Capacitor structure

KR103019604B1Active Publication Date: 2026-09-16WINBOND ELECTRONICS CORP
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Patent Information

Application Number
KR1020240120509
Authority / Receiving Office
KR · KR
Patent Type
Patents
Current Assignee / Owner
Priority Date
2024-02-02
Filing Date
2024-09-05
Publication Date
2026-09-16
Estimated Expiration
2044-09-05

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Abstract

The present invention provides a capacitor structure capable of effectively increasing the capacitance of the capacitor structure. A capacitor structure is provided comprising a first capacitor element structure, a first circuit layer, and at least one second capacitor element structure. The first capacitor element structure includes a first substrate and a plurality of first capacitors. The plurality of first capacitors are located within the first substrate. The first circuit layer is located on the first capacitor element structure. At least one second capacitor element structure is located on the first circuit layer. The second capacitor element structure includes a second substrate and a plurality of second capacitors. The plurality of second capacitors are located within the second substrate. The plurality of first capacitors and the plurality of second capacitors are connected in parallel through the first circuit layer.
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Citation Information

Patent Citations

  • Thin film condenser, thin film condenser built-in typehigh density mounting substrate, and method formanufacturing thin film condenser

    KR1020050041993A

  • Capacitor and method for manufacturing same

    KR1020140042482A