Aluminum bonded LED board structure for stackable implementation and improved heat dissipation

Abstract

An aluminum-bonded LED substrate structure that provides stacking implementation and improved heat dissipation effect may include an LED, a main aluminum PCB, a heat sink, and a sub-glass PCB. The aluminum-bonded LED substrate structure may create a first layer aluminum-bonded LED substrate structure using the LED, the main aluminum PCB, and the heat sink, and may create a stacked structure including a second layer and a third layer connected to the first layer using a sub-glass PCB that is physically and electrically connected to the main aluminum PCB. The second layer and the third layer may be physically and electrically connected to a cross-section where circuit design is performed in the first layer.

Description

Technology Field

[0001] The following embodiments relate to an aluminum-bonded LED substrate structure that provides a stacked implementation and an improved heat dissipation effect. Background Technology

[0003] Conventional LED modules were typically manufactured by producing individually packaged LED chips and then placing them onto a printed circuit board (PCB) designed with specific arrays and circuits. However, recently, manufacturing has evolved into the Chip on Board (COB) method, where LED chips are packaged directly onto the PCB. This COB method shortens the existing separate packaging process by directly packaging LED chips onto a PCB suited for the intended purpose.

[0004] Furthermore, to extract light from an LED, diode components and wires to supply current to the components are required. Additionally, reflective materials, light-transmitting materials to reduce light attenuation, concentrators (e.g., lenses) to focus light in a specific direction, and fluorescent materials to adjust the color of the light are used to minimize the loss of generated light. Along with this, methods to effectively conduct and dissipate the heat generated during the process of converting electricity into light are also essential.

[0005] The substrate of an LED module includes blue LED chips and features a circuit pattern on a device substrate, typically equipped with multiple semiconductor light-emitting elements. Additionally, it includes various light-diffusing components such as lenses, including a resin layer containing a phosphor, a reflective layer, and an adhesive layer, enabling efficient use and management of light.

[0006] Modern LED substrate technology is manufactured as a combined form of various components, including LEDs, PCBs (Printed Circuit Boards), pads, frames, and heat sinks. This complex structure requires multiple processes during the manufacturing of LED substrates, resulting in increased substrate weight and reduced heat dissipation efficiency. In particular, the need for effective heat dissipation solutions is becoming increasingly emphasized as the use of high-performance LEDs grows.

[0007] Conventional LED substrates have disadvantages such as being heavy and having poor heat dissipation, so various attempts have been made to improve them. One such method is to replace the PCB, pads, and frame with a single aluminum plate. By using an aluminum plate, heat dissipation problems can be overcome, and the manufacturing process is simplified, resulting in lighter weight and easier replacement of the substrate.

[0008] However, the use of aluminum plates presented limitations, such as the impossibility of designing laminated structures and restrictions on double-sided designs. This implied constraints on design space and acted as a factor limiting the functionality and versatility of LED substrates. The problem to be solved

[0010] The present invention aims to overcome the limitations of double-sided design and the possibility of designing a laminated structure while using an aluminum plate. Through this, it aims to improve the heat dissipation efficiency of the LED substrate, simplify the manufacturing process, and minimize design space constraints. means of solving the problem

[0012] An aluminum-bonded LED substrate structure that provides stacking implementation and improved heat dissipation effect may include an LED, a main aluminum PCB, a heat sink, and a sub-glass PCB. The aluminum-bonded LED substrate structure may create a first layer aluminum-bonded LED substrate structure using the LED, the main aluminum PCB, and the heat sink, and may create a stacked structure including a second layer and a third layer connected to the first layer using a sub-glass PCB that is physically and electrically connected to the main aluminum PCB. The second layer and the third layer may be physically and electrically connected to a cross-section where circuit design is performed in the first layer.

[0013] The aluminum-bonded LED substrate structure includes an intermediate control layer between a main aluminum PCB and a sub-glass PCB, the intermediate control layer protects the PCB from damage caused by thermal expansion and contraction, has a structure for a multi-pin design, provides multiple electrical paths between the main aluminum PCB and the sub-glass PCB, controls the flow of a first signal with a voltage exceeding a specified level in the main aluminum PCB and a second signal with a voltage below a specified level in the sub-glass PCB, and uses the first signal and the second signal as mutually complementary signals to restore the original data signal by adding the phases of the first signal and the second signal when noise or interference occurs, the structure provides the sub-glass PCB having a structure in which multiple sub-glass PCBs can be bonded to the main aluminum PCB, and controls the electrical signal flowing in the main aluminum PCB to flow continuously between the first sub-glass PCB and the second sub-glass PCB by allowing a second sub-glass PCB to be bonded to the lower right side when a first sub-glass PCB is bonded to the lower left side of the main aluminum PCB. Physically, a plurality of sub-glass PCBs can be arranged on each side of the main aluminum PCB to maintain left-right balance. Effects of the invention

[0015] The present invention overcomes the limitations of conventional LED substrates using aluminum plates by enabling a stacked structure through soldering an aluminum plate and a sub-PCB plate. This structure combines the excellent heat dissipation performance of the aluminum plate with the design flexibility of the sub-PCB, thereby providing a basis for manufacturing a lightweight yet high-performance LED substrate.

[0016] In addition, the possibility of stacked structures and double-sided designs through sub-PCBs expands the design space of LED substrates and enables the integration of various functions and complex circuit designs. This can result in significantly improving the functionality and versatility of LED substrates.

[0017] In addition, the present invention combines the heat dissipation efficiency of the aluminum plate with the design flexibility of the sub-PCB, thereby improving the performance and reliability of the LED substrate while simultaneously simplifying the manufacturing process and reducing weight. Brief explanation of the drawing

[0019] FIG. 1 is a schematic diagram showing the configuration of a system using an aluminum-bonded LED substrate according to one embodiment. Figure 2 is a block diagram showing the structure of an aluminum-bonded LED substrate according to one embodiment. Figure 3a illustrates an aluminum PCB in an aluminum bonded LED substrate structure according to the present document. Figure 3b shows a sub-PCB coupled to an aluminum PCB in an aluminum coupled LED substrate structure according to the present document. FIG. 3c illustrates a structure in which a sub-PCB is physically and electrically connected to an aluminum PCB (215) in an aluminum combined LED substrate structure according to the present document. Specific details for implementing the invention

[0020] FIG. 1 is a schematic diagram showing the configuration of a system using an aluminum-bonded LED substrate according to one embodiment.

[0021] Referring to FIG. 1, a system according to one embodiment may include lighting and a device (101).

[0022] First, lighting can perform the function of illuminating a specific place using various light sources and can be implemented in various forms of lighting, including LED lighting.

[0023] The device (101) may be a private server owned by a person or organization providing a service using the device (101), a cloud server, or a peer-to-peer (P2P) set of distributed nodes. The device (101) may be configured to perform all or part of the computational functions, storage / reference functions, input / output functions, and control functions of a conventional computer. The device (101) may be configured to communicate with multiple lights via wired or wireless means.

[0024] The device (101) can perform a dimming control method of the light by controlling the frequency used to turn the light on or off.

[0025] The device (101) can divide the existing cycle to create several additional steps to change the frequency for performing dimming control of the lighting, thereby allowing the change in light to be implemented naturally.

[0026] Meanwhile, for convenience of explanation, only three lights are shown in FIG. 1, but the number of lights can vary depending on the embodiment. As long as the processing capacity of the device (101) allows, there is no particular limit to the number of lights.

[0028] Figure 2 is a block diagram showing the structure of an aluminum-bonded LED substrate according to one embodiment.

[0029] Conventionally, an LED substrate was created using an LED (201), a PCB (203), a pad (205), a frame (207), and a heat sink (209). In this case, a stacked structure is possible, but there is a problem that multiple processes are required due to the large number of components to be combined. Additionally, the weight increases due to the large number of components to be combined, and there is a problem that heat dissipation is poor due to the characteristics of the glass material PCB (203). Furthermore, there is a problem that replacing the LED substrate is not easy because the number and complexity of the components to be combined are large.

[0030] On the other hand, the structure of the aluminum-bonded LED substrate according to the embodiment of the present document may include an LED (201), a PCB (aluminum) (215), and a heat sink (209). Compared to the prior art, the manufacturing process can be simplified by combining the PCB (203), pad (205), and frame (207) into a single aluminum PCB (215).

[0031] In addition, by using an aluminum PCB (215), the heat dissipation problem can be resolved, and the LED substrate creation process can be simplified, making the replacement of the LED substrate relatively easy and the weight relatively light.

[0032] However, aluminum plates have limitations in that lamination is impossible and only a single side can be used, making double-sided design impossible. In this case, there is a disadvantage in that the design space is reduced.

[0033] The aluminum-bonded LED substrate structure according to this document, which provides stacking implementation and improved heat dissipation effects, aims to present a structure that can overcome the limitations of insufficient design space on aluminum PCB boards while improving existing LED substrate structures.

[0034] The aluminum-bonded LED substrate structure according to this document, which provides stacking implementation and improved heat dissipation effects, can increase the design space by connecting a sub-PCB in addition to the aluminum PCB (215) and can provide the effect of enabling a stacked design of the aluminum PCB (215). In FIG. 3, a structure in which a sub-PCB is physically and electrically connected to the aluminum PCB (215) will be described.

[0036] Figure 3a illustrates an aluminum PCB in an aluminum bonded LED substrate structure according to the present document.

[0037] Figure 310 illustrates the structure of an aluminum PCB (310). Although the aluminum PCB (310) has superior heat dissipation compared to a standard PCB, it has a limitation in that circuits can only be designed on one side based on the front and back. Also, the aluminum PCB (310) cannot be stacked, so there are limitations on the circuit design space.

[0038] FIG. 3b shows a sub-PCB coupled to an aluminum PCB in an aluminum-coupled LED substrate structure according to the present document. The sub-PCB (320) can be made of glass material like a general PCB and can be physically and electrically connected to the aluminum PCB (310) of FIG. 3a through soldering.

[0039] FIG. 3c illustrates a structure in which a sub-PCB is physically and electrically connected to an aluminum PCB (215) in an aluminum combined LED substrate structure according to the present document.

[0040] This invention aims to overcome the shortcomings of existing systems that integrate LEDs, PCBs, pads, frames, and heat sinks. Conventional LED substrates require multiple manufacturing processes due to their various components and suffer from issues such as relatively heavy weight and insufficient heat dissipation performance. To address these problems, this invention resolves them by replacing the PCB, pads, and frame with a single aluminum plate. The use of an aluminum plate effectively overcomes heat dissipation issues and offers the advantages of simplified manufacturing processes, ease of substrate replacement, and weight reduction.

[0041] However, aluminum plates have the disadvantage that the implementation of a laminated structure is impossible and double-sided design is not feasible, resulting in limited design space. To overcome these limitations, the present invention introduces a sub-PCB board connected to an aluminum plate by solder. This enables a laminated structure while using an aluminum plate and proposes a new structure that overcomes the limitation of being unable to design double-sided. The aluminum plate and the sub-PCB board are connected using solder, and through this connection, connections between patterns are formed, thereby generating a lamination effect.

[0042] According to the present invention, aluminum PCBs and conventional glass PCBs each have unique advantages and disadvantages. Aluminum PCBs enable excellent heat dissipation performance, weight reduction, and simplification of the manufacturing process. On the other hand, conventional glass PCBs provide flexibility in stacked structures and double-sided designs. The core of the present invention is to combine the advantages of these two materials to provide a new type of LED substrate capable of stacked structures and double-sided designs by soldering a sub-PCB board onto an aluminum plate.

[0043] This bonding method physically connects the aluminum plate and the sub-PCB using solder. This connection method enables electrical connections between patterns and maximizes the utilization of design space through a stacking effect. This can overcome the design space limitations of conventional aluminum plates and result in significantly improved efficiency and functionality of LED substrates.

[0044] In the process of joining the sub-glass PCB (320) and the main aluminum PCB (310), a special bonding structure formed on the edge of the sub-glass PCB can play a key role in physical bonding with the main PCB. This bonding structure can ensure higher mechanical stability and reliability of the electrical connection by joining the two PCBs through precise interlocking instead of relying on traditional soldering methods. This can significantly improve the stability of the electronic device, especially in environments with severe shock or vibration.

[0045] The special bonding structure formed on the edges of the sub-glass PCB plays a very important role in physical bonding with the main PCB. This bonding structure facilitates bonding with the main PCB in a way different from traditional soft soldering methods, and this difference is clearly evident not only in physical and chemical properties but also in the manufacturing process.

[0046] Traditional soft soldering is a process of physically joining two metal parts by melting solder between them. This method requires high heat, and the metal parts can only bond together once the solder reaches its melting point. The heat generated during this process can damage particularly sensitive electronic components, and there are also concerns regarding the environmental and health issues associated with the solder itself.

[0047] In contrast, a special bonding structure formed on the edges of the sub-glass PCB enables bonding with the main PCB even at low temperatures using a separate material. This bonding structure acts as a type of adhesive and provides a stronger and more stable connection, particularly by utilizing engineered chemicals or nanotechnology. This approach significantly reduces the risk of heat-induced damage and can also provide a safer environmental alternative.

[0048] This structure is formed by applying a special treatment to the edges during the manufacturing process of the sub-glass PCB. The materials used in this process are selected considering bonding efficiency, durability, and reactivity, and sometimes high-grade materials such as photocurable resins or conductive adhesives are used. These materials are activated by applying light or heat to form a robust bond between the main PCB and the sub-glass PCB.

[0049] The use of such specialized bonding structures significantly contributes to improving the reliability and lifespan of electronic products. Compared to traditional soft soldering, this method allows for operation at lower temperatures, reducing the risk of heat-induced damage and providing a safer environmental alternative.

[0050] Special bonding tissue refers to a combination of innovative materials and structures designed to bond the sub-glass PCB and the main PCB. This tissue optimizes electrical and mechanical properties to ensure a robust and highly reliable connection between the PCBs. Here, the term "tissue" refers to a complex possessing physical and chemical properties, rather than in a biological sense.

[0051] This special bonding structure is used to physically bond two PCBs while maintaining an electrical connection. This adhesive can be a polymer-based material containing conductive particles (e.g., silver, copper).

[0052] Specialized connective tissues utilize nanoscale materials (e.g., nanowires, nanotubes) to enhance electrical and mechanical properties. These materials provide mechanical strength along with extremely high conductivity.

[0053] The special bonding structure is a photocurable resin that hardens when exposed to light (primarily UV), enabling a fast and efficient bonding process. This simplifies the manufacturing process and improves productivity.

[0054] The form and structure of special connective tissues can have the following characteristics.

[0055] Specialized connective tissues feature a composite structure composed of multiple layers, each performing a specific function. For example, one layer is responsible for conductivity, while another layer enhances adhesion. Specialized connective tissues may include microscale patterned structures to optimize electrical properties. These patterns play a crucial role in improving electrical connectivity between PCBs.

[0056] Special bonding structures can be designed to minimize physical and chemical mismatches that may occur at the interface between two PCBs. This ensures mechanical strength and electrical reliability. Special bonding structures provide high adhesion and mechanical strength to guarantee a robust bond between PCBs. They maintain excellent electrical connectivity through conductive materials and structural properties. Furthermore, special bonding structures enhance heat transfer, preventing overheating issues and extending the lifespan of electronic components.

[0057] The intrinsic bonding mechanism may include an intermediate control layer inserted between the sub-glass PCB (320) and the main aluminum PCB (310). The intermediate control layer can protect the PCB from damage caused by thermal expansion and contraction. Even in environments with severe temperature fluctuations, this layer minimizes physical deformation and can maintain the performance of the PCB. The intermediate control layer can optimize the transmission of electrical signals. This layer can improve the overall performance of the electronic device by contributing to reducing electrical noise and increasing signal accuracy.

[0058] The heat press machine used in the bonding process can be controlled with great precision to perfectly bond the intermediate control layer between the two PCBs. This process precisely controls heat and pressure to ensure that the intermediate layer is deformed into an optimal shape between the two PCBs.

[0059] The sub-glass PCB (320) can be designed with various paths and multiple pins to optimize signal transmission with the main aluminum PCB (310). The multiple pin design can be used to meet complex signal transmission requirements and for applications requiring high-speed data transmission.

[0060] Multi-pin design is a method of connecting electronic circuits using a large number of pins to increase the efficiency and speed of signal transmission. This design plays a crucial role, particularly in applications requiring high-speed data transmission. Multi-pin design enables the faster transmission of more signals while maintaining signal integrity, which is essential in various fields such as high-performance computing, high-resolution video transmission, high-speed networking, and communication systems.

[0061] A multi-pin design between the sub-glass PCB (320) and the main aluminum PCB (310) is implemented to optimize signal transmission between the two PCBs. The sub-glass PCB is generally a material that can contain more delicate and precise electronic components or circuits. On the other hand, the main aluminum PCB provides higher heat transfer capability and physical strength.

[0062] By establishing multiple paths between the sub-glass PCB and the main aluminum PCB, potential bottlenecks during signal transmission are reduced. This minimizes interference between signals when various signals are transmitted simultaneously, thereby improving the reliability and performance of the entire system.

[0063] Signal integrity is critical in high-speed data transmission. Multi-pin designs utilize precisely calculated pin arrangements and paths to minimize signal distortion or loss. This ensures signal accuracy even at high data transmission speeds.

[0064] The multi-pin design can also contribute to thermal management. Combined with the excellent heat transfer capabilities of the main aluminum PCB, it can effectively regulate the temperature of the entire system. This helps prevent component overheating while maintaining high performance. By efficiently arranging more pins through the multi-pin design, more functions can be implemented within a limited space.

[0065] The signal transmission optimization process for an aluminum-bonded LED substrate structure providing stacking implementation and improved heat dissipation according to this document is achieved through various technical approaches. The aluminum-bonded LED substrate structure providing stacking implementation and improved heat dissipation according to this document can minimize electromagnetic interference (EMI) and signal loss by optimizing the signal path during the design process. This ensures signal integrity and can be a critical factor in high-speed data transmission. Each layer of the PCB is designed to meet specific signal transmission requirements, which can contribute to simplifying the signal transmission path and reducing electrical noise.

[0066] In the multilayer PCB design of the aluminum-bonded LED substrate structure providing stacking implementation and improved heat dissipation according to this document, the power distribution network (PDN) can be optimized by utilizing the internal layers. The aluminum-bonded LED substrate structure providing stacking implementation and improved heat dissipation according to this document can increase the efficiency of power supply and improve overall signal transmission performance by providing a short path between the power and ground layers.

[0067] The aluminum-bonded LED substrate structure according to this document, which provides stacking implementation and improved heat dissipation, can utilize pair differential signals for high-speed signal transmission. This method can be used to cancel out electromagnetic interference between signals and maintain signal integrity. Pair differential signals enable stable signal transmission even at high data transmission speeds.

[0068] Differential signaling is a method of transmitting data using two opposing signals. These two signals act as complementary signals; when a signal line indicates a high voltage, the other line indicates a low voltage. The main advantage of this method is its high immunity to external electromagnetic interference (EMI) and noise that may occur during signal transmission. Since noise or interference occurring along the transmission path affects both signal lines equally, the receiving end can reconstruct the original data signal by taking the difference between the two signals. Consequently, differential signal transmission guarantees signal stability while maintaining high signal integrity.

[0069] According to one embodiment, a first signal with a voltage exceeding a specified level can be controlled to flow through the main aluminum PCB (310), and a second signal with a voltage below a specified level can be controlled to flow through the sub glass PCB (320). A structure can be provided that uses the first signal and the second signal as mutually complementary signals to restore the original data signal by adding the phases of the first signal and the second signal when noise or interference occurs. The magnitude of the voltage may vary depending on the setting, but the magnitude of the first signal may be relatively larger than the second signal. The first signal and the second signal may function as differential signals.

[0070] The process for optimizing the physical and electrical coupling between two PCBs in the bonding process for an aluminum-bonded LED substrate structure that provides stacking implementation and improved heat dissipation effects according to this document is as follows. First, thermal and mechanical properties can be optimized by precisely controlling the material and thickness of the intermediate control layer. The aluminum-bonded LED substrate structure that provides stacking implementation and improved heat dissipation effects according to this document can compensate for the difference in thermal expansion coefficients between PCBs composed of different materials and improve stability in high and low temperature environments.

[0071] In the bonding process of the aluminum-bonded LED substrate structure providing stacking implementation and improved heat dissipation according to this document, a vision system can be utilized to ensure precise alignment of the two PCBs. This can be important for enhancing the accuracy of electrical connections as well as physical bonding. Precise alignment maintains the integrity of the signal transmission path and optimizes electrical performance.

[0072] The unique bonding mechanism of the aluminum-bonded LED substrate structure, which provides stacking implementation and improved heat dissipation according to this document, utilizes enhanced adhesives or soldering materials to achieve excellent mechanical and electrical connections even under high temperatures and pressures. These materials maintain stable performance over long periods and can be used to protect the PCB from damage caused by environmental factors.

[0074] According to one embodiment, a new type of interface considering the characteristics of each PCB may be introduced to strengthen the bond between the main aluminum PCB (310) and the sub glass PCB (320). Considering the difference in physical properties between the two materials, aluminum and glass, a flexible connection part is designed to minimize problems that may occur in the bonding of two materials with different coefficients of thermal expansion. This connection part is made of a flexible material such as rubber or silicone so as to effectively absorb expansion or contraction caused by temperature changes.

[0076] According to one embodiment, the sub-glass PCB has a structure in which a plurality of them can be coupled to the main aluminum PCB, and when a first sub-glass PCB is coupled to the lower left side of the main aluminum PCB, a second sub-glass PCB that is subsequently coupled can be coupled to the lower right side, thereby controlling the electrical signal flowing through the main aluminum PCB to flow continuously between the first sub-glass PCB and the second sub-glass PCB, and physically, a plurality of sub-glass PCBs can be arranged on each side of the main aluminum PCB to maintain left-right balance.

[0078] According to one embodiment, the main aluminum PCB (310) has excellent thermal conductivity, so this can be utilized to increase the thermal management efficiency of the entire PCB system. Electronic components installed on the sub-glass PCB (320) may generate heat. In this case, a thermally conductive adhesive or a thermal interface material (TIM) is applied between the main aluminum PCB (310) and the sub-glass PCB (320) to allow the main aluminum PCB (310) to effectively dissipate the heat generated from the sub-glass PCB (320). This can increase the thermal stability of the entire system.

[0079] According to one embodiment, considering the convenience of maintenance and upgrades, the connection between the main aluminum PCB (310) and the sub glass PCB (320) can be modularized and made easy to separate and reassemble. To this end, the connecting component located between the two PCBs can be designed to adopt a clip or snap-fit ​​method so that it can be easily connected or separated without a separate tool. By doing so, users or technicians can perform upgrades or maintenance of the system more easily.

[0081] According to one embodiment, for the aluminum-bonded LED substrate structure to combine a main aluminum PCB and a sub-glass PCB, the main aluminum PCB may utilize an Al enrichment layer and first and second alloy layers provided on the surface of the carbon steel material to apply enhanced plating and heat dissipation, and the sub-glass PCB may use carbon fiber reinforced plastic (CFRP) combined with carbon fiber and plastic resin.

[0082] A heat transfer adhesive layer composed of a mixture of thermosetting liquid silicone, a thermosetting agent, fumed silica, polysiloxane, and copper powder is used for bonding between the main aluminum PCB and the sub glass PCB, and a heat sink having a structure with a maximized surface area in the form of fins or blades can be mounted on the main aluminum PCB to effectively dissipate heat from the aluminum bonded LED substrate.

[0083] To protect the surface of the main aluminum PCB, a molten Al-Si plating layer and a chrome or chrome-free coating layer are applied, and an anodizing treatment is performed to form an artificial oxide layer, while the sub-glass PCB can use a ceramic material to enhance heat dissipation.

[0085] The utilization of composite materials, the application of bonding and heat transfer technologies, and surface treatment and coating technologies are widely used in modern engineering. These technologies can improve product performance, increase durability, and expand usability across various industrial sectors.

[0086] Composite materials combine two or more materials to create new material properties. For example, carbon fiber reinforced plastic (CFRP) is a combination of carbon fibers and plastic resin, used as a lightweight yet high-strength material. Carbon fibers provide strength and stiffness, while the plastic resin serves to bind and protect the carbon fibers. These composite materials are utilized in various fields, such as aircraft structures, automotive parts, and sporting goods.

[0087] Adhesive technology is used to bond various materials together. In particular, high-performance adhesives play a crucial role in bonding layers of composite materials. These adhesives provide resistance to heat and chemicals along with high adhesion. Heat transfer technology refers to methods of efficiently transferring heat within or between materials. For example, heat sinks are used to effectively dissipate heat generated by electronic devices. They are made of metals with high thermal conductivity to rapidly transfer heat to the outside.

[0088] Surface treatment technology is used to improve the surface properties of materials. For example, anodizing improves corrosion resistance by forming a protective layer on the surface of aluminum. During this process, an artificial oxide layer is formed on the aluminum surface. Coating technology imparts new properties by applying specific substances to the surface of materials. For example, nano-coating imparts properties such as water resistance, antifouling, and antibacterial effects by coating the surface of materials with nanoparticles. Such coatings can be utilized in various fields, including electronic devices, medical devices, and building materials.

[0089] The introduction of an intermediate adhesive layer serves not only as a physical bond but also as a crucial medium for heat transfer. Through this layer, heat generated from the main aluminum PCB is efficiently transferred to the sub-glass PCB, improving overall thermal management. Furthermore, the application of laser welding technology enables high precision and fine adjustment, thereby enhancing the reliability of electrical connections.

[0090] The design of composite material busbars can balance lightweighting and electrical conductivity while simultaneously increasing welding adhesion. This can contribute to reducing the overall weight of the product while maximizing the efficiency of electrical connections.

[0091] Composite busbars can be designed to simultaneously consider electrical conductivity and mechanical strength. For example, composite materials combining carbon fiber and aluminum offer excellent electrical conductivity as well as lightweight properties. Applying such a mixture to busbars allows for the efficient transmission of electrical signals and power while reducing structural stress. In particular, the combination of aluminum's high conductivity and carbon fiber's strength and lightness maximizes power transmission efficiency within electronic devices, saving space and weight.

[0092] A precise integrated control system utilizes multiple sensors and control algorithms to monitor and adjust the manufacturing process in real time. For example, a system combining temperature and pressure sensors continuously detects heat distribution and bonding pressure during the laser welding process. This data is analyzed by algorithms to optimize welding parameters (e.g., laser output, welding speed) and ensure bonding quality. This enhances the consistency of the bonding process and minimizes the possibility of defects.

[0094] According to one embodiment, the aluminum bonded LED substrate structure has a nano adhesive attached between a main aluminum PCB and a sub glass PCB, and the nano adhesive is activated when exposed to ultraviolet (UV) light for a specified period of time to fill the fine gap between the main aluminum PCB and the sub glass PCB, and the activated nano adhesive can prevent overheating of the aluminum bonded LED substrate by dispersing heat generated from the main aluminum PCB to the sub glass PCB.

[0095] An electrical interface using conductive ink is applied between the main aluminum PCB and the sub-glass PCB, and a conductive pattern printed with conductive ink is applied to some electrical paths between the main aluminum PCB and the sub-glass PCB to set the priority of electrical transmission compared with other electrical paths.

[0096] The aluminum-bonded LED substrate structure may have a structure in which a light-emitting diode (LED) is placed on a main aluminum PCB (310), a light sensor capable of receiving light from the LED is placed on a sub glass PCB (320), data processed by the main PCB is converted into a light signal and emitted through the LED, and the light sensor on the sub PCB receives this and converts it back into an electrical signal to check whether the data processed by the main PCB is being converted into light having a specified illuminance.

[0098] Nanoadhesives penetrate into the minute gaps between two materials to form a strong bond at the molecular level. These adhesives can have a particularly high ability to absorb mechanical stress that may arise due to differences in thermal expansion coefficients. The application of nanoadhesives is activated by ultraviolet (UV) light, and complete bonding is achieved within seconds. This method can provide rapid manufacturing times and excellent mechanical and electrical stability.

[0099] Conductive ink is a form of printable electronics technology capable of creating flexible circuits. By utilizing this technology to print custom conductive patterns between two PCBs, the electrical connection between them is improved. For example, it creates a path that directly transfers required power from specific components on the main PCB to other components on the sub-PCB. This method optimizes signal transmission and power supply between the two PCBs, thereby increasing the efficiency and reliability of the entire system.

[0101] According to one embodiment, the structure may further include a connecting pad made of at least one material of rubber or silicone between the main aluminum PCB and the sub glass PCB, and may have a structure that controls the dispersion of light generated from an LED or focuses light in a specific direction by using the sub glass PCB as an optical filter or lens, and uses a finely adjustable screw coupling method designed to have a narrow spacing of screw threads in micrometers for mechanical coupling between the main aluminum PCB and the sub glass PCB, and may have a structure that controls the main aluminum PCB to maintain its structure when the sub glass PCB is added or removed by modularizing the main aluminum PCB to include a plurality of LEDs.

[0103] Although the embodiments have been described above with reference to the limited drawings, those skilled in the art can apply various technical modifications and variations based on the above. For example, suitable results may be achieved even if the described techniques are performed in a different order than described, and / or if the components of the described system, structure, device, circuit, etc. are combined or assembled in a form different from described, or replaced or substituted by other components or equivalents.

Claims

Claim 1 In an aluminum-bonded LED substrate structure providing stacking implementation and improved heat dissipation effect, the structure comprises an LED, a main aluminum PCB, a heat sink, and a sub-glass PCB; the LED, the main aluminum PCB, and the heat sink are bonded to form a first layer; an intermediate control layer composed of a mixture of thermosetting liquid silicone, a thermosetting agent, nano-fumed silica, polysiloxane, and copper powder is provided between the main aluminum PCB and the sub-glass PCB to protect the PCB from damage caused by thermal expansion and contraction; a polymer-based special bonding structure comprising conductive particles of silver or copper and nanowires or nanotubes is formed on the edge of the sub-glass PCB; the special bonding structure provides physical bonding and electrical connection with the main aluminum PCB; a first signal with a voltage exceeding a specified level is controlled to flow through the main aluminum PCB, and a second signal with a voltage below a specified level is controlled to flow through the sub-glass PCB; the first signal and the second signal are used as mutually complementary signals so that in the event of noise or interference, the first signal and the second signal An aluminum-bonded LED substrate structure characterized by restoring the original data signal by adding phase, wherein a plurality of sub-glass PCBs are symmetrically arranged on both sides of the main aluminum PCB, and the first sub-glass PCB and the second sub-glass PCB are electrically connected in series so that an electrical signal is sequentially transmitted from the first sub-glass PCB coupled to the lower left side of the main aluminum PCB to the second sub-glass PCB coupled to the lower right side, and wherein a plurality of sub-glass PCBs are arranged on each side of the main aluminum PCB to maintain left-right balance. Claim 2 An aluminum-bonded LED substrate structure according to claim 1, characterized in that a molten Al-Si plating layer and a chrome or chrome-free coating layer are applied to protect the surface of the main aluminum PCB and an artificial oxide layer is formed by anodizing treatment, and the sub-glass PCB is made of a ceramic material to improve heat dissipation. Claim 3 An aluminum-bonded LED substrate structure according to claim 1, wherein a light-emitting diode (LED) is disposed on the main aluminum PCB and a light sensor capable of receiving light from the LED is disposed on the sub glass PCB, data processed by the main aluminum PCB is converted into a light signal and emitted through the LED, the light sensor on the sub glass PCB receives the converted light signal and converts it back into an electrical signal, and the structure is characterized by checking whether the data processed by the main aluminum PCB is converted into light having a specified illuminance.

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