card (10) so that the probe card (10) faces the holding unit (30) and is supported on the lower base (36), and an estimation device (60) that estimates the AOD of the contactor (12) in the Z direction based on the thrust (T) of the driving unit (37) in the Z direction.

Description

Technology Field

[0001] The present invention relates to a semiconductor device test apparatus for testing a DUT (Device Under the Test) and a method for estimating the amount of deformation of a contactor to which a terminal of the DUT is pressed in the semiconductor device test apparatus. Background Technology

[0002] An electronic component testing device is known for testing the electrical characteristics of an electronic circuit made in a bare die (bare chip) after dicing a semiconductor wafer (see, for example, Patent Document 1). This electronic component testing device is equipped with a test head having a probe card and a handler that moves the bare die and presses it firmly against the probe card.

[0003] This handler is equipped with a transfer device that transfers a DUT from a tray onto an alignment unit, and an alignment unit that positions the bare die transferred by the transfer device relative to a probe card and then firmly presses the pads of the bare die onto the contactors of the probe card. Prior art literature

[0004] Japanese Patent Publication No. 2016-85203 The problem to be solved

[0005] In the electronic component testing device described above, deformation of the contactor occurs when the pad of the bare die is pressed firmly against the contactor of the probe card. Since excessive deformation of the contactor can cause damage to the contactor and the pad, it is necessary to predict the amount of contactor deformation. However, there is a problem in that the amount of contactor deformation cannot be predicted in the conventional electronic component testing device described above.

[0006] The problem that the present invention aims to solve is to provide a semiconductor device test apparatus and a method for estimating the amount of deformation of a contact when a terminal of a DUT is pressed against a contact of a contact device. means of solving the problem

[0007] [1] The first aspect of the present invention is a semiconductor device test apparatus having a holding device for holding a DUT, a connecting device having a contactor that contacts a terminal of the DUT, a driving device that presses the terminal toward the contactor by moving the holding device in a first direction, and a base part that supports the driving device, a supporting part that supports the connecting device so that the connecting device faces the holding device and is supported by the base part, and an estimation device that estimates a first deformation amount of the contactor in the first direction based on the thrust of the driving device in the first direction.

[0008] [2] The present invention 2 may be a semiconductor device test device of the present invention, wherein the semiconductor device test device further comprises a driving control device that controls the driving unit to move the holding unit in the first direction by an amount of indicated movement, and the estimation device may be a semiconductor device test device that calculates an estimated value of the first deformation amount based on the first elastic deformation amount of the holding unit, the second elastic deformation amount of the pressing unit, and the third elastic deformation amount of the support unit from the amount of indicated movement.

[0009] [3] The present invention, in the semiconductor device test device of the present invention, may be a semiconductor device test device having a memory unit that stores a first spring constant of the holding device, a second spring constant of the pressurizing device, and a third spring constant of the support member, a calculation unit that calculates the first to third elastic deformation amount based on the first to third spring constants and the thrust, and an estimation unit that calculates the estimated value by subtracting the first to third elastic deformation amount from the indicated displacement amount.

[0010] [4] The present invention's Sun 4 may be a semiconductor device test device of Sun 3, wherein the memory unit additionally stores an indicated movement amount corresponding to the thrust, and the estimation unit uses the indicated movement amount corresponding to the thrust as the indicated movement amount.

[0011] [5] The present invention's Sun 5 may be a semiconductor device test device of Sun 3, wherein the driving unit further comprises a first measuring device for measuring the thrust of the driving unit, and the calculation unit may use the thrust measured by the first measuring device as the thrust.

[0012] [6] The present invention's Sun 6 may be a semiconductor device test device of Sun 3 or Sun 5, wherein the driving unit further comprises a second measuring unit that measures the amount of movement of the holding device by the driving unit, and the estimating unit may use the amount of movement measured by the second measuring unit as the indicated amount of movement.

[0013] [7] The present invention may be a semiconductor device test device in which the driving control unit can control the driving unit to deform the contactor in the first direction by a preset amount of deformation by the pressure of the driving unit, the memory unit additionally stores a thrust corresponding to the preset amount of deformation, the calculation unit uses the thrust corresponding to the preset amount of deformation as the thrust, and the estimation unit uses the preset amount of deformation as the indicated amount of movement.

[0014] [8] The present invention's 8 may be a semiconductor device test device of any one of the 1 to 7 types, wherein the holding device may include a holding part that holds the DUT and adjusts the temperature of the DUT, and an alignment stage that supports the holding part and positions the DUT relative to the connecting device.

[0015] [9] The present invention's embodiment 9 may be a semiconductor device test device of any one of embodiments 1 to 8, wherein the support member is installed by erecting a bridge beam to which the connecting device is attached and a column member that supports the bridge beam.

[0016]

[10] The present invention's embodiment 10 is a semiconductor device test device of any one of embodiments 1 to 9, wherein the semiconductor device test device may additionally have a determination device that determines whether the estimated value of the first deformation amount calculated by the estimation device is normal or abnormal.

[0017]

[11] The present invention, in a semiconductor device test device of the present invention, may further comprise a drive control device that controls the drive unit, and when the judgment device determines that the estimated value is abnormal, the drive control device may control the drive unit to stop the drive unit from moving in the first direction of the holding device.

[0018]

[12] The present invention's Sun 12 may be a semiconductor device test device of Sun 10 or Sun 11, wherein the semiconductor device test device may additionally be a semiconductor device test device having a notification device that indicates that the estimated value is abnormal.

[0019]

[13] The present invention, in any one of the semiconductor device test devices from sun 1 to sun 12, may further comprise a drive control device that controls the drive device to deform the contactor in the first direction by a preset amount of deformation by the pressure of the drive device, and the estimation device may further comprise a recommendation value calculation unit that calculates a recommended value of the set amount of deformation such that the estimated value of the first amount of deformation becomes the optimal value based on the type of the connection device and the thrust, and the drive control device may control the drive device based on the recommended value.

[0020]

[14] The present invention, in any one of the semiconductor device test devices 1 to 13, may be a semiconductor device test device in which the DUT comprises a unibody die and the connection device comprises a probe card having a contactor that contacts the terminal provided by the die.

[0021]

[15] The present invention's Sun 15 is a strain estimation method for estimating a first strain in a semiconductor device test device of any one of Sun 1 to Sun 14, and is a strain estimation method having an estimation process for estimating the first strain based on the thrust.

[0022]

[16] The present invention, in a method for estimating the amount of deformation of a sun 15, may be a method for estimating the amount of deformation of a first deformation by subtracting the first elastic deformation of the holding device, the second elastic deformation of the pressing device, and the third elastic deformation of the support part from the amount of movement of the holding part in the first direction assumed by control by the driving control device.

[0023]

[17] The present invention's 17 is a method for estimating the amount of deformation of a sun 16, wherein the method for estimating the amount of deformation may further comprise an acquisition process for acquiring a first spring constant of the holding device, a second spring constant of the pressurizing device, and a third spring constant of the support member, and a calculation process for calculating the first to third elastic deformation amounts based on the first to third spring constants and the thrust.

[0024]

[18] The present invention, in a method for estimating the amount of deformation of a sun 17, may be a method for estimating the amount of deformation, wherein the acquisition process comprises moving the holding device from a first position to a second position by the driving unit, acquiring the amount of change of thrust when the holding device moves from the first position to the second position, acquiring the amount of second deformation in the first direction of the holding device when the holding device moves from the first position to the second position, and calculating the first spring constant based on the amount of change of thrust and the amount of second deformation.

[0025]

[19] The present invention, in a method for estimating the amount of deformation of a sun 18, the support member includes a bridge beam with a dummy board attached and a column member that is erected and installed on the base member and supports the bridge beam, and the acquisition process may be a method for estimating the amount of deformation including holding a load cell in the holding device, moving the holding device to the first position by the driving unit to bring the load cell into contact with the dummy board, acquiring a third amount of deformation in the first direction of the load cell when the holding device is located in the second position, and acquiring a second amount of deformation by subtracting the third amount of deformation from the distance between the first position and the second position.

[0026]

[20] The present invention's sun 20 may be a method for estimating the amount of deformation of sun 18 or sun 19, wherein the acquisition process may include acquiring a fourth amount of deformation in the first direction of the support member when the holding device is moved from the first position to the second position by the driving unit, and calculating a third spring constant of the support member based on the change in thrust and the fourth amount of deformation.

[0027]

[21] The present invention's 21 is a method for estimating the amount of deformation of a sun 20, wherein the acquisition process may include calculating a fifth amount of deformation in the first direction of the pressurizing device by subtracting the distance between the first position and the second position and the fourth amount of deformation from the set amount of deformation of the contactor, and calculating a second spring constant of the pressurizing device based on the change amount of thrust and the fifth amount of deformation.

[0028]

[22] The present invention's 22 is a method for estimating a deformation amount of any one of the 15 to 21 of the present invention, wherein the method for estimating a deformation amount may additionally include a determination process for determining whether the estimated value of the first deformation amount is normal or abnormal.

[0029]

[23] The present invention's 23 is a method for estimating the amount of deformation of the present invention, wherein the method for estimating the amount of deformation of the present invention may additionally include a stopping process in which, in the determination process, the movement of the holding device in the first direction by the driving unit is stopped when the estimated value is determined to be abnormal.

[0030]

[24] The present invention's Sun 24 is a method for estimating the amount of deformation of Sun 22 or Sun 23, wherein the method for estimating the amount of deformation may additionally include a notification process that indicates that the estimated value is abnormal when the estimated value is determined to be abnormal in the determination process.

[0031]

[25] The present invention's 25 is a deformation amount estimation method of any one of the 15 to 24, wherein the deformation amount estimation method may additionally include a recommendation value calculation process for calculating a recommended value of a set deformation amount in which the estimated value of the first deformation amount becomes the optimal value based on the type of the connecting device and the thrust, and a movement process for controlling the driving unit based on the recommended value after the recommendation value calculation process. Effects of the invention

[0032] In the present invention, the semiconductor device test apparatus and the deformation amount estimation method can estimate the first deformation amount of a contactor in a first direction based on the thrust of a driving unit in a first direction, so that the deformation amount of a contactor when a terminal of a DUT is pressed against the contactor can be predicted. Brief explanation of the drawing

[0033] FIG. 1 is a cross-sectional view showing a semiconductor device test apparatus in a first embodiment of the present invention. FIG. 2 is a cross-sectional view showing the state in which the terminal of the DUT and the contactor of the probe card begin to make contact in the semiconductor device test apparatus of FIG. 1. Figure 3 is a cross-sectional view showing the state in which the DUT is raised further from the state shown in Figure 2. FIG. 4 is a block diagram illustrating the configuration of a driving unit and a control device in a first embodiment of the present invention. FIG. 5 is a graph showing the relationship between elastic deformation amount, displacement amount and thrust in the first embodiment of the present invention. FIG. 6 is a flowchart illustrating a preliminary measurement process of a spring constant in a first embodiment of the present invention. FIG. 7 is a cross-sectional view showing the state in which the holding unit is raised to a first position when pre-measuring the spring constant in the semiconductor device test apparatus of FIG. 1. FIG. 8 is a cross-sectional view showing the state in which the holding unit is raised to a second position when pre-measuring the spring constant in the semiconductor device test apparatus of FIG. 1. FIG. 9 is a flowchart illustrating an AOD estimation method in a first embodiment of the present invention. FIG. 10 is a flowchart illustrating a method for calculating the recommended value of a POD in the first embodiment of the present invention. FIG. 11 is a block diagram illustrating the configuration of a driving unit and a control device thereof in a second embodiment of the present invention. FIG. 12 is a flowchart illustrating a different AOD estimation method in an embodiment of the present invention. Specific details for implementing the invention

[0034] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0035] [First Embodiment]

[0036] FIG. 1 is a cross-sectional view showing a semiconductor device test apparatus (1) in the present embodiment. FIG. 2 is a cross-sectional view showing the state in which the terminal (101) of the DUT (100) and the contactor (12) of the probe card (10) begin to make contact in the semiconductor device test apparatus (1) of FIG. 1. That is, FIG. 2 shows the semiconductor device test apparatus (1) and the DUT (100) when the position of the terminal (101) of the DUT (100) in FIG. 1 is raised by the distance (d) shown in FIG. 1. The dashed line in FIG. 2 represents the semiconductor device test apparatus (1) of FIG. 1. FIG. 3 is a cross-sectional view showing the state in which the DUT (100) is raised further from the state shown in FIG. 2. The dashed line in FIG. 3 represents the semiconductor device test apparatus (1) of FIG. 2. FIG. 4 is a block diagram explaining the configuration of the driving unit (37) and the control unit (50) in the present embodiment.

[0037] As shown in FIGS. 1 to 3, in this embodiment, the semiconductor device test apparatus (1) is a device for testing the electrical characteristics of a DUT (100). In this semiconductor device test apparatus (1), the terminal (101) of the DUT (100) is brought into contact with the contactor (12) of the probe card (10), and then the test of the DUT (100) is performed.

[0038] In this embodiment, the DUT (100) may be exemplified as a bare die (bare chip) formed by dicing a semiconductor wafer, and the semiconductor device test device (1) tests the electrical characteristics of an electronic circuit made in this bare die. The terminal (101) is, for example, a pad.

[0039] In addition, in this embodiment, the DUT (100) is a reorganized bare die, but the DUT (100) may be a die formed on a semiconductor wafer before reorganization. Also, in this embodiment, the case of testing one die is described as an example, but multiple dies may be tested simultaneously.

[0040] As shown in FIG. 1, this semiconductor device test device (1) is equipped with a probe card (10), a test head (15), and a handler (20). In this embodiment, the probe card (10) corresponds to an example of a "connection device" in the present invention.

[0041] The probe card (10) is attached to the bridge beam (41) (described later) of the support part (40) (described later) of the handler (20) and faces the internal space of the handler (20). In addition, the probe card (10) is electrically connected to the test head (15) and electrically connects the DUT (100) and the test head (15) during testing of the DUT (100).

[0042] The probe card (10) includes a substrate (11) and a plurality of contactors (12). The substrate (11) is a printed circuit board, and in this embodiment, the substrate (11) is attached to a bridge beam (41). In addition, in this embodiment, the plurality of contactors (12) correspond to an example of a "contactor" in the present invention.

[0043] A plurality of contactors (12) are arranged on the lower surface of the substrate (11) to correspond to the positions of a plurality of terminals (101) of the DUT (100). The contactors (12) are needle-shaped members capable of elastic deformation in the Z direction of the drawing. Specific examples of such contactors (12) include, for instance, a vertical type probe needle, a pogo pin, a cantilever type probe needle, a bump provided on a membrane, and a contactor manufactured using MEMS technology.

[0044] The handler (20) is equipped with a holding unit (30), a pressurizing unit (35), a support member (40), and a control device (50). In this embodiment, the holding unit (30) corresponds to an example of a "holding device" in the present invention, and in this embodiment, the pressurizing unit (35) corresponds to an example of a "pressurizing device" in the present invention.

[0045] The holding unit (30) holds the DUT (100). The holding unit (30) is equipped with a thermal head (31) and an alignment stage (32). The thermal head (31) holds the DUT (100) and also adjusts the temperature of the DUT (100). In this embodiment, the thermal head (31) corresponds to an example of a "holding part" in the present invention.

[0046] The method by which the thermal head (31) holds the DUT (100) is not particularly limited, but for example, a method of vacuum adsorbing the DUT (100) onto the upper surface of the thermal head (31) can be exemplified. Additionally, the method by which the thermal head (31) adjusts the temperature of the DUT (100) is not particularly limited, but for example, a method of heating the DUT (100) by a temperature control device such as a heater provided within the thermal head (31) can be exemplified. Furthermore, this temperature control device may be equipped with a cooling source capable of cooling the heater in addition to the heater.

[0047] Additionally, although not specifically illustrated, the handler (20) may be equipped with a transfer device for transferring the DUT (100) onto the thermal head (31). For example, the handler (20) may be equipped with a transfer arm capable of picking and placing the DUT (100) mounted on the tray by means of a suction head, and the DUT (100) may be transferred from the tray onto the thermal head (31) by means of this transfer arm.

[0048] The alignment stage (32) supports the thermal head (31) from below. This alignment stage (32) is a stage for positioning the DUT (100) relative to the probe card (10). Specifically, the alignment stage (32) positions the DUT (100) relative to the probe card (10) by adjusting the relative position and orientation of the DUT (100) relative to the probe card (10) so that the terminal (101) of the DUT (100) faces the contactor (12) of the probe card (10). The alignment stage (32) is not particularly limited, but, for example, an XYθ stage, etc., may be used.

[0049] The pressurizing unit (35) moves the holding unit (30) holding the DUT (100) along the Z direction in the drawing. This pressurizing unit (35) is equipped with a lower base (36) and a driving unit (37). In this embodiment, the lower base (36) corresponds to an example of a "base part" in the present invention, and in this embodiment, the +Z direction corresponds to an example of a "first direction" in the present invention.

[0050] The lower base (36) supports the drive unit (37) from below. The drive unit (37) is installed upright on the lower base (36) and extends upward (in the +Z direction in the drawing) from the upper surface of the lower base (36).

[0051] As shown in FIGS. 1 to 3, the driving unit (37) is a device that raises the holding unit (30) along the Z direction and presses the DUT (100) firmly against the probe card (10). During the test of the DUT (100), the driving unit (37) raises the holding unit (30) in the +Z direction to press the terminal (101) of the DUT (100) toward the contactor (12). Additionally, after the test of the DUT (100) is finished, the driving unit (37) lowers the holding unit (30) in the -Z direction to move the terminal (101) of the DUT (100) away from the contactor (12).

[0052] Additionally, although not specifically illustrated, the driving unit (37) may be movable in the X direction or Y direction in the drawing. For example, the pressurizing unit (35) may be equipped with a rail installed on the lower base (36), and the driving unit (37) may additionally be equipped with a driving mechanism that enables movement along this rail.

[0053] As shown in FIG. 4, the driving unit (37) is equipped with a motor (371), a thrust sensor (372), and a stroke sensor (373). The motor (371) generates power for the driving unit (37) to raise and lower the holding unit (30). This motor (371) receives a driving signal (S) from the driving control device (55) (described later) of the control device (50). d It is controlled by ), and this driving signal (S d Power is generated to raise and lower the holding unit (30) based on ).

[0054] The thrust sensor (372) measures the thrust (T) in the Z direction of the drive unit (37). In addition, the thrust sensor (372) measures the measured thrust (T REAL ) outputs to the first operation unit (62) (described later) or the second operation unit (80) (described later) of the control device (50).

[0055] In this embodiment, the motor (371) is equipped with a ball screw mechanism not shown. The thrust sensor (372) measures the thrust (T) based on the driving torque of the motor (371), the lead of the feed screw of the ball screw mechanism, and the positive efficiency of the feed screw.

[0056] The stroke sensor (373) is the assumed amount of movement (stroke amount) (L) of the holding unit (30) in the Z direction, assumed according to the control by the drive control device (55). z ) measures the measured amount of movement (L z ) outputs to the estimation unit (63) of the control device (50).

[0057] The driving unit (37) is the measured value (movement amount (L) of this stroke sensor (373) z The holding unit (30) is controlled by a drive control device (55) to be raised until it becomes equal to the POD (Programmed Over Drive). Additionally, the POD is a preset amount of deformation of the contactor (12), which is set according to the type of probe card (10) or the type of DUT (100).

[0058] This POD is not specifically limited but is a value determined by prior measurement, etc. For example, by controlling the driving unit (37) by the driving control device (55) to press the DUT (100) firmly against the contactor (12), the amount of movement of the terminal (101) of the DUT (100) being pressed against the contactor (12) to the extent that the DUT (100) can be tested is measured in advance. The value of this measured amount of movement can be set as the POD. Furthermore, in this embodiment, the POD corresponds to an example of a "set deformation amount" in the present invention.

[0059] However, in reality, this POD does not correspond to the amount of deformation in the +Z direction of the contactor (12) when the lifting of the holding unit (30) is completed, as shown in FIG. 3. The amount of deformation in the +Z direction of the contactor (12) when the lifting of the holding unit (30) is completed is also referred to as AOD (Actual Over Drive), press-in amount, or overdrive amount. Hereinafter, this amount of deformation is referred to as AOD. Furthermore, in this embodiment, AOD corresponds to an example of the "first amount of deformation" in the present invention.

[0060] If only the amount of movement of the holding unit (30) by the driving unit (37) is considered, when the raising of the holding unit (30) is completed, the AOD must match the POD (AOD=POD). However, at this time, in reality, because elastic deformation of the holding unit (30), the pressurizing unit (35), and the support unit (40) occurs, the AOD becomes smaller than the POD (AOD <POD). 따라서, 본 실시 형태에 있어서 반도체 디바이스 시험 장치(1)에서는, 후술하는 바와 같이, 이러한 AOD를 추정하는 것이 가능한 추정 장치(60)를 포함하는 제어 장치(50)를 구비하고 있다.

[0061] In addition, the amount of movement (L) measured by the stroke sensor (373) z Regarding ), as shown in FIGS. 1 and 2, during the period from the start of the rising of the holding unit (30) until the terminal (101) of the DUT (100) starts to contact the contactor (12) of the probe card (10) (-d≤L z ≤0), amount of movement (L z ) is the amount of movement (L) in the +Z direction of the actual holding unit (30). REAL It becomes the same as )(L z =L REAL ). In addition, in this embodiment, the amount of movement (L z As a standard for ), the amount of movement when the holding unit (30) has risen by a distance (d) from the initial position is used.

[0062] In this regard, when the terminal (101) is tightly pressed against the contactor (12), the amount of movement (L) is due to the elastic deformation described above. z ) is the amount of movement (L REAL It does not become equal to ), and the amount of movement (L REAL ) includes an error. In this embodiment, such a movement amount (L z ) corresponds to an example of "imaginary movement amount" in the present invention.

[0063] As shown in FIGS. 1 to 3, the support member (40) supports the probe card (10) so that the probe card (10) faces the holding unit (30) and is also supported on the lower base (36). The support member (40) is equipped with a bridge beam (41) and a column member (42).

[0064] The bridge beam (41) is not specifically limited but is located inside an opening provided in an upper base (not shown) that constitutes the ceiling of the support member (40). A probe card (10) is attached to the lower surface of this bridge beam (41).

[0065] The column member (42) is erected and installed on the lower base (36) and also supports the bridge beam (41). In this embodiment, the column member (42) is interposed between the lower base (36) and the bridge beam (41) and is in direct contact with the lower base (36) and the bridge beam (41).

[0066] As shown in FIG. 4, the control device (50) controls the driving of the driving unit (37). The control device (50) is composed of a computational processing unit equipped with a CPU, ROM, RAM, and an input / output interface. The control device (50) is equipped with a driving control device (55), an estimation device (60), a judgment device (70), a notification device (75), and a second computational unit (80).

[0067] The drive control device (55), as described above, sends a drive signal (S) to the drive unit (37). d )cast Transmits. This driving signal (S d ) includes information specifying the torque of the motor (371). The drive control device (55) has a drive signal (S d After receiving the ) the driving unit (37) is instructed to raise the holding unit (30) by a distance corresponding to the POD by controlling the torque of the motor (371).

[0068] The estimation device (60) estimates the AOD based on the thrust (T) of the driving unit (37) in the +Z direction. This estimation device (60) is equipped with a memory unit (61), a first calculation unit (62), an estimation unit (63), and a recommended value calculation unit (64). In this embodiment, the first calculation unit (62) corresponds to an example of a "calculation unit" in the present invention.

[0069] The memory unit (61) stores the first spring constant (k1) of the holding unit (30), the second spring constant (k2) of the pressurizing unit (35), and the third spring constant (k3) of the support unit (40). Since the first to third spring constants (k1 to k3) may differ for each handler (20), it is desirable to obtain the first to third spring constants (k1 to k3) for each handler (20) in advance before using the handler (20) for testing the DUT (100). Furthermore, the method for obtaining the first to third spring constants (k1 to k3) in advance will be described later.

[0070] This memory unit (61) outputs the first to third spring constants (k1 to k3) to the first calculation unit (62). The first calculation unit (62) calculates the first elastic deformation amount (x1) of the holding unit (30) as shown in FIG. 3, the second elastic deformation amount (x2) of the pressurizing unit (35), and the third elastic deformation amount (x3) of the support unit (40) based on the first to third spring constants (k1 to k3) and the thrust (T).

[0071] In this embodiment, the first calculation unit (62) measures the thrust (T) as the thrust (T) measured by the thrust sensor (372) when the terminal (101) is pressing the contactor (12). REAL ) is used. Here, when the terminal (101) is pressing the contactor (12), it refers to the amount of movement (L) output from the stroke sensor (373). z It means when ) is greater than 0 (0 <L z ), at this time, thrust (T REAL) increases in real time until the end of the rise of the holding unit (30).

[0072] The first to third elastic deformation amounts (x1 to x3) can be calculated based on Hooke's law using the following equations (1) to (3). Additionally, since thrust (T) can be expressed as a linear function using the torque of the driving unit (37), the elastic deformation amount can be calculated using the value of the torque instead of thrust (T).

[0073] x1=T REAL / k1… (1)

[0074] x2=T REAL / k2… (2)

[0075] x3=T REAL / k3… (3)

[0076] FIG. 5 shows the elastic deformation amount (x) and displacement amount (L) in the present embodiment. z This is a graph showing the relationship between ) and thrust (T). In Fig. 5, the horizontal axis represents thrust (T). In Fig. 5, the vertical axis on the left represents elastic deformation (x), and the vertical axis on the right represents displacement (L z It represents ).

[0077] The first straight line (1) shown in FIG. 5 is a proportional straight line expressed by equation (1) above, the second straight line (2) is a proportional straight line expressed by equation (2) above, and the third straight line (3) is a proportional straight line expressed by equation (3) above. The first to third elastic deformation amounts (x1 to x3) are the measured values ​​(T) in equations (1) to (3) above, which express the first to third straight lines (1 to 3). REAL It can be calculated by substituting ). In addition, the relationship between the first to third lines (1 to 3) is not limited to the relationship shown in FIG. 5. The relationship between the first to third lines (1 to 3) is changed by the first to third spring constants (k1 to k3).

[0078] As shown in FIG. 4, the first operation unit (62) outputs the first to third elastic deformation amounts (x1 to x3) to the estimation unit (63). The estimation unit (63) calculates the displacement amount (L) as shown in the following equation (4). z (0 <L z By subtracting the first to third elastic deformation amounts (x1 to x3) from )) the estimated value of AOD (AOD E Produces ).

[0079] AOD E =L z -x1-x2-x3… (4)

[0080] The above equation (4) has the following physical meaning. That is, as shown in FIG. 3, when the DUT (100) presses the probe card (10), the thermal head (31) and alignment stage (32) of the holding unit (30) are pressed in the -Z direction through the DUT (100) and deformed to be compressed in the Z direction. Accordingly, the holding unit (30) is deformed to be compressed in the Z direction by a first elastic deformation amount (x1). Likewise, the lower base (36) and driving part (37) of the pressing unit (35) are also deformed to be compressed in the Z direction, and the pressing unit (35) is deformed to be compressed in the Z direction by a second elastic deformation amount (x2).

[0081] Additionally, the bridge beam (41) and column member (42) of the support member (40) are pushed up in the +Z direction through the probe card (10), so the bridge beam (41) is deformed to bend toward the +Z direction, and the column member (42) is deformed to extend toward the +Z direction. Accordingly, the support member (40) is deformed to move out toward the +Z direction by a third elastic deformation amount (x3).

[0082] Accordingly, AOD is the measured amount of movement (L z Since the amount of movement (L at a specific point in time) is reduced by the sum of the first to third elastic deformation amounts (x1 to x3) with respect to ), by using the above equation (4), the amount of movement (L) at a specific point in time is reduced. z ) and thrust (TREAL Estimated value (AOD) based on ) E ) can be produced.

[0083] In addition, since the thickness of the DUT (100) and the thickness of the substrate (11) are thin compared to the components of the handler (20), the DUT (100) and the substrate (11) are hardly elastically deformed. Accordingly, in this embodiment, the amount of elastic deformation of the DUT (100) and the substrate (11) was not considered.

[0084] The recommendation value calculation unit (64) receives the AOD input from the AOD input unit (300). D Regarding the recommended value of the POD (POD R ) is obtained. Since the recommended value calculation unit (64) is not directly related to the estimation of AOD described in this embodiment, details will be described later.

[0085] The estimation unit (63) gives an estimated value (AOD) to the judgment device (70). E ) outputs. The judgment device (70) outputs the calculated estimated value (AOD). E It determines whether ) is normal or abnormal. Although not specifically limited, the determination device (70) determines whether the estimated value (AOD) is greater than the preset threshold value of AOD. E It is determined to be normal if ) is small, and conversely, the estimated value (AOD) is smaller than the corresponding threshold value. E It is determined to be abnormal if ) is large.

[0086] The judgment device (70) is an estimated value (AOD E If it is determined that ) is abnormal, a stop signal (S) to the drive control device (55) S ) outputs. The drive control device (55) outputs a stop signal (S S After receiving the input, the drive unit (37) is controlled to stop the movement of the holding unit (30) in the +Z direction. Specifically, the drive control device (55) controls the drive unit (37) to stop the motor (371) of the drive unit (37).

[0087] In addition, the judgment device (70) has an estimated value (AOD). E If ) is determined to be abnormal, a signal (S) to the notification device (75) j ) outputs. This notification device (75) outputs an estimated value (AOD). E It indicates that ) is abnormal. The notification device (75) is, for example, a device capable of outputting light or sound externally, and specifically, may be a display, warning light, speaker, etc. Such a notification device (75) informs the worker, etc. of an estimated value (AOD) by means of light or sound. E It can convey the intent that ) is abnormal.

[0088] The second calculation unit (80) calculates the first to third spring constants (k1 to k3) described above in advance before performing the estimation of AOD by the estimation device (60). Then, the second calculation unit (80) outputs the calculated first to third spring constants (k1 to k3) to the memory unit (61). Below, a method for pre-measuring the first to third spring constants (k1 to k3) using the second calculation unit (80) will be described.

[0089] FIG. 6 is a flowchart illustrating a preliminary measurement process of spring constants (k1 to k3) in the present embodiment. FIG. 7 is a cross-sectional view showing the state in which the holding unit (30) is raised to a first position (P1) when pre-measuring spring constants (k1 to k3) in the semiconductor device test apparatus (1) of FIG. 1, and FIG. 8 is a cross-sectional view showing the state in which the holding unit (30) is raised to a second position (P2) when pre-measuring spring constants (k1 to k3) in the semiconductor device test apparatus (1) of FIG. 1. The dashed lines in FIG. 8 represent the semiconductor device test apparatus (1), load cell (400), first measuring device (500), second measuring device (600), and dummy board (700) in FIG. 7. Furthermore, the preliminary measurement process shown in FIG. 6 corresponds to an example of an "acquisition process" in the present invention.

[0090] In the preliminary measurement process of this embodiment, as shown in FIG. 7, spring constants (k1 to k3) are calculated using a load cell (400), a first measuring device (500), a second measuring device (600), and a dummy board (700).

[0091] As shown in FIG. 4, the load cell (400) measures the thrust (load) in the Z direction applied to the load cell (400) and outputs it to the second calculation unit (80). In this preliminary measurement process, the probe card (10) is not attached to the bridge beam (41), and the third deformation amount (ΔD3) of the load cell (400) can be considered as the AOD of the contactor (12) of the probe card (10).

[0092] As shown in FIG. 7, the first measuring device (500) is attached to the holding unit (30). The first measuring device (500) measures the distance from the first measuring device (500) to the dummy board (700). Also, as shown in FIG. 4, the first measuring device (500) outputs the measured distance (H1, H2) (described later) to the second calculation unit (80). Although not specifically limited, a laser displacement meter, etc., can be used as the first measuring device (500).

[0093] As shown in FIG. 7, the second measuring device (600) measures the distance from the second measuring device (600) to the upper surface of the support member (40). The second measuring device (600) is equipped with a laser displacement meter (602) attached to the gantry frame (601) so as to face the upper surface of the bridge beam (41) and the gantry frame (601) provided on the outside of the handler (20). As shown in FIG. 4, the laser displacement meter (602) outputs the measured distance (H3, H4) (described later) to the second calculation unit (80).

[0094] As shown in FIG. 7, the dummy board (700) is a printed circuit board. As described above, in this preliminary measurement process, the probe card (10) is not attached to the bridge beam (41), and the dummy board (700) is attached to the bridge beam (41) instead of the substrate (11) of the probe card (10). The dummy board (700) is provided to ensure that the pressure applied to the bridge beam (41) through the load cell (400) is similar to the pressure applied to the bridge beam (41) through the substrate (11) of the probe card (10). Accordingly, the deformation of the bridge beam (41) when the probe card (10) is attached can be reproduced in the preliminary measurement process.

[0095] In the preliminary measurement process, first, as shown in FIG. 6, in step S101, the load cell (400) is held on the upper surface of the holding unit (30). Then, in step S102, by raising the holding unit (30) to a first position (P1) by the driving unit (37), the load cell (400) is brought into contact with the dummy board (700) as shown in FIG. 7. In addition, in this embodiment, the first position (P1) is the above movement amount (L z It is set to a position where ) becomes 0. However, the first position (P1) is not specifically limited and can be any position where the load cell (400) can be brought into contact with the dummy board (700).

[0096] In this embodiment, in step S102, the distance (H) measured by the first measuring device (500) is H1 (H=H1). Additionally, in this step S102, deformation of the load cell (400), deformation of the holding unit (30), deformation of the pressing unit (35), and elastic deformation of the support member (40) did not occur.

[0097] Next, in step S103 shown in FIG. 6, as shown in FIG. 8, the holding unit (30) is raised from the first position (P1) to the second position (P2) by the driving unit (37). At this time, the distance (H) measured by the first measuring device (500) is H2, which is shorter than H1 (H=H2 d This is the position after the driving unit (37) has driven the holding unit (30) to raise it by a set deformation amount (POD) along the path. This second position (P2) is not specifically limited and can be a position higher than the first position (P1).

[0098] Next, in step S104 shown in FIG. 6, the amount of change (ΔT) of the thrust (T) is obtained. As shown in FIG. 4, the second calculation unit (80) can calculate the amount of change (ΔT) from the output of the load cell (400). In addition, ΔT can be calculated based on the amount of change of the measured value of the thrust sensor (372) of the drive unit (37).

[0099] In Fig. 5, the amount of movement (L) obtained in this preliminary measurement process z A fourth straight line (4) representing the relationship between ) and thrust (T) was shown. In step S102, the thrust (T) output by the load cell (400) is set to 0. Then, in step S103, the drive control device (55) [determines] the holding unit (30) moves the amount (L ZP The drive unit (37) is controlled to rise by ) amount. In this embodiment, the thrust (T) measured after this rise is completed p ) is the change (ΔT) (ΔT=T P ).

[0100] ​Next, in step S105 shown in FIG. 6, a third deformation amount (ΔD3) in the Z direction of the load cell (400) is obtained. In this embodiment, the spring constant (k4) of the load cell (400) is a known value, and the memory unit (61) stores this spring constant (k4). The second calculation unit (80) calculates the third deformation amount (ΔD3) of the load cell (400) based on Hooke's Law, using the known spring constant (k4) obtained from the memory unit (61) and the change amount (ΔT).

[0101] Next, in step S106 shown in FIG. 6, the second deformation amount (ΔD2) of the holding unit (30) is obtained. As shown in FIG. 8, the second deformation amount (ΔD2) can be obtained by subtracting the third deformation amount (ΔD3) of the load cell (400) from the distance (ΔH) between the first position (P1) and the second position (P2).

[0102] In this embodiment, the second calculation unit (80) first calculates the distance (ΔH) between the first position (P1) and the second position (P2) by subtracting H2 obtained from the first measuring device (500) in step S103 from the height (H1) obtained from the first measuring device (500) in step S102 (ΔH=H1-H2). Then, the second calculation unit (80) calculates the second deformation amount (ΔD2) of the holding unit (30) by subtracting the third deformation amount (ΔD3) from this distance (ΔH) (ΔD2=ΔH-ΔD3).

[0103] Next, in step S107 shown in FIG. 6, the first spring constant (k1) of the holding unit (30) is calculated based on the change in thrust (ΔT) and the second deformation amount (ΔD2).

[0104] Additionally, in step S108 shown in FIG. 6, the fourth deformation amount (ΔD4) of the support member (40) is obtained. The fourth deformation amount (ΔD4) of the support member (40) is the sum of the bending amount of the bridge beam (41) in the +Z direction and the elongation amount (stretching amount) of the column member (42) in the +Z direction, and as shown in FIG. 8, the fourth deformation amount (ΔD4) can be calculated from the measurement value of the laser displacement meter (602).

[0105] In this embodiment, the second calculation unit (80) calculates the fourth deformation amount (ΔD4) by subtracting the distance (H4) output by the laser displacement meter (602) in step S103 from the distance (H3) output by the laser displacement meter (602) in step S102 (ΔD4=H3-H4).

[0106] Next, in step S109 shown in FIG. 6, the third spring constant (k3) of the support member (40) is calculated based on the change in thrust (ΔT) and the fourth deformation amount (ΔD4).

[0107] Additionally, in step S110 shown in FIG. 6, the second calculation unit (80) obtains the fifth deformation amount (ΔD5) of the pressurizing unit (35). The fifth deformation amount (ΔD5) is the displacement amount (L ZP It can be calculated by subtracting the distance (ΔH) and the fourth deformation amount (ΔD4) from ) (ΔD5=L ZP -ΔH-ΔD4). Here, since the distance (ΔH) is the sum of the aforementioned second deformation amount (ΔD2) and third deformation amount (ΔD3), the fifth deformation amount (ΔD5) is the displacement amount (L ZP In step S103, it is calculated by subtracting the sum between the third elastic deformation amount (ΔD3) of the load cell (400), the second elastic deformation amount (ΔD2) of the holding unit (30), and the fourth elastic deformation amount (ΔD4) of the support member (40) (ΔD5=L ZP -ΔD2-ΔD3-ΔD4).

[0108] Next, in step S111 shown in FIG. 6, the second calculation unit (80) calculates the second spring constant (k2) of the pressurizing unit (35) based on the change amount of thrust (ΔT) and the fifth deformation amount (ΔD5). In addition, if the driving unit (37) is equipped with a driving belt that transmits power from the motor (371), the second spring constant (k2) is also taken into account for the elongation of this driving belt.

[0109] In this manner, the first to third spring constants (k1 to k3) can be calculated by the second operation unit (80). The second operation unit (80) outputs the first to third spring constants (k1 to k3) calculated in this way to the memory unit (61), and the memory unit (61) stores the first to third spring constants (k1 to k3).

[0110] Next, a method for estimating AOD using the semiconductor device test apparatus (1) described above will be explained. This method for estimating AOD corresponds to an example of a "method for estimating deformation amount" in the present invention.

[0111] FIG. 9 is a flowchart illustrating an AOD estimation method in the present embodiment. This AOD estimation method is executed after the position determination of the DUT (100) by the alignment stage (32) is completed.

[0112] First, in step S201 of FIG. 9, the drive control device (55) moves the amount of movement (L z Control of the drive unit (37) is initiated to perform the raising of the holding unit (30) until it becomes a POD. Subsequently, in step S202, as shown in FIGS. 2 to 4, while the holding unit (30) is rising, the thrust (T) by the thrust sensor (372) REAL While measuring ) the amount of movement (L) by the stroke sensor (373) z ) is measured. As shown in Fig. 4, the measured thrust (T REAL ) and amount of movement (L z) is output to the first operation unit (62) of the estimation device (60).

[0113] Next, as shown in FIG. 9, in step S203, the measured thrust (T) by the first calculation unit (62) REAL The first to third elastic deformation amounts (x1 to x3) are calculated from the first to third spring constants (k1 to k3). This step S203 corresponds to an example of a "calculation process" in the present invention.

[0114] Next, in step S204, the movement amount (L) based on the above equation (4) by the estimation unit (63). z Estimated value (AOD) from ) and the first to third elastic deformation amounts (x1 to x3) E ) is calculated. This step S204 corresponds to an example of an "estimation process" in the present invention.

[0115] Next, in step S205, the estimated value (AOD) calculated by the determination device (70) E Determines whether ) is normal or abnormal.

[0116] In step S205, the estimated value (AOD) by the determination device (70) E If ) is determined to be normal, in step S206, the drive control device (55) [determines] the amount of movement (L) acquired by the stroke sensor (373). z Determines whether ) has reached the POD.

[0117] In step S206, the amount of movement (L z If it is determined that ) has reached the POD, in step S207, the drive control device (55) controls the drive unit (37) to complete the raising of the holding unit (30). Meanwhile, in step S206, the amount of movement (L z If it is determined that the POD has not been reached, the drive control device (55) controls the drive unit (37) to continue the upward movement of the holding unit (30).

[0118] Also, in step S205, the estimated value (AODE If it is determined that ) is abnormal, in step S208, the drive control device (55) controls the drive unit (37) to stop the rising of the holding unit (30). Also, at the same time, the notification device (75) informs the operator of the estimated value (AOD). E It conveys the intent that ) is abnormal.

[0119] In the above embodiment, if the semiconductor device test device (1) and the method for estimating AOD are as follows, the thrust (T) obtained from the thrust sensor (372) REAL Based on ), the rising AOD of the holding unit (30) can be estimated.

[0120] In addition, in the present embodiment, if the semiconductor device test device (1) and the method for estimating AOD are used, the AOD can always be monitored when pressure is applied to the contactor (12) of the terminal (101), so it is possible to determine whether the AOD at that point is normal or abnormal. Therefore, since the AOD can be suppressed from becoming excessive when pressure is applied to the contactor (12) of the terminal (101), damage to the terminal (101) and the contactor (12) can be reduced. Thus, the lifespan of the terminal (101) and the contactor (12) can be extended.

[0121] Furthermore, in this embodiment, if the semiconductor device test device (1) and the method for estimating AOD are the desired AOD, D Recommended value of the POD corresponding to (POD R It can also calculate the desired AOD. D This is, for example, the optimal value of AOD set according to the type of probe card (10).

[0122] FIG. 10 shows the recommended value of the POD (POD) in this embodiment. R This is a flowchart explaining the method of calculating ). As shown in FIG. 10, first, in step S301, a desired AOD is input to the AOD input unit (300) shown in FIG. 4. D cast Input. AOD D The value may be a value set in a test program stored in the semiconductor device test device (1), similar to the POD described above, or a value entered by an operator into the semiconductor device test device (1) before executing a test of the DUT (100). The AOD input unit (300) is not particularly limited, but may be a storage medium storing a test program, or a user interface.

[0123] Next, in step 302, the desired AOD is sent from the AOD input unit (300) to the recommendation value calculation unit (64). D cast Input, and the recommendation value calculation unit (64) is AOD D A POD is selected according to the above. Specifically, in this case, the memory unit (61) shown in FIG. 4 stores a table showing the relationship between the POD and the thrust (T) in addition to the first to third spring constants (k1 to k3) described above. For example, in the equation of the fourth straight line (4) shown in FIG. 5, the amount of movement (L Z By considering ) as a POD, a table including the POD and the thrust (T) corresponding to this POD can be obtained.

[0124] And, the recommendation value calculation unit (64), in addition to the first to third spring constants (k1 to k3) described above, substitutes the combination between the POD included in this table and the thrust (T) corresponding to the POD into the following equation (5) to calculate a plurality of AODs corresponding to the combination.

[0125] AOD=POD-T / k1-T / k2-T / k3… (5)

[0126] And, the recommendation value calculation unit (64) calculates the AOD among the plurality of AODs calculated from the above (5) equation. D Select the value of the POD used when calculating the AOD value closest to .

[0127] Next, in step S303, the recommendation value calculation unit (64) selects the selected POD and calculates the recommendation value (POD R It outputs to the drive control device (55) as ).

[0128] Next, in step S304, the drive control device (55) recommends a value (POD R The drive unit (37) is controlled to raise the holding unit (30) by that amount.

[0129] In the above embodiment, if the semiconductor device test device (1) and the method for estimating AOD are the desired AOD D Recommended value corresponding to (POD R Since the holding unit (30) can be raised by ) amount, the value of the AOD is the desired AOD D It can be set to a value approximately the same as that. Accordingly, since the terminal (101) can be pressed against the contactor (12) to obtain an AOD suitable for the type of probe card, damage to the terminal (101) and the contactor (12) can be reduced. Therefore, the lifespan of the terminal (101) and the contactor (12) can be extended.

[0130] [Second Embodiment]

[0131] FIG. 11 is a block diagram illustrating the configuration of the driving unit (37) and the control device (50) in the second embodiment. In the second embodiment, the driving unit (37) does not have a thrust sensor (372) and a stroke sensor (373). That is, it differs from the first embodiment in that it estimates the value of AOD without using the measurement results of the sensors, but the other configurations are identical. Below, regarding the estimation of AOD in the second embodiment, only the differences from the first embodiment will be explained, and parts that are identical in configuration to the first embodiment will be given the same reference numerals and will be omitted from explanation.

[0132] As shown in FIG. 11, in this embodiment, the drive control device (55) gives a drive signal (S) to raise the holding unit (30). d )cast Output to the motor (371). More specifically, the drive control device (55) supplies a current to the motor (371) that causes the motor (371) to generate a predetermined torque (TQ). Additionally, the drive control device (55) outputs a signal containing information regarding the torque (TQ) to the memory unit (61).

[0133] In this embodiment, the memory unit (61) stores a table showing the relationship between torque (TQ) and thrust (T), and obtains the thrust (T) corresponding to the torque (TQ) from the table. Although not specifically limited, the relationship between torque (TQ) and thrust (T) can be obtained based on the torque of the motor (371) and the thrust detected by the load cell (400) when a preliminary measurement process (see FIG. 6) is performed.

[0134] Furthermore, the memory unit (61), in the same manner as in the first embodiment, in addition to the first to third spring constants (k1 to k3) described above, has an indicated movement amount (L Zi It also stores a table showing the relationship between ) and thrust (T). The memory unit (61) stores the thrust (T) corresponding to the input torque (TQ) and the indicated displacement amount (L) corresponding to the thrust (T) based on the equation of the fourth straight line (4) shown in FIG. 5. Zi ) is acquired. And, this memory unit (61) has a thrust (T) corresponding to the torque (TQ) and an indicated displacement amount (L) corresponding to the thrust (T). Zi ) and the first to third spring constants (k1 to k3) described above are output to the first calculation unit (62). In addition, as described above, the first calculation unit (62), in the same manner as in the first embodiment, calculates the first to third elastic deformation amounts (x1 to x3) based on the first to third spring constants (k1 to k3) and the thrust (T). Then, the first calculation unit (62) calculates the indicated displacement amount (LZi ) and the first to third elastic deformation amounts (x1 to x3) are output to the estimation unit (63). In addition, as described above, since thrust (T) can be expressed as a linear function using the torque of the motor (371) of the drive unit (37), the elastic deformation amount may be calculated using the value of torque (TQ) instead of thrust (T).

[0135] The estimation unit (63) is a moving amount (L) as shown in the following equation (6). zi By subtracting the first to third elastic deformation amounts (x1 to x3) from ), the estimated value of AOD (AOD E Produces ).

[0136] AOD E =L zi -x1-x2-x3… (6)

[0137] In this way, according to the second embodiment, the semiconductor device test device (1) and the method for estimating AOD can estimate the rising AOD of the holding unit (30) based on the torque (TQ) of the motor (371).

[0138] Furthermore, the embodiments described above are provided to facilitate understanding of the present invention and are not intended to limit the invention. Accordingly, each element disclosed in the above embodiments is intended to include all design modifications or equivalents that fall within the technical scope of the present invention.

[0139] For example, the AOD estimation method described in the first and second embodiments is a method for estimating AOD in real time when pressurizing the DUT (100), and a desired POD before pressurizing the DUT (100). D It may also be a method to estimate AOD based on

[0140] FIG. 12 is a flowchart illustrating a different AOD estimation method in the present embodiment. This AOD estimation method is executed before the holding unit (30) starts to rise.

[0141] As shown in FIG. 12, first, in step S401, the desired POD in the memory unit (61) D cast Input. It is not specifically illustrated, but the desired POD D It can be input into the memory unit (61) by the POD input unit (200).

[0142] Next, in step S402, the memory unit (61) is the desired POD D Thrust corresponding to (T D )second Acquire the desired POD D Thrust corresponding to (T D ) is the amount of movement (L z ) This POD D This is an estimated value of the thrust obtained when it becomes. This thrust (T D ) can be obtained, for example, from the fourth straight line (4) shown in FIG. 5, and specifically, in this fourth straight line (4), the amount of movement (L Z The value of ) is POD D It can be done with the thrust at that time.

[0143] Next, in step S403, the first calculation unit (62) generates thrust (T D ) and the first to third elastic deformation amounts (x) from the first to third spring constants (k1 to k3). D1 to x D3 ) is calculated. At this time, the first operation unit (62) may use the above equations (1) to (3).

[0144] Next, in step S404, the estimation unit (63) is POD D and the first to third elastic deformation amounts (x D1 to x D3 Estimated value (AOD) based on the following equation (7) from ) E Produces ).

[0145] AOD E =POD D -x D1 -x D2 -x D3 … (7)

[0146] Next, in step S405, the estimated value (AOD) calculated by the determination device (70) E Determines whether ) is normal or abnormal.

[0147] In step S405, the estimated value (AOD) by the determination device (70) E If it is determined that ) is normal, in step S406, the drive control device (55) holds the holding unit (30) POD D Start controlling the drive unit (37) to raise it by that amount.

[0148] Meanwhile, in step S405, the estimated value (AOD) by the judgment device (70) E If it is determined that ) is abnormal, in step S407, the drive control device (55) controls the drive unit (37) to stop the start of the rising of the holding unit (30). Also, at the same time, the notification device (75) informs the operator of the estimated value (AOD). E It conveys the intent that ) is abnormal.

[0149] As described above, in the present embodiment, the semiconductor device test device (1) and the method for estimating AOD can estimate the AOD when the holding unit (30) is in a state where the raising is completed before the terminal (101) of the DUT (100) contacts the contactor (12).

[0150] In addition, if this semiconductor device test device (1) and the method for estimating AOD are used, when the estimated AOD is abnormal, a POD is appropriately used. D cast By modifying it, the AOD can be suppressed from becoming excessive, thereby extending the lifespan of the terminal (101) and the contactor (12). Explanation of the symbols

[0151] 1: Semiconductor device test apparatus 10: Probe card 11: Substrate 12: Contactor 15: Test head 20: Handler 30: Holding unit 31: Thermal head 311: Holding surface 32: Alignment stage 35: Pressurizing unit 36: Lower base 37: Drive unit 371: Motor 372: Thrust sensor 373: Stroke sensor 40: Support member 41: Bridge beam 42: Column member 50: Control device 55: Drive control unit 60: Estimation unit 61: Memory unit 62: First operation unit 63: Estimation Unit 64: Recommendation Value Calculation Unit 70: Judgment device 75: Notification device 80: Second operation unit 100: DUT 101: Terminal 200: POD Input 300: AOD Input Section 400: Load Cell 500: First measuring device 600: Second measuring device 601: Gantry frame 602: Laser displacement gauge 700: Dummy board

Claims

Claim 1 delete Claim 2 A semiconductor device test apparatus comprising: a holding device for holding a DUT; a connecting device having a contactor that contacts a terminal of the DUT; a pressing device having a driving unit that presses the terminal toward the contactor by moving the holding device in a first direction and a base unit that supports the driving unit; a supporting unit that supports the connecting device so that the connecting device faces the holding device and is supported by the base unit; an estimation device that estimates a first deformation amount of the contactor in the first direction based on the thrust of the driving unit in the first direction; and a driving control device that additionally controls the driving unit so that the driving unit moves the holding device in the first direction by an indicated amount of movement, wherein the estimation device calculates an estimated value of the first deformation amount based on the first elastic deformation amount of the holding device, the second elastic deformation amount of the pressing device, and the third elastic deformation amount of the supporting unit from the indicated amount of movement. Claim 3 A semiconductor device test apparatus according to claim 2, wherein the estimation device comprises: a memory unit storing a first spring constant of the holding device, a second spring constant of the pressurizing device, and a third spring constant of the support member; a calculation unit calculating the first to third elastic deformation amounts based on the first to third spring constants and the thrust; and an estimation unit calculating the estimated value based on the indicated displacement amount and the first to third elastic deformation amounts. Claim 4 A semiconductor device test apparatus according to claim 3, wherein the memory unit further stores the indicated movement amount corresponding to the thrust, and the estimation unit uses the indicated movement amount corresponding to the thrust as the indicated movement amount. Claim 5 The semiconductor device test device of claim 2, wherein the semiconductor device test device further comprises a determination device for determining whether the estimated value of the first deformation amount calculated by the estimation device is normal or abnormal. Claim 6 A semiconductor device test device according to claim 5, wherein when the determination device determines that the estimated value is abnormal, the drive control device controls the drive unit to stop the drive unit from moving the holding device in the first direction. Claim 7 A semiconductor device test device according to claim 5, wherein the semiconductor device test device further comprises a notification device indicating that the estimated value is abnormal. Claim 8 A semiconductor device test device according to claim 2, wherein the estimation device further comprises a recommendation value calculation unit that calculates a recommended value of the indicated displacement amount such that the estimated value of the first displacement amount becomes the optimal value based on the type of the connection device and the thrust, and the drive control device controls the drive unit based on the recommended value. Claim 9 A semiconductor device test apparatus according to claim 2, wherein the DUT comprises a reorganized die, and the connecting device comprises a probe card having a contactor that contacts the terminal provided by the die. Claim 10 A strain estimation method for estimating a first strain amount in a semiconductor device test apparatus described in any one of claims 2 to 9, comprising an estimation process for estimating the first strain amount based on the thrust. Claim 11 A method for estimating a deformation amount according to claim 10, wherein the estimation process comprises calculating an estimated value of the first deformation amount based on the indicated movement amount of the holding device in the first direction indicated by the drive control device, the first elastic deformation amount of the holding device, the second elastic deformation amount of the pressing device, and the third elastic deformation amount of the support member. Claim 12 The deformation amount estimation method of claim 11 further comprises an acquisition process for acquiring a first spring constant of the holding device, a second spring constant of the pressurizing device, and a third spring constant of the support member, and a calculation process for calculating the first to third elastic deformation amounts based on the first to third spring constants and the thrust. Claim 13 A method for estimating a deformation amount according to claim 12, wherein the acquisition process comprises moving the holding device from a first position to a second position by the driving unit, acquiring the amount of change in thrust when the holding device moves from the first position to the second position, acquiring the amount of second deformation in the first direction of the holding device when the holding device moves from the first position to the second position, and calculating the first spring constant based on the amount of change in thrust and the amount of second deformation. Claim 14 A method for estimating a deformation amount according to claim 13, wherein the support member comprises a bridge beam to which a dummy board is attached and a column member that is erected and installed on the base member and supports the bridge beam, and the acquisition process comprises holding a load cell in the holding device, moving the holding device to the first position by the driving unit to bring the load cell into contact with the dummy board, acquiring a third deformation amount in the first direction of the load cell when the holding device is located in the second position, and acquiring a second deformation amount by subtracting the third deformation amount from the distance between the first position and the second position. Claim 15 A method for estimating a deformation amount according to claim 13, wherein the acquisition process comprises acquiring a fourth deformation amount in the first direction of the support member when the holding device is moved from the first position to the second position by the driving unit, and calculating a third spring constant of the support member based on the change amount of the thrust and the fourth deformation amount. Claim 16 A method for estimating a deformation amount according to claim 15, wherein the acquisition process comprises calculating a fifth deformation amount in the first direction of the pressurizing device by subtracting the distance between the first position and the second position and the fourth deformation amount from a preset deformation amount of the contactor, and calculating a second spring constant of the pressurizing device based on the change amount of the thrust and the fifth deformation amount.

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