Polishing device, processing system, and polishing method

Abstract

A polishing device suitable for surface-based polishing is realized. The polishing device (100) includes a plurality of substrate holding support mechanisms (200) arranged along a first direction (X direction) of a substrate (300), a plurality of polishing heads (201) arranged along a second direction (Y direction) intersecting the first direction (X direction), a stage (202) that holds the substrate (300) and extends in the second direction (Y direction) opposite to the plurality of polishing heads (201), and a driving mechanism (500, 600) for moving the plurality of polishing heads (201) and the stage (202) in the first direction (X direction).

Description

Technology Field

[0001] The present invention relates to a polishing apparatus, a processing system, and a polishing method. The present application claims priority based on Japanese Patent Application No. 2020-092211 filed on May 27, 2020. All disclosures of Japanese Patent Application No. 2020-092211, including the specification, claims, drawings, and abstract, are incorporated herein by reference in their entirety. Background Technology

[0002] Chemical Mechanical Polishing (CMP) devices exist as a type of substrate polishing device used in semiconductor processing. CMP devices can be broadly classified into "face-up type" (where the surface of the substrate to be polished faces upward) and "face-down type" (where the surface of the substrate to be polished faces downward) depending on the direction in which the surface of the substrate to be polished faces.

[0003] Patent Document 1 discloses a face-up type CMP device. This CMP device is configured to perform back-side reference polishing. That is, this CMP device supports the side opposite to the surface to be polished (back side) of a rectangular substrate at a base, and polishes the entire surface of the substrate to a certain thickness while pressing the substrate against the base with a plurality of polishing heads that are smaller in diameter than the substrate. Prior art literature

[0004] Japanese Patent Publication No. 2009-502721 The problem to be solved

[0005] Conventional face-up type CMP devices employ back-side reference polishing as described above, and are not suitable for surface-side reference polishing.

[0006] In other words, surface-based polishing is a method in which a polishing head is used as the reference point, and the substrate is pressed against the polishing head from the side opposite to the surface to be polished (the back side), thereby removing a uniform thickness from anywhere on the entire surface of the substrate. To perform surface-based polishing using a conventional face-up type CMP device, it is considered necessary to press the back side of the substrate, for example, using an airbag. However, in this case, since the polishing head is smaller in diameter than the substrate, there is a risk of substrate damage if the airbag presses down on areas of the substrate where the polishing head is not present. As such, it is difficult for conventional face-up type CMP devices to meet the requirements of surface-based polishing.

[0007] Therefore, the present invention has one objective of realizing a polishing device, a processing system, and a polishing method suitable for surface-based polishing. means of solving the problem

[0008] The present invention discloses a polishing device, in one embodiment, comprising a plurality of substrate holding support mechanisms arranged along a first direction of a substrate, a plurality of polishing heads arranged along a second direction intersecting the first direction, a stage extending in the second direction opposite to the plurality of polishing heads, and a driving mechanism for moving the plurality of polishing heads and the stage in the first direction. Brief explanation of the drawing

[0009] FIG. 1 is a schematic diagram illustrating the configuration of a polishing device according to an embodiment of the present invention. Figure 2 is a schematic diagram illustrating the state of a polishing head when polishing the outer periphery of a substrate. Figure 3 is a schematic diagram illustrating the state of a polishing head when polishing the outer periphery of a substrate. FIG. 4 is a schematic diagram illustrating the configuration of a processing system including a polishing device. Figure 5 is a perspective view illustrating the overall configuration of the polishing device. FIG. 6 is a perspective view illustrating the overall configuration of the polishing device. FIG. 7 is a drawing illustrating a modified example of a substrate holding support mechanism. FIG. 8 is a drawing illustrating the movement of a plurality of grinding heads in a first direction (X direction). FIG. 9 is a schematic diagram illustrating the fourth driving mechanism. Figure 10 is a diagram schematically illustrating the configuration of the stage. FIG. 11 is a perspective view schematically illustrating the configuration of a pressurizing mechanism. FIG. 12 is a cross-sectional view schematically illustrating the configuration of a pressurizing mechanism and a guide member. FIG. 13 is a schematic diagram illustrating the role of a guide member when the polishing head and stage move from a state of holding a mask to a state of holding a substrate. FIG. 14 is a drawing illustrating a modified example of a guide member. FIG. 15 is a drawing illustrating the movement of the stage in the first direction (X direction). Figure 16 is a diagram illustrating the flow of the polishing process of a polishing device. Figure 17 is a diagram illustrating the flow of the polishing process of a polishing device. Figure 18 is a diagram illustrating the flow of the polishing process of a polishing device. FIG. 19 is a drawing illustrating an example of scanning multiple polishing heads and a stage. Figure 20 is a diagram illustrating the flow of the polishing process of a polishing device. Figure 21 is a diagram illustrating the flow of the polishing process of a polishing device. FIG. 22 is a cross-sectional view schematically illustrating the configuration of a pressurizing mechanism and a guide member. FIG. 23 is a perspective view schematically illustrating the configuration of a platen and a guide member. FIG. 24 is a perspective view schematically illustrating the configuration of a surface plate. FIG. 25 is a perspective view schematically illustrating the configuration of a modified example of a platen. FIG. 26 is a flowchart illustrating a polishing method of the present embodiment. Specific details for implementing the invention

[0010] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. However, the drawings used are schematic drawings. Accordingly, the size, location, and shape of the illustrated parts may differ from the size, location, and shape of the actual device.

[0011] First, an overview of a polishing device according to an embodiment of the present invention will be explained using FIG. 1. FIG. 1 is a diagram schematically illustrating the configuration of a polishing device according to an embodiment of the present invention. Although the polishing device of this embodiment is assumed to be a face-up type chemical mechanical polishing device (hereinafter referred to as a CMP device), it may also be a mechanical polishing device that does not use a polishing liquid containing abrasive particles. Here, a face-up type polishing device is a device that polishes while the surface to be polished (surface to be polished) of a substrate is oriented upward.

[0012] As illustrated in FIG. 1, the polishing device (100) includes a substrate holding support mechanism (200), a polishing head (201), and a stage (202). The substrate holding support mechanism (200) is a member for fixing the substrate (300) so that it does not move during polishing. The polishing head (201) is a member installed above the substrate (300) to polish the substrate (300). The stage (202) is a member installed below the substrate (300) so as to place the substrate (300) between it and the polishing head (201) to press the substrate (300) against the polishing head (201).

[0013] The substrate holding support mechanism (200) mounts and supports a substrate (300) to be polished. The substrate holding support mechanism (200) includes an adsorption member (301) and holds and supports the substrate (300) so that it does not move during polishing by adsorbing the substrate (300) with this. The adsorption member (301) is intended to be a vacuum adsorption pad, but the substrate (300) may be held and supported by other means. The adsorption member (301) may be replaced appropriately if its performance deteriorates due to repeated use.

[0014] The location where the substrate holding support mechanism (200) holds and supports the substrate (300) cannot be polished by the polishing head (201) because the stage (202) interferes. If there is an area on the substrate (300) that does not require polishing as a handling area, that area can be held and supported, but if polishing of the entire surface of the substrate is required, there is a risk of interference between the substrate holding support mechanism (200) and the polishing head (201) or the stage (202).

[0015] Therefore, the substrate holding support mechanism (200) may be divided, and the area of ​​the substrate (300) held and supported by each may be divided. By doing so, the substrate holding support mechanism (200) can be withdrawn from the location where the polishing head (201) or the stage (202) is polishing, making it possible to hold and support the substrate only at locations spaced apart from the polishing head (201) or the stage (202). Specifically, in this embodiment, the polishing device (100) includes a plurality of substrate holding support mechanisms (200) spaced apart along the long side direction of a rectangular substrate (300).

[0016] When polishing is completed, the substrate holding support mechanism (200) can detach the substrate (300) to replace the substrate (300), and the adsorption member (301) can release the adsorption of the substrate (300).

[0017] The polishing head (201) is configured to rotate via a rotational axis (203) by a rotational mechanism (204). The rotational mechanism (204) can drive the polishing head (201) at any rotational speed. Additionally, a polishing tool (302) is installed on the lower surface of the polishing head (201). The polishing tool (302) is conceived as a grinding stone used for mechanical polishing or a polishing pad used in a CMP device, but it may be any other tool. The polishing tool (302) rotates in accordance with the rotation of the polishing head (201) and polishes the substrate (300) by repeatedly sliding against the substrate surface. The polishing tool (302) is a consumable item and is replaced appropriately when it wears out from repeated use. Additionally, there are many types of polishing tools (302), and an appropriate one is selected according to the polishing target and purpose.

[0018] The polishing head (201) includes a chemical supply hole (205), and a chemical is supplied from there during polishing. The chemical supply hole (205) is connected to a chemical supply device (206). The chemical supply device (206) pressurizes the chemical to the chemical supply hole (205) while maintaining the quality of the chemical. The chemical supply device (206) may be built into the polishing device (100) or installed as a separate device externally. In the case of CMP, the chemical may be a grit solution containing abrasive particles. In the case of mechanical polishing, the chemical may be water or pure water.

[0019] During polishing, the polishing head (201) rotates to slide the polishing tool (302) relative to the substrate (300). At this time, since the substrate (300) does not move, the relative speed between the polishing tool (302) and the substrate (300) is reduced near the center of the polishing head (201), and almost no polishing occurs. Therefore, the polishing head (201) moves horizontally along the substrate (300) to polish the entire surface of the substrate. At this time, the stage (202) follows the polishing head (201) and always comes directly below the polishing head (201).

[0020] When the polishing head (201) is small in diameter compared to the substrate (300), it is assumed that polishing the entire surface of the substrate will take time. Therefore, the polishing device (100) may include a plurality of polishing heads (201) for the purpose of shortening the polishing time, and these polish the substrate (300) in parallel. In that case, the polishing device (100) may include a plurality of stages (202).

[0021] The polishing head (201) is equipped with an up-and-down movement mechanism (207) to absorb the difference in thickness between the substrate (300) and the polishing tool (302). Before starting polishing, the polishing device (100) lowers the polishing head (201) to detect contact between the polishing tool (302) and the substrate (300). If a motor is used in the up-and-down movement mechanism (207), it is possible to lower the polishing head (201) and determine that the polishing tool (302) has come into contact with the substrate (300) when the driving current exceeds a certain value. By doing so, it becomes possible to position the polishing head (201) at an appropriate height even in situations where the thickness of the substrate (300) to be polished has changed, or where the polishing tool (302) has worn down and become thin.

[0022] The stage (202) receives the reaction force of the force with which the substrate (300) is pressed by the polishing head (201). Depending on the purpose of the polishing device, the shape of the stage (202) may be a flat plate with high surface precision and rigidity, or it may have a flexible structure that follows the shape of the substrate, such as an airbag.

[0023] Additionally, during polishing, the stage (202) moves in accordance with the polishing head (201). That is, since the stage (202) moves while in contact with the substrate (300), the upper surface of the stage (202) and the substrate (300) always slide together. Therefore, it is desirable for the upper surface of the stage (202) to have low frictional resistance and high wear resistance. If the stage (202) cannot be manufactured with such materials, a protective sheet (303) having these characteristics may be attached to the upper surface of the stage (202), and replaced whenever it deteriorates.

[0024] The polishing device (100) includes a pressure mechanism (208) for inserting a substrate (300) into a polishing head (201) and a stage (202) and pressing a polishing tool (302) onto the substrate (300). The pressure mechanism (208) may be located on the polishing head side above the substrate or on the stage side below the substrate. When surface-based polishing is performed, the pressure mechanism (208) is provided on the stage side, and when back-based polishing is performed, the pressure mechanism (208) is provided on the polishing head side. The up-and-down movement mechanism (207) of the polishing head (201) may serve as the pressure mechanism (208), and since the substrate (300) can be pressed by air pressure if the shape of the stage (202) is an airbag shape, the stage (202) may serve as the pressure mechanism (208).

[0025] The polishing rate (amount of polishing per unit time) can be controlled by controlling the pressing force of the pressurizing mechanism (208), the rotational speed of the rotating mechanism (204) that rotates the polishing head (201), and the speed at which the polishing head (201) drives horizontally along the substrate (300). These controls are performed by the control unit (209).

[0026] FIG. 2 is a schematic diagram illustrating the state of a polishing head (201) when polishing the outer edge of a substrate. When polishing the outer edge of a substrate, as shown in FIG. 2, the polishing head (201) may tilt relative to the substrate (300), and there is a risk of over-polishing the edges of the substrate. In addition, if the stage (202) adopts an airbag shape, there is a risk that the inflated airbag may come into contact with the polishing head (201) and cause damage.

[0027] Therefore, the polishing device (100) may be equipped with a mask (210) as shown in FIG. 3. FIG. 3 is a schematic diagram illustrating the state of a polishing head (201) when polishing the outer edge of a substrate. Since the mask (210) is functionally not of the same thickness as the substrate (300), a problem may occur, so it is necessary to replace the mask (210) with one of appropriate thickness according to the thickness of the substrate (300). In addition, since the mask (210) loses its function if it wears out and becomes thin during polishing, it is necessary to manufacture the mask (210) with a material having high wear resistance or to coat its surface with such a material.

[0028] In the case where the mask (210) is not provided, as shown in FIG. 2, a part of the polishing tool (302) is pressed against the substrate (300). At that time, if the substrate (300) is pressed with a force equivalent to when the entire surface of the polishing tool (302) is in contact with the substrate (300), the pressure force is concentrated at the point of contact and the polishing rate increases extremely. To avoid this, in the case where the mask (210) is not provided, the control unit (209) may control the pressure force of the pressure mechanism (208) according to the area where the polishing tool (302) is in contact with the substrate (300).

[0029] Next, a processing system including a polishing device will be described. FIG. 4 is a schematic diagram illustrating the configuration of a processing system (1000) including a polishing device. When polishing is performed continuously, the polishing tool (302) deteriorates, and the polishing rate gradually decreases. To avoid this, as shown in FIG. 4, the polishing device (100) may be equipped with a tool regeneration (dressing) member (211) to regenerate the polishing tool (302). Generally, a diamond or ceramic grinding stone is used for tool regeneration, but the regeneration of the polishing tool (302) may be performed by other means.

[0030] In addition, when the polishing device (100) is equipped with a plurality of polishing heads (201), a single tool regeneration member (211) may be used alternately, but since polishing cannot be performed while the tool regeneration unit is in use and thus throughput is reduced, the same number of tool regeneration members (211) as the polishing heads (201) may be provided.

[0031] The timing for using the tool regeneration member (211) may be performed while the polishing is finished and the substrate (300) is being replaced, but in the case where the polishing tool (302) cannot be used in a short time due to the configuration of polishing a large substrate with a small diameter pad, the polishing tool (302) may be regenerated by using the tool regeneration member (211) appropriately while the substrate is being polished.

[0032] The polishing device (100) may be equipped with a sensor (212) for measuring the amount of polishing. The method of measuring the amount of polishing by using the sensor (212) to measure and compare the film thickness on the surface of the substrate before and after polishing may also be a method of determining whether a film remains on the substrate or whether all films have been removed and polishing is complete.

[0033] The control unit (209) may control the rotation speed of the rotating mechanism, the pressure of the pressing mechanism, and the horizontal movement speed of the polishing head based on the film thickness data acquired by the sensor (212) to adjust to an arbitrary polishing rate and to control to polish uniformly on the entire surface of the substrate.

[0034] The substrate (300) that has finished polishing needs to be quickly washed away with a chemical solution. Therefore, the processing system (1000) includes a cleaning device (213) for cleaning the substrate polished by the polishing device (100). The cleaning device (213) may use a chemical solution, pure water, or a mixture of pure water and gas for cleaning the substrate. Cleaning of the substrate may be performed in parallel with polishing, but it may also be performed in an independent unit, so that the substrate (300) is returned to it after polishing is completed and cleaning is performed there. In that case, the processing system includes a return device (214) for returning the substrate (300) between the polishing device (100) and the cleaning device (213).

[0035] Since a watermark (dry mark) remains on the substrate when the wet substrate (300) is naturally dried, the processing system (1000) includes a drying device (215) for drying the substrate (300) that has been cleaned by the cleaning device (213). The watermark is generated when substances in the moisture remaining on the substrate are collected at the outer edge of the water droplet due to the surface tension of the water. The drying device (215) dries the substrate (300) by blowing away the water droplet with high-pressure gas, or by replacing the moisture on the substrate with a solvent having low surface tension to volatilize it. The conveying device (214) can convey the substrate (300) between the polishing device (100), the cleaning device (213), and the drying device (215).

[0036] <First Embodiment: Surface-based polishing using an airbag method>

[0037] Hereinafter, a more specific configuration of the polishing device (100) will be described. The first embodiment is a polishing device (100) that uses an airbag method as the pressure mechanism (208) described above. FIGS. 5 and 6 are perspective views illustrating the overall configuration of the polishing device. As described above, the polishing device (100) includes a plurality of substrate holding support mechanisms (200). The substrate holding support mechanisms (200) are spaced apart along a first direction that extends horizontally along the long side of a rectangular substrate (300). In this embodiment, the plurality of substrate holding support mechanisms (200) are each configured to include a rod-shaped base (200a) that extends in the vertical direction and a support member (200b) that extends upward from the top of the base (200a). The support member (200b) is movable in the vertical direction. The substrate holding support mechanism (200) is arranged in a plurality at intervals along the first direction and is also arranged in a matrix shape at intervals along the second direction along the short side of the substrate (300). The second direction is a direction that extends horizontally intersecting the first direction, and in this embodiment, it is a direction orthogonal to the first direction and the vertical direction (up and down direction). In the following description, the first direction may be referred to as the "X direction," the second direction as the "Y direction," and the vertical direction as the "Z direction."

[0038] When polishing the substrate (300), the substrate (300) is conveyed by a hand (400) as shown in FIG. 5. The hand (400) includes a plurality of rod-shaped members (401) that extend in the X direction at intervals from each other, and a connecting member (402) that connects one end of each of the plurality of rod-shaped members (401), and conveys the substrate (300) by placing it on the plurality of rod-shaped members (401). When bringing the substrate (300) into the polishing device (100), the support member (200b) descends, and the substrate (300) mounted on the hand (400) is conveyed onto a plurality of substrate holding support mechanisms (200) along the X direction at a position higher than the top of the support member (200b). As illustrated in FIG. 6, when the substrate (300) is conveyed to a predetermined position on a plurality of substrate holding support mechanisms (200), the substrate holding support mechanism (200) receives the substrate (300) by raising the support member (200b). By doing so, the substrate (300) can be installed on the plurality of substrate holding support mechanisms (200). The substrate holding support mechanism (200) adjusts the position of the support member (200b) in the Z direction so that the received substrate (300) is at the same height as the mask (210). As described above, the substrate holding support mechanism (200) can hold and support the substrate (300) so that it does not move during polishing by adsorbing the substrate (300) using the adsorption member (301). When the substrate holding support mechanism (200) receives the substrate (300), the hand (400) retracts along the X direction.

[0039] In addition, in this embodiment, an example is shown in which a substrate holding support mechanism (200) including a rod-shaped base (200a) and a support member (200b) is arranged in a matrix shape, but the configuration of the substrate holding support mechanism (200) is not limited to this. FIG. 7 is a drawing illustrating a modified example of a substrate holding support mechanism. As shown in FIG. 7, the substrate holding support mechanism (200) may be configured to include a plurality of support members (200c) spaced apart in a first direction (X direction). Each support member (200c) is a plate-shaped member extending along the Y direction, and a cutout (200d) is formed at the top thereof to avoid interference with the rod-shaped member (401) of the hand (400) and the rail base (601) and rail member (602) described below. Each support member (200c) is movable in the Z direction.

[0040] As described above, the polishing device (100) includes a plurality of polishing heads (201) for polishing a substrate (300). As shown in FIG. 5, the plurality of polishing heads (201) are arranged along the Y direction. The polishing device (100) includes a first driving mechanism (500) for moving the plurality of polishing heads (201) along a first direction (X direction). The first driving mechanism (500) includes a rail base (501) that extends along the X direction and is provided as a pair to accommodate the plurality of polishing heads (201), and a pair of rail members (502) that are arranged on the upper surface of the rail base (501) and extend along the X direction. The first driving mechanism (500) includes a pair of supports (503) movable along a rail member (502) and a girder member (504) that extends in the Y direction across the pair of supports (503) and is supported by the supports (503). A plurality of grinding heads (201) are suspended and supported by the girder member (504). FIG. 8 is a drawing illustrating the movement of a plurality of grinding heads (201) in a first direction (X direction). In FIG. 8, if the side where the tool regeneration member (211) is provided is considered the upstream side in the X direction, the first driving mechanism (500) can move a plurality of grinding heads (201) in the X direction by moving the supports (503) downstream in the X direction along the rail member (502) by a known mechanism such as a rack and pinion, an electric cylinder, or an actuator.

[0041] Additionally, the polishing device (100) includes a fourth driving mechanism (550) that moves a plurality of polishing heads (201) in a second direction (Y direction). FIG. 9 is a schematic diagram illustrating the fourth driving mechanism (550). As shown in FIG. 9, the fourth driving mechanism (550) may be configured to include, for example, a rail member (551) that extends along the Y direction and is provided on the lower surface of a girder member (504), and a support member (552) that can move along the rail member (551). A plurality of polishing heads (201) are suspended and supported by the support member (552). The fourth driving mechanism (550) can move a plurality of polishing heads (201) in the Y direction by moving the support member (552) along the Y direction by means of a known mechanism such as a rack and pinion, an electric cylinder, or an actuator.

[0042] Additionally, as described above, the polishing device (100) includes a mask (210). The mask (210) is a plate-shaped member in the shape of a frame having the same thickness as the substrate (300), and is positioned to surround the four sides of the substrate (300) as shown in FIGS. 6 and 8. The mask (210) is fixed to a pair of rail bases (501) at a height equal to the position in the Z direction of the substrate (300) during polishing. By providing the mask (210), as described above, the pressure force of the polishing head (201) is concentrated at the periphery of the substrate (300), thereby suppressing the extreme increase in the polishing rate.

[0043] FIG. 10 is a schematic diagram illustrating the configuration of a stage. As shown in FIG. 10, the polishing device (100) includes a stage (202) that extends in a second direction (Y direction). Although the polishing head (201) is omitted in FIG. 10, the stage (202) is positioned opposite a plurality of polishing heads (201) with a substrate (300) fitted therein. The stage (202) includes a pressing mechanism (208) for pressing the substrate (300) against the plurality of polishing heads (201).

[0044] FIG. 11 is a perspective view schematically illustrating the configuration of a pressurizing mechanism (208). FIG. 12 is a cross-sectional view schematically illustrating the configuration of a pressurizing mechanism (208) and a guide member (290). As shown in FIG. 10 to FIG. 12, the pressurizing mechanism (208) includes a base (222) extending along the Y direction, a plurality of pocket-shaped members (224) disposed on the base (222), and a fluid supply member (226) for supplying fluid to the plurality of pocket-shaped members (224). The plurality of pocket-shaped members (224) are provided in correspondence with the number of a plurality of polishing heads (201) and are arranged along the Y direction.

[0045] The pocket-shaped member (224) is, for example, an airbag, and the fluid supply member (226) is configured to supply air to the airbag. By supplying fluid from the fluid supply member (226) to the pocket-shaped member (224), the pocket-shaped member (224) expands and is configured to press the substrate (300) against a plurality of polishing heads (201). That is, the polishing device (100) of the present embodiment is configured to perform surface-based polishing to remove a certain thickness from anywhere on the entire surface of the substrate by pressing the substrate (300) against the polishing head (201) by the pocket-shaped member (224) from the opposite side (back side) of the surface to be polished of the substrate (300), using the polishing head (201) as the polishing reference.

[0046] The surface of the pocket-shaped member (224) that contacts the substrate (300) preferably has low frictional resistance and high wear resistance. If the pocket-shaped member (224) cannot be manufactured from such a material, a protective sheet (228) having these characteristics (e.g., a PTFE (polytetrafluoroethylene) sheet) may be attached to the upper surface of the pocket-shaped member (224), and replaced whenever it deteriorates. Additionally, a PTFE coating may be applied to the upper surface of the pocket-shaped member (224), for example. The pocket-shaped member (224) of this embodiment may be manufactured by molding a material such as silicone rubber into a ring (donut shape). By molding the pocket-shaped member (224) into a ring, a hole (224a) is formed in the center of the pocket-shaped member (224). The pressurizing mechanism (208) includes a fluid supply member (227) for supplying fluid (e.g., a liquid containing pure water or a surfactant) between the pocket-shaped member (224) and the substrate (300) through a hole (224a). By supplying fluid from the fluid supply member (227), the frictional resistance between the pocket-shaped member (224) and the substrate (300) can be reduced, and heat generation accompanying the sliding movement of both can be suppressed.

[0047] As illustrated in FIG. 12, the polishing device (100) includes guide members (290) disposed at both ends of the first direction (X direction) of the stage (202). The guide members (290) have a first end (290a) disposed at a height equal to the upper surface of the stage (202), a second end (290b) disposed at a position lower than the upper surface of the stage (202), and an incline (290c) provided between the first end (290a) and the second end (290b). The guide members (290) are members for preventing damage to the substrate (300) or the stage (202) when the polishing head (201) and the stage (202) move from a state of wearing a mask (210) to a state of wearing a substrate (300).

[0048] FIG. 13 is a schematic diagram illustrating the role of a guide member (290) when the polishing head (201) and the stage (202) move from a state where they are holding a mask (210) to a state where they are holding a substrate (300). As indicated by the dashed line in FIG. 13, the end (300a) of the substrate (300) may be suspended by its own weight. In this case, if the stage (202) without the guide member (290) moves from the bottom of the mask (210) to the bottom of the substrate (300), the stage (202) may interfere with the end (300a) where the substrate (300) is suspended, and there is a risk that the substrate (300) may be damaged. Additionally, if the stage (202) and the suspended end (300a) of the substrate (300) interfere, there is also a risk that the stage (202) may be damaged. For example, if the stage (202) includes a pocket-shaped member (224), there is a risk that the pocket-shaped member (224) may rupture if the portion (300a) where the substrate (300) is suspended is pressed against the side of the pocket-shaped member (224). In contrast, the guide member (290) can guide the suspended end (300a) of the substrate (300) between the polishing head (201) and the stage (202) by lifting it with the second end (290b) and the incline (290c) when the stage (202) moves from the bottom of the mask (210) to the bottom of the substrate (300). By doing so, damage to the substrate (300) can be prevented. FIG. 14 is a drawing illustrating a modified example of the guide member (290). As illustrated in FIG. 14, the guide member (290') may be configured to include a plurality of pulleys (291a, 291c, 291b) whose upper surface height decreases as they move away from the stage (202). Between the first end (290a') of the upper surface of the pulley (291a) and the second end (290b') of the upper surface of the pulley (291b), a virtual slope (290c') connecting the upper surfaces of the pulleys (291a, 291c, 291b) is formed.Accordingly, the guide member (290') can guide the suspended end (300a) of the substrate (300) by lifting it by the second end (290b') and the incline (290c') when the stage (202) moves from the bottom of the mask (210) to the bottom of the substrate (300), thereby guiding it between the polishing head (201) and the stage (202).

[0049] As illustrated in FIG. 10, the grinding device (100) includes a second driving mechanism (600) for moving the stage (202) in a first direction (X direction). The second driving mechanism (600) includes three rail bases (601) that extend along the X direction and are spaced apart from each other, and a rail member (602) that extends along the X direction and is positioned on the upper surface of each of the three rail bases (601). The second driving mechanism (600) includes a girder member (604) that extends in the Y direction across the three rail bases (601), is supported by the rail bases (601), and is movable along the rail member (602). The stage (202) is held and supported on the girder member (604). FIG. 15 is a drawing illustrating the movement of the stage (202) in the first direction (X direction). As illustrated in FIG. 15, the second driving mechanism (600) can move the stage (202) in the X direction by moving the girder member (604) along the rail member (602) downstream in the X direction by means of a known mechanism such as a rack pinion, an electric cylinder, or an actuator. The first driving mechanism (500) and the second driving mechanism (600) described above can move the plurality of polishing heads (201) and the stage (202) in the X direction in synchronization. Furthermore, in this embodiment, the first driving mechanism (500) and the second driving mechanism (600) are described as separate components, but they may be a single component that moves the plurality of polishing heads (201) and the stage (202) in the X direction in synchronization. In this case, the polishing device (100) may include a connecting mechanism capable of mechanically connecting or disconnecting the plurality of polishing heads (201) and the stage (202).When performing polishing of the substrate (300), the integrated driving mechanism connects a plurality of polishing heads (201) and a stage (202) by means of a connecting mechanism, and by using a known mechanism such as a rack and pinion, an electric cylinder, or an actuator in the first driving mechanism (500) to move a support (503) in the X direction, the plurality of polishing heads (201) and the stage (202) can be moved in sync in the X direction. Meanwhile, when performing dressing of the polishing tool (302), the integrated driving mechanism separates the two and moves only the plurality of polishing heads (201) to the tool regeneration member (211) by using a known mechanism such as a rack and pinion, an electric cylinder, or an actuator in the first driving mechanism (500) to move a support (503) in the X direction.

[0050] Additionally, the polishing device (100) includes a fifth driving mechanism (650) for moving the stage (202) in a second direction (Y direction). As illustrated in FIG. 15, the fifth driving mechanism (650) may be configured to include a rail member (651) that extends along the Y direction and is provided on the upper surface of a girder member (604), and a support member (652) that can move along the rail member (651). The stage (202) is supported on the support member (652). The fifth driving mechanism (650) can move the stage (202) in the Y direction by moving the support member (652) along the Y direction by means of a known mechanism such as a rack pinion, an electric cylinder, or an actuator. The above-described fourth driving mechanism (550) and the fifth mechanism (650) can move the stage (202) in the Y direction in synchronization with a plurality of polishing heads (201). In addition, in this embodiment, the fourth driving mechanism (550) and the fifth driving mechanism (650) are described as separate components, but they may be an integrated component that moves the plurality of polishing heads (201) and the stage (202) in the Y direction in synchronization. In this case, when polishing the substrate (300), the integrated driving mechanism connects the plurality of polishing heads (201) and the stage (202) by the connecting mechanism described above, and by using a known mechanism such as a rack and pinion, an electric cylinder, or an actuator in the fourth driving mechanism (550) to move the support (552) in the Y direction, the plurality of polishing heads (201) and the stage (202) can be moved in the Y direction in synchronization. In the fifth driving mechanism (650), a known mechanism such as a rack and pinion, an electric cylinder, or an actuator may be used to move the support (652) in the Y direction, thereby moving the plurality of polishing heads (201) and the stage (202) in the Y direction in synchronization.

[0051] As illustrated in FIGS. 10 and 15, the polishing device (100) includes a third driving mechanism (280) for moving a plurality of substrate holding support mechanisms (200) in an up-and-down direction (Z direction) according to the movement of the stage (202) in a first direction (X direction). The plurality of substrate holding support mechanisms (200) are members for holding and supporting a substrate (300), but in the area where the stage (202) exists, they interfere with the stage (202). Therefore, the third driving mechanism (280) is configured to retract the support member (200b) of the substrate holding support mechanism (200) in the area that interferes with the stage (202) in a downward direction.

[0052] Specifically, in the state shown in FIG. 10, the support member (200b) of the plurality of substrate holding support mechanisms (200) arranged in the Y direction within area A enclosed by dashed lines retracts downward. In contrast, in the state shown in FIG. 15, where the stage (202) has moved downstream in the X direction, the support member (200b) of the plurality of substrate holding support mechanisms (200) arranged in the Y direction within area B enclosed by dashed lines, which is downstream in the X direction from area A, retracts downward, while the support member (200b) of the plurality of substrate holding support mechanisms (200) in area A extends upward to support the substrate (300). Additionally, the third driving mechanism (280) can move the support member (200b) in the Z direction by means of a known mechanism such as an electric cylinder or an actuator.

[0053] Next, the flow of the polishing process of the polishing device (100) is described. As shown in FIG. 6, the polishing device (100) has a plurality of polishing heads (201) arranged on a mask (210) on the upstream side in the X direction and a stage (202) arranged below the mask (210), and rotates the plurality of polishing heads (201) around a rotation axis (203) while applying pressure by a pressure mechanism (208). Subsequently, as shown in FIG. 8, the polishing device (100) performs surface reference polishing of the substrate (300) while moving the plurality of polishing heads (201) and the stage (202) to the downstream side in the X direction. FIG. 16 to 18 are drawings for explaining the flow of the polishing process of the polishing device (100). As shown in FIG. 16, when the plurality of polishing heads (201) and the stage (202) move until they attach the downstream mask (210), the polishing device (100) stops the pressurization by the pressurizing mechanism (208) and moves the plurality of polishing heads (201) and the stage (202) in the Y direction as shown in FIG. 17. Subsequently, the polishing device (100) resumes the pressurization by the pressurizing mechanism (208) and moves the plurality of polishing heads (201) and the stage (202) upstream in the X direction as shown in FIG. 18. The polishing device (100) moves until the plurality of polishing heads (201) and the stage (202) attach the upstream mask (210), and stops the pressure applied by the pressure mechanism (208), and misaligns the positions of the plurality of polishing heads (201) and the stage (202) in the Y direction, thereby repeating the X-direction scanning as described above.

[0054] FIG. 19 is a drawing illustrating an example of scanning a plurality of polishing heads (201) and a stage (202). As shown in FIG. 19 (a), the polishing device (100) may reciprocate the plurality of polishing heads (201) and the stage (202) in the X direction while changing their positions in the Y direction between two strokes. Additionally, as shown in FIG. 19 (b), the polishing device (100) may reciprocate the plurality of polishing heads (201) and the stage (202) in the X direction while changing their positions in the Y direction between four strokes. Additionally, as shown in FIG. 19 (c), the polishing device (100) may reciprocate the plurality of polishing heads (201) and the stage (202) in the X direction while changing their positions in the Y direction between eight strokes. As shown in FIG. 19, the polishing device (100) can uniformly polish the substrate (300) by increasing the number of reciprocating strokes, thereby reducing the distance (step distance) for changing the position of the polishing head (201) in the Y direction. Additionally, FIG. 19 illustrates cases where the number of strokes is 2, 4, or 8, but the number of strokes is arbitrary. If the number of strokes is even, the movement of the polishing head (201) and the stage (202) in the X direction can be used for polishing, but it does not matter if it is odd. If the number of strokes is odd, it becomes necessary to move the polishing head (201) and the stage (202) in the X direction before polishing starts or after polishing ends, while the polishing head (201) is not in contact with the substrate (300).

[0055] Here, if the movement speed of the polishing head (201) in the X direction is low, the amount of polishing on the substrate (300) increases, and if it is high, the amount of polishing on the substrate (300) decreases. That is, the movement speed of the polishing head (201) in the X direction and the amount of polishing on the substrate (300) are inversely proportional. Therefore, if the movement speed of the polishing head (201) in the X direction fluctuates during the polishing of the substrate (300), the amount of polishing on the substrate (300) varies depending on the area, and as a result, polishing non-uniformity occurs, which is undesirable. In contrast, the polishing device (100) moves a plurality of polishing heads (201) and a stage (202) in the X direction at a constant speed in a constant speed region α within the range of the long side direction of the substrate (300). Meanwhile, the polishing device (100) can decelerate and stop the movement of a plurality of polishing heads (201) and a stage (202) in the X direction in an acceleration / deceleration region β outside the range of the long side direction of the substrate (300), and then shift their position in the Y direction, and then start and accelerate the movement in the X direction. In this way, the polishing device (100) can uniformly polish the substrate (300) by moving a plurality of polishing heads (201) and a stage (202) at a constant speed within the range of the long side direction of the substrate (300), that is, during the polishing of the substrate (300).

[0056] FIGS. 20 and 21 are drawings for explaining the flow after the polishing process of the polishing device (100). When the polishing process of the substrate (300) is finished, or when the polishing tool (302) becomes unusable during the polishing of the substrate (300), as shown in FIG. 20, the polishing device (100) moves a plurality of polishing heads (201) to the uppermost position in the X direction and performs a regeneration process (dressing) of the polishing tool (302) using a tool regeneration member (211). While the regeneration process of the polishing tool (302) is being performed, the polishing device (100) performs a removal process of the substrate (300). That is, the polishing device (100) inserts the hand (400) into the lower side of the substrate (300), places the substrate (300) on the hand (400) by lowering the support member (200b or 200c) of the substrate holding support mechanism (200), and removes the substrate (300) by withdrawing the hand (400) to the downstream side in the X direction as shown in FIG. 21.

[0057] The polishing device (100) of the first embodiment is suitable for surface-based polishing. That is, when polishing a large substrate (300) in a face-up manner using a small-diameter polishing head (201) as in the present embodiment, it was common practice to perform back-side-based polishing. In order to perform surface-based polishing, a pressurizing mechanism such as an airbag is provided on the back side of the substrate (300), but if the entire substrate (300) is pressed, it results in pressing even the area where the polishing head is not present, which may cause damage to the substrate (300). In contrast, the polishing device (100) of the first embodiment is configured such that a stage (202) of a size corresponding to the size of a plurality of polishing heads (201) moves in the X direction in synchronization with the plurality of polishing heads (201), and since the substrate (300) can be pressed only in the area where the polishing head (201) is present, surface-based polishing can be performed appropriately even on a large substrate (300).

[0058] <Second Embodiment: Surface-based polishing using a constant pressure method>

[0059] Next, the configuration of the polishing device (100) of the second embodiment is described. The second embodiment is a polishing device (100) that uses a constant pressure method as the pressure mechanism (208) described above. The second embodiment is the same as the first embodiment except that the configuration of the pressure mechanism (208) is different. The description of the configuration that overlaps with the first embodiment is omitted.

[0060] FIG. 22 is a cross-sectional view schematically illustrating the configuration of a pressure mechanism (208) and a guide member (290). As shown in FIG. 22, the pressure mechanism (208) includes a base (222) that extends along the Y direction, similar to the first embodiment, and a pressure member (225) disposed on the base (222). The pressure member (225) extends along the Y direction and is provided in a region corresponding to a plurality of polishing heads (201). The pressure member (225) has a plurality of holes (225b) formed on a surface (225a) facing the substrate (300). The pressure mechanism (208) includes a fluid supply member (226) for supplying fluid to a fluid passage communicating with the plurality of holes (225b) of the pressure member (225).

[0061] The fluid supply member (226) is configured to supply a fluid, such as air, to the pressurizing member (225). By supplying fluid from the fluid supply member (226) to the pressurizing member (225), fluid is ejected from a plurality of holes (225b) and the substrate (300) is pressed against a plurality of polishing heads (201). That is, the polishing device (100) of the present embodiment is configured to perform surface-based polishing to remove a certain thickness from any part of the entire surface of the substrate by pressing the substrate (300) against the polishing head (201) by the pressurizing member (225) from the opposite side (back side) of the surface to be polished of the substrate (300), using the polishing head (201) as the polishing reference. In addition, the pressurizing member (225) is not limited to the structure shown in FIG. 22 and may be configured to include a porous body having a plurality of pores formed therein. In this case, the fluid supplied to the porous body from the fluid supply member (226) is ejected from the surface of the porous body opposite to the substrate (300) and presses the substrate (300) against the plurality of polishing heads (201). By providing a shielding member that shields the fluid on the side of the porous body, the fluid may be ejected only from the surface of the porous body opposite to the substrate (300).

[0062] According to the polishing device (100) of the second embodiment, it is suitable for surface-based polishing, just like the first embodiment.

[0063] <Third Embodiment: Back-side Reference Grinding Using a Surface Plate>

[0064] Next, the configuration of the polishing device (100) of the third embodiment is described. The polishing device (100) of the third embodiment is configured such that a flat plate is used instead of the pressure mechanism (208) described above, and the up-and-down movement mechanism (207) presses the substrate (300). The third embodiment is the same as the first embodiment except that a flat plate is used instead of the pressure mechanism (208) and the up-and-down movement mechanism (207) presses the substrate (300). The description of the configuration that overlaps with the first embodiment is omitted.

[0065] FIG. 23 is a perspective view schematically illustrating the configuration of a platen (229) and a guide member (290). As shown in FIG. 23, the stage (202) includes a base (222) that extends along the Y direction, similar to the first embodiment, and a platen (229) provided on the base (222). The platen (229) has a flat surface (229a) for supporting a substrate (300) that is pressed by a plurality of polishing heads (201). The flat surface (229a) of the platen (229) that contacts the substrate (300) preferably has low frictional resistance and high wear resistance. If the platen (229) cannot be manufactured from such a material, a protective sheet (e.g., a PTFE sheet) having these characteristics may be attached to the upper surface of the platen (229), and replaced whenever it deteriorates. In addition, a PTFE coating may be applied to the upper surface of the platen (229), for example.

[0066] FIG. 24 is a perspective view schematically illustrating the configuration of a polishing plate. As shown in FIG. 24, a plurality of holes (229b) are formed along the Y direction on the plane (229a) of the polishing plate (229) of the present embodiment. The polishing device (100) includes a fluid supply member (227) for supplying fluid (e.g., pure water) between the polishing plate (229) and the substrate (300) through the holes (229b). By supplying fluid from the fluid supply member (227), the frictional resistance between the polishing plate (229) and the substrate (300) can be reduced, and heat generation accompanying the sliding movement of both can be suppressed. Furthermore, in the present embodiment, an example is shown in which a plurality of holes (229b) are formed along the Y direction at the center of the X direction of the plane (229a) of the polishing plate (229), but this is not limited thereto. FIG. 25 is a perspective view schematically illustrating a modified configuration of the polishing plate. As illustrated in FIG. 25, a plurality of holes (229c, 229d) may be formed along the Y direction at both ends of the plane (229a) in the X direction of the plate (229). By doing so, when the stage (202) moves in the X direction, fluid can always be supplied from the holes (a plurality of holes (229c) or a plurality of holes (229d)) in the forward direction of travel, thereby lubricating the entire plate (229). For example, the polishing device (100) may include a switching mechanism (e.g., a switching valve) that can switch to supply fluid from either the plurality of holes (229c) or the plurality of holes (229d). By using the switching mechanism to supply fluid only from the holes in the forward direction of travel of the stage (202), the polishing device (100) can lubricate the entire plate (229) while suppressing the amount of fluid used.

[0067] According to the polishing device (100) of the third embodiment, back-side reference polishing can be appropriately performed using an inexpensive, small plate (229). That is, in the case of polishing a large substrate (300) in a face-up manner using a small-diameter polishing head (201) as in the present embodiment, in conventional back-side reference polishing, it was common to use a large plate that supports the entire substrate (300). In order to perform back-side reference polishing with high precision, a plate having a flat surface with high surface precision is required, but since a large plate having a flat surface with high surface precision is expensive, the cost of the polishing device increases. In contrast, the polishing device (100) of the third embodiment is configured such that the stage (202) moves in a first direction in synchronization with a plurality of polishing heads (201). Therefore, since the platen only needs to have a size corresponding to the size of the multiple polishing heads (201), even when polishing a large substrate (300), a small platen (229) can be used to perform back-side reference polishing.

[0068] As described above, according to the first to third embodiments, a face-up type polishing device can suitably perform surface-based polishing and also support back-based polishing. That is, when performing surface-based polishing, the stage (202) described in the first or second embodiment can be adopted, and when performing back-based polishing, the stage (202) described in the third embodiment can be adopted. In this way, even a single polishing device (100) can support either surface-based polishing or back-based polishing by exchanging the stage (202).

[0069] <Polishing Method>

[0070] Next, a polishing method performed using a polishing device (100) of any of the above embodiments will be described. FIG. 26 is a flowchart illustrating the polishing method of the present embodiment. As shown in FIG. 26, the polishing method of the present embodiment first performs a receiving process of a substrate (300) using a hand (400) (receiving step 102). In the receiving step (102), as described above, with the support member (200b) lowered, the substrate (300) mounted on the hand (400) is conveyed along the X direction onto a plurality of substrate holding support mechanisms (200) at a position higher than the top of the support member (200b).

[0071] When the substrate (300) is conveyed to a predetermined position on the plurality of substrate holding support mechanisms (200), the polishing method performs an installation process of the substrate (300) using the plurality of substrate holding support mechanisms (200) (installation step 104). In installation step 104, as described above, by raising the support member (200b), the substrate holding support mechanism (200) receives the substrate (300), and thereby the substrate (300) is installed on the plurality of substrate holding support mechanisms (200). When the substrate holding support mechanism (200) receives the substrate (300), the hand (400) retracts along the X direction.

[0072] Next, the polishing method uses a first driving mechanism (500) and a second driving mechanism (600) to move a plurality of polishing heads (201) and a stage (202) to a polishing start position at the end of the mask (210) on the upstream side in the X direction (movement step 105). Next, the polishing method starts polishing by rotating a plurality of polishing heads (201) using a rotation mechanism (204) and supplying a chemical solution (a liquid, water, or pure water) from the chemical solution supply hole (205) of the polishing head (201) (polishing step 106). Next, the polishing method starts applying pressure by fitting the mask (210) with the plurality of polishing heads (201) and the stage (202) (pressure step 108). The pressure step (108) is performed by pressing the mask (210) from the stage (202) side toward the polishing head (201) side when the stage (202) includes a pressure mechanism (208) as in the first and second embodiments. Meanwhile, the pressure step (108) is performed by pressing the mask (210) from the polishing head (201) side toward the stage (202) side when the stage (202) includes a polishing plate (229) as in the third embodiment. Since the polishing step 106 and the pressure step 108 are continuously performed while scanning the plurality of polishing heads (201) and the stage (202) in the X direction as described below, the substrate (300) is pressed while the plurality of polishing heads (201) and the stage (202) are holding the substrate (300).

[0073] Continuing, the polishing method moves a plurality of polishing heads (201) and a stage (202) in a first direction (X direction) using a first driving mechanism (500) and a second driving mechanism (600) while performing a polishing step 106 and a pressurizing step 108 (scanning step 110).

[0074] Next, the polishing method moves a plurality of substrate holding support mechanisms (200) in the up-down direction (Z direction) using a third driving mechanism (280) in accordance with the movement of the stage (202) in the X direction during the scanning step 110 (up-down driving step 112). The up-down driving step 112 is performed by lowering the substrate holding support mechanism (200) that the stage (202) is approaching to prevent interference with the stage (202), and then raising the lowered substrate holding support mechanism (200) to support the substrate (300) again once the stage (202) passes.

[0075] Next, the polishing method determines whether the plurality of polishing heads (201) and the stage (202) have reached the opposite side mask (210) by means of the scanning step 110 (determination step 113). If the polishing method determines that the plurality of polishing heads (201) and the stage (202) have not reached the opposite side mask (210) (determination step 113, "No"), it returns to the scanning step 110 and repeats the process. Meanwhile, if the polishing method determines that the plurality of polishing heads (201) and the stage (202) have reached the opposite side mask (210) (determination step 113, "Yes"), it releases the pressure applied by the pressure step (108) (step 114) and determines whether the polishing process of the substrate (300) has been completed (determination step 116).

[0076] If it is determined that the polishing process of the substrate (300) has not been completed (determination step 116, "No"), the polishing method determines whether the polishing tool (302) needs to be regenerated based on the polishing time after the previous dressing of the polishing tool (302) currently in use or the number of strokes in the X direction, etc. (determination step 117). If it is determined that the polishing tool (302) needs to be regenerated (determination step 117, "Yes"), the polishing method stops the rotation of the polishing head (201) (step 118). Subsequently, the polishing method moves a plurality of polishing heads (201) to the position of the tool regeneration member (211) using the first driving mechanism (500), and performs dressing of the polishing tool (302) using the tool regeneration member (211) (dressing step 119). When the dressing step (119) is completed, the polishing method returns to the movement step 105 and repeats the process. Meanwhile, in the polishing method, if it is determined that regeneration of the polishing tool (302) is unnecessary (determination step 117, "No"), the fourth driving mechanism (550) is used to move the plurality of polishing heads (201) in the second direction (Y direction) (movement step 120). In the movement step 120, if the stage (202) includes a pressure mechanism (208) as in the first and second embodiments, the fifth driving mechanism (650) is used to move the stage (202) in the Y direction in synchronization with the plurality of polishing heads (201). Additionally, in the movement step 120, if the stage (202) includes a platen (229) as in the third embodiment, but the length of the platen (229) in the Y direction is equal to the length of the plurality of polishing heads (201) in the Y direction, the fifth driving mechanism (650) is used to move the stage (202) in the Y direction in synchronization with the plurality of polishing heads (201).Meanwhile, in the moving step 120, as in the third embodiment, if the stage (202) includes a platen (229) and the length of the platen (229) in the Y direction is greater than or equal to the sum of the lengths of the multiple polishing heads (201) in the Y direction and the moving portion in the Y direction, the stage (202) does not need to be moved in the Y direction. After the moving step 120, the polishing method returns to the pressing step 108 and repeats the process.

[0077] In the polishing method, when it is determined that the polishing process of the substrate (300) is finished (determination step 116, "Yes"), the rotation of the polishing head (201) is stopped (step 122). Subsequently, the polishing method moves a plurality of polishing heads (201) to the position of the tool regeneration member (211) using the first driving mechanism (500), and performs dressing of the polishing tool (302) using the tool regeneration member (211) (dressing step 124). Next, the polishing method performs the removal process of the substrate (300) using the hand (400) (removal step 126). The removal step 126 is performed by inserting the hand (400) into the lower portion of the substrate (300), lowering the support member (200b) of the substrate holding support mechanism (200) to place the substrate (300) on the hand (400), and withdrawing the hand (400) to the downstream side in the X direction.

[0078] Although several embodiments of the present invention have been described above, the above-described embodiments are intended to facilitate understanding of the present invention and are not intended to limit the present invention. The present invention may be modified or improved without departing from its intent, and it is understood that the present invention includes equivalents thereof. Furthermore, any combination of or omission of each component described in the claims and specification is possible within the scope of solving at least some of the problems described above or within the scope of exhibiting at least some of the effects.

[0079] The present invention discloses a polishing device, in one embodiment, comprising a plurality of substrate holding support mechanisms arranged along a first direction of a substrate, a plurality of polishing heads arranged along a second direction intersecting the first direction, a stage extending in the second direction opposite to the plurality of polishing heads, and a driving mechanism for moving the plurality of polishing heads and the stage in the first direction.

[0080] In addition, the present invention discloses a polishing device in which, as one embodiment, the driving mechanism comprises a first driving mechanism for moving the plurality of polishing heads in the first direction and a second driving mechanism for moving the stage in the first direction, wherein the first driving mechanism and the second driving mechanism are configured to move the plurality of polishing heads and the stage in the first direction in synchronization.

[0081] In addition, the present invention discloses a polishing device that, as one embodiment, further comprises a third driving mechanism for moving the plurality of substrate holding support mechanisms in an up-and-down direction according to the movement of the first direction of the stage.

[0082] In addition, the present invention discloses, as one embodiment, a polishing apparatus further comprising a mask surrounding the substrate and having the same thickness as the substrate.

[0083] In addition, the present invention discloses a polishing device that, as one embodiment, further comprises a fourth driving mechanism for moving the plurality of polishing heads in the second direction.

[0084] In addition, the present invention discloses a polishing device that further comprises, as one embodiment, a fifth driving mechanism for moving the stage in the second direction.

[0085] In addition, the present invention discloses a grinding device, in one embodiment, comprising a guide member disposed at both ends of the first direction of the stage, a first end disposed at a height equal to the upper surface of the stage, a second end disposed at a position lower than the upper surface of the stage, and a guide member having an incline provided between the first end and the second end.

[0086] In addition, the present invention discloses a polishing device, in which, as one embodiment, the stage includes a pressing mechanism for pressing the substrate against the plurality of polishing heads.

[0087] In addition, the present invention discloses a polishing device, in which, as one embodiment, the pressurizing mechanism comprises a base, a pocket-shaped member disposed on the base, and a fluid supply member for supplying fluid to the pocket-shaped member.

[0088] In addition, the present invention discloses a polishing device that, as one embodiment, further comprises a fluid supply member for supplying fluid to the contact surface of the pocket-shaped member with the substrate.

[0089] In addition, the present invention discloses a polishing device, in which, as one embodiment, the pressurizing mechanism comprises a base, a pressurizing member disposed on the base and having a plurality of holes formed on a surface facing the substrate, and a fluid supply member for supplying fluid to a fluid passage communicating with the plurality of holes of the pressurizing member.

[0090] In addition, the present invention discloses a polishing device, in which, as one embodiment, the stage comprises a platen having a flat surface that supports a substrate that is pressed by the plurality of polishing heads.

[0091] In addition, the present invention discloses a polishing device further comprising, as one embodiment, a fluid supply member for supplying fluid to the plane of the polishing plate.

[0092] In addition, the present invention discloses, as one embodiment, a processing system comprising a polishing device of any of the above, a cleaning device for cleaning a substrate polished by the polishing device, a drying device for drying a substrate cleaned by the cleaning device, and a conveying device for conveying the substrate between the polishing device, the cleaning device, and the drying device.

[0093] In addition, the present invention discloses a polishing method, in one embodiment, comprising: an installation step of installing a substrate on a plurality of substrate holding support mechanisms arranged along a first direction; a pressing step of pressing the substrate by means of a plurality of polishing heads arranged along a second direction intersecting the first direction and a stage extending in the second direction opposite to the plurality of polishing heads; a polishing step of rotating the plurality of polishing heads; and a scanning step of moving the plurality of polishing heads and the stage in the first direction while performing the pressing step and the polishing step.

[0094] In addition, the present invention discloses a polishing method, as one embodiment, further comprising an up-and-down driving step for moving the plurality of substrate holding support mechanisms in an up-and-down direction according to the movement of the stage in the first direction during the injection step.

[0095] In addition, the present invention discloses a polishing method in which, as one embodiment, the pressure step and the polishing step are initiated in a state in which a mask having the same thickness as the substrate and surrounding the substrate is fitted by a plurality of polishing heads and the stage.

[0096] In addition, the present invention discloses a polishing method, as one embodiment, further comprising a movement step in which, when the plurality of polishing heads and the stage reach the mask by the injection step, the pressure applied by the pressure step is released and the plurality of polishing heads are moved in the second direction. Explanation of the symbols

[0097] 100: Grinding device 200: Substrate holding support mechanism 201: Grinding Head 202: Stage 208: Pressurizing device 209: Control unit 210: Mask 213: Cleaning device 214: Return device 215: Drying device 224: Pocket-shaped member 225: Pressurizing member 225b: hole 226: Fluid supply absence 227: Fluid supply absence 229: The correct opposite 229a: Plane 229b: hole 280: Third driving mechanism 290: Absence of guide 290a: First end 290b: Second end 290c: Slope 300: Substrate 302: Grinding Tools 500: First driving mechanism 550: 4th driving mechanism 600: Second driving mechanism 650: 5th driving mechanism 1000: Processing system

Claims

Claim 1 A polishing device comprising a plurality of substrate holding support mechanisms arranged along a first direction, a plurality of polishing heads arranged along a second direction intersecting the first direction, a stage extending in the second direction arranged opposite to the plurality of polishing heads, a first driving mechanism for moving the plurality of polishing heads in the first direction, and a second driving mechanism for moving the stage in the first direction, wherein the first driving mechanism and the second driving mechanism are configured to move the plurality of polishing heads and the stage in the first direction in synchronization so that the stage can move in accordance with the plurality of polishing heads, and wherein the plurality of polishing heads and the stage have a substrate held and supported by the substrate holding support mechanism between them. Claim 2 delete Claim 3 A polishing device according to claim 1, further comprising a third driving mechanism for moving the plurality of substrate holding support mechanisms in an up-and-down direction according to the movement of the first direction of the stage. Claim 4 A polishing device according to claim 1, further comprising a mask surrounding the substrate and having the same thickness as the substrate. Claim 5 A polishing device according to claim 1, further comprising a fourth driving mechanism for moving the plurality of polishing heads in the second direction. Claim 6 A grinding device according to claim 1, further comprising a fifth driving mechanism for moving the stage in the second direction. Claim 7 A grinding device according to claim 1, further comprising a guide member disposed at both ends of the first direction of the stage, a first end disposed at a height equal to the upper surface of the stage, a second end disposed at a position lower than the upper surface of the stage, and a guide member having an incline provided between the first end and the second end. Claim 8 A polishing device according to claim 1, wherein the stage comprises a pressing mechanism for pressing the substrate against the plurality of polishing heads. Claim 9 In claim 8, the above-mentioned pressurizing mechanism comprises a base, a pocket-shaped member disposed on the base, and a fluid supply member for supplying fluid to the pocket-shaped member, a grinding device. Claim 10 A polishing device according to claim 9, further comprising a fluid supply member for supplying fluid to the contact surface of the pocket-shaped member with the substrate. Claim 11 A polishing device according to claim 8, wherein the pressurizing mechanism comprises a base, a pressurizing member disposed on the base and having a plurality of holes formed on a surface opposite to the substrate, and a fluid supply member for supplying fluid to a fluid passage communicating with the plurality of holes of the pressurizing member. Claim 12 A polishing device according to claim 1, wherein the stage comprises a polishing plate having a flat surface that supports a substrate that is pressed by the plurality of polishing heads. Claim 13 A grinding device according to claim 12, further comprising a fluid supply member for supplying fluid to the plane of the above-mentioned plate. Claim 14 A processing system comprising a polishing device described in claim 1, a cleaning device for cleaning a substrate polished by the polishing device, a drying device for drying a substrate cleaned by the cleaning device, and a conveying device for conveying the substrate between the polishing device, the cleaning device and the drying device. Claim 15 A polishing method comprising: an installation step of installing a substrate on a plurality of substrate holding support mechanisms arranged along a first direction; a pressing step in which a plurality of polishing heads and a stage press against the substrate; a polishing step of rotating the plurality of polishing heads; and a scanning step of moving the plurality of polishing heads and the stage in the first direction in synchronization so that the stage can move in accordance with the plurality of polishing heads while performing the pressing step and the polishing step, wherein the plurality of polishing heads are arranged along a second direction intersecting the first direction, and the stage extends in the second direction opposite to the plurality of polishing heads. Claim 16 A polishing method according to claim 15, further comprising an up-and-down driving step for moving the plurality of substrate holding support mechanisms in an up-and-down direction according to the movement of the stage in the first direction in the injection step. Claim 17 In claim 15, the above-mentioned pressure step and the above-mentioned polishing step are initiated in a state in which a mask having the same thickness as the substrate and surrounding the substrate is fitted by a plurality of polishing heads and the stage. Claim 18 A polishing method according to claim 17, further comprising a movement step in which, when the plurality of polishing heads and the stage reach the mask by the injection step, the pressure applied by the pressure step is released and the plurality of polishing heads are moved in the second direction.

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