Double-sided inline foreign matter measurement and defective product separation device for printed circuit boards

Abstract

The present invention relates to a double-sided inline foreign substance measurement and defective product separation device for printed circuit boards. The technical problem to be solved is to provide a device that accurately detects foreign substances and abnormal circuit patterns by simultaneously inspecting the upper and lower surfaces in real time during a continuous production process of printed circuit boards, and automatically sorts defective boards based on this. To this end, the present invention comprises: an upper camera unit that photographs the upper surface of a printed circuit board; a lower camera unit that photographs the lower surface of a printed circuit board; a board transfer and alignment unit that transfers the printed circuit board from one side to the other and controls the Z-axis position and X / Y-axis position of the printed circuit board; and a foreign substance detection and defective pattern analysis unit that receives captured images of the upper and lower surfaces of the printed circuit board from the upper camera unit and the lower camera unit and detects whether foreign substances and defective patterns exist on the upper and lower surfaces of the printed circuit board. A double-sided inline foreign matter measurement and defective product separation device for printed circuit boards is disclosed, comprising: a defective board sorting unit that picks up and transfers to another path so as not to pass to a subsequent process when the foreign matter detection and defective pattern analysis unit determines that the printed circuit board is a defective board.

Description

Technology Field

[0001] The present invention relates to a double-sided inline foreign matter measurement and defective product separation device for printed circuit boards. Background Technology

[0002] Printed circuit boards (PCBs) are components that play a crucial role in electronic devices and are used as substrates for constructing electronic circuits. In particular, PCBs equipped with high-performance semiconductors are becoming increasingly finer and more complex in terms of circuit patterns. Accordingly, inspection technology to ensure the quality of PCBs is very important. Existing PCB inspection technologies mainly rely on visual inspection or apply batch inspection methods through Automatic Optical Inspection (AOI) systems.

[0003] Although AOI systems identify defects by moving inspected PCBs to an inspection device, this method has disadvantages, such as the ability to inspect only a portion of the samples from the entire process, time delays in returning the boards to their original positions after inspection, and reduced productivity. Furthermore, it cannot guarantee the accurate detection of contamination or defects that may occur during the inspection process, and it is difficult to immediately reflect the results of defects in subsequent processes once they occur on the production line.

[0004] The primary challenge arising from these issues is to improve inspection accuracy while simultaneously rapidly identifying defective substrates during the production process and propagating them to subsequent processes to prevent mass production of defective substrates. Therefore, this invention aims to overcome the limitations of existing technologies and propose a method for automatically separating defective substrates through accurate real-time inspection during a continuous production process.

[0005] The information described above disclosed in the background technology of this invention is intended only to enhance understanding of the background of the present invention and may therefore include information that does not constitute prior art. The problem to be solved

[0006] The primary objective of the present invention is to provide a device that accurately detects foreign substances and abnormal circuit patterns by simultaneously inspecting the upper and lower surfaces in real time during a continuous PCB production process, and automatically sorts out defective substrates based on this detection. Through this, it is possible to prevent defective substrates from advancing to the next process, increase the yield of good products, and reduce large-scale losses. Specifically, the present invention resolves the issues of reduced productivity and accuracy that may occur in conventional inspection methods, and enables efficient quality control by detecting defective substrates in real time even in high-speed production processes. Furthermore, it allows for the accurate separation of defective substrates and their delivery to subsequent processes, thereby minimizing the defect rate. means of solving the problem

[0007] The double-sided inline foreign substance measurement and defective product separation device for a printed circuit board according to the present invention comprises: an upper camera unit for photographing the upper surface of a printed circuit board; a lower camera unit for photographing the lower surface of a printed circuit board; a board transfer and alignment unit for transferring the printed circuit board from one side to the other and controlling the Z-axis position and X / Y-axis position of the printed circuit board; a foreign substance detection and defective pattern analysis unit for receiving captured images of the upper and lower surfaces of the printed circuit board from the upper camera unit and the lower camera unit and detecting whether foreign substances and defective patterns exist on the upper and lower surfaces of the printed circuit board; and a defective board sorting unit for picking up and transferring the defective board to another path so that it does not pass to a subsequent process when the foreign substance detection and defective pattern analysis unit determines the printed circuit board to be a defective board.

[0008] In some examples, the upper camera unit includes an upper camera that photographs the upper surface of the printed circuit board, an upper height sensing unit that senses the height from the printed circuit board for automatic focus control of the upper camera, and an upper height control unit that controls the upper height of the upper camera, and the lower camera unit includes a lower camera that photographs the lower surface of the printed circuit board, a lower height sensing unit that senses the height from the printed circuit board for automatic focus control of the lower camera, and a lower height control unit that controls the lower height of the lower camera.

[0009] In some examples, the substrate transfer and alignment unit comprises: a substrate transfer unit including a pair of rollers positioned below the printed circuit board and a belt coupled to the pair of rollers to allow the printed circuit board to be mounted and transferred from one side to the other; and an alignment unit including a pressing guide roll positioned on each side of the transfer direction of the printed circuit board to press the upper surface of the printed circuit board so that the printed circuit board is pressed toward the belt in the Z-axis direction, and an alignment guide roll positioned on each side of the transfer direction of the printed circuit board to press the side of the printed circuit board so that the printed circuit board is aligned in the X / Y axis direction.

[0010] In some examples, it further includes an upper lighting unit installed around the upper camera unit to provide illumination to the upper surface of the printed circuit board; and a lower lighting unit installed around the lower camera unit to provide illumination to the lower surface of the printed circuit board.

[0011] In some examples, the defective substrate sorting unit includes a robotic arm for picking up the defective substrate; a vacuum chuck installed at the end of the robotic arm for vacuum adsorbing the defective substrate; and a separate conveyor for transporting the defective substrate to another path.

[0012] In some examples, the foreign object detection and defect pattern analysis unit outputs a warning notification signal if the number of defect substrates is higher than a set value.

[0013] In some examples, the foreign object detection and defect pattern analysis unit receives an original printed circuit board circuit diagram in the form of a CAD (Computer Aided Design) file and compares and analyzes the original printed circuit board circuit diagram with the circuit diagram of the actual printed circuit board captured by the upper camera unit and the lower camera unit.

[0014] In some examples, the foreign object detection and defect pattern analysis unit compares the circuit diagram entered into the CAD file with the circuit diagram of the printed circuit board inspected in real time to identify defects and abnormal parts that occurred in the circuit diagram.

[0015] In some examples, the foreign object detection and defect pattern analysis unit learns the shape of the foreign object using an artificial intelligence module (e.g., a deep learning module) and distinguishes and outputs each foreign object shape based on the learned information. Effects of the invention

[0016] The present invention can accurately detect foreign substances and defect patterns through a high-resolution camera system that simultaneously inspects the top and bottom surfaces and an AI-based pattern recognition algorithm. This enables the rapid identification and sorting of defective substrates. Furthermore, if a defect is detected immediately in a continuous flow production process, the present invention can prevent the defective substrate from proceeding to subsequent processes. This lowers the defect rate, increases the yield of good products, and reduces large-scale losses. Additionally, through a function that automatically sorts defective substrates, the present invention allows for the efficient separation of defective products without manual intervention by inspection operators. This enhances the level of automation in the production line and ensures consistency in quality control. Moreover, by automatically sorting defective substrates at the beginning of the production process, the present invention can prevent the mass production of large quantities of defective substrates that could occur in subsequent processes. Furthermore, by preventing defective substrates from passing to subsequent processes, waste is minimized, and the causes of defects can be rapidly identified, contributing to process improvement. Additionally, the present invention can be applied to various manufacturing processes, including not only printed circuit boards but also solar substrates, silicon substrates, and flexible substrates. In particular, it provides an effective solution for foreign substance detection and defect sorting in high-speed and large-scale production environments. Through these effects, the present invention will further enhance PCB inspection technology and contribute to improving the productivity and quality of high-performance electronic devices. Brief explanation of the drawing

[0017] FIGS. 1a and 1b are a rear perspective view and a front view illustrating a double-sided inline foreign matter measurement and defective product separation device for a printed circuit board according to the present invention. FIG. 2 is a perspective view illustrating a substrate measuring section of a double-sided inline foreign matter measuring and defective product separation device for printed circuit boards according to the present invention. FIG. 3 is a perspective view illustrating the board alignment and transfer section of the double-sided inline foreign matter measurement and defective product separation device for printed circuit boards according to the present invention. FIG. 4 is an enlarged perspective view of the board alignment and transfer section of the double-sided inline foreign matter measurement and defective product separation device for printed circuit boards according to the present invention. FIG. 5 is a perspective view illustrating the lighting unit of the double-sided inline foreign matter measurement and defective product separation device for printed circuit boards according to the present invention. FIG. 6 is a perspective view illustrating a defective sorting section of a double-sided inline foreign matter measurement and defective product separation device for printed circuit boards according to the present invention. Specific details for implementing the invention

[0018] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0019] The present inventions are provided to more fully explain the invention to those skilled in the art, and the following examples may be modified in various different forms, and the scope of the invention is not limited to the following examples. Rather, these examples are provided to make the disclosure more faithful and complete and to fully convey the spirit of the invention to those skilled in the art.

[0020] Additionally, in the drawings below, the thickness or size of each layer is exaggerated for convenience and clarity of explanation, and like reference numerals in the drawings refer to like elements. As used herein, the term "and / or" includes any one of the listed items and all combinations of one or more thereof. Furthermore, in this specification, the meaning of "connected" refers not only to cases where Member A and Member B are directly connected, but also to cases where Member C is interposed between Member A and Member B so that Member A and Member B are indirectly connected.

[0021] The terms used herein are for describing specific embodiments and are not intended to limit the invention. As used herein, the singular form may include the plural form unless the context clearly indicates otherwise. Additionally, as used herein, "comprise, include" and / or "comprising, including" specify the presence of the mentioned features, numbers, steps, actions, parts, elements, and / or groups thereof, and do not exclude the presence or addition of one or more other features, numbers, actions, parts, elements, and / or groups.

[0022] Although terms such as "first," "second," etc. are used in this specification to describe various components, parts, regions, layers, and / or parts, it is obvious that these components, parts, regions, layers, and / or parts should not be limited by these terms. These terms are used solely to distinguish one component, part, region, layer, or part from another region, layer, or part. Accordingly, the first component, part, region, layer, or part described below may refer to the second component, part, region, layer, or part without departing from the teachings of the present invention.

[0023] Spatial terms such as "beneath," "below," "lower," "above," and "upper" may be used to facilitate understanding of one element or feature depicted in the drawings and another element or feature. These spatial terms are intended to facilitate understanding of the invention according to various process or usage conditions of the invention and are not intended to limit the invention. For example, if an element or feature in the drawings is inverted, an element or feature described as "beneath" or "below" becomes "upper" or "on top." Therefore, "below" is a concept that encompasses "upper" or "below."

[0024] Additionally, the control unit (controller) and / or other related devices or components according to the present invention may be implemented using any suitable hardware, firmware (e.g., application-specific semiconductor), software, or a suitable combination of software, firmware, and hardware. For example, various components of the control unit (controller) and / or other related devices or components according to the present invention may be formed on a single integrated circuit chip or on separate integrated circuit chips. Additionally, various components of the control unit (controller) may be implemented on a flexible printed circuit film, or may be formed on a tape carrier package, a printed circuit board, or on the same substrate as the control unit (controller). Additionally, various components of the control unit (controller) may be processes or threads running on one or more processors in one or more computing devices, which may execute computer program instructions and interact with other components to perform the various functions mentioned below. Computer program instructions are stored in memory that can be executed on a computing device using a standard memory device, such as, for example, random access memory. Computer program instructions may also be stored on other non-transitory computer readable media, such as, for example, CD-ROMs, flash drives, etc. Furthermore, those skilled in the art relating to the present invention should recognize that the functions of various computing devices may be combined with one another, integrated into a single computing device, or the functions of a specific computing device may be distributed across one or more other computing devices without departing from the embodiments of the present invention.

[0025] For example, the control unit (controller) according to the present invention may be operated in a conventional commercial computer comprising a central processing unit, a mass storage device such as a hard disk or a solid-state disk, a volatile memory device, an input device such as a keyboard or a mouse, and an output device such as a monitor or a printer.

[0026] FIGS. 1a and 1b are drawings showing a rear perspective view and a front view of a double-sided inline foreign matter measurement and defective product separation device (100) for a printed circuit board (PCB) according to the present invention. These drawings help to visually understand the components and operation of the system of the present invention and clearly explain the overall configuration of the system and the role of each component.

[0027] FIG. 1a shows a view from the rear of the device (100) according to the present invention and shows the main computer system and control device that drive the entire system. As shown in FIG. 1a, the device (100) according to the present invention may include an AI process computer (101), an upper image acquisition computer (102), a lower image acquisition computer (103), and a lighting controller (104).

[0028] The AI ​​process computer (101) plays an important role in the present invention. This computer is responsible for the function of learning and analyzing foreign substances or defect patterns present on the PCB in real time using an artificial intelligence (AI) module. The AI ​​module analyzes collected images and accurately classifies foreign substances or defect patterns to identify defective substrates and perform subsequent processing.

[0029] The upper image acquisition computer (102) and the lower image acquisition computer (103) each serve to process images generated from cameras that photograph the upper and lower surfaces of the PCB. These computers process the images received from the cameras in real time and detect foreign substances and defect patterns. Images captured by each camera are transmitted to the computer, where foreign substance detection and defect pattern analysis are performed.

[0030] The lighting controller (104) is a device that controls the lighting required when photographing the upper and lower surfaces. This device accurately illuminates the surface of the substrate being photographed to improve image quality and helps to distinguish foreign substances and defective patterns.

[0031] FIG. 1b shows a view from the front of the device (100) and shows the part where the PCB is actually inspected and how the user interface device is configured. As illustrated in FIG. 1b, the device (100) according to the present invention may include an upper surface measuring mechanism (105), a lower surface measuring mechanism (106), a PCB aligner (1071), a load (1072), a light (1073), a keyboard and mouse (1074), and a monitor (1075).

[0032] The upper surface measuring mechanism (105) and the lower surface measuring mechanism (106) are devices for inspecting the upper and lower surfaces of the PCB, respectively. These mechanisms include an upper camera unit (110) and a lower camera unit (120), and accurately measure the substrate to analyze foreign substances and defect patterns in real time.

[0033] The upper surface measuring mechanism (105) and the lower surface measuring mechanism (106) accurately scan the surface of the substrate and transmit this information to the AI ​​process computer (101) to play an important role in separating defective substrates.

[0034] A PCB aligner (1071) is a device responsible for aligning a substrate. This device precisely adjusts the X-axis, Y-axis, and Z-axis directions of the substrate so that the substrate is placed in the correct position during inspection.

[0035] The PCB aligner (1071) works in conjunction with the substrate transfer component to help position the substrate accurately between the camera and the inspection device. In practice, the PCB aligner (1071) is associated with the substrate transfer and alignment unit (130).

[0036] The load (1072) serves to safely load the substrate into the inline inspection device (100), and the substrate is transported between the upper surface measuring mechanism (105) and the lower surface measuring mechanism (106).

[0037] The lighting (1073) plays an important role when photographing the substrate and improves inspection quality by adjusting the appropriate lighting angle and brightness. The lighting (1073) is associated with a lighting controller (104), an upper lighting unit (160), and a lower lighting unit (170).

[0038] The keyboard and mouse (1074) are input devices that enable the user to interact with the AI ​​process computer (101) or the image acquisition computer (102, 103). Through this, the inspection results can be monitored in real time, and manual control or settings can be changed as needed.

[0039] The monitor (1075) is a display device that displays a real-time image of the substrate being inspected to the user and shows the separation status of the defective substrate or the substrate status in real-time.

[0040] The electrical system of the present invention may be installed in a cuboid-shaped main frame (or control rack). The system includes the following elements: The main frame or control rack is a central device in which all computers and devices are installed. Here, major control devices such as an AI process computer (101), image acquisition computers (102, 103), and a lighting controller (104) are integrated and managed. The main frame manages power supply and communication connections between each device and enables efficient control of the entire system.

[0041] FIGS. 1a and 1b clearly visualize the components and operating principles of the double-sided inline foreign object measurement and defective product separation device (100) of a PCB according to the present invention. Major system components, such as an AI process computer (101), an image acquisition computer (102, 103), an upper / lower surface measurement mechanism (105, 106), and a PCB aligner (1071), are integrated within a cuboid-shaped main frame to support accurate inspection and separation of defective substrates. This overall system configuration plays an essential role in effectively performing double-sided inspection of the PCB and automatic separation of defective substrates.

[0043] FIG. 2 is a perspective view illustrating the upper camera unit / lower camera unit (110 / 120) of the double-sided inline foreign matter measurement and defective product separation device (100) of the PCB according to the present invention, FIG. 3 is a perspective view illustrating the substrate transfer and alignment unit (130) of the double-sided inline foreign matter measurement and defective product separation device (100) of the PCB according to the present invention, FIG. 4 is an enlarged perspective view illustrating the substrate transfer and alignment unit (130) of the double-sided inline foreign matter measurement and defective product separation device (100) of the PCB according to the present invention, FIG. 5 is a perspective view illustrating the upper lighting unit / lower lighting unit (150 / 170) of the double-sided inline foreign matter measurement and defective product separation device (100) of the PCB according to the present invention, and FIG. 6 is a perspective view illustrating the defective sorting unit (150) of the double-sided inline foreign matter measurement and defective product separation device (100) of the PCB according to the present invention.

[0044] As illustrated in FIGS. 2 to 6, the double-sided inline foreign object measurement and defective product separation device (100) of a PCB according to the present invention may include an upper camera unit (110), a lower camera unit (120), a substrate transfer and alignment unit (130), a foreign object detection and defective pattern analysis unit (not shown), and a defective substrate sorting unit (150). The device (100) according to the present invention may further include an upper lighting unit (160) and a lower lighting unit (170).

[0045] First, refer to FIG. 2. The upper camera unit (110) and the lower camera unit (120) each serve to photograph and inspect the upper and lower surfaces of the PCB.

[0046] The upper camera unit (110) captures the upper surface of the PCB and transmits the captured upper surface image to the foreign object detection and defect pattern analysis unit. The upper camera unit (110) includes an upper camera (111) that captures the upper surface of the PCB, an upper height sensing unit (112) that senses the height from the PCB for automatic focus control of the upper camera (111), and an upper height control unit (113) that controls the upper height of the upper camera (111). Through this, the height and focus of the upper camera (111) can be precisely controlled, and an accurate image can be captured.

[0047] The lower camera unit (120) photographs the lower surface of the PCB and transmits the captured lower surface image to the foreign object detection and defect pattern analysis unit. The lower camera unit (120) includes a lower camera (121) that photographs the lower surface of the PCB, a lower height sensing unit (not shown) that senses the height from the PCB for automatic focus control of the lower camera (121), and a lower height control unit (123) that controls the lower height of the lower camera (121). Through this, the height and focus of the lower camera (121) can be precisely controlled, and an accurate image can be captured.

[0048] The upper camera unit (110) and the lower camera unit (120) are key components of the present invention and are responsible for inspecting the upper and lower surfaces of the PCB, respectively. These two cameras detect foreign substances and defective patterns in real time through high-resolution image capture and precise position control. An example of the operation of each camera unit is described below.

[0049] The upper camera unit (110) captures the upper surface of the PCB to detect foreign substances and defective patterns. An example of the operation of the upper camera unit (110) is as follows: The upper camera (111) captures the upper surface of the PCB using a high-resolution image sensor. This camera is mainly combined with a high-magnification lens to accurately capture fine circuit patterns, foreign substances, and defective patterns. The captured image is converted into a digital image and transmitted to the foreign substance detection and defective pattern analysis unit.

[0050] The upper camera (111) is automatically controlled to maintain a constant focus while capturing the upper surface of the PCB. This is an important process because there may be various heights or surfaces on the upper surface of the PCB. The upper height sensing unit (112) senses the height from the PCB and measures the height of the upper camera (111) in real time. The measured height information is transmitted to the upper height control unit (113) to adjust the upper camera (111) so that it maintains an optimal focus on a specific part of the upper surface of the PCB.

[0051] The image captured by the upper camera (111) is transmitted to the foreign object detection and defect pattern analysis unit. The analysis unit analyzes the captured image in real time to detect foreign objects (dust, foreign object particles, etc.) or defect patterns (bridges, defects, etc.).

[0052] The lower camera unit (120) photographs the lower surface of the PCB and serves to detect foreign substances and defective patterns, just as it does on the upper surface. An example of the operation of the lower camera unit (120) is as follows: The lower camera (121) photographs the lower surface of the PCB. This camera, like the upper camera (111), uses a high-resolution image sensor and a high-magnification lens to precisely capture even very small defects.

[0053] The image captured by the lower camera unit (120) is converted into a digital image and transmitted to the foreign object detection and defect pattern analysis unit. The lower camera (121) also automatically adjusts the focus to capture an accurate image on the lower surface of the PCB. The lower height sensing unit (not shown) measures the height of the area captured by the lower camera (121), and the lower height control unit (123) adjusts the height of the camera based on this sensing information to maintain an accurate focus. This automatic focus control function prevents image distortion that may occur due to minute differences on the surface of the substrate and increases inspection accuracy. The image captured by the lower camera (121) is transmitted to the foreign object detection and defect pattern analysis unit in the same way as the upper camera (111).

[0054] These images compare and analyze foreign substances and defect patterns on the upper and lower surfaces to comprehensively identify defects found on the upper and lower surfaces, respectively.

[0055] The upper camera unit (110) and the lower camera unit (120) cooperate to inspect both sides of the PCB simultaneously. In some examples, these two cameras inspect the PCB at different points in time, but time synchronization and image processing synchronization are possible during the inspection process. Additionally, the two cameras collect data simultaneously to quickly and accurately detect foreign substances and defect patterns.

[0056] In some examples, images captured by the upper and lower cameras (111, 121), respectively, are processed at the same time, allowing the inspection results to be compared and consistent analysis to be possible. The two cameras can operate simultaneously to minimize inspection time and increase productivity. Through this cooperative operation, double-sided inspection can be performed simultaneously, thereby maximizing the accuracy and efficiency of the inspection.

[0057] The upper camera unit (110) and the lower camera unit (120) each capture images of the upper and lower surfaces in real time to precisely analyze foreign substances and defect patterns. The two cameras increase inspection accuracy through an automatic focus control system and a height sensing component, and transmit the captured images in real time to enable defect identification and automatic sorting in the foreign substance detection and defect pattern analysis unit. Through this operation, both sides of the PCB are inspected simultaneously, ensuring high-quality inspection even in high-speed production processes.

[0058] Next, refer to FIGS. 3 and FIGS. 4. The substrate transfer and alignment unit (130) transfers the PCB from one side to the other and can control the Z-axis position and X / Y-axis position of the PCB. That is, while transferring the PCB from one side to the other, the substrate transfer and alignment unit (130) precisely controls the Z-axis and X / Y-axis positions so that cameras can capture images at accurate positions.

[0059] The substrate transfer and alignment section (130) can be divided into a substrate transfer section (131) and an alignment section (132).

[0060] The substrate transfer unit (131) may include a pair of rollers (1311) positioned on the lower side of the PCB, and a belt (1312) coupled to the pair of rollers (1311) to allow the PCB to be loaded and transferred from one side to the other. In some cases, a magnetic roller may be used instead of the belt (1312). That is, although a driving belt is used as an example of a transfer method in the present invention, other methods other than a driving belt may also be included.

[0061] The alignment section (132) includes a pressing guide roll (1321) positioned on each side of the PCB's transport direction to press the upper surface of the PCB so that the PCB is pressed toward the belt (1312) in the Z-axis direction, and an alignment guide roll (1322) positioned on each side of the PCB's transport direction to press the side of the PCB so that the PCB is aligned in the X / Y axis direction.

[0062] The substrate transfer and alignment unit (130) is a device that plays a key role in accurately transferring and precisely aligning the PCB during the inspection process. This unit performs two main tasks simultaneously: substrate transfer and substrate alignment. An example of the operation of each task is described.

[0063] The substrate transfer unit (131) is responsible for the function of transferring the PCB from one side to the other on the production line at a constant speed and with precise position control. The main components of the transfer unit include a roller (1311) and a belt (1312), or in some cases, a magnetic drive method as described above is applied instead of the belt.

[0064] A pair of rollers (1311) are positioned on the lower side of the substrate transfer unit (131). These rollers (1311) serve to transfer the substrate in a horizontal direction. The rollers (1311) are located on the lower side of the substrate and are driven by a belt (1312). The rollers (1311) serve to hold the substrate from both sides and move it at a constant speed. The belt (1312) is connected to the rollers (1311), and the substrate is mounted on the belt (1312) and transferred at a constant speed. The belt (1312) moves along the lower side of the substrate to transfer the substrate from one side to the other, and the transfer speed is set according to the production process. The belt (1312) ensures a transfer speed and constant movement, and allows the substrate to move smoothly. The substrate transfer unit (131) transfers the PCB at a constant speed, but must be able to accurately control changes in the position of the substrate during the transfer process. To this end, the roller (1311) and belt (1312) help the substrate move flatly through precise adjustment.

[0065] The substrate alignment section (132) performs the function of aligning the transferred PCB to an accurate position and angle. This alignment section (132) includes a pressing guide roll (1321) and an alignment guide roll (1322).

[0066] The pressing guide roll (1321) presses the upper surface of the substrate to position the substrate accurately in the Z-axis direction. This roll (1321) presses the substrate at the point where the substrate contacts the belt (1312). The pressure in the Z-axis direction helps maintain a constant height of the substrate. This ensures that the substrate is consistently maintained vertically and prevents distortion during inspection. The role of this roll (1321) is to ensure that the substrate is maintained at an accurate height, allowing the camera to adjust the angle and capture an accurate image.

[0067] The alignment guide roll (1322) presses the sides of the substrate to ensure that the substrate is accurately aligned in the X-axis and Y-axis directions. The alignment roll (1322) is positioned on both sides of the substrate to assist in alignment while keeping the substrate horizontal. The roll (1322) compresses the substrate from side to side to ensure alignment and maintain an accurate straight path of movement so that the substrate is not pushed toward the belt (1312). By pressing the sides of the alignment roll (1322), the substrate is kept in the center of the belt (1312) and moves accurately.

[0068] When the substrate moves in the substrate transfer unit (131), it is accurately aligned with the help of the alignment roll (1322) and the pressing roll (1321). This alignment unit (132) controls the orthogonality of the substrate so that the substrate can move without distortion in the X / Y and Z axis directions.

[0069] The alignment unit (132) accurately aligns the horizontal and vertical states of the substrate, enabling the camera and image sensor to perform inspection at accurate focus.

[0070] The alignment unit (132) according to the present invention is a key element that ensures the accurate position and alignment of the PCB and helps the PCB move precisely in alignment with the inspection device. As described above, the alignment unit (132) is composed of a pressing guide roll (1321) and an alignment guide roll (1322), and each presses the upper surface and side surface of the PCB to control the position and angle of the substrate.

[0071] The pressing guide rolls (1321) perform the function of pressing the upper surface of the PCB in the Z-axis direction. These rolls (1321) are positioned to ensure horizontal stability of the substrate and precise Z-axis position control. The pressing guide rolls (1321) apply pressure to the upper surface of the PCB to ensure that the substrate maintains a constant height in the Z-axis direction. This ensures that the substrate is stably attached to the belt (1312), preventing unnecessary movement or changes in the height of the substrate, and serves to increase inspection accuracy. Multiple pressing guide rolls (1321) are arranged, and each roll evenly presses the upper surface of the substrate to control changes in the substrate position in the Z-axis direction. These multiple rolls serve to fix the substrate so that it does not shake or distort during transport, and help the substrate move while maintaining an accurate height. The pressure applied by the pressing guide rolls (1321) is constant, and the pressure applied to the substrate is evenly distributed on the upper surface to maintain Z-axis stability.

[0072] The alignment guide rolls (1322) play an important role in aligning the PCB in the X / Y axis direction by applying pressure to the sides of the PCB. These rolls (1322) apply pressure to the sides of the substrate to guide the substrate to move at a position where it forms a precise right angle. The alignment guide rolls (1322) apply pressure to the sides of the substrate to ensure it is accurately aligned in the X and Y axis directions. This prevents the substrate from moving left and right or up and down while moving, and ensures that the substrate is transported in a precisely aligned state. Multiple alignment guide rolls (1322) are also arranged to apply pressure evenly from both sides of the substrate to support the X / Y axis alignment of the substrate. These rolls (1322) ensure that the substrate is positioned precisely in the center on the belt (1312), thereby preventing errors that may occur in the X / Y axis while the substrate is moving. The alignment in the X / Y axis direction maintains a precise right angle with respect to the direction in which the substrate is transported and prevents unnecessary rotation or tilting of the substrate.

[0073] Here, just as the top and side surfaces of the PCB are perpendicular to each other, the rotation axes of the pressing guide roll (1321) and the alignment guide roll (1322) are perpendicular to each other. This is an important factor for accurately handling the movement and alignment of the substrate, and when each rotation axis is exactly perpendicular, the substrate moves consistently on the belt, and a camera or other inspection device can perform inspection at the correct position. Maintaining accurate perpendicularity is important for the substrate to be aligned with the inspection device's camera system to provide an accurate image and to minimize distortion that may occur during defect inspection.

[0074] The alignment unit (132) plays a key role in maintaining the accurate alignment of the substrate during the substrate transfer and inspection process. If the substrate is not accurately aligned, the accuracy of the image captured by the inspection device may decrease, and the accuracy of defect detection may also be significantly affected. This system prevents distortion of the substrate and ensures that the substrate can be consistently and stably measured by the inspection device.

[0075] The alignment unit (132) of the present invention precisely presses the upper surface and side surface of the substrate simultaneously to maintain the accuracy of the movement path and ensures accurate alignment in the X / Y and Z axis directions. In particular, it is differentiated from existing technologies in that it is designed to evenly press the substrate and maintain accurate alignment by using a plurality of pressing guide rolls (1321) and a plurality of alignment guide rolls (1322), and enables efficient defect detection and sorting.

[0076] The alignment unit (132) according to the present invention is configured to maintain an accurate position and angle while the PCB moves through a combined configuration of a pressing guide roll (1321) and an alignment guide roll (1322). This device precisely presses the upper and side surfaces of the substrate simultaneously and ensures accurate alignment in the X / Y and Z axis directions, thereby maximizing the performance of the inspection device. This configuration prevents distortion of the substrate and enables accurate inspection, thereby allowing for the effective separation of defective substrates.

[0077] The substrate transfer unit (131) and the alignment unit (132) cooperate with each other to ensure that the PCB moves quickly and accurately on the production line. An example of the cooperative operation of these two components is as follows: The substrate transfer unit (131) transfers the substrate at a constant speed and helps keep the substrate flat on the belt (1312). The alignment unit (132) accurately aligns the substrate in the X / Y and Z axis directions while the substrate is being transferred, so that no errors occur during camera inspection and subsequent processes.

[0078] The process of transferring and aligning the substrates is highly precise and synchronized, enabling accurate inspection even on high-speed production lines.

[0079] The substrate transfer and alignment unit (130) performs two important roles of accurately transferring and aligning the substrate. The substrate transfer unit (131) transfers the substrate at a constant speed, and the substrate alignment unit (132) helps the substrate to be aligned at an accurate position and angle. These two systems are essential elements for preventing distortion of the substrate and increasing the accuracy of the inspection process. Through precise position control and alignment functions, the present invention can realize efficient and reliable quality control in the PCB inspection process.

[0080] The foreign substance detection and defect pattern analysis unit receives captured images of the upper and lower surfaces of the PCB from the upper camera unit (110) and the lower camera unit (120) and detects whether foreign substances and defect patterns exist on the upper and lower surfaces of the PCB. That is, the foreign substance detection and defect pattern analysis unit analyzes the images received from the upper camera (111) and the lower camera (121) to detect foreign substances and defect patterns in real time. The operation of the foreign substance detection and defect pattern analysis unit is described in detail below, and can be installed in the form of software on the AI ​​process computer (101), the upper image acquisition computer (102), and / or the lower image acquisition computer (103).

[0081] Refer to FIG. 5. An upper lighting unit (160) is installed around an upper camera unit (110) to provide illumination to the upper surface of the PCB. A lower lighting unit (170) is installed around a lower camera unit (120) to provide illumination to the lower surface of the PCB. That is, an upper lighting unit (160) and a lower lighting unit (170) are installed around the upper camera (111) and the lower camera unit (120), respectively, to provide appropriate illumination to the upper and lower surfaces of the PCB. This illumination improves image quality and enhances the visibility of foreign substances and defective patterns, thereby ensuring accurate inspection.

[0082] Refer to FIG. 6. When the defective substrate sorting unit (150) determines that the PCB is a defective substrate in the foreign matter detection and defective pattern analysis unit, it picks up the defective substrate and transfers it to another path so that the defective substrate does not pass to a subsequent process.

[0083] The defective substrate sorting unit (150) may include a robot arm (151), a vacuum chuck (152), and a conveyor (153). The robot arm (151) is installed on one side of the conveyor (153) to pick up defective substrates on the substrate transport and alignment unit (130). The vacuum chuck (152) is installed at the end of the robot arm (151) to vacuum-suck the defective substrates. The conveyor (153) transports the defective substrates returned by the robot arm (151) and the vacuum chuck (152) to another path.

[0084] The defective substrate sorting unit (150) plays an important role in automatically sorting defective substrates and processing them so that they do not pass to a subsequent process. This unit is a system that combines various functions for the accurate separation of defective substrates and the efficient transport of defective substrates. An example of the operation of the defective substrate sorting unit (150) is as follows:

[0085] The operation of the defective substrate sorting unit (150) begins with the process of identifying defective substrates in the foreign matter detection and defective pattern analysis unit. The foreign matter detection and defective pattern analysis unit analyzes images collected from the upper and lower cameras (111, 121) and classifies substrates containing foreign matter or defective patterns as defective. Defective substrates are sorted in the following procedure:

[0086] If foreign substances or defective patterns exceed the set criteria, the corresponding substrate is determined to be a defective substrate. Determination of defective substrates is performed in real time, and this information is transmitted to the defective substrate sorting unit (150). The robot arm (151) plays the role of picking up defective substrates. When a defective substrate is identified, the robot arm (151) automatically picks up the corresponding substrate quickly and accurately and performs the task of transporting it to another path. The robot arm (151) is installed on one side of the conveyor (153) and automatically identifies the defective substrate, determines its location, and picks it up accurately. The robot arm (151) uses a motor and a smart sensor to precisely track the position of the substrate and is controlled to quickly pick up the defective substrate. A vacuum chuck (152) is mounted on the end of the robot arm (151) to vacuum-suction the defective substrate. The vacuum chuck (152) uses vacuum pressure to strongly fix the substrate and stably holds it so that the substrate does not move. The robot arm (151) transports the defective substrate to an accurate location and moves it to a subsequent path. The vacuum chuck (152) is a device that plays an important role when the robot arm (151) picks up a defective substrate. This device allows the defective substrate to be stably picked up by vacuum suction. The vacuum chuck (152) uses vacuum pressure to strongly suction the surface of the substrate. By physically fixing the substrate, it ensures that the substrate does not fall off when the robot arm (151) moves or rotates the substrate. The suction force of the vacuum chuck (152) can be adjusted according to the size or type of the substrate, and flexible application is possible for substrates of various sizes. After the defective substrate is picked up on the conveyor (153), the robot arm (151) moves the substrate using the vacuum chuck (152). The substrate is transferred to another conveyor or other transfer system not shown in the drawing and transported to the defective substrate path. The conveyor (153) is a system that sorts out good substrates remaining on the conveyor (153) and transports them to the normal path.That is, there may be good substrates and defective substrates on the conveyor (153), and the good substrates play an important role in moving to the normal path and transporting the defective substrates to a different path.

[0087] In other words, the conveyor (153) is a conveyor that normally transports good products to the next process, and since the conveyor that transports products identified as defective is not separately indicated in the drawing, defective substrates picked up by the robot arm are collected and processed separately in a tray for collecting defective substrates placed at a different location where the robot arm touches. In addition, instead of the robot arm, they may be transported using a separate conveyor for transporting defective products installed perpendicular to the transport direction of the good substrates.

[0088] The defective substrate sorting unit (150) performs an important role in automatically sorting defective substrates and blocking them from passing to subsequent processes. It performs the function of accurately picking up and separating defective substrates through the cooperative operation of a robot arm (151), a vacuum chuck (152), and a conveyor (153), thereby preventing the spread of defective substrates that may occur on the production line and contributing to increasing the yield of good products. This automated sorting process plays an important role in maximizing efficiency and improving productivity.

[0089] In some examples, the foreign object detection and defect pattern analysis unit outputs a warning notification signal through a monitor, etc., if the number of defective boards exceeds a set value. In some examples, the foreign object detection and defect pattern analysis unit receives an original PCB circuit diagram in the form of a CAD (Computer Aided Design) file and compares and analyzes the original PCB circuit diagram with the circuit diagram of the actual PCB captured by the upper camera unit (110) and the lower camera unit (120). Through this, differences between the circuit design and the actual product can be identified, and defects can be accurately identified. In some examples, the foreign object detection and defect pattern analysis unit compares the circuit diagram entered in the CAD file with the circuit diagram of the PCB inspected in real time to find defects and abnormal parts that occurred in the circuit diagram. In some examples, the foreign object detection and defect pattern analysis unit learns the shape of foreign objects using an AI module and can distinguish and output each foreign object shape based on the learned information. Through this, continuously improved foreign object detection performance can be achieved.

[0090] The foreign substance detection and defect pattern analysis unit is an important component that accurately detects various foreign substances and defect patterns that may occur on the upper and lower surfaces of the PCB. This unit actually processes and analyzes images captured by the upper camera unit (110) and the lower camera unit (120) in real time to determine whether there is a defect. An example of its operation is described as follows:

[0091] The upper camera unit (110) and the lower camera unit (120) each serve to photograph the upper and lower surfaces of the PCB. Each camera captures a high-resolution image and transmits this image to the foreign object detection and defect pattern analysis unit.

[0092] Each camera captures images in high resolution, enabling detailed detection of defects and foreign objects. The cameras automatically control focus and height to maintain image accuracy and quality.

[0093] The foreign object detection and defect pattern analysis unit processes and analyzes received images in real time to detect various foreign objects and defect patterns that may occur on the top and bottom surfaces. An example of this process is as follows:

[0094] First, if foreign substances (e.g., dust, foreign particles, ink residue, etc.) are present on the upper and lower surfaces of the PCB, these substances may interfere with the accurate operation of the circuit or cause defects.

[0095] The image processing algorithm analyzes each pixel to identify foreign substances. If a foreign substance exceeds a certain size, it is identified as such, and information regarding its size, location, and shape is recorded to take follow-up action.

[0096] It detects defects that may occur in the circuit patterns of the PCB (e.g., incorrect connections, bridges, fine line widths, missing circuits, etc.). This is accomplished through a defect pattern recognition algorithm.

[0097] It automatically detects bridges, short circuits, and fine lines requiring improvement, and classifies them as defects in real time.

[0098] Meanwhile, artificial intelligence (AI) technology is utilized to learn the shapes of foreign substances. The AI ​​module enhances shape recognition capabilities based on repeatedly inspected data and classifies and outputs foreign substance shapes based on learned information. For example, it automatically distinguishes shapes such as "L," "O," and "S" shapes and identifies the causes of defect patterns (e.g., ink stains, circuit crossovers, faulty connections) such as "scratches," "underexposure of patterns," and "substrate dents."

[0099] These AI modules learn not only foreign substances but also defect patterns, enabling them to identify various occurring defects in real time and classify their types. Through this, the causes and impacts of defects are analyzed and utilized as information to be passed on to subsequent processes.

[0100] In addition, a feature is provided to compare and analyze the original circuit diagram provided as a CAD (Computer-Aided Design) file with the actual inspected circuit diagram. This allows for real-time verification of circuit design errors or defects that occur during manufacturing.

[0101] CAD file comparative analysis automatically identifies discrepancies by comparing the original circuit diagram with the circuit patterns on the actual board. For example, if connections intended in the design are not properly executed or if there are minute defects, they are classified as abnormal and determined to be defects.

[0102] The analyzed defects and foreign matter are classified in detail by size, shape, and location information, and the information is transmitted to the defective substrate sorting unit (150).

[0103] If the number or size of defects within a defective circuit board exceeds a certain threshold, the warning notification system is automatically activated to provide real-time warnings to the operator.

[0104] The location and shape information of the detected defect helps to accurately separate the defective substrate by a robot arm (151) or an automatic separation device (100) and exclude it from subsequent processes.

[0105] All inspection processes are handled in real time. The results of real-time image and pattern analysis are immediately determined, and the process of separating defective circuit boards begins.

[0106] The monitor (1075) or notification system controls the defect rate in real time by sending an immediate notification to the operator when the number of defective boards exceeds a set standard.

[0107] The analyzed defects are transferred to the defective substrate sorting unit (150) and automatically separated by a robot arm (151) or another sorting device (100).

[0108] At this point, defective substrates are transferred to a different path and processed quickly so as not to disrupt the flow of the production line in subsequent processes.

[0109] In this way, the foreign substance detection and defect pattern analysis unit analyzes images captured from the upper and lower cameras (121) in real time to detect foreign substances and defect patterns, and based on this, automatically sorts out defective substrates to minimize the impact on subsequent processes. Through this, production efficiency and quality can be significantly improved, and high quality can be maintained even on high-speed production lines by controlling the defect rate in real time.

[0110] In this way, the present invention simultaneously inspects both sides of a PCB and accurately detects foreign substances and defective patterns, thereby blocking defects that may occur during the production process in real time. Furthermore, by automatically sorting out defective substrates to prevent them from proceeding to subsequent processes, it maintains quality and increases production efficiency. The AI-based shape analysis and CAD file comparison functions enable more precise inspection, drastically reducing the defect rate and significantly improving productivity compared to conventional inspection methods. Additionally, by automatically separating defective substrates, quality control of the production process is automated, reducing the burden on workers and preventing large-scale losses. The present invention is applicable in various industrial fields and can be particularly useful in high-speed production lines.

[0111] The above description is merely one embodiment for implementing the double-sided inline foreign matter measurement and defective product separation device for PCBs according to the present invention. The present invention is not limited to the above-described embodiment, and the technical spirit of the present invention extends to the scope in which various modifications can be made by anyone with ordinary knowledge in the field to which the invention belongs, without departing from the gist of the invention as claimed in the following patent claims. Explanation of the symbols

[0112] 100; Double-sided inline foreign object measurement and defective product separation device for printed circuit boards (PCBs) 101; AI process computer 102; Top image acquisition computer 103; Lower image acquisition computer 104; Lighting controller 105; upper surface measuring mechanism 106; lower surface measuring mechanism 1071; PCB Aligner 1072; Load 1073; Lighting 1074; Keyboard and mouse 1075; Monitor 110; Upper camera unit 111; Upper camera 112; Upper height sensing unit 113; upper height control unit 120; lower camera unit 121; lower camera 123; lower height control unit 130; Substrate transfer and alignment unit 131; Substrate transfer unit 1311; Roller 1312; Belt 132; Alignment section 1321; Pressing guide roll 1322; Alignment guide roll 150; Defective substrate sorting unit 151; Robot arm 152; Vacuum chuck 153; conveyor 160; upper lighting unit 170; lower lighting unit

Claims

Claim 1 An upper camera unit for photographing the upper surface of a printed circuit board; a lower camera unit for photographing the lower surface of a printed circuit board; a board transfer and alignment unit for transferring the printed circuit board from one side to the other and controlling the Z-axis position and X / Y-axis position of the printed circuit board; a foreign substance detection and defective pattern analysis unit for receiving captured images of the upper and lower surfaces of the printed circuit board from the upper camera unit and the lower camera unit and detecting whether foreign substances and defective patterns exist on the upper and lower surfaces of the printed circuit board; and a defective board sorting unit for picking up the defective board and transferring it to another path so that it does not proceed to a subsequent process when the foreign substance detection and defective pattern analysis unit determines the printed circuit board to be a defective board; wherein the board transfer and alignment unit comprises a board transfer unit including a pair of rollers positioned below the printed circuit board and a belt coupled to the pair of rollers to allow the printed circuit board to be mounted and transferred from one side to the other. The system includes an alignment section comprising a pressing guide roll positioned on each side of the transport direction of the printed circuit board to press the upper surface of the printed circuit board so that the printed circuit board is pressed toward the belt in the Z-axis direction, and an alignment guide roll positioned on each side of the transport direction of the printed circuit board to press the side of the printed circuit board so that the printed circuit board is aligned in the X / Y axis direction; wherein the printed circuit board is mounted by directly contacting the upper side of the belt without contacting the pair of rollers, and the pressing guide roll presses the printed circuit board toward the upper side of the belt in the Z-axis direction at the part where the printed circuit board directly contacts the belt so that the height of the printed circuit board is maintained at a constant height, and the rotation axis of the pressing guide roll and the rotation axis of the alignment guide roll are perpendicular to each other so that the printed circuit board is transported in a constant direction on the upper side of the belt, thereby enabling double-sided inline foreign object measurement and defective product separation of the printed circuit board. Device. Claim 2 In claim 1, the upper camera unit comprises an upper camera that photographs the upper surface of the printed circuit board, an upper height sensing unit that senses the height from the printed circuit board for automatic focus control of the upper camera, and an upper height control unit that controls the upper height of the upper camera, and the lower camera unit comprises a lower camera that photographs the lower surface of the printed circuit board, a lower height sensing unit that senses the height from the printed circuit board for automatic focus control of the lower camera, and a lower height control unit that controls the lower height of the lower camera, a double-sided inline foreign matter measurement and defective product separation device for a printed circuit board. Claim 3 delete Claim 4 A double-sided inline foreign matter measurement and defective product separation device for a printed circuit board, comprising: an upper lighting unit installed around the upper camera unit to provide illumination to the upper surface of the printed circuit board; and a lower lighting unit installed around the lower camera unit to provide illumination to the lower surface of the printed circuit board. Claim 5 In claim 1, the defective substrate sorting unit comprises: a robot arm for picking up the defective substrate; a vacuum chuck installed at the end of the robot arm for vacuum adsorbing the defective substrate; and a separate conveyor for transporting the defective substrate to another path, a device for measuring foreign matter on both sides of a printed circuit board and separating defective products. Claim 6 In claim 1, the foreign matter detection and defect pattern analysis unit outputs a warning notification signal if the number of defective boards is higher than a set value, a double-sided inline foreign matter measurement and defective product separation device for printed circuit boards. Claim 7 In claim 1, the foreign object detection and defect pattern analysis unit receives an original printed circuit board circuit diagram in the form of a CAD (Computer Aided Design) file, and compares and analyzes the original printed circuit board circuit diagram with the circuit diagram of an actual printed circuit board captured by the upper camera unit and the lower camera unit, thereby forming a double-sided inline foreign object measurement and defective product separation device for a printed circuit board. Claim 8 In claim 7, the foreign matter detection and defect pattern analysis unit compares the circuit diagram input into the CAD file with the circuit diagram of the printed circuit board inspected in real time to find defects and abnormal parts that occurred in the circuit diagram, a double-sided inline foreign matter measurement and defective product separation device for a printed circuit board. Claim 9 In claim 1, the foreign object detection and defect pattern analysis unit learns the shape of the foreign object using an artificial intelligence module and distinguishes and outputs each foreign object shape based on the learned information, a double-sided inline foreign object measurement and defective product separation device for printed circuit boards.

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