Selected reject band non-radiofrequency-coupling tiles and associated methods and systems

Abstract

The selected reject band non-radiofrequency (RF)-coupling tile includes a ground plate disposed on the first side of the printed circuit board. The selected reject band non-RF-coupling tile also includes a planar inductor disposed on the second side of the printed circuit board (PCB). The selected reject band non-RF-coupling tile also includes a conductive via structure extending through the printed circuit board. The conductive via structure is electrically connected to both the ground plate and the planar inductor at a location near the inner end of the planar inductor. The selected reject band non-RF-coupling tile is used to shield enclosure walls and / or other electrical circuits from RF fields. The selected reject band non-RF-coupling tile is also used to encapsulate an RF transport component to block RF fields emanating from the RF transport component.

Description

Background Technology

[0001] Many industrial systems use radio frequency (RF) power for various purposes. For example, the semiconductor manufacturing industry uses RF power to generate plasmas for various purposes, particularly etching materials from semiconductor wafers, depositing materials on semiconductor wafers, and cleaning materials from semiconductor wafers. Components that deliver RF power must often be enclosed in electrically grounded structures to prevent the associated RF fields from interfering with other neighboring electrical systems. FIG. 1 illustrates an exemplary enclosure (101) containing an internal area where a configuration of an RF circuit (103) is installed. The walls of the enclosure (101) are electrically grounded. If the RF circuit (103) is positioned too close to the walls of the enclosure (101), the RF fields emitted from the RF circuit (103) will be coupled to the walls of the enclosure (101), thereby causing loss / waste of RF power and parasitic effects through the RF circuit (103) that may affect the performance of downstream RF devices. Therefore, the RF circuit (103) must be positioned away from the walls of the enclosure by a minimum distance (102) to prevent adverse coupling of RF power from the RF circuit (103) to the walls of the enclosure (101). Unfortunately, the minimum distance (102) required to prevent unwanted RF coupling to the walls of the enclosure (101) is considerably large and requires the enclosure (101) to be enlarged accordingly, which is not always possible, especially within the scope of semiconductor manufacturing facilities. Furthermore, at higher RF power, the minimum distance (102) increases and the corresponding size of the enclosure (101) increases.However, it is often not possible to increase the size of the enclosure (101) as needed to achieve the minimum separation distance (102) between the RF circuit and the walls of the enclosure (101). Therefore, due to size limitations, many systems must absorb RF power loss / waste and manage parasitic problems caused by the unavoidable coupling of unwanted RF power from the RF circuit (103) to the walls of the enclosure (101). It is in this context that the present invention arises.

[0002] In an exemplary embodiment, a selected reject band non-radiofrequency (RF)-coupling tile is disclosed. The selected reject band non-RF-coupling tile includes a ground plate disposed on a first side of a printed circuit board (PCB). The selected reject band non-RF-coupling tile also includes a planar inductor disposed on a second side of the printed circuit board. The selected reject band non-RF-coupling tile also includes a conductive via structure extending through the printed circuit board. The conductive via structure is electrically connected to the planar inductor near the inner end of the planar inductor. The conductive via structure is also electrically connected to the ground plate.

[0003] In an exemplary embodiment, a method for creating a selected block band non-RF-coupling tile is disclosed. The method includes the step of placing a ground plate on a first side of a printed circuit board. The method also includes the step of forming a hole through the printed circuit board. The method also includes the step of placing a conductive via structure within the hole to make electrical contact with the ground plate. The method also includes the step of placing a planar inductor on a second side of the printed circuit board. The planar inductor is placed so that the planar inductor makes electrical contact with the conductive via structure at a location near the inner end of the planar inductor.

[0004] In an exemplary embodiment, a selected cut-band non-RF-coupling enclosure is disclosed. The selected cut-band non-RF-coupling enclosure comprises an enclosure wall formed of an electrically conductive material. The enclosure wall is electrically connected to a reference ground potential. The enclosure wall has an inner side and an outer side. The selected cut-band non-RF-coupling enclosure also comprises at least one selected cut-band non-RF-coupling tile disposed on the inner side of the enclosure wall. Each of the at least one selected cut-band non-RF-coupling tile comprises a corresponding ground plate disposed on a first side of a corresponding printed circuit board. The corresponding ground plate is positioned in physical and electrical contact with the inner side of the enclosure wall. Each of the at least one selected cut-band non-RF-coupling tile also comprises a corresponding planar inductor disposed on a second side of a corresponding printed circuit board. Each of at least one selected block band non-RF-coupling tile also includes a corresponding conductive via structure that extends through the corresponding printed circuit board and is electrically connected to both the corresponding ground plate and the corresponding planar inductor near the inner end of the corresponding planar inductor.

[0005] In an exemplary embodiment, a method for forming a selected cut-band non-RF-coupling enclosure is disclosed. The method comprises the step of having a selected cut-band non-RF-coupling tile comprising a ground plate disposed on a first side of a printed circuit board and a planar inductor disposed on a second side of the printed circuit board. The selected cut-band non-RF-coupling tile also comprises a conductive via structure that extends through the printed circuit board and is electrically connected to both the ground plate and the planar inductor near the inner end of the planar inductor. The method further comprises the step of placing the selected cut-band non-RF-coupling tile on an inner side of an enclosure wall such that the ground plate of the selected cut-band non-RF-coupling tile is in physical and electrical contact with an inner side of the enclosure wall. The enclosure wall is formed of an electrically conductive material. And, the enclosure wall is electrically connected to a reference ground potential.

[0006] In an exemplary embodiment, an RF signal filter is disclosed. The RF signal filter includes a first selected cut-band non-RF-coupling tile. The RF signal filter also includes a second selected cut-band non-RF-coupling tile. The RF signal filter also includes a planar-shaped RF line filter disposed between the first selected cut-band non-RF-coupling tile and the second selected cut-band non-RF-coupling tile. The first selected cut-band non-RF-coupling tile, the second selected cut-band non-RF-coupling tile, and the planar-shaped RF line filter are integrally formed as a single unit.

[0007] In an exemplary embodiment, a method for forming an RF signal filter is disclosed. The method comprises the step of having a first selected cut-band non-RF-coupling tile. The method also comprises the step of having a second selected cut-band non-RF-coupling tile. The method further comprises the step of placing a planar-shaped RF line filter between the first selected cut-band non-RF-coupling tile and the second selected cut-band non-RF-coupling tile so that the first selected cut-band non-RF-coupling tile, the second selected cut-band non-RF-coupling tile, and the planar-shaped RF line filter are integrally formed as a single unit.

[0008] Other aspects and advantages of the present invention will become more apparent from the following detailed description taken together with the accompanying drawings, which exemplify the present invention by way of example. Brief explanation of the drawing

[0009] FIG. 1 illustrates an exemplary enclosure including an internal area in which a radio frequency (RF) circuit configuration is installed. FIG. 2a shows a top view of a selected reject band non-RF-coupling tile according to some embodiments. FIG. 2b shows a bottom view of a selected blocking band non-RF-coupling tile according to some embodiments. FIG. 2c illustrates a side view of a selected blocking band non-RF-coupling tile corresponding to the AA cross-section as referenced in FIG. 2a, according to some embodiments. FIG. 2d illustrates a vertical cross-sectional view through a selected blocking band non-RF-coupling tile corresponding to the BB cross-section as referenced in FIG. 2a, according to some embodiments. FIG. 2e shows a close-up vertical cross-sectional view of a planar inductor on a selected cut-off band non-RF-coupling tile corresponding to the CC cross-section as referenced in FIG. 2a, according to some embodiments. FIG. 2f illustrates an equiangular view of the top of a selected block band non-RF-coupling tile, with the PCB material removed for illustrative purposes according to some embodiments. FIG. 3a illustrates a plan view of a selected cut-off band non-RF-coupling tile including another example of a planar inductor having a square spiral shape according to some embodiments. FIG. 3b illustrates a plan view of a selected cut-off band non-RF-coupling tile including another example of a planar inductor having a hexagonal spiral shape according to some embodiments. FIG. 3c illustrates a plan view of a selected cut-off band non-RF-coupling tile including another example of a planar inductor having an octagonal spiral shape according to some embodiments. FIG. 3d illustrates a plan view of a selected cut-off band non-RF-coupling tile including another example of a planar inductor having a circular spiral shape according to some embodiments. FIG. 3e illustrates a plan view of a selected cut-off band non-RF-coupling tile including another example of a planar inductor having a triangular spiral shape according to some embodiments. FIG. 3f illustrates a plan view of a selected cut-off band non-RF-coupling tile including an example of a planar inductor having a square double helix shape according to some embodiments. FIG. 4 illustrates a plot of RF field attenuation provided by a selected cut-band non-RF-coupling tile of the present disclosure as a function of operating RF frequency, according to some embodiments. FIG. 5 illustrates a flowchart of a method for creating selected block band non-RF-coupling tiles of the present disclosure according to some embodiments. FIG. 6a illustrates the arrangement of six selected blocking band non-RF-coupling tiles positioned on the wall of an enclosure according to some embodiments. FIG. 6b shows a side view of the enclosure wall shown in FIG. 6a according to some embodiments. FIG. 7 illustrates a flowchart of a method for forming a selected block band non-RF-coupling enclosure according to some embodiments. FIG. 8a illustrates an exemplary arrangement of selected block band non-RF-coupling tiles for effective encapsulation of RF transport components according to some embodiments. FIG. 8b illustrates a circuit diagram showing the electrical function of a first selected block band non-RF-coupling tile in the configuration of FIG. 8a according to some embodiments. FIG. 8c illustrates plots of impedance provided by a first selected cut-off band non-RF-coupling tile as a function of frequency for different values ​​of capacitance (C1), based on the circuit of FIG. 8b according to some embodiments. FIG. 8d illustrates plots of impedance provided by a first selected cut-off band non-RF-coupling tile as a function of frequency for different values ​​of both capacitance (C2) and inductance (L1), based on the circuit of FIG. 8b, according to some embodiments. FIG. 9a illustrates an RF-shielded RF line filter according to some embodiments. FIG. 9b illustrates a view toward a first set of planar inductors of four selected cut-band non-RF-coupling tiles, referenced as cross-section AA in FIG. 9a, according to some embodiments. FIG. 9c illustrates a side view of a first set of four selected blocking band non-RF-coupling tiles, referenced as the BB cross-section in FIG. 9b, according to some embodiments. FIG. 9d illustrates the front part of an RF line filter according to some embodiments. FIG. 9e illustrates the latter part of an RF line filter according to some embodiments. FIG. 9f illustrates the assembly of the front and rear portions of an RF line filter according to some embodiments. FIG. 9g illustrates an equiangular view of a partial assembly of an RF-shielded RF line filter according to some embodiments. FIG. 9h illustrates an isometric view of FIG. 9g having a second set of four selected cut-band non-RF-coupling tiles positioned on the side of an RF line filter, as shown in FIG. 9a, according to some embodiments. FIG. 10 illustrates a flowchart of a method for forming an RF signal filter according to some embodiments. Specific details for implementing the invention

[0010] In the following description, numerous specific details are provided to provide a complete understanding of the present disclosure. However, it will be apparent to those skilled in the art that embodiments of the present disclosure may be practiced without some or all of these specific details. In other examples, known process operations have not been described in detail so as not to unnecessarily obscure the present disclosure.

[0011] FIG. 2a illustrates a top view of a selected reject band non-radiofrequency (RF)-coupling tile (200) according to some embodiments. FIG. 2b illustrates a bottom view of a selected reject band non-RF-coupling tile (200) according to some embodiments. The selected reject band non-RF-coupling tile (200) is also referred to as an RF band reject filter. The selected reject band non-RF-coupling tile (200) includes a ground plate (207) disposed on a first side of a printed circuit board (PCB) (201). The ground plate (207) is configured to cover the bottom of the selected reject band non-RF-coupling tile (200), as shown in FIG. 2b. According to some embodiments, a ground plate (207) is exposed on the bottom of the selected cut-band non-RF-coupling tile (200). The selected cut-band non-RF-coupling tile (200) also includes a planar inductor (203) disposed on a second side of the PCB (201). The planar inductor (203) is configured to extend across the top surface of the selected cut-band non-RF-coupling tile (200). In this way, in some embodiments, the selected cut-band non-RF-coupling tile (200) is formed as a two-layer PCB (201) having a planar inductor (203) on one side of the PCB (201) and a ground plate (207) on the other side of the PCB (201). The planar inductor (203) is configured to have a spiral shape in which the inner end (203A) of the planar inductor (203) is positioned at the center of the spiral shape and the outer end (203B) of the planar inductor (203) is positioned at the outer edge of the spiral shape. In some embodiments, the planar inductor (203) is exposed on the top surface of a selected cut-off band non-RF-coupling tile (200).However, in some embodiments, the planar inductor (203) is covered by a thin layer of PCB material, for example, less than about 1 mm, to protect the planar inductor (203) so that the planar inductor (203) is not exposed on the top surface of the selected cut-band non-RF-coupling tile (200). The selected cut-band non-RF-coupling tile (200) also includes a conductive via structure (205) extending through the PCB (201) to electrically connect to both the ground plate (207) and the planar inductor (203) near the inner end (203A) of the planar inductor (203). In this way, the inner end (203A) of the planar inductor (203) is electrically connected to the ground plate (207) through a conductive via structure (205) at a location near the center of the ground plate (207) (shown in FIG. 2b).

[0012] FIG. 2c illustrates a side view of a selected cut-band non-RF-coupling tile (200) corresponding to the AA section as referenced in FIG. 2a, according to some embodiments. FIG. 2d illustrates a vertical cross-sectional view through a selected cut-band non-RF-coupling tile (200) corresponding to the BB section as referenced in FIG. 2a, according to some embodiments. FIG. 2e illustrates a close-up vertical cross-sectional view of a planar inductor (203) corresponding to the CC section as referenced in FIG. 2a, according to some embodiments. As illustrated in FIG. 2e, in some embodiments, the planar inductor (203) is defined by a substantially rectangular vertical cross section having a nominal width (211) when measured parallel to the PCB (201) in a range extending from about 0.1 mm (millimeters) to about 10 mm, and a nominal height (213) when measured perpendicular to the PCB (201) in a range extending from about 0.05 mm to about 3 mm. It should be understood that the vertical cross section of the planar inductor (203) as-manufactured may have a substantially rectangular shape compared to a perfect rectangular shape due to manufacturing performance. For example, the vertical cross section of the planar inductor (203) as-manufactured may have a substantially rectangular shape with some variation in rounding at some of the corners. Additionally, in some embodiments, the distance (209) between adjacent turns of the planar inductor (203), when measured parallel to the PCB (201), is within a range extending from about 0.1 mm to about 5 mm. In some embodiments, a substantially uniform value of the distance (209) between adjacent turns is maintained around the helical shape of the planar inductor (203). However, in some embodiments, the value of the distance (209) between adjacent turns varies around the helical shape of the planar inductor (203).Additionally, in some embodiments, the planar inductor (203) includes a number of turns within a range extending from about 2 turns to about 50 turns. It should be understood that the number of turns of the planar inductor (203) is limited by the width (211) of the vertical cross-section of the planar inductor (203), the distance (209) between adjacent turns of the planar inductor (203), and the total area of ​​the PCB (201). FIG. 2f illustrates an equal angle of the top of a selected cut-band non-RF-coupling tile (200), with the PCB (201) material removed for illustrative purposes, according to some embodiments.

[0013] A planar inductor (203) is shaped and sized to prevent coupling of RF signals within a specific RF frequency band to a ground plate (207). When placed, a selected cut-band non-RF-coupling tile (200) is oriented such that the planar inductor (203) faces a source of an RF field incident on the selected cut-band non-RF-coupling tile (200). The planar inductor (203) functions to block and / or reflect RF signals within a specific RF frequency band to prevent RF signals from reaching the ground plate (207). The specific RF frequency band configured to block / reflect the planar inductor is defined to encompass the operating RF frequency responsible for generating RF fields within the vicinity of the selected cut-band non-RF-coupling tile (200). The planar inductor (203) is configured to have a specific interaction with the RF field to block / reflect RF signals from reaching the ground plate (207).

[0014] As illustrated in FIG. 2a, in some embodiments, the planar inductor (203) has a square spiral shape. FIG. 3a illustrates a plan view of a selected cut-band non-RF-coupling tile (200A) including another example of a planar inductor (203A) having a square spiral shape according to some embodiments. The planar inductor (203A) is also placed on a corresponding square-shaped PCB (201A). It should be understood that the selected cut-band non-RF-coupling tile (200A) also includes a ground plate (207A) and a conductive via structure (205A) in the same manner as described for the selected cut-band non-RF-coupling tile (200) of FIG. 2a.

[0015] In different embodiments, the helical shape of the planar inductor (203) may differ. For example, in various embodiments, the helical shape of the planar inductor (203) is, in particular, a hexagonal helical shape, an octagonal helical shape, a circular helical shape, a rectangular helical shape, or a triangular helical shape. FIG. 3b illustrates a plan view of a selected cut-band non-RF-coupling tile (200B) including another example of a planar inductor (203B) having a hexagonal helical shape according to some embodiments. The planar inductor (203B) is also placed on a corresponding hexagonal-shaped PCB (201B). It should be understood that the selected cut-band non-RF-coupling tile (200B) also includes a ground plate (207B) and a conductive via structure (205B) in the same manner as described for the selected cut-band non-RF-coupling tile (200) of FIG. 2a. FIG. 3c illustrates a top view of a selected cut-band non-RF-coupling tile (200C) including another example of a planar inductor (203C) having an octagonal spiral shape according to some embodiments. The planar inductor (203C) is also placed on a corresponding octagonal-shaped PCB (201C). It should be understood that the selected cut-band non-RF-coupling tile (200C) also includes a ground plate (207C) and a conductive via structure (205C) in the same manner as described for the selected cut-band non-RF-coupling tile (200) of FIG. 2a.

[0016] FIG. 3d illustrates a plan view of a selected cut-band non-RF-coupling tile (200D) including another example of a planar inductor (203D) having a circular spiral shape according to some embodiments. The planar inductor (203D) is also placed on a corresponding circular-shaped PCB (201D). It should be understood that the selected cut-band non-RF-coupling tile (200D) also includes a ground plate (207D) and a conductive via structure (205D) in the same manner as described for the selected cut-band non-RF-coupling tile (200) of FIG. 2a. FIG. 3e illustrates a plan view of a selected cut-band non-RF-coupling tile (200E) including another example of a planar inductor (203E) having a triangular spiral shape according to some embodiments. A planar inductor (203E) is also placed on a corresponding triangular-shaped PCB (201E). It should be understood that the selected cut-band non-RF-coupling tile (200E) also includes a ground plate (207E) and a conductive via structure (205E) in the same manner as described for the selected cut-band non-RF-coupling tile (200) of FIG. 2a. In some embodiments, any helical configuration of the planar inductor (203) may be formed by a double helix, a triple helix, etc. For example, FIG. 3f shows a plan view of a selected cut-band non-RF-coupling tile (200F) including an example of a planar inductor (203F) having a square double helix shape according to some embodiments. The planar inductor (203F) is also placed on a corresponding square-shaped PCB (201F). It should be understood that the selected cut-band non-RF-coupling tile (200F) also includes a ground plate (207F) and a conductive via structure (205F) in the same manner as described for the selected cut-band non-RF-coupling tile (200) of FIG. 2a.It should be understood that the planar spiral inductor (203) can be configured in many different ways, provided that the selected cut-band non-RF-coupling tiles (200, 200A to 200F) function to prevent RF fields associated with the operating RF frequency from being coupled with the ground plate (207). For ease of description, the selected cut-band non-RF-coupling tile (200) is used herein to describe various embodiments. However, it should be understood that any of the selected cut-band non-RF-coupling tiles (200, 200A, 200B, 200C, 200D, 200E, 200F), or variations thereof, may be used in the various embodiments disclosed herein where the selected cut-band non-RF-coupling tile (200) is appropriately referenced.

[0017] In some embodiments, the PCB (201) is formed from a dielectric material, such as FR-4 glass epoxy, among many other possible PCB substrate materials. In some embodiments, the thickness of the PCB (201) between the planar inductor (203) and the ground plate (207) (measured vertically between the planar inductor (203) and the ground plate (207)) is up to about 6 mm. In some embodiments, the thickness of the PCB (201) between the planar inductor (203) and the ground plate (207) (measured vertically between the planar inductor (203) and the ground plate (207)) is within a range extending from about 1 mm to about 6 mm. In some embodiments, the thickness of the PCB (201) between the planar inductor (203) and the ground plate (207) (measured vertically between the planar inductor (203) and the ground plate (207)) is within a range extending from about 3 mm to about 4 mm. Additionally, in some embodiments, the percentage of the area of ​​the ground plate (207) overlapped by the planar inductor (203) is within a range extending from about 30% to about 100%. In some embodiments, the percentage of the area of ​​the ground plate (207) overlapped by the planar inductor (203) is within a range extending up to about 50%. The PCB (201) ensures that the gap between the planar inductor (203) and the ground plate (207) is carefully controlled and maintained. The PCB (201) also ensures that a fixed spatial relationship is maintained between the planar inductor (203) and the ground plate (207).

[0018] In some embodiments, the ground plate (207), planar inductor (203), and conductive via structure (205) are formed of copper, and the PCB (201) is formed of FR-4 glass epoxy. However, in other embodiments, the ground plate (207), planar inductor (203), and conductive via structure (205) may be formed of another electrically conductive material compatible with the PCB manufacturing process. Additionally, in other embodiments, the PCB (201) may be formed of essentially any PCB substrate material.

[0019] The selected cut-band non-RF-coupling tile (200) is configured to provide maximum attenuation of the incident RF field at a specific operating RF frequency. FIG. 4 illustrates a plot of the RF field attenuation provided by the selected cut-band non-RF-coupling tile (200) as a function of the operating RF frequency according to some embodiments. FIG. 4 illustrates how an exemplary selected cut-band non-RF-coupling tile (200) provides maximum attenuation of the incident RF field when the operating RF frequency approaches 55 MHz (megaHertz). It should be understood that the specific operating RF frequency at which the selected cut-band non-RF-coupling tile (200) provides maximum RF field attenuation depends on the configuration of the selected cut-band non-RF-coupling tile (200) and is not limited to 55 MHz. In various embodiments, the selected cut-off band non-RF-coupling tile (200) may be configured to provide maximum RF field attenuation at RF operating frequencies within a range extending from about 100 kHz to about 1000 MHz.

[0020] In some embodiments, the inductance (L) of the planar inductor (203) is calculated using the “Modified Wheeler Formula” as described by Sunderarajan S. Mohan et al. in “Simple Accurate Expressions for Planar Spiral Inductances” in IEEE Journal of Solid-State Circuits, Vol., 34, No. 10, October 1999. Additionally, the capacitance (C) of the PCB (201) between the planar inductor (203) and the ground plate (207) is calculated as C = εA / d, where (ε) is the dielectric constant of the PCB (201) material between the planar inductor (203) and the ground plate (207), (A) is the area of ​​the ground plate (207) overlapped by the planar inductor (203) (essentially the total bottom surface area of ​​the planar inductor (203)), and (d) is the distance between the planar inductor (203) and the ground plate (207) (the thickness of the PCB (201) between the planar inductor (203) and the ground plate (207). If the inductance (L) of the planar inductor (203) and the capacitance (C) between the planar inductor (203) and the ground plate (207) are known, the resonant frequency of the selected cut-off band non-RF-coupling tile (200) is F res = 1 / [2π(LC) 1 / 2 It is calculated as ]. Accordingly, by controlling the configuration of the planar inductor (203) and the corresponding inductance (L), and by controlling the thickness of the PCB (201) between the planar inductor (203) and the ground plate (207) and the corresponding capacitance (C), the resonant frequency (F) of the selected cutoff band non-RF-coupling tile (200) is calculated. resIt should be understood that it is possible to tune ) to the target operating RF frequency. In this way, different configurations of the selected cut-off band non-RF-coupling tiles (200) can be made to be used to block RF fields associated with different target RF operating frequencies.

[0021] FIG. 5 illustrates a flowchart of a method for creating a selected block band non-RF-coupling tile (200) according to some embodiments. The method includes an action (501) for placing a ground plate (207) on a first side of a PCB (201). The method also includes an action (503) for forming a hole through the PCB (201). In some embodiments, the action (503) is performed before the action (501). The method also includes an action (505) for placing a conductive via structure (205) in the hole to make electrical contact with the ground plate (207). The method also includes an action (507) for placing a planar inductor (203) on a second side of the PCB (201), wherein the planar inductor (203) is formed to have a spiral shape. The planar inductor (203) is positioned so that a location of the planar inductor (203) near the inner end (203A) of the planar inductor (203) is in electrical contact with the conductive via structure (205). In some embodiments, the ground plate (207), the planar inductor (203), and the conductive via structure (205) are formed of copper, and the PCB (201) is formed of FR-4 glass epoxy. However, in other embodiments, the ground plate (207), the planar inductor (203), and the conductive via structure (205) may be formed of another electrically conductive material compatible with the PCB manufacturing process. Additionally, in other embodiments, the PCB (201) may be formed of essentially any PCB substrate material. The method also includes the resonant frequency (F) of the selected cut-band non-RF-coupling tile (200). res It includes the step of controlling the configuration of the planar inductor (203) and the thickness of the PCB (201) to tune the ) to the target operating RF frequency.

[0022] The selected cut-band non-RF-coupling tile (200) provides a mechanism by which the size of the enclosure surrounding the RF transmission circuit can be reduced without causing adverse effects of RF field coupling with the grounded enclosure walls. The selected cut-band non-RF-coupling tile (200) disclosed herein functions as an RF band cut-off filter when positioned between an RF field source, e.g., an RF signal transmission circuit / device, and a grounded enclosure wall, wherein the planar inductor (203) of the selected cut-band non-RF-coupling tile (200) is oriented to face the RF field source, and the ground plate (207) of the selected cut-band non-RF-coupling tile (200) is in physical and electrical contact with the grounded enclosure wall.

[0023] FIG. 6a illustrates the arrangement of six selected cut-band non-RF-coupling tiles (200) positioned on the walls of an enclosure (601) according to some embodiments. The enclosure (601) is electrically grounded. The configuration of FIG. 6a is an example to illustrate a method by which selected cut-band non-RF-coupling tiles (200) can be positioned to essentially completely cover the inner wall surfaces of an enclosure (601) configured to surround RF transmission circuits / devices. It should be understood that, as described for the selected cut-band non-RF-coupling tiles (200A to 200F) in FIG. 3a through 3f, with different shapes and sizes of selected cut-band non-RF-coupling tiles (200), the inner wall surfaces of an enclosure having essentially any size and shape can essentially be completely covered. FIG. 6b illustrates a side view of an exemplary enclosure (601) wall in which selected blockband non-RF-coupling tiles (200) are positioned on top, according to some embodiments. FIG. 6b illustrates a method in which an RF transport component (603), which is an inductor in this example, can be positioned at a distance (605) from the selected blockband non-RF-coupling tiles (200), wherein the distance (605) is smaller than the distance from which the RF field extends away from the RF transport component (603). In this example, the RF field emanating from the RF transport component (603) is blocked / reflected by the selected blockband non-RF-coupling tiles (200) to prevent coupling / interaction of the RF field with the grounded enclosure wall (601).

[0024] The selected cut-band non-RF-coupling tiles (200) are configured such that a planar inductor (203) resonates with a ground plate (207) and a grounded enclosure wall (601) at a specific operating RF frequency. In this way, when the selected cut-band non-RF-coupling tiles (200) are positioned to have ground plates (207) that make physical and electrical contact with their planar inductors (203) facing the grounded enclosure wall (601) and the RF field of a specific operating RF frequency, the selected cut-band non-RF-coupling tiles (200) provide high attenuation of the RF field of a specific operating RF frequency so as to prevent the RF field from coupling with the ground plates (207) and the grounded enclosure wall (601). It should be understood that selected block band non-RF-coupling tiles (200) provide a mechanism for reducing the size of RF equipment enclosures and, in turn, reduce the overall size of RF devices and systems.

[0025] In some embodiments, a selected cut-band non-RF-coupling enclosure is provided. The selected cut-band non-RF-coupling enclosure comprises an enclosure wall formed of an electrically conductive material. The enclosure wall is electrically connected to a reference ground potential. The enclosure wall has an inner side and an outer side. The selected cut-band non-RF-coupling enclosure comprises an inner volume in which an RF field is generated. The selected cut-band non-RF-coupling enclosure also comprises at least one selected cut-band non-RF-coupling tile (200) disposed on the inner side of the enclosure wall. Each of the at least one selected cut-band non-RF-coupling tile (200) comprises a corresponding ground plate (207) disposed on a first side of a corresponding PCB (201). The corresponding ground plate (207) is positioned in physical and electrical contact with the inner side of the enclosure wall. Each of at least one selected cut-band non-RF-coupling tile (200) includes a corresponding planar inductor (203) disposed on a second side of the corresponding PCB (201). Each of at least one selected cut-band non-RF-coupling tile (200) includes a corresponding conductive via structure (205) that extends through the corresponding PCB (201) and is electrically connected to both the corresponding ground plate (207) and the corresponding planar inductor (203) at a location near the inner end (203A) of the corresponding planar inductor (203). In some embodiments, at least one selected cut-band non-RF-coupling tile (200) prevents an RF field from coupling / interacting with an area of ​​the enclosure wall covered by at least one selected cut-band non-RF-coupling tile (200). In some embodiments, at least one selected blocking band non-RF-coupling tile (200) substantially covers the inner side of the enclosure wall.In some embodiments, at least one selected block band non-RF-coupling tile (200) has one or more of a square shape, a hexagonal shape, an octagonal shape, a rectangular spiral shape, a circular shape, and a triangular shape.

[0026] FIG. 7 illustrates a flowchart of a method for forming a selected cut-band non-RF-coupling enclosure according to some embodiments. The method comprises an operation (701) having a selected cut-band non-RF-coupling tile (200) comprising a ground plate (207) disposed on a first side of a PCB (201) and a planar inductor (203) disposed on a second side of the PCB (201). The selected cut-band non-RF-coupling tile (200) comprises a conductive via structure (205) that extends through the PCB (201) and is electrically connected to both the ground plate (207) and the planar inductor (203) at a location near an inner end (203A) of the planar inductor (203). The method also includes an action (703) for placing a selected blocking band non-RF-coupling tile (200) on the inner side of an enclosure wall such that the ground plate (207) of the selected blocking band non-RF-coupling tile (200) makes physical and electrical contact with the inner side of the enclosure wall. The enclosure wall is formed of an electrically conductive material. The enclosure wall is electrically connected to a reference ground potential. The enclosure wall is part of an enclosure containing an internal volume where an RF field is generated. The selected blocking band non-RF-coupling tile (200) prevents the RF field from coupling / interacting with the area of ​​the enclosure wall covered by the selected blocking band non-RF-coupling tile (200). In some embodiments, the selected blocking band non-RF-coupling tile (200) substantially covers the inner side of the enclosure wall. In some embodiments, the selected blocking band non-RF-coupling tile (200) has one or more of the following shapes: square, hexagonal, octagonal, rectangular spiral, circular, and triangular.

[0027] In some embodiments, a selected cut-band non-RF-coupling tile (200) may be used to effectively encapsulate an RF transport component so that the RF field emitted from the RF transport component does not extend through the selected cut-band non-RF-coupling tile (200). In some embodiments, by using RF transport components individually encapsulated by the selected cut-band non-RF-coupling tiles (200), there is no RF field that can reach the walls of the grounded enclosure. Thus, by using RF transport components individually encapsulated by the selected cut-band non-RF-coupling tiles (200), it may be possible to leave the surrounding grounded enclosure unshielded. Additionally, by using RF transport components individually encapsulated by the selected cut-band non-RF-coupling tiles (200), it may be possible to remove or reduce the surrounding enclosures while still providing shielding and protection from radiation / RF interference. It must be recognized that with the removal or reduction of surrounding enclosures, more space is freed up for use by other components.

[0028] FIG. 8a illustrates an example of a method in which selected cut-band non-RF-coupling tiles (200) may be used to effectively encapsulate an RF transfer component (805) according to some embodiments. A first selected cut-band non-RF-coupling tile (200-1) is positioned on one side of the RF transfer component (805) such that a planar inductor (203-1) of the first selected cut-band non-RF-coupling tile (200-1) faces toward the RF transfer component (805). The first selected cut-band non-RF-coupling tile (200-1) includes a ground plate (207-1), a PCB (201-1), a planar inductor (203-1), and a conductive via structure (205-1), as described for the selected cut-band non-RF-coupling tile (200) of FIG. 2a. A second selected cut-band non-RF-coupling tile (200-2) is positioned on another side of the RF transfer component (805) such that the planar inductor (203-2) of the second selected cut-band non-RF-coupling tile (200-2) faces toward the RF transfer component (805). The second selected cut-band non-RF-coupling tile (200-2) includes a ground plate (207-2), a PCB (201-2), a planar inductor (203-2), and a conductive via structure (205-2), as described for the selected cut-band non-RF-coupling tile (200) of FIG. 2a. A PCB substrate material (801) is placed between the first selected cut-band non-RF-coupling tile (200-1) and the RF transfer component (805). The PCB substrate material (801) binds to both the first selected cut-band non-RF-coupling tile (200-1) and the RF transmission component (805). The PCB substrate material (803) is placed between the second selected cut-band non-RF-coupling tile (200-2) and the RF transmission component (805).The PCB substrate material (803) binds to both the second selected block band non-RF-coupling tile (200-2) and the RF transmission component (805).

[0029] In some embodiments, the first end of the RF transmission component (805) is covered by a PCB material (815). An electrically conductive input terminal (809) is placed on the outer side of the PCB material (815). At least one electrical conductor (807) is electrically connected to the input terminal (809) and the RF transmission component (805). In some embodiments, the second end of the RF transmission component (805) is covered by a PCB material (817). An electrically conductive output terminal (813) is placed on the outer side of the PCB material (817). At least one electrical conductor (811) is electrically connected to the output terminal (813) and the RF transmission component (805).

[0030] In the configuration of FIG. 8a, the first selected cut-band non-RF-coupling tile (200-1) and the second selected cut-band non-RF-coupling tile (200-2) are each configured to resonate at the operating RF frequency of the RF transport component (805). In this way, the first selected cut-band non-RF-coupling tile (200-1) and the second selected cut-band non-RF-coupling tile (200-2) each function to block / reflect the RF field emitted from the RF transport component (805). FIG. 8b illustrates a circuit diagram showing the electrical function of the first selected cut-band non-RF-coupling tile (200-1) in the configuration of FIG. 8a according to some embodiments. In the configuration of FIG. 8a, the electrical function of the second selected cut-band non-RF-coupling tile (200-2) is identical to the electrical function of the first selected cut-band non-RF-coupling tile (200-1). Accordingly, the circuit diagram of FIG. 8b describes the first selected cut-band non-RF-coupling tile (200-1) and the second selected cut-band non-RF-coupling tile (200-2) as identical, respectively. In the circuit diagram of FIG. 8b, the PCB substrate material (801) between the RF transfer component (805) and the planar inductor (203-1) is represented as capacitance (C1). The RF transfer component (805) is represented as the RF field. The planar inductor (203-1) is represented as inductance (L1). The PCB (201-1) between the planar inductor (203-1) and the ground plate (207-1) is represented as capacitance (C2). And, the ground plate (207-1) is represented as electrical ground. As the PCB substrate material (801) between the RF transmission component (805) and the planar inductor (203-1) becomes thinner, the capacitance (C1) increases, and vice versa.Additionally, as the PCB (201-1) between the planar inductor (203-1) and the ground plate (207-1) becomes thinner, the capacitance (C2) increases, and vice versa. Also, the configuration of the planar inductor (203-1) can be varied to change the inductance (L1) of the planar inductor (203-1). As previously mentioned, in some embodiments, the inductance of the planar inductor (203-1) is determined using the "Modified Wheeler Formula".

[0031] FIG. 8c illustrates plots of the impedance provided by the first selected cut-band non-RF-coupling tile (200-1) as a function of frequency for different values ​​of capacitance (C1), based on the circuit of FIG. 8b according to some embodiments. The data in FIG. 8c indicates that higher values ​​of capacitance (C1) provide wider bands of RF frequencies that can be blocked / reflected by the first selected cut-band non-RF-coupling tile (200-1). Therefore, it is important to increase the capacitance value (C1). To increase the value of capacitance (C1), it is necessary to reduce the thickness of the PCB substrate material (801) between the RF transfer component (805) and the planar inductor (203-1) as much as possible. In some embodiments, the thickness of the PCB substrate material (801) between the RF transfer component (805) and the planar inductor (203-1) is less than about 1 mm. In some embodiments, the thickness of the PCB substrate material (801) between the RF transfer component (805) and the planar inductor (203-1) is less than about 0.5 mm. In some embodiments, the thickness of the PCB substrate material (801) between the RF transfer component (805) and the planar inductor (203-1) is the thinnest available PCB layer thickness.

[0032] FIG. 8d illustrates plots of the impedance provided by the first selected cut-band non-RF-coupling tile (200-1) as a function of frequency for different values ​​of both capacitance (C2) and inductance (L1), based on the circuit of FIG. 8b, according to some embodiments. The data in FIG. 8d indicates that a lower capacitance value (C2) combined with a higher inductance value (L1) provides a wider band of RF frequencies that can be blocked / reflected by the first selected cut-band non-RF-coupling tile (200-1). Therefore, it is important to reduce the capacitance value (C2). To reduce the value of the capacitance (C2), it is necessary to increase the thickness of the PCB (201-1) between the planar inductor (203-1) and the ground plate (207-1). In some embodiments, the thickness of the PCB (201-1) between the planar inductor (203-1) and the ground plate (207-1) is up to about 6 mm. In some embodiments, the thickness of the PCB (201-1) between the planar inductor (203-1) and the ground plate (207-1) is within a range extending from about 1 mm to about 6 mm. In some embodiments, the thickness of the PCB (201-1) between the planar inductor (203-1) and the ground plate (207-1) is within a range extending from about 3 mm to about 4 mm. In some embodiments, the thickness of the PCB (201-1) between the planar inductor (203-1) and the ground plate (207-1) is the thickest available PCB layer thickness. In some embodiments, the thickness of the PCB (201-1) between the planar inductor (203-1) and the ground plate (207-1) is formed by a plurality of stacked PCB layers.

[0033] In some embodiments, the RF line filter is a specific example of an RF transport component (805) that can be effectively encapsulated by selected cut-band non-RF-coupling tiles (200). The RF line filter is configured to filter RF frequencies in a frequency band where the operating RF frequency exists. The RF line filter is placed in the RF power path to prevent RF signals from being reverse-coupled with other electrical components. For example, in some semiconductor manufacturing systems, the RF line filter is installed to prevent RF from being coupled into a heater array and then moving back to the heater power supply. In this example, the RF line filter is placed in the heater power supply path between the heater power supply and the heater. Conventional RF line filters are open-air RF line filters that emit a large RF field capable of interacting with distant components and / or ground walls. Based on the configuration of FIG. 8a, the conventional RF line filter can be reconfigured and encapsulated by blocking band non-RF-coupling tiles (200) selected to prevent RF field interaction with neighboring electrical components and / or ground walls.

[0034] FIG. 9a illustrates an RF-shielded RF line filter (900) according to some embodiments. FIG. 9a illustrates an example of a method in which selected cut-band non-RF-coupling tiles (200) may be used to effectively encapsulate an RF line filter (920) to form an RF-shielded RF line filter (900). A first set of four selected cut-band non-RF-coupling tiles (200) is positioned on one side of the RF line filter (920) such that planar inductors (203) of the first set of four selected cut-band non-RF-coupling tiles (200) face toward the RF line filter (920). A second set of four selected cut-band non-RF-coupling tiles (200) is positioned on another side of the RF line filter (920) such that the planar inductors (203) of the second set of four selected cut-band non-RF-coupling tiles (200) face toward the RF line filter (920). Each of the first and second sets of four selected cut-band non-RF-coupling tiles (200) includes a ground plate (207), a PCB (201), a planar inductor (203), and a conductive via structure (205), as described for the selected cut-band non-RF-coupling tile (200) in FIG. 2a. A PCB substrate material (901) is placed between a first set of four selected cut-band non-RF-coupling tiles (200) and an RF line filter (920). The PCB substrate material (901) is bound to each of the first set of four selected cut-band non-RF-coupling tiles (200) and the RF line filter (920). A PCB substrate material (903) is placed between a second set of four selected cut-band non-RF-coupling tiles (200) and an RF line filter (920).The PCB substrate material (903) is bound to a second set of four selected block band non-RF-coupling tiles (200) and an RF line filter (920) respectively.

[0035] In some embodiments, the first end of the RF line filter (920) is covered by a PCB material (907). An electrically conductive input terminal (911) is placed on the outer side of the PCB material (907). The input terminal (911) is electrically connected to the RF line filter (920). In some embodiments, the second end of the RF line filter (920) is covered by a PCB material (905). An electrically conductive output terminal (909) is placed on the outer side of the PCB material (905). The output terminal (909) is electrically connected to the RF line filter (920).

[0036] In the configuration of FIG. 9a, each of the first set of four selected cut-band non-RF-coupling tiles (200) and the second set of four selected cut-band non-RF-coupling tiles (200) is configured to resonate at the operating RF frequency of the RF line filter (920). In this way, each of the selected cut-band non-RF-coupling tiles (200) functions to block / reflect the RF field emitted from the RF line filter (920). The circuit diagram of FIG. 8b describes the electrical function of each of the selected cut-band non-RF-coupling tiles (200) in the configuration of FIG. 9a.

[0037] FIG. 9b illustrates a view toward a first set of planar inductors (203) of four selected cut-band non-RF-coupling tiles (200), referenced as section AA in FIG. 9a, according to some embodiments. A view toward a second set of planar inductors (203) of four selected cut-band non-RF-coupling tiles (200) is as shown in FIG. 9b. FIG. 9c illustrates a side view of a first set of four selected cut-band non-RF-coupling tiles (200), referenced as section BB in FIG. 9b, according to some embodiments. A side view toward a second set of four selected cut-band non-RF-coupling tiles (200) is as shown in FIG. 9c.

[0038] FIG. 9d illustrates a front portion (923) of an RF line filter (920) according to some embodiments. The front portion (923) comprises a hexagonal double planar helix of an electrically conductive material comprising a first hexagonal planar helix (923A) of an electrically conductive material and a second hexagonal planar helix (923B) of an electrically conductive material. FIG. 9e illustrates a rear portion (924) of an RF line filter (920) according to some embodiments. The rear portion (924) comprises a hexagonal double planar helix of an electrically conductive material comprising a first hexagonal planar helix (924A) of an electrically conductive material and a second hexagonal planar helix (924B) of an electrically conductive material. FIG. 9f illustrates an assembly of the front portion (923) and the rear portion (924) of an RF line filter (920) according to some embodiments. The first hexagonal planar spiral (923A) of the first part (923) is electrically connected to the first hexagonal planar spiral (924A) of the second part (924) by a conductive via structure (925A). Similarly, the second hexagonal planar spiral (923B) of the first part (923) is electrically connected to the second hexagonal planar spiral (924B) of the second part (924) by a conductive via structure (925B). Referring again to FIG. 9a, a PCB material (927) is placed between the first part (923) and the second part (924) of the RF line filter (920). Additionally, in FIG. 9a, the conductive via structures (925A and 925B) are represented as conductive via structures (925) extending through a PCB material (927) to electrically connect the front portion (923) of the RF line filter (920) to the rear portion (924) of the RF line filter (920).

[0039] FIG. 9g illustrates an isometric view of a partial assembly of an RF-shielded RF line filter (900) according to some embodiments. PCB materials (201, 901, 903, and 927) are not shown in FIG. 9g to avoid obscuring other features. The first hexagonal planar spiral (923A) and the second hexagonal spiral (923B) of the front portion (923) of the RF line filter (920) are each electrically connected to an output terminal (909). Additionally, the first hexagonal planar spiral (924A) and the second hexagonal spiral (924B) of the rear portion (924) of the RF line filter (920) are each electrically connected to an input terminal (911). FIG. 9h illustrates an isometric view of FIG. 9g having a second set of four selected cut-band non-RF-coupling tiles (200) positioned on the side of an RF line filter (920) according to some embodiments, as shown in FIG. 9a.

[0040] In some embodiments of the RF shielded RF line filter (900), the first set of four selected cut-band non-RF-coupling tiles (200) is a first monolithic selected cut-band non-RF-coupling tile having four distinct planar inductors connected to the ground plate (207) through each conductive via (205), having a continuous ground plate (207) and a continuous PCB (201) material disposed between each of the ground plate (207) and four planar inductors (203). Additionally, in these embodiments, the second set of four selected cut-band non-RF-coupling tiles (200) is a second monolithic selected cut-band non-RF-coupling tile having four distinct planar inductors connected to the ground plate (207) through each conductive via (205), having a continuous PCB (201) material disposed between the ground plate (207) and each of the four planar inductors (203). In these embodiments of the RF shielded RF line filter (900), the RF line filter (920) is a planar-shaped RF line filter disposed between the first monolithic selected cut-band non-RF-coupling tile and the second monolithic selected cut-band non-RF-coupling tile. In these embodiments of the RF shielded RF line filter (900), the first monolithic selected cut-band non-RF-coupling tile, the second monolithic selected cut-band non-RF-coupling tile, and the planar-shaped RF line filter (920) are integrally formed as a single unit.

[0041] FIG. 10 illustrates a flowchart of a method for forming an RF signal filter according to some embodiments. The method includes an operation (1001) having a first selected cut-band non-RF-coupling tile (200). The method includes an operation (1003) having a second selected cut-band non-RF-coupling tile (200). The method includes an operation (1005) for placing a planar-shaped RF line filter (920) between the first selected cut-band non-RF-coupling tile (200) and the second selected cut-band non-RF-coupling tile (200) so that the first selected cut-band non-RF-coupling tile (200), the second selected cut-band non-RF-coupling tile (200), and the planar-shaped RF line filter (920) are integrally formed as a single unit.

[0042] In some embodiments of the method, a first selected cut-band non-RF-coupling tile (200) and a second selected cut-band non-RF-coupling tile (200) are each formed by placing a corresponding ground plate (207) on a first side of a corresponding PCB (201), forming a hole through the corresponding PCB (201), placing a corresponding conductive via structure (205) in the hole to make electrical contact with the corresponding ground plate (207), and placing a corresponding planar inductor (203) on a second side of the corresponding PCB (201). The corresponding planar inductor (203) is placed so that the planar inductor (203) makes electrical contact with the corresponding conductive via structure (205) at a location near the inner end (203A) of the planar inductor (203). The method also includes the step of orienting the corresponding planar inductor (203) of the first selected cut-band non-RF-coupling tile (200) to face toward the planar-shaped RF line filter (920). The method also includes the step of orienting the corresponding planar inductor (203) of the second selected cut-band non-RF-coupling tile (200) to face toward the planar-shaped RF line filter (920).

[0043] The method also includes the step of placing a PCB material (901) of a first thickness between a corresponding planar inductor (203) of a first selected cut-band non-RF-coupling tile (200) and a planar-shaped RF line filter (920). The method also includes the step of placing a PCB material (903) of a second thickness between a corresponding planar inductor (203) of a second selected cut-band non-RF-coupling tile (200) and a planar-shaped RF line filter (920). In some embodiments, the first thickness of the PCB material (901) is substantially the same as the second thickness of the PCB material (903). In some embodiments, the thickness of the PCB (201) of the first selected block band non-RF-coupling tile (200) is greater than or equal to the first thickness of the PCB material (901), and the thickness of the PCB (201) of the second selected block band non-RF-coupling tile (200) is greater than or equal to the second thickness of the PCB material (903).

[0044] In some embodiments, the method comprises forming a planar-shaped RF line filter (920) to include an electrical input portion at a first edge of the RF signal filter and an electrical output portion at a second edge of the RF signal filter. In some embodiments, the method comprises forming a planar-shaped inductor to include a first planar-shaped inductor (923) that turns in a first direction from an outer end of a first planar-shaped conductor (923) to an inner end of a first planar-shaped conductor (923). The method also comprises forming a planar-shaped inductor to include a second planar-shaped conductor (924) that turns in a first direction from an inner end of a second planar-shaped conductor (924) to an outer end of a second planar-shaped conductor (924). The method also includes the step of orienting the first planar helical conductor (923) substantially parallel to the second planar helical conductor (924). The method also includes the step of connecting the outer end of the first planar helical conductor (923) to the electrical input of an RF signal filter. The method also includes the step of connecting the outer end of the second planar helical conductor (924) to the electrical output of an RF signal filter. The method also includes the step of connecting the inner end of the first planar helical conductor (923) to an internal conductive via structure (925). The method also includes the step of connecting the inner end of the second planar helical conductor (924) to an internal conductive via structure (925).In some embodiments, the method also includes the step of placing a third thickness PCB material (927) between a first planar spiral-shaped conductor (923) and a second planar spiral-shaped conductor (924) of an RF line filter so that an internal conductive via structure (925) extends through the third thickness PCB material (927).

[0045] While the foregoing disclosure includes some details for the sake of clarity of understanding, it will be apparent that specific changes and modifications may be made within the scope of the appended claims. For example, it should be understood that one or more features from any embodiment disclosed herein may be combined with one or more features of any other embodiment disclosed herein. Accordingly, the embodiments shall be considered illustrative and not limiting, and the claimed may be modified within the scope and equivalents of the disclosed embodiments, not limited to the details provided herein.

Claims

Claim 1 delete Claim 2 delete Claim 3 delete Claim 4 delete Claim 5 delete Claim 6 delete Claim 7 delete Claim 8 delete Claim 9 delete Claim 10 delete Claim 11 delete Claim 12 A radio frequency (RF) signal filter comprising: a first selected cut-band non-radio frequency-coupling tile; a second selected cut-band non-radio frequency-coupling tile; and a planar-shaped RF line filter disposed between the first selected cut-band non-radio frequency-coupling tile and the second selected cut-band non-radio frequency-coupling tile, wherein the first selected cut-band non-radio frequency-coupling tile, the second non-radio frequency-coupling tile, and the planar-shaped RF line filter are integrally formed as a single unit. Claim 13 A radio frequency signal filter according to claim 12, wherein each of the first selected cut-band non-radio frequency-coupling tile and the second selected cut-band non-radio frequency-coupling tile comprises a corresponding ground plate disposed on a first side of a corresponding printed circuit board, and each of the first selected cut-band non-radio frequency-coupling tile and the second selected cut-band non-radio frequency-coupling tile comprises a corresponding planar inductor disposed on a second side of the corresponding printed circuit board, and each of the first selected cut-band non-radio frequency-coupling tile and the second selected cut-band non-radio frequency-coupling tile comprises a corresponding conductive via structure extending through the corresponding printed circuit board and electrically connected to both the corresponding ground plate and the corresponding planar inductor at a location near the inner end of the corresponding planar inductor. Claim 14 A radio frequency signal filter according to claim 13, wherein the corresponding planar inductor of the first selected cut-band non-radio frequency-coupling tile is oriented to face the planar-shaped RF line filter, and the corresponding planar inductor of the second selected cut-band non-radio frequency-coupling tile is oriented to face the planar-shaped RF line filter. Claim 15 A radio frequency signal filter according to claim 14, further comprising: a printed circuit board material of a first thickness disposed between the corresponding planar inductor of the first selected cut-band non-radio frequency-coupling tile and the planar-shaped RF line filter; and a printed circuit board material of a second thickness disposed between the corresponding planar inductor of the second selected cut-band non-radio frequency-coupling tile and the planar-shaped RF line filter. Claim 16 A radio frequency signal filter according to claim 15, wherein the first thickness of the printed circuit board material is substantially the same as the second thickness of the printed circuit board material. Claim 17 A radio frequency signal filter according to claim 15, wherein the thickness of the corresponding printed circuit board of the first selected cut-off band non-radio frequency-coupling tile is greater than or equal to the first thickness of the printed circuit board material, and the thickness of the corresponding printed circuit board of the second selected cut-off band non-radio frequency-coupling tile is greater than or equal to the second thickness of the printed circuit board material. Claim 18 In claim 15, the planar-shaped RF line filter comprises a planar spiral-shaped inductor having an electrical input portion at a first edge of the RF signal filter and an electrical output portion at a second edge of the RF signal filter, a radio frequency signal filter. Claim 19 In claim 18, the planar helical inductor comprises a first planar helical conductor turning in a first direction from an outer end of the first planar helical conductor to an inner end of the first planar helical conductor, and the planar helical inductor comprises a second planar helical conductor turning in a first direction from an inner end of the second planar helical conductor to an outer end of the second planar helical conductor, wherein the first planar helical conductor is oriented substantially parallel to the second planar helical conductor, the outer end of the first planar helical conductor is connected to the electrical input, the outer end of the second planar helical conductor is connected to the electrical output, the inner end of the first planar helical conductor is connected to an internal conductive via structure, and the second A radio frequency signal filter, wherein the inner end of the planar spiral-shaped conductor is connected to the inner conductive via structure. Claim 20 In claim 19, the first planar helical conductor and the second planar helical conductor are separated from each other by a printed circuit board material of a third thickness, and the internal conductive via structure extends through the printed circuit board material of the third thickness, a radio frequency signal filter. Claim 21 In claim 14, the radio frequency signal filter, wherein each of the corresponding planar inductors of the first selected cut-off band non-radio frequency-coupling tile and the second selected cut-off band non-radio frequency-coupling tile has a spiral shape. Claim 22 A radio frequency signal filter according to claim 21, wherein each of the corresponding planar inductors of the first selected cut-off band non-radio frequency-coupling tile and the second selected cut-off band non-radio frequency-coupling tile has a substantially rectangular vertical cross-sectional shape defined by a width and a height, wherein the width is measured parallel to the corresponding printed circuit board and the height is measured perpendicular to the corresponding printed circuit board, the width is within a range extending from 0.1 mm to 10 mm, and the height is within a range extending from 0.05 mm to 3 mm. Claim 23 In claim 21, the radio frequency signal filter wherein each of the corresponding planar inductors of the first selected cut-off band non-radio frequency-coupling tile and the second selected cut-off band non-radio frequency-coupling tile comprises a plurality of turns within a range extending from 2 turns to 50 turns. Claim 24 A radio frequency signal filter according to claim 23, wherein each of the corresponding planar inductors of the first selected cut-off band non-radio frequency-coupling tile and the second selected cut-off band non-radio frequency-coupling tile has a spacing between adjacent turns within a range extending from 0.1 mm to 5 mm when measured parallel to the corresponding printed circuit board. Claim 25 In claim 21, the radio frequency signal filter, wherein each of the corresponding planar inductors of the first selected cut-off band non-radio frequency-coupling tile and the second selected cut-off band non-radio frequency-coupling tile has a square spiral shape. Claim 26 In claim 21, the radio frequency signal filter, wherein each of the corresponding planar inductors of the first selected cut-off band non-radio frequency-coupling tile and the second selected cut-off band non-radio frequency-coupling tile has a hexagonal spiral shape, an octagonal spiral shape, a circular spiral shape, or a rectangular spiral shape, or a triangular spiral shape. Claim 27 A radio frequency signal filter according to claim 14, wherein the corresponding planar inductor of the first selected cut-off band non-radio frequency-coupling tile is formed and sized to prevent coupling of radio frequency signals within a specific radio frequency band to the corresponding ground plate of the first selected cut-off band non-radio frequency-coupling tile, and the corresponding planar inductor of the second selected cut-off band non-radio frequency-coupling tile is formed and sized to prevent coupling of radio frequency signals within a specific radio frequency band to the corresponding ground plate of the second selected cut-off band non-radio frequency-coupling tile. Claim 28 A radio frequency signal filter according to claim 14, wherein the corresponding ground plate, the corresponding planar inductor, and the corresponding conductive via structure of the first selected cut-band non-radio frequency-coupling tile are formed of copper, and the corresponding printed circuit board of the first selected cut-band non-radio frequency-coupling tile is formed of FR-4 glass epoxy, and the corresponding ground plate, the corresponding planar inductor, and the corresponding conductive via structure of the second selected cut-band non-radio frequency-coupling tile are formed of copper, and the corresponding printed circuit board of the second selected cut-band non-radio frequency-coupling tile is formed of FR-4 glass epoxy. Claim 29 A radio frequency signal filter according to claim 14, wherein the percentage of the area of ​​the corresponding ground plate of the first selected cut-band non-radio frequency-coupling tile that is overlapped by the corresponding planar inductor of the first selected cut-band non-radio frequency-coupling tile is within a range extending from 30% to 100%, and the percentage of the area of ​​the corresponding ground plate of the second selected cut-band non-radio frequency-coupling tile that is overlapped by the corresponding planar inductor of the second selected cut-band non-radio frequency-coupling tile is within a range extending from 30% to 100%. Claim 30 A radio frequency signal filter according to claim 14, wherein the thickness of the corresponding printed circuit board of the first selected cut-off band non-radio frequency-coupling tile is within a range extending from 1 mm to 6 mm, and the thickness of the corresponding printed circuit board of the second selected cut-off band non-radio frequency-coupling tile is within a range extending from 1 mm to 6 mm.

Images